WO2018141295A1 - 摄像模组及其模制电路板组件、电路板以及应用 - Google Patents

摄像模组及其模制电路板组件、电路板以及应用 Download PDF

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Publication number
WO2018141295A1
WO2018141295A1 PCT/CN2018/075334 CN2018075334W WO2018141295A1 WO 2018141295 A1 WO2018141295 A1 WO 2018141295A1 CN 2018075334 W CN2018075334 W CN 2018075334W WO 2018141295 A1 WO2018141295 A1 WO 2018141295A1
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WO
WIPO (PCT)
Prior art keywords
substrate
circuit board
circuit
photosensitive chip
photosensitive
Prior art date
Application number
PCT/CN2018/075334
Other languages
English (en)
French (fr)
Chinese (zh)
Inventor
王明珠
程端良
席逢生
赵波杰
田中武彦
黄桢
陈振宇
郭楠
Original Assignee
宁波舜宇光电信息有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 宁波舜宇光电信息有限公司 filed Critical 宁波舜宇光电信息有限公司
Priority to KR1020217026115A priority Critical patent/KR102431381B1/ko
Priority to US16/483,150 priority patent/US11039052B2/en
Priority to KR1020197025226A priority patent/KR102303294B1/ko
Priority to KR1020217002179A priority patent/KR102350661B1/ko
Priority to EP18748678.2A priority patent/EP3579537A4/en
Priority to JP2019542096A priority patent/JP7104711B2/ja
Priority to CN201880005176.2A priority patent/CN110089102B/zh
Publication of WO2018141295A1 publication Critical patent/WO2018141295A1/zh
Priority to US17/314,723 priority patent/US11451693B2/en

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
    • G01S17/02—Systems using the reflection of electromagnetic waves other than radio waves
    • G01S17/06—Systems determining position data of a target
    • G01S17/08—Systems determining position data of a target for measuring distance only
    • G01S17/32—Systems determining position data of a target for measuring distance only using transmission of continuous waves, whether amplitude-, frequency-, or phase-modulated, or unmodulated
    • G01S17/36—Systems determining position data of a target for measuring distance only using transmission of continuous waves, whether amplitude-, frequency-, or phase-modulated, or unmodulated with phase comparison between the received signal and the contemporaneously transmitted signal
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09972—Partitioned, e.g. portions of a PCB dedicated to different functions; Boundary lines therefore; Portions of a PCB being processed separately or differently
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10121—Optical component, e.g. opto-electronic component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10424—Frame holders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1327—Moulding over PCB locally or completely

Definitions

  • the present invention relates to the field of optical imaging, and more particularly to a camera module and its molded circuit board assembly, circuit board and application.
  • the rapid development of technology has made electronic devices more and more oriented towards high-performance and intelligent development.
  • the intelligence of electronic devices depends on the camera modules that are deployed in electronic devices, especially the imaging quality of camera modules.
  • signal transmission capabilities have a greater impact on the intelligence of electronic devices.
  • the size of the camera module (including the circumferential size and height dimension) also affects the lightness and thinness of the electronic device. Therefore, how to improve the imaging quality and signal of the camera module based on the size of the camera module is reduced. Transmission capacity has become a technical problem that the industry needs to solve.
  • a circuit board 10P of a conventional camera module is shown in FIG. 1, wherein a digital circuit portion 11P and an analog circuit portion 12P are provided on the circuit board 10P, and the digital circuit portion 11P and the analog circuit are provided.
  • the portion 12P is electrically communicable, wherein the circuit of the digital circuit portion 11P and the circuit of the analog circuit portion 12P are arranged in a mixed manner, and at least one photosensitive chip is turned on by the digital circuit portion 11P .
  • the digital circuit portion 11P is for processing a digital signal, wherein the digital signal includes MIPI (digital transmission type data signal), IIC (digital control type signal), MCLK (digital clock signal), DVDD/DGND (digital power supply), and the like.
  • the analog circuit portion 12P is for processing an analog signal, wherein the analog signal includes AVDD (analog power supply), VTG/VRGSL (analog voltage reference), and the like. It will be understood by those skilled in the art that the digital circuit portion 11P performs the communication in the high and low peak signal communication of the current when processing and transmitting the digital signal, and the circuit of the digital circuit portion 11P is transmitting the digital signal. When electromagnetic waves are generated in the vicinity of the circuit, the analog circuit portion 12P processes and transmits the analog signal in a fine microwave-driven communication manner of current and voltage, which causes the analog circuit portion 12P to transmit the analog signal. It is susceptible to interference from electromagnetic waves.
  • the circuit board 10P of the existing camera module is arranged in such a manner that the circuits of the digital circuit portion 11P and the circuits of the analog circuit portion 12P are mixed together, resulting in the processing and transmission of the analog circuit portion 12.
  • the analog signal is described, it is susceptible to interference of electromagnetic waves generated by the circuit of the digital circuit unit 11P to reduce the transmission processing and signals of the circuit board 10P, thereby affecting the performance of the image pickup module.
  • the circuit portion 10P of the conventional camera module is arranged such that the circuit of the digital circuit portion 11P and the circuit of the analog circuit portion 12P are mixed together, not only the circuit board 10P is added. The complexity of the circuit and the reliability of the circuit board 10P are reduced.
  • An object of the present invention is to provide a camera module and a molded circuit board assembly therefor, a circuit board and an application thereof, wherein the circuit board includes a digital circuit portion and an analog circuit portion, the digital circuit portion and the analog circuit The portion is communicably turned on, and electromagnetic waves generated by the circuitry of the digital circuit portion are prevented from interfering with the electrical signal processed and transmitted by the analog circuit portion.
  • An object of the present invention is to provide a camera module, a molded circuit board assembly, a circuit board, and an application thereof, wherein the circuit board includes a substrate, and the digital circuit portion and the analog circuit portion can be respectively formed in the Different regions of the substrate are capable of forming the safe distance between the analog circuit portion and the digital circuit portion.
  • An object of the present invention is to provide a camera module and a molded circuit board assembly therefor, and a circuit board assembly, wherein the substrate has at least one chip holding portion for holding at least one photosensitive chip, wherein the The photoreceptor chip and the digital circuit portion of the chip holding portion of the substrate are electrically connected to the analog circuit portion.
  • An object of the present invention is to provide a camera module, a molded circuit board assembly, a circuit board and an application thereof, wherein the size of the camera module can be reduced, so that the camera module is particularly suitable for application.
  • An object of the present invention is to provide a camera module and a molded circuit board assembly therefor, and a circuit board assembly, wherein the substrate has at least one receiving space to form the chip holding portion, wherein the photosensitive chip is accommodated in The accommodation space is configured to sink the photosensitive chip, and in this manner, the height dimension of the camera module can be reduced.
  • An object of the present invention is to provide a camera module and a molded circuit board assembly therefor, a circuit board and an application, wherein the photosensitive chip is housed in the accommodating space to sink the photosensitive chip in such a manner
  • the height difference between the upper surface of the photosensitive chip and the upper surface of the substrate can be reduced, even the upper surface of the photosensitive chip and the upper surface of the substrate are flush, or the upper surface of the photosensitive chip is low
  • the upper surface of the substrate is used to reduce the height dimension of the camera module.
  • An object of the present invention is to provide a camera module and a molded circuit board assembly therefor, and a circuit board assembly, wherein at least a portion of the circuit of the analog circuit portion extends along a width direction of the substrate, such that the The circuit board's circuitry is more compact and sensible.
  • An object of the present invention is to provide a camera module, a molded circuit board assembly, a circuit board, and an application thereof, wherein the camera module provides a molded base, and the molded base can be integrally coupled to the In this way, the size of the camera module can be reduced, so that the camera module is particularly suitable for being applied to electronic devices that are thin and thin.
  • An object of the present invention is to provide a camera module, a molded circuit board assembly, a circuit board, and an application thereof, wherein the molded base can also be integrally coupled to a non-photosensitive area of the photosensitive chip to enable the The photosensitive chip, the molded base, and the circuit board are integrally combined.
  • An object of the present invention is to provide a camera module, a molded circuit board assembly, a circuit board and an application thereof, wherein the molded base can reinforce the strength of the circuit board, so that the circuit board can be selected to have a greater thickness.
  • a thin sheet of material is used to reduce the height dimension of the camera module.
  • An object of the present invention is to provide a camera module and a molded circuit board assembly, a circuit board and an application thereof, wherein the camera module further provides a protection portion, wherein the protection is performed before the molding base is formed The portion is located between the circuit board and an upper mold of a molding die to protect the circuit board.
  • An object of the present invention is to provide a camera module and a molded circuit board assembly therefor, a circuit board and an application, wherein the protection portion is located between the circuit board and an upper mold of the molding die, thereby forming the molding When the upper mold of the mold contacts the circuit board to generate an impact force, the protection portion can absorb the impact force to prevent the impact force from directly acting on the circuit board, thereby protecting the circuit board to avoid the circuit board. Damage deformation.
  • An object of the present invention is to provide a camera module and a molded circuit board assembly therefor, a circuit board and an application, wherein the protection portion is located between the circuit board and an upper mold of the molding die, thereby forming the molding When the upper mold of the mold contacts the circuit board to generate an impact force, the protection portion can act as a buffer to prevent the impact force from striking the circuit board, thereby protecting the circuit board to avoid damage to the circuit board. Deformation.
  • An object of the present invention is to provide a camera module and a molded circuit board assembly therefor, a circuit board and an application, wherein the protection portion is located between the circuit board and an upper mold of the molding die to block a gap is formed between the upper surface of the circuit board and the pressing surface of the upper mold of the molding die, so that when the molding base is molded, the chip holding of the molding material can be prevented from entering the substrate. To prevent contamination of the sensor chip.
  • An object of the present invention is to provide a camera module and a molded circuit board assembly therefor, a circuit board and an application, wherein the protection portion is located between the circuit board and an upper mold of the molding die to block A gap is formed between the pressing faces of the upper mold of the molding die on the upper surface of the circuit board, so that when the molding base is molded, the molding material can be prevented from leaking and a "flash" phenomenon occurs.
  • An object of the present invention is to provide a camera module, a molded circuit board assembly, a circuit board and an application thereof, wherein the protection portion is disposed on a pressing surface of an upper mold of the molding die, thereby forming a molding die When the upper mold is pressed against the upper surface of the circuit board, the protection portion is held between the upper mold of the molding die and the circuit board.
  • An object of the present invention is to provide a camera module, a molded circuit board assembly, a circuit board and an application thereof, wherein the protection portion is disposed on an upper surface of the circuit board, thereby applying a mold on the molding die The protective portion is held between the upper mold of the molding die and the circuit board when pressed against the upper surface of the circuit board.
  • the invention provides a circuit board comprising:
  • the digital circuit portion and the analog circuit portion are respectively formed on the substrate, and the digital circuit portion and the analog circuit portion are electrically connected to each other, wherein at least a portion of the analog circuit portion There is a safe distance from the digital circuit portion.
  • between 40% and 100% of the portion of the analog circuit portion and the digital circuit portion have the safety distance.
  • between 70% and 99% of the portion of the analog circuit portion and the digital circuit portion have the safety distance.
  • the parameter of the width dimension of the safety distance formed between the analog circuit portion and the digital circuit portion is L1, wherein the value of the parameter L1 of the width dimension of the safety distance is The range is: 0.02 mm ⁇ L1 ⁇ 0.5 mm.
  • the parameter L1 of the width dimension of the safety distance has a value range of: 0.1 mm ⁇ L1 ⁇ 0.4 mm.
  • the shape of the analog circuit portion is selected from the group consisting of an L shape, a C shape, and an unclosed O shape.
  • the substrate has at least one receiving space for accommodating a photosensitive chip.
  • the substrate comprises two or more layers of sheet material that overlap each other.
  • the number of layers of the sheet layer of the substrate ranges from 2 to 20.
  • the number of layers of the sheet layer of the substrate ranges from 4 to 10.
  • the substrate has at least one communication hole and includes at least one circuit connector, wherein each of the communication holes of the substrate respectively communicates with two adjacent layers of the plate layer, each of the Circuit connectors are respectively formed on inner walls of the substrate that are used to form the communication holes, and each of the circuit connectors respectively electrically connects the circuits of two adjacent plate layers.
  • the circuits on each of the sheet layers are respectively a horizontally extending circuit and a vertically extending circuit, and the horizontally extending circuit extends along a length direction and/or a width direction of the sheet layer.
  • the vertical extension circuit extends along a vertical direction of the sheet layer, wherein the vertical extension circuit of one of the sheet layers is turned on by the circuit connector and the horizontal extension circuit adjacent to the sheet layer Ground connection.
  • the diameter parameter of the communication hole is a
  • the width parameter of the circuit is b
  • the minimum distance parameter of the adjacent circuit or the adjacent communication hole is c
  • the minimum distance parameter of the edge of the substrate to the edge of the analog circuit area is d
  • the parameter of the narrowest side width dimension of the substrate is e, wherein the value range of the parameter e is: [2*d+min( a, b) * 2 + c] ⁇ [2 * d + 10 * max (a, b) + 9 * c].
  • the value range of the parameter e is: [2*d+2*max(a,b)+c] ⁇ [2*d+4*max(a,b)+3*c ].
  • the thickness of the sheet layer of the substrate ranges from 0.005 mm to 0.5 mm.
  • the thickness of the sheet layer of the substrate ranges from 0.01 mm to 0.2 mm.
  • the present invention further provides a molded circuit board assembly comprising:
  • At least one photosensitive chip At least one photosensitive chip
  • a molded base wherein the molded base has at least one light window
  • At least one circuit board wherein the circuit board includes a digital circuit portion, an analog circuit portion, and a substrate, wherein the digital circuit portion and the analog circuit portion are respectively formed on the substrate, and the digital circuit portion and The analog circuit portions are electrically connected to each other, wherein at least a portion of the analog circuit portion and the digital circuit portion have a safe distance, wherein the photosensitive chip is held at a chip holding portion of the circuit board And the photosensitive chip is electrically connected to at least one of the analog circuit portion and the digital circuit portion of the circuit board, wherein the molding base is integrally coupled to the substrate, And the photosensitive area of the photosensitive chip corresponds to the light window of the molding base.
  • the molding base integrally bonds the non-photosensitive area of the photosensitive chip.
  • the photosensitive chip is attached to the chip holding portion of the photosensitive chip.
  • the molded circuit board assembly further includes at least one electronic component, wherein each of the electronic components is respectively mounted on the substrate, or each of the electronic components is respectively All or part of the substrate is buried, and each of the electronic components is electrically connected to the digital circuit portion or the analog circuit portion.
  • a camera module comprising:
  • At least one optical lens At least one optical lens
  • At least one sensor chip At least one sensor chip
  • At least one circuit board wherein the circuit board includes a digital circuit portion, an analog circuit portion, and a substrate, wherein the digital circuit portion and the analog circuit portion are respectively formed on the substrate, and the digital circuit portion and The analog circuit portions are electrically connected to each other, wherein at least a portion of the analog circuit portion and the digital circuit portion have a safe distance, wherein the photosensitive chip is held at a chip holding portion of the circuit board And the photosensitive chip is electrically connected to at least one of the analog circuit portion and the digital circuit portion of the circuit board, and the optical lens is held in a photosensitive path of the photosensitive chip.
  • the camera module further includes at least one lens holder, wherein the lens holder has at least one light passage, wherein the lens holder is mounted on the circuit board, and the photosensitive chip
  • the photosensitive area corresponds to the light passing passage of the lens holder, and the light passing passage of the lens holder forms a light path between the photosensitive chip and the optical lens.
  • the camera module further includes a molded base, wherein the molded base has at least one light window, wherein the molded base is integrally coupled to the circuit board.
  • the molding base surrounds the photosensitive region of the photosensitive chip such that a photosensitive region of the photosensitive chip corresponds to the light window of the molding base, and the mirror holder The light passage forms a light path between the photosensitive chip and the optical lens.
  • the molding base integrally bonds the non-photosensitive area of the photosensitive chip.
  • the photosensitive chip is attached to the chip holding portion of the photosensitive chip.
  • the camera module further includes at least one bracket and at least one filter element, the bracket has at least one light passing hole, and the filter element is mounted on the bracket, the bracket Mounted on the molding base to hold the filter element between the optical lens and the photosensitive chip by the bracket.
  • the camera module further includes at least one electronic component, wherein each of the electronic components is respectively mounted on the substrate, or each of the electronic components is respectively Partially buried in the substrate, and each of the electronic components is electrically connected to the digital circuit portion or the analog circuit portion.
  • the present invention further provides an electronic device, including an electronic device body and a camera module disposed on the electronic device body, wherein the camera module includes:
  • At least one optical lens At least one optical lens
  • At least one sensor chip At least one sensor chip
  • At least one circuit board wherein the circuit board includes a digital circuit portion, an analog circuit portion, and a substrate, wherein the digital circuit portion and the analog circuit portion are respectively formed on the substrate, and the digital circuit portion and The analog circuit portions are electrically connected to each other, wherein at least a portion of the analog circuit portion and the digital circuit portion have a safe distance, wherein the photosensitive chip is held at a chip holding portion of the circuit board And the photosensitive chip is electrically connected to at least one of the analog circuit portion and the digital circuit portion of the circuit board, and the optical lens is held in a photosensitive path of the photosensitive chip.
  • the electronic device body is a smart phone, a tablet computer, a personal digital assistant, an electronic paper book, an MP3/4/5, an e-book, a calculator.
  • the present invention provides a molded circuit board assembly comprising:
  • At least one photosensitive chip At least one photosensitive chip
  • a molded base wherein the molded base has at least one light window
  • At least one circuit board wherein the circuit board further includes a substrate, wherein the substrate has at least one chip holding portion, at least one protection area surrounding the chip holding portion, and at least around the periphery of the protection area a bonding region, wherein the photosensitive chip is held at the chip holding portion of the substrate, wherein the protecting portion is located at least in the protective region of the substrate, wherein the molding base is integrally coupled to the substrate The bonding region of the substrate, and the molding base surrounds the photosensitive region of the photosensitive chip such that the photosensitive region of the photosensitive chip corresponds to the light window of the molding base.
  • the protection portion is provided at least in the protective region of the substrate.
  • the protection portion is formed at least in the protective region of the substrate.
  • the protection portion is disposed on the protective region and the bonding region of the substrate.
  • the protection portion is formed on the protective region and the bonding region of the substrate.
  • the protection portion is formed of ink applied to the substrate.
  • the protection portion is formed by glue applied to the substrate.
  • the protection portion has at least one opening, and the photosensitive area of the photosensitive chip corresponds to the opening of the protection portion.
  • the molding base is integrally bonded to the non-photosensitive area of the photosensitive chip.
  • the present invention further provides a camera module including at least one optical lens and a molded circuit board assembly, wherein the molded circuit board assembly includes:
  • At least one photosensitive chip At least one photosensitive chip
  • a molded base wherein the molded base has at least one light window
  • the circuit board further includes a substrate, wherein the substrate has at least one chip holding portion, at least one protection area surrounding the chip holding portion, and at least around the periphery of the protection area a bonding region, wherein the photosensitive chip is held at the chip holding portion of the substrate, wherein the protecting portion is located at least in the protective region of the substrate, wherein the molding base is integrally coupled to the substrate The bonding region of the substrate, and the molding base surrounds the photosensitive region of the photosensitive chip such that the photosensitive region of the photosensitive chip corresponds to the light window of the molding base, Wherein the optical lens is held in a photosensitive path of the photosensitive chip, and the light window of the molded base forms a light path between the photosensitive chip and the optical lens.
  • the camera module further includes at least one bracket and at least one filter element, the bracket has at least one light passing hole, and the filter element is mounted on the bracket, the bracket Mounted on the molding base to hold the filter element between the optical lens and the photosensitive chip by the bracket.
  • the present invention further provides an electronic device including an electronic device body and at least one of the camera modules disposed on the electronic device body, wherein the camera module includes at least one optical a lens and a molded circuit board assembly, wherein the molded circuit board assembly comprises:
  • At least one photosensitive chip At least one photosensitive chip
  • a molded base wherein the molded base has at least one light window
  • the circuit board further includes a substrate, wherein the substrate has at least one chip holding portion, at least one protection area surrounding the chip holding portion, and at least around the periphery of the protection area a bonding region, wherein the photosensitive chip is held at the chip holding portion of the substrate, wherein the protecting portion is located at least in the protective region of the substrate, wherein the molding base is integrally coupled to the substrate The bonding region of the substrate, and the molding base surrounds the photosensitive region of the photosensitive chip such that the photosensitive region of the photosensitive chip corresponds to the light window of the molding base, Wherein the optical lens is held in a photosensitive path of the photosensitive chip, and the light window of the molded base forms a light path between the photosensitive chip and the optical lens.
  • the electronic device body is a smart phone, a tablet computer, a personal digital assistant, an electronic paper book, an MP3/4/5, an e-book, a calculator.
  • the present invention further provides a method of fabricating a molded circuit board assembly, wherein the manufacturing method comprises the following steps:
  • the method further comprises the steps of:
  • At least the protection portion is disposed on the protective region of the substrate.
  • the method further comprises the steps of:
  • the protection portion is further formed on the bonding region of the substrate.
  • the method further includes the step of applying at least ink to the protective region of the substrate to borrow The protective portion is formed by the ink in the protective region of the substrate.
  • the method further includes the step of applying at least glue to the protective region of the substrate to borrow The protective portion is formed by the glue on the protective region of the substrate.
  • the method further comprises the steps of:
  • a molding material added to the molding space is cured such that the molding material forms the molding base bonded to the bonding region of the substrate.
  • the present invention further provides a method of manufacturing a camera module, wherein the manufacturing method comprises the following steps:
  • FIG. 1 is a schematic diagram of a circuit board of a conventional camera module.
  • FIG. 2 is a perspective view of an electronic device in accordance with a preferred embodiment of the present invention.
  • FIG 3 is a perspective view of a camera module according to the above preferred embodiment of the present invention.
  • FIG. 4A is a schematic view of the camera module according to the above preferred embodiment of the present invention taken along an intermediate position.
  • 4B is a schematic view showing a modified embodiment of the camera module according to the above preferred embodiment of the present invention, taken along the intermediate position.
  • 4C is a schematic view showing another modified embodiment of the camera module according to the above preferred embodiment of the present invention, which is cut along an intermediate position.
  • 4D is a schematic view showing another modified embodiment of the camera module according to the above preferred embodiment of the present invention, which is cut along an intermediate position.
  • FIG. 5 is a top plan view of a circuit board of the camera module according to the above preferred embodiment of the present invention, illustrating a relationship between a digital circuit portion, an analog circuit portion, and a substrate of the circuit board.
  • FIG. 6 is a top plan view of the circuit board of the camera module according to the above preferred embodiment of the present invention, illustrating the relationship between the digital circuit portion of the circuit board and the substrate.
  • FIG. 7 is a top plan view of the circuit board of the camera module according to the above preferred embodiment of the present invention, illustrating the relationship between the analog circuit portion of the circuit board and the substrate.
  • FIG. 8 is a top plan view showing a modified embodiment of the circuit board of the camera module according to the above preferred embodiment of the present invention, illustrating the digital circuit portion and the analog circuit of the circuit board The relationship between the part and the substrate.
  • FIG. 9 is a partial schematic view of the circuit board of the camera module according to the above preferred embodiment of the present invention.
  • FIG. 10 is a schematic diagram showing the circuit layout principle of the circuit board of the camera module according to the above preferred embodiment of the present invention.
  • Figure 11 is a schematic illustration of a first manufacturing step of the camera module in accordance with the above-described preferred embodiment of the present invention.
  • FIG. 12A is a schematic diagram showing a second manufacturing step of the camera module according to the above preferred embodiment of the present invention.
  • FIG. 12B is a schematic diagram showing a first optional modification step of the second manufacturing step of the camera module according to the above preferred embodiment of the present invention.
  • FIG. 12C is a schematic diagram showing a second optional modification step of the second manufacturing step of the camera module according to the above preferred embodiment of the present invention.
  • Figure 13 is a schematic illustration of a third manufacturing step of the camera module in accordance with the above-described preferred embodiment of the present invention.
  • Figure 14 is a schematic illustration of a fourth manufacturing step of the camera module in accordance with the above-described preferred embodiment of the present invention.
  • Figure 15 is a schematic illustration of a fifth manufacturing step of the camera module in accordance with the above-described preferred embodiment of the present invention.
  • FIG. 16 is a schematic diagram showing a sixth manufacturing step of the camera module according to the above preferred embodiment of the present invention.
  • Figure 17 is a schematic illustration of a seventh manufacturing step of the camera module in accordance with the above-described preferred embodiment of the present invention.
  • FIG. 18 is a schematic illustration of an eighth manufacturing step of the camera module in accordance with the above-described preferred embodiment of the present invention.
  • Figure 19 is a schematic illustration of a ninth manufacturing step of the camera module in accordance with the above-described preferred embodiment of the present invention.
  • FIG. 20A is a schematic diagram showing the interference of the tested MIPI signal of the camera module according to the above preferred embodiment of the present invention.
  • FIG. 20B is a schematic diagram of the interference of the tested MIPI signal of the prior art camera module.
  • the term “a” is understood to mean “at least one” or “one or more”, that is, in one embodiment, the number of one element may be one, and in other embodiments, the element The number can be multiple, and the term “a” cannot be construed as limiting the quantity.
  • a camera module 1 in accordance with a preferred embodiment of the present invention is illustrated in the following description, wherein one or more of the camera modules 1 It can be disposed on an electronic device body 2 to form an electronic device, and the camera module 1 is used to help the electronic device acquire an image.
  • the camera module 1 is disposed at the rear of the electronic device body 2 as an example, and those skilled in the art It can be understood that, in other examples of the electronic device, the camera module 1 may also be disposed at a front portion or other position of the electronic device body 2, or at least one of the camera modules 1 is set. A front portion of the electronic device body 2 and at least one of the camera modules 1 are disposed at a rear portion of the electronic device body 2. Therefore, the specific example of the electronic device shown in FIG. 2 should not be considered as limiting the content and scope of the camera module 1 of the present invention.
  • the type of the electronic device body 2 is also not limited, for example, the electronic device body 2 can be implemented as a smart phone such as that shown in FIG. 2, in other examples, The electronic device body 2 can also be implemented as, but not limited to, a tablet computer, a personal digital assistant, an electronic paper book, an MP3/4/5, an e-book, a calculator, and the like.
  • the camera module 1 can be implemented as a single-lens camera module, or can be implemented as an array camera module, such as a dual-lens camera module, a three-lens camera module, and the like.
  • the camera module 1 is implemented as a single-lens camera module as an example to illustrate the features and advantages of the camera module 1 of the present invention, but it should not be regarded as Limitations on the content and scope of the camera module 1 of the present invention.
  • the camera module 1 includes at least one optical lens 10, at least one sensor chip 20, and at least one circuit board 30, wherein The photosensitive chip 20 and the circuit board 30 are turned on, and the optical lens 10 is held in a photosensitive path of the photosensitive chip 20, wherein light reflected by the object enters the camera module 1 from the optical lens 10. The interior is then received by the sensor chip 20 and photoelectrically converted to form an electrical signal relating to the image of the object.
  • the circuit board 30 may be electrically connected to the electronic device body 2, wherein the electrical signal can be transmitted from the photosensitive chip 20 to the electronic device body 2 by the circuit board 30 to enable the electrical
  • the signal is stored in the electronic device body 2, or an image about the object can be displayed through the display screen of the electronic device body 2. That is, the electronic device body 2 can convert the electrical signal about the image of the object formed by the photosensitive chip 20 into an image format, and can be displayed through the display screen of the electronic device body 2.
  • the camera module 1 further includes a molded base 40, wherein the molded base 40 has at least one light window 41, wherein the molded base 40 can be integrally coupled to the same
  • the circuit board 30 is configured such that the photosensitive area of the photosensitive chip 20 can correspond to the light window 41 of the molding base 40, so that the light window 41 of the molding base 40 forms the photosensitive a light passing path of the chip 20 and the optical lens 10 to allow light reflected by an object from the optical lens 10 to enter the inside of the camera module 1 to pass through the light window 41 The light path is then received by the photosensitive chip 20 and photoelectrically converted.
  • the molding base 40 may be integrally bonded to the circuit board 30, and then the photosensitive chip 20 may be electrically conducted through the light window 41 of the molding base 40.
  • the circuit board 30 is described.
  • the photosensitive chip 20 and the circuit board 30 may be turned on first, and then the molded base 40 may be integrally coupled to the circuit board 30.
  • the camera module 1 of the present invention is not limited in this regard.
  • the molding base 40 may further be integrally combined with at least a portion of the non-photosensitive area of the photosensitive chip 20 such that the molding base 40, the circuit board 30, and the photosensitive chip 20 Combine into one.
  • the photosensitive chip 20 and the circuit board 30 may be electrically connected first, and then the molding base 40 is integrally coupled to the circuit board 30 and at least a portion of the non-photosensitive area of the photosensitive chip 20. So that the molding base 40 integrates the molding base 40, the circuit board 30, and the photosensitive chip 20 into one body in such a manner as to embed at least a portion of the non-photosensitive area of the photosensitive chip 20. .
  • the camera module 1 includes at least one of the optical lens 10 and at least one of the molded circuit board assemblies 1000, wherein the molded circuit board assembly 1000 further includes at least one of the photosensitive chips 20, at least a circuit board 30 and at least one of the molding bases 40, the molding base 40 having at least one of the light windows 41, the photosensitive chip 20 and the circuit board 30 being turned on,
  • a molding base 40 is integrally coupled to the circuit board 30, and a photosensitive area of the photosensitive chip 20 corresponds to the light window 41 of the molding base 40, and the optical lens 10 is held in the The photosensitive path of the photosensitive chip 20.
  • the molding base 40 further encloses at least a portion of the non-photosensitive area of the photosensitive chip 20.
  • the camera module 1 may be a fixed focus camera module or a zoom camera module.
  • the optical lens 10 can be directly mounted on a top surface 42 of the molding base 40 such that the optical lens 10 is Holding the photosensitive path of the photosensitive chip 20; or the optical lens 10 is assembled to a lens barrel, the lens barrel being mounted on the top surface 42 of the molding base 40 such that the The optical lens 10 is held in a photosensitive path of the photosensitive chip 20; or the lens barrel integrally extends from the top surface 42 of the molding base 40, and the optical lens 10 is assembled to the lens barrel The optical lens 10 is held in the photosensitive path of the photosensitive chip 20.
  • the camera module 1 further includes at least one driver 50, wherein the optical lens 10 is drivably disposed on the driver 50, and the driver 50 is mounted on the molding base.
  • the top surface 42 of 40 is such that the optical lens 10 is held in the photosensitive path of the photosensitive chip 20.
  • the driver 50 can drive the optical lens 10 to be displaced along the photosensitive path of the photosensitive chip 20 to adjust the distance between the optical lens 10 and the photosensitive chip 20, so that the camera module 1 is formed.
  • the zoom camera module can drive the optical lens 10 to be displaced along the photosensitive path of the photosensitive chip 20 to adjust the distance between the optical lens 10 and the photosensitive chip 20, so that the camera module 1 is formed.
  • the driver 50 and the circuit board 30 are turned on. Specifically, the driver 50 is provided with a set of driver pins 51, the driver pins 51 of the driver 50 extending from the top surface 42 of the molding base 40 toward the circuit board 30 and It is electrically connected to the circuit board 30.
  • an outer surface 43 of the molding base 40 is provided with at least one lead slot 431, wherein the pin slot 431 extends from the top surface 42 of the molding base 40 toward the circuit board Extending in the 30 direction, the driver pin 51 of the driver 50 is held in the pin slot 431 of the molding base 40. In this way, the driver pin 51 of the driver 50 is not The outer surface 43 of the molding base 40 is protruded, so that on the one hand, the driver pin 51 can be prevented from being touched to cause a defect that affects the reliability of the driver 50. The integrity of the appearance of the camera module 1 can be ensured.
  • the pin groove 431 of the outer surface 43 of the molded base 40 is formed when the molded base 40 is molded.
  • the outer surface 43 of the molding base 40 is an inclined surface to facilitate the drafting of the molding die 100 after the molding base 40 is formed by a molding process through a molding die 100.
  • the angle of inclination of the outer surface 43 of the molded base 40 is formed by a cutting process.
  • the angle formed by the outer surface 43 of the molding base 40 and the optical axis of the photosensitive chip 20 is ⁇ , wherein the parameter ⁇ is an acute angle.
  • the type of the driver 50 is not limited in the camera module 1 of the present invention.
  • the driver 50 can be implemented as, but not limited to, a voice coil motor.
  • the camera module 1 further includes at least one filter element 60, wherein the filter element 60 is held between the optical lens 10 and the photosensitive chip 20 to enable The light entering the interior of the camera module 1 of the optical lens 10 can be received and photoelectrically converted by the photosensitive chip 20 after being filtered by the filter element 60, wherein the filter element 60 can be filtered from the The optical lens 10 enters the stray light in the light inside the camera module 1 to improve the imaging quality of the camera module 1.
  • the type of the filter element 60 is not limited in the camera module 1 of the present invention.
  • the filter element 60 may be implemented as, but not limited to, an infrared cut filter.
  • the filter element 60 can also form part of the molded circuit board assembly 1000.
  • the filter element 60 is mounted on the top surface 42 of the molding base 40 to enable the filter element 60 to It is held between the optical lens 10 and the photosensitive chip 20.
  • the top surface 42 of the molded base 40 forms at least one outer side surface 421 and at least one inner side surface 422, wherein the driver 50 is mounted on the outer side of the molded base 40.
  • the surface 421, the filter element 60 is mounted on the inner side surface 422 of the molding base 40.
  • the plane in which the outer side surface 421 of the molded base 40 is located is flush with the plane in which the inner side surface 422 is located, that is, the top surface 42 of the molded base 40 is a flat.
  • the outer side surface 421 and the inner side surface 422 of the molded base 40 have a height difference, for example, the plane of the outer side surface 421 of the molded base 40 is higher than the plane a plane in which the inner surface 422 is located, thereby forming at least one filter mounting groove 423, wherein the filter mounting groove 423 communicates with the light window 41, wherein the molded substrate 40 is mounted
  • the filter element 60 of the inner surface 422 is housed in the filter mounting groove 423 to reduce the height dimension of the camera module 1 and to improve the stability of the filter element 60.
  • the filter element 60 may be directly or indirectly fixed on the photosensitive chip 20, for example, The filter element 60 may be directly covered on the photosensitive chip 20 such that the filter element 60 and the photosensitive chip 20 are in contact, or a filter is disposed between the filter element 60 and the photosensitive chip 20. a support such that the filter element 60 and the photosensitive chip 20 have a safe distance, and then the molding base 40 is molded by a molding process to further embed the molding base 40 The outer edge of the filter element 60 is such that the filter element 60, the molded base 40, the circuit board 30, and the photosensitive chip 20 are integrated.
  • the molding base 40 of the camera module 1 may further combine the non-photosensitive regions of the photosensitive chip 20 to further reduce the length and width of the camera module 1 . size.
  • the photosensitive chip 20 may be first mounted on the circuit board 30, and then a molding process is performed to form the molding.
  • the susceptor 40, and the molded susceptor 40 is bonded to the non-photosensitive area of the photosensitive chip 20.
  • the camera module 1 may further include a bracket 70 , wherein the bracket 70 has a light through hole 71 , and the filter element 60 is mounted on the bracket 70 . Closing the light-passing aperture 71, wherein the bracket 70 is attached to the inner side surface 422 of the molding base 40 such that the filter element 60 is held by the optical lens 10 and In this manner, the size of the filter element 60 can be reduced between the photosensitive chips 20, thereby reducing the material cost of the camera module 1.
  • the camera module 1 may further include at least one electronic component 80, wherein the electronic component 80 is mounted on the circuit board 30, or the electronic component 80 may be partially or completely embedded The substrate 33.
  • the molded base 40 may embed at least one of the At least a portion of the electronic component 80.
  • the molding base 40 embeds a part of the electronic component 80 located on the upper surface of the circuit board 30 or embeds all of the electronic components 80. In this way, on the one hand, The molding base 40 can isolate the electronic component 80 and the outside air to prevent the surface of the electronic component 80 from being oxidized. On the other hand, the molding base 40 can isolate adjacent electronic components.
  • the device 80 can not only avoid the mutual interference of the adjacent electronic components 80, but also can make the isolation of the adjacent electronic components 80 closer to the limited area of the circuit board 30.
  • Mounting the electronic component 80 with a larger number and size, and on the other hand, the molding base 40 can isolate the electronic component 80 and the photosensitive chip 20 to avoid the electronic component Contaminants such as solder powder, debris, etc. generated by the surface of the 80 or the soldering position of the electronic component 80 and the circuit board 30 contaminate the photosensitive area of the photosensitive chip 20.
  • the type of the electronic component 80 is not limited in the camera module 1 of the present invention.
  • the electronic component 80 can be implemented as, but not limited to, a resistor, a capacitor, a processor, Relays, etc.
  • FIG. 4D illustrates the camera module 1 according to a variant embodiment of the present invention, wherein the camera module 1 may be free of the molded base 40.
  • the camera module 1 includes at least a lens holder 90, wherein the lens holder 90 has at least one light passage 91, wherein the lens holder 90 is mounted on the circuit board 30 after the photosensitive chip 20 and the circuit board 30 are turned on.
  • the photosensitive area of the photosensitive chip 20 is corresponding to the light-passing channel 91 of the lens holder 90, wherein the optical lens 10 can be directly or indirectly disposed on the lens holder 90 such that the The optical lens 10 is held in the photosensitive path of the photosensitive chip 20, so that the light entering the inside of the camera module 1 from the optical lens 10 passes through the light-passing passage 91 of the lens holder 90. Photoelectric conversion is received and performed by the photosensitive chip 20.
  • the light reflected by the object enters the interior of the camera module 1 from the optical lens 10, and is received by the sensor chip 20 and photoelectrically converted to form an image about the object.
  • the electrical signal It can be understood by those skilled in the art that the electrical signal is processed and transmitted to the electronic device body 2 by the circuit board 30 of the camera module 1, and of course, the electrical signal is used by the circuit board 30. Transfer to other devices is also possible. In the camera module 1 of the present invention, the stability of the circuit board 30 when processing and transmitting the electrical signal is effectively improved to ensure high performance of the camera module 1.
  • the circuit board 30 further includes at least one digital circuit portion 31, at least one analog circuit portion 32, and a substrate 33, wherein the digital circuit portion 31 and the analog circuit portion 32 are respectively formed at Different regions of the substrate 31, and the digital circuit portion 31 and the analog circuit portion 32 are communicably turned on, respectively, and the photosensitive chip 20 is turned on by the digital circuit portion 31 of the circuit board 30. And the analog circuit unit 32.
  • the electrical signal formed by the photosensitive chip 20 can be transmitted from the digital circuit portion 31 and the analog circuit portion 32 to each of the electronic component 80 and a connector 130.
  • the digital circuit portion 31 to which the present invention relates is a collection of the circuit board 30 formed of digital circuits for processing a digital signal (Digital Signal), wherein the digital A signal is a signal that is discrete (quantized) in both time and amplitude.
  • the value quantized by the electrical signal is encoded into a sequence consisting of only two numbers, 0 and 1, and the corresponding number is generated by the pulse signal generator.
  • the signal, wherein the digital signal includes, but is not limited to, MIPI (Digital Transmission Type Digital Signal), IIC (Digital Control Class Signal), MCLK (Digital Clock Signal), DVDD/DGND (Digital Power Supply), and the like.
  • the analog circuit portion 32 to which the present invention relates is a set of circuit boards 30 formed by analog circuits for processing analog signals (Analog Signals), wherein the analog signals refer to time continuous A continuous amplitude signal, wherein the analog signal includes but is not limited to AVDD/AGND (analog power supply), VTG/VRGSL (analog voltage reference), and the like.
  • analog signals refer to time continuous A continuous amplitude signal
  • the analog signal includes but is not limited to AVDD/AGND (analog power supply), VTG/VRGSL (analog voltage reference), and the like.
  • the connector 130 may be directly disposed on the substrate 33 or indirectly disposed on the substrate through a connecting plate 140 such as a soft board, a hard and soft board, a hard board, a ceramic board or the like. 33, and the connector 130 is connected to the digital circuit portion 31 and the analog circuit portion 32. Subsequently, after the camera module 1 is mounted on the electronic device body 2, the connector 130 and the circuit board of the electronic device body 2 are connected to each other such that the photosensitive chip 20 is formed. The electrical signal can be transmitted from the digital circuit portion 31 and the analog circuit portion 32 to the electronic device body 2 through the connector 130.
  • the digital circuit portion 31 and the analog circuit portion 32 of the circuit board 30 are both mounted on the substrate 33 and mounted on the substrate 33 or The electronic component 80 embedded in the substrate 33 is formed.
  • the digital circuit unit 31 includes a circuit provided on the substrate 33 and at least one of the electronic components 80 mounted on the substrate 33 or embedded in the substrate 33
  • the simulation The circuit portion 32 includes a circuit provided on the substrate 33 and at least one of the electronic components 80 mounted on the substrate 33 or embedded in the substrate 33.
  • the digital circuit portion 31 and the analog circuit portion 32 of the circuit board 30 in the art are formed in different regions of the substrate 33, in such a manner that the digital circuit portion 31 of the circuit board 30
  • the electromagnetic waves generated by the circuit can be prevented from interfering with the electrical signals transmitted and processed by the analog circuit portion 33.
  • the analog circuit portion 32 of the circuit board 30 and the digital circuit portion 31 have a safe distance therebetween to prevent electromagnetic wave interference generated by the circuit of the digital circuit portion 31 from being The electrical signal transmitted and processed by the analog circuit portion 32.
  • FIG. 20A is a diagram showing the interference of the tested MIPI signal of the camera module 1 of the present invention
  • FIG. 20B is a diagram showing the interference of the tested MIPI signal of the camera module of the prior art.
  • the safe distance is provided between 40% to 100% of the portion of the analog circuit portion 32 and the digital circuit portion 31.
  • the safety distance parameter between the analog circuit portion 32 and the digital circuit portion 31 is L1, wherein the parameter L1 ranges from 0.02 mm to 0.5 mm (including 0.02 mm and 0.5 mm).
  • the parameter L1 ranges from 0.1 mm to 0.4 mm (including 0.1 mm and 0.4 mm).
  • the substrate 33 has at least one line arrangement portion 331 and a chip holding portion 332, wherein the digital circuit portion 31 and the analog circuit portion 32 are formed in the line arrangement portion 331 of the substrate 33, the sensor chip 20 is disposed on the chip holding portion 332 of the substrate 33.
  • the line arrangement portion 331 further has a digital circuit region 3311 and an analog circuit region 3312, wherein the digital circuit portion 31 is disposed on the line arrangement
  • the circuit of the digital circuit region 3311 of the portion 331 is formed with the electronic component 80 located in the digital circuit region 3311, and the analog circuit portion 32 is provided by the analog circuit region provided in the line arrangement portion 331
  • the circuit of 3312 is formed with the electronic component 80 located in the analog circuit region 3312, such that the circuit of the digital circuit portion 31 and the circuit of the analog circuit portion 32 are no longer mixed together, thereby being able to block
  • the electromagnetic waves generated by the circuits of the digital circuit portion 31 interfere with the electrical signals transmitted and processed by the analog circuit portion 32 to ensure the communication capability of the circuit board 30.
  • the analog circuit portion 32 is formed in the analog circuit region 3312 of the line arrangement portion 331, such that the circuit of the analog circuit portion 32 and the electronic component 80 are integrated to cause the circuit board 30 is more concise.
  • the analog circuit portion 32 surrounds at least two sides of the chip holding portion 332 of the substrate 33 such that the analog circuit portion 32 surrounds at least two sides of the photosensitive chip 20.
  • the analog circuit portion 32 may be, but not limited to, an "L” shape, a "C” shape, an unclosed "O” shape, or the like.
  • the chip holding portion 332 of the substrate 33 is implemented as a flat mounting portion for mounting the photosensitive chip 20.
  • the chip holding portion 332 is located at a middle portion of the substrate 33.
  • the circuit board 30 further includes at least one substrate connector 34, wherein each of the substrate connectors 34 is disposed on the line arrangement portion 331 of the substrate 33, and each of the substrate connectors 34 is electrically Connected to the digital circuit portion 31 or the analog circuit portion 32, for example, each of the substrate connectors 34 may be disposed in the digital circuit region 3311 of the line arrangement portion 331 of the substrate 33, respectively.
  • the non-photosensitive area of the photosensitive chip 20 has at least one chip connector 21.
  • the photosensitive chip 20 is attached to the chip holding portion 332 of the substrate 33 to hold the photosensitive chip 20 in the chip holding portion 332, the photosensitive chip 20 is connected to the photosensitive chip through a conductive medium 110.
  • the conductive medium 110 may be implemented as a lead which may be formed between the chip connector 21 of the photosensitive chip 20 and the substrate connector 34 of the circuit board 30 by a wire bonding process.
  • the conductive medium 110 is implemented as the lead.
  • the wire bonding direction of the conductive medium 110 is not limited in the present invention.
  • the wire bonding direction of the conductive medium 110 may be from the photosensitive chip 20 to the circuit board 30, or the conductive medium 110 is hit.
  • the line direction may be from the circuit board 30 to the photosensitive chip 20.
  • the surface on which the photosensitive region of the photosensitive chip 20 is located is the upper surface of the photosensitive chip 20, and the surface of the photosensitive chip 20 corresponding to the photosensitive material is the photosensitive chip 20 a lower surface, that is, the photosensitive chip 20 has an upper surface, a lower surface, and a side surface, wherein the side surface is connected to the upper surface and the lower surface upward and downward, respectively, wherein the chip connector 21 may be disposed on the The upper surface of the photosensitive chip 20.
  • the chip connector 21 can also be disposed on the lower surface or the side surface of the photosensitive chip 20.
  • the type of the conductive medium 110 is not limited in the camera module 1 of the present invention.
  • the conductive medium 110 may be gold, copper, silver, or the like, which can be used to turn on the photosensitive chip 20 .
  • the type of the circuit board 30 is not limited in the camera module 1 of the present invention.
  • the conductive medium 110 may be gold, copper, silver, or the like, which can be used to turn on the photosensitive chip 20 .
  • the type of the circuit board 30 is not limited in the camera module 1 of the present invention.
  • the conductive medium 110 may be gold, copper, silver, or the like, which can be used to turn on the photosensitive chip 20 .
  • the type of the circuit board 30 is not limited in the camera module 1 of the present invention.
  • the conductive medium 110 may be gold, copper, silver, or the like, which can be used to turn on the photosensitive chip 20 .
  • the type of the circuit board 30 is not limited in the camera module 1 of the present invention.
  • the conductive medium 110 may be gold, copper,
  • the shape of the substrate connector 34 of the circuit board 30 and the shape of the chip connector 21 of the photosensitive chip 20 are not limited in the camera module 1 of the present invention.
  • the shape of the substrate connecting member 34 of the circuit board 30 and the shape of the chip connecting member 21 of the photosensitive chip 20 may be a disk shape, a spherical shape, or the like, respectively.
  • FIG. 8 shows a modified embodiment of the circuit board 30 of the camera module 1 according to the present invention, wherein the chip holding portion 332 of the substrate 33 is implemented as a receiving space 3321 for The photosensitive chip 20 is housed such that the photosensitive chip 20 is held by the chip holding portion 332.
  • the accommodating space 3321 of the substrate 33 is implemented as a recess, preferably a through hole, in which the photosensitive chip 20 is housed in the accommodating space 3321 and is electrically connected through the conductive medium 110.
  • the molding base 40 is integrally formed on the line arrangement portion 331 of the circuit board 30 and at least a portion of the non-photosensitive area of the photosensitive chip 20,
  • the photosensitive chip 20 is held in the accommodating space 3321 by the molding base 40.
  • the height dimension of the camera module 1 can be reduced, and on the other hand, the The flatness of the photosensitive chip 20 is no longer limited by the flatness of the circuit board 30, but is maintained by the molding base 40, thereby making the photosensitive chip 20 flatter, and the circuit board 30 can A thinner plate material is selected to further reduce the height dimension of the camera module 1.
  • the photosensitive chip 20 may be mounted on the substrate 33 in a flip chip process, and the photosensitive chip 20 and the circuit board 30 may be turned on.
  • the type of the substrate 33 is not limited in the camera module 1 of the present invention.
  • the substrate 33 may be, but not limited to, a soft board, a hard board, a ceramic board, and a soft and hard board.
  • the substrate 33 has at least two sheet layers 333, that is, two or more of the sheet layers 333 overlap each other to form the substrate 33.
  • the circuit of the digital circuit unit 31 and the circuit of the analog circuit unit 32 are respectively provided on each of the plate layers 333 of the substrate 33.
  • the layer number parameter of the plate layer 333 of the substrate 33 is Y, wherein the parameter Y ranges from 2 to 20 (including 2 and 20).
  • the parameter Y has a value ranging from 3 to 15 (including 3 and 15). More preferably, the parameter Y has a value ranging from 4 to 10 (including 4 and 10).
  • the thickness parameter of the plate layer 333 is Z, wherein the parameter Z ranges from 0.005 mm to 0.5 mm (including 0.005 mm and 0.5 mm). Preferably, the parameter Z ranges from 0.01 mm to 0.2 mm. Mm (including 0.01mm and 0.2mm).
  • the substrate 33 has at least one communication hole 334 and a circuit connector 335, wherein the communication hole 334 communicates with each of the plate layers 333 of the substrate 33, and the circuit connector 335 is formed in the communication hole 334.
  • the peripheral wall is for turning on the circuit of the digital circuit portion 31 provided in each of the plate layers 333 and the circuit of the analog circuit portion 32.
  • the circuit of the digital circuit portion 31 includes a horizontal extension circuit 311 and a vertical extension circuit 312, wherein the horizontal extension circuit 311 of the digital circuit portion 31 of the plate layer 333 disposed on the upper layer is substantially horizontally Extending, the handle extension circuit 312 of the digital circuit portion 31 of the plate layer 333 of the upper layer is electrically connected to the digital circuit of the plate layer 333 provided on the lower layer through the circuit connector 335 The horizontal extension circuit 311 of the portion 31.
  • the circuit of the analog circuit portion 32 also includes the horizontal extension circuit 311 and the vertical extension circuit 312, wherein the horizontal extension of the analog circuit portion 32 of the plate layer 333 provided on the upper layer
  • the circuit 311 extends substantially horizontally
  • the vertical extension circuit 312 of the analog circuit portion 32 of the plate layer 333 of the upper layer is electrically connected to the plate layer provided on the lower layer through the circuit connector 335
  • the horizontal extension circuit 311 of the analog circuit portion 32 of 333 According to the above aspect, the width dimension of the substrate 33 can be sufficiently utilized to make the length and width of the substrate 33 smaller, thereby further reducing the volume of the image pickup module 1.
  • the diameter of the communication hole 334 may be larger than the width of the circuit, or may be equal to or smaller than the diameter of the circuit.
  • the diameter parameter of the communication hole 334 is a, wherein the parameter a ranges from 0.005 mm to 0.8 mm (including 0.005 mm and 0.8 mm). Preferably, the parameter a ranges from 0.1 mm to 0.5 mm. (including 0.1mm and 0.5mm).
  • the minimum width parameter of the circuit be b, wherein the parameter b ranges from 0.001 mm to 0.5 mm (including 0.001 mm and 0.5 mm), preferably, the parameter b ranges from 0.02 mm to 0.1 mm. (including 0.02mm and 0.1mm).
  • the minimum distance parameter of the adjacent circuit or the communication hole 334 is c, wherein the parameter c ranges from 0.001 mm to 0.5 mm (including 0.001 mm and 0.5 mm), preferably, the value of the parameter c.
  • the range is: 0.02 mm to 0.1 mm (including 0.02 mm and 0.1 mm).
  • the minimum distance parameter of the edge of the substrate 33 of the circuit board 30 and the edge of the analog circuit region 3312 is d, that is, the parameter of the cutting tolerance superimposed line manufacturing tolerance is d.
  • the parameter of the narrowest side width dimension of the substrate 33 (ie, the distance between the inner wall of the substrate 33 for forming the accommodating space 3321 and the outer wall of the substrate 33) is e, wherein the parameter e has a value range of :[2*d+min(a,b)*2+c] ⁇ [2*d+10*max(a,b)+9*c] (including [2*d+min(a,b)* 2+c] and [2*d+10*max(a,b)+9*c], preferably, the parameter e has a value range of: [2*d+2*max(a,b)+c ] ⁇ [2*d+4*max(a,b)+3*c] (including [2*d+2*max(a,b)+c] and [2*d+4*max(a, b) +3*c]).
  • the distance parameter of the photosensitive chip 20 and the accommodating space 332 is h, wherein the parameter h ranges from 0.002 mm to 5 mm (including 0.002 mm and 5 mm), preferably 0.02. Mm ⁇ 1mm (including 0.02mm and 1mm).
  • the size of the circuit board 30 affects the size of the camera module 1.
  • the parameter of the length dimension of the photosensitive chip 20 in a certain direction is f
  • the parameter of the length dimension of the camera module 1 in this direction is g
  • the center of the photosensitive chip 20 is As the origin
  • the value of the parameter g is: [f+3*d+min(a,b)*2+c+h] ⁇ [f+3*d+10*max(a,b)+9 *c+h] (including [f+3*d+min(a,b)*2+c+h] and [f+3*d+10*max(a,b)+9*c+h] ).
  • the value of the parameter g ranges from: [f+3*d+2*max(a,b)+c+h] ⁇ [f+3*d+4*max(a,b)+3* c+h] (including [f+3*d+2*max(a,b)+c+h] and [f+3*d+4*max(a,b)+3*c+h]) .
  • the camera module 1 further includes at least one protection portion 120, wherein the protection portion 120 has at least one opening 121, wherein the protection portion 120 is formed or
  • the line arrangement portion 331 of the substrate 33 of the circuit board 30, the chip holding portion 332 of the substrate 33, the electronic component 80 or the connector corresponds to the protection portion The opening 121 of 120.
  • the protection portion 120 can protect the circuit board 30, and can protect the photosensitive area of the photosensitive chip 20 from contamination.
  • the protection portion 120 can prevent the circuit board 30 from being caused when the molding base 40 is contracted by curing in a manner of being held between the molding base 40 and the circuit board 30. The undesirable phenomenon of rolling up protects the circuit board 30.
  • the molding base 40 can embed a part of the protection portion 120.
  • the protection portion 120 may also be formed or disposed on at least a portion of the non-photosensitive area of the photosensitive chip 20, so that the molding die 100 is pressed against the photosensitive in the molding process. A non-photosensitive area of the chip 20.
  • the protection portion 120 may be formed at or disposed on at least a portion of the line arrangement portion 331 of the substrate 33 and the non-photosensitive region of the photosensitive chip 20.
  • the protection portion 120 may not have the opening 121, for example, before the photosensor chip 20 is mounted to the substrate 33.
  • the protective portion 120 is formed on the surface of the substrate 33 by applying any possible material such as ink to the surface of the substrate 33 so as to be formed on the surface of the substrate 33 by a material such as ink.
  • the line arrangement portion 331 of the substrate 33 further includes at least one bonding region 3313 and at least one protection region 3314, wherein the protection portion 120 is formed at least or disposed on the circuit arrangement of the substrate 33 The protected area 3314 of the portion 331.
  • a portion of the protection portion 120 may also be formed at or disposed on at least a portion of the bonding region 3313 of the line arrangement portion 331 of the substrate 33, or a portion of the protection portion 120 may also be At least a portion of the non-photosensitive region of the photosensitive chip 20 may be formed or disposed, or a portion of the protective portion 120 may be simultaneously formed or disposed at least a portion of the non-photosensitive region of the photosensitive chip 20 and At least a portion of the bonding region 3313, or a portion of the protection portion 120 may also be formed or disposed on the chip holding portion 332.
  • the molded base is formed when a portion of the protection portion 120 is formed at or disposed in the bonding region 3313 and the molding base 40 is integrally coupled to
  • the molding base 40 can isolate the digital circuit portion 31 and the analog circuit portion 32 after molding, thereby further preventing electromagnetic wave interference generated by the circuit of the digital circuit portion 31 from being beside the analog circuit portion 32.
  • the electrical signal transmitted and processed. 11 to 19 illustrate a manufacturing process of the camera module 1 in which the camera module 1 is molded on the circuit board 30 by the molding die 100 while being fabricated. Block 40.
  • the molding die 100 includes an upper die 101 and a lower die 102, wherein the upper die 101 has at least one base molding portion 1011 and at least one light window molding portion 1012 and has at least one molding guide groove 1013, wherein the molding die 101 A window forming portion 1012 is integrally formed in a middle portion of the base molding portion 1011 to form the molding guide groove 1013 between the base molding portion 1011 and the light window molding portion 1012, wherein the upper mold portion At least one of 101 and the lower mold 102 can be operated such that the molding die 100 is subjected to a mold clamping and drafting operation to form at least one molding between the upper mold 101 and the lower mold 102.
  • the space 103 that is, the molding space 103 of the molding die 100 is formed at a position corresponding to the molding guide groove 1013 of the upper mold 101. It can be understood that when the molding die forms two or more of the molding spaces 103, adjacent molding spaces 103 can be turned on to allow a molding material 200 to be added to one of the moldings. The space 103, the molding material 200 can also be filled in the adjacent molding space 103.
  • the electronic component 80 is mounted on the substrate 33 of the circuit board 30 such that the electronic component 80 is electrically connected to the circuit provided on the substrate 33, thereby
  • the circuit provided in the digital circuit region 3311 of the line arrangement portion 331 of the substrate 33 and the electronic component 80 mounted on the digital circuit region 3311 form the digital circuit portion 31
  • the circuit provided in the analog circuit region 3312 of the line arrangement portion 331 of the substrate 33 and the electronic component 80 mounted on the analog circuit region 3312 form the analog circuit portion 32.
  • the electronic component 80 is mounted on the upper surface of the substrate 33 in FIG. 11, in other examples, the electronic component 80 can be mounted.
  • the electronic component 80 is attached to the lower surface of the substrate 33, or both the upper surface and the lower surface of the substrate 33. Nevertheless, those skilled in the art will appreciate that the electronic component 80 may also be partially or fully embedded in the substrate 33.
  • the protection portion 120 is provided or formed in the protection region 3314 of the line arrangement portion 331 of the substrate 33.
  • the protection portion 120 is formed at least in the protection region 3314 of the substrate 33 in the drawing.
  • a medium such as ink may be applied to the protective region 3314 of the substrate 33 to be formed in the protective region 3314 of the substrate 33 by a medium such as ink.
  • the protection portion 120 may also form the protective portion 120 at the bonding region 3313 of the substrate 33 and/or at the chip holding portion 332 of the substrate 33.
  • the protecting portion 120 may be formed by a medium such as glue applied to the protective region 3314 of the substrate 33 after curing, it being understood that the medium is such as glue.
  • the opening 121 of the protection portion 120 may also be formed while the protection portion 3314 is formed, wherein the opening 121 of the protection portion 120 corresponds to the chip holding portion 332.
  • the protection portion 120 may also be formed on the bonding region 3313 of the substrate 33.
  • the photosensitive chip 20 may be first held in the chip holding portion 332, for example, the photosensitive chip 20 may be mounted on the chip holding portion 332, or
  • the photosensitive chip 20 is housed in the chip holding portion 332 that is implemented as the accommodating space 3321, and then the protective portion 120 is formed in a non-photosensitive region of the photosensitive chip 20 and corresponds to the photosensitive chip 20
  • the opening 121 of the photosensitive region, or the non-photosensitive region of the photosensitive chip 20 and the protective region 3314 simultaneously form the protective portion 120 and the opening 121 corresponding to the photosensitive region of the photosensitive chip 20,
  • the protection portion 120 and the opening 121 corresponding to the photosensitive region of the photosensitive chip 20 are simultaneously formed in the non-photosensitive region of the photosensitive chip 20, the protective region 3314, and the bonding region 3313.
  • the width dimension of the protective region 3314 of the substrate 33 is set to a parameter L2, wherein the parameter L2 ranges from 0.01 mm to 10 mm (including 0.01 mm and 10 mm). Preferably, the parameter L2 ranges from 0.5 mm to 5 mm (including 0.5 mm and 5 mm).
  • the protection area 3314 is at least a partial area of the pressing surface 10121 of the light window forming block 1012 of the upper mold 101 of the molding die 100, thereby ensuring the protection area 3314.
  • the width can ensure the width of the protection portion 120 formed in the protection region 3314 so that the circuit board 30 can be protected by the protection portion 120 in the molding process.
  • the protective portion 120 may not be formed on the circuit board 30, but the protective portion 120 is formed on the upper mold 101 of the molding die 100.
  • the pressing surface 10121 of the light window forming block 1012 so that the protecting portion 120 can be located between the pressing surface 10121 of the light window forming block 1012 and the circuit board 30 in a molding process To protect the board.
  • the protection portion 120 may not have the opening 121, for example, the protection portion 120 can be implemented to cover at least the coverage of the light window molding block 1012 of the upper mold 101. membrane.
  • the protection portion 120 can also be formed on the photosensitive chip 20, for example, the chip surface protective glue of the photosensitive chip 20 can form the protection portion 120, thereby In the manufacturing process, the pressing surface 10121 of the upper mold 101 of the molding die 100 is pressed against the photosensitive chip 20 such that the protecting portion 120 is located on the pressing surface 10121 and the photosensitive chip. Between 20 to protect the photosensitive chip 20.
  • the protection portion 120 may also be formed on the filter element 60 such that the pressing surface 10121 of the upper mold 101 of the molding die 100 is pressed against the filter in a molding process. The element 60 protects the filter element 60 by positioning the protection portion 120 between the pressing surface 10121 and the filter element 60.
  • the features and advantages of the camera module 1 of the present invention are further explained by taking the protection region 120 formed on the bonding region 3313 of the substrate 33 and the protection region 3314 as an example.
  • the pressing surface 10121 of the upper mold 101 is pressed against the protection area 3314 when the molding die 100 is operated to be clamped, wherein the bonding area 3313 is located in the molding of the molding die 100. Space 103.
  • the protection portion 120 is located between the pressing surface 10121 of the upper mold 101 and the circuit board 30, so that the protection portion 120 can prevent the pressing surface 10121 of the upper mold 101 from directly pressing On the circuit board 30.
  • the protection portion 120 has sufficient elasticity. In this way, on the one hand, the protection portion 120 can absorb the impact force generated by the molding die 100 when being clamped, thereby avoiding the impact force.
  • the circuit board 30 has a defect of damage deformation.
  • the protection portion 120 can prevent a gap from being formed between the pressing surface 10121 of the upper mold 101 and the circuit board 30, thereby In the molding process, the molding material 200 is prevented from entering the protection region 3314 from the bonding region 3313.
  • the width dimension of the protective region 3314 of the substrate 33 is a value range of the parameter L2, so that the pressing surface 10121 of the upper mold 101 and the protection portion 120 can be completely contacted to ensure The reliability of the molding process. It is to be noted that the protection portion 120 has sufficient strength to ensure that the pressing surface of the upper mold 101 is not deformed when the pressing surface 10121 is pressed against the protection portion 120. It will affect its shape after the molding process is completed because it is too large.
  • the molding material 200 in the form of a fluid is added to the molding space 103 of the molding die 100, and the molding material 200 is filled in the molding space 103 so that when the molding material 200 is in the molding space
  • the molded base 40 is obtained after curing in 103. Since the protecting portion 120 prevents a gap from being formed between the pressing surface 10121 of the upper mold 101 and the circuit board 30, the molding material 200 does not overflow to prevent the molding material 200 from leaking. The phenomenon of "flashing" appeared.
  • the molding material 200 may be a liquid material, or may be a solid particle, or a mixture of a liquid material and solid particles, so that the molding material 200 can flow so as to be added to the The molding material 200 of the molding space 103 can fill the molding space 103.
  • the inner surface of the upper mold 101 may also form the protective portion 120, such as a cover film, to facilitate the mold.
  • the base 40 is molded and then demolded. It can be understood that the inner surface of the upper mold 101 includes the pressing surface 10121 and the inner surface of the upper mold 101 for forming the forming guide groove 1013.
  • a plurality of the circuit boards 30 may form a circuit board assembly, and then the circuit board assembly is subjected to a molding process. At this time, the molding base needs to be molded after the drafting.
  • the board assembly of the socket 40 is divided, for example, by cutting or etching to obtain the molded circuit board assembly 1000.
  • the photosensitive chip 20 is attached to the chip holding portion 332 of the substrate 33 through the light window 41 of the molding base 40, and the conductive medium is made by a wire bonding process. Both ends of the 110 are electrically connected to the substrate connector 34 and the chip connector 21 of the photosensitive chip 20, respectively, to electrically connect the photosensitive chip 20 and the circuit board 30.
  • the filter element 40 is attached to the inner side surface 422 of the top surface 42 of the molded base 40.
  • the optical lens 10 is assembled to the driver 50, and the driver 50 is assembled to the outer surface 421 of the top surface 42 of the molding base 40 such that the optical lens 10 is held
  • the photosensitive module 20 is obtained by the photosensitive path of the photosensitive chip 20.
  • the present invention further provides a method of fabricating a molded circuit board assembly 1000, wherein the manufacturing method includes the following steps:
  • a photosensitive chip 20 is electrically connected to the substrate 33 via the light window 41 of the molding base 40 to fabricate the molded circuit board assembly 1000.
  • the present invention further provides a method of manufacturing a camera module 1, wherein the manufacturing method includes the following steps:
PCT/CN2018/075334 2017-02-04 2018-02-05 摄像模组及其模制电路板组件、电路板以及应用 WO2018141295A1 (zh)

Priority Applications (8)

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KR1020217026115A KR102431381B1 (ko) 2017-02-04 2018-02-05 카메라 모듈 및 이의 몰딩 회로 기판 어셈블리, 회로 기판 및 응용
US16/483,150 US11039052B2 (en) 2017-02-04 2018-02-05 Camera module and molding circuit board assembly, circuit board and application thereof
KR1020197025226A KR102303294B1 (ko) 2017-02-04 2018-02-05 카메라 모듈 및 이의 몰딩 회로 기판 어셈블리, 회로 기판 및 응용
KR1020217002179A KR102350661B1 (ko) 2017-02-04 2018-02-05 카메라 모듈 및 이의 몰딩 회로 기판 어셈블리, 회로 기판 및 응용
EP18748678.2A EP3579537A4 (en) 2017-02-04 2018-02-05 CAMERA MODULE AND SHAPED PCB ARRANGEMENT, PCB AND APPLICATION THEREOF
JP2019542096A JP7104711B2 (ja) 2017-02-04 2018-02-05 撮像モジュールおよびそのモールド回路基板アセンブリ、回路基板および応用
CN201880005176.2A CN110089102B (zh) 2017-02-04 2018-02-05 摄像模组及其模制电路板组件、电路板以及应用
US17/314,723 US11451693B2 (en) 2017-02-04 2021-05-07 Camera module and molding circuit board assembly, circuit board and application thereof

Applications Claiming Priority (2)

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CN201710064137 2017-02-04
CN201710064137.7 2017-02-04

Related Child Applications (2)

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US16/483,150 A-371-Of-International US11039052B2 (en) 2017-02-04 2018-02-05 Camera module and molding circuit board assembly, circuit board and application thereof
US17/314,723 Division US11451693B2 (en) 2017-02-04 2021-05-07 Camera module and molding circuit board assembly, circuit board and application thereof

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US11451693B2 (en) 2022-09-20
KR20190112079A (ko) 2019-10-02
JP2020509580A (ja) 2020-03-26
KR102350661B1 (ko) 2022-01-14
CN108401091B (zh) 2022-06-28
CN209105276U (zh) 2019-07-12
CN110089102B (zh) 2021-08-10
US20210266436A1 (en) 2021-08-26
KR102431381B1 (ko) 2022-08-11
CN209089073U (zh) 2019-07-09
KR20210011079A (ko) 2021-01-29
CN108401091A (zh) 2018-08-14
CN110089102A (zh) 2019-08-02
KR20210106020A (ko) 2021-08-27
JP7104711B2 (ja) 2022-07-21
US20200244852A1 (en) 2020-07-30
US11039052B2 (en) 2021-06-15
EP3579537A4 (en) 2020-11-04
EP3579537A1 (en) 2019-12-11
CN108401092B (zh) 2024-03-15
KR102303294B1 (ko) 2021-09-15

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