WO2018116693A1 - Pâte conductrice - Google Patents

Pâte conductrice Download PDF

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Publication number
WO2018116693A1
WO2018116693A1 PCT/JP2017/040700 JP2017040700W WO2018116693A1 WO 2018116693 A1 WO2018116693 A1 WO 2018116693A1 JP 2017040700 W JP2017040700 W JP 2017040700W WO 2018116693 A1 WO2018116693 A1 WO 2018116693A1
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WO
WIPO (PCT)
Prior art keywords
conductive paste
viscosity
metal
metal pin
temperature
Prior art date
Application number
PCT/JP2017/040700
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English (en)
Japanese (ja)
Inventor
範博 山口
Original Assignee
タツタ電線株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by タツタ電線株式会社 filed Critical タツタ電線株式会社
Priority to CN201780078128.1A priority Critical patent/CN110140206A/zh
Priority to JP2018557609A priority patent/JPWO2018116693A1/ja
Publication of WO2018116693A1 publication Critical patent/WO2018116693A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering

Definitions

  • the present invention relates to a conductive paste.
  • PoP Package on Package
  • the basic PoP structure is a structure in which a plurality of package substrates having electrodes arranged on the surface are stacked on each other via solder balls.
  • each package substrate is electrically connected by solder balls.
  • Patent Document 1 discloses the following stacked semiconductor package.
  • Patent Document 1 includes a plurality of first package substrates each having a mounting region for a semiconductor element and stacked with each other via stacking solder balls, and corresponding to the plurality of first package substrates.
  • a plurality of recesses having a size, the plurality of first package substrates being covered by the multistage recesses so that the plurality of first package substrates are accommodated, and the plurality of the plurality of first package substrates being interposed via connection solder balls.
  • a second package substrate including a reference potential wiring electrically connected to each of the first package substrates; and a first package substrate positioned at a lowermost stage among the plurality of first package substrates.
  • each of the plurality of first package substrates is a stepped portion corresponding to the multi-step recess.
  • Stacked semiconductor package characterized in that it is electrically connected to the reference potential wiring on the bottom surface of the multi-stage recess is disclosed.
  • solder balls are used for electrical connection between package substrates.
  • the electrodes arranged on the surface of the package substrate are further densely packed. If the electrodes are to be dense in this way, the solder balls must also be dense. On the other hand, a certain space is required between the solder balls in order to prevent a short circuit.
  • the solder ball has a substantially spherical shape, and the sphere is disadvantageous for filling the space. In other words, even if the solder balls are tried to be densely packed, the solder balls cannot be sufficiently densed due to the shape restriction. Thus, attempts have been made to use columnar metal pins as means for electrically connecting package substrates.
  • the metal pins need to be erected on the package substrate.
  • a method of standing the metal pins on the package substrate a method of fixing the metal pins to the package substrate using solder has been considered.
  • solder is first arranged on the package substrate, and metal pins are arranged thereon.
  • the metal pins are fixed to the package substrate by heating and melting the solder, and then cooling and solidifying the solder.
  • the viscosity of the solder becomes too low and the metal pin is inclined due to its own weight or the solder is melted.
  • the metal pin is inclined due to a change in the surface tension of the solder.
  • the present invention has been made to solve the above-described problems, and an object of the present invention is to provide a conductive paste capable of standing a metal pin on an electrode without tilting.
  • the present inventors have conducted intensive studies.
  • the present invention was completed by finding that a metal pin can be erected on an electrode without tilting by using a conductive paste.
  • the conductive paste of the present invention is a conductive paste containing metal powder and a thermosetting resin, which is used for standing metal pins on electrodes arranged on a package substrate, and is at room temperature T 1 .
  • the viscosity of the conductive paste and the viscosity V 1 the viscosity of the conductive paste at high temperature T 2 than room T 1 and the viscosity V 2, the viscosity of the conductive paste at high temperature T 3 than the temperature T 2
  • the viscosity is V 3
  • the viscosity V 2 is lower than the viscosity V 1
  • the viscosity V 3 is higher than the viscosity V 1
  • the temperature of the conductive paste is from the room temperature T 1 to the temperature T 3.
  • the viscosity V 2 becomes a minimum value of the viscosity change in the conductive paste
  • the viscosity V 1 was a 200 ⁇ 8000 Pa ⁇ s
  • the viscosity V 2 is 100-600 Characterized in that it is a Pa ⁇ s.
  • the viscosity V 2 is lower than the viscosity V 1. Further, in the conductive paste of the present invention, the viscosity V 3 is higher than the viscosity V 1 . That is, when the conductive paste is heated, the viscosity once decreases, and then the viscosity increases.
  • the conductive paste is sandwiched between the metal pin and the electrode and the conductive paste is heated. As described above, when the conductive paste is heated, the viscosity of the conductive paste once decreases. At this time, the conductive paste comes into contact with the metal pin without any gap. Thereafter, the conductive paste is further heated. At this time, since the viscosity of the conductive paste increases, the metal pin is firmly fixed. Since the conductive paste of the present invention has such properties, the metal pin can be erected on the electrode without tilting by using the conductive paste of the present invention.
  • the viscosity V 1 is 200 to 8000 Pa ⁇ s. If the viscosity V 1 is less than 200 Pa ⁇ s, the conductive paste is too soft, when erected metal pins on the electrode, the metal pin is easily tilt. If the viscosity V 1 is greater than 8000 Pa ⁇ s, it is difficult to apply the conductive paste to the electrode.
  • the viscosity V 2 is 100 to the viscosity V 2 is 6000 Pa ⁇ s is less than 100 Pa ⁇ s, the conductive paste becomes too soft, standing metal pins on the electrode When installing, the metal pin tends to tilt. If the viscosity V 2 exceeds 6000 Pa ⁇ s, as well as conductive paste is sufficiently soft when erected metal pins on the electrode, the conductive paste is sufficiently hard to contact with the metal pin. As a result, it becomes difficult to firmly fix the metal pin.
  • the viscosity V 3 is preferably 10,000 Pa ⁇ s or more.
  • the viscosity V 3 is less than 10000 Pa ⁇ s, the conductive paste is not sufficiently hard, metal pins, easily detached from the electrode. That is, it becomes difficult to firmly fix the metal pin.
  • the temperature T 2 is desirably 80 to 150 ° C.
  • the temperature range from once the viscosity of the conductive paste decreases until the viscosity of the conductive paste increases becomes an appropriate range, and the conductive paste is conductive for an appropriate time.
  • the viscosity of the paste will decrease. Therefore, when the metal pin is erected on the electrode, the conductive paste can contact the metal pin without a gap. As a result, the metal pin can be firmly fixed.
  • the metal powder preferably includes a low melting point metal and a high melting point metal having a melting point higher than that of the low melting point metal.
  • the low melting point metal can form an alloy with a metal pin made of copper.
  • the low melting point metal can form an alloy with a metal pin made of copper
  • the metal pin made of copper and the conductive paste have a low An alloy with a melting point metal is formed.
  • the alloy may be a mixture of a low melting point metal element and an element constituting a metal pin, or may be an intermetallic compound of these elements.
  • the melting point of the low melting point metal is desirably 180 ° C. or lower.
  • the temperature T 2 tends to increase. Therefore, the temperature range from when the viscosity of the conductive paste once decreases to when it rises tends to be narrowed. Therefore, it becomes difficult to firmly fix the metal pin on the electrode.
  • the low melting point metal includes at least one selected from the group consisting of indium, tin, lead and bismuth. These metals have melting points and conductivity suitable as low melting point metals.
  • the melting point of the refractory metal is desirably 800 ° C. or higher.
  • the refractory metal preferably includes at least one selected from the group consisting of copper, silver, gold, nickel, silver-coated copper, and silver-coated copper alloy. These metals are excellent in conductivity. When the metal pin is erected on the electrode using the conductive paste, the conductivity between the metal pin and the electrode can be improved.
  • the metal pin can be firmly fixed on the electrode by using the conductive paste of the present invention, the metal pin can be erected on the electrode without tilting when the package substrate is manufactured. .
  • FIG. 1 is a chart schematically showing an example of the relationship between the viscosity of the conductive paste of the present invention and the temperature.
  • FIGS. 2A and 2B are schematic views schematically showing an example of a method of standing metal pins on electrodes arranged on the surface of a package substrate using solder.
  • FIGS. 3A to 3C are schematic views schematically showing an example of a method for erecting a metal pin using the conductive paste of the present invention.
  • FIG. 4 is a schematic view schematically showing a base material preparation step included in the steps of the method for manufacturing a package substrate using the conductive paste of the present invention.
  • FIG. 5 is a schematic view schematically showing a printing process included in the process of the package substrate manufacturing method using the conductive paste of the present invention.
  • FIG. 1 is a chart schematically showing an example of the relationship between the viscosity of the conductive paste of the present invention and the temperature.
  • FIGS. 2A and 2B are schematic views schematically showing an example of
  • FIG. 6 is a schematic view schematically showing a metal pin placement step included in the steps of the method for manufacturing a package substrate using the conductive paste of the present invention.
  • 7A and 7B are schematic views schematically showing a heating process included in the process of the method for manufacturing a package substrate using the conductive paste of the present invention.
  • FIG. 8 is a schematic view schematically showing a conductive paste attaching process included in the process of the manufacturing method of the package substrate using the conductive paste of the present invention.
  • FIG. 9 is a schematic view schematically showing a metal pin placement step included in the steps of the method for manufacturing a package substrate using the conductive paste of the present invention.
  • the conductive paste is a conductive paste containing metal powder and a thermosetting resin, which is used for standing metal pins on electrodes arranged on the package substrate.
  • FIG. 1 is a chart schematically showing an example of the relationship between the viscosity of the conductive paste of the present invention and the temperature.
  • the viscosity at room temperature T 1 is the viscosity V 1
  • the viscosity at the temperature T 2 higher than the room temperature T 1 is the viscosity V 2
  • the viscosity at the temperature T 3 higher than the temperature T 2 is the viscosity at the temperature T 3 .
  • the viscosity at each temperature of the conductive paste of the present invention has the following relationship. That is, the viscosity V 2 is lower than the viscosity V 1. The viscosity V 3 is higher than the viscosity V 1. Further, when the temperature of the conductive paste is changed from room temperature T 1 to a temperature T 3, a viscosity V 2 is a minimum value of the viscosity change of electrically conductive paste.
  • the viscosity V 2 is lower than the viscosity V 1. Further, in the conductive paste of the present invention, the viscosity V 3 is higher than the viscosity V 1 . That is, when the conductive paste is heated, the viscosity once decreases, and then the viscosity increases.
  • the conductive paste is sandwiched between the metal pin and the electrode and the conductive paste is heated. As described above, when the conductive paste is heated, the viscosity of the conductive paste once decreases. At this time, the conductive paste comes into contact with the metal pin without any gap. Thereafter, the conductive paste is further heated. At this time, since the viscosity of the conductive paste increases, the metal pin is firmly fixed. Since the conductive paste of the present invention has such properties, the metal pin can be erected on the electrode without tilting by using the conductive paste of the present invention.
  • FIGS. 2A and 2B are schematic views schematically showing an example of a method of standing metal pins on electrodes arranged on the surface of a package substrate using solder.
  • solder Placement Step As shown in FIG. 2A, when using the solder 170 to stand the metal pin 150 on the electrode 130, first, the electrode 130 placed on the substrate 120 is used. Solder 170 is disposed on the metal pin 150 and the metal pin 150 is disposed thereon.
  • the solder 170 is heated and melted, and then the solder 170 is cooled and solidified to fix the metal pin 150 to the electrode 130.
  • the solder 170 is melted, the viscosity of the solder 170 is excessively decreased, or the solder 170
  • the surface tension of the metal pin 150 changes, the metal pin 150 is easily tilted.
  • the solder 170 is cooled and solidified in a state where the metal pin 150 is tilted, so that the metal pin 150 is easily fixed to the electrode 130 in a state where the metal pin 150 is tilted.
  • FIGS. 3A to 3C are schematic views schematically showing an example of a method for erecting a metal pin using the conductive paste of the present invention.
  • the conductive property is interposed between the metal pin 50 and the electrode 30.
  • the paste 40 is sandwiched.
  • the conductive paste 40 includes a metal powder 41 and a thermosetting resin 42.
  • FIG. 3A only by sandwiching the conductive paste 40 between the metal pin 50 and the electrode 30, and between the metal pin 50 and the conductive paste 40, and between the electrode 30 and the conductive paste. There may be a gap 60 between 40 and 40.
  • the conductive paste 40 when heated to a temperature T 2, metal powder 41 contained in the conductive paste 40 is softened, once the viscosity of the conductive paste 40 is a minimum value the viscosity V 2. That is, the viscosity of the conductive paste 40 decreases.
  • the gap 60 is filled with the conductive paste 40, and the metal pin 50 and the conductive paste 40, and the electrode 30 and the conductive paste 40 are in contact with each other without a gap.
  • thermosetting resin 42 contained in the conductive paste 40 begins to cure. That is, the viscosity of the conductive paste 40 is increased and hardened to become a cured product 45 of the conductive paste. As a result, the metal pin 50 is firmly fixed on the electrode 30.
  • the metal pin 150 when the metal pin 150 is erected on the electrode 130 using solder, the metal pin 150 is easily inclined, but the metal pin 50 is erected on the electrode 30 using the conductive paste 40. In this case, the metal pin 50 can be easily erected on the electrode 30 without being inclined.
  • the room temperature T 1 is not particularly limited, but is preferably 18 to 30 ° C., and more preferably 25 ° C. Such a temperature is an air temperature suitable for work.
  • the viscosity V 1 is 200 to 8000 Pa ⁇ s, preferably 300 to 4000 Pa ⁇ s, and more preferably 700 to 3000 Pa ⁇ s. If the viscosity V 1 is less than 200 Pa ⁇ s, the conductive paste is too soft, when erected metal pins on the electrode, the metal pin is easily tilt. If the viscosity V 1 is greater than 8000 Pa ⁇ s, I am difficult to apply the conductive paste to the electrode.
  • Viscosity in the present specification means viscosity measured under the following conditions using a rheometer (model number: MCR302, manufacturer: Anton Parr). Temperature increase rate: 5 ° C / min Measuring jig: PP25 Swing angle ⁇ : 0.1% Frequency f: 1Hz Temperature: 25-200 ° C
  • the temperature T 2 is not particularly limited, but is preferably 80 to 150 ° C., more preferably 100 to 145 ° C., and further preferably 120 to 140 ° C.
  • the temperature T 2 is 80 to 150 ° C.
  • the viscosity of the paste will decrease. Therefore, when the metal pin is erected on the electrode, the conductive paste can contact the metal pin without a gap. As a result, the metal pin can be firmly fixed.
  • the viscosity V 2 is 100 to 6000 Pa ⁇ s, more preferably 250 to 2100 Pa ⁇ s. If the viscosity V 2 is less than 100 Pa ⁇ s, the conductive paste is too soft, when erected metal pins on the electrode, the metal pin is easily tilt. If the viscosity V 2 exceeds 6000 Pa ⁇ s, as well as conductive paste is sufficiently soft when erected metal pins on the electrode, the conductive paste is sufficiently hard to contact with the metal pin. As a result, it becomes difficult to firmly fix the metal pin.
  • the viscosity V 2 is desirably 100 Pa ⁇ s or more lower than the viscosity V 1 and more desirably 110 to 2500 Pa ⁇ s.
  • Viscosity V 2 is In the above-mentioned range, since the conductive paste is moderate softness, conductive paste may be in contact without any gap in the metal pin. As a result, the metal pin can be firmly fixed.
  • the temperature T 3 is not particularly limited, but is preferably 150 ° C. or higher, and more preferably 160 to 180 ° C. Temperature T 3 is lower than 0.99 ° C., a temperature at which the viscosity of the conductive paste is increased too low, the conductive paste, the conductive paste before sufficiently fill the gap between the metal pin and the conductive paste Viscosity tends to increase. Therefore, a gap is easily generated between the metal pin and the conductive paste.
  • the viscosity V 3 is not particularly limited, but is preferably 10,000 Pa ⁇ s or more, and more preferably 10,000 to 50,000 Pa ⁇ s. Viscosity V 3, is less than 10000 Pa ⁇ s, the conductive paste is not sufficiently hard, metal pins, easily detached from the electrode. That is, it becomes difficult to firmly fix the metal pin.
  • the metal powder preferably includes a low melting point metal and a high melting point metal having a melting point higher than that of the low melting point metal.
  • the ratio, melting point, type and the like of the low melting point metal and the high melting point metal, the temperature T 2 and the temperature T 3 , and the viscosity V 1 , the viscosity V 2 and the viscosity V 3 can be controlled.
  • the viscosity V 2 can be suitably controlled by selecting the melting point and type of the low melting point metal.
  • the metal powder may be composed of, for example, a mixture of low melting point metal particles and high melting point metal particles, or may be composed of particles in which a low melting point metal and a high melting point metal are integrated. It may be composed of particles, high melting point metal particles, and a mixture of particles in which a low melting point metal and a high melting point metal are integrated.
  • the low melting point metal can form an alloy with a metal pin made of copper.
  • the low melting point metal can form an alloy with a metal pin made of copper
  • the metal pin made of copper and the conductive paste have a low An alloy with a melting point metal is formed.
  • a part of the metal pin made of copper and a part of the conductive paste are integrated, and the metal pin can be firmly fixed on the electrode.
  • the melting point of the low melting point metal is not particularly limited, but is preferably 180 ° C. or less, more preferably 60 to 170 ° C., and further preferably 120 to 145 ° C. desirable.
  • the temperature T 2 tends to increase. Therefore, the temperature range from when the viscosity of the conductive paste once decreases to when it rises tends to be narrowed. Therefore, it becomes difficult to firmly fix the metal pin on the electrode. If the melting point of the low melting point metal is less than 60 ° C., the temperature T 2 tends to be low.
  • the temperature range from when the viscosity of the conductive paste once decreases to when it rises is likely to widen. For this reason, when the metal pin is erected on the electrode, the metal pin is inclined by the influence of the change in the surface tension of the conductive paste, or is easily inclined by its own weight.
  • the low melting point metal is not particularly limited, but preferably contains at least one selected from the group consisting of indium, tin, lead and bismuth. These metals have melting points and conductivity suitable as low melting point metals.
  • the melting point of the refractory metal is not particularly limited, but is preferably 800 ° C. or higher, more preferably 800 to 1500 ° C., and further preferably 900 to 1100 ° C. desirable.
  • the refractory metal is not particularly limited, but preferably contains at least one selected from the group consisting of copper, silver, gold, nickel, silver-coated copper, and silver-coated copper alloy. . These metals are excellent in conductivity. When the metal pin is erected on the electrode using the conductive paste, the conductivity between the metal pin and the electrode can be improved.
  • the weight of the low melting point metal is less than 1/4 of the weight of the refractory metal, temperature T 2 is likely higher. Therefore, the temperature range from when the viscosity of the conductive paste once decreases to when it rises tends to be narrowed. Therefore, it becomes difficult to firmly fix the metal pin on the electrode.
  • thermosetting resin is not particularly limited, and examples thereof include acrylate resins, epoxy resins, phenol resins, urethane resins, and silicone resins. More specific thermosetting resins include bisphenol A type epoxy resin, brominated epoxy resin, bisphenol F type epoxy resin, novolac type epoxy resin, alicyclic epoxy resin, glycidylamine type epoxy resin, 1,6-hexane. Examples thereof include glycidyl ether type epoxy resins such as diol diglycidyl ether, heterocyclic epoxy resins, aminophenol type epoxy resins and the like. These thermosetting resins may be used alone or in combination.
  • the curing temperature of the thermosetting resin is desirably higher by 10 ° C. than the melting point of the low melting point metal.
  • the curing temperature of the thermosetting resin is lower than the above temperature, the thermosetting resin is cured before the low melting point metal is softened, and the low melting point metal and the metal pin are difficult to form an alloy.
  • the upper limit of the curing temperature is preferably 200 ° C. Further, the curing temperature of the thermosetting resin is more preferably 160 to 180 ° C.
  • the weight of the thermosetting resin exceeds 1/4 of the weight of the metal powder, the conductivity between the metal pin and the electrode tends to decrease.
  • the weight of the thermosetting resin is less than 1/19 of the weight of the metal powder, it is difficult to print the conductive paste on the package substrate.
  • the conductive paste of the present invention may contain a curing agent, a flux, a curing catalyst, an antifoaming agent, a leveling agent, an organic solvent, an inorganic filler, and the like in addition to the metal powder and the thermosetting resin.
  • 2-phenyl-4,5-dihydroxymethylimidazole 2-phenylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 2-ethylimidazole, 2-phenylimidazole, 2-ethyl-4- Examples thereof include methylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-undecylimidazolium trimellitate and the like.
  • zinc chloride As flux, zinc chloride, lactic acid, citric acid, oleic acid, stearic acid, glutamic acid, benzoic acid, oxalic acid, glutamic acid hydrochloride, aniline hydrochloride, cetylpyridine bromide, urea, hydroxyethyllaurylamine, polyethylene glycol laurylamine Oleylpropylenediamine, triethanolamine, glycerin, hydrazine, rosin and the like.
  • the first example of the manufacturing method of the package substrate is: (1) a base material preparation step of preparing a base material on which electrodes are arranged; (2) A printing process for printing the conductive paste of the present invention on the electrode; (3) a metal pin placement step of placing a metal pin on the conductive paste; (4) By heating the conductive paste, the conductive paste is softened and then cured to obtain a cured product of the conductive paste, and the metal pin is inserted through the cured product of the conductive paste. And a metal pin standing step for standing on the electrode.
  • FIG. 4 is a schematic view schematically showing a base material preparation step included in the steps of the method for manufacturing a package substrate using the conductive paste of the present invention.
  • FIG. 5 is a schematic view schematically showing a printing process included in the process of the package substrate manufacturing method using the conductive paste of the present invention.
  • FIG. 6 is a schematic view schematically showing a metal pin placement step included in the steps of the method for manufacturing a package substrate using the conductive paste of the present invention.
  • 7A and 7B are schematic views schematically showing a heating process included in the process of the method for manufacturing a package substrate using the conductive paste of the present invention.
  • the base material 20 having the electrode 30 disposed on the surface 21 is prepared.
  • the material of the base material 20 is not particularly limited, and may be an epoxy resin, BT resin (bismaleimide triazine), polyimide, fluororesin, polyphenylene ether, liquid crystal polymer, phenol resin, ceramic, or the like.
  • the material of the electrode 30 is not particularly limited, and may be copper, tin, nickel, aluminum, gold, silver, or the like.
  • the base material 20 with the electrode 30 disposed on the surface can be produced by a known method.
  • the conductive paste 40 including the metal powder 41 and the thermosetting resin 42 is printed.
  • the conductive paste 40 does not specifically limit as a printing method of the electrically conductive paste 40, It can carry out by well-known methods, such as screen printing.
  • the metal pin 50 is arranged on the conductive paste 40. As shown in FIG. 6, gaps 60 are generated between the metal pins 50 and the conductive paste 40 and between the electrodes 30 and the conductive paste 40.
  • the metal pins 50 are desirably arranged so as to have a density of 100 to 500 pins / 1 package.
  • the package substrate to be manufactured can be made smaller by densely gathering the metal pins 50.
  • the PoP on which the manufactured package substrates are stacked can be reduced.
  • the shape of the metal pin 50 is not particularly limited as long as it is substantially columnar, but may be, for example, a prismatic shape such as a substantially triangular prism shape, a substantially quadrangular prism shape, a substantially hexagonal column shape, a substantially cylindrical shape, a substantially elliptical column shape, etc. May be. Among these, a quadrangular prism shape or a cylindrical shape is desirable.
  • the bottom surface of the metal pin 50 is preferably a substantially rectangular shape having a length of 50 to 300 ⁇ m and a width of 50 to 300 ⁇ m.
  • the bottom surface of the metal pin 50 is preferably approximately circular with a diameter of 70 to 150 ⁇ m.
  • the metal pins 50 can be suitably concentrated.
  • a metal pin is not specifically limited, It is desirable to contain at least 1 sort (s) selected from the group which consists of copper, silver, gold
  • the second example of the manufacturing method of the package substrate is: (1) a base material preparation step of preparing a base material on which electrodes are arranged; (2) a conductive paste attaching step of attaching a conductive paste containing metal powder and a thermosetting resin to the end of the metal pin; (3) A metal pin placement step of placing a metal pin by contacting a conductive paste on the electrode; (4) By heating the conductive paste, the conductive paste is softened and then cured to obtain a cured product of the conductive paste, and the metal pin is erected on the electrode through the cured conductive paste. And a metal pin erecting step.
  • the second example of the package substrate manufacturing method is the following (2) printing step and (3) metal pin placement step of the first example of the package substrate manufacturing method described below. And (3 ′) a manufacturing method of a package substrate replaced with a metal pin arranging step.
  • FIG. 8 is a schematic view schematically showing a conductive paste attaching process included in the process of the manufacturing method of the package substrate using the conductive paste of the present invention.
  • FIG. 9 is a schematic view schematically showing a metal pin placement step included in the steps of the method for manufacturing a package substrate using the conductive paste of the present invention.
  • the conductive paste 40 containing the metal powder 41 and the thermosetting resin 42 is attached to the end portion 51 of the metal pin 50.
  • the method for attaching the conductive paste 40 to the end portion 51 of the metal pin 50 is not particularly limited, and may be attached by, for example, a dip method. Since the desirable shape and material of the metal pin 50 and the desirable composition of the conductive paste 40 are as described above, description thereof is omitted here.
  • the numerical value of the raw material means parts by weight.
  • the silver-coated copper powder has an average particle diameter of 2 ⁇ m, a silver melting point of 962 ° C., and a copper melting point of 1085 ° C.
  • the silver powder has an average particle diameter of 5 ⁇ m and a melting point of 962 ° C.
  • the Sn42% -Bi58% alloy has an average particle size of 10 ⁇ m and a melting point of 139 ° C.
  • the Sn 80% -Bi 20% alloy has an average particle diameter of 5 ⁇ m and a melting point of 139 ° C.
  • Table 1 shows the relationship between the temperature (T 1 to T 3 ) and the viscosity (V 1 to V 3 ) of the obtained conductive paste.
  • the viscosity was measured using a rheometer (model number: MCR302, manufacturer: Anton Parr) under the following conditions. Temperature increase rate: 5 ° C / min Measuring jig: PP25 Swing angle ⁇ : 0.1% Frequency f: 1Hz Temperature: 25-200 ° C
  • a package substrate was manufactured as follows.
  • the conductive paste is heated to 180 ° C. at a rate of temperature increase of 20 ° C./min, and then the conductive paste is softened and then cured to obtain a cured product of the conductive paste. It was. Thereby, the metal pin was set up on the said electrode through the hardened
  • the package substrate using the conductive paste according to Examples 1 to 8 has a small inclination in the metal pins and is suitable for stacking the package substrates.
  • Base material 21 Surface 30 of base material Electrode 40 Conductive paste 41 Metal powder 42 Thermosetting resin 45 Cured product of conductive paste 50 Metal pin 51 End of metal pin

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  • Conductive Materials (AREA)

Abstract

L'invention concerne une pâte conductrice qui permet à une broche métallique d'être construite sur une électrode sans inclinaison. Une pâte conductrice qui selon la présente invention contient une poudre métallique et un thermodurcissable, est utilisée pour construire une broche métallique sur une électrode disposée sur un substrat de boîtier, et est caractérisé en ce que, lorsque V1 représente la viscosité de la pâte conductrice à la température ambiante T1, V2 représente la viscosité de la pâte conductrice à une température T2 supérieure à la température ambiante T1, et V3 représente la viscosité de la pâte conductrice à une température T3 supérieure à la température T2, la viscosité V2 est inférieure à la viscosité V1, la viscosité V3 est supérieure à la viscosité V1, la viscosité V2 atteint un minimum local dans le changement de viscosité de la pâte conductrice lorsque la température de la pâte conductrice passe de la température ambiante T1 à la température T3, la viscosité V1 est de 200-8000 Pa·s, et la viscosité V2 est de 100-6000 Pa·s.
PCT/JP2017/040700 2016-12-19 2017-11-13 Pâte conductrice WO2018116693A1 (fr)

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CN201780078128.1A CN110140206A (zh) 2016-12-19 2017-11-13 导电膏
JP2018557609A JPWO2018116693A1 (ja) 2016-12-19 2017-11-13 導電性ペースト

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JP2006059765A (ja) * 2004-08-23 2006-03-02 Tatsuta System Electronics Kk 導電性ペースト
JP2008108629A (ja) * 2006-10-26 2008-05-08 Tatsuta System Electronics Kk 導電性ペースト及びこれを用いた多層基板
JP2010108845A (ja) * 2008-10-31 2010-05-13 Namics Corp 外部電極用導電性ペースト、及びそれを用いて形成した外部電極を備えた積層セラミック電子部品
JP2011129694A (ja) * 2009-12-17 2011-06-30 Tamura Seisakusho Co Ltd はんだ接合補強剤組成物、及びこれを用いた実装基板の製造方法
JP2014028380A (ja) * 2012-07-31 2014-02-13 Koki:Kk 金属フィラー、はんだペースト、及び接続構造体
JP2015173156A (ja) * 2014-03-11 2015-10-01 イビデン株式会社 プリント配線板の製造方法と金属ポストを搭載するためのマスク
WO2016136204A1 (fr) * 2015-02-27 2016-09-01 タツタ電線株式会社 Pâte conductrice et substrat multicouche l'utilisant

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6095639B2 (ja) * 2014-12-26 2017-03-15 株式会社タムラ製作所 異方性導電性ペーストおよびそれを用いたプリント配線基板の製造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006059765A (ja) * 2004-08-23 2006-03-02 Tatsuta System Electronics Kk 導電性ペースト
JP2008108629A (ja) * 2006-10-26 2008-05-08 Tatsuta System Electronics Kk 導電性ペースト及びこれを用いた多層基板
JP2010108845A (ja) * 2008-10-31 2010-05-13 Namics Corp 外部電極用導電性ペースト、及びそれを用いて形成した外部電極を備えた積層セラミック電子部品
JP2011129694A (ja) * 2009-12-17 2011-06-30 Tamura Seisakusho Co Ltd はんだ接合補強剤組成物、及びこれを用いた実装基板の製造方法
JP2014028380A (ja) * 2012-07-31 2014-02-13 Koki:Kk 金属フィラー、はんだペースト、及び接続構造体
JP2015173156A (ja) * 2014-03-11 2015-10-01 イビデン株式会社 プリント配線板の製造方法と金属ポストを搭載するためのマスク
WO2016136204A1 (fr) * 2015-02-27 2016-09-01 タツタ電線株式会社 Pâte conductrice et substrat multicouche l'utilisant

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JPWO2018116693A1 (ja) 2019-10-24
TW201838101A (zh) 2018-10-16

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