KR102552837B1 - 필름상 접착제 복합 시트 및 반도체 장치의 제조 방법 - Google Patents

필름상 접착제 복합 시트 및 반도체 장치의 제조 방법 Download PDF

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Publication number
KR102552837B1
KR102552837B1 KR1020197027967A KR20197027967A KR102552837B1 KR 102552837 B1 KR102552837 B1 KR 102552837B1 KR 1020197027967 A KR1020197027967 A KR 1020197027967A KR 20197027967 A KR20197027967 A KR 20197027967A KR 102552837 B1 KR102552837 B1 KR 102552837B1
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KR
South Korea
Prior art keywords
film
adhesive
film adhesive
support sheet
composite sheet
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Application number
KR1020197027967A
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English (en)
Korean (ko)
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KR20190126817A (ko
Inventor
유타 사가와
케이시 후세
Original Assignee
린텍 가부시키가이샤
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Application filed by 린텍 가부시키가이샤 filed Critical 린텍 가부시키가이샤
Publication of KR20190126817A publication Critical patent/KR20190126817A/ko
Application granted granted Critical
Publication of KR102552837B1 publication Critical patent/KR102552837B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83191—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on the semiconductor or solid-state body

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)
KR1020197027967A 2017-03-28 2018-03-16 필름상 접착제 복합 시트 및 반도체 장치의 제조 방법 KR102552837B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017063654 2017-03-28
JPJP-P-2017-063654 2017-03-28
PCT/JP2018/010464 WO2018180594A1 (fr) 2017-03-28 2018-03-16 Feuille composite adhésive du type film et procédé de fabrication d'un dispositif semi–conducteur

Publications (2)

Publication Number Publication Date
KR20190126817A KR20190126817A (ko) 2019-11-12
KR102552837B1 true KR102552837B1 (ko) 2023-07-06

Family

ID=63675511

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020197027967A KR102552837B1 (ko) 2017-03-28 2018-03-16 필름상 접착제 복합 시트 및 반도체 장치의 제조 방법

Country Status (5)

Country Link
JP (1) JPWO2018180594A1 (fr)
KR (1) KR102552837B1 (fr)
CN (1) CN110461973B (fr)
TW (1) TWI758445B (fr)
WO (1) WO2018180594A1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111524848A (zh) * 2019-02-01 2020-08-11 相丰科技股份有限公司 拉伸膜扩张方法及膜扩张机
TWI677932B (zh) * 2019-02-01 2019-11-21 相豐科技股份有限公司 拉伸膜擴張方法及其膜擴張機
JP7471880B2 (ja) 2020-03-18 2024-04-22 リンテック株式会社 フィルム状接着剤及びダイシングダイボンディングシート
JP7471879B2 (ja) 2020-03-18 2024-04-22 リンテック株式会社 フィルム状接着剤及びダイシングダイボンディングシート
JP7446887B2 (ja) * 2020-03-30 2024-03-11 リンテック株式会社 フィルム状接着剤

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007016074A (ja) * 2005-07-05 2007-01-25 Hitachi Chem Co Ltd 粘接着シート、粘接着シートの製造方法及び半導体装置の製造方法
JP2008101183A (ja) * 2006-09-20 2008-05-01 Hitachi Chem Co Ltd 粘接着シート、これを用いて製造される半導体装置及び半導体装置の製造方法
WO2016140248A1 (fr) * 2015-03-04 2016-09-09 リンテック株式会社 Feuille composite adhésive de type film et procédé de fabrication de dispositif à semi-conducteur

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6730595B2 (en) * 2000-12-12 2004-05-04 Mitsui Chemicals, Inc. Protecting method for semiconductor wafer and surface protecting adhesive film for semiconductor wafer used in said method
JP2005116920A (ja) * 2003-10-10 2005-04-28 Nitto Denko Corp 半導体加工用粘着シートおよび半導体加工方法
JP5353703B2 (ja) 2007-10-09 2013-11-27 日立化成株式会社 接着フィルム付き半導体チップの製造方法及びこの製造方法に用いられる半導体用接着フィルム、並びに、半導体装置の製造方法
JP5193753B2 (ja) * 2008-08-28 2013-05-08 リンテック株式会社 ダイシングシートおよび半導体チップの製造方法
JP2011060848A (ja) * 2009-09-07 2011-03-24 Nitto Denko Corp 熱硬化型ダイボンドフィルム、ダイシング・ダイボンドフィルム、及び、半導体装置
US20120156456A1 (en) * 2010-03-14 2012-06-21 Mitsubishi Plastics, Inc. Transparent double-sided self-adhesive sheet

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007016074A (ja) * 2005-07-05 2007-01-25 Hitachi Chem Co Ltd 粘接着シート、粘接着シートの製造方法及び半導体装置の製造方法
JP2008101183A (ja) * 2006-09-20 2008-05-01 Hitachi Chem Co Ltd 粘接着シート、これを用いて製造される半導体装置及び半導体装置の製造方法
WO2016140248A1 (fr) * 2015-03-04 2016-09-09 リンテック株式会社 Feuille composite adhésive de type film et procédé de fabrication de dispositif à semi-conducteur

Also Published As

Publication number Publication date
TWI758445B (zh) 2022-03-21
KR20190126817A (ko) 2019-11-12
CN110461973B (zh) 2022-02-08
WO2018180594A1 (fr) 2018-10-04
TW201900803A (zh) 2019-01-01
CN110461973A (zh) 2019-11-15
JPWO2018180594A1 (ja) 2020-02-06

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AMND Amendment
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X701 Decision to grant (after re-examination)
GRNT Written decision to grant