KR101808985B1 - 고분자 나노무기입자 복합체 및 이를 제조하는 방법 - Google Patents

고분자 나노무기입자 복합체 및 이를 제조하는 방법 Download PDF

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Publication number
KR101808985B1
KR101808985B1 KR1020170041715A KR20170041715A KR101808985B1 KR 101808985 B1 KR101808985 B1 KR 101808985B1 KR 1020170041715 A KR1020170041715 A KR 1020170041715A KR 20170041715 A KR20170041715 A KR 20170041715A KR 101808985 B1 KR101808985 B1 KR 101808985B1
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KR
South Korea
Prior art keywords
nano
inorganic particle
adhesive layer
adhesive
layer
Prior art date
Application number
KR1020170041715A
Other languages
English (en)
Korean (ko)
Inventor
김태일
홍혜린
김윤철
Original Assignee
성균관대학교산학협력단
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 성균관대학교산학협력단 filed Critical 성균관대학교산학협력단
Priority to KR1020170041715A priority Critical patent/KR101808985B1/ko
Application granted granted Critical
Publication of KR101808985B1 publication Critical patent/KR101808985B1/ko
Priority to PCT/KR2018/003767 priority patent/WO2018182353A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
    • B32B9/007—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile comprising carbon, e.g. graphite, composite carbon
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Laminated Bodies (AREA)
KR1020170041715A 2017-03-31 2017-03-31 고분자 나노무기입자 복합체 및 이를 제조하는 방법 KR101808985B1 (ko)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020170041715A KR101808985B1 (ko) 2017-03-31 2017-03-31 고분자 나노무기입자 복합체 및 이를 제조하는 방법
PCT/KR2018/003767 WO2018182353A1 (fr) 2017-03-31 2018-03-30 Composite de nanoparticules de polymères et son procédé de préparation

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020170041715A KR101808985B1 (ko) 2017-03-31 2017-03-31 고분자 나노무기입자 복합체 및 이를 제조하는 방법

Publications (1)

Publication Number Publication Date
KR101808985B1 true KR101808985B1 (ko) 2017-12-13

Family

ID=60944343

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020170041715A KR101808985B1 (ko) 2017-03-31 2017-03-31 고분자 나노무기입자 복합체 및 이를 제조하는 방법

Country Status (2)

Country Link
KR (1) KR101808985B1 (fr)
WO (1) WO2018182353A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018182353A1 (fr) * 2017-03-31 2018-10-04 성균관대학교산학협력단 Composite de nanoparticules de polymères et son procédé de préparation
KR20210090352A (ko) * 2020-01-10 2021-07-20 성균관대학교산학협력단 엠보가 형성된 방열 코팅층 및 방열 시트의 제조 방법

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009184155A (ja) 2008-02-04 2009-08-20 Touch Panel Kenkyusho:Kk 導電性フィルムまたは導電性シートおよび抵抗膜式タッチパネル構造体
KR101193315B1 (ko) 2003-10-24 2012-10-19 레오나르트 쿠르츠 스티프퉁 운트 코. 카게 접착제의 구조화 및 전사 필름에 의한 전기적 기능층의 구조화
KR101542702B1 (ko) 2014-12-31 2015-08-06 성균관대학교산학협력단 투명 접착제용 조성물 및 이를 제조하는 방법

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009041574A1 (de) * 2008-10-29 2010-05-12 Electrovac Ag Verbundmaterial, Verfahren zum Herstellen eines Verbundmaterials sowie Kleber oder Bondmaterial
US8222352B2 (en) * 2008-12-24 2012-07-17 Nitto Denko Corporation Silicone resin composition
KR101487480B1 (ko) * 2013-01-16 2015-01-29 주식회사 엘엠에스 함몰홈에 접착부가 구비된 방열시트
KR102263853B1 (ko) * 2014-11-28 2021-06-10 엘지디스플레이 주식회사 플렉서블 방열필름 및 그 제조 방법
KR101734912B1 (ko) * 2015-03-02 2017-05-12 주식회사 엘엠에스 방열 시트
KR101808985B1 (ko) * 2017-03-31 2017-12-13 성균관대학교산학협력단 고분자 나노무기입자 복합체 및 이를 제조하는 방법

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101193315B1 (ko) 2003-10-24 2012-10-19 레오나르트 쿠르츠 스티프퉁 운트 코. 카게 접착제의 구조화 및 전사 필름에 의한 전기적 기능층의 구조화
JP2009184155A (ja) 2008-02-04 2009-08-20 Touch Panel Kenkyusho:Kk 導電性フィルムまたは導電性シートおよび抵抗膜式タッチパネル構造体
KR101542702B1 (ko) 2014-12-31 2015-08-06 성균관대학교산학협력단 투명 접착제용 조성물 및 이를 제조하는 방법

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018182353A1 (fr) * 2017-03-31 2018-10-04 성균관대학교산학협력단 Composite de nanoparticules de polymères et son procédé de préparation
KR20210090352A (ko) * 2020-01-10 2021-07-20 성균관대학교산학협력단 엠보가 형성된 방열 코팅층 및 방열 시트의 제조 방법
KR102563235B1 (ko) * 2020-01-10 2023-08-03 성균관대학교산학협력단 엠보가 형성된 방열 코팅층 및 방열 시트의 제조 방법

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