Classifications

• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
  • C08L83/04—Polysiloxanes
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K3/00—Use of inorganic substances as compounding ingredients
  • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
  • C08K3/20—Oxides; Hydroxides
  • C08K3/22—Oxides; Hydroxides of metals
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K3/00—Use of inorganic substances as compounding ingredients
  • C08K3/28—Nitrogen-containing compounds
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K3/00—Use of inorganic substances as compounding ingredients
  • C08K3/34—Silicon-containing compounds
  • C08K3/36—Silica
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K3/00—Use of inorganic substances as compounding ingredients
  • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
  • C08K3/20—Oxides; Hydroxides
  • C08K3/22—Oxides; Hydroxides of metals
  • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K3/00—Use of inorganic substances as compounding ingredients
  • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
  • C08K3/20—Oxides; Hydroxides
  • C08K3/22—Oxides; Hydroxides of metals
  • C08K2003/2296—Oxides; Hydroxides of metals of zinc
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K2201/00—Specific properties of additives
  • C08K2201/001—Conductive additives
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K2201/00—Specific properties of additives
  • C08K2201/002—Physical properties
  • C08K2201/005—Additives being defined by their particle size in general

Definitions

• the present invention relates to silicone compositions used to improve the heat dissipation of electronic products.
• a heat dissipating composition in which a filler such as zinc oxide powder or aluminum oxide powder is blended with silicone oil is known.
• compositions in which other fillers are added to the silicone oil together with zinc oxide powder and aluminum oxide powder, or fillers such as diamond, boron nitride and carbon nanotubes having high thermal conductivity are also known.
• the thermally conductive material may improve heat dissipation of electronic products by including various fillers, but due to the high content of fillers, the fluidity and handleability of the thermally conductive material may be deteriorated, and thus many practical applications are applied to electronic products. I'm having a hard time.
• the present invention is to provide a silicone composition having excellent heat dissipation and excellent fluidity, handleability and the like.
• the present invention comprises a filler comprising a silicon macromer having a content of an alkoxy group bonded to a silicon atom of 0.1 to 1 mol%, silica, and at least two selected from the group consisting of zinc oxide, aluminum oxide and aluminum nitride.
• a silicone composition comprising a silicon macromer having a content of an alkoxy group bonded to a silicon atom of 0.1 to 1 mol%, silica, and at least two selected from the group consisting of zinc oxide, aluminum oxide and aluminum nitride.
• the silicone macromer may have a viscosity of 10 to 50 mPa ⁇ s at 25 ° C.
• the silicone macromer may be a compound represented by Formula 1 below.
• n is an integer of 8 to 48.
• the mixing ratio (a: b: c) of the zinc oxide (a), the aluminum oxide (b) and the aluminum nitride (c) may be a weight ratio of 1: 1.20 to 1.45: 0 to 0.6.
• the average particle size (D 50 ) of the zinc oxide may be 3 ⁇ m or less.
• the average particle size (D 50 ) of the aluminum oxide may be 5 ⁇ m or less.
• the average particle size (D 50 ) of the aluminum nitride may be 5 ⁇ m or less.
• the silicone composition may further include a colorant.
• the silicone composition of the present invention has excellent handleability and workability due to good fluidity, and can exhibit excellent heat dissipation due to high thermal conductivity and low contact thermal resistance. Therefore, when the silicone composition of the present invention is applied to a heating element (for example, a computer GPU, a CPU; an ECU in an automotive electric field; a power module of an inverter and an electronic component), heat generated in the heating element is efficiently conducted, thereby The heat dissipation can be improved.
• a heating element for example, a computer GPU, a CPU; an ECU in an automotive electric field; a power module of an inverter and an electronic component
• the silicone composition of this invention contains a silicone macromer, a silica, and a filler.
• Silicone macromers included in the silicone composition of the present invention impart fluidity to the silicone composition to improve the handleability, workability, and the like of the silicone composition.
• the silicone macromer may have an amount of an alkoxy group bonded to the silicon atom (specifically, the ratio of the alkoxy group to the total functional groups bonded to the silicon atom) of 0.1 to 1 mol%, specifically 0.4 to 0.6 mol%. .
• the content of the alkoxy group is less than the above range, the viscosity of the silicone composition may be increased or the heat dissipation may be decreased.
• the alkoxy group is more than the above range, the reliability of the silicone composition may be lowered due to the separation or volatilization of a component having a lower molecular weight. have.
• the silicone macromer may have a viscosity of 10 to 50 mPa ⁇ s at 25 ° C. in consideration of fluidity of the silicone composition.
• the viscosity of the silicone macromer is less than 10 mPa ⁇ s, the silicone macromer and the filler may be separated due to the decrease in the mixing property of the silicone macromer and the filler. It is difficult to contain a high content of the silicone composition may lower the heat dissipation.
• the viscosity of the silicone macromer may be 12 to 42 mPa ⁇ s at 25 ° C., more specifically 22 to 33 mPa ⁇ s.
• Such a silicone macromer may be a compound represented by the following Chemical Formula 1.
• n is an integer of 8 to 48. Specifically, n may be an integer of 10 to 40, more specifically may be an integer of 20 to 30.
• Silica included in the silicone composition of the present invention prevents the silicone macromer from contacting with moisture and improves the durability (mechanical strength) of the silicone composition.
• the silica may have a specific surface area of 195 to 250 m 2 / g, and may be one that is surface treated with a silazane compound to ensure dispersibility. When the specific surface area of the silica is out of the above range, the dispersibility or flowability of the silica may decrease.
• hexamethylene disilazane (HMDZ) etc. are mentioned as a specific example of the said silazane compound.
• the silica content may be 1 to 5 parts by weight, based on 100 parts by weight of the silicone macromer, in consideration of fluidity, heat dissipation, and the like of the silicone composition. If the content of silica is out of the above range, durability or dispersibility may be lowered.
• the filler included in the silicone composition of the present invention includes two or more selected from the group consisting of zinc oxide, aluminum oxide, and aluminum nitride, and imparts thermal conductivity to the silicone composition to improve heat dissipation of the silicone composition.
• the silicone composition of the present invention optimizes the particle size of zinc oxide, aluminum oxide, and aluminum nitride used as a filler so that the silicone composition can be made without deteriorating the fluidity of the silicone composition even if the silicone composition contains a high amount of filler. It is possible to lower the contact thermal resistance with the substrate to be applied.
• the zinc oxide used as the filler may have an average particle size (D 50 ) of 3 ⁇ m or less, and specifically 0.3 to 0.6 ⁇ m. When the average particle size (D 50 ) of zinc oxide is out of the above range, the filling rate of the filler may be lowered.
• the content of such zinc oxide may be 400 to 900 parts by weight based on 100 parts by weight of the silicone macromer.
• the heat dissipation of the silicone composition may be lowered.
• the aluminum oxide used as the filler may have an average particle size (D 50 ) of 5 ⁇ m or less, specifically 3 ⁇ m or less, and may have a spherical shape.
• D 50 average particle size of the aluminum oxide
• the thermal resistance of the silicone composition may be lowered.
• the content of such aluminum oxide may be 400 to 1000 parts by weight based on 100 parts by weight of the silicone macromer.
• the heat dissipation, workability, etc. of the silicone composition may be lowered.
• the aluminum nitride used as the filler may have an average particle size (D 50 ) of 5 ⁇ m or less, specifically 1 ⁇ m or less, and the shape may be spherical.
• D 50 average particle size of the aluminum nitride
• the content of the aluminum nitride may be 100 to 300 parts by weight based on 100 parts by weight of the silicone macromer. When the content of aluminum nitride is out of the above range, the workability of the silicone composition may be reduced.
• the silicone composition of the present invention may further include a colorant to adjust the color.
• the colorant further included in the silicone composition of the present invention imparts color to the silicone composition.
• the colorant carbon black, aniline black, titanium black, acetylene black, or a mixture thereof may be used.
• Such a colorant may be 0.5 to 1 part by weight based on 100 parts by weight of the silicone macromer in consideration of color, flowability, heat dissipation, etc. of the silicone composition. If the content of the colorant is outside the above range, the insulation of the silicone composition may be lowered.
• Such a silicone composition of the present invention may have a viscosity of 10,000 to 70,000 mPa ⁇ s at 25 ° C. As the silicone composition of the present invention exhibits a viscosity within the above range, it is excellent in fluidity and can improve workability such as dispensing property and screen printability.
• the silicone composition of the present invention has a low thermal resistance and high thermal conductivity of 2.9 W / mK or more, and when applied to a heating element (for example, an electronic product), the heat dissipation of the heating element can be improved.
• each component was weighed and introduced into a 1 L planetary mixer, followed by mixing at 25 ° C. for 4 hours to prepare a silicone composition.
• the composition of each component was as shown in Table 1, the content of each component was weighed based on 100 parts by weight of the silicone macromer.
• the average particle size of the filler was measured using the micro track MT3300EX which is a particle size analyzer from Nikki Kabushiki Kaisha.
• a silicone composition was prepared through the same process as in Example 1, except that the composition of Table 1 was applied.
• a silicone composition was manufactured through the same process as in Example 1, except that the composition of Table 2 was applied.
• Example 1 Example 2 Example 3 Example 4 Example 5 Example 6
• Example 7 Silicone macromermethoxy group content: 0.5 mol%) 100 100 100 100 100 100 Silicon macromethoxy group content: 1.1 mol%) - - - - - - Silicon macromethoxy group content: 0.05 mol%) - - - - - - - filler Zinc oxide powder (average particle size: 0.6 ⁇ m) 650 550 445 445 445 445 445 Spherical Aluminum Oxide Powder (Average Size: 5 ⁇ m) - - - 610 - - - Spherical Aluminum Oxide Powder (Average Size: 3 ⁇ m) 890 750 610 - 530 650 610 Spherical Aluminum Nitride Powder (Average Particle Size: 1 ⁇ m) - - 260 260 - - - Silica (Specific surface area: 220 m2 / g) 1.6 1.4 1.6 1.3 1.3 1.3 1.3 Toning Agent
• Comparative Example 1 Comparative Example 2 Silicone macromermethoxy group content: 0.5 mol%) - - Silicon macromethoxy group content: 1.1 mol%) 100 - Silicon macromethoxy group content: 0.05 mol%) - 100 filler Zinc oxide powder (average particle size: 0.6 ⁇ m) 445 445 Spherical Aluminum Oxide Powder (Average Size: 5 ⁇ m) - - Spherical Aluminum Oxide Powder (Average Size: 3 ⁇ m) 610 610 Spherical Aluminum Nitride Powder (Average Particle Size: 1 ⁇ m) - - Silica (Specific surface area: 220 m2 / g) 1.3 1.3 Toning Agent (KCC, YS0108K) 0.6 0.6 0.6 0.6 0.6 0.6 0.6 0.6 0.6 0.6 0.6 0.6 0.6 0.6 0.6 0.6 0.6 0.6 0.6 0.6 0.6 0.6 0.6 0.6 0.6 0.6 0.6 0.6 0.6 0.6 0.6 0.6 0.6 0.6
• Viscosity After leaving the silicone composition in a constant temperature room at 25 ° C. for 24 hours, the viscosity at shear rate 10 was measured using a rheometer viscometer from Brickfield.
• Thermal Conductivity After injecting the silicone composition into a 3 cm thick mold and covering the kitchen wrap, the thermal conductivity was measured using a thermal conductivity meter (QTM-500) manufactured by Kyoto Denshi Kogyo Co., Ltd.
• Example 1 Example 2 Example 3 Example 4 Example 5 Example 6 Example 7 Comparative Example 1 Comparative Example 2 importance 3.5 3.45 3.28 3.3 3.28 3.35 3.33 3.33 3.33 color Gray Gray Gray Gray Gray Gray Gray Gray Gray Gray Gray Gray Gray Gray Gray Gray Gray Gray Gray Gray Gray Gray Gray Gray Gray Gray Gray Gray Gray Viscosity (mPas) 56,000 30,000 65,000 38,000 22,000 50,000 45,000 7,000 25,000 Thermal Conductivity (W / mK) 3.1 2.9 3 3.1 2.2 2.7 2.6 2.5 2.3 Thermal resistance (K / W, thickness: 20 ⁇ m) 0.63 0.64 0.62 0.64 0.66 0.65 0.66 0.66 0.69 Thermal resistance (K / W, thickness: 100 ⁇ m) 0.75 0.75 0.74 0.74 0.76 0.76 0.76 0.76 0.79
• the silicone composition of the present invention is excellent in thermal conductivity.

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• 2016
  • 2016-11-21 KR KR1020160154665A patent/KR101864505B1/ko active IP Right Grant
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  • 2017-09-12 CN CN201780068534.XA patent/CN109906249A/zh active Pending
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