WO2021018230A1 - 摄像模组和感光组件及其制造方法 - Google Patents

摄像模组和感光组件及其制造方法 Download PDF

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Publication number
WO2021018230A1
WO2021018230A1 PCT/CN2020/105726 CN2020105726W WO2021018230A1 WO 2021018230 A1 WO2021018230 A1 WO 2021018230A1 CN 2020105726 W CN2020105726 W CN 2020105726W WO 2021018230 A1 WO2021018230 A1 WO 2021018230A1
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Prior art keywords
shaping
photosensitive
photosensitive chip
circuit board
shaping member
Prior art date
Application number
PCT/CN2020/105726
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English (en)
French (fr)
Inventor
栾仲禹
黄桢
刘丽
陈凯
Original Assignee
宁波舜宇光电信息有限公司
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Publication date
Priority claimed from CN201921235828.XU external-priority patent/CN209861013U/zh
Priority claimed from CN201921235825.6U external-priority patent/CN209861012U/zh
Priority claimed from CN201910709053.3A external-priority patent/CN112311974A/zh
Priority claimed from CN201910709052.9A external-priority patent/CN112311973A/zh
Application filed by 宁波舜宇光电信息有限公司 filed Critical 宁波舜宇光电信息有限公司
Priority to US17/631,605 priority Critical patent/US20220278151A1/en
Priority to EP20847045.0A priority patent/EP3998768A4/en
Publication of WO2021018230A1 publication Critical patent/WO2021018230A1/zh

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    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/52—Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements

Definitions

  • the main purpose of the present application is to provide a camera module, a photosensitive component and a manufacturing method thereof, which can bend a planar photosensitive chip into a shape that fits the actual focal imaging surface. In this way, the camera module is improved.
  • the imaging quality of the group is improved.
  • Another object of the present application is to provide a camera module, a photosensitive component and a manufacturing method thereof, wherein the chip manufacturer does not need to change the existing photosensitive chip manufacturing process, that is, the photosensitive component provided by the application is manufactured
  • the process can be implemented based on the existing planar photosensitive chip.
  • Another object of the present application is to provide a camera module, a photosensitive component and a manufacturing method thereof, wherein a accommodating space under the photosensitive chip includes a heat sink for enhancing the heat dissipation of the photosensitive chip to strengthen the The heat dissipation performance of the camera module is described.
  • An embodiment of the present application provides a photosensitive component, which includes:
  • a photosensitive chip electrically connected to the circuit board
  • the shaping component includes a first shaping piece and a second shaping piece, the first shaping piece, the photosensitive chip and the circuit board form the accommodating space, and the second shaping piece
  • the shaping element is disposed on the circuit board and located in the accommodating space, and the height of the second shaping element is lower than that of the first shaping element.
  • the circuit board has at least one opening formed therethrough and communicating with the accommodating space, and the at least one opening is configured to be used in the process of assembling the photosensitive element.
  • the gas in the accommodating space is discharged to make the photosensitive chip bend downward.
  • the position where a part of the openings are formed on the circuit board corresponds to the central area of the photosensitive chip, and another part of the openings is formed at the position of the circuit board at the position Between the first shaping element and the second shaping element.
  • the second shaping member is symmetrically arranged on both sides of the center line set by the longer side of the photosensitive chip.
  • the cross-sectional shape of the first shaping member is a closed ring.
  • the first shaping member includes a first shaping member body and an adhesive applied to the first shaping member body
  • the second shaping member includes a second shaping member body and Adhesive applied to the main body of the second shaping member.
  • the first shaping element body and the second shaping element body are integrally formed on the top surface of the circuit board.
  • the first shaping element body and the second shaping element body are made of metal materials.
  • the first shaping element body and the second shaping element body are integrally formed on the top surface of the circuit board through an electroplating process.
  • the photosensitive component further includes a heat sink, wherein the heat sink is formed in the accommodating space, wherein the heat sink is attached to at least a part of the lower surface of the photosensitive chip .
  • the photosensitive component further includes at least one electronic component arranged in a non-photosensitive area of the photosensitive chip.
  • the photosensitive component further includes a bracket provided on the circuit board, wherein the bracket forms a light-through hole corresponding to the photosensitive area of the photosensitive chip.
  • the bracket is integrally formed on the circuit board through a molding process to integrally cover at least a part of the circuit board and at least a part of the at least one electronic component.
  • the bracket is integrally formed on the circuit board through a molding process to integrally cover at least a part of the circuit board, the at least one electronic component, and the photosensitive chip At least part of the non-photosensitive area.
  • the inner side of the bracket is perpendicular to the upper surface of the photosensitive chip.
  • the inner side of the bracket extends obliquely outward.
  • the photosensitive component further includes a side encapsulation that wraps the photosensitive chip and the outer side of the shaping member, which is used to prevent the position of the photosensitive chip from shifting during the molding process. .
  • the filter element is installed on the installation platform of the bracket.
  • the photosensitive component further includes a filter element holder, and the filter element holder is installed on the holder and used for installing the filter element.
  • the present application also provides a camera module, which includes:
  • the camera module further includes a driving element, wherein the driving element is supported by the bracket, and the optical lens is mounted on the driving element.
  • a method for manufacturing a photosensitive component which includes:
  • circuit board Providing a circuit board, a photosensitive chip, a first shaping element and a second shaping element, wherein the circuit board includes at least one opening;
  • the photosensitive chip is pulled downward by the suction device, so that the photosensitive chip is bent downward.
  • the photosensitive chip is bent until the lower surface of the photosensitive chip is attached to the curved surface, so that when the photosensitive chip is bent downward, a lower surface that matches the focal imaging surface of the photosensitive component is formed.
  • the method further includes:
  • An adhesive is applied between the first shaping element and the second shaping element, wherein the height of the upper surface of the adhesive is lower than that of the second shaping element.
  • a heat dissipation material is injected into the accommodation space through the opening to form the heat dissipation element in the accommodation space, wherein the heat dissipation element is attached to at least a part of the lower surface of the photosensitive chip.
  • a method for manufacturing a photosensitive component which includes:
  • circuit board and a photosensitive chip, wherein the circuit board includes at least one opening
  • a first shaping piece and a second shaping piece are integrally formed on the circuit board, wherein the height of the second shaping piece is smaller than the height of the first shaping piece;
  • the photosensitive chip is pulled downward by the suction device, so that the photosensitive chip is bent downward.
  • the upper surface of at least one of the first shaping member and the second shaping member includes an arc-shaped surface recessed downward and inward, wherein the photosensitive chip is pulled downward by the suction device , So that the photosensitive chip is bent downward, including:
  • the photosensitive chip is bent until the lower surface of the photosensitive chip is attached to the curved surface, so that when the photosensitive chip is bent downward, a lower surface that matches the focal imaging surface of the photosensitive component is formed.
  • integrally forming a first shaping element and a second shaping element on the circuit board includes:
  • the method further includes:
  • An adhesive is applied between the first shaping element and the second shaping element, wherein the height of the upper surface of the adhesive is lower than that of the second shaping element.
  • the upper surface of at least one of the first shaping member and the second shaping member includes an arc-shaped surface recessed downward and inward, wherein the photosensitive chip is pulled downward by the suction device , So that the photosensitive chip is bent downward, including:
  • the position where the opening is formed on the circuit board corresponds to the central area of the photosensitive chip.
  • a photosensitive chip electrically connected to the circuit board
  • the upper surface of at least one of the first shaping member and the second shaping member includes an arc-shaped surface recessed downward and inward, and the arc-shaped surface is configured to cause the photosensitive chip to face When bent downward, a lower surface that matches the focal imaging surface of the photosensitive component is formed.
  • the circuit board has at least one opening formed therethrough and communicating with the accommodating space, and the at least one opening is configured to be used in the process of assembling the photosensitive element.
  • the gas in the accommodating space is discharged to make the photosensitive chip bend downward.
  • the second shaping member is symmetrically arranged with respect to the center of the photosensitive chip.
  • the second shaping member is symmetrically arranged on both sides of the center line set by the longer side of the photosensitive chip.
  • the cross-sectional shape of the first shaping member is a closed ring.
  • the position where a part of the openings are formed on the circuit board corresponds to the central area of the photosensitive chip, and another part of the openings is formed at the position of the circuit board at the position Between the first shaping element and the second shaping element.
  • the positions where the openings are formed on the circuit board are arranged symmetrically with respect to the center of the photosensitive chip.
  • another part of the openings formed in the circuit board are arranged symmetrically with respect to the center of the photosensitive chip.
  • the second shaping member is symmetrically arranged with respect to the center of the photosensitive chip.
  • the second shaping member is symmetrically arranged on both sides of the center line set by the longer side of the photosensitive chip.
  • the first shaping member includes a first shaping member body and an adhesive applied to the first shaping member body
  • the second shaping member includes a second shaping member body and Adhesive applied to the main body of the second shaping member.
  • the first shaping element body and the second shaping element body are integrally formed on the top surface of the circuit board.
  • the first shaping element body and the second shaping element body are prefabricated and installed on the circuit board.
  • the first shaping element body and the second shaping element body are made of metal materials.
  • the first shaping element body and the second shaping element body are integrally formed on the top surface of the circuit board through an electroplating process.
  • the photosensitive component further includes a heat sink formed in the accommodating space and attached to at least a part of the lower surface of the photosensitive chip.
  • the photosensitive component further includes at least one electronic component arranged in a non-photosensitive area of the photosensitive chip.
  • the bracket is integrally formed on the circuit board through a molding process to integrally cover at least a part of the circuit board and at least a part of the at least one electronic component.
  • the bracket is integrally formed on the circuit board through a molding process to integrally cover at least a part of the circuit board, the at least one electronic component, and the photosensitive chip At least a part of the non-photosensitive area.
  • the inner side of the bracket is perpendicular to the upper surface of the photosensitive chip.
  • the inner side of the bracket extends obliquely outward.
  • the bracket includes a mounting platform recessed on the top surface of the bracket for supporting the filter element thereon.
  • the photosensitive component further includes a side encapsulation that wraps the photosensitive chip and the outer side of the shaping member, which is used to prevent the position of the photosensitive chip from shifting during the molding process. .
  • the photosensitive element further includes a filter element held in the photosensitive path of the photosensitive element.
  • the filter element is stacked on the photosensitive element, and after the support is integrally formed on the circuit board by a molding process, the support is integrally covered with the circuit board At least a part of, the at least one electronic component, at least a part of the non-photosensitive area of the photosensitive chip, and at least a part of the filter element.
  • the filter element is supported on the top of the bracket.
  • the filter element is installed on the installation platform of the bracket.
  • the photosensitive component further includes a filter element holder, and the filter element holder is installed on the holder and used for installing the filter element.
  • the present application also provides a camera module, which includes:
  • the optical lens is mounted on the bracket.
  • the camera module further includes a driving element, wherein the driving element is supported by the bracket, and the optical lens is mounted on the driving element.
  • a method for manufacturing a photosensitive component which includes:
  • the gas in the accommodating space is discharged through the at least one opening to generate a pressure difference between the upper surface and the lower surface of the photosensitive chip, so that the photosensitive chip is bent downward.
  • the upper surface of at least one of the first shaping member and the second shaping member includes an arc-shaped surface recessed downward and inward, wherein the container is discharged through the at least one opening. Setting the gas in the space to generate a pressure difference between the upper surface and the lower surface of the photosensitive chip, so that the photosensitive chip is bent downward, including:
  • the photosensitive chip is bent until the lower surface of the photosensitive chip is attached to the curved surface, so that when the photosensitive chip is bent downward, a lower surface that matches the focal imaging surface of the photosensitive component is formed.
  • the position where the opening is formed on the circuit board corresponds to the central area of the photosensitive chip.
  • a heat dissipation material is injected into the accommodation space through the opening to form the heat dissipation element in the accommodation space, wherein the heat dissipation element is attached to at least a part of the lower surface of the photosensitive chip.
  • a method for manufacturing a photosensitive component which includes:
  • the gas in the accommodating space is discharged through the at least one opening to generate a pressure difference between the upper surface and the lower surface of the photosensitive chip, so that the photosensitive chip is bent downward.
  • integrally forming a first shaping element and a second shaping element on the circuit board includes:
  • the upper surface of at least one of the first shaping member and the second shaping member includes an arc-shaped surface recessed downward and inward, wherein the container is discharged through the at least one opening. Setting the gas in the space to generate a pressure difference between the upper surface and the lower surface of the photosensitive chip, so that the photosensitive chip is bent downward, including:
  • the photosensitive chip is bent until the lower surface of the photosensitive chip is attached to the curved surface, so that when the photosensitive chip is bent downward, a lower surface that matches the focal imaging surface of the photosensitive component is formed.
  • the position where the opening is formed on the circuit board corresponds to the central area of the photosensitive chip.
  • the method further includes:
  • a heat dissipation material is injected into the accommodation space through the opening to form the heat dissipation element in the accommodation space, wherein the heat dissipation element is attached to at least a part of the lower surface of the photosensitive chip.
  • FIG. 1 illustrates a schematic diagram of the pickup process of the photosensitive chip in the existing COB assembly process.
  • Fig. 3 illustrates a schematic diagram of a photosensitive assembly according to an embodiment of the present application.
  • Fig. 5 illustrates a top view of the photosensitive assembly according to an embodiment of the present application.
  • Fig. 6 illustrates an enlarged schematic view of the upper surface of the shaping member in the photosensitive assembly according to an embodiment of the present application.
  • Fig. 7 illustrates a schematic top view of a modified implementation of the photosensitive assembly according to an embodiment of the present application.
  • Fig. 8 illustrates a schematic top view of another modified implementation of the photosensitive assembly according to an embodiment of the present application.
  • FIG. 10 illustrates a schematic diagram of still another modified embodiment of the photosensitive assembly according to the embodiment of the present application.
  • FIG. 12 illustrates a schematic diagram of another modified implementation of the photosensitive assembly according to an embodiment of the present application.
  • FIG. 14 illustrates a schematic diagram of another modified implementation of the photosensitive assembly according to an embodiment of the present application.
  • FIG. 17 illustrates a schematic diagram of another modified implementation of the photosensitive assembly according to an embodiment of the present application.
  • FIG. 18 illustrates a schematic diagram of another modified implementation of the photosensitive assembly according to an embodiment of the present application.
  • 22A and 22B illustrate schematic diagrams of another manufacturing process of the photosensitive assembly according to an embodiment of the present application.
  • FIG. 24 illustrates a schematic diagram of another modified implementation of the camera module according to an embodiment of the present application.
  • FIG. 26 illustrates a schematic diagram of another modified implementation of the camera module according to an embodiment of the present application.
  • FIG. 27 illustrates a schematic diagram of another modified implementation of the camera module according to an embodiment of the present application
  • FIG. 28 illustrates a schematic diagram of a camera module according to an embodiment of the present application, wherein the camera module is a dynamic focus camera module.
  • FIGS. 30A and 30B illustrate schematic diagrams of the manufacturing process of the photosensitive assembly according to an embodiment of the present application.
  • Fig. 31 illustrates a top view of the photosensitive assembly according to an embodiment of the present application.
  • Fig. 32 illustrates an enlarged schematic diagram of the upper surface of the shaping member in the photosensitive assembly according to an embodiment of the present application.
  • FIG. 33 illustrates a schematic top view of a modified implementation of the photosensitive assembly according to an embodiment of the present application.
  • FIG. 34 illustrates a schematic top view of another modified implementation of the photosensitive assembly according to the embodiment of the present application.
  • FIG. 35 illustrates a schematic diagram of another modified implementation of the photosensitive assembly according to an embodiment of the present application.
  • FIG. 36 illustrates a schematic diagram of still another modified embodiment of the photosensitive assembly according to the embodiment of the present application.
  • FIG. 37 illustrates a schematic diagram of another modified implementation of the photosensitive assembly according to the embodiment of the present application.
  • FIG. 40 illustrates a schematic diagram of another modified implementation of the photosensitive assembly according to an embodiment of the present application.
  • FIG. 41 illustrates a schematic diagram of another modified implementation of the photosensitive assembly according to an embodiment of the present application.
  • FIG. 42 illustrates a schematic diagram of another modified implementation of the photosensitive assembly according to an embodiment of the present application.
  • FIG. 43 illustrates a schematic diagram of another modified implementation of the photosensitive assembly according to an embodiment of the present application.
  • FIG. 44 illustrates a schematic diagram of another modified implementation of the photosensitive assembly according to the embodiment of the present application.
  • FIG. 45 illustrates a schematic diagram of another modified implementation of the photosensitive assembly according to the embodiment of the present application.
  • FIG. 46 illustrates a schematic diagram of another modified implementation of the photosensitive assembly according to the embodiment of the present application.
  • FIG. 47 illustrates a schematic diagram of another modified implementation of the photosensitive assembly according to an embodiment of the present application.
  • 48A and 48B illustrate schematic diagrams of another manufacturing process of the photosensitive assembly according to an embodiment of the present application.
  • FIG. 50 illustrates a schematic diagram of another modified implementation of the camera module according to an embodiment of the present application.
  • FIG. 51 illustrates a schematic diagram of another modified implementation of the camera module according to an embodiment of the present application.
  • FIG. 52 illustrates a schematic diagram of another modified implementation of the camera module according to an embodiment of the present application.
  • FIG. 53 illustrates a schematic diagram of another modified implementation of the camera module according to an embodiment of the present application
  • the existing camera module is usually assembled by COB (Chip on Board) process: picking up the photosensitive chip, attaching to the circuit board, and attaching the plastic bracket to the circuit board.
  • COB Chip on Board
  • FIG. 1 illustrates a schematic diagram of the pickup process of the photosensitive chip in the existing COB assembly process.
  • the photosensitive chip is picked up by suction, and since the photosensitive area of the photosensitive chip cannot be contacted, the suction nozzle of the pickup can only be attached to the non-sensitive area of the photosensitive chip.
  • the suction nozzle of the pickup can only be attached to the non-sensitive area of the photosensitive chip.
  • the photosensitive chip will be bent toward the photosensitive surface of the photosensitive chip due to being sucked, and assume an upward convex shape (from the effect shown in Figure 1, it is vividly stated ,
  • the curved shape of the photosensitive chip can be defined as a "crying face" shape).
  • FIG. 2 illustrates a schematic diagram of the imaging light path of the camera module.
  • the actual focal plane (the actual focal imaging plane) is formed
  • An arc convex toward the image side, that is, the actual focal plane is an arc surface.
  • the manufacturing process of a curved photosensitive chip is more complicated and more difficult.
  • most of the photosensitive chip manufacturers and camera module manufacturers are currently separated.
  • the curved photosensitive chip has become a big problem in transportation: the flat photosensitive chip can be transported by imposition.
  • the curved photosensitive chip is difficult to transport by imposition.
  • the photosensitive chip In addition to the imaging problem, as the size of the photosensitive chip continues to increase (or the frame rate increases), the photosensitive chip generates a lot of heat during the working process, and how to achieve heat dissipation is also an urgent problem to be solved.
  • the basic idea of the present application is to bend the planar photosensitive chip into a shape that fits the actual focal imaging surface through a special manufacturing process, and in this way, the imaging quality of the camera module is improved.
  • a heat sink for enhancing heat dissipation is formed on the back of the photosensitive chip to solve the heat dissipation problem.
  • a photosensitive component which includes: a circuit board, a photosensitive chip and a shaping component, wherein the circuit board has at least one opening formed therethrough, and the photosensitive chip is electrically connected to the In the circuit board, the lower surface of the photosensitive chip is attached to the shaping component to form an accommodation space with the shaping component and the circuit board, wherein the accommodation space is connected to the at least one opening , And configured to make the photosensitive chip bend downward during the process of assembling the photosensitive component.
  • the planar photosensitive chip is bent into a shape adapted to the actual focal imaging surface through a special manufacturing process, so as to improve the imaging quality of the camera module.
  • the present application also provides a photosensitive component, which includes a photosensitive chip and a shaping component, wherein the circuit board has at least one opening formed therethrough, and the photosensitive chip is electrically connected to the circuit Board, the lower surface of the photosensitive chip is attached to the shaping component to form an accommodating space with the shaping component and the circuit board, wherein the accommodating space is connected to the at least one opening, and It is configured such that the photosensitive chip is bent downward during the process of assembling the photosensitive component. In this way, the planar photosensitive chip is bent into a shape adapted to the actual focal imaging surface through a special manufacturing process, so as to improve the imaging quality of the camera module.
  • the photosensitive assembly 10 includes a circuit board 11, a photosensitive chip 12 electrically connected to the circuit board 11, and a shaping member 13, wherein the lower surface 122 of the photosensitive chip 12 is attached to the shaping member 13, and A accommodating space 100 is formed with the shaping component 13 and the circuit board 11, and the accommodating space 100 is configured such that the photosensitive chip 12 is bent downward during the process of assembling the photosensitive component 10.
  • the photosensitive chip 12 is bent into a shape that fits the actual focal plane, and in this way the imaging quality is improved.
  • the shaping member 13 sets a shaping surface 130, wherein the shaping surface 130 is configured to limit the shape of the photosensitive chip 12 to bend downward, so that the The shape of the lower surface 122 of the photosensitive chip 12 is adapted to the actual focal plane, in this way the imaging quality is improved.
  • the shaping component 13 includes a first shaping piece 131 and a second shaping piece 132, wherein the first shaping piece 131 is fixed to the circuit board 11, so The lower surface 122 of the photosensitive chip 12 is attached to the first shaping member 131.
  • an accommodating space is formed between the first shaping member 131, the photosensitive chip 12 and the circuit board 11. 100.
  • the second shaping member 132 is fixed on the circuit board 11 and located in the accommodating space 100, and the height of the second shaping member 132 is lower than that of the first shaping member 131.
  • the first shaping member 131 and the second shaping member 132 are arranged in a stepped manner.
  • the upper surface of at least one of the first shaping member 131 and the second shaping member 132 includes an arc-shaped surface recessed downward and inward, and the arc-shaped surface is configured such that When the photosensitive chip 12 is bent downwards, a lower surface 122 that matches the focal imaging surface of the photosensitive assembly 10 is formed, so that the upper surfaces of the first shaping member 131 and the second shaping member 132 form a downward curve.
  • the said shaping surface 130 Preferably, in the embodiment of the present application, the upper surfaces of the first shaping member 131 and the second shaping member 132 each include an arc-shaped surface recessed downward and inward, as shown in FIG. 6.
  • the shaping component 13 further includes at least one opening 133 formed through the circuit board 11 and communicating with the accommodating space 100, wherein the photosensitive chip 12 is attached to the first shaping After the member 131 forms the accommodating space 100, the at least one opening 133 is configured to enable the suction device 40 to extend into the accommodating space 100 and be attached to at least a part of the lower surface 122 of the photosensitive chip 12, The photosensitive chip 12 is bent downward by pulling force. That is to say, in the embodiment of the present application, the specific force used to bend the photosensitive chip 12 is the pulling force generated by the suction device 40.
  • the technical principle for making the photosensitive chip 12 bend downward in the accommodating space 100 is: through the opening 133, the photosensitive chip 12 is used to bend the suction of the photosensitive chip 12
  • the device 40 extends into the accommodating space 100 and is adsorbed on the lower surface 122 of the photosensitive chip 12 to force the photosensitive chip 12 to bend downward by pulling the suction device 40 downward.
  • the suction device 40 includes a suction cup 41 and an extension rod 42 extending downward from the suction cup 41, wherein the suction cup 41 is used for suction to the lower surface 122 of the photosensitive chip 12 After the suction cup 41 is attached to the photosensitive chip 12, at least a part of it can be pulled down by the extension rod 42 to make the photosensitive chip 12 bend downward.
  • the adsorption device 40 can also be implemented in other types, which is not limited by this application.
  • the first shaping member 131 has a closed shape, so that the accommodating space formed by the first shaping member 131, the circuit board 11 and the photosensitive chip 12 100 is a closed space, which can effectively prevent dust located outside the first shaping member 131 from entering the accommodating space 100 through the first shaping member 131 to pollute the photosensitive chip.
  • the shape of the first shaping member 131 is adapted to the shape of the circuit board 11 and the photosensitive chip 12.
  • the shape of the existing circuit board 11 and the photosensitive chip 12 is generally rectangular. Accordingly, the shape of the first shaping member 131 is preferably implemented as a closed "mouth" shape.
  • the shape of the circuit board 11 and the photosensitive chip 12 will change.
  • the first shaping member 131 The shape can also be adjusted adaptively, which is not limited by this application.
  • the size of the first shaping member 131 is adapted to the size of the photosensitive chip 12, so that when the photosensitive chip 12 is attached to the first shaping member 131, the first shaping member 131 131 is supported on the edge portion of the photosensitive chip 12.
  • the upper surface 121 of the photosensitive chip 12 includes a photosensitive area 1211 and a non-sensitive area 1212 located around the photosensitive area 1211, wherein the photosensitive area 1211 is usually a sensitive area.
  • the non-photosensitive area 1212 is located at the edge portion of the upper surface 121 and surrounds the photosensitive area 1211.
  • the size of the first shaping member 131 is adapted to the photosensitive chip 12, so that the first shaping member 131 is supported on the non-photosensitive area 1212 of the photosensitive chip 12, so that the During the subsequent bending of the photosensitive chip 12, the photosensitive area 1211 of the photosensitive chip 12 will not be damaged.
  • the premise of the centerline of the photosensitive chip 12 mentioned in the present invention is that the photosensitive chip has a regular shape, that is, the photosensitive area 1211 and the non-sensitive area 1212 of the photosensitive chip 12 are symmetrically distributed about the center. .
  • the center line of the photosensitive chip 12 in the present invention refers to the center line of the photosensitive area 1211.
  • the shape and size of the first shaping member 131 are adapted to the size and shape of the photosensitive chip 12, so that when the photosensitive chip 12 is attached to the first shaping member 131, the The first shaping member 131 is supported on the non-photosensitive area 1212 of the photosensitive chip 12, and the center of the first shaping member 131 is coaxial with the center of the photosensitive chip 12. In other words, the photosensitive chip 12 is coaxially attached to the first shaping member 131.
  • the first shaping member 131 includes a first shaping member body 1311 and an adhesive 1340 applied to the first shaping member body, wherein the first shaping member The main body 1311 is arranged on the circuit board 11, and the adhesive 1340 is used to bond the photosensitive chip 12.
  • the function of the adhesive 1340 is to adhere the first shaping member main body 1311 and the photosensitive chip 12, and its thickness and material do not limit the application.
  • the photosensitive chip 12 may also be directly disposed on the first shaping member main body 1311 by ultrasonic welding and other processes without the adhesive 1340. That is to say, in other examples of this application, the adhesive is 1340 unnecessary components.
  • the adhesive 1340 has a certain degree of flexibility and high viscosity.
  • the second shaping member 132 should be preset in a preset position of the circuit board 11 in order to bond the photosensitive chip 12 to the first shaping member. After the member 131 forms the accommodating space 100, the second shaping member 132 is received in the accommodating space 100.
  • the height difference between the first shaping element 131 and the second shaping element 132 should be reduced, that is, the second shaping element 132
  • the height of the shaping element 132 should be increased; when the second shaping element 132 is far from the first shaping element 131, the height difference between the first shaping element 131 and the second shaping element 132 should increase, that is, The height of the second shaping member 132 should be reduced.
  • the shape of the shaping surface 130 matches the shape of the actual focal plane, which does not mean that the shape of the shaping surface 130 is exactly the same or completely coincides with the shape of the actual focal plane. It only means that the shape of the shaping surface 130 tends to be consistent with the shape of the actual focal plane.
  • the second shaping member 132 is arranged symmetrically with respect to the center of the photosensitive chip 12. In this way, when the lower surface 122 of the photosensitive chip 12 is attached to the second shaping member 132 under the action of the pressure difference, the bonding point of the second shaping member 132 and the photosensitive chip 12 is also relative to the The center of the photosensitive chip 12 is symmetrically distributed to form a uniform adhesive force on opposite sides or around the photosensitive chip 12 to ensure that the photosensitive chip 12 can be shaped more stably. More specifically, in the embodiment of the present application, the second shaping member 132 is symmetrically arranged on both sides of the center line set by the longer side of the photosensitive chip 12.
  • the adhesive 1340 applied to the first shaping element main body 1311 and the adhesive 1340 applied to the second shaping element main body 1321 can be implemented as the same
  • the adhesive 1340 may be a different type of adhesive 1340, and the applied amount or thickness of the adhesive 1340 is not limited by this application.
  • the first shaping element main body 1311 and the second shaping element main body 1321 are made of materials with higher hardness and higher thermal conductivity, for example, metal materials (including pure metal materials). , Metal and non-metal alloy materials, metal and metal alloy materials).
  • the shape of the photosensitive chip 12 is shaped as the shape of the shaping surface 130, so that the photosensitive
  • the shape of the lower surface 122 of the chip 12 is adapted to the actual focal plane.
  • the position where the opening 133 is formed on the circuit board 11 corresponds to the central area of the photosensitive chip 12.
  • the suction cup 41 of the suction device 40 can be attached to the central area of the lower surface 122 of the photosensitive chip 12, in this way,
  • the tension and bending force generated by the suction device 40 is the largest in the central area of the photosensitive chip 12 and gradually decreases with the central area toward the edge, so that the deformation of the photosensitive chip 12 is from the edge of the photosensitive chip 12 to the photosensitive chip 12
  • the center of 12 gradually increases to fit the shape of the actual focal plane.
  • the number of the openings 133 can be set to one or more, which is not limited by this application. It should also be understood that, in other examples of the embodiment of the present application, the opening 133 may also be formed in other positions on the circuit board 11.
  • Fig. 7 illustrates a schematic top view of a modified implementation of the photosensitive assembly according to an embodiment of the present application.
  • the position where the opening 133 is formed on the circuit board 11 is located between the first shaping member 131 and the second shaping member 132.
  • a corresponding number of the adsorption devices 40 can be used to bend the photosensitive chip.
  • the number of the openings 133 is two, correspondingly The number of the adsorption device 40 is also two.
  • the position where the opening 133 is formed on the circuit board 11 is arranged symmetrically with respect to the central area of the photosensitive chip 12, so that the suction device 40 is attached to the photosensitive chip 12.
  • the attachment positions of the lower surface of the chip 12 are also arranged symmetrically with respect to the central area of the photosensitive chip 12, thereby forming a relatively uniform tension at each position symmetrical to the central area of the photosensitive chip 12, so that the photosensitive chip 12
  • the chip 12 can be more symmetrically and gently bent downward in a manner tending to the shape of the shaping surface 130.
  • Fig. 8 illustrates a schematic diagram of another modified implementation of the photosensitive assembly according to an embodiment of the present application.
  • a part of the opening 133 is formed in the circuit board 11 at a position corresponding to the central area of the photosensitive chip 12, and another part of the opening 133 is formed in the The position of the circuit board 11 is between the first shaping member 131 and the second shaping member 132.
  • a corresponding number of the suction devices 40 can be used to bend the photosensitive chip.
  • the attachment positions of the lower surface of the chip 12 are also arranged symmetrically with respect to the central area of the photosensitive chip 12, thereby forming a relatively uniform tension at each position symmetrical to the central area of the photosensitive chip 12, so that the photosensitive chip 12
  • the chip 12 can be more symmetrically and gently bent downward in a manner tending to the shape of the shaping surface 130.
  • the circuit board 11 further includes a recess formed in the The first positioning groove 111 and the second positioning groove 112 on the top surface of the circuit board 11, wherein the first positioning groove 111 is used for positioning to fit the first shaping member 131 therein , And, the second positioning groove 112 is used for positioning to fit the second shaping member 132 therein.
  • the first positioning groove 111 is implemented to penetrate through the The first positioning through hole of the circuit board 11 and the first positioning groove 112 are implemented as second positioning through holes formed through the circuit board 11, wherein the first positioning through hole 111 is used for It is positioned to fit the first shaping element 131 therein, and the second positioning through hole 112 is used to position it to fit the second shaping element 132 therein.
  • the photosensitive component 10 further includes a reinforcing plate 18 attached to the bottom surface of the circuit board 11.
  • the reinforcing plate 18 is made of a metal material with high thermal conductivity, so that the heat generated by the photosensitive chip 12 can be directly conducted through the first shaping member 131 and the second shaping member 132 To the reinforcing plate 18, the purpose of heat dissipation is realized.
  • the first shaping member 131 and the second shaping member 132 are prefabricated parts, that is, the first shaping member body 1311 and the second shaping member 1321 are After being prefabricated, it is attached to the preset position of the circuit board 11.
  • the first shaping member 131 and the second shaping member 132 may also be integrally formed at a predetermined position of the circuit board 11.
  • the first shaping element main body 1311 and the second shaping element main body 1321 are made of metal materials
  • the first shaping element main body 1311 and the second shaping element main body 1321 can be integrated by an electroplating molding process. It is formed at the preset position of the circuit board 11.
  • first shaping element body 1311 and the second shaping element body 1321 are made of other materials with higher hardness and higher thermal conductivity, the corresponding integral molding process can be used in all
  • the first shaping element 131 and the second shaping element 132 are integrally formed at a preset position of the circuit board 11. In this regard, this application is not limited.
  • the shaping component 13 may also include a greater number or less of shaping members.
  • the shaping member 13 further includes a third shaping member 134 (including a body of the third shaping member 134 and a top surface applied to the body of the third shaping member 134 1340), wherein the third shaping element 134 is provided between the first shaping element 131 and the second shaping element 132 to pass the first shaping element 131, the second shaping element 131 and the second shaping element 132.
  • the shaping member 132 and the third shaping member 134 form the shaping surface 130.
  • the shaping member 13 only includes the first shaping member 131, wherein the upper surface of the first shaping member 131 includes a downward and inward depression
  • the curved surface is configured such that when the photosensitive chip 12 is bent downward, a lower surface 122 that matches the focal imaging surface of the photosensitive assembly 10 is formed.
  • FIG. 13 illustrates a schematic diagram of another modified implementation of the photosensitive assembly according to an embodiment of the present application.
  • both the first shaping member 131 and the second shaping member 132 have a closed ring shape, so that the first shaping member 131 and the second shaping member 132 A containing cavity is formed between.
  • the shaping member 13 further includes an adhesive 1340 arranged between the first shaping member 131 and the second shaping member 132, wherein the upper surface of the adhesive 1340 The height of the highest point of the surface is higher than the upper surface of the second shaping member 132.
  • the adhesive 1340 should have a relatively high viscosity to prevent the adhesive 1340 from flowing out from the upper surface of the second shaping member 132. In this way, after the photosensitive chip 12 is attached to the first shaping member 131, the photosensitive chip 12 is pulled by the suction device 40 to force the photosensitive chip 12 to bend downward until it is adhered to the The adhesive 1340 between the first shaping element 131 and the second shaping element 132. It is worth mentioning that in this modified embodiment, the adhesive 1340 may not be provided on the upper surface of the second shaping member 132.
  • the adhesive 1340 may flow to the upper surface of the second shaping member 132 during inhalation, so that The photosensitive chip 12 is bent downward and pasted to the second shaping member 132 through the adhesive 1340 to achieve better bonding and improve reliability. Furthermore, the adhesive 1340 may not be higher than the second shaping member 132, for example, the upper surface of the adhesive 1340 is flush with the upper surface of the second shaping member 132.
  • the photosensitive component 10 further includes a heat dissipation member 19 formed in the accommodating space 100, wherein the The heat sink 19 is attached to at least a part of the lower surface 122 of the photosensitive chip 12, so that the heat generated by the photosensitive chip 12 can be conducted to the outside through the heat sink 19 in contact with the photosensitive chip 12,
  • the heat sink 19 needs to be filled in the accommodating space 100, so the first shaping member 131 is preferably implemented in a closed shape.
  • the heat sink 19 fills the entire accommodating space 100, so that the lower surface 122 of the photosensitive chip 12 is completely in contact with the heat sink 19 to maximize Increase the heat dissipation area and improve the heat dissipation performance.
  • the forming position and filling ratio of the heat sink 19 in the accommodating space 100 depend on the shape of the second shaping member 132 and the position of the at least one opening 133.
  • the second shaping member 132 when the second shaping member 132 is implemented as a closed "mouth" shape, and the at least one opening 133 is formed in the circuit board 11, the position corresponding to the central area of the photosensitive chip 12 At this time, the heat dissipation member 19 can only occupy the cavity enclosed by the second shaping member 132, the photosensitive chip 12 and the circuit board 11 at most, as shown in FIG. 14.
  • the heat dissipation member 19 can occupy the entire accommodating space 100, and only part of the opening 133 needs to be formed in the entire accommodating space 100.
  • the position of the circuit board 11 is set to correspond to the central area of the photosensitive chip 12, and at the same time, another part of the opening 133 is formed at the position of the circuit board 11 to be located between the first shaping member 131 and the The space between the second shaping members 132 is sufficient.
  • the heat dissipation material 190 when the heat dissipation material 190 is implemented as a fluid heat dissipation material 190, the fluid heat dissipation material 190 can be injected into the accommodating space 100 through the opening 133, so as to be cured and formed.
  • the heat sink 19 is formed.
  • the photosensitive component 10 when performing the injection process, the photosensitive component 10 may be turned upside down to prevent the fluid-like heat dissipation material 190 from flowing out of the opening 133.
  • the circuit board 11 when the number of the opening 133 is only one, in order to balance the internal and external pressures so that the fluid-like heat dissipation material 190 can be smoothly injected into the accommodating space 100, the circuit board 11 can be further A vent 135 is opened, as shown in FIG. 15.
  • the suction hole is used to inject the heat dissipation material 190, and its function is equivalent to the ventilation hole 135. That is, when the number of the openings 133 exceeds one, at least one of the openings forms the vent 135.
  • the heat dissipating material 190 can fill the entire accommodating space 100, so that after solidification and molding, on the one hand, The heat sink 19 is attached to the entire lower surface 122 of the photosensitive chip 12 (corresponding to the portion of the accommodating space 100) to increase the heat dissipation area; on the other hand, the heat sink 19 extends from the bottom of the photosensitive chip 12
  • the surface 122 extends to the opening 133, that is, the heat dissipation member 19 directly extends to the outside to facilitate heat dissipation.
  • the photosensitive component 10 further includes a reinforcing plate 18 attached to the bottom surface of the circuit board 11.
  • the reinforcing plate 18 is made of a metal material with high thermal conductivity. In this way, the heat dissipation performance of the photosensitive component 10 is further enhanced.
  • the heat dissipation material 190 may also be implemented in other forms, for example, a granular heat dissipation material 190, as shown in FIG. 16.
  • the granular heat dissipation material 190 can be filled into the accommodating space 100 to form the heat dissipation member 19.
  • the photosensitive component 10 further includes a reinforcing plate 18 for sealing the opening 133, and
  • the reinforcing plate 18 is made of a metal material with high thermal conductivity, so as to seal the opening 133 while further enhancing the heat dissipation performance of the photosensitive component 10.
  • the photosensitive component 10 further includes at least one electronic component 14 for electrically connecting the photosensitive chip 12 to the lead wire of the circuit board 11, and filtering light
  • each of the leads 123 bends and extends between the photosensitive chip 12 and the circuit board 11, so as to electrically connect the photosensitive chip 12 to the circuit board 11 through the leads 123, thereby
  • the circuit board 11 can supply power to the photosensitive chip 12 based on the lead 123, and the photosensitive chip 12 can transmit the collected signal based on the lead 123.
  • the type of the lead 123 is not limited by this application.
  • the lead 123 may be a gold wire, a silver wire, or a copper wire.
  • the lead 123 can be installed between the circuit board 11 and the photosensitive chip 12 through a process of "golding wire" to achieve electrical connection between the two.
  • the "golden thread” process is generally divided into two types: the “positive gold line” process and the “reverse gold line” process.
  • the “positive gold wire” process means that in the process of laying out the lead 123, first one end of the lead 123 is formed on the conductive end of the circuit board 11, and then the lead 123 is bent and extended, and finally The other end of the lead 123 is formed on the conductive end of the photosensitive chip 12. In this way, the lead 123 is formed between the photosensitive chip 12 and the circuit board 11.
  • the "reverse gold wire” process means that in the process of laying out the leads 123, first one end of the lead 123 is formed on the conductive end of the photosensitive chip 12, and then the lead 123 is bent and extended, and finally The other end of the lead 123 is formed on the conductive end of the circuit board 11. In this way, the lead 123 is formed between the photosensitive chip 12 and the circuit board 11. It is worth mentioning that the height of the upward protrusion of the lead 123 formed by the "reverse gold wire” process is relative to the height of the upward protrusion of the lead 123 formed by the "positive gold wire” process. Therefore, preferably, In this specific implementation, the wire 123 is formed using the "reversed gold wire” process.
  • the photosensitive chip 12 and the circuit board 11 can be connected in other ways (the lead 123 may not be used), for example, a back Turn-on technical solutions.
  • this application is not limited.
  • the bracket 16 is disposed on the circuit board 11 to support the filter element 15.
  • the bracket 16 is implemented as a traditional plastic bracket 16, which is prefabricated and attached to the top surface of the circuit board 11, wherein the filter element 15 is installed
  • At least the photosensitive area 1211 on the top of the support 16 and corresponding to the photosensitive chip 12 is used to filter the light entering the photosensitive chip 12 to improve imaging quality.
  • the photosensitive component 10 is based on a traditional COB process.
  • the filter element 15 can be implemented in different types, including but not limited to, the filter element 15 can be implemented as an infrared cut filter, a full transmission spectrum filter, and others.
  • the filter or a combination of multiple filters can be Switching to be selectively located on the photosensitive path of the photosensitive chip 12, so that the infrared cut filter can be switched to the photosensitive path of the photosensitive chip 12 when used in an environment with sufficient light such as daytime.
  • the full transmission spectrum can be filtered
  • the film is switched to the light-sensing path of the light-sensing chip 12 to allow part of the infrared rays of the light reflected by the object entering the light-sensing chip 12 to pass through.
  • FIG. 17 illustrates a schematic diagram of another modified implementation of the photosensitive assembly according to an embodiment of the present application.
  • the photosensitive component 10 is manufactured based on the MOB (Molding on Board) process.
  • the bracket 16 is implemented as a molded bracket 16A, which is integrally formed on the circuit board 11 through a molding process to integrally cover at least a part of the circuit board 11 and At least part of the electronic components 14.
  • the circuit board 11 can be placed in the lower mold, and then an upper mold matched with the lower mold is provided to form a molding cavity between the upper and lower molds after the upper and lower molds are closed.
  • the aforementioned mold includes a pressing block that is pressed onto the circuit board 11 when the mold is closed.
  • a molding material is injected into the molding cavity, and after curing, molding and drawing, the molded support is integrally covered with at least a part of the circuit board 11 and at least part of the electronic component 14 16A.
  • the first shaping component 131 and the second shaping component 132 of the shaping component are integrally formed on the module support 16 After the preset position of the circuit board 11, it is installed in the preset position of the circuit board 11. Such a manufacturing sequence is conducive to project implementation.
  • the upper mold includes a pressing block, wherein the pressing block is pressed against the non-photosensitive area 1212 of the photosensitive chip 12 when the mold is closed. Furthermore, a molding material is injected into the molding cavity, and after being cured, molded, and pulled out, at least a part of the circuit board 11, the at least one electronic component 14, and the non-conductive parts of the photosensitive chip 12 are obtained. At least a part of the molded support 16B of the photosensitive area 1212, wherein the area occupied by the press block corresponds to forming a light-through hole of the photosensitive chip 12.
  • the shape of the inner surface of the molded bracket 16B is determined by the shape of the pressure block.
  • the inner side surface of the mold bracket 16B is perpendicular to the upper surface 121 of the photosensitive chip 12.
  • the inner side of the bracket molding 16B extends obliquely outward.
  • the inner side surface of the press block has a step shape
  • the inner side surface of the molded bracket 16 also has a step shape to form on the top surface of the molded bracket 16B for mounting the filter Component 15 mounting platform 160.
  • this technical solution is defined as an IOM solution (IRFilter on Molding) in the application, as shown in Figure 19.
  • the first shaping element 131 and the second shaping element 132 of the shaping assembly are integrally formed on the module support 16 Before the preset positions of the circuit board 11 and the photosensitive chip 12, they are pre-installed or integrally formed at the preset positions of the circuit board 11. Such a manufacturing sequence is conducive to project implementation.
  • the The photosensitive component 10 also includes a side encapsulation 161 that wraps the photosensitive chip 12 and the sides of the first shaping member 131 to prevent the position of the photosensitive chip 12 from shifting during the molding process, such as Shown in Figure 20. It should be understood that the side encapsulation 161 can not only prevent the position of the photosensitive chip 12 from shifting, but also can effectively reduce the stress generated by the mold bracket 16B from being transmitted to the photosensitive chip 12.
  • FIG. 21 illustrates a schematic diagram of another modified implementation of the photosensitive assembly according to an embodiment of the present application.
  • the filter element 15 is stacked on the photosensitive chip 12, and the bracket 16 is implemented as a molded bracket 16C, which is integrally molded by a molding process to cover the At least a part of the circuit board 11, the at least one electronic component 14, at least a part of the non-photosensitive area 1212 of the photosensitive chip 12 and at least a part of the filter element 15.
  • the filter element 15 is stacked on the The photosensitive chip 12 is described to form a semi-finished component. Furthermore, the semi-finished component is placed in the lower mold, and then an upper mold matched with the lower mold is provided to form a molding cavity between the upper and lower molds after they are closed.
  • the upper mold includes a pressing block, wherein the pressing block is pressed against the filter element 15 when the mold is closed. Furthermore, a molding material is injected into the molding cavity, and after being cured, molded, and pulled out, at least a part of the circuit board 11, the at least one electronic component 14, and the non-conductive parts of the photosensitive chip 12 are obtained. At least a part of the molded support 16C of the photosensitive area 1212, wherein the area occupied by the press block corresponds to forming a light through hole of the photosensitive chip 12.
  • the shape of the inner surface of the molded bracket 16C is determined by the shape of the pressure block.
  • the inner side surface of the molded support 16C is perpendicular to the filter element 15.
  • the inner side of the molded bracket 16C extends obliquely outward.
  • this technical solution is defined as an IOC solution (IR Filter on Chip) in the application.
  • the photosensitive chip 12 in addition to supporting the filter element 15 on the bracket 16 (including the plastic bracket 16, the molded bracket 16A, 16B, 16C), the photosensitive chip 12
  • the filter element 15 can also be installed in other ways, as long as the filter element 15 is held in the photosensitive path of the photosensitive component 10.
  • the photosensitive assembly 10 further includes a filter element holder 17, and the filter element holder 17 is installed on the holder 16 and used for installing the filter element 15.
  • the filter element 15 may also be supported in the optical lens 20, or may be formed on the optical lens in the form of a coating. The surface of the lens in the lens 20. In this regard, this application is not limited.
  • the photosensitive component based on the embodiment of the present application has been clarified that the planar photosensitive chip is bent into a shape adapted to the actual focal imaging surface through a special manufacturing process, so as to improve the imaging quality of the camera module.
  • the manufacturing process of the photosensitive element 10 is explained below from the perspective of manufacturing process.
  • FIGS. 4A and 4B the manufacturing process of the photosensitive component 10 based on the embodiment of the present application is illustrated, which is used to prepare the photosensitive component and its modification implementation as described above.
  • the method for manufacturing the photosensitive component 10 includes the following steps:
  • a circuit board 11, a photosensitive chip 12, a first shaping member 131 and a second shaping member 132 are provided, wherein the circuit board 11 includes at least one opening 133. It is worth mentioning that the opening 133 on the circuit board 11 may also be formed by a punching process after the accommodating space 100 is formed, which is not limited by this application.
  • the first shaping member 131 and the second shaping member 132 are fixed at a predetermined position of the circuit board 11.
  • the photosensitive chip 12 is attached to the first shaping member 131 to define an accommodating space 100 between the first shaping member 131, the circuit board 11 and the photosensitive chip 12, wherein, the opening 133 formed in the circuit board 11 communicates with the accommodating space 100, wherein the second shaping member 132 is located in the accommodating space 100, and the second shaping member The height of 132 is lower than that of the first shaping member 131, wherein the upper surface of at least one of the first shaping member and the second shaping member includes an arc-shaped surface recessed downward and inward.
  • the suction device 40 is attached to at least a part of the lower surface 122 of the photosensitive chip 12 through the opening 133.
  • the photosensitive chip 12 is pulled down by the suction device 40 to make the photosensitive chip 12 bend downward.
  • the suction device 40 includes a suction cup 41 and an extension rod 42 extending downward from the suction cup 41, wherein the suction cup 41 is used for suctioning at least of the lower surface 122 of the photosensitive chip 12
  • the extension rod 42 can be pulled to make the photosensitive chip 12 bend downward.
  • the adsorption device 40 can also be implemented in other types, which is not limited by this application.
  • the number of the openings 133 can be set to one or more, which is not limited by this application. It should also be understood that, in other examples of the embodiment of the present application, the opening 133 may also be formed in other positions on the circuit board 11.
  • the first shaping member 131 should have a closed shape (for example, implemented as a "mouth" shape), and the second shaping member 132 is relative to the center of the photosensitive chip 12 Symmetrical arrangement.
  • the height setting of the second shaping member 132 is related to the relative positional relationship between the second shaping member 131 and the first shaping member 131.
  • the shape of the shaping surface 130 defined by the first shaping member 131 and the second shaping member 132 for defining the curved shape of the photosensitive chip 12 is set based on the shape of the actual focal plane .
  • the height difference between the first shaping element 131 and the second shaping element 132 should be reduced (that is, the second shaping element 132 The height of the piece 132 should increase); when the second shaping piece 132 is far away from the first shaping piece 131, the height difference between the first shaping piece 131 and the second shaping piece 132 should increase (that is, so The height of the second shaping member 132 should be reduced).
  • the upper surface of at least one of the first shaping member 131 and the second shaping member 132 includes an arc-shaped surface recessed downward and inward, and the arc-shaped surface is configured such that When the photosensitive chip 12 is bent downwards, a lower surface 122 that matches the focal imaging surface of the photosensitive assembly 10 is formed, so that the upper surfaces of the first shaping member 131 and the second shaping member 132 form a downward curve.
  • the said shaping surface 130 Preferably, in the embodiment of the present application, the upper surface of the first shaping member 131 and the second shaping member 132 includes an arc-shaped surface recessed downward and inward.
  • the process of bending the photosensitive chip 12 includes:
  • the manufacturing method further includes the steps:
  • the heat sink 19 occupies the entire accommodating space 100, so that the lower surface 122 (corresponding to the accommodating space 100) of the photosensitive chip 12 is completely in contact with the accommodating space 100.
  • the heat sink 19 is in contact with each other, and in this way, the heat dissipation area is maximized and the heat dissipation performance is improved.
  • the process of forming the heat dissipation element 19 in the accommodating space 100 includes: adding the fluid heat dissipation material 190 is injected into the accommodating space 100 through the opening 133 to form the heat sink 19 after curing and molding.
  • the photosensitive component 10 may be turned upside down to prevent the fluid-like heat dissipation material 190 from flowing out of the opening 133.
  • the circuit board 11 can be further Open vent 135.
  • the suction hole is used to inject the heat dissipation material 190, and its function is equivalent to the ventilation hole 135. That is, when the number of the openings 133 exceeds one, at least one of the suction holes forms the ventilation hole 135.
  • an additional strong plate 18 can be further attached to the bottom surface of the circuit board 11, wherein, preferably, the strengthening plate 18 is made of a metal material with a higher thermal conductivity. In this way, the heat dissipation performance of the photosensitive component 10 is further enhanced.
  • the heat dissipation material 190 when the heat dissipation material 190 is implemented as a granular heat dissipation material 190.
  • the process of forming the heat sink 19 in the accommodating space 100 includes: filling the heat-dissipating material 190 in granular form into the accommodating space 100 through the opening 133, and, in the circuit
  • An additional strong plate 18 is attached to the bottom surface of the plate 11 to seal the opening 133 through the reinforcing plate 18.
  • the reinforcing plate 18 is made of a metal material with high thermal conductivity, so as to seal the opening 133 while further enhancing the heat dissipation performance of the photosensitive component 10.
  • the manufacturing process of the photosensitive component 10 further includes: installing a bracket 16 on the circuit board 11, and installing the filter element 15 on the bracket 16.
  • the bracket 16 is implemented as a traditional plastic bracket 16.
  • the process of installing the bracket 16 on the circuit board 11 is specifically expressed as: mounting the plastic bracket 16 on the circuit board 11.
  • the filter element 15 is attached to the holder 16.
  • the bracket 16 is implemented as a molded bracket 16A.
  • the process of arranging the support 16 on the circuit board 11 includes: integrally molding the molded support 16A on the circuit board 11 through a molding process, wherein the molded support 16A covers the circuit board 11 At least a part of the circuit board 11 and at least a part of the at least one electronic component 14.
  • the filter element 15 is attached to the mold holder 16A.
  • the first shaping member 131 and the second shaping member 132 are integrally formed on the circuit board 11 at the predetermined position after the module bracket 16 is mounted on The preset position of the circuit board 11. Such a manufacturing sequence is conducive to project implementation.
  • a side encapsulation 161 is applied to the side of the chip 12 and the first shaping member 131, so that the side encapsulation 161 wraps the side of the photosensitive chip 12 and the first shaping member 131. In this way, Prevent the position of the photosensitive chip 12 from shifting during the molding process.
  • the support 16 is implemented as a molded support 16C.
  • the process of setting the support 16 and the circuit board 11 includes: stacking the filter element 15 on the photosensitive chip 12 , And, the molded support 16C is integrally formed on the circuit board 11, wherein the integrally covers at least a part of the circuit board 11, the at least one electronic component 14, and the photosensitive chip 12 At least a part of the photosensitive region 1212 and at least a part of the filter element 15.
  • the filter element 15 in addition to supporting the filter element 15 on the bracket 16 (including the plastic bracket 16, the molded bracket 16A, 16B, 16C), the photosensitive chip 12
  • the filter element 15 can also be installed in other ways, as long as the filter element 15 is held in the photosensitive path of the photosensitive component 10.
  • the photosensitive assembly 10 further includes a filter element holder 17, and the filter element holder 17 is installed on the holder 16 and used for installing the filter element 15.
  • the filter element 15 may also be supported in the optical lens 20, or may be formed on the optical lens in the form of a coating. The surface of the lens in the lens 20. In this regard, this application is not limited.
  • the manufacturing process of the photosensitive component 10 includes the following steps:
  • a circuit board 11 and a photosensitive chip 12 are provided, wherein the circuit board 11 includes at least one opening 133. It is worth mentioning that the opening 133 on the circuit board 11 may also be formed by a punching process after the accommodating space 100 is formed, which is not limited by this application.
  • the photosensitive chip 12 is attached to the first shaping member 131, in this way, a container is defined and formed between the first shaping member 131, the circuit board 11 and the photosensitive chip 12.
  • the suction device 40 is attached to at least a part of the lower surface 122 of the photosensitive chip 12 through the opening 133.
  • the photosensitive chip 12 is pulled down by the suction device 40 to make the photosensitive chip 12 bend downward.
  • the first shaping member 131 and the second shaping member 132 are integrally formed on the circuit board 11, instead of being prefabricated first. Placement method.
  • the process of integrally forming a first shaping member 131 and a second shaping member 132 on the circuit board 11 includes:
  • Adhesives 1340 are respectively applied to the first shaping element main body 1311 and the second shaping element main body 1321 to form the first shaping element 131 and the second shaping element main body 1311 and the adhesive 1340.
  • the second shaping member 132 is formed by the second shaping member main body 1321 and the adhesive 1340.
  • the suction device 40 includes a suction cup 41 and an extension rod 42 extending downward from the suction cup 41, wherein the suction cup 41 is used for suctioning at least of the lower surface 122 of the photosensitive chip 12
  • the extension rod 42 can be pulled to make the photosensitive chip 12 bend downward.
  • the adsorption device 40 can also be implemented in other types, which is not limited by this application.
  • the position where the opening 133 is formed on the circuit board 11 corresponds to the central area of the photosensitive chip 12, so that when the suction device 40 extends through the opening 133 into the accommodating space 100 At this time, the suction cup 41 of the suction device 40 can be attached to the central area of the lower surface 122 of the photosensitive chip 12, so that the bending force generated by the suction device 40 is the largest in the central area of the photosensitive chip 12 and follows The central area gradually decreases toward the edge, so that the degree of deformation of the photosensitive chip 12 gradually increases from the edge of the photosensitive chip 12 to the center of the photosensitive chip 12, and is adapted to the shape of the actual focal plane.
  • the first shaping member 131 should have a closed shape (for example, implemented as a "mouth" shape), and the second shaping member 132 is relative to the center of the photosensitive chip 12 Symmetrical arrangement.
  • the height setting of the second shaping member 132 is related to the relative positional relationship between the second shaping member 131 and the first shaping member 131.
  • the shape of the shaping surface 130 defined by the first shaping member 131 and the second shaping member 132 for defining the curved shape of the photosensitive chip 12 is set based on the shape of the actual focal plane .
  • the height difference between the first shaping element 131 and the second shaping element 132 should be reduced (ie, the second shaping element 132 The height of the piece 132 should increase); when the second shaping piece 132 is far away from the first shaping piece 131, the height difference between the first shaping piece 131 and the second shaping piece 132 should increase (that is, so The height of the second shaping member 132 should be reduced).
  • the upper surface of at least one of the first shaping member 131 and the second shaping member 132 includes an arc-shaped surface recessed downward and inward, and the arc-shaped surface is configured such that When the photosensitive chip 12 is bent downwards, a lower surface 122 that matches the focal imaging surface of the photosensitive assembly 10 is formed, so that the upper surfaces of the first shaping member 131 and the second shaping member 132 form a downward curve.
  • the said shaping surface 130 Preferably, in the embodiment of the present application, the upper surface of the first shaping member 131 and the second shaping member 132 includes an arc-shaped surface recessed downward and inward.
  • the process of bending the photosensitive chip 12 includes:
  • the photosensitive chip 12 is bent until the lower surface 122 of the photosensitive chip 12 is attached to the curved surface, so that when the photosensitive chip 12 is bent downward, it forms a lower surface that matches the focal imaging surface of the photosensitive component 10. surface.
  • the preparation process of the photosensitive component 10 further includes the following steps:
  • a heat dissipation material is injected into the accommodating space 100 through the opening 133 to form the heat sink in the accommodating space 100, wherein the heat sink is attached to the bottom surface 122 of the photosensitive chip 12 At least part of it.
  • the heat sink 19 occupies the entire accommodating space 100, so that the lower surface 122 (corresponding to the accommodating space 100) of the photosensitive chip 12 is completely in contact with the accommodating space 100.
  • the heat sink 19 is in contact with each other, and in this way, the heat dissipation area is maximized and the heat dissipation performance is improved.
  • the process of forming the heat dissipation element 19 in the accommodating space 100 includes: adding the fluid heat dissipation material 190 is injected into the accommodating space 100 through the opening 133 to form the heat sink 19 after curing and molding.
  • the photosensitive component 10 may be turned upside down to prevent the fluid-like heat dissipation material 190 from flowing out of the opening 133.
  • the circuit board 11 can be further Open vent 135.
  • the openings 133 are used to inject the heat dissipation material 190, and their function is equivalent to the ventilation holes 135. That is, when the number of the openings 133 exceeds one, at least one of the openings 133 forms the vent 135.
  • an additional strong plate 18 can be further attached to the bottom surface of the circuit board 11, wherein, preferably, the strengthening plate 18 is made of a metal material with a higher thermal conductivity. In this way, the heat dissipation performance of the photosensitive component 10 is further enhanced.
  • the bracket 16 is implemented as a traditional plastic bracket 16.
  • the process of installing the bracket 16 on the circuit board 11 is specifically expressed as: mounting the plastic bracket 16 on the circuit board 11.
  • the filter element 15 is attached to the holder 16.
  • the bracket 16 is implemented as a molded bracket 16A.
  • the process of arranging the support 16 on the circuit board 11 includes: integrally molding the molded support on the circuit board 11 through a molding process, wherein the molded support 16A covers the At least a part of the circuit board 11 and at least a part of the at least one electronic component 14. Furthermore, the filter element 15 is attached to the mold holder.
  • the bracket 16 is implemented as a molded bracket. Accordingly, the process of arranging the bracket 16 on the circuit board 11 includes: integrally forming the bracket 16 on the circuit board 11 through a molding process. A molded bracket, wherein the molded bracket covers at least a part of the circuit board 11, the at least one electronic component 14, and at least a part of the non-photosensitive area 1212 of the photosensitive chip 12. Furthermore, the filter element 15 is attached to the mold holder.
  • the photosensitive chip 12 is further included in the photosensitive chip before the MOC process is performed to form the molded support. 12 and the side of the shaping member 13 apply side encapsulation 161, so that the side encapsulation 161 wraps the side of the photosensitive chip 12 and the side of the shaping member 13, in this way, prevent the molding The position of the photosensitive chip 12 shifts during the process.
  • the support 16 is implemented as a molded support. Accordingly, the process of setting the support 16 and the circuit board 11 includes: stacking the filter element 15 on the photosensitive chip 12, And, the molded support 16C is integrally formed on the circuit board 11, wherein the integrally covers at least a part of the circuit board 11, the at least one electronic component 14, and the non-photosensitive chip 12 At least a part of the area 1212 and at least a part of the filter element 15.
  • the shape of the inner side of the molded support 16 is determined by the shape of the press block.
  • the inner side of the molded bracket 16 also has a stepped shape, so as to form on the top surface of the molded bracket 16 for mounting the filter Component 15 mounting platform 160. Accordingly, in these examples, the filter element 15 is mounted on the mounting platform 160.
  • the photosensitive assembly 10 in addition to supporting the filter element 15 on the support 16 (including a plastic support and a molded support) and the photosensitive chip 12, other To install the filter element 15 in this way, it is only necessary to keep the filter element 15 in the photosensitive path of the photosensitive component 10.
  • the photosensitive assembly 10 further includes a filter element holder 17, and the filter element holder 17 is installed on the holder 16 and used for installing the filter element 15.
  • the filter element 15 may also be supported in the optical lens 20, or may be formed on the optical lens in the form of a coating. The surface of the lens in the lens 20. In this regard, this application is not limited.
  • the camera module includes a moving focus camera module and a fixed focus camera module.
  • the photosensitive chip 12 is bent based on the shape of the actual focal plane, and in this way the imaging quality of the camera module can be improved.
  • the camera module based on the embodiment of the present application has been clarified that it uses a special manufacturing process to bend the planar photosensitive chip 12 into a shape that fits the actual focal imaging surface. In this way, the The imaging quality of the camera module.
  • the photosensitive assembly 10 includes a circuit board 11, a photosensitive chip 12 electrically connected to the circuit board 11, and a shaping component 13, wherein the lower surface 122 of the photosensitive chip 12 is attached to the shaping component 13, and A accommodating space 100 is formed with the shaping component 13 and the circuit board 11, and the accommodating space 100 is configured such that the photosensitive chip 12 is bent downward during the process of assembling the photosensitive component 10.
  • the photosensitive chip 12 is bent into a shape that fits the actual focal plane, and in this way the imaging quality is improved.
  • the shaping member 13 is fixed on the top surface of the circuit board 11, wherein the top surface of the shaping member 13 is attached to the photosensitive
  • the lower surface 122 of the chip 12 forms the accommodating space 100 with the photosensitive chip 12 and the circuit board 11. It should be understood that the accommodating space 100 located below the photosensitive chip 12 provides a deformation space for the photosensitive chip 12 to bend downward under the action of a specific force.
  • the shaping member 13 sets a shaping surface 130, wherein the shaping surface 130 is configured to limit the shape of the photosensitive chip 12 to bend downward, so that the The shape of the lower surface 122 of the photosensitive chip 12 is adapted to the actual focal plane, in this way the imaging quality is improved.
  • the shaping component 13 includes a first shaping piece 131 and a second shaping piece 132, wherein the first shaping piece 131 is fixed to the circuit board 11, so The lower surface 122 of the photosensitive chip 12 is attached to the first shaping member 131.
  • an accommodating space is formed between the first shaping member 131, the photosensitive chip 12 and the circuit board 11. 100.
  • the second shaping member 132 is fixed on the circuit board 11 and located in the accommodating space 100, and the height of the second shaping member 132 is lower than that of the first shaping member 131.
  • the first shaping member 131 and the second shaping member 132 are arranged in a stepped manner.
  • the upper surface of at least one of the first shaping member 131 and the second shaping member 132 includes an arc-shaped surface recessed downward and inward, and the arc-shaped surface is configured such that When the photosensitive chip 12 is bent downwards, a lower surface 122 that matches the focal imaging surface of the photosensitive assembly 10 is formed, so that the upper surfaces of the first shaping member 131 and the second shaping member 132 form a downward curve.
  • the said shaping surface 130 Preferably, in the embodiment of the present application, the upper surfaces of the first shaping member 131 and the second shaping member 132 each include an arc-shaped surface recessed downward and inward, as shown in FIG. 32.
  • the shaping component 13 further includes at least one opening 133 formed through the circuit board 11 and communicating with the accommodating space 100, wherein the photosensitive chip 12 is attached to the first shaping After the accommodating space 100 is formed by the member 131, the gas in the accommodating space 100 can be discharged through the opening 133 to form a pressure difference between the upper and lower surfaces 121, 122 of the photosensitive chip 12 to force The photosensitive chip 12 is bent downward until it is attached to the shaping surface 130 formed by the first shaping member 131 and the second shaping member 132.
  • the first shaping member 131 has a closed shape.
  • the shape of the first shaping member 131 is adapted to the shape of the circuit board 11 and the photosensitive chip 12.
  • the shape of the existing circuit board 11 and the photosensitive chip 12 is generally rectangular.
  • the shape of the first shaping member 131 is preferably implemented as a closed "mouth" shape.
  • the first shaping member 131 The shape can also be adjusted adaptively, which is not limited by this application.
  • the mouth-shaped first shaping member 131 has an opening.
  • the opening is shielded by the photosensitive chip 12 attached to the first shaping member 131, so that the photosensitive chip 12 ,
  • the circuit board 11 and the first shaping member 131 surround and form the accommodating space 100.
  • the size of the first shaping member 131 is adapted to the size of the photosensitive chip 12, so that when the photosensitive chip 12 is attached to the first shaping member 131, the first shaping member 131 131 is supported on the edge portion of the photosensitive chip 12.
  • the premise of the centerline of the photosensitive chip 12 mentioned in the present invention is that the photosensitive chip has a regular shape, that is, the photosensitive area 1211 and the non-sensitive area 1212 of the photosensitive chip 12 are symmetrically distributed about the center. .
  • the center line of the photosensitive chip 12 in the present invention refers to the center line of the photosensitive area 1211.
  • the shape and size of the first shaping member 131 are adapted to the size and shape of the photosensitive chip 12, so that when the photosensitive chip 12 is attached to the first shaping member 131, the The first shaping member 131 is supported on the non-photosensitive area 1212 of the photosensitive chip 12, and the center of the first shaping member 131 is coaxial with the center of the photosensitive chip 12. In other words, the photosensitive chip 12 is coaxially attached to the first shaping member 131.
  • the first shaping member 131 includes a first shaping member body 1311 and an adhesive 1340 applied to the first shaping member body, wherein the first shaping member The main body 1311 is arranged on the circuit board 11, and the adhesive 1340 is used to bond the photosensitive chip 12.
  • the function of the adhesive 1340 is to adhere the first shaping member main body 1311 and the photosensitive chip 12, and its thickness and material do not limit the application.
  • the photosensitive chip 12 may also be directly disposed on the first shaping member main body 1311 by ultrasonic welding and other processes without the adhesive 1340. That is to say, in other examples of this application, the adhesive is 1340 unnecessary components.
  • the adhesive 1340 has a certain degree of flexibility and high viscosity.
  • the second shaping member 132 should be preset in a preset position of the circuit board 11 in order to bond the photosensitive chip 12 to the first shaping member. After the member 131 forms the accommodating space 100, the second shaping member 132 is received in the accommodating space 100.
  • the height of the second shaping member 132 is smaller than the height of the first shaping member 131.
  • the height setting of the second shaping element 132 is related to the relative positional relationship between the second shaping element 132 and the first shaping element 131.
  • the shape of the shaping surface 130 formed by the first shaping element 131 and the second shaping element 132 is set based on the shape of the actual focal plane. In other words, the relative positional relationship between the first shaping element 131 and the second shaping element 132 and the setting of the height difference between the two should match the actual focal plane shape.
  • the height difference between the first shaping element 131 and the second shaping element 132 should be reduced, that is, the second shaping element 132
  • the height of the shaping element 132 should be increased; when the second shaping element 132 is far from the first shaping element 131, the height difference between the first shaping element 131 and the second shaping element 132 should increase, that is, The height of the second shaping member 132 should be reduced.
  • the shape of the shaping surface 130 matches the shape of the actual focal plane, which does not mean that the shape of the shaping surface 130 is exactly the same or completely coincides with the shape of the actual focal plane. It only means that the shape of the shaping surface 130 tends to be consistent with the shape of the actual focal plane.
  • the second shaping member 132 is arranged symmetrically with respect to the center of the photosensitive chip 12. In this way, when the lower surface 122 of the photosensitive chip 12 is attached to the second shaping member 132 under the action of the pressure difference, the bonding point of the second shaping member 132 and the photosensitive chip 12 is also relative to the The center of the photosensitive chip 12 is symmetrically distributed to form a uniform adhesive force on opposite sides or around the photosensitive chip 12 to ensure that the photosensitive chip 12 can be shaped more stably. More specifically, in the embodiment of the present application, the second shaping member 132 is symmetrically arranged on both sides of the center line set by the longer side of the photosensitive chip 12.
  • the second shaping member 132 can also be arranged symmetrically with respect to the center of the photosensitive chip 12 in other ways. It is worth mentioning that, in the embodiment of the present application, the shape of the second shaping member 132 is not limited by this application, and it includes but is not limited to elongated shape, column shape, etc.
  • the second shaping member 132 includes a second shaping member main body 1321 and an adhesive 1340 applied on the second shaping member main body 1321. It should be understood that the photosensitive chip 12 is adhered to the upper surface of the second shaping member 132 by the adhesive 1340 to prevent the photosensitive chip 12 from being suspended in the middle and breaking, and to prevent The photosensitive chip 12 is deformed during use (for example, it gradually tends to be a flat photosensitive chip).
  • the adhesive 1340 applied to the first shaping element main body 1311 and the adhesive 1340 applied to the second shaping element main body 1321 can be implemented as the same
  • the adhesive 1340 may be a different type of adhesive 1340, and the applied amount or thickness of the adhesive 1340 is not limited by this application.
  • the first shaping element main body 1311 and the second shaping element main body 1321 are made of materials with higher hardness and higher thermal conductivity, for example, metal materials (including pure metal materials). , Metal and non-metal alloy materials, metal and metal alloy materials).
  • the first shaping member main body 1311 and the second shaping member main body 1321 respectively extend between the photosensitive chip 12 and the circuit board 11, so as to act as the first
  • a shaping element main body 1311 and the second shaping element main body 1321 are made of a metal material with high thermal conductivity, the heat generated by the operation of the photosensitive chip 12 can be used by the first shaping element main body 1311 And the second shaping member main body 1321 is efficiently conducted to the circuit board 11 and finally distributed to the outside.
  • the heat dissipation part will be further described in the subsequent description, and will not be expanded here.
  • the photosensitive chip 12 When the photosensitive chip 12 is bonded to the first shaping member 131 to define the accommodating space 100, between the lower surface 122 of the photosensitive chip 12 and the adhesive 1340 of the second shaping member 132 There is a certain distance. Correspondingly, as the gas in the accommodating space 100 is sucked out through the opening 133, the photosensitive chip 12 is continuously bent downward under the action of the pressure difference to make the lower surface of the photosensitive chip 12 The distance between 122 and the second shaping member 132 is continuously reduced until the lower surface 122 of the photosensitive chip 12 contacts the adhesive 1340 of the second shaping member 132, so that the adhesive 1340 will The photosensitive chip 12 is also adhered to the second shaping member 132.
  • the shape of the photosensitive chip 12 is shaped as the shape of the shaping surface 130, so that the photosensitive
  • the shape of the lower surface 122 of the chip 12 is adapted to the actual focal plane.
  • the pressure difference formed at each position between the upper and lower surfaces 121, 122 of the photosensitive chip 12 gradually increases from the edge position of the photosensitive chip 12 to the central area, so that the increasing pressure Under the effect of the difference, the degree of deformation of the photosensitive chip 12 gradually increases from the edge of the photosensitive chip 12 to the center of the photosensitive chip 12 to bend downwardly in a manner tending to the shaping surface 130. That is to say, in the embodiment of the present application, the position where the opening 133 is formed on the circuit board 11 is set to correspond to the central area of the photosensitive chip 12, which is beneficial to the deformation of the photosensitive chip 12.
  • the number of the openings 133 can be set to one or more, which is not limited by this application.
  • the opening 133 may also be formed at other positions on the circuit board 11.
  • FIG. 33 illustrates a schematic top view of a modified implementation of the photosensitive assembly according to an embodiment of the present application.
  • the opening 133 is formed in the circuit board 11 at a position between the first shaping member 131 and the second shaping member 132.
  • the position where the opening 133 is formed on the circuit board 11 is arranged symmetrically with respect to the center of the photosensitive chip 12, so that the gas in the accommodating space 100 can pass through
  • a suction device such as an air pump
  • the gas in the accommodating space 100 can be discharged along the opening 133 relatively uniformly and symmetrically, so as to be symmetrical with respect to the center of the photosensitive chip 12
  • a relatively uniform pressure difference is formed at each position, so that the photosensitive chip 12 can be more symmetrically and gently curved downward in a manner that tends to the shape of the shaping surface 130.
  • FIG. 34 illustrates a schematic diagram of another modified implementation of the photosensitive assembly according to an embodiment of the present application.
  • a part of the opening 133 formed in the circuit board 11 corresponds to the central area of the photosensitive chip 12, and another part of the opening 133 is formed in the The position of the circuit board 11 is between the first shaping member 131 and the second shaping member 132.
  • another part of the openings 133 formed in the circuit board 11 are arranged symmetrically with respect to the center of the photosensitive chip 12.
  • the first positioning groove 111 is implemented to penetrate through the The first positioning through hole of the circuit board 11 and the first positioning groove 112 are implemented as second positioning through holes formed through the circuit board 11, wherein the first positioning through hole 111 is used for It is positioned to fit the first shaping element 131 therein, and the second positioning through hole 112 is used to position it to fit the second shaping element 132 therein.
  • the photosensitive component 10 further includes a reinforcing plate 18 attached to the bottom surface of the circuit board 11.
  • the shaping component 13 may also include a greater number or less of shaping members.
  • the shaping member 13 further includes a third shaping member 134 (including a body of the third shaping member 134 and a top surface applied to the body of the third shaping member 134 1340), wherein the third shaping element 134 is provided between the first shaping element 131 and the second shaping element 132 to pass the first shaping element 131, the second shaping element 131 and the second shaping element 132.
  • the shaping member 132 and the third shaping member 134 form the shaping surface 130.
  • FIG. 37 the shaping member 13 further includes a third shaping member 134 (including a body of the third shaping member 134 and a top surface applied to the body of the third shaping member 134 1340), wherein the third shaping element 134 is provided between the first shaping element 131 and the second shaping element 132 to pass the first shaping element 131, the second shaping element 131 and the second shaping element 132.
  • the shaping member 132 and the third shaping member 134 form the shaping surface 130.
  • the shaping member 13 only includes the first shaping member 131, wherein the upper surface of the first shaping member 131 includes a downward and inward depression
  • the curved surface is configured such that when the photosensitive chip 12 is bent downward, a lower surface 122 that matches the focal imaging surface of the photosensitive assembly 10 is formed.
  • FIG. 39 illustrates a schematic diagram of another modified implementation of the photosensitive assembly according to an embodiment of the present application.
  • both the first shaping member 131 and the second shaping member 132 have a closed ring shape, so that the first shaping member 131 and the second shaping member 132 A containing cavity is formed between.
  • the shaping member 13 further includes an adhesive 1340 arranged between the first shaping member 131 and the second shaping member 132, wherein the upper surface of the adhesive 1340 The height of the highest part of the surface is higher than the upper surface of the second shaping member 132.
  • the adhesive 1340 may flow to the upper surface of the second shaping member 132, thereby making The photosensitive chip 12 is bent downward and then pasted to the second shaping member 132 by the adhesive 1340, so as to achieve better bonding and improve reliability. Furthermore, the adhesive 1340 may not be higher than the second shaping member 132, for example, the upper surface of the adhesive 1340 is flush with the upper surface of the second shaping member 132.
  • the photosensitive assembly 10 further includes a heat dissipation member 19 formed in the accommodating space 100, wherein The heat sink 19 is attached to at least a part of the lower surface 122 of the photosensitive chip 12, so that the heat generated by the photosensitive chip 12 can be conducted to the outside through the heat sink 19 in contact with the photosensitive chip 12 .
  • the heat sink 19 fills the entire accommodating space 100, so that the lower surface 122 of the photosensitive chip 12 is completely in contact with the heat sink 19 to maximize Increase the heat dissipation area and improve the heat dissipation performance.
  • the forming position and filling ratio of the heat sink 19 in the accommodating space 100 depend on the shape of the second shaping member 132 and the position of the at least one opening 133.
  • the position of the circuit board 11 is set to correspond to the central area of the photosensitive chip 12, and at the same time, another part of the opening 133 is formed at the position of the circuit board 11 to be located between the first shaping member 131 and the The space between the second shaping members 132 is sufficient.
  • the heat dissipation material 190 used to make the heat sink 19 can enter the accommodating space 100 through the opening 133 to form the heat sink 19 in the accommodating space 100.
  • the heat dissipation material 190 when the heat dissipation material 190 is implemented as a fluid heat dissipation material 190, the fluid heat dissipation material 190 can be injected into the accommodating space 100 through the opening 133, so as to be cured and formed.
  • the heat sink 19 is formed.
  • the photosensitive component 10 when performing the injection process, the photosensitive component 10 may be turned upside down to prevent the fluid-like heat dissipation material 190 from flowing out of the opening 133.
  • the circuit board 11 when the number of the opening 133 is only one, in order to balance the internal and external pressures so that the fluid-like heat dissipation material 190 can be smoothly injected into the accommodating space 100, the circuit board 11 can be further A vent 135 is opened, as shown in FIG. 41.
  • the suction hole is used to inject the heat dissipation material 190, and its function is equivalent to the ventilation hole 135. That is, when the number of the openings 133 exceeds one, at least one of the openings forms the vent 135.
  • the heat dissipating material 190 can fill the entire accommodating space 100, so that after solidification and molding, on the one hand, The heat sink 19 is attached to the entire lower surface 122 of the photosensitive chip 12 (corresponding to the portion of the accommodating space 100) to increase the heat dissipation area; on the other hand, the heat sink 19 extends from the bottom of the photosensitive chip 12
  • the surface 122 extends to the opening 133, that is, the heat dissipation member 19 directly extends to the outside to facilitate heat dissipation.
  • the photosensitive component 10 further includes a reinforcing plate 18 attached to the bottom surface of the circuit board 11.
  • the reinforcing plate 18 is made of a metal material with high thermal conductivity. In this way, the heat dissipation performance of the photosensitive component 10 is further enhanced.
  • the heat dissipation material 190 may also be implemented in other forms, for example, a granular heat dissipation material 190, as shown in FIG. 42.
  • the granular heat dissipation material 190 can be filled into the accommodating space 100 to form the heat dissipation member 19.
  • the photosensitive component 10 further includes a reinforcing plate 18 for sealing the opening 133, and
  • the reinforcing plate 18 is made of a metal material with high thermal conductivity, so as to seal the opening 133 while further enhancing the heat dissipation performance of the photosensitive component 10.
  • the photosensitive component 10 further includes at least one electronic component 14 for electrically connecting the photosensitive chip 12 to the lead wire of the circuit board 11, and filtering light
  • the "golden thread” process is generally divided into two types: the “positive gold line” process and the “reverse gold line” process.
  • the “positive gold wire” process means that in the process of laying out the lead 123, first one end of the lead 123 is formed on the conductive end of the circuit board 11, and then the lead 123 is bent and extended, and finally The other end of the lead 123 is formed on the conductive end of the photosensitive chip 12. In this way, the lead 123 is formed between the photosensitive chip 12 and the circuit board 11.
  • the "reverse gold wire” process means that in the process of laying out the leads 123, first one end of the lead 123 is formed on the conductive end of the photosensitive chip 12, and then the lead 123 is bent and extended, and finally The other end of the lead 123 is formed on the conductive end of the circuit board 11. In this way, the lead 123 is formed between the photosensitive chip 12 and the circuit board 11. It is worth mentioning that the height of the upward protrusion of the lead 123 formed by the "reverse gold wire” process is relative to the height of the upward protrusion of the lead 123 formed by the "positive gold wire” process. Therefore, preferably, In this specific implementation, the wire 123 is formed by using the "reverse gold wire” process.
  • the photosensitive chip 12 and the circuit board 11 can be connected in other ways (the lead 123 may not be used), for example, a back Turn-on technical solutions.
  • this application is not limited.
  • the bracket 16 is provided on the circuit board 11 to support the filter element 15.
  • the bracket 16 is implemented as a traditional plastic bracket 16, which is prefabricated and attached to the top surface of the circuit board 11, wherein the filter element 15 is installed
  • At least the photosensitive area 1211 on the top of the support 16 and corresponding to the photosensitive chip 12 is used to filter the light entering the photosensitive chip 12 to improve imaging quality.
  • the photosensitive component 10 is based on a traditional COB process.
  • the filter element 15 can be implemented in different types, including but not limited to, the filter element 15 can be implemented as an infrared cut filter, a full transmission spectrum filter, and others.
  • the filter or a combination of multiple filters can be Switching to be selectively located on the photosensitive path of the photosensitive chip 12, so that the infrared cut filter can be switched to the photosensitive path of the photosensitive chip 12 when used in an environment with sufficient light such as daytime.
  • the full transmission spectrum can be filtered
  • the film is switched to the light-sensing path of the light-sensing chip 12 to allow part of the infrared rays of the light reflected by the object entering the light-sensing chip 12 to pass through.
  • FIG. 43 illustrates a schematic diagram of another modified implementation of the photosensitive assembly according to an embodiment of the present application.
  • the photosensitive component 10 is manufactured based on the MOB (Molding on Board) process.
  • the bracket 16 is implemented as a molded bracket 16A, which is integrally formed on the circuit board 11 through a molding process to integrally cover at least a part of the circuit board 11 and At least part of the electronic components 14.
  • the circuit board 11 can be placed in the lower mold, and then an upper mold matched with the lower mold is provided to form a molding cavity between the upper and lower molds after the upper and lower molds are closed.
  • the aforementioned mold includes a pressing block that is pressed onto the circuit board 11 when the mold is closed.
  • a molding material is injected into the molding cavity, and after curing, molding and drawing, the molded support is integrally covered with at least a part of the circuit board 11 and at least part of the electronic component 14 16A.
  • the first shaping component 131 and the second shaping component 132 of the shaping component are integrally formed on the module support 16 After the preset position of the circuit board 11, it is installed in the preset position of the circuit board 11. Such a manufacturing sequence is conducive to project implementation.
  • FIG. 44 illustrates a schematic diagram of another modified implementation of the photosensitive assembly according to the embodiment of the present application.
  • the photosensitive component 10 is manufactured based on the MOC (Molding on Chip) process.
  • the bracket 16 is implemented as a molded bracket 16B, which is integrally formed on the circuit board 11 through a molding process to integrally cover at least a part of the circuit board 11, The at least one electronic component 14 and at least a part of the non-photosensitive area 1212 of the photosensitive chip 12.
  • the upper mold includes a pressing block, wherein the pressing block is pressed against the non-photosensitive area 1212 of the photosensitive chip 12 when the mold is closed. Furthermore, a molding material is injected into the molding cavity, and after being cured, molded, and pulled out, at least a part of the circuit board 11, the at least one electronic component 14, and the non-conductive parts of the photosensitive chip 12 are obtained. At least a part of the molded support 16B of the photosensitive area 1212, wherein the area occupied by the press block corresponds to forming a light-through hole of the photosensitive chip 12.
  • the shape of the inner surface of the molded bracket 16B is determined by the shape of the pressure block.
  • the inner side surface of the mold bracket 16B is perpendicular to the upper surface 121 of the photosensitive chip 12.
  • the inner side of the bracket molding 16B extends obliquely outward.
  • the inner side surface of the press block has a step shape
  • the inner side surface of the molded bracket 16 also has a step shape to form on the top surface of the molded bracket 16B for mounting the filter Component 15 mounting platform 160.
  • this technical solution is defined as an IOM solution (IRFilter on Molding) in the application, as shown in Figure 45.
  • the The photosensitive component 10 also includes a side encapsulation 161 that wraps the photosensitive chip 12 and the sides of the first shaping member 131 to prevent the position of the photosensitive chip 12 from shifting during the molding process, such as Shown in Figure 46. It should be understood that the side encapsulation 161 can not only prevent the position of the photosensitive chip 12 from shifting, but also can effectively reduce the stress generated by the mold bracket 16B from being transmitted to the photosensitive chip 12.
  • FIG. 47 illustrates a schematic diagram of another modified implementation of the photosensitive assembly according to an embodiment of the present application.
  • the filter element 15 is stacked on the photosensitive chip 12, and the bracket 16 is implemented as a molded bracket 16C, which is integrally molded by a molding process to cover the At least a part of the circuit board 11, the at least one electronic component 14, at least a part of the non-photosensitive area 1212 of the photosensitive chip 12 and at least a part of the filter element 15.
  • the filter element 15 is stacked on the The photosensitive chip 12 is described to form a semi-finished component. Furthermore, the semi-finished component is placed in the lower mold, and then an upper mold matched with the lower mold is provided to form a molding cavity between the upper and lower molds after they are closed.
  • the upper mold includes a pressing block, wherein the pressing block is pressed against the filter element 15 when the mold is closed. Furthermore, a molding material is injected into the molding cavity, and after being cured, molded, and pulled out, at least a part of the circuit board 11, the at least one electronic component 14, and the non-conductive parts of the photosensitive chip 12 are obtained. At least a part of the molded support 16C of the photosensitive area 1212, wherein the area occupied by the press block corresponds to forming a light through hole of the photosensitive chip 12.
  • the photosensitive chip 12 in addition to supporting the filter element 15 on the bracket 16 (including the plastic bracket 16, the molded bracket 16A, 16B, 16C), the photosensitive chip 12
  • the filter element 15 can also be installed in other ways, as long as the filter element 15 is held in the photosensitive path of the photosensitive component 10.
  • the photosensitive assembly 10 further includes a filter element holder 17, and the filter element holder 17 is installed on the holder 16 and used for installing the filter element 15.
  • the filter element 15 may also be supported in the optical lens 20, or may be formed on the optical lens in the form of a coating. The surface of the lens in the lens 20. In this regard, this application is not limited.
  • the photosensitive component based on the embodiment of the present application has been clarified that the planar photosensitive chip is bent into a shape adapted to the actual focal imaging surface through a special manufacturing process, so as to improve the imaging quality of the camera module.
  • the manufacturing process of the photosensitive element 10 is explained below from the perspective of manufacturing process.
  • FIGS. 30A and 30B the manufacturing process of the photosensitive component 10 based on the embodiment of the present application is illustrated, which is used to prepare the photosensitive component and its modification implementation as described above.
  • the method for manufacturing the photosensitive component 10 includes the following steps:
  • a circuit board 11 a photosensitive chip 12, a first shaping member 131 and a second shaping member 132 are provided, wherein the circuit board 11 includes at least one opening 133.
  • the gas in the accommodating space 100 is sucked out through the opening 133 to generate a pressure difference between the upper surface 121 and the lower surface of the photosensitive chip 12, thereby forcing the photosensitive chip 12 to bend downward until Attached to the second shaping member 132 so that the lower surface 122 of the photosensitive chip 12 is suitably attached to the first shaping member 131 and the second shaping member 132 to define the shaping surface 130 formed.
  • the first shaping member 131 should have a closed shape (for example, implemented as a "mouth” shape), and the second shaping member 132 is relative to the center of the photosensitive chip 12 It is arranged symmetrically, and the position where the opening 133 is formed on the circuit board 11 corresponds to the central area of the photosensitive chip 12.
  • the opening 133 is formed in the circuit board 11 at a position between the first shaping member 131 and the second shaping member 132, and the opening 133 is formed in the circuit board 11 The positions are arranged symmetrically with respect to the center of the photosensitive chip 12.
  • the height setting of the second shaping member 132 is related to the relative positional relationship between the second shaping member 131 and the first shaping member 131. Specifically, the shape of the shaping surface 130 defined by the first shaping member 131 and the second shaping member 132 for defining the curved shape of the photosensitive chip 12 is set based on the shape of the actual focal plane .
  • the shape of the shaping surface 130 matches the shape of the actual focal plane, which does not mean that the shape of the shaping surface 130 is exactly the same or completely coincides with the shape of the actual focal plane. It only means that the shape of the shaping surface 130 tends to be consistent with the shape of the actual focal plane.
  • the upper surface of at least one of the first shaping member 131 and the second shaping member 132 includes an arc-shaped surface recessed downward and inward, and the arc-shaped surface is configured such that When the photosensitive chip 12 is bent downwards, a lower surface 122 that matches the focal imaging surface of the photosensitive assembly 10 is formed, so that the upper surfaces of the first shaping member 131 and the second shaping member 132 form a downward curve.
  • the said shaping surface 130 Preferably, in the embodiment of the present application, the upper surface of the first shaping member 131 and the second shaping member 132 includes an arc-shaped surface recessed downward and inward.
  • the manufacturing method further includes the steps:
  • a heat dissipation member 19 is formed in the accommodating space 100 defined by the first shaping member 131, the photosensitive chip 12 and the circuit board 11, wherein the heat dissipation member 19 is attached to the photosensitive chip 12 At least a part of the lower surface 122.
  • the heat sink 19 occupies the entire accommodating space 100, so that the lower surface 122 (corresponding to the accommodating space 100) of the photosensitive chip 12 is completely in contact with the accommodating space 100.
  • the heat sink 19 is in contact with each other, and in this way, the heat dissipation area is maximized and the heat dissipation performance is improved.
  • the process of forming the heat dissipation element 19 in the accommodating space 100 includes: adding the fluid heat dissipation material 190 is injected into the accommodating space 100 through the opening 133 to form the heat sink 19 after curing and molding.
  • the photosensitive component 10 may be turned upside down to prevent the fluid-like heat dissipation material 190 from flowing out of the opening 133.
  • the circuit board 11 can be further Open vent 135.
  • the suction hole is used to inject the heat dissipation material 190, and its function is equivalent to the ventilation hole 135. That is, when the number of the openings 133 exceeds one, at least one of the suction holes forms the ventilation hole 135.
  • an additional strong plate 18 can be further attached to the bottom surface of the circuit board 11, wherein, preferably, the strengthening plate 18 is made of a metal material with a higher thermal conductivity. In this way, the heat dissipation performance of the photosensitive component 10 is further enhanced.
  • the heat dissipation material 190 when the heat dissipation material 190 is implemented as a granular heat dissipation material 190.
  • the process of forming the heat sink 19 in the accommodating space 100 includes: filling the heat-dissipating material 190 in granular form into the accommodating space 100 through the opening 133, and, in the circuit
  • An additional strong plate 18 is attached to the bottom surface of the plate 11 to seal the opening 133 through the reinforcing plate 18.
  • the reinforcing plate 18 is made of a metal material with high thermal conductivity, so as to seal the opening 133 while further enhancing the heat dissipation performance of the photosensitive component 10.
  • the manufacturing process of the photosensitive component 10 further includes: installing a bracket 16 on the circuit board 11, and installing the filter element 15 on the bracket 16.
  • the bracket 16 is implemented as a molded bracket 16A.
  • the process of arranging the support 16 on the circuit board 11 includes: integrally molding the molded support 16A on the circuit board 11 through a molding process, wherein the molded support 16A covers the circuit board 11 At least a part of the circuit board 11 and at least a part of the at least one electronic component 14.
  • the filter element 15 is attached to the mold holder 16A.
  • the first shaping member 131 and the second shaping member 132 are integrally formed on the circuit board 11 at the predetermined position after the module bracket 16 is mounted on The preset position of the circuit board 11. Such a manufacturing sequence is conducive to project implementation.
  • the bracket 16 is implemented as a molded bracket 16B.
  • the process of arranging the bracket 16 on the circuit board 11 includes: integral molding of the circuit board 11 through a molding process.
  • the molded support 16B wherein the molded support 16B covers at least a part of the circuit board 11, the at least one electronic component 14, and at least a part of the non-photosensitive area 1212 of the photosensitive chip 12.
  • the filter element 15 is attached to the mold bracket 16B.
  • a side encapsulation 161 is applied to the side of the chip 12 and the first shaping member 131, so that the side encapsulation 161 wraps the side of the photosensitive chip 12 and the first shaping member 131. In this way, Prevent the position of the photosensitive chip 12 from shifting during the molding process.
  • the support 16 is implemented as a molded support 16C.
  • the process of setting the support 16 and the circuit board 11 includes: stacking the filter element 15 on the photosensitive chip 12 , And, the molded support 16C is integrally formed on the circuit board 11, wherein the integrally covers at least a part of the circuit board 11, the at least one electronic component 14, and the photosensitive chip 12 At least a part of the photosensitive region 1212 and at least a part of the filter element 15.
  • the shape of the inner side of the molded support 16 is determined by the shape of the press block.
  • the inner side of the molded bracket 16 also has a stepped shape, so as to form on the top surface of the molded bracket 16 for mounting the filter Component 15 mounting platform 160. Accordingly, in these examples, the filter element 15 is mounted on the mounting platform 160.
  • the filter element 15 in addition to supporting the filter element 15 on the bracket 16 (including the plastic bracket 16, the molded bracket 16A, 16B, 16C), the photosensitive chip 12
  • the filter element 15 can also be installed in other ways, as long as the filter element 15 is held in the photosensitive path of the photosensitive component 10.
  • the photosensitive assembly 10 further includes a filter element holder 17, and the filter element holder 17 is installed on the holder 16 and used for installing the filter element 15.
  • the filter element 15 may also be supported in the optical lens 20, or may be formed on the optical lens in the form of a coating. The surface of the lens in the lens 20. In this regard, this application is not limited.
  • FIGS. 48A and 48B the second manufacturing process of the photosensitive component based on the embodiment of the present application is illustrated, which is used to prepare the photosensitive component and its modification implementation as described above.
  • the manufacturing process of the photosensitive component 10 includes the following steps:
  • a circuit board 11 and a photosensitive chip 12 are provided, wherein the circuit board 11 includes at least one opening 133. It is worth mentioning that the opening 133 on the circuit board 11 may also be formed by a punching process after the accommodating space 100 is formed, which is not limited by this application.
  • first shaping piece 131 and a second shaping piece 132 are integrally formed on the circuit board 11, wherein the height of the second shaping piece 132 is lower than that of the first shaping piece 131, in this way ,
  • the first shaping member and the second shaping member 132 define a concave shaping surface 130.
  • the photosensitive chip 12 is attached to the first shaping member 131, in this way, a container is defined and formed between the first shaping member 131, the circuit board 11 and the photosensitive chip 12.
  • the gas in the accommodating space 100 is sucked out through the opening 133 to generate a pressure difference between the upper surface 121 and the lower surface of the photosensitive chip 12, thereby forcing the photosensitive chip 12 to bend downward until Attached to the second shaping member 132 so that the lower surface 122 of the photosensitive chip 12 is suitably attached to the first shaping member 131 and the second shaping member 132 to define the shaping surface 130 formed.
  • the first shaping member 131 and the second shaping member 132 are integrally formed on the circuit board 11, instead of being prefabricated first. Placement method.
  • the process of integrally forming a first shaping member 131 and a second shaping member 132 on the circuit board 11 includes:
  • a first shaping element body 1311 and a second shaping element body 1321 are integrally formed on the circuit board 11 through an electroplating forming process;
  • Adhesives 1340 are respectively applied to the first shaping element main body 1311 and the second shaping element main body 1321 to form the first shaping element 131 and the second shaping element main body 1311 and the adhesive 1340.
  • the second shaping member 132 is formed by the second shaping member main body 1321 and the adhesive 1340.
  • the first shaping member 131 should have a closed shape (for example, implemented as a "mouth” shape), and the second shaping member 132 is relative to the center of the photosensitive chip 12 It is arranged symmetrically, and the position where the opening 133 is formed on the circuit board 11 corresponds to the central area of the photosensitive chip 12.
  • the opening 133 is formed in the circuit board 11 at a position between the first shaping member 131 and the second shaping member 132, and the opening 133 is formed in the circuit board 11 The positions are arranged symmetrically with respect to the center of the photosensitive chip 12.
  • the height setting of the second shaping member 132 is related to the relative positional relationship between the second shaping member 131 and the first shaping member 131. Specifically, the shape of the shaping surface 130 defined by the first shaping member 131 and the second shaping member 132 for defining the curved shape of the photosensitive chip 12 is set based on the shape of the actual focal plane . More specifically, when the second shaping element 132 is close to the first shaping element 131, the height difference between the first shaping element 131 and the second shaping element 132 should be reduced (that is, the second shaping element 132).
  • the height of the piece 132 should increase); when the second shaping piece 132 is far away from the first shaping piece 131, the height difference between the first shaping piece 131 and the second shaping piece 132 should increase (that is, so The height of the second shaping member 132 should be reduced).
  • the top surface of the second shaping member body 1321 is bent inward and downward.
  • the upper surface of at least one of the first shaping member 131 and the second shaping member 132 includes an arc-shaped surface recessed downward and inward, and the arc-shaped surface is configured such that When the photosensitive chip 12 is bent downwards, a lower surface 122 that matches the focal imaging surface of the photosensitive assembly 10 is formed, so that the upper surfaces of the first shaping member 131 and the second shaping member 132 form a downward curve.
  • the said shaping surface 130 Preferably, in the embodiment of the present application, the upper surface of the first shaping member 131 and the second shaping member 132 includes an arc-shaped surface recessed downward and inward.
  • the process of bending the photosensitive chip 12 includes:
  • the preparation process of the photosensitive component 10 further includes the following steps:
  • the heat sink 19 occupies the entire accommodating space 100, so that the lower surface 122 (corresponding to the accommodating space 100) of the photosensitive chip 12 is completely in contact with the accommodating space 100.
  • the heat sink 19 is in contact with each other, and in this way, the heat dissipation area is maximized and the heat dissipation performance is improved.
  • the process of forming the heat dissipation element 19 in the accommodating space 100 includes: adding the fluid heat dissipation material 190 is injected into the accommodating space 100 through the opening 133 to form the heat sink 19 after curing and molding.
  • the photosensitive element 10 when performing the injection process, can be turned upside down to prevent the fluid-like heat dissipation material 190 from flowing out of the opening 133.
  • the circuit board 11 when the number of the opening 133 is only one, in order to balance the internal and external pressures so that the fluid-like heat dissipation material 190 can be smoothly injected into the accommodating space 100, the circuit board 11 can be further Open vent 135.
  • the suction hole is used to inject the heat dissipation material 190, and its function is equivalent to the ventilation hole 135. That is, when the number of the openings 133 exceeds one, at least one of the suction holes forms the ventilation hole 135.
  • the heat dissipation material 190 when the heat dissipation material 190 is implemented as a granular heat dissipation material 190.
  • the process of forming the heat sink 19 in the accommodating space 100 includes: filling the heat-dissipating material 190 in granular form into the accommodating space 100 through the opening 133, and, in the circuit
  • the reinforcing plate 18 is attached to the bottom surface of the plate 11 to seal the opening 133 through the reinforcing plate 18.
  • the reinforcing plate 18 is made of a metal material with high thermal conductivity, so as to seal the opening 133 while further enhancing the heat dissipation performance of the photosensitive component 10.
  • the manufacturing process of the photosensitive component 10 further includes: installing a bracket 16 on the circuit board 11, and installing the filter element 15 on the bracket 16.
  • the bracket 16 is implemented as a traditional plastic bracket 16.
  • the process of installing the bracket 16 on the circuit board 11 is specifically expressed as: mounting the plastic bracket 16 on the circuit board 11.
  • the filter element 15 is attached to the holder 16.
  • the bracket 16 is implemented as a molded bracket 16A.
  • the process of arranging the support 16 on the circuit board 11 includes: integrally molding the molded support 16A on the circuit board 11 through a molding process, wherein the molded support 16A covers the circuit board 11 At least a part of the circuit board 11 and at least a part of the at least one electronic component 14.
  • the filter element 15 is attached to the mold holder 16A.
  • the first shaping member 131 and the second shaping member 132 are integrally formed on the circuit board 11 at the predetermined position after the module bracket 16 is mounted on The preset position of the circuit board 11. Such a manufacturing sequence is conducive to project implementation.
  • the bracket 16 is implemented as a molded bracket 16B.
  • the process of arranging the bracket 16 on the circuit board 11 includes: integral molding of the circuit board 11 through a molding process.
  • the molded support 16B wherein the molded support 16B covers at least a part of the circuit board 11, the at least one electronic component 14, and at least a part of the non-photosensitive area 1212 of the photosensitive chip 12.
  • the filter element 15 is attached to the mold bracket 16B.
  • the support 16 is implemented as a molded support 16C.
  • the process of setting the support 16 and the circuit board 11 includes: stacking the filter element 15 on the photosensitive chip 12 , And, the molded support 16C is integrally formed on the circuit board 11, wherein the integrally covers at least a part of the circuit board 11, the at least one electronic component 14, and the photosensitive chip 12 At least a part of the photosensitive region 1212 and at least a part of the filter element 15.
  • the shape of the inner side of the molded support 16 is determined by the shape of the press block.
  • the inner side of the molded bracket 16 also has a stepped shape, so as to form on the top surface of the molded bracket 16 for mounting the filter Component 15 mounting platform 160. Accordingly, in these examples, the filter element 15 is mounted on the mounting platform 160.
  • the method for manufacturing the photosensitive component based on the embodiments of the present application is clarified, which uses a special manufacturing process to bend a planar photosensitive chip into a shape that fits the actual focal imaging surface, so as to improve the Image quality.
  • a heat sink for enhancing heat dissipation is formed on the lower surface of the photosensitive chip to improve heat dissipation performance.
  • the camera module includes a moving focus camera module and a fixed focus camera module.
  • the camera module When the camera module is implemented as a fixed-focus camera module, the camera module includes the photosensitive component and the optical lens 20 as described above, wherein the optical lens 20 is held on the photosensitive component 10 path. Specifically, the optical lens 20 is usually mounted on the bracket 16 to hold the optical lens 20 on the photosensitive component of the photosensitive component 10, and the specific effects can be seen in FIGS. 49 to 53. It is worth mentioning that the drawings only illustrate a few typical photosensitive components in the embodiments of the present application, and the corresponding modifications and implementations are not listed one by one, which should be fully understood by those skilled in the art.
  • the photosensitive chip 12 is bent based on the shape of the actual focal plane, and in this way the imaging quality of the camera module can be improved.
  • the camera module When the camera module is implemented as a dynamic focus camera module, as shown in FIG. 54, the camera module includes the photosensitive component, the optical lens 20, and the driving element 30 as described above, wherein the driving element 30 Mounted on the bracket 16, the optical lens 20 is mounted on the driving element 30, so that the driving element 30 can carry the optical lens 20 to move along the photosensitive path of the photosensitive assembly 10 to achieve movement Focus function.
  • the drawings only illustrate a typical photosensitive component in the embodiments of the present application, and the corresponding deformation implementations are not listed one by one, which should be fully understood by those skilled in the art.

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Abstract

本申请公开了一种摄像模组和感光组件及其制造方法。该感光组件，包括线路板、电连接于所述线路板的感光芯片，以及，设置于所述线路板的整形部件。所述感光芯片的下表面附着于所述整形部件，以与所述整形部件和所述线路板形成一容置空间。所述容置空间配置为使得在组装所述感光组件的过程中所述感光芯片向下弯曲。这样，在组装过程中将感光芯片弯曲成适配于实际焦点平面的形状，以提高成像质量。

Description

摄像模组和感光组件及其制造方法 技术领域
本申请涉及摄像模组领域，尤其涉及摄像模组和感光组件及其制造方法，其通过特殊的制造工艺将平面状的感光芯片弯曲成适配于实际焦点成像面的形状，通过这样的方式，提高所述摄像模组的成像质量。
背景技术
摄像模组是重要的图像传感设备。随着消费者对终端设备(例如，智能手机)的成像质量要求越来越高，摄像模组所采集的感光芯片尺寸也逐渐增大，这引发了一系列技术问题，例如，芯片变形、芯片散热不良等。这些技术问题在现有的摄像模组制备工艺中得不到妥善解决。
因此，需要改进的摄像模组结构和制造方案以提供满足要求摄像模组。
发明内容
本申请的主要目的在于提供一种摄像模组和感光组件及其制造方法，其能够将平面状的感光芯片弯曲成适配于实际焦点成像面的形状，通过这样的方式，提高所述摄像模组的成像质量。
本申请的另一目的在于提供一种摄像模组和感光组件及其制造方法，其中，所述摄像模组的感光芯片在运输过程中仍为平面状，以使得仍能够通过拼版状的方式进行运输。
本申请的另一目的在于提供一种摄像模组和感光组件及其制造方法，其中，芯片制造厂商无需改变现有的感光芯片制造工艺，也就是说，本申请所提供的所述感光组件制造工艺能够基于现有的平面状的感光芯片来实施。
本申请的另一目的在于提供一种摄像模组和感光组件及其制造方法，其中，在所述感光芯片下方的容置空间中包括用于加强所述感光芯片散热的散热件，以加强所述摄像模组的散热性能。
为实现上述至少一目的或优势，提出了本申请。本申请的实施例提供了一种感光组件，其包括：
线路板；
电连接于所述线路板的感光芯片；以及
设置于所述线路板的整形部件，其中，所述感光芯片的下表面附着于所述整形部件，以与所述整形部件和所述线路板形成一容置空间，其中，所述线路板具有贯穿地形成于其中且连通于所述容置空间的至少一开孔，其中，所述容置空间和所述开孔配置为使得在组装所述感光组件的过程中所述感光芯片向下弯曲。
在本申请一实施例中，所述至少一开孔配置为使得至少一吸附装置能够藉由所述至少一开孔伸入所述容置空间并附着于所述感光芯片的下表面的至少一部分，以通过拉力使得所述感光芯片向下弯曲。
在本申请一实施例中，所述整形部件包括第一整形件和第二整形件，所述第一整形件与所述感光芯片和所述线路板形成所述容置空间，所述第二整形件设置于所述线路板且位于所述容置空间内，所述第二整形件的高度低于所述第一整形件。
在本申请一实施例中，所述第一整形件和第二整形件中的至少一个的上表面包括向下向内凹陷的弧形表面，所述弧形表面配置为使得所述感光芯片向下弯曲时形成与所述感光组件的焦点成像面相适配的下表面。
在本申请一实施例中，所述线路板具有贯穿地形成于其中且连通于所述容置空间的至少一开孔，所述至少一开孔配置为在组装所述感光组件的过程中时排出所述容置空间内的气体以使得所述感光芯片向下弯曲。
在本申请一实施例中，所述开孔形成于所述线路板的位置对应于所述感光芯片的中心区域。
在本申请一实施例中，所述开孔形成于所述线路板的位置位于所述第一整形件和所述第二整形件之间。
在本申请一实施例中，部分所述开孔形成于所述线路板的位置对应于所述感光芯片的中心区域，以及，另一部分所述开孔形成于所述线路板的位置位于所述第一整形件和所述第二整形件之间。
在本申请一实施例中，所述开孔形成于所述线路板的位置相对于所述感光芯片的中心对称布置。
在本申请一实施例中，另一部分所述开孔形成于所述线路板的位置相对于所述感光芯片的中心对称布置。
在本申请一实施例中，所述第二整形件相对于所述感光芯片的中心对称布置。
在本申请一实施例中，所述第二整形件对称地布置于所述感光芯片的较长边所设定的中心线的两侧。
在本申请一实施例中，所述第一整形件的横截面形状为封闭环形。
在本申请一实施例中，所述第一整形件包括第一整形件主体和施加于所述第一整形件主体上的粘着剂，以及，所述第二整形件包括第二整形件主体和施加于所述第二整形件主体上的黏着剂。
所述第二整形件的横截面形状为封闭环形，其中，所述整形部件还包括设置于所述第一整形件和所述第二整形件之间的黏着剂，其中，所述黏着剂的高度低于所述第二整形件的高度
在本申请一实施例中，所述第一整形件主体和所述第二整形件主体一体成型于所述线路板的顶表面。
在本申请一实施例中，所述第一整形件主体和所述第二整形件主体由金属材料制成。
在本申请一实施例中，所述第一整形件主体和所述第二整形件主体预制而成，并被安装于所述线路板。
在本申请一实施例中，所述第一整形件主体和所述第二整形件主体通过电镀工艺一体成型于所述所述线路板的顶表面。
在本申请一实施例中，所述感光组件进一步包括散热件，其中，所述散热件形成于所述容置空间内，其中，所述散热件附着于所述感光芯片的下表面的至少一部分。
在本申请一实施例中，所述散热件通过散热材料经由所述散热件通过散热材料经由所述至少一开孔进入所述容置空间而形成。
在本申请一实施例中，所述感光组件进一步包括布置于所述感光芯片的非感光区域的至少一电子元器件。
在本申请一实施例中，所述感光组件进一步包括设于所述线路板的支架，其中，所述支架形成对应于所述感光芯片的感光区域的通光孔。
在本申请一实施例中，所述支架通过模塑工艺一体成型于所述线路板，以一体包覆所述线路板的至少一部分和至少部分所述至少一电子元器件。
在本申请一实施例中，所述支架通过模塑工艺一体成型于所述线路板， 以一体包覆所述线路板的至少一部分、所述至少一电子元器件，以及，所述感光芯片的非感光区域的至少一部分。
在本申请一实施例中，所述支架的内侧面垂直于所述感光芯片的上表面。
在本申请一实施例中，所述支架的内侧面向外倾斜地延伸。
在本申请一实施例中，所述支架包括凹陷地形成于所述支架的顶表面的安装平台，用于支持滤光元件于其上。
在本申请一实施例中，所述感光组件进一步包括包裹所述感光芯片和所述整形部件的外侧的侧包胶，用于防止在执行模塑工艺过程中所述感光芯片的位置发生偏移。
在本申请一实施例中，所述感光组件进一步包括保持于所述感光组件的感光路径的滤光元件。
在本申请一实施例中，所述滤光元件叠置于所述感光元件，并且，在所述支架通过模塑工艺一体成型于所述线路板后，所述支架一体包覆所述线路板的至少一部分、所述至少一电子元器件、所述感光芯片的非感光区域的至少一部分和所述滤光元件的至少一部分。
在本申请一实施例中，所述滤光元件支持于所述支架的顶部。
在本申请一实施例中，所述滤光元件安装于所述支架的所述安装平台。
在本申请一实施例中，所述感光组件进一步包括滤光元件支架，所述滤光元件支架安装于所述支架，并用于安装所述滤光元件。
根据本申请的另一方面，本申请还提供一种摄像模组，其包括：
光学镜头；以及
如上所述的感光组件，其中，所述光学镜头被保持于所述感光组件的感光路径。
在本申请一实施例中，所述感光芯片的下表面的弯曲形状适配于所述摄像模组的实际焦点成像面的形状。
在本申请一实施例中，所述光学镜头安装于所述支架。
在本申请一实施例中，所述摄像模组进一步包括驱动元件，其中，所述驱动元件支持于所述支架，所述光学镜头安装于所述驱动元件。
在本申请一实施例中，所述光学镜头安装于所述滤光元件支架。
根据本申请的又一方面，还提供一种感光组件制造方法，其包括：
提供一线路板、一感光芯片、一第一整形件和一第二整形件，其中，所 述线路板包括至少一开孔；
将所述第一整形件和所述第二整形件设于所述线路板，其中，所述第二整形件的高度小于所述第一整形件；
将所述感光芯片的下表面附着于所述第一整形件，以与所述整形部件和所述线路板形成一容置空间，其中，所述至少一开孔连通于所述容置空间，其中，所述第二整形件位于所述容置空间内；
通过所述开孔将吸附装置附着于所述感光芯片的下表面的至少一部分；以及，
通过所述吸附装置向下拉所述感光芯片，以使得所述感光芯片向下弯曲。
在本申请一实施例中，所述第一整形件和第二整形件中的至少一个的上表面包括向下向内凹陷的弧形表面，其中，通过所述吸附装置向下拉所述感光芯片，以使得所述感光芯片向下弯曲，包括：
弯曲所述感光芯片直至所述感光芯片的下表面附着于所述弧形表面，以使得所述感光芯片向下弯曲时形成与所述感光组件的焦点成像面相适配的下表面。
在本申请一实施例中，在将所述第一整形件和所述第二整形件设于所述线路板之后，以及，在将所述感光芯片的下表面附着于所述第一整形件，以与所述整形部件和所述线路板形成一容置空间之前，还包括：
在所述第一整形件和所述第二整形件之间施加黏着剂，其中，所述黏着剂的上表面高度低于所述第二整形件。
在本申请一实施例中，所述开孔形成于所述线路板的位置对应于所述感光芯片的中心区域。
在本申请一实施例中，所述方法，进一步包括：
通过所述开孔注入散热材料至所述容置空间，以在所述容置空间内形成所述散热件，其中，所述散热件附着于所述感光芯片的下表面的至少一部分。
根据本申请又一方面，还提供一种感光组件制造方法，其包括：
提供一线路板和一感光芯片，其中，所述线路板包括至少一开孔；
在所述线路板上一体成型一第一整形件和一第二整形件，其中，所述第二整形件的高度小于所述第一整形件；
将所述感光芯片的下表面附着于所述第一整形件，以与所述整形部件和所述线路板形成一容置空间，其中，所述至少一开孔连通于所述容置空间， 其中，所述第二整形件位于所述容置空间内；
通过所述开孔将吸附装置附着于所述感光芯片的下表面的至少一部分；以及，
通过所述吸附装置向下拉所述感光芯片，以使得所述感光芯片向下弯曲。
在本申请一实施例中，所述第一整形件和第二整形件中的至少一个的上表面包括向下向内凹陷的弧形表面，其中，通过所述吸附装置向下拉所述感光芯片，以使得所述感光芯片向下弯曲，包括：
弯曲所述感光芯片直至所述感光芯片的下表面附着于所述弧形表面，以使得所述感光芯片向下弯曲时形成与所述感光组件的焦点成像面相适配的下表面。
在本申请一实施例中，在所述线路板上一体成型一第一整形件和一第二整形件，包括：
通过电镀工艺在所述线路板上一体成型一第一整形件主体和一第二整形件主体；以及
在所述第一整形件主体上和所述第二整形件主体上分别施加黏着剂。
在本申请一实施例中，在所述线路板上一体成型一第一整形件和一第二整形件之后，以及，在将所述感光芯片的下表面附着于所述第一整形件，以与所述整形部件和所述线路板形成一容置空间之前，还包括：
在所述第一整形件和所述第二整形件之间施加黏着剂，其中，所述黏着剂的上表面高度低于所述第二整形件。
在本申请一实施例中，所述第一整形件和第二整形件中的至少一个的上表面包括向下向内凹陷的弧形表面，其中，通过所述吸附装置向下拉所述感光芯片，以使得所述感光芯片向下弯曲，包括：
弯曲所述感光芯片直至所述感光芯片的下表面附着于所述弧形表面，以使得所述感光芯片向下弯曲时形成与所述感光组件的焦点成像面相适配的下表面。
在本申请一实施例中，所述开孔形成于所述线路板的位置对应于所述感光芯片的中心区域。
在本申请一实施例中，所述方法进一步包括：
通过所述开孔注入散热材料至所述容置空间，以在所述容置空间内形成所述散热件，其中，所述散热件附着于所述感光芯片的下表面的至少一部分。
根据本申请的又一方面，还提供了一种感光组件，其包括：
线路板；
电连接于所述线路板的感光芯片；以及
设置于所述线路板的整形部件，其中，所述感光芯片的下表面附着于所述整形部件，以与所述整形部件和所述线路板形成一容置空间，所述容置空间配置为使得在组装所述感光组件的过程中所述感光芯片向下弯曲。
在本申请一实施例中，所述整形部件包括第一整形件和第二整形件，所述第一整形件与所述感光芯片和所述线路板形成所述容置空间，所述第二整形件设置于所述线路板且位于所述容置空间内，所述第二整形件的高度低于所述第一整形件。
在本申请一实施例中，所述第一整形件和第二整形件中的至少一个的上表面包括向下向内凹陷的弧形表面，所述弧形表面配置为使得所述感光芯片向下弯曲时形成与所述感光组件的焦点成像面相适配的下表面。
在本申请一实施例中，所述线路板具有贯穿地形成于其中且连通于所述容置空间的至少一开孔，所述至少一开孔配置为在组装所述感光组件的过程中时排出所述容置空间内的气体以使得所述感光芯片向下弯曲。
在本申请一实施例中，所述开孔形成于所述线路板的位置对应于所述感光芯片的中心区域。
在本申请一实施例中，所述第二整形件相对于所述感光芯片的中心对称布置。
在本申请一实施例中，所述第二整形件对称地布置于所述感光芯片的较长边所设定的中心线的两侧。
在本申请一实施例中，所述第一整形件的横截面形状为封闭环形。
在本申请一实施例中，所述开孔形成于所述线路板的位置位于所述第一整形件和所述第二整形件之间。
在本申请一实施例中，部分所述开孔形成于所述线路板的位置对应于所述感光芯片的中心区域，以及，另一部分所述开孔形成于所述线路板的位置位于所述第一整形件和所述第二整形件之间。
在本申请一实施例中，所述开孔形成于所述线路板的位置相对于所述感光芯片的中心对称布置。
在本申请一实施例中，另一部分所述开孔形成于所述线路板的位置相对 于所述感光芯片的中心对称布置。
在本申请一实施例中，所述第二整形件相对于所述感光芯片的中心对称布置。
在本申请一实施例中，所述第二整形件对称地布置于所述感光芯片的较长边所设定的中心线的两侧。
在本申请一实施例中，所述整形部件还包括施加于所述第一整形件和第二整形件之间的黏着剂，其中，所述黏着剂的高度高于所述第二整形件的上表面。
在本申请一实施例中，所述第一整形件包括第一整形件主体和施加于所述第一整形件主体上的黏着剂，以及，所述第二整形件包括第二整形件主体和施加于所述第二整形件主体上的黏着剂。
在本申请一实施例中，所述第一整形件主体和所述第二整形件主体一体成型于所述线路板的顶表面。
在本申请一实施例中，所述第一整形件主体和所述第二整形件主体预制而成，并被安装于所述线路板。在本申请一实施例中，所述第一整形件主体和所述第二整形件主体通过金属材料制成。
在本申请一实施例中，所述第一整形件主体和所述第二整形件主体通过电镀工艺一体成型于所述所述线路板的顶表面。
在本申请一实施例中，所述感光组件进一步包括散热件，所述散热件形成于所述容置空间内，且附着于所述感光芯片的下表面的至少一部分。
在本申请一实施例中，所述散热件通过散热材料经由所述至少一开孔进入所述容置空间而形成。
在本申请一实施例中，所述开孔中至少之一形成所述通气孔。
在本申请一实施例中，所述感光组件进一步包括布置于所述感光芯片的非感光区域的至少一电子元器件。
在本申请一实施例中，所述感光组件进一步包括设于所述线路板的支架，其中，所述支架形成对应于所述感光芯片的感光区域的通光孔。
在本申请一实施例中，所述支架通过模塑工艺一体成型于所述线路板，以一体包覆所述线路板的至少一部分和至少部分所述至少一电子元器件。
在本申请一实施例中，所述支架通过模塑工艺一体成型于所述线路板，以一体包覆所述线路板的至少一部分、所述至少一电子元器件，以及，所述 感光芯片的非感光区域的至少一部分。
在本申请一实施例中，所述支架的内侧面垂直于所述感光芯片的上表面。
在本申请一实施例中，所述支架的内侧面向外倾斜地延伸。
在本申请一实施例中，所述支架包括凹陷地形成于所述支架的顶表面的安装平台，用于支持滤光元件于其上。
在本申请一实施例中，所述感光组件进一步包括包裹所述感光芯片和所述整形部件的外侧的侧包胶，用于防止在执行模塑工艺过程中所述感光芯片的位置发生偏移。
在本申请一实施例中，所述感光组件进一步包括保持于所述感光组件的感光路径的滤光元件。
在本申请一实施例中，所述滤光元件叠置于所述感光元件，并且，在所述支架通过模塑工艺一体成型于所述线路板后，所述支架一体包覆所述线路板的至少一部分、所述至少一电子元器件、所述感光芯片的非感光区域的至少一部分和所述滤光元件的至少一部分。
在本申请一实施例中，所述滤光元件支持于所述支架的顶部。
在本申请一实施例中，所述滤光元件安装于所述支架的所述安装平台。
在本申请一实施例中，所述感光组件进一步包括滤光元件支架，所述滤光元件支架安装于所述支架，并用于安装所述滤光元件。
根据本申请的又一方面，本申请还提供一种摄像模组，其包括：
光学镜头；以及
如上所述的感光组件，其中，所述光学镜头被保持于所述感光组件的感光路径。
在本申请一实施例中，所述感光芯片的下表面的弯曲形状适配于所述摄像模组的实际焦点成像面的形状。
在本申请一实施例中，所述光学镜头安装于所述支架。
在本申请一实施例中，所述摄像模组进一步包括驱动元件，其中，所述驱动元件支持于所述支架，所述光学镜头安装于所述驱动元件。
根据本申请的又一方面，还提供一种感光组件制造方法，其包括：
提供一线路板、一感光芯片、一第一整形件和一第二整形件，其中，所述线路板包括至少一开孔；
将所述第一整形件和所述第二整形件设于所述线路板，其中，所述第二 整形件的高度小于所述第一整形件；
将所述感光芯片的下表面附着于所述第一整形件，以与所述整形部件和所述线路板形成一容置空间，其中，所述至少一开孔连通于所述容置空间，其中，所述第二整形件位于所述容置空间内；以及
通过所述至少一开孔排出所述容置空间内的气体，以在所述感光芯片的上表面和下表面之间产生压强差，以使得所述感光芯片向下弯曲。
在本申请一实施例中，所述第一整形件和第二整形件中的至少一个的上表面包括向下向内凹陷的弧形表面，其中，通过所述至少一开孔排出所述容置空间内的气体，以在所述感光芯片的上表面和下表面之间产生压强差，以使得所述感光芯片向下弯曲，包括：
弯曲所述感光芯片直至所述感光芯片的下表面附着于所述弧形表面，以使得所述感光芯片向下弯曲时形成与所述感光组件的焦点成像面相适配的下表面。
在本申请一实施例中，所述开孔形成于所述线路板的位置对应于所述感光芯片的中心区域。
在本申请一实施例中，所述方法，进一步包括：
通过所述开孔注入散热材料至所述容置空间，以在所述容置空间内形成所述散热件，其中，所述散热件附着于所述感光芯片的下表面的至少一部分。
根据本申请的又一方面，还提供一种感光组件制造方法，其包括：
提供一线路板和一感光芯片，其中，所述线路板包括至少一开孔；
在所述线路板上一体成型一第一整形件和一第二整形件，其中，所述第二整形件的高度小于所述第一整形件；
将所述感光芯片的下表面附着于所述第一整形件，以与所述整形部件和所述线路板形成一容置空间，其中，所述至少一开孔连通于所述容置空间，其中，所述第二整形件位于所述容置空间内；以及
通过所述至少一开孔排出所述容置空间内的气体，以在所述感光芯片的上表面和下表面之间产生压强差，以使得所述感光芯片向下弯曲。
在本申请一实施例中，在所述线路板上一体成型一第一整形件和一第二整形件，包括：
通过电镀工艺在所述线路板上一体成型一第一整形件主体和一第二整形件主体；以及
在所述第一整形件主体上和所述第二整形件主体上分别施加黏着剂。
在本申请一实施例中，所述第一整形件和第二整形件中的至少一个的上表面包括向下向内凹陷的弧形表面，其中，通过所述至少一开孔排出所述容置空间内的气体，以在所述感光芯片的上表面和下表面之间产生压强差，以使得所述感光芯片向下弯曲，包括：
弯曲所述感光芯片直至所述感光芯片的下表面附着于所述弧形表面，以使得所述感光芯片向下弯曲时形成与所述感光组件的焦点成像面相适配的下表面。
在本申请一实施例中，所述开孔形成于所述线路板的位置对应于所述感光芯片的中心区域。
在本申请一实施例中，所述方法进一步包括：
通过所述开孔注入散热材料至所述容置空间，以在所述容置空间内形成所述散热件，其中，所述散热件附着于所述感光芯片的下表面的至少一部分。
通过对随后的描述和附图的理解，本申请进一步的目的和优势将得以充分体现。
本申请的这些和其它目的、特点和优势，通过下述的详细说明，附图和权利要求得以充分体现。
附图说明
通过结合附图对本申请实施例进行更详细的描述，本申请的上述以及其他目的、特征和优势将变得更加明显。附图用来提供对本申请实施例的进一步理解，并且构成说明书的一部分，与本申请实施例一起用于解释本申请，并不构成对本申请的限制。在附图中，相同的参考标号通常代表相同部件或步骤。
图1图示了现有的COB组装工艺中感光芯片的拾取过程的示意图。
图2图示了摄像模组的成像光路示意图。
图3图示了根据本申请实施例的感光组件的示意图。
图4A和图4B图示了根据本申请实施例的所述感光组件的制造过程的示意图。
图5图示了根据本申请实施例的所述感光组件的俯视图。
图6图示了根据本申请实施例的所述感光组件中整形部件的上表面的放 大示意图。
图7图示了根据本申请实施例的所述感光组件的一种变形实施的俯视示意图。
图8图示了根据本申请实施例的所述感光组件的另一种变形实施的俯视示意图。
图9图示了根据本申请实施例的所述感光组件的又一种变形实施的示意图。
图10图示了根据本申请实施例的所述感光组件的又一种变形实施例的示意图。
图11图示了根据本申请实施例的所述感光组件的又一种变形实施的示意图。
图12图示了根据本申请实施例的所述感光组件的又一种变形实施的示意图。
图13图示了根据本申请实施例的所述感光组件的又一种变形实施的示意图。
图14图示了根据本申请实施例的所述感光组件的又一种变形实施的示意图。
图15图示了根据本申请实施例的所述感光组件的又一种变形实施的示意图。
图16图示了根据本申请实施例的所述感光组件的又一种变形实施的示意图。
图17图示了根据本申请实施例的所述感光组件的又一种变形实施的示意图。
图18图示了根据本申请实施例的所述感光组件的又一种变形实施的示意图。
图19图示了根据本申请实施例的所述感光组件的又一种变形实施的示意图。
图20图示了根据本申请实施例的所述感光组件的又一种变形实施的示意图。
图21图示了根据本申请实施例的所述感光组件的又一种变形实施的示意图。
图22A和图22B图示了根据本申请实施例的所述感光组件的另一种制造过程的示意图。
图23图示了根据本申请实施例的摄像模组的示意图，其中，所述摄像模组为定焦摄像模组。
图24图示了根据本申请实施例的所述摄像模组的另一种变形实施的示意图。
图25图示了根据本申请实施例的所述摄像模组的又一种变形实施的示意图。
图26图示了根据本申请实施例的所述摄像模组的又一种变形实施的示意图。
图27图示了根据本申请实施例的所述摄像模组的又一种变形实施的示意图
图28图示了根据本申请实施例的摄像模组的示意图，其中，所述摄像模组为动焦摄像模组。
图29图示了根据本申请实施例的感光组件的示意图。
图30A和图30B图示了根据本申请实施例的所述感光组件的制造过程的示意图。
图31图示了根据本申请实施例的所述感光组件的俯视图。
图32图示了根据本申请实施例的所述感光组件中整形部件的上表面的放大示意图。
图33图示了根据本申请实施例的所述感光组件的一种变形实施的俯视示意图。
图34图示了根据本申请实施例的所述感光组件的另一种变形实施的俯视示意图。
图35图示了根据本申请实施例的所述感光组件的又一种变形实施的示意图。
图36图示了根据本申请实施例的所述感光组件的又一种变形实施例的示意图。
图37图示了根据本申请实施例的所述感光组件的又一种变形实施的示意图。
图38图示了根据本申请实施例的所述感光组件的又一种变形实施的示 意图。
图39图示了根据本申请实施例的所述感光组件的又一种变形实施的示意图。
图40图示了根据本申请实施例的所述感光组件的又一种变形实施的示意图。
图41图示了根据本申请实施例的所述感光组件的又一种变形实施的示意图。
图42图示了根据本申请实施例的所述感光组件的又一种变形实施的示意图。
图43图示了根据本申请实施例的所述感光组件的又一种变形实施的示意图。
图44图示了根据本申请实施例的所述感光组件的又一种变形实施的示意图。
图45图示了根据本申请实施例的所述感光组件的又一种变形实施的示意图。
图46图示了根据本申请实施例的所述感光组件的又一种变形实施的示意图。
图47图示了根据本申请实施例的所述感光组件的又一种变形实施的示意图。
图48A和图48B图示了根据本申请实施例的所述感光组件的另一种制造过程的示意图。
图49图示了根据本申请实施例的摄像模组的示意图，其中，所述摄像模组为定焦摄像模组。
图50图示了根据本申请实施例的所述摄像模组的另一种变形实施的示意图。
图51图示了根据本申请实施例的所述摄像模组的又一种变形实施的示意图。
图52图示了根据本申请实施例的所述摄像模组的又一种变形实施的示意图。
图53图示了根据本申请实施例的所述摄像模组的又一种变形实施的示意图
图54图示了根据本申请实施例的摄像模组的示意图，其中，所述摄像模组为动焦摄像模组。
具体实施方式
下面，将参考附图详细地描述根据本申请的示例实施例。显然，所描述的实施例仅仅是本申请的一部分实施例，而不是本申请的全部实施例，应理解，本申请不受这里描述的示例实施例的限制。
申请概述
如上所述，随着消费者对终端设备的成像质量要求越来越高，摄像模组所采集的感光芯片尺寸也逐渐增大，这引发了一系列技术问题。并且，这些技术问题在现有的摄像模组制备工艺中得不到不能妥善解决。因此，需要改进的摄像模组结构及其制造方案以生产满足性能要求的感光组件和摄像模组。
具体来说，现有的摄像模组通常采用COB(Chip on Board)工艺进行组装：拾取感光芯片拾取→贴附于线路板→贴装塑料支架于线路板。然而，随着尺寸的不断增大，感光芯片在拾取过程中易发生形变。
图1图示了现有的COB组装工艺中感光芯片的拾取过程的示意图。如图1所示，在现有COB组装工艺中，采用吸附的方式拾取感光芯片，并且，由于感光芯片的感光区域无法接触，因此拾取器的吸嘴只能附着于感光芯片的非感光区域。在拾取过程中，由于吸嘴的吸气吸附作用，感光芯片会因被吸附而朝向感光芯片的感光面弯曲，呈向上凸起的形状(从如图1所呈现的效果来看，形象地说，可将感光芯片的弯曲形状定义为“哭脸”状)。
本领域技术人员应知晓，即便感光芯片没有发生“哭脸”状形变(即感光芯片为平面状)，由于感光芯片的边缘部分和中心部分相对于光学镜头的光程差不同，导致光心在抵达感光芯片的边缘部分时，容易出现畸变、边角失光以及锐角下降等不良现象，导致成像效果变差。在发生“哭脸”状形变之后，这些不良现象会进一步地加剧，更为严重地影响了成像质量。
具体来说，图2图示了摄像模组的成像光路示意图。如图2所示，在摄像模组的成像过程中，(一般将光学镜头所在的一侧定义为物侧，将感光芯片所在一侧定义为像侧)实际焦点平面(实际焦点成像平面)形成向像侧凸 起的弧形，也就是说，实际焦点平面为弧形面。本领域技术人员应知晓，当感光芯片所在平面与焦点平面重合时，成像质量最佳。但是，在实际情况中，即使采用多镜片去调制摄像模组的光学系统，焦点平面依旧会呈现为弧形面。这也是为什么即便感光芯片在拾取过程中没有变形却依旧会产生畸变、边角失光以及锐角下降等不良现象的原因。然而，由于在拾取过程中，感光芯片发生了“哭脸”状形变，对照图2中实际焦点平面的形状应可以看出，“哭脸”状的形变恰好与实际焦点平面的形变方式相反，导致畸变、边角失光以及锐角下降等不良现象的程度被加剧，更为严重地影响摄像模组的成像质量。
为了解决感光芯片“哭脸”状弯曲问题，目前有一种技术方向是提供一种“笑脸状”弯曲的感光芯片(相关技术可参照专利申请文件CN201480052226.4)。虽然，弯曲的感光芯片能够缓解上述技术问题，但却带来了一系列新的问题，并且有些技术问题在实际产业中难以克服。
具体来说，首先，如何将弯曲的感光芯片安装于摄像模组中是亟需解决的，因为现有的摄像模组组装工艺针对的都是平面状的感光芯片。其次，相对于平面状的感光芯片，弯曲状的感光芯片的制造工艺较为复杂且工艺难度更高。还有，目前大部分感光芯片的制造厂商和摄像模组的制造企业是分离的，弯曲的感光芯片比起平面感光芯片来说，运输成了一大难题：平面感光芯片可采用拼版方式运输，而弯曲的感光芯片却难以用拼版的方式运输。
除了成像问题之外，随着感光芯片的尺寸不断增大(或者说，帧率的提高)，感光芯片在工作过程中会产生大量的热量，如何实现散热也是急需解决的问题。
针对上述技术问题，本申请的基本构思是通过特殊的制造工艺将平面状的感光芯片弯曲成适配于实际焦点成像面的形状，通过这样的方式，提高所述摄像模组的成像质量。并且，在感光芯片的背面形成用于加强散热的散热件，以解决散热问题。
基于此，本申请提出了一种感光组件，其包括：线路板、感光芯片和整形部件，其中，所述线路板具有贯穿地形成于其中的至少一开孔，所述感光芯片电连接于所述线路板，所述感光芯片的下表面附着于所述整形部件，以与所述整形部件和所述线路板形成一容置空间，其中，所述容置空间连通于所述至少一开孔，并被配置为使得在组装所述感光组件的过程中所述感光芯片向下弯曲。这样，通过特殊的制造工艺将平面状的感光芯片弯曲成适配于 实际焦点成像面的形状，以提高所述摄像模组的成像质量。
基于此，本申请还提供了一种感光组件，其包括：感光芯片和整形部件，其中，所述线路板具有贯穿地形成于其中的至少一开孔，所述感光芯片电连接于所述线路板，所述感光芯片的下表面附着于所述整形部件，以与所述整形部件和所述线路板形成一容置空间，其中，所述容置空间连通于所述至少一开孔，并被配置为使得在组装所述感光组件的过程中所述感光芯片向下弯曲。这样，通过特殊的制造工艺将平面状的感光芯片弯曲成适配于实际焦点成像面的形状，以提高所述摄像模组的成像质量。
在介绍本申请的基本原理之后，下面将参考附图来具体介绍本申请的各种非限制性实施例。
示例性感光组件及其制造方法一
如图3至4B所示，根据本申请实施例的感光组件及其制造过程的一个示例被阐明。如图3所示，感光组件10包括线路板11、电连接于所述线路板11的感光芯片12和整形部件13，其中，所述感光芯片12的下表面122附着于所述整形部件13，以与所述整形部件13和所述线路板11形成一容置空间100，所述容置空间100配置为使得在组装所述感光组件10的过程中所述感光芯片12向下弯曲。特别地，在本申请实施例中，所述感光芯片12被弯曲成与实际焦点平面相适配的形状，通过这样的方式来提高成像质量。
如图3和4B所示，在本申请实施例中，所述整形部件13被固设于所述线路板11的顶表面上，其中，所述整形部件13的顶表面附着于所述感光芯片12的下表面122，以与所述感光芯片12和所述线路板11形成所述容置空间100。应可以理解，位于所述感光芯片12下方的所述容置空间100为所述感光芯片12在特定力的作用下向下弯曲提供变形空间。并且，在本申请实施例中，所述整形部件13设定一整形面130，其中，所述整形面130被配置为限制所述感光芯片12向下弯曲的形状，以使得弯曲之后的所述感光芯片12的下表面122的形状适配于实际焦点平面，通过这样的方式来提高成像质量。
更具体地说，在本申请实施例中，所述整形部件13包括第一整形件131和第二整形件132，其中，所述第一整形件131被固设于所述线路板11，所述感光芯片12的下表面122附着于所述第一整形件131，通过这样的方 式，在所述第一整形件131、所述感光芯片12和所述线路板11之间形成一容置空间100。所述第二整形件132被固设于所述线路板11且位于所述容置空间100内，并且，所述第二整形件132的高度低于所述第一整形件131。换言之，在本申请实施例中，所述第一整形件131和所述第二整形件132呈台阶状布置。特别地，在本申请实施例中，所述第一整形件131和第二整形件132中的至少一个的上表面包括向下向内凹陷的弧形表面，所述弧形表面配置为使得所述感光芯片12向下弯曲时形成与所述感光组件10的焦点成像面相适配的下表面122，以通过所述第一整形件131和所述第二整形件132的上表面形成向下弯曲的所述整形面130。优选地，在本申请实施例中，所述第一整形件131和第二整形件132中上表面都包括向下向内凹陷的弧形表面，如图6所示。
进一步地，所述整形部件13还包括贯穿地形成于所述线路板11且连通于所述容置空间100的至少一开孔133，其中，在所述感光芯片12附着于所述第一整形件131以形成所述容置空间100后，所述至少一开孔133配置为使得吸附装置40能够伸入所述容置空间100并附着于所述感光芯片12的下表面122的至少一部分，以通过拉力使得所述感光芯片12向下弯曲。也就是说，在本申请实施例中，用于弯曲所述感光芯片12的特定力为由所述吸附装置40所产生的拉力。也就是说，在本申请实施例中，使得所述感光芯片12在所述容置空间100内向下弯曲的技术原理为：通过所述开孔133将用于拉弯所述感光芯片12的吸附装置40伸入所述容置空间100并吸附于所述感光芯片12的下表面122，以通过向下拉拽所述吸附装置40迫使所述感光芯片12向下弯曲。
图4A和图4B图示了所述吸附装置的一种示例。如图4A和图4B所示，所述吸附装置40包括吸盘41和自所述吸盘41往下延伸的延长杆42，其中，所述吸盘41用于吸附于所述感光芯片12的下表面122的至少一部分，在所述吸盘41附着于所述感光芯片12后，可通过拉拽所述延长杆42，以使得所述感光芯片12向下弯曲。值得一提的是，在本申请其他示例中，所述吸附装置40还可以被实施为其他类型，对此，并不为本申请所局限。
特别地，在本申请实施例中，所述第一整形件131具有封闭形状，以使得由所述第一整形件131、所述线路板11和所述感光芯片12形成的所述容置空间100为封闭空间，这样能有效地防止位于所述第一整形件131外侧的 灰尘通过所述第一整形件131进入所述容置空间100对所述感光芯片造成污染。如图5所示，优选地，所述第一整形件131的形状与所述线路板11和所述感光芯片12的形状相适配。本领域技术人员应知晓，现有的线路板11和感光芯片12的形状通常为长方形，相应地，所述第一整形件131的形状优选地被实施为封闭“口”字形。当然，本领域的技术人员应可以理解，随着摄像模组技术的发展和及其应用场景的扩展，线路板11和感光芯片12的形状会发生改变，对应地，所述第一整形件131的形状也可做出自适应调整，对此，并不为本申请所局限。
在某些实施例中，所述第一整形件131关于所述感光芯片12中心对称布置于所述线路板11，优选地所述第一整形件131关于所述感光芯片较长边的中心线对称设置。所述第一整形件131并不需要构成封闭形状，既所述第一整形件131只需确保可以支撑到所述感光芯片的较短边的边缘即可，例如所述第一整形件131被实施长条状，且沿着所述感光芯片12的较短边设置于所述线路板12。
优选地，所述第一整形件131的尺寸与所述感光芯片12的尺寸相适配，以使得当所述感光芯片12贴附于所述第一整形件131时，所述第一整形件131支撑于所述感光芯片12的边缘部分。本领域技术人员应知晓，所述感光芯片12的上表面121，包括感光区域1211和位于所述感光区域1211周围的非感光区域1212，其中，由于所述感光区域1211为敏感区域其通常被设于所述感光芯片12的上表面121的中心部分，以及，所述非感光区域1212位于所述上表面121的边缘部分并包围所述感光区域1211并。也就是说，所述第一整形件131的尺寸与所述感光芯片12相适配，以使得所述第一整形件131支撑于所述感光芯片12的非感光区域1212，这样可确保所述感光芯片12在后续被弯曲的过程中，所述感光芯片12的感光区域1211不会遭到破坏。值得注意的是，本发明中提及到所述感光芯片12中心线前提为所述感光芯片为规则形状，既所述感光芯片12的感光区域1211和所述非感光区域1212是关于中心对称分布。当所述感光芯片12为非规则形状，则本发明所述感光芯片12中心线指的是所述感光区域1211的中心线。
更为优选地，所述第一整形件131的形状和尺寸与所述感光芯片12的尺寸和形状相适配，以使得当所述感光芯片12附着于所述第一整形件131时，所述第一整形件131支撑于所述感光芯片12的非感光区域1212，并 且，所述第一整形件131的中心与所述感光芯片12的中心同轴。也就是说，所述感光芯片12同轴地附着于所述第一整形件131。
如图3所示，在本申请实施例中，所述第一整形件131包括第一整形件主体1311和施加于所述第一整形件主体上的黏着剂1340，其中，所述第一整形件主体1311被设于所述线路板11上，所述黏着剂1340用于粘接所述感光芯片12。应可以理解，所述黏着剂1340的作用在于粘接所述第一整形件主体1311和所述感光芯片12，其厚度、材料并不会对本申请构成限制。并且，在本申请其他示例中，所述感光芯片12还可采取超声波焊接等工艺直接设置于所述第一整形件主体1311而无需所述黏着剂1340。也就是说，在本申请其他示例中，所述黏着剂为1340非必要元件。优选地，本申请实施例中，所述黏着剂1340具有一定的柔韧性和较高的黏性。
特别地，在形成所述容置空间100之前，所述第二整形件132应事先预设于所述线路板11的预设位置，以在所述感光芯片12粘接于所述第一整形件131以形成所述容置空间100后，将所述第二整形件132收容于所述容置空间100内。
如前所述，所述第二整形件132的高度小于所述第一整形件131的高度。特别地，在本申请实施例中，所述第二整形件132的高度设定与其与所述第一整形件131之间的相对位置关系有关。具体来说，由所述第一整形件131与所述第二整形件132形成的所述整形面130的形状基于实际焦点平面的形状而设定。也就是说，所述第一整形件131与所述第二整形件132之间的相对位置关系与两者之间的高度差的设定应匹配于实际焦点平面形状。更明确地说，当所述第二整形件132靠近所述第一整形件131时，所述第一整形件131与所述第二整形件132的高度差应缩减，即，所述第二整形件132的高度应增加；当所述第二整形件132远离所述第一整形件131时，所述第一整形件131与所述第二整形件132的高度差应增加，即，所述第二整形件132的高度应缩减。值得一提的是，在本申请实施例中，所述整形面130的形状匹配于实际焦点平面形状，并不表示所述整形面130的形状与所述实际焦点平面的形状完全一致或者完全重合，其仅表示所述整形面130的形状趋向于与实际焦点平面的形状相一致。
优选地，在本申请实施例中，所述第二整形件132相对于所述感光芯片12的中心对称布置。这样，当所述感光芯片12的下表面122在压强差的作 用下附着于所述第二整形件132时，所述第二整形件132与所述感光芯片12的粘接点也相对于所述感光芯片12的中心对称地分布，以在所述感光芯片12的相对两侧或者四周形成统一的粘接力，以确保所述感光芯片12能够更为稳定地定形。更为具体地，在本申请实施例中，所述第二整形件132对称地布置于所述感光芯片12的较长边所设定的中心线的两侧。当然，本领域的技术人员应可以理解，在本申请其他示例中，所述第二整形件132还能以其他方式对称地相对于所述感光芯片12的中心布置。值得一提的是，在本申请实施例中，所述第二整形件132的形状并不为本申请所局限，其包括但不限于细长状、立柱状等。
与所述第一整形件131相类似，在本申请实施例中，所述第二整形件132包括第二整形件主体1321和施加于所述第二整形件主体1321上的黏着剂1340。应可以理解，通过所述黏着剂1340将所述感光芯片12粘接于所述第二整形件132的上表面上，以预防所述感光芯片12出现中间悬空情况而发生断裂，以及，预防所述感光芯片12在使用过程中变形(例如，逐渐趋向于平面状的感光芯片)。值得一得的是，在本申请实施例中，施加于所述第一整形件主体1311上的黏着剂1340和施加于所述第二整形件主体1321上的黏着剂1340可被实施为同一种黏着剂1340或者为不同类型的黏着剂1340，并且，所述黏着剂1340的施加量或者厚度都不为本申请所局限。
优选地，在本申请实施例中，所述第一整形件主体1311和所述第二整形件主体1321由硬度较高和导热率较高的材料制成，例如，金属材料(包括纯金属材料，金属与非金属合金材料，金属与金属合金材料)。应注意到，在本申请实施例中，所述第一整形件主体1311和所述第二整形件主体1321分别延伸于所述感光芯片12和所述线路板11之间，从而当所述第一整形件主体1311和所述第二整形件主体1321被实施为由导热率较高的金属材料制成时，所述感光芯片12工作所产生的热量能够藉由所述第一整形件主体1311和所述第二整形件主体1321高效地传导至所述线路板11并最终散发到外界。关于散热部分会在后续描述中进一步描述，在此不继续展开。
在所述感光芯片12粘结于所述第一整形件131以界定形成所述容置空间100时，所述感光芯片12的下表面122与所述第二整形件132的黏着剂1340之间存在一定的距离。相应地，随着所述吸附装置40拉动所述感光芯片12向下弯曲时，在拉力的作用下所述感光芯片12不断地向下弯曲以使 得所述感光芯片12的下表面122与所述第二整形件132之间的距离被不断缩减，直至所述感光芯片12的下表面122与所述第二整形件132的黏着剂1340相接触，以通过所述黏着剂1340将所述感光芯片12也粘接于所述第二整形件132。当所述感光芯片12同时粘接于所述第一整形件131和所述第二整形件132时，所述感光芯片12的形状被定形为所述整形面130的形状，以使得所述感光芯片12的下表面122的形状适配于实际焦点平面。
如图5所示，在本申请实施例中，所述开孔133形成于所述线路板11的位置对应于所述感光芯片12的中心区域。这样，当所述吸附装置40通过所述开孔133伸入所述容置空间100时，所述吸附装置40的吸盘41能够附着于所述感光芯片12的下表面122的中心区域，这样，所述吸附装置40产生的拉弯力在所述感光芯片12的中心区域最大并随着中心区域往边缘部分逐渐减少，以使得所述感光芯片12的变形度从感光芯片12的边缘到感光芯片12的中心逐渐增大，适配于实际焦点平面的形状。值得一提的是，在本申请实施例中，所述开孔133的数量可设置为一个或者多个，对此并不为本申请所局限。还应可以理解，在本申请实施例的其他示例中，所述开孔133还可以形成在所述线路板11上的其他位置。
图7图示了根据本申请实施例的所述感光组件的一种变形实施的俯视示意图。如图7所示，在该变形实施例中，所述开孔133形成于所述线路板11的位置位于所述第一整形件131和所述第二整形件132之间。相应地，在该变形实施例中，可采用对应数量的所述吸附装置40来拉弯所述感光芯片，例如，在该变形实施例中，所述开孔133的数量为2个，相应地，所述吸附装置40的数量也为2个。
优选地，在该变形实施例中，所述开孔133形成于所述线路板11的位置相对于所述感光芯片12的中心区域对称地布置，这样，所述吸附装置40附着于所述感光芯片12的下表面的附着位置也相对于所述感光芯片12的中心区域对称地布置，从而在相对所述感光芯片12的中心区域对称的各个位置上形成较为一致的拉力，以使得所述感光芯片12能够更为对称地且平缓地以趋向于所述整形面130的形状的方式向下弯曲。
图8图示了根据本申请实施例的所述感光组件的另一种变形实施的示意图。如图8所示，在该变形实施例中，部分所述开孔133形成于所述线路板11的位置对应于所述感光芯片12的中心区域，以及，另一部分所述开孔133 形成于所述线路板11的位置位于所述第一整形件131和所述第二整形件132之间。相应地，在该变形实施例中，可采用对应数量的所述吸附装置40来拉弯所述感光芯片，例如，在该变形实施例中，所述开孔133的数量为3个(其中，1个设置于所述线路板11的位置对应于所述感光芯片12的中心区域，另外2个设置于所述第一整形件131和所述第二整形件132之间)，相应地，所述吸附装置40的数量也为3个。特别地，在该变形实施例中，另一部分所述开孔133形成于所述线路板11的位置相对于所述感光芯片12的中心对称布置，这样，所述吸附装置40附着于所述感光芯片12的下表面的附着位置也相对于所述感光芯片12的中心区域对称地布置，从而在相对所述感光芯片12的中心区域对称的各个位置上形成较为一致的拉力，以使得所述感光芯片12能够更为对称地且平缓地以趋向于所述整形面130的形状的方式向下弯曲。
为了便于定位和安装所述第一整形件131和所述第二整形件132，如图9所示，在本申请实施例的一些示例中，所述线路板11还包括凹陷地形成于所述线路板11的顶表面上的第一定位凹槽111和第二定位凹槽112，其中，所述第一定位凹槽111用于定位以适配地安装所述第一整形件131于其内，以及，所述第二定位凹槽112用于定位以适配地安装所述第二整形件132于其内。
在本申请的另外一些示例中，为了便于定位和安装所述第一整形件131和所述第二整形件132，如图10所示，所述第一定位凹槽111被实施为贯穿于所述线路板11的第一定位通孔和所述第一定位凹槽112被实施为贯穿地形成于所述线路板11的第二定位通孔，其中，所述第一定位通孔111用于定位以适配地安装所述第一整形件131于其内，以及，所述第二定位通孔112用于定位以适配地安装所述第二整形件132于其内。并且，所述感光组件10还包括贴附于所述线路板11底表面的加强板18。优选地，所述加强板18由导热率较高的金属材料制成，这样所述感光芯片12所产生的热量能藉由所述第一整形件131和所述第二整形件132直接被传导至所述加强板18，实现散热的目的。
值得一提的是，在本申请实施例中，所述第一整形件131和所述第二整形件132是预制件，即所述第一整形件主体1311和所述第二整形件1321在预制后被贴附于所述线路板11的预设位置上。或者，所述第一整形件131 和所述第二整形件132也可一体成型于所述线路板11的预设位置。例如，当所述第一整形件主体1311和所述第二整形件主体1321由金属材料制成时，所述第一整形件主体1311和所述第二整形件主体1321可通过电镀成型工艺一体成型于所述线路板11的预设位置。当然，应容易理解，当所述第一整形件主体1311和所述第二整形件主体1321由其他具有较高硬度和导热率较高的材料制成时，可采用对应的一体成型工艺在所述线路板11的预设位置上一体成型所述第一整形件131和所述第二整形件132。对此，并不为本申请所局限。
还值得一提的是，在本申请实施例的其他示例中，所述整形部件13还可以包括更多数量或者更少的整形件。例如，在本申请另外的示例中，如图11所示，所述整形部件13还包括第三整形件134(包括第三整形件134主体和施加于所述第三整形件134主体的顶表面上的黏着剂1340)，其中，所述第三整形件134设于所述第一整形件131和所述第二整形件132之间，以通过所述第一整形件131、所述第二整形件132和所述第三整形件134形成所述整形面130。再如，如图12所示，在本申请另外的示例中，所述整形部件13仅包括所述第一整形件131，其中，所述第一整形件131的上表面包括向下向内凹陷的弧形表面，所述弧形表面配置为使得所述感光芯片12向下弯曲时形成与所述感光组件10的焦点成像面相适配的下表面122。
图13图示了根据本申请实施例的所述感光组件的又一种变形实施的示意图。如图13所示，在该变形实施例中，所述第一整形件131和所述第二整形件132都具有封闭环形，以在所述第一整形件131和所述第二整形件132之间形成一容纳腔。特别地，在该变形实施例中，所述整形部件13还包括设于所述第一整形件131和所述第二整形件132之间的黏着剂1340，其中，所述黏着剂1340的上表面最高点的高度高于所述第二整形件132的上表面。应可以理解，在该变形实施例中，所述黏着剂1340应具有较高的粘稠度，以防止所述黏着剂1340从所述第二整形件132的上表面流出。这样，当所述感光芯片12贴附于所述第一整形件131后，通过所述吸附装置40拉动所述感光芯片12以迫使所述感光芯片12向下弯曲直至粘接于设于所述第一整形件131和所述第二整形件132之间的所述黏着剂1340。值得一提的是，在该变形实施例中，所述第二整形件132的上表面可不设置所述黏着剂1340。值得注意的是，由于所述黏着剂1340高度高于所述第二整形件132， 故在吸气时，所述黏着剂1340可能会流至所述第二整形件132的上表面，从而使得所述感光芯片12向下弯曲后通过所述黏着剂1340粘贴于所述第二整形件132，以使得黏合更佳，提升可靠性。进一步，所述黏着剂1340也可不高于所述第二整形件132，例如所述黏着剂1340上表面与所述第二整形件132上表面齐平。
为了提升所述感光组件的散热性能，如图3至4B所示，在本申请实施例中，所述感光组件10还包括形成于所述容置空间100内的散热件19，其中，所述散热件19附着于所述感光芯片12的下表面122的至少一部分，以使得所述感光芯片12所产生的热量能够藉由与所述感光芯片12所接触的所述散热件19传导至外界，在该实施例中，所述散热件19需要填充于所述容置空间100，故所述第一整形件131优选实施为封闭形状。
优选地，在本申请实施例中，所述散热件19充满整个所述容置空间100，以使得所述感光芯片12的下表面122完全地与所述散热件19相接触，以最大化地增大散热面积，提升散热性能。值得一提的是，所述散热件19在所述容置空间100的形成位置和填充比例取决于所述第二整形件132的形状以及所述至少一开孔133的位置设置。
具体来说，当所述第二整形件132被实施为封闭的“口”字型，并且所述至少一开孔133形成于所述线路板11的位置对应于所述感光芯片12的中心区域时，所述散热件19最多只能占满由所述第二整形件132、所述感光芯片12和所述线路板11所围成的腔室内，如图14所示。当然，即便所述第二整形件132被实施为封闭的“口”字型，所述散热件19也能占满整个所述容置空间100，只需要将部分所述开孔133形成于所述线路板11的位置设置为对应于所述感光芯片12的中心区域，同时，将另一部分所述开孔133形成于所述线路板11的位置设置为位于所述第一整形件131和所述第二整形件132之间即可。
在具体实施中，用于制成所述散热件19的散热材料190可通过所述开孔133进入所述容置空间100内，以在所述容置空间100内形成所述散热件19。
例如，当所述散热材料190被实施为具有流体状的散热材料190时，流体状的所述散热材料190可通过所述开孔133注入至所述容置空间100内，以在固化成型后形成所述散热件19。为了便于操作，在执行注入工艺 时，可将所述感光组件10倒置以防止流体状的所述散热材料190所述开孔133流出。特别地，当所述开孔133的数量仅有一个时，为了平衡内外压强使得流体状的所述散热材料190能够被顺利注入所述容置空间100内，可在所述线路板11上进一步开设通气孔135，如图15所示。当然，当所述开孔133的数量超过一个时，所述吸气孔中除了被用于注入所述散热材料190的之外，其作用便相当于所述通气孔135。也就是说，当所述开孔133的数量超过一个时，所述开孔中至少之一形成所述通气孔135。
值得一提的是，当所述散热件19通过流体状的散热材料190固化成型时，优选地，所述散热材料190能够充满整个所述容置空间100，以在固化成型后，一方面所述散热件19贴附于所述感光芯片12的整个下表面122(对应于容置空间100的部分)以增大散热面积；另一方面，所述散热件19自所述感光芯片12的下表面122延伸至所述开孔133，也就是说，所述散热件19直接延伸至外界，以更加利于散热。当然，在本申请实施例的其他示例中，所述感光组件10还包括贴附于所述线路板11底表面的加强板18，优选地，所述加强板18由导热率较高的金属材料制成，通过这样的方式进一步增强所述感光组件10的散热性能。
当然，在本申请实施例的其他示例中，所述散热材料190还可以被实施为其他形式，例如，颗粒状的散热材料190，如图16所示。相应地，可将颗粒状的所述散热材料190填充至所述容置空间100内，以形成所述散热件19。为了防止颗粒状的所述散热材料190从所述开孔133出漏出，在本申请实施例的该示例中，所述感光组件10还包括用于密封所述开孔133的加强板18，并且，优选地，所述加强板18由导热率较高的金属材料制成，以在密封所述开孔133的同时还进一步增强了所述感光组件10的散热性能。
进一步地，如图3所示，在本申请实施例中，所述感光组件10还包括至少一电子元器件14，用于电连接所述感光芯片12至所述线路板11的引线，滤光元件15和支架16，其中，所述至少一电子元器件14设于所述线路板11上并位于所述感光芯片12的周围，其包括但不限于电容，电阻，电感等。
在所述感光芯片12贴附于所述第一整形件131并弯曲成型后，通过所述引线123实现所述感光芯片12与所述线路板11之间的电气连接。具体来说，每一所述引线123弯曲地延伸于所述感光芯片12和所述线路板11 之间，以通过所述引线123将所述感光芯片12电连接于所述线路板11，从而，所述线路板11可基于所述引线123对所述感光芯片12进行供电，以及，所述感光芯片12可基于所述引线123将所采集到的信号传输出去。
值得一提的是，在该具体示例中，所述引线123的类型并不为本申请所局限，例如，所述引线123可以是金线、银线、铜线。并且，所述引线123可通过“打金线”的工艺安装于所述线路板11和所述感光芯片12之间，以用于实现两者之间的电连接。
具体来说，“打金线”工艺一般分为两种类型：“正打金线”工艺和“反打金线”工艺。“正打金线”工艺指的是在布设所述引线123的过程中，首先在所述线路板11的导电端上形成所述引线123的一端，进而弯曲地延伸所述引线123，并最终在所述感光芯片12的导电端上形成所述引线123的另一端，通过这样的方式，在所述感光芯片12和所述线路板11之间形成所述引线123。“反打金线”工艺指的是在布设所述引线123的过程中，首先在所述感光芯片12的导电端上形成所述引线123的一端，进而弯曲地延伸所述引线123，并最终在所述线路板11的导电端上形成所述引线123的另一端，通过这样的方式，在所述感光芯片12和所述线路板11之间形成所述引线123。值得一提的是，通过“反打金线”工艺所形成的所述引线123向上突起的高度相对“正打金线”工艺所形成的所述引线123向上突起的高度，因此，优选地，在该具体实施中，采用“反打金线”工艺形成所述引线123。
当然，本领域的技术人员应知晓，在本申请实施例的其他示例中，所述感光芯片12和所述线路板11可通过其他方式进行导通(可不采用所述引线123)，例如采用背部导通的技术方案。对此，并不为本申请所局限。
如图3所示，在本申请实施例中，所述支架16被设置于所述线路板11，用于支撑所述滤光元件15。具体来说，在本申请实施例中，所述支架16被实施为传统的塑料支架16，其预制成型并贴附于所述线路板11的顶表面，其中，所述滤光元件15被安装于所述支架16的顶部且对应于所述感光芯片12的至少感光区域1211，以用于对进入所述感光芯片12的光线进行过滤，以改善成像品质。也就是说，在本申请实施例中，所述感光组件10基于传统的COB工艺制程。
本领域的技术人员应知晓，所述滤光元件15能够被实施为不同的类型， 包括但不限于所述滤光元件15能够被实施为红外截止滤光片、全透光谱滤光片以及其他的滤光片或者多个滤光片的组合。具体来说，例如，当所述滤光元件15被实施为红外截止滤光片和全透光谱滤光片的组合，即，所述红外截止滤光片和所述全透光谱滤片能够被切换以选择性地位于所述感光芯片12的感光路径上，这样，在白天等光线较为充足的环境下使用时，可以将所述红外截止滤光片切换至所述感光芯片12的感光路径，以藉由所述红外截止滤光片过滤进入所述感光芯片12的被物体反射的光线中的红外线，并且，当夜晚等光线较暗的环境中使用时，可以将所述全透光谱滤光片切换至所述感光芯片12的感光路径，以允许进入所述感光芯片12的被物体反射的光线中的红外线部分透光。
图17图示了根据本申请实施例的所述感光组件的又一种变形实施的示意图。如图17所示，在该变形实施中，所述感光组件10基于MOB(Molding on Board)工艺制备而成。具体来说，在该变形实施例中，所述支架16被实施为模塑支架16A，其通过模塑工艺一体成型于所述线路板11，以一体包覆所述线路板11的至少一部分和至少部分所述电子元器件14。
在具体制备工艺中，可将线路板11放置于下模具，再提供与所述下模具相配合的上模具，以在上、下模具合模后在两者之间形成成型腔，其中，所述上模具包括在合模时压合于所述线路板11的压块。进而，将模塑材料注入所述成型腔，待固化成型、拔模后得到一体包覆于一体包覆所述线路板11的至少一部分和至少部分所述电子元器件14的所述模塑支架16A。
值得一提的是，所述模塑支架16A的内侧面的形状由所述压块的形状决定。例如，当所述压块的侧面垂直于所述线路板11时，所述模塑支架16A的内侧面垂直于所述感光芯片12的上表面121。再如，当所述压块的内侧面倾斜于所述线路板11时，所述模塑支架16A的内侧面向外倾斜地延伸。
值得一提的是，当所述感光组件10基于MOB工艺制成时，优选地所述整形组件的所述第一整形件131和所述第二整形件132在所述模组支架16一体成型于所述线路板11的预设位置后，再安装于所述线路板11的预设位置。这样的制成顺序有利于工程实施。
图18图示了根据本申请实施例的所述感光组件的又一种变形实施的示意图。如图18所示，在该变形实施中，所述感光组件10基于MOC(Molding on Chip)工艺制备而成。具体来说，在该变形实施例中，所述支架16被实 施为模塑支架16B，其通过模塑工艺一体成型于所述线路板11，以一体包覆所述线路板11的至少一部分、所述至少一电子元器件14，以及，所述感光芯片12的非感光区域1212的至少一部分。
在具体制备工艺中，在将所述感光芯片12贴附于所述第一整形件131并弯曲成型以贴附于所述第二整形件132后(为了便于描述，将此状态定位为组件半成品)，将所述组件半成品放置于下模具，再提供与所述下模具相配合的上模具，以在上、下模具合模后在两者之间形成成型腔。所述上模具包括压块，其中，在合模时所述压块压合于所述感光芯片12的非感光区域1212。进而，将模塑材料注入所述成型腔，待固化成型、拔模后得到一体包覆所述线路板11的至少一部分、所述至少一电子元器件14，以及，所述感光芯片12的非感光区域1212的至少一部分的所述模塑支架16B，其中，所述压块所占据的区域对应形成所述感光芯片12的通光孔。
值得一提的是，所述模塑支架16B的内侧面的形状由所述压块的形状决定。例如，当所述压块的侧面垂直于所述感光芯片12的上表面121时，所述模塑支架16B的内侧面垂直于所述感光芯片12的上表面121。再如，当所述压块的内侧面倾斜于所述感光芯片12的上表面121时，所述支架模塑16B的内侧面向外倾斜地延伸。特别地，当所述压块的内侧面具有台阶状时，所述模塑支架16的内侧面也具有台阶状，以在所述模塑支架16B的顶表面上形成用于安装所述滤光元件15的安装平台160。为了便于说明，在申请中将此技术方案定义为IOM方案(IRFilter on Molding)，如图19所示。
值得一提的是，当所述感光组件10基于MOC工艺制成时，所述整形组件的所述第一整形件131和所述第二整形件132在所述模组支架16一体成型于所述线路板11和所述感光芯片12的预设位置前，预先安装或者一体成型于所述线路板11的预设位置。这样的制成顺序有利于工程实施。
值得一提的是，为了防止在执行MOC工艺的过程中所述感光芯片12被注入的模塑材料所冲击而造成位置上的偏移，在本申请该变形实施例的一些示例中，所述感光组件10还包括包裹所述感光芯片12和所述第一整形件131的侧部的侧包胶161，用于防止在执行模塑工艺过程中所述感光芯片12的位置发生偏移，如图20所示。应可以理解，所述侧包胶161不仅能够防止所述感光芯片12的位置发生偏移，还能够有效地较少所述模塑支架16B所产生的应力传递至所述感光芯片12。
图21图示了根据本申请实施例的所述感光组件的又一种变形实施的示意图。如图21所示，在该变形实施中，所述滤光元件15叠置于所述感光芯片12，所述支架16被实施为模塑支架16C，其通过模塑工艺一体成型以包覆所述线路板11的至少一部分、所述至少一电子元器件14、所述感光芯片12的非感光区域1212的至少一部分和所述滤光元件15的至少一部分。
在具体制备工艺中，在将所述感光芯片12贴附于所述第一整形件131并弯曲成型以贴附于所述第二整形件132后，将所述滤光元件15叠置于所述感光芯片12，以形成组件半成品。进而，将所述组件半成品放置于下模具，再提供与所述下模具相配合的上模具，以在上、下模具合模后在两者之间形成成型腔。所述上模具包括压块，其中，在合模时所述压块压合于所述滤光元件15。进而，将模塑材料注入所述成型腔，待固化成型、拔模后得到一体包覆所述线路板11的至少一部分、所述至少一电子元器件14，以及，所述感光芯片12的非感光区域1212的至少一部分的所述模塑支架16C，其中，所述压块所占据的区域对应形成所述感光芯片12的通光孔。
值得一提的是，所述模塑支架16C的内侧面的形状由所述压块的形状决定。例如，当所述压块的侧面垂直于所述滤光元件15时，所述模塑支架16C的内侧面垂直于所述滤光元件15。再如，当所述压块的内侧面倾斜于所述滤光元件15时，所述模塑支架16C的内侧面向外倾斜地延伸。为了便于说明，在申请中将此技术方案定义为IOC方案(IR Filter on Chip)。
值得一提的是，在本申请实施例中，除了将所述滤光元件15支持于所述支架16(包括塑料支架16、模塑支架16A,16B，16C)、所述感光芯片12之外，还可以通过其他方式来安装所述滤光元件15，仅需将所述滤光元件15保持于所述感光组件10的感光路径即可。例如，在本申请实施例的其他示例中，所述感光组件10进一步包括滤光元件支架17，所述滤光元件支架17安装于所述支架16，并用于安装所述滤光元件15。再如，当所述感光组件10与光学镜头20相配合形成摄像模组时，所述滤光元件15还可以被支持于所述光学镜头20内，或者，以镀膜的形式形成于所述光学镜头20中透镜的表面。对此，并不为本申请所局限。
综上基于本申请实施例的感光组件被阐明，其通过特殊的制造工艺将平面状的感光芯片弯曲成适配于实际焦点成像面的形状，以提高所述摄像模组的成像质量。
以下以从制造工艺的角度阐述所述感光组件10的制造过程。
如图4A和图4B所示，基于本申请实施例的所述感光组件10的制造过程被阐明，其用于制备如上所述的感光组件及其变形实施。
具体来说，根据本申请实施例的所述感光组件10制造方法，包括步骤：
首先，提供一线路板11、一感光芯片12、一第一整形件131和一第二整形件132，其中，所述线路板11包括至少一开孔133。值得一提的是，所述线路板11上的所述开孔133也可以在形成所述容置空间100之后通过打孔工艺形成，对此，并不为本申请所局限。
接着，将所述第一整形件131和所述第二整形件132固设于所述线路板11的预设位置。
然后，将所述感光芯片12贴附于所述第一整形件131，以在所述第一整形件131、所述线路板11和所述感光芯片12之间界定形成一容置空间100，其中，形成于所述线路板11的所述开孔133连通于所述容置空间100，其中，所述第二整形件132位于所述容置空间100内，并且，所述第二整形件132的高度低于所述第一整形件131，其中，所述第一整形件和第二整形件中的至少一个的上表面包括向下向内凹陷的弧形表面。
继而，通过所述开孔133将吸附装置40附着于所述感光芯片12的下表面122的至少一部分。
接着，通过所述吸附装置40向下拉所述感光芯片12，以使得所述感光芯片12向下弯曲。
在本申请实施例中，所述吸附装置40包括吸盘41和自所述吸盘41往下延伸的延长杆42，其中，所述吸盘41用于吸附于所述感光芯片12的下表面122的至少一部分，在所述吸盘41附着于所述感光芯片12后，可通过拉拽所述延长杆42，以使得所述感光芯片12向下弯曲。值得一提的是，在本申请其他示例中，所述吸附装置40还可以被实施为其他类型，对此，并不为本申请所局限。
优选地，所述开孔133形成于所述线路板11的位置对应于所述感光芯片12的中心区域，这样，当所述吸附装置40通过所述开孔133伸入所述容置空间100时，所述吸附装置40的吸盘41能够附着于所述感光芯片12的下表面122的中心区域，这样，所述吸附装置40产生的拉弯力在所述感 光芯片12的中心区域最大并随着中心区域往边缘部分逐渐减少，以使得所述感光芯片12的变形度从感光芯片12的边缘到感光芯片12的中心逐渐增大，适配于实际焦点平面的形状。值得一提的是，在本申请实施例中，所述开孔133的数量可设置为一个或者多个，对此并不为本申请所局限。还应可以理解，在本申请实施例的其他示例中，所述开孔133还可以形成在所述线路板11上的其他位置。
优选地，在本申请实施例中，所述第一整形件131应具有封闭形状(例如，被实施为具有“口”字形)，所述第二整形件132相对于所述感光芯片12的中心对称布置。值得一提的是，所述第二整形件132的高度设定与其与所述第一整形件131之间的相对位置关系有关。具体来说，由所述第一整形件131与所述第二整形件132界定形成的用于限定所述感光芯片12弯曲形状的所述整形面130的形状基于实际焦点平面的形状而设定。更明确地，当所述第二整形件132靠近所述第一整形件131时，所述第一整形件131与所述第二整形件132的高度差应缩减(即，所述第二整形件132的高度应增加)；当所述第二整形件132远离所述第一整形件131时，所述第一整形件131与所述第二整形件132的高度差应增加(即，所述第二整形件132的高度应缩减)。
特别地，在本申请实施例中，所述第一整形件131和第二整形件132中的至少一个的上表面包括向下向内凹陷的弧形表面，所述弧形表面配置为使得所述感光芯片12向下弯曲时形成与所述感光组件10的焦点成像面相适配的下表面122，以通过所述第一整形件131和所述第二整形件132的上表面形成向下弯曲的所述整形面130。优选地，在本申请实施例中，所述第一整形件131和第二整形件132中上表面都包括向下向内凹陷的弧形表面。
相应地，弯曲所述感光芯片12的过程，包括：
弯曲所述感光芯片12直至所述感光芯片12的下表面122附着于所述弧形表面，以使得所述感光芯片12向下弯曲时形成与所述感光组件10的焦点成像面相适配的下表面。
如图4B所示，所述制造方法，进一步包括步骤：
在由所述第一整形件131、所述感光芯片12和所述线路板11所界定形成的容置空间100内形成散热件19，其中，所述散热件19附着于所述感光芯片12的下表面122的至少一部分。
优选地，在本申请实施例中，所述散热件19占满整个所述容置空间100，以使得所述感光芯片12的下表面122(对应于容置空间100的部分)完全地与所述散热件19相接触，通过这样的方式最大化地增大散热面积，提升散热性能。
在具体实施中，当所述散热材料190被实施为具有流体状的散热材料190时，在所述容置空间100内形成所述散热件19的过程，包括：将流体状的所述散热材料190通过所述开孔133注入至所述容置空间100内，以在固化成型后形成所述散热件19。
为了便于操作，在执行注入工艺时，可将所述感光组件10倒置以防止流体状的所述散热材料190所述开孔133流出。特别地，当所述开孔133的数量仅有一个时，为了平衡内外压强使得流体状的所述散热材料190能够被顺利注入所述容置空间100内，可在所述线路板11上进一步开设通气孔135。当然，当所述开孔133的数量超过一个时，所述吸气孔中除了被用于注入所述散热材料190的之外，其作用便相当于所述通气孔135。也就是说，当所述开孔133的数量超过一个时，所述吸气孔中至少之一形成所述通气孔135。
在所述散热件19成型后，可进一步地在所述线路板11底表面贴附加强板18，其中，优选地，所述加强板18由导热率较高的金属材料制成，通过这样的方式进一步增强所述感光组件10的散热性能。
在具体实施中，当所述散热材料190被实施为颗粒状的散热材料190。在所述容置空间100内形成所述散热件19的过程，包括：将颗粒状的所述散热材料190通过所述开孔133填充至所述容置空间100内，以及，在所述线路板11底表面贴附加强板18以通过所述加强板18密封所述开孔133。优选地，所述加强板18由导热率较高的金属材料制成，以在密封所述开孔133的同时还进一步增强了所述感光组件10的散热性能。
进一步地，所述感光组件10的制造过程，还包括：将支架16设置于所述线路板11，并且，将滤光元件15安装于所述支架16。
具体来说，在COB工艺中，所述支架16被实施为传统的塑料支架16。相应地，设置于所述支架16于所述线路板11的过程，具体表现为：将所述塑料支架16贴装于所述线路板11。进而，将所述滤光元件15贴装于所述支架16。
在MOB工艺中，所述支架16被实施为模塑支架16A。相应地，设置所述支架16于所述线路板11的过程，包括：在所述线路板11上通过模塑工艺一体成型所述模塑支架16A，其中，所述模塑支架16A包覆所述线路板11的至少一部分和至少部分所述至少一电子元器件14。进而，将所述滤光元件15贴装于所述模塑支架16A。
值得一提的是，在MOB工艺中，所述第一整形件131和所述第二整形件132在所述模组支架16一体成型于所述线路板11的预设位置后，再安装于所述线路板11的预设位置。这样的制成顺序有利于工程实施。
在MOC工艺中，所述支架16被实施为模塑支架16B，相应地，设置所述支架16于所述线路板11的过程，包括：在所述线路板11上通过模塑工艺一体成型所述模塑支架16B，其中，所述模塑支架16B包覆所述线路板11的至少一部分、所述至少一电子元器件14，以及，所述感光芯片12的非感光区域1212的至少一部分。进而，将所述滤光元件15贴装于所述模塑支架16B。
为了防止在执行MOC工艺的过程中所述感光芯片12被注入的模塑材料所冲击而造成位置上的偏移，在执行MOC工艺以形成所述模塑支架16B之前，还包括在所述感光芯片12和所述第一整形件131的侧部施加侧包胶161，以使得所述侧包胶161包裹所述感光芯片12和所述第一整形件131的侧部，通过这样的方式，防止在执行模塑工艺过程中所述感光芯片12的位置发生偏移。
在IOC工艺中，所述支架16被实施为模塑支架16C，相应地，设置所述支架16与所述线路板11的过程，包括：叠置所述滤光元件15于所述感光芯片12，以及，在所述线路板11一体成型所述模塑支架16C，其中，所述一体包覆所述线路板11的至少一部分、所述至少一电子元器件14、所述感光芯片12的非感光区域1212的至少一部分和所述滤光元件15的至少一部分。
值得一提的是，在MOB，MOC和IOC工艺中，所述模塑支架16的内侧面的形状由压块的形状决定。特别地，当所述压块的内侧面具有台阶状时，所述模塑支架16的内侧面也具有台阶状，以在所述模塑支架16的顶表面上形成用于安装所述滤光元件15的安装平台160。相应地，在这些示例中，所述滤光元件15安装于所述安装平台160。
还值得一提的是，在本申请实施例中，除了将所述滤光元件15支持于所述支架16(包括塑料支架16、模塑支架16A,16B，16C)、所述感光芯片12之外，还可以通过其他方式来安装所述滤光元件15，仅需将所述滤光元件15保持于所述感光组件10的感光路径即可。例如，在本申请实施例的其他示例中，所述感光组件10进一步包括滤光元件支架17，所述滤光元件支架17安装于所述支架16，并用于安装所述滤光元件15。再如，当所述感光组件10与光学镜头20相配合形成摄像模组时，所述滤光元件15还可以被支持于所述光学镜头20内，或者，以镀膜的形式形成于所述光学镜头20中透镜的表面。对此，并不为本申请所局限。
如图22A和22B所示，基于本申请实施例的所述感光组件的第二种制造过程被阐明，其用于制备如上所述的感光组件10及其变形实施。
具体来说，如图22A所示，根据本申请实施例的所述感光组件10制造过程，包括步骤：
首先，首先，提供一线路板11和一感光芯片12，其中，所述线路板11包括至少一开孔133。值得一提的是，所述线路板11上的所述开孔133也可以在形成所述容置空间100之后通过打孔工艺形成，对此，并不为本申请所局限。
接着，在所述线路板11上一体成型一第一整形件131和一第二整形件132，其中，所述第二整形件132的高度低于所述第一整形件131，通过这样的方式，所述第一整件形和所述第二整形件132界定形成下凹的一整形面130。
然后，将所述感光芯片12贴附于所述第一整形件131，通过这样的方式，在所述第一整形件131、所述线路板11和所述感光芯片12之间界定形成一容置空间100，其中，所述开孔133连通于所述容置空间100。
继而，通过所述开孔133将吸附装置40附着于所述感光芯片12的下表面122的至少一部分。
然后，通过所述吸附装置40向下拉所述感光芯片12，以使得所述感光芯片12向下弯曲。
也就是说，相较于第一种制备过程，在第二种制备过程中，所述第一整形件131和所述第二整形件132一体成型于所述线路板11，而非先预制后 贴装的方式。
具体来说，在本申请实施例中，在所述线路板11上一体成型一第一整形件131和一第二整形件132的过程，包括：
通过电镀成型工艺在所述线路板11上一体成型一第一整形件主体1311和一第二整形件主体1321；以及
在所述第一整形件主体1311和所述第二整形件主体1321上分别施加黏着剂1340，以通过所述第一整形件主体1311和所述黏着剂1340形成所述第一整形件131和通过所述第二整形件主体1321和所述黏着剂1340形成所述第二整形件132。
在本申请实施例中，所述吸附装置40包括吸盘41和自所述吸盘41往下延伸的延长杆42，其中，所述吸盘41用于吸附于所述感光芯片12的下表面122的至少一部分，在所述吸盘41附着于所述感光芯片12后，可通过拉拽所述延长杆42，以使得所述感光芯片12向下弯曲。值得一提的是，在本申请其他示例中，所述吸附装置40还可以被实施为其他类型，对此，并不为本申请所局限。
优选地，所述开孔133形成于所述线路板11的位置对应于所述感光芯片12的中心区域，这样，当所述吸附装置40通过所述开孔133伸入所述容置空间100时，所述吸附装置40的吸盘41能够附着于所述感光芯片12的下表面122的中心区域，这样，所述吸附装置40产生的拉弯力在所述感光芯片12的中心区域最大并随着中心区域往边缘部分逐渐减少，以使得所述感光芯片12的变形度从感光芯片12的边缘到感光芯片12的中心逐渐增大，适配于实际焦点平面的形状。值得一提的是，在本申请实施例中，所述开孔133的数量可设置为一个或者多个，对此并不为本申请所局限。还应可以理解，在本申请实施例的其他示例中，所述开孔133还可以形成在所述线路板11上的其他位置。
优选地，在本申请实施例中，所述第一整形件131应具有封闭形状(例如，被实施为具有“口”字形)，所述第二整形件132相对于所述感光芯片12的中心对称布置。值得一提的是，所述第二整形件132的高度设定与其与所述第一整形件131之间的相对位置关系有关。具体来说，由所述第一整形件131与所述第二整形件132界定形成的用于限定所述感光芯片12弯曲形状的所述整形面130的形状基于实际焦点平面的形状而设定。更明确地， 当所述第二整形件132靠近所述第一整形件131时，所述第一整形件131与所述第二整形件132的高度差应缩减(即，所述第二整形件132的高度应增加)；当所述第二整形件132远离所述第一整形件131时，所述第一整形件131与所述第二整形件132的高度差应增加(即，所述第二整形件132的高度应缩减)。
特别地，在本申请实施例中，所述第一整形件131和第二整形件132中的至少一个的上表面包括向下向内凹陷的弧形表面，所述弧形表面配置为使得所述感光芯片12向下弯曲时形成与所述感光组件10的焦点成像面相适配的下表面122，以通过所述第一整形件131和所述第二整形件132的上表面形成向下弯曲的所述整形面130。优选地，在本申请实施例中，所述第一整形件131和第二整形件132中上表面都包括向下向内凹陷的弧形表面。
相应地，弯曲所述感光芯片12的过程，包括：
弯曲所述感光芯片12直至所述感光芯片12的下表面122附着于所述弧形表面，以使得所述感光芯片12向下弯曲时形成与所述感光组件10的焦点成像面相适配的下表面。
如图22B所示，所述感光组件10的制备过程，进一步包括步骤：
通过所述开孔133注入散热材料至所述容置空间100，以在所述容置空间100内形成所述散热件，其中，所述散热件附着于所述感光芯片12的下表面122的至少一部分。
优选地，在本申请实施例中，所述散热件19占满整个所述容置空间100，以使得所述感光芯片12的下表面122(对应于容置空间100的部分)完全地与所述散热件19相接触，通过这样的方式最大化地增大散热面积，提升散热性能。
在具体实施中，当所述散热材料190被实施为具有流体状的散热材料190时，在所述容置空间100内形成所述散热件19的过程，包括：将流体状的所述散热材料190通过所述开孔133注入至所述容置空间100内，以在固化成型后形成所述散热件19。
为了便于操作，在执行注入工艺时，可将所述感光组件10倒置以防止流体状的所述散热材料190所述开孔133流出。特别地，当所述开孔133的数量仅有一个时，为了平衡内外压强使得流体状的所述散热材料190能够被顺利注入所述容置空间100内，可在所述线路板11上进一步开设通气孔 135。当然，当所述开孔133的数量超过一个时，所述开孔133中除了被用于注入所述散热材料190的之外，其作用便相当于所述通气孔135。也就是说，当所述开孔133的数量超过一个时，所述开孔133中至少之一形成所述通气孔135。
在所述散热件19成型后，可进一步地在所述线路板11底表面贴附加强板18，其中，优选地，所述加强板18由导热率较高的金属材料制成，通过这样的方式进一步增强所述感光组件10的散热性能。
进一步地，所述感光组件10的制造过程，还包括：将支架16设置于所述线路板11，并且，将滤光元件15安装于所述支架16。
具体来说，在COB工艺中，所述支架16被实施为传统的塑料支架16。相应地，设置于所述支架16于所述线路板11的过程，具体表现为：将所述塑料支架16贴装于所述线路板11。进而，将所述滤光元件15贴装于所述支架16。
在MOB工艺中，所述支架16被实施为模塑支架16A。相应地，设置所述支架16于所述线路板11的过程，包括：在所述线路板11上通过模塑工艺一体成型所述模塑支架，其中，所述模塑支架16A包覆所述线路板11的至少一部分和至少部分所述至少一电子元器件14。进而，将所述滤光元件15贴装于所述模塑支架。
在MOC工艺中，所述支架16被实施为模塑支架，相应地，设置所述支架16于所述线路板11的过程，包括：在所述线路板11上通过模塑工艺一体成型所述模塑支架，其中，所述模塑支架包覆所述线路板11的至少一部分、所述至少一电子元器件14，以及，所述感光芯片12的非感光区域1212的至少一部分。进而，将所述滤光元件15贴装于所述模塑支架。
为了防止在执行MOC工艺的过程中所述感光芯片12被注入的模塑材料所冲击而造成位置上的偏移，在执行MOC工艺以形成所述模塑支架之前，还包括在所述感光芯片12和所述整形部件13的侧部施加侧包胶161，以使得所述侧包胶161包裹所述感光芯片12和所述整形部件13的侧部，通过这样的方式，防止在执行模塑工艺过程中所述感光芯片12的位置发生偏移。
在IOC工艺中，所述支架16被实施为模塑支架，相应地，设置所述支架16与所述线路板11的过程，包括：叠置所述滤光元件15于所述感光芯片12，以及，在所述线路板11一体成型所述模塑支架16C，其中，所述一 体包覆所述线路板11的至少一部分、所述至少一电子元器件14、所述感光芯片12的非感光区域1212的至少一部分和所述滤光元件15的至少一部分。
值得一提的是，在MOB，MOC和IOC工艺中，所述模塑支架16的内侧面的形状由压块的形状决定。特别地，当所述压块的内侧面具有台阶状时，所述模塑支架16的内侧面也具有台阶状，以在所述模塑支架16的顶表面上形成用于安装所述滤光元件15的安装平台160。相应地，在这些示例中，所述滤光元件15安装于所述安装平台160。
还值得一提的是，在本申请实施例中，除了将所述滤光元件15支持于所述支架16(包括塑料支架和模塑支架)、所述感光芯片12之外，还可以通过其他方式来安装所述滤光元件15，仅需将所述滤光元件15保持于所述感光组件10的感光路径即可。例如，在本申请实施例的其他示例中，所述感光组件10进一步包括滤光元件支架17，所述滤光元件支架17安装于所述支架16，并用于安装所述滤光元件15。再如，当所述感光组件10与光学镜头20相配合形成摄像模组时，所述滤光元件15还可以被支持于所述光学镜头20内，或者，以镀膜的形式形成于所述光学镜头20中透镜的表面。对此，并不为本申请所局限。
综上，基于本申请实施例的所述感光组件10制造方法被阐明，其通过特殊的制造工艺将平面状的感光芯片12弯曲成适配于实际焦点成像面的形状，以提高所述摄像模组的成像质量。并且，在所述感光芯片12的背面形成用于加强散热的散热件19，以提高散热性能。
示意性摄像模组一
以下具体介绍将如上所述感光组件10应用于摄像模组。本领域技术人员知晓，摄像模组有动焦摄像模组和定焦摄像模组。
当所述摄像模组被实施为定焦摄像模组时，所述摄像模组包括如上所述的感光组件和光学镜头20，其中，所述光学镜头20被保持于所述感光组件10的感光路径。具体来说，通常所述光学镜头20安装于所述支架16，以将所述光学镜头20保持于所述感光组件10的感光组件，其具体效果可参见如图23至如图27。值得一提的是，附图中仅示意了本申请实施例中几款典型的感光组件，其相应的变形实施并未一一列举，对此本领域技术人员应 能充分理解。
在成像过程中，外界光线先穿过所述光学镜头20，在被所述滤光元件15过滤后，被所述感光芯片12所采集。特别地，在本申请实施例中，所述感光芯片12基于实际焦点平面的形状被弯曲，通过这样的方式使得所述摄像模组的成像质量得以提高。
当所述摄像模组被实施为动焦摄像模组时，如图28所示，所述摄像模组包括如上所述的感光组件、光学镜头20和驱动元件30，其中，所述驱动元件30安装于所述支架16，所述光学镜头20安装于所述驱动元件30，这样，所述驱动元件30能承载着所述光学镜头20沿着所述感光组件10的感光路径移动，以实现动焦功能。值得一提的是，附图中仅示意了本申请实施例中一款典型的感光组件，其相应的变形实施并未一一列举，对此本领域技术人员应能充分理解。
综上，基于本申请实施例的所述摄像模组被阐明，其通过特殊的制造工艺将平面状的感光芯片12弯曲成适配于实际焦点成像面的形状，通过这样的方式，提高所述摄像模组的成像质量。
示例性感光组件及其制造方法二
如图29至图30B所示，根据本申请实施例的感光组件及其制造过程的另一示例被阐明。如图29所示，感光组件10包括线路板11、电连接于所述线路板11的感光芯片12和整形部件13，其中，所述感光芯片12的下表面122附着于所述整形部件13，以与所述整形部件13和所述线路板11形成一容置空间100，所述容置空间100配置为使得在组装所述感光组件10的过程中所述感光芯片12向下弯曲。特别地，在本申请实施例中，所述感光芯片12被弯曲成与实际焦点平面相适配的形状，通过这样的方式来提高成像质量。
如图29至图30B所示，在本申请实施例中，所述整形部件13被固设于所述线路板11的顶表面上，其中，所述整形部件13的顶表面附着于所述感光芯片12的下表面122，以与所述感光芯片12和所述线路板11形成所述容置空间100。应可以理解，位于所述感光芯片12下方的所述容置空间100为所述感光芯片12在特定力的作用下向下弯曲提供变形空间。并且，在本申请实施例中，所述整形部件13设定一整形面130，其中，所述整形 面130被配置为限制所述感光芯片12向下弯曲的形状，以使得弯曲之后的所述感光芯片12的下表面122的形状适配于实际焦点平面，通过这样的方式来提高成像质量。
更具体地说，在本申请实施例中，所述整形部件13包括第一整形件131和第二整形件132，其中，所述第一整形件131被固设于所述线路板11，所述感光芯片12的下表面122附着于所述第一整形件131，通过这样的方式，在所述第一整形件131、所述感光芯片12和所述线路板11之间形成一容置空间100。所述第二整形件132被固设于所述线路板11且位于所述容置空间100内，并且，所述第二整形件132的高度低于所述第一整形件131。换言之，在本申请实施例中，所述第一整形件131和所述第二整形件132呈台阶状布置。特别地，在本申请实施例中，所述第一整形件131和第二整形件132中的至少一个的上表面包括向下向内凹陷的弧形表面，所述弧形表面配置为使得所述感光芯片12向下弯曲时形成与所述感光组件10的焦点成像面相适配的下表面122，以通过所述第一整形件131和所述第二整形件132的上表面形成向下弯曲的所述整形面130。优选地，在本申请实施例中，所述第一整形件131和第二整形件132中上表面都包括向下向内凹陷的弧形表面，如图32所示。
进一步地，所述整形部件13还包括贯穿地形成于所述线路板11且连通于所述容置空间100的至少一开孔133，其中，在所述感光芯片12附着于所述第一整形件131以形成所述容置空间100后，藉由所述开孔133可将所述容置空间100内的气体排出，以在所述感光芯片12的上下表面121,122之间形成压强差以迫使所述感光芯片12向下弯曲直至附着于由所述第一整形件131和所述第二整形件132形成的所述整形面130。
为了形成所述容置空间100，在本申请实施例中，所述第一整形件131具有封闭形状。如图31所示，优选地，所述第一整形件131的形状与所述线路板11和所述感光芯片12的形状相适配。本领域技术人员应知晓，现有的线路板11和感光芯片12的形状通常为长方形，相应地，所述第一整形件131的形状优选地被实施为封闭“口”字形。当然，本领域的技术人员应可以理解，随着摄像模组技术的发展和及其应用场景的扩展，线路板11和感光芯片12的形状会发生改变，对应地，所述第一整形件131的形状也可做出自适应调整，对此，并不为本申请所局限。
应可以理解，口字型的所述第一整形件131具有开口。相应地，在所述第一整形件131被固设于所述线路板11后，所述开口被附着于所述第一整形件131的所述感光芯片12所遮蔽，从而所述感光芯片12、所述线路板11和所述第一整形件131包围形成所述容置空间100。优选地，所述第一整形件131的尺寸与所述感光芯片12的尺寸相适配，以使得当所述感光芯片12贴附于所述第一整形件131时，所述第一整形件131支撑于所述感光芯片12的边缘部分。本领域技术人员应知晓，所述感光芯片12的上表面121，包括感光区域1211和位于所述感光区域1211周围的非感光区域1212，其中，由于所述感光区域1211为敏感区域其通常被设于所述感光芯片12的上表面121的中心部分，以及，所述非感光区域1212位于所述上表面121的边缘部分并包围所述感光区域1211并。也就是说，所述第一整形件131的尺寸与所述感光芯片12相适配，以使得所述第一整形件131支撑于所述感光芯片12的非感光区域1212，这样可确保所述感光芯片12在后续被弯曲的过程中，所述感光芯片12的感光区域1211不会遭到破坏。值得注意的是，本发明中提及到所述感光芯片12中心线前提为所述感光芯片为规则形状，既所述感光芯片12的感光区域1211和所述非感光区域1212是关于中心对称分布。当所述感光芯片12为非规则形状，则本发明所述感光芯片12中心线指的是所述感光区域1211的中心线。
更为优选地，所述第一整形件131的形状和尺寸与所述感光芯片12的尺寸和形状相适配，以使得当所述感光芯片12附着于所述第一整形件131时，所述第一整形件131支撑于所述感光芯片12的非感光区域1212，并且，所述第一整形件131的中心与所述感光芯片12的中心同轴。也就是说，所述感光芯片12同轴地附着于所述第一整形件131。
如图29所示，在本申请实施例中，所述第一整形件131包括第一整形件主体1311和施加于所述第一整形件主体上的黏着剂1340，其中，所述第一整形件主体1311被设于所述线路板11上，所述黏着剂1340用于粘接所述感光芯片12。应可以理解，所述黏着剂1340的作用在于粘接所述第一整形件主体1311和所述感光芯片12，其厚度、材料并不会对本申请构成限制。并且，在本申请其他示例中，所述感光芯片12还可采取超声波焊接等工艺直接设置于所述第一整形件主体1311而无需所述黏着剂1340。也就是说，在本申请其他示例中，所述黏着剂为1340非必要元件。优选地，本申请实 施例中，所述黏着剂1340具有一定的柔韧性和较高的黏性。
特别地，在形成所述容置空间100之前，所述第二整形件132应事先预设于所述线路板11的预设位置，以在所述感光芯片12粘接于所述第一整形件131以形成所述容置空间100后，将所述第二整形件132收容于所述容置空间100内。
如前所述，所述第二整形件132的高度小于所述第一整形件131的高度。特别地，在本申请实施例中，所述第二整形件132的高度设定与其与所述第一整形件131之间的相对位置关系有关。具体来说，由所述第一整形件131与所述第二整形件132形成的所述整形面130的形状基于实际焦点平面的形状而设定。也就是说，所述第一整形件131与所述第二整形件132之间的相对位置关系与两者之间的高度差的设定应匹配于实际焦点平面形状。更明确地说，当所述第二整形件132靠近所述第一整形件131时，所述第一整形件131与所述第二整形件132的高度差应缩减，即，所述第二整形件132的高度应增加；当所述第二整形件132远离所述第一整形件131时，所述第一整形件131与所述第二整形件132的高度差应增加，即，所述第二整形件132的高度应缩减。值得一提的是，在本申请实施例中，所述整形面130的形状匹配于实际焦点平面形状，并不表示所述整形面130的形状与所述实际焦点平面的形状完全一致或者完全重合，其仅表示所述整形面130的形状趋向于与实际焦点平面的形状相一致。
优选地，在本申请实施例中，所述第二整形件132相对于所述感光芯片12的中心对称布置。这样，当所述感光芯片12的下表面122在压强差的作用下附着于所述第二整形件132时，所述第二整形件132与所述感光芯片12的粘接点也相对于所述感光芯片12的中心对称地分布，以在所述感光芯片12的相对两侧或者四周形成统一的粘接力，以确保所述感光芯片12能够更为稳定地定形。更为具体地，在本申请实施例中，所述第二整形件132对称地布置于所述感光芯片12的较长边所设定的中心线的两侧。当然，本领域的技术人员应可以理解，在本申请其他示例中，所述第二整形件132还能以其他方式对称地相对于所述感光芯片12的中心布置。值得一提的是，在本申请实施例中，所述第二整形件132的形状并不为本申请所局限，其包括但不限于细长状、立柱状等。
与所述第一整形件131相类似，在本申请实施例中，所述第二整形件 132包括第二整形件主体1321和施加于所述第二整形件主体1321上的黏着剂1340。应可以理解，通过所述黏着剂1340将所述感光芯片12粘接于所述第二整形件132的上表面上，以预防所述感光芯片12出现中间悬空情况而发生断裂，以及，预防所述感光芯片12在使用过程中变形(例如，逐渐趋向于平面状的感光芯片)。值得一得的是，在本申请实施例中，施加于所述第一整形件主体1311上的黏着剂1340和施加于所述第二整形件主体1321上的黏着剂1340可被实施为同一种黏着剂1340或者为不同类型的黏着剂1340，并且，所述黏着剂1340的施加量或者厚度都不为本申请所局限。
优选地，在本申请实施例中，所述第一整形件主体1311和所述第二整形件主体1321由硬度较高和导热率较高的材料制成，例如，金属材料(包括纯金属材料，金属与非金属合金材料，金属与金属合金材料)。应注意到，在本申请实施例中，所述第一整形件主体1311和所述第二整形件主体1321分别延伸于所述感光芯片12和所述线路板11之间，从而当所述第一整形件主体1311和所述第二整形件主体1321被实施为由导热率较高的金属材料制成时，所述感光芯片12工作所产生的热量能够藉由所述第一整形件主体1311和所述第二整形件主体1321高效地传导至所述线路板11并最终散发到外界。关于散热部分会在后续描述中进一步描述，在此不继续展开。
在所述感光芯片12粘结于所述第一整形件131以界定形成所述容置空间100时，所述感光芯片12的下表面122与所述第二整形件132的黏着剂1340之间存在一定的距离。相应地，随着所述容置空间100内的气体通过所述开孔133被吸出后，在压强差的作用下所述感光芯片12不断地向下弯曲以使得所述感光芯片12的下表面122与所述第二整形件132之间的距离被不断缩减，直至所述感光芯片12的下表面122与所述第二整形件132的黏着剂1340相接触，以通过所述黏着剂1340将所述感光芯片12也粘接于所述第二整形件132。当所述感光芯片12同时粘接于所述第一整形件131和所述第二整形件132时，所述感光芯片12的形状被定形为所述整形面130的形状，以使得所述感光芯片12的下表面122的形状适配于实际焦点平面。
如图31所示，在本申请实施例中，所述开孔133形成于所述线路板11的位置对应于所述感光芯片12的中心区域。这样，当所述容置空间100内的气体通过诸如气泵之类的吸气装置被排出时，位于所述容置空间100内的 气体从四周能以特定方式地流出所述开孔133(靠近感光芯片12中心的其他流速快，靠近感光芯片12边缘的气体流速慢)。基于压强与流速之间的关系可知，形成于所述感光芯片12上下表面121,122之间的各个位置的压强差从所述感光芯片12的边缘位置到中心区域逐渐增大，从而在渐增的压强差的作用下，所述感光芯片12的变形度从感光芯片12的边缘到感光芯片12的中心逐渐增大以趋向于所述整形面130的方式向下弯曲变形。也就是说，在本申请实施例中，将所述开孔133形成于所述线路板11的位置设置为对应于所述感光芯片12的中心区域，有利于所述感光芯片12的变形方式更趋向于实际焦点平面的形状，并且，渐变的压强差(没有应力突变)有利于防止所述感光芯片12在变形过程中突然发生断裂。值得一提的是，在本申请实施例中，所述开孔133的数量可设置为一个或者多个，对此并不为本申请所局限。
当然应可以理解，在本申请实施例的其他示例中，所述开孔133还可以形成在所述线路板11上的其他位置。
图33图示了根据本申请实施例的所述感光组件的一种变形实施的俯视示意图。如图33所示，在该变形实施例中，所述开孔133形成于所述线路板11的位置位于所述第一整形件131和所述第二整形件132之间。优选地，在该变形实施例中，所述开孔133形成于所述线路板11的位置相对于所述感光芯片12的中心对称地布置，以使得在所述容置空间100内的气体通过诸如气泵之类的吸气装置被排出时，位于所述容置空间100内的气体能分别相对均匀且对称地沿着所述开孔133排出，从而在相对所述感光芯片12的中心对称的各个位置上形成较为一致的压强差，以使得所述感光芯片12能够更为对称地且平缓地以趋向于所述整形面130的形状的方式向下弯曲。
图34图示了根据本申请实施例的所述感光组件的另一种变形实施的示意图。如图34所示，在该变形实施例中，部分所述开孔133形成于所述线路板11的位置对应于所述感光芯片12的中心区域，以及，另一部分所述开孔133形成于所述线路板11的位置位于所述第一整形件131和所述第二整形件132之间。特别地，在该变形实施例中，另一部分所述开孔133形成于所述线路板11的位置相对于所述感光芯片12的中心对称布置。
为了便于定位和安装所述第一整形件131和所述第二整形件132，如图35所示，在本申请实施例的一些示例中，所述线路板11还包括凹陷地形成 于所述线路板11的顶表面上的第一定位凹槽111和第二定位凹槽112，其中，所述第一定位凹槽111用于定位以适配地安装所述第一整形件131于其内，以及，所述第二定位凹槽112用于定位以适配地安装所述第二整形件132于其内。
在本申请的另外一些示例中，为了便于定位和安装所述第一整形件131和所述第二整形件132，如图36所示，所述第一定位凹槽111被实施为贯穿于所述线路板11的第一定位通孔和所述第一定位凹槽112被实施为贯穿地形成于所述线路板11的第二定位通孔，其中，所述第一定位通孔111用于定位以适配地安装所述第一整形件131于其内，以及，所述第二定位通孔112用于定位以适配地安装所述第二整形件132于其内。并且，所述感光组件10还包括贴附于所述线路板11底表面的加强板18。优选地，所述加强板18由导热率较高的金属材料制成，这样所述感光芯片12所产生的热量能藉由所述第一整形件131和所述第二整形件132直接被传导至所述加强板18，实现散热的目的。
值得一提的是，在本申请实施例中，所述第一整形件131和所述第二整形件132是预制件，即所述第一整形件主体1311和所述第二整形件1321在预制后被贴附于所述线路板1的预设位置上。或者，所述第一整形件131和所述第二整形件132也可一体成型于所述线路板11的预设位置。例如，当所述第一整形件主体1311和所述第二整形件主体1321由金属材料制成时，所述第一整形件主体1311和所述第二整形件主体1321可通过电镀成型工艺一体成型于所述线路板11的预设位置。当然，应容易理解，当所述第一整形件主体1311和所述第二整形件主体1321由其他具有较高硬度和导热率较高的材料制成时，可采用对应的一体成型工艺在所述线路板11的预设位置上一体成型所述第一整形件131和所述第二整形件132。对此，并不为本申请所局限。
还值得一提的是，在本申请实施例的其他示例中，所述整形部件13还可以包括更多数量或者更少的整形件。例如，在本申请另外的示例中，如图37所示，所述整形部件13还包括第三整形件134(包括第三整形件134主体和施加于所述第三整形件134主体的顶表面上的黏着剂1340)，其中，所述第三整形件134设于所述第一整形件131和所述第二整形件132之间，以通过所述第一整形件131、所述第二整形件132和所述第三整形件134 形成所述整形面130。再如，如图38所示，在本申请另外的示例中，所述整形部件13仅包括所述第一整形件131，其中，所述第一整形件131的上表面包括向下向内凹陷的弧形表面，所述弧形表面配置为使得所述感光芯片12向下弯曲时形成与所述感光组件10的焦点成像面相适配的下表面122。
图39图示了根据本申请实施例的所述感光组件的又一种变形实施的示意图。如图39所示，在该变形实施例中，所述第一整形件131和所述第二整形件132都具有封闭环形，以在所述第一整形件131和所述第二整形件132之间形成一容纳腔。特别地，在该变形实施例中，所述整形部件13还包括设于所述第一整形件131和所述第二整形件132之间的黏着剂1340，其中，所述黏着剂1340的上表面最高处高度高于所述第二整形件132的上表面。应可以理解，在该变形实施例中，所述黏着剂1340应具有较高的粘稠度，以防止所述黏着剂1340从所述第二整形件132的上表面流出。这样，当所述感光芯片12贴附于所述第一整形件131后，通过吸气排出所述容置空间100内的气体所产生的压强差能迫使所述感光芯片12向下弯曲直至粘接于设于所述第一整形件131和所述第二整形件132之间的所述黏着剂1340。值得一提的是，在该变形实施例中，所述第二整形件132的上表面可不设置所述黏着剂1340。值得注意的是，由于所述黏着剂1340高度高于所述第二整形件132，故在吸气时，所述黏着剂1340可能会流至所述第二整形件132的上表面，从而使得所述感光芯片12向下弯曲后通过所述黏着剂1340粘贴于所述第二整形件132，以使得黏合更佳，提升可靠性。进一步，所述黏着剂1340也可不高于所述第二整形件132，例如所述黏着剂1340上表面与所述第二整形件132上表面齐平。
为了提升所述感光组件的散热性能，如图29至图30B所示，在本申请实施例中，所述感光组件10还包括形成于所述容置空间100内的散热件19，其中，所述散热件19附着于所述感光芯片12的下表面122的至少一部分，以使得所述感光芯片12所产生的热量能够藉由与所述感光芯片12所接触的所述散热件19传导至外界。
优选地，在本申请实施例中，所述散热件19充满整个所述容置空间100，以使得所述感光芯片12的下表面122完全地与所述散热件19相接触，以最大化地增大散热面积，提升散热性能。值得一提的是，所述散热件19在所述容置空间100的形成位置和填充比例取决于所述第二整形件132的形 状以及所述至少一开孔133的位置设置。
具体来说，当所述第二整形件132被实施为封闭的“口”字型，并且所述至少一开孔133形成于所述线路板11的位置对应于所述感光芯片12的中心区域时，所述散热件19最多只能占满由所述第二整形件132、所述感光芯片12和所述线路板11所围成的腔室内，如图40所示。当然，即便所述第二整形件132被实施为封闭的“口”字型，所述散热件19也能占满整个所述容置空间100，只需要将部分所述开孔133形成于所述线路板11的位置设置为对应于所述感光芯片12的中心区域，同时，将另一部分所述开孔133形成于所述线路板11的位置设置为位于所述第一整形件131和所述第二整形件132之间即可。
在具体实施中，用于制成所述散热件19的散热材料190可通过所述开孔133进入所述容置空间100内，以在所述容置空间100内形成所述散热件19。
例如，当所述散热材料190被实施为具有流体状的散热材料190时，流体状的所述散热材料190可通过所述开孔133注入至所述容置空间100内，以在固化成型后形成所述散热件19。为了便于操作，在执行注入工艺时，可将所述感光组件10倒置以防止流体状的所述散热材料190所述开孔133流出。特别地，当所述开孔133的数量仅有一个时，为了平衡内外压强使得流体状的所述散热材料190能够被顺利注入所述容置空间100内，可在所述线路板11上进一步开设通气孔135，如图41所示。当然，当所述开孔133的数量超过一个时，所述吸气孔中除了被用于注入所述散热材料190的之外，其作用便相当于所述通气孔135。也就是说，当所述开孔133的数量超过一个时，所述开孔中至少之一形成所述通气孔135。
值得一提的是，当所述散热件19通过流体状的散热材料190固化成型时，优选地，所述散热材料190能够充满整个所述容置空间100，以在固化成型后，一方面所述散热件19贴附于所述感光芯片12的整个下表面122(对应于容置空间100的部分)以增大散热面积；另一方面，所述散热件19自所述感光芯片12的下表面122延伸至所述开孔133，也就是说，所述散热件19直接延伸至外界，以更加利于散热。当然，在本申请实施例的其他示例中，所述感光组件10还包括贴附于所述线路板11底表面的加强板18，优选地，所述加强板18由导热率较高的金属材料制成，通过这样的方式进 一步增强所述感光组件10的散热性能。
当然，在本申请实施例的其他示例中，所述散热材料190还可以被实施为其他形式，例如，颗粒状的散热材料190，如图42所示。相应地，可将颗粒状的所述散热材料190填充至所述容置空间100内，以形成所述散热件19。为了防止颗粒状的所述散热材料190从所述开孔133出漏出，在本申请实施例的该示例中，所述感光组件10还包括用于密封所述开孔133的加强板18，并且，优选地，所述加强板18由导热率较高的金属材料制成，以在密封所述开孔133的同时还进一步增强了所述感光组件10的散热性能。
进一步地，如图29所示，在本申请实施例中，所述感光组件10还包括至少一电子元器件14，用于电连接所述感光芯片12至所述线路板11的引线，滤光元件15和支架16，其中，所述至少一电子元器件14设于所述线路板11上并位于所述感光芯片12的周围，其包括但不限于电容，电阻，电感等。
在所述感光芯片12贴附于所述第一整形件131并弯曲成型后，通过所述引线123实现所述感光芯片12与所述线路板11之间的电气连接。具体来说，每一所述引线123弯曲地延伸于所述感光芯片12和所述线路板11之间，以通过所述引线123将所述感光芯片12电连接于所述线路板11，从而，所述线路板11可基于所述引线123对所述感光芯片12进行供电，以及，所述感光芯片12可基于所述引线123将所采集到的信号传输出去。
值得一提的是，在该具体示例中，所述引线123的类型并不为本申请所局限，例如，所述引线123可以是金线、银线、铜线。并且，所述引线123可通过“打金线”的工艺安装于所述线路板11和所述感光芯片12之间，以用于实现两者之间的电连接。
具体来说，“打金线”工艺一般分为两种类型：“正打金线”工艺和“反打金线”工艺。“正打金线”工艺指的是在布设所述引线123的过程中，首先在所述线路板11的导电端上形成所述引线123的一端，进而弯曲地延伸所述引线123，并最终在所述感光芯片12的导电端上形成所述引线123的另一端，通过这样的方式，在所述感光芯片12和所述线路板11之间形成所述引线123。“反打金线”工艺指的是在布设所述引线123的过程中，首先在所述感光芯片12的导电端上形成所述引线123的一端，进而弯曲地延伸所述引线123，并最终在所述线路板11的导电端上形成所述引线123 的另一端，通过这样的方式，在所述感光芯片12和所述线路板11之间形成所述引线123。值得一提的是，通过“反打金线”工艺所形成的所述引线123向上突起的高度相对“正打金线”工艺所形成的所述引线123向上突起的高度，因此，优选地，在该具体实施中，采用“反打金线”工艺形成所述引线123。
当然，本领域的技术人员应知晓，在本申请实施例的其他示例中，所述感光芯片12和所述线路板11可通过其他方式进行导通(可不采用所述引线123)，例如采用背部导通的技术方案。对此，并不为本申请所局限。
如图29所示，在本申请实施例中，所述支架16被设置于所述线路板11，用于支撑所述滤光元件15。具体来说，在本申请实施例中，所述支架16被实施为传统的塑料支架16，其预制成型并贴附于所述线路板11的顶表面，其中，所述滤光元件15被安装于所述支架16的顶部且对应于所述感光芯片12的至少感光区域1211，以用于对进入所述感光芯片12的光线进行过滤，以改善成像品质。也就是说，在本申请实施例中，所述感光组件10基于传统的COB工艺制程。
本领域的技术人员应知晓，所述滤光元件15能够被实施为不同的类型，包括但不限于所述滤光元件15能够被实施为红外截止滤光片、全透光谱滤光片以及其他的滤光片或者多个滤光片的组合。具体来说，例如，当所述滤光元件15被实施为红外截止滤光片和全透光谱滤光片的组合，即，所述红外截止滤光片和所述全透光谱滤片能够被切换以选择性地位于所述感光芯片12的感光路径上，这样，在白天等光线较为充足的环境下使用时，可以将所述红外截止滤光片切换至所述感光芯片12的感光路径，以藉由所述红外截止滤光片过滤进入所述感光芯片12的被物体反射的光线中的红外线，并且，当夜晚等光线较暗的环境中使用时，可以将所述全透光谱滤光片切换至所述感光芯片12的感光路径，以允许进入所述感光芯片12的被物体反射的光线中的红外线部分透光。
图43图示了根据本申请实施例的所述感光组件的又一种变形实施的示意图。如图43所示，在该变形实施中，所述感光组件10基于MOB(Molding on Board)工艺制备而成。具体来说，在该变形实施例中，所述支架16被实施为模塑支架16A，其通过模塑工艺一体成型于所述线路板11，以一体包覆所述线路板11的至少一部分和至少部分所述电子元器件14。
在具体制备工艺中，可将线路板11放置于下模具，再提供与所述下模具相配合的上模具，以在上、下模具合模后在两者之间形成成型腔，其中，所述上模具包括在合模时压合于所述线路板11的压块。进而，将模塑材料注入所述成型腔，待固化成型、拔模后得到一体包覆于一体包覆所述线路板11的至少一部分和至少部分所述电子元器件14的所述模塑支架16A。
值得一提的是，所述模塑支架16A的内侧面的形状由所述压块的形状决定。例如，当所述压块的侧面垂直于所述线路板11时，所述模塑支架16A的内侧面垂直于所述感光芯片12的上表面121。再如，当所述压块的内侧面倾斜于所述线路板11时，所述模塑支架16A的内侧面向外倾斜地延伸。
值得一提的是，当所述感光组件10基于MOB工艺制成时，优选地所述整形组件的所述第一整形件131和所述第二整形件132在所述模组支架16一体成型于所述线路板11的预设位置后，再安装于所述线路板11的预设位置。这样的制成顺序有利于工程实施。
图44图示了根据本申请实施例的所述感光组件的又一种变形实施的示意图。如图44所示，在该变形实施中，所述感光组件10基于MOC(Molding on Chip)工艺制备而成。具体来说，在该变形实施例中，所述支架16被实施为模塑支架16B，其通过模塑工艺一体成型于所述线路板11，以一体包覆所述线路板11的至少一部分、所述至少一电子元器件14，以及，所述感光芯片12的非感光区域1212的至少一部分。
在具体制备工艺中，在将所述感光芯片12贴附于所述第一整形件131并弯曲成型以贴附于所述第二整形件132后(为了便于描述，将此状态定位为组件半成品)，将所述组件半成品放置于下模具，再提供与所述下模具相配合的上模具，以在上、下模具合模后在两者之间形成成型腔。所述上模具包括压块，其中，在合模时所述压块压合于所述感光芯片12的非感光区域1212。进而，将模塑材料注入所述成型腔，待固化成型、拔模后得到一体包覆所述线路板11的至少一部分、所述至少一电子元器件14，以及，所述感光芯片12的非感光区域1212的至少一部分的所述模塑支架16B，其中，所述压块所占据的区域对应形成所述感光芯片12的通光孔。
值得一提的是，所述模塑支架16B的内侧面的形状由所述压块的形状决定。例如，当所述压块的侧面垂直于所述感光芯片12的上表面121时，所述模塑支架16B的内侧面垂直于所述感光芯片12的上表面121。再如，当 所述压块的内侧面倾斜于所述感光芯片12的上表面121时，所述支架模塑16B的内侧面向外倾斜地延伸。特别地，当所述压块的内侧面具有台阶状时，所述模塑支架16的内侧面也具有台阶状，以在所述模塑支架16B的顶表面上形成用于安装所述滤光元件15的安装平台160。为了便于说明，在申请中将此技术方案定义为IOM方案(IRFilter on Molding)，如图45所示。
值得一提的是，当所述感光组件10基于MOC工艺制成时，所述整形组件的所述第一整形件131和所述第二整形件132在所述模组支架16一体成型于所述线路板11和所述感光芯片12的预设位置前，预先安装或者一体成型于所述线路板11的预设位置。这样的制成顺序有利于工程实施。
值得一提的是，为了防止在执行MOC工艺的过程中所述感光芯片12被注入的模塑材料所冲击而造成位置上的偏移，在本申请该变形实施例的一些示例中，所述感光组件10还包括包裹所述感光芯片12和所述第一整形件131的侧部的侧包胶161，用于防止在执行模塑工艺过程中所述感光芯片12的位置发生偏移，如图46所示。应可以理解，所述侧包胶161不仅能够防止所述感光芯片12的位置发生偏移，还能够有效地较少所述模塑支架16B所产生的应力传递至所述感光芯片12。
图47图示了根据本申请实施例的所述感光组件的又一种变形实施的示意图。如图47所示，在该变形实施中，所述滤光元件15叠置于所述感光芯片12，所述支架16被实施为模塑支架16C，其通过模塑工艺一体成型以包覆所述线路板11的至少一部分、所述至少一电子元器件14、所述感光芯片12的非感光区域1212的至少一部分和所述滤光元件15的至少一部分。
在具体制备工艺中，在将所述感光芯片12贴附于所述第一整形件131并弯曲成型以贴附于所述第二整形件132后，将所述滤光元件15叠置于所述感光芯片12，以形成组件半成品。进而，将所述组件半成品放置于下模具，再提供与所述下模具相配合的上模具，以在上、下模具合模后在两者之间形成成型腔。所述上模具包括压块，其中，在合模时所述压块压合于所述滤光元件15。进而，将模塑材料注入所述成型腔，待固化成型、拔模后得到一体包覆所述线路板11的至少一部分、所述至少一电子元器件14，以及，所述感光芯片12的非感光区域1212的至少一部分的所述模塑支架16C，其中，所述压块所占据的区域对应形成所述感光芯片12的通光孔。
值得一提的是，所述模塑支架16C的内侧面的形状由所述压块的形状决 定。例如，当所述压块的侧面垂直于所述滤光元件15时，所述模塑支架16C的内侧面垂直于所述滤光元件15。再如，当所述压块的内侧面倾斜于所述滤光元件15时，所述模塑支架16C的内侧面向外倾斜地延伸。为了便于说明，在申请中将此技术方案定义为IOC方案(IR Filter on Chip)。
值得一提的是，在本申请实施例中，除了将所述滤光元件15支持于所述支架16(包括塑料支架16、模塑支架16A,16B，16C)、所述感光芯片12之外，还可以通过其他方式来安装所述滤光元件15，仅需将所述滤光元件15保持于所述感光组件10的感光路径即可。例如，在本申请实施例的其他示例中，所述感光组件10进一步包括滤光元件支架17，所述滤光元件支架17安装于所述支架16，并用于安装所述滤光元件15。再如，当所述感光组件10与光学镜头20相配合形成摄像模组时，所述滤光元件15还可以被支持于所述光学镜头20内，或者，以镀膜的形式形成于所述光学镜头20中透镜的表面。对此，并不为本申请所局限。
综上基于本申请实施例的感光组件被阐明，其通过特殊的制造工艺将平面状的感光芯片弯曲成适配于实际焦点成像面的形状，以提高所述摄像模组的成像质量。
以下以从制造工艺的角度阐述所述感光组件10的制造过程。
如图30A和图30B所示，基于本申请实施例的所述感光组件10的制造过程被阐明，其用于制备如上所述的感光组件及其变形实施。
具体来说，根据本申请实施例的所述感光组件10制造方法，包括步骤：
首先，提供一线路板11、一感光芯片12、一第一整形件131和一第二整形件132，其中，所述线路板11包括至少一开孔133。
接着，将所述第一整形件131和所述第二整形件132固设于所述线路板11的预设位置。
然后，将所述感光芯片12贴附于所述第一整形件131，以在所述第一整形件131、所述线路板11和所述感光芯片12之间界定形成一容置空间100，其中，形成于所述线路板11的所述开孔133连通于所述容置空间100，其中，所述第二整形件132位于所述容置空间100内，并且，所述第二整形件132的高度低于所述第一整形件131，其中，所述第一整形件和第二整形件中的至少一个的上表面包括向下向内凹陷的弧形表面。
继而，通过所述开孔133吸出所述容置空间100内的气体，以在所述感光芯片12的上表面121和下表面之间产生压强差，从而迫使所述感光芯片12向下弯曲直到附着于所述第二整形件132，以使得所述感光芯片12的下表面122适配地附着于所述第一整形件131和所述第二整形件132界定形成的所述整形面130。
值得一提的是，所述线路板11上的所述开孔133也可以在形成所述容置空间100之后通过打孔工艺形成，对此，并不为本申请所局限。
优选地，在本申请实施例中，所述第一整形件131应具有封闭形状(例如，被实施为具有“口”字形)，所述第二整形件132相对于所述感光芯片12的中心对称布置，并且，所述开孔133形成于所述线路板11的位置对应于所述感光芯片12的中心区域。或者，所述开孔133形成于所述线路板11的位置位于所述第一整形件131和所述第二整形件132之间，并且，所述开孔133形成于所述线路板11的位置相对于所述感光芯片12的中心对称布置。
值得一提的是，所述第二整形件132的高度设定与其与所述第一整形件131之间的相对位置关系有关。具体来说，由所述第一整形件131与所述第二整形件132界定形成的用于限定所述感光芯片12弯曲形状的所述整形面130的形状基于实际焦点平面的形状而设定。更明确地，当所述第二整形件132靠近所述第一整形件131时，所述第一整形件131与所述第二整形件132的高度差应缩减(即，所述第二整形件132的高度应增加)；当所述第二整形件132远离所述第一整形件131时，所述第一整形件131与所述第二整形件132的高度差应增加(即，所述第二整形件132的高度应缩减)。值得一提的是，在本申请实施例中，所述整形面130的形状匹配于实际焦点平面形状，并不表示所述整形面130的形状与所述实际焦点平面的形状完全一致或者完全重合，其仅表示所述整形面130的形状趋向于与实际焦点平面的形状相一致。
特别地，在本申请实施例中，所述第一整形件131和第二整形件132中的至少一个的上表面包括向下向内凹陷的弧形表面，所述弧形表面配置为使得所述感光芯片12向下弯曲时形成与所述感光组件10的焦点成像面相适配的下表面122，以通过所述第一整形件131和所述第二整形件132的上表面形成向下弯曲的所述整形面130。优选地，在本申请实施例中，所述第 一整形件131和第二整形件132中上表面都包括向下向内凹陷的弧形表面。
相应地，弯曲所述感光芯片12的过程，包括：
弯曲所述感光芯片12直至所述感光芯片12的下表面122附着于所述弧形表面，以使得所述感光芯片12向下弯曲时形成与所述感光组件10的焦点成像面相适配的下表面。
如图30B所示，所述制造方法，进一步包括步骤：
在由所述第一整形件131、所述感光芯片12和所述线路板11所界定形成的容置空间100内形成散热件19，其中，所述散热件19附着于所述感光芯片12的下表面122的至少一部分。
优选地，在本申请实施例中，所述散热件19占满整个所述容置空间100，以使得所述感光芯片12的下表面122(对应于容置空间100的部分)完全地与所述散热件19相接触，通过这样的方式最大化地增大散热面积，提升散热性能。
在具体实施中，当所述散热材料190被实施为具有流体状的散热材料190时，在所述容置空间100内形成所述散热件19的过程，包括：将流体状的所述散热材料190通过所述开孔133注入至所述容置空间100内，以在固化成型后形成所述散热件19。
为了便于操作，在执行注入工艺时，可将所述感光组件10倒置以防止流体状的所述散热材料190所述开孔133流出。特别地，当所述开孔133的数量仅有一个时，为了平衡内外压强使得流体状的所述散热材料190能够被顺利注入所述容置空间100内，可在所述线路板11上进一步开设通气孔135。当然，当所述开孔133的数量超过一个时，所述吸气孔中除了被用于注入所述散热材料190的之外，其作用便相当于所述通气孔135。也就是说，当所述开孔133的数量超过一个时，所述吸气孔中至少之一形成所述通气孔135。
在所述散热件19成型后，可进一步地在所述线路板11底表面贴附加强板18，其中，优选地，所述加强板18由导热率较高的金属材料制成，通过这样的方式进一步增强所述感光组件10的散热性能。
在具体实施中，当所述散热材料190被实施为颗粒状的散热材料190。在所述容置空间100内形成所述散热件19的过程，包括：将颗粒状的所述散热材料190通过所述开孔133填充至所述容置空间100内，以及，在所 述线路板11底表面贴附加强板18以通过所述加强板18密封所述开孔133。优选地，所述加强板18由导热率较高的金属材料制成，以在密封所述开孔133的同时还进一步增强了所述感光组件10的散热性能。
进一步地，所述感光组件10的制造过程，还包括：将支架16设置于所述线路板11，并且，将滤光元件15安装于所述支架16。
具体来说，在COB工艺中，所述支架16被实施为传统的塑料支架16。相应地，设置于所述支架16于所述线路板11的过程，具体表现为：将所述塑料支架16贴装于所述线路板11。进而，将所述滤光元件15贴装于所述支架16。
在MOB工艺中，所述支架16被实施为模塑支架16A。相应地，设置所述支架16于所述线路板11的过程，包括：在所述线路板11上通过模塑工艺一体成型所述模塑支架16A，其中，所述模塑支架16A包覆所述线路板11的至少一部分和至少部分所述至少一电子元器件14。进而，将所述滤光元件15贴装于所述模塑支架16A。
值得一提的是，在MOB工艺中，所述第一整形件131和所述第二整形件132在所述模组支架16一体成型于所述线路板11的预设位置后，再安装于所述线路板11的预设位置。这样的制成顺序有利于工程实施。
在MOC工艺中，所述支架16被实施为模塑支架16B，相应地，设置所述支架16于所述线路板11的过程，包括：在所述线路板11上通过模塑工艺一体成型所述模塑支架16B，其中，所述模塑支架16B包覆所述线路板11的至少一部分、所述至少一电子元器件14，以及，所述感光芯片12的非感光区域1212的至少一部分。进而，将所述滤光元件15贴装于所述模塑支架16B。
为了防止在执行MOC工艺的过程中所述感光芯片12被注入的模塑材料所冲击而造成位置上的偏移，在执行MOC工艺以形成所述模塑支架16B之前，还包括在所述感光芯片12和所述第一整形件131的侧部施加侧包胶161，以使得所述侧包胶161包裹所述感光芯片12和所述第一整形件131的侧部，通过这样的方式，防止在执行模塑工艺过程中所述感光芯片12的位置发生偏移。
在IOC工艺中，所述支架16被实施为模塑支架16C，相应地，设置所述支架16与所述线路板11的过程，包括：叠置所述滤光元件15于所述感 光芯片12，以及，在所述线路板11一体成型所述模塑支架16C，其中，所述一体包覆所述线路板11的至少一部分、所述至少一电子元器件14、所述感光芯片12的非感光区域1212的至少一部分和所述滤光元件15的至少一部分。
值得一提的是，在MOB，MOC和IOC工艺中，所述模塑支架16的内侧面的形状由压块的形状决定。特别地，当所述压块的内侧面具有台阶状时，所述模塑支架16的内侧面也具有台阶状，以在所述模塑支架16的顶表面上形成用于安装所述滤光元件15的安装平台160。相应地，在这些示例中，所述滤光元件15安装于所述安装平台160。
还值得一提的是，在本申请实施例中，除了将所述滤光元件15支持于所述支架16(包括塑料支架16、模塑支架16A,16B，16C)、所述感光芯片12之外，还可以通过其他方式来安装所述滤光元件15，仅需将所述滤光元件15保持于所述感光组件10的感光路径即可。例如，在本申请实施例的其他示例中，所述感光组件10进一步包括滤光元件支架17，所述滤光元件支架17安装于所述支架16，并用于安装所述滤光元件15。再如，当所述感光组件10与光学镜头20相配合形成摄像模组时，所述滤光元件15还可以被支持于所述光学镜头20内，或者，以镀膜的形式形成于所述光学镜头20中透镜的表面。对此，并不为本申请所局限。
如图48A和48B所示，基于本申请实施例的所述感光组件的第二种制造过程被阐明，其用于制备如上所述的感光组件及其变形实施。
具体来说，如图48A所示，根据本申请实施例的所述感光组件10制造过程，包括步骤：
首先，提供一线路板11和一感光芯片12，其中，所述线路板11包括至少一开孔133。值得一提的是，所述线路板11上的所述开孔133也可以在形成所述容置空间100之后通过打孔工艺形成，对此，并不为本申请所局限。
接着，在所述线路板11上一体成型一第一整形件131和一第二整形件132，其中，所述第二整形件132的高度低于所述第一整形件131，通过这样的方式，所述第一整件形和所述第二整形件132界定形成下凹的一整形面130。
然后，将所述感光芯片12贴附于所述第一整形件131，通过这样的方式，在所述第一整形件131、所述线路板11和所述感光芯片12之间界定形成一容置空间100，其中，所述开孔133连通于所述容置空间100。
继而，通过所述开孔133吸出所述容置空间100内的气体，以在所述感光芯片12的上表面121和下表面之间产生压强差，从而迫使所述感光芯片12向下弯曲直到附着于所述第二整形件132，以使得所述感光芯片12的下表面122适配地附着于所述第一整形件131和所述第二整形件132界定形成的所述整形面130。
也就是说，相较于第一种制备过程，在第二种制备过程中，所述第一整形件131和所述第二整形件132一体成型于所述线路板11，而非先预制后贴装的方式。
具体来说，在本申请实施例中，在所述线路板11上一体成型一第一整形件131和一第二整形件132的过程，包括：
通过电镀成型工艺在所述线路板11上一体成型一第一整形件主体1311和一第二整形件主体1321；以及
在所述第一整形件主体1311和所述第二整形件主体1321上分别施加黏着剂1340，以通过所述第一整形件主体1311和所述黏着剂1340形成所述第一整形件131和通过所述第二整形件主体1321和所述黏着剂1340形成所述第二整形件132。
优选地，在本申请实施例中，所述第一整形件131应具有封闭形状(例如，被实施为具有“口”字形)，所述第二整形件132相对于所述感光芯片12的中心对称布置，并且，所述开孔133形成于所述线路板11的位置对应于所述感光芯片12的中心区域。或者，所述开孔133形成于所述线路板11的位置位于所述第一整形件131和所述第二整形件132之间，并且，所述开孔133形成于所述线路板11的位置相对于所述感光芯片12的中心对称布置。
值得一提的是，所述第二整形件132的高度设定与其与所述第一整形件131之间的相对位置关系有关。具体来说，由所述第一整形件131与所述第二整形件132界定形成的用于限定所述感光芯片12弯曲形状的所述整形面130的形状基于实际焦点平面的形状而设定。更明确地，当所述第二整形件132靠近所述第一整形件131时，所述第一整形件131与所述第二整形件 132的高度差应缩减(即，所述第二整形件132的高度应增加)；当所述第二整形件132远离所述第一整形件131时，所述第一整形件131与所述第二整形件132的高度差应增加(即，所述第二整形件132的高度应缩减)。优选地，所述第二整形件主体1321的顶表面向内向下弯曲。
值得一提的是，在本申请实施例中，所述整形面130的形状匹配于实际焦点平面形状，并不表示所述整形面130的形状与所述实际焦点平面的形状完全一致或者完全重合，其仅表示所述整形面130的形状趋向于与实际焦点平面的形状相一致。
特别地，在本申请实施例中，所述第一整形件131和第二整形件132中的至少一个的上表面包括向下向内凹陷的弧形表面，所述弧形表面配置为使得所述感光芯片12向下弯曲时形成与所述感光组件10的焦点成像面相适配的下表面122，以通过所述第一整形件131和所述第二整形件132的上表面形成向下弯曲的所述整形面130。优选地，在本申请实施例中，所述第一整形件131和第二整形件132中上表面都包括向下向内凹陷的弧形表面。
相应地，弯曲所述感光芯片12的过程，包括：
弯曲所述感光芯片12直至所述感光芯片12的下表面122附着于所述弧形表面，以使得所述感光芯片12向下弯曲时形成与所述感光组件10的焦点成像面相适配的下表面。
如图48B所示，所述感光组件10的制备过程，进一步包括步骤：
在由所述第一整形件131、所述感光芯片12和所述线路板11所界定形成的容置空间100内形成散热件19，其中，所述散热件19附着于所述感光芯片12的下表面122的至少一部分。
优选地，在本申请实施例中，所述散热件19占满整个所述容置空间100，以使得所述感光芯片12的下表面122(对应于容置空间100的部分)完全地与所述散热件19相接触，通过这样的方式最大化地增大散热面积，提升散热性能。
在具体实施中，当所述散热材料190被实施为具有流体状的散热材料190时，在所述容置空间100内形成所述散热件19的过程，包括：将流体状的所述散热材料190通过所述开孔133注入至所述容置空间100内，以在固化成型后形成所述散热件19。
为了便于操作，在执行注入工艺时，可将所述感光组件10倒置以防止 流体状的所述散热材料190所述开孔133流出。特别地，当所述开孔133的数量仅有一个时，为了平衡内外压强使得流体状的所述散热材料190能够被顺利注入所述容置空间100内，可在所述线路板11上进一步开设通气孔135。当然，当所述开孔133的数量超过一个时，所述吸气孔中除了被用于注入所述散热材料190的之外，其作用便相当于所述通气孔135。也就是说，当所述开孔133的数量超过一个时，所述吸气孔中至少之一形成所述通气孔135。
在所述散热件19成型后，可进一步地在所述线路板11底表面贴附一加强板18，其中，优选地，所述加强板18由导热率较高的金属材料制成，通过这样的方式进一步增强所述感光组件10的散热性能。
在具体实施中，当所述散热材料190被实施为颗粒状的散热材料190。在所述容置空间100内形成所述散热件19的过程，包括：将颗粒状的所述散热材料190通过所述开孔133填充至所述容置空间100内，以及，在所述线路板11底表面贴附所述加强板18以通过所述加强板18密封所述开孔133。优选地，所述加强板18由导热率较高的金属材料制成，以在密封所述开孔133的同时还进一步增强了所述感光组件10的散热性能。
进一步地，所述感光组件10的制造过程，还包括：将支架16设置于所述线路板11，并且，将滤光元件15安装于所述支架16。
具体来说，在COB工艺中，所述支架16被实施为传统的塑料支架16。相应地，设置于所述支架16于所述线路板11的过程，具体表现为：将所述塑料支架16贴装于所述线路板11。进而，将所述滤光元件15贴装于所述支架16。
在MOB工艺中，所述支架16被实施为模塑支架16A。相应地，设置所述支架16于所述线路板11的过程，包括：在所述线路板11上通过模塑工艺一体成型所述模塑支架16A，其中，所述模塑支架16A包覆所述线路板11的至少一部分和至少部分所述至少一电子元器件14。进而，将所述滤光元件15贴装于所述模塑支架16A。
值得一提的是，在MOB工艺中，所述第一整形件131和所述第二整形件132在所述模组支架16一体成型于所述线路板11的预设位置后，再安装于所述线路板11的预设位置。这样的制成顺序有利于工程实施。
在MOC工艺中，所述支架16被实施为模塑支架16B，相应地，设置所 述支架16于所述线路板11的过程，包括：在所述线路板11上通过模塑工艺一体成型所述模塑支架16B，其中，所述模塑支架16B包覆所述线路板11的至少一部分、所述至少一电子元器件14，以及，所述感光芯片12的非感光区域1212的至少一部分。进而，将所述滤光元件15贴装于所述模塑支架16B。
为了防止在执行MOC工艺的过程中所述感光芯片12被注入的模塑材料所冲击而造成位置上的偏移，在执行MOC工艺以形成所述模塑支架16B之前，还包括在所述感光芯片12和所述第一整形件131的侧部施加侧包胶161，以使得所述侧包胶161包裹所述感光芯片12和所述第一整形件131的侧部，通过这样的方式，防止在执行模塑工艺过程中所述感光芯片12的位置发生偏移。进一步，所述侧包胶161也可以起到缓冲作用，既减小所述模塑支架16B传递至所述感光芯片12的应力。
在IOC工艺中，所述支架16被实施为模塑支架16C，相应地，设置所述支架16与所述线路板11的过程，包括：叠置所述滤光元件15于所述感光芯片12，以及，在所述线路板11一体成型所述模塑支架16C，其中，所述一体包覆所述线路板11的至少一部分、所述至少一电子元器件14、所述感光芯片12的非感光区域1212的至少一部分和所述滤光元件15的至少一部分。
值得一提的是，在MOB，MOC和IOC工艺中，所述模塑支架16的内侧面的形状由压块的形状决定。特别地，当所述压块的内侧面具有台阶状时，所述模塑支架16的内侧面也具有台阶状，以在所述模塑支架16的顶表面上形成用于安装所述滤光元件15的安装平台160。相应地，在这些示例中，所述滤光元件15安装于所述安装平台160。
还值得一提的是，在本申请实施例中，除了将所述滤光元件15支持于所述支架16(包括塑料支架16、模塑支架16A,16B，16C)、所述感光芯片12之外，还可以通过其他方式来安装所述滤光元件15，仅需将所述滤光元件15保持于所述感光组件10的感光路径即可。例如，在本申请实施例的其他示例中，所述感光组件10进一步包括滤光元件支架17，所述滤光元件支架17安装于所述支架16，并用于安装所述滤光元件15。再如，当所述感光组件10与光学镜头20相配合形成摄像模组时，所述滤光元件15还可以被支持于所述光学镜头20内，或者，以镀膜的形式形成于所述光学 镜头20中透镜的表面。对此，并不为本申请所局限。
综上，基于本申请实施例的所述感光组件制造方法被阐明，其通过特殊的制造工艺将平面状的感光芯片弯曲成适配于实际焦点成像面的形状，以提高所述摄像模组的成像质量。并且，在所述感光芯片的下表面形成用于加强散热的散热件，以提高散热性能。
示意性摄像模组二
以下具体介绍将如上所述感光组件10应用于摄像模组。本领域技术人员知晓，摄像模组有动焦摄像模组和定焦摄像模组。
当所述摄像模组被实施为定焦摄像模组时，所述摄像模组包括如上所述的感光组件和光学镜头20，其中，所述光学镜头20被保持于所述感光组件10的感光路径。具体来说，通常所述光学镜头20安装于所述支架16，以将所述光学镜头20保持于所述感光组件10的感光组件，其具体效果可参见如图49至如图53。值得一提的是，附图中仅示意了本申请实施例中几款典型的感光组件，其相应的变形实施并未一一列举，对此本领域技术人员应能充分理解。
在成像过程中，外界光线先穿过所述光学镜头20，在被所述滤光元件15过滤后，被所述感光芯片12所采集。特别地，在本申请实施例中，所述感光芯片12基于实际焦点平面的形状被弯曲，通过这样的方式使得所述摄像模组的成像质量得以提高。
当所述摄像模组被实施为动焦摄像模组时，如图54所示，所述摄像模组包括如上所述的感光组件、光学镜头20和驱动元件30，其中，所述驱动元件30安装于所述支架16，所述光学镜头20安装于所述驱动元件30，这样，所述驱动元件30能承载着所述光学镜头20沿着所述感光组件10的感光路径移动，以实现动焦功能。值得一提的是，附图中仅示意了本申请实施例中一款典型的感光组件，其相应的变形实施并未一一列举，对此本领域技术人员应能充分理解。
综上，基于本申请实施例的所述摄像模组被阐明，其通过特殊的制造工艺将平面状的感光芯片12弯曲成适配于实际焦点成像面的形状，通过这样的方式，提高所述摄像模组的成像质量。
本领域的技术人员应理解，上述描述及附图中所示的本发明的实施例只作为举例而并不限制本发明。本发明的目的已经完整并有效地实现。本发明的功能及结构原理已在实施例中展示和说明，在没有背离所述原理下，本发明的实施方式可以有任何变形或修改。

Claims (54)

  1. 一种感光组件，其特征在于，包括：
    线路板；
    电连接于所述线路板的感光芯片；以及
    设置于所述线路板的整形部件，其中，所述感光芯片的下表面附着于所述整形部件，以与所述整形部件和所述线路板形成一容置空间，其中，所述线路板具有贯穿地形成于其中且连通于所述容置空间的至少一开孔，其中，所述容置空间和所述开孔配置为使得在组装所述感光组件的过程中所述感光芯片向下弯曲。
  2. 根据权利要求1所述的感光组件，其中，所述至少一开孔配置为使得至少一吸附装置能够藉由所述至少一开孔伸入所述容置空间并附着于所述感光芯片的下表面的至少一部分，以通过拉力使得所述感光芯片向下弯曲。
  3. 根据权利要求2所述的感光组件，其中，所述整形部件包括第一整形件和第二整形件，所述第一整形件与所述感光芯片和所述线路板形成所述容置空间，所述第二整形件设置于所述线路板且位于所述容置空间内，所述第二整形件的高度低于所述第一整形件。
  4. 根据权利要求3所述的感光组件，其中，所述第一整形件和第二整形件中的至少一个的上表面包括向下向内凹陷的弧形表面，所述弧形表面配置为使得所述感光芯片向下弯曲时形成与所述感光组件的焦点成像面相适配的下表面。
  5. 根据权利要求2所述的感光组件，其中，所述开孔形成于所述线路板的位置对应于所述感光芯片的中心区域。
  6. 根据权利要求5所述的感光组件，其中，所述吸附装置附着于所述感光芯片的下表面的位置为所述感光芯片的下表面的中心区域。
  7. 根据权利要求4所述的感光组件，其中，所述第二整形件相对于所述感光芯片的中心对称布置。
  8. 根据权利要求7所述的感光组件，其中，所述第二整形件对称地布置于所述感光芯片的较长边所设定的中心线的两侧。
  9. 根据权利要求3所述的感光组件，其中，所述第一整形件的横截面形状为封闭环形。
  10. 根据权利要求9所述的感光组件，其中，所述第二整形件的横截面形状为封闭环形，其中，所述整形部件还包括设置于所述第一整形件和所述第二整形件之间的黏着剂，其中，所述黏着剂的高度高于所述第二整形件的高度。
  11. 根据权利要求3所述的感光组件，其中，所述第一整形件包括第一整形件主体和施加于所述第一整形件主体上的黏着剂，以及，所述第二整形件包括第二整形件主体和施加于所述第二整形件主体上的黏着剂。
  12. 根据权利要求10或11所述的感光组件，其中，所述第一整形件主体和所述第二整形件主体一体成型于所述线路板的顶表面。
  13. 根据权利要求12所述的感光组件，其中，所述第一整形件主体和所述第二整形件主体预制而成，并被安装于所述线路板。
  14. 根据权利要求3所述的感光组件，进一步包括散热件，其中，所述散热件形成于所述容置空间内，且附着于所述感光芯片的下表面的至少一部分。
  15. 根据权利要求14所述的感光组件，其中，所述散热件通过散热材料经由所述散热件通过散热材料经由所述至少一开孔进入所述容置空间而形成。
  16. 一种摄像模组，其特征在于，包括：
    光学镜头；以及
    如权利要求1-15任一所述的摄像模组，其中，所述光学镜头被保持于所述感光组件的感光路径。
  17. 根据权利要求16所述的摄像模组，其中，所述感光芯片的下表面的弯曲形状适配于所述摄像模组的实际焦点成像面的形状。
  18. 一种感光组件制造方法，其特征在于，包括：
    提供一线路板、一感光芯片、一第一整形件和一第二整形件，其中，所述线路板包括至少一开孔；
    将所述第一整形件和所述第二整形件设于所述线路板，其中，所述第二整形件的高度小于所述第一整形件；
    将所述感光芯片的下表面附着于所述第一整形件，以与所述整形部件和所述线路板形成一容置空间，其中，所述至少一开孔连通于所述容置空间，其中，所述第二整形件位于所述容置空间内；
    通过所述开孔将吸附装置附着于所述感光芯片的下表面的至少一部分；以及，
    通过所述吸附装置向下拉所述感光芯片，以使得所述感光芯片向下弯曲。
  19. 根据权利要求18所述的制造方法，其中，所述第一整形件和第二整形件中的至少一个的上表面包括向下向内凹陷的弧形表面，其中，通过所述吸附装置向下拉所述感光芯片，以使得所述感光芯片向下弯曲，包括：
    弯曲所述感光芯片直至所述感光芯片的下表面附着于所述弧形表面，以使得所述感光芯片向下弯曲时形成与所述感光组件的焦点成像面相适配的下表面。
  20. 根据权利要求18所述的制造方法，其中，在将所述第一整形件和所述第二整形件设于所述线路板之后，以及，在将所述感光芯片的下表面附着于所述第一整形件，以与所述整形部件和所述线路板形成一容置空间之前， 还包括：
    在所述第一整形件和所述第二整形件之间施加黏着剂，其中，所述黏着剂的上表面高度低于所述第二整形件。
  21. 根据权利要求18所述的制造方法，其中，所述开孔形成于所述线路板的位置对应于所述感光芯片的中心区域。
  22. 根据权利要求18所述的制造方法，进一步包括：
    通过所述开孔注入散热材料至所述容置空间，以在所述容置空间内形成所述散热件，其中，所述散热件附着于所述感光芯片的下表面的至少一部分。
  23. 一种感光组件制造方法，其特征在于，包括：
    提供一线路板和一感光芯片，其中，所述线路板包括至少一开孔；
    在所述线路板上一体成型一第一整形件和一第二整形件，其中，所述第二整形件的高度小于所述第一整形件；
    将所述感光芯片的下表面附着于所述第一整形件，以与所述整形部件和所述线路板形成一容置空间，其中，所述至少一开孔连通于所述容置空间，其中，所述第二整形件位于所述容置空间内；
    通过所述开孔将吸附装置附着于所述感光芯片的下表面的至少一部分；以及，
    通过所述吸附装置向下拉所述感光芯片，以使得所述感光芯片向下弯曲。
  24. 根据权利要求23所述的制造方法，其中，所述第一整形件和第二整形件中的至少一个的上表面包括向下向内凹陷的弧形表面，其中，通过所述吸附装置向下拉所述感光芯片，以使得所述感光芯片向下弯曲，包括：
    弯曲所述感光芯片直至所述感光芯片的下表面附着于所述弧形表面，以使得所述感光芯片向下弯曲时形成与所述感光组件的焦点成像面相适配的下表面。
  25. 根据权利要求23所述的制造方法，其中，在所述线路板上一体成型一第一整形件和一第二整形件，包括：
    通过电镀工艺在所述线路板上一体成型一第一整形件主体和一第二整形件主体；以及
    在所述第一整形件主体上和所述第二整形件主体上分别施加黏着剂。
  26. 根据权利要求23所述的制造方法，其中，在所述线路板上一体成型一第一整形件和一第二整形件之后，以及，在将所述感光芯片的下表面附着于所述第一整形件，以与所述整形部件和所述线路板形成一容置空间之前，还包括：
    在所述第一整形件和所述第二整形件之间施加黏着剂，其中，所述黏着剂的上表面高度低于所述第二整形件。
  27. 根据权利要求23所述的制造方法，其中，所述第一整形件和第二整形件中的至少一个的上表面包括向下向内凹陷的弧形表面，其中，通过所述吸附装置向下拉所述感光芯片，以使得所述感光芯片向下弯曲，包括：
    弯曲所述感光芯片直至所述感光芯片的下表面附着于所述弧形表面，以使得所述感光芯片向下弯曲时形成与所述感光组件的焦点成像面相适配的下表面。
  28. 根据权利要求23所述的制造方法，其中，所述开孔形成于所述线路板的位置对应于所述感光芯片的中心区域。
  29. 根据权利要求23所述的制造方法，进一步包括：
    通过所述开孔注入散热材料至所述容置空间，以在所述容置空间内形成所述散热件，其中，所述散热件附着于所述感光芯片的下表面的至少一部分。
  30. 一种感光组件，其特征在于，包括：
    线路板；
    电连接于所述线路板的感光芯片；以及
    设置于所述线路板的整形部件，其中，所述感光芯片的下表面附着于所述整形部件，以与所述整形部件和所述线路板形成一容置空间，所述容置空间配置为使得在组装所述感光组件的过程中所述感光芯片向下弯曲。
  31. 根据权利要求30所述的感光组件，其中，所述整形部件包括第一整形件和第二整形件，所述第一整形件与所述感光芯片和所述线路板形成所述容置空间，所述第二整形件设置于所述线路板且位于所述容置空间内，所述第二整形件的高度低于所述第一整形件。
  32. 根据权利要求31所述的感光组件，其中，所述第一整形件和第二整形件中的至少一个的上表面包括向下向内凹陷的弧形表面，所述弧形表面配置为使得所述感光芯片向下弯曲时形成与所述感光组件的焦点成像面相适配的下表面。
  33. 根据权利要求30所述的感光组件，其中，所述线路板具有贯穿地形成于其中且连通于所述容置空间的至少一开孔，所述至少一开孔配置为在组装所述感光组件的过程中时排出所述容置空间内的气体以使得所述感光芯片向下弯曲。
  34. 根据权利要求33所述的感光组件，其中，所述开孔形成于所述线路板的位置对应于所述感光芯片的中心区域。
  35. 根据权利要求32所述的感光组件，其中，所述第二整形件相对于所述感光芯片的中心对称布置。
  36. 根据权利要求35所述的感光组件，其中，所述第二整形件对称地布置于所述感光芯片的较长边所设定的中心线的两侧。
  37. 根据权利要求32所述的感光组件，其中，所述第一整形件的横截面形状为封闭环形。
  38. 根据权利要求32所述的感光组件，其中，所述整形部件还包括施加于所述第一整形件和第二整形件之间的黏着剂，其中，所述黏着剂的高度高于所述第二整形件的上表面。
  39. 根据权利要求32所述的感光组件，其中，所述第一整形件包括第一整形件主体和施加于所述第一整形件主体上的黏着剂，以及，所述第二整形件包括第二整形件主体和施加于所述第二整形件主体上的黏着剂。
  40. 根据权利要求39所述的感光组件，其中，所述第一整形件主体和所述第二整形件主体一体成型于所述线路板的顶表面。
  41. 根据权利要求39所述的感光组件，其中，所述第一整形件主体和所述第二整形件主体预制而成，并被安装于所述线路板。
  42. 根据权利要求33所述的感光组件，进一步包括散热件，其中，所述散热件形成于所述容置空间内，且附着于所述感光芯片的下表面的至少一部分。
  43. 根据权利要求42所述的感光组件，其中，所述散热件通过散热材料经由所述至少一开孔进入所述容置空间而形成。
  44. 一种摄像模组，其特征在于，包括：
    光学镜头；以及
    如权利要求30-43任一所述的感光组件，其中，所述光学镜头被保持于所述感光组件的感光路径。
  45. 根据权利要求44所述的摄像模组，其中，所述感光芯片的下表面的弯曲形状适配于所述摄像模组的实际焦点成像面的形状。
  46. 一种感光组件制造方法，其特征在于，包括：
    提供一线路板、一感光芯片、一第一整形件和一第二整形件，其中，所述线路板包括至少一开孔；
    将所述第一整形件和所述第二整形件设于所述线路板，其中，所述第二整形件的高度小于所述第一整形件；
    将所述感光芯片的下表面附着于所述第一整形件，以与所述整形部件和所述线路板形成一容置空间，其中，所述至少一开孔连通于所述容置空间，其中，所述第二整形件位于所述容置空间内；以及
    通过所述至少一开孔排出所述容置空间内的气体，以在所述感光芯片的上表面和下表面之间产生压强差，以使得所述感光芯片向下弯曲。
  47. 根据权利要求46所述的制造方法，其中，所述第一整形件和第二整形件中的至少一个的上表面包括向下向内凹陷的弧形表面，其中，通过所述至少一开孔排出所述容置空间内的气体，以在所述感光芯片的上表面和下表面之间产生压强差，以使得所述感光芯片向下弯曲，包括：
    弯曲所述感光芯片直至所述感光芯片的下表面附着于所述弧形表面，以使得所述感光芯片向下弯曲时形成与所述感光组件的焦点成像面相适配的下表面。
  48. 根据权利要求46所述的制造方法，其中，所述开孔形成于所述线路板的位置对应于所述感光芯片的中心区域。
  49. 根据权利要求46所述的制造方法，进一步包括：
    通过所述开孔注入散热材料至所述容置空间，以在所述容置空间内形成所述散热件，其中，所述散热件附着于所述感光芯片的下表面的至少一部分。
  50. 一种感光组件制造方法，其特征在于，包括：
    提供一线路板和一感光芯片，其中，所述线路板包括至少一开孔；
    在所述线路板上一体成型一第一整形件和一第二整形件，其中，所述第二整形件的高度小于所述第一整形件；
    将所述感光芯片的下表面附着于所述第一整形件，以与所述整形部件和所述线路板形成一容置空间，其中，所述至少一开孔连通于所述容置空间，其中，所述第二整形件位于所述容置空间内；以及
    通过所述至少一开孔排出所述容置空间内的气体，以在所述感光芯片的上表面和下表面之间产生压强差，以使得所述感光芯片向下弯曲。
  51. 根据权利要求50所述的制造方法，其中，在所述线路板上一体成型一第一整形件和一第二整形件，包括：
    通过电镀工艺在所述线路板上一体成型一第一整形件主体和一第二整形件主体；以及
    在所述第一整形件主体上和所述第二整形件主体上分别施加黏着剂。
  52. 根据权利要求50所述的制造方法，其中，所述第一整形件和第二整形件中的至少一个的上表面包括向下向内凹陷的弧形表面，其中，通过所述至少一开孔排出所述容置空间内的气体，以在所述感光芯片的上表面和下表面之间产生压强差，以使得所述感光芯片向下弯曲，包括：
    弯曲所述感光芯片直至所述感光芯片的下表面附着于所述弧形表面，以使得所述感光芯片向下弯曲时形成与所述感光组件的焦点成像面相适配的下表面。
  53. 根据权利要求50所述的制造方法，其中，所述开孔形成于所述线路板的位置对应于所述感光芯片的中心区域。
  54. 根据权利要求50所述的制造方法，进一步包括：
    通过所述开孔注入散热材料至所述容置空间，以在所述容置空间内形成所述散热件，其中，所述散热件附着于所述感光芯片的下表面的至少一部分。
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