WO2018166192A1 - 显示设备及其柔性电路板 - Google Patents

显示设备及其柔性电路板 Download PDF

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Publication number
WO2018166192A1
WO2018166192A1 PCT/CN2017/105512 CN2017105512W WO2018166192A1 WO 2018166192 A1 WO2018166192 A1 WO 2018166192A1 CN 2017105512 W CN2017105512 W CN 2017105512W WO 2018166192 A1 WO2018166192 A1 WO 2018166192A1
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WIPO (PCT)
Prior art keywords
bonding
pin
mark
circuit board
pins
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
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PCT/CN2017/105512
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English (en)
French (fr)
Inventor
梁硕珍
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HKC Co Ltd
Chongqing HKC Optoelectronics Technology Co Ltd
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HKC Co Ltd
Chongqing HKC Optoelectronics Technology Co Ltd
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Application filed by HKC Co Ltd, Chongqing HKC Optoelectronics Technology Co Ltd filed Critical HKC Co Ltd
Priority to US16/491,376 priority Critical patent/US10930598B2/en
Publication of WO2018166192A1 publication Critical patent/WO2018166192A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/688—Flexible insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/166—Alignment or registration; Control of registration
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/301—Marks applied to devices, e.g. for alignment or identification for alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/601—Marks applied to devices, e.g. for alignment or identification for use after dicing
    • H10W46/607—Located on parts of packages, e.g. on encapsulations or on package substrates

Definitions

  • the present disclosure relates to the field of liquid crystal display technologies, and in particular, to a display device and a flexible circuit board thereof.
  • a flexible circuit board comprising: a flexible substrate; a driving chip disposed on the flexible substrate; the driving chip is configured to generate a driving signal; a bonding pin, the bonding pin is disposed on the flexible substrate At least one side, the bonding pin is a plurality of pins for bonding an external signal line to the driving chip; and a bonding mark, the bonding mark is disposed on the flexible substrate and located at each The pin area within the outermost two bonding pins of the bonding pin; the bonding mark is used for the alignment operation of the flexible substrate for bonding operation.
  • the bonding pins are disposed on one side of the flexible substrate;
  • the bonding is labeled as at least two; at least two of the bonding marks are located at different locations of the pin region.
  • the bonding marks are two; two of the bonding marks are symmetrically distributed in the pin area.
  • the bonding pins are disposed on two sides of the flexible substrate; the pin regions on each side are provided with two bonding marks; the two bonding marks are related to the The central axis of the driver chip is symmetrically set.
  • the pin area is provided with a registration clearance area; the alignment clearance area has no bonding pins, so that the extending direction enters the bonding pin of the alignment clearance area.
  • the length is smaller than the length of the bonding pins of the other regions; the bonding mark is set in the alignment clearance area.
  • the bonding mark is attached to the flexible substrate; the bonding mark and each of the bonding pins are made of a metal material.
  • the bonding mark is a set of bonding marks; each bonding mark set includes two bonding units of different shapes.
  • the bonding marks are in the shape of a cross, a square, a T or an L.
  • the present disclosure also provides a display device including: a display panel including a signal line; a flexible circuit board including: a flexible substrate; a driving chip disposed on the flexible substrate; the driving a chip for generating a driving signal; a bonding pin disposed on at least one side of the flexible substrate, the bonding pin being a plurality of pins for driving the signal line and the driving
  • the chip performs a bonding connection; and a bonding mark disposed on the flexible substrate and located within a pin area of the outermost two bonding pins of each bonding pin; the bonding The marking is used to perform an alignment operation on the flexible substrate for bonding operations.
  • a method of fabricating a display device comprising: providing a flexible circuit board; on the flexible circuit board Setting a bonding mark on a pin area within the outermost two bonding pins of at least one side; aligning the bonding mark of the flexible circuit board with a mark on the display panel, and aligning the flexible circuit
  • the bonding pin of the board and the signal line of the display panel are connected in a bonding manner.
  • the bonding mark is set in the area where the bonding pin is located, so there is no need to set the bonding mark position area outside the bonding pin area on the flexible circuit board, thereby making the bonding on the same specification flexible circuit board.
  • the total pitch length of the pins is lengthened, and the spacing between the bonding pins is widened, which improves the utilization and yield of the flexible circuit board.
  • 1 is a structural block diagram of an exemplary flexible circuit board
  • FIG. 2 is a structural block diagram of a flexible circuit board in an embodiment of the present disclosure
  • FIG. 3 is a schematic structural view of a flexible circuit board in an embodiment of FIG. 2;
  • FIG. 4 is a schematic structural view of a flexible circuit board in another embodiment of FIG. 2;
  • FIG. 5 is a schematic structural view of a flexible circuit board in still another embodiment of FIG. 2;
  • FIG. 6 is a schematic structural diagram of a display device in an embodiment of the present disclosure.
  • a conventional flexible circuit board includes a flexible substrate 10, a driving chip 20, a lead region 30, and a bonding mark 41 and a bonding mark 43.
  • Pin area 30 is the area where the bonding pins are within the outermost two bonding pins.
  • the bonding mark 41 and the bonding mark 43 are disposed on both sides of the pin area 30.
  • the side of the flexible substrate 10 on which the pin region 30 is disposed also needs to reserve the position of the bonding mark 41 and the bonding mark 43, the total pitch length Y1 of the bonding pin is correspondingly reduced, thereby causing the pins to be between The pitch is reduced to reduce the utilization of the flexible circuit board. And the reduction of the spacing between the pins easily leads to product performance not meeting the requirements and reducing the yield of the product.
  • the flexible circuit board includes a flexible substrate 100, a driving chip 200, and bonding pins (not shown).
  • the driving chip 200 is disposed on the flexible circuit board for driving the liquid crystal display panel when the flexible circuit board is connected to the liquid crystal display panel.
  • the bonding pins are disposed in the lead region 300 on one side of the flexible substrate 100.
  • the pin area 300 is the area where the bonding pins are located within the outermost two bonding pins.
  • the bonding marks are two, that is, the bonding mark 401 and the bonding mark 403. In other embodiments, the bonding mark can be three or more. And the bonding mark is located at different positions in the pin area.
  • the bonding mark 401 and the bonding mark 403 are both disposed in the pin area 300, so that it is not necessary to provide a bonding mark position area outside the pin area 300 of the flexible substrate 100, thereby making the bonding of the same specification of the flexible circuit board.
  • the total pitch length of the foot becomes longer, and the spacing between the bonding pins is widened, which improves the utilization rate and yield of the flexible circuit board.
  • the flexible circuit board of Figure 1 has a bonding mark 41 and a bonding mark 43 disposed on both sides of the pin area 30, and the total pitch of the bonding pins is Y1.
  • the flexible circuit board of Figure 2 places the bonding mark 401 and the bonding mark 403 in the pin area 300, and the total pitch of the bonding pins is Y2. Since there is no need to reserve the position of the bonding mark 401 and the bonding mark 403 outside the pin area 300, Y2 is longer than Y1. That is, the total pitch of the bonding pins in Figure 2 is long. The length becomes longer, which widens the spacing between bonding pins, thus increasing the utilization and yield of the flexible circuit board.
  • the bonding mark can be disposed on one side or both sides of the flexible substrate of the flexible circuit board according to the flexible circuit board.
  • the bonding is marked as two to make the flexible circuit board and the liquid crystal display panel aligned accurately.
  • the two bonding marks are located at different locations within the pin area 300.
  • the bonding marks can be symmetrically distributed within the pin area 300.
  • bonding marks are disposed in the lead regions 300 on each side of the flexible substrate 100 to make the flexible circuit board
  • the two bonding marks on each side of the flexible circuit board are symmetrically disposed about the central axis of the driving chip 200 on the flexible substrate 100.
  • the bonding mark can be a bonding tag group.
  • Each bonding tag group includes two bonding units of different shapes.
  • the bonding unit is a cross, a square, a T or an L.
  • the alignment accuracy can be improved by forming a bonding mark group by bonding units of different shapes.
  • Bonding marks can be attached to the flexible substrate 100. Bonding marks and bonding pins can be made of the same metal material, such as copper. The use of the same metal material to prepare bonding marks and bonding pins can simplify the preparation process.
  • the pin area 300 is provided with a aligning clearance area.
  • the bonding mark is set in the alignment clearance area. There is no bonding pin in the alignment clearance area, so that the length of the bonding pin extending into the alignment clearance area is smaller than the bonding pin length of other areas.
  • a matching clearance area 501 and a registration clearance area 503 are disposed in the pin area 300.
  • the bonding mark 401 is placed in the alignment clearance area 501, and the bonding mark 403 is placed in the alignment clearance area 503.
  • the length of the bonding pin 301 between the alignment clearance area 501 (502) and the driving chip 200 is smaller than the length of the bonding pin 301 of the other area.
  • the area of the alignment clearance area is small so that the alignment clearance area and the bonding standard The note is placed between the two bonding pins. At this point, all bonding pins in the pin area have the same length. Therefore, there is no need to set the bonding mark location area outside the bonding pin area on the flexible circuit board, and the pin area does not need to be adaptively modified for the bonding pins in order to reserve the bonding flag.
  • Figure 4. When the range of the alignment clearance area 501 and the alignment clearance area 503 is so small that it can be placed between the two bonding pins 301, the alignment clearance area 501 and the bonding mark 401 and the alignment clearance area 503 are The alignment mark 403 is placed between the two bonding pins 301. At this time, all the bonding pins 301 in the bonding pin area 300 are the same length, so there is no need to modify the bonding pin 301 to meet the requirements of the clearing clearance area.
  • the bonding flag need not be set in the alignment clearance area, that is, the pin area does not need to set the alignment clearance area.
  • the bonding mark is small in size so that the bonding mark can be placed on the bonding pin.
  • the bonding mark is placed directly on the bonding pin, and there is no need to reserve the bonding mark position in the bonding pin area.
  • the bonding mark and the bonding pin are made of the same metal material, which simplifies the preparation process.
  • the bonding mark and the bonding pin are made of the same material, so that the bonding mark is set on the bonding pin without affecting the bonding of the bonding pin to the signal line of the liquid crystal display panel without affecting the bonding pin. Signal transmission. As shown in Figure 5.
  • the bonding mark 401 and the bonding mark 403 can be placed on any of the bonding pins 301.
  • the bonding mark 401 and the bonding mark 403 are the same metal material as the bonding pin 301 to simplify the preparation process.
  • the bonding mark 401 and the bonding mark 403 and the bonding pin 301 are made of the same material, so that the bonding mark 401 and the bonding mark 403 are disposed on the bonding pin 301 without affecting the bonding pin 301 and the liquid crystal.
  • the signal lines of the display panel are attached and do not affect the transmission of the bonding pin 301 signal.
  • the present disclosure also provides a display device including a display panel and a flexible circuit board.
  • the display panel includes signal lines.
  • the flexible circuit board is the flexible circuit board described in any of the above embodiments.
  • the bonding pins of the flexible circuit board are bonded to the signal lines of the display panel.
  • the present disclosure also provides a method for preparing a display device, including the steps of:
  • the bonding mark of the flexible circuit board is aligned with the mark on the display panel, and the bonding pin of the flexible circuit board and the signal line of the display panel are connected.
  • the display panel is a liquid crystal display panel or an OLED display panel. In other embodiments, the display panel can also be other types of display panels.

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Mathematical Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Liquid Crystal (AREA)
  • Geometry (AREA)

Abstract

一种柔性电路板，包括：柔性基板（100）；驱动芯片（200），设置在柔性基板上；驱动芯片用于生成驱动信号；邦定引脚（301），邦定引脚设置在柔性基板的至少一侧，邦定引脚为多根，用于将外部信号线与驱动芯片进行邦定连接；以及邦定标记（401,403），邦定标记设置于柔性基板上且位于邦定引脚最外侧的两根邦定引脚以内的引脚区（300）；邦定标记用于对邦定操作的柔性基板进行对位操作。

Description

显示设备及其柔性电路板 技术领域
本公开涉及液晶显示技术领域，特别是涉及一种显示设备及其柔性电路板。
背景技术
随着科技的发展，人们对显示面板的设计要求也越来越高。传统的显示面板一般通过柔性电路板上的驱动芯片进行驱动。将柔性电路板与显示面板进行邦定时，会在柔性电路板的区域内做邦定标记。一般的邦定标记设置在需要邦定引脚的两侧，因此同一规格的柔性电路板上的引脚的总间距长度也会变小，进而导致引脚之间的间距减小，从而降低柔性电路板的利用率。并且引脚之间的间距减小容易导致产品性能不能满足要求，降低了产品良率。
公开内容
基于此，有必要提供一种能够提高利用率且提高产品良率的显示设备及其柔性电路板。
一种柔性电路板，包括：柔性基板；驱动芯片，设置在所述柔性基板上；所述驱动芯片用于生成驱动信号；邦定引脚，所述邦定引脚设置在所述柔性基板的至少一侧，所述邦定引脚为多根，用于将外部信号线与所述驱动芯片进行邦定连接；以及邦定标记，所述邦定标记设置于所述柔性基板上且位于各邦定引脚中最外侧的两根邦定引脚以内的引脚区；所述邦定标记用于对邦定操作的柔性基板进行对位操作。
在其中一个实施例中，所述各邦定引脚设置在所述柔性基板的一侧；所述 邦定标记为至少两个；至少两个所述邦定标记位于所述引脚区的不同位置处。
在其中一个实施例中，所述邦定标记为两个；两个所述邦定标记对称分布于所述引脚区。
在其中一个实施例中，所述各邦定引脚设置在所述柔性基板的两侧；每一侧所述引脚区设置有两个邦定标记；所述两个邦定标记关于所述驱动芯片的中心轴对称设置。
在其中一个实施例中，所述引脚区设置有对位净空区；所述对位净空区内无邦定引脚，从而使得延伸方向进入所述对位净空区内的邦定引脚的长度小于其他区域的邦定引脚的长度；所述邦定标记设置于所述对位净空区内。
在其中一个实施例中，所述邦定标记贴附在所述柔性基板上；所述邦定标记与各所述邦定引脚均为金属材质。
在其中一个实施例中，所述邦定标记为邦定标记组；每个邦定标记组包括两个形状不同的邦定单元。
在其中一个实施例中，所述邦定标记的形状为十字形、方形、T形或者L形。
本公开还提供一种显示设备，包括：显示面板，所述显示面板包括信号线；柔性电路板，所述柔性电路板包括：柔性基板；驱动芯片，设置在所述柔性基板上；所述驱动芯片用于生成驱动信号；邦定引脚，所述邦定引脚设置在所述柔性基板的至少一侧，所述邦定引脚为多根，用于将所述信号线与所述驱动芯片进行邦定连接；以及邦定标记，所述邦定标记设置于所述柔性基板上且位于各邦定引脚中最外侧的两根邦定引脚以内的引脚区；所述邦定标记用于对邦定操作的柔性基板进行对位操作。
一种显示设备的制备方法，包括：提供柔性电路板；在所述柔性电路板的 至少一侧的最外侧两根邦定引脚以内的引脚区设置邦定标记；将所述柔性电路板的所述邦定标记与显示面板上的标记进行对位，并将所述柔性电路板的邦定引脚和所述显示面板的信号线进行邦定连接。
上述柔性电路板，邦定标记设置在邦定引脚所在区域，因此无需在柔性电路板上的邦定引脚区域外设置邦定标记位置区，从而使得同一规格的柔性电路板上的邦定引脚的总间距长度变长，邦定引脚之间的间距变宽，提高了柔性电路板的利用率和良品率。
附图说明
图1为示例性的柔性电路板的结构框图；
图2为本公开实施例中的柔性电路板的结构框图；
图3为图2中的一实施例中的柔性电路板的结构示意图；
图4为图2中的另一个实施例中的柔性电路板的结构示意图；
图5为图2中的再一个实施例中的柔性电路板的结构示意图；
图6为本公开实施例中的显示设备的结构示意图。
具体实施方式
为了使本公开的目的、技术方案及优点更加清楚明白，以下结合附图及实施例，对本公开进行进一步详细说明。应当理解，此处所描述的具体实施例仅仅用以解释本公开，并不用于限定本公开。
传统的液晶显示面板一般通过柔性电路板上的驱动芯片进行驱动。将柔性电路板与液晶显示面板进行邦定时，会在柔性电路板的区域内做邦定标记。一般邦定标记设置在邦定引脚的两侧，因此同一规格的柔性电路板上的引脚的总 间距长度也会变小，进而导致引脚之间的间距减小。如图1所示。传统的柔性电路板包括柔性基板10、驱动芯片20、引脚区30以及邦定标记41和邦定标记43。引脚区30为最外侧两根邦定引脚以内的邦定引脚所在区域。邦定标记41和邦定标记43设置在引脚区30的两侧。由于柔性基板10上设置引脚区30的一侧还需要预留邦定标记41和邦定标记43的位置，从而使得邦定引脚的总间距长度Y1相应减小，进而导致引脚之间的间距减小，降低柔性电路板的利用率。并且引脚之间的间距减小容易导致产品性能不能满足要求，降低了产品良率。
本实施例提供一种能够提高利用率且提高产品良率的柔性电路板。如图2所示，该柔性电路板包括柔性基板100、驱动芯片200以及邦定引脚(图未示)。驱动芯片200设置在柔性电路板上，用于在柔性电路板与液晶显示面板连接时对液晶显示面板进行驱动。邦定引脚设置在柔性基板100的一侧的引脚区300内。引脚区300为最外侧两根邦定引脚以内的邦定引脚所在区域。在本实施例中，邦定标记为两个，即邦定标记401和邦定标记403。在其他的实施例中，邦定标记可以为三个或者三个以上。并且邦定标记位于引脚区的不同位置。邦定标记401和邦定标记403都设置在引脚区300内，因此无需在柔性基板100的引脚区300外设置邦定标记位置区，从而使得同一规格的柔性电路板上的邦定引脚的总间距长度变长，邦定引脚之间的间距变宽，提高了柔性电路板的利用率和良品率。
参见图1和图2。图1和图2是同一规格的柔性电路板。图1的柔性电路板将邦定标记41和邦定标记43设置在引脚区30的两侧，邦定引脚的总间距的长度为Y1。图2的柔性电路板将邦定标记401和邦定标记403设置在引脚区300内，邦定引脚的总间距的长度为Y2。由于引脚区300外无需预留邦定标记401和邦定标记403的位置，因此Y2比Y1长。也即是图2中邦定引脚的总间距长 度变长，从而使得邦定引脚之间的间距变宽，因此提高了柔性电路板的利用率和良品率。
邦定标记根据柔性电路板需要邦定区域可设置在柔性电路板的柔性基板一侧或者两侧。在一实施例中，当邦定引脚设置在柔性电路板的柔性基板的一侧时，邦定标记为两个，以使得柔性电路板和液晶显示板对位准确。两个邦定标记位于引脚区300内的不同位置。邦定标记可以对称分布在引脚区300内。在一实施例中，当邦定引脚设置在柔性电路板的柔性基板100两侧时，柔性基板100每一侧的引脚区300内均设置有两个邦定标记，以使得柔性电路板与液晶显示板对位时，柔性电路板的两侧分别与液晶显示板准确对位。柔性电路板每一侧的两个邦定标记关于柔性基板100上的驱动芯片200的中心轴对称设置。邦定标记可以为邦定标记组。每个邦定标记组包括两个形状不同的邦定单元。邦定单元为十字形、方形、T形或者L形。通过不同形状的邦定单元组成呈一个邦定标记组，可以提高对位的准确度。邦定标记可以贴附在柔性基板100上。邦定标记与邦定引脚可以采用相同的金属材质，如均采用铜制备而成。采用同种金属材质制备邦定标记和邦定引脚，可以简化制备工艺。
在一实施例中，引脚区300设置有对位净空区。邦定标记设置在对位净空区内。对位净空区内无邦定引脚，从而使得延伸方向进入对位净空区内的邦定引脚的长度小于其他区域的邦定引脚长度。如图3所示，引脚区300内设置有对位净空区501和对位净空区503。邦定标记401放置在对位净空区501内，邦定标记403放置在对位净空区503内。对位净空区501和对位净空区503内无邦定引脚301。对位净空区501(502)与驱动芯片200之间的邦定引脚301的长度小于其他区域的邦定引脚301的长度。
在一实施例中，对位净空区的区域范围很小以使得对位净空区以及邦定标 记放置在两根邦定引脚之间。此时，引脚区内所有的邦定引脚长度一样。因此，柔性电路板上无需在邦定引脚区域外设置邦定标记位置区，并且引脚区无需为了预留邦定标记而对邦定引脚进行适应性改动。如图4所示。当对位净空区501和对位净空区503区域范围很小以至于可以放置在两根邦定引脚301之间时，将对位净空区501和邦定标记401以及对位净空区503和对位标记403放置在两根邦定引脚301之间。此时，邦定引脚区域300内所有的邦定引脚301长度一样，因此无需对邦定引脚301进行改动以满足对位净空区的要求。
在一实施例中，邦定标记无需设置在对位净空区中，也即是引脚区无需设置对位净空区。邦定标记尺寸很小以使得邦定标记可以放置在邦定引脚上。邦定标记直接放置在邦定引脚上，邦定引脚区域内无需预留邦定标记位置。邦定标记与邦定引脚为同样的金属材质，可以简化制备工艺。同时，邦定标记和邦定引脚材质相同，以使得邦定标记设置在邦定引脚上时不会影响邦定引脚与液晶显示面板的信号线贴合且不会影响邦定引脚信号的传输。如图5所示。邦定标记401和邦定标记403可放置在任何一根邦定引脚301上。邦定标记401和邦定标记403与邦定引脚301为相同的金属材质，以简化制备工艺。同时，邦定标记401和邦定标记403以及邦定引脚301材质相同，以使得邦定标记401和邦定标记403设置在邦定引脚301上时不会影响邦定引脚301与液晶显示面板的信号线贴合且不会影响邦定引脚301信号的传输。
本公开还提供一种显示设备，包括显示面板和柔性电路板。显示面板包括信号线。柔性电路板为上述任一实施例所述的柔性电路板。柔性电路板的邦定引脚与显示面板的信号线进行邦定。
本公开还提供一种显示设备的制备方法，包括步骤：
提供柔性电路板；
在柔性电路板的至少一侧的最外侧两根邦定引脚以内的引脚区设置邦定标记；
将柔性电路板的邦定标记与显示面板上的标记进行对位，并将柔性电路板的邦定引脚和显示面板的信号线进行邦定连接。
在本实施例中，显示面板为液晶显示面板或OLED显示面板。在其他实施例中，显示面板还可以是其他类型的显示面板。
以上所述实施例的各技术特征可以进行任意的组合，为使描述简洁，未对上述实施例中的各个技术特征所有可能的组合都进行描述，然而，只要这些技术特征的组合不存在矛盾，都应当认为是本说明书记载的范围。
以上所述实施例仅表达了本公开的几种实施方式，其描述较为具体和详细，但并不能因此而理解为对公开专利范围的限制。应当指出的是，对于本领域的普通技术人员来说，在不脱离本公开构思的前提下，还可以做出若干变形和改进，这些都属于本公开的保护范围。因此，本公开专利的保护范围应以所附权利要求为准。

Claims (17)

  1. 一种柔性电路板，包括：
    柔性基板；
    驱动芯片，设置在所述柔性基板上；所述驱动芯片用于生成驱动信号；
    邦定引脚，所述邦定引脚设置在所述柔性基板的至少一侧，所述邦定引脚为多根，用于将外部信号线与所述驱动芯片进行邦定连接；以及
    邦定标记，所述邦定标记设置于所述柔性基板上且位于各邦定引脚中最外侧的两根邦定引脚以内的引脚区；所述邦定标记用于对邦定操作的柔性基板进行对位操作。
  2. 根据权利要求1所述的柔性电路板，其中，所述各邦定引脚设置在所述柔性基板的一侧；所述邦定标记为至少两个；至少两个所述邦定标记位于所述引脚区的不同位置处。
  3. 根据权利要求1所述的柔性电路板，其中，所述邦定标记为两个；两个所述邦定标记对称分布于所述引脚区。
  4. 根据权利要求1所述的柔性电路板，其中，所述各邦定引脚设置在所述柔性基板的两侧；每一侧所述引脚区设置有两个邦定标记；所述两个邦定标记关于所述驱动芯片的中心轴对称设置。
  5. 根据权利要求1所述的柔性电路板，其中，所述引脚区设置有对位净空区；所述对位净空区内无邦定引脚，从而使得延伸方向进入所述对位净空区内的邦定引脚的长度小于其他区域的邦定引脚的长度；所述邦定标记设置于所述对位净空区内。
  6. 根据权利要求1所述的柔性电路板，其中，所述邦定标记贴附在所述柔性基板上；所述邦定标记与各所述邦定引脚均为金属材质。
  7. 根据权利要求1所述的柔性电路板，其中，所述邦定标记为邦定标记组； 每个邦定标记组包括两个形状不同的邦定单元。
  8. 根据权利要求1所述的柔性电路板，其中，所述邦定标记的形状为十字形、方形、T形或者L形。
  9. 一种显示设备，包括
    显示面板，所述显示面板包括信号线；
    柔性电路板，包括：
    柔性基板；
    驱动芯片，设置在所述柔性基板上；所述驱动芯片用于生成驱动信号；
    邦定引脚，所述邦定引脚设置在所述柔性基板的至少一侧，所述邦定引脚为多根，用于将所述信号线与所述驱动芯片进行邦定连接；以及
    邦定标记，所述邦定标记设置于所述柔性基板上且位于各邦定引脚中最外侧的两根邦定引脚以内的引脚区；所述邦定标记用于对邦定操作的柔性基板进行对位操作。
  10. 根据权利要求9所述的显示设备，其中，所述各邦定引脚设置在所述柔性基板的一侧；所述邦定标记为至少两个；至少两个所述邦定标记位于所述引脚区的不同位置处。
  11. 根据权利要求9所述的显示设备，其中，所述邦定标记为两个；两个所述邦定标记对称分布于所述引脚区。
  12. 根据权利要求9所述的显示设备，其中，所述各邦定引脚设置在所述柔性基板的两侧；每一侧所述引脚区设置有两个邦定标记；所述两个邦定标记关于所述驱动芯片的中心轴对称设置。
  13. 根据权利要求9所述的显示设备，其中，所述引脚区设置有对位净空区；所述对位净空区内无邦定引脚，从而使得延伸方向进入所述对位净空区内 的邦定引脚的长度小于其他区域的邦定引脚的长度；所述邦定标记设置于所述对位净空区内。
  14. 根据权利要求9所述的显示设备，其中，所述邦定标记贴附在所述柔性基板上；所述邦定标记与各所述邦定引脚均为金属材质。
  15. 根据权利要求9所述的显示设备，其中，所述邦定标记为邦定标记组；每个邦定标记组包括两个形状不同的邦定单元。
  16. 根据权利要求9所述的显示设备，其中，所述邦定标记的形状为十字形、方形、T形或者L形。
  17. 一种显示设备的制备方法，包括：
    提供柔性电路板；
    在所述柔性电路板的至少一侧的最外侧两根邦定引脚以内的引脚区设置邦定标记；
    将所述柔性电路板的所述邦定标记与显示面板上的标记进行对位，并将所述柔性电路板的邦定引脚和所述显示面板的信号线进行邦定连接。
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112599021A (zh) * 2021-01-06 2021-04-02 武汉华星光电半导体显示技术有限公司 显示装置
CN112965632A (zh) * 2021-03-19 2021-06-15 上海摩软通讯技术有限公司 触控模组及触控装置

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106973485A (zh) * 2017-03-14 2017-07-21 惠科股份有限公司 显示设备及其柔性电路板
CN107329297A (zh) * 2017-08-30 2017-11-07 上海中航光电子有限公司 显示面板的绑定结构和显示面板
CN107863055B (zh) * 2017-11-29 2021-06-22 武汉天马微电子有限公司 一种柔性基板及其状态检测方法、显示装置
CN109064904B (zh) * 2018-09-21 2021-01-05 武汉天马微电子有限公司 一种显示面板及显示装置
CN109166478B (zh) * 2018-10-19 2021-04-06 惠科股份有限公司 显示装置
US10877330B2 (en) 2018-10-19 2020-12-29 HKC Corporation Limited Display device
CN109460166B (zh) * 2018-11-15 2022-03-18 信利（惠州）智能显示有限公司 一种柔性电路板绑定处理方法及柔性电路板
CN110930866B (zh) * 2019-11-26 2021-07-06 Tcl华星光电技术有限公司 覆晶薄膜及显示装置
US20220140048A1 (en) * 2020-03-31 2022-05-05 Boe Technology Group Co., Ltd. Display panel, method for preparing the same, and display device
CN111443538A (zh) * 2020-04-09 2020-07-24 深圳市华星光电半导体显示技术有限公司 一种窄边框显示面板及显示装置
CN111896819A (zh) * 2020-04-17 2020-11-06 重庆京东方光电科技有限公司 一种触控面板、触控面板检测装置和检测方法
KR102873275B1 (ko) * 2020-06-17 2025-10-20 주식회사 엘지에너지솔루션 연성인쇄회로기판의 제조 방법
CN112130700A (zh) * 2020-09-30 2020-12-25 业成光电(无锡)有限公司 柔性电路板、触控装置及终端
CN112510015B (zh) * 2020-11-30 2024-02-20 武汉天马微电子有限公司 显示面板以及电子设备
CN112800713B (zh) * 2021-02-10 2024-01-26 深圳市华星光电半导体显示技术有限公司 一种绑定引脚自动化转换方法及系统
CN113050318B (zh) * 2021-03-18 2022-01-25 惠科股份有限公司 液晶面板及液晶显示装置
CN115715408B (zh) * 2021-04-13 2025-09-12 京东方科技集团股份有限公司 显示面板的翻折方法、翻折装置
CN113707700B (zh) * 2021-08-31 2023-05-26 京东方科技集团股份有限公司 一种显示模组、制备方法以及显示装置
CN113838765B (zh) * 2021-09-23 2024-07-19 京东方科技集团股份有限公司 一种绑定方法和绑定装置
CN114206020B (zh) * 2021-12-10 2024-03-22 苏州华星光电技术有限公司 一种邦定装置以及邦定方法
CN116978288B (zh) * 2022-04-21 2025-09-16 成都辰显光电有限公司 显示屏、显示屏制造方法及拼接屏
CN118073391B (zh) * 2024-01-29 2024-09-13 惠科股份有限公司 发光模组、检测方法和显示装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5430325A (en) * 1992-06-30 1995-07-04 Rohm Co. Ltd. Semiconductor chip having dummy pattern
CN105448748A (zh) * 2014-07-30 2016-03-30 中芯国际集成电路制造(上海)有限公司 一种半导体器件及其制备方法、电子装置
CN105741678A (zh) * 2016-04-05 2016-07-06 深圳市华星光电技术有限公司 Cof结构、驱动电路及显示装置
CN106973485A (zh) * 2017-03-14 2017-07-21 惠科股份有限公司 显示设备及其柔性电路板

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5592365A (en) * 1993-12-21 1997-01-07 Sharp Kabushiki Kaisha Panel assembly structure and panel assembling method capable of achieving a highly reliable connection of electrode terminals even when the electrode terminals have a fine pitch
EP0845697B1 (en) * 1995-08-07 2004-03-17 Hitachi, Ltd. Active matrix type liquid crystal display device resistant to static electricity
JPH11305254A (ja) * 1998-04-24 1999-11-05 Hitachi Ltd 液晶表示装置
JP3861688B2 (ja) * 1999-06-11 2006-12-20 セイコーエプソン株式会社 液晶装置及びその製造方法
JP2001125085A (ja) * 1999-10-29 2001-05-11 Seiko Epson Corp 電気光学パネルおよびその製造方法、ならびに、電気光学装置および電子機器
TWI286629B (en) * 2000-07-20 2007-09-11 Samsung Electronics Co Ltd Liquid crystal display device and flexible circuit board
JP2003229454A (ja) * 2002-01-31 2003-08-15 Optrex Corp 液晶表示パネルの電極端子接続方法
TWI238444B (en) * 2002-12-10 2005-08-21 Seiko Epson Corp Method for manufacturing optoelectronic device, optoelectronic device and electronic machine
JP2005301056A (ja) * 2004-04-14 2005-10-27 Hitachi Displays Ltd 表示装置とその製造方法
TW200638143A (en) * 2004-10-29 2006-11-01 Toshiba Matsushita Display Tec Display device
KR100684793B1 (ko) * 2004-12-07 2007-02-20 삼성에스디아이 주식회사 릴상의 테이프 캐리어 패키지와 이를 적용한 플라즈마디스플레이 장치
KR101171178B1 (ko) * 2005-01-04 2012-08-06 삼성전자주식회사 커팅 패턴이 형성된 가요성 인쇄회로기판용 원판 및 이를커팅한 가요성 인쇄회로기판을 구비한 평판표시장치
US7495927B2 (en) * 2007-01-24 2009-02-24 Epson Imaging Devices Corporation Mount structure, electro-optical device, and electronic apparatus
CN101287329B (zh) * 2007-04-13 2011-04-20 群康科技(深圳)有限公司 显示装置
JP5259211B2 (ja) * 2008-02-14 2013-08-07 ルネサスエレクトロニクス株式会社 半導体装置
KR101049824B1 (ko) * 2009-09-30 2011-07-15 삼성에스디아이 주식회사 플라즈마 디스플레이 장치
JP5359812B2 (ja) * 2009-11-24 2013-12-04 セイコーエプソン株式会社 電気光学装置、及び電子機器
KR20130046150A (ko) * 2011-10-27 2013-05-07 엘지디스플레이 주식회사 플렉서블 디스플레이 장치의 제조장치 및 그 제조방법
JP2013131677A (ja) * 2011-12-22 2013-07-04 Sony Corp 回路基板、表示装置モジュールおよび電子機器
CN103513452A (zh) * 2012-06-29 2014-01-15 北京京东方光电科技有限公司 显示装置的组装方法
JP2015079848A (ja) * 2013-10-17 2015-04-23 シナプティクス・ディスプレイ・デバイス株式会社 表示装置駆動用半導体集積回路装置
KR102163358B1 (ko) * 2014-07-21 2020-10-12 엘지디스플레이 주식회사 디스플레이 장치
JP2016081480A (ja) * 2014-10-22 2016-05-16 株式会社ジャパンディスプレイ タッチセンサ及びそのタッチセンサを備えた表示装置
JP6322555B2 (ja) * 2014-11-26 2018-05-09 株式会社ジャパンディスプレイ 検出装置及び検出機能付き表示装置
KR20160091526A (ko) * 2015-01-23 2016-08-03 삼성디스플레이 주식회사 플렉서블 디스플레이의 본딩 방법 및 시스템
CN104661430A (zh) * 2015-03-17 2015-05-27 京东方科技集团股份有限公司 一种对位标识、电路板和显示装置
CN205750197U (zh) * 2016-07-07 2016-11-30 京东方科技集团股份有限公司 显示面板和显示装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5430325A (en) * 1992-06-30 1995-07-04 Rohm Co. Ltd. Semiconductor chip having dummy pattern
CN105448748A (zh) * 2014-07-30 2016-03-30 中芯国际集成电路制造(上海)有限公司 一种半导体器件及其制备方法、电子装置
CN105741678A (zh) * 2016-04-05 2016-07-06 深圳市华星光电技术有限公司 Cof结构、驱动电路及显示装置
CN106973485A (zh) * 2017-03-14 2017-07-21 惠科股份有限公司 显示设备及其柔性电路板

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112599021A (zh) * 2021-01-06 2021-04-02 武汉华星光电半导体显示技术有限公司 显示装置
CN112599021B (zh) * 2021-01-06 2022-08-05 武汉华星光电半导体显示技术有限公司 显示装置
CN112965632A (zh) * 2021-03-19 2021-06-15 上海摩软通讯技术有限公司 触控模组及触控装置
CN112965632B (zh) * 2021-03-19 2024-04-02 上海摩软通讯技术有限公司 触控模组及触控装置

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