WO2018040468A1 - 显示器及其显示面板 - Google Patents

显示器及其显示面板 Download PDF

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Publication number
WO2018040468A1
WO2018040468A1 PCT/CN2017/070518 CN2017070518W WO2018040468A1 WO 2018040468 A1 WO2018040468 A1 WO 2018040468A1 CN 2017070518 W CN2017070518 W CN 2017070518W WO 2018040468 A1 WO2018040468 A1 WO 2018040468A1
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WIPO (PCT)
Prior art keywords
layer
disposed
doped portion
display panel
substrate
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Application number
PCT/CN2017/070518
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English (en)
French (fr)
Inventor
马亮
赵莽
Original Assignee
武汉华星光电技术有限公司
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Application filed by 武汉华星光电技术有限公司 filed Critical 武汉华星光电技术有限公司
Priority to US15/326,551 priority Critical patent/US10216058B2/en
Publication of WO2018040468A1 publication Critical patent/WO2018040468A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate
    • H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
    • H01L29/7869—Thin film transistors, i.e. transistors with a channel being at least partly a thin film having a semiconductor body comprising an oxide semiconductor material, e.g. zinc oxide, copper aluminium oxide, cadmium stannate
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
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    • G02F1/1362—Active matrix addressed cells
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    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
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    • G02F1/1368—Active matrix addressed cells in which the switching element is a three-electrode device
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    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1222—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or crystalline structure of the active layer
    • H01L27/1225—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or crystalline structure of the active layer with semiconductor materials not belonging to the group IV of the periodic table, e.g. InGaZnO
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    • H01L29/78609—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device for preventing leakage current
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    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
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    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate
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    • H01L29/78633—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device with a light shield
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
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    • H01L29/78696—Thin film transistors, i.e. transistors with a channel being at least partly a thin film characterised by the structure of the channel, e.g. multichannel, transverse or longitudinal shape, length or width, doping structure, or the overlap or alignment between the channel and the gate, the source or the drain, or the contacting structure of the channel
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
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    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
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    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
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    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
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    • G02F1/136213—Storage capacitors associated with the pixel electrode
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    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
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    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
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    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
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    • G02F1/1368—Active matrix addressed cells in which the switching element is a three-electrode device
    • G02F1/13685—Top gates
    • H—ELECTRICITY
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    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
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    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
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    • H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
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    • H01L29/78624—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device characterised by the drain or the source properties, e.g. the doping structure, the composition, the sectional shape or the contact structure with LDD structure or an extension or an offset region or characterised by the doping profile the source and the drain regions being asymmetrical

Definitions

  • the present invention relates to the field of display technologies, and in particular, to a display and a display panel thereof.
  • LCD panels are the mainstream display devices in the market.
  • mobile phone screens often use FFS (Fringe). Field Switching, this display mode, because of its wide viewing angle and is not susceptible to slight changes in the thickness of the liquid crystal cell;
  • TFT Thin Film Transistor (thin film transistor) devices usually have leakage problems, which requires a large storage capacitor Cst to prevent pixel gray-scale changes caused by TFT leakage during one frame time.
  • the gray scale change of the pixel causes the optical quality of the liquid crystal panel to decrease.
  • Such as crosstalk and flicker, and larger storage capacitors are susceptible to resolution and aperture ratio.
  • the technical problem to be solved by the present invention is to provide a display and a liquid crystal panel thereof, which can reduce crosstalk and flicker of the liquid crystal panel.
  • the present invention adopts a technical solution to provide a display panel
  • the display panel includes at least a first substrate, a second substrate, and a liquid crystal layer sandwiched between the first substrate and the second substrate.
  • a light shielding layer disposed on the first substrate, a buffer layer disposed on the light shielding layer and the first substrate, a first semiconductor layer disposed on the buffer layer, and an active layer disposed on the first semiconductor layer and the buffer layer
  • the active layer includes an intrinsic portion, a first lightly doped portion and a second lightly doped portion respectively located on both sides of the intrinsic portion, and a first heavily doped region on a side of the first lightly doped portion away from the intrinsic portion a second heavily doped portion located on a side of the second lightly doped portion away from the intrinsic portion, the intrinsic portion completely covering the first semiconductor layer
  • the display panel further includes a second semiconductor layer disposed on the buffer layer, a gate insulating layer disposed on the active layer and the second semiconductor layer and the buffer layer, a
  • the second heavily doped portion is at least partially disposed on the second semiconductor layer.
  • the second metal layer includes a first sub-metal layer and a second sub-metal layer, and the first sub-metal layer is electrically connected to the first heavily doped portion through via holes disposed on the interlayer dielectric layer and the gate insulating layer.
  • the second sub-metal layer is electrically connected to the second heavily doped portion through a via hole disposed on the interlayer dielectric layer and the gate insulating layer, and the transparent electrode layer passes through the via hole disposed on the passivation layer and the planarization layer
  • the two submetal layers are turned on.
  • a display panel including at least a first substrate, a second substrate, and a liquid crystal layer sandwiched between the first substrate and the second substrate.
  • a light shielding layer disposed on the first substrate, a buffer layer disposed on the light shielding layer and the first substrate, a first semiconductor layer disposed on the buffer layer, and an active layer disposed on the first semiconductor layer and the buffer layer.
  • the active layer includes an intrinsic portion, a first lightly doped portion and a second lightly doped portion respectively located on both sides of the intrinsic portion, and a first heavily doped portion on a side of the first lightly doped portion away from the intrinsic portion.
  • the impurity portion is located at a second heavily doped portion of the second lightly doped portion away from the intrinsic portion, and the intrinsic portion completely covers the first semiconductor layer.
  • the display panel further includes a second semiconductor layer disposed on the buffer layer, a gate insulating layer disposed on the active layer and the second semiconductor layer and the buffer layer, a first metal layer disposed on the gate insulating layer, An interlayer dielectric layer disposed on the first metal layer, a second metal layer disposed on the interlayer dielectric layer, a planarization layer disposed on the second metal layer and the interlayer dielectric layer, and a planarization layer disposed on the planarization layer a common electrode layer, a passivation layer disposed on the planarization layer and the common electrode layer, and a transparent electrode layer disposed on the passivation layer, the second metal layer passing through via holes disposed on the interlayer dielectric layer and the gate insulating layer
  • Conductive layer is conductive
  • the transparent electrode layer is electrically connected to the second metal layer through via holes provided on the passivation layer and the planarization layer
  • the common electrode layer is disposed on a region corresponding to the upper and lower sides of the second semiconductor layer, the transparent electrode
  • the active layer includes an intrinsic portion, a first lightly doped portion and a second lightly doped portion respectively located on both sides of the intrinsic portion, and a first heavily doped portion on a side of the first lightly doped portion away from the intrinsic portion.
  • the second portion is located at a side of the second lightly doped portion away from the intrinsic portion, and the second heavily doped portion is at least partially disposed on the second semiconductor layer.
  • the second metal layer includes a first sub-metal layer and a second sub-metal layer, and the first sub-metal layer is electrically connected to the first heavily doped portion through via holes disposed on the interlayer dielectric layer and the gate insulating layer.
  • the second sub-metal layer is electrically connected to the second heavily doped portion through a via hole disposed on the interlayer dielectric layer and the gate insulating layer, and the transparent electrode layer passes through the via hole disposed on the passivation layer and the planarization layer
  • the two submetal layers are turned on.
  • the first semiconductor layer and the second semiconductor layer are N-type semiconductor layers.
  • the material of the first semiconductor layer and the second semiconductor layer is indium gallium zinc oxide.
  • the display panel further comprises a color filter disposed on the second substrate.
  • the active layer is a polysilicon semiconductor layer
  • the display panel is a fringe field switch display panel.
  • a display including a display panel and a backlight module for providing backlight for the display panel, the display panel including at least a first substrate and a second substrate a liquid crystal layer sandwiched between the first substrate and the second substrate, a light shielding layer disposed on the first substrate, a buffer layer disposed on the light shielding layer and the first substrate, and a first semiconductor layer disposed on the buffer layer And an active layer disposed on the first semiconductor layer and the buffer layer.
  • the active layer includes an intrinsic portion, a first lightly doped portion and a second lightly doped portion respectively located on both sides of the intrinsic portion, and a first heavily doped portion on a side of the first lightly doped portion away from the intrinsic portion.
  • the impurity portion is located at a second heavily doped portion of the second lightly doped portion away from the intrinsic portion, and the intrinsic portion completely covers the first semiconductor layer.
  • the display panel further includes a second semiconductor layer disposed on the buffer layer, a gate insulating layer disposed on the active layer and the second semiconductor layer and the buffer layer, a first metal layer disposed on the gate insulating layer, An interlayer dielectric layer disposed on the first metal layer, a second metal layer disposed on the interlayer dielectric layer, a planarization layer disposed on the second metal layer and the interlayer dielectric layer, and a planarization layer disposed on the planarization layer a common electrode layer, a passivation layer disposed on the planarization layer and the common electrode layer, and a transparent electrode layer disposed on the passivation layer, the second metal layer passing through via holes disposed on the interlayer dielectric layer and the gate insulating layer
  • Conductive layer is conductive
  • the transparent electrode layer is electrically connected to the second metal layer through via holes provided on the passivation layer and the planarization layer
  • the common electrode layer is disposed on a region corresponding to the upper and lower sides of the second semiconductor layer, the transparent electrode
  • the active layer includes an intrinsic portion, a first lightly doped portion and a second lightly doped portion respectively located on both sides of the intrinsic portion, and a first heavily doped portion on a side of the first lightly doped portion away from the intrinsic portion.
  • the second portion is located at a side of the second lightly doped portion away from the intrinsic portion, and the second heavily doped portion is at least partially disposed on the second semiconductor layer.
  • the second metal layer includes a first sub-metal layer and a second sub-metal layer, and the first sub-metal layer is electrically connected to the first heavily doped portion through via holes disposed on the interlayer dielectric layer and the gate insulating layer.
  • the second sub-metal layer is electrically connected to the second heavily doped portion through a via hole disposed on the interlayer dielectric layer and the gate insulating layer, and the transparent electrode layer passes through the via hole disposed on the passivation layer and the planarization layer
  • the two submetal layers are turned on.
  • the first semiconductor layer and the second semiconductor layer are N-type semiconductor layers.
  • the material of the first semiconductor layer and the second semiconductor layer is indium gallium zinc oxide.
  • the display panel further comprises a color filter disposed on the second substrate.
  • the display panel includes at least a first substrate, a second substrate, a liquid crystal layer sandwiched between the first substrate and the second substrate, and is disposed in the first a light shielding layer on a substrate, a buffer layer disposed on the light shielding layer and the first substrate, a first semiconductor layer disposed on the buffer layer, and an active layer disposed on the first semiconductor layer and the buffer layer, driven at the gate
  • the signal is unbiased, a PN junction is formed by the first semiconductor and the active layer, and a very thin space charge region is formed at the PN junction; in the case where the gate drive signal is negatively biased, due to the applied electric field
  • the direction is consistent with the direction of the internal electric field of the PN junction, which increases the space charge region and reduces the channel of the electronic offset, thereby reducing the leakage current of the thin film transistor and reducing the crosstalk and flicker of the liquid crystal panel.
  • FIG. 1 is a schematic structural view of a display panel according to a preferred embodiment of the present invention.
  • FIG. 2 is a schematic diagram showing the distribution of space charge regions in the case where the gate driving signal is unbiased in the display panel of the present invention
  • FIG. 3 is a schematic diagram showing a spatial charge region distribution of a display panel of the present invention in a case where a gate driving signal is negatively biased;
  • Figure 4 is a schematic view showing the structure of the display of the present invention.
  • FIG. 1 is a schematic structural view of a display panel according to a preferred embodiment of the present invention.
  • the display panel includes a first substrate 11 , a second substrate 12 , a liquid crystal layer 13 sandwiched between the first substrate 11 and the second substrate 12 , a light shielding layer 14 disposed on the first substrate 11 , A buffer layer 15 disposed on the light shielding layer 14 and the first substrate 11, a first semiconductor layer 16 disposed on the buffer layer 15, and an active layer 17 disposed on the first semiconductor layer 16 and the buffer layer 15 are provided.
  • a PN junction is formed by the first semiconductor and the active layer 17 in the case where the gate driving signal is unbiased, at the PN
  • a very thin space charge region is formed at the junction; in the case where the gate drive signal is negatively biased, since the applied electric field direction coincides with the direction of the internal electric field of the PN junction, the space charge region is increased, and the electron offset is lowered.
  • the channel can reduce the leakage current of the thin film transistor and can reduce the crosstalk and flicker of the liquid crystal panel.
  • the active layer 17 includes an intrinsic portion 171, a first lightly doped portion 172 and a second lightly doped portion 173 respectively located on both sides of the intrinsic portion 171, and the first lightly doped portion 171 is away from the intrinsic portion.
  • the first heavily doped portion 174 on the side of the 171 is located at the second heavily doped portion 175 on the side of the second lightly doped portion 173 away from the intrinsic portion 171, and the intrinsic portion 171 completely covers the first semiconductor layer 16.
  • the intrinsic portion 171 completely covers the first semiconductor layer 16 such that the first semiconductor layer 16 is completely out of contact with the first lightly doped portion 172, the second lightly doped portion 173, and the first heavily doped portion.
  • the 174 or the second heavily doped portion 175 is contacted to ensure that the drain and source are not directly turned on if the gate drive signal is unbiased.
  • the active layer 17 is a polysilicon semiconductor layer 17.
  • the active layer 17 can also be other types of active layers.
  • the display panel further includes a second semiconductor layer 18 disposed on the buffer layer 15, a gate insulating layer 19 disposed on the active layer 17 and the second semiconductor layer 18 and the buffer layer 15, and a gate insulating layer disposed on the gate insulating layer a first metal layer 20 on 19, an interlayer dielectric layer 21 disposed on the first metal layer 20, a second metal layer 22 disposed on the interlayer dielectric layer 21, a second metal layer 22, and an interlayer dielectric a planarization layer 23 on the layer 21, a common electrode layer 24 disposed on the planarization layer 23, a passivation layer 25 disposed on the planarization layer 23 and the common electrode layer 24, and a transparent electrode disposed on the passivation layer 25.
  • the layer 26, the second metal layer 22 is electrically connected to the active layer 17 through via holes provided on the interlayer dielectric layer 21 and the gate insulating layer 19, and the transparent electrode layer 26 is provided through the passivation layer 25 and the planarization layer 23
  • the upper via is electrically connected to the second metal layer 22, the common electrode layer 24 is disposed on a region corresponding to the upper and lower sides of the second semiconductor layer 18, the transparent electrode layer 26 is disposed in a region corresponding to the common electrode layer 24, and the active layer 17 is further It is disposed on the second semiconductor layer 18.
  • the projection of the common electrode layer 24 on the second semiconductor layer 18 completely overlaps with the second semiconductor layer 18, which facilitates the formation of a storage capacitor therebetween.
  • the common electrode layer 24 is in the second semiconductor.
  • the projection on layer 18 may also partially overlap the second semiconductor layer 18.
  • FIG. 2 is a schematic diagram showing the space charge region distribution of the display panel of the present invention in the case where the gate driving signal is unbiased.
  • the PN junction is formed by the first semiconductor 16 and the intrinsic portion 171 of the active layer 17, and a thin portion is formed at the boundary of the intrinsic portion 171 with the first semiconductor layer 16. Space charge zone s.
  • FIG. 3 is a schematic diagram showing the spatial charge region distribution of the display panel of the present invention in the case where the gate driving signal is negatively biased.
  • the gate driving signal is negatively biased, since the applied electric field direction coincides with the internal electric field direction of the PN junction, the space charge region s is increased to form a new larger space charge region t, which reduces the electron offset.
  • the channel p (the electron offset channel p is narrowed), thereby reducing the leakage current of the thin film transistor and reducing the crosstalk and flicker of the liquid crystal panel.
  • the gate drive signal is a voltage signal applied to the first metal layer 20.
  • the first metal layer 20 is a gate layer.
  • the second heavily doped portion 175 is at least partially disposed on the second semiconductor layer 18.
  • the second semiconductor layer 18 is electrically connected to the second sub-metal layer 222 through the second heavily doped portion 175, and the second semiconductor layer 18 is disposed on the common electrode layer 24
  • the upper and lower corresponding regions thus forming a storage capacitor Cst2 between the second semiconductor layer 18 and the common electrode layer 24, and finally the total storage capacitor size is Cst2 plus the storage capacitor Cst1 between the transparent electrode layer 26 and the common electrode layer 24, Compared with the traditional display panel, the storage capacitor is increased, which can further reduce flicker and crosstalk.
  • the second metal layer 22 includes a first sub-metal layer 221 and a second sub-metal layer 222, and the first sub-metal layer 221 passes through the vias disposed on the interlayer dielectric layer 21 and the gate insulating layer 19 and the first
  • the heavily doped portion 174 is turned on, and the second sub-metal layer 222 is electrically connected to the second heavily doped portion 175 through via holes provided on the interlayer dielectric layer 21 and the gate insulating layer 19, and the transparent electrode layer 26 is disposed through
  • the via holes on the passivation layer 25 and the planarization layer 23 are electrically connected to the second sub-metal layer 222.
  • the first sub-metal layer 221 is a drain layer
  • the second sub-metal layer 222 is a drain layer. It is understood that in other embodiments, the first sub-metal layer 221 may be a drain layer, and the second The sub-metal layer 222 is a source layer.
  • the first semiconductor layer 16 and the second semiconductor layer 18 are N-type semiconductor layers.
  • the material of the first semiconductor layer 16 and the second semiconductor layer 18 is indium gallium zinc oxide, ie IGZO (indium gallium) Zinc oxide). Due to the transparent nature of the indium gallium zinc oxide, the increased first semiconductor layer 16 and second semiconductor layer 18 do not affect the aperture ratio of the display panel and do not affect the normal display.
  • IGZO indium gallium Zinc oxide
  • the display panel further includes a color filter 27 disposed on the second substrate 12.
  • the display panel may further include a support pillar supported between the first substrate 11 and the second substrate 12 or may further include other film layers on the first substrate 11 or the second substrate 12, such as a polarizer. Wait.
  • the display panel in this embodiment is a fringe field switch display panel.
  • the display panel may also be other types of display panels.
  • FIG. 4 is a schematic structural view of the display of the present invention.
  • the display includes a display panel 41 and a backlight module 42 for providing backlighting to the display panel 41.
  • the display panel 41 is the display panel described in any one of the above embodiments.
  • the present invention provides at least a first substrate, a second substrate, a liquid crystal layer sandwiched between the first substrate and the second substrate, a light shielding layer disposed on the first substrate, a light shielding layer, and a first substrate.
  • the layer forms a PN junction, forming a very thin space charge region at the PN junction; in the case where the gate drive signal is negatively biased, the space charge is increased because the applied electric field direction coincides with the direction of the internal electric field of the PN junction.
  • the region reduces the channel of the electronic offset, thereby reducing the leakage current of the thin film transistor and reducing the crosstalk and flicker of the liquid crystal panel.

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Abstract

一种显示面板及使用该显示面板的显示器，该显示面板至少包括第一基板（11）、第二基板（12）、夹持在第一基板（11）和第二基板（12）之间的液晶层（13）、设置在第一基板（11）上的遮光层（14）、设置在遮光层（14）和第一基板（11）上的缓冲层（15）、设置在缓冲层（15）上的第一半导体层（16）以及设置在第一半导体层（16）和缓冲层（15）上的有源层（17）。通过上述结构，显示面板能够降低薄膜晶体管的漏电流，能够降低液晶面板的串扰和闪烁。

Description

显示器及其显示面板
【技术领域】
本发明涉及显示技术领域，特别是涉及一种显示器及其显示面板。
【背景技术】
液晶面板由于其轻薄化和低功耗等优点，是目前市场中的主流显示装置，目前手机屏幕往往采用FFS（Fringe Field Switching，边缘场开关）这种显示模式，因其有较宽的视角和不易受液晶盒厚轻微变化的影响；
在液晶面板中，TFT（Thin Film Transistor，薄膜晶体管）器件通常存在漏电问题，这就需要较大的储存电容Cst，以防止在一帧的时间TFT漏电引起像素灰阶变化，像素灰阶变化会引起液晶面板光学品质下降。如串扰和闪烁等现象，而较大储存电容又易受到分辨率和开口率影响。
因此，需要提供显示器及其显示面板，以解决上述技术问题。
【发明内容】
本发明主要解决的技术问题是提供一种显示器及其液晶面板，能够降低液晶面板的串扰和闪烁。
为解决上述技术问题，本发明采用的一个技术方案是：提供一种显示面板，该显示面板至少包括第一基板、第二基板、夹持在第一基板和第二基板之间的液晶层、设置在第一基板上的遮光层、设置在遮光层和第一基板上的缓冲层、设置在缓冲层上的第一半导体层以及设置在第一半导体层和缓冲层上的有源层，其中，有源层包括本征部、分别位于本征部两侧的第一轻掺杂部和第二轻掺杂部、位于第一轻掺杂部远离本征部一侧的第一重掺杂部、位于第二轻掺杂部远离本征部一侧的第二重掺杂部，本征部完全覆盖第一半导体层，其中，显示面板进一步包括设置在缓冲层上的第二半导体层、设置在有源层和第二半导体层和缓冲层上的栅极绝缘层、设置在栅极绝缘层上的第一金属层、设置在第一金属层上的层间介质层、设置在层间介质层上的第二金属层、设置在第二金属层和层间介质层上的平坦化层、设置在平坦化层上的公共电极层、设置在平坦化层和公共电极层上的钝化层以及设置在钝化层上的透明电极层，第二金属层通过设置在层间介质层和栅极绝缘层上的过孔与有源层导通，透明电极层通过设置在钝化层和平坦化层上的过孔与第二金属层导通，公共电极层设置在与第二半导体层上下对应的区域，透明电极层设置在与公共电极层对应的区域，有源层还设置在第二半导体层上。
其中，第二重掺杂部至少部分设置在第二半导体层上。
其中，第二金属层包括第一子金属层和第二子金属层，第一子金属层通过设置在层间介质层和栅极绝缘层上的过孔与第一重掺杂部导通，第二子金属层通过设置在层间介质层和栅极绝缘层上的过孔与第二重掺杂部导通，透明电极层通过设置在钝化层和平坦化层上的过孔与第二子金属层导通。
为解决上述技术问题，本发明采用的另一个技术方案是：提供一种显示面板，该显示面板至少包括第一基板、第二基板、夹持在第一基板和第二基板之间的液晶层、设置在第一基板上的遮光层、设置在遮光层和第一基板上的缓冲层、设置在缓冲层上的第一半导体层以及设置在第一半导体层和缓冲层上的有源层。
其中，有源层包括本征部、分别位于本征部两侧的第一轻掺杂部和第二轻掺杂部、位于第一轻掺杂部远离本征部一侧的第一重掺杂部、位于第二轻掺杂部远离本征部一侧的第二重掺杂部，本征部完全覆盖第一半导体层。
其中，显示面板进一步包括设置在缓冲层上的第二半导体层、设置在有源层和第二半导体层和缓冲层上的栅极绝缘层、设置在栅极绝缘层上的第一金属层、设置在第一金属层上的层间介质层、设置在层间介质层上的第二金属层、设置在第二金属层和层间介质层上的平坦化层、设置在平坦化层上的公共电极层、设置在平坦化层和公共电极层上的钝化层以及设置在钝化层上的透明电极层，第二金属层通过设置在层间介质层和栅极绝缘层上的过孔与有源层导通，透明电极层通过设置在钝化层和平坦化层上的过孔与第二金属层导通，公共电极层设置在与第二半导体层上下对应的区域，透明电极层设置在与公共电极层对应的区域，有源层还设置在第二半导体层上。
其中，有源层包括本征部、分别位于本征部两侧的第一轻掺杂部和第二轻掺杂部、位于第一轻掺杂部远离本征部一侧的第一重掺杂部、位于第二轻掺杂部远离本征部一侧的第二重掺杂部，第二重掺杂部至少部分设置在第二半导体层上。
其中，第二金属层包括第一子金属层和第二子金属层，第一子金属层通过设置在层间介质层和栅极绝缘层上的过孔与第一重掺杂部导通，第二子金属层通过设置在层间介质层和栅极绝缘层上的过孔与第二重掺杂部导通，透明电极层通过设置在钝化层和平坦化层上的过孔与第二子金属层导通。
其中，第一半导体层和第二半导体层为N型半导体层。
其中，第一半导体层和第二半导体层的材料为铟镓锌氧化物。
其中，显示面板进一步包括设置在第二基板上的彩色滤光片。
其中，有源层为多晶硅半导体层，显示面板为边缘场开关显示面板。
为解决上述技术问题，本发明采用的又一个技术方案是：提供一种显示器，显示器包括显示面板和用于为显示面板提供背光的背光模组，该显示面板至少包括第一基板、第二基板、夹持在第一基板和第二基板之间的液晶层、设置在第一基板上的遮光层、设置在遮光层和第一基板上的缓冲层、设置在缓冲层上的第一半导体层以及设置在第一半导体层和缓冲层上的有源层。
其中，有源层包括本征部、分别位于本征部两侧的第一轻掺杂部和第二轻掺杂部、位于第一轻掺杂部远离本征部一侧的第一重掺杂部、位于第二轻掺杂部远离本征部一侧的第二重掺杂部，本征部完全覆盖第一半导体层。
其中，显示面板进一步包括设置在缓冲层上的第二半导体层、设置在有源层和第二半导体层和缓冲层上的栅极绝缘层、设置在栅极绝缘层上的第一金属层、设置在第一金属层上的层间介质层、设置在层间介质层上的第二金属层、设置在第二金属层和层间介质层上的平坦化层、设置在平坦化层上的公共电极层、设置在平坦化层和公共电极层上的钝化层以及设置在钝化层上的透明电极层，第二金属层通过设置在层间介质层和栅极绝缘层上的过孔与有源层导通，透明电极层通过设置在钝化层和平坦化层上的过孔与第二金属层导通，公共电极层设置在与第二半导体层上下对应的区域，透明电极层设置在与公共电极层对应的区域，有源层还设置在第二半导体层上。
其中，有源层包括本征部、分别位于本征部两侧的第一轻掺杂部和第二轻掺杂部、位于第一轻掺杂部远离本征部一侧的第一重掺杂部、位于第二轻掺杂部远离本征部一侧的第二重掺杂部，第二重掺杂部至少部分设置在第二半导体层上。
其中，第二金属层包括第一子金属层和第二子金属层，第一子金属层通过设置在层间介质层和栅极绝缘层上的过孔与第一重掺杂部导通，第二子金属层通过设置在层间介质层和栅极绝缘层上的过孔与第二重掺杂部导通，透明电极层通过设置在钝化层和平坦化层上的过孔与第二子金属层导通。
其中，第一半导体层和第二半导体层为N型半导体层。
其中，第一半导体层和第二半导体层的材料为铟镓锌氧化物。
其中，显示面板进一步包括设置在第二基板上的彩色滤光片。
本发明的有益效果是：区别于现有技术的情况，本发明通过设置显示面板至少包括第一基板、第二基板、夹持在第一基板和第二基板之间的液晶层、设置在第一基板上的遮光层、设置在遮光层和第一基板上的缓冲层、设置在缓冲层上的第一半导体层以及设置在第一半导体层和缓冲层上的有源层，在栅极驱动信号无偏压的情况下，由第一半导体与有源层形成PN结，在PN结处形成一个很薄的空间电荷区；在栅极驱动信号为负偏压的情况下，由于外加的电场方向与PN结的内电场方向一致，增大了空间电荷区，降低了电子偏移的通道，从而能降低薄膜晶体管的漏电流，能够降低液晶面板的串扰和闪烁。
【附图说明】
图1是本发明优选实施例的显示面板的结构示意图；
图2是本发明显示面板在栅极驱动信号为无偏压的情况下的空间电荷区分布示意图；
图3是本发明显示面板在栅极驱动信号为负偏压的情况下的空间电荷区分布示意图；
图4是本发明显示器的结构示意图。
【具体实施方式】
下面结合附图和实施例对本发明进行详细的说明。
请参阅图1，图1是本发明优选实施例的显示面板的结构示意图。在本实施例中，显示面板包括第一基板11、第二基板12、夹持在第一基板11和第二基板12之间的液晶层13、设置在第一基板11上的遮光层14、设置在遮光层14和第一基板11上的缓冲层15、设置在缓冲层15上的第一半导体层16以及设置在第一半导体层16和缓冲层15上的有源层17。
由于在设置有源层17之前在其下方先形成了一层第一半导体层16，在栅极驱动信号为无偏压的情况下，由第一半导体与有源层17形成PN结，在PN结处形成一个很薄的空间电荷区；在栅极驱动信号为负偏压的情况下，由于外加的电场方向与PN结的内电场方向一致，增大了空间电荷区，降低了电子偏移的通道，从而能降低薄膜晶体管的漏电流，能够降低液晶面板的串扰和闪烁。
优选地，有源层17包括本征部171、分别位于本征部171两侧的第一轻掺杂部172和第二轻掺杂部173、位于第一轻掺杂部171远离本征部171一侧的第一重掺杂部174、位于第二轻掺杂部173远离本征部171一侧的第二重掺杂部175，本征部171完全覆盖第一半导体层16。
如图1所示，本征部171完全将第一半导体层16覆盖使得，第一半导体层16完全不与第一轻掺杂部172、第二轻掺杂部173、第一重掺杂部174或者第二重掺杂部175接触，保证漏极和源极不会在栅极驱动信号为无偏压下的情况下直接导通。
优选地，有源层17为多晶硅半导体层17。在其他实施例中，有源层17也可以为其他类型的有源层。
优选地，显示面板进一步包括设置在缓冲层15上的第二半导体层18、设置在有源层17和第二半导体层18和缓冲层15上的栅极绝缘层19、设置在栅极绝缘层19上的第一金属层20、设置在第一金属层20上的层间介质层21、设置在层间介质层21上的第二金属层22、设置在第二金属层22和层间介质层21上的平坦化层23、设置在平坦化层23上的公共电极层24、设置在平坦化层23和公共电极层24上的钝化层25以及设置在钝化层25上的透明电极层26，第二金属层22通过设置在层间介质层21和栅极绝缘层19上的过孔与有源层17导通，透明电极层26通过设置在钝化层25和平坦化层23上的过孔与第二金属层22导通，公共电极层24设置在与第二半导体层18上下对应的区域，透明电极层26设置在与公共电极层24对应的区域，有源层17还设置在第二半导体层18上。优选地，公共电极层24在第二半导体层18上的投影与第二半导体层18完全重叠，更利于二者之间存储电容的形成，在其他实施例中，公共电极层24在第二半导体层18上的投影与第二半导体层18也可以是部分重叠。
请参阅图2，图2是本发明显示面板在栅极驱动信号为无偏压的情况下的空间电荷区分布示意图。在栅极驱动信号无偏压的情况下，由第一半导体16与有源层17的本征部171形成PN结，在本征部171上与第一半导体层16交界处形成一个很薄的空间电荷区s。
请参阅图3，图3是本发明显示面板在栅极驱动信号为负偏压的情况下的空间电荷区分布示意图。在栅极驱动信号为负偏压的情况下，由于外加的电场方向与PN结的内电场方向一致，增大了空间电荷区s形成新的更大的空间电荷区t，降低了电子偏移的通道p（电子偏移通道p变窄），从而能降低薄膜晶体管的漏电流，能够降低液晶面板的串扰和闪烁。
本领域技术人员不难理解，栅极驱动信号为施加在第一金属层20上的电压信号。第一金属层20为栅极层。
优选地，第二重掺杂部175至少部分设置在第二半导体层18上。
进一步地，由于第二半导体层18的设置，且第二半导体层18通过第二重掺杂部175与第二子金属层222导通，又由于第二半导体层18设置在与公共电极层24上下对应的区域，因此在第二半导体层18和公共电极层24之间形成存储电容Cst2，最终总的存储电容大小为Cst2加上透明电极层26与公共电极层24之间的存储电容Cst1，相比传统的显示面板增大了存储电容，可以更进一步的降低闪烁和串扰。
优选地，第二金属层22包括第一子金属层221和第二子金属层222，第一子金属层221通过设置在层间介质层21和栅极绝缘层19上的过孔与第一重掺杂部174导通，第二子金属层222通过设置在层间介质层21和栅极绝缘层19上的过孔与第二重掺杂部175导通，透明电极层26通过设置在钝化层25和平坦化层23上的过孔与第二子金属层222导通。
优选地，第一子金属层221为源极层，第二子金属层222为漏极层，可以理解，在其他实施例中，也可以是第一子金属层221为漏极层，第二子金属层222为源极层。
优选地，第一半导体层16和第二半导体层18为N型半导体层。
更为优选地，第一半导体层16和第二半导体层18的材料为铟镓锌氧化物，即IGZO(indium gallium zinc oxide)。由于铟镓锌氧化物的透明特性，增加的第一半导体层16和第二半导体层18不会对显示面板的开口率造成影响，且不会影响正常的显示。
优选地，显示面板进一步包括设置在第二基板12上的彩色滤光片27。本领域技术人员可以理解，显示面板还可以包括支撑在第一基板11和第二基板12之间的支撑柱或者在第一基板11或者第二基板12上还可以包括其他膜层，例如偏光片等。
优选地，本实施例中的显示面板为边缘场开关显示面板，在其他实施例中，显示面板也可以为其他类型的显示面板。
请参阅图4，图4是本发明显示器的结构示意图。在本实施例中，显示器包括显示面板41和用于为显示面板41提供背光的背光模组42，该显示面板41为上述任意一个实施例所述的显示面板。
本发明通过设置显示面板至少包括第一基板、第二基板、夹持在第一基板和第二基板之间的液晶层、设置在第一基板上的遮光层、设置在遮光层和第一基板上的缓冲层、设置在缓冲层上的第一半导体层以及设置在第一半导体层和缓冲层上的有源层，在栅极驱动信号无偏压的情况下，由第一半导体与有源层形成PN结，在PN结处形成一个很薄的空间电荷区；在栅极驱动信号为负偏压的情况下，由于外加的电场方向与PN结的内电场方向一致，增大了空间电荷区，降低了电子偏移的通道，从而能降低薄膜晶体管的漏电流，能够降低液晶面板的串扰和闪烁。
以上所述仅为本发明的实施方式，并非因此限制本发明的专利范围，凡是利用本发明说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本发明的专利保护范围内。

Claims (20)

  1. 一种显示面板，其中，所述显示面板至少包括第一基板、第二基板、夹持在所述第一基板和所述第二基板之间的液晶层、设置在第一基板上的遮光层、设置在所述遮光层和所述第一基板上的缓冲层、设置在所述缓冲层上的第一半导体层以及设置在所述第一半导体层和所述缓冲层上的有源层，
    其中，所述有源层包括本征部、分别位于所述本征部两侧的第一轻掺杂部和第二轻掺杂部、位于所述第一轻掺杂部远离所述本征部一侧的第一重掺杂部、位于所述第二轻掺杂部远离所述本征部一侧的第二重掺杂部，所述本征部完全覆盖所述第一半导体层，
    所述显示面板进一步包括设置在所述缓冲层上的第二半导体层、设置在所述有源层和所述第二半导体层和所述缓冲层上的栅极绝缘层、设置在所述栅极绝缘层上的第一金属层、设置在所述第一金属层上的层间介质层、设置在所述层间介质层上的第二金属层、设置在所述第二金属层和所述层间介质层上的平坦化层、设置在所述平坦化层上的公共电极层、设置在所述平坦化层和所述公共电极层上的钝化层以及设置在所述钝化层上的透明电极层，所述第二金属层通过设置在所述层间介质层和所述栅极绝缘层上的过孔与所述有源层导通，所述透明电极层通过设置在所述钝化层和所述平坦化层上的过孔与所述第二金属层导通，所述公共电极层设置在与所述第二半导体层上下对应的区域，所述透明电极层设置在与所述公共电极层对应的区域，所述有源层还设置在所述第二半导体层上。
  2. 根据权利要求1所述的显示面板，其中，所述第二重掺杂部至少部分设置在所述第二半导体层上。
  3. 根据权利要求1所述的显示面板，其中，所述第二金属层包括第一子金属层和第二子金属层，所述第一子金属层通过设置在所述层间介质层和所述栅极绝缘层上的过孔与所述第一重掺杂部导通，所述第二子金属层通过设置在所述层间介质层和所述栅极绝缘层上的过孔与所述第二重掺杂部导通，所述透明电极层通过设置在所述钝化层和所述平坦化层上的过孔与所述第二子金属层导通。
  4. 一种显示面板，其中，所述显示面板至少包括第一基板、第二基板、夹持在所述第一基板和所述第二基板之间的液晶层、设置在第一基板上的遮光层、设置在所述遮光层和所述第一基板上的缓冲层、设置在所述缓冲层上的第一半导体层以及设置在所述第一半导体层和所述缓冲层上的有源层。
  5. 根据权利要求4所述的显示面板，其中，所述有源层包括本征部、分别位于所述本征部两侧的第一轻掺杂部和第二轻掺杂部、位于所述第一轻掺杂部远离所述本征部一侧的第一重掺杂部、位于所述第二轻掺杂部远离所述本征部一侧的第二重掺杂部，所述本征部完全覆盖所述第一半导体层。
  6. 根据权利要求4所述的显示面板，其中，所述显示面板进一步包括设置在所述缓冲层上的第二半导体层、设置在所述有源层和所述第二半导体层和所述缓冲层上的栅极绝缘层、设置在所述栅极绝缘层上的第一金属层、设置在所述第一金属层上的层间介质层、设置在所述层间介质层上的第二金属层、设置在所述第二金属层和所述层间介质层上的平坦化层、设置在所述平坦化层上的公共电极层、设置在所述平坦化层和所述公共电极层上的钝化层以及设置在所述钝化层上的透明电极层，所述第二金属层通过设置在所述层间介质层和所述栅极绝缘层上的过孔与所述有源层导通，所述透明电极层通过设置在所述钝化层和所述平坦化层上的过孔与所述第二金属层导通，所述公共电极层设置在与所述第二半导体层上下对应的区域，所述透明电极层设置在与所述公共电极层对应的区域，所述有源层还设置在所述第二半导体层上。
  7. 根据权利要求4所述的显示面板，其中，所述有源层包括本征部、分别位于所述本征部两侧的第一轻掺杂部和第二轻掺杂部、位于所述第一轻掺杂部远离所述本征部一侧的第一重掺杂部、位于所述第二轻掺杂部远离所述本征部一侧的第二重掺杂部，所述第二重掺杂部至少部分设置在所述第二半导体层上。
  8. 根据权利要求7所述的显示面板，其中，所述第二金属层包括第一子金属层和第二子金属层，所述第一子金属层通过设置在所述层间介质层和所述栅极绝缘层上的过孔与所述第一重掺杂部导通，所述第二子金属层通过设置在所述层间介质层和所述栅极绝缘层上的过孔与所述第二重掺杂部导通，所述透明电极层通过设置在所述钝化层和所述平坦化层上的过孔与所述第二子金属层导通。
  9. 根据权利要求6所述的显示面板，其中，所述第一半导体层和第二半导体层为N型半导体层。
  10. 根据权利要求9所述的显示面板，其中，所述第一半导体层和第二半导体层的材料为铟镓锌氧化物。
  11. 根据权利要求4所述的显示面板，其中，所述显示面板进一步包括设置在所述第二基板上的彩色滤光片。
  12. 根据权利要求4所述的显示面板，其中，所述有源层为多晶硅半导体层，所述显示面板为边缘场开关显示面板。
  13. 一种显示器，其中，所述显示器包括显示面板和用于为所述显示面板提供背光的背光模组，所述显示面板至少包括第一基板、第二基板、夹持在所述第一基板和所述第二基板之间的液晶层、设置在第一基板上的遮光层、设置在所述遮光层和所述第一基板上的缓冲层、设置在所述缓冲层上的第一半导体层以及设置在所述第一半导体层和所述缓冲层上的有源层。
  14. 根据权利要求13所述的显示器，其中，所述有源层包括本征部、分别位于所述本征部两侧的第一轻掺杂部和第二轻掺杂部、位于所述第一轻掺杂部远离所述本征部一侧的第一重掺杂部、位于所述第二轻掺杂部远离所述本征部一侧的第二重掺杂部，所述本征部完全覆盖所述第一半导体层。
  15. 根据权利要求13所述的显示器，其中，所述显示面板进一步包括设置在所述缓冲层上的第二半导体层、设置在所述有源层和所述第二半导体层和所述缓冲层上的栅极绝缘层、设置在所述栅极绝缘层上的第一金属层、设置在所述第一金属层上的层间介质层、设置在所述层间介质层上的第二金属层、设置在所述第二金属层和所述层间介质层上的平坦化层、设置在所述平坦化层上的公共电极层、设置在所述平坦化层和所述公共电极层上的钝化层以及设置在所述钝化层上的透明电极层，所述第二金属层通过设置在所述层间介质层和所述栅极绝缘层上的过孔与所述有源层导通，所述透明电极层通过设置在所述钝化层和所述平坦化层上的过孔与所述第二金属层导通，所述公共电极层设置在与所述第二半导体层上下对应的区域，所述透明电极层设置在与所述公共电极层对应的区域，所述有源层还设置在所述第二半导体层上。
  16. 根据权利要求13所述的显示器，其中，所述有源层包括本征部、分别位于所述本征部两侧的第一轻掺杂部和第二轻掺杂部、位于所述第一轻掺杂部远离所述本征部一侧的第一重掺杂部、位于所述第二轻掺杂部远离所述本征部一侧的第二重掺杂部，所述第二重掺杂部至少部分设置在所述第二半导体层上。
  17. 根据权利要求16所述的显示器，其中，所述第二金属层包括第一子金属层和第二子金属层，所述第一子金属层通过设置在所述层间介质层和所述栅极绝缘层上的过孔与所述第一重掺杂部导通，所述第二子金属层通过设置在所述层间介质层和所述栅极绝缘层上的过孔与所述第二重掺杂部导通，所述透明电极层通过设置在所述钝化层和所述平坦化层上的过孔与所述第二子金属层导通。
  18. 根据权利要求15所述的显示器，其中，所述第一半导体层和第二半导体层为N型半导体层。
  19. 根据权利要求18所述的显示器，其中，所述第一半导体层和第二半导体层的材料为铟镓锌氧化物。
  20. 根据权利要求13所述的显示器，其中，所述显示面板进一步包括设置在所述第二基板上的彩色滤光片。
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CN106125432A (zh) * 2016-08-29 2016-11-16 武汉华星光电技术有限公司 显示器及其显示面板
CN107068903A (zh) * 2017-04-07 2017-08-18 惠科股份有限公司 一种显示面板和显示装置
CN107121852B (zh) * 2017-06-20 2020-05-05 武汉华星光电技术有限公司 一种阵列基板及液晶面板
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