WO2018182353A1 - Composite de nanoparticules de polymères et son procédé de préparation - Google Patents

Composite de nanoparticules de polymères et son procédé de préparation Download PDF

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Publication number
WO2018182353A1
WO2018182353A1 PCT/KR2018/003767 KR2018003767W WO2018182353A1 WO 2018182353 A1 WO2018182353 A1 WO 2018182353A1 KR 2018003767 W KR2018003767 W KR 2018003767W WO 2018182353 A1 WO2018182353 A1 WO 2018182353A1
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Prior art keywords
nano
adhesive layer
composite
adhesive
inorganic
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PCT/KR2018/003767
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English (en)
Korean (ko)
Inventor
김태일
홍혜린
김윤철
Original Assignee
성균관대학교산학협력단
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Publication of WO2018182353A1 publication Critical patent/WO2018182353A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
    • B32B9/007—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile comprising carbon, e.g. graphite, composite carbon
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding

Definitions

  • the present invention relates to a polymer-nano inorganic particle composite, and more particularly, to a polymer-nano inorganic particle composite that can be used as a heat sink and an electromagnetic wave shielding agent because of its excellent thermal and electrical conductivity.
  • High thermal conductivity substrates are frequently used to effectively remove heat from devices having heat-generating properties to protect products or to maintain performance of devices.
  • the nanoparticles were manufactured by physically dispersing the nanoparticles in the polymer. This has the advantages of the polymer and at the same time have the properties of the functional nanoparticles, the process is easy and simple has shown an advantage in mass production.
  • the nanoparticles are randomly located in the polymer, high nanoparticle ratios are required in order to secure high thermal conductivity, thereby degrading the polymer properties such as low flexibility, fragile and low adhesion, and high unit cost.
  • the vertical heat transfer rate is reported to be 10 times smaller than the horizontal heat transfer rate.
  • a method of aligning the nanoparticles in the polymer was also used. According to a specific manufacturing method, a method of dispersing metalized nanoparticles in a flowable polymer and then aligning them using magnetic force, and aligning the nanoparticles such as filtration using a filter paper or freezing molding, and then emptying the polymer This can be broken down by filling in.
  • the surface of the particles was coated with metal ions or the like, so that the insulation was poor and the process was time-consuming due to the viscosity of the polymer. .
  • alignment in only one direction is possible, so that the thermal conductivity in the vertical direction is rather reduced.
  • the volume is increased during the injection of the polymer, the alignment is disturbed.
  • the reproducibility was greatly reduced because the alignment interval and density cannot be precisely controlled during the alignment process.
  • One object of the present invention is to provide a polymer-nano inorganic particle composite having excellent electrical or thermal transfer property vertically and horizontally and a method for producing the same.
  • the polymer nano-inorganic composite is a substrate, a first adhesive layer having a first negative surface on the substrate, a first laminated on the first adhesive layer, along the first negative surface A nanoinorganic particle layer, on the first nanoinorganic particle layer, a second adhesive layer having a second intaglio surface having a constant thickness and a second intaglio space on the first intaglio surface, and the second intaglio on the second adhesive layer And a second nanoinorganic particle layer stacked along the surface, wherein the first nanoinorganic particle layer and the second nanoinorganic particle layer are electrically or thermally connected in a vertical direction.
  • the substrate may be a flexible transparent substrate.
  • the coating on the adhesive layer of the first and second nanoinorganic particles may be located on the surface of the adhesive layer, or all or part of the nanoinorganic particles may be impregnated into the adhesive layer.
  • the adhesive may include a bisphenol A acrylate compound and an alkoxysilyl acrylate compound.
  • the bisphenol A-based diacrylate compound may include bisphenol A glycerolate (1 glycerol / phenol) diacrylate of Formula 1 below.
  • the alkoxysilyl-based acrylate compound may include 3- (trimethoxysilyl) propyl methacrylate (Formula 2) below.
  • the adhesive may comprise a photoinitiator.
  • the photoinitiator comprises 2-benzyl-2- (dimethylamino) -4-morpholinobutyrophenone (2-Benzyl-2- (dimethylamino) -4-morpholinobutyrophenone) of Formula 3 below, Polymer Nano Inorganic Particle Complex:
  • the adhesive may comprise poly (methyl silsesquioxane).
  • the thickness of the adhesive layer may be smaller than the thickness of the intaglio surface.
  • the nano-inorganic particles may include at least one of graphene, metallic grid, carbon nanotubes, silver nanowires and boron nitride.
  • Another embodiment of the heat sink may include any one of the above-described polymer nano-inorganic composites.
  • the electromagnetic wave shielding agent may include any one of the above-described polymer nano-inorganic composites.
  • a method for preparing a polymer nanoinorganic particle composite includes a first step of preparing a substrate, a second step of forming a first adhesive layer on the substrate, and a stamp having nano inorganic particles located on an embossed surface thereof.
  • the first negative surface is formed on one surface of the first adhesive layer, the third step of laminating the nano-inorganic particle layer along the first negative surface, while the first negative surface formed by the nano-inorganic particle layer
  • the first nano-inorganic particle layer and the second nano-inorganic particle layer adjacent to the first nano-inorganic particle layer is electrically or thermally connected in the vertical direction.
  • the adhesive is a thermosetting or light curing adhesive, and in the third step, the adhesive is cured by irradiation with heat or light.
  • the present invention even if a low content of the nano-inorganic particles, it is possible to implement a high thermal conductivity, it is possible to maintain the flexibility, adhesion and the like properties of the polymer.
  • the mold since the mold is manufactured, high reliability can be maintained even in mass production, and the thermal conductivity can be effectively controlled by adjusting the size of the structure and the aspect ratio.
  • the present invention can be applied to various fields such as a TIM and a heat dissipation substrate.
  • high thermal conductivity may be achieved even at a low nanoparticle ratio.
  • 3D structures having various densities can be fabricated, and the selective thermal conductivity in the axial (vertical) and plane (horizontal) directions can also be controlled using the same.
  • the adhesive polymer it is possible to easily transfer the device to the substrate without a separate process.
  • the photocurable polymer the adhesiveness of the part in which an element is not transferred can be removed easily.
  • a polymer having a high flexibility it can be applied to the bending device.
  • FIG. 1 is a schematic diagram of a method for producing a composite of an embodiment of the present invention.
  • Figure 2 is a schematic diagram of a cross-sectional view of a composite according to another embodiment of the present invention.
  • Figure 3 is a schematic diagram of a cross-sectional view of a composite according to another embodiment of the present invention.
  • FIG. 4 is a schematic diagram of a heat sink and an IC chip including a composite according to another embodiment of the present invention.
  • FIG. 6 is an electron micrograph, an energy dispersive spectroscopy (EDS) result graph, and a result table of a part of the composite shown in FIG. 5.
  • EDS energy dispersive spectroscopy
  • first”, “second”, and the like do not limit the components of the present invention, but are merely set to distinguish the components.
  • the meaning of “on” or “on” includes not only directly placing another component on one component, but also inserting and placing a third component between two components. do.
  • Figure 1 shows a schematic diagram of a method for producing a composite of an embodiment of the present invention.
  • the adhesive layer (Adhesive) laminated on the substrate is transferred to a polydimethylsiloxane (PDMS) -coated stamp (PDMS) coated with nano-inorganic particles, and the embossed layer is formed on the stamp.
  • PDMS polydimethylsiloxane
  • PDMS polydimethylsiloxane
  • PDMS polydimethylsiloxane
  • PDMS polydimethylsiloxane
  • PDMS polydimethylsiloxane
  • PDMS polydimethylsiloxane
  • PDMS polydimethylsiloxane
  • PDMS polydimethylsiloxane
  • PDMS polydimethylsiloxane
  • PDMS polydimethylsiloxane
  • PDMS polydimethylsiloxane
  • PDMS polydimethylsi
  • the nano-inorganic particle layer can be better transferred, and the adhesive layer can be cured.
  • the order disclosed in FIG. 1 is only one example, and the specific manufacturing method thereof is not limited to FIG. 1.
  • a substrate is prepared.
  • the substrate is not particularly limited, but may be a polymer substrate, preferably a flexible transparent polymer such as PET.
  • a first adhesive layer is formed on the substrate.
  • the first adhesive layer may be positioned on the substrate by various methods in a range consistent with the object of the present invention.
  • the adhesive is a thermosetting or light curing adhesive, and in the third step, it may be cured by irradiating heat or light.
  • the adhesive may include a transparent adhesive including a bisphenol A acrylate compound and an alkoxysilyl acrylate compound.
  • the bisphenol A-based diacrylate compound may be bisphenol A glycerolate (1 glycerol / phenol) diacrylate of Formula 1 below.
  • the alkoxysilyl acrylate compound may be 3- (trimethoxysilyl) propyl methacrylate of Formula 2 below.
  • the adhesive may include a photoinitiator.
  • the photoinitiator may be 2-benzyl-2- (dimethylamino) -4-morpholinobutyrophenone (2-Benzyl-2- (dimethylamino) -4-morpholinobutyrophenone) of Formula 3 below.
  • the adhesive may comprise poly (methyl silsesquioxane).
  • the adhesive of the present invention can provide sufficient adhesion to the nano-inorganic particles while forming a thin layer, and facilitates percolation between the nano-inorganic particles. This percolation maximizes the conduction and heat dissipation characteristics.
  • the thickness of the adhesive layer of the present invention is characterized in that 100nm to 150nm, less than 100nm may cause a process defect. Thickness of 150 nm or more may lower the mechanical stability.
  • a stamp in which the nano-inorganic particles are located on the embossed surface, a first negative surface is formed on one surface of the first adhesive layer, and the nano-inorganic particle layer is stacked along the first negative surface.
  • the coating on the adhesive layer of the nano-inorganic particles may be located on the surface of the adhesive layer, or include impregnating some or all of the nano-inorganic particles into the folding layer.
  • a stamp can be used.
  • the stamp may use a polymethylsiloxane (PMDS) mold for structures such as lines, spaces, pillars, prisms, and the like.
  • PMDS polymethylsiloxane
  • the mold is only one example of performing a stamping process, but is not limited thereto.
  • the boron nitride particles dispersed in ethanol are uniformly coated on the PDMS structure, and when the PDMS coating is applied with heat, the solvent is blown away immediately after passing the bar coater with the solution. Boron is coated onto the PDMS in the plane direction, increasing contact between the nanoparticles, thereby increasing thermal conductivity.
  • the coating thickness may be controlled by adjusting the concentration of the boron nitride dispersion, the coating speed, and the temperature.
  • the 3D structure of the nanoparticles in the polymer is made through the multi-layer transfer method of the nanoparticles through the PDMS mold, it is easy to modify the nanoparticle structure according to the size and aspect ratio of the mold.
  • transfer using a mold since it has high reproducibility, large area production using roll-to-roll is also possible.
  • the nano-inorganic particles may include at least one of graphene, a metallic grid, carbon nanotubes, silver nanowires and boron nitride.
  • nano-inorganic particles coated stamp is physically contacted with the adhesive layer and pressure is applied, an embossed surface is formed on the adhesive layer so as to correspond to the relief formed on the stamp.
  • the nano-inorganic particle layer coated on the surface of the stamp is transferred, located along the embossed surface of the adhesive layer.
  • the embossed or engraved surface is not particularly limited in the specific surface form, but represents a surface shape such as an uneven or serrated form formed on the surface of the adhesive layer.
  • the stamp is peeled off after partially curing the adhesive layer by irradiation with heat or light, the structure of the relief surface is formed to correspond to the relief formed on the surface of the stamp on the adhesive layer, and simultaneously coated on the stamp due to the adhesive property of the adhesive.
  • the nano inorganic particle layer can be easily transferred to the adhesive layer.
  • the sheet having the nanoparticle 3D structure in the adhesive layer may be prepared by coating the adhesive layer thereon and transferring the inorganic nanoparticles several times.
  • the second adhesive layer is formed to have a predetermined thickness while forming the first intaglio surface formed by the nano-inorganic particle layer.
  • the description of the second adhesive layer used here is the same as that described in the first adhesive layer, and thus no particular description is given.
  • the second adhesive layer and the first adhesive layer may be the same composition, or may be different.
  • the shape of the intaglio surface may be the same or may be different.
  • a second negative surface is formed on one surface of the second adhesive layer by using a stamp in which nano-inorganic particles are positioned on the relief surface.
  • the stamp used here may use the same stamp as described in the above-described third step. However, it is not limited to this.
  • the second and third steps may be performed two or more times to form a composite in which the adhesive layer coated with the nano-inorganic particle layer is alternately laminated.
  • the adhesive layer on which the nanoparticle layer formed first is laminated and the adhesive layer on which the nanoparticle layer formed second are laminated will be described.
  • the first adhesive layer in which the first nano-inorganic particle layer is laminated on the negative surface, laminated on the substrate and the substrate is formed.
  • An additional adhesive is applied on the intaglio surface to laminate the second adhesive layer.
  • the second adhesive layer also forms an intaglio surface through the third step, and stacks the second nano-inorganic particle layer. This process can be carried out repeatedly to suit the purpose of the present invention.
  • the first nano inorganic particle layer and the first adhesive layer, the second nano inorganic particle layer and the second adhesive layer may be alternately stacked.
  • the alternating stacking means that the first layer and the second layer stacked on the first layer do not overlap and overlap each other.
  • the first layer and the second layer stacked alternately or at an angle are stacked at an angle. It is used herein in the sense of inclusion.
  • the first nano-inorganic particle layer and the second nano-inorganic particle layer adjacent to the first nano-inorganic particle layer may be electrically or thermally connected in the vertical direction.
  • “connected” means that some or all of the first nano inorganic particle layer is in physical contact with the second nano inorganic particle layer.
  • the thickness of the second adhesive layer is the intaglio of the second adhesive layer except for the depth to fill the intaglio surface of the first adhesive layer. It is desirable to be smaller than the thickness of the surface.
  • the pattern, direction, depth, etc. of the intaglio surface of the first composite layer and the intaglio surface of the second composite layer are the same, or It may be different.
  • a composite according to another embodiment of the present invention is a substrate, a first adhesive layer having a first negative surface on the substrate, the first nano-inorganic particle layer laminated on the first adhesive layer, along the first negative surface On the first nano-inorganic particle layer, a second adhesive layer having a second intaglio surface having a constant thickness and a second intaglio space of the first intaglio surface, and along the second intaglio surface on the second adhesive layer
  • the stacked second nano inorganic particle layer, wherein the first nano inorganic particle layer and the second nano inorganic particle layer is electrically or thermally connected in the vertical direction.
  • 2 and 3 is a schematic view of a cross-sectional view of the composite according to an embodiment of the present invention. 2 and 3 are only examples of the present invention, and the present invention is not limited to these structures. As shown in FIG. 2 and FIG. 3, the first nanoinorganic particle layer 22 and the second nanoinorganic particle layer 32 are vertically connected, so that thermal or electrical conduction can be quickly performed.
  • the composite 1 of the present invention includes a substrate 10 and composite layers 20 and 30 stacked on the substrate 10.
  • the composite layers 20 and 30 are composed of adhesive layers 21 and 31 and nano inorganic particle layers 22 and 32.
  • a negative surface exists on the surface of the adhesive layer that does not face the substrate, and a nano inorganic particle layer is laminated along the negative surface.
  • the composite layers may be laminated alternately. The number of laminated composite layers can be variously applied as desired by the present invention.
  • the nano-inorganic particle layer should be in contact with the nano-inorganic particle layer which is partially or entirely adjacent to the layers to be stacked in the vertical direction, through which, it should be electrically or thermally connected.
  • Another embodiment of the heat sink of the present invention includes any one of the various composites described above.
  • h-BN & polymer composite refers to a composite obtained by alternately stacking an inorganic nanoparticle layer and an adhesive layer.
  • the enlarged inset shows a composite placed on a heat sink and alternately stacked layers comprising adhesive and nano-inorganic particles (H-BN). Since the nano-inorganic particle layers are vertically thermally or electrically connected inside the composite, heat generated in an electronic device including an IC chip is easily released to the heat sink.
  • the electromagnetic wave shielding agent includes any one of the above-described various composites.
  • bisphenol A glycerol (1 glycerol / phenol) diacrylate, 3- (trimethoxysilyl) propyl methacrylate, spin-on glass (SOG 500F), as an ultra-thin adhesive 2-benzyl-2- (dimethylamino) -4 and anhydrous ethanol were prepared by mixing in a ratio of 200: 100: 100: 9: 1700.
  • the PET film was prepared as a substrate, which was treated with oxygen plasma, and then the adhesive prepared on the substrate was spin coated at 3000 rpm for 30 seconds to form a 100-120 nm thick adhesive layer.
  • PDMS was prepared as a stamp material to transfer the nano-inorganic particles to the adhesive layer by a stamping method.
  • PDMS stamps were prepared using the SYLGARD 184 silicone elastomer kit (Dow Corning Inc.). In SYLGARD 184, the PDMS precursor and the curing agent are mixed in a 10: 1 ratio and poured into a Petri dish. The bubbles were removed and cured at 70 ° C. for 1 hour. Boron nitride was coated to form a nano-inorganic particle layer on the PDMS mold. Using a boron nitride-coated PDMS mold, a stamping process was performed to form a negative surface on the adhesive layer, and the nano-inorganic particle layer was transferred onto the negative surface. This process was repeated 5 or more times.
  • FIG. 6 shows an electron micrograph, an energy dispersive spectroscopy (EDS) result graph, and a result table of a part of the composite shown in FIG. 5. As shown in Figure 6, it was confirmed that the presence of a large amount of nitrogen and boron in the portion connected to the nano-inorganic particle layer.
  • EDS energy dispersive spectroscopy

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Laminated Bodies (AREA)

Abstract

Selon un mode de réalisation de la présente invention, un composite de nanoparticules de polymères comprend: un substrat; une première couche adhésive sur la couche de surface, ayant sur la couche de surface une première surface gravée; une première couche de nanoparticules inorganiques, empilée sur la première surface gravée, sur la première couche adhésive; une seconde couche adhésive, sur la première couche de nanoparticules inorganiques, remplissant l'espace gravé de la première surface gravée, ayant une épaisseur prédéterminée, et ayant une seconde surface gravée; et une seconde couche de nanoparticules inorganiques, empilée sur la seconde surface gravée, sur la seconde couche adhésive, la première couche de nanoparticules inorganiques et la seconde couche de nanoparticules inorganiques étant connectées électriquement ou thermiquement dans le sens vertical.
PCT/KR2018/003767 2017-03-31 2018-03-30 Composite de nanoparticules de polymères et son procédé de préparation WO2018182353A1 (fr)

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KR1020170041715A KR101808985B1 (ko) 2017-03-31 2017-03-31 고분자 나노무기입자 복합체 및 이를 제조하는 방법

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KR101808985B1 (ko) * 2017-03-31 2017-12-13 성균관대학교산학협력단 고분자 나노무기입자 복합체 및 이를 제조하는 방법
KR102563235B1 (ko) * 2020-01-10 2023-08-03 성균관대학교산학협력단 엠보가 형성된 방열 코팅층 및 방열 시트의 제조 방법

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