WO2018180594A1 - Feuille composite adhésive du type film et procédé de fabrication d'un dispositif semi–conducteur - Google Patents

Feuille composite adhésive du type film et procédé de fabrication d'un dispositif semi–conducteur Download PDF

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Publication number
WO2018180594A1
WO2018180594A1 PCT/JP2018/010464 JP2018010464W WO2018180594A1 WO 2018180594 A1 WO2018180594 A1 WO 2018180594A1 JP 2018010464 W JP2018010464 W JP 2018010464W WO 2018180594 A1 WO2018180594 A1 WO 2018180594A1
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Prior art keywords
film
adhesive
support sheet
film adhesive
sheet
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PCT/JP2018/010464
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English (en)
Japanese (ja)
Inventor
雄太 佐川
啓示 布施
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リンテック株式会社
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Application filed by リンテック株式会社 filed Critical リンテック株式会社
Priority to JP2019509284A priority Critical patent/JPWO2018180594A1/ja
Priority to CN201880020526.2A priority patent/CN110461973B/zh
Priority to KR1020197027967A priority patent/KR102552837B1/ko
Publication of WO2018180594A1 publication Critical patent/WO2018180594A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83191—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on the semiconductor or solid-state body

Definitions

  • the present invention relates to a film-like adhesive composite sheet and a method for manufacturing a semiconductor device.
  • a semiconductor chip to which a film adhesive for use in die bonding is attached may be used.
  • the film adhesive is pasted on a plurality of individual semiconductor chips obtained by dicing a semiconductor wafer, and then this film
  • the film adhesive is usually attached to a plurality of semiconductor chips using a film adhesive composite sheet in which a film adhesive is provided on a support sheet.
  • the semiconductor chip is manufactured by, for example, forming a groove in a semiconductor wafer and then grinding the back side until reaching the groove, but this is an example, and the semiconductor chip is manufactured by other methods.
  • the semiconductor chip to which the film adhesive after cutting is attached is separated (pick up) from the support sheet together with the film adhesive and used for die bonding.
  • a method of cutting the film adhesive for example, a method of cutting the film adhesive by irradiating a laser, or a method of cutting the film adhesive by expanding is known.
  • the laser irradiation method requires a laser irradiation device and has a problem that it cannot be efficiently cut in a short time.
  • the expanding method requires an expanding device and has a problem that the cut surface may be roughened.
  • the film adhesive since the expand works only in the same plane direction as the film adhesive, the film adhesive may only be stretched with the support sheet and not cut. For this reason, the film-like adhesive may be cooled to be easily cut and expanded, but in this case, a cooling step is required, resulting in poor productivity.
  • a film adhesive having a specific thickness and tensile elongation at break is used, and the semiconductor chip is picked up together with the uncut film adhesive immediately before the semiconductor chip is picked up.
  • a method of cutting a film adhesive using a shearing force generated by lifting in the direction is disclosed (see Patent Document 1).
  • the present invention has been made in view of the above circumstances, and at the time of manufacturing a semiconductor device, a semiconductor chip to which a film-like adhesive is applied is suppressed by a simplified method, while suppressing the occurrence of process abnormality. It is an object of the present invention to provide a film-like adhesive composite sheet in which a film-like adhesive is provided on a support sheet that can be separated from the support sheet, and a method for manufacturing a semiconductor device using the composite sheet.
  • the present invention provides a film-like adhesive composite sheet in which a curable film-like adhesive having a thickness of 1 to 60 ⁇ m is provided on a support sheet having a substrate, the support sheet There is provided a film-like adhesive composite sheet having a product (A ⁇ B) of Young's modulus A (MPa) and thickness B (mm) of the support sheet in the range of 4 to 150 MPa ⁇ mm.
  • the breaking elongation C of the laminate obtained by laminating the film-like adhesive before curing so that the total thickness becomes 200 ⁇ m is 5 to 2000%.
  • the present invention is also a method of manufacturing a semiconductor device using the film-like adhesive composite sheet, wherein the film-like adhesive composite sheet is divided into a plurality of semiconductor chips via the film-like adhesive. And applying a force from the side opposite to the side on which the film-like adhesive is provided to the support sheet of the film-like adhesive composite sheet attached to the semiconductor chip.
  • a step of cutting the film adhesive by applying force to the film adhesive over, and a step of separating the semiconductor chip and the film adhesive after cutting attached to the semiconductor chip from the support sheet A method for manufacturing a semiconductor device is provided.
  • the support sheet has a substrate
  • the curable film adhesive has a thickness of 1 to 60 ⁇ m
  • the product of Young's modulus of the support sheet and the thickness of the support sheet is 4 to 150 MPa ⁇ mm.
  • Film adhesive composite sheet [2] When the film adhesive is laminated to have a total thickness of 200 ⁇ m by laminating the uncured film adhesive, the breaking elongation of the laminate is 1 to 2000%.
  • [3] A method for manufacturing a semiconductor device using the film adhesive composite sheet according to [1], Affixing the film adhesive composite sheet to a plurality of semiconductor chips that have been divided via the film adhesive; With respect to the support sheet in the film adhesive composite sheet affixed to the semiconductor chip, a force is applied to the film adhesive through the support sheet from the side opposite to the side where the film adhesive is provided. Cutting the film adhesive by adding Separating the semiconductor chip and the film adhesive after cutting attached to the semiconductor chip from the support sheet; A method for manufacturing a semiconductor device, comprising:
  • the semiconductor chip to which the film adhesive is stuck can be separated from the support sheet while suppressing the occurrence of process abnormality by a simplified method.
  • a film-like adhesive composite sheet in which a film-like adhesive is provided on a support sheet, and a method of manufacturing a semiconductor device using the composite sheet.
  • the film-like adhesive composite sheet of the present invention is a film-like adhesive composite sheet in which a curable film-like adhesive having a thickness of 1 to 60 ⁇ m is provided on a support sheet having a substrate, and the support sheet
  • the product of Young's modulus (A) (MPa) and the thickness (B) (mm) of the support sheet (that is, the value of A ⁇ B) is in the range of 4 to 150 MPa ⁇ mm.
  • the film-like adhesive composite sheet is provided with a film-like adhesive on a support sheet, and is stuck to one surface of a semiconductor chip by the film-like adhesive when a semiconductor device is manufactured. In a later step, the semiconductor chip is separated (picked up) from the support sheet while the film adhesive is stuck.
  • the product (A ⁇ B) of Young's modulus (A) (MPa) of the support sheet and thickness (B) (mm) of the support sheet is 4 to 4 By being in the range of 150 MPa ⁇ mm, the semiconductor chip to which the film adhesive is affixed can be separated from the support sheet while suppressing the occurrence of process abnormality.
  • the product (A ⁇ B) of the thickness (B) (mm) of the support sheet is preferably 13.6 to 112.5 MPa ⁇ mm. More specifically, it is as follows.
  • the film adhesive can be cut by performing a normal pickup operation of applying force to the film adhesive through the support sheet.
  • the film-like adhesive can be cut at normal temperature at a place where the film-like adhesive is intended, without separately providing a process mainly for cutting the film-like adhesive. Therefore, the separation (lifting) defect of the semiconductor chip due to the fact that the film adhesive is not cut is suppressed.
  • the part corresponding to the target semiconductor chip of the film adhesive is peeled off from the support sheet, and the phenomenon that the part corresponding to the semiconductor chip other than the target of the film adhesive is peeled off from the support sheet is suppressed.
  • the film-like adhesive is not only for the target part of the film-like adhesive but is not separated from the support sheet, and the film-like adhesive is used not only for the target semiconductor chip but also for the adjacent semiconductor chip.
  • the occurrence of so-called double dies that are pulled away from the support sheet is suppressed.
  • “suppression of process abnormality” means suppression of the separation failure of the semiconductor chip, generation of a double die, and the like.
  • the substrate is greatly deformed. It is considered that the pick-up force is not transmitted to the film adhesive and it becomes difficult to cut the film adhesive. Moreover, if the product (A ⁇ B) exceeds 150 MPa ⁇ mm, the substrate is hard and the area around the target film-like adhesive corresponding to the semiconductor chip is lifted, and the force at the time of pick-up is film. It is considered that it is difficult to cut the film adhesive regardless of the adhesive.
  • the product (A ⁇ B) of the Young's modulus (A) (MPa) of the support sheet and the thickness (B) (mm) of the support sheet is in the range of 4 to 150 MPa ⁇ mm. Then, the base material is not greatly deformed and the pick-up force is easily transmitted to the film adhesive, so that the film adhesive can be easily cut. In addition, since the base material does not become too hard and the surroundings of the target film-like adhesive corresponding to the semiconductor chip can be prevented from lifting, the force at the time of pick-up is easily transmitted to the film-like adhesive, so the film The adhesive can be easily cut.
  • the film-like adhesive composite sheet it is possible to suppress the separation failure of the semiconductor chip and the generation of the double die. Furthermore, the process mainly intended for cutting the film adhesive as described above, for example, the process of cutting the film adhesive by irradiating the laser, the process of cutting the film adhesive by expanding, etc. Since it can be omitted, problems caused by performing these steps can be avoided, the film adhesive can be cut at room temperature, the number of steps can be reduced, and a semiconductor device can be manufactured by a simplified method.
  • Patent Document 1 Japanese Unexamined Patent Application Publication No. 2013-179317
  • the semiconductor chip is lifted together with the uncut film adhesive in the pickup direction immediately before the pickup of the semiconductor chip.
  • a method of cutting a film adhesive using a shearing force generated at that time is disclosed.
  • it is not certain whether the semiconductor chip to which the cut film adhesive is attached can be picked up from the support sheet while suppressing the occurrence of process abnormality.
  • a film-like adhesive composite sheet in which a film-like adhesive is provided on a general dicing sheet that is, a support sheet having a base material and a pressure-sensitive adhesive layer
  • a general dicing sheet that is, a support sheet having a base material and a pressure-sensitive adhesive layer
  • the support sheet is a sheet having a substrate, and may be a sheet made of only the substrate (that is, having only the substrate), or a sheet having a substrate and other layers other than the substrate. May be.
  • seat provided with the adhesive layer on the base material is mentioned, for example.
  • the film adhesive described later is provided on the support sheet. Therefore, for example, when the support sheet is a sheet provided with a pressure-sensitive adhesive layer on a base material, a film adhesive is provided on the pressure-sensitive adhesive layer.
  • a film adhesive is provided on the base material in direct contact.
  • the thickness of the support sheet can be appropriately selected depending on the purpose within a range that satisfies the condition of the product (A ⁇ B), but is preferably 20 ⁇ m to 200 ⁇ m, more preferably 25 ⁇ m to 150 ⁇ m, 30 ⁇ m to 100 ⁇ m is particularly preferable, and 38 ⁇ m to 80 ⁇ m is very particularly preferable.
  • the thickness of the support sheet means the thickness of the entire support sheet.
  • the thickness of the support sheet composed of a plurality of layers means the total thickness of all the layers constituting the support sheet. means.
  • a measuring method of the thickness of a support sheet the method of measuring thickness with a contact-type thickness meter in arbitrary five places, and calculating the average of the measured value etc. are mentioned, for example.
  • the Young's modulus of the support sheet can be appropriately selected depending on the purpose within a range satisfying the product (A ⁇ B) condition, but is preferably 50 MPa to 5000 MPa, more preferably 100 MPa to 4000 MPa, and 150 MPa. It is particularly preferably from ⁇ 3000 MPa, very particularly preferably from 170 MPa to 2250 MPa. “Young's modulus” is a value measured using a universal testing machine under the conditions of gripping tool spacing: 100 mm, pulling speed: 200 mm / min, based on JIS K7127: 1999, as described in Examples below. is there.
  • the support sheet according to the present invention has a thickness (B) of 38 ⁇ m to 80 ⁇ m, a Young's modulus (A) of 170 MPa to 2250 MPa, and a product (A ⁇ B) of 13.6 to A support sheet of 112.5 MPa ⁇ mm is preferred.
  • the constituent material of the base material is preferably various resins.
  • polyethylene for example, low density polyethylene (may be abbreviated as LDPE), linear low density polyethylene (may be abbreviated as LLDPE).
  • High density polyethylene may be abbreviated as HDPE
  • polypropylene polybutene, polybutadiene, polymethylpentene, styrene / ethylene butylene / styrene block copolymer, polyvinyl chloride, vinyl chloride copolymer, polyethylene terephthalate (May be abbreviated as PET), polybutylene terephthalate, polyurethane, polyurethane acrylate, polyimide, ethylene vinyl acetate copolymer, ionomer resin, ethylene / (meth) acrylic acid copolymer, ethylene / (meth) acrylic acid ester Polymer, Polystyrene, polycarbonate, fluorocarbon resins, hydrogenated product of any of these resins, modified products, include cross-linked product or copolymer and the like.
  • (meth) acrylic acid is a concept including both “acrylic acid” and “methacrylic acid”.
  • (meth) acrylate is a concept including both “acrylate” and “methacrylate”
  • (meth) acryloyl group Is a concept including both an “acryloyl group” and a “methacryloyl group”.
  • the resin constituting the substrate may be only one kind, or two or more kinds, and in the case of two or more kinds, the combination and ratio thereof can be arbitrarily selected.
  • the substrate may be composed of one layer (that is, a single layer) or may be composed of two or more layers.
  • a base material consists of multiple layers, these multiple layers may be the same or different from each other. That is, all the layers may be the same, all the layers may be different, or only some of the layers may be the same. And when a several layer differs from each other, the combination of these several layers is not specifically limited unless the effect of this invention is impaired.
  • the plurality of layers being different from each other means that at least one of the material and the thickness of each layer is different from each other.
  • “a plurality of layers may be the same or different from each other” means “all layers may be the same or all layers are different. Means that only some of the layers may be the same ”, and“ a plurality of layers are different from each other ”means that“ at least one of the constituent materials and thickness of each layer is different from each other ”. Means.
  • the thickness of the substrate can be appropriately selected depending on the purpose within a range satisfying the product (A ⁇ B) condition, but is preferably 20 ⁇ m to 200 ⁇ m, more preferably 25 ⁇ m to 150 ⁇ m, and more preferably 30 ⁇ m. It is particularly preferably from 100 to 100 ⁇ m, particularly preferably from 38 to 80 ⁇ m.
  • the thickness of the substrate means the thickness of the entire substrate.
  • the thickness of the substrate composed of a plurality of layers means the total thickness of all the layers constituting the substrate. means.
  • the method of measuring thickness using a contact-type thickness meter in arbitrary five places, and calculating the average of a measured value etc. are mentioned, for example.
  • the Young's modulus of the substrate can be appropriately selected according to the purpose within a range satisfying the product (A ⁇ B) condition, but is preferably 50 MPa to 5000 MPa, more preferably 100 MPa to 4000 MPa, and 150 MPa. It is particularly preferably from ⁇ 3000 MPa, very particularly preferably from 170 MPa to 2250 MPa.
  • the substrate according to the present invention is preferably a substrate having a thickness of 38 ⁇ m to 80 ⁇ m, a Young's modulus of 170 MPa to 2250 MPa, and a product of 13.6 to 112.5 MPa ⁇ mm. .
  • the substrate In order to improve adhesion to other layers such as a pressure-sensitive adhesive layer provided on the base material, surface roughness treatment by sandblasting, solvent treatment, etc., corona discharge treatment, electron beam irradiation treatment, plasma treatment
  • the surface may be subjected to oxidation treatment such as ozone / ultraviolet irradiation treatment, flame treatment, chromic acid treatment, and hot air treatment.
  • the base material may have a surface subjected to primer treatment.
  • the base material prevents the base material from adhering to other sheets or the base material from adhering to the adsorption table when the antistatic coat layer and the film-like adhesive composite sheet are stored in an overlapping manner. It may have a layer or the like.
  • the substrate preferably has a surface subjected to an electron beam irradiation treatment from the viewpoint of suppressing generation of fragments of the substrate due to blade friction during dicing of the semiconductor wafer.
  • An adhesive layer can be formed from the adhesive composition containing the various components for comprising this.
  • the ratio of the content of components that do not vaporize at room temperature in the pressure-sensitive adhesive composition is usually the same as the ratio of the content of the components of the pressure-sensitive adhesive layer.
  • “normal temperature” means a temperature that is not particularly cooled or heated, that is, a normal temperature, and examples thereof include a temperature of 15 to 25 ° C.
  • the semiconductor chip can be easily picked up by irradiating the energy ray to reduce its adhesiveness.
  • the treatment for reducing the adhesiveness by irradiating the adhesive layer with the energy ray may be performed after the film-like adhesive composite sheet has been applied to the adherend, or in advance before being applied to the adherend. May be.
  • “energy beam” means an electromagnetic wave or charged particle beam having energy quanta, and examples thereof include ultraviolet rays and electron beams.
  • Ultraviolet rays can be irradiated by using, for example, a high-pressure mercury lamp, a fusion H lamp, or a xenon lamp as an ultraviolet ray source.
  • the electron beam can be emitted by an electron beam accelerator or the like.
  • “energy ray curable” means the property of being cured by irradiation with energy rays
  • “non-energy ray curable” means the property of not being cured even when irradiated with energy rays. .
  • the pressure-sensitive adhesive composition examples include a composition containing an acrylic polymer and an energy beam polymerizable compound (pressure-sensitive adhesive composition (i)); an acrylic having a hydroxyl group and a polymerizable group in the side chain.
  • a composition (adhesive composition (ii)) containing a polymer (for example, having a hydroxyl group and having a polymerizable group in the side chain via a urethane bond) and an isocyanate-based crosslinking agent is preferable.
  • a composition containing a solvent is more preferable.
  • the pressure-sensitive adhesive composition further comprises various additives such as a photopolymerization initiator, a colorant (pigment, dye), a deterioration inhibitor, an antistatic agent, a flame retardant, a silicone compound, and a chain transfer agent. Any of these may be contained.
  • the pressure-sensitive adhesive composition may contain a reaction retarder for suppressing the progress of an undesired crosslinking reaction during storage.
  • a reaction retarder what inhibits the effect
  • a preferable thing what forms a chelate complex by the chelate with respect to the said catalyst is mentioned, for example.
  • More preferable reaction retarders include those having two or more carbonyl groups (—C ( ⁇ O) —) in the molecule, and those having two carbonyl groups in the molecule, for example, Dicarboxylic acid, keto acid, diketone and the like can be mentioned.
  • the thickness of the pressure-sensitive adhesive layer can be appropriately selected depending on the purpose as long as the condition of product (A ⁇ B) is satisfied, but is preferably 1 to 100 ⁇ m.
  • the thickness is more preferably 1 to 60 ⁇ m, and particularly preferably 1 to 30 ⁇ m.
  • the “thickness of the pressure-sensitive adhesive layer” means the thickness of the whole pressure-sensitive adhesive layer.
  • the thickness of the pressure-sensitive adhesive layer composed of a plurality of layers is the total of all layers constituting the pressure-sensitive adhesive layer. Means the thickness.
  • the method of measuring thickness using a contact-type thickness meter in arbitrary five places, and calculating the average of a measured value etc. are mentioned, for example.
  • the pressure-sensitive adhesive composition is obtained by blending each component for constituting the pressure-sensitive adhesive layer such as an acrylic polymer. For example, except that the blending components are different, the same as in the case of the adhesive composition described later. Obtained by the method.
  • the pressure-sensitive adhesive layer can be formed by applying a pressure-sensitive adhesive composition to the surface of the substrate and drying it. At this time, you may bridge
  • the heating conditions can be, for example, 100 to 130 ° C. for 1 to 5 minutes, but are not limited thereto.
  • the pressure-sensitive adhesive layer formed by applying the pressure-sensitive adhesive composition to the release-treated surface of the release film and drying it may be bonded to the surface of the substrate, and the release film may be removed as necessary.
  • An adhesive layer can be formed on the material.
  • Application of the adhesive composition to the surface of the base material or the surface of the release layer of the release material may be performed by a known method, for example, air knife coater, blade coater, bar coater, gravure coater, roll coater, roll knife.
  • a known method for example, air knife coater, blade coater, bar coater, gravure coater, roll coater, roll knife.
  • Examples include a method using various coaters such as a coater, a curtain coater, a die coater, a knife coater, a screen coater, a Meyer bar coater, and a kiss coater.
  • the film adhesive has curability.
  • the film adhesive preferably has thermosetting properties, and preferably has pressure sensitive adhesive properties.
  • a film adhesive having both thermosetting and pressure-sensitive adhesive properties can be applied by lightly pressing on various adherends in an uncured state.
  • the film adhesive may be one that can be applied to various adherends by heating and softening.
  • the film adhesive finally becomes a cured product having high impact resistance by curing, and this cured product can maintain sufficient adhesive properties even under severe high temperature and high humidity conditions.
  • the film adhesive has a thickness of 1 ⁇ m to 60 ⁇ m, preferably 3 ⁇ m to 25 ⁇ m, and more preferably 5 ⁇ m to 15 ⁇ m.
  • a high adhesive force can be obtained for the adherend (that is, the semiconductor chip).
  • the thickness of the film adhesive is equal to or less than the above upper limit value, it is generated in this operation by performing an operation to apply a force to the film adhesive through a support sheet, which is usually performed when manufacturing a semiconductor device.
  • the film-like adhesive can be easily cut using the shearing force, and there is no need to provide a separate process mainly for cutting the film-like adhesive.
  • Examples of the method for measuring the thickness of the film adhesive include a method of measuring the thickness using a contact-type thickness meter at any five locations and calculating the average of the measured values.
  • the elongation at break C of the laminate obtained by laminating the film adhesive before curing so that the total thickness becomes 200 ⁇ m is preferably, for example, 5 to 2000%. 30 to 1200% is more preferable, 40 to 1100% is further preferable, and 45 to 1050% is particularly preferable.
  • the breaking elongation (C) is not more than the above upper limit value, the film adhesive can be more easily cut before picking up the semiconductor chip to which the film adhesive is stuck.
  • the film-like adhesive according to the film-like adhesive composite sheet of the present invention is a laminate in which the film-like adhesive before curing is laminated as one side surface and the total thickness becomes 200 ⁇ m
  • a film-like adhesive having the property that the elongation at break (C) of the laminate is 1 to 2000%, preferably 30 to 1200%, more preferably 40 to 1100%, particularly preferably 45 to 1050%. is there.
  • the elongation at break (C) is preferably 2000% or less, more preferably 1500% or less, particularly preferably 1000% or less, for example, 30 to 1500%, Any of 40 to 500% and 45 to 1000% may be used.
  • the breaking elongation (C) is not more than the above upper limit value, the film adhesive can be more easily cut by various methods before picking up the semiconductor chip to which the film adhesive is attached. That is, as the film adhesive cutting method, not only the most general pin push-up method but also other methods such as a slider push-up method can be suitably applied, and the versatility of the film adhesive composite sheet is enhanced.
  • breaking elongation (C) (%) means the elongation at break of a laminate obtained by laminating the film-like adhesive before curing so that the total thickness becomes 200 ⁇ m. Degree.
  • the elongation at break of the film-like adhesive before curing or the laminate obtained by laminating the same is JIS K7161-1994 (ISO 527-1) or JIS K7127: 1999 (ISO 527-3). This is a value obtained according to the above. If the object to be measured (test specimen) does not have a yield point, the tensile fracture strain is measured, and if it has a yield point, the nominal strain at the time of tensile fracture is measured. Can be requested.
  • the laminate for which the elongation at break C is to be determined is a film-like adhesive before curing having a thickness of less than 200 ⁇ m, preferably 1-60 ⁇ m in thickness for constituting the film-like adhesive composite sheet of the present invention. It is the laminated body obtained by laminating
  • the breaking elongation C is determined by cutting the laminate into a test piece having a width of 15 mm, a length of 100 mm, and a thickness of 200 ⁇ m, and the test piece is separated by a distance (for example, universal)
  • a distance for example, universal
  • the distance between the tips of the fixed gripping instrument is fixed at two places so that the distance is 75 mm, and the tensile speed is 200 mm / min. It is calculated
  • the elongation at break (C) is X% (wherein X is a positive number)” means that a test piece (a test prepared from a laminate) in the measurement method described above.
  • X% the original length in the tensile direction (the length when not being pulled), that is, the total length in the tensile direction of the test piece. This means that the test piece breaks when the length becomes [1 + X / 100] times the length before being pulled.
  • the breaking strength (D) of the laminate obtained by laminating the film adhesive before curing so that the total thickness is 200 ⁇ m is preferably 0.1 to 17 MPa. 0.2 to 15 MPa is more preferable, and 0.4 to 13 MPa is particularly preferable.
  • the laminated body is the same as the laminated body which is a measurement target of the above-described breaking elongation (C) (%).
  • the breaking strength D is a tensile stress when the test piece is broken (broken) at the time of breaking elongation (C) measurement, that is, tensile breaking stress, and can be measured simultaneously with the breaking elongation (C).
  • a film-like adhesive having a characteristic that the breaking strength (D) of the laminate is preferably 0.1 to 17 MPa, more preferably 0.2 to 15 MPa, and particularly preferably 0.4 to 13 MPa.
  • the adhesive force (E) of the film adhesive before curing to the semiconductor wafer is preferably 3N / 24 mm or more, and more preferably 4N / 24 mm or more.
  • the upper limit value of the adhesive force (E) can be, for example, any one of 15 N / 24 mm, 11 N / 24 mm, and 10 N / 24 mm, but these are examples.
  • the film-like adhesive according to the film-like adhesive composite sheet of the present invention has, as one side surface, an adhesive force (E) when the film-like adhesive before curing is adhered to a semiconductor wafer, preferably 3N / 24 mm.
  • the adhesive force E (N / 24 mm) of the film adhesive before curing to the semiconductor wafer can be measured by the following method. That is, a laminated sheet of a film adhesive and an adhesive tape having a width of 24 mm and an arbitrary length is produced. In this laminated sheet, a film adhesive is laminated on the pressure-sensitive adhesive surface of the pressure-sensitive adhesive tape. As the pressure-sensitive adhesive tape, a width of 24 mm of “Cello Tape (registered trademark) No. 405” manufactured by Nichiban Co., Ltd. is used. Next, the laminated sheet is attached to a semiconductor wafer with a film adhesive heated to 60 ° C.
  • the laminated body is immediately left for 30 minutes in a standard environment defined in JIS Z0237 2009, and then the laminated sheet of film adhesive and adhesive tape is attached to the film adhesive and semiconductor wafer from each other.
  • the so-called 180 ° peeling is performed by peeling off at a peeling speed of 150 mm / min so that the surfaces that are in contact with each other form an angle of 180 °.
  • the peeling force at this time is measured, and the measured value is defined as an adhesive force E (N / 24 mm).
  • the length of the laminated sheet used for the measurement is not particularly limited as long as the peel force can be stably measured.
  • the length of the laminated sheet is preferably 120 to 250 mm, for example.
  • the adhesive force (E) of the film adhesive before curing to the semiconductor wafer is the type and amount of the components of the film adhesive, the thickness of the film adhesive, and the surface on which the film adhesive of the support sheet is provided. By adjusting the material constituting this, the state of this surface (surface state), etc., it can be adjusted as appropriate. For example, if it is a component of a film adhesive, the film adhesive before curing can be bonded to a semiconductor wafer by adjusting the type or amount of a coupling agent (e) such as a silane coupling agent described later. The force E can be easily adjusted.
  • a coupling agent e
  • the surface state of the support sheet is, for example, the surface treatment mentioned above as improving the adhesion to the other layers of the base material, that is, the unevenness treatment by sandblasting, solvent treatment, etc .; corona It can be adjusted by performing oxidation treatment such as discharge treatment, electron beam irradiation treatment, plasma treatment, ozone / ultraviolet irradiation treatment, flame treatment, chromic acid treatment, hot air treatment, etc .; primer treatment. However, these adjustment methods are only examples.
  • the breaking elongation (C) and breaking strength (D) of the film adhesive can be adjusted as appropriate by adjusting the type and amount of the components contained in the film adhesive. For example, the molecular weight and content of the polymer component (a) described later, the structure of the component constituting the epoxy thermosetting resin (b), the softening point and the content, and the content of the filler (c) are adjusted. By doing this, the breaking elongation (C) and the breaking strength (D) of the film adhesive can be easily adjusted. However, these adjustment methods are only examples.
  • the value of E / (C ⁇ D) determined from the breaking elongation (C), the breaking strength (D), and the adhesive force (E) is preferably 0.0005 or more, It is more preferably 0.0006 or more, and particularly preferably 0.0007 or more.
  • the upper limit value of E / (C ⁇ D) is not particularly limited, and can be any one of 0.80 or less, 0.50 or less, and 0.10 or less, but these are examples.
  • the film-like adhesive according to the film-like adhesive composite sheet of the present invention has, as one side surface, E / (determined from the breaking elongation (C), the breaking strength (D), and the adhesive force (E).
  • C ⁇ D is preferably in the form of a film having a property of 0.0005 or more and 0.80 or less, more preferably 0.0006 or more and 0.50 or less, and particularly preferably 0.0007 or more and 0.10 or less. It is an adhesive.
  • the film adhesive can be formed from an adhesive composition containing the constituent materials.
  • a film adhesive can be formed in the target site
  • the content ratio of components that do not vaporize at normal temperature is usually the same as the content ratio of the components of the film adhesive.
  • “normal temperature” is as described above.
  • the adhesive composition may be applied by a known method, for example, an air knife coater, blade coater, bar coater, gravure coater, roll coater, roll knife coater, curtain coater, die coater, knife coater, screen coater. And a method using various coaters such as a Meyer bar coater and a kiss coater.
  • the drying conditions of the adhesive composition are not particularly limited, but the adhesive composition is preferably heated and dried when it contains a solvent described later, and in this case, for example, at 70 to 130 ° C. for 10 seconds to It is preferable to dry under conditions of 5 minutes.
  • Preferred examples of the adhesive composition include a composition containing a polymer component (a) and an epoxy thermosetting resin (b).
  • a a polymer component
  • b an epoxy thermosetting resin
  • the polymer component (a) is a component that can be regarded as formed by polymerization reaction of a polymerizable compound, and imparts film-forming properties, flexibility, etc. to the film adhesive, and is attached to an object to be bonded such as a semiconductor chip. It is a polymer compound for improving adhesiveness (sticking property). Moreover, a polymer component (a) is also a component which does not correspond to the epoxy resin (b1) and thermosetting agent (b2) which are mentioned later.
  • polymer component (a) one type may be used alone, two or more types may be used in combination, and when two or more types are used in combination, their combination and ratio can be arbitrarily selected.
  • polymer component (a) examples include acrylic resins (for example, resins having a (meth) acryloyl group), polyesters, urethane resins (for example, resins having a urethane bond), acrylic urethane resins, silicone resins ( Examples thereof include a resin having a siloxane bond), a rubber-based resin (for example, a resin having a rubber structure), a phenoxy resin, a thermosetting polyimide, and the like, and an acrylic resin is preferable.
  • acrylic resins for example, resins having a (meth) acryloyl group
  • polyesters examples include urethane resins (for example, resins having a urethane bond), acrylic urethane resins, silicone resins ( Examples thereof include a resin having a siloxane bond), a rubber-based resin (for example, a resin having a rubber structure), a phenoxy resin, a thermosetting polyimide, and the like, and an acrylic resin is preferable.
  • the weight average molecular weight (Mw) of the acrylic resin is preferably 10,000 to 2,000,000, and more preferably 100,000 to 1500,000.
  • Mw weight average molecular weight of the acrylic resin
  • the weight average molecular weight of the acrylic resin is equal to or more than the lower limit, the shape stability of the film adhesive (time stability during storage) is improved.
  • weight average molecular weight of the acrylic resin is not more than the above upper limit value, the film adhesive can easily follow the uneven surface of the adherend, and voids or the like between the adherend and the film adhesive. Occurrence is further suppressed.
  • “weight average molecular weight” is a polystyrene equivalent value measured by a gel permeation chromatography (sometimes abbreviated as GPC) method, unless otherwise specified.
  • the glass transition temperature (sometimes abbreviated as Tg) of the acrylic resin is preferably ⁇ 60 to 70 ° C., and more preferably ⁇ 30 to 50 ° C.
  • Tg glass transition temperature
  • the adhesive force between the film adhesive and the support sheet is suppressed, and the semiconductor chip provided with the film adhesive is separated from the support sheet at the time of pickup. Becomes easier.
  • the adhesive force E of a film adhesive and a semiconductor chip improves because Tg of acrylic resin is below the said upper limit.
  • Examples of the (meth) acrylic acid ester constituting the acrylic resin include methyl (meth) acrylate, ethyl (meth) acrylate, n-propyl (meth) acrylate, isopropyl (meth) acrylate, (meth ) N-butyl acrylate, isobutyl (meth) acrylate, sec-butyl (meth) acrylate, tert-butyl (meth) acrylate, pentyl (meth) acrylate, hexyl (meth) acrylate, (meth) acrylic Heptyl acid, 2-ethylhexyl (meth) acrylate, isooctyl (meth) acrylate, n-octyl (meth) acrylate, n-nonyl (meth) acrylate, isononyl (meth) acrylate, decyl (meth) acrylate , Undecyl (me
  • the acrylic resin is, for example, one or more monomers selected from (meth) acrylic acid, itaconic acid, vinyl acetate, acrylonitrile, styrene, N-methylolacrylamide and the like in addition to the (meth) acrylic ester. May be obtained by copolymerization.
  • Only one type of monomer constituting the acrylic resin may be used, or two or more types may be used, and in the case of two or more types, the combination and ratio thereof can be arbitrarily selected.
  • the acrylic resin may have a functional group that can be bonded to other compounds such as a vinyl group, a (meth) acryloyl group, an amino group, a hydroxyl group, a carboxy group, and an isocyanate group.
  • the functional group of the acrylic resin may be bonded to another compound via a cross-linking agent (f) described later, or may be directly bonded to another compound not via the cross-linking agent (f). .
  • the acrylic resin is bonded to another compound through the functional group, the reliability of the package obtained using the film-like adhesive composite sheet tends to be improved.
  • thermoplastic resin other than an acrylic resin
  • thermoplastic resin it becomes easier to separate the semiconductor chip provided with the film adhesive from the support sheet at the time of pickup, or the film adhesive can easily follow the uneven surface of the adherend. Therefore, the occurrence of voids or the like may be further suppressed between the adherend and the film adhesive.
  • the weight average molecular weight of the thermoplastic resin is preferably 1000 to 100,000, more preferably 3000 to 80,000.
  • the glass transition temperature (Tg) of the thermoplastic resin is preferably ⁇ 30 to 150 ° C., and more preferably ⁇ 20 to 120 ° C.
  • thermoplastic resin examples include polyester, polyurethane, phenoxy resin, polybutene, polybutadiene, and polystyrene.
  • thermoplastic resin which an adhesive composition and a film adhesive contain may be sufficient as the said thermoplastic resin which an adhesive composition and a film adhesive contain, and when it is 2 or more types, those combinations and ratios can be selected arbitrarily.
  • the content of the acrylic resin in the polymer component (a) relative to the total content (total mass) of all components other than the solvent is preferably 5 to 40% by mass, and more preferably 7 to 25% by mass.
  • the content of the polymer component (a) relative to the total content (mass) of all components other than the solvent Is preferably 5 to 85% by mass, more preferably 7 to 80% by mass, regardless of the type of the polymer component (a).
  • the above-mentioned effects can be obtained.
  • the uncured film adhesive is exposed to a high temperature, its hardness decreases, and the film is in an uncured or semi-cured state. There is a concern that the wire bonding suitability of the adhesive may be reduced. Therefore, the content of the polymer component (a) in the adhesive composition is preferably set in consideration of such influence.
  • Epoxy thermosetting resin (b) is composed of an epoxy resin (b1) and a thermosetting agent (b2).
  • the epoxy-based thermosetting resin (b) contained in the adhesive composition and the film adhesive may be only one type, or two or more types, and when there are two or more types, the combination and ratio thereof are arbitrary. Can be selected.
  • Epoxy resin (b1) examples include known ones such as polyfunctional epoxy resins, biphenyl compounds, bisphenol A diglycidyl ether and hydrogenated products thereof, orthocresol novolac epoxy resins, dicyclopentadiene type epoxy resins, Biphenyl type epoxy resins, bisphenol A type epoxy resins, bisphenol F type epoxy resins, phenylene skeleton type epoxy resins, and the like, and bifunctional or higher functional epoxy compounds are listed.
  • an epoxy resin having an unsaturated hydrocarbon group may be used as the epoxy resin (b1).
  • An epoxy resin having an unsaturated hydrocarbon group is more compatible with an acrylic resin than an epoxy resin having no unsaturated hydrocarbon group. Therefore, the reliability of the package obtained using the film-like adhesive composite sheet is improved by using the epoxy resin having an unsaturated hydrocarbon group.
  • the epoxy resin having an unsaturated hydrocarbon group examples include a compound obtained by converting a part of the epoxy group of a polyfunctional epoxy resin into a group having an unsaturated hydrocarbon group. Such a compound can be obtained, for example, by addition reaction of (meth) acrylic acid or a derivative thereof to an epoxy group.
  • “derivative” means a compound in which at least one group of the original compound is substituted with another group (substituent) unless otherwise specified.
  • the “group” includes not only an atomic group formed by bonding a plurality of atoms but also one atom.
  • the unsaturated hydrocarbon group is a polymerizable unsaturated group. Specific examples thereof include an ethenyl group (also referred to as a vinyl group), a 2-propenyl group (also referred to as an allyl group), and a (meth) acryloyl group. , (Meth) acrylamide groups and the like, and an acryloyl group is preferred.
  • the weight average molecular weight of the epoxy resin (b1) is not particularly limited, but is preferably 300 to 30000 from the viewpoints of curability of the film adhesive and strength and heat resistance of the cured film adhesive.
  • the epoxy equivalent of the epoxy resin (b1) is preferably 100 to 1000 g / eq, and more preferably 150 to 800 g / eq.
  • the “epoxy equivalent” means the number of grams (g / eq) of an epoxy compound containing 1 gram equivalent of an epoxy group, and can be measured according to the method of JIS K 7236: 2001.
  • epoxy resin (b1) one type may be used alone, two or more types may be used in combination, and when two or more types are used in combination, their combination and ratio can be arbitrarily selected.
  • thermosetting agent (b2) functions as a curing agent for the epoxy resin (b1).
  • a thermosetting agent (b2) the compound which has 2 or more of functional groups which can react with an epoxy group in 1 molecule is mentioned, for example.
  • the functional group include a phenolic hydroxyl group, an alcoholic hydroxyl group, an amino group, a carboxy group, a group in which an acid group has been anhydrideized, and the like, and a phenolic hydroxyl group, an amino group, or an acid group has been anhydrideized. It is preferably a group, more preferably a phenolic hydroxyl group or an amino group.
  • thermosetting agents (b2) examples of the phenolic curing agent having a phenolic hydroxyl group include polyfunctional phenol resins, biphenols, novolac type phenol resins, dicyclopentadiene type phenol resins, biphenyl type phenol resins, and aralkyl type phenols. Examples thereof include resins.
  • examples of the amine-based curing agent having an amino group include dicyandiamide (hereinafter sometimes abbreviated as “DICY”).
  • the thermosetting agent (b2) may have an unsaturated hydrocarbon group.
  • the thermosetting agent (b2) having an unsaturated hydrocarbon group for example, a compound in which a part of the hydroxyl group of the phenol resin is substituted with a group having an unsaturated hydrocarbon group, an aromatic ring of the phenol resin, Examples thereof include compounds in which a group having a saturated hydrocarbon group is directly bonded.
  • the unsaturated hydrocarbon group in the thermosetting agent (b2) is the same as the unsaturated hydrocarbon group in the epoxy resin having an unsaturated hydrocarbon group described above.
  • thermosetting agent (b2) In the case of using a phenolic curing agent as the thermosetting agent (b2), it is easy to adjust the adhesive force E of the film adhesive before curing to the semiconductor wafer within the above-described range.
  • the agent (b2) preferably has a high softening point or glass transition temperature.
  • the weight average molecular weight of the thermosetting agent (b2) is preferably 60 to 30000, for example.
  • thermosetting agent (b2) may be used individually by 1 type, may use 2 or more types together, and when using 2 or more types together, those combinations and ratios can be selected arbitrarily.
  • the content of the thermosetting agent (b2) is preferably 0.1 to 500 parts by mass with respect to 100 parts by mass of the epoxy resin (b1). It is more preferably 1 to 200 parts by mass.
  • the content of the thermosetting agent (b2) is greater than or equal to the lower limit value, the curing of the film adhesive is more likely to proceed.
  • the moisture absorption rate of a film adhesive is reduced because the said content of a thermosetting agent (b2) is below the said upper limit, and the reliability of the package obtained using the film adhesive composite sheet Will be improved.
  • the content of the epoxy-based thermosetting resin (b) (that is, the total content of the epoxy resin (b1) and the thermosetting agent (b2)) is the polymer component (a )
  • Content is preferably 50 to 1000 parts by mass, more preferably 100 to 900 parts by mass, and particularly preferably 150 to 870 parts by mass.
  • the content of the epoxy thermosetting resin (b) is within such a range, the semiconductor chip provided with the film-like adhesive can be easily detached from the support sheet at the time of pickup.
  • the content of the epoxy thermosetting resin (b) is preferably 20 to 80% by mass with respect to the total mass of the adhesive composition and the film adhesive.
  • the film adhesive contains, in addition to the polymer component (a) and the epoxy-based thermosetting resin (b), other components not corresponding to these, if necessary. You may do it.
  • Preferred examples of other components contained in the film adhesive include a curing accelerator (c), a filler (d), a coupling agent (e), a crosslinking agent (f), and an energy ray curable resin. (G), photoinitiator (h), general-purpose additive (i), etc. are mentioned.
  • the film-like adhesive according to the film-like adhesive composite sheet of the present invention has, as one aspect, a polymer component (a); an epoxy-based thermosetting resin (b); a curing accelerator (c), At least selected from the group consisting of a filler (d), a coupling agent (e), a crosslinking agent (f), an energy ray curable resin (g), a photopolymerization initiator (h) and a general-purpose additive (i).
  • a polymer component a
  • an epoxy-based thermosetting resin b
  • a curing accelerator At least selected from the group consisting of a filler (d), a coupling agent (e), a crosslinking agent (f), an energy ray curable resin (g), a photopolymerization initiator (h) and a general-purpose additive (i).
  • the curing accelerator (c) is a component for adjusting the curing rate of the adhesive composition.
  • Preferred curing accelerators (c) include, for example, tertiary amines such as triethylenediamine, benzyldimethylamine, triethanolamine, dimethylaminoethanol, tris (dimethylaminomethyl) phenol; 2-methylimidazole, 2-phenylimidazole Imidazoles such as 2-phenyl-4-methylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole (for example, at least one hydrogen atom is hydrogen Imidazoles substituted with groups other than atoms); organic phosphines such as tributylphosphine, diphenylphosphine, triphenylphosphine (for example, phosphines wherein at least one hydrogen atom is replaced with an organic group); tetraphenylphosphones
  • the curing accelerator (c) contained in the adhesive composition and the film adhesive may be only one kind, or two or more kinds, and in the case of two or more kinds, the combination and ratio thereof can be arbitrarily selected. .
  • the content of the curing accelerator (c) in the adhesive composition and the film adhesive is based on 100 parts by mass of the epoxy thermosetting resin (b). 0.01 to 10 parts by mass is preferable, and 0.1 to 5 parts by mass is more preferable.
  • the effect by using a hardening accelerator (c) is acquired more notably because the said content of a hardening accelerator (c) is more than the said lower limit.
  • the content of the curing accelerator (c) is not more than the above upper limit value, for example, the highly polar curing accelerator (c) is adhered in the film adhesive under high temperature and high humidity conditions. The effect of suppressing segregation by moving to the adhesive interface side becomes higher, and the reliability of the package obtained using the film-like adhesive composite sheet is further improved.
  • the film-like adhesive can easily adjust its thermal expansion coefficient, and the film-like adhesive is optimized by optimizing the thermal expansion coefficient for the object to be adhered to the film-like adhesive.
  • the reliability of the package obtained using the adhesive composite sheet is further improved.
  • a film adhesive can also reduce the moisture absorption rate of the film adhesive after hardening, or can improve heat dissipation by containing a filler (d).
  • the filler (d) may be either an organic filler or an inorganic filler, but is preferably an inorganic filler.
  • Preferred inorganic fillers include, for example, powders such as silica, alumina, talc, calcium carbonate, titanium white, bengara, silicon carbide, boron nitride; beads formed by spheroidizing these inorganic fillers; surface modification of these inorganic fillers Products; single crystal fibers of these inorganic fillers; glass fibers and the like.
  • the inorganic filler is preferably silica or alumina.
  • the filler (d) contained in the adhesive composition and the film-like adhesive may be only one type, or two or more types, and in the case of two or more types, the combination and ratio thereof can be arbitrarily selected.
  • the content of the filler (d) with respect to the total content (total mass) of all components other than the solvent in the adhesive composition (that is, the filling with respect to the total mass of the film adhesive)
  • the content of the material (d) is preferably 5 to 80% by mass, more preferably 7 to 60% by mass.
  • the coupling agent (e) has a functional group capable of reacting with an inorganic compound or an organic compound.
  • the coupling agent (e) is preferably a compound having a functional group capable of reacting with the functional group of the polymer component (a), the epoxy thermosetting resin (b), etc., and is a silane coupling agent. It is more preferable.
  • Preferred examples of the silane coupling agent include 3-glycidyloxypropyltrimethoxysilane, 3-glycidyloxypropylmethyldiethoxysilane, 3-glycidyloxypropyltriethoxysilane, 3-glycidyloxymethyldiethoxysilane, 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, 3-methacryloyloxypropyltrimethoxysilane, 3-aminopropyltrimethoxysilane, 3- (2-aminoethylamino) propyltrimethoxysilane, 3- (2-amino Ethylamino) propylmethyldiethoxysilane, 3-
  • the coupling agent (e) which an adhesive composition and a film adhesive contain only 1 type may be sufficient, 2 or more types may be sufficient, and when it is 2 or more types, those combinations and ratios can be selected arbitrarily. .
  • the content of the coupling agent (e) in the adhesive composition and the film-like adhesive is the sum of the polymer component (a) and the epoxy thermosetting resin (b).
  • the content is preferably 0.03 to 20 parts by mass, more preferably 0.05 to 10 parts by mass, and particularly preferably 0.1 to 5 parts by mass with respect to the content of 100 parts by mass.
  • the content of the coupling agent (e) is equal to or higher than the lower limit, the dispersibility of the filler (d) in the resin is improved, the adhesion of the film adhesive to the adherend is improved, and the like.
  • the effect obtained by using the coupling agent (e) is more remarkably obtained. Moreover, generation
  • Crosslinking agent (f) As the polymer component (a), those having functional groups such as vinyl group, (meth) acryloyl group, amino group, hydroxyl group, carboxy group, isocyanate group and the like that can be bonded to other compounds such as the above-mentioned acrylic resin.
  • the adhesive composition and the film adhesive may contain a crosslinking agent (f) for bonding the functional group with another compound to crosslink. By crosslinking using the crosslinking agent (f), the initial adhesive force and cohesive force of the film adhesive can be adjusted.
  • crosslinking agent (f) examples include an organic polyvalent isocyanate compound, an organic polyvalent imine compound, a metal chelate crosslinking agent (that is, a crosslinking agent having a metal chelate structure), and an aziridine crosslinking agent (that is, having an aziridinyl group).
  • a crosslinking agent examples include an organic polyvalent isocyanate compound, an organic polyvalent imine compound, a metal chelate crosslinking agent (that is, a crosslinking agent having a metal chelate structure), and an aziridine crosslinking agent (that is, having an aziridinyl group).
  • organic polyvalent isocyanate compound examples include an aromatic polyvalent isocyanate compound, an aliphatic polyvalent isocyanate compound, and an alicyclic polyvalent isocyanate compound (hereinafter, these compounds are collectively referred to as “aromatic polyvalent isocyanate compound and the like”).
  • a trimer such as the aromatic polyisocyanate compound, isocyanurate and adduct; a terminal isocyanate urethane prepolymer obtained by reacting the aromatic polyvalent isocyanate compound and the polyol compound. Etc.
  • the “adduct body” includes the aromatic polyisocyanate compound, the aliphatic polyisocyanate compound or the alicyclic polyisocyanate compound, and a low amount such as ethylene glycol, propylene glycol, neopentyl glycol, trimethylolpropane or castor oil. It means a reaction product with a molecularly active hydrogen-containing compound, and examples thereof include an xylylene diisocyanate adduct of trimethylolpropane as described later.
  • the “terminal isocyanate urethane prepolymer” means a prepolymer having a urethane bond and an isocyanate group at the end of the molecule.
  • organic polyvalent isocyanate compound for example, 2,4-tolylene diisocyanate; 2,6-tolylene diisocyanate; 1,3-xylylene diisocyanate; 1,4-xylene diisocyanate; diphenylmethane-4 Dimethylmethane-2,4'-diisocyanate; 3-methyldiphenylmethane diisocyanate; hexamethylene diisocyanate; isophorone diisocyanate; dicyclohexylmethane-4,4'-diisocyanate; dicyclohexylmethane-2,4'-diisocyanate; trimethylol Any one of tolylene diisocyanate, hexamethylene diisocyanate and xylylene diisocyanate is added to all or some hydroxyl groups of a polyol such as propane. Or two or more compounds are added; lysine diisocyanate.
  • a polyol such as propane.
  • organic polyvalent imine compound examples include N, N′-diphenylmethane-4,4′-bis (1-aziridinecarboxamide), trimethylolpropane-tri- ⁇ -aziridinylpropionate, and tetramethylolmethane.
  • -Tri- ⁇ -aziridinylpropionate, N, N′-toluene-2,4-bis (1-aziridinecarboxamide) triethylenemelamine and the like.
  • the crosslinking agent (f) When an organic polyvalent isocyanate compound is used as the crosslinking agent (f), it is preferable to use a hydroxyl group-containing polymer as the polymer component (a).
  • the cross-linking agent (f) has an isocyanate group and the polymer component (a) has a hydroxyl group, the cross-linking structure can be simplified in the film adhesive by the reaction between the cross-linking agent (f) and the polymer component (a). Can be introduced.
  • the cross-linking agent (f) contained in the adhesive composition and the film adhesive may be only one kind, two or more kinds, and in the case of two or more kinds, the combination and ratio thereof can be arbitrarily selected.
  • the content of the crosslinking agent (f) in the adhesive composition is 0.01 to 20 parts by mass with respect to 100 parts by mass of the polymer component (a). It is preferably 0.1 to 10 parts by mass, more preferably 0.5 to 5 parts by mass.
  • the content of the cross-linking agent (f) is equal to or higher than the lower limit value, the effect of using the cross-linking agent (f) is more remarkably obtained.
  • the excessive use of a crosslinking agent (f) is suppressed because the said content of a crosslinking agent (f) is below the said upper limit.
  • the energy ray curable resin (g) has a property of being cured (polymerized) when irradiated with energy rays.
  • the energy ray curable compound include compounds having at least one polymerizable double bond in the molecule, and acrylate compounds having a (meth) acryloyl group are preferable.
  • acrylate compound examples include trimethylolpropane tri (meth) acrylate, tetramethylolmethanetetra (meth) acrylate, pentaerythritol tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol monohydroxypenta ( Chain aliphatic skeleton-containing (meth) acrylates such as (meth) acrylate, dipentaerythritol hexa (meth) acrylate, 1,4-butylene glycol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate; Cyclic aliphatic skeleton-containing (meth) acrylates such as cyclopentanyl di (meth) acrylate and tricyclodecane dimethylol diacrylate; polyethylene glycol di (meth) acrylate and the like Realkylene glycol (
  • the weight average molecular weight of the energy ray curable resin (g) is preferably 100 to 30000.
  • the energy ray curable resin (g) contained in the adhesive composition may be only one type, or two or more types, and in the case of two or more types, the combination and ratio thereof can be arbitrarily selected.
  • the content of the energy beam curable resin (g) is preferably 1 to 95% by mass, more preferably 3 to 90% by mass, with respect to the total mass of the adhesive composition. It is particularly preferable that the content is% by mass.
  • the adhesive composition may contain the photopolymerization initiator (h) in order to efficiently advance the polymerization reaction of the energy beam curable resin (g). Good.
  • Examples of the photopolymerization initiator (h) in the adhesive composition include benzoin such as benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzoin benzoic acid, benzoin methyl benzoate, and benzoin dimethyl ketal.
  • benzoin such as benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzoin benzoic acid, benzoin methyl benzoate, and benzoin dimethyl ketal.
  • Acetophenone compounds such as acetophenone, 2-hydroxy-2-methyl-1-phenyl-propan-1-one, 2,2-dimethoxy-1,2-diphenylethane-1-one; bis (2,4,6 Acylphosphine oxide compounds such as -trimethylbenzoyl) phenylphosphine oxide and 2,4,6-trimethylbenzoyldiphenylphosphine oxide; benzylphenyl sulfide, tetramethylthiuram monosulfate Sulfide compounds such as amides; ⁇ -ketol compounds such as 1-hydroxycyclohexyl phenyl ketone; azo compounds such as azobisisobutyronitrile; titanocene compounds such as titanocene; thioxanthone compounds such as thioxanthone; peroxide compounds; Diketone compound; benzyl; dibenzyl; benzophenone; 2,4-diethylthioxanth
  • 1 type may be sufficient as the photoinitiator (h) which an adhesive composition contains, and when it is 2 or more types, those combinations and ratios can be selected arbitrarily.
  • the content of the photopolymerization initiator (h) is preferably 0.1 to 20 parts by mass with respect to 100 parts by mass of the energy ray curable resin (g). More preferably, it is ⁇ 10 parts by mass, and particularly preferably 2 to 5 parts by mass.
  • the general-purpose additive (I) may be a known one, and can be arbitrarily selected according to the purpose.
  • the general-purpose additive (I) is not particularly limited, but preferred examples thereof include a plasticizer, an antistatic agent, an antioxidant, and a colorant (dye Pigments), gettering agents and the like.
  • the general-purpose additive (i) contained in the adhesive composition and the film-like adhesive may be only one type, or two or more types, and when there are two or more types, the combination and ratio thereof can be arbitrarily selected. .
  • Content of an adhesive composition and a film adhesive is not specifically limited, What is necessary is just to select suitably according to the objective.
  • the adhesive composition further contains a solvent.
  • the adhesive composition containing a solvent has good handleability.
  • the solvent is not particularly limited, but preferred examples include hydrocarbons such as toluene and xylene; methanol, ethanol, 2-propanol, isobutyl alcohol (also referred to as 2-methylpropan-1-ol), 1-butanol and the like. Alcohols; esters such as ethyl acetate; ketones such as acetone and methyl ethyl ketone; ethers such as tetrahydrofuran; amides such as dimethylformamide and N-methylpyrrolidone (that is, compounds having an amide bond).
  • the solvent which an adhesive composition contains only 1 type may be sufficient, and it may be 2 or more types, and when it is 2 or more types, those combinations and ratios can be selected arbitrarily.
  • the solvent contained in the adhesive composition is preferably methyl ethyl ketone or the like from the viewpoint that the components contained in the adhesive composition can be mixed more uniformly.
  • An adhesive composition is obtained by mix
  • the order of addition at the time of blending each component is not particularly limited, and two or more components may be added simultaneously.
  • a solvent it may be used by mixing the solvent with any compounding component other than the solvent and diluting the compounding component in advance, or by diluting any compounding component other than the solvent in advance. You may use it by mixing a solvent with these compounding ingredients without leaving.
  • the method of mixing each component at the time of compounding is not particularly limited, from a known method such as a method of mixing by rotating a stirrer or a stirring blade; a method of mixing using a mixer; a method of mixing by applying ultrasonic waves What is necessary is just to select suitably.
  • the temperature and time during the addition and mixing of each component are not particularly limited as long as each compounding component does not deteriorate, and may be adjusted as appropriate, but the temperature is preferably 15 to 30 ° C.
  • the support sheet is composed of only a base material, and the film-like adhesive is provided in direct contact with the base material.
  • the support sheet does not have a pressure-sensitive adhesive layer or the like and the film-like adhesive is provided directly on the substrate, the components in the film-like adhesive are on the substrate such as the pressure-sensitive adhesive layer. Transition to other layers is suppressed, and conversely, the components in the other layers are transferred to the film-like adhesive. Therefore, the occurrence of process abnormality during the manufacture of the semiconductor device and the decrease in the reliability of the semiconductor package are remarkably suppressed.
  • the film-like adhesive composite sheet of the present invention can be produced by sequentially laminating the above-described layers so as to have a corresponding positional relationship.
  • the method for forming each layer is as described above. For example, when laminating a pressure-sensitive adhesive layer on a base material when producing a support sheet, the above-mentioned pressure-sensitive adhesive composition is applied on the base material, and dried as necessary. Layers can be stacked.
  • the adhesive composition is applied on the pressure-sensitive adhesive layer as one side surface, It is possible to form the adhesive directly on the pressure-sensitive adhesive layer. That is, when forming a laminated structure of two continuous layers using any composition, another composition is directly applied on the layer formed from the composition to newly Layers can be formed. Moreover, as another aspect, the layer laminated
  • a film-like adhesive composite sheet in which a pressure-sensitive adhesive layer is laminated on a base material and a film-like adhesive is laminated on the pressure-sensitive adhesive layer (that is, the support sheet is a laminate of the base material and the pressure-sensitive adhesive layer).
  • a pressure-sensitive adhesive composition is coated on a base material, and dried as necessary, thereby laminating a pressure-sensitive adhesive layer on the base material, Separately, by applying an adhesive composition on the release film and drying as necessary, a film adhesive is formed on the release film, and the exposed surface of the film adhesive is A film-like adhesive composite sheet can be obtained by laminating the film-like adhesive on the pressure-sensitive adhesive layer by laminating the exposed surface of the pressure-sensitive adhesive layer laminated on the substrate.
  • the pressure-sensitive adhesive composition is applied on the release film.
  • the pressure-sensitive adhesive layer is formed on the release film by drying as required, and the exposed surface of the pressure-sensitive adhesive layer is bonded to one surface of the substrate so that the pressure-sensitive adhesive layer is It may be laminated on the material.
  • the release film may be removed at an arbitrary timing after the target laminated structure is formed.
  • a film-like adhesive composite sheet may be produced by appropriately selecting a layer employing such a process.
  • the film-like adhesive composite sheet is usually stored in a state in which a release film is bonded to the surface of the outermost layer (for example, a film-like adhesive) on the side opposite to the support sheet. Therefore, on this release film (preferably its release-treated surface), a composition for forming a layer constituting the outermost layer on the side opposite to the support sheet side in the film-like adhesive composite sheet (that is, an adhesive composition) A layer constituting the outermost layer is formed on the release film, and the layer on the opposite side of the layer that is in contact with the release film
  • the film-like adhesive composite sheet can also be obtained by laminating the remaining layers on the exposed surface by any one of the methods described above and leaving the laminated film without removing the release film.
  • a method for manufacturing a semiconductor device is a method for manufacturing a semiconductor device using the film-like adhesive composite sheet, wherein the film-like adhesive composite sheet is interposed via the film-like adhesive.
  • Affixing to a plurality of divided semiconductor chips (hereinafter, may be abbreviated as “applying step"), with respect to the support sheet in the film adhesive composite sheet affixed to the semiconductor chip, Cutting the film adhesive by applying force to the film adhesive through the support sheet from the side opposite to the side on which the film adhesive is provided (hereinafter referred to as “cutting step”).
  • cutting step When the semiconductor chip and the film adhesive after cutting attached to the semiconductor chip are separated from the support sheet (hereinafter referred to as “pulling”).
  • pulseling When the semiconductor chip and the film adhesive after cutting attached to the semiconductor chip are separated from the support sheet (hereinafter referred to as “pulling”).
  • the manufacturing method by using the film-like adhesive composite sheet, a semiconductor chip to which the film-like adhesive is attached is produced in a simplified manner at the time of manufacturing a semiconductor device. It is possible to suppress the separation from the support sheet.
  • the film adhesive composite sheet is attached to a plurality of divided semiconductor chips via the film adhesive.
  • the film adhesive in one film adhesive composite sheet is stuck on the back surface of a plurality of semiconductor chips.
  • the plurality of divided semiconductor chips form a groove from the surface of the semiconductor wafer opposite to the application surface (sometimes referred to as the back surface) of the film-like adhesive composite sheet until the semiconductor chip reaches this groove. It can be produced by grinding the back surface.
  • a method of forming the groove for example, a method of forming a groove by cutting a semiconductor wafer using a blade (that is, blade dicing), a method of forming a groove by cutting a semiconductor wafer by laser irradiation (that is, a method of forming a groove) Laser dicing), a method of forming a groove by cutting a semiconductor wafer by spraying water containing an abrasive (namely, water dicing), and the like.
  • a modified layer is formed inside the semiconductor wafer.
  • the semiconductor wafer can also be produced by dividing it at the site where the modified layer is formed.
  • FIG. 1 is a cross-sectional view schematically showing an embodiment from cutting of a film adhesive to separation from a semiconductor chip support sheet in the production method of the present invention. In FIG. 1, only the configuration related to the film-like adhesive composite sheet is shown in cross section.
  • the film adhesive 12 of the film adhesive composite sheet 1 is adhered to the back surfaces 9b of the plurality of semiconductor chips 9 by the pasting step. And in this process, the surface (it is called a back surface) on the opposite side to the surface (it may be called the surface) 11a of the support sheet 11 in the film adhesive composite sheet 1 in which the film adhesive 12 is provided.
  • a push-up portion 81 that pushes up the semiconductor chip is in contact with 11b.
  • the film adhesive composite sheet 1 is a sheet in which the base material and the film adhesive 12 are laminated, and the side in contact with the base material in the film adhesive 12 The surface on the opposite side is attached to the back surface 9 b of the semiconductor chip 9.
  • the film-like adhesive composite sheet 1 has a base material, a pressure-sensitive adhesive layer, and a film-like adhesive 12 laminated in this order, and a film The surface of the adhesive 12 opposite to the side in contact with the pressure-sensitive adhesive layer is affixed to the back surface 9 b of the semiconductor chip 9.
  • a force is applied to the support sheet 11 in the film-like adhesive composite sheet 1 from the back surface 11 b of the support sheet 11, so that it passes over the support sheet 11.
  • a force is applied to the film adhesive 12.
  • a protrusion that is, a pin
  • a protrusion 811 protrudes from the push-up portion 81, and the tip of the protrusion 811 pushes up the support sheet 11 from the back surface 11b, so that the film-like adhesive 12 is interposed via the support sheet 11.
  • An example in which force is applied in the protruding direction of the protrusion 811 is shown.
  • push-up conditions such as the protrusion amount (that is, the push-up amount) of the protrusion 811, the protrusion speed (ie, the push-up speed), and the hold time of the protrusion state (ie, the lifting waiting time) can be adjusted as appropriate.
  • the case where the number of the protrusions 811 that push up the support sheet 11 is five is shown, but it may be one or two or more, and the number of the protrusions 811 may be appropriately selected. Good.
  • the film adhesive 12 can be cut. More specifically, the film-like adhesive 12 can be cut at room temperature at a target location, that is, a location surrounding only the semiconductor chip 9 that is to be separated from the support sheet 11. And, for example, a process mainly for cutting the film adhesive 12 such as a process of irradiating the film adhesive 12 with a laser and a process of cutting the film adhesive 12 by expanding, etc. It can cut without providing.
  • the separation step After the cutting step, as shown in FIG. 1C, the semiconductor chip 9 and the cut film adhesive 12 attached to the semiconductor chip 9 are separated from the support sheet 11 (that is, the pickup) To do).
  • This step is usually performed continuously immediately after the cutting step.
  • an example is shown in which the cut film adhesive 12 attached to the semiconductor chip 9 is peeled off from the support sheet 11 by pulling up the semiconductor chip 9 by the pulling portion 82 of the semiconductor device manufacturing apparatus.
  • the method of pulling up the semiconductor chip 9 may be a known method, for example, a method of sucking and pulling up the surface of the semiconductor chip 9 with a vacuum collet.
  • the film adhesive composite sheet 1 is used when the semiconductor chip 9 is pulled up, the film adhesive 12 can be peeled from the support sheet 11 while suppressing the occurrence of process abnormality. More specifically, the portion corresponding to the target semiconductor chip 9 of the film adhesive 12 is peeled off from the support sheet 11 and the portion corresponding to the semiconductor chip 9 other than the target of the film adhesive 12 is The phenomenon of peeling from the support sheet 11 is suppressed. And since the film adhesive 12 is cut
  • a semiconductor chip separated (that is, picked up) together with the film adhesive is used, and thereafter, in the same manner as the conventional method, that is, the semiconductor chip is placed on the circuit surface of the substrate.
  • a semiconductor device can be manufactured through a step of die bonding with a film adhesive.
  • the semiconductor chip is die-bonded to the circuit surface of the substrate with a film adhesive, and if necessary, one or more semiconductor chips are further laminated on the semiconductor chip, and wire bonding is performed. By sealing with, it is set as a semiconductor package. Then, a target semiconductor device may be manufactured using this semiconductor package.
  • the method for manufacturing a semiconductor device of the present invention includes attaching the film-like adhesive composite sheet to a plurality of divided semiconductor chips via the film-like adhesive. With respect to the support sheet in the film adhesive composite sheet affixed to the semiconductor chip, a force is applied to the film adhesive through the support sheet from the side opposite to the side where the film adhesive is provided. Cutting the film adhesive by adding, Separating the semiconductor chip and the film adhesive after cutting attached to the semiconductor chip from the support sheet; After the semiconductor chip separated from the support sheet is die-bonded to the circuit surface of the substrate by the film adhesive, and if desired, one or more semiconductor chips are further laminated on the semiconductor chip and wire bonding is performed. , To obtain a semiconductor package by sealing the whole with resin, including.
  • the manufacturing method of the semiconductor device of the present invention is not limited to the above-described method described with reference to FIG. 1, and a part of the configuration is changed, deleted, or deleted in the above-described method within a range not impairing the effect of the present invention. It may be added.
  • a method of applying force to the film adhesive 12 through the support sheet 11 the method of applying force to the film adhesive 12 by pushing up the support sheet 11 with the protrusions 811 has been described so far.
  • a method other than this for example, a method of applying force to the film adhesive 12 by pushing up the support sheet 11 with a slider instead of the protrusion 811 can be mentioned.
  • FIG. 2 is a cross-sectional view for schematically explaining another embodiment in which a force is applied to the above-described film-like adhesive to cut it.
  • the same components as those shown in FIG. 1 are denoted by the same reference numerals as those in FIG. 1, and detailed description thereof is omitted.
  • the same applies to the drawings after FIG. What is shown here is an alternative to the film adhesive cutting method described with reference to FIG.
  • the pasting process is performed by the same method as described with reference to FIG.
  • a force is applied to the film adhesive 12 through the back surface 11b support sheet 11 to the support sheet 11 in the film adhesive composite sheet 1.
  • the protrusion 81 does not protrude from the protrusion 811 as shown in FIG. 1B, but moves by the slider 812 as shown in FIGS. 2A and 2B.
  • the support sheet 11 is pushed up from the back surface 11b.
  • the surface 812a of the slider 812 protruding from the push-up portion 81 is in contact with the back surface 11b of the support sheet 11.
  • the front surface 812a of the slider 812 is not parallel to the back surface 11b of the support sheet 11 before the cutting step as shown in FIG. Therefore, by applying a force from the back surface 11b to the support sheet 11 in a direction orthogonal to the front surface 812a of the slider 812, that is, in an oblique direction rather than a vertical direction, a difference in the push-up height of the film adhesive 12 is obtained. Occurs.
  • the force applied to the film adhesive 12 through the support sheet 11 is the same as in the case of FIG.
  • the shear force generated along with the push-up is generated.
  • the film adhesive 12 can be cut while suppressing the occurrence of process abnormality.
  • the pushing conditions such as the protruding amount of the slider 812 (that is, the pushing amount), the inclination angle (that is, the pushing speed), and the moving speed (that is, the lifting waiting time) can be adjusted as appropriate.
  • the slider 812 is then moved in a direction parallel to the back surface 11b of the support sheet 11 that has not been pushed up, as shown in FIG. Thereby, the push-up site
  • the film-like adhesive 12 can be cut while suppressing the occurrence of process abnormality by the shearing force generated along with the above.
  • the film adhesive 12 is cut while suppressing the occurrence of process abnormality as in the case described with reference to FIG. Thereafter, the separation step can be performed by the same method as described with reference to FIG.
  • the cutting effect of the film adhesive is usually higher in the pin push-up method as described with reference to FIG. 1 than in the slider push-up method as described with reference to FIG. Therefore, which method is adopted is preferably selected in consideration of characteristics relating to strength such as Young's modulus (A) of the support sheet and breaking elongation (C) of the film adhesive.
  • the cutting step since the film adhesive can be cut at a target location, the film adhesive is not cut. Along with this, the separation (lifting) defect of the semiconductor chip is suppressed.
  • the target portion of the film adhesive is peeled off from the support sheet, so that the separation (lifting) defect of the semiconductor chip is poor. Occurrence is suppressed.
  • the non-target portion of the film adhesive is prevented from peeling off from the support sheet, not only the target semiconductor chip but also the semiconductor chip adjacent thereto is simultaneously separated from the support sheet together with the film adhesive. Generation of so-called double die is suppressed.
  • FIG. 3 is a cross-sectional view schematically showing one embodiment of the film adhesive composite sheet and the semiconductor chip in the manufacturing process of the semiconductor device when the conventional film adhesive composite sheet is used.
  • the film adhesive composite sheet 7 shown here is used, as shown in FIG. 3A, the support sheet 71 is greatly deformed even if a force is applied to the film adhesive 72 through the support sheet 71. The pick-up force is not transmitted to the film-like adhesive, and the film-like adhesive 72 is not cut. Further, when the semiconductor chip 9 is pulled up, the film-like adhesive 72 is peeled off from the semiconductor chip 9, and the support sheet 71 remains stacked. As a result, as shown in FIG. 3B, the lifting failure of the semiconductor chip 9 occurs.
  • Such a process abnormality is, for example, in the film-like adhesive composite sheet 7, whether the Young's modulus (A) (MPa) of the support sheet is small, or the thickness (B) (mm) of the support sheet is small, Or it is easy to generate
  • FIG. 4 is a cross-sectional view schematically showing another embodiment of the film adhesive composite sheet and the semiconductor chip in the process of manufacturing the semiconductor device when the conventional film adhesive composite sheet is used.
  • the film-like adhesive composite sheet 7 shown here is used, even if a force is applied to the film-like adhesive 72 through the support sheet 71 as shown in FIG. . Therefore, the area around the target film-like adhesive corresponding to the semiconductor chip is also lifted, and the force at the time of pick-up is not transmitted to the film-like adhesive, so that the film-like adhesive 72 is not cut. Furthermore, when the semiconductor chip 9 is pulled up, the film adhesive 72 is peeled off from the semiconductor chip 9 and remains laminated on the support sheet 71. As a result, as shown in FIG.
  • the lifting failure of the semiconductor chip 9 occurs.
  • a process abnormality is, for example, in the film-like adhesive composite sheet 7, whether the Young's modulus (A) (MPa) of the support sheet is large, or the thickness (B) (mm) of the support sheet is large, Or it is easy to generate
  • process abnormality described with reference to FIGS. 3 to 4 is an example, and other process abnormality may occur depending on circumstances.
  • the film-like adhesive composite sheet of the present invention when used, the occurrence of such a process abnormality is suppressed, and as a result, a semiconductor device is manufactured at a lower cost by a simplified method than before. it can.
  • the film-like adhesive composite sheet is A film-like adhesive composite sheet in which a curable film-like adhesive is provided on a support sheet,
  • the support sheet has a substrate,
  • the thickness of the support sheet is 20 ⁇ m to 200 ⁇ m, preferably 25 ⁇ m to 150 ⁇ m, more preferably 30 ⁇ m to 100 ⁇ m, particularly preferably 38 ⁇ m to 80 ⁇ m;
  • the film adhesive has a thickness of 1 ⁇ m to 60 ⁇ m, preferably 3 ⁇ m to 25 ⁇ m, more preferably 5 ⁇ m to 15 ⁇ m;
  • the Young's modulus of the support sheet is 50 MPa to 5000 MPa, preferably 100 MPa to 4000 MPa, more preferably 150 MPa to 3000 MPa, particularly preferably 170 MPa to 2250 MPa;
  • the product of the Young's modulus of the support sheet and the thickness of the support sheet is 4 to 150 MPa ⁇ mm, preferably 13,6 to 112.5 MPa ⁇ mm;
  • the curable film adhesive has a value of the adhesive force / (the breaking elongation ⁇ the breaking strength) of 0.0005 or more and 0.80 or less, preferably 0.0006 or more and 0.50 or less, more preferably Having a property of 0.0007 or more and 0.10 or less, It is a film adhesive composite sheet.
  • the film-like adhesive composite sheet is: A film-like adhesive composite sheet in which a curable film-like adhesive is provided on a support sheet,
  • the support sheet has a substrate,
  • the thickness of the support sheet is 20 ⁇ m to 200 ⁇ m, preferably 25 ⁇ m to 150 ⁇ m, more preferably 30 ⁇ m to 100 ⁇ m, particularly preferably 38 ⁇ m to 80 ⁇ m;
  • the substrate is a substrate composed of polyethylene terephthalate;
  • the curable film adhesive has a thickness of 1 to 60 ⁇ m, preferably 3 ⁇ m to 25 ⁇ m, more preferably 5 to 15 ⁇ m;
  • the curable film adhesive comprises a polymer component (a), an epoxy thermosetting resin (b), a curing accelerator (c), a filler (d), a coupling agent (e), and a crosslinking agent.
  • the polymer component (a) is an acrylic resin
  • the epoxy-based thermosetting resin (b) includes at least one resin selected from the group consisting of a bisphenol A type epoxy resin, a polyfunctional aromatic type epoxy resin, and a dicyclopentadiene type epoxy resin;
  • the content of the polymer component (a) is 5 to 85% by mass, preferably 7 to 80% by mass with respect to the total mass of the curable film adhesive;
  • the content of the epoxy thermosetting resin (b) is 50 to 1000 parts by weight, preferably 100 to 900 parts by weight, more preferably 150 parts per 100 parts by weight of the polymer component (a). Up to 870 parts by weight;
  • the product of the Young's modulus of the support sheet and the thickness of the support sheet is 4 to 150 MPa ⁇ mm, preferably 13,6 to 112.5 MPa ⁇ mm. It is a film adhesive composite sheet.
  • a method for manufacturing a semiconductor device includes: Affixing the film adhesive composite sheet to a plurality of divided semiconductor chips via the film adhesive; With respect to the support sheet in the film adhesive composite sheet affixed to the semiconductor chip, over the support sheet from the side opposite to the side where the film adhesive is provided, to the film adhesive Cutting the film adhesive by applying force; Separating the semiconductor chip and the film adhesive after cutting attached to the semiconductor chip from the support sheet; including, A method for manufacturing a semiconductor device.
  • the manufacturing method further includes die-bonding the semiconductor chip separated from the support sheet to the circuit surface of the substrate with the film adhesive, and optionally stacking one or more semiconductor chips on the semiconductor chip. After the wire bonding, the semiconductor package may be obtained by sealing the whole with resin.
  • Polymer component (a) -1 Acrylic resin (“Coponil N-2359-6” manufactured by Nippon Synthetic Chemical Industry Co., Ltd.)
  • Epoxy resin (b1) -1 Liquid bisphenol A type epoxy resin (“JER834” manufactured by Mitsubishi Chemical Corporation, epoxy equivalent 250 g / eq, weight average molecular weight 470)
  • B1) -2 Polyfunctional aromatic type (triphenylene type) epoxy resin (“EPPN-502H” manufactured by Nippon Kayaku Co., Ltd., epoxy equivalent 167 g / eq, softening point 54 ° C., weight average molecular weight 1200)
  • B1) -5 Dicyclopentadiene type epoxy resin (“ADEKA RESIN EP-4088L” manufactured by ADEKA, epoxy equivalent 165 g / eq)
  • Thermosetting agent (b2) biphenyl type phenol resin (Maywa Kasei Co., Ltd.
  • Curing accelerator (c) -1 2-phenyl-4,5-dihydroxymethylimidazole (“Curesol 2PHZ” manufactured by Shikoku Chemicals)
  • Filler (d) -1: spherical silica (“SC2050” manufactured by Admatechs)
  • Coupling agent (e) -1: Silane coupling agent, 3-glycidoxypropylmethyldiethoxysilane (“KBE-402” manufactured by Shin-Etsu Silicone)
  • Support sheet (1) 2-ethylhexyl acrylate (hereinafter abbreviated as “2EHA”) (65 parts by mass), methyl methacrylate (hereinafter abbreviated as “MMA”) (25 parts by mass), and acrylic acid Acrylic resin (weight average molecular weight 400000, glass transition temperature -28 ° C.) obtained by copolymerizing -2-hydroxyethyl (hereinafter abbreviated as “HEA”) (10 parts by mass) ((a) -2) 250 A solution in which 50.27 parts by mass of a mass part, 50.27 parts by mass of a crosslinking agent ((f) -1: BHS-8515: trade name, manufactured by Toyo Ink Mfg.
  • 2EHA 2-ethylhexyl acrylate
  • MMA methyl methacrylate
  • HOA acrylic acid Acrylic resin
  • tolylene diisocyanate compound was dissolved in 175.13 parts of toluene was prepared.
  • the solution was applied to a light release sheet (product name “SP-PET38 1031” (thickness: 38 ⁇ m) manufactured by Lintec Co., Ltd. so that the thickness of the coating film was 20 ⁇ m. 4 times peeling off the substrate after lamination, was thick 80 ⁇ m support sheet (1).
  • Support sheet (2) low-density PE / PP / low-density PE, two-kind / three-layer base material with a total thickness of 80 ⁇ m, smooth on one side and glossy on the other side for the purpose of blocking prevention Multi-layer plastic sheet Support sheet (3): Light release sheet manufactured by Lintec (product name “SP-PET38 1031”, thickness 38 ⁇ m)
  • Support sheet (4) Lintec light release sheet (product name “SP-PET50 1031”, thickness 50 ⁇ m)
  • Support sheet (6) A solution in which 250 parts by mass of the acrylic resin ((a) -2) and 50.27 parts by mass of the crosslinking agent ((f) -1) were dissolved in 175.13 parts of toluene was prepared. As a substrate, the solution was applied to a light release sheet (product name “SP-PET38 1031” (thickness: 38 ⁇ m) manufactured by Lintec Co., Ltd. so that the thickness of the coating film was 20 ⁇ m. After making only the coating film, this was made into the support sheet (6) of thickness 20 micrometers. Support sheet (7): Lintec light release sheet (product name “SP-PET75 1031”, thickness 75 ⁇ m) Support sheet (8): Light release sheet manufactured by Lintec (product name “SP-PET100 1031”, thickness 100 ⁇ m)
  • Each support sheet obtained above was cut into a rectangle having a width of 15.0 mm and a length of about 150 mm to obtain a test piece.
  • a universal testing machine manufactured by Shimadzu Corporation: Autograph AG-IS 500N
  • JIS K7127 1999
  • Example 2 Except that the support sheet (1) used in Example 1 was replaced with the support sheet (2), the glossy surface side of the support sheet (2) was bonded to the exposed surface of the film adhesive. A film-like adhesive composite sheet was produced in the same manner as in Example 1.
  • Example 3 The support sheet (1) used in Example 1 was replaced with the support sheet (3), except that the side of the release treatment surface of the support sheet (3) was bonded to the exposed surface of the film adhesive, A film-like adhesive composite sheet was produced in the same manner as in Example 1.
  • Example 4 A film-like adhesive composite sheet was produced in the same manner as in Example 3 except that the support sheet (3) used in Example 3 was replaced with the support sheet (4).
  • Example 1 The support sheet (1) used in Example 1 is replaced with the support sheet (5), except that one side of the support sheet (5) is bonded to the exposed surface of the film adhesive. In the same manner, a film-like adhesive composite sheet was produced.
  • Example 2 The support sheet (1) used in Example 1 is replaced with the support sheet (6), except that one side of the support sheet (6) is bonded to the exposed surface of the film adhesive. In the same manner, a film-like adhesive composite sheet was produced.
  • Example 3 A film-like adhesive composite sheet was produced in the same manner as in Example 3 except that the support sheet (3) used in Example 3 was replaced with the support sheet (7).
  • Example 4 A film-like adhesive composite sheet was produced in the same manner as in Example 3 except that the support sheet (3) used in Example 3 was replaced with the support sheet (8).
  • the cutting time exceeds 10 seconds
  • the cutting is stopped once, and the laminate being cut is heated again using a hot plate heated to 80 ° C., and then cut within 10 seconds. A piece was made. The reason why the laminate is cut after heating is to prevent the end of the test piece from having a defective portion that causes breakage.
  • the elongation at break of the obtained test piece was measured according to JIS K7161-1994. More specifically, it is as follows. That is, a universal testing machine (“Autograph AG-IS 500N” manufactured by Shimadzu Corporation) was used, and the test piece was fixed at two locations with the fixing gripping device. At this time, the distance between the tips of the fixed gripping tool (the length of the exposed portion of the test piece, the distance between the fixed portions) was set to 75 mm. Then, the tensile speed was set to 200 mm / min, the test piece was pulled between the fixed portions, and the breaking elongation of the test piece was obtained to obtain the breaking elongation (C) (%).
  • a universal testing machine (“Autograph AG-IS 500N” manufactured by Shimadzu Corporation) was used, and the test piece was fixed at two locations with the fixing gripping device. At this time, the distance between the tips of the fixed gripping tool (the length of the exposed portion of the test piece, the distance between the fixed portions) was set to 75 mm
  • the breaking elongation (C) of the film-like adhesives used in Examples 1 to 4 and Comparative Examples 1 to 4 was the same and was 900%.
  • the breaking strengths (D) of the film adhesives used in Examples 1 to 4 and Comparative Examples 1 to 4 were all the same and were 0.5 MPa.
  • the film-like adhesive composite sheet is cut into a size of 24 mm ⁇ 300 mm, and the film-like adhesive is heated to 60 ° C., and cellophane tape (“Cellotape (registered trademark) No. .405 ", width 24 mm).
  • the base material is peeled off from the film-like adhesive, and the exposed film-like adhesive is heated to 60 ° C. and attached to the dry polished surface of a 6-inch silicon wafer (thickness: 350 ⁇ m).
  • a cellophane tape, a film adhesive, and a silicon wafer were laminated to obtain a laminate. The obtained laminate was immediately left for 30 minutes in an environment of 23 ° C.
  • the laminated sheet is peeled off at a peeling speed of 150 mm / min so that the surfaces of the film adhesive and silicon wafer that are in contact with each other form an angle of 180 °, so-called 180 ° peeling is performed.
  • the peel force was measured, and the measured value was defined as the adhesive force E (N / 24 mm) between the film adhesive and the semiconductor chip.
  • the adhesive force (E) between the film adhesive and the semiconductor chip used in Examples 1 to 4 and Comparative Examples 1 to 4 was the same, and was 10 N / 24 mm. Moreover, when E / (C ⁇ D) was determined from these measurement results, it was 0.022 (N / 24 mm / (% ⁇ MPa)).
  • the film-like adhesive composite sheets of Examples 1 to 4 are products of the Young's modulus (A) (MPa) of the support sheet and the thickness (B) (mm) of the support sheet ( A ⁇ B) is in the range of 4 to 150 MPa ⁇ mm, and the silicon chip on which the film-like adhesive of these sheets is applied mainly cuts the film-like adhesive by a 1-pin push-up method. Even without providing a separate process, it was possible to cut the film adhesive while suppressing the occurrence of abnormal processes. Furthermore, the silicon chip to which the film adhesive after cutting was attached could be separated from the support sheet while suppressing the occurrence of process abnormality. Thus, the film-like adhesive composite sheets of Examples 1 to 4 showed good pickup suitability in the 1-pin push-up method.
  • the film-like adhesive composite sheets of Comparative Examples 1 to 4 are products (A ⁇ B) of the Young's modulus (A) (MPa) of the support sheet and the thickness (B) (mm) of the support sheet. ) was less than 4 MPa ⁇ mm or more than 150 MPa ⁇ mm, and did not satisfy the above range. And in the silicon chip to which the film-like adhesive of these sheets is stuck, the number of occurrences of process abnormalities between the cutting of the film-like adhesive and the separation of the silicon chip with the film-like adhesive from the support sheet is small. Many of them had poor pickability.
  • the present invention can be used for manufacturing semiconductor devices, it is extremely useful industrially.
  • SYMBOLS 1 Film adhesive composite sheet, 11 ... Support sheet, 11a ... Front surface of support sheet, 11b ... Back surface of support sheet, 12 ... Film adhesive, 9 ... Semiconductor Chip, 9b ... Back side of semiconductor chip, 7 ... Film adhesive composite sheet, 71 ... Support sheet, 72 ... Film adhesive, 81 ... Push-up part, 82 ... Pull up , 811 ... projection, 812 ... slider

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  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)

Abstract

L'invention concerne une feuille composite adhésive du type film dans laquelle un adhésif du type film durcissable est disposé sur une feuille de support, laquelle feuille de support comprend un matériau de base, l'adhésif de type film durcissable a une épaisseur comprise entre 1 et 60 µm, et le produit du module de Young de la feuille de support et de l'épaisseur de la feuille de support est compris entre 4 et 150 MPa· mm.
PCT/JP2018/010464 2017-03-28 2018-03-16 Feuille composite adhésive du type film et procédé de fabrication d'un dispositif semi–conducteur WO2018180594A1 (fr)

Priority Applications (3)

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JP2019509284A JPWO2018180594A1 (ja) 2017-03-28 2018-03-16 フィルム状接着剤複合シート及び半導体装置の製造方法
CN201880020526.2A CN110461973B (zh) 2017-03-28 2018-03-16 膜状粘合剂复合片及半导体装置的制造方法
KR1020197027967A KR102552837B1 (ko) 2017-03-28 2018-03-16 필름상 접착제 복합 시트 및 반도체 장치의 제조 방법

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JP2017-063654 2017-03-28
JP2017063654 2017-03-28

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WO2018180594A1 true WO2018180594A1 (fr) 2018-10-04

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Country Link
JP (1) JPWO2018180594A1 (fr)
KR (1) KR102552837B1 (fr)
CN (1) CN110461973B (fr)
TW (1) TWI758445B (fr)
WO (1) WO2018180594A1 (fr)

Cited By (4)

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CN111524848A (zh) * 2019-02-01 2020-08-11 相丰科技股份有限公司 拉伸膜扩张方法及膜扩张机
JP2021155680A (ja) * 2020-03-30 2021-10-07 リンテック株式会社 フィルム状接着剤
JP7471879B2 (ja) 2020-03-18 2024-04-22 リンテック株式会社 フィルム状接着剤及びダイシングダイボンディングシート
JP7471880B2 (ja) 2020-03-18 2024-04-22 リンテック株式会社 フィルム状接着剤及びダイシングダイボンディングシート

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TWI677932B (zh) * 2019-02-01 2019-11-21 相豐科技股份有限公司 拉伸膜擴張方法及其膜擴張機

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JP5353703B2 (ja) 2007-10-09 2013-11-27 日立化成株式会社 接着フィルム付き半導体チップの製造方法及びこの製造方法に用いられる半導体用接着フィルム、並びに、半導体装置の製造方法
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JP2008101183A (ja) * 2006-09-20 2008-05-01 Hitachi Chem Co Ltd 粘接着シート、これを用いて製造される半導体装置及び半導体装置の製造方法
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WO2016140248A1 (fr) * 2015-03-04 2016-09-09 リンテック株式会社 Feuille composite adhésive de type film et procédé de fabrication de dispositif à semi-conducteur

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Publication number Priority date Publication date Assignee Title
CN111524848A (zh) * 2019-02-01 2020-08-11 相丰科技股份有限公司 拉伸膜扩张方法及膜扩张机
JP7471879B2 (ja) 2020-03-18 2024-04-22 リンテック株式会社 フィルム状接着剤及びダイシングダイボンディングシート
JP7471880B2 (ja) 2020-03-18 2024-04-22 リンテック株式会社 フィルム状接着剤及びダイシングダイボンディングシート
JP2021155680A (ja) * 2020-03-30 2021-10-07 リンテック株式会社 フィルム状接着剤
JP7446887B2 (ja) 2020-03-30 2024-03-11 リンテック株式会社 フィルム状接着剤

Also Published As

Publication number Publication date
TWI758445B (zh) 2022-03-21
KR20190126817A (ko) 2019-11-12
CN110461973B (zh) 2022-02-08
KR102552837B1 (ko) 2023-07-06
TW201900803A (zh) 2019-01-01
CN110461973A (zh) 2019-11-15
JPWO2018180594A1 (ja) 2020-02-06

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