WO2018181871A1 - モジュール - Google Patents

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Publication number
WO2018181871A1
WO2018181871A1 PCT/JP2018/013552 JP2018013552W WO2018181871A1 WO 2018181871 A1 WO2018181871 A1 WO 2018181871A1 JP 2018013552 W JP2018013552 W JP 2018013552W WO 2018181871 A1 WO2018181871 A1 WO 2018181871A1
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WO
WIPO (PCT)
Prior art keywords
component
heat
main surface
heat radiating
module
Prior art date
Application number
PCT/JP2018/013552
Other languages
English (en)
French (fr)
Inventor
喜人 大坪
喜孝 松川
Original Assignee
株式会社村田製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Priority to CN201880022973.1A priority Critical patent/CN110476245B/zh
Priority to JP2019510226A priority patent/JP6760487B2/ja
Publication of WO2018181871A1 publication Critical patent/WO2018181871A1/ja
Priority to US16/581,942 priority patent/US11177189B2/en

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Definitions

  • the present invention relates to a module having a heat dissipation structure.
  • modules where heat-generating components are mounted on the mounting surface of the board measures to dissipate heat may be taken to prevent characteristic fluctuations and damage to the components due to temperature rise during component use.
  • a heat dissipation measure for example, there is an electronic device 100 described in Patent Document 1 shown in FIG.
  • the electronic device 100 includes a printed circuit board 101 on which electronic components 102a, 102b, and 102c are mounted, a heat radiating plate 103 that releases heat generated from the electronic components 102a, 102b, and 102c to the outside, and the printed circuit board 101 and the heat radiating plate 103. And a mold resin 104 filled in between. And between the heat sink 103 and the electronic components 102a, 102b, 102c, the heat conductive bumps 105 having a height higher than the height difference of the mounting height of the electronic components 102a, 102b, 102c are arranged in a compressed state. Has been. The thermally conductive bump 105 thermally couples the electronic components 102 a, 102 b, 102 c and the heat radiating plate 103.
  • Japanese Patent No. 5544906 (see paragraph 0032, FIG. 1)
  • the heat dissipation plate 103 is disposed on the upper surface of the mold resin 104, the heat conductive bumps 105 become long, and thus the electronic components 102a, 102b, and 102c are generated. Therefore, it takes a long time to transmit the heat to the heat radiating plate 103 via the heat conductive bump 105, and there is a possibility that a sufficient heat radiating effect cannot be obtained.
  • the present invention has been made in view of the above-described problems, and can improve the heat dissipation effect while suppressing characteristic fluctuations and damage to the components caused by temperature rise during use of the components mounted on the substrate.
  • the purpose is to provide modules.
  • a module of the present invention includes a substrate, a first component that is a heat dissipation target mounted on one main surface of the substrate, and a sealing resin layer that seals the first component.
  • a heat radiating member having a first heat radiating portion and a second heat radiating portion, and the sealing resin layer includes a first concave portion and a first concave portion on a surface opposite to the surface facing the one main surface.
  • a second recess extending to the main surface side is provided, and the first heat radiating portion is spaced from the surface opposite to the mounting side surface of the first component on the sealing resin layer.
  • the heat dissipating part is disposed in the second recess provided in the sealing resin layer, and The area of the second heat radiating portion on the surface including the surface facing the first component of the first overlapping portion extending from the surface facing the first component toward the opposite surface of the first component. Is smaller than the area of the first overlapping portion.
  • the area where the second heat radiating portion and the surface on the opposite side of the first component overlap is the same as the first overlapping portion of the first heat radiating portion and the first overlapping portion. Since it is smaller than the area where the opposite surface of one component overlaps, damage to the first component during formation of the second heat radiating portion can be suppressed.
  • polymerization part of a 1st heat radiating part is arrange
  • a second component that is not a heat dissipation target mounted on the one main surface is further provided, and the first heat dissipation portion is provided with a space from a surface opposite to the mounting side surface of the second component. And has a second overlapping portion that overlaps at least the opposite surface of the second component in a plan view as viewed from a direction perpendicular to the one main surface, and the second component of the second overlapping portion is provided in the second component.
  • the shortest distance from the facing surface to the opposite surface of the second part is less than the shortest distance from the surface facing the first part of the first overlapping portion to the opposite surface of the first part. It may be large.
  • the surface area of the first heat radiating portion is increased, and the heat dissipation effect is further improved.
  • the shortest distance from the surface facing the second part of the second overlapping portion to the surface opposite to the second component is from the surface facing the first component of the first overlapping portion to the surface opposite to the first component. Therefore, the heat generated from the first component is not easily transmitted to the second component via the second heat radiating portion and the first heat radiating portion, and the second component is the first component. It becomes difficult to be affected by the heat generated from the.
  • the first heat dissipating part may further include a second component that is not a heat dissipating object mounted on the one main surface, and the first heat dissipating portion overlaps the one main surface in a plan view as viewed from a direction perpendicular to the one main surface. Of these, it may be present in almost all except for a region overlapping the surface on the opposite side to the surface on the mounting side of the second component. According to this configuration, the surface area of the first heat radiating portion is increased, and the heat dissipation effect is further improved.
  • it further includes a second component that is not a heat dissipation target mounted on the one main surface, and the first heat radiating portion is opposed to the one main surface and in a plan view as viewed from a direction perpendicular to the one main surface.
  • the inter-part overlapping part that overlaps at least the region between the first part and the second part, and the heat dissipating member is arranged on the one main face from the side facing the one main face of the inter-part overlapping part.
  • a heat transfer portion extending so as to exist between the first component and the second component, and the shortest distance between the first component and the heat transfer portion is the second component and the heat transfer portion. It may be smaller than the shortest distance from the heat part.
  • the heat transfer portion exists between the first component and the second component and closer to the first component than the second component, the heat generated from the first component is transferred. It is absorbed by the heat part and dissipated from the heat radiating member, and the second part is less susceptible to the heat generated from the first part.
  • the first heat radiating portion is opposed to the one main surface, and overlaps at least a region between the first component and the second component in a plan view as viewed from a direction perpendicular to the one main surface. It has a superposition part, and the heat dissipation member exists between the first part and the second part from the surface side facing the one main surface of the inter-part superposition part toward the one main surface.
  • the heat transfer part may be further provided, and the shortest distance between the first part and the heat transfer part may be smaller than the shortest distance between the second part and the heat transfer part. According to this configuration, since the heat transfer portion exists between the first component and the second component and closer to the first component than the second component, the heat generated from the first component is transferred. It is absorbed by the heat part and dissipated from the heat radiating member, and the second part is less susceptible to the heat generated from the first part.
  • the heat transfer portion has a frame shape surrounding the first component so that the heat transfer portion exists at least outside a side of the first component facing the second component in a plan view as viewed from a direction perpendicular to the one main surface. It may be. According to this configuration, since the first component and the second component are partitioned by the heat transfer section, the second component is not easily affected by the heat generated from the first component.
  • the first heat radiating portion is disposed in the first concave portion provided in the sealing resin layer at a distance from the surface on the opposite side of the first component, and is perpendicular to the main surface.
  • a first overlapping portion that overlaps at least the surface on the opposite side of the first component in a plan view as viewed from any direction, and the second heat radiating portion is the first component from the surface facing the first component of the first overlapping portion.
  • the area of the second heat dissipating portion on the surface including the surface facing the first part of the first overlapping portion is smaller than the area of the first overlapping portion.
  • the area where the second heat radiating portion and the surface on the opposite side of the first component overlap is the first overlapping portion of the first heat radiating portion and the first component. Since it is smaller than the area where the opposite surface overlaps, it is possible to suppress damage to the first component during the formation of the second heat radiating portion. Further, since the first overlapping portion of the first heat radiating portion is disposed in the first concave portion provided in the sealing resin layer at a distance from the surface on the opposite side of the first component, as in the prior art.
  • FIG. (A) is a top view in the state which excluded the upper surface part of the shield layer of the module which concerns on 1st Embodiment of this invention, (b) at the time of making it include the upper surface part of a shield layer
  • FIG. (A) is a top view in the state which excluded the upper surface part of the shield layer of the module which concerns on 2nd Embodiment of this invention, (b) is a case where it is made to include the upper surface part of a shield layer.
  • FIG. (A) is a top view in the state except the upper surface part of the shield layer of the module which concerns on the modification 1 of 2nd Embodiment of this invention, (b) is a case where the upper surface part of a shield layer is included.
  • FIG. (A) is a top view in the state which excluded the upper surface part of the shield layer of the module which concerns on 3rd Embodiment of this invention, (b) (a) at the time of making it include the upper surface part of a shield layer
  • FIG. (A) is a top view in the state except the upper surface part of the shield layer of the module which concerns on the modification 1 of 3rd Embodiment of this invention
  • (b) is a case where it is made to include the upper surface part of a shield layer
  • (A) is a top view in the state which excluded the upper surface part of the shield layer of the module which concerns on the modification 2 of 3rd Embodiment of this invention
  • (b) is a case where it is made to include the upper surface part of a shield layer It is FF sectional drawing of (a).
  • (A) is a top view in the state which excluded the upper surface part of the shield layer of the module which concerns on the modification 3 of 3rd Embodiment of this invention
  • (b) is a case where it is made to include the upper surface part of a shield layer It is GG sectional drawing of (a). It is sectional drawing of the conventional module.
  • FIG. 1A is a plan view of the module 1 according to the first embodiment with the top surface portion of the shield layer 8 removed, and FIG. 1B includes the top surface portion of the shield layer 8.
  • FIG. 2 is a cross-sectional view taken along the line AA in FIG.
  • the module 1 is mounted on, for example, a mother board of an electronic device.
  • the module 1 includes a substrate 2, two first components 3 mounted on one main surface 2 a of the substrate 2, one second component 4 and thirteen third components 5, each first component 3, and second component 2.
  • the heat radiating member 7 includes a shield layer 8 provided so as to cover an upper surface 21a of a first heat radiating portion 21 described later and a side surface of the substrate 2.
  • the number of the 1st components 3, the 2nd components 4, and the 3rd components 5 is an example, and is not limited to this.
  • the shield layer 8 is not essential.
  • the substrate 2 is formed of, for example, low temperature co-fired ceramics or glass epoxy resin.
  • a plurality of land electrodes 9 are formed on one main surface 2a of the substrate 2, a plurality of external electrodes 10 are formed on the other main surface 2b, and a plurality of electrodes (wiring electrodes, ground electrodes) 11 and via conductors are formed inside. 12 is formed.
  • the land electrode 9 is connected to the electrode (wiring electrode, ground electrode) 11 via the via conductor 12
  • the external electrode 10 is connected to the electrode (wiring electrode, ground electrode) 11 via the via conductor 12.
  • the ground electrode is exposed from the side surface of the substrate 2 and is in contact with the shield layer 8.
  • Each land electrode 9, each external electrode 10, and each electrode (wiring electrode, ground electrode) 11 are each formed of a metal generally employed as an electrode such as Cu, Ag, or Al.
  • Each via conductor 12 is made of a metal such as Ag or Cu.
  • Each first component 3 is a component that generates heat and is a heat dissipation target that requires heat dissipation.
  • Each first component 3 is mounted on the one main surface 2a of the substrate 2 by connecting the connection terminals to the land electrodes 9 formed on the one main surface 2a of the substrate 2 using the solder 13, for example.
  • the second component 4 is a component that does not require heat dissipation and is not a heat dissipation target.
  • the second component 4 is a component whose characteristics tend to fluctuate due to the influence of heat generated from the first component 3.
  • the second component 4 is mounted on the one main surface 2a of the substrate 2 by connecting the connection terminal to the exposed surface of the via conductor 12 on the one main surface 2a of the substrate 2 using the solder 13, for example.
  • the third component 5 is a component that does not require heat dissipation and is not a heat dissipation target.
  • the third component 5 is a component whose characteristics are likely to fluctuate due to the influence of heat generated from the first component 3.
  • each third component 5 is mounted on the one main surface 2 a of the substrate 2.
  • semiconductor elements such as an IC element and a power amplifier element as components that generate heat.
  • the first component 3 is a component whose heat generation becomes a problem.
  • positioned is formed.
  • the sealing resin layer 6 covers the one main surface 2a, each first component 3, the second component 4, and each third component, and excludes the upper surface 21a of the first heat radiating portion 21 described later of each heat radiating member 7.
  • the main surface 2a, each first component 3, second component 4, each third component 5, and each heat radiating member 7 are sealed so as to cover each heat radiating member 7.
  • the sealing resin layer 6 can be formed of a resin generally employed as a sealing resin such as an epoxy resin containing a silica filler.
  • a resin such as an epoxy resin containing a filler having a high thermal conductivity such as an alumina filler can also be used for the sealing resin layer 6 for high thermal conductivity.
  • Each heat dissipating member 7 has a first heat dissipating part 21 and a plurality of second heat dissipating parts 22, and is formed of a heat conductive material (for example, a high heat conductive material such as metal).
  • a heat conductive material for example, a high heat conductive material such as metal
  • the first heat radiating portion 21 is a surface facing the one main surface 2a of the first component 3, that is, a surface opposite to the surface on the mounting side in a plan view as viewed from the direction perpendicular to the one main surface 2a of the substrate 2 ( Hereinafter, it is referred to as “upper surface”.) 3a and the peripheral region of the upper surface 3a.
  • the first heat radiating portion 21 is disposed in the recess 6A provided in the sealing resin layer 6 with a space from the upper surface 3a of the first component 3, and is perpendicular to the one main surface 2a of the substrate 2. It has the 1st superposition
  • a surface (hereinafter referred to as “upper surface”) 21 a that is parallel to the one main surface 2 a of the first heat radiating portion 21 and is farthest from the one main surface 2 a is the one main surface 2 a of the sealing resin layer 6. Is the same plane as the surface (hereinafter referred to as the “upper surface”) 6 a that is farthest from the main surface 2 a and is exposed from the upper surface 6 a of the sealing resin layer 6.
  • a surface (hereinafter, referred to as “lower surface”) 25 b that is parallel to the one main surface 2 a of the first overlapping portion 25 and is closest to the one main surface 2 a does not contact the upper surface 3 a of the first component 3.
  • the distance from the one main surface 2 a to the lower surface 25 b of the first overlapping portion 25 is larger than the distance from the one main surface 2 a to the upper surface 3 a of the first component 3.
  • the plurality of second heat radiating portions 22 are arranged in the concave portions 6B provided in the sealing resin layer 6, and are provided in a matrix on the lower surface 25b side of the first overlapping portion 25.
  • Each second heat radiating portion 22 has a substantially cylindrical shape, extends from the lower surface 25 b side of the first overlapping portion 25 toward the first component 3 to the upper surface 3 a of the first component 3, and the upper surface of the first component 3. It is in contact with 3a.
  • each 2nd thermal radiation part 22 does not need to contact the upper surface 3a of the 1st component 3.
  • each 2nd thermal radiation part 22 has the area of each 2nd thermal radiation part 22 in the surface containing the lower surface 25b of the 1st superposition
  • the lower surface 25b of the first overlapping portion 25 corresponds to the “surface facing the first part of the first overlapping portion” in the present invention. That is, the “heat dissipating member” in the present embodiment is a “first heat dissipating part” disposed in the recess 6A provided in the upper surface 6a of the sealing resin layer 6, and further from the first heat dissipating part toward the first component.
  • the two-stage structure of the “second heat radiating portion” disposed in the recessed portion 6B provided partially.
  • the heat dissipation member in this embodiment has a stepped structure.
  • the upper surface 3 a of one first component 3 illustrated in the approximate center of FIG. 1, and the lower surface 25 b of one first overlapping portion 25 also illustrated in the approximately center of FIG. 1. Is shorter than the shortest distance between the upper surface 3a of the other first component 3 and the lower surface 25b of the other first overlapping portion 25.
  • the distance between the upper surface 3a of the first component 3 and the lower surface 25b of the first overlapping portion 25 is changed depending on the degree of necessity of radiating heat. Reduce the distance of the higher degree of sex.
  • the distance between the upper surface 3a of the first component 3 and the lower surface 25b of the first overlapping portion 25 may be the same regardless of the degree of necessity of radiating heat.
  • the heat radiating member 7 does not exist in the portion overlapping the second component 4 and the heat radiating member 7 exists in the portion overlapping each third component 5 in a plan view as viewed from the direction perpendicular to the one main surface 2 a. Absent.
  • the plurality of second heat radiating portions 22 included in the heat radiating member 7 are arranged in a matrix on the lower surface 25b side of the first overlapping portion 25, but may not be arranged in a matrix. .
  • the shape of the second heat radiating portion 22 is a substantially cylindrical shape, but may be a columnar shape other than the substantially cylindrical shape, for example, a substantially rectangular columnar shape.
  • one heat radiating member has a first heat radiating portion and a plurality of second heat radiating portions.
  • the first heat radiating portion is disposed in the recess 6A provided in the sealing resin layer 6 with a space from the upper surface 3a of the first component 3 for each of the two first components 3.
  • the first overlapping portion overlaps at least the upper surface 3a of the first component 3 in a plan view as viewed from the direction perpendicular to the main surface 2a.
  • each 2nd thermal radiation part is 1st components from the lower surface side of a 1st superposition
  • the shield layer 8 covers the upper surface 6 a and the side surface of the sealing resin layer 6, the upper surface 21 a of the first heat radiation portion 21 of each heat radiating member 7, and the side surface of the substrate 2.
  • the shield layer 8 reduces unnecessary electromagnetic waves radiated from external devices from reaching the first component 3, the second component 4, the third component 5, etc. of the module 1, or the first component of the module 1. 3, for reducing unnecessary electromagnetic waves radiated from the second component 4, each third component 5 and the like from leaking to the outside.
  • the shield layer 8 is, for example, laminated on the adhesion layer and the adhesion layer laminated on the upper surface 6 a and the side surface of the sealing resin layer 6, the upper surface 21 a of the first heat radiation part 21 of each heat radiation member 7 and the side surface of the substrate 2. It can be formed in a multilayer structure having a conductive layer and a corrosion-resistant layer stacked on the conductive layer.
  • the adhesion layer is provided to increase the adhesion strength between the conductive layer and the sealing resin layer 6 and can be formed of a metal such as SUS, for example.
  • the conductive layer is a layer that bears the substantial shielding function of the shield layer 8 and can be formed of any one of Cu, Ag, and Al, for example.
  • the corrosion resistant layer is provided to prevent the conductive layer from being corroded or scratched, and can be formed of, for example, SUS.
  • SUS for example, a sputtering method, a vapor deposition method, a paste coating method, or the like can be used.
  • Module manufacturing method Next, a method for manufacturing the module 1 will be described.
  • a plurality of land electrodes 9 are formed on one main surface 2a, a plurality of external electrodes 10 are formed on the other main surface 2b, and a plurality of electrodes (wiring electrodes, ground electrodes) 11 and a plurality of via conductors are formed therein.
  • An assembly of the substrates 2 on which 12 etc. are formed is prepared.
  • Each land electrode 9, each external electrode 10, and each electrode (wiring electrode, ground electrode) 11 can be formed by screen-printing a conductive paste containing a metal such as Cu, Ag, or Al, respectively. it can.
  • Each via conductor 12 can be formed by a known method after forming a via hole using a laser or the like.
  • two first components 3, one second component 4, and thirteen third components 5 are mounted on one main surface 2a of the substrate 2 using a known surface mounting technique.
  • the solder 13 is formed on the desired land electrode 9 of the land electrodes 9, the first component 3 is mounted on the corresponding land electrode 9 of the land electrodes 9 on which the solder 13 is formed, After mounting one component 3, reflow processing is performed. Further, for example, the solder 13 is formed on a desired exposed surface among the exposed surfaces from the one main surface 2a of the via conductor 12 formed in the substrate 2, and the via conductor on which the solder 13 is formed.
  • the second component 4 is mounted on the corresponding exposed surface of the exposed surfaces from the one main surface 2a of 12
  • the reflow process is performed.
  • the third component 5 is mounted in the same manner as the second component 4, and after the mounting, the reflow process is performed. Note that the assembly of the substrates 2 is cleaned as necessary after the reflow process.
  • a temporary sealing resin layer that is a source of the sealing resin layer 6 is formed.
  • a transfer mold method, a compression mold method, a liquid resin method, a sheet resin method, or the like can be used for forming the temporary sealing resin layer.
  • a resin generally employed as a sealing resin such as a general silica resin-containing epoxy resin can be used.
  • a resin such as an epoxy resin containing a filler having a high thermal conductivity such as an alumina filler can be used.
  • the assembly of the substrate 2 is subjected to plasma cleaning as necessary.
  • each first component 3 in a plan view as viewed from a direction perpendicular to the one main surface 2a, of the surface opposite to the one main surface 2a of the temporary sealing resin layer.
  • the region including the periphery thereof is irradiated with laser, the resin is removed to a position that does not reach the upper surface 3a of the first component 3, and a recess 6A for disposing each first heat radiating portion 21 is formed.
  • a plurality of portions of the bottom surface of the recess 6A facing the top surface 3a of the first component 3 are irradiated with laser, and the resin is removed until the top surface 3a of each first component 3 is reached.
  • a recess 6B for arranging the portion 22 is formed.
  • positioning each heat radiating member 7 is formed.
  • a UV laser, a CO 2 laser, a YAG laser, a Green laser, or the like can be used as the laser.
  • a heat conductive material for example, a high heat conductive material such as a metal
  • the recesses 6A and the recesses 6B are basically filled with the same heat conductive material. However, the recess 6A and the recess 6B may be filled with different heat conductive materials. Thereby, the heat radiating member 7 including the first heat radiating portion 21 and the plurality of second heat radiating portions 22 is formed for each first component 3.
  • the module 1 before forming the shield layer 8 is separated into pieces by dicer or laser processing.
  • a shield layer 8 is formed so as to be in contact with each other.
  • a sputtering method, a vapor deposition method, a paste coating method, or the like can be used for the formation of the shield layer 8.
  • the first heat radiating portion 21 is disposed in the recess 6A provided in the sealing resin layer 6 with a space from the upper surface 3a of the first component 3, and on the one main surface.
  • the first overlapping portion 25 overlaps at least the upper surface 3a of the first component 3 in a plan view as viewed from the direction perpendicular to 2a, and each second heat radiating portion 22 is first from the lower surface 25b side of the first overlapping portion 25.
  • the area of the second heat radiating portion 22 on the surface including the lower surface 25b of the first overlapping portion 25 is smaller than the area of the first overlapping portion 25, extending to the upper surface 3a toward the upper surface 3a of the component 3.
  • positioning the 2nd thermal radiation part 22 is shown. Damage to the component 3 can be suppressed.
  • polymerization part 25 of the 1st thermal radiation part 21 is arrange
  • polymerization part 25 of the 1st heat radiating part 21 and the 1st component 3 becomes small. Therefore, since the heat generated from the first component 3 is quickly transmitted to the first heat radiating portion 21 having a surface area larger than the surface area of the second heat radiating portion 22 via the second heat radiating portion 22, the heat radiating effect is improved.
  • the heat dissipation member 7 is formed on the surface opposite to the surface facing the one main surface 2 a of the second component 4 or the one main surface 2 a of the third component 5. Since it does not overlap the opposite surface and the opposite surface, the heat generated from the first component 3 is not easily transmitted to the second component 4 and the third component 5 via the second heat radiating portion 22 and the first heat radiating portion 21.
  • the second component 4 and the third component 5 are less susceptible to the heat generated from the first component 3. As a result, it is possible to prevent the characteristic variation and the performance deterioration due to the temperature rise of the second component 4 and the third component 5.
  • the heat radiating member 7 can be appropriately arranged according to the first component 3 that requires heat radiation, and the heat radiation performance is improved. Further, since the plurality of second heat radiating portions 22 are driven into a wedge with respect to the sealing resin layer 6, peeling between the sealing resin layer 6 and the second heat radiating portion 22 can be suppressed, and sealing is performed. It is also possible to suppress the disconnection of the shield layer 8 due to the peeling between the stop resin layer 6 and the second heat radiation part 22.
  • FIG. 2A is a plan view of the module 1a according to the second embodiment with the upper surface portion of the shield layer 8 removed, and FIG. 2B includes the upper surface portion of the shield layer 8.
  • FIG. 3 is a sectional view taken along line BB in FIG.
  • the difference between the module 1a according to the second embodiment and the module 1 according to the first embodiment described with reference to FIG. 1 is that, as shown in FIG. 2, in a plan view viewed from a direction perpendicular to the one main surface 2a.
  • the heat radiating member 30 faces the surface (hereinafter referred to as “upper surface”) 4 a opposite to the surface facing the one main surface 2 a of the second component 4 and the one main surface 2 a of each third component 5. It is a point which has the part which overlaps with the surface (henceforth "upper surface") on the opposite side of a surface. Since other configurations are the same as those of the module 1 according to the first embodiment, the description thereof is omitted by giving the same reference numerals.
  • the heat dissipating member 30 has a first heat dissipating part 31 and a plurality of second heat dissipating parts 22, and is formed of a heat conductive material (for example, a high heat conductive material such as metal).
  • a heat conductive material for example, a high heat conductive material such as metal.
  • the 2nd thermal radiation part 22 of 2nd Embodiment has the structure similar to the 2nd thermal radiation part 22 of 1st Embodiment.
  • the first heat radiating portion 31 is present in a region excluding the peripheral portion of the first main surface 2a in a plan view as viewed from a direction perpendicular to the one main surface 2a of the substrate 2.
  • the 1st thermal radiation part 31 is arrange
  • substrate. 2 has a first overlapping portion 25 that overlaps at least the upper surface 3a of the first component 3 in a plan view as viewed from a direction perpendicular to the one main surface 2a.
  • the first heat radiating portion 31 is disposed in the recess 6 ⁇ / b> A provided in the sealing resin layer 6 with a space from the upper surface 4 a of the second component 4, and is perpendicular to the one main surface 2 a of the substrate 2.
  • a second overlapping portion 36 is provided that overlaps at least the upper surface 4a of the second component 4 in a plan view as viewed from the direction.
  • the first heat radiating portion 31 is arranged in a recess provided in the sealing resin layer 6 at an interval from the upper surface of the third component 5 for each of the 13 third components 5.
  • a third overlapping portion 37 that overlaps at least the upper surface of the third component 5 in a plan view as viewed from the direction perpendicular to the one main surface 2a.
  • the surface (hereinafter referred to as “upper surface”) 31 a that is parallel to the one main surface 2 a of the first heat radiating portion 31 and is the most distant from the one main surface 2 a is the upper surface 6 a of the sealing resin layer 6. It is on the same surface and exposed from the upper surface 6 a of the sealing resin layer 6. Further, for each first overlapping portion 25, the distance from one main surface 2 a to the lower surface 25 b of the first overlapping portion 25 is such that the lower surface 25 b of the first overlapping portion 25 does not contact the upper surface 3 a of the first component 3. On the other hand, it is larger than the distance from the main surface 2a to the upper surface 3a of the first component 3.
  • a surface (hereinafter referred to as “lower surface”) 36 b that is parallel to the one main surface 2 a of the second overlapping portion 36 and is closest to the one main surface 2 a does not contact the upper surface 4 a of the second component 4.
  • the distance from the one main surface 2a to the lower surface 36b of the second overlapping portion 36 is larger than the distance from the one main surface 2a to the upper surface 4a of the second component 4.
  • the surface parallel to the one main surface 2a of the third overlapping portion 37 and closest to the one main surface 2a (hereinafter referred to as “lower surface”) is the third component.
  • the distance from one main surface 2 a to the lower surface of the third overlapping portion 37 is larger than the distance from one main surface 2 a to the upper surface of the third component 5 so as not to contact the upper surface of 5.
  • the shortest distance from the lower surface 36b of the second overlapping portion 36 to the upper surface 4a of the second component 4 is larger than the shortest distance from the lower surface 25b of the first overlapping portion 25 to the upper surface 3a of the first component 3. Further, the shortest distance from the lower surface of the third overlapping portion 37 to the upper surface of the third component 5 is larger than the shortest distance from the lower surface 25b of the first overlapping portion 25 to the upper surface 3a of the first component 3.
  • the first heat radiating portion 31 includes the second overlapping portion 36 and each third component overlapping at least the upper surface 4a of the second component 4 in a plan view as viewed from the direction perpendicular to the one main surface 2a. Since the third overlapping portion 37 that overlaps at least the upper surface of the third component 5 is provided every 5, the surface area of the first heat dissipation portion 31 is increased, and the heat dissipation effect is further improved. Further, the shortest distance from the lower surface 36b of the second overlapping portion 36 to the upper surface 4a of the second component 4 is not made the same as the shortest distance from the lower surface 25b of the first overlapping portion 25 to the upper surface 3a of the first component 3, and is large.
  • the heat generated from the first component 3 is less likely to be transmitted to the second component 4 via the second heat radiating portion 22 and the first heat radiating portion 31, and the second component 4 is generated from the first component 3. Less susceptible to heat. As a result, it is possible to prevent the characteristic variation and the performance deterioration due to the temperature rise of the second component 4.
  • the shortest distance from the lower surface of the third overlapping portion 37 to the upper surface of the third component 5 is not the same as the shortest distance from the lower surface 25b of the first overlapping portion 25 to the upper surface 3a of the first component 3, Since it is increased, the heat generated from the first component 3 is less likely to be transmitted to the third component 5 via the second heat radiating portion 22 and the first heat radiating portion 31, and the third component 5 is generated from the first component 3. Less susceptible to heat. As a result, it is possible to prevent the characteristic variation and the performance deterioration due to the temperature rise of the third component 5.
  • FIG. 3A is a plan view of the module 1b according to the first modification of the second embodiment with the upper surface portion of the shield layer 8 removed
  • FIG. 3B is the upper surface portion of the shield layer 8.
  • FIG. 4 is a cross-sectional view taken along the line CC of FIG.
  • the module 1 b according to the first modification of the second embodiment is configured such that the heat radiating member 30 is replaced with the first heat radiating portion 31 with respect to the module 1 a according to the second embodiment described with reference to FIG. 2.
  • the structure is replaced with a heat radiating member 40 having a first heat radiating portion 41 having a structure in which a portion overlapping the upper surface 4a of the second component 4 in a plan view as viewed from a direction perpendicular to the main surface 2a is removed. ing.
  • the heat radiating member 40 has a first heat radiating portion 41 and a plurality of second heat radiating portions 22 and is made of a heat conductive material (for example, a high heat conductive material such as metal).
  • a heat conductive material for example, a high heat conductive material such as metal.
  • the 2nd thermal radiation part 22 of the modification 1 of 2nd Embodiment has the structure similar to the 2nd thermal radiation part 22 of 1st Embodiment.
  • the first heat radiating portion 41 includes a top surface 4a of the second component 4 and an upper surface 4a of the second component 4 in a plan view as viewed from a direction perpendicular to the one main surface 2a of the substrate 2 while excluding the peripheral portion thereof. Exists in the area excluding the surrounding area.
  • the first heat radiating portion 41 is present in substantially all of the region overlapping the one main surface 2a except the region overlapping the upper surface 4a of the second component 4 in a plan view as viewed from the direction perpendicular to the one main surface 2a. .
  • the first heat radiating portion 41 includes a first overlapping portion 25 corresponding to each first component 3 and a third overlapping portion 37 corresponding to each third component 5.
  • the surface 41a that is parallel to the one main surface 2a of the first heat radiating portion 41 and is farthest from the one main surface 2a is on the same surface as the upper surface 6a of the sealing resin layer 6, and It is exposed from the upper surface 6a.
  • FIG. 4A is a plan view of the module 1c according to the third embodiment with the top surface portion of the shield layer 8 removed, and FIG. 4B includes the top surface portion of the shield layer 8.
  • FIG. 5 is a DD sectional view of FIG.
  • the module 1c according to the third embodiment is different from the module 1a according to the second embodiment described with reference to FIG. 2 in that, as shown in FIG. A plurality of heat transfer parts having a substantially cylindrical shape between the first component 3 and other components (first component 3, second component 4, third component 5) in a plan view as viewed from a direction perpendicular to the surface 2a. It is the point which has the structure which added 51. Since other configurations are the same as those of the module 1a according to the second embodiment, the description thereof is omitted by giving the same reference numerals.
  • the heat radiating member 50 includes a first heat radiating portion 31, a plurality of second heat radiating portions 22, and a plurality of heat transfer portions 51, and is formed of a heat conductive material (for example, a high heat conductive material such as metal).
  • a heat conductive material for example, a high heat conductive material such as metal.
  • the 1st thermal radiation part 31, the several 2nd thermal radiation part 22, and the several heat-transfer part 51 are formed with the same heat conductive material.
  • the 1st heat radiating part 31 of 3rd Embodiment has the structure similar to the 1st heat radiating part 31 of 2nd Embodiment, and the 1st heat radiating part 31 is opposed to one main surface 2a, and one main An inter-component overlapping portion 55 that overlaps at least a region between the first component 3 and other components (first component 3, second component 4, third component 5) in a plan view as viewed from a direction perpendicular to the surface 2a. is there.
  • polymerization part 55 is "the inter-part superposition
  • the second heat radiating portion 22 of the third embodiment has the same structure as the second heat radiating portion 22 of the first embodiment.
  • the plurality of heat transfer portions 51 are substantially circular in a plan view as viewed from a direction perpendicular to the one main surface 2a.
  • the plurality of heat transfer portions 51 are opposed to the one main surface 2a of the inter-part overlapping portion 55 in a plan view as viewed from the direction perpendicular to the one main surface 2a (hereinafter referred to as “lower surface”).
  • the first component 3 and other components are provided on the 55b side. More specifically, a plurality of first components 3 mounted substantially at the center of the one main surface 2a so as to surround the first component 3 in a plan view as viewed from a direction perpendicular to the one main surface 2a.
  • the heat transfer section 51 is provided.
  • Each heat transfer portion 51 is disposed in a recess 6D provided in the sealing resin layer 6, and the first component 3 and other components (from the lower surface 55b side of the inter-component overlapping portion 55 toward the main surface 2a ( The first part 3, the second part 4, and the third part 5) extend so as to exist and have a substantially cylindrical shape.
  • each heat transfer section 51 includes a surface including a surface facing the one main surface 2a of the first component 3 and the one main surface 2a from the lower surface 55b side of the inter-component overlapping portion 55 toward the one main surface 2a. It extends to a predetermined position between.
  • Each heat transfer portion 51 may extend from the lower surface 55b side of the inter-component overlapping portion 55 toward the one main surface 2a to reach the one main surface 2a, but damages the one main surface 2a of the substrate 2. It is good also as extending to the position which does not reach one main surface 2a.
  • each heat transfer portion 51 provided between the adjacent first component 3 and the second component 4 or the third component 5 The shortest distance from the nearest first part 3 is the second part 4 or the third part 5 closest to the heat transfer part 51 among the heat transfer part 51, the second part 4, and the plurality of third parts 5. Less than the shortest distance.
  • the shortest distance between the first component 3 and the heat transfer portion 51 is Is smaller than the shortest distance between the second component 4 and the heat transfer section 51.
  • the first component 3 With respect to the heat transfer section 51 provided between the first component 3 disposed in the vicinity of the side of the one main surface 2a and the third component 5 adjacent to the first component 3, the first component 3 The shortest distance between the heat transfer part 51 and the third part 5 is shorter than the shortest distance between the heat transfer part 51.
  • the shape of the heat-transfer part 51 is made into the substantially cylindrical shape
  • columnar shapes other than a substantially cylindrical shape for example, a substantially square pillar shape, may be sufficient.
  • the heat generated from the first component 3 is absorbed by the heat transfer unit 51 and is transmitted from the heat transfer unit 51 to the heat radiating member 50 to be radiated.
  • the first component 3 is less susceptible to the heat generated from the other first component 3, and the second component 4 and each third component 5 are affected by the heat generated from each first component 3. It becomes difficult.
  • FIG. 5A is a plan view of the module 1d according to the first modification of the third embodiment with the upper surface portion of the shield layer 8 removed
  • FIG. 5B is the upper surface portion of the shield layer 8.
  • FIG. 6 is a cross-sectional view taken along the line EE of FIG.
  • the module 1 d according to the first modification of the third embodiment is configured such that the heat radiating member 50 of the heat transfer unit 51 is replaced with the module 1 c according to the third embodiment described with reference to FIG. 4.
  • the structure is replaced with a heat radiating member 60 having a heat transfer portion 61 having a shape different from the shape.
  • the heat radiating member 60 includes a first heat radiating portion 31, a plurality of second heat radiating portions 22, and a heat transfer portion 61, and is formed of a heat conductive material (for example, a high heat conductive material such as a metal).
  • a heat conductive material for example, a high heat conductive material such as a metal.
  • the 1st thermal radiation part 31, the some 2nd thermal radiation part 22, and the heat-transfer part 61 are formed with the same heat conductive material.
  • the 1st thermal radiation part 31 of the modification 1 of 3rd Embodiment has the structure similar to the 1st thermal radiation part 31 of 2nd Embodiment.
  • the 2nd heat radiation part 22 of the modification 1 of 3rd Embodiment has the structure similar to the 2nd heat radiation part 22 of 1st Embodiment.
  • the first component 3 and the other components (first component 3, second component 4, It is provided so as to exist between the third part 5). More specifically, a rectangular frame surrounding the periphery of the first component 3 with respect to the first component 3 mounted substantially at the center of the one main surface 2a in a plan view as viewed from a direction perpendicular to the one main surface 2a. And a U-shaped frame surrounding the periphery of the first component 3 arranged in the vicinity of the side of the one main surface 2a, excluding the side facing the side of the one main surface 2a of the first component 3 It is a shape that is integrated.
  • the heat transfer portion 61 is disposed in a recess 6E provided in the sealing resin layer 6, and the first component 3 and other components (first components) from the lower surface 55b side of the inter-component overlapping portion 55 toward the main surface 2a. 1 part 3, second part 4, third part 5) so as to exist between them.
  • the heat transfer portion 61 is located between the surface including the surface facing the one main surface 2a of the first component 3 and the one main surface 2a from the lower surface 55b side of the inter-part overlapping portion 55 toward the one main surface 2a. To a predetermined position.
  • the heat transfer portion 61 may extend from the lower surface 55b side of the inter-part overlapping portion 55 toward the one main surface 2a to a position reaching the one main surface 2a, but damages the one main surface 2a of the substrate 2. It is good also as extending to the position which does not reach one main surface 2a so that it may not give.
  • the flat plate portion of the heat transfer section 61 provided between the adjacent first component 3 and the second component 4 or the third component 5, the flat plate portion of the heat transfer section 61 and the plurality of first components 3
  • the shortest distance between the flat part and the first part 3 closest to the flat part is the second part 4 or the second part 4 closest to the flat part of the second part 4 and the plurality of third parts 5. It is smaller than the shortest distance from the third component 5.
  • the flat plate portion of the heat transfer portion 61 provided between the first component 3 and the second component 4 mounted substantially at the center of the one main surface 2a the first component 3 and the heat transfer portion 61
  • the shortest distance with the flat plate portion is smaller than the shortest distance between the second component 4 and the flat plate portion of the heat transfer section 61.
  • the shortest distance between the first component 3 and the flat plate portion of the heat transfer section 61 is smaller than the shortest distance between the third component 5 and the flat plate portion of the heat transfer section 61.
  • the heat generated from the first component 3 is absorbed by the heat transfer unit 61 and is transferred from the heat transfer unit 61 to the heat radiating member 60 to be radiated.
  • the first component 3 is less susceptible to the heat generated from the other first component 3, and the second component 4 and each third component 5 are affected by the heat generated from each first component 3. It becomes difficult.
  • FIG. 6A is a plan view of the module 1e according to the second modification of the third embodiment with the upper surface portion of the shield layer 8 removed
  • FIG. 6B is the upper surface portion of the shield layer 8.
  • FIG. 7 is a cross-sectional view taken along the line FF in FIG.
  • the module 1e according to the second modification of the third embodiment is different from the module 1d according to the first modification described with reference to FIG.
  • the structure is replaced with 60A.
  • the heat radiating member 60A has a first heat radiating part 31A, a plurality of second heat radiating parts 22 and a heat transfer part 61, and is formed of a heat conductive material (for example, a high heat conductive material such as metal).
  • a heat conductive material for example, a high heat conductive material such as metal.
  • the first heat radiating part 31A, the plurality of second heat radiating parts 22 and the heat transfer part 61 are formed of the same heat conductive material.
  • the 2nd thermal radiation part 22 of the modification 2 of 3rd Embodiment has the structure similar to the 2nd thermal radiation part 22 of 1st Embodiment.
  • the heat-transfer part 61 of the modification 2 of 3rd Embodiment has the structure similar to the heat-transfer part 61 of the modification 1 of 3rd Embodiment.
  • the first heat radiating portion 31A is present in each first component 3 and a region between the upper surface 3a and the region between the first components 3 in a plan view as viewed from a direction perpendicular to the one main surface 2a of the substrate 2.
  • the first heat radiating portion 31A does not exist in a region overlapping the upper surface 4a of the second component 4 in a plan view as viewed from the direction perpendicular to the one main surface 2a of the substrate 2, and each third component 5 It does not exist in the region overlapping with the upper surface of.
  • the first heat radiating portion 31 ⁇ / b> A has a first overlapping portion 25 corresponding to each first component 3.
  • the surface 31Aa that is parallel to the one main surface 2a of the first heat radiating portion 31A and is farthest from the one main surface 2a is on the same surface as the upper surface 6a of the sealing resin layer 6, and It is exposed from the upper surface 6a.
  • FIG. 7A is a plan view of the module 1f according to the third modification of the third embodiment with the upper surface portion of the shield layer 8 removed
  • FIG. 7B is the upper surface portion of the shield layer 8.
  • FIG. 8 is a cross-sectional view taken along the line GG of FIG.
  • the module 1 f according to the third modification of the third embodiment is different from the module 1 d according to the first modification of the third embodiment described with reference to FIG.
  • the heat radiating member 31 is replaced with a heat radiating member 60B having a first heat radiating portion 31B having a structure in which a portion overlapping the upper surface 4a of the second component 4 is removed from the first heat radiating portion 31 in a plan view as viewed from the direction perpendicular to the one main surface 2a Have a structure.
  • the heat dissipating member 60B has a first heat dissipating part 31B, a plurality of second heat dissipating parts 22, and a heat transfer part 61, and is formed of a heat conductive material (for example, a high heat conductive material such as metal).
  • a heat conductive material for example, a high heat conductive material such as metal.
  • the first heat radiating portion 31B, the plurality of second heat radiating portions 22, and the heat transfer portion 61 are formed of the same heat conductive material.
  • the 2nd thermal radiation part 22 of the modification 3 of 3rd Embodiment has the structure similar to the 2nd thermal radiation part 22 of 1st Embodiment.
  • the heat-transfer part 61 of the modification 3 of 3rd Embodiment has the structure similar to the heat-transfer part 61 of the modification 1 of 3rd Embodiment.
  • the first heat dissipating part 31B is a plan view viewed from a direction perpendicular to the one main surface 2a of the substrate 2 and excludes the peripheral portion of the one main surface 2a, and the upper surface 4a of the second component 4 and the upper surface 4a Exists in the area excluding the surrounding area.
  • the first heat radiating portion 31B is present in substantially all of the region overlapping the one main surface 2a except the region overlapping the upper surface 4a of the second component 4 in a plan view as viewed from the direction perpendicular to the one main surface 2a.
  • the first heat radiating portion 31 ⁇ / b> B includes a first overlapping portion 25 corresponding to each first component 3 and a third overlapping portion 37 corresponding to each third component 5.
  • a surface 31Ba that is parallel to the one main surface 2a of the first heat radiating portion 31B and is farthest from the one main surface 2a is on the same surface as the upper surface 6a of the sealing resin layer 6, and It is exposed from the upper surface 6a.
  • the present invention can be applied to a module having a heat dissipation structure.
  • Module 2 Substrate 2a One main surface 3 First part 4 Second part 6 Sealing resin layer 7, 30, 40, 50, 60, 60A, 60B Heat radiation member 21, 31, 31A, 31B, 41 First heat radiation Part 22 Second heat radiation part 25 First superposition part 36 Second superposition part 51, 61 Heat transfer part 55 Inter-part superposition part

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Abstract

基板に実装された部品の使用時の温度上昇に伴う特性変動や部品に与える損傷を抑えることを目的とする。　モジュール１は、基板２と、基板２の一方主面２ａに実装された放熱対象である第１部品３と、第１部品３を封止する封止樹脂層６と、第１放熱部２１及び第２放熱部２２を有する放熱部材７とを備え、第１放熱部２１は、第１部品３の上面３ａに対して間隔を空けて封止樹脂層６に設けられた、一方主面２ａに垂直な方向から見た平面視において第１部品３の上面３ａに重なる第１重合部２５を有し、第２放熱部２２は、第１重合部２５の下面２５ｂ側から第１部品３の上面３ａに向かって第１部品３の上面３ａにまで延び、第１重合部２５の下面２５ｂを含む面における第２放熱部２２の面積が第１重合部２５の面積より小さい。

Description

モジュール
　本発明は、放熱構造を有するモジュールに関する。
　基板の実装面に発熱する部品が実装されたモジュールでは、部品の使用時の温度上昇に伴う特性変動や部品の損傷を防ぐために、放熱対策が施される場合がある。このような放熱対策が施されたモジュールとして、例えば、図８に示す特許文献１に記載の電子装置１００がある。
　電子装置１００は、電子部品１０２ａ，１０２ｂ，１０２ｃが実装されたプリント基板１０１と、電子部品１０２ａ，１０２ｂ，１０２ｃから発生した熱を外界に逃す放熱板１０３と、プリント基板１０１と放熱板１０３との間に充填したモールド樹脂１０４とを備えている。そして、放熱板１０３と電子部品１０２ａ，１０２ｂ，１０２ｃとの間には、電子部品１０２ａ，１０２ｂ，１０２ｃの実装高さの高低差よりも高さが高い熱伝導性バンプ１０５が圧縮した状態で配列されている。熱伝導性バンプ１０５は、電子部品１０２ａ，１０２ｂ，１０２ｃと、放熱板１０３とを熱結合している。
特許第５５４４９０６号（段落００３２、図１参照）
　しかしながら、上記した電子装置１００では、モールド樹脂１０４の上面に放熱板１０３が配置された構造であるため、熱伝導性バンプ１０５が長くなってしまい、これにより、電子部品１０２ａ，１０２ｂ，１０２ｃから発生した熱が熱伝導性バンプ１０５を介して放熱板１０３に伝わるのに要する時間が長くなり、十分な放熱効果が得られない虞がある。
　本発明は、上記した課題に鑑みてなされたものであり、基板に実装された部品の使用時の温度上昇に伴う特性変動や部品に与える損傷を抑えつつ、放熱効果の向上を図ることができるモジュールを提供することを目的とする。
　上記した目的を達成するために、本発明のモジュールは、基板と、前記基板の一方主面に実装された放熱対象である第１部品と、前記第１部品を封止する封止樹脂層と、第１放熱部及び第２放熱部を有する放熱部材とを備え、前記封止樹脂層には、前記一方主面と対向する面と反対側の面に第１凹部と当該第１凹部から前記一方主面側に延びた第２凹部が設けられており、前記第１放熱部は、前記第１部品の実装側の面と反対側の面に対して間隔を空けて前記封止樹脂層に設けられた前記第１凹部に配置されており、前記一方主面に垂直な方向から見た平面視において少なくとも前記第１部品の前記反対側の面に重なる第１重合部を有し、前記第２放熱部は、前記封止樹脂層に設けられた前記第２凹部に配置されており、前記第１重合部の前記第１部品に対向する面側から前記第１部品の前記反対側の面に向かって延び、前記第１重合部の前記第１部品に対向する面を含む面における前記第２放熱部の面積が前記第１重合部の面積より小さいことを特徴としている。
　この構成によれば、一方主面に垂直な方向から見た平面視において、第２放熱部と第１部品の反対側の面とが重なり合う面積は、第１放熱部の第１重合部と第１部品の反対側の面とが重なり合う面積に比べて小さいので、第２放熱部の形成時における第１部品の損傷を抑えることができる。さらに、第１放熱部の第１重合部は第１部品の反対側の面に対して間隔を空けて封止樹脂層に設けられた第１凹部に配置されているため、従来技術のように放熱板を封止樹脂層の上面に配置する場合に比べ、第１放熱部の第１重合部と第１部品との距離が小さくなる。これにより、第１部品から発生した熱が第２放熱部を介して速やかに第２放熱部の表面積より表面積が大きい第１放熱部に伝わるため、放熱効果の向上が図られる。
　また、前記一方主面に実装された放熱対象ではない第２部品を更に備え、前記第１放熱部は、前記第２部品の実装側の面と反対側の面に対して間隔を空けて設けられており、前記一方主面に垂直な方向から見た平面視において少なくとも前記第２部品の前記反対側の面に重なる第２重合部を有し、前記第２重合部の前記第２部品に対向する面から前記第２部品の前記反対側の面までの最短距離は、前記第１重合部の前記第１部品に対向する面から前記第１部品の前記反対側の面までの最短距離より大きいとしてもよい。この構成によれば、第１放熱部の表面積が大きくなり、放熱効果の更なる向上が図られる。また、第２重合部の第２部品に対向する面から第２部品の反対側の面までの最短距離を第１重合部の第１部品に対向する面から第１部品の反対側の面までの最短距離と同じにせずに大きくしているため、第１部品から発生した熱が第２放熱部及び第１放熱部を経由して第２部品に伝わりにくくなり、第２部品は第１部品から発生した熱の影響を受けにくくなる。
　また、前記一方主面に実装された放熱対象ではない第２部品を更に備え、前記第１放熱部は、前記一方主面に垂直な方向から見た平面視において、前記一方主面に重なる領域のうちの前記第２部品の実装側の面と反対側の面に重なる領域を除く略全てに存在するとしてもよい。この構成によれば、第１放熱部の表面積が大きくなり、放熱効果の更なる向上が図られる。
　また、前記一方主面に実装された放熱対象ではない第２部品を更に備え、前記第１放熱部は、前記一方主面に対向し、前記一方主面に垂直な方向から見た平面視において少なくとも前記第１部品と前記第２部品との間の領域に重なる部品間重合部を有し、前記放熱部材は、前記部品間重合部の前記一方主面に対向する面側から前記一方主面に向かって前記第１部品と前記第２部品との間に存在するように延びる伝熱部を更に備え、前記第１部品と前記伝熱部との最短距離は、前記第２部品と前記伝熱部との最短距離より小さいとしてもよい。この構成によれば、第１部品と第２部品との間であって第２部品より第１部品の方に近い位置に伝熱部が存在するために、第１部品から発生した熱が伝熱部に吸収されて放熱部材から放熱され、第２部品は第１部品から発生した熱の影響を受けにくくなる。
　また、前記第１放熱部は、前記一方主面に対向し、前記一方主面に垂直な方向から見た平面視において少なくとも前記第１部品と前記第２部品との間の領域に重なる部品間重合部を有し、前記放熱部材は、前記部品間重合部の前記一方主面に対向する面側から前記一方主面に向かって前記第１部品と前記第２部品との間に存在するように延びる伝熱部を更に備え、前記第１部品と前記伝熱部との最短距離は、前記第２部品と前記伝熱部との最短距離より小さいとしてもよい。この構成によれば、第１部品と第２部品との間であって第２部品より第１部品の方に近い位置に伝熱部が存在するために、第１部品から発生した熱が伝熱部に吸収されて放熱部材から放熱され、第２部品は第１部品から発生した熱の影響を受けにくくなる。
　また、前記伝熱部は前記一方主面に垂直な方向から見た平面視において前記第１部品の前記第２部品に対向する辺の外側に少なくとも存在するように前記第１部品を取り囲む枠状であるとしてもよい。この構成によれば、伝熱部により第１部品と第２部品とが仕切られるために、第２部品は第１部品から発生した熱の影響を受けにくくなる。
　本発明によれば、第１放熱部は、第１部品の反対側の面に対して間隔を空けて封止樹脂層に設けられた前記第１凹部に配置されており、一方主面に垂直な方向から見た平面視において少なくとも第１部品の反対側の面に重なる第１重合部を有し、第２放熱部は、第１重合部の第１部品に対向する面側から第１部品の反対側の面に向かって延び、第１重合部の第１部品に対向する面を含む面における第２放熱部の面積が第１重合部の面積より小さい。このため、一方主面に垂直な方向から見た平面視において、第２放熱部と第１部品の反対側の面とが重なり合う面積は、第１放熱部の第１重合部と第１部品の反対側の面とが重なり合う面積に比べて小さいので、第２放熱部の形成時における第１部品の損傷を抑えることができる。さらに、第１放熱部の第１重合部は第１部品の反対側の面に対して間隔を空けて封止樹脂層に設けられた前記第１凹部に配置されているため、従来技術のように放熱板を封止樹脂層の上面に配置する場合に比べ、第１放熱部の第１重合部と第１部品との距離が小さくなる。これにより、第１部品から発生した熱が第２放熱部を介して速やかに第２放熱部の表面積より表面積が大きい第１放熱部に伝わるため、放熱効果の向上が図られる。
（ａ）は本発明の第１実施形態に係るモジュールのシールド層の上面部分を除いた状態での平面図であり、（ｂ）はシールド層の上面部分を含むようにした場合の（ａ）のＡ－Ａ断面図である。 （ａ）は本発明の第２実施形態に係るモジュールのシールド層の上面部分を除いた状態での平面図であり、（ｂ）はシールド層の上面部分を含むようにした場合の（ａ）のＢ－Ｂ断面図である。 （ａ）は本発明の第２実施形態の変形例１に係るモジュールのシールド層の上面部分を除いた状態での平面図であり、（ｂ）はシールド層の上面部分を含むようにした場合の（ａ）のＣ－Ｃ断面図である。 （ａ）は本発明の第３実施形態に係るモジュールのシールド層の上面部分を除いた状態での平面図であり、（ｂ）はシールド層の上面部分を含むようにした場合の（ａ）のＤ－Ｄ断面図である。 （ａ）は本発明の第３実施形態の変形例１に係るモジュールのシールド層の上面部分を除いた状態での平面図であり、（ｂ）はシールド層の上面部分を含むようにした場合の（ａ）のＥ－Ｅ断面図である。 （ａ）は本発明の第３実施形態の変形例２に係るモジュールのシールド層の上面部分を除いた状態での平面図であり、（ｂ）はシールド層の上面部分を含むようにした場合の（ａ）のＦ－Ｆ断面図である。 （ａ）は本発明の第３実施形態の変形例３に係るモジュールのシールド層の上面部分を除いた状態での平面図であり、（ｂ）はシールド層の上面部分を含むようにした場合の（ａ）のＧ－Ｇ断面図である。 従来のモジュールの断面図である。
　＜第１実施形態＞
　本発明の第１実施形態に係るモジュール１について図１を参照して説明する。なお、図１（ａ）は第１実施形態に係るモジュール１のシールド層８の上面部分を除いた状態での平面図であり、図１（ｂ）はシールド層８の上面部分を含むようにした場合の図１（ａ）のＡ－Ａ断面図である。
　第１実施形態に係るモジュール１は、例えば、電子機器のマザー基板等に搭載されるものである。モジュール１は、基板２と、基板２の一方主面２ａに実装された２つの第１部品３、１つの第２部品４及び１３個の第３部品５と、各第１部品３、第２部品４及び各第３部品５等を封止する封止樹脂層６と、封止樹脂層６に設けられた２つの放熱部材７と、封止樹脂層６の後述する上面６ａ及び側面、各放熱部材７の後述する第１放熱部２１の上面２１ａ並びに基板２の側面を被覆するように設けられたシールド層８とを備える。なお、第１部品３、第２部品４、第３部品５の個数は一例であり、これに限定されるものではない。なお、シールド層８は必須ではない。
　基板２は、例えば低温同時焼成セラミックスやガラスエポキシ樹脂等で形成される。基板２の一方主面２ａには複数のランド電極９が形成され、他方主面２ｂには複数の外部電極１０が形成され、内部には複数の電極（配線電極、グランド電極）１１及びビア導体１２が形成されている。例えば、ランド電極９はビア導体１２を介して電極（配線電極、グランド電極）１１に接続され、外部電極１０はビア導体１２を介して電極（配線電極、グランド電極）１１に接続されている。なお、グランド電極は基板２の側面から露出してシールド層８と接触している。
　各ランド電極９、各外部電極１０、各電極（配線電極、グランド電極）１１は、それぞれ、ＣｕやＡｇ、Ａｌ等の電極として一般的に採用される金属で形成されている。また、各ビア導体１２は、ＡｇやＣｕ等の金属で形成されている。
　各第１部品３は、発熱する部品であって、放熱を必要とする放熱対象である部品である。各第１部品３は、例えば接続端子が基板２の一方主面２ａに形成されたランド電極９に半田１３を用いて接続されることによって、基板２の一方主面２ａに実装されている。また、第２部品４は、放熱を必要としない放熱対象でない部品であり、例えば第１部品３から発した熱の影響を受けて特性が変動しやすい部品である。第２部品４は、例えば、接続端子が、基板２の一方主面２ａにおけるビア導体１２の露出面に、半田１３を用いて接続されることによって、基板２の一方主面２ａに実装されている。また、第３部品５は、放熱を必要としない放熱対象でない部品であり、例えば第１部品３から発した熱の影響を受けて特性が変動しやすい部品である。各第３部品５についても、第２部品４と同様に、基板２の一方主面２ａに実装されている。ここで、発熱する部品として、ＩＣ素子やパワーアンプ素子等の半導体素子がある。また、ＩＣ素子でも回路設計や回路の機能によって発熱量が大きい場合とそうでない場合がある。また、インダクタやコンデンサ、フィルタ等の受動素子の発熱量は小さく、これらの発熱は一般的にはあまり問題とならないが、小型化の進展により、熱を放出するこれらの表面積が減少してきたことから、部品の高密度実装化や回路設計によってはこれらの発熱が問題となることがある。したがって、第１部品３はその発熱が問題となる部品となる。
　封止樹脂層６には、一方主面２ａと反対側に各放熱部材７の後述する第１放熱部２１の第１重合部２５が配置される凹部６Ａと、各放熱部材７の後述する第２放熱部２２が配置される凹部６Ｂが形成されている。そして、封止樹脂層６は、一方主面２ａ、各第１部品３、第２部品４及び各第３部品を覆うとともに、各放熱部材７の後述する第１放熱部２１の上面２１ａを除いて各放熱部材７を覆うように、一方主面２ａ、各第１部品３、第２部品４、各第３部品５及び各放熱部材７を封止する。封止樹脂層６は、シリカフィラー入りのエポキシ樹脂等の封止樹脂として一般的に採用される樹脂で形成することができる。また、高熱伝導のため、封止樹脂層６にアルミナフィラー等の熱伝導率が高いフィラー入りのエポキシ樹脂等の樹脂を使用することもできる。
　各放熱部材７は、第１放熱部２１と複数の第２放熱部２２とを有しており、熱伝導性材料（例えば、金属等の高熱伝導性材料）で形成される。
　第１放熱部２１は、基板２の一方主面２ａに垂直な方向から見た平面視において、第１部品３の一方主面２ａに対向する面、すなわち実装側の面と反対側の面（以下、「上面」と記載する。）３ａとその上面３ａの周辺領域に存在する。そして、第１放熱部２１は、第１部品３の上面３ａに対して間隔を空けて封止樹脂層６に設けられた凹部６Ａに配置されており、基板２の一方主面２ａに垂直な方向から見た平面視において、少なくとも第１部品３の上面３ａに重なる第１重合部２５を有する。第１放熱部２１の一方主面２ａと平行な面であって一方主面２ａから最も離れた面（以下、「上面」と記載する。）２１ａは、封止樹脂層６の一方主面２ａと平行な面であって一方主面２ａから最も離れた面（以下、「上面」と記載する。）６ａと同一平面上にあり、封止樹脂層６の上面６ａから露出している。また、第１重合部２５の一方主面２ａと平行な面であって一方主面２ａに最も近い面（以下、「下面」と記載する。）２５ｂが第１部品３の上面３ａに接触しないように、一方主面２ａから第１重合部２５の下面２５ｂまでの距離は、一方主面２ａから第１部品３の上面３ａまでの距離より大きくなっている。
　そして、複数の第２放熱部２２が、封止樹脂層６に設けられた凹部６Ｂに配置されており、第１重合部２５の下面２５ｂ側にマトリックス状に設けられている。各第２放熱部２２は、略円柱状をしており、第１重合部２５の下面２５ｂ側から第１部品３に向かって第１部品３の上面３ａにまで延び、第１部品３の上面３ａに接触している。なお、各第２放熱部２２は第１部品３の上面３ａに接触していなくてもよい。そして、各第２放熱部２２は、第１重合部２５の下面２５ｂを含む面における各第２放熱部２２の面積は第１重合部２５の面積より小さくなっている。なお、第１重合部２５の下面２５ｂが本発明の「第１重合部の第１部品に対向する面」に相当する。すなわち、本実施形態における「放熱部材」は、封止樹脂層６の上面６ａに設けられた凹部６Ａに配置された「第１放熱部」と、当該第１放熱部からさらに第１部品に向かって部分的に設けられた凹部６Ｂに配置された「第２放熱部」の、２段階の構造を有している。このように、本実施形態における放熱部材は、段階的な構造となっている。
　２つの第１部品３のうち、図１の略中央に図示された一方の第１部品３の上面３ａと、同じく図１の略中央に図示された一方の第１重合部２５の下面２５ｂとの最短距離は、もう一方の第１部品３の上面３ａともう一方の第１重合部２５の下面２５ｂとの最短距離より小さくなっている。このように、放熱対象の２つの第１部品３において、放熱の必要性の度合いに応じて第１部品３の上面３ａと第１重合部２５の下面２５ｂとの距離を変えて、放熱の必要性の度合いが高い方の距離を小さくする。なお、放熱対象の２つの第１部品３において、放熱の必要性の度合いに関わらず第１部品３の上面３ａと第１重合部２５の下面２５ｂとの距離を同じにしてもよい。
　ただし、モジュール１では、一方主面２ａに垂直な方向から見た平面視において、第２部品４と重なる部分には放熱部材７がなく、各第３部品５と重なる部分には放熱部材７がない。
　なお、第１実施形態では、放熱部材７が有する複数の第２放熱部２２は第１重合部２５の下面２５ｂ側にマトリックス状に配置されているが、マトリックス状に配置されていなくてもよい。
　また、第２放熱部２２の形状は、略円柱状としているが、略円柱状以外の柱状、例えば略四角柱状であってもよい。
　また、２つの第１部品３毎に放熱部材７を設ける代わりに、一方主面２ａに垂直な方向から見た平面視において、２つの第１部品３の上面３ａの双方を含む部品領域に重なる１つの放熱部材を有するようにしてもよい。この場合に、１つの放熱部材が、第１放熱部と複数の第２放熱部とを有するようにする。第１放熱部は、２つの第１部品３毎に、第１部品３の上面３ａに対して間隔を空けて封止樹脂層６に設けられた凹部６Ａに配置されており、基板２の一方主面２ａに垂直な方向から見た平面視において少なくとも第１部品３の上面３ａに重なる第１重合部を有するようにする。そして、２つの第１重合部毎に、複数の第２放熱部が第１重合部の下面側にマトリックス状に設けられ、各第２放熱部は、第１重合部の下面側から第１部品３の上面３ａに向かって第１部品３の上面３ａにまで延び、第１部品３の上面３ａに接触しているようにしてもよい。なお、各第２放熱部は第１部品３の上面３ａに接触していなくてもよい。
　シールド層８は、封止樹脂層６の上面６ａ及び側面、各放熱部材７の第１放熱部２１の上面２１ａ並びに基板２の側面それぞれに接触するように被覆している。シールド層８は、外部機器から放射される不要電磁波がモジュール１の各第１部品３、第２部品４、各第３部品５等へ到来することを低減したり、モジュール１の各第１部品３、第２部品４、各第３部品５等から放射される不要電磁波が外部へ漏洩することを低減したりするためのものである。
　シールド層８は、例えば、封止樹脂層６の上面６ａ及び側面、各放熱部材７の第１放熱部２１の上面２１ａ並びに基板２の側面に積層された密着層と、密着層に積層された導電層と、導電層に積層された耐食層とを有する多層構造で形成することができる。密着層は、導電層と封止樹脂層６等との密着強度を高めるために設けられるものであり、例えば、ＳＵＳ等の金属で形成することができる。導電層は、シールド層８の実質的なシールド機能を担う層であり、例えば、Ｃｕ、Ａｇ、Ａｌのうちのいずれかの金属で形成することができる。耐食層は、導電層が腐食したり、傷が付いたりするのを防止するために設けられるものであり、例えば、ＳＵＳで形成することができる。シールド層８の形成に、例えば、スパッタ方式、蒸着方式、ペースト塗布方式等を用いることができる。
　（モジュールの製造方法）
　次に、モジュール１の製造方法について説明する。
　まず、一方主面２ａに複数のランド電極９が形成され、他方主面２ｂに複数の外部電極１０が形成されるとともに、内部に複数の電極（配線電極、グランド電極）１１、複数のビア導体１２等が形成された基板２の集合体を用意する。各ランド電極９、各外部電極１０、及び各電極（配線電極、グランド電極）１１については、ＣｕやＡｇ、Ａｌ等の金属を含有する導電性ペーストをスクリーン印刷するなどしてそれぞれ形成することができる。また、各ビア導体１２については、レーザ等を用いてビアホールを形成した後、周知の方法により形成することができる。
　次に、基板２の一方主面２ａに、周知の表面実装技術を用いて２つの第１部品３、１つの第２部品４及び１３個の第３部品５を実装する。例えば、ランド電極９のうち所望のランド電極９上に半田１３を形成しておき、半田１３が形成されているランド電極９のうちの対応するランド電極９に第１部品３を実装し、第１部品３を実装した後、リフロー処理を行う。また、例えば、基板２内に形成されているビア導体１２の一方主面２ａからの露出面のうち、所望の露出面上に半田１３を形成しておき、半田１３が形成されているビア導体１２の一方主面２ａからの露出面のうちの対応する露出面に第２部品４を実装し、実装した後、リフロー処理を行う。また、第３部品５についても、第２部品４と同様に実装し、実装した後、リフロー処理を行う。なお、リフロー処理後に必要に応じて基板２の集合体の洗浄を行う。
　次に、基板２の一方主面２ａとこの一方主面２ａに実装された各第１部品３、第２部品４及び各第３部品５とを覆うように、基板２の一方主面２ａに封止樹脂層６の元となる仮の封止樹脂層を形成する。仮の封止樹脂層の形成に、例えば、トランスファーモールド方式、コンプレッションモールド方式、液状樹脂工法、シート樹脂工法等を用いることができる。ここで、仮の封止樹脂層に、一般的なシリカフィラー入りのエポキシ樹脂等の封止樹脂として一般的に採用されている樹脂を用いることができる。なお、仮の封止樹脂層に高い熱伝導性を持たせるために、アルミナフィラー等の熱伝導率が高いフィラー入りのエポキシ樹脂等の樹脂を用いることができる。なお、仮の封止樹脂層の形成前に、必要に応じて基板２の集合体のプラズマ洗浄を行う。
　次に、仮の封止樹脂層の一方主面２ａに対向する面と反対側の面のうちの、一方主面２ａに垂直な方向から見た平面視において、各第１部品３の上面３ａ及びその周辺を含む領域にレーザを照射し、第１部品３の上面３ａに達しない位置まで樹脂を除去して、各第１放熱部２１を配置するための凹部６Ａを形成する。さらに、凹部６Ａの底面のうち、第１部品３の上面３ａに対向する部分の複数個所にレーザを照射し、各第１部品３の上面３ａに達するまで樹脂を除去して、各第２放熱部２２を配置するための凹部６Ｂを形成する。これにより、各放熱部材７を配置するための凹部が設けられた封止樹脂層６が形成される。ここで、レーザとして、例えば、ＵＶレーザ、ＣＯ２レーザ、ＹＡＧレーザ、Ｇｒｅｅｎレーザなどを使用することができる。
　次に、封止樹脂層６における各放熱部材７を配置するための凹部に熱伝導性材料（例えば、金属等の高熱伝導性材料）を充填する。凹部６Ａと凹部６Ｂには同一の熱伝導性材料を充填することを基本とする。但し、凹部６Ａと凹部６Ｂに異なる熱伝導性材料を充填してもよい。これにより、第１部品３毎に、第１放熱部２１と複数の第２放熱部２２からなる放熱部材７が形成される。
　次に、ダイサーまたはレーザ加工により、シールド層８の形成前のモジュール１を個片化する。
　次に、個片化されたシールド層８の形成前のモジュール１に対して、封止樹脂層６の上面６ａ及び側面、各放熱部材７の第１放熱部２１の上面２１ａ並びに基板２の側面それぞれに接触するように覆うシールド層８を形成する。シールド層８の形成に、例えば、スパッタ方式、蒸着方式、ペースト塗布方式等を用いることができる。
　上記した第１実施形態によれば、第１放熱部２１は、第１部品３の上面３ａに対して間隔を空けて封止樹脂層６に設けられた凹部６Ａに配置されおり、一方主面２ａに垂直な方向から見た平面視において少なくとも第１部品３の上面３ａに重なる第１重合部２５を有し、各第２放熱部２２は、第１重合部２５の下面２５ｂ側から第１部品３の上面３ａに向かって当該上面３ａにまで延び、第１重合部２５の下面２５ｂを含む面における第２放熱部２２の面積が第１重合部２５の面積より小さい。このため、第２部品３の上面３ａにおいて、当該上面３ａに相当する封止樹脂６を全体的に削る場合に比べて、第２放熱部２２を配置するための凹部６Ｂの形成時における第１部品３の損傷を抑えることができる。また、第１放熱部２１の第１重合部２５は第１部品３の上面３ａに対して間隔を空けて封止樹脂層６に設けられた凹部６Ａに配置されているため、従来技術のように放熱板を封止樹脂層の上面に配置する場合に比べ、第１放熱部２１の第１重合部２５と第１部品３との距離が小さくなる。これにより、第１部品３から発生した熱が第２放熱部２２を介して速やかに第２放熱部２２の表面積より表面積が大きい第１放熱部２１に伝わるため、放熱効果の向上が図られる。
　また、一方主面２ａに垂直な方向から見た平面視において、放熱部材７が第２部品４の一方主面２ａに対向する面と反対側の面や第３部品５の一方主面２ａに対向する面と反対側の面に重なっていないので、第１部品３から発生した熱が第２放熱部２２及び第１放熱部２１を経由して第２部品４及び第３部品５に伝わりにくく、第２部品４や第３部品５が第１部品３から発生した熱の影響を受けにくくなる。この結果、第２部品４や第３部品５の温度上昇による特性の変動や性能の劣化を防止することができる。
　また、放熱を必要とする第１部品３に応じて放熱部材７を適切に配置することが可能となり、放熱性の向上が図られる。また、複数の第２放熱部２２が封止樹脂層６に対して楔を打ち込むような形態となるので、封止樹脂層６と第２放熱部２２間の剥がれを抑制することができ、封止樹脂層６と第２放熱部２２間の剥がれに起因するシールド層８の断線も抑えることが可能になる。
　また、特許文献１の構造では、熱伝導性バンプ１０５が圧縮した状態で電子部品１０２ａ，１０２ｂ，１０２ｃに当接することから、熱伝導性バンプ１０５の導電性成分が当接した電子部品１０２ａ，１０２ｂ，１０２ｃの実装面側に回り込み、電子部品１０２ａ，１０２ｂ，１０２ｃにショート等の不具合が発生したり、電子部品１０２ａ，１０２ｂ，１０２ｃの信頼性が低下したりする虞がある。モジュール１では、第２放熱部２２の導電性成分が第１部品３の回路形成面に回り込みにくいため、第１部品３にショート等の不具合が発生しにくい。したがって、第１部品３の信頼性の低下も起こりにくい。
　＜第２実施形態＞
　本発明の第２実施形態に係るモジュール１ａについて図２を参照して説明する。なお、図２（ａ）は第２実施形態に係るモジュール１ａのシールド層８の上面部分を除いた状態での平面図であり、図２（ｂ）はシールド層８の上面部分を含むようにした場合の図２（ａ）のＢ－Ｂ断面図である。
　第２実施形態に係るモジュール１ａが図１を用いて説明した第１実施形態に係るモジュール１と異なる点は、図２に示すように、一方主面２ａに垂直な方向から見た平面視において、放熱部材３０が、第２部品４の一方主面２ａに対向する面の反対側の面（以下、「上面」と記載する。）４ａ及び各第３部品５の一方主面２ａに対向する面の反対側の面（以下、「上面」と記載する。）に重なる部分を有している点である。その他の構成は第１実施形態に係るモジュール１と同様であるため、同一符号を付すことによりその説明を省略する。
　放熱部材３０は、第１放熱部３１と複数の第２放熱部２２とを有しており、熱伝導性材料（例えば、金属等の高熱伝導性材料）で形成される。なお、第２実施形態の第２放熱部２２は第１実施形態の第２放熱部２２と同様の構造をしている。
　第１放熱部３１は、基板２の一方主面２ａに垂直な方向から見た平面視において、一方主面２ａにおいて、その周縁部を除いた領域に存在する。そして、第１放熱部３１は、２つの第１部品３毎に、第１部品３の上面３ａに対して間隔を空けて封止樹脂層６に設けられた凹部６Ａに配置されており、基板２の一方主面２ａに垂直な方向から見た平面視において少なくとも第１部品３の上面３ａに重なる第１重合部２５を有する。また、第１放熱部３１は、第２部品４の上面４ａに対して間隔を空けて封止樹脂層６に設けられた凹部６Ａに配置されており、基板２の一方主面２ａに垂直な方向から見た平面視において少なくとも第２部品４の上面４ａに重なる第２重合部３６を備える。また、第１放熱部３１は、１３個の第３部品５毎に、第３部品５の上面に対して間隔を空けて封止樹脂層６に設けられた凹部に配置されており、基板２の一方主面２ａに垂直な方向から見た平面視において少なくとも第３部品５の上面と重なり合う第３重合部３７とを有する。
　第１放熱部３１の一方主面２ａと平行な面であって、一方主面２ａから最も離れた面（以下、「上面」と記載する。）３１ａは、封止樹脂層６の上面６ａと同一面上にあり、封止樹脂層６の上面６ａから露出している。また、各第１重合部２５について、第１重合部２５の下面２５ｂが第１部品３の上面３ａに接触しないように、一方主面２ａから第１重合部２５の下面２５ｂまでの距離は、一方主面２ａから第１部品３の上面３ａまでの距離より大きくなっている。また、第２重合部３６の一方主面２ａと平行な面であって一方主面２ａに最も近い面（以下、「下面」と記載する。）３６ｂが第２部品４の上面４ａに接触しないように、一方主面２ａから第２重合部３６の下面３６ｂまでの距離は、一方主面２ａから第２部品４の上面４ａまでの距離より大きくなっている。また、各第３重合部３７について、第３重合部３７の一方主面２ａと平行な面であって一方主面２ａに最も近い面（以下、「下面」と記載する。）が第３部品５の上面に接触しないように、一方主面２ａから第３重合部３７の下面までの距離は、一方主面２ａから第３部品５の上面までの距離より大きくなっている。
　第２重合部３６の下面３６ｂから第２部品４の上面４ａまでの最短距離は、第１重合部２５の下面２５ｂから第１部品３の上面３ａまでの最短距離より大きくなっている。また、第３重合部３７の下面から第３部品５の上面までの最短距離は、第１重合部２５の下面２５ｂから第１部品３の上面３ａまでの最短距離より大きくなっている。
　ただし、モジュール１ａでは、第２重合部３６の下面３６ｂ側から第２部品４の上面４ａに向かって延びる第２放熱部２２がなく、第３重合部３７の下面側から第３部品５の上面に向かって延びる第２放熱部２２がない。
　上記した第２実施形態によれば、第１放熱部３１は一方主面２ａに垂直な方向から見た平面視において少なくとも第２部品４の上面４ａに重なる第２重合部３６及び各第３部品５毎に少なくとも第３部品５の上面に重なる第３重合部３７を有しているため、第１放熱部３１の表面積が大きくなり、放熱効果の更なる向上が図られる。また、第２重合部３６の下面３６ｂから第２部品４の上面４ａまでの最短距離を、第１重合部２５の下面２５ｂから第１部品３の上面３ａまでの最短距離と同じにせず、大きくしているため、第１部品３から発生した熱が第２放熱部２２及び第１放熱部３１を経由して第２部品４に伝わりにくくなり、第２部品４は第１部品３から発生した熱の影響を受けにくくなる。この結果、第２部品４の温度上昇による特性の変動や性能の劣化を防止することができる。また、同様に、第３重合部３７の下面から第３部品５の上面までの最短距離を、第１重合部２５の下面２５ｂから第１部品３の上面３ａまでの最短距離と同じにせず、大きくしているため、第１部品３から発生した熱が第２放熱部２２及び第１放熱部３１を経由して第３部品５に伝わりにくくなり、第３部品５は第１部品３から発生した熱の影響を受けにくくなる。この結果、第３部品５の温度上昇による特性の変動や性能の劣化を防止することができる。
　＜変形例１＞
　本発明の第２実施形態の変形例１に係るモジュール１ｂについて図３を参照して説明する。なお、図３（ａ）は第２実施形態の変形例１に係るモジュール１ｂのシールド層８の上面部分を除いた状態での平面図であり、図３（ｂ）はシールド層８の上面部分を含むようにした場合の図３（ａ）のＣ－Ｃ断面図である。
　第２実施形態の変形例１に係るモジュール１ｂは、図３に示すように、図２を用いて説明した第２実施形態に係るモジュール１ａに対して、放熱部材３０を、第１放熱部３１から、一方主面２ａに垂直な方向から見た平面視において第２部品４の上面４ａに重なる部分を取り除いた構造をしている第１放熱部４１を有する放熱部材４０に置き換えた構造をしている。
　放熱部材４０は、第１放熱部４１と複数の第２放熱部２２とを有しており、熱伝導性材料（例えば、金属等の高熱伝導性材料）で形成される。なお、第２実施形態の変形例１の第２放熱部２２は第１実施形態の第２放熱部２２と同様の構造をしている。
　第１放熱部４１は、基板２の一方主面２ａに垂直な方向から見た平面視において、一方主面２ａにおいて、その周縁部を除くとともに、第２部品４の上面４ａとその上面４ａの周辺とを除いた領域に存在する。この第１放熱部４１は、一方主面２ａに垂直な方向から見た平面視において、一方主面２ａに重なる領域のうちの第２部品４の上面４ａに重なる領域を除く略全てに存在する。第１放熱部４１は、各第１部品３に対応する第１重合部２５と、各第３部品５に対応する第３重合部３７とを有する。第１放熱部４１の一方主面２ａと平行な面であって一方主面２ａから最も離れた面４１ａは、封止樹脂層６の上面６ａと同一面上にあり、封止樹脂層６の上面６ａから露出している。
　＜第３実施形態＞
　本発明の第３実施形態に係るモジュール１ｃについて図４を参照して説明する。なお、図４（ａ）は第３実施形態に係るモジュール１ｃのシールド層８の上面部分を除いた状態での平面図であり、図４（ｂ）はシールド層８の上面部分を含むようにした場合の図４（ａ）のＤ－Ｄ断面図である。
　第３実施形態に係るモジュール１ｃが図２を用いて説明した第２実施形態に係るモジュール１ａと異なる点は、図４に示すように、放熱部材５０が、放熱部材３０に対して、一方主面２ａに垂直な方向から見た平面視において第１部品３と他の部品（第１部品３、第２部品４、第３部品５）との間に略円柱状をした複数の伝熱部５１を付加した構造をしている点である。その他の構成は第２実施形態に係るモジュール１ａと同様であるため、同一符号を付すことによりその説明を省略する。
　放熱部材５０は、第１放熱部３１と複数の第２放熱部２２と複数の伝熱部５１とを有しており、熱伝導性材料（例えば、金属等の高熱伝導性材料）で形成される。例えば、第１放熱部３１と複数の第２放熱部２２と複数の伝熱部５１とは同じ熱伝導性材料で形成されている。なお、第３実施形態の第１放熱部３１は第２実施形態の第１放熱部３１と同様の構造をしており、第１放熱部３１には、一方主面２ａに対向し、一方主面２ａに垂直な方向から見た平面視において少なくとも第１部品３と他の部品（第１部品３、第２部品４、第３部品５）との間の領域に重なる部品間重合部５５がある。なお、部品間重合部５５のうちの少なくとも一方主面２ａの略中央に実装された第１部品３と第２部品４との間の領域に重なる部分が本発明の「部品間重合部」に相当する。また、第３実施形態の第２放熱部２２は第１実施形態の第２放熱部２２と同様の構造をしている。
　複数の伝熱部５１が、一方主面２ａに垂直な方向から見た平面視において、略円形をしている。そして、複数の伝熱部５１が、一方主面２ａに垂直な方向から見た平面視において、部品間重合部５５の一方主面２ａに対向する面（以下、「下面」と記載する。）５５ｂ側に第１部品３と他の部品（第１部品３、第２部品４、第３部品５）との間に設けられている。さらに記載すると、一方主面２ａの略中央に実装された第１部品３に対して、一方主面２ａに垂直な方向から見た平面視において、この第１部品３の周囲を取り囲むように複数の伝熱部５１が設けられている。また、一方主面２ａの辺の近傍に配置された第１部品３に対して、一方主面２ａに垂直な方向から見た平面視において、この第１部品３の一方主面２ａの当該辺に対向する辺を除いた周囲を取り囲むように複数の伝熱断部５１が設けられている。
　各伝熱部５１は、封止樹脂層６に設けられた凹部６Ｄに配置されており、部品間重合部５５の下面５５ｂ側から一方主面２ａに向かって第１部品３と他の部品（第１部品３、第２部品４、第３部品５）との間に存在するように延び、略円柱状をしている。例えば、各伝熱部５１は、部品間重合部５５の下面５５ｂ側から一方主面２ａに向かって、第１部品３の一方主面２ａに対向する面を含む面と一方主面２ａとの間の所定位置にまで延びている。なお、各伝熱部５１は、部品間重合部５５の下面５５ｂ側から一方主面２ａに向かって一方主面２ａに達する位置まで延びていてもよいが、基板２の一方主面２ａに損傷を与えないように一方主面２ａに達しない位置まで延びているとしてもよい。
　隣接する第１部品３と第２部品４または第３部品５との間に設けられた各伝熱部５１に関して、伝熱部５１と複数の第１部品３のうちのこの伝熱部５１に最も近い第１部品３との最短距離は、この伝熱部５１と第２部品４及び複数の第３部品５のうちのこの伝熱部５１に最も近い第２部品４または第３部品５との最短距離より小さい。例えば、一方主面２ａの略中央に実装された第１部品３と第２部品４との間に設けられた伝熱部５１に関して、この第１部品３とこの伝熱部５１との最短距離は、この第２部品４とこの伝熱部５１との最短距離より小さい。また、例えば、一方主面２ａの辺の近傍に配置された第１部品３とこの第１部品３と隣接する第３部品５と間に設けられた伝熱部５１に関して、この第１部品３とこの伝熱部５１との最短距離は、この第３部品５とこの伝熱部５１との最短距離より小さい。
　なお、伝熱部５１の形状は、略円柱状としているが、略円柱状以外の柱状、例えば略四角柱状であってもよい。
　上記した第３実施形態によれば、第１部品３から発生した熱が伝熱部５１に吸収され、伝熱部５１から放熱部材５０に伝わって放熱される。これにより、第１部品３はもう一方の第１部品３から発生した熱の影響を受けにくくなり、第２部品４や各第３部品５は各第１部品３から発生した熱の影響を受けにくくなる。この結果、第１部品３、第２部品４、第３部品５それぞれの温度上昇による特性の変動や性能の劣化を防止することができる。
　＜変形例１＞
　本発明の第３実施形態の変形例１に係るモジュール１ｄについて図５を参照して説明する。なお、図５（ａ）は第３実施形態の変形例１に係るモジュール１ｄのシールド層８の上面部分を除いた状態での平面図であり、図５（ｂ）はシールド層８の上面部分を含むようにした場合の図５（ａ）のＥ－Ｅ断面図である。
　第３実施形態の変形例１に係るモジュール１ｄは、図５に示すように、図４を用いて説明した第３実施形態に係るモジュール１ｃに対して、放熱部材５０を、伝熱部５１の形状と異なる形状の伝熱部６１を有する放熱部材６０に置き換えた構造をしている。
　放熱部材６０は、第１放熱部３１と複数の第２放熱部２２と伝熱部６１とを有しており、熱伝導性材料（例えば、金属等の高熱伝導性材料）で形成される。例えば、第１放熱部３１と複数の第２放熱部２２と伝熱部６１とは同じ熱伝導性材料で形成されている。なお、第３実施形態の変形例１の第１放熱部３１は第２実施形態の第１放熱部３１と同様の構造をしている。また、第３実施形態の変形例１の第２放熱部２２は第１実施形態の第２放熱部２２と同様の構造をしている。
　伝熱部６１が、一方主面２ａに垂直な方向から見た平面視において、部品間重合部５５の下面５５ｂ側に第１部品３と他の部品（第１部品３、第２部品４、第３部品５）との間に存在するように設けられている。さらに記載すると、一方主面２ａに垂直な方向から見た平面視において、一方主面２ａの略中央に実装された第１部品３に対してこの第１部品３の周囲を囲む矩形状の枠と、一方主面２ａの辺の近傍に配置された第１部品３に対してこの第１部品３の一方主面２ａの当該辺に対向する辺を除いた周囲を囲むコの字状の枠とを一体とした形状になっている。
　伝熱部６１は、封止樹脂層６に設けられた凹部６Ｅに配置されており、部品間重合部５５の下面５５ｂ側から一方主面２ａに向かって第１部品３と他の部品（第１部品３、第２部品４、第３部品５）との間に存在するように延びている。例えば、伝熱部６１は、部品間重合部５５の下面５５ｂ側から一方主面２ａに向かって、第１部品３の一方主面２ａに対向する面を含む面と一方主面２ａとの間の所定位置にまで延びている。なお、伝熱部６１は、部品間重合部５５の下面５５ｂ側から一方主面２ａに向かって一方主面２ａに達する位置まで延びていてもよいが、基板２の一方主面２ａに損傷を与えないように一方主面２ａに達しない位置まで延びているとしてもよい。
　隣接する第１部品３と第２部品４または第３部品５との間に設けられた伝熱部６１の平板部分に関して、伝熱部６１のこの平板部分と複数の第１部品３のうちのこの平板部分に最も近い第１部品３との最短距離は、伝熱部６１のこの平板部分と第２部品４及び複数の第３部品５のうちのこの平板部分に最も近い第２部品４または第３部品５との最短距離より小さい。例えば、一方主面２ａの略中央に実装された第１部品３と第２部品４との間に設けられた伝熱部６１の平板部分に関して、この第１部品３と伝熱部６１のこの平板部分との最短距離は、この第２部品４と伝熱部６１のこの平板部分との最短距離より小さい。また、例えば、一方主面２ａの辺の近傍に配置された第１部品３とこの第１部品３と隣接する第３部品５との間に設けられた伝熱部６１の平板部分に関して、この第１部品３と伝熱部６１のこの平板部分との最短距離は、この第３部品５と伝熱部６１のこの平板部分との最短距離より小さい。
　上記した第３実施形態の変形例１によれば、第１部品３から発生した熱が伝熱部６１に吸収され、伝熱部６１から放熱部材６０に伝わって放熱される。これにより、第１部品３はもう一方の第１部品３から発生した熱の影響を受けにくくなり、第２部品４や各第３部品５は各第１部品３から発生した熱の影響を受けにくくなる。この結果、第１部品３、第２部品４、第３部品５それぞれの温度上昇による特性の変動や性能の劣化を防止することができる。
　＜変形例２＞
　本発明の第３実施形態の変形例２に係るモジュール１ｅについて図６を参照して説明する。なお、図６（ａ）は第３実施形態の変形例２に係るモジュール１ｅのシールド層８の上面部分を除いた状態での平面図であり、図６（ｂ）はシールド層８の上面部分を含むようにした場合の図６（ａ）のＦ－Ｆ断面図である。
　第３実施形態の変形例２に係るモジュール１ｅは、図６に示すように、図５を用いて説明した第３実施形態の変形例１に係るモジュール１ｄに対して、放熱部材６０を、一方主面２ａに垂直な方向から見た平面視において各第１部品３の配置領域に存在し、第２部品４及び各第３部品５の配置領域に存在しない第１放熱部３１Ａを有する放熱部材６０Ａに置き換えた構造をしている。
　放熱部材６０Ａは、第１放熱部３１Ａと複数の第２放熱部２２と伝熱部６１とを有しており、熱伝導性材料（例えば、金属等の高熱伝導性材料）で形成される。例えば、第１放熱部３１Ａと複数の第２放熱部２２と伝熱部６１とは同じ熱伝導性材料で形成されている。なお、第３実施形態の変形例２の第２放熱部２２は第１実施形態の第２放熱部２２と同様の構造をしている。また、第３実施形態の変形例２の伝熱部６１は第３実施形態の変形例１の伝熱部６１と同様の構造をしている。
　第１放熱部３１Ａは、基板２の一方主面２ａに垂直な方向から見た平面視において、各第１部品３とその上面３ａの周辺領域と第１部品３間の領域に存在する。なお、第１放熱部３１Ａは、基板２の一方主面２ａに垂直な方向から見た平面視において、第２部品４の上面４ａと重なる領域には存在せず、また、各第３部品５の上面と重なる領域には存在しない。第１放熱部３１Ａは、各第１部品３に対応する第１重合部２５を有する。第１放熱部３１Ａの一方主面２ａと平行な面であって一方主面２ａから最も離れた面３１Ａａは、封止樹脂層６の上面６ａと同一面上にあり、封止樹脂層６の上面６ａから露出している。
　＜変形例３＞
　本発明の第３実施形態の変形例３に係るモジュール１ｆについて図７を参照して説明する。なお、図７（ａ）は第３実施形態の変形例３に係るモジュール１ｆのシールド層８の上面部分を除いた状態での平面図であり、図７（ｂ）はシールド層８の上面部分を含むようにした場合の図７（ａ）のＧ－Ｇ断面図である。
　第３実施形態の変形例３に係るモジュール１ｆは、図７に示すように、図５を用いて説明した第３実施形態の変形例１に係るモジュール１ｄに対して、放熱部材６０を、第１放熱部３１から、一方主面２ａに垂直な方向から見た平面視において第２部品４の上面４ａに重なる部分を取り除いた構造をしている第１放熱部３１Ｂを有する放熱部材６０Ｂに置き換えた構造をしている。
　放熱部材６０Ｂは、第１放熱部３１Ｂと複数の第２放熱部２２と伝熱部６１とを有しており、熱伝導性材料（例えば、金属等の高熱伝導性材料）で形成される。例えば、第１放熱部３１Ｂと複数の第２放熱部２２と伝熱部６１とは同じ熱伝導性材料で形成されている。なお、第３実施形態の変形例３の第２放熱部２２は第１実施形態の第２放熱部２２と同様の構造をしている。また、第３実施形態の変形例３の伝熱部６１は第３実施形態の変形例１の伝熱部６１と同様の構造をしている。
　第１放熱部３１Ｂは、基板２の一方主面２ａに垂直な方向から見た平面視において、一方主面２ａにおいて、その周縁部を除くとともに、第２部品４の上面４ａとその上面４ａの周辺とを除いた領域に存在する。この第１放熱部３１Ｂは、一方主面２ａに垂直な方向から見た平面視において、一方主面２ａに重なる領域のうちの第２部品４の上面４ａに重なる領域を除く略全てに存在する。第１放熱部３１Ｂは、各第１部品３に対応する第１重合部２５と、各第３部品５に対応する第３重合部３７とを有する。第１放熱部３１Ｂの一方主面２ａと平行な面であって一方主面２ａから最も離れた面３１Ｂａは、封止樹脂層６の上面６ａと同一面上にあり、封止樹脂層６の上面６ａから露出している。
　なお、本発明は上記した各実施形態に限定されるものではなく、その趣旨を逸脱しない限りにおいて、上記したもの以外に種々の変更を行うことができる。例えば、上記した各実施形態の内容及び変形例の内容を組み合わせてもよい。
　本発明は、放熱構造を有するモジュールに適用することができる。
　１～１ｆ　モジュール
　２　基板
　２ａ　一方主面
　３　第１部品
　４　第２部品
　６　封止樹脂層
　７，３０，４０，５０，６０，６０Ａ，６０Ｂ　放熱部材
　２１，３１，３１Ａ，３１Ｂ，４１　第１放熱部
　２２　第２放熱部
　２５　第１重合部
　３６　第２重合部
　５１，６１　伝熱部
　５５　部品間重合部

Claims (6)

  1. 　基板と、
    　前記基板の一方主面に実装された放熱対象である第１部品と、
    　前記第１部品を封止する封止樹脂層と、
    　第１放熱部及び第２放熱部を有する放熱部材と
    　を備え、
    　前記封止樹脂層には、前記一方主面と対向する面と反対側の面に第１凹部と当該第１凹部から前記一方主面側に延びた第２凹部が設けられており、
    　前記第１放熱部は、前記第１部品の実装側の面と反対側の面に対して間隔を空けて前記封止樹脂層に設けられた前記第１凹部に配置されており、前記一方主面に垂直な方向から見た平面視において少なくとも前記第１部品の前記反対側の面に重なる第１重合部を有し、
    　前記第２放熱部は、前記封止樹脂層に設けられた前記第２凹部に配置されており、前記第１重合部の前記第１部品に対向する面側から前記第１部品の前記反対側の面に向かって延び、
    　前記第１重合部の前記第１部品に対向する面を含む面における前記第２放熱部の面積が前記第１重合部の面積より小さい
    　ことを特徴とするモジュール。
  2. 　前記一方主面に実装された放熱対象ではない第２部品を更に備え、
    　前記第１放熱部は、前記第２部品の実装側の面と反対側の面に対して間隔を空けて設けられており、前記一方主面に垂直な方向から見た平面視において少なくとも前記第２部品の前記反対側の面に重なる第２重合部を有し、
    　前記第２重合部の前記第２部品に対向する面から前記第２部品の前記反対側の面までの最短距離は、前記第１重合部の前記第１部品に対向する面から前記第１部品の前記反対側の面までの最短距離より大きい
    　ことを特徴とする請求項１に記載のモジュール。
  3. 　前記一方主面に実装された放熱対象ではない第２部品を更に備え、
    　前記第１放熱部は、前記一方主面に垂直な方向から見た平面視において、前記一方主面に重なる領域のうちの前記第２部品の実装側の面と反対側の面に重なる領域を除く略全てに存在する
    　ことを特徴とする請求項１に記載のモジュール。
  4. 　前記一方主面に実装された放熱対象ではない第２部品を更に備え、
    　前記第１放熱部は、前記一方主面に対向し、前記一方主面に垂直な方向から見た平面視において少なくとも前記第１部品と前記第２部品との間の領域に重なる部品間重合部を有し、
    　前記放熱部材は、前記部品間重合部の前記一方主面に対向する面側から前記一方主面に向かって前記第１部品と前記第２部品との間に存在するように延びる伝熱部を更に備え、
    　前記第１部品と前記伝熱部との最短距離は、前記第２部品と前記伝熱部との最短距離より小さい
    　ことを特徴とする請求項１に記載のモジュール。
  5. 　前記第１放熱部は、前記一方主面に対向し、前記一方主面に垂直な方向から見た平面視において少なくとも前記第１部品と前記第２部品との間の領域に重なる部品間重合部を有し、
    　前記放熱部材は、前記部品間重合部の前記一方主面に対向する面側から前記一方主面に向かって前記第１部品と前記第２部品との間に存在するように延びる伝熱部を更に備え、
    　前記第１部品と前記伝熱部との最短距離は、前記第２部品と前記伝熱部との最短距離より小さい
    　ことを特徴とする請求項２または３に記載のモジュール。
  6. 　前記伝熱部は前記一方主面に垂直な方向から見た平面視において前記第１部品の前記第２部品に対向する辺の外側に少なくとも存在するように前記第１部品を取り囲む枠状であることを特徴とする請求項４または５に記載のモジュール。
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CN110476245B (zh) 2023-08-01
US11177189B2 (en) 2021-11-16

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