WO2018058746A1 - 散热结构、电子装置、云台及飞行器 - Google Patents

散热结构、电子装置、云台及飞行器 Download PDF

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Publication number
WO2018058746A1
WO2018058746A1 PCT/CN2016/104857 CN2016104857W WO2018058746A1 WO 2018058746 A1 WO2018058746 A1 WO 2018058746A1 CN 2016104857 W CN2016104857 W CN 2016104857W WO 2018058746 A1 WO2018058746 A1 WO 2018058746A1
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WIPO (PCT)
Prior art keywords
heat
heat dissipation
circuit board
dissipation structure
generating device
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Ceased
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PCT/CN2016/104857
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English (en)
French (fr)
Inventor
蓝求
周长兴
刘万启
邱贞平
张梁
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SZ DJI Technology Co Ltd
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SZ DJI Technology Co Ltd
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Priority to CN201680087787.7A priority Critical patent/CN109479384A/zh
Publication of WO2018058746A1 publication Critical patent/WO2018058746A1/zh
Anticipated expiration legal-status Critical
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B64—AIRCRAFT; AVIATION; COSMONAUTICS
    • B64U—UNMANNED AERIAL VEHICLES [UAV]; EQUIPMENT THEREFOR
    • B64U20/00—Constructional aspects of UAVs
    • B64U20/90—Cooling
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the invention relates to a heat dissipation structure, an electronic device having the heat dissipation structure, a cloud platform and an aircraft having the electronic device or the cloud platform.
  • a heat dissipation structure for dissipating heat to a heat generating device on a circuit board including a heat sink member that can be disposed on the heat generating device, wherein the heat sink member includes a heat sink body connected to each other And a heat conducting member that is in direct contact with the heat generating device on the circuit board and/or the circuit board.
  • the heat sink body includes a plurality of separate heat dissipating units that are respectively in contact with different heat generating devices or are in contact with different heat generating portions on the same heat generating device.
  • the heat dissipation structure includes a heat conduction member corresponding to the number of the heat dissipation units, and the heat conduction member and the corresponding heat dissipation unit are connected to each other.
  • the heat dissipation unit is integrally formed with the corresponding heat conduction member.
  • the heat conducting member extends from the corresponding heat dissipating unit along the side of the heat generating device to the circuit board, and the heat generating device on the circuit board and/or the circuit board direct contact.
  • the heat dissipation unit includes at least one heat dissipation fin, and the heat dissipation fin and the heat conduction member respectively extend in opposite directions.
  • the surface of the heat dissipation fin is sawtoothed to increase the heat dissipation area.
  • the heat dissipation unit includes a plurality of heat dissipation fins, and the distance between each two adjacent heat dissipation fins is equal.
  • the heat conducting member includes an extending portion extending from the heat sink body toward the circuit board, and a contact portion extending perpendicularly from the extending portion away from an end portion of the heat sink body, the extending portion and the extending portion The side walls of the heat generating device are in contact, and the contact portion is in contact with the circuit board.
  • the heat dissipation structure further includes a heat conductive film disposed between the heat generating device and the heat sink member.
  • the heat conductive film is at least one of a graphene heat conductive film, a silica gel heat conductive film, an alumina heat conductive rubber layer or a boron nitride heat conductive rubber layer.
  • the heat sink body and the heat conducting member are made of a conductive material and can be electrically connected to the heat generating device.
  • An electronic device includes a circuit board, a heat generating device, and a heat dissipating structure, wherein the heat generating device is disposed on the circuit board, the heat sink member includes a heat sink body and a heat conducting member, and the heat sink body and the heat conducting member are both Electrically connected to the circuit board.
  • the circuit board is a flexible circuit board, a rigid circuit board or a soft and hard circuit board.
  • the number of the heat generating devices is plural, and the heat sink body includes a plurality of separate heat dissipating units that are respectively in contact with different heat generating devices or different heat generating portions of the same heat generating device.
  • the electronic device is at least one of a flight controller, an image sensor or an electronic governor.
  • a pan/tilt head comprising at least one rotating bracket and a motor for driving the rotating bracket to rotate, wherein the pan/tilt head further comprises an electronic governor for controlling operation of the motor, the electronic governor comprising The heat dissipation structure of any of 1-12 is required.
  • the pan/tilt head includes three rotating brackets connected in sequence, respectively driven The three sets of motors of the three rotating brackets and the three sets of ESCs respectively controlling the motor, the number of ESCs of each group is one or more.
  • An aircraft comprising an aircraft body, and an electronic device, as described above, disposed on the aircraft body, fired to the aircraft body as described above.
  • the heat dissipation structure provided by the present invention is directly connected to the heat conducting member, and the heat conducting member is directly connected with the heat generating device on the circuit board and/or the circuit board. Contact can improve the heat dissipation effect of the heat dissipation structure.
  • FIG. 1 is a schematic cross-sectional view of an electronic device according to an embodiment of the present invention.
  • FIG. 2 is a schematic cross-sectional view of the electronic device when the heat dissipating fin has a zigzag cross section according to another embodiment of the present invention.
  • FIG 3 is a cross-sectional view of the electronic device when the heat conducting member extends from the heat sink body along opposite sides of the heat generating device to the circuit board in another embodiment.
  • a component when a component is considered to be “connected” to another component, it can be directly connected to another component or a central component can be present at the same time.
  • a component When a component is considered to be “set to” another component, it can be placed directly on another component or possibly with a centered component.
  • the heat dissipation structure 10 provided by the present invention is used for dissipating heat from the heat generating device 13 on the circuit board 11 .
  • the heat dissipation structure 10 includes a heat sink member 15 and a heat conductive film 17 that are used together.
  • the heat sink member 15 can be disposed on the heat generating device 13.
  • the heat sink member 15 includes a heat sink body 150 and a heat conductive member 155 that are connected to each other.
  • the heat conductive member 155 extends from the heat sink body 150 along the heat generating device 13 side to the circuit board 11.
  • the heat generating device 13 is electrically connected to the circuit board 11, and the heat sink body 150 is electrically connected to the circuit board through a heat conducting member 155, thereby achieving electrical connection with the heat generating device 13.
  • the heat generating device 13 dissipates heat through two ways, that is, directly contacting the heat sink body 150 directly or indirectly through the top surface to dissipate heat, and on the other hand, conducting heat through the circuit board 11 and the heat conducting member 155. To the heat sink body 150 for heat dissipation.
  • the heat sink body 150 includes a plurality of separate heat dissipation units 151.
  • the plurality of heat dissipation units 151 are respectively in contact with different heat generating devices 13 to achieve heat dissipation.
  • each of the heat dissipation units 151 is separated from each other to ensure effective electrical isolation between the respective heat-generating devices 13 to avoid short circuit.
  • the number of the heat dissipation unit 151 and the heat generating device 13 are corresponding, thereby ensuring a better heat dissipation effect on the single heat generating device 13.
  • the heat dissipating units 151 are separated from each other, so that when electrically conducting, it is ensured that they are not short-circuited with other heat generating devices 13. It can be understood that some heat generating devices 13 have a large heat generating area and a large number of heat generating points, and a plurality of heat radiating units 151 may be disposed in a plurality of heat generating points of the heat generating device 13, or the heat generating surface of the heat generating device 13 may be divided into regions according to regions.
  • the heat dissipating unit 151 realizes a better heat dissipating effect; similarly, since it is not connected to the heat dissipating unit 151 of the other heat generating device 13, electrical isolation can be achieved to avoid short circuit.
  • the heat sink body 150 and the heat conducting member 155 are made of a conductive material, since the heat sink body 150 and the heat conducting member 155 are connected to each other, and the heat conducting member 155 is electrically connected to the circuit board 11 and the heat generating device 13 and the circuit board 11 are electrically connected.
  • the connection so that the circuit board 11, the heat generating device 13, the heat conducting member 155 and the heat sink body 150 can be electrically connected, thereby improving the heat dissipation efficiency of the circuit board 11 and the heat generating device 13 while improving the circuit board 11 and The conductive effect of the heat generating device 13.
  • the heat conducting member 155 can also be in direct contact with the heat generating device 13 to further improve heat transfer efficiency.
  • each of the heat dissipation units 151 includes a connection plate 152 and a plurality of mutually spaced heat dissipation fins 153 extending from the connection plate 152 .
  • the distance between each two adjacent heat dissipation fins 153 is equal.
  • the arrangement direction of the heat dissipation fins 153 is defined. For the thickness direction of the heat sink surface 153, a cross section of each of the heat dissipation fins 153 along the thickness direction thereof is rectangular.
  • the spacing distance between the heat dissipation fins 153 can also be other modes, such as an arithmetic progression, a geometric progression, a specific function curve, and the like.
  • the number of the heat conducting members 155 corresponds to the number of the heat radiating units 151.
  • Each of the heat conducting members 155 is connected to a corresponding one of the heat radiating units 151.
  • the heat conducting member 155 and the corresponding heat dissipating unit 151 may be connected by a snapping structure, a locking structure or the like, or may be connected to each other by integral molding.
  • the heat conducting member 155 is integrally formed with the corresponding heat radiating unit 151.
  • the heat conducting member 155 and the heat dissipation fin 153 extend in opposite directions.
  • the heat conducting member 155 and the heat dissipation fins 153 extend perpendicularly from the connecting plate 152 in opposite directions.
  • the heat conducting member 155 extends from the corresponding heat radiating unit 151 along the heat generating device 13 side to the circuit board 11 and to the circuit board 11 and/or the circuit board 11
  • the heat generating device 13 is in direct contact.
  • the heat conducting member 155 includes an extension portion 156 and a contact portion 157 that are connected to each other.
  • the extension portion 156 extends from the heat sink body 150 toward the circuit board 11 .
  • the extending portion 156 extends perpendicularly from the heat sink body 150 to the circuit board 11 .
  • the contact portion 157 extends perpendicularly from the end of the extension portion 156 away from the heat sink body 150.
  • the extending portion 156 is in contact with the side wall of the heat generating device 13.
  • the contact portion 157 is in contact with the circuit board 11.
  • the heat dissipation unit 151 is electrically connected to the heat generating device 13 and/or the circuit board 11 through the contact portion 157 of the corresponding heat conducting member 155 .
  • the heat dissipating unit 151 is connected to other components. At this time, the heat dissipating unit 151 and the corresponding heat conducting member 155 can serve as high-power wires, thereby improving the ability of the circuit board 11 to pass current.
  • the heat conductive film 17 is disposed between the heat generating device 13 and the heat sink member 15. In the illustrated embodiment, the heat conductive film 17 is disposed between the heat generating device 13 and the connecting plate 152.
  • the material of the heat conductive film 17 may be at least one of the following: graphene, thermal silica gel, alumina heat conductive rubber, boron nitride heat conductive rubber.
  • the heat dissipation fins 153 in order to increase the heat dissipation area of the heat dissipation fins 153 , the heat dissipation fins The surface of the sheet 153 is serrated. It can be understood that the surface of the heat dissipation fin 153 may also be wave-shaped, or the heat dissipation area may be increased by providing bumps, bosses, or the like on the surface of the heat dissipation fin 153.
  • the heat conductive member 155 is along the heat sink body 150.
  • the heat generating device 13 extends to the circuit board 11 on opposite sides.
  • the heat conducting members 155 are symmetrically located on opposite sides of the heat generating device 13.
  • the heat conducting member 155 may also extend from the heat sink body 150 along any two sides or any four sides of the heat generating device 13 to the circuit board 11, and the extending portion 156 and the The side walls of the heat generating device 13 are in contact, and the contact portion 157 is in contact with the circuit board.
  • the heat conductive members 155 on each side of the heat generating device 13 may be continuously disposed or spaced apart along the circumferential direction of the heat generating device 13.
  • the present invention further provides an electronic device 100 including a circuit board 11 , at least one heat generating device 13 and the heat dissipation structure 10 .
  • the circuit board 11 can be a flexible circuit board, a rigid circuit board, or a soft and hard circuit board.
  • the circuit board 11 is configured to carry the heat generating device 13 and the heat dissipation structure 10 .
  • the plurality of heat generating devices 13 are plural.
  • the heat generating devices 13 are all disposed on the circuit board 11 and can be electrically connected to the circuit board 11.
  • the plurality of heat dissipation units 151 of the heat dissipation structure 10 are respectively in contact with the heat generating device 13 to achieve heat dissipation.
  • the electronic device 100 can be an electronic device such as an electronic governor, a flight controller, or an image sensor.
  • the electronic device is an electronic governor.
  • the invention also provides an aircraft (not shown).
  • the aircraft includes an aircraft body and an electronic device 100 as described above disposed on the aircraft body.
  • the electronic device 100 is an electronic governor.
  • the present invention also includes a pan/tilt (not shown), the pan/tilt includes at least one rotating bracket and a motor for driving the rotation of the rotating bracket, wherein the pan/tilt further includes an electronic unit that controls operation of the motor A governor comprising the heat dissipation structure 10 as described above.
  • the pan/tilt includes three rotating brackets connected in sequence, three sets of motors respectively driving the three rotating brackets, and three sets of electrical tones respectively controlling the motor, and the number of electrical tones of each group is one. Or multiple.
  • the three rotating brackets are divided into Don't be a heading bracket, a roll axle bracket, and a pitch axle bracket.
  • the motor is a heading axis motor, a roll axis motor, and a pitch axis motor.
  • the present invention also provides an aircraft (not shown), such as an unmanned aerial vehicle, comprising an aircraft body and an electronic device as described above disposed on the aircraft body or a pan/tilt head as described above coupled to the aircraft body .
  • an aircraft such as an unmanned aerial vehicle
  • the electronic device on the aircraft can also be any combination of one or more of an electronic governor, an image sensor, and a flight controller.
  • the heat dissipation structure provided by the present invention is directly connected to the heat conducting member, and the heat conducting member is directly connected with the heat generating device on the circuit board and/or the circuit board. Contact can improve the heat dissipation effect of the heat dissipation structure.
  • the heat sink body and the heat conductive member are electrically connected to the circuit board and/or the heat generating device on the circuit board, when the heat sink body is connected to other components, the heat dissipation structure can be used as a high power wire. Thereby improving the ability of the board to pass current. Moreover, due to the separated structure of the heat dissipating unit, short circuits between different heat generating devices can be effectively avoided.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Remote Sensing (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

一种散热结构（10），用于对电路板（11）上的发热器件（13）散热，所述散热结构（10）包括散热器件（15），所述散热器件（15）能够设置在所述发热器件（13）上，其中，所述散热器件（15）包括相互连接的散热器本体（150）及导热件（155），所述导热件（155）与所述电路板（11）及/或所述电路板（11）上的发热器件（13）直接接触；另外提供一种具有该散热结构（10）的电子装置（100）、云台以及包括所述电子装置（100）或云台的飞行器。

Description

散热结构、电子装置、云台及飞行器 技术领域
本发明涉及一种散热结构，一种具有该散热结构的电子装置、云台以及具有该电子装置或云台的飞行器。
背景技术
在电子装置的控制系统中存在很多大功率的功能模块，例如飞行控制模块、图像传输模块、电子调速模块等，所述功能模块在运行时会产生大量的热量，若不及时将所述热量散去，将损害所述功能模块，使得所述功能模块无法正常运转。为了保证各功能模块的正常运转通常会设置散热结构。然而，现有的散热结构中散热器与导热件分离，散热效果不佳。
发明内容
有鉴于此，有必要提供一种克服上述问题的散热结构、具有该散热结构的电子装置、云台以及飞行器。
一种散热结构，用于对电路板上的发热器件散热，所述散热结构包括散热器件，所述散热器件能够设置在所述发热器件上，其中，所述散热器件包括相互连接的散热器本体及导热件，所述导热件与所述电路板及/或所述电路板上的发热器件直接接触。
进一步地，所述散热器本体包括多个分离的散热单元，所述多个散热单元分别与不同的发热器件接触，或者与同一发热器件上不同的发热部位接触。
进一步地，所述散热结构包括与所述散热单元数目对应的导热件，所述导热件与对应的散热单元相互连接。
进一步地，所述散热单元与对应的导热件一体成型。
进一步地，所述导热件自对应的散热单元沿所述发热器件一侧延伸至所述电路板，并与所述电路板及/或所述电路板上的发热器件 直接接触。
进一步地，所述散热单元包括至少一个散热鳍片，所述散热鳍片与所述导热件分别沿相反的方向延伸设置。
进一步地，所述散热鳍片的表面呈锯齿状，以增大散热面积。
进一步地，所述散热单元包括多个散热鳍片，每两个相邻散热鳍片之间间隔的距离相等。
进一步地，所述导热件包括自所述散热器本体向所述电路板延伸的延伸部，及自所述延伸部远离所述散热器本体的端部垂直延伸的接触部，所述延伸部与所述发热器件的侧壁接触，所述接触部与所述电路板接触。
进一步地，所述散热结构还包括设置在所述发热器件与所述散热器件之间的导热膜。
进一步地，所述导热膜为石墨烯导热膜，硅胶导热膜，氧化铝导热橡胶层或者氮化硼导热橡胶层中的至少一种。
进一步地，所述散热器本体及导热件为导电材料制成，并能够与发热器件电性导通。
一种电子装置，包括电路板、发热器件以及散热结构，所述发热器件设置在所述电路板上，所述散热器件包括散热器本体和导热件，所述散热器本体及所述导热件均与所述电路板电连接。
进一步地，所述电路板为柔性电路板，刚性电路板或者软硬结合电路板。
进一步地，所述发热器件的数量为多个，所述散热器本体包括多个分离的散热单元，所述多个散热单元分别与不同的发热器件或同一发热器件的不同发热部位接触。
进一步地，所述电子装置为飞行控制器，图像传感器或者电子调速器中的至少一种。
一种云台，包括至少一个转动支架以及驱动所述转动支架转动的电机，其特征在于，所述云台还包括控制所述电机运转的电子调速器，所述电子调速器包括如权利要求1-12任一项所述的散热结构。
进一步地，所述云台包括依次连接的三个转动支架、分别驱动 所述三个转动支架的三组电机以及分别控制所述电机的三组电调，每组电调的数目为一个或多个。
一种飞行器，其包括飞行器本体，以及设置于飞行器本体上的如上所述的电子装置火连接于所述飞行器本体上的如上所述的云台。
与现有技术相比，本发明提供的散热结构，由于所述散热器本体与所述导热件相互连接，且所述导热件与所述电路板及/或所述电路板上的发热器件直接接触，可提升所述散热结构的散热效果。
附图说明
图1是本发明一实施方式提供的电子装置的剖面示意图。
图2是本发明另一实施方式中当所述散热鳍片截面呈锯齿状时，所述电子装置的剖面示意图。
图3是另一实施方式中当所述导热件自所述散热器本体沿所述发热器件的相对两侧延伸至所述电路板时，所述电子装置的剖面示意图。
主要元件符号说明
散热结构                   10
电路板                     11
发热器件                   13
散热器件                   15
散热器本体                 150
散热单元                   151
导热件                     155
连接板                     152
散热鳍片                   153
延伸部                     156
接触部                     157
导热膜                     17
电子装置                   100
如下具体实施方式将结合上述附图进一步说明本发明。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明的一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
需要说明的是，当一个组件被认为是“连接”另一个组件，它可以是直接连接到另一个组件或者可能同时存在居中组件。当一个组件被认为是“设置于”另一个组件，它可以是直接设置在另一个组件上或者可能同时存在居中组件。
除非另有定义，本文所使用的所有的技术和科学术语与属于本发明的技术领域的技术人员通常理解的含义相同。本文中在本发明的说明书中所使用的术语只是为了描述具体的实施例的目的，不是旨在于限制本发明。本文所使用的术语“及/或”包括一个或多个相关的所列项目的任意的和所有的组合。
下面结合附图，对本发明的一些实施方式作详细说明。在不冲突的情况下，下述的实施例及实施例中的特征可以相互组合。
请参阅图1，本发明提供的散热结构10，用于对电路板11上的发热器件13进行散热。
本实施方式中，所述散热结构10包括配合使用的散热器件15及导热膜17。
所述散热器件15能够设置在所述发热器件13上。所述散热器件15包括相互连接的散热器本体150及导热件155。本实施方式中，当 所述散热器件15设置于所述发热器件13上时，所述导热件155自所述散热器本体150沿所述发热器件13一侧延伸至所述电路板11。所述发热器件13与所述电路板11电连接，所述散热器本体150通过导热件155与所述电路板电连接，从而实现与所述发热器件13的电连接。
从而，本实施例中，发热器件13通过两个途径散热，一方面为通过顶面直接或间接与散热器本体150接触以进行散热，另一方面为通过电路板11、导热件155将热量传导至散热器本体150以进行散热。
所述散热器本体150包括多个分离的散热单元151。所述多个散热单元151分别与不同的发热器件13接触，从而实现散热。本实施方式中，各个所述散热单元151相互分离，以保证对应的各个所述发热器件13之间的有效的电性隔离，避免短路。
本实施例中，所述散热单元151和发热器件13的数目对应，从而保证对单个发热器件13具有较好的散热效果。所述散热单元151相互之间彼此分离，从而在电导通的时候，可保证不会与其他发热器件13短路。可以理解，某些发热器件13的发热面积大，发热点较多，可对此发热器件13的多个发热点配置多个散热单元151，或对此发热器件13的发热面按区域划分配置多个散热单元151，从而实现较好的散热效果；同理，由于与其他发热器件13的散热单元151未连通，故同样可实现电性隔离，避免短路。
进一步地，所述散热器本体150及导热件155为导电材料制成，由于散热器本体150和导热件155相互连接，且导热件155与电路板11电连接以及发热器件13和电路板11电连接，从而可以使得电路板11、发热器件13、导热件155及散热器本体150能够电连接，进而可在提高对电路板11及发热器件13的散热效率的同时，一并提高电路板11和发热器件13的导电效果。所述导热件155还可以和所述发热器件13直接接触，进一步提高热传导效率。
本实施方式中，每个所述散热单元151的结构相同。所述散热单元151包括连接板152及自所述连接板152延伸设置的多个相互间隔的散热鳍片153。本实施方式中，每两个相邻的散热鳍片153之间间隔的距离相等。本实施方式中，将所述散热鳍片153的排列方向定义 为所述散热器面153的厚度方向，每个所述散热鳍片153沿其厚度方向的截面呈矩形。
可以理解，所述散热鳍片153之间的间隔距离也可为其他方式，如等差数列、等比数列、特定函数曲线等。
本实施方式中，所述导热件155的数目与所述散热单元151的数目对应。每个所述导热件155与对应的一个所述散热单元151相互连接。所述导热件155与对应的所述散热单元151可通过卡合结构、锁固结构等方式连接，也可通过一体成型的方式相互连接。本实施方式中，所述导热件155与对应的所述散热单元151一体成型。
所述导热件155与所述散热鳍片153沿相反的方向延伸设置。本实施方式中，所述导热件155与所述散热鳍片153分别自所述连接板152沿相反方向垂直延伸。本实施方式中，所述导热件155自对应的所述散热单元151沿所述发热器件13一侧延伸至所述电路板11，并与所述电路板11及/或所述电路板11上的发热器件13直接接触。所述导热件155包括相互连接的延伸部156及接触部157。所述延伸部156自所述散热器本体150向所述电路板11延伸设置。本实施方式中，所述延伸部156自所述散热器本体150向所述电路板11垂直延伸。所述接触部157自所述延伸部156远离所述散热器本体150的端部垂直延伸。本实施方式中，所述延伸部156与所述发热器件13的侧壁接触。所述接触部157与所述电路板11接触。本实施方式中，所述散热单元151通过对应的导热件155的接触部157与所述发热器件13及/或所述电路板11电性导通。所述散热单元151连接至其他元件上，此时所述散热单元151与对应的所述导热件155可作为大功率导线，从而提升所述电路板11的通过电流的能力。
所述导热膜17设置在所述发热器件13与所述散热器件15之间。图示实施方式中，所述导热膜17设置在所述发热器件13与所述连接板152之间。所述导热膜17的材料可以为以下至少一种：石墨烯，导热硅胶，氧化铝导热橡胶，氮化硼导热橡胶。
请参阅图2，为增大所述散热鳍片153的散热面积，所述散热鳍 片153表面呈锯齿状。可以理解，散热鳍片153的表面也可呈波浪形，或通过在散热鳍片153的表面设置凸点、凸台等方式增加散热面积。
可以理解，请参阅图3，为进一步提升所述散热结构的散热效率，当所述散热器件15设置于所述发热器件13上时，所述导热件155自所述散热器本体150沿所述发热器件13相对两侧延伸至所述电路板11。所述导热件155位于所述发热器件13相对两侧的结构对称。当然，所述导热件155也可自所述散热器本体150沿所述发热器件13的相邻两侧，任意三侧或四周延伸至所述电路板11，且所述延伸部156与所述发热器件13的侧壁接触，所述接触部157与所述电路板接触。此时，所述发热器件13每侧的导热件155可沿所述发热器件13的周向连续设置或间隔设置。
请再次参阅图1，本发明还提供一种电子装置100，包括一个电路板11，至少一个发热器件13及所述散热结构10。
所述电路板11可为柔性电路板，刚性电路板，或软硬结合电路板等。所述电路板11用于承载所述发热器件13及所述散热结构10。
本实施方式中，所述发热器件13为多个。所述发热器件13均设置于所述电路板11上，并能够与所述电路板11电连接。所述散热结构10的多个散热单元151分别与所述发热器件13接触，以实现散热。
所述电子装置100可为电子调速器，飞行控制器，或图像传感器等电子装置。本实施例中，所述电子装置为电子调速器。本发明还提供一种飞行器(图未示)。所述飞行器包括飞行器本体，及设置于飞行器本体上的如上述的电子装置100。本实施方式中，所述电子装置100为电子调速器。
本发明还包括一种云台(图未示)，所述云台包括至少一个转动支架以及驱动所述转动支架转动的电机，其特征在于，所述云台还包括控制所述电机运转的电子调速器，所述电子调速器包括如上所述的散热结构10。
本实施方式中，所述云台包括依次连接的三个转动支架、分别驱动所述三个转动支架的三组电机以及分别控制所述电机的三组电调，每组电调的数目为一个或多个。具体地，所述三个转动支架分 别为航向轴支架、横滚轴支架以及俯仰轴支架。相应地，所述电机为航向轴电机、横滚轴电机以及俯仰轴电机。
本发明还提供一种飞行器(图未示)，如无人飞行器，其包括飞行器本体以及设置于飞行器本体上的如上所述的电子装置或连接于所述飞行器本体上的如上所述的云台。可以理解，所述飞行器上的电子装置也可为电子调速器、图像传感器、飞行控制器中的一种或多种的任意组合。
与现有技术相比，本发明提供的散热结构，由于所述散热器本体与所述导热件相互连接，且所述导热件与所述电路板及/或所述电路板上的发热器件直接接触，可提升所述散热结构的散热效果。
另外，由于散热器本体及导热件与所述电路板及/或所述电路板上的发热器件电连接，当所述散热器本体连接至其他元件时，所述散热结构可以作为大功率导线，从而提升电路板的通过电流的能力。且由于散热单元的分离结构，还可有效避免不同发热器件之间出现短路。
可以理解的是，对于本领域的普通技术人员来说，可以根据本发明的技术构思做出其它各种相应的改变与变形，而所有这些改变与变形都应属于本发明权利要求的保护范围。

Claims (19)

  1. 一种散热结构，用于对电路板上的发热器件散热，所述散热结构包括散热器件，所述散热器件能够设置在所述发热器件上，其中，所述散热器件包括相互连接的散热器本体及导热件，所述导热件与所述电路板及/或所述电路板上的发热器件直接接触。
  2. 如权利要求1所述的散热结构，其特征在于，所述散热器本体包括多个分离的散热单元，所述多个散热单元分别与不同的发热器件接触，或者与同一发热器件上不同的发热部位接触。
  3. 如权利要求2所述的散热结构，其特征在于，所述散热结构包括与所述散热单元数目对应的导热件，所述导热件与对应的散热单元相互连接。
  4. 如权利要求3所述的散热结构，其特征在于，所述散热单元与对应的导热件一体成型。
  5. 如权利要求3所述的散热结构，其特征在于，所述导热件自对应的散热单元沿所述发热器件一侧延伸至所述电路板，并与所述电路板及/或所述电路板上的发热器件直接接触。
  6. 如权利要求2所述的散热结构，其特征在于，所述散热单元包括至少一个散热鳍片，所述散热鳍片与所述导热件分别沿相反的方向延伸设置。
  7. 如权利要求6所述的散热结构，其特征在于，所述散热鳍片的表面呈锯齿状，以增大散热面积。
  8. 如权利要求6所述的散热结构，其特征在于，所述散热单元包括多个散热鳍片，每两个相邻散热鳍片之间间隔的距离相等。
  9. 如权利要求1所述的散热结构，其特征在于，所述导热件包括自所述散热器本体向所述电路板延伸的延伸部，及自所述延伸部远离所述散热器本体的端部垂直延伸的接触部，所述延伸部与所述发热器件的侧壁接触，所述接触部与所述电路板接触。
  10. 如权利要求1所述的散热结构，其特征在于，所述散热结构还包括设置在所述发热器件与所述散热器件之间的导热膜。
  11. 如权利要求10所述的散热结构，其特征在于，所述导热膜为石墨烯导热膜，硅胶导热膜，氧化铝导热橡胶层或者氮化硼导热橡胶层中的至少一种。
  12. 如权利要求2-6任一项所述的散热结构，其特征在于，所述散热器本体及导热件为导电材料制成，并能够与发热器件电性导通。
  13. 一种电子装置，包括电路板、发热器件以及散热结构，所述发热器件设置在所述电路板上，所述散热器件包括散热器本体和导热件，所述散热器本体通过所述导热件与所述电路板电连接。
  14. 如权利要求13所述的电子装置，其特征在于，所述电路板为柔性电路板，刚性电路板或者软硬结合电路板。
  15. 如权利要求13所述的电子装置，其特征在于，所述发热器件的数量为多个，所述散热器本体包括多个分离的散热单元，所述多个散热单元分别与不同的发热器件或同一发热元件的不同发热部位接触。
  16. 如权利要求13所述的电子装置，其特征在于，所述电子装置为飞行控制器，图像传感器或者电子调速器中的至少一种。
  17. 一种云台，包括至少一个转动支架以及驱动所述转动支架转动的电机，其特征在于，所述云台还包括控制所述电机运转的电子调速器，所述电子调速器包括如权利要求1-12任一项所述的散热结构。
  18. 如权利要求17所述的云台，其特征在于，所述云台包括依次连接的三个转动支架、分别驱动所述三个转动支架的三组电机以及分别控制所述电机的三组电调，每组电调的数目为一个或多个。
  19. 一种飞行器，其包括飞行器本体，以及设置于飞行器本体上如权利要求13-16任一项所述的电子装置或连接于所述飞行器本体上的如权利要求17或18所述的云台。
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CN112118718B (zh) * 2020-10-31 2023-05-26 Oppo广东移动通信有限公司 电子设备及其散热方法

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