WO2021031710A1 - 感光组件、摄像模组及其制备方法 - Google Patents

感光组件、摄像模组及其制备方法 Download PDF

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Publication number
WO2021031710A1
WO2021031710A1 PCT/CN2020/099936 CN2020099936W WO2021031710A1 WO 2021031710 A1 WO2021031710 A1 WO 2021031710A1 CN 2020099936 W CN2020099936 W CN 2020099936W WO 2021031710 A1 WO2021031710 A1 WO 2021031710A1
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WIPO (PCT)
Prior art keywords
photosensitive
area
photosensitive chip
circuit board
chip mounting
Prior art date
Application number
PCT/CN2020/099936
Other languages
English (en)
French (fr)
Inventor
赵波杰
郑程倡
Original Assignee
宁波舜宇光电信息有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201910779860.2A external-priority patent/CN112423488A/zh
Priority claimed from CN201921371310.9U external-priority patent/CN210405821U/zh
Application filed by 宁波舜宇光电信息有限公司 filed Critical 宁波舜宇光电信息有限公司
Publication of WO2021031710A1 publication Critical patent/WO2021031710A1/zh

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits

Definitions

  • This application relates to the field of camera modules, and in particular to photosensitive components, camera modules and preparation methods thereof.
  • the main purpose of this application is to provide a photosensitive component, a camera module and a preparation method thereof, wherein the ink layer of the circuit board has a hollow area formed in the mounting area of the photosensitive chip, so as to be applied to the hollow area
  • the adhesive causes the photosensitive chip to bend downward during the process of mounting the photosensitive chip on the photosensitive chip mounting area of the circuit board. In this way, the bending state of the photosensitive chip is adjusted to improve the performance of the camera module. Image quality.
  • Another object of the present application is to provide a photosensitive component, a camera module and a preparation method thereof, wherein, during the process of mounting the photosensitive chip on the photosensitive chip mounting area, the adhesive applied to the hollow area The ink layer around the adhesive is cured and shrinks. Compared with the adhesive, the ink layer located around the adhesive has the characteristics of less deformation, so that the lower surface of the photosensitive chip is bent downward to adjust the bending state of the photosensitive chip .
  • Another object of the present application is to provide a photosensitive component, a camera module and a manufacturing method thereof, wherein the hollow area is located in the photosensitive chip mounting area and the hollow area does not overlap with the photosensitive chip mounting area The area is located on the shorter side of the photosensitive chip mounting area, so that during the assembly process, the shorter side of the photosensitive chip has a larger curvature to adapt to the field curvature of the optical lens.
  • Another object of the present application is to provide a photosensitive component, a camera module and a manufacturing method thereof, wherein the hollow area is located in the photosensitive chip mounting area and the hollow area does not overlap with the photosensitive chip mounting area The area is located at the corner area of the mounting area of the photosensitive chip, so that during the assembly process, the corner area of the photosensitive chip has a larger curvature to adapt to the curvature of field of the optical lens.
  • Another object of the present application is to provide a photosensitive component, a camera module and a preparation method thereof, wherein the photosensitive chip is directly bonded to the circuit board main body to improve the stability of the combination of the photosensitive chip and the circuit board .
  • Another object of the present application is to provide a photosensitive component, a camera module and a manufacturing method thereof, wherein the hollow area can further reduce the overall height of the photosensitive component and the camera module.
  • a photosensitive component which includes:
  • the circuit board includes a circuit board main body and an ink layer formed on the circuit board main body, the ink layer includes a hollow area of a photosensitive chip mounting area formed on the circuit board, and the hollow area is configured to apply an adhesive to Thereon, the photosensitive chip is bent downward during the process of mounting the photosensitive chip on the circuit board through the adhesive.
  • the hollowed-out area partially overlaps the photosensitive chip mounting area, and the non-overlapping area of the hollowed-out area and the photosensitive chip mounting area is located at a shorter length of the photosensitive chip mounting area. Side.
  • the hollow area partially overlaps with the photosensitive chip mounting area, and the non-overlapping area of the hollow area and the photosensitive chip mounting area is located in a corner area of the photosensitive chip mounting area .
  • the non-overlapping area of the hollow area and the photosensitive chip mounting area is symmetrically distributed with respect to the photosensitive chip mounting area.
  • the width of the hollow area corresponding to the shorter side of the photosensitive chip mounting area is greater than the width of the hollow area corresponding to the longer side of the photosensitive chip mounting area.
  • the center of the hollow area corresponds to the center of the photosensitive chip mounting area.
  • the shape of the hollow area is a centrally symmetrical figure.
  • the shape of the hollow area corresponds to the shape of the photosensitive chip mounting area.
  • the hollow area has a cross shape.
  • the ink layer further includes at least one air escape through hole, and the at least one air escape through hole extends from the hollow area and protrudes from the photosensitive chip mounting area.
  • the photosensitive assembly further includes at least one electronic component provided on the circuit board and a lead wire for electrically connecting the photosensitive chip and the circuit board, wherein the at least one An air escape channel is formed on the side of the circuit board without the leads and the electronic components.
  • the area of the hollow area is 30% to 90% of the area of the photosensitive chip mounting area.
  • the thickness of the part of the ink layer for mounting the photosensitive chip is higher than the thickness of the ink layer of other parts.
  • the thickness of the ink layer is 30-100 microns.
  • the thickness of the adhesive is 10-100 microns.
  • the ink layer is not easily deformed compared to the adhesive.
  • the adhesive has insulating properties.
  • the present application also provides a camera module, which includes:
  • An optical lens held on the photosensitive path of the photosensitive component is an optical lens held on the photosensitive path of the photosensitive component.
  • the curved shape of the lower surface of the photosensitive chip is adapted to the shape of the actual focal imaging surface of the camera module.
  • a method for manufacturing a photosensitive component which includes:
  • the photosensitive chip is mounted on the photosensitive chip mounting area, so that the photosensitive chip is bent downward by the adhesive.
  • forming a hollow area on the photosensitive chip mounting area of the circuit board includes:
  • circuit board main body Provides a circuit board main body
  • the ink layer is etched through an etching process to form the hollow area on the photosensitive chip mounting area of the circuit board.
  • forming a hollow area on the photosensitive chip mounting area of the circuit board includes:
  • circuit board main body Provides a circuit board main body
  • the shield is removed to form the hollow area at a position corresponding to the shield.
  • forming a hollow area on the photosensitive chip mounting area of the circuit board includes:
  • An ink layer with the hollow area is formed on the main body of the circuit board by means of inkjet printing.
  • FIG. 1 illustrates a schematic diagram of the pickup process of the photosensitive chip in the existing COB assembly process.
  • Figure 2 illustrates a schematic diagram of the imaging light path of the camera module.
  • Fig. 3 illustrates a schematic diagram of a camera module according to an embodiment of the present application.
  • Fig. 4 illustrates a schematic diagram of a photosensitive assembly according to an embodiment of the present application.
  • Fig. 5 illustrates a schematic top view of the photosensitive assembly according to an embodiment of the present application.
  • FIG. 6 illustrates a schematic top view of a modified implementation of the photosensitive assembly according to the embodiment of the present application.
  • Fig. 7 illustrates a schematic top view of another modified implementation of the photosensitive assembly according to an embodiment of the present application.
  • FIG. 8 illustrates a schematic top view of another modified implementation of the photosensitive assembly according to the embodiment of the present application.
  • FIG. 9 illustrates a schematic top view of another modified implementation of the photosensitive assembly according to the embodiment of the present application.
  • Fig. 10 illustrates a schematic top view of another modified implementation of the photosensitive assembly according to an embodiment of the present application.
  • FIG. 11 illustrates a schematic top view of another modified implementation of the photosensitive assembly according to the embodiment of the present application.
  • Fig. 12 illustrates a schematic diagram of another modified implementation of the photosensitive assembly according to an embodiment of the present application.
  • FIG. 13 illustrates a schematic diagram of another modified implementation of the photosensitive assembly according to an embodiment of the present application.
  • FIG. 14 illustrates a schematic diagram of another modified implementation of the photosensitive assembly according to the embodiment of the present application.
  • FIG. 15 illustrates a schematic diagram of another modified implementation of the photosensitive assembly according to an embodiment of the present application.
  • Fig. 16 illustrates a schematic diagram of another modified implementation of the photosensitive assembly according to an embodiment of the present application.
  • FIG. 17 illustrates a schematic diagram of the manufacturing process of the photosensitive component according to an embodiment of the present application.
  • the existing camera module is usually assembled using a COB (Chip on Board) process: picking up the photosensitive chip picking up ⁇ attaching to the circuit board ⁇ electrically connecting the photosensitive chip to the circuit board.
  • COB Chip on Board
  • FIG. 1 illustrates a schematic diagram of the pickup process of the photosensitive chip in the existing COB assembly process.
  • the photosensitive chip is picked up by suction, and since the photosensitive area of the photosensitive chip cannot be contacted, the suction nozzle of the pickup can only be attached to the non-sensitive area of the photosensitive chip.
  • the suction nozzle of the pickup can only be attached to the non-sensitive area of the photosensitive chip.
  • the photosensitive chip will be bent toward the photosensitive surface of the photosensitive chip due to being sucked, and assume an upward convex shape (from the effect shown in Figure 1, it is vividly stated ,
  • the curved shape of the photosensitive chip can be defined as a "crying face" shape).
  • FIG. 2 illustrates a schematic diagram of the imaging light path of the camera module.
  • the shape of the actual focal imaging surface is a curved surface convex toward the image side.
  • the imaging quality is the best.
  • the actual focal plane still appears as a curved surface. This is why even if the photosensitive chip is not deformed during the pick-up process, it will still produce distortion, loss of light at the corners and loss of sharpness.
  • the adhesive is cured by baking.
  • the expansion of the circuit board is greater than that of the photosensitive chip, and when the temperature drops back to room temperature, the shrinkage of the circuit board is also greater than that of the photosensitive chip, causing the photosensitive chip to bend convexly toward the image side. That is to say, when the photosensitive chip is mounted on the circuit board through the DA process, the crying face-like deformation is aggravated, resulting in distortion, corner loss, and sharp angle reduction, which further deteriorates the imaging effect.
  • the basic idea of this application is to hollow out the portion of the ink layer of the circuit board corresponding to the photosensitive chip mounting area, so that the photosensitive chip is mounted on the circuit board through the adhesive applied in the hollowed-out area During the process of the photosensitive chip mounting area, the photosensitive chip is bent downward, and in this way, the bending state of the photosensitive chip is adjusted to improve its imaging quality.
  • the present application proposes a photosensitive component including: a photosensitive chip and a circuit board, wherein the circuit board includes a circuit board main body and an ink layer formed on the circuit board main body, and the ink layer includes The hollow area of the photosensitive chip mounting area of the circuit board, the hollow area is configured to apply an adhesive thereon, so that the photosensitive chip is mounted on the circuit board by the adhesive Bend down. In this way, the bending state of the photosensitive chip is adjusted to improve its imaging quality.
  • the camera module As shown in FIGS. 3 and 4, the camera module according to the embodiment of the present application is illustrated, wherein the camera module includes an optical lens 10 and a photosensitive component 20, and the optical lens 10 is held on the photosensitive component 20 The photosensitive path, so that the light collected by the optical lens 10 can be imaged in the photosensitive component 20 along the photosensitive path.
  • the photosensitive component 20 includes: a circuit board 21, a photosensitive chip 22, at least one electronic component 23, and a package 24, wherein the photosensitive chip 22 is electrically connected to the The circuit board 21, the at least one electronic component 23 is disposed around the photosensitive chip 22 and electrically connected to the circuit board 21, and the package body 24 is disposed on the circuit board 21 and configured for mounting The optical lens 10 is on it.
  • the package body 24 is implemented as a traditional plastic bracket, which is prefabricated and mounted on the circuit board 21 at a predetermined position through the COB process.
  • the package body 24 may also be implemented as other types of packages 24.
  • the package body 24 may be implemented as a mold that is formed on the circuit board 21 by a MOB (Molding on Board) process and integrally covers at least a part of the circuit board 21 and at least a part of the electronic components 23.
  • Plastic bracket as shown in Figure 15.
  • the package body 24 can also be implemented as being formed on the circuit board 21 through a MOC (Molding on Chip) process and integrally covering at least a part of the circuit board 21 and the non-photosensitive area of the photosensitive chip 22 At least a part of and a molded support of at least a part of the electronic component 23 are as shown in FIG. In this regard, this application is not limited.
  • MOC Manufacturing on Chip
  • the at least one electronic component 23 may be mounted on the upper surface of the circuit board 21 through a surface mounting technology (Surface Mounting Technology). Generally, the at least one electronic component 23 is mounted on the surrounding area of the photosensitive chip 22. Alternatively, the at least one electronic component 23 can also be embedded in the circuit board 21 to reduce the height of the at least one electronic component 23 protruding from the circuit board 21. It should be understood that the installation process of the at least one electronic component 23 is not limited by this application. At the same time, in the embodiments of the present application, the type of the at least one electronic component 23 is not limited to this application, and includes but not limited to capacitors, inductors, triodes, thyristors, resistors, etc.
  • the electrical connection between the photosensitive chip 22 and the circuit board 21 is realized by a lead 25.
  • each lead 25 is bent and extends between the photosensitive chip 22 and the circuit board 21, so as to electrically connect the photosensitive chip 22 to The circuit board 21, therefore, the circuit board 21 can supply power to the photosensitive chip 22 based on the lead 25, and the photosensitive chip 22 can transmit the collected signal based on the lead 25.
  • the type of the lead 25 is not limited by this application.
  • the lead 25 may be a gold wire, a silver wire, or a copper wire.
  • the lead 25 may be installed between the circuit board 21 and the photosensitive chip 22 through a process of "golding wire" to achieve electrical connection between the two.
  • the "golden thread” process is generally divided into two types: the “positive gold line” process and the “reverse gold line” process.
  • the “positive gold wire” process means that in the process of laying out the leads 25, one end of the lead 25 is first formed on the conductive end of the circuit board 21, and then the lead 25 is bent and extended, and finally The other end of the lead 25 is formed on the conductive end of the photosensitive chip 22. In this way, the lead 25 is formed between the photosensitive chip 22 and the circuit board 21.
  • the "reverse gold wire” process means that in the process of laying the lead 25, one end of the lead 25 is formed on the conductive end of the photosensitive chip 22, and then the lead 25 is bent and extended, and finally The other end of the lead 25 is formed on the conductive end of the circuit board 21. In this way, the lead 25 is formed between the photosensitive chip 22 and the circuit board 21. It is worth mentioning that the height of the upward protrusion of the lead 25 formed by the "reverse gold wire” process is relative to the height of the upward protrusion of the lead 25 formed by the "positive gold wire” process. Therefore, preferably, In this specific implementation, the wire 25 is formed using the "reversed gold wire” process.
  • the photosensitive chip 22 and the circuit board 21 can be connected in other ways, for example, a back-connected way. In this regard, this application is not limited.
  • the photosensitive chip 22 is mounted on the circuit board 21, that is, the circuit board 21 has a photosensitive chip mounting area 210 for mounting the photosensitive chip 22 thereon.
  • the size of the photosensitive chip 22 in the camera module is gradually increasing, which leads to the problem of chip deformation during the process of mounting the photosensitive chip 22 on the circuit board 21 It is more likely to happen and more severe.
  • the structure of the circuit board 21 is modified to match the improved mounting process of the photosensitive chip 22.
  • the circuit board 21 includes a circuit board main body 211 and an ink layer 212 formed on the circuit board main body 211 to protect the printed circuit board by the ink layer 212.
  • the exposed wire paths on the circuit board main body 211 can protect the circuit board main body 211.
  • the ink layer 212 can also prevent moisture and various dielectrics from oxidizing the circuit to harm the electrical performance and prevent external mechanical damage.
  • the ink layer 212 can also be solder-proof and insulated, prevent short circuits caused by the soldering of the electronic components 23, save the amount of solder, and can also avoid conduction between circuits. It is worth mentioning that the conductive ends on the circuit board main body 211 are exposed to the ink layer 212.
  • the ink layer 212 includes a hollow area 213 formed in the photosensitive chip mounting area 210, wherein the hollow area 213 is configured to apply an adhesive 26 on The adhesive 26 is used to make the photosensitive chip 22 bend downward during the process of mounting the photosensitive chip 22 on the circuit board 21. That is to say, in the embodiment of the present application, the area corresponding to the photosensitive chip 22 in the ink layer 212 is hollowed out to form the hollowed-out area 213 on the photosensitive chip mounting area 210.
  • the adhesive 26 applied in the hollowed-out area 213 will shrink during the curing process and be located at the Compared with the adhesive 26, the ink layer 212 around the adhesive 26 has the characteristics of less deformation, so that the lower surface of the photosensitive chip 22 is bent downward.
  • FIG. 5 illustrates a schematic top view of the photosensitive component 20 according to an embodiment of the present application.
  • the hollow area 213 is located in the photosensitive chip mounting area 210. That is to say, in the embodiment of the present application, the hollow area 213 is contained in the photosensitive chip mounting area 210.
  • the boundary of the hollow area 213 is completely located in the photosensitive chip mounting area 210, that is, from the photosensitive chip 22 and the ink layer From the perspective of the relative position of 212, the projection of the photosensitive chip 22 and the ink layer 212 on the circuit board 21 has only a closed overlapping area.
  • the adhesive 26 is first applied to the hollow area 213 (it should be understood that in the embodiment of the present application, The application position of the adhesive 26 includes not only the hollowed-out area 213, but also the part of the ink layer 212 used to support the photosensitive chip 22); further, the photosensitive chip 22 is placed on the On the photosensitive mounting area (it should be understood that at this time, the edge of the photosensitive chip 22 is supported on the ink layer 212); further, the adhesive 26 is cured to bond the photosensitive chip 22 to the On the circuit board main body 211.
  • the adhesive 26 will shrink to a certain extent, so that after the adhesive 26 corresponding to the middle area of the lower surface of the photosensitive chip 22 shrinks, The lower surface of the photosensitive chip 22 is pulled to bend downward, so as to adjust the bending state of the photosensitive chip 22.
  • the lower surface of the photosensitive chip 22 is bent downward under the action of the adhesive 26. Therefore, the photosensitive chip 22 is bent toward the object side during the pickup process. The degree of exposure is reduced, so that it tends to be flat, and even the photosensitive chip 22 is convexly curved toward the image side under the action of the adhesive 26. That is to say, in the embodiment of the present application, the adhesive 26 can compensate for the convex curvature of the photosensitive chip 22 toward the object side caused by the baking and cooling of the circuit board 21.
  • the center of the hollow area 213 corresponds to the center of the photosensitive chip mounting area 210.
  • the center of the hollow area 213 coincides with the center of the mounting area of the photosensitive chip 22, or the hollow area 213 and the photosensitive chip mounting area 210 are arranged coaxially.
  • the center of the hollow area 213 corresponds to the center of the photosensitive surface of the photosensitive chip 22, wherein
  • the photosensitive surface of the photosensitive chip 22 represents the area set by the photosensitive area of the photosensitive chip 22. It is worth mentioning that in the existing photosensitive chip, the photosensitive surface of the photosensitive chip 22 is not necessarily located in the central area of the photosensitive chip 22.
  • the shape of the hollow area 213 is a centrally symmetrical figure, for example, a cross shape (as shown in FIG. 6), so that the photosensitive chip 22 can be uniformly bent.
  • the graphics of the hollow area 213 can also be implemented as other graphics, such as a circle, an ellipse, a regular multi-deformation, etc., which is not limited by this application.
  • the shape of the hollow area 213 is a centrally symmetrical figure, from the perspective of the relative positions of the photosensitive chip 22 and the ink layer 212, the photosensitive chip 22 and the ink layer 212 are on the line
  • the overlapping area of the projection on the board 21 is symmetrically distributed with respect to the photosensitive chip 22.
  • the shape of the hollow area 213 corresponds to the shape of the photosensitive chip mounting area 210.
  • the existing photosensitive chip 22 usually has a rectangular structure.
  • the photosensitive chip mounting area 210 is implemented as a rectangle corresponding to the size of the photosensitive chip 22, and the shape of the hollow area 213 is a rectangle scaled according to a specific ratio.
  • the shape design of the photosensitive chip 22 in different scenarios will change.
  • the photosensitive chip mounting area 210 The shape of the hollow area 213 needs to be changed simultaneously.
  • the width of the hollow area 213 corresponding to the shorter side of the photosensitive chip mounting area 210 is larger than that of the hollow area 213 corresponding to the longer side of the photosensitive chip mounting area 210.
  • the width of the side so that the short side of the photosensitive chip 22 can relatively be bent relatively.
  • the width of the hollow area 213 corresponding to the shorter side of the photosensitive chip mounting area 210 is configured to be greater than the width of the hollow area 213 corresponding to the longer side of the photosensitive chip mounting area 210. It is beneficial to improve the imaging quality of the photosensitive component 20 and the camera module.
  • FIG. 7 illustrates a schematic top view of another modified implementation of the photosensitive assembly 20 according to an embodiment of the present application.
  • the boundary portion of the hollow area 213 coincides with the two boundaries of the photosensitive chip mounting area 210.
  • the projection of the photosensitive chip 22 and the ink layer 212 on the circuit board 21 includes two overlapping areas.
  • the non-overlapping area between the hollow area 213 and the photosensitive chip mounting area 210 is located on the shorter side of the photosensitive chip mounting area 210, In this way, the short side of the photosensitive chip 22 is relatively bent. More preferably, as shown in FIG. 7, the non-overlapping area of the hollow area 213 and the photosensitive chip mounting area 210 is symmetrically distributed with respect to the center of the photosensitive chip mounting area 210, so that the photosensitive chip 22 is curved Can be more uniform.
  • FIG. 8 illustrates a schematic top view of another modified implementation of the photosensitive assembly 20 according to an embodiment of the present application.
  • the boundary portion of the hollow area 213 coincides with the four boundaries of the photosensitive chip mounting area 210.
  • the projection of the photosensitive chip 22 and the ink layer 212 on the circuit board 21 includes four overlapping areas.
  • the non-overlapping area of the hollow area 213 and the photosensitive chip mounting area 210 is located in the corner area of the photosensitive chip mounting area 210. It should be understood that since the lens focal plane is farther away from the central field of view, the degree of curvature is higher, and therefore, the corner area of the photosensitive chip 22 can have a larger curvature to match the field curvature of the lens for imaging. More preferably, as shown in FIG. 8, the non-overlapping area between the hollow area 213 and the photosensitive chip mounting area 210 is located at 4 corner areas of the photosensitive chip mounting area 210.
  • the non-overlapping area of the hollow area 213 and the photosensitive chip mounting area 210 may be set at two corners of the photosensitive chip 22 area.
  • the region, in this regard, is not limited by this application.
  • FIG. 9 illustrates a schematic top view of another modified implementation of the photosensitive component 20 according to an embodiment of the present application, in which the photosensitive component 20 shown in FIG. 9 is a schematic diagram of the photosensitive component 20 shown in FIG. Transformation implementation.
  • FIG. 10 illustrates a schematic top view of another modified implementation of the photosensitive component 20 according to the embodiment of the present application, wherein the photosensitive component 20 shown in FIG. 10 is a schematic diagram of the photosensitive component 20 shown in FIG. Transformation implementation.
  • FIG. 11 illustrates a schematic top view of another modified implementation of the photosensitive component 20 according to an embodiment of the present application, in which the photosensitive component 20 shown in FIG. 11 is a schematic diagram of the photosensitive component 20 shown in FIG. Transformation implementation.
  • the ink layer 212 further includes at least one air escape channel 214, and the at least one air escape channel 214 extends outward from the hollow area 213 and protrudes from the photosensitive chip Installation area 210.
  • the function of the at least one air escape channel 214 is to avoid unexpected inclination and/or bending of the photosensitive chip 22 due to the expansion of the gas in the enclosed space.
  • the closed space refers to the closed space enclosed by the photosensitive component 20 and the hollow area 213. Specifically, when the adhesive 26 is solidified, the enclosed space is baked and cooled. If the at least one air escape channel 214 is not provided, the gas in the enclosed space cannot be exchanged with the outside. When the air pressure in the enclosed space exceeds the preset threshold, the photosensitive chip 22 may be tilted and/or unexpectedly. Or bend.
  • the at least one air escape channel 214 is formed on the side of the circuit board 21 without the lead 25.
  • the at least one air escape channel 214 may also be formed on the side of the circuit board 21 where the lead 25 exists, as shown in FIG. 10.
  • the distance between the conductive end and the photosensitive chip mounting area 210 is about 100 microns. Therefore, if at least one air escape channel 214 is provided in the circuit board 21 At one side of the lead 25, attention should be paid to the length of the at least one air escape channel 214 protruding from the photosensitive chip mounting area 210.
  • the length is less than 100 microns to prevent the ink located on the peripheral side of the conductive end from being removed.
  • the ink has the function of soldering and insulation, and after the ink on the peripheral side of the conductive end is removed, a short circuit may occur between adjacent conductive ends.
  • the at least one air escape channel 214 can also cause the photosensitive chip 22 to lower the portion of the ink layer 212 corresponding to the at least one air escape channel 214 to bend the photosensitive chip 22 during the bending process. Interference.
  • the wire path on the circuit board main body 211 may become Exposure (the conductive path is not shown in the figure). Based on this, in the wiring design process of the circuit board 21, the wire paths arranged at the position of the hollow area 213 can be reduced.
  • the adhesive 26 may be configured to have insulating properties to avoid short circuits between the wire paths.
  • the adhesive 26 When applying the adhesive 26 to the hollow area 213, preferably, the adhesive 26 is disposed in the hollow area 213 corresponding to the middle position of the photosensitive surface of the photosensitive chip 22, so that the photosensitive chip The middle area of the photosensitive surface 22 can be uniformly bent downward by the curing and contraction force of the adhesive 26, so that the imaging surface of the photosensitive chip 22 can be adjusted relatively uniformly.
  • the adhesive 26 can be arranged in a rice shape.
  • the area of the hollow area 213 is 30% to 90% of the area of the photosensitive chip mounting area 210. It should be understood that when the area of the hollow area 213 is small, the central area of the photosensitive chip 22 can be accurately curved toward the object side; and when the area of the hollow area 213 is large, it can be applied More of the adhesive 26 can provide a stronger adhesive force, so that the photosensitive chip 22 is firmly and stably bonded to the circuit board 21.
  • the adhesive 26 may also be arranged on the ink layer 212 in the photosensitive chip mounting area 210. Furthermore, preferably, the thickness of the adhesive 26 applied in the hollowed-out area 213 is higher than the thickness of the surrounding adhesive 26. In this way, during the curing process of the adhesive 26, the adhesive 26 applied in the hollow area 213 produces a larger amount of shrinkage, while the surrounding adhesive 26 has a relatively small amount of shrinkage. The ink layer 212 is not easily deformed. In this way, the bending state of the photosensitive chip 22 can be further adjusted.
  • the thickness of the ink layer 212 may be set to be between 30 and 100 microns.
  • the thickness of the part of the ink layer 212 for mounting the photosensitive chip 22 is higher than the thickness of other parts of the ink layer 212, as shown in FIGS. 12-14.
  • the part of the ink layer indicates the part of the ink layer 212 that is not used for mounting the photosensitive chip 22.
  • the thickness of the wire path in the circuit board 21 is increased, that is, the height of the wire and the conductive end is increased. As shown in FIG.
  • the thickness of the wire path in the circuit board 21 remains unchanged, and only the height of the ink layer 212 is increased.
  • the thickness of the wire path in the circuit board 21 remains unchanged, and only the portion of the ink layer 212 used to support the photosensitive chip 22 has an increased thickness.
  • the thickness of the ink layer 212 is too large, the solvent is difficult to volatilize when the ink is cured, which increases the manufacturing difficulty of the ink layer 212, and only the ink layer 212 used to support the photosensitive chip 22 is increased.
  • the manufacturing difficulty of the ink layer 212 is reduced, and at the same time, there is no need to add additional process problems due to changing the thickness of the wire path.
  • the thicker part of the ink layer 212 can be formed at one time or through multiple processes, which is not limited by this application.
  • the thickness of the adhesive 26 used to bond the photosensitive chip 22 and the circuit board 21 is about 10-50 microns, while the thickness of the ink layer 212 on the surface of the circuit board 21 is about At 20-30 microns.
  • the thicker adhesive 26 can produce greater shrinkage during the curing process, and has a better chip bending adjustment effect.
  • Using thick glue will make the photosensitive surface of the photosensitive chip 22 and the circuit The distance between the plates 21 becomes larger, thereby increasing the thickness of the camera module.
  • the camera module and its photosensitive component based on the embodiments of the present application are clarified, which hollow out the part of the ink layer of the circuit board corresponding to the photosensitive chip mounting area, so that the adhesive applied in the hollowed-out area makes the
  • the photosensitive chip is mounted on the photosensitive chip mounting area 210 of the circuit board, the photosensitive chip is bent downward. In this way, the bending state of the photosensitive chip 22 is adjusted to improve its imaging quality.
  • the camera module is implemented as a fixed-focus camera module as shown in FIGS. 3-11 as an example, a person of ordinary skill in the art should understand that the camera module involved in this application can also be It is implemented as a dynamic focus camera module, that is, the camera module further includes a driving element disposed between the optical lens 10 and the photosensitive assembly 20, so that the driving element carries the optical lens 10 along the photosensitive assembly. The path moves to change the distance between the optical lens 10 and the photosensitive component 20.
  • the camera module can also be implemented as an optical anti-shake camera module, that is, the camera module further includes an optical anti-shake motor disposed between the optical lens 10 and the photosensitive component 20 to The optical anti-shake motor prevents the image quality from being affected by shaking during shooting.
  • this application is not limited.
  • FIG. 17 illustrates a schematic diagram of the manufacturing process of the photosensitive component 20 according to an embodiment of the present application.
  • the manufacturing process of the photosensitive component 20 according to the embodiment of the present application first includes: forming a hollow area 213 on the photosensitive chip mounting area 210 of the circuit board 21, wherein the hollow area 213 is located in the photosensitive chip mounting area 210. Chip mounting area 210; then, applying an adhesive 26 on the hollow area 213 and the photosensitive chip mounting area 210; and finally mounting the photosensitive chip 22 on the photosensitive chip mounting area 210 to pass the The adhesive 26 bends the photosensitive chip 22 downward.
  • the process of forming the hollow area 213 on the photosensitive chip mounting area 210 of the circuit board 21 includes: first, providing a circuit board main body 211; then, forming an ink layer 212 on the circuit board main body 211; and The ink layer 212 is etched through an etching process to form the hollow area 213 on the photosensitive chip mounting area 210 of the circuit board 21.
  • the ink layer 212 may be formed on the circuit board main body 211 by any one of printing, curtaining, spraying, or rolling. Furthermore, an etching pattern is provided on the ink layer 212, wherein the etching pattern is made of a material that is not transparent to ultraviolet rays, and the etching pattern corresponds to the exposed conductive ends, resistors and capacitors, and other electronic components 23 pads.
  • the pattern of the hollow area 213 (for example, the conductive pattern on the film can be transferred to the ink layer 212 of the circuit board 21 by the photosensitive reaction of the photoresist); It does not transmit ultraviolet light, and the rest of the ink irradiated by ultraviolet light undergoes photopolymerization reaction, and the monomer becomes a polymer; finally, the non-photopolymerized ink on the surface of the circuit board 21 is removed by a weak alkaline solution, so that the bonding pad and the hollow area 213 are exposed .
  • the hollow area 213 may also be formed on the ink layer 212 in other ways.
  • the process of forming the hollow area 213 on the photosensitive chip mounting area 210 of the circuit board 21 includes: providing a circuit board main body 211; however, disposing a shield at the position where the hollow area 213 is to be formed Then, an ink layer 212 is formed around the shield, and at the same time, the shield is removed to form the hollow area 213 at a position corresponding to the shield.
  • the process of forming the hollow area 213 on the photosensitive chip mounting area 210 of the circuit board 21 includes: providing a circuit board main body 211; and printing on the circuit board by inkjet printing An ink layer 212 having the hollowed-out area 213 is formed on the main body 211.
  • the method for preparing the photosensitive component based on the embodiment of the present application is clarified, which can prepare the photosensitive component as described above and its modification.

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Abstract

一种感光组件及其摄像模组和制备方法，该感光组件包括感光芯片（22）和线路板（21），所述线路板（21）包括线路板主体（211）和形成于所述线路板主体（211）的油墨层（212）。所述油墨层（212）包括形成于所述线路板（21）的感光芯片安装区域（210）的镂空区域（213）。所述镂空区域（213）配置为施加黏着剂（26）于其上，以通过所述黏着剂（26）使得在感光芯片（22）贴装于所述线路板（21）的过程中所述感光芯片（22）向下弯曲。从而调整所述感光芯片（22）的弯曲状态以提高其成像质量。

Description

感光组件、摄像模组及其制备方法 技术领域
本申请涉及摄像模组领域，尤其涉及感光组件、摄像模组及其制备方法。
背景技术
随着移动电子设备的普及，被应用于移动电子设备的用于帮助使用者获取影像(例如视频或者图像)的摄像模组的相关技术得到了迅猛的发展和进步，并且在近年来，摄像模组在诸如医疗、安防、工业生产等诸多的领域都得到了广泛的应用。
随着消费者对移动电子设备(例如，智能手机)的成像质量要求越来越高，摄像模组中感光芯片尺寸逐渐增大。这引发了一系列技术问题，例如，芯片变形问题、摄像模组尺寸过大等。因此，需要改进的摄像模组结构设计和制备方案。
发明内容
本申请的主要目的在于提供一种感光组件、摄像模组及其制备方法，其中，所述线路板的油墨层具有形成于感光芯片安装区域的镂空区域，以通过施加在所述镂空区域内的黏着剂使得在感光芯片贴装于所述线路板的感光芯片安装区域的过程中所述感光芯片向下弯曲，通过这样的方式，调整所述感光芯片的弯曲状态以提高所述摄像模组的成像质量。
本申请的另一目的在于提供一种感光组件、摄像模组及其制备方法，其中，在所述感光芯片贴装于所述感光芯片安装区域的过程中，施加于所述镂空区域内的黏着剂会固化会产生收缩而位于所述黏着剂周围的油墨层相较于所述黏着剂具有不易形变的特性，以使得所述感光芯片的下表面向下弯曲以调整所述感光芯片的弯曲状态。
本申请的另一目的在于提供一种感光组件、摄像模组及其制备方法，其中，所述镂空区域位于所述感光芯片安装区域内且所述镂空区域与所述感光芯片安装区域的不重合区域位于所述感光芯片安装区域的较短边侧，以使得 在组装过程中，所述感光芯片的短边侧产生较大的弯曲，以适应光学镜头的场曲。
本申请的另一目的在于提供一种感光组件、摄像模组及其制备方法，其中，所述镂空区域位于所述感光芯片安装区域内且所述镂空区域与所述感光芯片安装区域的不重合区域位于所述感光芯片安装区域的转角区域，以使得在组装过程中，所述感光芯片的转角区域产生较大的弯曲，以适应光学镜头的场曲。
本申请的另一目的在于提供一种感光组件、摄像模组及其制备方法，其中，所述感光芯片直接粘接于线路板主体，以提高所述感光芯片与所述线路板的结合稳定性。
本申请的另一目的在于提供一种感光组件、摄像模组及其制备方法，其中，通过所述镂空区域，可进一步降低所述感光组件及其摄像模组的整体高度尺寸。
通过下面的描述，本申请的其它优势和特征将会变得显而易见，并可以通过权利要求书中特别指出的手段和组合得到实现。
为实现上述至少一目的或优势，本申请提供一种感光组件，其包括：
感光芯片；以及
线路板，包括线路板主体和形成于所述线路板主体的油墨层，所述油墨层包括形成于所述线路板上的感光芯片安装区域的镂空区域，所述镂空区域配置为施加黏着剂于其上，以通过所述黏着剂使得在所述感光芯片贴装于所述线路板的过程中所述感光芯片向下弯曲。
在根据本申请的感光组件中，所述镂空区域与所述感光芯片安装区域部分重合，并且，所述镂空区域与所述感光芯片安装区域的不重合区域位于所述感光芯片安装区域的较短边侧。
在根据本申请的感光组件中，所述镂空区域与所述感光芯片安装区域部分重合，并且，所述镂空区域与所述感光芯片安装区域的不重合区域位于所述感光芯片安装区域的转角区域。
在根据本申请的感光组件中，所述镂空区域与所述感光芯片安装区域的不重合区域相对于所述感光芯片安装区域对称分布。
在根据本申请的感光组件中，所述镂空区域对应于所述感光芯片安装区域的较短边侧的宽度大于所述镂空区域对应于所述感光芯片安装区域的较 长边侧的宽度。
在根据本申请的感光组件中，所述镂空区域的中心对应于所述感光芯片安装区域的中心。
在根据本申请的感光组件中，所述镂空区域的形状为中心对称图形。
在根据本申请的感光组件中，所述镂空区域的形状对应于所述感光芯片安装区域的形状。
在根据本申请的感光组件中，所述镂空区域的形状为十字型。
在根据本申请的感光组件中，所述油墨层还包括至少一逃气通孔，所述至少一逃气通孔自所述镂空区域往外延伸并突出所述感光芯片安装区域。
在根据本申请的感光组件中，所述感光组件还包括设置于所述线路板的至少一电子元器件和用于电连接所述感光芯片和所述线路板的引线，其中，所述至少一逃气通道形成于所述线路板上没有所述引线和所述电子元器件的一侧。
在根据本申请的感光组件中，所述镂空区域的面积为所述感光芯片安装区域面积的30～90％。
在根据本申请的感光组件中，所述油墨层中用于安装所述感光芯片的部分的厚度高于其他部分的油墨层的厚度。
在根据本申请的感光组件中，所述油墨层的厚度为30～100微米。
在根据本申请的感光组件中，所述黏着剂的厚度为10～100微米。
在根据本申请的感光组件中，所述油墨层相较于所述黏着剂不易变形。
在根据本申请的感光组件中，所述黏着剂具有绝缘性。
根据本申请的另一方面，本申请还提供一种摄像模组，其包括：
如上所述的感光组件；以及
保持于所述感光组件的感光路径上的光学镜头。
在根据本申请的摄像模组中，所述感光芯片的下表面的弯曲形状适配于所述摄像模组的实际焦点成像面的形状。
根据本申请的又一方面，还提供一种感光组件制备方法，其包括：
在线路板的感光芯片安装区域上形成镂空区域，其中，所述镂空区域位于所述感光芯片安装区域内；
在所述镂空区域和所述感光芯片安装区域上施加黏着剂；以及
将所述感光芯片贴装于所述感光芯片安装区域，以通过所述黏着剂向下 弯曲所述感光芯片。
在根据本申请的感光组件制备方法中，在线路板的感光芯片安装区域上形成镂空区域，包括：
提供一线路板主体；
在线路板主体上形成油墨层；以及
通过蚀刻工艺蚀刻所述油墨层，以在所述线路板的所述感光芯片安装区域上形成所述镂空区域。
在根据本申请的感光组件制备方法中，在线路板的感光芯片安装区域上形成镂空区域，包括：
提供一线路板主体；
在待形成镂空区域的位置设置一遮蔽物；
在所述遮蔽物的周围形成油墨层；以及
去除所述遮蔽物，以在所述遮蔽物对应的位置形成所述镂空区域。
在根据本申请的感光组件制备方法中，在线路板的感光芯片安装区域上形成镂空区域，包括：
提供一线路板主体；以及
通过喷墨打印的方式在所述线路板主体上形成具有所述镂空区域的油墨层。
通过对随后的描述和附图的理解，本申请进一步的目的和优势将得以充分体现。
本申请的这些和其它目的、特点和优势，通过下述的详细说明，附图和权利要求得以充分体现。
附图说明
通过结合附图对本申请实施例进行更详细的描述，本申请的上述以及其他目的、特征和优势将变得更加明显。附图用来提供对本申请实施例的进一步理解，并且构成说明书的一部分，与本申请实施例一起用于解释本申请，并不构成对本申请的限制。在附图中，相同的参考标号通常代表相同部件或步骤。
图1图示了现有的COB组装工艺中感光芯片的拾取过程的示意图。
图2图示了摄像模组的成像光路示意图。
图3图示了根据本申请实施例的摄像模组的示意图。
图4图示了根据本申请实施例的感光组件的示意图。
图5图示了根据本申请实施例的所述感光组件的俯视示意图。
图6图示了根据本申请实施例的所述感光组件的一变形实施的俯视示意图。
图7图示了根据本申请实施例的所述感光组件的另一变形实施的俯视示意图。
图8图示了根据本申请实施例的所述感光组件的又一变形实施的俯视示意图。
图9图示了根据本申请实施例的所述感光组件的又一变形实施的俯视示意图。
图10图示了根据本申请实施例的所述感光组件的又一变形实施的俯视示意图。
图11图示了根据本申请实施例的所述感光组件的又一变形实施的俯视示意图。
图12图示了根据本申请实施例的所述感光组件的又一变形实施的示意图。
图13图示了根据本申请实施例的所述感光组件的又一变形实施的示意图。
图14图示了根据本申请实施例的所述感光组件的又一变形实施的示意图。
图15图示了根据本申请实施例的所述感光组件的又一变形实施的示意图。
图16图示了根据本申请实施例的所述感光组件的又一变形实施的示意图。
图17图示了根据本申请实施例的所述感光组件的制备过程的示意图。
具体实施方式
下面，将参考附图详细地描述根据本申请的示例实施例。显然，所描述的实施例仅仅是本申请的一部分实施例，而不是本申请的全部实施例，应理解，本申请不受这里描述的示例实施例的限制。
申请概述
如上所述，随着消费者对终端设备的成像质量要求越来越高，摄像模组的感光芯片尺寸也逐渐增大，这引发了一系列技术问题，例如，芯片变形问题、摄像模组尺寸过大等。因此，需要改进的摄像模组结构设计和制备方案。
具体来说，现有的摄像模组通常采用COB(Chip on Board)工艺进行组装：拾取感光芯片拾取→贴附于线路板→将感光芯片电连接于线路板。然而，随着尺寸的不断增大，感光芯片在拾取过程中易发生形变。
图1图示了现有的COB组装工艺中感光芯片的拾取过程的示意图。如图1所示，在现有COB组装工艺中，采用吸附的方式拾取感光芯片，并且，由于感光芯片的感光区域无法接触，因此拾取器的吸嘴只能附着于感光芯片的非感光区域。在拾取过程中，由于吸嘴的吸气吸附作用，感光芯片会因被吸附而朝向感光芯片的感光面弯曲，呈向上凸起的形状(从如图1所呈现的效果来看，形象地说，可将感光芯片的弯曲形状定义为“哭脸”状)。
本领域技术人员应知晓，即使感光芯片没有发生“哭脸”状形变(即，感光芯片为平面状)，由于感光芯片的边缘部分和中心部分相对于光学镜头的光程差不同，镜头光学设计及镜头组装过程中存在组装公差等因素，导致成像光线在抵达感光芯片的边缘部分时，容易出现畸变、边角失光以及清晰度下降等不良现象，导致成像效果变差。在发生“哭脸”状形变之后，这些不良现象会进一步地加剧，更为严重地影响了成像质量。
具体来说，图2图示了摄像模组的成像光路示意图。如图2所示，在摄像模组的成像过程中，由于镜头光学设计及镜头组装过程中存在组装公差等因素，实际焦点成像面的形状为向像侧方向凸起的弧形面。本领域技术人员应知晓，当感光芯片所在平面与实际焦点成像面重合时，成像质量最佳。但是，在实际情况中，即使采用多镜片去调制摄像模组的光学系统，实际焦点平面依旧会呈现为弧形面。这也是即便感光芯片在拾取过程中没有变形却依旧会产生畸变、边角失光以及清晰度下降等不良现象的原因。然而，由于在拾取过程中，感光芯片发生了“哭脸”状形变，对照图2中实际焦点平面的形状应可以看出，“哭脸”状的形变恰好与实际焦点平面的形变方式相反，导致畸变、边角失光以及锐角下降等不良现象的程度被加剧，更为严重地影响摄像模组的成像质量。
另外，在感光芯片通过DA(D i e Attach，芯片贴附)工艺贴装于线路板的对应区域的过程中，由于线路板和感光芯片的热膨胀系数不一致，黏着剂在通过烘烤固化过程中，线路板所产生的膨胀量大于感光芯片，而在温度重新降为室温时，线路板所产生的收缩量也大于感光芯片，导致所述感光芯片出现向像侧凸起的弯曲。也就是说，在将感光芯片通过DA工艺贴装于线路板时，哭脸状的变形被加剧，导致出现畸变、边角失光以及锐角下降等不良现象，使得成像效果进一步变差。
尤其地，对于高像素、大芯片尺寸的摄像模组而言，由于其感光芯片尺寸快速增加且感光芯片相较于其他一般芯片的厚度要薄，因此，大尺寸的感光芯片更容易产生弯曲问题，对摄像模组的成像品质的影响越来越大。
针对上述技术问题，本申请的基本构思是将线路板的油墨层中对应于感光芯片安装区域的部分进行镂空，以通过施加在镂空区域内的黏着剂使得在感光芯片贴装于所述线路板的感光芯片安装区域的过程中所述感光芯片向下弯曲，通过这样的方式，调整所述感光芯片的弯曲状态以提高其成像质量。
基于此，本申请提出了一种感光组件，其包括：感光芯片和线路板，其中，所述线路板包括线路板主体和形成于所述线路板主体的油墨层，所述油墨层包括形成于所述线路板的感光芯片安装区域的镂空区域，所述镂空区域配置为施加黏着剂于其上，以通过所述黏着剂使得在感光芯片贴装于所述线路板的过程中所述感光芯片向下弯曲。这样，调整所述感光芯片的弯曲状态以提高其成像质量。
在介绍本申请的基本原理之后，下面将参考附图来具体介绍本申请的各种非限制性实施例。
示例性摄像模组及其感光组件
如图3和图4所示，根据本申请实施例的摄像模组被阐明，其中，所述摄像模组包括光学镜头10和感光组件20，所述光学镜头10保持于所述感光组件20的感光路径，以使得藉由所述光学镜头10所采集的光线能够沿着该感光路径在所述感光组件20中成像。
如图4所示，根据本申请实施例的所述感光组件20，包括：线路板21、感光芯片22、至少一电子元器件23和封装体24，其中，所述感光芯片22电连接于所述线路板21，所述至少一电子元器件23设于所述感光芯片22 的周围且电连接于所述线路板21，所述封装体24设置于所述线路板21并被配置用于安装所述光学镜头10于其上。
具体来说，在本申请实施例中，所述封装体24被实施为传统的塑料支架，其预制而成并通过COB工艺贴装于所述线路板21的预设位置。当然，本领域技术人员应可以理解，在本申请其他示例中，所述封装体24还可以被实施为其他类型封装体24。例如，所述封装体24可被实施为通过MOB(Molding on Board)工艺形成于所述线路板21并一体包覆所述线路板21的至少一部分和所述电子元器件23的至少一部分的模塑支架，如图15所示。再如，所述封装体24还可被实施为通过MOC(Molding on Chip)工艺形成于所述线路板21并一体包覆所述线路板21的至少一部分、所述感光芯片22的非感光区域的至少一部分和所述电子元器件23的至少一部分的模塑支架，如图16所示。对此，并不为本申请所局限。
在本申请实施例中，所述至少一电子元器件23可通过表面贴装工艺(Surface Mounting Technology)贴装于所述线路板21的上表面。通常，所述至少一电子元器件23贴装于所述感光芯片22的周围区域。或者，所述至少一电子元器件23还可以预埋于所述线路板21，以降低所述至少一电子元器件23突出于所述线路板21的高度。应可以理解，对于所述至少一电子元器件23的安装工艺，并不为本申请所局限。同时，在本申请实施例中，所述至少一电子元器件23的类型并不为本申请所局限，其包括但不限于电容、电感、三极管、晶闸管、电阻等。
在本申请实施例中，所述感光芯片22和所述线路板21之间的电气连接通过引线25实现。具体来说，在本申请实施例中，每一所述引线25弯曲地延伸于所述感光芯片22和所述线路板21之间，以通过所述引线25将所述感光芯片22电连接于所述线路板21，从而，所述线路板21可基于所述引线25对所述感光芯片22进行供电，以及，所述感光芯片22可基于所述引线25将所采集到的信号传输出去。值得一提的是，所述引线25的类型并不为本申请所局限，例如，所述引线25可以是金线、银线、铜线。并且，所述引线25可通过“打金线”的工艺安装于所述线路板21和所述感光芯片22之间，以用于实现两者之间的电连接。
具体来说，“打金线”工艺一般分为两种类型：“正打金线”工艺和“反打金线”工艺。“正打金线”工艺指的是在布设所述引线25的过程中， 首先在所述线路板21的导电端上形成所述引线25的一端，进而弯曲地延伸所述引线25，并最终在所述感光芯片22的导电端上形成所述引线25的另一端，通过这样的方式，在所述感光芯片22和所述线路板21之间形成所述引线25。“反打金线”工艺指的是在布设所述引线25的过程中，首先在所述感光芯片22的导电端上形成所述引线25的一端，进而弯曲地延伸所述引线25，并最终在所述线路板21的导电端上形成所述引线25的另一端，通过这样的方式，在所述感光芯片22和所述线路板21之间形成所述引线25。值得一提的是，通过“反打金线”工艺所形成的所述引线25向上突起的高度相对“正打金线”工艺所形成的所述引线25向上突起的高度，因此，优选地，在该具体实施中，采用“反打金线”工艺形成所述引线25。
当然，本领域的技术人员应知晓，在本申请的其他示例中，所述感光芯片22和所述线路板21可通过其他方式进行导通，例如采用背部导通的方式。对此，并不为本申请所局限。
在本申请实施例中，所述感光芯片22贴装于所述线路板21，也就是说，所述线路板21具有感光芯片安装区域210，用于安装所述感光芯片22于其上。如前所述，随着消费者对终端设备的成像质量要求越来越高，摄像模组中感光芯片22尺寸逐渐增大，导致在贴装感光芯片22于线路板21的过程中芯片变形问题更易发生且更为严峻。针对于此技术问题，在本申请实施例中，对所述线路板21的结构进行改造并匹配改进的感光芯片22贴装工艺。
具体来说，如图4所示，在本申请实施例中，所述线路板21包括线路板主体211和形成于所述线路板主体211的油墨层212，以通过所述油墨层212保护所述线路板主体211上裸露的导线通路，以达到保护线路板主体211的目的。并且，所述油墨层212还能够防止湿气及各种电介质的侵害使线路氧化而危害电气性能，并防止外来的机械伤害的目的。同时，所述油墨层212还可以防焊绝缘，防止在电子元器件23焊接式造成短路，并节省焊锡用量，还能够避免线路之间的导通。值得一提的是，所述线路板主体211上的导电端暴露于所述油墨层212。
特别地，如图4所示，在本申请实施例中，所述油墨层212包括形成于所述感光芯片安装区域210的镂空区域213，其中，所述镂空区域213配置为施加黏着剂26于其上，以通过所述黏着剂26使得在感光芯片22贴装 于所述线路板21的过程中所述感光芯片22向下弯曲。也就是说，在本申请实施例中，所述油墨层212中对应于所述感光芯片22的区域被镂空，以在所述感光芯片安装区域210上形成所述镂空区域213。相应地，在所述感光芯片22贴装于所述线路板21的所述感光芯片安装区域210时，施加于所述镂空区域213内的所述黏着剂26在固化过程中会收缩而位于所述黏着剂26周围的油墨层212相较于所述黏着剂26具有不易形变的特性，以使得所述感光芯片22的下表面向下弯曲。
具体来说，图5图示了根据本申请实施例的所述感光组件20的俯视示意图。如图5所示，在本申请实施例中，所述镂空区域213位于所述感光芯片安装区域210内。也就是说，在本申请实施例中，所述镂空区域213被收容于所述感光芯片安装区域210内。特别地，在如图5所示意的所述感光组件20中，所述镂空区域213的边界完全位于所述感光芯片安装区域210内，也就是说，从所述感光芯片22和所述油墨层212的相对位置角度来看，所述感光芯片22与所述油墨层212在所述线路板21上的投影只有一个封闭的重叠区域。
相应地，在将所述感光芯片22贴装于所述感光芯片安装区域210的过程中，首先将所述黏着剂26施加于所述镂空区域213内(应可以理解，在本申请实施例中，所述黏着剂26的施加位置不仅包括所述镂空区域213，还可以包括所述油墨层212中用于支持所述感光芯片22的部分)；进而，将所述感光芯片22放置于所述感光安装区域上(应可以理解，此时，所述感光芯片22的边缘被支持于所述油墨层212上)；进而，固化所述黏着剂26以将所述感光芯片22粘接于所述线路板主体211上。应可以理解，在所述黏着剂26固化的过程中，所述黏着剂26会产生一定的收缩，这样，在对应于所述感光芯片22的下表面中间区域的所述黏着剂26收缩后，会拉到所述感光芯片22的下表面向下弯曲，从而调整所述感光芯片22的弯曲状态。具体来说，在本申请实施例中，所述感光芯片22的下表面在所述黏着剂26的作用下向下弯曲，因此，所述感光芯片22在拾取过程中产生的朝向物侧方向弯曲的程度得以降低，使其趋向平整，甚至，在所述黏着剂26的作用下所述感光芯片22朝向像侧方向凸起地弯曲。也就是说，在本申请实施例中，所述黏着剂26可以补偿线路板21由于烘烤、冷却导致的所述感光芯片22朝向物侧方向凸起的弯曲。
较佳地，在本申请实施例中，所述镂空区域213的中心对应于所述感光芯片安装区域210的中心。也就是说，优选地，所述镂空区域213的中心与所述感光芯片22的安装区域的中心重合，或者，所述镂空区域213与所述感光芯片安装区域210同轴地设置。
较佳地，在本申请实施例中，当所述感光芯片22贴装于所述感光芯片安装区域210时，所述镂空区域213的中心对应于所述感光芯片22的感光面的中心，其中，所述感光芯片22的感光面表示所述感光芯片22的感光区域所设定的区域。值得一提的是，在现有的感光芯片中，所述感光芯片22的感光面不一定位于所述感光芯片22的中心区域。
较佳地，在本申请实施例中，所述镂空区域213的形状为中心对称图形，例如，十字型(如图6所示)，以使得所述感光芯片22能够均匀地弯曲。值得一提的是，所述镂空区域213的图形还可以被实施为其他图形，例如，圆形、椭圆形、正多变形等，对此，并不为本申请所局限。同时，应可以理解，当所述镂空区域213的形状为中心对称图形时，从感光芯片22和油墨层212的相对位置角度来看，所述感光芯片22与所述油墨层212在所述线路板21上的投影的重叠区域是相对于所述感光芯片22对称分布的。
较佳地，在本申请实施例中，所述镂空区域213的形状对应于所述感光芯片安装区域210的形状。本领域普通技术人员应知晓，现有的感光芯片22通常具有矩形结构。相应地，优选地，在本申请实施例中，所述感光芯片安装区域210被实施为对应于所述感光芯片22尺寸的矩形，以及，所述镂空区域213的形状为按照特定比例缩放的矩形。当然，本领域技术人员应可以理解，随着技术的发展所述感光芯片22在不同场景下其形状设计会发生变化，当所述感光芯片22的形状发生变化时，所述感光芯片安装区域210和所述镂空区域213的形状需同步地做出改变。
较佳地，在本申请实施例中，所述镂空区域213对应于所述感光芯片安装区域210的较短边侧的宽度大于所述镂空区域213对应于所述感光芯片安装区域210的较长边侧的宽度，以使得所述感光芯片22的短边侧能相对产生较大的弯曲。本领域普通技术人员应可以理解，通常来说，镜头焦点面越远离中心视场处的弯曲程度越高，且感光芯片22在因线路板21涨缩的影响下而产生的弯曲也呈现出短边侧较大的情况。因此，将所述镂空区域213对应于所述感光芯片安装区域210的较短边侧的宽度配置为大于所述镂 空区域213对应于所述感光芯片安装区域210的较长边侧的宽度，有利于改善所述感光组件20和所述摄像模组的成像质量。
图7图示了根据本申请实施例的所述感光组件20的另一变形实施的俯视示意图。如图7所示，在该变形实施中，所述镂空区域213的边界部分与所述感光芯片安装区域210的两条边界重合。如图7所示，从感光芯片22和油墨层212的相对位置角度来看，所述感光芯片22与所述油墨层212在所述线路板21上的投影包括两个重叠区域。
较佳地，如图7所示，在该变形实施例中，所述镂空区域213与所述感光芯片安装区域210之间的不重合区域位于所述感光芯片安装区域210的较短边侧，以使得所述感光芯片22的短边侧产生相对较大的弯曲。更较佳地，如图7所示，所述镂空区域213与所述感光芯片安装区域210的不重合区域相对于所述感光芯片安装区域210中心对称分布，以使得所述感光芯片22的弯曲能够更加均匀。
图8图示了根据本申请实施例的所述感光组件20的又一变形实施的俯视示意图。如图8所示，在该变形实施中，所述镂空区域213的边界部分与所述感光芯片安装区域210的四条边界重合。如图8所示，从感光芯片22和油墨层212的相对位置角度来看，所述感光芯片22与所述油墨层212在所述线路板21上的投影包括四个重叠区域。
较佳地，如图8所示，在该变形实施例中，所述镂空区域213与所述感光芯片安装区域210的不重合区域位于所述感光芯片安装区域210的转角区域。应可以理解，由于镜头焦点面越远离中心视场处的弯曲程度越高，因此，可以使得所述感光芯片22的转角区域具有较大弯曲，以配合镜头的场曲进行成像。更较佳地，如图8所示，所述镂空区域213与所述感光芯片安装区域210的不重合区域位于所述感光芯片安装区域210的4个转角区域。当然，本领域普通技术人员应可以理解，在该变形实施的其他示例中，所述镂空区域213与所述感光芯片安装区域210的不重合区域可设置于所述感光芯片22区域的2个转角区域，对此，并不为本申请所局限。
图9图示了根据本申请实施例的所述感光组件20的又一变形实施的俯视示意图，其中，图9中所示意的所述感光组件20为图5所示意的所述感光组件20的变形实施。图10图示了根据本申请实施例的所述感光组件20的又一变形实施的俯视示意图，其中，图10中所示意的所述感光组件20 为图7所示意的所述感光组件20的变形实施。图11图示了根据本申请实施例的所述感光组件20的又一变形实施的俯视示意图，其中，图11中所示意的所述感光组件20为图8所示意的所述感光组件20的变形实施。如图9-11所示，在该变形实施中，所述油墨层212还包括至少一逃气通道214，所述至少一逃气通道214自所述镂空区域213往外延伸并突出所述感光芯片安装区域210。
特别地，在本申请实施例中，所述至少一逃气通道214的作用在于避免因封闭空间中的气体膨胀而对所述感光芯片22造成预料之外的倾斜和/或弯曲。这里，封闭空间指的是由所述感光组件20和所述镂空区域213所围成的封闭空间。具体来说，在进行所述黏着剂26的固化时，会对封闭空间进行烘烤并进行冷却。如果没有设置所述至少一逃气通道214，封闭空间内的气体无法与外界进行交换，当封闭空间内气压超过预设阈值后，便可能对所述感光芯片22造成预料之外的倾斜和/或弯曲。
较佳地，如图9和图11所示，所述至少一逃气通道214形成于所述线路板21上没有所述引线25的一侧。当然，本领域技术人员应可以理解，所述至少一逃气通道214也可以形成于所述线路板21中存在所述引线25的一侧，如图10所示。特别地，本领域普通技术人员应知晓，导电端与所述感光芯片安装区域210之间的距离约为100微米左右，因此，如果将至少一逃气通道214设置于所述线路板21中存在所述引线25的一侧，需注意所述至少一逃气通道214的突出于所述感光芯片安装区域210的长度。优选地，该长度小于100微米，以避免位于导电端周侧的油墨被去除。本领域普通技术人员应知晓，油墨具有防焊绝缘的作用，导电端周侧的油墨被去除后，可能会使得相邻导电端之间发生短路。
值得一提的是，所述至少一逃气通道214还可以使得所述感光芯片22在弯曲的过程中降低所述至少一逃气通道214所对应的油墨层212部分对所述感光芯片22弯曲的干扰。
应可以理解，在本申请实施例中，在将所述油墨层212镂空以在所述油墨层212的中间区域形成所述镂空区域213后，位于所述线路板主体211上的导线通路可能会暴露(图中未示意导电通路)。基于此，可以在所述线路板21的布线设计过程中，减少布设在所述镂空区域213位置的导线通路。或者，可以将所述黏着剂26配置为具有绝缘性，以避免导线通路之间产生 短路。
在施加所述黏着剂26于所述镂空区域213时，优选地，所述黏着剂26布设于所述镂空区域213中对应所述感光芯片22的感光面的中间位置，从而使得所述感光芯片22的感光面的中间区域能够均匀地受所述黏着剂26固化收缩的力而向下弯曲，以使得可以相对均匀地调整所述感光芯片22的成像面。在具体实施中，所述黏着剂26可布设为米字型。
优选地，在本申请实施例中，所述镂空区域213的面积为所述感光芯片安装区域210面积的30～90％。应可以理解，当所述镂空区域213的面积较小时，可以准确地使得所述感光芯片22的中心区域向物侧方向凸起地弯曲；而所述镂空区域213的面积较大时，可以施加更多的所述黏着剂26以提供较强的粘接力，使所述感光芯片22牢固稳定的粘接于所述线路板21。
值得一提的是，在具体实施中，在所述感光芯片安装区域210中的所述油墨层212部分上同样也可以布设所述黏着剂26。并且，优选地，施加于所述镂空区域213内的所述黏着剂26的厚度高于周围的所述黏着剂26的厚度。这样，在所述黏着剂26固化的过程中，施加于所述镂空区域213内的所述黏着剂26产生较大的收缩量，而周围的所述黏着剂26的收缩量相对较少且周围的油墨层212不易变形，通过这样的方式，还可以进一步地调整所述感光芯片22的弯曲状态。
值得一提的是，在本申请实施例中，所述油墨层212的厚度可以设置为30～100微米之间。优选地，在本申请实施例中，所述油墨层212中用于安装所述感光芯片22的部分的厚度高于其他部分的油墨层212的厚度，如图12-14所示，这里，其他部分的油墨层表示所述油墨层212中不用于安装所述感光芯片22的部分。具体来说，如图12所示，所述线路板21中导线通路的厚度提高，即，导线和导电端的高度增高。如图13所示，所述线路板21中导线通路的厚度不变，仅增加所述油墨层212的高度。如图14所示，所述线路板21中导线通路的厚度不变，并且，仅有所述油墨层212中用于支持所述感光芯片22的部分的厚度增加。值得一提的是，当油墨层212厚度过大时，油墨固化时溶剂难以挥发，增大油墨层212的制造难度，而仅将用于支持所述感光芯片22的油墨层212部分增高，可以降低油墨层212的制造难度，同时不必因为改变导线通路的厚度而增加额外的工艺问题。在具体实施中，较厚的所述油墨层212部分可以一次性成型也可以通过多次工艺成 型，对此，并不为本申请所局限。
值得一提的是，在常规摄像模组中，用于粘接感光芯片22与线路板21之间的黏着剂26的厚度大约在10～50微米，而线路板21表面的油墨层212厚度约在20～30微米。较厚的所述黏着剂26在固化过程中可以产生较大的收缩量，具有较好的芯片弯曲调整效果，而使用胶厚的胶水又会使得所述感光芯片22的感光面与所述线路板21之间的距离变大，从而增加摄像模组的厚。综合考量上述因素，优选地将所述油墨层212的厚度设置在30～100微米之间，所述黏着剂26的厚度设置在10～100微米之间，从而在保证摄像模组的高度受到较小的影响同时，提供了一定的粘接力及芯片弯曲调整效果。
综上，基于本申请实施例的摄像模组及其感光组件被阐明，其将线路板的油墨层中对应于感光芯片安装区域的部分进行镂空，以通过施加在镂空区域内的黏着剂使得在感光芯片贴装于所述线路板的感光芯片安装区域210的过程中所述感光芯片向下弯曲，通过这样的方式，调整所述感光芯片22的弯曲状态，以提高其成像质量。
虽然，以上以所述摄像模组被实施为如图3-11所示意的定焦摄像模组为示例，本领域普通技术人员应可以理解，本申请所涉及的所述摄像模组还可以被实施为动焦摄像模组，即，所述摄像模组还包括设置于光学镜头10和感光组件20之间的驱动元件，以通过所述驱动元件承载着所述光学镜头10沿着所述感光路径移动，以改变所述光学镜头10和所述感光组件20之间的距离。或者，所述摄像模组还可以被实施为光学防抖摄像模组，即，所述摄像模组还包括设置于所述光学镜头10和所述感光组件20之间的光学防抖马达，以通过所述光学防抖马达防止拍摄时因抖动而影响成像质量。对此，并不为本申请所局限。
示意性感光组件制备方法
根据本申请另一方面，还提供一种感光组件20制备方法。图17图示了根据本申请实施例的所述感光组件20的制备过程的示意图。如图17所示，根据本申请实施例的所述感光组件20制备过程，首先包括：在线路板21的感光芯片安装区域210上形成镂空区域213，其中，所述镂空区域213位于所述感光芯片安装区域210内；然后，在所述镂空区域213和所述感光芯片安装区域210上施加黏着剂26；以及，最终将感光芯片22贴装于 所述感光芯片安装区域210，以通过所述黏着剂26向下弯曲所述感光芯片22。
在本申请实施例中，在线路板21的感光芯片安装区域210上形成镂空区域213的过程，包括：首先，提供一线路板主体211；然后，在线路板主体211上形成油墨层212；以及，通过蚀刻工艺蚀刻所述油墨层212，以在所述线路板21的所述感光芯片安装区域210上形成所述镂空区域213。
具体来说，可以通过印刷、淋幕、喷涂或者滚涂等方式中的任意一种所述在线路板主体211形成所述油墨层212。进而，在所述油墨层212上设置一层蚀刻图案，其中，该蚀刻图案由不透紫外线的材料制成，并且该蚀刻图案对应于需要裸露的导电端、电阻电容等电子元器件23焊盘以及所述镂空区域213的图案(例如，可以是利用光抗蚀剂的感光反应将菲林上的导电图形转移到所述线路板21的油墨层212上)；接着照射紫外线，由于蚀刻图案之外不透过紫外线，其余受到紫外线照射的油墨发生感光聚合反应，由单体成聚合体；最终，通过弱碱溶液去除线路板21表面上未感光聚合的油墨，使焊盘及镂空区域213裸露出来。
本领域技术人员应可以理解，在本申请其他示例中，还可以通过其他方式在所述油墨层212上形成所述镂空区域213。
例如，在本申请其他示例中，在线路板21的感光芯片安装区域210上形成镂空区域213的过程，包括：提供一线路板主体211；然而，在待形成镂空区域213的位置设置一遮蔽物；继而，在所述遮蔽物的周围形成油墨层212，同时，去除所述遮蔽物，以在所述遮蔽物对应的位置形成所述镂空区域213。
再如，在本申请其他示例中，在线路板21的感光芯片安装区域210上形成镂空区域213的过程，包括：提供一线路板主体211；以及，通过喷墨打印的方式在所述线路板主体211上形成具有所述镂空区域213的油墨层212。
综上，基于本申请实施例的感光组件制备方法被阐明，其能够制备如上所述的感光组件及其变形实施。
本领域的技术人员应理解，上述描述及附图中所示的本发明的实施例只作为举例而并不限制本发明。本发明的目的已经完整并有效地实现。本发明 的功能及结构原理已在实施例中展示和说明，在没有背离所述原理下，本发明的实施方式可以有任何变形或修改。

Claims (24)

  1. 一种感光组件，其特征在于，包括：
    感光芯片；以及
    线路板，包括线路板主体和形成于所述线路板主体的油墨层，所述油墨层包括形成于所述线路板上的感光芯片安装区域的镂空区域，所述镂空区域配置为施加黏着剂于其上，以通过所述黏着剂使得在所述感光芯片贴装于所述线路板的过程中所述感光芯片向下弯曲。
  2. 根据权利要求1所述的感光组件，其中，所述镂空区域位于所述感光芯片安装区域内。
  3. 根据权利要求2所述的感光组件，其中，所述镂空区域与所述感光芯片安装区域部分重合，并且，所述镂空区域与所述感光芯片安装区域的不重合区域位于所述感光芯片安装区域的较短边侧。
  4. 根据权利要求2所述的感光组件，其中，所述镂空区域与所述感光芯片安装区域部分重合，并且，所述镂空区域与所述感光芯片安装区域的不重合区域位于所述感光芯片安装区域的转角区域。
  5. 根据权利要求3或4所述的感光组件，其中，所述镂空区域与所述感光芯片安装区域的不重合区域相对于所述感光芯片安装区域对称分布。
  6. 根据权利要求2所述的感光组件，其中，所述镂空区域对应于所述感光芯片安装区域的较短边侧的宽度大于所述镂空区域对应于所述感光芯片安装区域的较长边侧的宽度。
  7. 根据权利要求2所述的感光组件，其中，所述镂空区域的中心对应于所述感光芯片安装区域的中心。
  8. 根据权利要求7所述的感光组件，其中，所述镂空区域的形状为中心对称图形。
  9. 根据权利要求8所述的感光组件，其中，所述镂空区域的形状对应于所述感光芯片安装区域的形状。
  10. 根据权利要求8所述的感光组件，其中，所述镂空区域的形状为十字型。
  11. 根据权利要求1或2所述的感光组件，其中，所述油墨层还包括至少一逃气通孔，所述至少一逃气通孔自所述镂空区域往外延伸并突出所述感 光芯片安装区域。
  12. 根据权利要求11所述的感光组件，还包括设置于所述线路板的至少一电子元器件和用于电连接所述感光芯片和所述线路板的引线，其中，所述至少一逃气通道形成于所述线路板上没有设置所述引线的一侧。
  13. 根据权利要求2所述的感光组件，其中，所述镂空区域的面积为所述感光芯片安装区域面积的30～90％。
  14. 根据权利要求1或2所述的感光组件，其中，所述油墨层中用于安装所述感光芯片的部分的厚度高于其他部分的油墨层的厚度。
  15. 根据权利要求14所述的感光组件，其中，所述油墨层的厚度为30～100微米。
  16. 根据权利要求15所述的感光组件，其中，所述黏着剂的厚度为10～100微米。
  17. 根据权利要求1所述的感光组件，其中，所述油墨层相较于所述黏着剂不易变形。
  18. 根据权利要求1所述的感光组件，其中，所述黏着剂具有绝缘性。
  19. 一种摄像模组，其特征在于，包括：
    如权利要求1-18任一所述的感光组件；以及
    保持于所述感光组件的感光路径上的光学镜头。
  20. 根据权利要求19所述的摄像模组，其中，所述感光芯片的下表面的弯曲形状适配于所述摄像模组的实际焦点成像面的形状。
  21. 一种感光组件制备方法，其特征在于，包括：
    在线路板的感光芯片安装区域上形成镂空区域，其中，所述镂空区域位于所述感光芯片安装区域内；
    在所述镂空区域和所述感光芯片安装区域上施加黏着剂；以及
    将所述感光芯片贴装于所述感光芯片安装区域，以通过所述黏着剂向下弯曲所述感光芯片。
  22. 根据权利要求21所述的感光组件制备方法，其中，在线路板的感光芯片安装区域上形成镂空区域，包括：
    提供一线路板主体；
    在线路板主体上形成油墨层；以及
    通过蚀刻工艺蚀刻所述油墨层，以在所述线路板的所述感光芯片安装区 域上形成所述镂空区域。
  23. 根据权利要求21所述的感光组件制备方法，其中，在线路板的感光芯片安装区域上形成镂空区域，包括：
    提供一线路板主体；
    在待形成镂空区域的位置设置一遮蔽物；
    在所述遮蔽物的周围形成油墨层；以及
    去除所述遮蔽物，以在所述遮蔽物对应的位置形成所述镂空区域。
  24. 根据权利要求21所述的感光组件制备方法，其中，在线路板的感光芯片安装区域上形成镂空区域，包括：
    提供一线路板主体；以及
    通过喷墨打印的方式在所述线路板主体上形成具有所述镂空区域的油墨层。
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