WO2018058746A1 - Structure de dissipation de chaleur, dispositif électronique, dispositif de panoramique-inclinaison et aéronef - Google Patents

Structure de dissipation de chaleur, dispositif électronique, dispositif de panoramique-inclinaison et aéronef Download PDF

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Publication number
WO2018058746A1
WO2018058746A1 PCT/CN2016/104857 CN2016104857W WO2018058746A1 WO 2018058746 A1 WO2018058746 A1 WO 2018058746A1 CN 2016104857 W CN2016104857 W CN 2016104857W WO 2018058746 A1 WO2018058746 A1 WO 2018058746A1
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WO
WIPO (PCT)
Prior art keywords
heat
heat dissipation
circuit board
dissipation structure
generating device
Prior art date
Application number
PCT/CN2016/104857
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English (en)
Chinese (zh)
Inventor
蓝求
周长兴
刘万启
邱贞平
张梁
Original Assignee
深圳市大疆创新科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市大疆创新科技有限公司 filed Critical 深圳市大疆创新科技有限公司
Priority to CN201680087787.7A priority Critical patent/CN109479384A/zh
Publication of WO2018058746A1 publication Critical patent/WO2018058746A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the invention relates to a heat dissipation structure, an electronic device having the heat dissipation structure, a cloud platform and an aircraft having the electronic device or the cloud platform.
  • a heat dissipation structure for dissipating heat to a heat generating device on a circuit board including a heat sink member that can be disposed on the heat generating device, wherein the heat sink member includes a heat sink body connected to each other And a heat conducting member that is in direct contact with the heat generating device on the circuit board and/or the circuit board.
  • the heat sink body includes a plurality of separate heat dissipating units that are respectively in contact with different heat generating devices or are in contact with different heat generating portions on the same heat generating device.
  • the heat dissipation structure includes a heat conduction member corresponding to the number of the heat dissipation units, and the heat conduction member and the corresponding heat dissipation unit are connected to each other.
  • the heat dissipation unit is integrally formed with the corresponding heat conduction member.
  • the heat conducting member extends from the corresponding heat dissipating unit along the side of the heat generating device to the circuit board, and the heat generating device on the circuit board and/or the circuit board direct contact.
  • the heat dissipation unit includes at least one heat dissipation fin, and the heat dissipation fin and the heat conduction member respectively extend in opposite directions.
  • the surface of the heat dissipation fin is sawtoothed to increase the heat dissipation area.
  • the heat dissipation unit includes a plurality of heat dissipation fins, and the distance between each two adjacent heat dissipation fins is equal.
  • the heat conducting member includes an extending portion extending from the heat sink body toward the circuit board, and a contact portion extending perpendicularly from the extending portion away from an end portion of the heat sink body, the extending portion and the extending portion The side walls of the heat generating device are in contact, and the contact portion is in contact with the circuit board.
  • the heat dissipation structure further includes a heat conductive film disposed between the heat generating device and the heat sink member.
  • the heat conductive film is at least one of a graphene heat conductive film, a silica gel heat conductive film, an alumina heat conductive rubber layer or a boron nitride heat conductive rubber layer.
  • the heat sink body and the heat conducting member are made of a conductive material and can be electrically connected to the heat generating device.
  • An electronic device includes a circuit board, a heat generating device, and a heat dissipating structure, wherein the heat generating device is disposed on the circuit board, the heat sink member includes a heat sink body and a heat conducting member, and the heat sink body and the heat conducting member are both Electrically connected to the circuit board.
  • the circuit board is a flexible circuit board, a rigid circuit board or a soft and hard circuit board.
  • the number of the heat generating devices is plural, and the heat sink body includes a plurality of separate heat dissipating units that are respectively in contact with different heat generating devices or different heat generating portions of the same heat generating device.
  • the electronic device is at least one of a flight controller, an image sensor or an electronic governor.
  • a pan/tilt head comprising at least one rotating bracket and a motor for driving the rotating bracket to rotate, wherein the pan/tilt head further comprises an electronic governor for controlling operation of the motor, the electronic governor comprising The heat dissipation structure of any of 1-12 is required.
  • the pan/tilt head includes three rotating brackets connected in sequence, respectively driven The three sets of motors of the three rotating brackets and the three sets of ESCs respectively controlling the motor, the number of ESCs of each group is one or more.
  • An aircraft comprising an aircraft body, and an electronic device, as described above, disposed on the aircraft body, fired to the aircraft body as described above.
  • the heat dissipation structure provided by the present invention is directly connected to the heat conducting member, and the heat conducting member is directly connected with the heat generating device on the circuit board and/or the circuit board. Contact can improve the heat dissipation effect of the heat dissipation structure.
  • FIG. 1 is a schematic cross-sectional view of an electronic device according to an embodiment of the present invention.
  • FIG. 2 is a schematic cross-sectional view of the electronic device when the heat dissipating fin has a zigzag cross section according to another embodiment of the present invention.
  • FIG 3 is a cross-sectional view of the electronic device when the heat conducting member extends from the heat sink body along opposite sides of the heat generating device to the circuit board in another embodiment.
  • a component when a component is considered to be “connected” to another component, it can be directly connected to another component or a central component can be present at the same time.
  • a component When a component is considered to be “set to” another component, it can be placed directly on another component or possibly with a centered component.
  • the heat dissipation structure 10 provided by the present invention is used for dissipating heat from the heat generating device 13 on the circuit board 11 .
  • the heat dissipation structure 10 includes a heat sink member 15 and a heat conductive film 17 that are used together.
  • the heat sink member 15 can be disposed on the heat generating device 13.
  • the heat sink member 15 includes a heat sink body 150 and a heat conductive member 155 that are connected to each other.
  • the heat conductive member 155 extends from the heat sink body 150 along the heat generating device 13 side to the circuit board 11.
  • the heat generating device 13 is electrically connected to the circuit board 11, and the heat sink body 150 is electrically connected to the circuit board through a heat conducting member 155, thereby achieving electrical connection with the heat generating device 13.
  • the heat generating device 13 dissipates heat through two ways, that is, directly contacting the heat sink body 150 directly or indirectly through the top surface to dissipate heat, and on the other hand, conducting heat through the circuit board 11 and the heat conducting member 155. To the heat sink body 150 for heat dissipation.
  • the heat sink body 150 includes a plurality of separate heat dissipation units 151.
  • the plurality of heat dissipation units 151 are respectively in contact with different heat generating devices 13 to achieve heat dissipation.
  • each of the heat dissipation units 151 is separated from each other to ensure effective electrical isolation between the respective heat-generating devices 13 to avoid short circuit.
  • the number of the heat dissipation unit 151 and the heat generating device 13 are corresponding, thereby ensuring a better heat dissipation effect on the single heat generating device 13.
  • the heat dissipating units 151 are separated from each other, so that when electrically conducting, it is ensured that they are not short-circuited with other heat generating devices 13. It can be understood that some heat generating devices 13 have a large heat generating area and a large number of heat generating points, and a plurality of heat radiating units 151 may be disposed in a plurality of heat generating points of the heat generating device 13, or the heat generating surface of the heat generating device 13 may be divided into regions according to regions.
  • the heat dissipating unit 151 realizes a better heat dissipating effect; similarly, since it is not connected to the heat dissipating unit 151 of the other heat generating device 13, electrical isolation can be achieved to avoid short circuit.
  • the heat sink body 150 and the heat conducting member 155 are made of a conductive material, since the heat sink body 150 and the heat conducting member 155 are connected to each other, and the heat conducting member 155 is electrically connected to the circuit board 11 and the heat generating device 13 and the circuit board 11 are electrically connected.
  • the connection so that the circuit board 11, the heat generating device 13, the heat conducting member 155 and the heat sink body 150 can be electrically connected, thereby improving the heat dissipation efficiency of the circuit board 11 and the heat generating device 13 while improving the circuit board 11 and The conductive effect of the heat generating device 13.
  • the heat conducting member 155 can also be in direct contact with the heat generating device 13 to further improve heat transfer efficiency.
  • each of the heat dissipation units 151 includes a connection plate 152 and a plurality of mutually spaced heat dissipation fins 153 extending from the connection plate 152 .
  • the distance between each two adjacent heat dissipation fins 153 is equal.
  • the arrangement direction of the heat dissipation fins 153 is defined. For the thickness direction of the heat sink surface 153, a cross section of each of the heat dissipation fins 153 along the thickness direction thereof is rectangular.
  • the spacing distance between the heat dissipation fins 153 can also be other modes, such as an arithmetic progression, a geometric progression, a specific function curve, and the like.
  • the number of the heat conducting members 155 corresponds to the number of the heat radiating units 151.
  • Each of the heat conducting members 155 is connected to a corresponding one of the heat radiating units 151.
  • the heat conducting member 155 and the corresponding heat dissipating unit 151 may be connected by a snapping structure, a locking structure or the like, or may be connected to each other by integral molding.
  • the heat conducting member 155 is integrally formed with the corresponding heat radiating unit 151.
  • the heat conducting member 155 and the heat dissipation fin 153 extend in opposite directions.
  • the heat conducting member 155 and the heat dissipation fins 153 extend perpendicularly from the connecting plate 152 in opposite directions.
  • the heat conducting member 155 extends from the corresponding heat radiating unit 151 along the heat generating device 13 side to the circuit board 11 and to the circuit board 11 and/or the circuit board 11
  • the heat generating device 13 is in direct contact.
  • the heat conducting member 155 includes an extension portion 156 and a contact portion 157 that are connected to each other.
  • the extension portion 156 extends from the heat sink body 150 toward the circuit board 11 .
  • the extending portion 156 extends perpendicularly from the heat sink body 150 to the circuit board 11 .
  • the contact portion 157 extends perpendicularly from the end of the extension portion 156 away from the heat sink body 150.
  • the extending portion 156 is in contact with the side wall of the heat generating device 13.
  • the contact portion 157 is in contact with the circuit board 11.
  • the heat dissipation unit 151 is electrically connected to the heat generating device 13 and/or the circuit board 11 through the contact portion 157 of the corresponding heat conducting member 155 .
  • the heat dissipating unit 151 is connected to other components. At this time, the heat dissipating unit 151 and the corresponding heat conducting member 155 can serve as high-power wires, thereby improving the ability of the circuit board 11 to pass current.
  • the heat conductive film 17 is disposed between the heat generating device 13 and the heat sink member 15. In the illustrated embodiment, the heat conductive film 17 is disposed between the heat generating device 13 and the connecting plate 152.
  • the material of the heat conductive film 17 may be at least one of the following: graphene, thermal silica gel, alumina heat conductive rubber, boron nitride heat conductive rubber.
  • the heat dissipation fins 153 in order to increase the heat dissipation area of the heat dissipation fins 153 , the heat dissipation fins The surface of the sheet 153 is serrated. It can be understood that the surface of the heat dissipation fin 153 may also be wave-shaped, or the heat dissipation area may be increased by providing bumps, bosses, or the like on the surface of the heat dissipation fin 153.
  • the heat conductive member 155 is along the heat sink body 150.
  • the heat generating device 13 extends to the circuit board 11 on opposite sides.
  • the heat conducting members 155 are symmetrically located on opposite sides of the heat generating device 13.
  • the heat conducting member 155 may also extend from the heat sink body 150 along any two sides or any four sides of the heat generating device 13 to the circuit board 11, and the extending portion 156 and the The side walls of the heat generating device 13 are in contact, and the contact portion 157 is in contact with the circuit board.
  • the heat conductive members 155 on each side of the heat generating device 13 may be continuously disposed or spaced apart along the circumferential direction of the heat generating device 13.
  • the present invention further provides an electronic device 100 including a circuit board 11 , at least one heat generating device 13 and the heat dissipation structure 10 .
  • the circuit board 11 can be a flexible circuit board, a rigid circuit board, or a soft and hard circuit board.
  • the circuit board 11 is configured to carry the heat generating device 13 and the heat dissipation structure 10 .
  • the plurality of heat generating devices 13 are plural.
  • the heat generating devices 13 are all disposed on the circuit board 11 and can be electrically connected to the circuit board 11.
  • the plurality of heat dissipation units 151 of the heat dissipation structure 10 are respectively in contact with the heat generating device 13 to achieve heat dissipation.
  • the electronic device 100 can be an electronic device such as an electronic governor, a flight controller, or an image sensor.
  • the electronic device is an electronic governor.
  • the invention also provides an aircraft (not shown).
  • the aircraft includes an aircraft body and an electronic device 100 as described above disposed on the aircraft body.
  • the electronic device 100 is an electronic governor.
  • the present invention also includes a pan/tilt (not shown), the pan/tilt includes at least one rotating bracket and a motor for driving the rotation of the rotating bracket, wherein the pan/tilt further includes an electronic unit that controls operation of the motor A governor comprising the heat dissipation structure 10 as described above.
  • the pan/tilt includes three rotating brackets connected in sequence, three sets of motors respectively driving the three rotating brackets, and three sets of electrical tones respectively controlling the motor, and the number of electrical tones of each group is one. Or multiple.
  • the three rotating brackets are divided into Don't be a heading bracket, a roll axle bracket, and a pitch axle bracket.
  • the motor is a heading axis motor, a roll axis motor, and a pitch axis motor.
  • the present invention also provides an aircraft (not shown), such as an unmanned aerial vehicle, comprising an aircraft body and an electronic device as described above disposed on the aircraft body or a pan/tilt head as described above coupled to the aircraft body .
  • an aircraft such as an unmanned aerial vehicle
  • the electronic device on the aircraft can also be any combination of one or more of an electronic governor, an image sensor, and a flight controller.
  • the heat dissipation structure provided by the present invention is directly connected to the heat conducting member, and the heat conducting member is directly connected with the heat generating device on the circuit board and/or the circuit board. Contact can improve the heat dissipation effect of the heat dissipation structure.
  • the heat sink body and the heat conductive member are electrically connected to the circuit board and/or the heat generating device on the circuit board, when the heat sink body is connected to other components, the heat dissipation structure can be used as a high power wire. Thereby improving the ability of the board to pass current. Moreover, due to the separated structure of the heat dissipating unit, short circuits between different heat generating devices can be effectively avoided.

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  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

La présente invention concerne une structure de dissipation de chaleur (10) utilisée pour la dissipation de chaleur d'un moyen de chauffage (13) sur une carte de circuit imprimé (11). La structure de dissipation de chaleur (10) comprend un moyen de dissipation de chaleur (15), le moyen de dissipation de chaleur (15) peut être disposé sur le moyen de chauffage (13), le moyen de dissipation de chaleur (15) comprenant un corps de radiateur (150) et une pièce de conduction de chaleur (155) reliés l'un à l'autre, la pièce de conduction de chaleur (155) étant en contact direct avec la carte de circuit imprimé (11) et/ou le moyen de chauffage (13) sur la carte de circuit imprimé (11). L'invention concerne en outre un dispositif électronique (100) avec la structure de dissipation de chaleur (10), un dispositif de panoramique-inclinaison et un aéronef comprenant le dispositif électronique (100) ou le dispositif de panoramique-inclinaison.
PCT/CN2016/104857 2016-09-27 2016-11-07 Structure de dissipation de chaleur, dispositif électronique, dispositif de panoramique-inclinaison et aéronef WO2018058746A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201680087787.7A CN109479384A (zh) 2016-09-27 2016-11-07 散热结构、电子装置、云台及飞行器

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201621082727.XU CN206118273U (zh) 2016-09-27 2016-09-27 散热结构、电子装置、云台及飞行器
CN201621082727.X 2016-09-27

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WO2018058746A1 true WO2018058746A1 (fr) 2018-04-05

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CN (2) CN206118273U (fr)
WO (1) WO2018058746A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
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CN112118718A (zh) * 2020-10-31 2020-12-22 Oppo广东移动通信有限公司 电子设备及其散热方法
CN112955773A (zh) * 2020-03-27 2021-06-11 深圳市大疆创新科技有限公司 测距装置及可移动平台

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CN108716516B (zh) * 2018-05-15 2020-06-26 汶上海纬机车配件有限公司 一种弧形散热板条合金钢制动盘及其制作方法
CN109991586A (zh) * 2019-03-29 2019-07-09 深圳市速腾聚创科技有限公司 激光雷达装置
CN112533461A (zh) * 2020-12-25 2021-03-19 东莞市李群自动化技术有限公司 驱控一体板、控制系统和机器人

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CN101426357A (zh) * 2007-10-31 2009-05-06 鸿富锦精密工业（深圳）有限公司 散热装置
CN102480899A (zh) * 2010-11-26 2012-05-30 鸿富锦精密工业（深圳）有限公司 散热装置
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112955773A (zh) * 2020-03-27 2021-06-11 深圳市大疆创新科技有限公司 测距装置及可移动平台
CN112118718A (zh) * 2020-10-31 2020-12-22 Oppo广东移动通信有限公司 电子设备及其散热方法
CN112118718B (zh) * 2020-10-31 2023-05-26 Oppo广东移动通信有限公司 电子设备及其散热方法

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Publication number Publication date
CN109479384A (zh) 2019-03-15
CN206118273U (zh) 2017-04-19

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