WO2016163695A1 - Procédé de fabrication de carte de circuit imprimé multicouche à l'aide d'une encre conductrice au cuivre et d'un frittage à la lumière, et carte de circuit imprimé multicouche ainsi fabriquée - Google Patents

Procédé de fabrication de carte de circuit imprimé multicouche à l'aide d'une encre conductrice au cuivre et d'un frittage à la lumière, et carte de circuit imprimé multicouche ainsi fabriquée Download PDF

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WO2016163695A1
WO2016163695A1 PCT/KR2016/003447 KR2016003447W WO2016163695A1 WO 2016163695 A1 WO2016163695 A1 WO 2016163695A1 KR 2016003447 W KR2016003447 W KR 2016003447W WO 2016163695 A1 WO2016163695 A1 WO 2016163695A1
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printed circuit
circuit board
printing
conductive copper
manufacturing
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PCT/KR2016/003447
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English (en)
Korean (ko)
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김학성
주성준
남권우
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한양대학교 산학협력단
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Definitions

  • the present invention relates to a method of manufacturing a multilayer printed circuit board using conductive copper ink and photosintering, and a multilayer printed circuit board manufactured therefrom.
  • the conventional multilayer circuit board manufacturing method uses a semiconductor process. First, an electrode pattern is formed by applying a photoetching process to a plate on which copper copper foils are laminated on both surfaces of an insulating layer. In the plate where the via hole is required, the hole is drilled using a laser or a drill, and then the copper foil is plated to form the copper foil inside the hole. After the above process is completed, one double-sided circuit board is completed, and this method is repeated to manufacture another double-sided circuit board having a pattern, and then an adhesive insulating sheet such as prepreg is laminated on the upper and lower surfaces of the double-sided circuit board. Then, deterioration compression is performed on the entire substrate layer to produce a multilayer circuit board.
  • the above-described process has a problem that it is very inefficient in the manufacture of a printed circuit board because it is a method to form a circuit, then again drilled through a punching process and plated inside the hole.
  • the photolithography process is currently a manufacturing method of most printed circuit boards, but since it is an intermittent production method of more than 12 steps, it is very complicated, has high process cost, and uses a large amount of toxic chemicals such as acid, so that it can be applied to the next-generation flexible substrate. Not only is it difficult, but it can also cause environmental pollution.
  • the demand for via holes for printed circuit boards is increasing, and thus, difficulties in manufacturing processes using conventional photolithography manufacturing methods are increasing.
  • printed electronic technology is a continuous process manufacturing method for forming a print-based electrode pattern such as screen printing, gravure printing, etc., and consists of three simple processes of printing, drying, and sintering, which are conventional photolithography. Compared to the process, it has the advantages of low cost, eco-friendliness, flexibility, large area mass production, low temperature / simple process and so on.
  • the printed electronic technology may be applied to various electronic products such as a flexible display, a solar cell, a radio frequency identification device (RFID), a flexible electronic product, a wearable electronic product, a thin solar cell, and a thin battery.
  • RFID radio frequency identification
  • the core technology of the printing electronic device, as well as the conductive ink the sintering process, which is a very important process that will affect the damage of the substrate, the electrical conductivity of the pattern after sintering and the quality of the pattern according to the sintering method and conditions to be.
  • Conventional sintering method of conductive nano ink has a thermal sintering method, but since the sintering is performed at a high temperature of 300 ° C. or higher, there is a problem that it cannot be applied to a flexible substrate which is a next-generation substrate.
  • laser sintering, plasma sintering, micro Wave sintering and the like have been proposed. However, these techniques also have problems that are unsuitable for electronic pattern printing, increase production costs, and are not suitable for mass production.
  • Korean Patent Laid-Open Publication No. 10-2012-0132424 discloses a method of photosintering conductive copper nanoinks, specifically, mixing copper nanoparticles or copper precursors with a polymer dispersant, coating and drying on a substrate, and extreme A method of photosintering conductive copper nano ink through a process such as wave white light irradiation is disclosed.
  • Korean Patent Publication No. 10-2014-0044743 discloses a conductive hybrid copper ink and a photosintering method using the same, specifically, copper nanoparticles, a copper precursor, and / or a metal precursor other than copper having a predetermined solubility. And a method of photosintering a conductive hybrid copper ink by mixing a polymer binder resin, coating and drying on a substrate, and irradiation with microwave white light.
  • Patent Document 1 Korean Unexamined Patent Publication No. 10-2012-0132424
  • Patent Document 2 Republic of Korea Patent Publication No. 10-2014-0044743
  • the present invention to solve the above problems,
  • It provides a method of manufacturing a multilayer printed circuit board using a conductive copper ink and photosintering comprising a.
  • the substrate is photopaper, PET, paper, glass, polybutylene terephthalate, polyethylene terephthalate, polysulfone, polyether, polyetherimide, polyethylene naphthalate (PEN), polymethyl Of methacrylate, acrylic resin, heat resistant epoxy, BT epoxy / glass fiber, vinyl acetate resin (EVA), butyl rubber resin, polyarylate, polyimide, polycarbonate, silicone, ferrite, ceramic and FR-4 It can be any one substrate selected.
  • the via hole is formed by drilling the substrate by a drill or a laser before step b), and may have a diameter of 20 ⁇ m to 150 ⁇ m.
  • the conductive copper ink may include 30 wt% to 80 wt% of the copper nanoparticles based on the total weight of the conductive copper ink.
  • the conductive copper ink is 5 wt% to 35 wt% copper precursor, 0.05 wt% to 2 wt% carbon nanotube and 0.1 wt% to the total weight of the conductive copper ink. It may further comprise one or more materials selected from the group consisting of 10% by weight of copper nanowires.
  • the coating of the conductive copper ink during the step b) is screen printing, inkjet printing, micro-contact printing, imprinting ), Gravure printing, gravure-offset printing and flexographic printing by at least one printing method selected from the group consisting of 30 mm / s to 200 mm / s At a printing speed, it may be performed once to 20 times.
  • additional preliminary printing may be performed using a plate making perforated only the portion corresponding to the via hole, or a mask that may penetrate ink only into the portion corresponding to the via hole. can do.
  • the light sintering step of step c) is 1 J / cm 2 to 7 J / cm 2 light irradiation energy for preheating or tissue densification, or solvent drying to increase the light sintering efficiency
  • the light sintering step of step c) is a light irradiation energy of 4 J / cm 2 to 20 J / cm 2 , a pulse duration of 0.05 ms to 20 ms, and It can be performed by light irradiation with a xenon flash lamp, with a light pulse number of 1 to 100 times.
  • the lamination of step d) may be performed by laminating an insulating layer between the lower surface of one double-sided printed circuit board and the lower surface of the other double-sided printed circuit board and then thermocompressing. .
  • the blind via hole or through hole printing step of step e) is filled with the blind via hole or through hole by using a conductive copper ink, by performing printing once to 30 times Can be performed.
  • the blind via hole or through hole printing step of step e) may be performed using a mask capable of printing only the blind via hole or through hole.
  • the blind via-hole or through-hole photosintering step of step e) may include a pre-irradiation step for preheating or densifying tissue to increase photosintering efficiency, or drying the solvent; And dividing into the main light irradiation step for sintering the particles, or dividing into multiple stages.
  • the preliminary light irradiation step of the blind via hole or through-hole sintering step of step e) is a light irradiation energy of 2 J / cm 2 to 10 J / cm 2 , step 1 To step 5 may be performed.
  • the present invention also provides a multilayer printed circuit board manufactured by the above method.
  • the present invention it is possible to manufacture a multilayer printed circuit board having a low cost, simple and excellent electrical conductivity within a short time, and the manufactured multilayer printed circuit board is suitable for high density and miniaturization, and can be generated during printing and sintering. There is no problem of insufficient filling or insufficient sintering.
  • large-area and mass-produced white light sintering processes that can be linked to the R2R process can be achieved, resulting in Radio Frequency Identification Device (RFID), Flexible Electronics, Wearable Electronics, and Large Area Display. It can be widely applied to high value-added products such as thin plate solar cell, thin plate battery and the like.
  • FIG. 1 is a schematic process diagram of a method of manufacturing a multilayer printed circuit board using a conductive copper ink and photosintering according to the present invention.
  • Figure 2 is a view showing a comparison of the finished pattern after printing according to the content of the copper nanoparticles in the conductive copper ink used in the present invention in a photograph.
  • FIG. 3 shows a schematic diagram of a method of coating a conductive ink in the method according to the invention.
  • FIG. 4 is a view schematically showing a process diagram in which the light sintering is performed in a preliminary light irradiation step and a main light irradiation step in order to improve the sintering characteristics of the via holes in the method according to the present invention.
  • FIG. 5 illustrates a method of stacking a plurality of double-sided printed circuit boards and forming blind via holes or through holes, performing a printing process on the stacked multilayer printed circuit boards, and a printed substrate.
  • Figure is a schematic diagram showing a process for the step of drying.
  • FIG. 6 is a diagram showing a schematic process diagram in which preliminary light irradiation and main light irradiation are performed only on a portion of a hole in which conductive ink is printed and dried.
  • 7a to 7d are photographs observed by scanning electron microscopy (SEM) after photosintering using various inks according to the present invention.
  • SEM scanning electron microscopy
  • a conventional method of manufacturing a multilayer copper circuit board based on a conventional copper copper foil is a semiconductor process.
  • one double-sided circuit board is completed, and a plurality of double-sided circuit boards are formed by repeating the pattern.
  • the multilayer printed circuit board is manufactured by laminating an adhesive insulating sheet such as prepreg on the upper and lower surfaces of the plurality of double-sided circuit boards, and then bonding the entire substrate layer through deterioration compression.
  • this conventional conventional method is very inefficient because the circuit is formed using a photolithography process, and then additionally performs the perforation process and the plating process.
  • the photolithography process is currently a manufacturing method for most printed circuit boards, and is an intermittent production method including a multi-step, for example, 12 or more steps, which leads to an increase in process cost since the process itself is very complicated.
  • toxic chemicals such as acids used in photolithography processes not only cause environmental pollution problems, but also are not suitable for application to next generation flexible substrates.
  • there is a lot of difficulties in applying the conventional photolithography process because the demand for via holes in a printed circuit board is increasing.
  • the present invention proposes a method of manufacturing a printing-based multilayer printed circuit board, which is mainly composed of three steps of printing, drying, and sintering, and a conventional photolithography process, and another solution proposed to solve the problem. It solved most of the problems caused by the processes. Specifically, problems of the conventional method of manufacturing a multilayer printed circuit board based on printing, that is, a problem of being very expensive because noble metal based nanoparticles are used, and to solve such problems, a process based on conductive nanoparticles such as copper is used.
  • the substrate used may be a rigid or flexible substrate.
  • the substrate may be photo paper, PET, paper, glass, polybutylene terephthalate, polyethylene terephthalate, polysulfone, polyether, polyetherimide, polyethylene naphthalate (PEN), poly Methyl methacrylate, acrylic resin, heat resistant epoxy, BT epoxy / glass fiber, vinyl acetate resin (EVA), butyl rubber resin, polyarylate, polyimide, polycarbonate, silicone, ferrite, ceramic and FR-4 It may be any substrate selected from among, and preferably, any one selected from glass, polyimide, polycarbonate, polymethyl methacrylate, polyethylene terephthalate, heat resistant epoxy, and FR-4.
  • Figure 1 shows a schematic process diagram of the method according to the invention, referring to Figure 1, in the present invention, first, a via hole is formed in a predetermined portion of the substrate, the via hole is to perform a subsequent printing step It may be formed by previously punching the substrate using a drilling means such as a drill or a laser in advance.
  • the size of the formed via hole may have a diameter of 20 ⁇ m to 150 ⁇ m, and when the diameter of the via hole is out of the range, it is preferable to perforate the via hole with an appropriate size because ink filling becomes difficult during the printing process. .
  • the conductive ink is coated on the top and bottom surfaces of the substrate on which the via holes are formed and then dried.
  • the present invention uses a conductive copper ink that is economical and has excellent electrical conductivity compared to the conductive ink based on the precious metal, wherein the conductive copper ink is 30 wt% to 80 based on the total weight of the conductive copper ink. It may comprise by weight copper nanoparticles.
  • FIG. 2 shows photographs of the completed patterns after printing according to the content of copper nanoparticles in the conductive copper ink.
  • an excellent pattern is produced when the content of the copper nanoparticles is 30% by weight to 80% by weight based on the total weight of the conductive copper ink, and when the content of the copper nanoparticles is less than 30% by weight. Since the viscosity of the ink is excessively reduced, it is difficult to maintain the pattern shape after printing, and when it exceeds 80% by weight, the ink does not penetrate the substrate well because the viscosity of the ink is excessively high, and thus There is a problem that smooth printing is difficult.
  • the conductive copper ink used in the present invention may include one or more additional components selected from the group consisting of copper precursors, carbon nanotubes, and copper nanowires in addition to the above-described copper nanoparticles.
  • the copper precursor may be CuCl, CuCl 2 , Cu (acac) 2 , Cu (hfac) 2 , Cu (tfac) 2 , Cu (dpm) 2 , Cu (ppm) 2 , Cu (fod) 2 , Cu (acim) 2 , Cu (nona-F) 2 , Cu (acen) 2 , Cu (NO 3 ) 2 ⁇ 3H 2 0, Cu (C 3 H 4 F 3 O) 2 and CuSO
  • One or more copper precursors selected from the group consisting of 4 ⁇ 5H 2 O may be used.
  • the content of the additional components also affects the resistance values of the patterns and via holes formed after photosintering performed in a later step, thereby ensuring excellent electrical conductivity.
  • the content for each component is 5 wt% to 35 wt% based on the total weight of the conductive copper ink, 0.05 wt% to 2 wt% of carbon nanotubes, and 0.1 wt% to 10 wt% of copper nanowires. It is preferable.
  • various printing methods may be used, for example, screen printing, inkjet printing, micro-contact printing, imprinting, and the like.
  • One or more printing methods selected from the group consisting of imprinting, gravure printing, gravure-offset printing and flexography printing can be used.
  • FIG. 3 illustrates a schematic diagram of a method of coating the conductive ink in the method according to the present invention.
  • the via hole is formed on the substrate 110 using the aforementioned printing method.
  • the conductive copper ink 120 is coated on the top and back surfaces using the screen printing head 130 and the mask or plate making 140, and this process may be performed once to 20 times.
  • the process is performed more than 20 times, there is a problem that the thickness of the pattern becomes so thick that the sintering of the pattern portion and the via hole may not be performed smoothly during sintering.
  • the ink can be penetrated only to the plated or the portion corresponding to the via hole before performing the printing described above.
  • Further pre-printing may be performed using a mask that is present to produce a substrate 150 filled only with copper conductive ink (upper path in FIG. 3). Such preliminary printing may be performed once, but may be performed two or more times as necessary.
  • the printed double-sided printed circuit board 160 is manufactured by performing a drying process.
  • a method using a hot air fan, an oven, a hot plate, an infrared ray, or a combination thereof may be used.
  • the thickness of the ink printed in the via hole other than the printed pattern layer is thicker than the thickness of the pattern layer, in order to effectively evaporate the solvent, it is maintained for about 1 hour at a temperature of 60 ° C. to 130 ° C. using infrared rays. It is preferable to make it dry.
  • the drying process must be effectively performed to prevent micropores after sintering, thereby making it possible to manufacture highly conductive and reliable pattern layers and via holes.
  • the photo-sintering process is performed on the double-sided printed circuit board manufactured by the drying process.
  • Light sintering conditions are light irradiation energy of 4 J / cm 2 to 20 J / cm 2 , light irradiation time of 0.05 ms to 20 ms, and 1 to 100 light pulse number, It can be carried out by light irradiation with a xenon flash lamp, which can be sintered only when sufficient energy is irradiated according to suitable light sintering conditions.
  • the light sintering step of step c) is preliminary light irradiation to irradiate light with light irradiation energy of 1 J / cm 2 to 7 J / cm 2 for preheating or densification of the tissue to increase the light sintering efficiency, or solvent drying step; And the main light irradiation step for particle sintering.
  • the main light irradiation may be performed by dividing the main light into multiple stages rather than one stage.
  • the sintering efficiency can be improved.
  • the process of manufacturing the light sintered pattern layer 430 by performing the light sintering in the preliminary light irradiation step 410 and the main light irradiation step 420 is schematically illustrated.
  • preliminary light irradiation is performed on only the via hole portions by using a separate mask in which only the portions corresponding to the via holes are perforated, and the sintering characteristics through the main light irradiation. You can also improve.
  • the light irradiation energy in the preliminary light irradiation step may affect the resistance value of the via hole after sintering even if the same main light irradiation energy is used. Referring to Examples and Table 2 below, 1 J / cm 2 to In the case of light irradiation with light irradiation energy of 7 J / cm 2 , the via hole resistance value after sintering can be lowered.
  • a plurality of double-sided printed circuit boards may be stacked, and a blind via hole or a through hole may be formed for interlayer connection.
  • the lamination may be performed by laminating an insulating layer between the lower surface of one double-sided printed circuit board and the lower surface of the other double-sided printed circuit board and then thermocompression bonding.
  • FIG. 5 is a schematic process diagram of stacking a plurality of double-sided printed circuit boards and forming blind via holes or through holes, performing a printing process on the stacked multilayer printed circuit boards, and drying the printed substrates. Is shown.
  • a plurality of printed circuit boards 510 manufactured by performing the above steps c) are stacked, and an insulating layer is formed between the lower surface of one double-sided printed circuit board and the lower surface of the other double-sided printed circuit board.
  • the shape of the multilayer printed circuit board is completed by performing thermocompression bonding.
  • the printed circuit board 510 includes a pattern layer 530 and a substrate 540, and also includes a buried via hole 550 generated in the previous step.
  • the insulating layer 520 it is preferable to use an insulating resin such as, but not limited to, a bismaleimide-triazine resin (BT) having a large insulating effect.
  • BT bismaleimide-triazine resin
  • a predetermined blind via hole 560 or through hole 570 is formed using a laser or a drill on the stacked multilayer printed circuit board, and a printing process is performed on the formed via hole or through hole.
  • This printing step may be performed by filling the blind via hole or through hole using the screen printing head 580 and the conductive copper ink 590, and performing printing once to thirty times.
  • the printing process may be performed using a printing plate or mask 591 separately manufactured to fill only via holes or through holes.
  • the drying thickness is much thicker than the circuit pattern
  • a mask that exposes only the holes may be covered to strongly apply infrared rays or the like.
  • a photosintering step is performed on the dried blind via hole or through hole, which, as described above, is preheated or densified to increase the photosintering efficiency, or preliminary light irradiation for solvent drying. step; And the main light irradiation step for particle sintering.
  • the hole has to be slightly stronger than when sintering the double-sided printed circuit pattern because the thickness of the ink is thick, for example, light irradiation energy of 2 J / cm 2 to 10 J / cm 2 . As such, it may be performed in steps of 1 to 5 steps.
  • FIG. 6 shows a schematic process diagram in which preliminary light irradiation and main light irradiation are performed on only the portion of the hole where the conductive ink is printed and dried.
  • the light irradiation is performed by using a mask 610 that is perforated only in the corresponding area.
  • the multilayer printed circuit board according to the present invention is completed.
  • the present invention also provides a multilayer printed circuit board manufactured by the above method.
  • 7A to 7D use copper nanoparticle ink 7a, copper nanoparticle and copper precursor ink 7b, copper nanoparticle and copper nanowire ink 7c, and copper nanoparticle and carbon nanotube ink 7d.
  • the photo sintered by the method according to the present invention and then observed with a scanning electron microscope (SEM) is shown.
  • the multi-layer printed circuit board manufactured according to the present invention has significantly reduced the voids between particles after sintering, compared to the conventional circuit board, and has a pore reduction effect by controlling the composition of the ink to be used within an appropriate range. It can be further improved, thus achieving a significant electrical conductivity improvement effect.
  • Copper nanoparticles (Quantum sphere Inc., diameter: 20-50 nm) was dissolved in a solution of diethylene glycol (DEG) solvent and a polyvinylpyrrolidone (PVP, molecular weight 55,000) dispersant.
  • DEG diethylene glycol
  • PVP polyvinylpyrrolidone
  • the ink was prepared by dispersing using a sonicator, stirrer, ball mill, and three roll mill after adding to a weight%.
  • the agglomerated copper aggregate in the prepared ink was removed using a filter (pore size: 0.45 mu m), and then dispersed again using a mixed degassing machine.
  • the prepared conductive ink was printed in an electrode form by printing 10 times at a speed of 100 mm / s using a screen printer on a polyimide (PI) substrate on which via holes were preformed.
  • the electrode pattern was completed by drying the said pattern using the infrared ray of 100 degreeC temperature. Pulsed light was then irradiated to the dried pattern. The irradiation time of the pulsed light was 10 ms, the number of pulses was one, and the pulse energy was 12 J / cm 2 .
  • Example 2 60 wt% of copper nanoparticles and 0.05 wt% of carbon nanotubes (Example 2), 0.1 wt% (Example 3), 1 wt% (Example 4) and 2 wt% (Example 5), respectively
  • ink preparation and specimen preparation were performed in the same manner as in Example 1, and pulsed light was irradiated under the same conditions as in Example 1.
  • Example 6 to Example 9. Copper Nanoparticles and Copper nano wire Light sintering using ink containing
  • Example 6 60 wt% of copper nanoparticles and 0.1 wt% of copper nanowire (Example 6), 0.5 wt% (Example 7), 5 wt% (Example 8) and 10 wt% (Example 9), respectively
  • ink preparation and specimen preparation were performed in the same manner as in Example 1, and pulsed light was irradiated under the same conditions as in Example 1.
  • Example 10 Photosintering with Inks Containing Copper Nanoparticles and Copper Precursors
  • Example 10 60% by weight of copper nanoparticles and 5% by weight of copper precursor (Cu (NO 3 ) 2 .3H 2 0) (Example 10), 10% by weight (Example 11), 20% by weight (Example 12) And after the addition in the amount of 35% by weight (Example 13), the ink preparation and specimen preparation were carried out in the same manner as in Example 1, the pulsed light was irradiated under the same conditions as in Example 1.
  • Example 14 to Example 17 Preliminary Photosintering and Main Photosintering with Inks Containing Copper Nanoparticles (Single Printing)
  • the conductive ink was printed once using a plated plate having only via holes.
  • the preliminary light irradiation conditions were then set to 1 J / cm 2 (Example 14), 3 J / cm 2 (Example 15), 5 J / cm 2 (Example 16) and 7 J / cm 2 (Example 17). ),
  • the via hole was sintered with a main light irradiation condition of 12 J / cm 2 .
  • Example 18 Preliminary Using Inks Containing Copper Nanoparticles Light sintering And main light sintering (three times printing)
  • the conductive ink was printed three times using a plated plate having only via holes. Thereafter, the via hole was sintered at a preliminary light irradiation condition of 5 J / cm 2 and a main light irradiation condition of 12 J / cm 2 . The resistance of the via hole after sintering was measured to 0.95 ohms.
  • An electrode pattern was prepared by the same method as in Example 1, except that the light irradiation energy was 4 J / cm 2 (Example 19), 6 J / cm 2 (Example 20), and 8 J / cm 2 during the light sintering process. (Example 21), 10 J / cm 2 (Example 22), 14 J / cm 2 (Example 23), 16 J / cm 2 (Example 24), 18 J / cm 2 (Example 25) and Pulsed light was irradiated at 20 J / cm 2 (Example 26).
  • Comparative example 1 Using Inks Containing Copper Nanoparticles and Copper Precursors Light sintering (50 wt% copper precursor)
  • Example 1 After adding 60 wt% of copper nanoparticles and 50 wt% of copper precursor, ink preparation and specimen fabrication were performed in the same manner as in Example 1, and pulsed light was irradiated under the same conditions as in Example 1.
  • Example 1 After adding 60% by weight of copper nanoparticles and 15% by weight of copper nanowires, ink preparation and specimen preparation were performed in the same manner as in Example 1, and pulsed light was irradiated under the same conditions as in Example 1.
  • Example 1 After adding 60% by weight of copper nanoparticles and 2.5% by weight of carbon nanotubes, ink preparation and specimen preparation were performed in the same manner as in Example 1, and pulsed light was irradiated under the same conditions as in Example 1.
  • the conductive ink was printed three times using only the plated via holes, and the preliminary light irradiation conditions were 9 J / cm 2 and 11 J / cm 2 . Via holes were sintered at a light irradiation condition of 12 J / cm 2 .
  • Example Ink Preliminary Light Irradiation Energy (J / cm 2 ) Main light irradiation energy (J / cm 2 ) After sintering Via Hall resistance (Ohm) Copper nanoparticle ink ( Example Ink according to 1) 1 (Example 14) 12 1.1 3 (Example 15) 12 0.9 5 (Example 16) 12 0.79 7 (Example 17) 12 0.81 9 (Comparative Example 4) 12 5.66 11 (Comparative Example 5) 12 11.4
  • Type of ink Content of each substance in the ink ( wt% ) Resistance of pattern after sintering (Ohm / sq ) After sintering Via Hall resistance (Ohm) Copper Nanoparticles / Copper Precursor Inks Content of copper precursor 5 (Example 10) 0.12 1.09 10 (Example 11) 0.10 1.01 20 (Example 12) 0.09 0.94 35 (Example 13) 0.03 0.86 50 (Comparative Example 1) 5.38 4.13 Copper Nanoparticles / Carbon Nanotubes Inks Content of Carbon Nanotubes 0.05 (Example 2) 0.11 1.06 0.1 (Example 3) 0.07 0.99 1 (Example 4) 0.01 0.84 2 (Example 5) 1.13 0.79 2.5 (Comparative Example 3) 4.34 5.98 Copper Nanoparticles / Copper Nanowire Inks Content of Copper Nanowires 0.1 (Example 6) 0.11 1.06 0.5 (Example 7) 0.05 0.95 5 (Example 8) 0.02 0.85 10 (
  • the composition of the conductive copper ink is set to the optimum conditions, and the light for sintering It can be seen that the irradiation energy level should be optimized. Furthermore, referring to Table 2, it can be seen that it is preferable to perform preliminary light irradiation in a suitable energy range in order to improve the electrical conductivity of the via holes.
  • the large area and mass production of the white light sintering process which can be linked with the R2R process, can be achieved, and thus, a radio frequency identification device (RFID), a flexible electronic product, a wearable electronic product, a large area It can be widely applied to high value-added products such as displays, thin sheet solar cells, thin sheet batteries and the like.
  • RFID radio frequency identification device

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

L'invention concerne un procédé de fabrication d'une carte de circuit imprimé multicouche à l'aide d'une encre conductrice au cuivre et d'un frittage à la lumière, et une carte de circuit imprimé multicouche ainsi fabriquée et, plus particulièrement, un procédé de fabrication d'une carte de circuit imprimé multicouche à l'aide d'une encre conductrice au cuivre et d'un frittage à la lumière, et une carte de circuit imprimé multicouche ainsi fabriquée, le procédé comprenant les étapes consistant à : a) former un trou d'interconnexion sur une partie prédéfinie d'un substrat ; b) fabriquer une carte de circuit imprimé à deux faces en revêtant une encre conductrice au cuivre sur les surfaces supérieure et arrière du substrat sur lequel est formé le trou d'interconnexion, puis sécher ; c) soumettre la carte de circuit imprimé à deux faces à un frittage à la lumière ; d) stratifier plusieurs cartes de circuit imprimé à deux faces fabriquées en répétant les étapes a) à c), puis former un trou d'interconnexion aveugle ou un trou traversant pour une connexion interfaciale ; et e) réaliser une impression et un frittage à la lumière sur le trou d'interconnexion aveugle ou le trou traversant. La présente invention est susceptible de fabriquer une carte de circuit imprimé multicouche présentant une excellente conductivité électrique dans un temps court, de façon économique et avec un procédé simple. La carte de circuit imprimé multicouche fabriquée est appropriée pour la densification et la miniaturisation, et ne provoque pas les problèmes de remplissage inadéquat ou de frittage insuffisant qui peuvent se produire pendant l'impression et le frittage. En outre, la carte à circuit imprimé multicouche peut favoriser l'augmentation de la qualité et la production en masse dans un procédé de frittage à la lumière blanche qui peut être lié à un procédé R2R, et est ainsi largement applicable à des produits de grande valeur tels que des dispositifs d'identification par radiofréquence (RFID), des dispositifs électroniques souples, des dispositifs électroniques portables, des affichages de grande taille, des cellules solaires du type plat et mince et des batteries du type plat et mince.
PCT/KR2016/003447 2015-04-06 2016-04-04 Procédé de fabrication de carte de circuit imprimé multicouche à l'aide d'une encre conductrice au cuivre et d'un frittage à la lumière, et carte de circuit imprimé multicouche ainsi fabriquée WO2016163695A1 (fr)

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KR10-2015-0048366 2015-04-06

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