WO2018052236A3 - 증착 장치 - Google Patents

증착 장치 Download PDF

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Publication number
WO2018052236A3
WO2018052236A3 PCT/KR2017/010016 KR2017010016W WO2018052236A3 WO 2018052236 A3 WO2018052236 A3 WO 2018052236A3 KR 2017010016 W KR2017010016 W KR 2017010016W WO 2018052236 A3 WO2018052236 A3 WO 2018052236A3
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
deposition
thin film
deposition apparatus
forming material
Prior art date
Application number
PCT/KR2017/010016
Other languages
English (en)
French (fr)
Other versions
WO2018052236A2 (ko
Inventor
문일권
황도원
Original Assignee
(주)알파플러스
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by (주)알파플러스 filed Critical (주)알파플러스
Priority to JP2019534621A priority Critical patent/JP6751820B2/ja
Priority to CN201780054794.1A priority patent/CN109689926B/zh
Publication of WO2018052236A2 publication Critical patent/WO2018052236A2/ko
Publication of WO2018052236A3 publication Critical patent/WO2018052236A3/ko

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • C23C14/542—Controlling the film thickness or evaporation rate
    • C23C14/543—Controlling the film thickness or evaporation rate using measurement on the vapor source
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/243—Crucibles for source material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • C23C14/542—Controlling the film thickness or evaporation rate
    • C23C14/545—Controlling the film thickness or evaporation rate using measurement on deposited material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/568—Transferring the substrates through a series of coating stations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02612—Formation types
    • H01L21/02617—Deposition types
    • H01L21/02631—Physical deposition at reduced pressure, e.g. MBE, sputtering, evaporation
    • H01L21/203—

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

본 발명은 증착용 노즐에 달라붙은 오염 물질로부터 기판의 표면을 보호할 수 있는 증착 장치를 제공하는 것이 그 기술적 과제이다. 이를 위해, 본 발명의 증착 장치는, 기판에 하나 이상의 박막 형성용 물질을 증착시키기 위한 증착 장치로서, 상기 기판으로 제1 박막 형성용 물질을 분사시키기 위한 복수의 증착용 노즐이 제1 방향으로 길게 배열된 제1 전도관을 가지는 제1 선형 증발원; 상기 제1 전도관과 상기 기판 사이에 구비되며 상기 분사되는 제1 박막 형성용 물질의 일부를 상기 기판으로 통과시키는 통과 영역부와 상기 제1 박막 형성용 물질의 나머지를 차단시키는 가림 영역부를 포함하는 고정형 가림 부재; 및 상기 고정형 가림 부재에 구비되어 상기 복수의 증착용 노즐 중 적어도 하나의 증착용 노즐에 묻은 오염 물질이 상기 기판으로 이동되는 것을 막는 제1 오염 방지 부재를 포함한다.
PCT/KR2017/010016 2016-09-13 2017-09-13 증착 장치 WO2018052236A2 (ko)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2019534621A JP6751820B2 (ja) 2016-09-13 2017-09-13 蒸着装置
CN201780054794.1A CN109689926B (zh) 2016-09-13 2017-09-13 蒸镀装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2016-0118317 2016-09-13
KR1020160118317A KR101839879B1 (ko) 2016-09-13 2016-09-13 증착 장치

Publications (2)

Publication Number Publication Date
WO2018052236A2 WO2018052236A2 (ko) 2018-03-22
WO2018052236A3 true WO2018052236A3 (ko) 2018-08-09

Family

ID=61620104

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2017/010016 WO2018052236A2 (ko) 2016-09-13 2017-09-13 증착 장치

Country Status (4)

Country Link
JP (1) JP6751820B2 (ko)
KR (1) KR101839879B1 (ko)
CN (1) CN109689926B (ko)
WO (1) WO2018052236A2 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113445006B (zh) * 2020-04-09 2023-01-31 重庆康佳光电技术研究院有限公司 一种蒸镀衬锅

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20080004816A (ko) * 2006-07-06 2008-01-10 세메스 주식회사 높이 조절 가능형 증발원
KR20140026100A (ko) * 2012-08-24 2014-03-05 주식회사 에스에프에이 스퍼터 장치
KR20140136159A (ko) * 2013-05-20 2014-11-28 주식회사 선익시스템 증착두께 측정장치
KR20140136650A (ko) * 2013-05-21 2014-12-01 삼성디스플레이 주식회사 박막 증착 방법
KR20150081857A (ko) * 2014-01-07 2015-07-15 주식회사 선익시스템 증착장치용 증발원

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100964224B1 (ko) 2008-02-28 2010-06-17 삼성모바일디스플레이주식회사 증착 장치 및 박막 형성 방법
DE112010001483T5 (de) * 2009-04-03 2012-09-13 Tokyo Electron Limited Abscheidungskopf und Filmbildungsvorrichtung
JP2014132101A (ja) * 2011-04-11 2014-07-17 Tokyo Electron Ltd 成膜装置及び成膜方法
CN202968676U (zh) * 2012-12-18 2013-06-05 汉能科技有限公司 一种线性蒸发源装置
US9048373B2 (en) * 2013-06-13 2015-06-02 Tsmc Solar Ltd. Evaporation apparatus and method
JP2015183229A (ja) * 2014-03-24 2015-10-22 株式会社日立ハイテクファインシステムズ 真空蒸着装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20080004816A (ko) * 2006-07-06 2008-01-10 세메스 주식회사 높이 조절 가능형 증발원
KR20140026100A (ko) * 2012-08-24 2014-03-05 주식회사 에스에프에이 스퍼터 장치
KR20140136159A (ko) * 2013-05-20 2014-11-28 주식회사 선익시스템 증착두께 측정장치
KR20140136650A (ko) * 2013-05-21 2014-12-01 삼성디스플레이 주식회사 박막 증착 방법
KR20150081857A (ko) * 2014-01-07 2015-07-15 주식회사 선익시스템 증착장치용 증발원

Also Published As

Publication number Publication date
JP2019529720A (ja) 2019-10-17
CN109689926A (zh) 2019-04-26
JP6751820B2 (ja) 2020-09-09
WO2018052236A2 (ko) 2018-03-22
KR101839879B1 (ko) 2018-03-19
CN109689926B (zh) 2021-02-26

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