JP7369546B2 - コイル部品 - Google Patents
コイル部品 Download PDFInfo
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- JP7369546B2 JP7369546B2 JP2019102295A JP2019102295A JP7369546B2 JP 7369546 B2 JP7369546 B2 JP 7369546B2 JP 2019102295 A JP2019102295 A JP 2019102295A JP 2019102295 A JP2019102295 A JP 2019102295A JP 7369546 B2 JP7369546 B2 JP 7369546B2
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- magnetic
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- 239000011810 insulating material Substances 0.000 claims description 155
- 239000004020 conductor Substances 0.000 claims description 100
- 239000000758 substrate Substances 0.000 claims description 21
- 239000002923 metal particle Substances 0.000 claims description 19
- 239000003550 marker Substances 0.000 claims description 7
- 238000009413 insulation Methods 0.000 description 19
- 239000000463 material Substances 0.000 description 17
- 230000015556 catabolic process Effects 0.000 description 14
- 239000012212 insulator Substances 0.000 description 12
- 238000000034 method Methods 0.000 description 9
- 238000013459 approach Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 230000006866 deterioration Effects 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 239000002131 composite material Substances 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000002002 slurry Substances 0.000 description 3
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 239000000696 magnetic material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- 229910002796 Si–Al Inorganic materials 0.000 description 1
- 229910008458 Si—Cr Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- QDOXWKRWXJOMAK-UHFFFAOYSA-N dichromium trioxide Chemical compound O=[Cr]O[Cr]=O QDOXWKRWXJOMAK-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/24—Magnetic cores
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/32—Insulating of coils, windings, or parts thereof
- H01F27/324—Insulation between coil and core, between different winding sections, around the coil; Other insulation structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/12—Insulating of windings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
- H01F2027/2809—Printed windings on stacked layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/1003—Non-printed inductor
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Coils Or Transformers For Communication (AREA)
Description
2 回路基板
10 磁性基体
10a 第1の端面(第1面)
10c 第2の端面(第2面)
10e 第1の主面(第4面)
10f 第2の主面(第3面)
21、22 外部電極
21a、22a 主電極部
21b、21c、22b、22c フランジ部
25 導体パターン
31 第1絶縁材
32 第2絶縁材
C11~C16 コイルパターン
40a 上部カバー領域
40b 下部カバー領域
40c コア領域
40a1、40b1 重複領域
Claims (14)
- 軟磁性金属粒子を含み、第1面、前記第1面と対向する第2面、前記第1面と前記第2面とを接続する第3面、及び前記第3面に対向する第4面を有する磁性基体と、
前記磁性基体の前記第1面に設けられた第1主電極部及び前記第3面に設けられた第1フランジ部を有する第1外部電極と、
前記磁性基体の前記第2面に設けられた第2主電極部及び前記第4面に設けられた第2フランジ部を有する第2外部電極と、
前記第3面に対向するように設けられ前記第2外部電極に接続される第1引出導体を含む第1コイルパターン、及び、前記第4面に対向するように設けられ前記第1外部電極に接続される第2引出導体を含む第2コイルパターンを有し、前記第3面及び前記第4面と交わるコイル軸の周りに延びるコイル導体と、
前記第2外部電極の前記第2フランジ部と前記第2コイルパターンとの間に、前記第4面のうち前記第2フランジ部側の一部のみを覆うように設けられた絶縁材と、
を備え、
前記第2コイルパターンと前記第2外部電極の前記第2フランジ部との間の距離は、前記第2コイルパターンと前記第2外部電極の前記第2主電極部との間の距離よりも小さく、
前記第2コイルパターンは、前記磁性基体に接する、
コイル部品。 - 前記絶縁材は、前記第2外部電極の前記第2フランジ部の任意の部分と前記第2コイルパターンの任意の部分とを結ぶ線分上に位置する、
請求項1に記載のコイル部品。 - 前記磁性基体は、前記コイル導体の内側に配置されたコア領域を有し、
前記絶縁材は、前記コイル軸に沿う方向から視た視点で前記コア領域と重複しない位置に設けられる、
請求項1又は請求項2に記載のコイル部品。 - 前記磁性基体は、前記第2コイルパターンと前記第4面との間にあるカバー領域を有し、
前記カバー領域における前記軟磁性金属粒子の充填率は、前記コイル軸に沿う方向から視た視点で前記絶縁材と重複する領域においてそれ以外の領域よりも高い、
請求項1から請求項3のいずれか1項に記載のコイル部品。 - 前記絶縁材は、前記カバー領域から光学的に識別可能である、
請求項4に記載のコイル部品。 - 前記絶縁材は、前記コイル軸に沿う方向から視た視点で前記第2外部電極の前記第2フランジ部と重複しないマーカー部を有する、
請求項5に記載のコイル部品。 - 前記第1外部電極の前記第1フランジ部と前記第1コイルパターンとの間に前記第3面の一部を覆うように設けられた他の絶縁材を備え、
前記第1コイルパターンと前記第1外部電極の前記第1フランジ部との間の距離は、前記第1コイルパターンと前記第1外部電極の前記第1主電極部との間の距離よりも小さい、
請求項1から請求項6のいずれか1項に記載のコイル部品。 - 前記他の絶縁材は、前記第1外部電極の前記第1フランジ部の任意の部分と前記第1コイルパターンの任意の部分とを結ぶ線分上に位置する、
請求項7に記載のコイル部品。 - 前記磁性基体は、前記コイル導体の内側に配置されたコア領域を有し、
前記他の絶縁材は、前記コイル軸に沿う方向から視た視点で前記コア領域と重複しない位置に設けられる、
請求項7または請求項8のいずれか1項に記載のコイル部品。 - 前記磁性基体は、前記第1コイルパターンと前記第3面との間にある他のカバー領域を有し、
前記他のカバー領域における前記軟磁性金属粒子の充填率は、前記コイル軸に沿う方向から視た視点で前記他の絶縁材と重複する領域においてそれ以外の領域よりも高い、
請求項7から請求項9のいずれか1項に記載のコイル部品。 - 前記他の絶縁材は、前記他のカバー領域から光学的に識別可能である、
請求項10に記載のコイル部品。 - 前記他の絶縁材は、前記コイル軸に沿う方向から視た視点で前記第1外部電極の前記第1フランジ部と重複しない他のマーカー部を有する、
請求項11に記載のコイル部品。 - 請求項1から請求項12のいずれか1項に記載のコイル部品を含む回路基板。
- 請求項13に記載の回路基板を含む電子機器。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019102295A JP7369546B2 (ja) | 2019-05-31 | 2019-05-31 | コイル部品 |
US16/887,321 US10902992B2 (en) | 2019-05-31 | 2020-05-29 | Coil component |
US17/124,239 US11315721B2 (en) | 2019-05-31 | 2020-12-16 | Coil component |
US17/670,825 US11810707B2 (en) | 2019-05-31 | 2022-02-14 | Coil component |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019102295A JP7369546B2 (ja) | 2019-05-31 | 2019-05-31 | コイル部品 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2020198336A JP2020198336A (ja) | 2020-12-10 |
JP7369546B2 true JP7369546B2 (ja) | 2023-10-26 |
Family
ID=73550340
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019102295A Active JP7369546B2 (ja) | 2019-05-31 | 2019-05-31 | コイル部品 |
Country Status (2)
Country | Link |
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US (3) | US10902992B2 (ja) |
JP (1) | JP7369546B2 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7373930B2 (ja) * | 2019-06-28 | 2023-11-06 | 太陽誘電株式会社 | 積層コイル部品 |
US11881339B2 (en) * | 2019-12-10 | 2024-01-23 | Samsung Electro-Mechanics Co., Ltd. | Coil component |
JP2021136336A (ja) * | 2020-02-27 | 2021-09-13 | Tdk株式会社 | 積層コイル部品 |
JP7444146B2 (ja) | 2021-08-05 | 2024-03-06 | 株式会社村田製作所 | コイル部品 |
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JP2010021591A (ja) | 2009-10-27 | 2010-01-28 | Tdk Corp | 積層型電子部品 |
JP2013110171A (ja) | 2011-11-17 | 2013-06-06 | Taiyo Yuden Co Ltd | 積層インダクタ |
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2019
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-
2020
- 2020-05-29 US US16/887,321 patent/US10902992B2/en active Active
- 2020-12-16 US US17/124,239 patent/US11315721B2/en active Active
-
2022
- 2022-02-14 US US17/670,825 patent/US11810707B2/en active Active
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JP2010021591A (ja) | 2009-10-27 | 2010-01-28 | Tdk Corp | 積層型電子部品 |
JP2013110171A (ja) | 2011-11-17 | 2013-06-06 | Taiyo Yuden Co Ltd | 積層インダクタ |
JP2013135220A (ja) | 2011-12-22 | 2013-07-08 | Samsung Electro-Mechanics Co Ltd | チップインダクタ及びその製造方法 |
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US20160111205A1 (en) | 2014-10-15 | 2016-04-21 | Samsung Electro-Mechanics Co., Ltd. | Chip component and manufacturing method thereof |
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Also Published As
Publication number | Publication date |
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US20210134517A1 (en) | 2021-05-06 |
US11315721B2 (en) | 2022-04-26 |
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