WO2018159485A1 - Substrat multicouche - Google Patents

Substrat multicouche Download PDF

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Publication number
WO2018159485A1
WO2018159485A1 PCT/JP2018/006676 JP2018006676W WO2018159485A1 WO 2018159485 A1 WO2018159485 A1 WO 2018159485A1 JP 2018006676 W JP2018006676 W JP 2018006676W WO 2018159485 A1 WO2018159485 A1 WO 2018159485A1
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WO
WIPO (PCT)
Prior art keywords
coil
insulating base
driver
conductor
multilayer substrate
Prior art date
Application number
PCT/JP2018/006676
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English (en)
Japanese (ja)
Inventor
邦明 用水
伊藤　慎悟
Original Assignee
株式会社村田製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Priority to CN201890000462.5U priority Critical patent/CN210641154U/zh
Publication of WO2018159485A1 publication Critical patent/WO2018159485A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Definitions

  • the present invention relates to a multilayer substrate, and more particularly to a multilayer substrate including an IC incorporated in a multilayer body and a coil formed in the multilayer body.
  • Patent Document 1 discloses an actuator in which a plurality of coils, a driver IC, and a magnetic sensor are mounted on a substrate. In the actuator, the position of the movable body provided with the magnet can be moved by the magnetic fields generated from the plurality of coils.
  • the actuator characteristics may vary due to the following problems.
  • the actuator Since the actuator is configured such that the coil and the driver IC are mounted on the substrate, the mounting position of the driver IC with respect to the coil is likely to be shifted during mounting.
  • the current flowing in the wiring between the driver IC and the coil is particularly large in the actuator, and a relatively large magnetic field is generated from the wiring. Therefore, when the mounting position of the driver IC is shifted and the current path of the wiring changes, the magnetic field from the wiring changes, and the action on the magnet may change from the specified state.
  • the driver IC is connected to the magnetic sensor, and controls the current flowing in the coil based on information (signal from the magnetic sensor) obtained from the magnetic sensor.
  • the current flowing through the wiring connecting the driver IC and the magnetic sensor is extremely small compared to the current flowing through the wiring connecting the coil and the driver IC, and is easily affected by noise. Therefore, the driver IC may erroneously recognize a signal from the magnetic sensor under the influence of the magnetic field generated from the driver IC and the magnetic field generated from the wiring connecting the driver IC and the coil.
  • An object of the present invention is to provide a multi-layered substrate including a plurality of coils and a driver IC, in which variation in the generated magnetic field for each individual is suppressed by suppressing a shift in the positional relationship of the driver IC with respect to the plurality of coils. There is to do.
  • the multilayer substrate of the present invention is A laminate having a plurality of insulating base material layers laminated and having an IC placement region inside; A driver IC at least partially disposed in the IC placement region; A first coil and a second coil that are formed in the laminate, each of which has a winding axis along the lamination direction in the plurality of insulating base layers, and is connected to the driver IC; A magnetic sensor connected to the driver IC; With The IC placement region is a region sandwiched between a first coil formation region that is a formation region of the first coil and a second coil formation region that is a formation region of the second coil.
  • the driver IC is housed inside the laminated body in which the coil is formed (since the laminated body, the coil, and the driver IC are integrated into a single component), the driver IC and the coil As compared with the case where each is mounted on a substrate or the like, the positional relationship between the driver IC and the coil is less likely to shift during mounting. Therefore, with this configuration, it is possible to realize a multilayer substrate that suppresses variations in the generated magnetic field due to a shift in the positional relationship of the driver IC with respect to the coil.
  • the plurality of insulating base layers may be made of a resin material.
  • a conductor such as a coil has relatively higher rigidity than an insulating base material layer made of a resin material.
  • the driver IC is sandwiched (enclosed) by a member having a relatively higher rigidity than the insulating base material layer made of a resin material. Therefore, with this configuration, even when an external force is applied to the stacked body, the positional relationship between the driver IC and the coil is prevented from being shifted.
  • the resin material is preferably a thermoplastic resin.
  • a conductor such as a coil is made of a material having lower fluidity than an insulating base material layer made of a thermoplastic resin at a temperature at the time of forming a laminated body (at the time of heating and pressurizing a plurality of insulating base material layers).
  • the driver IC since the driver IC is arranged in the IC arrangement area sandwiched between the first coil formation area and the second coil formation area, excessive flow of the insulating base material layer in the IC arrangement area at the time of heating and pressurization is performed. Is suppressed, and the position of the driver IC is stabilized. Therefore, with this configuration, variations in the generated magnetic field due to the positional relationship between the driver IC and the coil after heating and pressing are suppressed.
  • the driver IC is housed in a cavity formed by a plurality of insulating base layers.
  • a part of the insulating base layer that has flowed during heating and pressurization when forming a laminate is formed. It flows into the cavity. For this reason, the generation of a gap in the cavity is suppressed, and the fixing failure of the driver IC housed in the laminated body hardly occurs. Therefore, the electrical connection reliability between the driver IC and the conductor in the multilayer body is increased.
  • the magnetic sensor is housed in the laminated body and disposed in an inner portion of the winding region of the first coil or the second coil. It is preferable. In the inner part of the coil winding region, excessive flow of the insulating base material layer during heating and pressurization is suppressed, and this configuration stabilizes the position of the magnetic sensor. In addition, with this configuration, even when an external force is applied to the stacked body, the displacement of the magnetic sensor is suppressed.
  • the magnetic sensor is preferably disposed at a position overlapping the winding axis of the first coil or the second coil.
  • the magnetic sensor is arranged on the winding axis of the coil, which is less affected by the magnetic field generated from the coil, so that it is difficult to be affected by the magnetic field formed by the coil. Therefore, the magnetic field detection accuracy of the magnetic sensor can be increased.
  • the first coil is formed on each of two or more insulating base layers among the plurality of insulating base layers.
  • the second coil is configured to include a plurality of second coil conductors that are respectively formed on two or more insulating base layers of the plurality of insulating base layers. preferable.
  • the driver IC is arranged so as to be entirely accommodated in the IC arrangement region. This configuration further suppresses the displacement of the positional relationship between the driver IC and the coil even when an external force is applied to the stacked body, as compared with a case where a part of the driver IC is housed inside the IC arrangement region.
  • a multilayer board including a plurality of coils and a driver IC
  • FIG. 1 is an external perspective view of a multilayer substrate 101 according to the first embodiment.
  • FIG. 2 is an exploded plan view of the multilayer substrate 101.
  • 3A is a plan view of the multilayer substrate 101
  • FIG. 3B is a cross-sectional view taken along line AA in FIG. 3A.
  • 4A is a plan view of the multilayer substrate 101 showing the winding regions WE1 and WE2 of the first coil L1 and the second coil L2, and
  • FIG. 4B is a cross-sectional view taken along line BB in FIG. 4A.
  • FIG. FIG. 5 is a cross-sectional view showing a usage state of the multilayer substrate 101.
  • FIG. 1 is an external perspective view of a multilayer substrate 101 according to the first embodiment.
  • FIG. 2 is an exploded plan view of the multilayer substrate 101.
  • 3A is a plan view of the multilayer substrate 101, and
  • FIG. 3B is a cross-sectional view taken along line AA in FIG. 3A.
  • 4A is a plan view of the multilayer substrate 101 showing the winding regions WE1 and WE2 of the first coil L1 and the second coil L2, and
  • FIG. 4B is a cross-sectional view taken along line BB in FIG. 4A.
  • FIG. 1 is an external perspective view of a multilayer substrate 101 according to the first embodiment.
  • FIG. 2 is an exploded plan view of the multilayer substrate 101.
  • 3A is a plan view of the multilayer substrate 101
  • FIG. 3B is a cross-sectional view taken along line AA in FIG. 3A.
  • 4A is a plan view of the multilayer substrate 101 showing the winding regions WE1 and WE2 of the first coil
  • the thickness of each part is exaggerated.
  • the IC placement area AD is indicated by hatching
  • the first coil formation area FE1 and the second coil formation area FE2 are indicated by dot patterns.
  • the winding area WE1 of the first coil and the winding area WE2 of the second coil are shown by cross-hatching.
  • the multilayer substrate 101 includes a laminated body 10, a driver IC 3, two magnetic sensors 1 and 2, a first coil L1 and a second coil L2 connected to the driver IC 3, and four external electrodes P1, P2, P3. P4.
  • the stacked body 10 is a substantially rectangular parallelepiped whose longitudinal direction coincides with the X-axis direction, and has a first main surface VS1 and a second main surface VS2 facing the first main surface VS1.
  • Four external electrodes P1, P2, P3, and P4 are formed on the first main surface VS1 of the multilayer body 10.
  • the first main surface VS1 is a mounting surface.
  • the stacked body 10 has an IC placement region AD inside.
  • the IC placement area AD is a first coil formation area FE1 that is the formation area of the first coil L1, and a formation area that is the formation area of the second coil L2. This is a region sandwiched between the two coil formation regions FE2.
  • the driver IC 3 is at least partially arranged in the IC arrangement area AD.
  • the entire driver IC 3 is arranged so as to be accommodated in the IC arrangement area AD.
  • the driver IC 3 moves a magnet (described in detail later) attached to the movable body by controlling power feeding of the first coil L1 and the second coil L2.
  • the laminate 10 is formed by laminating a plurality of insulating base layers 11, 12, 13, 14, 15, 16 made of a resin material (thermoplastic resin).
  • the plurality of insulating base material layers 11, 12, 13, 14, 15, and 16 are rectangular flat plates whose longitudinal directions coincide with the X axis.
  • the plurality of insulating base layers 11, 12, 13, 14, 15, and 16 are sheets mainly made of a liquid crystal polymer, for example.
  • External electrodes P1, P2, P3, and P4 are formed on the back surface of the insulating base layer 11.
  • the external electrodes P1, P2, P3, and P4 are rectangular conductors arranged near the center of the insulating base material layer 11.
  • the external electrodes P1, P2, P3, and P4 are conductor patterns such as Cu foil.
  • interlayer connection conductors V11, V21, V31, and V41 are formed on the insulating base material layer 11.
  • Conductors 21, 22, 23, 24, C12, C22, C32, and C42 are formed on the back surface of the insulating base layer 12.
  • the conductors 21, 22, 23, and 24 are rectangular conductors disposed near the center of the insulating base material layer 12.
  • the conductor C12 is an L-shaped conductor disposed at a position closer to the first corner (the lower left corner of the insulating base layer 12 in FIG. 2) from the center of the insulating base layer 12.
  • the conductor C22 is an L-shaped conductor disposed at a position closer to the second corner (the upper left corner of the insulating base layer 12 in FIG. 2) from the center of the insulating base layer 12.
  • the conductor C32 is an L-shaped conductor disposed at a position closer to the third corner (upper right corner of the insulating base layer 12 in FIG. 2) from the center of the insulating base layer 12.
  • the conductor C42 is an L-shaped conductor disposed at a position near the fourth corner (the lower right corner of the insulating base layer 12 in FIG. 2) from the center of the insulating base layer 12.
  • the conductors 21, 22, 23, 24, C12, C22, C32, and C42 are conductor patterns such as Cu foil, for example.
  • the insulating base layer 12 is formed with interlayer connection conductors VC12, VC13, VC22, VC23, VC32, VC33, VC42, and VC43.
  • the first coil conductor L11 is an L-shaped conductor disposed at a position near the first corner (the lower left corner of the insulating base layer 13 in FIG. 2) from the center of the insulating base layer 13.
  • the first coil conductor L17 is a rectangular conductor disposed at a position closer to the third side (the upper side of the insulating base layer 13 in FIG. 2) from the center of the insulating base layer 13.
  • the second coil conductor L21 is an L-shaped conductor disposed at a position near the fourth corner (the lower right corner of the insulating base layer 13 in FIG. 2) from the center of the insulating base layer 13.
  • the second coil conductor L27 is a rectangular conductor disposed at a position near the third side from the center of the insulating base layer 13.
  • the conductors 31, 32, 33, and 34 are rectangular conductors disposed near the center of the insulating base material layer 13.
  • the conductors C11 and C41 are rectangular conductors arranged at positions near the center of the first side of the insulating base layer 13 (the lower side of the insulating base layer 13 in FIG. 2).
  • the conductors C21 and C31 are rectangular conductors arranged near the center of the third side of the insulating base layer 13.
  • the conductors C13 and C23 are rectangular conductors disposed at positions closer to the second side (the left side of the insulating base layer 13 in FIG. 2) from the center of the insulating base layer 13.
  • the conductors C33 and C43 are rectangular conductors disposed at positions closer to the fourth side (the right side of the insulating base material layer 13 in FIG. 2) than the center of the insulating base material layer 13.
  • the first coil conductors L11, L17, the second coil conductors L21, L27, the conductors 31, 32, 33, 34, C11, C13, C21, C23, C31, C33, C41, C43 are conductor patterns such as Cu foil, for example. is there.
  • interlayer connection conductors V31, V32, V33, V34, VL11, VL12, VL17, VL18, VL21, VL22, VL27, VL28, VC14, VC24, VC34, and VC44 are formed on the insulating base material layer 13.
  • the first coil conductors L12 and L16 and the second coil conductors L22 and L26 are formed on the back surface of the insulating base layer 14.
  • the first coil conductor L12 is a rectangular spiral conductor of about two turns arranged at a position closer to the second side (the left side of the insulating base layer 14 in FIG. 2) from the center of the insulating base layer 14.
  • the first coil conductor L16 is a rectangular conductor arranged near the center of the third side of the insulating base layer 14 (the upper side of the insulating base layer 14 in FIG. 2).
  • the second coil conductor L22 is a rectangular spiral conductor of about 2 turns disposed at a position near the fourth side (the right side of the insulating base layer 14 in FIG.
  • the second coil conductor L26 is a rectangular conductor arranged near the center of the third side of the insulating base layer 14.
  • the first coil conductors L12 and L16 and the second coil conductors L22 and L26 are conductor patterns such as Cu foil, for example.
  • the insulating base material layer 14 is formed with interlayer connection conductors VL13, VL16, VL23, VL26 and openings AP0, AP1, AP2.
  • the opening AP0 is a through hole that matches the planar shape of the driver IC3.
  • the opening AP1 is a through hole that matches the planar shape of the magnetic sensor 1
  • the opening AP2 is a through hole that matches the planar shape of the magnetic sensor 2.
  • the openings AP0, AP1, AP2 are formed by, for example, laser processing. Alternatively, the openings AP0, AP1, AP2 may be formed by punching or the like.
  • the first coil conductors L13 and L15 and the second coil conductors L23 and L25 are formed on the back surface of the insulating base layer 15.
  • the first coil conductor L13 is a rectangular spiral conductor of about 1.5 turns arranged at a position closer to the second side (the left side of the insulating base layer 15 in FIG. 2) from the center of the insulating base layer 15. .
  • the first coil conductor L15 is a rectangular conductor disposed near the center of the third side of the insulating base layer 15 (the upper side of the insulating base layer 15 in FIG. 2).
  • the second coil conductor L23 is a rectangular spiral conductor of about 1.5 turns arranged near the fourth side (the right side of the insulating base layer 15 in FIG.
  • the second coil conductor L25 is a rectangular conductor arranged near the center of the third side of the insulating base material layer 15.
  • the first coil conductors L13 and L15 and the second coil conductors L23 and L25 are conductor patterns such as Cu foil, for example.
  • interlayer connection conductors VL14, VL15, VL24, VL25 and openings AP3, AP4 are formed in the insulating base material layer 15.
  • the opening AP3 is a through hole that matches the planar shape of the magnetic sensor 1
  • the opening AP4 is a through hole that matches the planar shape of the magnetic sensor 2.
  • the openings AP3 and AP4 are formed by, for example, laser processing. Alternatively, the openings AP3 and AP4 may be formed by punching or the like.
  • the first coil conductor L14 and the second coil conductor L24 are formed on the back surface of the insulating base layer 16.
  • the first coil conductor L14 is a rectangular spiral conductor of about two turns arranged at a position closer to the second side (the left side of the insulating base layer 16 in FIG. 2) from the center of the insulating base layer 16.
  • the second coil conductor L24 is a rectangular spiral conductor of about 2 turns disposed at a position near the fourth side (the right side of the insulating base layer 16 in FIG. 2) from the center of the insulating base layer 16.
  • the first coil conductor L14 and the second coil conductor L24 are conductor patterns such as Cu foil, for example.
  • one end of the first coil conductor L11 is connected to the terminal of the driver IC 3 via the interlayer connection conductor VL11.
  • the other end of the first coil conductor L11 is connected to one end of the first coil conductor L12 via the interlayer connection conductor VL12.
  • the other end of the first coil conductor L12 is connected to one end of the first coil conductor L13 via the interlayer connection conductor VL13.
  • the other end of the first coil conductor L13 is connected to one end of the first coil conductor L14 via an interlayer connection conductor VL14.
  • the other end of the first coil conductor L14 is connected to the first coil conductor L15 via an interlayer connection conductor VL15.
  • the first coil conductor L15 is connected to the terminal of the driver IC 3 via the first coil conductors L16, L17 and the interlayer connection conductors VL16, VL17, VL18.
  • the first coil conductor L11, L12, L13, L14, L15, L16, and L17 formed on each of the plurality of insulating base layers 13, 14, 15, and 16 includes the first 5.5 turns.
  • a coil L1 is configured. Both ends of the first coil L1 are connected to terminals of the driver IC3.
  • the first coil L1 is formed inside the laminated body 10, and the lamination direction (Z-axis direction) of the plurality of insulating base material layers 11, 12, 13, 14, 15, 16 is used. ) Along the winding axis AX1.
  • one end of the second coil conductor L21 is connected to a terminal of the driver IC 3 via the interlayer connection conductor VL21.
  • the other end of the second coil conductor L21 is connected to one end of the second coil conductor L22 via an interlayer connection conductor VL22.
  • the other end of the second coil conductor L22 is connected to one end of the second coil conductor L23 via an interlayer connection conductor VL23.
  • the other end of the second coil conductor L23 is connected to one end of the second coil conductor L24 via an interlayer connection conductor VL24.
  • the other end of the second coil conductor L24 is connected to the second coil conductor L25 via an interlayer connection conductor VL25.
  • the second coil conductor L25 is connected to the terminal of the driver IC 3 via the second coil conductors L26, L27 and the interlayer connection conductors VL26, VL27, VL28.
  • the second coil conductor L21, L22, L23, L24, L25, L26, and L27 formed on each of the plurality of insulating base layers 13, 14, 15, and 16 includes a second of about 5.5 turns.
  • a coil L2 is configured. Both ends of the second coil L2 are connected to the terminals of the driver IC3.
  • the second coil L2 is formed inside the multilayer body 10 and has a winding axis AX2 along the Z-axis direction.
  • the winding axis AX1 of the first coil L1 and the winding axis AX2 of the second coil L2 coincide with the Z-axis direction.
  • the winding axis AX1 of the first coil L1 ( Alternatively, the present invention is not limited to the configuration in which the winding axis AX2) of the second coil L2 and the Z-axis direction exactly match.
  • “the winding axis along the stacking direction of the plurality of insulating base layers” means, for example, that the winding axis AX1 of the first coil L1 (or the winding axis AX2 of the second coil L2) is in the Z-axis direction. Including the case where the angle is within the range of ⁇ 30 ° to + 30 °.
  • the external electrodes P1, P2, P3, and P4 are connected to the terminals of the driver IC 3, respectively.
  • the external electrode P1 is connected to the terminal of the driver IC 3 through the conductors 21 and 31 and the interlayer connection conductors V11, V21, and V31.
  • the external electrode P2 is connected to the terminal of the driver IC 3 through the conductors 22 and 32 and the interlayer connection conductors V12, V22, and V32.
  • the external electrode P3 is connected to the terminal of the driver IC 3 through the conductors 23 and 33 and the interlayer connection conductors V13, V23, and V33.
  • the external electrode P4 is connected to the terminal of the driver IC 3 through the conductors 24, 34 and the interlayer connection conductors V14, V24, V34.
  • Magnetic sensors 1 and 2 are elements that mainly sense an external magnetic field, and detect the amount of movement of a magnet (described in detail later) attached to a movable body.
  • the magnetic sensors 1 and 2 are Hall elements using the Hall effect, for example.
  • the magnetic sensors 1 and 2 each have two terminals.
  • the two terminals of the magnetic sensors 1 and 2 are connected to the driver IC 3 respectively.
  • the first terminal of the magnetic sensor 1 is connected to the terminal of the driver IC 3 via the conductors C11, C12, C13 and the interlayer connection conductors VC11, VC12, VC13, VC14.
  • the second terminal of the magnetic sensor 1 is connected to the terminal of the driver IC 3 through the conductors C21, C22, C23 and the interlayer connection conductors VC21, VC22, VC23, VC24.
  • the first terminal of the magnetic sensor 2 is connected to the terminal of the driver IC 3 via the conductors C31, C32, C33 and the interlayer connection conductors VC31, VC32, VC33, VC34.
  • the second terminal of the magnetic sensor 2 is connected to the terminal of the driver IC 3 via the conductors C41, C42, C43 and the interlayer connection conductors VC41, VC42, VC43, VC44.
  • the direction of the magnetic field detected by the magnetic sensors 1 and 2 is the orthogonal direction (direction parallel to the XY plane) of the winding axes AX1 and AX2 of the first coil L1 or the second coil L2.
  • the magnetic sensor 1 is disposed at a position overlapping the winding axis AX1 of the first coil L1, and the magnetic sensor 2 is wound around the second coil L2. It arrange
  • the magnetic sensor 1 is housed in the laminated body 10 and disposed in an inner portion of the winding region WE1 of the first coil L1.
  • the magnetic sensor 2 is housed in the stacked body 10 and is disposed in an inner portion of the winding region WE2 of the second coil L2.
  • FIG. 5 is a cross-sectional view showing a usage state of the multilayer substrate 101.
  • the magnets 4 and 5 shown in FIG. 5 are attached to a movable body (not shown).
  • a predetermined current is passed through the first coil L1 and the second coil L2
  • the magnets 4 and 5 are perpendicular to the stacking direction (Z-axis direction) by the magnetic field radiated from the first coil L1 and the second coil L2 (Y It is displaced in the axial direction (see the white arrow shown in FIG. 5).
  • the magnetic sensors 1 and 2 sense changes in the magnetic field when the magnets 4 and 5 are displaced.
  • the multilayer substrate 101 has the following effects.
  • the magnetic sensors 1, 2 and the driver IC 3 are accommodated in the laminated body 10 in which the coils (the first coil L1 and the second coil L2) are formed. That is, in the multilayer substrate 101, the laminate 10, the coils, the magnetic sensors 1 and 2, and the driver IC 3 are integrated into a single component. For this reason, the positional relationship between the driver IC 3 and the coil is less likely to be shifted when the multilayer substrate is mounted, compared to the case where the driver IC 3 and the coil are mounted on the substrate or the like. Therefore, with this configuration, it is possible to suppress the variation in the generated magnetic field caused by the positional relationship of the driver IC 3 with respect to the coil.
  • the positional relationship between the driver IC 3 and the magnetic sensors 1 and 2 is less likely to be shifted when the multilayer substrate is mounted, compared to the case where the driver IC 3 and the magnetic sensors 1 and 2 are mounted on the substrate or the like. Therefore, with this configuration, the wiring between the magnetic sensors 1 and 2 and the driver IC 3 and the influence of the magnetic field generated by the magnetic sensors 1 and 2 from the driver IC 3 and the wiring connecting the driver IC and the coil are reduced. It becomes difficult to be affected by the generated magnetic field, and noise superimposed on the signals from the magnetic sensors 1 and 2 is suppressed.
  • the plurality of insulating base material layers 11, 12, 13, 14, 15, 16 forming the laminate 10 are made of a resin material.
  • a conductor such as a coil has relatively higher rigidity than an insulating base material layer made of a resin material. That is, in the multilayer substrate 101, the driver IC 3 is sandwiched (enclosed) by a member having a relatively higher rigidity than the insulating base material layer made of a resin material, so that even when an external force is applied to the laminated body 10, Deviation in the positional relationship between the IC 3 and the coil is suppressed.
  • the plurality of insulating base layers 11, 12, 13, 14, 15, and 16 are made of a resin material of a thermoplastic resin.
  • a conductor such as a coil is made of a material having lower fluidity than an insulating base material layer made of a thermoplastic resin at a temperature at the time of forming a laminated body (at the time of heating and pressurizing a plurality of insulating base material layers).
  • the driver IC 3 is arranged in the IC arrangement area AD sandwiched between the first coil formation area FE1 and the second coil formation area FE2. Therefore, the insulating group in the IC arrangement area AD at the time of heating and pressurization is arranged.
  • the driver IC 3 is housed in a cavity (described in detail later) formed by a plurality of insulating base material layers 11, 12, 13, 14, 15, and 16. A part of the fluidized insulating base material layer flows into the cavity at the time of heating and pressurizing. For this reason, the generation of the gap in the cavity is suppressed, and the fixing failure of the driver IC 3 housed in the laminated body 10 hardly occurs. Therefore, the electrical connection reliability between the driver IC 3 and the conductor in the multilayer body 10 is increased.
  • the magnetic sensor 1 is housed in the multilayer body 10, and is disposed in the inner region of the winding region WE1 of the first coil L1.
  • the magnetic sensor 2 is housed in the stacked body 10 and is disposed in an inner region of the winding region WE2 of the second coil L2.
  • the inner portions of the winding regions WE1 and WE2 of the coils (the first coil L1 and the second coil L2), excessive flow of the insulating base material layer during heating and pressurization is suppressed. , 2 is stabilized.
  • displacement of the magnetic sensors 1 and 2 is suppressed.
  • the magnetic sensor 1 is disposed at a position overlapping the winding axis AX1 of the first coil L1, and the magnetic sensor 2 is positioned at the position overlapping the winding axis AX2 of the second coil L2. Is arranged. In this configuration, by placing the magnetic sensor on the winding axis of the coil that is less affected by the magnetic field generated from the coil (the first coil L1 or the second coil L2), it is less likely to be affected by the magnetic field formed by the coil. .
  • the magnetic field in the direction perpendicular to the winding axis of the coil is cancelled, so the magnetic field formed by the magnets 4 and 5 located in the winding axis direction (Z-axis direction) of the coil. It becomes possible to detect with high accuracy, and the magnetic field detection accuracy of the magnetic sensor can be increased.
  • the direction of the magnetic field detected by the magnetic sensors 1 and 2 is the orthogonal direction (direction on the XY plane) of the winding axes AX1 and AX2 of the first coil L1 and the second coil L2. It is valid.
  • the first coil L1 is formed on the plurality of insulating base layers 13, 14, 15, 16 respectively, and the plurality of first coil conductors L11, L12, L13, L14, L15. , L16, and L17.
  • the second coil L2 includes a plurality of second coil conductors L21, L22, L23, L24, L25, L26, and L27 formed on the plurality of insulating base layers 13, 14, 15, and 16, respectively.
  • the first coil formation region FE1 and the second coil formation region FE2 increase in the stacking direction (Z-axis direction), and thus the IC arrangement region AD can be increased.
  • the driver IC 3 it becomes easier to place the driver IC 3 in the IC placement area AD, and even when an external force is applied to the stacked body 10, the positional relationship between the driver IC 3 and the coil (the first coil L1 or the second coil L2) is further suppressed. Is done. Also, with this configuration, a coil having a predetermined number of turns and an inductance can be easily realized.
  • the entire driver IC 3 is arranged so as to be accommodated in the IC arrangement area AD.
  • the positional relationship between the driver IC 3 and the coil is further suppressed even when an external force is applied to the stacked body 10 as compared with a case where a part of the driver IC 3 is housed in the IC placement area AD. .
  • the multilayer substrate in the present invention is manufactured by, for example, the following manufacturing method.
  • the insulating base material layers 11, 12, 13, 14, 15, 16 in the aggregate substrate state are prepared.
  • the insulating base layers 11, 12, 13, 14, and 15 are sheets mainly made of a liquid crystal polymer, for example.
  • a metal foil for example, copper foil
  • the metal foil is patterned by photolithography.
  • conductor patterns first coil conductors L11 to L17, second coil conductors L21 to L27, external electrodes P1 to P4, conductors 21 to 24, 31 to 34, 41 to 44, C11 to C13, C21 to C23, C31
  • conductor patterns first coil conductors L11 to L17, second coil conductors L21 to L27, external electrodes P1 to P4, conductors 21 to 24, 31 to 34, 41 to 44, C11 to C13, C21 to C23, C31
  • interlayer connection conductors V11 to V14, V21 to V24, V31 to V34, V41 to V44, VC11 to VC14, VC21 to VC21 to the insulating base material layers 11, 12, 13, 14, and 15 in the aggregate substrate state VC24, VC31 to VC34, VC41 to VC44, VL11 to VL18, and VL21 to VL28).
  • the interlayer connection conductor is provided with a through-hole with a laser or the like, and then a conductive paste containing one or more of Cu, Ag, Sn, Ni, Mo or the like or an alloy thereof is disposed, It is provided by curing in the process. Therefore, the interlayer connection conductor is made of a material having a melting point lower than the temperature at the time of subsequent heating and pressurization.
  • openings AP0, AP1, AP2, AP3, AP4 are formed in the insulating base material layers 14, 15.
  • the opening AP0 is a through hole that matches the planar shape of the driver IC3.
  • the openings AP1 and AP2 are through holes that match the planar shape of the magnetic sensor 1, and the openings AP3 and AP4 are through holes that match the planar shape of the magnetic sensor 2.
  • the openings AP0, AP1, AP2, AP3, AP4 are formed by, for example, laser processing. Alternatively, the openings AP0, AP1, AP2, AP3, AP4 may be formed by punching or the like.
  • the insulating base material layers 11, 12, 13, 14, 15, and 16 are laminated.
  • a cavity along the shape of the driver IC 3 is formed in the laminated insulating base material layers 13, 14, and 15, and the driver IC 3 is accommodated in the cavity.
  • cavities along the shape of the magnetic sensors 1 and 2 are formed inside the laminated insulating base material layers 13, 14, 15, and 16, and the magnetic sensors 1 and 2 are housed in the cavities, respectively.
  • the driver IC 3 moves the magnet attached to the movable body by controlling the power supply of the coil.
  • the magnetic sensors 1 and 2 are elements that mainly sense an external magnetic field, for example, Hall elements that use the Hall effect.
  • the laminated insulating base material layers 11, 12, 13, 14, 15, 16 are heated and pressurized to form the laminated body 10 in the aggregate substrate state.
  • the laminate 10 is formed (at the time of heating and pressing), a part of the insulating base layers 13, 14, and 15 flows into the cavity, and the driver IC 3 is covered with the thermoplastic resin.
  • the laminate 10 is formed (at the time of heating and pressing), a part of the insulating base layers 13, 14, 15, 16 flows into the cavity, and the magnetic sensors 1, 2 are covered with the thermoplastic resin. Is called.
  • the multilayer substrate 101 is obtained by separating into individual pieces from the aggregate substrate.
  • the laminate 10 is a substantially rectangular parallelepiped, but is not limited to this configuration.
  • the shape of the laminated body 10 can be changed as appropriate within the scope of the operations and effects of the present invention, and may be, for example, a cube, a polygonal column, a cylinder, an elliptical column, etc.
  • the planar shape of the laminated body 10 is L-shaped, It may be a crank shape, a T shape, a Y shape, or the like.
  • a plurality of insulating base layers including an insulating base layer in which openings are formed are stacked, and the driver IC 3 and the magnetic sensor 1 are placed in a cavity formed inside the stacked plurality of insulating base layers.
  • the multilayer board of the present invention is not limited to this.
  • a plurality of insulating base layers including an insulating base layer printed with a thickness-adjusting resin paste on the surface are stacked, and a driver IC and a magnetic sensor are arranged in a portion where the thickness adjusting resin paste is not printed.
  • the driver IC and the magnetic sensor may be housed in the laminated body.
  • the multilayer substrate 101 is configured to include the laminated body 10 formed by laminating the six insulating base material layers 11, 12, 13, 14, 15, and 16, but is not limited thereto. .
  • the number of layers of the insulating base material layer forming the laminate 10 can be changed as appropriate within the range where the effects and advantages of the present invention are achieved.
  • the laminated body 10 is not limited to the structure formed by laminating
  • the laminated body 10 may have a configuration formed by laminating a plurality of insulating base material layers made of, for example, a thermosetting resin.
  • the laminate 10 may be a dielectric ceramic such as a low temperature co-fired ceramic (LTCC).
  • LTCC low temperature co-fired ceramic
  • the two magnetic sensors 1 and 2 are configured to be housed in the laminated body 10, but the number and arrangement of the magnetic sensors 1 and 2 are appropriately set within the scope of the operation and effect of the present invention. It can be changed.
  • the magnetic sensor provided in the multilayer substrate may be, for example, one, or three or more.
  • the magnetic sensor may be mounted on the second main surface VS2 of the multilayer body 10.
  • the magnetic sensor is accommodated in the laminated body 10 and disposed in the inner region of the coil winding region.
  • the magnetic sensor is preferably arranged at a position overlapping the winding axis of the coil.
  • the multilayer substrate 101 includes two coils (first coil L1 and second coil L2) having approximately 5.5 turns, but is not limited to this configuration.
  • the number of coils, the number of turns, and the shape of the multilayer substrate can be changed as appropriate within the scope of the effects and advantages of the present invention.
  • the multilayer substrate may include, for example, three or more coils.
  • the shape of the coil may be a helical shape or a planar spiral shape.
  • the coil includes a plurality of coil conductors respectively formed on the plurality of insulating base layers.
  • the multilayer substrate 101 includes the first coil L1 and the second coil L2 that are symmetrical with each other, the present invention is not limited to this configuration.
  • the plurality of coils included in the multilayer substrate 101 do not have to be symmetrical with each other.
  • the first coil L1 and the second coil L2 are arranged in the same layer in the stacking direction (Z-axis direction), but the plurality of coils are at different positions in the stacking direction (Z-axis direction). May be arranged.
  • circuit formed on the multilayer substrate of the present invention is not limited to the circuit of the multilayer substrate 101.
  • the circuit formed on the multilayer substrate can be changed as appropriate within the range where the functions and effects of the present invention are achieved.
  • other electronic components for example, a chip capacitor and a chip inductor may be mounted on the multilayer substrate.
  • the entire driver IC 3 is housed in the IC placement area AD, but the present invention is not limited to this configuration. If at least a part of the driver IC 3 is arranged in the IC arrangement area AD, the effects and advantages of the present invention can be obtained. However, from the effect described in (g) above, it is preferable that the entire driver IC 3 is housed in the IC placement area AD.
  • interlayer connection conductor VS1 ... first main face VS2 ... second main face WE1 ... 1 coil winding area WE2 ... 2nd coil winding area 1, 2 ... magnetic sensor 3 ... driver IC 4, 5 ... Magnet 10 ... Laminate 11, 12, 13, 14, 15, 16 ... Insulating base material layer 101 ... Multilayer substrate

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Coils Or Transformers For Communication (AREA)

Abstract

L'invention concerne un substrat multicouche (101) pourvu : d'un corps stratifié (10) formé par stratification d'une pluralité de couches de matériau de base isolantes ; d'une première bobine (L1) et d'une seconde bobine (L2) qui sont formées sur le corps stratifié (10) ; d'un circuit d'attaque (IC3) ; et de capteurs magnétiques (1, 2) qui sont connectés à l'IC d'attaque (3). L'axe d'enroulement (AX1) de la première bobine (L1) et l'axe d'enroulement (AX2) de la seconde bobine (L2) sont parallèles à la direction de stratification (direction d'axe Z). Le corps stratifié (10) a une région d'agencement d'IC (AD) en son sein. La région d'agencement d'IC (AD) est une zone interposée entre une zone de formation (FE1) de la première bobine (L1) et une zone de formation (FE2) de la seconde bobine (L2). Au moins une partie de l'IC d'attaque (3) est située dans la zone d'agencement d'IC (AD).
PCT/JP2018/006676 2017-03-02 2018-02-23 Substrat multicouche WO2018159485A1 (fr)

Priority Applications (1)

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JP2017039331 2017-03-02

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Cited By (1)

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Publication number Priority date Publication date Assignee Title
US20220059266A1 (en) * 2019-03-19 2022-02-24 Rohm Co., Ltd. Coil module, actuator provided with coil module, and method for manufacturing coil module

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Publication number Priority date Publication date Assignee Title
DE102020206989A1 (de) 2020-06-04 2021-12-09 Robert Bosch Gesellschaft mit beschränkter Haftung Schaltungsträger für eine elektronische Schaltung und Verfahren zur Herstellung des Schaltungsträgers
TWI789104B (zh) * 2021-11-08 2023-01-01 瑞昱半導體股份有限公司 電感裝置

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JP2012032526A (ja) * 2010-07-29 2012-02-16 Olympus Imaging Corp 像振れ補正装置及びカメラ
WO2014115434A1 (fr) * 2013-01-22 2014-07-31 株式会社村田製作所 Composant composite lc
JP2015050643A (ja) * 2013-09-02 2015-03-16 リコーイメージング株式会社 撮影装置及びその調整制御方法
WO2015079773A1 (fr) * 2013-11-28 2015-06-04 株式会社村田製作所 Électroaimant, procédé d'entraînement d'objectif, et procédé de fabrication d'électroaimant
WO2015129601A1 (fr) * 2014-02-27 2015-09-03 株式会社村田製作所 Procédé de fabrication d'électro-aimant, et électro-aimant

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Publication number Priority date Publication date Assignee Title
JP2012032526A (ja) * 2010-07-29 2012-02-16 Olympus Imaging Corp 像振れ補正装置及びカメラ
WO2014115434A1 (fr) * 2013-01-22 2014-07-31 株式会社村田製作所 Composant composite lc
JP2015050643A (ja) * 2013-09-02 2015-03-16 リコーイメージング株式会社 撮影装置及びその調整制御方法
WO2015079773A1 (fr) * 2013-11-28 2015-06-04 株式会社村田製作所 Électroaimant, procédé d'entraînement d'objectif, et procédé de fabrication d'électroaimant
WO2015129601A1 (fr) * 2014-02-27 2015-09-03 株式会社村田製作所 Procédé de fabrication d'électro-aimant, et électro-aimant

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220059266A1 (en) * 2019-03-19 2022-02-24 Rohm Co., Ltd. Coil module, actuator provided with coil module, and method for manufacturing coil module

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