MY158023A - Curable resin composition and semiconductor device using same - Google Patents

Curable resin composition and semiconductor device using same

Info

Publication number
MY158023A
MY158023A MYPI2015700026A MYPI2015700026A MY158023A MY 158023 A MY158023 A MY 158023A MY PI2015700026 A MYPI2015700026 A MY PI2015700026A MY PI2015700026 A MYPI2015700026 A MY PI2015700026A MY 158023 A MY158023 A MY 158023A
Authority
MY
Malaysia
Prior art keywords
same
semiconductor device
resin composition
curable resin
curable
Prior art date
Application number
MYPI2015700026A
Inventor
Takenaka Hiroto
Itaya Ryo
Kamuro Shigeaki
Original Assignee
Daicel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daicel Corp filed Critical Daicel Corp
Publication of MY158023A publication Critical patent/MY158023A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
    • C08K5/098—Metal salts of carboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3477—Six-membered rings
    • C08K5/3492—Triazines
    • C08K5/34924—Triazines containing cyanurate groups; Tautomers thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/045—Polysiloxanes containing less than 25 silicon atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin

Abstract

null
MYPI2015700026A 2013-08-02 2014-07-04 Curable resin composition and semiconductor device using same MY158023A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013161865 2013-08-02

Publications (1)

Publication Number Publication Date
MY158023A true MY158023A (en) 2016-08-30

Family

ID=52431541

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2015700026A MY158023A (en) 2013-08-02 2014-07-04 Curable resin composition and semiconductor device using same

Country Status (6)

Country Link
JP (1) JP5736525B1 (en)
KR (1) KR101563472B1 (en)
CN (1) CN104583325B (en)
MY (1) MY158023A (en)
TW (1) TWI547525B (en)
WO (1) WO2015016001A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105008460B (en) 2013-02-14 2016-12-14 株式会社大赛璐 Hardening resin composition, solidfied material, encapsulant and semiconductor device
WO2015186722A1 (en) * 2014-06-06 2015-12-10 株式会社ダイセル Curable resin composition, cured product, sealing material, and semiconductor device
JP6826581B2 (en) * 2016-02-22 2021-02-03 株式会社ダイセル Curable resin composition, cured product thereof, and semiconductor device
US11124649B1 (en) 2016-07-19 2021-09-21 Nichia Corporation Curable resin composition, cured product of same and semiconductor device
US10947384B2 (en) 2016-09-07 2021-03-16 Daicel Corporation Curable resin composition, cured product thereof, and semiconductor device
KR101864505B1 (en) * 2016-11-21 2018-06-29 주식회사 케이씨씨 Silicone composition having excellent heat-radiating function
CN114672025B (en) * 2022-04-20 2022-12-02 波米科技有限公司 Heterocycle-containing POSS siloxane compound and preparation method and application thereof

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2757869B1 (en) * 1996-12-31 1999-05-21 Rhodia Chimie Sa USE OF PT-BASED MIXTURES AND TRANSITIONAL METAL COMPOUNDS OTHER THAN PT TO IMPROVE ARC RESISTANCE PROPERTIES OF SILICON ELASTOMERS
TWI428396B (en) * 2006-06-14 2014-03-01 Shinetsu Chemical Co Phosphor-filled curable silicone resin composition and cured product thereof
JP5444631B2 (en) * 2007-04-06 2014-03-19 横浜ゴム株式会社 Composition for sealing optical semiconductor element, cured product thereof and sealed optical semiconductor element
JP4877381B2 (en) * 2008-12-16 2012-02-15 横浜ゴム株式会社 Silanol condensation catalyst, heat-curable silicone resin composition for encapsulating optical semiconductor, and optical semiconductor encapsulant using the same
JP5300148B2 (en) * 2009-11-30 2013-09-25 日本化薬株式会社 Epoxy resin composition, curable resin composition
KR20120114237A (en) * 2009-11-30 2012-10-16 닛뽄 가야쿠 가부시키가이샤 Curable resin composition and cured product thereof
JP4788837B2 (en) * 2010-01-26 2011-10-05 横浜ゴム株式会社 Silicone resin composition and method for using the same, silicone resin, silicone resin-containing structure, and optical semiconductor element sealing body
TWI504681B (en) * 2010-03-08 2015-10-21 Lintec Corp A hardening composition, a hardened product, and a hardening composition
JP5784618B2 (en) * 2010-09-22 2015-09-24 株式会社カネカ Modified polyhedral polysiloxane, polyhedral polysiloxane composition, cured product, and optical semiconductor device
WO2012063822A1 (en) * 2010-11-10 2012-05-18 横浜ゴム株式会社 Thermosetting silicone resin composition, and silicone resin-containing structure and optical semiconductor element encapsulant obtained using same
WO2012066998A1 (en) * 2010-11-18 2012-05-24 横浜ゴム株式会社 Heat-curable silicone resin composition, silicone resin-containing structure, optical semiconductor element sealed body, and silanol condensation catalyst
JP2012111875A (en) 2010-11-25 2012-06-14 Daicel Corp Curable resin composition and cured article
JP2012162666A (en) * 2011-02-08 2012-08-30 Kaneka Corp Polysiloxane-based composition of polyhedral structure
JP2012201706A (en) * 2011-03-23 2012-10-22 Kaneka Corp Polysiloxane-based composition
KR101867459B1 (en) 2011-07-04 2018-06-14 제이엔씨 주식회사 Compound comprising isocyanuric skeleton, epoxy groups, and organopolysiloxane or silsesquioxane skeleton having sih groups, thermosetting resin composition comprising compound as agent for imparting adhesion, cured product, and sealing member for optical semiconductor
US9181397B2 (en) * 2011-12-22 2015-11-10 Daicel Corporation Curable resin composition and cured product thereof
US9447277B2 (en) * 2012-05-25 2016-09-20 Daicel Corporation Curable resin composition and cured product thereof, encapsulating agent, and optical semiconductor device
US9646904B2 (en) * 2013-01-09 2017-05-09 Daicel Corporation Curable resin composition, and cured product of same

Also Published As

Publication number Publication date
WO2015016001A9 (en) 2015-03-12
TW201512309A (en) 2015-04-01
CN104583325B (en) 2016-11-09
KR20150030279A (en) 2015-03-19
WO2015016001A1 (en) 2015-02-05
TWI547525B (en) 2016-09-01
JPWO2015016001A1 (en) 2017-03-02
CN104583325A (en) 2015-04-29
JP5736525B1 (en) 2015-06-17
KR101563472B1 (en) 2015-10-26

Similar Documents

Publication Publication Date Title
IN2013KO01129A (en)
BR112015028305A2 (en) integrated underground ventilation device
EP2942816A4 (en) Semiconductor device
EP3010042A4 (en) Semiconductor device
EP2980856A4 (en) Semiconductor device
EP3076431A4 (en) Semiconductor device
MY158023A (en) Curable resin composition and semiconductor device using same
HK1199326A1 (en) Semiconductor light emitting device and light emitting device
EP2955836A4 (en) Semiconductor device
EP2958156A4 (en) Novel compound semiconductor and use thereof
EP2874188A4 (en) Semiconductor device
EP3076425A4 (en) Semiconductor device
EP2973723A4 (en) Field effect transistor devices with protective regions
EP3076435A4 (en) Semiconductor device
SG11201405097QA (en) Resin composition and semiconductor device
EP3018712A4 (en) Semiconductor device
EP3059768A4 (en) Curable silicone composition, and optical semiconductor device
IN2014DE01038A (en)
GB2511541B (en) Field effect transistor device
BR112015023511A2 (en) tensor
EP2951225A4 (en) An epoxy resin composition,and its applications
AR097668A1 (en) COLOR-POLYMER
EP3059285A4 (en) Curable silicone composition, and optical semiconductor device
EP2899763A4 (en) Novel compound semiconductor and use thereof
BR112015023782A2 (en) pulleys set