WO2022241684A1 - 一种电路板组件、摄像模组及电子设备 - Google Patents
一种电路板组件、摄像模组及电子设备 Download PDFInfo
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- WO2022241684A1 WO2022241684A1 PCT/CN2021/094690 CN2021094690W WO2022241684A1 WO 2022241684 A1 WO2022241684 A1 WO 2022241684A1 CN 2021094690 W CN2021094690 W CN 2021094690W WO 2022241684 A1 WO2022241684 A1 WO 2022241684A1
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- WIPO (PCT)
- Prior art keywords
- circuit board
- board
- plate portion
- fixed
- camera module
- Prior art date
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- 230000003287 optical effect Effects 0.000 claims description 35
- 230000002093 peripheral effect Effects 0.000 claims description 25
- 230000008093 supporting effect Effects 0.000 claims description 15
- 230000003014 reinforcing effect Effects 0.000 claims description 12
- 239000000725 suspension Substances 0.000 claims description 11
- 239000000853 adhesive Substances 0.000 claims description 8
- 230000001070 adhesive effect Effects 0.000 claims description 8
- 239000002313 adhesive film Substances 0.000 claims description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 6
- 239000010931 gold Substances 0.000 claims description 5
- 229910052737 gold Inorganic materials 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 238000003384 imaging method Methods 0.000 abstract description 8
- 238000000034 method Methods 0.000 description 20
- 239000002184 metal Substances 0.000 description 14
- 229910052751 metal Inorganic materials 0.000 description 14
- 230000008569 process Effects 0.000 description 14
- 230000009286 beneficial effect Effects 0.000 description 10
- 238000003466 welding Methods 0.000 description 8
- 238000005530 etching Methods 0.000 description 6
- 230000006870 function Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 230000006641 stabilisation Effects 0.000 description 4
- 238000011105 stabilization Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000010354 integration Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 230000004308 accommodation Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910001285 shape-memory alloy Inorganic materials 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 241001391944 Commicarpus scandens Species 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/60—Control of cameras or camera modules
Definitions
- the present application relates to the field of imaging technology, in particular to a circuit board assembly, a camera module and electronic equipment.
- the movable circuit board carries an image sensor, so that the movable circuit board can move laterally (perpendicular to the direction of the optical axis) with the fixed circuit board .
- Space for flexible connectors should be reserved between the movable circuit board and the fixed circuit board, resulting in a large lateral dimension of the camera module, which is not conducive to the improvement of integration.
- the application discloses a circuit board assembly, a camera module and electronic equipment, which are used to reduce the lateral dimension of the camera module.
- a circuit board assembly which can be applied to camera modules in mobile terminals such as mobile phones and tablet computers, and can specifically include:
- the edge of the first plate portion and the edge of the second plate portion are arranged as a first stepped structure, and the orthographic projection of the second plate portion on the reference plane is located at the position of the first plate portion on the reference plane.
- the surface of the first board part away from the second board part is also provided with an electrical connection structure for electrical connection with the image sensor, so that the image sensor is arranged on the first board part, and the area of the first board part is smaller than that of the second board part.
- the area of the plate is large, which does not affect the carrying area of the surface of the first plate carrying the image sensor.
- the space contracted by the second plate relative to the first plate accommodates part of the flexible connection
- the parts can reduce the gap between the first board part and the fixed circuit board, and reduce the lateral size of the camera module.
- the first board part and the second board part have an integrated structure, so that the movable circuit board has higher stability; or, the first board part and the second board part are In the split structure, the second plate part is fixed to the first plate part, which can save the etching process and reduce the difficulty of molding.
- the first board part and the second board part are fixed and electrically connected by a conductive adhesive, so as to realize physical fixing and circuit conduction between the two.
- the conductive adhesive includes an anisotropic conductive adhesive film and/or solder paste. While fixing the first board part and the second board part together, the first board part and the second board part can also be fixed together. Part of the circuit on the board is turned on.
- the flexible connection part includes a flexible connection part fixed and electrically connected to the second board part, and the flexible connection part is surrounded by the outer peripheral wall of the second board part and the fixed circuit board.
- the inner peripheral wall of the hollow structure is kept fixed and electrically connected to realize the fixing and electrical connection with the fixed circuit board, and the flexible connection part is connected to the inner peripheral wall of the hollow structure opposite to the second plate part, so that there is no need to generate a large flex while reducing wear with the first plate portion.
- the flexible connection part includes a flexible connection part fixed and electrically connected to the second board part, the flexible connection part is kept fixed with the outer peripheral wall of the second board part, and the flexible connection part is away from One end of the second plate part is also provided with a fixing part; the inner peripheral wall surrounding the hollow structure has a slot matching the fixing part, and the fixing part is inserted into the slot from the inner peripheral wall Among them, the flexible connection part is fixed and electrically connected to the fixed circuit board, avoiding occupying the internal space of the hollow structure, which is beneficial to reducing the lateral size, and is conducive to increasing the contact area between the slot and the fixed part, ensuring the connection stability.
- the fixed circuit board has a second stepped structure along the edge of the hollow structure, and the second stepped structure forms the slot; along the optical axis direction, the first stepped structure
- the opening and the opening of the second stepped structure have the same orientation, so that the flexible connection part does not have a large bend, and avoids abrasion with the first plate part.
- a camera module in a second aspect, includes a lens, an image sensor, a drive assembly and the circuit board assembly according to any one of claims 1 to 7, wherein the image sensor is arranged on the second A board part is away from the surface of the second board part, and is electrically connected to the first board part through the electrical connection structure, and the lens is arranged on the side of the image sensor away from the first board part;
- the driving assembly is used to support the movable circuit board on the side of the lens close to the image sensor, and is used to drive the movable circuit board to move relative to the fixed circuit board along a direction perpendicular to the optical axis.
- the driving component supports the movable circuit board on the lens, so that the movable circuit board has the flexibility of lateral movement, and can drive the movable circuit board to move in a direction perpendicular to the optical axis to realize the anti-shake function;
- the first The surface of the plate part away from the second plate part has a larger area, which is beneficial to carry the image sensor.
- the image sensor is electrically connected to the first plate part through the electrical connection structure, and the light entering through the lens can be incident on the image sensor for imaging.
- the circuit board assembly has a smaller lateral size, so the camera module can have a smaller lateral size.
- the drive assembly includes: a support component and a lateral drive component, the support component and the lateral drive component are integrated together, the lateral drive component is connected to the side of the lens close to the image sensor, and is used to move the The support component moves relative to the fixed circuit board along a direction perpendicular to the optical axis, and the support component is used to support the movable circuit board on the lateral drive component, which is beneficial to improve integration and reduce assembly difficulty.
- the drive assembly includes: a support component and a lateral drive component; wherein, the support component and the lateral drive component are independently provided; the support component is used to support the movable circuit board on the lens close to the image One side of the sensor; the lateral driving part is used to drive the movable circuit board to move relative to the fixed circuit board in a direction perpendicular to the optical axis; the supporting part and the lateral driving part are independently arranged, which is conducive to separate manufacturing and reduces the cost of components .
- the horizontal driving part may include an optical anti-shake motor, which has a good anti-shake effect
- the supporting part includes a suspension wire, which can have a certain supporting effect and make the movable circuit board have a certain degree of support in the lateral direction. A certain degree of freedom.
- connection form between the support member and the first plate may specifically be: the camera module further includes a filter holder and an infrared cut filter, and the infrared cut filter is located between the lens and the image sensor Between, and the filter holder supports the infrared cut filter on the third surface; the support member is connected between the lens and the filter holder.
- the support member is indirectly connected to the first plate portion by using the filter holder, which is beneficial to reduce the occupied area of the surface of the first plate portion away from the second plate portion.
- the camera module further includes gold wires, and the image sensor is electrically connected to the electrical connection structure through the gold wires.
- the surface of the first board part facing away from the second board part is further provided with components electrically connected to the first board part, and the surface area of the first board part away from the second board part is larger, Arranging the components on the surface is beneficial to reduce the difficulty of setting the components.
- the camera module further includes a reinforcing plate, the reinforcing plate is arranged on the surface of the fixed circuit board facing away from the lens, and the reinforcing plate covers the hollow structure to protect the hollow structure Sealed to prevent dust from entering.
- an electronic device in a third aspect, includes a casing and the camera module provided by any one of the above technical solutions, and the camera module is arranged in the casing.
- the electronic device has the same advantages as the camera module, which will not be repeated here.
- FIG. 1 is an axial sectional view of the first camera module provided by the embodiment of the present application.
- Fig. 2 is an axial sectional view of the second camera module provided by the embodiment of the present application.
- FIG. 3 is an axial sectional view of a third camera module provided in an embodiment of the present application.
- FIG. 4 is an axial cross-sectional view of a fourth camera module provided by an embodiment of the present application.
- the camera module provided in the embodiment of the present application can be applied to mobile terminals such as mobile phones and tablet computers.
- the camera module may specifically include:
- the first plate portion 12 and the second plate portion 10 the so-called “thickness direction” here refers to the arrangement direction from the surface of the fixed circuit board 3 for mounting components to the surface of the fixed circuit board away from the surface on which components are mounted , the second plate portion 10 is electrically connected to the first plate portion 12 so as to realize conduction between the two, and the specific electrical connection method will be introduced later;
- the orthographic projection of the second plate portion 10 on the reference plane is located at Within the scope of the orthographic projection of the first plate portion 12 on the reference plane, the edge of the first plate portion 12 and the edge of the second plate portion 10 form a first stepped structure T1, wherein the reference plane is the first plate portion 12 The plane away from the surface of the second plate portion
- An electrical connection structure is provided on the surface of the first plate portion 12 away from the second plate portion 10, and the electrical connection structure may specifically be a plurality of pads, and the plurality of pads correspond to the pins of the image sensor 9 in a one-to-one manner.
- the area of the surface of the first plate portion 12 facing away from the second plate portion 10 is larger than the area of the surface of the second plate portion 10 facing away from the first plate portion 12, which is convenient for arranging a sufficiently large image sensor 8 and a sufficient number of components 5,
- the components 5 may be resistors, capacitors, driver ICs and other devices, and the components 5 are electrically connected to the first board portion 12 .
- the edge of the first plate portion 12 and the edge of the second plate portion 10 are set as a first stepped structure T1
- the orthographic projection of the second plate portion 10 on the reference plane is located on the first plate portion 12
- the accommodating space formed by the shrinkage of the second plate part 10 relative to the first plate part 12 accommodates part of the flexible connector 11, which can reduce
- the gap between the first board part 12 and the fixed circuit board 3 is reduced, and the lateral dimension of the camera module is reduced.
- the retraction distances of the edges of the second plate portion 10 may be the same or different, but when the geometric center of the first plate portion 12 and the geometric center of the hollow structure 17 coincide with the optical axis L At this time, if it is ensured that the shrinkage distances of the edges of the second plate portion 10 are consistent, then the accommodation space around the second plate portion 10 can accommodate equal-length flexible connectors 11, then, along the surrounding second plate portion The stress of the flexible connecting member 11 in the peripheral direction of 10 is consistent, which is conducive to the uniform stress of the second plate portion 10 in all directions. In addition, along the direction around the optical axis L, the retraction distance of the second plate portion 10 relative to the first plate portion 11 may also be different.
- the retraction distance at the edge position where the flexible connector 11 is provided is larger, and the retraction distance at the edge position where the flexible connector 11 is not provided is smaller.
- the larger area of the second plate portion 10 can be reserved, and the area of the surface of the second plate portion 10 away from the first plate portion 12 can be larger, leaving enough area to arrange components, which is beneficial to reduce the cost of components 5
- the arrangement density can be reduced, thereby reducing the difficulty of arrangement, or, the number of arrangement of components 5 can also be increased to improve performance, and at the same time, it is beneficial to increase the overall structural firmness of the movable circuit board.
- the bottom surface of the fixed circuit board 3 (the surface facing away from the lens 15) is also provided with a reinforcing plate 4, which covers the hollow structure 17 at the same time, and the reinforcing plate 4 has the functions of strengthening and sealing. It can prevent dust from entering the camera module through the hollow structure, and the connector M is connected to the fixed circuit board 3.
- the connector M can have gold fingers to electrically connect the fixed circuit board 3 to the main board, etc., so that the camera module can be connected to the electronic circuit board.
- the main board of the device implements signal conduction.
- the image sensor 8 is connected to the electrical connection structure on the first plate portion 12 through the gold wire 6, the imaging surface of the image sensor 8 is away from the first plate portion 12, and the imaging surface of the lens 15 is set opposite to the image sensor 8; the lens 15 and the image
- An infrared cut-off filter 7 is arranged between the sensors 8 to filter out the infrared light from the incident light of the lens 15 before entering the image sensor 8, so as to improve the imaging quality.
- the infrared cut filter 7 is supported on the first plate portion 12 through the filter holder 16 .
- the lens holder 13 is supported on the fixed circuit board 3 , and the fixed circuit board 3 and the lens holder 13 are bonded by glue 2 , and the lens 15 is covered inside.
- the camera module also includes an auto focus (AF, Auto Focus) motor 14, and the auto focus motor 14 is connected with the lens 15 in transmission, so as to realize the longitudinal movement of the lens 15 for focusing.
- the auto-focus motor 14 is connected with a drive assembly, therefore, it can also be considered that the drive assembly is connected to the side of the lens 15 close to the image sensor 8, but the drive assembly is indirectly connected to the lens 15 through the auto-focus motor 14, the drive assembly It includes an optical image stabilization motor (OIS, Optical Image Stabilization) 1 and a suspension wire, the suspension wire is integrated in the optical image stabilization motor 1, and the optical image stabilization motor 1 can take the suspension wire along the direction perpendicular to the optical axis relative to the auto focus motor 14 Move, the suspension wire is connected with the filter holder 16 to indirectly support the movable circuit board on the optical anti-shake motor 1, so that the movable circuit board has a degree of freedom of lateral movement, and the suspension wire is not directly connected with the first plate portion 12 , which saves the area of the
- the suspension wire can support (here indirectly support) the movable circuit board to the lens 15 .
- the suspension wire is used as a supporting part, and the so-called “supporting part” means that part A (such as a movable circuit board) can be supported (directly or indirectly) on part B (such as lens 15), and part A can be positioned relative to part B Move in the C plane, but cannot move in the D direction (such as the optical axis L direction), and the D direction is perpendicular to the C plane;
- the optical anti-shake motor 1 is used as a lateral driving component, and the suspension wire is integrated with the optical anti-shake motor 1,
- the suspension wire can also be replaced by other supporting components such as shrapnel, silicon wafer and film, as long as the lateral driving component is connected (either directly or indirectly) to the lens 15 close to the image sensor 8 One side, and is used to move the supporting part relative to the fixed circuit board 3 in a direction perpen
- a lateral drive component such as an optical anti-shake motor 1
- the driving assembly is used to support the movable circuit board on the side of the lens 15 close to the image sensor 8 and is used to drive the movable circuit board to move relative to the fixed circuit board 3 along a direction perpendicular to the optical axis.
- the optical anti-shake motor 1 is exemplarily used as a driving component to drive the autofocus (AF) motor 14 and the lens 15 to move relative to the fixed circuit board 3 in a direction perpendicular to the optical axis L, so as to achieve anti-shake of the lens 15 .
- the drive assembly can also use a coil and a magnet to cooperate to achieve anti-shake.
- a coil is arranged on the movable circuit board, and a magnet is arranged on the fixed circuit board 3, and the active circuit is realized by powering on and off the coil. The attraction or repulsion movement between the boards relative to the fixed circuit board 3.
- a ceramic motor or SMA shapememoryalloys, shape memory alloy
- the driving component only needs to be able to drive the movable circuit board to move along the direction perpendicular to the optical axis L.
- the first plate portion 12 and the second plate portion 10 are split structures, the so-called “split structure” means that the first plate portion 12 and the second plate portion 10 are respectively an independent circuit board,
- the first plate part 12 and the second plate part 10 are independently manufactured and formed, and then fixed by welding or ACF (Anisotropic Conductive Film) process.
- the surface of the first plate portion 12 facing the second plate portion 10 is provided with a welding pad, and the surface of the second plate portion 10 facing the first plate portion 12 is also provided with a welding pad.
- the pads of the board part 10 are electrically connected in one-to-one correspondence, that is, to realize the electrical connection between the circuit of the first board part 12 and the circuit of the second board part 10 .
- the conductive adhesive 9 includes when the anisotropic conductive adhesive film is connected by a welding process, the conductive adhesive 9 includes solder paste.
- the above method can save the etching process, and it can be formed by directly bonding two plates together, which reduces the difficulty of forming and realizes Both are fixed.
- ACF process and soldering process can also be used in combination, therefore, the above-mentioned conductive adhesive 9 can be solder paste and anisotropic conductive adhesive film.
- the above connection of the second plate part 10 and the first plate part 12 by welding or ACF process is only exemplary, as long as the second plate part 10 and the first plate part 12 can be fixed, and the pads of the two are connected. .
- first plate part 12 and the second plate part 10 have an integrated structure, and the so-called "integrated structure” means
- the first stepped structure T1 is formed by removing part of the edge structure of a circuit board with independent functions through etching and other processes.
- the boundary line for example, the first stepped structure T1 only etches away a part of the thickness of a certain insulating layer, then the corresponding thickness of the etched part of the insulating layer belongs to the second plate part 10, and the unetched part
- the corresponding thickness belongs to the first plate portion 12, and the boundary of adjacent, extruded insulating layers or metal layers may be used as the boundary line between the first plate portion 12 and the second plate portion 10, and the insulating layer belongs to the first plate portion 12.
- One plate portion 12 while the metal layer belongs to the second plate portion 10 .
- the circuit board of this independent function is a multilayer board (multi layer PCB)
- the circuit layer of the first board part 12 and the circuit layer of the second board part 10 are communicated by metal vias, rather than connecting by pads conduction.
- the first plate portion 12 and the second plate portion 10 can be directly formed by etching the first stepped structure T1 from one plate.
- the advantage of this is that the movable circuit board has higher structural stability.
- the first board part 12 and the second board part 10 can also be directly molded by integral injection molding using a mold, omitting the step of etching, and the movable circuit board also has higher stability.
- the flexible connector 11 can be many forms of the flexible connector 11.
- the fixed portion 11b connected at one end, the outer peripheral wall of the second plate portion 10 is a wall facing the inner peripheral wall F, the fixed portion 11b can be a hard circuit board as a connecting terminal, the flexible connecting portion 11a is fixed and electrically connected to the fixed portion 11b, The flexible connection part 11a can be partially embedded in the hard second plate part 10.
- a plate in the specific preparation, a plate can be taken, and a flexible carrier is embedded in the external hard material, and the hard material in the middle part of the plate can be
- the flexible connection part 11a is exposed, and the outer hard material is divided into two spaced parts, one part forms the structure of the second plate part 10, and the other part forms the structure of the fixed part 11b, and the middle part is exposed.
- the flexible carrier is used as the flexible connection part 11a, so that the stability of the connection between the flexible connection part 11a and the fixed part 11b and the second plate part 10 is increased, the fracture is avoided, and the service life of the camera module is prolonged; of course, directly on the flexible
- the two parts spaced apart by the carrier are respectively formed by injection molding or other methods to wrap the hard material of the flexible carrier, respectively forming the fixed part 11b and the second plate part 10;
- the bond between the plates 3 is fixed.
- the flexible connection part 11a can be a flexible circuit board (FPC, Flexible Printed Circuit), and can also be a flexible strip-shaped connector, which reduces the resistance that the flexible connection part 11a needs to overcome when it is bent and deformed, and can also be increased on the flexible connection part 11a.
- FPC Flexible Printed Circuit
- the flexible connection part 11a can also form a certain bending or bending structure to produce a certain degree of redundancy.
- the redundancy when the movable circuit board moves relative to the fixed circuit board 3 , further reduces the amount of resistance that needs to be overcome when the flexible connecting portion 11 a deforms.
- the end of the flexible connection part 11a can also be fixed on the side end surface of the second plate part 10 (the surface used to form the first stepped structure T1 ) by means of bonding (such as ACF process bonding).
- the flexible connection part 11a flush with the surface of the second board part 10 away from the first board part 12, so that when the second board part 10 is away from the surface of the first board part 12, the components are arranged and the wires are to be routed to the fixed circuit.
- the board 3 it is convenient for the wiring to smoothly extend to the flexible connecting portion 11a, and it is not easy to break.
- the form of the fixing part 11 b that is convenient to be fixed with the fixed circuit board 3 can have various forms, as long as it can be stably connected and conducted.
- a second stepped structure T2 is formed on the edge of the hollow structure 17 of the fixed circuit board 3.
- a part of the opening of the second stepped structure T2 is located on the inner peripheral wall F surrounding the hollow structure 17, and the other part of the opening is located on the fixed circuit board.
- the second plate part 10 is located on the side away from the lens 15
- part of the opening of the first stepped structure T1 faces the reinforcing plate 4
- part of the opening of the second stepped structure T2 faces the reinforcing plate 4, which can ensure the flexible connection part 11a
- the smooth extension can prevent the flexible connection part 11a and the first plate part 12 from being worn.
- the second stepped structure T2 can be formed by etching at the edge position of the hollow structure 17 of the fixed circuit board 3; the fixing part 11b is arranged on the step of the second stepped structure T2 and is fixed and electrically connected to the step, Specifically, the inner wall of the second stepped structure T2 is provided with a metal connection part, and the fixed part 11b is electrically connected to the above-mentioned metal connection part as a connection terminal. Specifically, the fixed part 11b and the second stepped structure can be realized through an anisotropic conductive adhesive film Fixation and electrical connection of the inner wall of T2.
- the hollow part of the second stepped structure T2 matches the shape of the fixing part 11b, which does not occupy additional space in the hollow structure 17, and can make full use of the contactable area of the second stepped structure T2, so as to facilitate the realization of the fixing part 11b and the fixing part 11b.
- the second ladder-like structure T2 is stably connected, and the two can be bonded by an anisotropic conductive adhesive film or solder paste, so that specific lines can be connected while playing a bonding role, or through the ACF process Or soldering process conduction connection.
- the second stepped structure T2 is one of the forms of the slot matching the fixing part 11b, and the slot may only have an opening located on the inner peripheral wall F surrounding the hollow structure 17, the opening facing the second plate part 10, Moreover, the inner wall of the slot has a metal connection structure, which may be a metal sheet, to realize the electrical connection between the fixing part 11b and the inner wall of the slot, and further realize the conduction with the fixed circuit board 3 . And the slot matches the shape of the fixing part 11b.
- the flexible connecting member 11 includes a flexible connecting part 11a, one end of the flexible connecting part 11a is fixed and electrically connected to the outer peripheral wall of the second plate part 10, and the other end is connected to the outer peripheral wall of the second plate part 10.
- the inner peripheral wall F is fixed and electrically connected, and the outer peripheral wall is the wall surface of the second plate portion 10 facing the inner peripheral wall F, wherein, there are at least two ways of fixing and electrically connecting with the inner peripheral wall F: first, the inner peripheral wall F is provided with a metal connection structure, and the corresponding end of the flexible connection part 11a is provided with a connection terminal, and the connection terminal and the metal connection structure are fixed and electrically connected by welding or ACF process; the second type is the metal circuit in the flexible connection part 11a It is the same metal layer as the metal circuit in the fixed circuit board 3 itself, the metal layer passes through the inner peripheral wall F, and the circuit board with the metal layer is used to etch and expose the flexible connection part 11a.
- FIG. 4 refer to the embodiment corresponding to FIG. 2 for the matching method of the first board part 12 and the second board part 10 , and refer to the corresponding embodiment of FIG. 3 for the matching method of the flexible connector 11 and the fixed circuit board 3 .
- the structure is simple and stable, and steps such as sticking and welding are reduced.
- the embodiment of the present application also provides a circuit board assembly, which includes the fixed circuit board 3, the movable circuit board and the flexible connector 11 in the foregoing embodiments.
- a circuit board assembly which includes the fixed circuit board 3, the movable circuit board and the flexible connector 11 in the foregoing embodiments.
- the electronic device can be a mobile terminal such as a mobile phone and a tablet computer.
- the electronic device can include a casing and the camera module provided in the foregoing embodiments, and the camera module is used for imaging.
- the electronic device After the electronic device adopts the above-mentioned camera module, it is easier to achieve light and thin, and other beneficial effects can refer to the corresponding embodiments of the camera module.
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Abstract
本申请涉及成像技术领域，公开一种电路板组件、摄像模组及电子设备，该摄像模组包括：固定电路板、活动电路板和柔性连接件；固定电路板中部具有镂空结构，活动电路板至少部分设置于镂空结构中，活动电路板包括沿固定电路板厚度方向排布的第一板部和第二板部；第二板部在参考面上的正投影位于第一板部在参考面上的正投影范围内，形成第一阶梯状结构，其中，参考面为第一板部背离第二板部的表面所在平面；柔性连接件连接第二板部的边缘和固定电路板，第一板部背离第二板部的表面还设有用于与图像传感器电连接的电连接结构，以便于在第一板部设置图像传感器。第二板部相对于第一板部内缩的空间容纳部分柔性连接件，减小横向尺寸。
Description
本申请涉及成像技术领域，特别涉及一种电路板组件、摄像模组及电子设备。
随着智能手机等移动终端的快速发展，用户对其成像质量要求越来越高。而为了具有防抖效果，需要设置柔性连接件的活动电路板和固定电路板两部分，活动电路板承载有图像传感器，使活动电路板可以载着固定电路板横向(垂直于光轴方向)移动。活动电路板和固定电路板之间要留出柔性连接件的空间，导致摄像模组横向尺寸较大，不利于集成度的提高。
发明内容
本申请公开了一种电路板组件、摄像模组及电子设备，用于降低摄像模组的横向尺寸。
为达到上述目的，本申请提供以下技术方案：
第一方面，提供一种电路板组件，该电路板组件可以应用于手机、平板电脑等移动终端中的摄像模组中，具体可以包括：
固定电路板、活动电路板和柔性连接件；固定电路板中部具有镂空结构，所述活动电路板至少部分设置于所述镂空结构中，所述活动电路板包括沿所述固定电路板厚度方向排布、并电连接的第一板部和第二板部；所述第二板部在参考面上的正投影位于所述第一板部在所述参考面上的正投影范围内，以使所述第一板部的边缘和所述第二板部的边缘形成第一阶梯状结构，其中，所述参考面为所述第一板部背离所述第二板部的表面所在平面；所述第一板部背离所述第二板部的表面还设有用于与图像传感器电连接的电连接结构；所述柔性连接件连接所述第二板部的边缘和所述固定电路板，以将所述第二 板部和所述固定电路板电连接。
在上述摄像模组中，将第一板部的边缘和第二板部的边缘设置为第一阶梯状结构，第二板部在参考面上的正投影位于第一板部在参考面上的正投影范围内，第一板部背离第二板部的表面还设有用于与图像传感器电连接的电连接结构，以便于在第一板部设置图像传感器，第一板部的面积比第二板部的面积大，不影响第一板部承载图像传感器的表面的承载面积，而且，由于第一阶梯状结构的存在，第二板部相对于第一板部内缩的空间容纳了部分柔性连接件，可以减小第一板部和固定电路板之间的间隙，减小摄像模组的横向尺寸。
可选地，所述第一板部和所述第二板部为一体式结构，从而，活动电路板具有较高的稳定性；或者，所述第一板部和所述第二板部为分体式结构，所述第二板部固定于所述第一板部，可以省去蚀刻的过程，降低成型的难度。
可选地，所述第一板部和第二板部之间通过导电粘合物固定且电连接，以实现两者物理固定和线路导通。
可选地，所述导电粘合物包括异方性导电胶膜和/或锡膏，在将第一板部和第二板部固定在一起的同时，还可以将第一板部和第二板部上的部分线路导通。
可选地，所述柔性连接件包括与所述第二板部固定并电连接的柔性连接部，所述柔性连接部与所述第二板部的外周壁以及所述固定电路板上围成所述镂空结构的内周壁保持固定并电连接，实现了与固定电路板的固定和电连接，并且柔性连接部连接与第二板部相对的围成镂空结构的内周壁，可以不必产生较大弯曲，而减少与第一板部磨损。
可选地，所述柔性连接件包括与所述第二板部固定并电连接的柔性连接部，所述柔性连接部与所述第二板部的外周壁保持固定，所述柔性连接部远离所述第二板部的一端还设置有固定部；围成所述镂空结构的内周壁具有与所述固定部匹配的插槽，所述固定部自所述内周壁插接于所述插槽中，使所述柔性连接部与所述固定电路板固定且保持电连接，避免占用镂空结构的内 部空间，有利于缩小横向尺寸，并且，有利于增加插槽与固定部的接触面积，确保连接稳定性。
可选地，所述固定电路板沿着所述镂空结构的边缘具有第二阶梯状结构，所述第二阶梯状结构形成所述插槽；沿光轴方向，所述第一阶梯状结构的开口和所述第二阶梯状结构的开口具有相同的朝向，以便于柔性连接部不产生较大弯曲，避免与第一板部的磨损。
第二方面，提供一种摄像模组，该摄像模组包括镜头、图像传感器、驱动组件和权利要求1至7任一项所述的电路板组件，其中，所述图像传感器设置于所述第一板部背离所述第二板部的表面，并通过所述电连接结构与所述第一板部电连接，所述镜头设置于所述图像传感器背离所述第一板部的一侧；所述驱动组件用于将所述活动电路板支撑于所述镜头靠近所述图像传感器的一侧、并用于驱动所述活动电路板沿垂直于光轴的方向相对于所述固定电路板移动。
在上述摄像模组中，驱动组件将活动电路板支撑于镜头，便于活动电路板具有横向移动的灵活度，且可以驱动活动电路板沿垂直于光轴的方向移动，实现防抖功能；第一板部背离第二板部的表面具有更大面积，有利于承载图像传感器，图像传感器通过与电连接结构实现与第一板部电连接，经过镜头进入的光线可以入射至图像传感器成像。而电路板组件具有较小的横向尺寸，因此，摄像模组可以有较小的横向尺寸。
可选地，所述驱动组件包括：支撑部件和横向驱动部件，支撑部件和横向驱动部件集成在一起，所述横向驱动部件连接于所述镜头靠近所述图像传感器的一侧、并用于将所述支撑部件沿垂直于光轴的方向相对于所述固定电路板移动，所述支撑部件用于将所述活动电路板支撑于所述横向驱动部件，有利于提高集成度，降低组装难度。
可选地，所述驱动组件包括：支撑部件和横向驱动部件；其中，支撑部件和横向驱动部件分别独立设置；所述支撑部件用于将所述活动电路板支撑于所述镜头靠近所述图像传感器的一侧；横向驱动部件用于驱动所述活动电 路板沿垂直于光轴的方向相对于所述固定电路板移动；支撑部件和横向驱动部件独立设置，有利于分别制造，降低零部件成本。
其中，该横向驱动部件可以包括光学防抖马达，光学防抖马达具有良好的防抖作用，所述支撑部件包括悬丝，悬丝可以具有一定的支撑作用，并使活动电路板在横向上具有一定自由度。
可选地，支撑部件与第一板部的连接形式具体可以是：所述摄像模组还包括滤片支架和红外截止滤波片，所述红外截止滤波片位于所述镜头和所述图像传感器之间，且所述滤片支架将所述红外截止滤波片支撑于所述第三表面上；所述支撑部件连接于所述镜头和所述滤片支架之间。支撑部件利用滤片支架间接与第一板部连接，有利于减少占用第一板部远离第二板部的表面的面积。
可选地，所述摄像模组还包括金线，所述图像传感器通过所述金线与所述电连接结构电连接。
可选地，所述第一板部背离所述第二板部的表面还设有与所述第一板部电连接的元器件，第一板部背离第二板部的表面面积较大，将元器件设置在该表面，有利于降低元器件设置难度。
可选地，所述摄像模组还包括保强板，所述保强板设置在所述固定电路板背离所述镜头的表面，且所述保强板覆盖所述镂空结构，以对镂空结构密封，防止进入灰尘。
第三方面，提供一种电子设备，所述电子设备包括壳体以及上述任一技术方案提供的摄像模组，所述摄像模组设置于所述壳体内。
与现有技术相比，该电子设备具有与所述摄像模组相同的优势，在此不再赘述。
图1为本申请实施例提供的第一种摄像模组的轴向剖面图；
图2为本申请实施例提供的第二种摄像模组的轴向剖面图；
图3为本申请实施例提供的第三种摄像模组的轴向剖面图；
图4为本申请实施例提供的第四种摄像模组的轴向剖面图。
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
本申请实施例提供的摄像模组可以应用于手机、平板电脑等移动终端中。参考图1，该摄像模组具体可以包括：
固定电路板3、活动电路板、镜头15和柔性连接件11；固定电路板3中部具有镂空结构17，活动电路板设置于镂空结构17中，活动电路板包括沿固定电路板3厚度方向层叠设置的第一板部12和第二板部10，此处的所谓“厚度方向”是指该固定电路板3用于安装元器件的表面至固定电路板背离该安装有元器件的表面的排列方向，第二板部10与第一板部12之间电连接，以使两者之间实现导通，具体电连接的方式后文进行介绍；第二板部10在参考面上的正投影位于第一板部12在参考面上的正投影范围内，以使第一板部12的边缘和第二板部10的边缘形成第一阶梯状结构T1，其中，参考面为第一板部12背离第二板部10的表面所在平面，在该第一阶梯状结构T1中，第二板部10在边缘位置相对于第一板部12整体向内缩，内缩的空间形成了容纳空间，此处第二板部10的“内缩”是指第二板部10的边缘相对于第一板部12向光轴L方向向内错位一段距离；一方面，柔性连接件11连接第二板部10的边缘和固定电路板3，为第二板部10和固定电路板3之间提供物理上的柔性连接，使第二板部10可以相对于固定电路板3沿垂直于光轴L的方向移动，另一方面，柔性连接件11用于使第二板部10和固定电路板3之间电连接，使两者实现导通；第一板部12背离第二板部10的表面设有图像传感器8，镜头15设置于图像传感器8背离第一板部12的一侧。在第一板部12背离第二 板部10的表面设有电连接结构，该电连接结构具体可以是多个焊盘，上述多个焊盘按照与图像传感器9的引脚一一对应的方式排列，第一板部12背离第二板部10的表面的面积大于第二板部10背离第一板部12的面的面积，便于布置足够大的图像传感器8及足够多的元器件5，元器件5可以是电阻、电容、驱动IC等器件，元器件5与第一板部12电连接。
在上述摄像模组中，将第一板部12的边缘和第二板部10的边缘设置为第一阶梯状结构T1，第二板部10在参考面上的正投影位于第一板部12在参考面上的正投影范围内，而且，由于第一阶梯状结构T1的存在，第二板部10相对于第一板部12内缩形成的容纳空间容纳了部分柔性连接件11，可以减小第一板部12和固定电路板3之间的间隙，减小摄像模组的横向尺寸。
应当理解的是，第二板部10的各处边缘向内缩的距离可以相同，也可以不相同，但当第一板部12的几何中心与镂空结构17的几何中心均与光轴L重合时，此时若确保第二板部10的各处边缘内缩的距离一致，则沿环绕第二板部10的容纳空间可以容纳等长的柔性连接件11，那么，沿环绕第二板部10的周围方向上柔性连接件11的应力大小都是一致的，有利于第二板部10的各方向上受力均匀。此外，沿环绕光轴L的方向，第二板部10相对于第一板部11内缩的距离也可以不相同，例如，柔性连接件11数量为多个，且环绕光轴L间隔分布，仅需在设置有柔性连接件11边缘位置内缩的距离较大些，没有设置柔性连接件11的边缘位置内缩的距离较小些。如此，可以保留第二板部10的较大面积，可以在第二板部10背离第一板部12的面的面积较大，留有足有的面积布置元器件，有利于降低元器件5的布置密度，从而降低布置难度，或者，也可以增加元器件5的布置数量，提高性能，同时有利于增加活动电路板整体的结构牢固性。
在图1中，固定电路板3的底面(背离镜头15的面)还设有保强板4，该保强板4同时将镂空结构17覆盖住，保强板4具有保强和密封作用，可以防止尘埃通过镂空结构进入摄像模组内，连接器M与固定电路板3连接，具体连接器M可以具有金手指，以将固定电路板3与主板等电连接，使摄像模 组可以与电子设备的主板实现信号导通。图像传感器8通过金线6与第一板部12上的电连接结构导通，图像传感器8的成像面背离第一板部12，镜头15与图像传感器8的成像面相对设置；镜头15和图像传感器8之间设有红外截止滤波片7，以在镜头15入射的光进入到图像传感器8之前滤除掉其中的红外光，提高成像质量。红外截止滤波片7通过滤片支架16支撑于第一板部12上。镜头支架13支撑于固定电路板3上，固定电路板3与镜头支架13之间通过胶2粘结，并将镜头15包覆在内。摄像模组还包括自动对焦(AF，Auto Focus)马达14，自动对焦马达14与镜头15传动连接，以实现镜头15的纵向移动进行对焦。自动对焦马达14连接有驱动组件，因此，也可以认为驱动组件是与镜头15靠近图像传感器8的一侧连接的，只是该驱动组件是镜头15间接通过自动对焦马达14间接连接的，该驱动组件包括光学防抖马达(OIS，Optical Image Stabilization)1和悬丝，悬丝集成于光学防抖马达1，光学防抖马达1可以带着悬丝沿垂直于光轴的方向相对于自动对焦马达14移动，该悬丝与滤片支架16连接，以将活动电路板间接支撑于光学防抖马达1，使活动电路板具有横向移动的自由度，并且，悬丝没有直接与第一板部12连接，节省了第一板部12背离第二板部10的表面的面积，有利于安装元器件5或放置更大的图像传感器8。并且，在图1中，悬丝可以将活动电路板支撑(此处为间接支撑)于镜头15。悬丝作为支撑部件，所谓“支撑部件”是指可以将部件A(如活动电路板)支撑(可以是直接或间接支撑)于部件B(如镜头15)上，部件A可以相对于部件B在C面内移动，但不能在D方向(如光轴L方向)上移动，D方向垂直于C面；光学防抖马达1作为横向驱动部件，且悬丝与光学防抖马达1集成在一起，但并不限于上述形式，该悬丝还可以替换为弹片、硅片和薄膜等其它支撑部件，只要横向驱动部件连接(可以是直接连接，也可以是间接连接)于镜头15靠近图像传感器8的一侧、并用于将支撑部件沿垂直于光轴L的方向相对于固定电路板3移动，支撑部件用于将活动电路板支撑于横向驱动部件，有利于提高集成度，降低组装难度。但这仅仅是示例性地，也可以是如下支撑部件和横向驱动部件分别独立设置的 形式，分别独立起到各自的作用；支撑部件(如悬丝)用于将活动电路板支撑(可以直接也可以间接支撑)于镜头靠近图像传感器8的一侧；横向驱动部件(如光学防抖马达1)可以与镜头15靠近图像传感器8的一侧连接、并用于驱动活动电路板沿垂直于光轴的方向相对于固定电路板3移动；支撑部件和横向驱动部件独立设置，有利于分别制造，降低零部件成本。总之，驱动组件用于将活动电路板支撑于镜头15靠近图像传感器8的一侧、并用于驱动活动电路板沿垂直于光轴的方向相对于固定电路板3移动。
该光学防抖马达1示例性地作为驱动组件可以沿垂直于光轴L的方向驱动自动对焦(AF)马达14和镜头15相对于固定电路板3移动，实现镜头15的防抖。驱动组件除了采用光学防抖马达1之外，还可以采用线圈和磁铁配合实现防抖，例如，活动电路板上设置线圈，固定电路板3上设置磁铁，通过对线圈的通电断电实现活动电路板相对于固定电路板3之间的相吸或相斥运动。也可以采用陶瓷马达或SMA(shapememoryalloys，形状记忆合金)作为驱动组件，通过调节SMA通电电压的大小来实现调节活动电路板的横向移动距离。驱动组件只要可以驱动活动电路板沿垂直于光轴L的方向移动即可。
其中，在图1中，第一板部12和第二板部10为分体式结构，所谓“分体式结构”是指第一板部12和第二板部10分别为一个独立的电路板，第一板部12和第二板部10之间分别独立制作成型，然后通过焊接或ACF(异方性导电胶膜、Anisotropic Conductive Film)工艺固定。第一板部12朝向第二板部10的面设有焊盘，第二板部10朝向第一板部12的面也设有焊盘，通过将第一板部12的焊盘和第二板部10的焊盘一一对应电连接，即实现第一板部12的电路和第二板部10的电路的电连接。具体地，在通过焊接或ACF工艺连接后，第一板部12和第二板部10之间通过导电粘合物9固定并电连接，例如，通过ACF工艺连接时，导电粘合物9包括异方性导电胶膜，通过焊接工艺连接时，导电粘合物9包括锡膏，以上方式可以省去蚀刻的过程，直接将两块板材贴合在一起即可成型，降低成型的难度，实现两者的固定。此外，也可以结合使用ACF工艺和焊接工艺，因此，上述导电粘合物9可以为锡膏 和异方性导电胶膜。以上焊接或ACF工艺连接第二板部10和第一板部12仅仅是示例性的，只要可以将第二板部10和第一板部12固定，并且两者的焊盘实现导通即可。
但上述结构仅仅是示例性地，如图2所示，与图1所示结构相比区别在于，第一板部12和第二板部10为一体式结构，所谓“一体式结构”是指由一块独立功能的电路板经刻蚀等工艺去除掉边缘的部分结构形成第一阶梯状结构T1，在该独立功能的电路板中，第一板部12和第二板部10之间无明显分界线，例如第一阶梯状结构T1仅刻蚀掉某一绝缘层的一部分厚度，则该绝缘层中被刻蚀掉的部分对应的厚度属于第二板部10，未被刻蚀掉的部分对应的厚度属于第一板部12，也可以是以相邻的、挤压在一起的绝缘层或金属层的界限为第一板部12和第二板部10的分界线，绝缘层属于第一板部12，而金属层属于第二板部10。并且，当该独立功能的电路板为多层板(multi layer PCB)时，第一板部12的电路层和第二板部10电路层之间通过金属过孔连通，而不是通过焊盘连接导通。第一板部12和第二板部10可以直接利用一块板材刻蚀出第一阶梯状结构T1形成。这样的好处在于，活动电路板具有较高的结构稳定性。当然，也可以将第一板部12和第二板部10直接利用模具一体注塑成型，省去蚀刻的步骤，该活动电路板也具有较高的稳定性。
柔性连接件11的形式可以有多种，在图1中，柔性连接件11包括与第二板部10的外周壁连接的柔性连接部11a，以及，与柔性连接部远离第二板部10的一端连接的固定部11b，该第二板部10的外周壁为朝向内周壁F的壁面，固定部11b可以是硬质电路板作为连接端子，柔性连接部11a与固定部11b固定并电连接，柔性连接部11a可以部分埋设于硬质的第二板部10中，如此，在具体制备时，可以取一块板材，外部硬质材料内部埋设有柔性载体，将该板材中间部分的硬质材料以刻蚀等方式去掉，暴露出柔性的连接部11a，外部硬质材料被分为两个间隔的部分，一部分形成为第二板部10的结构，另一部分形成固定部11b的结构，中间暴露出的柔性载体作为柔性连接部11a，如此，增加了柔性连接部11a分别与固定部11b和第二板部10的结合的稳定 性，避免断裂，延长了摄像模组的使用寿命；当然直接在柔性载体相间隔的两个部位分别通过注塑等方式形成包裹柔性载体的硬质材料，分别形成固定部11b和第二板部10；固定部11b与固定电路板3连接，固定部11b便于与固定电路板3之间的粘结固定。柔性连接部11a可以为柔性电路板(FPC，Flexible Printed Circuit)，也可以为柔性的带状连接物，降低柔性连接部11a弯曲变形时所需克服的阻力，也可以在柔性连接部11a上增加一些穿孔，以进一步提高柔性连接部11a的柔软度，降低变形时所需克服阻力；此外，该柔性连接部11a还可以形成一定的弯折或弯曲结构，以产生一定的冗余度，由于存在冗余度，在活动电路板相对于固定电路板3运动的时候，进一步减小柔性连接部11a变形时所需要克服的阻力大小。柔性连接部11a的端部也可以通过粘结(如ACF工艺粘结)等方式固定在第二板部10的侧端面(用来形成第一阶梯状结构T1的面)。也可以使柔性连接部11a与第二板部10背离第一板部12的表面平齐，以便于当第二板部10背离第一板部12的面布置元器件，欲走线至固定电路板3时，方便走线可以平滑地延伸至柔性连接部11a上，不容易断裂。
固定部11b便于与固定电路板3固定的形式具体可以有多种形式，只要可以稳定连接导通即可。在图1中，固定电路板3的镂空结构17边缘形成有第二阶梯状结构T2，第二阶梯状结构T2的一部分开口位于围成镂空结构17的内周壁F，另一部分开口位于固定电路板3朝向保强板4的面，也就是，在光轴L方向上，第一阶梯状结构T1和第二阶梯状结构T2朝向相同，都是朝向保强板4，但当第一板部12位于第二板部10背离镜头15的一侧时，第一阶梯状结构T1的部分开口朝向保强板4，第二阶梯状结构T2的部分开口朝向保强板4，可以确保柔性连接部11a在光轴L方向上不会有较大落差，进而可以较为平滑的延伸可以防止柔性连接部11a与第一板部12发生磨损。其中，该第二阶梯状结构T2可以通过在固定电路板3的镂空结构17边缘位置采用蚀刻等方式形成；固定部11b设置于第二阶梯状结构T2的台阶上且与台阶固定并电连接，具体地，第二阶梯状结构T2的内壁设有金属连接部，固定部11b 作为连接端子与上述金属连接部电连接，具体可以通过异方性导电胶膜实现固定部11b与第二阶梯状结构T2的内壁的固定和电连接。第二阶梯状结构T2的镂空处与固定部11b形状相匹配，既不额外占用镂空结构17内的空间，又可以充分利用第二阶梯状结构T2处可接触的面积，便于实现固定部11b与第二阶梯状结构T2稳定连接，两者之间可以通过异方性导电胶膜或锡膏粘结，以便于在起到粘结作用的同时还可以将特定线路导通，也可以通过ACF工艺或者焊接工艺导通连接。此外，第二阶梯状结构T2作为与固定部11b匹配的插槽的形式之一，插槽还可以仅具有位于围成镂空结构17的内周壁F的开口，该开口朝向第二板部10，且该插槽的内壁具有金属连接结构，可以是金属片，实现固定部11b与插槽的内壁的电连接，进而实现与固定电路板3的导通。并且插槽与固定部11b的形状匹配。
除此之外，可以参考图3，与图1的区别在于，柔性连接件11包括柔性连接部11a，柔性连接部11a的一端与第二板部10的外周壁固定并电连接，另一端与内周壁F固定并电连接，该外周壁为第二板部10朝向内周壁F的壁面，其中，与内周壁F固定并电连接的方式可以至少有以下两种方式：第一种，内周壁F设有金属连接结构，柔性连接部11a的对应端部设有连接端子，该连接端子与金属连接结构通过焊接或ACF工艺实现固定和电连接；第二种，柔性连接部11a中的金属线路与固定电路板3中的金属线路本身是同一层金属层，该金属层穿过内周壁F，采用具有该金属层的电路板刻蚀并暴露出柔性连接部11a即可。
参考图4，第一板部12和第二板部10的配合方式参考图2对应的实施例，柔性连接件11与固定电路板3的配合方式参考图3对应的实施例。
该结构简单且稳定，减少了黏贴、焊接等步骤。
基于相同的发明构思，本申请实施例还提供一种电路板组件，该电路板组件包括前述实施例中的固定电路板3、活动电路板和柔性连接件11，其具体结构、配合关系和有益效果请参考前述摄像模组的实施例中相应描述。
基于相同的发明构思，提供一种电子设备，电子设备可以是手机和平板 电脑等移动终端，该电子设备可以包括壳体和前述实施例提供的摄像模组，摄像模组用于成像。
该电子设备采用上述摄像模组后，更容易实现轻薄化，其余有益效果可参考摄像模组对应的实施例。
显然，本领域的技术人员可以对本申请实施例进行各种改动和变型而不脱离本申请的精神和范围。这样，倘若本申请的这些修改和变型属于本申请权利要求及其等同技术的范围之内，则本申请也意图包含这些改动和变型在内。
Claims (16)
- 一种电路板组件，其特征在于，包括：固定电路板、活动电路板和柔性连接件；固定电路板中部具有镂空结构，所述活动电路板至少部分设置于所述镂空结构中，所述活动电路板包括沿所述固定电路板厚度方向排布、并电连接的第一板部和第二板部；所述第二板部在参考面上的正投影位于所述第一板部在所述参考面上的正投影范围内，以使所述第一板部的边缘和所述第二板部的边缘形成第一阶梯状结构，其中，所述参考面为所述第一板部背离所述第二板部的表面所在平面；所述第一板部背离所述第二板部的表面还设有用于与图像传感器电连接的电连接结构；所述柔性连接件连接所述第二板部的边缘和所述固定电路板，以将所述第二板部和所述固定电路板电连接。
- 根据权利要求1所述的电路板组件，其特征在于，所述第一板部和所述第二板部为一体式结构；或者，所述第一板部和所述第二板部为分体式结构，所述第二板部固定于所述第一板部。
- 根据权利要求2所述的电路板组件，其特征在于，所述第一板部和第二板部之间通过导电粘合物固定且电连接。
- 根据权利要求3所述的电路板组件，其特征在于，所述导电粘合物包括异方性导电胶膜和/或锡膏。
- 根据权利要求1所述的电路板组件，其特征在于，所述柔性连接件包括柔性连接部，所述柔性连接部与所述第二板部的外周壁以及所述固定电路板上围成所述镂空结构的内周壁保持固定，使所述柔性连接部与所述固定电路板固定且保持电连接。
- 根据权利要求1所述的电路板组件，其特征在于，所述柔性连接件包括柔性连接部，所述柔性连接部与所述第二板部的外周壁以及所述固定电路板上围成所述镂空结构的内周壁保持固定，所述柔性连接部远离所述第二板部的一端还设置有固定部，所述内周壁具有与所述固定部匹配的插槽，所述固定部自所述内周壁插接于所述插槽中，使所述柔性连接部与所述固定电路板固定且保持电连接。
- 根据权利要求6所述的电路板组件，其特征在于，所述固定电路板沿着所述镂空结构的边缘具有第二阶梯状结构，所述第二阶梯状结构形成所述插槽；沿光轴方向，所述第一阶梯状结构的开口和所述第二阶梯状结构的开口具有相同的朝向。
- 一种摄像模组，其特征在于，包括镜头、图像传感器、驱动组件和权利要求1至7任一项所述的电路板组件，其中，所述图像传感器设置于所述第一板部背离所述第二板部的表面，并通过所述电连接结构与所述第一板部电连接，所述镜头设置于所述图像传感器背离所述第一板部的一侧；所述驱动组件用于将所述活动电路板支撑于所述镜头靠近所述图像传感器的一侧、并用于驱动所述活动电路板沿垂直于光轴的方向相对于所述固定电路板移动。
- 根据权利要求8所述的摄像模组，其特征在于，所述驱动组件包括：支撑部件和横向驱动部件，所述横向驱动部件连接于所述镜头靠近所述图像传感器的一侧、并用于将所述支撑部件沿垂直于光轴的方向相对于所述固定电路板移动，所述支撑部件用于将所述活动电路板支撑于所述横向驱动部件。
- 根据权利要求8所述的摄像模组，其特征在于，所述驱动组件包括：支撑部件和横向驱动部件；其中，所述支撑部件用于将所述活动电路板支撑于所述镜头靠近所述图像传感器的一侧；横向驱动部件用于驱动所述活动电路板沿垂直于光轴的方向相对于所述固定电路板移动。
- 根据权利要求9或10所述的摄像模组，其特征在于，所述横向驱动部件包括光学防抖马达，所述支撑部件包括悬丝。
- 根据权利要求9或10所述的摄像模组，其特征在于，所述摄像模组还包括滤片支架和红外截止滤波片，所述红外截止滤波片位于所述镜头和所述图像传感器之间，且所述滤片支架将所述红外截止滤波片支撑于所述第三表面上；所述支撑部件连接于所述镜头和所述滤片支架之间。
- 根据权利要求8所述的摄像模组，其特征在于，所述摄像模组还包括金线，所述图像传感器通过所述金线与所述电连接结构电连接。
- 根据权利要求8所述的摄像模组，其特征在于，所述第一板部背离所述第二板部的表面还设有与所述第一板部电连接的元器件。
- 根据权利要求8所述的摄像模组，其特征在于，所述摄像模组还包括保强板，所述保强板设置在所述固定电路板背离所述镜头的表面，且所述保强板覆盖所述镂空结构。
- 一种电子设备，其特征在于，所述电子设备包括壳体以及权利要求8至15任一项所述的摄像模组，所述摄像模组设置于所述壳体内。
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20070012125A (ko) * | 2005-07-22 | 2007-01-25 | 삼성테크윈 주식회사 | 이미지 센서 모듈 및 이를 구비한 카메라 모듈 |
| CN108495010A (zh) * | 2018-05-28 | 2018-09-04 | 维沃移动通信有限公司 | 一种摄像头模组及移动终端 |
| CN209250741U (zh) * | 2018-12-19 | 2019-08-13 | 南昌欧菲晶润科技有限公司 | 光学防抖摄像头模组和电子设备 |
| CN211018977U (zh) * | 2020-01-09 | 2020-07-14 | 昆山丘钛微电子科技有限公司 | 摄像模组及电子设备 |
| CN112822350A (zh) * | 2020-12-25 | 2021-05-18 | 维沃移动通信有限公司 | 电子设备及摄像模组 |
| CN113132607A (zh) * | 2021-05-08 | 2021-07-16 | 南昌欧菲光电技术有限公司 | 一种柔性电路板、摄像模组及电子设备 |
-
2021
- 2021-05-19 WO PCT/CN2021/094690 patent/WO2022241684A1/zh active Application Filing
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20070012125A (ko) * | 2005-07-22 | 2007-01-25 | 삼성테크윈 주식회사 | 이미지 센서 모듈 및 이를 구비한 카메라 모듈 |
| CN108495010A (zh) * | 2018-05-28 | 2018-09-04 | 维沃移动通信有限公司 | 一种摄像头模组及移动终端 |
| CN209250741U (zh) * | 2018-12-19 | 2019-08-13 | 南昌欧菲晶润科技有限公司 | 光学防抖摄像头模组和电子设备 |
| CN211018977U (zh) * | 2020-01-09 | 2020-07-14 | 昆山丘钛微电子科技有限公司 | 摄像模组及电子设备 |
| CN112822350A (zh) * | 2020-12-25 | 2021-05-18 | 维沃移动通信有限公司 | 电子设备及摄像模组 |
| CN113132607A (zh) * | 2021-05-08 | 2021-07-16 | 南昌欧菲光电技术有限公司 | 一种柔性电路板、摄像模组及电子设备 |
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