WO2018032634A1 - 一种半自动曝光机做内层板的制作工艺 - Google Patents

一种半自动曝光机做内层板的制作工艺 Download PDF

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Publication number
WO2018032634A1
WO2018032634A1 PCT/CN2016/105908 CN2016105908W WO2018032634A1 WO 2018032634 A1 WO2018032634 A1 WO 2018032634A1 CN 2016105908 W CN2016105908 W CN 2016105908W WO 2018032634 A1 WO2018032634 A1 WO 2018032634A1
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film
board
inner layer
semi
exposure machine
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PCT/CN2016/105908
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English (en)
French (fr)
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林伟玉
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建业科技电子（惠州）有限公司
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Publication of WO2018032634A1 publication Critical patent/WO2018032634A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/052—Magnetographic patterning

Definitions

  • the invention relates to the technical field of printed circuit board processing, in particular to a semi-automatic exposure machine for making an inner layer board.
  • the inner layer production in the industry is produced by the film clamp wet film manual exposure machine, and the relative quality is relatively poor.
  • the inner layer board with dense line spacing is less than 0.1mm, the quality requirement is higher with wet film, Manually exposing the plywood with film, the low yield is easy to produce poor exposure and other scrapping, including the use of wet film coating ink for the inner layer circuit, easy to wipe the ink during the production process, forming an open circuit; manual exposure with a film clip Machine exposure, do dense lines and thin inner layer thickness is prone to poor exposure; usually the inner layer rejection rate of each batch of circuit boards is about 15%.
  • the object of the present invention is to provide a semi-automatic exposure machine for making an inner layer board, which has the characteristics of good exposure quality, simple operation, low scrap rate and low cost.
  • the invention discloses a semi-automatic exposure machine for making an inner layer board, comprising the following steps:
  • Inner layer film inner layer film is applied to the PCB board with the inner layer dry film with the same size and inner layer.
  • the film speed is 2.8-3.0m/min
  • the film pressure is 4.5 ⁇ 0.1kg/cm 2
  • the film temperature is: 105 ⁇ 5°C
  • the surface temperature of the board is ⁇ 55°C;
  • the inner layer board surface must be etched downwards, the etching speed is adjusted to 5-6m/min, and the line width line spacing requirement is ⁇ 0.03mm. After the requirement is reached, the board can be etched in batches, and then the board is obtained to obtain the inner layer board.
  • the exposed exposure ruler of the C-step semi-automatic exposure machine is selected from 6 to 6 full, and the inner layer is exposed without a hanging nail, and the inner layer is directly placed in the range of the four corners of the film, and then the exposure machine is turned on. Film is in place.
  • each plate of the plate is separated by a film to prevent the wipe from colliding.
  • the invention discloses a semi-automatic exposure machine which is used for making an inner layer board, and has the following beneficial effects: the invention is directed to a conventional inner layer board which is coated with a wet film coated plywood manual exposure machine, especially a dense inner layer board line. Since the inner layer board usually has a thin plate thickness, the ink on the surface of the board is easily scratched during production operation, resulting in an open circuit after etching, and exposure by a manual exposure machine is also easy to produce. Defects such as poor exposure and scrapping.
  • the inner layer dry film and the semi-automatic exposure machine are used to produce the film production for the semi-automatic exposure machine.
  • the dry film itself has a protective film on the surface, the scraping can be reduced during the operation, and the semi-automatic parallel exposure machine can reduce the manual non-parallel.
  • the exposure machine is prone to poor exposure problems, which significantly improves the quality of the inner layer of the line.
  • the invention discloses a semi-automatic exposure machine for making an inner layer board, comprising the following steps:
  • Inner layer film inner layer film is applied to the PCB board with the inner layer dry film with the same size and inner layer.
  • the film speed is 2.8-3.0m/min
  • the film pressure is 4.5 ⁇ 0.1kg/cm 2
  • the film temperature is: 105 ⁇ 5°C
  • the surface temperature of the board is ⁇ 55°C;
  • each board mark the cleaning frequency during exposure
  • each board of the production exposure is cleaned with a dust mites to clean the exposed inner film
  • each set of film production 50pnl to do the first board the first board draws the red line to mark
  • the laminate cannot be developed and etched.
  • the inner layer board surface must be etched downwards, the etching speed is adjusted to 5-6m/min, and the line width line spacing requirement is ⁇ 0.03mm. After the requirement is reached, the board can be etched in batches, and then the board is obtained to obtain the inner layer board. After the development and etching, each board of the board is separated by a film to prevent the wipe from colliding.
  • the invention uses a dry film to produce a film using a semi-automatic exposure machine, improves the yield of the inner layer, reduces the scrap rate, and finally reduces the scrap rate to less than 2%.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Laminated Bodies (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)

Abstract

本发明公开了一种半自动曝光机做内层板的制作工艺，包括以下步骤：内层菲林制作、内层贴膜、半自动曝光机曝光、首板标记和显影蚀刻。本发明的半自动曝光机做内层板的制作工艺具有曝光品质好、操作简单、报废率低和成本低廉的特点。

Description

一种半自动曝光机做内层板的制作工艺 技术领域
本发明涉及印刷电路板加工技术领域，具体为一种半自动曝光机做内层板的制作工艺。
背景技术
目前行业上的内层板制作用菲林夹湿膜手动曝光机生产，质量相对稳定性差，针对内层线路较密集，线宽线距小于0.1mm的内层板，质量要求较高用湿膜、用菲林做夹板手动曝光，良率较低容易产生曝光不良及其它报废，具体包括用湿膜涂布油墨做内层线路，在生产操作过程中易擦花油墨，形成开路；用菲林夹手动曝光机曝光，做密集线路且内层板厚较薄易出现曝光不良；通常每批电路板内层报废率15％左右。
发明内容
本发明的目的是提供一种半自动曝光机做内层板的制作工艺，具有曝光品质好、操作简单、报废率低和成本低廉的特点。
本发明可以通过以下技术方案来实现：
本发明公开了一种半自动曝光机做内层板的制作工艺，包括以下步骤：
A、内层菲林制作，在目前在生产上使用的菲林基础上，菲林4个对位点移出比内层板边大10mm，同时在菲林上设计2个半自动曝光机挂钉孔，挂钉孔比内层板边位置外移10mm，菲林4个角角线加粗至2.0mm；
B、内层贴膜，选用规格尺寸与内层板一致的内层干膜对PCB板进行内层贴膜，贴膜速度2.8-3.0m/min,贴膜压力：4.5±0.1kg/cm2,贴膜温度：105±5℃，出板板面温度≧55℃；
C、半自动曝光机曝光，选用半自动曝光机，采用与生产外层板相同的方法进行菲林安装，内层菲林挂钉孔在板边缘外部，在菲林设有挂钉孔处用打孔机打孔后安装菲林，菲林安装好后开启内层模式曝光；
D、首板标记，曝光时清洁频率每生产曝光一块板用粘尘辘清洁一次曝光的内层菲林，每套菲林生产50pnl做一次首板，首板画红线做标记，没有首板标记的内层板，不可以显影蚀刻；
E、显影蚀刻，内层板线路面须朝下蚀刻，调整蚀刻速度5-6m/min,确认线宽线距要求±0.03mm，达到要求后方可以批量蚀板，然后出板得到内层板。
进一步地，所述C步半自动曝光机曝的曝光尺选用6格残至6格满，内层板曝光时不用挂钉，直接把内层板放在菲林四边角线范围内，再开启曝光机菲林对位曝光。
进一步地，E步显影蚀刻后出板每块板采用隔胶片防止擦花撞开路。
本发明一种半自动曝光机做内层板的制作工艺，具有如下的有益效果：本发明针对传统的用湿膜涂布夹板菲林手动曝光机做内层板特别是线路较密集的内层板线路由于内层板通常板厚较薄，生产操作时容易产生板面油墨刮花，造成蚀刻后的开路，及用手动曝光机曝光做薄板也容易产生 曝光不良报废等的缺陷。改用内层干膜及半自动曝光机，制作半自动曝光机专用生产菲林生产，由于干膜本身表面有一层保护膜可以减少操作过程中的刮花报废，及用半自动平行曝光机可以减少手动非平行曝光机容易产生曝光不良问题，从而明显的改善了线路较密集的内层板质量。
具体实施方式
为了使本技术领域的人员更好地理解本发明的技术方案，下面结合实施例对本发明产品作进一步详细的说明。
本发明公开了一种半自动曝光机做内层板的制作工艺，包括以下步骤：
A、内层菲林制作，在正常生产菲林基础上，菲林4个对位点移出比内层板边大10mm，同时在菲林上设计2个半自动曝光机挂钉孔，挂钉孔比内层板边位置外移10mm，菲林4个角角线加粗至2.0mm；
B、内层贴膜，选用规格尺寸与内层板一致的内层干膜对PCB板进行内层贴膜，贴膜速度2.8-3.0m/min,贴膜压力：4.5±0.1kg/cm2,贴膜温度：105±5℃，出板板面温度≧55℃；
C、半自动曝光机曝光，选用半自动曝光机，采用与生产外层板相同的方法进行菲林安装，内层菲林挂钉孔在板边缘外部，在菲林设有挂钉孔处用打孔机打孔后安装菲林，菲林安装好后开启内层模式曝光。在曝光过程中，曝光尺选用6格残至6格满，内层板曝光时不用挂钉，直接把内层板放在菲林四边角线范围内，再开启曝光机菲林对位曝光。
D、首板标记，曝光时清洁频率每生产曝光一块板用粘尘辘清洁一次曝光的内层菲林，每套菲林生产50pnl做一次首板，首板画红线做标记，没有首板标记的内层板，不可以显影蚀刻。
E、显影蚀刻，内层板线路面须朝下蚀刻，调整蚀刻速度5-6m/min,确认线宽线距要求±0.03mm，达到要求后方可以批量蚀板，然后出板得到内层板。显影蚀刻后出板每块板采用隔胶片防止擦花撞开路。
在实际生产过程中，本发明改用干膜采用半自动曝光机生产菲林，提升生产内层板的良率，降低报废率，最终的报废率控制到2％以下。
以上所述，仅为本发明的较佳实施例而已，并非对本发明作任何形式上的限制；凡本行业的普通技术人员均可按说明书所示和以上所述而顺畅地实施本发明；但是，凡熟悉本专业的技术人员在不脱离本发明技术方案范围内，可利用以上所揭示的技术内容而作出的些许更动、修饰与演变的等同变化，均为本发明的等效实施例；同时，凡依据本发明的实质技术对以上实施例所作的任何等同变化的更动、修饰与演变等，均仍属于本发明的技术方案的保护范围之内。

Claims (3)

  1. 一种半自动曝光机做内层板的制作工艺，其特征在于包括以下步骤：
    A、内层菲林制作，在目前在生产上使用的菲林基础上，菲林4个对位点移出比内层板边大10mm，同时在菲林上设计2个半自动曝光机挂钉孔，挂钉孔比内层板边位置外移10mm，菲林4个角角线加粗至2.0mm；
    B、内层贴膜，选用规格尺寸与内层板一致的内层干膜对PCB板进行内层贴膜，贴膜速度2.8-3.0m/min,贴膜压力：4.5±0.1kg/cm2,贴膜温度：105±5℃，出板板面温度≧55℃；
    C、半自动曝光机曝光，选用半自动曝光机，采用与生产外层板相同的方法进行菲林安装，内层菲林挂钉孔在板边缘外部，菲林设有挂钉孔处用打孔机打孔后安装菲林，菲林安装好后开启内层模式曝光；
    D、首板标记，曝光时清洁频率每生产曝光一块板用粘尘辘清洁一次曝光的内层菲林，每套菲林生产50pnl做一次首板，首板画红线做标记，没有首板标记的内层板，不可以显影蚀刻；
    E、显影蚀刻，内层板线路面须朝下蚀刻，调整蚀刻速度5-6m/min,确认线宽线距要求±0.03mm，达到要求后方可以批量蚀板，然后出板得到内层板。
  2. 根据权利要求1所述的半自动曝光机做内层板的制作工艺，其特征在于：所述C步半自动曝光机曝的曝光尺选用6格残至6格满，内层板曝光时不用挂钉，直接把内层板放在菲林四边角线范围内，再开启曝光机 菲林对位曝光。
  3. 根据权利要求1所述的半自动曝光机做内层板的制作工艺，其特征在于：E步显影蚀刻后出板每块板采用隔胶片防止擦花撞开路。
    。
PCT/CN2016/105908 2016-08-15 2016-11-15 一种半自动曝光机做内层板的制作工艺 WO2018032634A1 (zh)

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