WO2018121526A1 - 小型零件的电镀装置 - Google Patents

小型零件的电镀装置 Download PDF

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Publication number
WO2018121526A1
WO2018121526A1 PCT/CN2017/118615 CN2017118615W WO2018121526A1 WO 2018121526 A1 WO2018121526 A1 WO 2018121526A1 CN 2017118615 W CN2017118615 W CN 2017118615W WO 2018121526 A1 WO2018121526 A1 WO 2018121526A1
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WO
WIPO (PCT)
Prior art keywords
plating
cylinder
disposed
electroplating
engaging portion
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PCT/CN2017/118615
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English (en)
French (fr)
Inventor
黄愽道
刘耀崇
Original Assignee
汉玛科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 汉玛科技股份有限公司 filed Critical 汉玛科技股份有限公司
Priority to EP17887748.6A priority Critical patent/EP3578694A4/en
Priority to CN201780045165.2A priority patent/CN110139949B/zh
Priority to KR1020197007693A priority patent/KR102244497B1/ko
Priority to JP2019524505A priority patent/JP6768953B2/ja
Publication of WO2018121526A1 publication Critical patent/WO2018121526A1/zh

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/16—Apparatus for electrolytic coating of small objects in bulk
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/16—Apparatus for electrolytic coating of small objects in bulk
    • C25D17/22—Apparatus for electrolytic coating of small objects in bulk having open containers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/16—Apparatus for electrolytic coating of small objects in bulk
    • C25D17/18—Apparatus for electrolytic coating of small objects in bulk having closed containers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks

Definitions

  • the present invention relates to a plating apparatus, and more particularly to a plating apparatus for a small part.
  • Hanging plating is a plating method in which parts are mounted on a hanger for plating deposition, and is generally used for plating of large-sized parts.
  • barrel plating is generally used for small parts that cannot be or are not suitable for hanging due to factors such as shape and size.
  • Barrel plating also known as roller plating, is to place a certain number of small parts in a special roller and deposit various metal or alloy coatings on the surface of the part in an indirect conductive manner to achieve surface protection, decoration or functionality. the goal of.
  • the plating method of the barrel plating parts has undergone a large change, in which the hanging plating is performed in a state in which the parts are separately packaged, and the barrel plating is performed in a state where the parts are concentrated and separated from each other, in this state.
  • the mixing cycle of the parts is generated during the process; in addition, the plating is performed in a state where the parts are completely exposed, and the barrel plating is performed in a closed drum (having a hole in the wall plate) and a solution having a low concentration of the solution.
  • the change in the way the part is plated brings two major defects to the barrel plating, namely the defects caused by the mixing cycle and the structural defects of the barrel plating.
  • the above defects have a serious impact on the production efficiency of the barrel plating and the improvement of the product quality, so that the superiority of the barrel plating cannot be fully exerted.
  • the current barrel plating technique is to connect the drum to a driving device. After loading the workpiece to be plated in the drum, the driving device is operated in the plating tank, and the workpiece to be plated is turned over to promote the electrolysis. The liquid is in sufficient contact to produce an electrochemical action. Since many of the needle-like or flaky microelectronic product parts are surface-plated, usually in a plating cylinder, there are many kinds of plating cylinders in the prior art, and most of the plating cylinders are Driven by horizontal drive units, these plating drums generally have problems of complicated structure, difficulty in solution replacement, low plating efficiency, and high maintenance cost.
  • a plating drum is disposed at a lower end of the drive shaft for enabling the electroplating tank provided with the anode to be rotationally driven, and flowing from the inside of the plating drum to the outside by the centrifugal force acting when the plating drum is rotationally driven. Further, the inside of the plating drum flows into the inside, but the plating drum is fixed to the lower end of the drive shaft, and cannot be moved and exchanged, so that the plating process of the automatic shifting and changing groove cannot be achieved.
  • the main object of the present invention is to provide a plating apparatus for a small-sized component, which is configured to dispose the driver under the plating tank and to rotate the plating cylinder by engaging the engaging portion and the driving motor to make the plating cylinder easy. Moving from one plating tank to another plating tank to carry out the shifting operation of the shifting and replacing, and the forced vortex blade at the bottom of the plating drum makes the plating liquid exchange fast, overcomes the defects caused by the mixing cycle and the structural defects of the barrel plating, and further Improve the plating speed and efficiency of the small parts.
  • the present invention provides a plating apparatus for small parts, comprising at least one plating unit; each plating unit comprises a moving frame, a plating cylinder, a plating tank and a driver; the plating cylinder has a cylinder a shaft, a rotating shaft and a engaging portion, wherein a first end of the rotating shaft is disposed on the cylindrical body, the engaging portion is disposed at a bottom of the cylindrical body; and the plating tank is provided with a plating The liquid is used to soak the plating drum; the driver is disposed in the plating tank for driving the engaging portion to rotate to drive the plating drum to rotate to generate centrifugal force.
  • the driver has a driving motor for engaging with the engaging portion of the plating drum to drive the cylinder to rotate.
  • the moving frame has a fixed plate, two side plates, two auxiliary rods and a rotary joint, the side plates are combined on two sides of the fixed plate, and the auxiliary rod is disposed at Between the side plates, the cylinder is located above the auxiliary rod, and the rotary joint is pivotally connected to the fixing plate for combining with the second end of the rotating shaft.
  • the moving frame further has two cathode seats, and the cathode seats are disposed on two sides of a bottom of the fixing plate for electrically connecting with a cathode ring.
  • the cylinder has a base, a surrounding wall and an upper cover, the base is combined with the surrounding wall, and the cathode ring is formed in the surrounding wall, the rotating shaft
  • the upper cover is coupled from the base and extends outward.
  • the plating apparatus further has a leakage plate disposed on the driving motor for receiving the liquid leaked from the plating tank.
  • the plating cylinder by rotating the plating cylinder by disposing the driver under the plating tank and by engaging the engaging portion and the driving motor, not only the plating cylinder is easily moved and replaced.
  • the plating speed and efficiency of the small parts can also be improved, and the structure of the electroplating apparatus of the small parts is simple, so that the subsequent maintenance cost is low.
  • FIG. 1 and 2 are schematic views showing a partial structure of a first preferred embodiment of a plating apparatus for a small part according to the present invention.
  • Figure 3 is a perspective view showing a partial structure of a second preferred embodiment of the electroplating apparatus for small parts according to the present invention.
  • Figure 4 is a cross-sectional view taken along line A-A of Figure 3;
  • Figure 5 is a schematic view showing a second plating bath according to a second preferred embodiment of the electroplating apparatus for small parts according to the present invention.
  • a first preferred embodiment of a plating apparatus for a small part of the present invention is used for electroplating or electroless plating of a plurality of small parts, such as chip type resistors, inductors, capacitors, and connections. Instruments, precision parts, etc.
  • the electroplating apparatus of the small part includes a body 101 and at least one or more plating units 102. The detailed construction, assembly relationship, and operation principle of each component will be described in detail below.
  • the electroplating apparatus of the small part is provided with a plating unit 102 on the base body 101, and each plating unit 102 includes a plating cylinder 2, a plating tank 3, and a driver. 4 and a mobile rack 5. It should be noted that, in other embodiments, a plurality of plating units 102 may be disposed on the body 101, which is not limited to the embodiment.
  • the plating drum 2 has a cylinder 21, a rotating shaft 22, an engaging portion 23 and a current carrying layer 24, wherein a first end 221 of the rotating shaft 22 is disposed at the The engaging portion 23 is provided at a bottom portion of the cylindrical body 21 on the cylindrical body 21.
  • the cylinder 21 has a base 211, a surrounding wall 212 and an upper cover 213. The tenon of the base 211 is engaged with the surrounding wall 212, and a cathode is formed in the surrounding wall 212.
  • the upper cover 213 covers the surrounding wall 212 to define an internal space (not shown), and the current transmission layer 24 is disposed on the base 211 of the cylinder 21, and the rotating shaft 22
  • the base 211 is coupled to the upper cover 213 and extends outward.
  • the plating tank 3 is a rectangular container in which a partition 103 is disposed.
  • the upper portion of the partition 103 is used for accommodating a plating solution, and the plating drum 2 can be immersed in the chamber.
  • one or more anode baskets 103 can be immersed.
  • the driver 4 is disposed below the bottom of the plating tank 3 for driving the engaging portion 23 to rotate to drive the plating drum 2 to rotate; and the driver 4 has a driving motor 41 and an electrode joint 42.
  • the driving motor 41 is a DC driving motor for engaging with the engaging portion 23 of the plating drum 2, so that the tubular body 21 is engaged by the engaging portion. 23 is rotated and rotated, for example, a jaw of the engaging portion 23 is engaged with a groove of the driving motor 41; the electrode connector 42 is disposed on the driving motor 41 for The cathode is electrically connected.
  • the plating drum 2 further has a cathode conductor 25 which is disposed in the engaging portion 23 for electrically contacting the electrode tab 42.
  • the moving frame 5 is combined on the seat body 101 and used to move on the seat body 101, and is located at a top of the plating tank 3, and by moving the The moving frame 5 can pull the plating drum 2 away from the plating tank 3 and place it in another plating tank (not shown); in addition, a second end 222 of the rotating shaft 22 is pivotally connected to the The frame 5 is moved, and the engaging portion 23 is located below the first end 221.
  • the moving frame 5 has a fixing plate 51, two side plates 52, two alignment blocks 53, two auxiliary rods 54 and a cover body 55, wherein the fixing plate 51 is used for the rotating shaft 22 The second end 222 is pivotally connected, and the two side plates 52 are combined on two sides of the fixing plate 51.
  • the two pairs of the positioning blocks 53 are disposed on two sides of the fixing plate 51, and are located on the two side plates. 52, the two pairs of blocks 53 are respectively fixed on the side plate 52 for alignment; the two auxiliary rods 54 are disposed between the side plates 52, so that the cylinder 21 is located at the side Above the auxiliary lever 54, the cover 55 is screwed to the first end 221 of the rotating shaft 22 to be fixed on the fixing plate 51.
  • the base 101 has a lifting base 7, wherein the moving frame 5 is disposed on the lifting base 7, and the moving frame 5 is driven by the lifting base 7 Moving between a soaking position of the plating tank 3 and a preparation position away from the plating tank 3.
  • an inner wall surrounding the wall 212 of the cylinder 21 of the plating drum 2 may be provided with the cathode ring 210, and the cathode ring 210 may be connected to a cathode conductor in the engaging portion 23. 25, and electrically connected to the electrode joint 42, and the small part in the cylinder 21 is driven onto the surface of the cathode ring by the centrifugal force of the plating drum 2 during rotation.
  • the current transport layer 24 is made of titanium metal or titanium-plated, titanium-sprayed material
  • the cylinder 21 is made of a plastic material
  • the current transport layer 24 and the cylinder An intermediate layer (not shown) is disposed between the bodies 21, and the intermediate layer is made of a plastic material.
  • the plating drum 2 is intermittently driven by the engaging portion 23 and the driving motor 41 by being disposed under the bottom of the plating tank 3. Rotating and electrically connecting to the electrode joint 42 through the surface of the cathode ring, while the small part in the barrel 21 is driven to the side by the centrifugal force of the plating drum 2 during rotation On the surface of the cathode ring, the effect of uniform plating on the surface of the small part is achieved.
  • FIG. 3, FIG. 4 and FIG. 5, are a second preferred embodiment of the electroplating apparatus for the small parts of the present invention, and substantially follow the same component names and drawing numbers of the above preferred embodiment, but the difference between the two.
  • the moving frame 5 can be moved by an external device, such as a robot arm, so that one of the plating drums 2 can be moved to another plating tank 3'; further, the plating drum 2
  • Another power line guide ring 26 is disposed in the barrel 21 and spaced apart from the surrounding wall 212.
  • the moving frame 5 has a fixing plate 51, two side plates 52, two auxiliary rods 54, and two grips.
  • a holding member 56 a rotary joint 57 and two cathode seats 58, wherein the side plates 52 are combined on both sides of the fixing plate 51, and the auxiliary rod 54 is disposed between the side plates 52, so that the tube
  • the body 21 is located on the auxiliary rod 54.
  • the holding members 56 are respectively disposed on two sides of a top surface of the fixing plate 51.
  • the rotary joint 57 is pivotally connected to the fixing plate 51 for Combined with the second end 222 of the rotating shaft 22, the cathode seat 58 is disposed at a bottom of the fixing plate 51
  • the two sides, a cathode lead for passing through the shaft 5922 is connected to the cathode 210 is electrically ring.
  • the bottom of the cylinder 21 has a forced vortex blade for exchanging the plating solution therein
  • the drive motor 41 is disposed below the bottom of the plating tank 3
  • the plating apparatus has another
  • the draining disk 43 is disposed between the driving motor 41 and the bottom of the plating tank 3 for receiving the liquid leaked from the plating tank 3.
  • the rotation of the rotary joint 57 allows the cylinder 21 to be separated from the rotating shaft 22 from the moving frame 5, and the cathode holder 58 on both sides of the bottom of the fixing plate 51 is
  • the cathode ring 210 can be electrically connected, and when the fixing plate 51 is removed, a power failure is formed.
  • the cathode ring 210 is rotationally accelerated to a specified rotational speed, the small part (the object to be plated) in the cylindrical body 21 is pressed against the cathode ring 210 by centrifugal force, and is supplied with electricity for electroplating.
  • the cathode ring 210 After the time is turned off and the cathode ring 210 is decelerated to a low rotation speed, the small parts (the object to be plated) in the cylinder 21 are mixed by gravity on the bottom of the barrel 21, and then the After the small parts (the objects to be plated) are mixed, the cathode ring 210 is rotated and accelerated to a predetermined rotation speed, so that the small parts (the object to be plated) are intermittently mixed at a low speed and accelerated, and the mixture is mixed at a low speed and accelerated, thereby further The surface of the small part (the object to be plated) can have a more uniform plating effect.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

本发明公开一种小型零件的电镀装置，包含一个或以上的电镀单元，每一个电镀单元具有一电镀滚筒、一电镀槽、一驱动器及一移动架；所述驱动器是设置在所述电镀槽内，用以带动所述电镀滚筒作间歇性旋转。所述移动架组合在所述电镀槽的一顶部，通过搬移所述移动架可将所述电镀滚筒自所述电镀槽抽离，并放置于另一电镀槽中，其中可扩充多个电镀槽，达成自动连续生产的目的。

Description

小型零件的电镀装置 技术领域
本发明是涉及一种电镀装置，特别是关于一种小型零件的电镀装置。
背景技术
通常情况下电镀有两种方式，一种是挂镀，另一种是滚镀。挂镀是将零件装在挂具上进行镀层沈积处理的一种电镀方式，一般用于大尺寸零件的电镀。而对于因形状、大小等因素影响无法或不宜装挂的小零件，则一般采用滚镀。滚镀亦称滚筒电镀，它是将一定数量的小零件置于专用滚筒内、在滚动状态下以间接导电方式在零件表面沈积各种金属或合金镀层，以达到表面防护、装饰或功能性的目的。与挂镀相比，滚镀零件的受镀方式发生了较大改变，其中挂镀在零件单独分装的状态下进行，而滚镀在零件集中且时合时离的状态下进行，在这个过程中产生了零件的混合周期；另外，挂镀在零件完全暴露的状态下进行，而滚镀在封闭的(虽然壁板上有孔)、溶液浓度较低的滚筒内进行。零件受镀方式的改变给滚镀带来两个最主要缺陷，即混和周期带来的缺陷和滚镀的结构缺陷。上述的缺陷对滚镀生产效率和产品质量的提高造成严重影响，使滚镀的优越性不能得以充分发挥。
进一步来说，目前的滚镀技术是将滚筒连接于一驱动装置，当滚筒内加载待镀工件后，接着置于电镀槽内运转所述驱动装置，而使待镀工件翻转，促使其与电解液充分接触而产生电化学作用，由于许多针状或薄片状的微小电子产品零件的表面电镀，通常在电镀滚筒中进行，现有技术中有很多种电镀滚筒，大部分的电镀滚筒都是由水平的驱动装置进行驱动，这些电镀滚筒普遍存在结构复杂、溶液置换不易、电镀效率低及维护成本较高的问题。
另外，还一种电镀滚筒是设置在驱动轴的下端，用以使装设有阳极的电镀槽能够被旋转驱动，并且利用电镀滚筒旋转驱动时所作用的离心力，从电 镀滚筒的内部流出到外部并且从外部流入到内部，但是所述电镀滚筒是固定在驱动轴的下端，无法被搬移抽换，因而无法达成自动搬移换槽的电镀流程。
因此，有必要提供改良的一种小型零件的电镀装置，以解决上述现有技术所存在的问题。
发明内容
有鉴于此，本发明的主要目的在于提供一种小型零件的电镀装置，利用将驱动器设置在电镀槽下，并且通过卡合部及驱动马达相卡合的方式带动电镀滚筒旋转，使电镀滚筒容易自一电镀槽移动至另一电镀槽来进行搬移抽换的换槽作业，并通过电镀滚筒底部强制性涡流叶片使电镀液交换快速，克服混和周期带来的缺陷及滚镀的结构缺陷，进而提升所述小型零件的电镀速度及效率。
为达上述的目的，本发明提供一种小型零件的电镀装置，包含至少一个电镀单元；每一个电镀单元包含一移动架、一电镀滚筒、一电镀槽及一驱动器；所述电镀滚筒具有一筒体、一转轴及一卡合部，其中所述转轴的一第一端设置在所述筒体上，所述卡合部设置在所述筒体的一底部；所述电镀槽容置一电镀液以浸泡所述电镀滚筒；所述驱动器设置在所述电镀槽内，用以驱动所述卡合部转动而带动所述电镀滚筒旋转而产生离心力。
在本发明的一实施例中，所述驱动器具有一驱动马达，用以与所述电镀滚筒的卡合部相卡合，而带动所述筒体旋转。
在本发明的一实施例中，所述移动架具有一固定板、二侧板、二辅助杆及一旋转接头，所述侧板组合在所述固定板的二侧，所述辅助杆设置在所述侧板之间，使所述筒体位于所述辅助杆之上，所述旋转接头枢接所述固定板上，用以与所述转轴的第二端组合在一起。
在本发明的一实施例中，所述移动架另具有二阴极座，所述阴极座设置在所述固定板的一底部的二侧，用以与一阴极环电性连接。
在本发明的一实施例中，所述筒体具有一底座、一围绕壁及一上盖，所述底座与所述围绕壁相结合，所述围绕壁内形成所述阴极环，所述转轴自所述底座连接所述上盖并向外延伸。
在本发明的一实施例中，所述电镀装置另具有一漏接盘，设置在所述驱动马达上，用以承装由所述电镀槽漏出的液体。
如上所述，利用将所述驱动器设置在所述电镀槽下，并且通过所述卡合部及所述驱动马达相卡合的方式带动所述电镀滚筒旋转，不仅使所述电镀滚筒容易移动置换，也能够提升所述小型零件的电镀速度及效率，而且所述小型零件的电镀装置的结构简单，使得后续的维护成本较低。
附图说明
图1及2是根据本发明小型零件的电镀装置的一第一较佳实施例的局部结构的一示意图。
图3是根据本发明小型零件的电镀装置的一第二较佳实施例的局部结构的一立体图。
图4是根据图3的A-A切线的一剖视图。
图5是根据本发明小型零件的电镀装置的一第二较佳实施例显示二电镀槽的一示意图。
实施方式
以下各实施例的说明是参考附加的图式，用以例示本发明可用以实施的特定实施例。再者，本发明所提到的方向用语，例如上、下、顶、底、前、后、左、右、内、外、侧面、周围、中央、水平、横s向、垂直、纵向、轴向、径向、最上层或最下层等，仅是参考附加图式的方向。因此，使用的方向用语是用以说明及理解本发明，而非用以限制本发明。
请参照图1及2所示，为本发明一种小型零件的电镀装置的一第一较佳实施例，用以电镀或化学镀多个小型零件，例如：芯片型电阻、电感、电容、 连接器、精密零件等。其中所述小型零件的电镀装置包含一座体101及至少一个或以上的电镀单元102。本发明将于下文详细说明各组件的细部构造、组装关系及其运作原理。
续参照图1及2所示，所述小型零件的电镀装置是将一个电镀单元102设置在所述座体101上，而且每一个电镀单元102包含一电镀滚筒2、一电镀槽3、一驱动器4及一移动架5。要说明的是，在其他实施例中，也可以设置在一座体101上设置有多个电镀单元102，并不以本实施例为限。
续参照图1及2所示，所述电镀滚筒2具有一筒体21、一转轴22、一卡合部23及一电流传输层24，其中所述转轴22的一第一端221设置在所述筒体21上，所述卡合部23设置在所述筒体21的一底部。进一步来说，所述筒体21具有一底座211、一围绕壁212及一上盖213，所述底座211的凸垣与所述围绕壁212相卡合，所述围绕壁212内形成一阴极环210，而且所述上盖213覆盖在所述围绕壁212而界定一内部空间(未标示)，而且所述电流传输层24设置在所述筒体21的底座211上，而且所述转轴22自所述底座211连接至所述上盖213并向外延伸。
续参照图1及2所示，所述电镀槽3为一矩形容器，其中设置一隔板103，所述隔板103上方用以容置一电镀液，所述电镀滚筒2可被浸泡在所述电镀槽3中，而且而且所述电镀槽3内可浸泡一个或多个阳极篮103。
续参照图1及2所示，所述驱动器4设置在所述电镀槽3的底部的下方，用以驱动所述卡合部23转动而带动所述电镀滚筒2旋转；且所述驱动器4具有一驱动马达41及一电极接头42，所述驱动马达41为直流驱动马达，用以与所述电镀滚筒2的卡合部23相卡合，进而使所述筒体21被所述卡合部23带动而旋转，例如：所述卡合部23的一夹爪与所述驱动马达41的一凹槽相卡合；所述电极接头42是设置在所述驱动马达41上，用以与一阴极电性连接。又，所述电镀滚筒2另具有一阴极导体25，所述阴极导体25设置在 所述卡合部23内，用以与所述电极接头42电性接触。
续参照图1及2所示，所述移动架5组合在所述座体101上，并用以在所述座体101上移动，而且位于所述电镀槽3的一顶部，而且通过移动所述移动架5可将所述电镀滚筒2自所述电镀槽3抽离，并放置于另一电镀槽(未绘示)中；另外，所述转轴22的一第二端222枢接在所述移动架5上，而且所述卡合部23位于所述第一端221的下方。进一步说明的是，所述移动架5具有一固定板51、二侧板52、二对位块53、二辅助杆54及一盖体55，其中所述固定板51用以供所述转轴22的第二端222枢接，所述两侧板52组合在所述固定板51的二侧，所述两对位块53设置在所述固定板51的二侧，而且位于所述两侧板52外，所述两对位块53是分别用以对位固定在所述侧板52上；所述两辅助杆54设置在所述侧板52之间，使所述筒体21位于所述辅助杆54之上，所述盖体55用以与所述转轴22的第一端221螺合在一起而固定在所述固定板51上。
续参照图1及2所示，所述座体101具有一升降座7，其中所述移动架5设置在所述升降座7上，而且所述移动架5受所述升降座7带动而在靠近所述电镀槽3的一浸泡位置及远离所述电镀槽3的一准备位置之间移动。
进一步说明的是，所述电镀滚筒2的筒体21的围绕壁212的一内壁可装设有所述阴极环210，所述阴极环210可连接至所述卡合部23内的一阴极导体25，而与所述电极接头42电性连接，并且利用所述电镀滚筒2在旋转时的离心力，使所述筒体21中的所述小型零件被带动至所述阴极环表面上。
要说明的是，所述电流传输层24是由钛金属或镀钛、喷钛物质所制成，所述筒体21是由塑料类材质所制成，所述电流传输层24及所述筒体21之间设置一中间层(未绘示)，所述中间层由塑料类材质所制成。
依据上述的结构，利用将所述驱动器4设置在所述电镀槽3的底部下方，而通过所述卡合部23及所述驱动马达41相卡合的方式带动所述电镀滚筒2 作间歇性旋转，并通过所述阴极环表面可电性连接至所述电极接头42，同时利用所述电镀滚筒2在旋转时的离心力，使所述筒体21中的所述小型零件被带动至所述阴极环表面上，而达到所述小型零件的表面均匀电镀的效果。
如上所述，利用将所述驱动器4设置在所述电镀槽3中，并且通过所述卡合部23及所述驱动马达41相卡合的方式带动所述电镀滚筒2旋转，不仅使所述电镀滚筒2容易移动置换，也能够提升所述小型零件的电镀速度及效率，而且所述小型零件的电镀装置的结构简单，使得后续的维护成本较低。
请参照图3、4及5所示，为本发明小型零件的电镀装置的一第二较佳实施例，并大致沿用上述较佳实施例相同组件名称及图号，但两者间差异之特征在于：所述移动架5可通过外部装置，例如：机械手臂来进行搬移，使所述电镀滚筒2可其中一电镀槽3被移动至另一电镀槽3’；再者，所述电镀滚筒2另具有一电力线导环26，设置在所述筒体21内且与所述围绕壁212相间隔；所述移动架5系具有一固定板51、二侧板52、二辅助杆54、二握持件56、一旋转接头57及二阴极座58，其中所述侧板52组合在所述固定板51的二侧，所述辅助杆54设置在所述侧板52之间，使所述筒体21位于所述辅助杆54之上，所述握持件56分别间隔设置在所述固定板51的一顶面的二侧，所述旋转接头57枢接所述固定板51上，用以与所述转轴22的第二端222组合在一起，所述阴极座58设置在所述固定板51的一底部的二侧，用以通过一阴极导线59经所述转轴22而与所述阴极环210电性连接。另外，所述筒体21的底部具有强制性涡流叶片，可使其中的电镀液交换快速，所述驱动马达41是设置在所述电镀槽3的底部的下方，而且所述电镀装置另具有一漏接盘43，设置在所述驱动马达41及所述电镀槽3的底部之间，用以承装由所述电镀槽3漏出的液体。
依据上述的结构，松开所述旋转接头57可以使所述筒体21与所述转轴22一并脱离所述移动架5，所述固定板51的底部的二侧的所述阴极座58在 电接触时能够与所述阴极环210电性连接，当所述固定板51搬离时形成断电。另外，当所述阴极环210旋转加速至一指定转速时，所述筒体21内的所述小型零件(被镀物)因离心力紧贴于所述阴极环210，并且供电进行电镀，在一段时间后断电并使所述阴极环210减速至一低转速，所述筒体21内的所述小型零件(被镀物)因重力落于所述筒体21底部而进行混合，接着所述小型零件(被镀物)混合之后再将所述阴极环210旋转加速至指定转速，如此间歇进行所述小型零件(被镀物)低速混合及加速电镀，再低速混合及加速电镀，进而使所述小型零件(被镀物)的表面能够有更均匀的电镀效果。
本发明已由上述相关实施例加以描述，然而上述实施例仅为实施本发明的范例。必需指出的是，已公开的实施例并未限制本发明的范围。相反的，包含于权利要求书的精神及范围的修改及均等设置均包括于本发明的范围内。

Claims (6)

  1. 一种小型零件的电镀装置，其特征在于：所述电镀装置包含：
    至少一个电镀单元，每一个电镀单元包含：
    一移动架；
    一电镀滚筒，具有一筒体、一转轴及一卡合部，其中所述转轴的一第一端设置在所述筒体上，所述卡合部设置在所述筒体的一底部；
    一电镀槽，容置一电镀液以浸泡所述电镀滚筒；及
    一驱动器，用以驱动所述卡合部转动而带动所述电镀滚筒旋转。
  2. 如权利要求1所述的小型零件的电镀装置，其特征在于：所述驱动器具有一驱动马达，用以与所述电镀滚筒的卡合部相卡合，而带动所述筒体间歇地旋转。
  3. 如权利要求1所述的小型零件的电镀装置，其特征在于：所述移动架具有：一固定板；二侧板，组合在所述固定板的二侧；二辅助杆，设置在所述侧板之间，使所述筒体位于所述辅助杆之上；及一旋转接头，枢接所述固定板上，用以与所述转轴的一第二端组合在一起。
  4. 如权利要求3所述的小型零件的电镀装置，其特征在于：所述移动架另具有二阴极座，设置在所述固定板的一底部的二侧，用以与一阴极环电性连接。
  5. 如权利要求1所述的小型零件的电镀装置，其特征在于：所述筒体具有一底座、一围绕壁及一上盖，所述底座与所述围绕壁相结合，所述围绕壁内形成所述阴极环，所述转轴自所述底座连接所述上盖并向外延伸。
  6. 如权利要求1所述的小型零件的电镀装置，其特征在于：所述电镀装置另具有一漏接盘，设置在所述驱动马达上，用以承装由所述电镀槽漏出的液体。
PCT/CN2017/118615 2016-12-28 2017-12-26 小型零件的电镀装置 WO2018121526A1 (zh)

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