WO2018182353A1

WO2018182353A1 - Polymer nanoparticle composite and method for preparing same

Info

Publication number: WO2018182353A1
Application number: PCT/KR2018/003767
Authority: WO
Inventors: 김태일; 홍혜린; 김윤철
Original assignee: 성균관대학교산학협력단
Priority date: 2017-03-31
Filing date: 2018-03-30
Publication date: 2018-10-04
Also published as: KR101808985B1

Abstract

A polymer nanoparticle composite according to one embodiment of the present invention comprises: a substrate; a first adhesive layer, on the surface layer, having a first engraved surface; a first inorganic nanoparticle layer, stacked on the first engraved surface, on the first adhesive layer; a second adhesive layer, on the first inorganic nanoparticle layer, filling the engraved space of the first engraved surface, having a predetermined thickness, and having a second engraved surface; and a second inorganic nanoparticle layer, stacked on the second engraved surface, on the second adhesive layer, wherein the first inorganic nanoparticle layer and the second inorganic nanoparticle layer are electrically or thermally connected in a vertical direction.

Description

Polymer nanoinorganic particle composite and method for manufacturing same

The present invention relates to a polymer-nano inorganic particle composite, and more particularly, to a polymer-nano inorganic particle composite that can be used as a heat sink and an electromagnetic wave shielding agent because of its excellent thermal and electrical conductivity.

BACKGROUND ART High thermal conductivity substrates are frequently used to effectively remove heat from devices having heat-generating properties to protect products or to maintain performance of devices.

In the case of the conventional polymer-nanoparticle composite having thermal conductivity, the nanoparticles were manufactured by physically dispersing the nanoparticles in the polymer. This has the advantages of the polymer and at the same time have the properties of the functional nanoparticles, the process is easy and simple has shown an advantage in mass production. However, since the nanoparticles are randomly located in the polymer, high nanoparticle ratios are required in order to secure high thermal conductivity, thereby degrading the polymer properties such as low flexibility, fragile and low adhesion, and high unit cost. There was a downside. In addition, it is difficult to control the effective nanoparticle arrangement, so that the vertical heat transfer rate is reported to be 10 times smaller than the horizontal heat transfer rate.

In addition, despite the addition of nanoparticles in a low ratio, in order to realize high thermal conductivity, a method of aligning the nanoparticles in the polymer was also used. According to a specific manufacturing method, a method of dispersing metalized nanoparticles in a flowable polymer and then aligning them using magnetic force, and aligning the nanoparticles such as filtration using a filter paper or freezing molding, and then emptying the polymer This can be broken down by filling in.

In the case of the method of aligning using magnetic force, in order to make the nanoparticles react with the magnetic force, the surface of the particles was coated with metal ions or the like, so that the insulation was poor and the process was time-consuming due to the viscosity of the polymer. . In addition, alignment in only one direction is possible, so that the thermal conductivity in the vertical direction is rather reduced.

In addition, even in the case of filtration, alignment can be performed only in the plane direction, and the thermal conductivity in the axial direction is greatly reduced.

In addition, in the case of the method of filling the polymer after the nanoparticle alignment, such as filtration or freeze-molding, the volume is increased during the injection of the polymer, the alignment is disturbed. In addition, the reproducibility was greatly reduced because the alignment interval and density cannot be precisely controlled during the alignment process. In addition, there was a disadvantage in that the filling rate of the nanofiller could not be maximized.

Therefore, it has similar thermal conductivity in the vertical and horizontal directions, transmits heat stably even in high temperature environment due to accumulated heat, and has excellent electrical insulation to prevent crosstalk in high-integrated circuits, and adhesive properties for connecting elements and substrates. It is time to develop this excellent composite manufacturing technology.

One object of the present invention is to provide a polymer-nano inorganic particle composite having excellent electrical or thermal transfer property vertically and horizontally and a method for producing the same.

According to one embodiment of the invention, the polymer nano-inorganic composite is a substrate, a first adhesive layer having a first negative surface on the substrate, a first laminated on the first adhesive layer, along the first negative surface A nanoinorganic particle layer, on the first nanoinorganic particle layer, a second adhesive layer having a second intaglio surface having a constant thickness and a second intaglio space on the first intaglio surface, and the second intaglio on the second adhesive layer And a second nanoinorganic particle layer stacked along the surface, wherein the first nanoinorganic particle layer and the second nanoinorganic particle layer are electrically or thermally connected in a vertical direction.

In one embodiment, the substrate may be a flexible transparent substrate.

In one embodiment, the coating on the adhesive layer of the first and second nanoinorganic particles may be located on the surface of the adhesive layer, or all or part of the nanoinorganic particles may be impregnated into the adhesive layer.

In one embodiment, the adhesive may include a bisphenol A acrylate compound and an alkoxysilyl acrylate compound.

In one embodiment, the bisphenol A-based diacrylate compound may include bisphenol A glycerolate (1 glycerol / phenol) diacrylate of Formula 1 below.

Formula 1

In one embodiment, the alkoxysilyl-based acrylate compound may include 3- (trimethoxysilyl) propyl methacrylate (Formula 2) below.

Formula 2

In one embodiment, the adhesive may comprise a photoinitiator.

In one embodiment, the photoinitiator comprises 2-benzyl-2- (dimethylamino) -4-morpholinobutyrophenone (2-Benzyl-2- (dimethylamino) -4-morpholinobutyrophenone) of Formula 3 below, Polymer Nano Inorganic Particle Complex:

Formula 3

In one embodiment, the adhesive may comprise poly (methyl silsesquioxane).

In one embodiment, the thickness of the adhesive layer may be smaller than the thickness of the intaglio surface.

In one embodiment, the nano-inorganic particles, may include at least one of graphene, metallic grid, carbon nanotubes, silver nanowires and boron nitride.

Another embodiment of the heat sink may include any one of the above-described polymer nano-inorganic composites.

Another embodiment of the present invention, the electromagnetic wave shielding agent may include any one of the above-described polymer nano-inorganic composites.

In another embodiment of the present invention, a method for preparing a polymer nanoinorganic particle composite includes a first step of preparing a substrate, a second step of forming a first adhesive layer on the substrate, and a stamp having nano inorganic particles located on an embossed surface thereof. By using, the first negative surface is formed on one surface of the first adhesive layer, the third step of laminating the nano-inorganic particle layer along the first negative surface, while the first negative surface formed by the nano-inorganic particle layer A fourth step of forming a second adhesive layer to have a predetermined thickness, and a fifth step of forming a second negative surface on one surface of the second adhesive layer by using a stamp in which nano-inorganic particles are placed on the embossed surface; Including, the first nano-inorganic particle layer and the second nano-inorganic particle layer adjacent to the first nano-inorganic particle layer is electrically or thermally connected in the vertical direction.

In one embodiment, the adhesive is a thermosetting or light curing adhesive, and in the third step, the adhesive is cured by irradiation with heat or light.

According to one embodiment of the present invention, even if a low content of the nano-inorganic particles, it is possible to implement a high thermal conductivity, it is possible to maintain the flexibility, adhesion and the like properties of the polymer. In addition, since the mold is manufactured, high reliability can be maintained even in mass production, and the thermal conductivity can be effectively controlled by adjusting the size of the structure and the aspect ratio. The present invention can be applied to various fields such as a TIM and a heat dissipation substrate.

Specifically, high thermal conductivity may be achieved even at a low nanoparticle ratio. By controlling the size and aspect ratio of the mold structure, 3D structures having various densities can be fabricated, and the selective thermal conductivity in the axial (vertical) and plane (horizontal) directions can also be controlled using the same. In addition, by using the adhesive polymer, it is possible to easily transfer the device to the substrate without a separate process. And using the photocurable polymer, the adhesiveness of the part in which an element is not transferred can be removed easily. In addition, by using a polymer having a high flexibility, it can be applied to the bending device.

1 is a schematic diagram of a method for producing a composite of an embodiment of the present invention.

Figure 2 is a schematic diagram of a cross-sectional view of a composite according to another embodiment of the present invention.

Figure 3 is a schematic diagram of a cross-sectional view of a composite according to another embodiment of the present invention.

4 is a schematic diagram of a heat sink and an IC chip including a composite according to another embodiment of the present invention.

5 (a) and (b) are electron micrographs of the cross section of the composite according to another embodiment of the present invention.

FIG. 6 is an electron micrograph, an energy dispersive spectroscopy (EDS) result graph, and a result table of a part of the composite shown in FIG. 5.

The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, the terms "comprise" or "have" are intended to indicate that a feature, component, or the like described in the specification exists, and one or more other features or components may not be present or added thereto. It does not mean nothing.

As used herein, "first", "second", and the like do not limit the components of the present invention, but are merely set to distinguish the components.

As used in this application, the meaning of “on” or “on” includes not only directly placing another component on one component, but also inserting and placing a third component between two components. do.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art. Terms such as those defined in the commonly used dictionaries should be construed as having meanings consistent with the meanings in the context of the related art, and are not construed in ideal or excessively formal meanings unless expressly defined in this application. Do not.

Hereinafter, each embodiment will be described in detail with reference to the accompanying drawings.

Figure 1 shows a schematic diagram of a method for producing a composite of an embodiment of the present invention. As shown in FIG. 1, the adhesive layer (Adhesive) laminated on the substrate is transferred to a polydimethylsiloxane (PDMS) -coated stamp (PDMS) coated with nano-inorganic particles, and the embossed layer is formed on the stamp. A corresponding intaglio is formed, and along the intaglio surface, nano inorganic particle layers are stacked. Alternatively, the composite may be prepared by applying an adhesive layer and repeating the process of forming a negative surface on the adhesive layer with a stamp. Here, by irradiating heat or light at the time of stamping, the nano-inorganic particle layer can be better transferred, and the adhesive layer can be cured. However, in the present invention, the order disclosed in FIG. 1 is only one example, and the specific manufacturing method thereof is not limited to FIG. 1.

(1) 제1 단계(1) first step

In the method of manufacturing a composite according to an embodiment of the present invention, first, as a first step, a substrate is prepared. The substrate is not particularly limited, but may be a polymer substrate, preferably a flexible transparent polymer such as PET.

(2) 제2 단계(2) second stage

As a second step, a first adhesive layer is formed on the substrate. The first adhesive layer may be positioned on the substrate by various methods in a range consistent with the object of the present invention.

The adhesive is a thermosetting or light curing adhesive, and in the third step, it may be cured by irradiating heat or light.

The adhesive may include a transparent adhesive including a bisphenol A acrylate compound and an alkoxysilyl acrylate compound.

The bisphenol A-based diacrylate compound may be bisphenol A glycerolate (1 glycerol / phenol) diacrylate of Formula 1 below.

The alkoxysilyl acrylate compound may be 3- (trimethoxysilyl) propyl methacrylate of Formula 2 below.

In addition, the adhesive may include a photoinitiator.

The photoinitiator may be 2-benzyl-2- (dimethylamino) -4-morpholinobutyrophenone (2-Benzyl-2- (dimethylamino) -4-morpholinobutyrophenone) of Formula 3 below.

The adhesive may comprise poly (methyl silsesquioxane).

The adhesive of the present invention can provide sufficient adhesion to the nano-inorganic particles while forming a thin layer, and facilitates percolation between the nano-inorganic particles. This percolation maximizes the conduction and heat dissipation characteristics.

The thickness of the adhesive layer of the present invention is characterized in that 100nm to 150nm, less than 100nm may cause a process defect. Thickness of 150 nm or more may lower the mechanical stability.

(3) 제3 단계(3) third stage

Then, as a third step, by using a stamp in which the nano-inorganic particles are located on the embossed surface, a first negative surface is formed on one surface of the first adhesive layer, and the nano-inorganic particle layer is stacked along the first negative surface. .

Here, the coating on the adhesive layer of the nano-inorganic particles may be located on the surface of the adhesive layer, or include impregnating some or all of the nano-inorganic particles into the folding layer.

For the stamping, a stamp can be used. The stamp may use a polymethylsiloxane (PMDS) mold for structures such as lines, spaces, pillars, prisms, and the like. In the present invention, the mold is only one example of performing a stamping process, but is not limited thereto.

In the method using such a mold, first, the boron nitride particles dispersed in ethanol are uniformly coated on the PDMS structure, and when the PDMS coating is applied with heat, the solvent is blown away immediately after passing the bar coater with the solution. Boron is coated onto the PDMS in the plane direction, increasing contact between the nanoparticles, thereby increasing thermal conductivity. The coating thickness may be controlled by adjusting the concentration of the boron nitride dispersion, the coating speed, and the temperature.

Since the 3D structure of the nanoparticles in the polymer is made through the multi-layer transfer method of the nanoparticles through the PDMS mold, it is easy to modify the nanoparticle structure according to the size and aspect ratio of the mold. In addition, in the case of transfer using a mold, since it has high reproducibility, large area production using roll-to-roll is also possible.

In addition, the nano-inorganic particles may include at least one of graphene, a metallic grid, carbon nanotubes, silver nanowires and boron nitride.

As the nano-inorganic particles coated stamp is physically contacted with the adhesive layer and pressure is applied, an embossed surface is formed on the adhesive layer so as to correspond to the relief formed on the stamp. In addition, the nano-inorganic particle layer coated on the surface of the stamp is transferred, located along the embossed surface of the adhesive layer.

Here, the embossed or engraved surface is not particularly limited in the specific surface form, but represents a surface shape such as an uneven or serrated form formed on the surface of the adhesive layer.

In the third step, heat or light can be further irradiated. When the stamp is peeled off after partially curing the adhesive layer by irradiation with heat or light, the structure of the relief surface is formed to correspond to the relief formed on the surface of the stamp on the adhesive layer, and simultaneously coated on the stamp due to the adhesive property of the adhesive. The nano inorganic particle layer can be easily transferred to the adhesive layer. In addition, by using partial curing through heat or light during transfer, separation between layers can be prevented. As described below, the sheet having the nanoparticle 3D structure in the adhesive layer may be prepared by coating the adhesive layer thereon and transferring the inorganic nanoparticles several times.

(4) 제4단계(4) 4th step

As a fourth step, the second adhesive layer is formed to have a predetermined thickness while forming the first intaglio surface formed by the nano-inorganic particle layer.

The description of the second adhesive layer used here is the same as that described in the first adhesive layer, and thus no particular description is given. However, the second adhesive layer and the first adhesive layer may be the same composition, or may be different. In addition, the shape of the intaglio surface may be the same or may be different.

(5) 제5단계(5) 5th step

As a fifth step, a second negative surface is formed on one surface of the second adhesive layer by using a stamp in which nano-inorganic particles are positioned on the relief surface.

The stamp used here may use the same stamp as described in the above-described third step. However, it is not limited to this.

In addition, the second and third steps may be performed two or more times to form a composite in which the adhesive layer coated with the nano-inorganic particle layer is alternately laminated.

Hereinafter, using the first and second modifiers, the adhesive layer on which the nanoparticle layer formed first is laminated and the adhesive layer on which the nanoparticle layer formed second are laminated will be described.

Specifically, first, through the first to the third step, the first adhesive layer in which the first nano-inorganic particle layer is laminated on the negative surface, laminated on the substrate and the substrate is formed. An additional adhesive is applied on the intaglio surface to laminate the second adhesive layer. The second adhesive layer also forms an intaglio surface through the third step, and stacks the second nano-inorganic particle layer. This process can be carried out repeatedly to suit the purpose of the present invention.

However, in this case, the first nano inorganic particle layer and the first adhesive layer, the second nano inorganic particle layer and the second adhesive layer may be alternately stacked. The alternating stacking means that the first layer and the second layer stacked on the first layer do not overlap and overlap each other. For example, the first layer and the second layer stacked alternately or at an angle are stacked at an angle. It is used herein in the sense of inclusion.

In the present invention, through the stacked structure, among the plurality of nano-inorganic particle layers in the composite, the first nano-inorganic particle layer and the second nano-inorganic particle layer adjacent to the first nano-inorganic particle layer may be electrically or thermally connected in the vertical direction. have. Here, "connected" means that some or all of the first nano inorganic particle layer is in physical contact with the second nano inorganic particle layer.

Further, in order to connect the first nanoinorganic particle layer and the second nanoinorganic particle layer in such a vertical direction, the thickness of the second adhesive layer is the intaglio of the second adhesive layer except for the depth to fill the intaglio surface of the first adhesive layer. It is desirable to be smaller than the thickness of the surface.

However, if the first nanoinorganic particle layer and the adjacent second nanoinorganic particle layer can be vertically connected, the pattern, direction, depth, etc. of the intaglio surface of the first composite layer and the intaglio surface of the second composite layer are the same, or It may be different.

A composite according to another embodiment of the present invention is a substrate, a first adhesive layer having a first negative surface on the substrate, the first nano-inorganic particle layer laminated on the first adhesive layer, along the first negative surface On the first nano-inorganic particle layer, a second adhesive layer having a second intaglio surface having a constant thickness and a second intaglio space of the first intaglio surface, and along the second intaglio surface on the second adhesive layer The stacked second nano inorganic particle layer, wherein the first nano inorganic particle layer and the second nano inorganic particle layer is electrically or thermally connected in the vertical direction.

In the description of this embodiment, the components described in the above-described manufacturing method are omitted.

2 and 3 is a schematic view of a cross-sectional view of the composite according to an embodiment of the present invention. 2 and 3 are only examples of the present invention, and the present invention is not limited to these structures. As shown in FIG. 2 and FIG. 3, the first nanoinorganic particle layer 22 and the second nanoinorganic particle layer 32 are vertically connected, so that thermal or electrical conduction can be quickly performed.

Specifically, the composite 1 of the present invention includes a substrate 10 and

composite layers

20 and 30 stacked on the substrate 10. The composite layers 20 and 30 are composed of

adhesive layers

21 and 31 and nano inorganic particle layers 22 and 32. A negative surface exists on the surface of the adhesive layer that does not face the substrate, and a nano inorganic particle layer is laminated along the negative surface. The composite layers may be laminated alternately. The number of laminated composite layers can be variously applied as desired by the present invention.

However, the nano-inorganic particle layer should be in contact with the nano-inorganic particle layer which is partially or entirely adjacent to the layers to be stacked in the vertical direction, through which, it should be electrically or thermally connected.

Another embodiment of the heat sink of the present invention includes any one of the various composites described above.

4 is a schematic view of a heat sink and an IC chip including a composite according to another embodiment of the present invention. In FIG. 4, h-BN & polymer composite refers to a composite obtained by alternately stacking an inorganic nanoparticle layer and an adhesive layer. The enlarged inset shows a composite placed on a heat sink and alternately stacked layers comprising adhesive and nano-inorganic particles (H-BN). Since the nano-inorganic particle layers are vertically thermally or electrically connected inside the composite, heat generated in an electronic device including an IC chip is easily released to the heat sink.

Another embodiment of the present invention, the electromagnetic wave shielding agent includes any one of the above-described various composites.

Hereinafter, the present invention will be described in detail through specific examples.

Example 1

To prepare the polymer-nano inorganic particle composite, bisphenol A glycerol (1 glycerol / phenol) diacrylate, 3- (trimethoxysilyl) propyl methacrylate, spin-on glass (SOG 500F), as an ultra-thin adhesive 2-benzyl-2- (dimethylamino) -4 and anhydrous ethanol were prepared by mixing in a ratio of 200: 100: 100: 9: 1700. The PET film was prepared as a substrate, which was treated with oxygen plasma, and then the adhesive prepared on the substrate was spin coated at 3000 rpm for 30 seconds to form a 100-120 nm thick adhesive layer.

PDMS was prepared as a stamp material to transfer the nano-inorganic particles to the adhesive layer by a stamping method. PDMS stamps were prepared using the SYLGARD 184 silicone elastomer kit (Dow Corning Inc.). In SYLGARD 184, the PDMS precursor and the curing agent are mixed in a 10: 1 ratio and poured into a Petri dish. The bubbles were removed and cured at 70 ° C. for 1 hour. Boron nitride was coated to form a nano-inorganic particle layer on the PDMS mold. Using a boron nitride-coated PDMS mold, a stamping process was performed to form a negative surface on the adhesive layer, and the nano-inorganic particle layer was transferred onto the negative surface. This process was repeated 5 or more times.

5 (a) and (b) show electron micrographs of the cross sections of the examples prepared under the experimental conditions described above. As shown in Figure 5 (a) and (b), it was confirmed that the nano-inorganic particle layer is vertically connected.

6 shows an electron micrograph, an energy dispersive spectroscopy (EDS) result graph, and a result table of a part of the composite shown in FIG. 5. As shown in Figure 6, it was confirmed that the presence of a large amount of nitrogen and boron in the portion connected to the nano-inorganic particle layer.

While the foregoing has been described with reference to preferred embodiments of the present invention, those skilled in the art will be able to variously modify and change the present invention without departing from the spirit and scope of the invention as set forth in the claims below. It will be appreciated.

Claims

Board;

A first adhesive layer having a first negative surface on the substrate;

A first nano-inorganic particle layer laminated on the first adhesive layer along the first intaglio surface;

A second adhesive layer on the first nanoinorganic particle layer, having a second intaglio surface having a constant thickness and having an intaglio space of the first intaglio surface; And

A second nano-inorganic particle layer laminated on the second adhesive layer along the second engraved surface,

The first nano-inorganic particle layer and the second nano-inorganic particle layer is electrically or thermally connected in the vertical direction, the polymer nano-inorganic particle composite.
The method of claim 1,

Wherein the substrate is a flexible transparent substrate, the polymer nano-inorganic particles composite.
The method of claim 1,

The coating on the adhesive layer of the first and second nanoinorganic particles comprises polymer nanoinorganic particle composites which are located on the surface of the adhesive layer or in which all or a portion of the nanoinorganic particles are impregnated into the adhesive layer.
The method of claim 1,

The adhesive is a polymer nano-inorganic composite, comprising a transparent adhesive comprising a bisphenol A acrylate compound and an alkoxysilyl acrylate compound.
The method of claim 4, wherein

The bisphenol A-based diacrylate compound includes bisphenol A glycerolate (1 glycerol / phenol) diacrylate of Formula 1 below, polymer nano inorganic particle complex:

Formula 1
The method of claim 4, wherein

The alkoxysilyl acrylate compound includes 3- (trimethoxysilyl) propyl methacrylate (3- (trimethoxysilyl) propyl methacrylate) of Formula 2 below, polymer nano-inorganic particle composite:

Formula 2
The method of claim 4, wherein

The adhesive comprises a photoinitiator, polymer nano inorganic particles composite.
The method of claim 7, wherein

The photoinitiator comprises 2-benzyl-2- (dimethylamino) -4-morpholinobutyrophenone (2-Benzyl-2- (dimethylamino) -4-morpholinobutyrophenone) of Formula 3 below, a polymer nano-inorganic composite :

Formula 3
The method of claim 4, wherein

The adhesive comprises a poly (methyl silsesquioxane) (poly (methyl silsesquioxane)), polymer nano inorganic particles composite.
The method of claim 1,

The thickness of the adhesive layer is smaller than the thickness of the intaglio surface, polymer nano inorganic particles composite.
The method of claim 1,

The nano-inorganic particles, graphene, metallic grid, carbon nanotubes, silver nanowires and boron nitride at least one of, the nano nanoparticles composite.
A heat sink comprising the polymer nanoinorganic particle composite of any one of claims 1 to 11.
An electromagnetic wave shielding material comprising a multilayer thin film of the polymer nanoinorganic particle composite according to any one of claims 1 to 11.
A first step of preparing a substrate;

A second step of forming a first adhesive layer on the substrate; And

A third step of forming a first negative surface on one surface of the first adhesive layer by using a stamp having nano inorganic particles on an embossed surface, and stacking the nano inorganic particle layer along the first negative surface;

A fourth step of forming a second adhesive layer so as to have a predetermined thickness while forming the first intaglio surface formed by the nano-inorganic particle layer; And

And a fifth step of forming a second engraved surface on one surface of the second adhesive layer by using a stamp having nano inorganic particles located on an embossed surface.

The first nano-inorganic particle layer and the second nano-inorganic particle layer adjacent to the first nano-inorganic particle layer is electrically or thermally connected in the vertical direction, the method for producing a polymer nano-inorganic particle composite.
The method of claim 14,

The adhesive is a thermosetting or light curing adhesive,

In the third step, the curing method by irradiating heat or light, polymer nano-inorganic particle composite.
The method of claim 14,

The substrate is a flexible transparent substrate, a method for producing a polymer nano-inorganic particle composite.
The method of claim 14,

The coating on the adhesive layer of the nano-inorganic particles includes the impregnation of all or a portion of the nano-inorganic particles on the surface of the adhesive layer or into the adhesive layer.
The method of claim 14,

The adhesive includes a transparent adhesive comprising a bisphenol A acrylate compound and an alkoxysilyl acrylate compound.
The method of claim 18,

The bisphenol A-based diacrylate compound includes a bisphenol A glycerolate (1 glycerol / phenol) diacrylate of the formula (1) below, a method for producing a polymer nano inorganic particle composite :

Formula 1
The method of claim 18,

The alkoxysilyl acrylate compound includes 3- (trimethoxysilyl) propyl methacrylate (3- (trimethoxysilyl) propyl methacrylate) of Formula 2 below:

Formula 2
The method of claim 18,

The adhesive comprises a photoinitiator, a method for producing a polymer nano-inorganic particle composite.
The method of claim 21,

The photoinitiator comprises 2-benzyl-2- (dimethylamino) -4-morpholinobutyrophenone (2-Benzyl-2- (dimethylamino) -4-morpholinobutyrophenone) of Formula 3 below, a polymer nano-inorganic composite Manufacturing Method:

Formula 3
The method of claim 18,

The adhesive comprises a poly (methyl silsesquioxane) (poly (methyl silsesquioxane)), a method for producing a polymer nano-inorganic particle composite.
The method of claim 14,

The thickness of the adhesive layer is smaller than the thickness of the intaglio surface, the manufacturing method of the polymer nano-inorganic particle composite.
The method of claim 14,

The nano-inorganic particles, graphene, metallic grid, carbon nanotubes, silver nanowires and boron nitride at least one of, the method of producing a polymer nano inorganic particles composite.