WO2018061633A1 - ビーム走査装置およびパターン描画装置 - Google Patents
ビーム走査装置およびパターン描画装置 Download PDFInfo
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- WO2018061633A1 WO2018061633A1 PCT/JP2017/031734 JP2017031734W WO2018061633A1 WO 2018061633 A1 WO2018061633 A1 WO 2018061633A1 JP 2017031734 W JP2017031734 W JP 2017031734W WO 2018061633 A1 WO2018061633 A1 WO 2018061633A1
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- scanning
- optical system
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/10—Scanning systems
- G02B26/12—Scanning systems using multifaceted mirrors
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/10—Scanning systems
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/24—Curved surfaces
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70591—Testing optical components
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
- G03F7/70833—Mounting of optical systems, e.g. mounting of illumination system, projection system or stage systems on base-plate or ground
Definitions
- the present invention relates to a beam scanning device that scans a spot light of a beam irradiated on an irradiated surface of an object, and a pattern drawing device that draws and exposes a predetermined pattern using such a beam scanning device.
- a spot light of a laser beam is projected onto an object to be irradiated (processing object), and the spot light is main-scanned in a one-dimensional direction by a scanning mirror (polygon mirror), and the object to be irradiated is set in the main scanning line direction.
- a laser processing apparatus optical scanning, for example, Japanese Patent Laid-Open No. 2005-262260
- Japanese Patent Application Laid-Open No. 2005-262260 discloses a galvano that corrects the irradiation position on the workpiece by reflecting the laser beam from the oscillator 1 in the Y direction (sub-scanning direction).
- a mirror a polygon mirror that reflects the laser beam reflected by the galvanometer mirror and scans the workpiece in the X direction (main scanning direction), and the laser beam reflected by the galvanometer mirror is condensed on the workpiece.
- the reflection angle of the galvanometer mirror so as to correct the irradiation position error of the laser beam on the workpiece in correspondence with the distortion generated when the laser beam passes through the f ⁇ lens.
- FIG. 8 of Japanese Patent Laid-Open No. 2005-262260 shows a laser light source that emits a detection laser beam for detecting the end of each reflecting surface of the polygon mirror while the polygon mirror is rotating, and each reflecting surface of the polygon mirror. And a detector for generating an edge detection signal by receiving the reflected light of the detection laser beam reflected at the edge of the laser, and the timing of pulse oscillation in the oscillator based on the edge detection signal is disclosed in Japanese Patent Laid-Open No. 2005-262260. A configuration for controlling as shown in FIG. 9 is shown.
- a scanning beam having a refracting power that makes a processing beam deflected by a reflection surface of a scanning member having a variable angle incident and collects the processing beam as a spot on an irradiated body.
- a beam scanning device including an optical system for receiving a reflected beam of an origin detection beam projected toward the reflecting surface of the scanning member, and when the reflecting surface of the scanning member reaches a predetermined angle
- a photoelectric detector that outputs an origin signal representing a light collecting optical system that is set to a refractive power smaller than the refractive power of the scanning optical system and condenses the reflected beam as a spot on the photoelectric detector; Prepare.
- a scanning beam having a refracting power that makes a processing beam deflected by a reflecting surface of a scanning member having a variable angle incident and collects the processing beam as a spot on an irradiated body.
- a beam scanning device including an optical system for receiving a reflected beam of an origin detection beam projected toward the reflecting surface of the scanning member, and when the reflecting surface of the scanning member reaches a predetermined angle
- a photoelectric detector that outputs an origin signal representing the scanning speed of the reflected beam of the beam for origin detection scanned on the photoelectric detector, and the spot of the beam for processing on the irradiated object
- a scanning optical system having a refractive power that makes a drawing beam deflected by a reflection surface of a scanning member having a variable angle incident and collects the drawing beam as a spot on a substrate.
- a pattern drawing apparatus that draws a pattern on the substrate by scanning the spot at a speed corresponding to a change in the angle of the reflecting surface of the scanning member and modulating the intensity of the drawing beam according to the pattern.
- a photoelectric detector that receives a reflected beam of the beam for detecting the origin projected toward the reflecting surface of the scanning member and outputs an origin signal indicating a time when the reflecting surface of the scanning member reaches a predetermined angle;
- a condensing optical system that is set to a refractive power smaller than that of the scanning optical system and collects the reflected beam as a spot on the photoelectric detector.
- a scanning optical system having a refractive power that makes a drawing beam deflected by a reflection surface of a scanning member having a variable angle incident and collects the drawing beam as a spot on a substrate.
- a pattern drawing apparatus that draws a pattern on the substrate by scanning the spot at a speed corresponding to a change in the angle of the reflecting surface of the scanning member and modulating the intensity of the drawing beam according to the pattern.
- a photoelectric detector that receives a reflected beam of the beam for detecting the origin projected toward the reflecting surface of the scanning member and outputs an origin signal indicating a time when the reflecting surface of the scanning member reaches a predetermined angle;
- An optical member that increases a scanning speed of the reflected beam of the origin detection beam scanned on the photoelectric detector higher than a scanning speed of the spot of the drawing beam on the substrate.
- FIG. 3 is a diagram of the arrangement of a polygon mirror, an f ⁇ lens system, a beam light receiving unit and the like constituting an origin sensor in the drawing unit shown in FIG.
- FIG. 2 It is the figure which simplified and showed arrangement
- FIG. 3 It is a figure which shows the detailed structure of the photoelectric conversion element shown in FIG. 3 or FIG.
- FIG. 5 is a plan view of the eight-sided polygon mirror shown in FIG. 3 or FIG. 4. It is a figure explaining the method to measure the reproducibility (variation) of the generation
- FIG. 12 is a graph showing the result of actually measuring the reproducibility of the origin signal generated corresponding to each of the reflection surfaces of the polygon mirror by the method shown in FIG. 9 under conditions different from those in FIG. It is a figure which shows the modification which changed arrangement
- FIG. 1 is a perspective view showing a schematic configuration of an exposure apparatus (pattern drawing apparatus) EX that performs an exposure process on a substrate (irradiated body) P according to the first embodiment.
- the exposure apparatus EX is a substrate processing apparatus used in a device manufacturing system for manufacturing an electronic device by performing predetermined processing (exposure processing or the like) on the substrate P.
- the device manufacturing system is a manufacturing system in which a manufacturing line for manufacturing, for example, a flexible display as an electronic device, a film-like touch panel, a film-like color filter for a liquid crystal display panel, a flexible wiring, or a flexible sensor is constructed. System. The following description is based on the assumption that a flexible display is used as the electronic device. Examples of the flexible display include an organic EL display and a liquid crystal display.
- a substrate P is sent from a supply roll (not shown) in which a flexible sheet-like substrate (sheet substrate) P is wound in a roll shape, and various processes are continuously performed on the sent substrate P.
- the substrate P after various treatments is wound up by a collection roll (not shown), which is a so-called roll-to-roll production method. Therefore, the substrate P after various treatments is a multi-sided substrate in which a plurality of devices (display panels) are arranged in a state where they are connected in the transport direction of the substrate P.
- the substrate P sent from the supply roll is sequentially subjected to various processes through the process device in the previous process, the exposure apparatus EX, and the process apparatus in the subsequent process, and is taken up by the collection roll.
- the substrate P has a belt-like shape in which the moving direction (transport direction) of the substrate P is the longitudinal direction (long direction) and the width direction is the short direction (short direction).
- a resin film or a foil (foil) made of a metal or alloy such as stainless steel is used for the substrate P.
- the material of the resin film include polyethylene resin, polypropylene resin, polyester resin, ethylene vinyl copolymer resin, polyvinyl chloride resin, cellulose resin, polyamide resin, polyimide resin, polycarbonate resin, polystyrene resin, and vinyl acetate resin. Among them, one containing at least one or more may be used.
- the thickness and rigidity (Young's modulus) of the substrate P are within a range in which folds and irreversible wrinkles due to buckling do not occur in the substrate P when passing through the transport path of the device manufacturing system or the exposure apparatus EX.
- a film such as PET (polyethylene terephthalate) or PEN (polyethylene naphthalate) having a thickness of about 25 ⁇ m to 200 ⁇ m is typical of a suitable sheet substrate.
- the substrate P may receive heat in each process performed in the device manufacturing system, it is preferable to select the substrate P made of a material whose thermal expansion coefficient is not significantly large.
- the thermal expansion coefficient can be suppressed by mixing an inorganic filler with a resin film.
- the inorganic filler may be, for example, titanium oxide, zinc oxide, alumina, or silicon oxide.
- the substrate P may be a single layer of ultrathin glass having a thickness of about 100 ⁇ m manufactured by a float process or the like, or a laminate in which the above resin film, foil, or the like is bonded to the ultrathin glass. It may be.
- the flexibility of the substrate P means the property that the substrate P can be bent without being sheared or broken even when a force of its own weight is applied to the substrate P. .
- flexibility includes a property of bending by a force of about its own weight.
- the degree of flexibility varies depending on the material, size and thickness of the substrate P, the layer structure formed on the substrate P, the environment such as temperature or humidity, and the like. In any case, when the substrate P is correctly wound around various transfer rollers, rotary drums, and other members for transfer direction provided in the transfer path in the device manufacturing system (exposure apparatus EX), the substrate P buckles and creases. If the substrate P can be smoothly transported without being attached or damaged (breaking or cracking), it can be said to be in the range of flexibility.
- the process device (including a single processing unit or a plurality of processing units) in the preceding process transports the substrate P sent from the supply roll along the longitudinal direction at a predetermined speed toward the exposure apparatus EX. Then, the previous process is performed on the substrate P sent to the exposure apparatus EX.
- the substrate P sent to the exposure apparatus EX by this pre-process is a substrate (photosensitive substrate) having a photosensitive functional layer (photosensitive layer) formed on the surface thereof.
- This photosensitive functional layer is applied as a solution on the substrate P and dried to form a layer (film).
- a typical photosensitive functional layer is a photoresist (in liquid or dry film form), but as a material that does not require development processing, the photosensitivity of the part that has been irradiated with ultraviolet rays is modified.
- SAM silane coupling agent
- the pattern portion exposed to ultraviolet rays on the substrate P is modified from lyophobic to lyophilic.
- conductive ink ink containing conductive nanoparticles such as silver or copper
- a liquid containing a semiconductor material on the lyophilic portion, a thin film transistor (TFT) or the like
- a pattern layer serving as an electrode, a semiconductor, insulation, or a connection wiring can be formed.
- a photosensitive reducing agent is used as the photosensitive functional layer
- the plating reducing group is exposed to the pattern portion exposed to ultraviolet rays on the substrate P. Therefore, after exposure, the substrate P is immediately immersed in a plating solution containing palladium ions or the like for a certain period of time to form (deposit) a pattern layer made of palladium.
- Such a plating process is an additive process, but may be based on an etching process as a subtractive process.
- the substrate P sent to the exposure apparatus EX is made of PET or PEN as a base material, and a metal thin film such as aluminum (Al) or copper (Cu) is deposited on the entire surface or selectively, and further on It is preferable that a photoresist layer is laminated on the substrate.
- the exposure apparatus (processing apparatus) EX transports the substrate P, which has been transported from the previous process apparatus, to a subsequent process apparatus (including a single processing section or a plurality of processing sections) at a predetermined speed. However, it is a processing apparatus that performs an exposure process on the substrate P.
- the exposure apparatus EX uses a light corresponding to a pattern for an electronic device (for example, a pattern of an electrode or wiring of a TFT constituting the electronic device) on the surface of the substrate P (the surface of the photosensitive functional layer, that is, the photosensitive surface). Irradiate the pattern. Thereby, a latent image (modified portion) corresponding to the pattern is formed on the photosensitive functional layer.
- the exposure apparatus EX is a direct drawing type exposure apparatus that does not use a mask as shown in FIG. 1, that is, a so-called spot scanning type exposure apparatus (drawing apparatus).
- the exposure apparatus EX performs pattern exposure for each part of the rotating drum DR that supports the substrate P and conveys it in the longitudinal direction for sub-scanning, and the substrate P that is supported in a cylindrical surface by the rotating drum DR.
- drawing units Un U1 to U6
- each of the plurality of drawing units Un receives spot light SP of a pulsed beam LB (pulse beam) for exposure
- the intensity of the spot light SP is measured with pattern data (drawing data) while one-dimensionally scanning (main scanning) with a polygon mirror (scanning member) in a predetermined scanning direction (Y direction) on the irradiated surface (photosensitive surface) of the substrate P.
- Modulation on / off at high speed according to the pattern information).
- a light pattern corresponding to a predetermined pattern such as an electronic device, a circuit, or a wiring is drawn and exposed on the irradiated surface of the substrate P.
- the spot light SP is relatively two-dimensionally scanned on the surface to be irradiated (the surface of the photosensitive functional layer) of the substrate P by the sub-scanning of the substrate P and the main scanning of the spot light SP.
- a predetermined pattern is drawn and exposed on the irradiated surface.
- a plurality of exposed areas where the pattern is exposed by the exposure apparatus EX are provided at predetermined intervals along the longitudinal direction of the substrate P. It will be. Since an electronic device is formed in this exposed region, the exposed region is also a device forming region.
- the rotary drum DR has a central axis AXo extending in the Y direction and extending in a direction intersecting with the direction in which gravity works, and a cylindrical outer peripheral surface having a constant radius from the central axis AXo.
- the rotating drum DR rotates around the central axis AXo while supporting (holding) a part of the substrate P by bending the outer surface (circumferential surface) into a cylindrical surface in the longitudinal direction. P is transported in the longitudinal direction.
- the rotating drum DR supports an area (part) on the substrate P onto which the beam LB (spot light SP) from each of the plurality of drawing units Un (U1 to U6) is projected on its outer peripheral surface.
- the rotating drum DR supports (holds and holds) the substrate P from the surface (back surface) opposite to the surface on which the electronic device is formed (surface on which the photosensitive surface is formed).
- shafts (not shown) supported by bearings are provided so as to rotate the rotating drum DR around the central axis AXo.
- the shaft is given a rotational torque from a rotational drive source (not shown) (for example, a motor, a speed reduction mechanism, etc.), and the rotary drum DR rotates around the central axis AXo at a constant rotational speed.
- the light source device (pulse light source device) LS generates and emits a pulsed beam (pulse beam, pulse light, laser) LB.
- This beam LB is ultraviolet light having sensitivity to the photosensitive layer of the substrate P and having a peak wavelength in a wavelength band of 370 nm or less.
- the light source device LS emits and emits a pulsed beam LB at a frequency (oscillation frequency, predetermined frequency) Fa according to control of a drawing control device (not shown).
- the light source device LS includes a semiconductor laser element that generates pulsed light in the infrared wavelength range, a fiber amplifier, and a wavelength conversion element (harmonic) that converts the amplified pulsed light in the infrared wavelength range into pulsed light in the ultraviolet wavelength range.
- a fiber amplifier laser light source composed of a wave generating element).
- the light source device LS is a fiber amplifier laser light source and the pulse generation of the beam LB is turned on / off at high speed according to the state of the pixels constituting the drawing data (logical value “0” or “1”). This is disclosed in the pamphlet of published No. 2015/166910.
- a beam LB emitted from the light source device LS includes a selection optical element OSn (OS1 to OS6) as a plurality of switching elements, a plurality of reflection mirrors M1 to M12, a plurality of incident mirrors IMn (IM1 to IM6), The light is selectively (alternatively) supplied to each of the drawing units Un (U1 to U6) via a beam switching unit including an absorber TR and the like.
- the selection optical elements OSn (OS1 to OS6) are transmissive to the beam LB, and are driven by an ultrasonic signal to deflect and emit the first-order diffracted light of the incident beam LB at a predetermined angle.
- An acousto-optic modulator (AOM: Acousto-Optic Modulator).
- the plurality of selection optical elements OSn and the plurality of incident mirrors IMn are provided corresponding to each of the plurality of drawing units Un.
- the selection optical element OS1 and the incident mirror IM1 are provided corresponding to the drawing unit U1
- the selection optical element OS2 to OS6 and the incidence mirror IM2 to IM6 correspond to the drawing units U2 to U6, respectively. Is provided.
- the beam LB from the light source device LS is guided by the reflecting mirrors M1 to M12 so that its optical path is bent in a spiral shape and to the absorber TR.
- OSn selection optical elements
- OS6 selection optical elements
- an off state a state where no ultrasonic signal is applied and no first-order diffracted light is generated
- a plurality of lenses are provided in the beam optical path from the reflection mirror M1 to the absorber TR, and the plurality of lenses converge the beam LB from the parallel light flux or after convergence.
- the diverging beam LB is returned to a parallel light beam. The configuration will be described later with reference to FIG.
- the beam LB from the light source device LS travels in the ⁇ X direction parallel to the X axis and enters the reflection mirror M1.
- the beam LB reflected in the ⁇ Y direction by the reflection mirror M1 enters the reflection mirror M2.
- the beam LB reflected in the + X direction by the reflection mirror M2 passes straight through the selection optical element OS5 and reaches the reflection mirror M3.
- the beam LB reflected in the ⁇ Y direction by the reflection mirror M3 enters the reflection mirror M4.
- the beam LB reflected in the ⁇ X direction by the reflection mirror M4 passes straight through the selection optical element OS6 and reaches the reflection mirror M5.
- the beam LB reflected in the ⁇ Y direction by the reflection mirror M5 enters the reflection mirror M6.
- the beam LB reflected in the + X direction by the reflection mirror M6 passes straight through the selection optical element OS3 and reaches the reflection mirror M7.
- the beam LB reflected in the ⁇ Y direction by the reflection mirror M7 enters the reflection mirror M8.
- the beam LB reflected in the ⁇ X direction by the reflection mirror M8 passes straight through the selection optical element OS4 and reaches the reflection mirror M9.
- the beam LB reflected in the ⁇ Y direction by the reflection mirror M9 enters the reflection mirror M10.
- the beam LB reflected in the + X direction by the reflection mirror M10 passes straight through the selection optical element OS1 and reaches the reflection mirror M11.
- the beam LB reflected in the ⁇ Y direction by the reflection mirror M11 enters the reflection mirror M12.
- the beam LB reflected in the ⁇ X direction by the reflection mirror M12 passes straight through the selection optical element OS2 and is guided to the absorber TR.
- the absorber TR is an optical trap that absorbs the beam LB in order to suppress leakage of the beam LB to the outside.
- each of the selection optical elements OSn (OS1 to OS6) has a function of deflecting the optical path of the beam LB from the light source device LS.
- the beam LBn (LB1 to LB6) deflected by each of the selection optical elements OSn is the original. It is lower than the intensity of the beam LB.
- the drawing control device controls the selected optical element OSn (OS1 to OS6) so that only one of the selected optical elements OSn (OS1 to OS6) is turned on for a predetermined time.
- one selected optical element OSn is in the ON state, about 20% of zero-order light that travels straight without being diffracted by the optical element for selection OSn remains, but it is finally absorbed by the absorber TR.
- Each of the selection optical elements OSn is installed so as to deflect the beam LBn (LB1 to LB6) which is the deflected first-order diffracted light in the ⁇ Z direction with respect to the incident beam LB.
- Beams LBn (LB1 to LB6) deflected and emitted from each of the selection optical elements OSn are projected onto incident mirrors IMn (IM1 to IM6) provided at positions away from each of the selection optical elements OSn by a predetermined distance. Is done.
- Each incident mirror IMn reflects the incident beam LBn (LB1 to LB6) in the ⁇ Z direction, thereby guiding the beam LBn (LB1 to LB6) to the corresponding drawing unit Un (U1 to U6).
- each selection optical element OSn may be used.
- Each of the plurality of optical elements for selection OSn turns on / off generation of diffracted light obtained by diffracting the incident beam LB in accordance with on / off of a drive signal (ultrasonic signal) from the drawing control device.
- the selection optical element OS5 transmits the incident beam LB from the light source device LS without diffracting it when the drive signal (high frequency signal) from the drawing control device is not applied and is in the off state. Therefore, the beam LB transmitted through the selection optical element OS5 enters the reflection mirror M3.
- the selection optical element OS5 is in the on state, the incident beam LB is diffracted and directed to the incident mirror IM5.
- the switching (beam selection) operation by the selection optical element OS5 is controlled by turning on / off the drive signal.
- the switching operation of each selection optical element OSn can guide the beam LB from the light source device LS to any one drawing unit Un, and switch the drawing unit Un on which the beam LBn is incident. Can do.
- a configuration in which a plurality of optical elements for selection OSn are arranged in series with respect to the beam LB from the light source device LS and the beam LBn is supplied to the corresponding drawing unit Un in a time-sharing manner. This is disclosed in the pamphlet of published No. 2015/166910.
- each of the selection optical elements OSn (OS1 to OS6) constituting the beam switching unit is turned on for a predetermined time is, for example, OS1 ⁇ OS2 ⁇ OS3 ⁇ OS4 ⁇ OS5 ⁇ OS6 ⁇ OS1 ⁇ .
- This order is determined by the order of the scanning start timing by the spot light set in each of the drawing units Un (U1 to U6). That is, in the present embodiment, any one of the drawing units U1 to U6 is synchronized with the rotation speed of the polygon mirror provided in each of the six drawing units U1 to U6 in synchronization with the phase of the rotation angle. It is possible to switch to the time division so that one reflection surface of the polygon mirror in one of them performs one spot scanning on the substrate P.
- the order of spot scanning of the drawing unit Un may be any as long as the phase of the rotation angle of each polygon mirror of the drawing unit Un is synchronized in a predetermined relationship.
- three drawing units U1, U3, U5 are arranged in the Y direction on the upstream side in the transport direction of the substrate P (the direction in which the outer peripheral surface of the rotary drum DR moves in the circumferential direction).
- Three drawing units U2, U4, U6 are arranged in the Y direction on the downstream side in the transport direction.
- pattern drawing on the substrate P is started from the upstream odd-numbered drawing units U1, U3, U5, and when the substrate P is fed for a certain length, the even-numbered drawing units U2, U4, U6 on the downstream side. Since pattern drawing is also started, the order of spot scanning of the drawing unit Un can be set as U1 ⁇ U3 ⁇ U5 ⁇ U2 ⁇ U4 ⁇ U6 ⁇ U1 ⁇ . Therefore, the order in which each of the selection optical elements OSn (OS1 to OS6) is turned on for a certain period of time is determined as OS1 ⁇ OS3 ⁇ OS5 ⁇ OS2 ⁇ OS4 ⁇ OS6 ⁇ OS1 ⁇ . .
- each of the drawing units U1 to U6 is provided with a polygon mirror PM for main scanning the incident beams LB1 to LB6.
- the polygon mirrors PM of the respective drawing units Un are synchronously controlled so as to maintain a constant rotational angle phase with each other while precisely rotating at the same rotational speed.
- the main scanning timing (main scanning period of the spot light SP) of each of the beams LB1 to LB6 projected onto the substrate P from each of the drawing units U1 to U6 can be set so as not to overlap each other.
- each of the selection optical elements OSn (OS1 to OS6) provided in the beam switching unit is controlled in synchronization with the rotational angle positions of each of the six polygon mirrors PM.
- An efficient exposure process in which the beam LB from the LS is time-divided to each of the plurality of drawing units Un can be performed.
- Synchronous control of the phase alignment of the rotation angles of each of the six polygon mirrors PM and the on / off switching timings of the selection optical elements OSn is disclosed in International Publication No. 2015/166910.
- the six polygon mirrors PM are rotated by shifting the phase of the rotation angle by 15 degrees relatively, and each polygon mirror PM scans the beam LBn by skipping one of the eight reflecting surfaces.
- On / off switching of each of the optical elements OSn (OS1 to OS6) is controlled.
- a drawing method using one reflecting surface of the polygon mirror PM is also disclosed in International Publication No. 2015/166910.
- the exposure apparatus EX is a so-called multi-head direct drawing exposure method in which a plurality of drawing units Un (U1 to U6) having the same configuration are arranged.
- Each of the drawing units Un draws a pattern for each partial region partitioned in the Y direction of the substrate P supported by the outer peripheral surface (circumferential surface) of the rotary drum DR.
- Each drawing unit Un (U1 to U6) condenses (converges) the beam LBn on the substrate P while projecting the beam LBn from the beam switching unit onto the substrate P (on the irradiated surface of the substrate P). Thereby, the beam LBn (LB1 to LB6) projected onto the substrate P becomes the spot light SP.
- the spot light SP of the beam LBn (LB1 to LB6) projected on the substrate P is scanned in the main scanning direction (Y direction) by the rotation of the polygon mirror PM of each drawing unit Un.
- the drawing line SLn is also a scanning locus on the substrate P of the spot light SP of the beam LBn.
- the drawing unit U1 scans the spot light SP along the drawing line SL1, and similarly, the drawing units U2 to U6 scan the spot light SP along the drawing lines SL2 to SL6.
- the drawing lines SLn (SL1 to SL6) of the plurality of drawing units Un (U1 to U6) include a central plane that includes the central axis AXo of the rotary drum DR and is parallel to the YZ plane. It is arranged in a staggered arrangement in two rows in the circumferential direction of DR.
- the odd-numbered drawing lines SL1, SL3, SL5 are located on the irradiated surface of the substrate P on the upstream side ( ⁇ X direction side) in the transport direction of the substrate P with respect to the center surface, and along the Y direction. They are arranged in a row at a predetermined interval.
- the even-numbered drawing lines SL2, SL4, SL6 are located on the irradiated surface of the substrate P on the downstream side (+ X direction side) in the transport direction of the substrate P with respect to the center surface, and are predetermined along the Y direction. Are arranged in a row separated by an interval of.
- a plurality of drawing units Un (U1 to U6) are also arranged in a staggered arrangement in two rows in the transport direction of the substrate P across the center plane, and odd-numbered drawing units U1, U3, U5 and even-numbered drawing
- the units U2, U4, and U6 are provided symmetrically with respect to the center plane when viewed in the XZ plane.
- the odd-numbered drawing lines SL1, SL3, SL5 and the even-numbered drawing lines SL2, SL4, SL6 are separated from each other, but the Y direction (the width direction of the substrate P).
- the main scanning direction) is set to be joined without being separated from each other.
- the drawing lines SL1 to SL6 are substantially parallel to the width direction of the substrate P, that is, the central axis AXo of the rotary drum DR.
- joining the drawing lines SLn in the Y direction means that the positions of the ends of the drawing lines SLn are adjacent or partially overlapped.
- the length of each drawing line SLn may be overlapped within a range of several percent or less in the Y direction including the drawing start point or the drawing end point. .
- the plurality of drawing units Un share the Y-direction scanning area (the main scanning range section) so as to cover the width dimension of the exposure area on the substrate P in total. ing.
- the main scanning range in the Y direction the length of the drawing line SLn
- drawing can be performed by arranging a total of six drawing units U1 to U6 in the Y direction.
- the width in the Y direction of a large exposure area is increased to about 180 to 360 mm.
- the length of each drawing line SLn (SL1 to SL6) (length of the drawing range) is basically the same. That is, the scanning distance of the spot light SP of the beam LBn scanned along each of the drawing lines SL1 to SL6 is basically the same.
- the spot light SP projected on the drawing line SLn during the main scanning is the beam It becomes discrete according to the oscillation frequency Fa (for example, 400 MHz) of the LB. Therefore, it is necessary to overlap the spot light SP projected by one pulse light of the beam LB and the spot light SP projected by the next one pulse light in the main scanning direction.
- the amount of overlap is set by the size ⁇ of the spot light SP, the scanning speed (main scanning speed) Vs of the spot light SP, and the oscillation frequency Fa of the beam LB.
- the effective size (diameter) ⁇ of the spot light SP is 1 / e 2 (or 1/2) of the peak intensity of the spot light SP when the intensity distribution of the spot light SP is approximated by a Gaussian distribution. Determined by width dimension.
- the scanning speed Vs of the spot light SP rotational speed of the polygon mirror PM
- the spot light SP so that the spot light SP overlaps the effective size (dimension) ⁇ by about ⁇ ⁇ 1 ⁇ 2.
- the oscillation frequency Fa is set. Therefore, the projection interval along the main scanning direction of the pulsed spot light SP is ⁇ / 2.
- the substrate P is effective for the spot light SP between one scanning of the spot light SP along the drawing line SLn and the next scanning. It is desirable to set so as to move by a distance of about 1 ⁇ 2 of a large size ⁇ . Further, when drawing lines SLn adjacent in the Y direction are continued in the main scanning direction, it is desirable to overlap by ⁇ / 2. In the present embodiment, the size (dimension) ⁇ of the spot light SP is set to about 3 to 4 ⁇ m.
- Each drawing unit Un (U1 to U6) is set so that each beam LBn travels toward the central axis AXo of the rotary drum DR when viewed in the XZ plane.
- the optical path (beam principal ray) of the beam LBn traveling from each drawing unit Un (U1 to U6) toward the substrate P becomes parallel to the normal line of the irradiated surface of the substrate P in the XZ plane.
- the beam LBn irradiated from each of the drawing units Un (U1 to U6) to the drawing line SLn (SL1 to SL6) is relative to the tangential plane at the drawing line SLn on the surface of the substrate P curved into a cylindrical surface. It is projected toward the substrate P so as to be always vertical. That is, with respect to the main scanning direction of the spot light SP, the beams LBn (LB1 to LB6) projected onto the substrate P are scanned in a telecentric state.
- the drawing unit U1 includes at least reflecting mirrors M20 to M24, a polygon mirror PM, and an f ⁇ lens system (drawing scanning lens) FT.
- a first cylindrical lens CYa (see FIG. 2) is disposed in front of the polygon mirror PM when viewed from the traveling direction of the beam LB1, and an f ⁇ lens system (f- ⁇ lens) is provided.
- a second cylindrical lens CYb (see FIG. 2) is provided after the FT.
- the first cylindrical lens CYa and the second cylindrical lens CYb correct the position variation in the sub-scanning direction of the spot light SP (drawing line SL1) due to the tilt error of each reflecting surface of the polygon mirror PM.
- the beam LB1 reflected in the ⁇ Z direction by the incident mirror IM1 enters the reflection mirror M20 provided in the drawing unit U1, and the beam LB1 reflected by the reflection mirror M20 advances in the ⁇ X direction and enters the reflection mirror M21.
- the beam LB1 reflected in the ⁇ Z direction by the reflection mirror M21 enters the reflection mirror M22, and the beam LB1 reflected by the reflection mirror M22 advances in the + X direction and enters the reflection mirror M23.
- the reflection mirror M23 reflects the incident beam LB1 toward the reflection surface RP of the polygon mirror PM so as to be bent in a plane parallel to the XY plane.
- the polygon mirror PM reflects the incident beam LB1 toward the + ⁇ direction toward the f ⁇ lens system FT.
- the polygon mirror PM deflects (reflects) the incident beam LB1 one-dimensionally in a plane parallel to the XY plane in order to scan the spot light SP of the beam LB1 on the irradiated surface of the substrate P.
- the polygon mirror (rotating polygonal mirror, movable deflecting member) PM includes a rotating shaft AXp extending in the Z-axis direction and a plurality of reflecting surfaces RP (reflecting in the present embodiment) formed around the rotating shaft AXp.
- the number of planes RP is assumed to be 8).
- the reflection angle of the pulsed beam LB1 irradiated on the reflection surface can be continuously changed by rotating the polygon mirror PM around the rotation axis AXp in a predetermined rotation direction.
- the beam LB1 is deflected by one reflecting surface RP, and the spot light SP of the beam LB1 irradiated on the irradiated surface of the substrate P is scanned along the main scanning direction (the width direction of the substrate P, the Y direction). can do.
- the number of drawing lines SL1 in which the spot light SP is scanned on the irradiated surface of the substrate P by one rotation of the polygon mirror PM is eight, which is the same as the number of the reflecting surfaces RP.
- the f ⁇ lens system (scanning lens, scanning optical system) FT is a telecentric scanning lens that projects the beam LB1 reflected by the polygon mirror PM onto the reflecting mirror M24.
- the beam LB1 transmitted through the f ⁇ lens system FT is projected onto the substrate P as the spot light SP through the reflection mirror M24.
- the reflection mirror M24 reflects the beam LB1 toward the substrate P so that the beam LB1 travels toward the central axis AXo of the rotary drum DR with respect to the XZ plane.
- the incident angle ⁇ of the beam LB1 to the f ⁇ lens system FT varies depending on the rotation angle ( ⁇ / 2) of the polygon mirror PM.
- the f ⁇ lens system FT projects the beam LB1 to the image height position on the irradiated surface of the substrate P in proportion to the incident angle ⁇ through the reflection mirror M24.
- the focal length of the f ⁇ lens system FT is fo and the image height position is yo
- a surface (parallel to the XY plane) on which the beam LB1 incident on the f ⁇ lens system FT is deflected in one dimension by the polygon mirror PM is a surface including the optical axis AXf of the f ⁇ lens system FT.
- the optical configuration of the drawing units Un (U1 to U6) will be described with reference to FIG.
- the drawing unit Un along the traveling direction of the beam LBn from the incident position of the beam LBn to the irradiated surface (substrate P), the reflection mirror M20, the reflection mirror M20a, and the polarization beam splitter BS1.
- an origin sensor (origin detection) that detects the angular position of each reflecting surface of the polygon mirror PM in order to detect the drawing start possible timing (scanning start timing of the spot light SP) of the drawing unit Un.
- a beam transmitting unit 60a and a beam receiving unit 60b are provided.
- the reflected light of the beam LBn reflected by the irradiated surface of the substrate P (or the surface of the rotating drum DR) is converted into the f ⁇ lens system FT, the polygon mirror PM, the polarization beam splitter BS1, and the like.
- a photodetector DTc is provided for detection via
- the beam LBn incident on the drawing unit Un travels in the ⁇ Z direction along the optical axis AX1 parallel to the Z axis, and is incident on the reflection mirror M20 inclined by 45 ° with respect to the XY plane.
- the beam LBn reflected by the reflection mirror M20 travels in the ⁇ X direction toward the reflection mirror M20a that is separated from the reflection mirror M20 in the ⁇ X direction.
- the reflection mirror M20a is disposed with an inclination of 45 ° with respect to the YZ plane, and reflects the incident beam LBn toward the polarization beam splitter BS1 in the ⁇ Y direction.
- the polarization separation surface of the polarization beam splitter BS1 is disposed at an angle of 45 ° with respect to the YZ plane, reflects a P-polarized beam, and transmits a linearly polarized (S-polarized) beam polarized in a direction orthogonal to the P-polarized light. If the beam LBn incident on the drawing unit Un is a P-polarized beam, the polarization beam splitter BS1 reflects the beam LBn from the reflection mirror M20a in the ⁇ X direction and guides it to the reflection mirror M21 side.
- the reflection mirror M21 is disposed at an angle of 45 ° with respect to the XY plane, and reflects the incident beam LBn in the ⁇ Z direction toward the reflection mirror M22 that is separated from the reflection mirror M21 in the ⁇ Z direction.
- the beam LBn reflected by the reflection mirror M21 enters the reflection mirror M22.
- the reflection mirror M22 is disposed with an inclination of 45 ° with respect to the XY plane, and reflects the incident beam LBn toward the reflection mirror M23 in the + X direction.
- the beam LBn reflected by the reflection mirror M22 enters the reflection mirror M23 via a ⁇ / 4 wavelength plate (not shown) and a cylindrical lens CYa.
- the reflection mirror M23 reflects the incident beam LBn toward the polygon mirror PM.
- the polygon mirror PM reflects the incident beam LBn toward the + X direction toward an f ⁇ lens system FT having an optical axis AXf parallel to the X axis.
- the polygon mirror PM deflects (reflects) the incident beam LBn one-dimensionally in a plane parallel to the XY plane in order to scan the spot light SP of the beam LBn on the irradiated surface of the substrate P.
- the polygon mirror PM has a plurality of reflecting surfaces (each side of a regular octagon in this embodiment) formed around a rotation axis AXp extending in the Z-axis direction, and is rotated by a rotation motor RM coaxial with the rotation axis AXp. Is done.
- the rotation motor RM is rotated at a constant rotation speed (for example, about 30,000 to 40,000 rpm) by a drawing control device (not shown).
- the effective length (for example, 50 mm) of the drawing lines SLn (SL1 to SL6) is set to a length equal to or shorter than the maximum scanning length (for example, 52 mm) that can scan the spot light SP by the polygon mirror PM.
- the center point of the drawing line SLn (the point through which the optical axis AXf of the f ⁇ lens system FT passes) is set at the center of the maximum scanning length.
- the cylindrical lens CYa converges the incident beam LBn on the reflection surface of the polygon mirror PM in the sub-scanning direction (Z direction) orthogonal to the main scanning direction (rotation direction) of the polygon mirror PM. That is, the cylindrical lens CYa converges the beam LBn in a slit shape (ellipse shape) extending in a direction parallel to the XY plane on the reflection surface of the polygon mirror PM. Even if the reflective surface of the polygon mirror PM is tilted from a state parallel to the Z axis by a cylindrical lens CYa whose generating line is parallel to the Y direction and a cylindrical lens CYb described later, the substrate P is irradiated. It is possible to prevent the irradiation position of the beam LBn (drawing line SLn) irradiated on the surface from shifting in the sub-scanning direction.
- the incident angle ⁇ of the beam LBn to the f ⁇ lens system FT (the angle with respect to the optical axis AXf) varies depending on the rotation angle ( ⁇ / 2) of the polygon mirror PM.
- the incident angle ⁇ of the beam LBn to the f ⁇ lens system FT is 0 degree
- the beam LBn incident on the f ⁇ lens system FT advances along the optical axis AXf.
- the beam LBn from the f ⁇ lens system FT is reflected in the ⁇ Z direction by the reflecting mirror M24, and is projected toward the substrate P through the cylindrical lens CYb.
- the beam LBn projected onto the substrate P by the f ⁇ lens system FT and the cylindrical lens CYb whose generating line is parallel to the Y direction is a minute spot light having a diameter of about several ⁇ m (for example, 2 to 3 ⁇ m) on the irradiated surface of the substrate P. Converged to SP.
- the beam LBn incident on the drawing unit Un is bent along the optical path cranked in a U-shape from the reflection mirror M20 to the substrate P when viewed in the XZ plane, and proceeds in the ⁇ Z direction to the substrate. Projected to P.
- Each of the six drawing units U1 to U6 scans the spot light SP of the beams LB1 to LB6 one-dimensionally in the main scanning direction (Y direction) and conveys the substrate P in the longitudinal direction, thereby The irradiated surface is relatively two-dimensionally scanned by the spot light SP, and the pattern drawn on each of the drawing lines SL1 to SL6 is exposed on the substrate P in a state where the patterns are joined in the Y direction.
- the effective scanning length LT of the drawing lines SLn is 50 mm
- the effective diameter ⁇ of the spot light SP is 4 ⁇ m
- the oscillation frequency Fa of the pulse emission of the beam LB from the light source device LS is 400 MHz.
- the pulsed light is emitted so that the spot light SP overlaps by 1/2 of the diameter ⁇ along the drawing line SLn (main scanning direction)
- the pixel size Pxy defined on the drawing data is set to 4 ⁇ m square on the substrate P, and one pixel is exposed by two pulses of the spot light SP in each of the main scanning direction and the sub-scanning direction.
- the scanning speed Vsp becomes high, it is also necessary to improve the reproducibility of the generation timing of the origin signal from the origin sensor (the beam transmitter 60a and the beam receiver 60b) that determines the pattern drawing start timing.
- the minimum dimension (minimum line width) of a pattern to be drawn is 8 ⁇ m (for two pixels)
- a new pattern is superimposed on the pattern already formed on the substrate P and exposed.
- the overlay accuracy (allowable position error range) in the second exposure is required to be about 1 ⁇ 4 to 5 of the minimum line width. That is, when the minimum line width is 8 ⁇ m, the allowable position error range is 2 ⁇ m to 1.6 ⁇ m.
- This value is equal to or less than the interval of two pulses of the spot light SP corresponding to the oscillation period Tf (2.5 nS) of the beam LB from the light source device LS, and it is confirmed that an error for one pulse of the spot light SP is not allowed. means. For this reason, the reproducibility of the origin signal generation timing that determines the pattern drawing start timing (start position) needs to be set to a period Tf (2.5 nS) or less.
- the rotation position of the reflection surface RP of the polygon mirror PM is just before the scanning of the spot light SP of the drawing beam LBn by the reflection surface RP can be started.
- An origin signal SZn whose waveform changes at the moment of arrival at a predetermined position is generated. Since the polygon mirror PM has eight reflecting surfaces RP, the beam receiving unit 60b outputs the origin signal SZn eight times during one rotation of the polygon mirror PM.
- the origin signal SZn is sent to a drawing control device (not shown), and after the origin signal SZn is generated, scanning of the spot light SP along the drawing line SLn is started after a predetermined delay time Tdn has elapsed.
- FIG. 3 is a view of the arrangement of the beam receiving unit 60b constituting the polygon mirror PM, the f ⁇ lens system FT, the origin sensor, and the like in the drawing unit Un in the XY plane.
- the laser beam Bga from the beam transmitting unit 60a is projected toward one reflecting surface RPa of the reflecting surfaces RP of the polygon mirror PM, and the spot light SP of the drawing beam LBn is drawn into the drawing line SLn.
- the angle state of the reflective surface RPa at the moment when it is located at the drawing start point is shown.
- the reflection surface RP (RPa) of the polygon mirror PM is disposed so as to be positioned on the entrance pupil plane orthogonal to the optical axis AXf of the f ⁇ lens system FT.
- the beam LBn traveling from the reflecting mirror M23 toward the polygon mirror PM A reflection surface RP (RPa) is set at a position where the principal ray and the optical axis AXf intersect.
- the distance from the main surface of the f ⁇ lens system FT to the surface of the substrate P (the condensing point of the spot light SP) is the focal length fo.
- the laser beam Bga is projected onto the reflection surface RPa as a parallel light flux in a non-photosensitive wavelength range with respect to the photosensitive functional layer of the substrate P.
- the reflected beam Bgb of the laser beam Bga reflected by the reflecting surface RPa is directed toward the f ⁇ lens system FT in the state of FIG. 3, but the reflecting surface RPa is reflected by the reflecting surface a predetermined time before the position of FIG.
- the reflected beam Bgb is incident on the lens system GLb constituting the beam receiving unit 60b, reflected by the reflecting mirror Mb, and reaches the photoelectric conversion element (photoelectric detector) DTo.
- the reflected beam Bgb (parallel light beam) is condensed as a spot light SPr on the light receiving surface of the photoelectric conversion element DTo by the lens system (condensing optical system) GLb, and the reflected beam Bgb is incident on the lens system GLb.
- the spot light SPr is scanned across the light receiving surface of the photoelectric conversion element DTo as the polygon mirror PM rotates, and the photoelectric conversion element DTo generates an origin signal SZn.
- the origin detection reflected beam Bgb is compared with the scanning speed Vsp of the spot light SP of the drawing beam LBn on the substrate P.
- the focal length of the lens system GLb is made larger than the focal length fo of the f ⁇ lens system FT so as to increase the scanning speed of the spot light SPr on the photoelectric conversion element DTo.
- FIG. 4 is a diagram showing the arrangement of the beam transmitter 60a and the beam receiver 60b shown in FIGS. 2 and 3 in a simplified manner.
- the beam transmitter 60a is a semiconductor that continuously emits the laser beam Bga.
- a laser light source LDo and a collimator lens (lens system) GLa that converts a laser beam Bga from the light source into a parallel light beam are provided.
- the laser beam Bga projected on the reflection surface RP (RPa) is rotated in the direction of rotation of the reflection surface RP (RPa) ( With respect to the main scanning direction (parallel to the XY plane), a parallel light beam having a certain width is obtained.
- the reflected beam Bgb is preferably condensed on the spot light SPr that is narrowed down in the main scanning direction on the photoelectric conversion element DTo.
- a lens system GLb having a focal length Fgs is provided.
- the distance from the reflecting surface RP (RPa) of the polygon mirror PM to the lens system GLb can be set relatively freely because the reflected beam Bgb becomes a parallel light beam.
- the light receiving surface of the photoelectric conversion element DTo is disposed at the position of the focal length Fgs on the rear side of the lens system GLb.
- the spot light SPr of the reflected beam Bgb is set to be approximately at the center of the light receiving surface of the photoelectric conversion element DTo. Is done.
- the reflected beam Bgb ′ is substantially the same as the light receiving surface of the photoelectric conversion element DTo. It is condensed.
- the reflected beam Bgb ′ directed from the lens system GLb to the photoelectric conversion element DTo does not need to be telecentric, but rather is more non-telecentric in order to increase the speed of the spot light SPr across the light receiving surface of the photoelectric conversion element DTo. Good.
- FIG. 5 shows a detailed configuration of the photoelectric conversion element DTo.
- the S9684 series sold as a laser beam synchronous detection photo IC manufactured by Hamamatsu Photonics Co., Ltd. is used.
- the photo IC includes light receiving surfaces PD1 and PD2, current amplifying units IC1 and IC2, and a comparator unit formed by two PIN photodiodes arranged with a narrow gap (dead zone) in the scanning direction of the spot light SPr.
- IC3 is packaged into one.
- each of the current amplification units IC1 and IC2 generates output signals STa and STb as shown in FIG.
- a constant offset voltage (reference voltage) Vref is applied to the current amplification unit IC1 that amplifies the photocurrent from the light receiving surface PD1 that first receives the spot light SPr, and the output signal STa of the current amplification unit IC1 is received by the light receiving surface PD1. Is biased so as to be at the reference voltage Vref when the photocurrent generated at is zero.
- the comparator IC3 compares the levels of the output signals STa and STb, and outputs a logic signal that is H level when STa> STb and L level when STa ⁇ STb. Output as signal SZn.
- the origin time (origin position) Tog the time when the origin signal SZn transitions from the H level to the L level is the origin time (origin position) Tog, and the generation timing of the origin signal SZn means the origin time Tog.
- the origin position (origin time Tog) is, for example, when the point on the substrate P through which the optical axis AXf of the f ⁇ lens system FT passes is used as a reference point, the main scanning direction of the spot light SP from the reference point Does not mean the origin as an absolute position that is always set to be separated by a certain distance, but is relatively a predetermined distance before (or a predetermined time before) the pattern drawing start timing along the drawing line SLn. It represents.
- the origin time Tog is the moment when the levels of the output signals STa and STb coincide with each other while the level of the output signal STb rises while the level of the output signal STa falls.
- the level changes (rise and fall waveforms) of the output signals STa and STb are caused by the relationship between the width of the light receiving surfaces PD1 and PD2 and the size of the spot light SPr, the scanning speed Vh of the spot light SPr and the response of the light receiving surfaces PD1 and PD2.
- the diameter of the spot light SPr is larger than the width of the dead zone and smaller than the width of the light receiving surface PD1
- each of the output signals STa and STb is as shown in FIG.
- a waveform is generated by the level change, and a stable origin signal SZn is obtained.
- FIG. 6 schematically shows a beam switching unit including a selection optical element OSn (OS1 to OS6) for selectively distributing the beam LB from the light source device LS to any one of the six drawing units U1 to U6.
- the configuration is shown. 6 are the same as those shown in FIG. 1, but the reflecting mirrors M1 to M12 shown in FIG. 1 are omitted as appropriate.
- a light source device LS composed of a fiber amplifier laser light source is connected to the drawing control device 200 and exchanges various control information SJ.
- the light source device LS includes a clock circuit that generates a clock signal CLK having an oscillation frequency Fa (for example, 400 MHz) when causing the beam LB to emit pulses, and performs drawing for each drawing unit Un sent from the drawing control device 200.
- the beam LBn is responsive to the clock signal CLK in burst mode (light emission for a predetermined number of clock pulses and light emission stop for a predetermined number of clock pulses). Pulse repetition).
- the drawing control apparatus 200 receives the origin signal SZn (SZ1 to SZ6) output from the origin sensor (photoelectric conversion element DTo) of each of the drawing units U1 to U6, and the polygon mirror PM of each of the drawing units U1 to U6. Is supplied to each of the polygon rotation control unit for controlling the rotation motor RM of the polygon mirror PM and the selection optical elements OSn (OS1 to OS6) so that the rotation speed and the rotation angle phase of the polygon mirror PM are designated. A beam switching control unit that controls on / off (application / non-application) of drive signals DF1 to DF6 as ultrasonic signals based on an origin signal SZn (SZ1 to SZ6).
- SZn origin signal
- SZ1 to SZ6 origin sensor
- the selection optical element OS4 out of the six selection optical elements OS1 to OS6 is selected, and intensity modulation is performed with the beam LB from the light source device LS (the drawing data of the pattern drawn by the drawing unit U4). 2) is deflected toward the incident mirror IM4 and supplied to the drawing unit U4 as a beam LB4.
- the order of the selection optical elements OSn from the light source device LS depends on the transmittance and diffraction efficiency of each of the selection optical elements OSn.
- the intensity of the selected beams LB1 to LB6 the peak intensity of the pulsed light
- the drawing control apparatus 200 transmits the drive signal so that the relative intensity difference between the beams LB1 to LB6 incident on each of the drawing units U1 to U6 is within a predetermined allowable range (for example, within ⁇ 5%).
- the level of each of DF1 to DF6 (the amplitude and power of the high frequency signal) is adjusted.
- FIG. 7 is a diagram showing a specific configuration around the optical element for selection OSn (OS1 to OS6) and the incident mirror IMn (IM1 to IM6).
- the beam LB emitted from the light source device LS is incident on the selection optical element OSn as a parallel light beam having a minute diameter (first diameter) of 1 mm or less, for example.
- the drive signal DFn which is a high-frequency signal (ultrasonic signal)
- the incident beam LB is transmitted without being diffracted by the selection optical element OSn.
- the transmitted beam LB passes through the condensing lens Ga and the collimating lens Gb provided on the optical path along the optical axis AXb, and enters the selection optical element OSn at the subsequent stage.
- the beam LB passing through the condenser lens Ga and the collimator lens Gb through the selection optical element OSn is coaxial with the optical axis AXb.
- the condensing lens Ga condenses the beam LB (parallel light beam) transmitted through the selection optical element OSn so as to be a beam waist at the position of the surface Ps located between the condensing lens Ga and the collimating lens Gb.
- the collimating lens Gb turns the beam LB diverging from the position of the surface Ps into a parallel light beam.
- the diameter of the beam LB converted into a parallel light beam by the collimating lens Gb is the first diameter.
- the rear focal position of the condensing lens Ga and the front focal position of the collimating lens Gb coincide with the surface Ps within a predetermined allowable range, and the front focal position of the condensing lens Ga is within the selection optical element OSn.
- the diffraction points are arranged so as to coincide with each other within a predetermined allowable range.
- the incident beam LB was not diffracted with the beam LBn (first-order diffracted light) diffracted by the selection optical element OSn.
- a zero-order beam LBnz is generated.
- the intensity of the incident beam LB is 100% and the decrease due to the transmittance of the optical element for selection OSn is ignored, the intensity of the diffracted beam LBn is about 80% at the maximum, and the remaining 20% is the 0th order. It becomes the intensity of the beam LBnz.
- the 0th-order beam LBnz passes through the condensing lens Ga and the collimating lens Gb, passes through the subsequent selection optical element OSn, and is absorbed by the absorber TR.
- the beam LBn (parallel light beam) deflected in the ⁇ Z direction with a diffraction angle corresponding to the high frequency of the drive signal DFn passes through the condenser lens Ga and travels toward the incident mirror IMn provided on the surface Ps. Since the front focal position of the condensing lens Ga is optically conjugate with the diffraction point in the optical element for selection OSn, the beam LBn from the condensing lens Ga toward the incident mirror IMn has a position decentered from the optical axis AXb.
- the light travels in parallel with the axis AXb and is condensed (converged) so as to be a beam waist at the position of the surface Ps.
- the position of the beam waist is set so as to be optically conjugate with the spot light SP projected onto the substrate P through the drawing unit Un.
- the beam LBn diffracted by the selection optical element OSn is reflected in the ⁇ Z direction by the incident mirror IMn, and passes through the collimating lens Gc.
- the light enters the drawing unit Un along the optical axis AX1 (see FIG. 2).
- the collimating lens Gc turns the beam LBn converged / diverged by the condenser lens Ga into a parallel light beam coaxial with the optical axis (AX1) of the collimating lens Gc.
- the diameter of the beam LBn made into a parallel light beam by the collimating lens Gc is substantially the same as the first diameter.
- the rear focal point of the condensing lens Ga and the front focal point of the collimating lens Gc are arranged on or near the reflecting surface of the incident mirror IMn within a predetermined allowable range.
- the front focal position of the condenser lens Ga and the diffraction point in the optical element for selection OSn are optically conjugated, and the incident mirror IMn is disposed on the surface Ps that is the rear focal position of the condenser lens Ga.
- ) is the maximum range of the deflection angle of the optical element for selection OSn itself, the size of the reflecting surface of the incident mirror IMn, and the optical system (relay system) up to the polygon mirror PM in the drawing unit Un. Although it is limited by the magnification, the width in the Z direction of the reflecting surface RP of the polygon mirror PM, the magnification from the polygon mirror PM to the substrate P (magnification of the f ⁇ lens system FT), etc., the effective spot light SP on the substrate P is limited. Adjustment is possible within the range of the size (diameter) or the pixel size (Pxy) defined on the drawing data.
- an overlay error between a new pattern drawn on the substrate P in each drawing unit Un and a pattern formed on the substrate P, or a new pattern drawn on the substrate P in each drawing unit Un It is possible to correct a joint error between various patterns with high accuracy and at high speed.
- FIG. 8 is a plan view of the eight-sided polygon mirror PM shown in FIG. 3 or FIG. 4. Here, for each of the eight reflecting surfaces RP, the origin signal SZn generated as shown in FIG.
- the eight reflecting surfaces RP are set to RPa, RPb, RPc, RPd, RPe, RPf, RPg, and RPh in the direction opposite to the rotation direction (clockwise) of the polygon mirror PM.
- a rotation reference mark Mcc for detecting the origin of rotation of the polygon mirror PM is formed on the upper surface (or lower surface) of the polygon mirror PM.
- the rotation reference mark Mcc is detected by a reflective photoelectric sensor (also referred to as a rotation detection sensor) that outputs a pulsed detection signal each time the polygon mirror PM rotates once.
- the speed fluctuation of the polygon mirror PM is measured based on the origin signal SZn.
- the polygon rotation control unit in the drawing control apparatus 200 is servo-controlled so that the polygon mirror PM is rotated at 36000 rpm, the polygon mirror PM is rotated 600 times per second.
- the upper rotation time TD for one rotation is 1/600 seconds ( ⁇ 166.667 ⁇ S).
- the actual circulation time TD from the origin time Tog of any one pulse in the origin signal SZn to the origin time Tog of the ninth pulse is set to be smaller than the oscillation frequency Fa used by the light source device LS for pulse emission.
- the measurement is repeated using a clock pulse having a high frequency (eg, twice or more). Since the polygon mirror PM rotates at high speed with inertia, the possibility of uneven speed during one rotation is low. However, depending on the servo control characteristics, etc., the design cycle time is several milliseconds to several tens of milliseconds. TD may fluctuate slightly.
- FIG. 9 is a diagram for explaining a method of measuring the reproducibility (variation) of the generation timing of the origin signal SZn.
- an example of how to determine the reproducibility of the origin time Tog2 of the origin signal SZn generated corresponding to the reflection surface RPa of the polygon mirror PM shown in FIG. The same measurement can be performed for each of RPb to RPh.
- the origin time Tog1 generated at the timing just before the origin time Tog2 is obtained as the origin signal SZn generated corresponding to the reflection surface RPh of the polygon mirror PM.
- the waveforms of the origin signals SZn (a) 1 to SZn (a) 7 generated while the polygon mirror PM rotates 7 times are obtained corresponding to the reflecting surface RPh.
- the origin times Tog1 are aligned and shown on the time axis.
- the measured values of the origin interval time ⁇ Tmn which should be constant, vary. Since this variation becomes a variation width ⁇ Te of the generation timing of the origin time Tog2 corresponding to the reflection surface RPa, the reproducibility of the origin signal SZn is a standard deviation value ⁇ of a large number of origin times Tog2 distributed within the variation width ⁇ Te. Alternatively, it is obtained as a 3 ⁇ value that is three times the standard deviation value ⁇ . As described above, when the light source device LS oscillates the beam LB with the period Tf, the 3 ⁇ value as reproducibility is preferably smaller than the period Tf.
- FIG. 10 is a diagram schematically showing a method for predicting the time error due to the speed fluctuation of the polygon mirror PM.
- the origin interval time ⁇ Tmn corresponding to each of the eight reflecting surfaces RPa to RPh is measured every many turns of the polygon mirror PM.
- the initial position (first origin time Tog) during one rotation of the polygon mirror PM is the reflection surface RPa, and the waveform of the origin signal SZn generated while the polygon mirror PM rotates twice from the reflection surface RPa is schematically shown. It was shown to.
- the origin interval time from the origin time Tog generated corresponding to the reflection surface RPa of the origin signal SZn to the origin time Tog generated corresponding to the adjacent reflection surface RPb is ⁇ Tma, and so on.
- the origin interval time from the surface RPb to the reflection surface RPc is ⁇ Tmb,...
- the origin interval time from the adjacent reflection surface RPh to the reflection surface RPa is ⁇ Tmh.
- the starting times Tog generated corresponding to each of the eight reflecting surfaces RPa to RPh are used as start points, and the round times TDa and TDb for each of the reflecting surfaces RPa to RPh of the polygon mirror PM. ... TDh is measured.
- Each of the round times TDa to TDh may be obtained as a total value of eight origin interval times ⁇ Tma to ⁇ Tmh corresponding to each of the eight reflecting surfaces RPa to RPh.
- Each of the round times TDa to TDh (or the origin interval time ⁇ Tma to ⁇ Tmh) is repeatedly measured while the polygon mirror PM rotates, for example, N times. Thereby, each data of the round times TDa to TDh measured from the origin time Tog corresponding to each of the eight reflecting surfaces RPa to RPh can be acquired over N rounds.
- the average lap times ave (TDa) to ave (TDh) of the lap times TDa to TDh acquired over N laps are calculated.
- each of the origin interval times ⁇ Tma to ⁇ Tmh measured after the second round shown in FIG. 10 includes an error due to the influence of the speed fluctuation in the round of the polygon mirror PM immediately before that, for example, 2
- the origin interval time ⁇ Tma actually measured after the lap is expected to have changed by the ratio between the revolution time TDa measured in the immediately preceding round and the average round time ave (TDa), and the expected interval time of the origin interval time ⁇ Tma ⁇ Tma ′ is calculated.
- an average interval time ave ( ⁇ Tma) of N ⁇ 1 origin interval times ⁇ Tma measured in each round after the second round is obtained.
- the average interval time ave (TDa) is multiplied by the average interval time ave ( ⁇ Tma) to the ratio of the average rotation time ave (TDa) to the actually measured rotation time TDa to calculate the expected interval time ⁇ Tma ′ corrected for the speed fluctuation.
- the difference value between the actually measured origin interval time ⁇ Tma and the expected interval time ⁇ Tma ′ is obtained as a more accurate variation amount ( ⁇ value) of the origin time Tog generated corresponding to the reflecting surface RPa.
- the variation amount of the origin time Tog of the origin signal SZn corresponding to each of the other reflection surfaces RPb to RPh is also obtained by the same calculation.
- each of the origin interval times ⁇ Tma to ⁇ Tmh which is the generation interval of the origin time Tog of the origin signal SZn, is only repeatedly measured during a plurality of rotations of the polygon mirror PM, resulting from the speed fluctuation of the polygon mirror PM. Therefore, accurate reproducibility (3 ⁇ value, etc.) with reduced errors can be obtained.
- the focal length Fgs of the lens system GLb in the beam receiving unit 60b of the origin sensor is set to be approximately the same as the focal length fo (for example, 100 mm) of the f ⁇ lens system FT, and photoelectric conversion is performed to the position of the focal length Fgs of the lens system GLb.
- the element DTo is arranged, the polygon mirror PM is rotated at about 38000 rpm, and the origin signal SZn (origin time Tog2) generated corresponding to each of the reflection surfaces RPa to RPh of the polygon mirror PM by the method shown in FIG. When the reproducibility was measured, a result as shown in FIG. 11 was obtained.
- SZn oil time Tog2
- the horizontal axis represents each position (RPa ⁇ RPb, RPb ⁇ RPc,... RPh ⁇ RPa) between the measured reflecting surfaces, and the vertical axis represents each reflecting surface after correcting and calculating the fluctuation of the circulation speed.
- the interval time ⁇ Tma to ⁇ Tmh is obtained by converting the waveform data of the origin signal SZn that is continuously generated over 10 revolutions of the polygon mirror PM into digital data having a sampling rate of 2.5 GHz (0.4 nS). It memorize
- the interval times ⁇ Tma to ⁇ Tmh after correcting the fluctuations in the circulation speed vary between 197.380 ⁇ S and 197.355 ⁇ S.
- each of the calculated interval times ⁇ Tma to ⁇ Tmh is 197.368 ⁇ S.
- Such variation in the interval times ⁇ Tma to ⁇ Tmh is, for example, that each of the eight apex angles formed by the adjacent reflecting surfaces among the reflecting surfaces RPa to RPh of the polygon mirror PM is not precisely 135 degrees.
- the variation in the interval time ⁇ Tma to ⁇ Tmh can also be caused by the degree of the eccentric error of the polygon mirror PM with respect to the rotation axis AXp.
- the 3 ⁇ value calculated from the distribution of each variation in the interval times ⁇ Tma to ⁇ Tmh is 2.3 nS to 5.9 nS, which is the pulse oscillation frequency of the beam LB from the light source device LS.
- the 3 ⁇ value is about 6 nS. If it exists, it means that the position of the pattern drawn along the drawing line SLn varies by about 5 ⁇ m (more precisely, 4.8 ⁇ m) in the main scanning direction.
- the focal length of the f ⁇ lens system FT is fo and the distance of the pulse interval (1/2 of the spot diameter) of the spot light SP on the substrate P is ⁇ Yp
- the polygon mirror PM reflecting surface corresponding to the pulse interval distance ⁇ Yp ) Is changed by ⁇ p ⁇ Yp / fo.
- the moving distance of the laser beam Bgb (spot light SPr) on the photoelectric conversion element DTo corresponding to the angle change ⁇ p is ⁇ Yg
- the moving distance ⁇ Yg is calculated from the focal length Fgs of the lens system GLb on the beam receiving unit 60b side. , ⁇ Yg ⁇ p ⁇ Fgs.
- the generation accuracy of the origin time Tog of the origin signal SZn preferably corresponds to the accuracy (resolution) of 1/2 or less of the pulse interval distance ⁇ Yp of the spot light SP
- the laser beam Bgb (spot) on the photoelectric conversion element DTo spot
- the scanning speed of the light SPr is increased to about twice the scanning speed of the spot light SP on the substrate P. That is, it is preferable that ⁇ Yg ⁇ 2 ⁇ ⁇ Yp. Therefore, in the present embodiment, the focal length Fgs of the lens system GLb is set to about twice the focal length fo of the f ⁇ lens system FT, but it goes without saying that it may be twice or more.
- FIG. 12 shows a result of measuring reproducibility in the same manner as in FIG. 11 by using another drawing unit having the same configuration as the drawing unit Un actually measured in FIG. 11 and changing the focal length Fgs of the lens system GLb to 2Fgs ⁇ fo. Indicates.
- the vertical axis and the horizontal axis in FIG. 12 represent the same as those in FIG. 11, but the scale of the vertical axis in FIG. 12 has a scale of 2 nS (5 nS in FIG. 11).
- the value was 1.3 nS to 2.5 nS, which was improved by about half compared to the case of FIG. Accordingly, in this case, when the diameter ⁇ of the spot light SP is 4 ⁇ m, the pixel size Pxy is 4 ⁇ m square on the substrate P, and one pixel is drawn with two pulses of the spot light SP, the pattern drawn along the drawing line SLn. The variation in the position in the main scanning direction is halved to about 2.5 ⁇ m. Note that the variation tendency of the interval times ⁇ Tma to ⁇ Tmh shown in FIG. 12 and the variation tendency of the interval times ⁇ Tma to ⁇ Tmh shown in FIG. 11 are greatly different in the order of nanoseconds.
- Variation errors in the interval times ⁇ Tma to ⁇ Tmh can be corrected by adjusting the delay time set from the origin time Tog of the origin signal SZn to the drawing start time for each of the reflection surfaces RPa to RPh of the polygon mirror PM.
- the origin sensor beam Bga projected onto the reflection surfaces RPa to RPh of the polygon mirror PM has a predetermined thickness (for example, 1 to 1) with respect to the dimension in the rotation direction of the reflection surfaces RPa to RPh.
- a predetermined thickness for example, 1 to 1
- the diameter dimension of the spot light SPr of the reflected beam Bgb collected on the photoelectric conversion element DTo is the width dimension of the light receiving surfaces PD1 and PD2 in the beam scanning direction and the width of the dead zone between the light receiving surfaces PD1 and PD2.
- the diameter dimension of the spot light SPr in the scanning direction is smaller than the smaller width dimension of the light receiving surfaces PD1 and PD2 and larger than the width of the dead zone so that a signal waveform as shown in FIG. Is set to such a condition.
- the focal length Fgs of the lens system GLb that receives the reflected beam Bgb is set to be longer than the focal length fo of the f ⁇ lens system FT so as to satisfy such a condition.
- the intensity distribution in the cross section of the beam Bga emitted from the semiconductor laser light source LDo shown in FIG. 4 is an ellipse having an aspect ratio of about 1: 2, and the major axis direction of the ellipse is represented by a polygon.
- the elliptical minor axis direction may be aligned with the rotational axis AXp direction of the polygon mirror PM in accordance with the rotation direction (main scanning direction) of the reflecting surfaces RPa to RPh of the mirror PM.
- the beam Bga can be effectively reflected as the reflected beam Bgb even if the height of each of the reflecting surfaces RPa to RPh of the polygon mirror PM is small (dimension in the direction of the rotation axis AXp), and the photoelectric conversion element DTo can be reflected.
- the numerical aperture (NA) in the scanning direction of the reflected beam Bgb that reaches can be made larger than the numerical aperture (NA) in the non-scanning direction, it relates to the scanning direction of spot light SPr (the direction crossing the light receiving surfaces PD1 and PD2 in FIG. 5). Increase resolution and sharpen contrast.
- a type that generates the origin signal SZn by comparing the signal level with the reference voltage may be used.
- the reproducibility of the origin time Tog of the origin signal SZn may be improved as the rise and fall of the signal waveform becomes steeper (the response time is shorter). It is preferable that the scanning speed of the spot light SPr that crosses the beam is faster than the scanning speed of the drawing spot light SP, and the spot light SPr is condensed as small as possible by the lens system GLb to increase the intensity per unit area.
- the origin sensor (lens system GLb, photoelectric conversion element DTo) is a polygon of the origin detection beam Bga projected from a light source different from the drawing (processing) beam LBn. It is assumed that the reflected beam Bgb at the mirror PM is detected photoelectrically. However, in the arrangement relationship shown in FIG. 3, the drawing beam LBn is not incident on the f ⁇ lens system FT (blank period) immediately after the reflecting surface RPa of the polygon mirror PM reaches the angular position RPa ′.
- the lens system GLb has an incident period.
- the drawing beam LBn is controlled not to enter the drawing unit Un by the pulse oscillation of the beam LB from the light source device LS and the control of the selection optical element OSn. Therefore, even during the blank period, the selection optical element OSn is turned on only during a period in which the drawing beam LBn can enter the lens system GLb, and the beam LB is pulse-oscillated from the light source device LS at the oscillation frequency Fa.
- the reflected beam of the beam LBn reflected by the polygon mirror PM may be received by the photoelectric conversion element DTo.
- the drawing beam LBn incident on the lens system GLb during the blank period is used as a beam for detecting the origin.
- FIG. 13 shows a modified example in which the arrangement of the origin sensors (the beam transmitting unit 60a and the beam receiving unit 60b) in the first embodiment shown in FIG. 3 is changed, and the same members as those in FIG. The same reference numerals are given.
- the reflection surface of the polygon mirror PM onto which the beam Bga from the beam transmitter 60a of the origin sensor is projected is opposite to the reflection surface of the polygon mirror PM onto which the drawing beam LBn is projected.
- the polygon mirror PM is set to be positioned on the near side in the rotation direction.
- the origin detection beam Bga is arranged so as to be projected onto the reflection surface RPc in front of the second surface.
- the reflected beam Bgb reflected by RPc is arranged so as to be condensed on the photoelectric conversion element DTo via the lens system GLb of the beam receiving unit 60b.
- the beam Bga for origin detection is arranged to be projected onto a reflection surface (RPc) different from the reflection surface RPa of the polygon mirror PM onto which the drawing beam LBn is projected, the beam transmission that constitutes the origin sensor.
- the degree of freedom of arrangement of the unit 60a and the beam receiving unit 60b is expanded, and the semiconductor laser light source LDo, the lens systems GLa and GLb, the photoelectric conversion element DTo, the reflection mirror Mb, and the like can be more stably installed. It is possible to further improve reproducibility.
- the origin sensor is arranged so as to detect the reflection surface RPc that is two surfaces before the reflection surface RPa, but the laser beam Bga is projected onto the reflection surface RPb that is one surface in front, thereby reflecting the reflection surface RPb.
- the drawing operation may be performed at a timing at which the drawing beam LBn is scanned by the reflecting surface RPb with reference to the origin time Tog of the origin signal SZn generated according to the angular position.
- FIG. 14 shows a modification in which the lens system GLb of the beam receiving unit 60b of the origin sensor in the first embodiment shown in FIG. 3 is replaced with a concave reflecting mirror (condensing optical system) GLc.
- the reflected beam Bgb of the beam Bga from the beam transmitter 60a (semiconductor laser light source LDo, lens system GLa) on the reflecting surface (RPa) of the polygon mirror PM is photoelectrically converted by the concave reflecting mirror GLc. While reflecting toward the element DTo, it is condensed as spot light SPr on the photoelectric conversion element DTo.
- the concave reflecting mirror GLc shown in FIG. 14 is an optical member having both functions of the reflecting mirror Mb and the lens system GLb in FIG. Also in this modification, the focal length of the concave reflecting mirror GLc is set longer than the focal length fo of the f ⁇ lens system FT, and preferably set to be twice or more.
- FIG. 15 shows a modified example in which the lens system GLb of the beam receiving unit 60b of the origin sensor in the first embodiment shown in FIG. 3 is replaced with a cylindrical lens (condensing optical system) GLd.
- the same reference numerals are given to the same members as the members inside.
- FIG. 15A shows a cylindrical lens GLd and a photoelectric conversion element in a plane (XY plane) on which the reflected beam Bgb of the origin detection beam Bga projected on one reflecting surface RPa of the polygon mirror PM is one-dimensionally scanned.
- FIG. 15A shows a cylindrical lens GLd and a photoelectric conversion element in a plane (XY plane) on which the reflected beam Bgb of the origin detection beam Bga projected on one reflecting surface RPa of the polygon mirror PM is one-dimensionally scanned.
- the cylindrical lens GLd has a positive refractive power (convex lens action) in the one-dimensional scanning plane (XY plane) of the reflected beam Bgb, and extends in the Z-axis direction (rotation axis AXp) perpendicular to the one-dimensional scanning plane. (Direction) functions as a parallel plate.
- the focal length in the XY plane of the cylindrical lens GLd having the generatrix in the Z-axis direction is set longer than the focal length fo of the f ⁇ lens system FT, and preferably set twice or more. Therefore, the reflected beam Bgb collected on the photoelectric conversion element DTo becomes a thin slit-like spot light SPr extending in the Z-axis direction.
- the cylindrical lens GLd may be changed to a cylindrical concave reflecting mirror having a cylindrical concave reflecting surface whose generating line is parallel to the Z axis, as in FIG.
- the refractive power in the main scanning direction of the optical member that condenses (converges) the reflected beam Bgb for origin detection is smaller than the refractive power in the main scanning direction of the scanning lens system, and preferably 1/2 or less. It means to set to.
- FIG. 16 shows a partial configuration of the drawing unit Un according to the second embodiment.
- the arrangement of is basically the same as the configuration of FIG.
- the drawing unit Un according to the present embodiment uses the drawing beam LBn for origin detection immediately before the scanning start point of the drawing line SLn used for pattern drawing in the maximum scanning range Lxa of the spot light SP on the substrate P. And an origin sensor that generates an origin signal SZn.
- a reflecting mirror that is arranged in the space between the substrate P and the cylindrical lens CYb and reflects the beam LBn that travels along the principal ray Le1 in the vicinity of the start of scanning within the maximum scanning range Lxa in the Y direction.
- Mh and a lens system (enlarging optical system) GLe arranged along the optical axis AXh so as to form a surface Pdr conjugate with the surface on which the beam LBn reflected by the reflection mirror Mh is condensed as the spot light SPr And a photoelectric conversion element DTo disposed on the surface Pdr.
- the reflection mirror Mh is disposed at an inclination of 45 degrees with respect to the optical axis AXf of the f ⁇ lens system FT so as not to block the beam LBn traveling along the principal ray Le1 to the scanning start point of the drawing line SLn.
- the spot light SPr by the beam LBn traveling along the principal ray Le2 is formed in a plane corresponding to the substrate P parallel to the optical axis AXf.
- the lens system GLe forms an image SPr ′ of the spot light SPr obtained by enlarging the spot light SPr twice or more on the conjugate plane Pdr.
- the image SPr ′ of the spot light SPr is scanned on the photoelectric conversion element DTo in the X-axis direction (the optical axis AXf and the optical axis AXf) at a speed twice or more the scanning speed of the spot light SPr. (Parallel direction).
- the light source device LS is used by the drawing control device 200 in FIG. 6 so that the beam LBn scanned by the polygon mirror PM is continuously emitted at 400 MHz within the range where the beam LBn is incident on the reflection mirror Mh. Is controlled.
- FIG. 17 shows the state of the drive signal DFn of the selection optical element OSn selected and controlled by the drawing control device 200 when the beam LBn is scanned by one reflecting surface of the polygon mirror PM, and the light source device LS at that time.
- FIG. 17 is a time chart showing a state of pulse oscillation of a beam LBn outputted from, and a state of an origin signal SZn outputted from the photoelectric conversion element DTo in FIG. 16.
- the drive signal DFn of the selection optical element OSn becomes H level only during the period ⁇ Yw immediately after the scanning start point in the maximum scanning range Lxa, and the selection optical element OSn is turned on.
- the range ⁇ Yw corresponds to a period during which the beam LBn projected through the f ⁇ lens system FT and the cylindrical lens CYb is incident on the reflection mirror Mh shown in FIG.
- the drawing controller 200 controls the light source device LS to output a beam LB (LBn) that continuously oscillates at 400 MHz only while the drive signal DFn is in the H level in the range ⁇ Yw. Therefore, during the period corresponding to the range ⁇ Yw, the image SPr ′ of the spot light SPr is one-dimensionally scanned along the conjugate plane Pdr, and the origin signal SZn from the photoelectric conversion element DTo is as shown in FIG. , Transition to the L level at the origin time Tog.
- the drawing control apparatus 200 sets the drive signal DFn of the selection optical element OSn to the H level again after a predetermined time from the origin time Tog of the origin signal SZn, and turns on the selection optical element OSn only during the period corresponding to the drawing line SLn. Put it in a state. Further, the drawing control apparatus 200 responds to the drawing data SDn so that the pattern drawing along the drawing line SLn is performed after the selection optical element OSn is turned on and after a certain delay time ⁇ to from the origin time Tog. Controls the pulse oscillation of the beam LB (LBn) of the device LS.
- LBn beam LB
- the beam LBn that is incident on the reflection mirror Mh via the f ⁇ lens system FT is used as the beam for detecting the origin, and the image SPr ′ of the spot light SPr that crosses the photoelectric conversion element DTo is obtained. Then, it moves at a speed twice or more the scanning speed of the spot light SP projected onto the substrate P. Therefore, the reproducibility of the generation timing of the origin time Tog of the origin signal SZn can be improved.
- a pulse luminescence beam LBn is used as the origin detection beam, so that the output signals STa and STb from the light receiving surfaces PD1 and PD2 of the photoelectric conversion element DTo are shown in FIG.
- a continuous smooth waveform may not be obtained as in A), or the diameter dimension of the image SPr ′ of the spot light SPr may be smaller than the width of the dead zone between the light receiving surfaces PD1 and PD2. Therefore, as shown in FIG. 18, a transmissive diffraction grating plate GPL having a period (grating pitch) in the scanning direction of the origin detection beam LBn is provided between the photoelectric conversion element DTo and the lens system GLe.
- the beam LBn toward the conversion element DTo is expanded by a diffraction phenomenon, and the diffracted light (0th order light, ⁇ 1st order light, ⁇ 2nd order light, etc.) of the beam LBn for one pulse is the width of the dead zone between the light receiving surfaces PD1 and PD2.
- the distribution of the beam LBn is expanded in the scanning direction by the diffraction phenomenon by the diffraction grating plate GPL, but in FIG.
- the direction in which the optical axis AH extends (Y-axis direction) and the scanning direction (X-axis direction)
- a cylindrical lens (negative refractive power) having a generatrix in the Z-axis direction orthogonal to each and having a concave cylindrical surface may be disposed at the position of the diffraction grating plate GPL.
- the light receiving surface of the photoelectric conversion element DTo is not optically conjugate with the surface of the spot light SPr collected immediately after the reflecting mirror Mh, but is elliptical in the scanning direction on the light receiving surfaces PD1 and PD2.
- a beam LBn (Ldf) having an extended intensity distribution is projected.
- FIG. 19 shows a configuration of a part of the drawing unit Un according to the third embodiment.
- the reflection mirror Mh, the lens system GLe, and the photoelectric conversion element DTo that are arranged between the cylindrical lens CYb and the substrate P are basically arranged in the same manner as in the configuration of FIG.
- the reflection mirror M23 ′ disposed between the cylindrical lens CYa and the polygon mirror PM is a dichroic mirror having wavelength selectivity, and is different from the beam Bga for detecting the origin (beam LBn).
- the reflection mirror M23 ′ has, for example, a high reflectance for a drawing beam LBn having a wavelength of 355 nm in the ultraviolet wavelength region, and a high transmittance for an origin detection beam Bga having a wavelength of 450 nm or more. It has a wavelength selection characteristic such that In addition, in the XY plane of FIG. 19, the incident direction of the beam Bga (parallel beam) for detecting the origin with respect to the incident direction of the drawing beam LBn from the reflecting mirror M23 ′ toward the reflecting surface (RPa) of the polygon mirror PM.
- the origin detection beam Bga transmitted through the reflection mirror M23 ′ becomes a reflection beam Bgb reflected by the reflection surface (RPa) of the polygon mirror PM and enters the f ⁇ lens system FT.
- the reflected beam Bgb is one-dimensionally scanned at the same speed in the main scanning direction together with the drawing beam LBn.
- the spot light of the drawing beam LBn is determined by the rotation direction (clockwise) of the polygon mirror PM in FIG. 19 and the difference in angle ⁇ between the drawing beam LBn incident on the polygon mirror PM and the origin detection beam Bga.
- the reflected beam Bgb of the origin detection beam Bga is incident on the reflecting mirror Mh via the f ⁇ lens system FT and the cylindrical lens CYb, and becomes the spot light SPr. Focused.
- the reflected beam Bgb reflected by the reflecting mirror Mh is re-imaged as an image SPr 'of the spot light SPr on the photoelectric conversion element DTo via the lens system GLe.
- the scanning speed of the image SPr ′ of the spot light SPr on the photoelectric conversion element DTo is the spot light of the drawing beam LBn. It is set to be twice or more the SP scanning speed.
- the beam Bga for detecting the origin may be arranged so as to be projected onto the polygon mirror PM through the optical path Lpt beside the reflection mirror M23 'without passing through the reflection mirror M23'.
- the reflection mirror M23 ′ does not need to be a dichroic mirror, but the angle ⁇ of the origin detection beam Bga with respect to the drawing beam LBn increases, so that the spot light SP is drawn from the origin time Tog of the origin signal SZn.
- the time required to reach the scanning start point of line SLn is slightly longer.
- FIG. 20 shows a partial configuration of the drawing unit Un according to the fourth embodiment.
- the first cylindrical lens CYa, the reflection mirror M23, the polygon mirror PM, the f ⁇ lens system FT, and the second cylindrical lens CYb are shown in FIG. Basically, the arrangement is the same as the configuration of FIG. 16 (FIG. 3).
- a beam transmitting unit 60a is provided so as to project a beam Bga for origin detection from the substrate P side toward the polygon mirror PM via the cylindrical lens CYb and the f ⁇ lens system FT.
- the reflected beam Bgb reflected is configured to be detected by a beam receiving unit 60b including a lens system GLb, a reflection mirror Mb, and a photoelectric conversion element DTo.
- a beam receiving unit 60b including a lens system GLb, a reflection mirror Mb, and a photoelectric conversion element DTo.
- the beam transmitter 60a includes a semiconductor laser light source LDo and a lens system GLa as shown in FIG. 4, and generates a beam Bga that is a parallel light beam.
- the beam Bga from the beam transmitter 60a is condensed as spot light SPz via the lens system GLu and the reflection mirror Mh1, and then reflected by the reflection mirror Mh2 arranged in the same manner as the reflection mirror Mh shown in FIG. Are reflected so as to be a principal ray Le2 parallel to the optical axis AXf of the f ⁇ lens system FT, pass through the cylindrical lens CYb and the f ⁇ lens system FT, and are projected onto the reflection surface (RPa) of the polygon mirror PM.
- the reflected beam Bgb of the beam Bga reflected by the reflecting surface (RPa) of the polygon mirror PM passes through the side of the reflecting mirror M23 and enters the lens system GLb, and is collected so as to become spot light SPr on the photoelectric conversion element DTo. Lighted.
- the position of the spot light SPr is optically conjugate with the spot light SPz on the XY plane (in the main scanning plane). Since there is a cylindrical lens CYb in the optical path of the origin detection beam Bga and the reflected beam Bgb from the beam transmitting unit 60a to the photoelectric conversion element DTo, in the case of FIG. 20, a spot crossing over the photoelectric conversion element DTo.
- the light SPr has a thin slit shape extending in the Z-axis direction (the direction in which the rotation axis AXp of the polygon mirror PM extends), as in FIG. Also in the present embodiment described above, the scanning speed of the spot light SPr across the photoelectric conversion element DTo is set on the substrate P by making the focal length (Fgs) of the lens system GLb longer than the focal length fo of the f ⁇ lens system FT. The scanning speed of the spot light SP can be made faster.
- FIG. 21 is a diagram showing the configuration of the origin sensor (beam transmitting unit 60a, beam receiving unit 60b) according to the fifth embodiment in the XY plane.
- the origin sensor beam transmitting unit 60a, beam receiving unit 60b
- members having the same functions as those of the previous embodiments and modifications are given the same reference numerals.
- a drawing beam LBn is projected toward one of the reflecting surfaces RP of the reflecting surface RP of the polygon mirror PM, and the reflection next to the reflecting surface RPa of the polygon mirror PM (one before).
- a laser beam (origin detection beam) Bga from the beam transmitter 60a is projected onto the surface RPb. Further, the angular position of the reflecting surface RPa in FIG.
- the reflection surface RP (RPa) of the polygon mirror PM is disposed so as to be positioned on the entrance pupil plane orthogonal to the optical axis AXf of the f ⁇ lens system FT.
- the beam LBn traveling from the reflecting mirror M23 toward the polygon mirror PM A reflection surface RP (RPa) is set at a position where the principal ray and the optical axis AXf intersect.
- the distance from the main surface of the f ⁇ lens system FT to the surface of the substrate P (the condensing point of the spot light SP) is the focal length fo.
- the beam Bga from the beam transmitting unit 60a is projected onto the reflecting surface RPb of the polygon mirror PM as a parallel light beam in a wavelength region having low sensitivity to the photosensitive functional layer of the substrate P.
- the reflected beam Bgb of the beam Bga reflected by the reflecting surface RPb is directed to the reflecting mirror MRa having a reflecting surface perpendicular to the XY plane.
- the reflected beam Bgc of the beam Bgb reflected by the reflecting mirror MRa is again projected toward the reflecting surface RPb of the polygon mirror PM.
- the reflected beam Bgd of the beam Bgc reflected by the reflecting surface RPb is received by the beam receiving unit 60b.
- the beam receiving unit 60b receives the beam Bgd traveling as shown in FIG.
- the beam Bga is shown as a simple line, but actually, as shown in FIG. 4, the reflection surface RP of the polygon mirror PM is rotated in the XY plane by the semiconductor laser light source LDo and the collimator lens GLa. It is converted into a parallel light beam having a predetermined width with respect to the direction.
- the beam Bgd is shown as a simple line.
- the beam Bgd becomes a parallel light beam having a predetermined width in the XY plane, and the beam Bgd is directed to the beam receiving unit 60b according to the rotation of the polygon mirror PM. Are scanned as indicated by an arrow Aw.
- the beam receiving unit 60b in FIG. 21 also includes a condensing lens GLb that condenses the beam Bgd as the spot light SPr on the photoelectric conversion element DTo, as in FIG.
- the spot light SPr of the beam Bgd after the beam Bga for detecting the origin is reflected twice by the reflection surface RP (RPb) of the polygon mirror PM using the reflection mirror MRa shown in FIG.
- the photoelectric conversion element DTo is configured to receive light. Therefore, the scanning speed Vh of the spot light SPr on the light receiving surfaces PD1 and PD2 shown in FIG. Compared to the case of receiving light with DTo, it can be doubled. Accordingly, in this embodiment, the scanning of the beam Bgd (spot light SPr) for detecting the origin on the photoelectric conversion element DTo is compared with the scanning speed Vsp of the drawing beam LBn (spot light SP) on the substrate P.
- the speed Vh can be increased about twice, and the reproducibility (3 ⁇ value) of the generation timing of the origin signal SZn can be improved.
- the refractive power (corresponding to the focal length Fgs) of the condenser lens GLb provided in the beam receiving unit 60b and the refractive power of the f ⁇ lens system FT (corresponding to the focal length fo) are the same.
- the scanning speed Vh of the spot light SPr crossing over the photoelectric conversion element DTo is increased to twice the scanning speed Vsp of the spot light SP scanned on the substrate P.
- FIG. 22 shows an example of such a beam scanning apparatus, and a drawing (processing) beam LBn (pulsed light or continuous light) is reflected on the reflecting surface of a galvanomirror GVM that reciprocally vibrates around a rotation axis APx within a certain angular range.
- the reflected beam LBn is projected as a spot light SP on a drawing (processing) line SLn on the substrate P through the f ⁇ lens system FT.
- the reflection surface of the galvanomirror GVM that reflects the drawing (processing) beam LBn is shown in FIG.
- a beam Bga parallel beam
- the reflected beam Bgb is condensed as the spot light SPr on the photoelectric conversion element DTo via the reflection mirror Mb and the lens system GLb.
- the focal length Fgs of the lens system GLb is set to be longer than the focal length fo of the f ⁇ lens system FT, and preferably set to Fgs> 2 ⁇ fo.
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Abstract
Description
図1は、第1の実施の形態の基板(被照射体)Pに露光処理を施す露光装置(パターン描画装置)EXの概略構成を示す斜視図である。なお、以下の説明においては、特に断わりのない限り、重力方向をZ方向とするXYZ直交座標系を設定し、図に示す矢印にしたがって、X方向、Y方向、およびZ方向を説明する。
Vsp=(8・α・VR・LT)/60〔mm/秒〕
したがって、発振周波数Faと回転速度VR(rpm)とは、以下の関係になるように設定される。
(φ/2)/Tf=(8・α・VR・LT)/60 ・・・ 式(1)
一例として、原点センサのビーム受光部60b内のレンズ系GLbの焦点距離Fgsを、fθレンズ系FTの焦点距離fo(例えば100mm)と同程度にし、レンズ系GLbの焦点距離Fgsの位置に光電変換素子DToを配置し、ポリゴンミラーPMを約38000rpmで回転させて、図9のような方法でポリゴンミラーPMの反射面RPa~RPhの各々に対応して発生する原点信号SZn(原点時刻Tog2)の再現性を実測したところ、図11に示すような結果が得られた。図11において、横軸は計測した反射面間の各位置(RPa→RPb、RPb→RPc、・・・RPh→RPa)を表し、縦軸は周回速度の変動を補正計算した後の各反射面間の間隔時間ΔTma~ΔTmh(μS)を表す。間隔時間ΔTma~ΔTmhは、本実施の形態では、ポリゴンミラーPMの10回転分に渡って連続して発生する原点信号SZnの波形データを、2.5GHz(0.4nS)のサンプリングレートを持つデジタル波形記憶装置で記憶し、その波形データを解析して実測した。
は、例えば、ポリゴンミラーPMの各反射面RPa~RPhのうちの隣り合った反射面同士の成す8つの頂角の各々が精密に135度になっていない、或いは回転軸AXpから反射面RPa~RPhの各々までの距離が精密に一定になっていない等の加工上の形状誤差に起因して生じる。また、間隔時間ΔTma~ΔTmhのばらつきは、回転軸AXpに対するポリゴンミラーPMの偏心誤差の程度によっても生じ得る。図11では、間隔時間ΔTma~ΔTmhの各々のばらつきの分布から計算される3σ値は、2.3nS~5.9nSとなったが、この値は、光源装置LSからのビームLBのパルス発振周波数を400MHz(周期2.5nS)としたとき、概ね3パルス以上のスポット光の走査位置の誤差が発生することを意味する。先に例示したように、スポット光SPの直径φを4μm、1画素サイズPxyを基板P上で4μm角、1画素分をスポット光SPの2パルス分で描画する場合、3σ値が6nS程度であると、描画ラインSLnに沿って描画されるパターンの位置が、主走査方向に5μm程度(正確には4.8μm)ばらつくことを意味する。
図13は、図3に示した第1の実施の形態における原点センサ(ビーム送光部60aとビーム受光部60b)の配置を変更した変形例を示し、図3中の部材と同じ部材には同一の符号を付してある。図13の変形例では、原点センサのビーム送光部60aからのビームBgaが投射されるポリゴンミラーPMの反射面が、描画用のビームLBnが投射されるポリゴンミラーPMの反射面に対して、ポリゴンミラーPMの回転方向の手前側に位置するように設定されている。図13では、描画用のビームLBnが反射面RPaに投射されるポリゴンミラーPMの角度位置において、原点検出用のビームBgaは2面手前の反射面RPcに投射されるように配置され、反射面RPcで反射した反射ビームBgbはビーム受光部60bのレンズ系GLbを介して光電変換素子DTo上に集光されるように配置される。このように、描画用のビームLBnが投射されるポリゴンミラーPMの反射面RPaと異なる反射面(RPc)に原点検出用のビームBgaを投射するように配置すると、原点センサを構成するビーム送光部60aやビーム受光部60bの配置の自由度が広がり、半導体レーザ光源LDo、レンズ系GLa、GLb、光電変換素子DTo、および反射ミラーMb等をより安定に設置することができ、原点信号SZnの再現性をさらに向上させることが可能である。なお、図13では、反射面RPaの2面手前の反射面RPcを検出するように原点センサを配置したが、1面手前の反射面RPbに対してレーザビームBgaを投射して、反射面RPbの角度位置に応じて発生する原点信号SZnの原点時刻Togを基準にして、反射面RPbによって描画用のビームLBnが走査されるタイミングで描画動作を行ってもよい。
図14は、図3に示した第1の実施の形態における原点センサのビーム受光部60bのレンズ系GLbを、凹面反射ミラー(集光光学系)GLcに置き換えた変形例を示し、その他の図3中の部材と同じ部材には同一の符号を付してある。図14の変形例では、ビーム送光部60a(半導体レーザ光源LDo、レンズ系GLa)からのビームBgaのポリゴンミラーPMの反射面(RPa)での反射ビームBgbを、凹面反射ミラーGLcによって光電変換素子DToに向けて反射させるとともに、光電変換素子DTo上でスポット光SPrとして集光する。すなわち、図14に示す凹面反射ミラーGLcは、図3中の反射ミラーMbとレンズ系GLbの各機能を併せ持った光学部材となる。本変形例でも、凹面反射ミラーGLcの焦点距離は、fθレンズ系FTの焦点距離foよりも長く設定され、好ましくは2倍以上に設定される。
図15は、図3に示した第1の実施の形態における原点センサのビーム受光部60bのレンズ系GLbを、シリンドリカルレンズ(集光光学系)GLdに置き換えた変形例を示し、その他の図3中の部材と同じ部材には同一の符号を付してある。図15〔A〕は、ポリゴンミラーPMの1つの反射面RPaに投射される原点検出用のビームBgaの反射ビームBgbが1次元走査される面(XY面)内におけるシリンドリカルレンズGLdと光電変換素子DToの配置関係を示し、図15〔B〕は、ポリゴンミラーPMの回転軸AXpと平行な面(XZ面)内における反射ビームBgb、シリンドリカルレンズGLd、光電変換素子DToの配置関係を示す。シリンドリカルレンズGLdは、反射ビームBgbの1次元走査の面内(XY面内)で正の屈折力(凸レンズ作用)を有し、1次元走査の面と垂直なZ軸方向(回転軸AXpが延びる方向)には平行平板として機能する。このように、Z軸方向に母線を有するシリンドリカルレンズGLdのXY面内での焦点距離は、fθレンズ系FTの焦点距離foよりも長く設定され、好ましくは2倍以上に設定される。したがって、光電変換素子DTo上に集光される反射ビームBgbは、Z軸方向に延びた細いスリット状のスポット光SPrになる。また、シリンドリカルレンズGLdは、図14と同様に、母線をZ軸と平行にした円筒面状の凹反射面を有するシリンドリカル凹面反射ミラーに変えてもよい。
図16は、第2の実施の形態による描画ユニットUnの一部の構成を示し、第1のシリンドリカルレンズCYa、反射ミラーM23、ポリゴンミラーPM、fθレンズ系FT、および第2のシリンドリカルレンズCYb等の配置は、基本的に図3の構成と同様である。本実施の形態による描画ユニットUnは、基板P上のスポット光SPの最大走査範囲Lxaのうち、パターン描画に使われる描画ラインSLnの走査開始点の直前で、描画用のビームLBnを原点検出用のビームとして検出して、原点信号SZnを生成するような原点センサを備える。そのために本実施の形態では、基板PとシリンドリカルレンズCYbとの間の空間に配置され、最大走査範囲Lxa内の走査開始付近で主光線Le1に沿って進むビームLBnをY方向に反射する反射ミラーMhと、反射ミラーMhで反射されたビームLBnがスポット光SPrとして集光される面と共役な面Pdrを形成するように光軸AXhに沿って配置されるレンズ系(拡大光学系)GLeと、面Pdrに配置される光電変換素子DToとを設ける。
ところで、本実施の形態では、原点検出用のビームとして、パルス発光するビームLBnを利用することから、光電変換素子DToの受光面PD1、PD2の各々からの出力信号STa、STbが、図5(A)のように連続した滑らかな波形にならなかったり、スポット光SPrの像SPr’の径寸法が受光面PD1とPD2の間の不感帯の幅よりも小さくなったりする可能性がある。そこで、図18に示すように、光電変換素子DToとレンズ系GLeとの間に、原点検出用のビームLBnの走査方向に周期(格子ピッチ)を有する透過型の回折格子板GPLを設け、光電変換素子DToに向かうビームLBnを回折現象によって広げ、1パルス分のビームLBnの回折光(0次光、±1次光、±2次光等)が受光面PD1とPD2の間の不感帯の幅をまたがるように設定する。本変形例では、回折格子板GPLによって回折現象でビームLBnの分布を走査方向に広げたが、図18において、光軸AHが延びる方向(Y軸方向)と走査方向(X軸方向)との各々と直交したZ軸方向に母線を有し、凹面状の円筒面を持つシリンドリカルレンズ(負の屈折力)を、回折格子板GPLの位置に配置してもよい。この場合、光電変換素子DToの受光面は、反射ミラーMhの直後に集光したスポット光SPrの面と光学的に共役にはならないが、受光面PD1、PD2上には走査方向に楕円状に引き延ばされた強度分布を持ったビームLBn(Ldf)が投射される。
図19は、第3の実施の形態による描画ユニットUnの一部の構成を示し、第1のシリンドリカルレンズCYa、反射ミラーM23’、ポリゴンミラーPM、fθレンズ系FT、および第2のシリンドリカルレンズCYb、およびシリンドリカルレンズCYbと基板Pの間に配置される反射ミラーMh、レンズ系GLe、光電変換素子DToは、基本的に図16の構成と同様に配置される。さらに本実施の形態による描画ユニットUnでは、シリンドリカルレンズCYaとポリゴンミラーPMの間に配置される反射ミラーM23’を、波長選択性を有するダイクロイックミラーとし、原点検出用のビームBga(ビームLBnと異なる波長の連続光)を、反射ミラーM23’の裏側からポリゴンミラーPMに向けて投射するように構成する。反射ミラーM23’は、例えば紫外波長域の355nmの波長を有する描画用のビームLBnに対しては高い反射率を有し、波長が450nm以上の原点検出用のビームBgaに対しては高い透過率を有するような波長選択特性を備える。また、図19のXY面内において、反射ミラーM23’からポリゴンミラーPMの反射面(RPa)に向かう描画用のビームLBnの入射方位に対し、原点検出用のビームBga(平行光束)の入射方位が主走査方向に角度Δεだけずれるように設定される。これによって、反射ミラーM23’を透過した原点検出用のビームBgaは、ポリゴンミラーPMの反射面(RPa)で反射された反射ビームBgbとなってfθレンズ系FTに入射する。反射ビームBgbは、描画用のビームLBnとともに主走査方向に同一の速度で一次元走査される。
図20は、第4の実施の形態による描画ユニットUnの一部の構成を示し、第1のシリンドリカルレンズCYa、反射ミラーM23、ポリゴンミラーPM、fθレンズ系FT、および第2のシリンドリカルレンズCYbは、基本的に図16(図3)の構成と同様に配置される。本実施の形態では、原点検出用のビームBgaを基板P側からシリンドリカルレンズCYb、fθレンズ系FTを介してポリゴンミラーPMに向けて投射するようにビーム送光部60aを設け、ポリゴンミラーPMで反射された反射ビームBgbが、レンズ系GLb、反射ミラーMb、光電変換素子DToで構成されるビーム受光部60bで検出されるように構成される。図20において、レンズ系GLb、反射ミラーMb、光電変換素子DToの光学的な配置関係は、図3のものと同一である。図20において、ビーム送光部60aは図4に示すように半導体レーザ光源LDoとレンズ系GLaとを含み、平行光束となったビームBgaを発生する。ビーム送光部60aからのビームBgaは、レンズ系GLuと反射ミラーMh1を介して、スポット光SPzとして集光された後、図16で示した反射ミラーMhと同様に配置される反射ミラーMh2によって、fθレンズ系FTの光軸AXfと平行な主光線Le2となるように反射され、シリンドリカルレンズCYbとfθレンズ系FTとを通ってポリゴンミラーPMの反射面(RPa)に投射される。
図21は、第5の実施の形態による原点センサ(ビーム送光部60a、ビーム受光部60b)の構成をXY面内でみた図である。図21において、先の各実施の形態や変形例の部材と同じ機能の部材には同じ符号を付してある。図21では、ポリゴンミラーPMの反射面RPのうちの1つの反射面RPaに向けて、描画用のビームLBnが投射され、ポリゴンミラーPMの反射面RPaの1つ隣り(1つ手前)の反射面RPbに、ビーム送光部60aからのレーザビーム(原点検出用ビーム)Bgaが投射されている。また、図21における反射面RPaの角度位置は、描画用のビームLBnのスポット光SPが描画ラインSLnの描画開始点に位置する直前の状態を示している。ここで、ポリゴンミラーPMの反射面RP(RPa)は、fθレンズ系FTの光軸AXfと直交する入射瞳面に位置するように配置される。厳密には、fθレンズ系FTに入射するビームLBnの主光線が光軸AXfと同軸になった瞬間の反射面RP(RPa)の角度位置において、反射ミラーM23からポリゴンミラーPMに向かうビームLBnの主光線と光軸AXfとが交差する位置に反射面RP(RPa)が設定される。また、fθレンズ系FTの主面から基板Pの表面(スポット光SPの集光点)までの距離が焦点距離foである。
ビーム走査装置として、ポリゴンミラーPMの代わりに、回転軸APxの回りに一定の角度範囲で往復振動するガルバノミラー(走査部材)GVMを用いる描画装置や加工装置もある。図22は、そのようなビーム走査装置の一例を示し、回転軸APxの回りに一定の角度範囲で往復振動するガルバノミラーGVMの反射面に描画用(加工用)のビームLBn(パルス光または連続光)が投射され、反射されたビームLBnはfθレンズ系FTを介して基板P上の描画(加工)ラインSLnにスポット光SPとして投射される。ガルバノミラーGVMが所定角度になった瞬間を原点位置として検出するために、描画用(加工用)のビームLBnを反射するガルバノミラーGVMの反射面(或いは、その裏側の反射面)に、図4と同様にして原点検出用のビームBga(平行光束)を投射し、その反射ビームBgbを反射ミラーMbとレンズ系GLbとを介して、光電変換素子DTo上にスポット光SPrとして集光する構成を設ける。この場合も、レンズ系GLbの焦点距離Fgsは、fθレンズ系FTの焦点距離foよりも長く設定され、好ましくは、Fgs>2・foに設定される。
Claims (26)
- 角度可変の走査部材の反射面で偏向された加工用のビームを入射して、被照射体に前記加工用のビームをスポットとして集光する屈折力を持つ走査用光学系を備えたビーム走査装置であって、
前記走査部材の反射面に向けて投射された原点検出用のビームの反射ビームを受光して、前記走査部材の反射面が所定角度になる時点を表す原点信号を出力する光電検出器と、
前記走査用光学系の屈折力よりも小さい屈折力に設定され、前記反射ビームを前記光電検出器にスポットとして集光する集光光学系と、
を備える、ビーム走査装置。 - 請求項1に記載のビーム走査装置であって、
前記走査用光学系の屈折力に対応した焦点距離をfo、前記集光光学系の屈折力に対応した焦点距離をFgsとしたとき、Fgs>foに設定される、ビーム走査装置。 - 請求項2に記載のビーム走査装置であって、
前記焦点距離foに対して前記焦点距離Fgsを2倍以上に設定する、ビーム走査装置。 - 請求項1~3のいずれか1項に記載のビーム走査装置であって、
連続発光する光源からのビームを平行光束に成形して前記原点検出用のビームとして出力するビーム送光部を備える、ビーム走査装置。 - 請求項4に記載のビーム走査装置であって、
前記被照射体に投射される前記加工用のビームは、紫外波長域でパルス発光するパルス光源装置から生成される、ビーム走査装置。 - 請求項1~3のいずれか1項に記載のビーム走査装置であって、
前記集光光学系は、前記加工用のビームが前記走査用光学系に非入射となるブランク期間中に前記走査部材の反射面によって偏向される方向であって、前記ブランク期間中に前記加工用のビームを前記原点検出用のビームとして入射可能な方向に配置される、ビーム走査装置。 - 請求項1~3のいずれか1項に記載のビーム走査装置であって、
前記加工用のビームが前記走査用光学系を介して走査される走査範囲の端部付近で、前記走査用光学系の一部の光路を通った前記加工用のビームを入射して、前記走査用光学系で集光されたスポットの拡大像を形成する拡大光学系を備え、
前記走査用光学系の一部の光路と前記拡大光学系との合成系を前記集光光学系とし、
前記光電検出器は、前記拡大光学系で拡大された前記加工用のビームのスポットの拡大像を受光するように配置される、ビーム走査装置。 - 請求項1~3のいずれか1項に記載のビーム走査装置であって、
前記原点検出用のビームが前記走査用光学系を介して走査される走査範囲の端部付近で、前記走査用光学系の一部の光路を通った前記原点検出用のビームを入射して、前記走査用光学系で集光されたスポットの拡大像を形成する拡大光学系を備え、
前記走査用光学系の一部の光路と前記拡大光学系との合成系を前記集光光学系とし、
前記光電検出器は、前記拡大光学系で拡大された前記原点検出用のビームのスポットの拡大像を受光するように配置される、ビーム走査装置。 - 請求項4に記載のビーム走査装置であって、
前記ビーム送光部は、前記原点検出用のビームが前記被照射体の側から前記走査用光学系に入射して前記走査部材の反射面に向かうように配置される、ビーム走査装置。 - 請求項1~9のいずれか1項に記載のビーム走査装置であって、
前記走査部材は、複数の反射面を有して回転軸の回りに回転する回転多面鏡、或いは回転軸の回りに往復振動するガルバノミラーであり、
前記走査用光学系は、前記走査部材で偏向された前記加工用のビームの偏向角と、前記被照射体上での前記加工用のビームのスポットの像高位置とを比例関係にしたf-θレンズ系である、ビーム走査装置。 - 角度可変の走査部材の反射面で偏向された加工用のビームを入射して、被照射体に前記加工用のビームをスポットとして集光する屈折力を持つ走査用光学系を備えたビーム走査装置であって、
前記走査部材の反射面に向けて投射された原点検出用のビームの反射ビームを受光して、前記走査部材の反射面が所定角度になる時点を表す原点信号を出力する光電検出器と、
前記光電検出器上で走査される前記原点検出用のビームの反射ビームの走査速度を、前記加工用のビームのスポットの前記被照射体上での走査速度よりも速める光学部材と、
を備える、ビーム走査装置。 - 請求項11に記載のビーム走査装置であって、
前記光学部材は、前記走査部材の反射面で反射された前記原点検出用のビームの前記反射ビームを前記光電検出器上にスポットとして集光する屈折力を有する集光光学系であって、
前記集光光学系の屈折力に対応した焦点距離を前記走査用光学系の屈折力に対応した焦点距離よりも長くした、ビーム走査装置。 - 請求項11に記載のビーム走査装置であって、
前記光学部材は、前記走査部材の反射面で反射された前記原点検出用のビームの前記反射ビームを前記走査部材の反射面に向けて反射する反射部と、
前記走査部材で2回目に反射した前記原点検出用のビームの反射ビームを前記光電検出器上にスポットとして集光する屈折力を有する集光光学系とを備える、ビーム走査装置。 - 角度可変の走査部材の反射面で偏向された描画用ビームを入射して、基板に前記描画用ビームをスポットとして集光する屈折力を持つ走査用光学系を備え、前記走査部材の反射面の角度変化に応じた速度で前記スポットを走査しつつ、前記描画用ビームの強度をパターンに応じて変調して、前記基板にパターンを描画するパターン描画装置であって、
前記走査部材の反射面に向けて投射された原点検出用のビームの反射ビームを受光して、
前記走査部材の反射面が所定角度になる時点を表す原点信号を出力する光電検出器と、
前記走査用光学系の屈折力よりも小さい屈折力に設定され、前記反射ビームを前記光電検出器にスポットとして集光する集光光学系と、
を備える、パターン描画装置。 - 請求項14に記載のパターン描画装置であって、
前記走査用光学系の屈折力に対応した焦点距離をfo、前記集光光学系の屈折力に対応した焦点距離をFgsとしたとき、Fgs>foに設定される、パターン描画装置。 - 請求項15に記載のパターン描画装置であって、
前記焦点距離foに対して前記焦点距離Fgsを2倍以上に設定する、パターン描画装置。 - 請求項14~16のいずれか1項に記載のパターン描画装置であって、
連続発光する光源からのビームを平行光束に成形して前記原点検出用のビームとして出力するビーム送光部を備える、パターン描画装置。 - 請求項17に記載のパターン描画装置であって、
前記基板に投射される前記描画用ビームは、紫外波長域でパルス発光するパルス光源装置から生成される、パターン描画装置。 - 請求項14~16のいずれか1項に記載のパターン描画装置であって、
前記集光光学系は、前記描画用ビームが前記走査用光学系に非入射となる期間中に前記走査部材の反射面によって偏向される方向であって、前記非入射となる期間中に前記描画用ビームを前記原点検出用のビームとして入射可能な方向に配置される、パターン描画装置。 - 請求項14~16のいずれか1項に記載のパターン描画装置であって、
前記描画用ビームが前記走査用光学系を介して走査される走査範囲の端部付近で、前記走査用光学系の一部の光路を通った前記描画用ビームを入射して、前記走査用光学系で集光されたスポットの拡大像を形成する拡大光学系を備え、
前記走査用光学系の一部の光路と前記拡大光学系との合成系を前記集光光学系とし、
前記光電検出器は、前記拡大光学系で拡大された前記描画用ビームのスポットの拡大像を受光するように配置される、パターン描画装置。 - 請求項14~16のいずれか1項に記載のパターン描画装置であって、
前記原点検出用のビームが前記走査用光学系を介して走査される走査範囲の端部付近で、前記走査用光学系の一部の光路を通った前記原点検出用のビームを入射して、前記走査用光学系で集光されたスポットの拡大像を形成する拡大光学系を備え、
前記走査用光学系の一部の光路と前記拡大光学系との合成系を前記集光光学系とし、
前記光電検出器は、前記拡大光学系で拡大された前記原点検出用のビームのスポットの拡大像を受光するように配置される、パターン描画装置。 - 請求項17に記載のパターン描画装置であって、
前記ビーム送光部は、前記原点検出用のビームが前記基板の側から前記走査用光学系に入射して前記走査部材の反射面に向かうように配置される、パターン描画装置。 - 請求項14~22のいずれか1項に記載のパターン描画装置であって、
前記走査部材は、複数の反射面を有して回転軸の回りに回転する回転多面鏡、或いは回転軸の回りに往復振動するガルバノミラーであり、
前記走査用光学系は、前記走査部材で偏向された前記描画用ビームの偏向角と、前記基板上での前記描画用ビームのスポットの像高位置とを比例関係にしたf-θレンズ系である、パターン描画装置。 - 角度可変の走査部材の反射面で偏向された描画用ビームを入射して、基板に前記描画用ビームをスポットとして集光する屈折力を持つ走査用光学系を備え、前記走査部材の反射面の角度変化に応じた速度で前記スポットを走査しつつ、前記描画用ビームの強度をパターンに応じて変調して、前記基板にパターンを描画するパターン描画装置であって、
前記走査部材の反射面に向けて投射された原点検出用のビームの反射ビームを受光して、前記走査部材の反射面が所定角度になる時点を表す原点信号を出力する光電検出器と、
前記光電検出器上で走査される前記原点検出用のビームの反射ビームの走査速度を、前記描画用ビームのスポットの前記基板上での走査速度よりも速める光学部材と、
を備える、パターン描画装置。 - 請求項24に記載のパターン描画装置であって、
前記光学部材は、前記走査部材の反射面で反射された前記原点検出用のビームの前記反射ビームを前記光電検出器上にスポットとして集光する屈折力を有する集光光学系であって、前記集光光学系の屈折力に対応した焦点距離を前記走査用光学系の屈折力に対応した焦点距離よりも長くした、パターン描画装置。 - 請求項24に記載のパターン描画装置であって、
前記光学部材は、前記走査部材の反射面で反射された前記原点検出用のビームの前記反射ビームを前記走査部材の反射面に向けて反射する反射部と、
前記走査部材で2回目に反射した前記原点検出用のビームの反射ビームを前記光電検出器上にスポットとして集光する屈折力を有する集光光学系とを備える、パターン描画装置。
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