Classifications

• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
  • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
  • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
  • H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
  • H10P76/2041—Photolithographic processes
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
  • H10P50/00—Etching of wafers, substrates or parts of devices
  • H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
  • G03F1/36—Masks having proximity correction features; Preparation thereof, e.g. optical proximity correction [OPC] design processes
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/70—Microphotolithographic exposure; Apparatus therefor
  • G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
  • G03F7/70433—Layout for increasing efficiency or for compensating imaging errors, e.g. layout of exposure fields for reducing focus errors; Use of mask features for increasing efficiency or for compensating imaging errors
  • G03F7/70441—Optical proximity correction [OPC]
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
  • H10P50/00—Etching of wafers, substrates or parts of devices
  • H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
  • H10P50/24—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials
  • H10P50/242—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials of Group IV materials
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
  • H10P50/00—Etching of wafers, substrates or parts of devices
  • H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
  • H10P50/26—Dry etching; Plasma etching; Reactive-ion etching of conductive or resistive materials
  • H10P50/264—Dry etching; Plasma etching; Reactive-ion etching of conductive or resistive materials by chemical means
  • H10P50/266—Dry etching; Plasma etching; Reactive-ion etching of conductive or resistive materials by chemical means by vapour etching only
  • H10P50/267—Dry etching; Plasma etching; Reactive-ion etching of conductive or resistive materials by chemical means by vapour etching only using plasmas
  • H10P50/268—Dry etching; Plasma etching; Reactive-ion etching of conductive or resistive materials by chemical means by vapour etching only using plasmas of silicon-containing layers
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
  • H10P50/00—Etching of wafers, substrates or parts of devices
  • H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
  • H10P50/28—Dry etching; Plasma etching; Reactive-ion etching of insulating materials
  • H10P50/282—Dry etching; Plasma etching; Reactive-ion etching of insulating materials of inorganic materials
  • H10P50/283—Dry etching; Plasma etching; Reactive-ion etching of insulating materials of inorganic materials by chemical means
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W20/00—Interconnections in chips, wafers or substrates
  • H10W20/01—Manufacture or treatment
  • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
  • H10W20/056—Manufacture or treatment of conductive parts of the interconnections by filling conductive material into holes, grooves or trenches
  • H10W20/057—Manufacture or treatment of conductive parts of the interconnections by filling conductive material into holes, grooves or trenches by selectively depositing, e.g. by using selective CVD or plating
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W20/00—Interconnections in chips, wafers or substrates
  • H10W20/01—Manufacture or treatment
  • H10W20/071—Manufacture or treatment of dielectric parts thereof
  • H10W20/081—Manufacture or treatment of dielectric parts thereof by forming openings in the dielectric parts
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W20/00—Interconnections in chips, wafers or substrates
  • H10W20/01—Manufacture or treatment
  • H10W20/071—Manufacture or treatment of dielectric parts thereof
  • H10W20/081—Manufacture or treatment of dielectric parts thereof by forming openings in the dielectric parts
  • H10W20/089—Manufacture or treatment of dielectric parts thereof by forming openings in the dielectric parts using processes for implementing desired shapes or dispositions of the openings, e.g. double patterning

Definitions

• the present embodiments relate to device processing techniques, and more particularly, to forming complex shapes in a layer during device fabrication.
• photolithography tools may employ 193 nm wavelength light to pattern semiconductor devices, where the devices may have dimensions as small as 10 nm to 30 nm.
• known features for forming electrical connection between two offset regions within a single device layer include an "L" shape, or a staggered shape, or other 2- dimensional shape.
• the capability for printing such shapes using conventional lithographic techniques is limited.
• Even advanced optical proximity correction (OPC) techniques for optical lithography may not adequately print such shapes.
• a staggered structure designed to have straight edges may instead have a rounded shape after lithographic processing. This rounding may result in the generation of a smaller area than the original design for other features to land on, and may additionally cause overlay margin errors where subsequently deposited material, such as a metal feature, overlaps in an unwanted fashion with another metal feature. This rounding is especially prevalent when the dimensions of the pattern are approximately 20 nm or less.
• a method of patterning a substrate may include providing a first surface feature and a second surface feature in a staggered configuration within a layer, the layer being disposed on the substrate.
• the method may also include directing first ions in a first exposure to a first side of the first surface feature and a first side of the second surface feature, in a presence of a reactive ambient containing a reactive species, wherein the first exposure etches the first side of the first surface feature and the first side of the second surface feature.
• the first surface feature and the second surface feature may merge to form a third surface feature.
• a method of patterning a layer disposed on a substrate may include providing a first surface feature and a second surface feature within the layer in a staggered configuration. The method may further include subjecting the first surface feature and the second surface feature to an exposure.
• the exposure may include directing, in a presence of a reactive ambient containing a reactive species, first ions to a first side of the first surface feature and to a first side of the second surface feature; and concurrently directing second ions to a second side of the first surface feature and to a second side of the second surface feature.
• the exposure may etch the first side of the first surface feature and the first side of the second surface feature, and etch the second side of the first surface feature and the second side of the second surface feature.
• the first surface feature and the second surface feature may merge to form a third surface feature.
• a method of forming a device structure may include providing a first surface feature and a second surface feature in a staggered configuration within a first layer, the first layer being disposed on a substrate.
• the method may also include directing first ions in an exposure to a first side of the first surface feature and to a first side of the second surface feature, in a presence of a reactive ambient containing a reactive species.
• the first exposure may etch the first side of the first surface feature and the second surface feature, wherein after the directing, the first surface feature and the second surface feature merge to form a third surface feature, where the third feature comprises a recess.
• the method may further include filling the third surface feature with a conductive material.
• FIGs. 1A-1C depict a top plan view of various operations involved for forming a surface feature according to various embodiments of the disclosure
• FIGs. ID-IE depict a side view of the operations of FIGs. 1B-1C;
• FIG. IF depicts a top plan view of an extraction assembly in accordance with embodiments of the disclosure.
• FIG. 1G depicts a top plan view of a device structure formed in accordance with embodiments of the disclosure.
• FIG. 1H depicts a top plan view of another device structure formed in accordance with embodiments of the disclosure.
• FIGs. 2A-2C depict a top plan view of various operations involved for forming a surface feature according to various additional embodiments of the disclosure
• FIG. 2D depicts a side view of the operation of FIG. 2B;
• FIG. 2E depicts a top plan view of an extraction assembly in accordance with other embodiments of the disclosure.
• FIGs. 3A-3B depict a top plan view of various operations for processing of a device structure according to other embodiments of the disclosure.
• FIG. 4 illustrates an example for generating a complex surface feature according to additional embodiments of the disclosure
• FIG. 5 illustrates a process flow according to additional embodiments of the disclosure.
• the present embodiments provide novel techniques to pattern substrates and in particular novel techniques to form a feature disposed on a substrate such as a surface feature.
• substrate may refer to an entity such as a semiconductor wafer, insulating wafer, ceramic, as well as any layers or structures disposed thereon.
• a surface feature, layer, series of layers, or other entity may be deemed to be disposed on a substrate, where the substrate may represent a combination of structures, such as a silicon wafer, oxide layer, and so forth.
• patterning a substrate may be understood to include patterning a layer or layers disposed on the substrate, including patterning surface features within a layer disposed on the substrate.
• the surface feature may be used for any purpose, including providing connections between other features, patterning a layer disposed underneath the surface feature, or other purpose.
• Examples of a surface feature include what is referred to herein as a complex 2-dimensional feature, or "complex 2-D feature.”
• the complex 2-D feature may have a complex 2-D shape as described below, where the smallest dimension of the complex 2-D feature is less than 100 nm, and in some cases is less than 30 nm.
• the complex 2-D feature may be a recess formed within a substrate or formed within a layer disposed on other layers within a substrate.
• Examples of a complex 2-D feature shape include an L-shape, a capital T-shape, a small t-shape, a zig-zag shape, or other shape, such as the shapes disclosed herein with respect to the figures.
• An example of a simple shape includes a line, circle, square, rectangle or other simple shape.
• techniques and apparatus are provided to generate a recess having a complex 2-D shape having sharply defined corners, among other features.
• FIGs. 1A-1C depict a top plan view of various operations involved for forming a surface feature according to various embodiments of the disclosure.
• FIGs. ID-IE depict a side cross-sectional view of the operations of FIGs. 1B-1C, shown along the section A-A of FIG. 1A.
• the device structure (not explicitly shown) may be formed in a substrate 100, where the substrate 100 may represent any number of layers and other features.
• the device structure may be formed from a surface feature to be formed in a layer of the substrate 100, in this case, shown as layer 101.
• a recessed structure shown as surface feature 120 may be formed in the layer 101.
• the surface feature 120 may be characterized as having a zig-zag shape made from two rectangles adjacent one another along a portion of a common edge, where the rectangles are also offset from one another along one direction.
• Such a surface feature may be used, for example, as a complex electrical interconnect, by filling in the surface feature 120 with a conductive material.
• FIG. 1G depicts a top plan view of a device structure 150 formed in accordance with embodiments of the disclosure.
• the surface feature 120 may be filled with an electrically conductive material, shown as material 127, forming an interconnect 126, where the interconnect 126 has a complex 2-D shape of the surface feature 120.
• the interconnect 126 may serve to electrically connect a metal line 130A to another metal line 130D, where the metal line 130A and metal line 130D may be formed in a different layer or level of the device structure 150, as known in the art.
• a conductive via 140A and a conductive via 140B may be formed along the Z-axis of the Cartesian coordinate system as shown to join different portions of the interconnect 126 to metal line 130A and metal line 130D, respectively.
• the interconnect 126 may be placed in a manner where no conductive material overlaps the metal line 130C or metal line 130B. This placement may be advantageous when the metal lines are formed in the same level as the interconnect 126 or when the separation between the level of the interconnect 126 and the level containing the metal lines is small. By avoiding overlap, potential shorting paths through a layer or unwanted electric fields or other undesirable effects may be avoided.
• a surface feature 102 A and a surface feature 102B are formed in the layer 101.
• the surface feature 102 A and surface feature 102B may be a recessed feature formed within the layer 101, as shown also in FIG. ID.
• the surface feature 102A and surface feature 102B may be formed according to known lithography and etching techniques, for example.
• the surface feature 102 A and surface feature 102B may have a simple rectangular shape where the simple rectangular shape may be printed in a suitable lithographic medium and in some cases transferred into another layer, such as the layer 101.
• the layer 101 may be a known SiOC (silicon-oxygen-carbon) material or known SiON (silicon-oxygen-nitrogen) material, a silicon material, including amorphous silicon, a known oxide such as a TEOS (tetraethyl orthosilicate) oxide, or other material.
• a first material of an underlying layer of substrate 100 shown as layer 106, may be a different material than a second material of layer 101.
• the layer 106 may be a known silicon oxide, silicon nitride, titanium nitride, silicon, or other material. The embodiments are not limited in this context.
• the surface feature 102 A and surface feature 102B have a simple shape, these features may be formed faithfully using known lithographic techniques according to a designed shape.
• Such simple shapes include a simple rectangle, where the rectangle may be formed faithfully even at dimensions as small as 10 nm to 30 nm in the direction of the smallest dimension, such as along the Y-axis.
• a staggered configuration refers to the situation where at least one end of a first surface feature is offset along a first axis, with respect to at least one end of a second surface feature. This situation is particularly depicted where the top end 160 of surface feature 102A is offset along the X-axis with respect to the top end 162 of surface feature 102B.
• the bottom end 164 of surface feature 102A is offset with respect to the bottom end 166 of the surface feature 102B.
• This staggered configuration of different surface features may be harnessed using novel etching processes to form complex 2-D features as detailed below.
• a configuration where two different surface features have two opposite ends mutually aligned with one another along a given axis does not constitute a "staggered configuration" as used herein. For example, when top end 160 is aligned with top end 162 along the X-axis and bottom end 164 is aligned with bottom end 166 along the X-axis, the resulting configuration is not a staggered configuration.
• this latter configuration may also be deemed a staggered configuration.
• the second surface feature, surface feature 102B is offset from the first surface feature, surface feature 102 A within the substrate plane (X-Y) plane along a second axis, represented by the Y-axis.
• the offset of surface feature 102A from surface feature 102B may be explained in the following manner.
• the first surface feature, surface feature 102A may extend from a first position PI to a second position P2 along a first axis, shown as the X-axis.
• the distance between PI and P2 may be preserved, at least in a part of the resulting surface feature, after processing is completed to form the surface feature 120, shown in FIG. 1C.
• FIG. 1C As further shown in FIG.
• the second surface feature, surface feature 102B may extend from a third position P3 to a fourth position P4 along the first axis, shown as the X-axis.
• the distance between P3 and P4 may also be preserved, at least in a portion of the resulting surface feature, after processing is completed to form the surface feature 120, shown in FIG. 1C.
• at least one position PI or P2 representing opposite ends of the surface feature 102 A along the X- axis, may be offset from a corresponding position, P3 or P4, in the surface feature 102B. In this manner, an offset is provided along the X-axis between at least one end of the surface feature 102A and the surface feature 102B. As detailed below, this offset may be harnessed using the novel techniques of the present embodiments to fabricate a complex 2-D shape, as described above.
• the surface feature 102A and the surface feature 102B are isolated from one another, meaning there is material of the layer 101 disposed between the surface feature 102A and surface feature 102B.
• the surface feature 102A is also displaced from or offset from the surface feature 102B along the Y-axis.
• the surface feature 102A and surface feature 102 A may be printed as line segments, where the spacing between line segments along the Y-axis is equal to the width of the line segments along the Y-axis.
• the embodiments are not limited in this context. Formation of such a line/spacing pattern is well within the capability of fabrication using known lithographic techniques, for dimensions ranging down to 10 nm to 30 nm.
• FIG. IB and FIG. ID there is shown a subsequent operation where the surface feature 102 A and surface feature 102B are subject to a first exposure, where the first exposure generates etching of the material of layer 101.
• the first exposure involves directing first ions, shown as ions 112, to the surface feature 102 A and the surface feature 102B as directional ions, an in particular, in a unidirectional manner, where the details of the geometry are described below.
• the first exposure has the effect of etching the surface feature 102 A and the surface feature 102B to merge to form a third surface feature.
• the target or design shape for the third surface feature is a complex 2-D feature having a complex shape, shown as design shape 104 in FIG. IB, and as represented by the final processed feature, surface feature 120, in FIG. 1C.
• the ions 112 are directed to a first surface of the surface feature 102 A, represented by side 114, while the ions 112 are also directed to a first surface of the surface feature 102B, also shown as the side 114.
• the ion trajectory of ions 112 is generally represented by the direction of the unidirectional arrows in the figures. As viewed in the top plan view of FIG. 1 A, the ion trajectory of ions 112 may extend along a first direction, where a projection of the ion trajectory of ions 112 within the substrate plane (the X-Y plane) is parallel to the Y-axis. Thus, the ions 112 in top plan view appear to travel parallel to the Y-axis. As shown in FIG.
• the ion trajectory of ions 112 may form a non-zero angle of incidence, shown as 6>, with respect to a perpendicular 121 to the substrate plane, the X-Y plane, where the perpendicular 121 in this case extends along the Z-axis.
• the value of ⁇ may be greater than zero and less than 90 degrees.
• the non-zero angle of incidence may be between 15 degrees and 75 degrees, depending on the width of a surface feature 120 along the Y-axis and the height of the surface feature 120 along the Z-axis.
• the trajectory of ions 112 in plan view extends parallel to the sides 115, where sides 115 form the ends of the surface feature 102A and surface feature 102B along the X-axis. Accordingly, the ions 112 may not impact the sides 115. In this manner, this unidirectional process may result in the selective etching of the side 114 while not etching the sides 115. This selective etching may generate the final structure, surface feature 120, where the dimensions and position of the surface feature 102 A and surface feature 102B are preserved along the X-axis, while at the same time the surface feature 102A and surface feature 102B merge into one complex feature as shown.
• the present inventors have successfully performed unidirectional etching of surface features having initial dimensions between 20 nm to 100 nm in a first direction within a plane.
• etching of material along the first direction was accomplished to increase the dimensions of the surface feature by 1 nm to 40 nm along the first direction, while no appreciable material was observed along a second direction, perpendicular to the first direction.
• etching along the X-axis is avoided, etching along just the Y-axis to form surface feature 120 results in the preservation of the positions (PI, P2, P3, and P4) of the edges of the surface feature 102A and surface feature 102B along the X-axis.
• the third surface feature may preserve the positions of certain edges of the first surface feature and the second surface feature.
• the complex 2-D feature, surface feature 120 has a set of edges located along the X-axis at the same positions, PI, P2, P3, and P4, of the surface features used to form the surface feature 120.
• FIG. 1H there is shown a top plan view of another device structure, device structure 180, formed in accordance with embodiments of the disclosure. This geometry is generally reflected in the arrangement shown in FIG. 1G when the metal line 130B and 130C are not present.
• a second layer may be formed. The second layer may be disposed above the first layer and may include at least two electrically conductive lines.
• a first metal line, such as metal line 130A, and second metal line, such as metal line 130B, may be formed in the second layer, in a manner wherein the third surface feature overlaps the first metal line and second metal line, as shown in FIG. 1H.
• These embodiments accordingly, may provide precise alignment of a complex 2-D feature disposed in a first layer with a plurality of lines disposed in a second layer, where the lines in the second layer are staggered from one another.
• the ions 1 12 may be directed to the surface feature 102 A and surface feature 102B in the presence of a reactive species, shown as the reactive species 122, and illustrated by the black dots.
• the ions 1 12 and reactive species 122 may be provided by a suitable apparatus capable of providing reactive species to the substrate as well as a concurrent beam of ions. Examples of such apparatus include plasma based apparatus having an extraction system extracting ions through an extraction aperture and directing the ions to a substrate.
• FIG. ID and FIG. IF illustrate an example of an extraction assembly 133, including an extraction aperture 132 for extracting the ions 112 from a plasma 134.
• the plasma 134 may be formed in a plasma chamber adjacent the extraction assembly 133, where the plasma 134 is formed by any known technique.
• the angle of incidence of the ions 112 with respect to the perpendicular 121, 6> may be controlled by controlling parameters of a plasma system as is known, including plasma power, gas pressure, aperture size, and displacement between different portions of the extraction plate, among other factors.
• ions may be extracted having trajectories parallel to one another or differ among themselves by +/- 5 degrees. This geometry allows the ions 112 to be directed as a parallel beam of ions along a target direction.
• the extraction assembly may include a plate 130 and a plate 131, where the plate 130 and plate 131 are offset from one another along the Z-axis.
• This geometry may tend to form a plasma meniscus oriented in a manner generating the ions 112, where the ions 112 when exiting the plasma 134 are directed along the trajectories shown by the arrows.
• the plate 130 and plate 131 may join one another and may define the extraction aperture 132, as shown in the plan view of FIG. IF.
• a single plate may include an aperture directing the ions 112 to the substrate 100 generally as shown.
• FIG. IF in particular illustrates a variant of the extraction assembly 133.
• the extraction aperture 132 is elongated along the second direction parallel to the X-axis, meaning the dimension of the extraction aperture 132 along the X-axis is larger than the dimension of the extraction aperture 132 along the Y-axis.
• the dimension of the extraction aperture 132 along the X-axis may be greater than 100 mm, while the dimension of the extraction aperture 132 along the Y-axis is less than 30 mm, and may be as narrow as 1 mm to 3 mm.
• the embodiments are not limited in this context.
• the ions 112 may accordingly form a ribbon beam having a high degree of uniformity along the X-axis, where the trajectories of ions 112 have a high degree of alignment along the Y-axis as shown.
• the ions 112 may form a ribbon beam having a long axis 117 parallel to a first axis (X-axis) a short axis parallel to a second axis (Y-axis) and, where the second axis is perpendicular to the first axis.
• reactive species 122 may be provided directly to the substrate 100 or through extraction aperture 132 as neutrals, ions, radicals, or a combination of neutrals, ions, and radicals.
• Ions 112 themselves may be inert ions, such as argon, krypton, neon, and the like, or may include reactive species.
• the combination of ions 112 and reactive species 122 may include known recipes for performing reactive ion etching of materials including silicon oxide layers, SiON layers, SiOC layers, silicon nitride layers, silicon layers, carbon layers, and other materials systems. The embodiments are not limited in this context.
• the one dimensional reactive ion etching process involves restricting the reactive ion etching to targeted features on a substrate surface while not affecting other features.
• the one dimensional reactive ion etching may differ from conventional reactive ion etching where ions directed may etch material along the vertical direction as well as along more than one direction within a plane of the substrate perpendicular to the vertical direction. For example, in conventional reactive ion etching, such as ashing of via structures formed within a layer the diameter of via structures may be increased in a non-selective manner along an X- direction and Y-direction.
• the etching may take place on select surfaces of the surface features provided in the layer 101. Additionally, because the ions 112 and reactive species 122 form an ambient for reactive ion etching, the etching shown in FIGs. IB and FIG. ID is not just selective as to different surfaces of the surface feature 102 A and surface feature 102B, and is also selective with respect to surfaces of other material. In particular, at least some of the reactive species 122 may be neutrals.
• the reactive species may pass through the extraction aperture 132 while not having a particular directionality, and may impinge upon various surfaces of the layer 101, as well as the exposed surfaces 125 of layer 106 within the surface feature 102A and surface feature 102B.
• the ions 112 may be restricted to impinging on the sides 114, while not impinging on the sides 115. Additionally, the ions 112 may impinge upon the top surface 124 of layer 101.
• the ions 112 and reactive species 122 may be designed to selectively etch material of the layer 101 with respect to the material of layer 106, meaning the etch rate of material of layer 101 is greater than the etch rate of layer 106.
• layer 106 may be silicon oxide and layer 101 may be silicon nitride. Accordingly, while ions 112 and reactive species 122 may impinge upon exposed surface 125, little or no etching of layer 106 within surface feature 102 A or surface feature 102B may take place in the scenario of FIG. IB and FIG. ID. Accordingly, after a first exposure to the ions 112 as illustrated in FIGs. IB and ID, the material of layer 101 is etched in a manner to generate the surface feature 120, while the exposed surface 125 remains unetched.
• the thickness of the layer 101 may also be reduced, since the combination of ions 112 and reactive species 122 is designed to selectively etch material of layer 101.
• the relative etch rate of layer 101 parallel to the Z-axis with respect to the etch rate along the Y-axis may be controlled by adjusting the value of 6>, for example.
• the layer 101 may be provided with an adequate initial thickness along the Z-axis so material of layer 101 remains after the etch process to form surface feature 120 is finished, as shown in FIG. IE.
• loss of thickness of layer 101 during the exposure to ions 112 may be acceptable, to the extent adequate thickness remains to form a structure within the surface feature 120, or to pattern underlying layers, such as layer 106, in subsequent processing, as the case may be. Additionally, because material of layer 101 is removed by a reactive ion etching process, the material of layer 101 once etched may remain volatilized and may not redeposit on other surfaces of the device structure 150, rendering a clean and accurate shape for the device structure 150, as shown in FIG. 1G.
• FIGs. 2A-2C depict a top plan view of various operations involved for forming a surface feature according to various additional embodiments of the disclosure.
• FIG. 2D depicts a side view of the operation of FIG. 2B, shown along the section A-A of FIG. 2A.
• FIG. 2D and FIG. 2E also depict a cross-sectional view and top plan view, respectively, of an extraction assembly in accordance with other embodiments of the disclosure.
• FIG. 2A an initial configuration of surface features may be provided in a substrate 100 as described above with respect to FIG. 1A.
• FIG. 2D there is shown a subsequent processing operation or set of processing operations, where ions 202 and ions 204 are directed to side 114 and side 116 of the surface feature 102 A and surface feature 102B.
• the trajectories of ions 202 and ions 204 may be arranged so as not to impact the sides 115, as shown.
• etching of the surface feature 102 A and surface feature 102B may proceed generally as described above with respect to FIG. IB and FIG. ID, with a difference being in the geometry of the etching taking place along the Y-axis, in this case toward the right and toward the left.
• an extraction assembly 220 may be used to perform the operation of FIG. 2B, where the extraction assembly 220 includes a planar extraction plate, shown as extraction plate 222, and includes a planar aperture, shown as extraction aperture 224.
• the extraction assembly 220 may further include a beam blocker 206, where the beam blocker 206 is disposed within the region above extraction aperture 224, and may have an elongated shape, as shown in FIG. 2D.
• the beam blocker 206 and extraction aperture 224 may generate a pair of plasma menisci, shown as meniscus 232 and meniscus 234, which menisci, in turn, generate the ions 202 and ions 204, respectively, as a pair of ribbon ion beams.
• the ions 202 and ions 204 are generated concurrently, so the substrate 100 is etched by ions 202 and ions 204 at the same time.
• one dimensional reactive ion etching is performed using a pair of concurrent ion beams having ion trajectories whose projections within the X-Y plane are parallel to a common axis, such as the Y-axis.
• a first ion beam and second ion beam as represented by ions 202 and ions 204, may form a mirror image about the X-Z plane so the ions 202 and ions 204 concurrently strike the opposing sides, sides 114 and sides 116.
• the second ions, ions 204 may have a second ion trajectory.
• the second ion trajectory extends along a second direction, shown by the arrows in FIG. 2B and FIG. 2D.
• the projection of the second direction within the substrate plane (X-Y plane) of the second ion trajectory may also be parallel to the Y-axis as shown in FIG. 2B.
• the second ion trajectory of ions 204 and may also form a non-zero angle of incidence with respect to the perpendicular 121, shown as - ⁇ .
• the second direction of ions 204 may be deemed to be opposite the first direction of ions 202, meaning, for example, the projection of the trajectory of ions 204 in the X-Y plane is opposite the projection of the trajectory of ions 202 in the X-Y plane, as illustrated in FIG. 2B.
• the value of ⁇ D may be equal to the value of - ⁇ .
• FIG. 2D may be similar to or the same as the structure of FIG. 1C, in this case also shown as surface feature 120. While in the embodiment particularly shown in FIG. 2D ions 202 and ions 204 are directed in a single exposure concurrently at the substrate 100, in other embodiments the ions 202 and ions 204 may be directed in succession in separate operations to the substrate 100. In various embodiments, first ions may be directed at a first side of the first surface feature and first side of the second surface feature in a first exposure, while the substrate is rotated about a perpendicular to the substrate plane after the first exposure.
• second ions may be directed to a second side of the first surface feature and a second side of the second surface feature, in the presence of the reactive ambient containing the reactive species.
• a combination of the first exposure and the second exposure may be used to form the third surface feature, as represented by the surface feature 120.
• the ions 202 may be directed to first sides, sides 114 of substrate 100 using the extraction assembly 133 in a first exposure.
• the ions 204 may be directed to second sides, sides 116, in a second exposure using the extraction assembly 133, by rotating the substrate 180 degrees within the X-Y plane between the first exposure and second exposure.
• FIGs. 3A-3B depict a top plan view of various operations for processing of a device structure according to other embodiments of the disclosure, where a design shape 302 is shown.
• a surface feature 304 in the shape of a square, and a surface feature 306, in the shape of a rectangle, are provided in a staggered configuration.
• the top ends of the surface feature 304 and surface feature 306 may be aligned at point P5 along the X-axis.
• the surface features may be processed using ions 112, in a reactive ambient, according to the techniques generally described above, resulting in a final surface feature 310, having the shape of the design shape 302.
• three or more isolated surface features may be processed according to the techniques described hereinabove to generate a final, complex 2-D structure.
• FIG. 4 illustrates an example where three isolated surface features, shown as surface feature 102A, surface feature 102B, and surface feature 102C are generated in a substrate 100, offset from one another along the X-axis, and etched along the Y-axis using ions 112 to generate a staircase shape, shown as surface feature 402.
• FIG. 5 illustrates a process flow 500 according to additional embodiments of the disclosure.
• a layer is provided on a substrate.
• the layer may be a known SiOC (silicon-oxygen-carbon) material or known SiON (silicon-oxygen-nitrogen) material, a silicon material, including amorphous silicon, a known oxide such as a TEOS (tetraethyl orthosilicate) oxide, or other material.
• a first material of an underlying layer of the substrate may be a different material than a second material of the layer.
• the material of the substrate may be a known silicon oxide, silicon nitride, titanium nitride, silicon, or other material.
• a first surface feature and a second surface feature may be provided in a staggered configuration within the layer.
• An example of a staggered configuration is where at least one end of the first surface feature is offset along a first axis, with respect to at least one end of the second surface feature.
• first ions are directed in an exposure to a first side of the first surface feature and a first side of the second surface feature, in the presence of a ambient containing a reactive species.
• the exposure may have appropriate duration wherein the exposure etches the first side of the first surface feature and the second surface feature so the first surface feature and the second surface feature merge to form a third surface feature.
• the present embodiments provide various advantages over conventional processing to define complex 2-dimensional features in a substrate.
• One advantage lies in the ability to increase a width of a plurality of recessed features while not increasing the length. This advantage leads to the related advantage of being able to form a complex feature by merging two formerly isolated features using a directional etch process to selectively increase the size of the features along just one direction.
• Another advantage is the ability to form a complex 2-dimensional shape within a substrate layer, enabling the faithful generation of a target shape for structures such as complex interconnect structures at sub 50 nm dimensions.

Landscapes

• Physics & Mathematics (AREA)
• General Physics & Mathematics (AREA)
• Drying Of Semiconductors (AREA)
• Engineering & Computer Science (AREA)
• Plasma & Fusion (AREA)
• Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
• Micromachines (AREA)

Priority Applications (3)

Applications Claiming Priority (4)

Publications (1)

Family

ID=61621300

Family Applications (1)

Country Status (6)

Families Citing this family (6)

Citations (5)

Family Cites Families (55)

• 2016
  • 2016-12-20 US US15/384,496 patent/US10229832B2/en active Active
• 2017
  • 2017-09-11 JP JP2019513013A patent/JP6889773B2/ja active Active
  • 2017-09-11 CN CN201780058139.3A patent/CN109791874B/zh active Active
  • 2017-09-11 WO PCT/US2017/050958 patent/WO2018057327A1/en not_active Ceased
  • 2017-09-11 KR KR1020197008831A patent/KR102363138B1/ko active Active
  • 2017-09-13 TW TW106131416A patent/TWI725230B/zh active

Patent Citations (5)

Also Published As

Similar Documents

Legal Events