WO2018145341A1 - 一种显示器、线路板及其引脚结构 - Google Patents

一种显示器、线路板及其引脚结构 Download PDF

Info

Publication number
WO2018145341A1
WO2018145341A1 PCT/CN2017/075932 CN2017075932W WO2018145341A1 WO 2018145341 A1 WO2018145341 A1 WO 2018145341A1 CN 2017075932 W CN2017075932 W CN 2017075932W WO 2018145341 A1 WO2018145341 A1 WO 2018145341A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
film layer
conductive film
pin
display
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2017/075932
Other languages
English (en)
French (fr)
Inventor
许欢
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuhan China Star Optoelectronics Technology Co Ltd
Original Assignee
Wuhan China Star Optoelectronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wuhan China Star Optoelectronics Technology Co Ltd filed Critical Wuhan China Star Optoelectronics Technology Co Ltd
Publication of WO2018145341A1 publication Critical patent/WO2018145341A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display

Definitions

  • the present invention relates to the field of display technologies, and in particular, to a display, a circuit board, and a pin structure thereof.
  • a pin on a circuit board and a pin on a conductive film layer are bonded together by an anisotropic conductive paste with conductive particles by thermocompression bonding, and pins on the circuit board are bonded together.
  • the pins on the conductive film layer are not directly turned on, but the conductive particles in the anisotropic conductive paste are captured by the pins on the circuit board and the pins on the conductive film layer, thereby realizing the circuit board.
  • the present invention provides a display, a wiring board and a lead structure thereof, and the display of the present invention can enhance the reliability of communication between the wiring board and the conductive film layer.
  • a technical solution proposed by the present invention is to provide a display, including:
  • circuit board and a display panel wherein the circuit board and the conductive film layer of the display panel are provided with pins;
  • a plurality of protrusions are disposed on the lead of the circuit board and/or the conductive film layer; pins of the circuit board and pins of the conductive film layer are respectively connected through the protrusions;
  • the protrusion is a spiked structure; the protrusion is disposed on a front end surface of the lead of the wiring board and/or the conductive film layer.
  • the present invention further provides a technical solution for providing a lead structure of a circuit board, comprising a circuit board and a pin body, wherein the pin body is disposed on the circuit board, and the pin body is provided with a plurality of Raised.
  • Another technical solution of the present invention is to provide a circuit board, wherein the circuit board includes a circuit board body and a pin, and the pin is disposed on the circuit board body, and the pin is provided with Several bumps.
  • the display provided by the present invention includes a circuit board and a display panel, and the conductive film layers of the circuit board and the display panel are each provided with a lead; the circuit board and/or the conductive A plurality of protrusions are disposed on the pin of the film layer; the pins of the circuit board and the pins of the conductive film layer are connected by the protrusions.
  • the liquid crystal display of the invention can make the conduction between the circuit board and the conductive film layer no longer depend on the capture of the conductive particles in the anisotropic conductive paste, wherein the circuit board and the conductive film layer can directly pass through the respective pins
  • the upper bumps are directly connected, thereby enhancing the reliability of the communication between the circuit board and the conductive film layer, and improving the working stability of the display panel.
  • FIG. 1 is a schematic structural view of a display 100 of the prior art
  • Figure 2 is an enlarged schematic structural view of A in Figure 1;
  • FIG. 3 is a schematic structural view of an embodiment of a display of the present invention.
  • Figure 4 is a schematic structural view showing an enlarged embodiment of B in Figure 3;
  • Figure 5 is a schematic structural view of another embodiment after being enlarged in B of Figure 3;
  • Fig. 6 is a structural schematic view showing an embodiment of a pin structure of a wiring board of the present invention.
  • FIG. 1 is a schematic structural view of a display 100 of the prior art
  • FIG. 2 is an enlarged schematic structural view of A in FIG. 1.
  • the display 100 of the prior art includes a display.
  • the panel 101, the PCB board 103, and the circuit board 102, and the display panel 101 and the PCB board 103 are connected by the circuit board 102. Therefore, both the display panel 101 and the PCB board 103 need to be connected to the wiring board 102.
  • both sides of the circuit board 102 are provided with pins (not shown in FIG. 1)
  • the PCB board 103 and the side of the display panel 101 connected to the circuit board 102 are provided with leads corresponding to the pins on the circuit board 102. foot.
  • connection between the circuit board 102 and the display panel 101 is actually the connection between the circuit board 102 and the conductive film layer 1011 of the display panel 101.
  • the wiring board 102 and the conductive film layer 1011 of the display panel 101 are connected by pins 1021 on the wiring board 102 and pins 1012 on the conductive film layer 1011 of the display panel 101.
  • there is no actual contact between the pin 1021 and the pin 1012 but a conductive paste with conductive particles is filled between the pin 1021 on the circuit board 102 and the pin 1012 on the conductive film layer 1011.
  • the conductive particles 1041 in the conductive paste 104 are captured by the pins 1021 on the circuit board 102 and the pins 1012 on the conductive film layer 1011, and the conductive particles 1041 are captured to the pins 1021 and the conductive film on the circuit board 102.
  • the connection of the pins 1021 on the wiring board 102 and the pins 1012 on the conductive film layer 1011 is realized.
  • FIG. 3 is a schematic structural view of an embodiment of the display of the present invention
  • FIG. 4 is a schematic structural view of an enlarged embodiment of B in FIG.
  • the display 200 of this embodiment includes a circuit board 202, a display panel 201, and a PCB board 203, and the connection relationship thereof is the same as that of the display 100 shown in FIG. 1.
  • the display panel in this embodiment 201 is the same as the display panel 101 shown in FIG. 1, and the conductive film layer 2011 of the circuit board 202 and the display panel 201 are provided with pins 2021, 2012.
  • a plurality of bumps 2022, 2013 are disposed on the pins 2021, 2012 on the circuit board 202 and/or the conductive film layer 2011; the pins 2021 of the circuit board 202 and the pins 2012 of the conductive film layer 2011 pass through the bumps. From 2022, 2013 to connect accordingly.
  • This embodiment is exemplified by a front end surface of a lead provided on a wiring board and/or a conductive film layer.
  • the bumps may be disposed at other positions of the pins of the circuit board and/or the conductive film layer, and the wiring board and the conductive film layer can be connected by the bumps.
  • the protrusion may be provided only on the pin of the circuit board, or the protrusion may be provided only on the pin of the conductive film layer, or the protrusion may be provided on the lead of the circuit board and the conductive film layer. .
  • the circuit board and the conductive film layer can be directly contacted by the protrusions, thereby connecting the two.
  • the protrusion is disposed on a front end surface of the pin on the circuit board and/or the conductive film layer; of course, the protrusion may also be disposed at other positions of the pin on the circuit board and/or the conductive film layer, thereby enabling Both the wiring board and the conductive film layer may be connected.
  • a layer of adhesive 204 needs to be attached between the circuit board 202 and the display panel 201, and the circuit board 202 and the display panel 201 are pressed together by hot stamping to make the adhesive.
  • the glue 204 is filled in the gap between the lead 2021 of the wiring board 202 and the pin 2012 of the conductive film layer 2011, thereby bonding the wiring board 202 and the display panel 201 to each other. Therefore, the adhesive 20 is also provided between the lead 2021 of the wiring board 202 and the pin of the conductive film layer 2011.
  • the bonding between the pins of the circuit board and the pins of the conductive film layer is performed.
  • the glue can be a non-conductive glue without conductive particles.
  • the adhesive may also be a conductive paste with conductive particles, for example, an anisotropic conductive paste.
  • the circuit board may be a flexible circuit board according to the structural requirements of the display.
  • the protrusions 2022, 2013 may be provided as a spike structure.
  • the leads 2021, 2013 on the circuit board 202 and/or the conductive film layer 2011 are set to a spike structure, the circuit board 202 and/or the pin 2021 on the conductive film layer 2011, on 2012
  • the tips of the spiked structures are in contact with each other to achieve the connection between the two, and to increase the stability of the conduction performance between the wiring board and the conductive film layer.
  • the display of the embodiment adopts a plurality of protrusions on the pins on the conductive film layer of the circuit board and the display panel, so that the pins on the conductive film layer of the circuit board and the display panel pass the protrusions on the respective pins.
  • the connection no longer relies on the capture of the conductive particles in the conductive adhesive, can enhance the reliability of the communication between the circuit board and the conductive film layer, and improve the working stability of the display panel.
  • FIG. 6 is a schematic structural view of an embodiment of a pin structure of a circuit board of the present invention.
  • the lead structure 300 of the circuit board in this embodiment includes a circuit board 301 and a lead body 302.
  • the lead body 302 is disposed on the circuit board 301.
  • the front end surface of the lead body 302 is provided with a plurality of Bump 303.
  • the protrusion 303 is a spiked structure.
  • the present invention also provides a circuit board having a pin structure having the same pin structure as that of the circuit board or the display panel in the embodiment of the display shown in FIGS. 3 to 5. I will not repeat them here.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Liquid Crystal (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

一种显示器（200）、线路板（202）及其引脚结构，该显示器（200）包括线路板（202）和显示面板（201），所述线路板（202）和所述显示面板（201）的导电膜层（2011）均设置有引脚（2021,2012）；所述线路板（202）和/或所述导电膜层（2011）的所述引脚（2021,2012）上设置若干个凸起（2022,2013）；所述线路板（202）的引脚（2021）和所述导电膜层（2011）的引脚（2012）通过所述凸起（2022,2013）进行相应连接。液晶显示器（200）中线路板（202）与导电膜层（2011）通过各自引脚（2021,2012）上的凸起（2022,2013）连接，增强了线路板（202）与导电膜层（2011）之间连通的可靠性，提升了显示面板（201）的工作稳定性能。

Description

一种显示器、线路板及其引脚结构
【技术领域】
本发明涉及显示技术领域，具体而言涉及一种显示器、线路板及其引脚结构。
【背景技术】
随着显示技术的发展，人们越来越追求更高的显示清晰度，导致显示面板的导电膜层上的引脚之间的间距越来越小，且引脚的宽度也越来越小。
在传统的显示器中，通过热压贴合将线路板上的引脚与导电膜层上的引脚通过带有导电粒子的异方性导电胶贴合在一起，而线路板上的引脚与导电膜层上的引脚并不会直接导通，而是通过线路板上的引脚与导电膜层上的引脚对异方性导电胶中的导电粒子进行捕捉，进而实现线路板上的引脚与导电膜层上的引脚之间的导通；但随着引脚之间的间距越来越小，且引脚的宽度也越来越小，导致引脚对导电粒子的捕捉越来越困难，大大降低了线路板与导电膜层之间连通的可靠性，降低了显示面板的工作稳定性。
【发明内容】
有鉴于此，本发明提供一种显示器、线路板及其引脚结构，本发明的显示器能够增强其中线路板与导电膜层之间连通的可靠性。
为解决上述技术问题，本发明提出的一个技术方案是：提供一种显示器，包括：
线路板和显示面板，所述线路板和所述显示面板的导电膜层均设置有引脚；
所述线路板和/或所述导电膜层的所述引脚上设置若干个凸起；所述线路板的引脚和所述导电膜层的引脚通过所述凸起进行相应连接；
所述凸起为尖刺结构；所述凸起设置在所述线路板和/或所述导电膜层的所述引脚的前端表面。
本发明还提出的一个技术方案：提供一种线路板的引脚结构，包括线路板和引脚本体，所述引脚本体设置在所述线路板上，所述引脚本体上设有若干个凸起。
本发明还提出另一个技术方案：提供一种线路板，其中，所述线路板上包括线路板本体和引脚，所述引脚设置在所述线路板本体上，所述引脚上设有若干个凸起。
有益效果：区别于现有技术，本发明提供的显示器包括线路板和显示面板，所述线路板和所述显示面板的导电膜层均设置有引脚；所述线路板和/或所述导电膜层的所述引脚上设置若干个凸起；所述线路板的引脚和所述导电膜层的引脚通过所述凸起进行相应连接。本发明的液晶显示器可以使其中的线路板与导电膜层之间的导通不再依赖对异方性导电胶中的导电粒子的捕捉，其中的线路板与导电膜层可以直接通过各自引脚上的凸起直接连接，进而增强了线路板与导电膜层之间连通的可靠性，提升了显示面板的工作稳定性能。
【附图说明】
图1是现有技术的显示器100的结构示意图；
图2是图1中A内放大的结构示意图；
图3是本发明显示器一实施例的结构示意图；
图4是图3中B内放大后一实施例结构示意图；
图5是图3中B内放大后另一实施例结构示意图；
图6是本发明线路板的引脚结构一实施例的结构示意图。
【具体实施方式】
为使本领域的技术人员更好地理解本发明的技术方案，下面结合附图和具体实施例对本发明所提供的一种显示器、线路板及其引脚结构做进一步详细描述。在附图中，相同的标号在整个说明书和附图中用来表示相同的结构和区域。
参阅图1和图2，图1是现有技术的显示器100的结构示意图，图2是图1中A内放大的结构示意图，如图1和图2所示，现有技术中显示器100包括显示面板101、PCB板103和线路板102，显示面板101与PCB板103通过线路板102实现连接。因此，显示面板101和PCB板103均需要与线路板102连接。其中，线路板102的两侧均设有引脚（图1中未画出），PCB板103和显示面板101与线路板102连接的一侧设有与线路板102上的引脚对应的引脚。其中，线路板102与显示面板101的连接实际上是线路板102与显示面板101的导电膜层1011的连接。线路板102与显示面板101的导电膜层1011之间通过线路板102上的引脚1021和显示面板101的导电膜层1011上的引脚1012连接。现有技术中，引脚1021和引脚1012之间并没有实际接触，而是在线路板102上的引脚1021和导电膜层1011上的引脚1012之间填充带有导电粒子的导电胶104，通过线路板102上的引脚1021和导电膜层1011上的引脚1012对导电胶104中的导电粒子1041进行捕捉，将导电粒子1041捕捉至线路板102上的引脚1021和导电膜层1011上的引脚1012之间，进而实现线路板102上的引脚1021和导电膜层1011上的引脚1012的连接。
但随着对显示器清晰度的要求越来越高，线路板上的引脚之间的间距越来越小，且引脚的宽度也越来越小，同时导电膜层上的引脚也随之发生了相应变化，使线路板上的引脚和导电膜层上的引脚对异导电胶中的导电粒子的捕捉越来越困难，导致线路板上的引脚和导电膜层上的引脚的导通性能越来越不稳定。
参阅图3和图4，图3是本发明显示器一实施例的结构示意图，图4是图3中B内放大后一实施例结构示意图。如图3和图4所示，该实施例的显示器200包括线路板202、显示面板201和PCB板203，其连接关系与图1所示的显示器100相同；此外，本实施例中的显示面板201与图1所示的显示面板101也相同，线路板202和显示面板201的导电膜层2011上均设置有引脚2021，2012。本实施例中，线路板202和/或导电膜层2011上的引脚2021，2012上设置若干个凸起2022,2013；线路板202的引脚2021和导电膜层2011的引脚2012通过凸起2022,2013进行相应连接。本实施例以凸起设置在线路板和/或导电膜层的引脚的前端表面为例。当然，在其他实施例中，凸起还可以设置在线路板和/或导电膜层的引脚的其他位置上，能够通过该凸起使线路板和导电膜层连接即可。
本实施例中，可以仅在线路板的引脚上设置凸起，也可以仅在导电膜层的引脚上设置凸起，也可以在线路板和导电膜层的引脚上均设置凸起。
本实施例通过在线路板和/或导电膜层的引脚上设置凸起，使线路板和导电膜层可以通过该凸起直接接触，进而使两者连接。可选的，凸起设置在线路板和/或导电膜层上的引脚的前端表面；当然，凸起也可以设置在线路板和/或导电膜层上的引脚的其他位置，能够使线路板和导电膜层两者连接即可。
进一步的，在显示器的制备过程中，需要在线路板202与显示面板201之间贴附一层粘合胶204，利用热帖压合的方式将线路板202与显示面板201压合，使粘合胶204填充在线路板202的引脚2021和导电膜层2011的引脚2012之间的空隙内，进而使线路板202与显示面板201互相粘合。因此，线路板202的引脚2021和导电膜层2011的引脚之间还具有粘合胶204。
在本实施例中，由于线路板的引脚和导电膜层的引脚能够通过各自引脚上的凸起进行相应连接，因此，路板的引脚和导电膜层的引脚之间的粘合胶可以是不带有导电粒子的非导电胶。此外，该粘合胶也可以是带有导电粒子的导电胶，例如，异方性导电胶。
进一步的，根据显示器的结构需求，线路板可以为柔性线路板。
进一步的，如图5所示，该凸起2022,2013可以设置为尖刺结构。将线路板202和/或导电膜层2011上的引脚2021，2012上的凸起2022，2013设置为尖刺结构，线路板202和/或导电膜层2011上的引脚2021,2012上的尖刺结构的尖端彼此接触，即可实现两者的连接，增加线路板和导电膜层之间的导通性能的稳定性。
本实施例的显示器通过将其中线路板和显示面板的导电膜层上的引脚上设置若干个凸起，使线路板和显示面板的导电膜层上的引脚通过各自引脚上的凸起连接，不再依赖对导电胶中的导电粒子的捕捉，能够增强线路板与导电膜层之间连通的可靠性，提升显示面板的工作稳定性能。
参阅图6，图6是本发明线路板的引脚结构一实施例的结构示意图。如图6所示，本实施例中的线路板的引脚结构300包括线路板301和引脚本体302，引脚本体302设置在线路板301上，引脚本体302的前端表面设置有若干个凸起303。
进一步的，该凸起303为尖刺结构。
进一步的，本发明还提出了一种具有引脚结构的线路板，该线路板的引脚结构与图3至图5所示的显示器一实施例中线路板或显示面板上的引脚相同，此处不再赘述。
以上仅为本发明的实施例，并非因此限制本发明的专利保护范围，凡是利用本发明说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本发明的专利保护范围。

Claims (12)

  1. 一种显示器，其中，包括：线路板和显示面板，所述线路板和所述显示面板的导电膜层均设置有引脚；所述线路板和/或所述导电膜层的所述引脚上设置若干个凸起；所述线路板的引脚和所述导电膜层的引脚通过所述凸起进行相应连接；
    所述凸起为尖刺结构；
    所述凸起设置在所述线路板和/或所述导电膜层的所述引脚的前端表面。
  2. 根据权利要求1所述的显示器，其中，所述线路板的引脚和所述导电膜层的引脚之间还包括粘合胶。
  3. 根据权利要求2所述的显示器，其中，所述粘合胶为带有导电粒子的导电胶或不带有导电粒子的非导电胶。
  4. 根据权利要求1所述的显示器，其中，所述线路板为柔性线路板。
  5. 一种线路板的引脚结构，其中，包括线路板和引脚本体，所述引脚本体设置在所述线路板上，所述引脚本体上设有若干个凸起。
  6. 根据权利要求5所述的引脚结构，其中，所述凸起为尖刺结构。
  7. 根据权利要求5所述的引脚结构，其中，所述凸起设置在所述引脚的前端表面。
  8. 一种线路板，其中，所述线路板上包括线路板本体和引脚，所述引脚设置在所述线路板本体上，所述引脚上设有若干个凸起。
  9. 根据权利要求8所述的线路板，其中，所述凸起设置在所述引脚的前端表面。
  10. 根据权利要求8所述的线路板，其中，所述凸起为尖刺结构。
  11. 根据权利要求8所述的线路板，其中，所述线路板本体为柔性线路板。
  12. 根据权利要求8所述的线路板，其中，所述凸起用于与显示器的显示面板的导电膜层连接。
PCT/CN2017/075932 2017-02-07 2017-03-08 一种显示器、线路板及其引脚结构 Ceased WO2018145341A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201710067973.0A CN106658988A (zh) 2017-02-07 2017-02-07 一种显示器、线路板及其引脚结构
CN201710067973.0 2017-02-07

Publications (1)

Publication Number Publication Date
WO2018145341A1 true WO2018145341A1 (zh) 2018-08-16

Family

ID=58845377

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2017/075932 Ceased WO2018145341A1 (zh) 2017-02-07 2017-03-08 一种显示器、线路板及其引脚结构

Country Status (2)

Country Link
CN (1) CN106658988A (zh)
WO (1) WO2018145341A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI810768B (zh) * 2021-12-27 2023-08-01 嘉聯益科技股份有限公司 電路板及電路板的製作方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1619807A (zh) * 2004-12-06 2005-05-25 友达光电股份有限公司 包括集成电路芯片的基板及其上的集成电路
CN2735377Y (zh) * 2004-08-31 2005-10-19 鸿富锦精密工业（深圳）有限公司 覆晶结构
CN101141027A (zh) * 2007-09-20 2008-03-12 友达光电（苏州）有限公司 平面显示器基板的电路连接结构与其连接方法
CN204215117U (zh) * 2014-12-02 2015-03-18 昆山国显光电有限公司 显示装置
CN204833208U (zh) * 2015-07-28 2015-12-02 南昌欧菲光科技有限公司 触控产品及其电连接装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2735377Y (zh) * 2004-08-31 2005-10-19 鸿富锦精密工业（深圳）有限公司 覆晶结构
CN1619807A (zh) * 2004-12-06 2005-05-25 友达光电股份有限公司 包括集成电路芯片的基板及其上的集成电路
CN101141027A (zh) * 2007-09-20 2008-03-12 友达光电（苏州）有限公司 平面显示器基板的电路连接结构与其连接方法
CN204215117U (zh) * 2014-12-02 2015-03-18 昆山国显光电有限公司 显示装置
CN204833208U (zh) * 2015-07-28 2015-12-02 南昌欧菲光科技有限公司 触控产品及其电连接装置

Also Published As

Publication number Publication date
CN106658988A (zh) 2017-05-10

Similar Documents

Publication Publication Date Title
TWI741885B (zh) 顯示裝置
TWI486106B (zh) 引腳結構與引腳連接結構
WO2018176545A1 (zh) 显示模组及终端
WO2013152646A1 (zh) 接合结构
WO2019200654A1 (zh) 显示面板及其显示装置
JPWO2002021199A1 (ja) 液晶表示装置
WO2019227695A1 (zh) 一种阵列基板、显示面板及显示设备
WO2020215465A1 (zh) 显示面板
WO2022032718A1 (zh) 一种显示面板及显示装置
WO2014153897A1 (zh) 透明导电膜
WO2018119572A1 (zh) 显示装置及电子装置及显示装置的制造方法
WO2019095500A1 (zh) 一种显示面板以及显示器
WO2018145341A1 (zh) 一种显示器、线路板及其引脚结构
WO2013166742A1 (zh) 液晶显示模组及液晶显示装置
TW200949341A (en) Liquid crystal panel with built-in touch control board and integrated circuit
CN209118667U (zh) 显示面板及显示装置
WO2018170965A1 (zh) 含Home键的移动终端及其显示面板
WO2018032997A1 (zh) 触控基板和触控显示装置
CN209297656U (zh) 一种柔性显示面板及显示装置
JPS6329729A (ja) 液晶セル
WO2017201892A1 (zh) 显示器、多段电路板及其制造方法
JP2003336016A (ja) 異方導電性両面テープとそれを用いた電子部品の実装方法
WO2022041874A1 (zh) 焊接结构和显示模组
CN112130700A (zh) 柔性电路板、触控装置及终端
CN106601141B (zh) Oled显示模组、显示装置及该显示模组的制备方法

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 17895890

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 17895890

Country of ref document: EP

Kind code of ref document: A1