WO2018012203A1 - 配線基板の製造方法、及び、配線基板 - Google Patents

配線基板の製造方法、及び、配線基板 Download PDF

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Publication number
WO2018012203A1
WO2018012203A1 PCT/JP2017/022462 JP2017022462W WO2018012203A1 WO 2018012203 A1 WO2018012203 A1 WO 2018012203A1 JP 2017022462 W JP2017022462 W JP 2017022462W WO 2018012203 A1 WO2018012203 A1 WO 2018012203A1
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WO
WIPO (PCT)
Prior art keywords
layer
wiring board
mold
plated
substrate
Prior art date
Application number
PCT/JP2017/022462
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
直樹 塚本
Original Assignee
富士フイルム株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士フイルム株式会社 filed Critical 富士フイルム株式会社
Priority to CN201780041403.2A priority Critical patent/CN109417852A/zh
Priority to KR1020187037266A priority patent/KR20190010634A/ko
Priority to JP2018527463A priority patent/JPWO2018012203A1/ja
Publication of WO2018012203A1 publication Critical patent/WO2018012203A1/ja

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0014—Shaping of the substrate, e.g. by moulding
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1605—Process or apparatus coating on selected surface areas by masking
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2053—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment only one step pretreatment
    • C23C18/206—Use of metal other than noble metals and tin, e.g. activation, sensitisation with metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2053—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment only one step pretreatment
    • C23C18/2066—Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material

Definitions

  • the conductive film having a metal layer formed on a substrate is used for various purposes. For example, in recent years, with an increase in the rate of mounting touch panels on mobile phones or portable game devices, the demand for conductive films for capacitive touch panel sensors capable of multipoint detection is rapidly expanding.
  • this invention makes it a subject to provide the manufacturing method of a wiring board which can manufacture more easily the wiring board formed by arrange
  • Another object of the present invention is to provide a wiring board.
  • a step A including a substrate and a patterned metal layer disposed on at least one main surface of the substrate, and preparing two conductive films having a three-dimensional shape; a first mold and a second One of the conductive films is disposed on one of the molds, the other of the conductive films is disposed on the other of the first mold and the second mold, and the first mold The mold and the second mold are clamped, and a resin is injected into a mold cavity formed by the first mold and the second mold, and two conductive films are arranged via a resin layer.
  • a process for producing a wiring board comprising: a process B for producing a wiring board that has been formed.
  • the plated layer is obtained by curing the plated layer precursor layer formed by the composition for forming a plated layer containing the polymerization initiator and the following compound X or composition Y.
  • the manufacturing method of the wiring board as described in [2].
  • Step X1 is a step of forming a plated layer precursor layer containing a functional group that interacts with a plating catalyst or a precursor thereof on a substrate; The step of applying energy in a pattern form to the precursor layer to be plated through a photomask having an opening of the pattern, and developing the precursor layer to be plated after energy application,
  • step B The method for manufacturing a wiring board according to any one of [1] to [5], wherein the resin is made of polycarbonate.
  • step B one of the conductive films is disposed on one of the first mold and the second mold, and the other mold of the first mold and the second mold is disposed.
  • the main surfaces on which the patterned metal layers of the two conductive films are disposed are respectively located on the mold cavity side, [1] to [1] to [6]
  • Two conductive films each including a substrate and a patterned metal layer disposed on at least one main surface of the substrate, two conductive films having a three-dimensional shape, and a resin layer.
  • the patterned metal layers respectively provided in the two conductive films are arranged to face each other via the resin layer, and each patterned metal layer is in direct contact with the resin layer. 11].
  • positioning two conductive films which have a three-dimensional shape facing each other can be provided.
  • the wiring board which has the said characteristic can be provided.
  • a numerical range expressed using “to” means a range including numerical values described before and after “to” as a lower limit value and an upper limit value.
  • the drawings in the present invention are schematic diagrams for facilitating understanding of the invention, and the thickness relationship or positional relationship of each layer does not necessarily match the actual one.
  • (meth) acryloyl intends acryloyl and / or methacryloyl.
  • (meth) acryl intends acrylic and / or methacryl.
  • Wiring board manufacturing method 1 In the method for manufacturing a wiring board according to the first embodiment of the present invention, two conductive films having a three-dimensional shape are arranged on two molds (first mold and second mold), respectively. A resin is injected into a mold cavity formed by the mold (hereinafter, the molding method is also referred to as “insert molding”). By injecting resin between the two conductive films facing each other by insert molding, air bubbles are not mixed between the two conductive films, and the wiring board can be manufactured more easily. Below, the procedure of each process is explained in full detail, referring drawings.
  • Step A is a step of preparing two conductive films having a three-dimensional shape, including a substrate and a patterned metal layer disposed on at least one main surface of the substrate.
  • preparation means that the conductive film is manufactured using raw materials described later, or is procured by a method such as simple purchase.
  • the conductive film prepared in Step A includes a substrate and a patterned metal layer disposed on at least one main surface of the substrate.
  • the main surface means a surface having the largest area facing each other among the surfaces constituting the substrate, and typically corresponds to a surface facing the thickness direction of the substrate.
  • FIG. 7 is a schematic view of a long substrate wound in a roll shape. As shown in FIG. 7, the long substrate 70 includes a main surface 71 (note that the main surface 71 and the opposite surface facing the thickness direction are also the other main surface).
  • step A two conductive films are prepared.
  • the two conductive films prepared may be the same or different.
  • a pattern-like metal layer described later provided in two opposing conductive films has a vertical and horizontal two-dimensional matrix.
  • the electrodes are arranged in a shape. Therefore, it is preferable that the patterns of the metal layers arranged on the two conductive films are different from each other.
  • FIG. 1 one Embodiment of the electroconductive film prepared by this process is shown.
  • FIG. 2A is a perspective view of an embodiment of the conductive film
  • FIG. 1 is a cross-sectional view taken along the line AA.
  • FIG. 2B is a partially enlarged view of the conductive film.
  • the conductive film 10 includes a substrate 12 and a patterned metal layer 14 disposed on one main surface of the substrate 12, and partially includes It has a hemispherical three-dimensional shape.
  • the substrate 12 has a hemispherical portion 12a and a flat portion 12b extending outward from the bottom of the hemispherical portion 12a, and the patterned metal layer 14 is mainly disposed on the hemispherical portion 12a. Moreover, as shown in FIG. 2B, the patterned metal layer 14 disposed on the hemispherical portion 12a is disposed on the outer surface of the hemispherical portion 12a.
  • the conductive film has a three-dimensional shape (three-dimensional shape), this form Not limited.
  • the three-dimensional shape include a three-dimensional shape containing a curved surface, and more specifically, a kamaboko shape, a corrugated shape, an uneven shape, and a cylindrical shape.
  • the patterned metal layer 14 is disposed on the outer surface of the hemispherical portion 12a of the substrate 12, but is not limited to this form. For example, you may arrange
  • FIG. 2C is a partially enlarged top view of the patterned metal layer 14, and the patterned metal layer 14 includes a plurality of fine metal wires 30 and includes a plurality of lattices 31 formed by intersecting metal fine wires 30. It has a mesh pattern.
  • the line width of the fine metal wire 30 is not particularly limited, but is preferably 1000 ⁇ m or less, more preferably 500 ⁇ m or less, further preferably 300 ⁇ m or less, preferably 2 ⁇ m or more, and more preferably 10 ⁇ m or more.
  • the thickness of the thin metal wire 30 is not particularly limited, but can be selected from 0.00001 to 0.2 mm from the viewpoint of conductivity, but is preferably 30 ⁇ m or less, more preferably 20 ⁇ m or less, and further preferably 0.01 to 9 ⁇ m. 0.05 to 5 ⁇ m is particularly preferable.
  • the lattice 31 includes an opening region surrounded by the thin metal wires 30.
  • the length W of one side of the grating 31 is preferably 1500 ⁇ m or less, more preferably 1300 ⁇ m or less, further preferably 1000 ⁇ m or less, preferably 5 ⁇ m or more, more preferably 30 ⁇ m or more, and further preferably 80 ⁇ m or more.
  • the lattice 31 has a substantially rhombus shape.
  • other polygonal shapes for example, a triangle, a quadrangle, a hexagon, and a random polygon
  • the shape of one side may be a curved shape or a circular arc shape in addition to a linear shape.
  • the arc shape for example, the two opposing sides may have an outwardly convex arc shape, and the other two opposing sides may have an inwardly convex arc shape.
  • the shape of each side may be a wavy shape in which an outwardly convex arc and an inwardly convex arc are continuous. Of course, the shape of each side may be a sine curve.
  • the patterned metal layer 14 has a mesh pattern, but is not limited to this form.
  • the substrate is not particularly limited as long as it has a main surface and supports the patterned metal layer.
  • a flexible substrate preferably an insulating substrate
  • a resin substrate is more preferable.
  • the resin substrate material include polyether sulfone resin, polyacrylic resin, polyurethane resin, polyester resin (polyethylene terephthalate, polyethylene naphthalate, etc.), polycarbonate resin, polysulfone resin, polyamide resin. , Polyarylate resin, polyolefin resin, cellulose resin, polyvinyl chloride resin, and cycloolefin resin. Of these, polycarbonate resins (more preferably polycarbonates) are preferable from the viewpoint of heat resistance after molding.
  • the thickness (mm) of the substrate is not particularly limited, but is preferably 0.05 to 2 mm, more preferably 0.1 to 1 mm, from the viewpoint of balance between handleability and thinning.
  • a multilayer structure may be sufficient as a board
  • substrate for example, you may contain a functional film as the one layer.
  • the substrate itself may be a functional film.
  • the type of metal constituting the patterned metal layer is not particularly limited, and examples thereof include copper, chromium, lead, nickel, gold, silver, tin, and zinc. From the viewpoint of conductivity, copper Gold or silver is preferable, and copper or silver is more preferable.
  • the conductive film having a three-dimensional shape can be produced by a known method. Details will be described later.
  • step B one of the conductive films is disposed on one of the first mold and the second mold capable of forming a mold cavity, and the process B includes the first mold and the second mold.
  • the other conductive film is placed on the other mold, the first mold and the second mold are clamped, and the resin is placed in the mold cavity formed by the first mold and the second mold.
  • the conductive film 10 is disposed (mounted) on each of the first mold 20 and the second mold 22.
  • the conductive film 10 includes a substrate 12 and a patterned metal layer 14 on the main surface of the substrate.
  • the first mold 20 and the second mold 22 are clamped and not shown in the mold cavity C formed by the first mold 20 and the second mold 22.
  • Resin is injected from the injection port (injection injection).
  • injection injection the resin is usually heated by a known heating means, and the molten resin is injected into the mold cavity C.
  • the mold first mold and / or second mold
  • the mold is cooled to solidify the resin, and the wiring board 24a, which is a molded body, is removed from the mold.
  • the wiring board 24 a contains the conductive film 10, the resin layer 26, and the conductive film 10 in this order.
  • the mold cavity is a space for forming a resin layer provided between the first mold and the second mold.
  • the shape of the first mold 20 is concave and the shape of the second mold 22 is convex.
  • the shape is not limited to this, and the three-dimensional shape (three-dimensional shape) of the conductive film 10 is not limited.
  • the mold having the optimum shape is selected according to the shape. That is, a mold having a shape corresponding to the three-dimensional shape of the conductive film 10 is selected.
  • the resulting wiring board 24a is obtained as follows: substrate 12 / patterned metal layer 14 / resin layer 26 / pattern.
  • the metal layer 14 / substrate 12 is provided in this order. That is, the patterned metal layers 14 included in the two conductive films are arranged to face each other via the resin layer 26, and each patterned metal layer 14 is in direct contact with the resin layer 26. Yes.
  • the substrate 12 functions as a protective layer for the patterned metal layer 14. Therefore, even if a protective layer for the patterned metal layer 14 is not separately provided, the wiring substrate 24a is scratch resistant. It has the feature that it is more excellent in performance.
  • FIG. 6A and FIG. 6B the modification of arrangement
  • the first mold 20 has the conductive film 10 with the main surface on which the patterned metal layer 14 is disposed on the mold side
  • the second mold 22 has the patterned metal.
  • the conductive film 10 is disposed with the main surface on which the layer 14 is disposed facing the mold cavity.
  • FIG. 6B the first mold 20 is provided with the conductive film 10 with the main surface on which the patterned metal layer 14 is arranged on the mold cavity side, and the second mold 22 is provided with a pattern.
  • the conductive film 10 is disposed with the main surface on which the metal layer 14 is disposed on the mold side.
  • the type of resin injected (filled) into the mold cavity is not particularly limited, and a known resin can be used.
  • a known resin can be used.
  • polycarbonate resins are preferable.
  • the material of the substrate and the resin injected into the mold cavity may be the same or different. If the material of the board and the resin injected into the mold cavity are the same resin, the thermal expansion coefficients (thermal linear expansion coefficient and thermal expansion coefficient) of both are equal, so the wiring board changes in temperature. Even if, for example, heat is generated by use, stress and strain due to the difference in thermal expansion coefficient are unlikely to occur. Since the stress and strain hardly occur, the durability of the wiring board is further improved.
  • the substrate material and the resin injected into the mold cavity are preferably polycarbonate resins in terms of heat resistance after molding.
  • the method for manufacturing a wiring board according to the above embodiment may include an optional step other than the step A and the step B within a range in which a desired effect is obtained.
  • the optional step include a self-healing layer forming step and a hard coat layer forming step.
  • the self-healing layer formation process is a process of forming a self-healing layer on the main surface of the substrate. This step can be performed before step A, after step A, and / or after step B.
  • the self-healing layer is a layer having a function (self-healing property) in which a scratch attached to the surface of the layer self-heals.
  • the self-repairing property is a function of making a scratch difficult by repairing the scratch by elastic recovery. More specifically, the surface of the layer is rubbed with a brass brush loaded with a load of 500 g. Immediately after that, when the presence of scratches is visually confirmed, it is intended that the scratches recover within 3 minutes after being scratched in an environment of 20 to 25 ° C.
  • examples of the self-healing layer include a layer containing a resin having a soft segment and a hard segment.
  • the soft segment acts to cushion the external force by acting as a cushion and functions to elastically recover the wound, and the hard segment functions to resist the external force.
  • examples of the material contained in the self-healing layer include a urethane resin having a polycarbonate skeleton, a urethane resin having a polycaprolactone skeleton, a urethane resin having a polyester skeleton, and the like.
  • the skeleton, the polycaprolactone skeleton, and the polyester skeleton function as a soft segment, and the urethane bond functions as a hard segment.
  • the thickness of the self-healing layer is preferably 0.5 to 50 ⁇ m, more preferably 1 to 30 ⁇ m.
  • the method for forming the self-healing layer is not particularly limited, and a known forming method can be used.
  • a method for forming the self-healing layer for example, a composition for forming a self-healing layer containing the above-described material is applied onto the main surface of the substrate, and dried and / or cured as necessary. Examples include a method of bringing the substrate into contact with the composition for forming a repair layer (for example, a method of immersing).
  • a hard-coat layer formation process is a process of forming a hard-coat layer on the main surface of an electroconductive film. This step can be performed after step A or after step B, and is preferably performed after step A.
  • the hard coat layer is not particularly limited, and a known layer can be used.
  • Examples of the hard coat layer include a layer obtained by polymerizing and curing a compound containing an unsaturated double bond, and a layer obtained by thermosetting using a sol-gel reaction.
  • the thickness of the hard coat layer is preferably 0.4 to 35 ⁇ m, more preferably 1 to 30 ⁇ m, and further preferably 1.5 to 20 ⁇ m.
  • the method for forming the hard coat layer is not particularly limited, and includes, for example, a compound containing an unsaturated double bond, and additives used as necessary (for example, a polymerization initiator, translucent particles, a solvent).
  • the composition for forming a hard coat layer is brought into contact with a conductive film, a coating film is formed on the conductive film, and the coating film is cured.
  • the hard coat layer may be formed on one or both of the two conductive films, and the hard coat layer is preferably formed on one main surface of the substrate.
  • the hard coat layer is preferably disposed at a portion that is touched by a user's finger during use.
  • a compound having an unsaturated double bond can function as a binder after curing.
  • the compound having an unsaturated double bond is preferably a polyfunctional monomer containing two or more polymerizable unsaturated groups. Moreover, it is more preferable that there are three or more polymerizable unsaturated groups.
  • Examples of the compound containing an unsaturated double bond include compounds having a polymerizable unsaturated group such as a (meth) acryloyl group, a vinyl group, a styryl group, and an allyl group. Of these, a (meth) acryloyl group is preferred as the polymerizable unsaturated group.
  • the compound containing an unsaturated double bond include (meth) acrylic acid diesters of alkylene glycol, (meth) acrylic acid diesters of polyoxyalkylene glycol, and (meth) acrylic acid diesters of polyhydric alcohols.
  • additives contained in the hard coat layer forming composition include photopolymerization initiators, translucent particles, solvents, and the like described in paragraphs 0025 to 0043 of JP2012-103690A which is incorporated herein by reference.
  • the wiring board obtained by the above procedure is a wiring board having a three-dimensional shape, which is formed by disposing two conductive films having a patterned metal layer on at least one main surface facing each other. It is.
  • the wiring board includes, for example, a touch sensor (also referred to as “touch panel sensor”), a semiconductor chip, FPC (Flexible printed circuits), COF (Chip on Film), TAB (Tape Automated Bonding), an antenna, a multilayer wiring board, and It can be applied to various uses such as a mother board. Especially, it is preferable to use for a touch sensor (electrostatic capacitance type touch panel sensor).
  • a patterned metal layer in the wiring board functions as a detection electrode or a lead wiring in the touch sensor.
  • one of the two conductive films is a transmission conductive film and the other is a reception conductive film.
  • the wiring board can also be used as a heating element. That is, by passing an electric current through the patterned metal layer, the temperature of the patterned metal layer rises, and the patterned metal layer functions as a hot wire.
  • step A as a method of preparing two conductive films having a three-dimensional shape, including a substrate and a patterned metal layer disposed on at least one main surface of the substrate, for example, the conductive film
  • the method of manufacturing or the method of procuring is mentioned. It does not restrict
  • Method 1 for producing conductive film includes a method comprising the following steps X1 to X4. Hereinafter, each process is explained in full detail.
  • a patterned layer to be plated containing a functional group that interacts with the plating catalyst or its precursor (hereinafter also referred to as “interactive group”) is formed on the substrate, and the substrate with the layer to be plated is formed. It is the process of obtaining.
  • the method in particular of forming the said pattern-like to-be-plated layer is not restrict
  • Formation method 1 of pattern-like to-be-plated layer A step of forming a plating layer precursor layer containing a functional group that interacts with the plating catalyst or its precursor on the substrate, and a plating layer precursor layer through a photomask having a patterned opening Applying energy to the pattern in a pattern (for example, exposure); And developing a plated layer precursor layer after applying energy to obtain a patterned plated layer (photolithography method).
  • a method (printing method) comprising: applying energy (for example, exposure) to the patterned plated layer precursor layer to obtain a patterned plated layer.
  • the method for forming the plating layer precursor layer on the substrate is not particularly limited.
  • a method for applying a composition for forming a layer to be plated, which will be described later, to the substrate, or formation of a layer to be plated And a method of bringing the composition into contact with the substrate for example, a method of immersing the substrate in the composition for forming a layer to be plated.
  • coat the to-be-plated layer forming composition in pattern shape For example, a screen printing method or the inkjet method etc. are mentioned.
  • the to-be-plated layer is obtained by curing a to-be-plated layer precursor layer formed by a composition for forming a to-be-plated layer containing a polymerization initiator and the following compound X or composition Y. .
  • a composition for to-be-plated layer forming is demonstrated for every component.
  • Polymerization initiator It does not restrict
  • the polymerization initiator include benzophenones, acetophenones, ⁇ -aminoalkylphenones, benzoins, ketones, thioxanthones, benzyls, benzyl ketals, oxime esters, anthrones, tetramethylthiuram monosulfide Bisacylphosphine oxides, acylphosphine oxides, anthraquinones, azo compounds, and derivatives thereof.
  • the content of the polymerization initiator in the composition for forming a layer to be plated is not particularly limited, but is preferably 0.01 to 1% by mass with respect to the total solid content of the composition for forming a layer to be plated. More preferably, the content is 0.1 to 0.5% by mass.
  • composition for forming a layer to be plated preferably contains the following compound X or composition Y.
  • Compound X a functional group that interacts with the plating catalyst or its precursor (hereinafter, also simply referred to as “interactive group”), and a compound composition that contains a polymerizable group Y: mutual interaction with the plating catalyst or its precursor COMPOSITION CONTAINING COMPOUND CONTAINING FUNCTIONAL FUNCTIONALITY AND COMPOUND CONTAINING POLYMERIZABLE GROUP
  • Compound X is a compound containing an interactive group and a polymerizable group.
  • the interactive group is intended to be a functional group capable of interacting with a plating catalyst or a precursor thereof applied to the patterned layer to be plated.
  • a functional group capable of forming an electrostatic interaction with the plating catalyst or a precursor thereof.
  • a nitrogen-containing functional group, a sulfur-containing functional group, and an oxygen-containing functional group capable of forming a coordination with the plating catalyst or its precursor.
  • the polymerizable group is a functional group that can form a chemical bond by applying energy, and examples thereof include a radical polymerizable group and a cationic polymerizable group.
  • a radical polymerizable group is preferable from the viewpoint of more excellent reactivity.
  • radical polymerizable groups include acrylic acid ester groups (acryloyloxy groups), methacrylic acid ester groups (methacryloyloxy groups), itaconic acid ester groups, crotonic acid ester groups, isocrotonic acid ester groups, maleic acid ester groups, and the like.
  • Examples include unsaturated carboxylic acid ester groups, styryl groups, vinyl groups, acrylamide groups, and methacrylamide groups.
  • a methacryloyloxy group, an acryloyloxy group, a vinyl group, a styryl group, an acrylamide group, or a methacrylamide group is preferable, and a methacryloyloxy group, an acryloyloxy group, or a styryl group is more preferable.
  • compound X two or more polymerizable groups may be contained. Further, the number of polymerizable groups contained in the compound X is not particularly limited, and may be one or two or more.
  • the compound X may be a low molecular compound or a high molecular compound.
  • a low molecular weight compound intends a compound having a molecular weight of less than 1000, and a high molecular weight compound intends a compound having a molecular weight of 1000 or more.
  • the weight average molecular weight of the polymer is not particularly limited, but is preferably from 1,000 to 700,000, more preferably from 2,000 to 200,000, from the viewpoint of better handleability such as solubility. In particular, from the viewpoint of polymerization sensitivity, it is more preferably 20000 or more.
  • the method for synthesizing such a polymer having a polymerizable group and an interactive group is not particularly limited, and a known synthesis method (see paragraphs [0097] to [0125] of JP-A-2009-280905) is used.
  • a repeating unit containing a polymerizable group represented by the following formula (a) (hereinafter also referred to as a polymerizable group unit as appropriate), and an interactive group represented by the following formula (b)
  • a copolymer containing a repeating unit (hereinafter also referred to as an interactive group unit as appropriate).
  • R 1 to R 5 are each independently a hydrogen atom or a substituted or unsubstituted alkyl group (for example, a methyl group, an ethyl group, a propyl group, and Butyl group, etc.).
  • the kind of the substituent is not particularly limited, and examples thereof include a methoxy group, a chlorine atom, a bromine atom, and a fluorine atom.
  • R 1 is preferably a hydrogen atom, a methyl group, or a methyl group substituted with a bromine atom.
  • R 2 is preferably a hydrogen atom, a methyl group, or a methyl group substituted with a bromine atom.
  • R 3 is preferably a hydrogen atom.
  • R 4 is preferably a hydrogen atom.
  • R 5 is preferably a hydrogen atom, a methyl group, or a methyl group substituted with a bromine atom.
  • X, Y, and Z each independently represent a single bond or a substituted or unsubstituted divalent organic group.
  • the divalent organic group include a substituted or unsubstituted divalent aliphatic hydrocarbon group (preferably having 1 to 8 carbon atoms, for example, an alkylene group such as a methylene group, an ethylene group, and a propylene group), a substituted or unsubstituted group.
  • Unsubstituted divalent aromatic hydrocarbon group (preferably having 6 to 12 carbon atoms, for example, phenylene group), —O—, —S—, —SO 2 —, —N (R) — (R: alkyl group) ), —CO—, —NH—, —COO—, —CONH—, and a combination thereof (for example, an alkyleneoxy group, an alkyleneoxycarbonyl group, and an alkylenecarbonyloxy group).
  • X, Y, and Z are a single bond, an ester group (—COO—), an amide group (—CONH—), an ether, because the polymer is easily synthesized and the adhesion of the patterned metal layer is more excellent.
  • a group (—O—) or a substituted or unsubstituted divalent aromatic hydrocarbon group is preferable, and a single bond, an ester group (—COO—), or an amide group (—CONH—) is more preferable.
  • L 1 and L 2 each independently represent a single bond or a substituted or unsubstituted divalent organic group.
  • a divalent organic group it is synonymous with the divalent organic group described by X, Y, and Z mentioned above.
  • L 1 is an aliphatic hydrocarbon group or a divalent organic group having a urethane bond or a urea bond (for example, an aliphatic group) in that the polymer is easily synthesized and the adhesion of the patterned metal layer is more excellent.
  • Group hydrocarbon group particularly those having 1 to 9 carbon atoms in total.
  • the total number of carbon atoms of L 1 means the total number of carbon atoms contained in the divalent organic group or a substituted or unsubstituted represented by L 1.
  • L 2 is a single bond, a divalent aliphatic hydrocarbon group, a divalent aromatic hydrocarbon group, or a combination of these in terms of better adhesion of the patterned metal layer.
  • L 2 preferably has a single bond or a total carbon number of 1 to 15.
  • the total number of carbon atoms of L 2 means the total number of carbon atoms contained in the divalent organic group or a substituted or unsubstituted represented by L 2.
  • W represents an interactive group.
  • the definition of the interactive group is as described above.
  • the content of the polymerizable group unit is preferably 5 to 50 mol% with respect to all repeating units in the polymer from the viewpoints of reactivity (curability and polymerization) and suppression of gelation during synthesis, 5 to 40 mol% is more preferable.
  • the content of the interactive group unit is preferably 5 to 95 mol%, preferably 10 to 95 mol%, based on all repeating units in the polymer, from the viewpoint of adsorptivity to the plating catalyst or its precursor. More preferred.
  • R 11 to R 13 each independently represents a hydrogen atom or a substituted or unsubstituted alkyl group.
  • the unsubstituted alkyl group include a methyl group, an ethyl group, a propyl group, and a butyl group.
  • the substituted alkyl group include a methyl group, an ethyl group, a propyl group, and a butyl group substituted with a methoxy group, a chlorine atom, a bromine atom, or a fluorine atom.
  • R 11 is preferably a hydrogen atom or a methyl group.
  • R 12 is preferably a hydrogen atom.
  • R 13 is preferably a hydrogen atom.
  • L 10 represents a single bond or a divalent organic group.
  • the divalent organic group include a substituted or unsubstituted aliphatic hydrocarbon group (preferably having 1 to 8 carbon atoms), a substituted or unsubstituted aromatic hydrocarbon group (preferably having 6 to 12 carbon atoms), —O —, —S—, —SO 2 —, —N (R) — (R: alkyl group), —CO—, —NH—, —COO—, —CONH—, and a combination thereof (for example, Alkyleneoxy group, alkyleneoxycarbonyl group, alkylenecarbonyloxy group, etc.).
  • one preferred form of L 10 includes —NH—aliphatic hydrocarbon group— or —CO—aliphatic hydrocarbon group—.
  • W is synonymous with the definition of W in Formula (b), and represents an interactive group.
  • the definition of the interactive group is as described above.
  • a preferable form of W includes an ionic polar group, and a carboxylic acid group is more preferable.
  • composition Y is a composition containing a compound containing an interactive group and a compound containing a polymerizable group. That is, the to-be-plated layer precursor layer contains two kinds of a compound containing an interactive group and a compound containing a polymerizable group.
  • the definitions of the interactive group and the polymerizable group are as described above.
  • the definition of the interactive group is as described above.
  • Such a compound may be a low molecular compound or a high molecular compound.
  • a polymer for example, polyacrylic acid having a repeating unit represented by the above-described formula (b) can be mentioned.
  • a polymerizable group is not contained in the compound containing an interactive group.
  • the compound containing a polymerizable group is a so-called monomer, and is preferably a polyfunctional monomer containing two or more polymerizable groups from the viewpoint that the pattern-form plated layer to be formed is more excellent in hardness. Specifically, it is preferable to use a monomer containing 2 to 6 polymerizable groups as the polyfunctional monomer. From the viewpoint of molecular mobility during the cross-linking reaction that affects the reactivity, the molecular weight of the polyfunctional monomer used is preferably 150 to 1000, more preferably 200 to 800.
  • the compound containing a polymerizable group may contain an interactive group.
  • the mass ratio of the compound containing the interactive group and the compound containing the polymerizable group is not particularly limited. From the viewpoint of the balance between the strength and plating suitability of the patterned plated layer to be formed, 0.1 to 10 is preferable, and 0.5 to 5 is more preferable.
  • composition for forming a layer to be plated In the composition for forming a layer to be plated, other components (for example, polymerization initiator, solvent, sensitizer, curing agent, polymerization inhibitor, antioxidant, antistatic agent, filler, particle, Flame retardants, lubricants, plasticizers, etc.) may be included.
  • other components for example, polymerization initiator, solvent, sensitizer, curing agent, polymerization inhibitor, antioxidant, antistatic agent, filler, particle, Flame retardants, lubricants, plasticizers, etc.
  • the method for bringing the composition for forming a layer to be plated into contact with the substrate is not particularly limited.
  • the method for applying the composition for forming a layer to be plated on the substrate, or the substrate in the composition for forming the layer to be plated The method of immersing is mentioned.
  • the method for imparting energy to the precursor layer to be plated is not particularly limited, and examples thereof include heat treatment or exposure treatment (light irradiation treatment), and exposure treatment is preferable in that the treatment is completed in a short time.
  • heat treatment or exposure treatment light irradiation treatment
  • exposure treatment is preferable in that the treatment is completed in a short time.
  • the method in particular of providing a pattern-form energy to a to-be-plated layer precursor layer is not restrict
  • a patterned plating layer can be obtained by performing development processing on the plating layer precursor layer to which energy is applied in the pattern.
  • the development processing method is not particularly limited, and optimal development processing is performed according to the type of material used.
  • As a developing solution an organic solvent and alkaline aqueous solution are mentioned, for example.
  • the patterned to-be-plated layer precursor layer is formed on the substrate
  • the patterned to-be-plated layer can be obtained by performing an exposure process without using a photomask.
  • composition A a composition containing a compound containing an interactive group and not containing a polymerizable group
  • the application method is not particularly limited, and the application method described above can be used. Among these, the screen printing method or the ink jet method is preferable.
  • the said composition A may contain a solvent from an applicability viewpoint. When the composition A contains a solvent, it may further contain a heating step for drying the solvent after coating.
  • the compound containing an interactive group and not containing a polymerizable group contained in the composition A is not particularly limited, and a known compound can be used.
  • known compounds include, but are not limited to, polyvinyl pyrrole.
  • Step X2 is a step of deforming the substrate with the layer to be plated to obtain the substrate with the layer to be plated having a three-dimensional shape.
  • the layer to be plated is also deformed following the deformation of the substrate.
  • the method for deforming the substrate with the layer to be plated is not particularly limited, and for example, known methods such as vacuum forming, blow molding, free blow molding, pressure forming, vacuum-pressure forming, and hot press forming can be used.
  • the temperature of the heat treatment performed during the deformation is preferably a temperature equal to or higher than the thermal deformation temperature of the substrate material, and is preferably in the range of glass transition temperature (Tg) +50 to 350 ° C.
  • the form of the three-dimensional shape is not particularly limited, and may be a hemispherical shape as shown in FIG. 2A or another shape.
  • Step X3 is a step of forming a patterned metal layer on the patterned plated layer by plating the patterned plated layer in the substrate with the plated layer having a three-dimensional shape.
  • this processing method it has further the process X4 which provides a plating catalyst or its precursor to a pattern-like to-be-plated layer before process X3, or a plating catalyst or its precursor is the pattern shape of process X1. It is contained in the layer to be plated. Below, the form which implements process X4 is explained in full detail.
  • Step X4 is a step of applying a plating catalyst or a precursor thereof to the patterned layer to be plated. Since the above-mentioned interactive group is contained in the patterned layer to be plated, the above-mentioned interactive group adheres (adsorbs) the applied plating catalyst or its precursor depending on its function.
  • the plating catalyst or a precursor thereof functions as a catalyst for plating treatment and / or an electrode. Therefore, the type of plating catalyst or precursor used is appropriately determined depending on the type of plating treatment.
  • the plating catalyst used or its precursor is an electroless plating catalyst or its precursor.
  • the electroless plating catalyst or its precursor will be described in detail.
  • Any electroless plating catalyst can be used as long as it becomes an active nucleus at the time of electroless plating.
  • metals that can be electrolessly plated include Pd, Ag, Cu, Ni, Pt, Au, and Co.
  • a metal colloid may be used as the electroless plating catalyst.
  • the electroless plating catalyst precursor used in this step can be used without particular limitation as long as it can become an electroless plating catalyst by a chemical reaction.
  • the metal ions of the metals mentioned as the electroless plating catalyst are mainly used.
  • a plating treatment is performed on the patterned layer to which the plating catalyst or its precursor is applied.
  • the method for the plating treatment is not particularly limited, and examples thereof include electroless plating treatment or electrolytic plating treatment (electroplating treatment).
  • the electroless plating process may be performed alone, or after the electroless plating process, the electrolytic plating process may be further performed.
  • the procedures of the electroless plating process and the electrolytic plating process will be described in detail.
  • the electroless plating process is a process in which a metal is deposited by a chemical reaction using a solution in which metal ions to be deposited as a plating are dissolved.
  • the electroless plating treatment is performed, for example, by immersing the substrate with the layer to be plated, to which the electroless plating catalyst has been applied, in water, removing excess electroless plating catalyst (metal) and then immersing it in an electroless plating bath.
  • a known electroless plating bath can be used as the electroless plating bath used.
  • the plating bath in addition to a solvent (for example, water), metal ions for plating, a reducing agent, and additives (stabilizers) that improve the stability of metal ions are mainly included.
  • a solvent for example, water
  • additives stabilizers
  • electroplating can be performed on the patterned layer to which the catalyst or its precursor is applied.
  • an electroplating process can be performed as needed after the said electroless-plating process.
  • the thickness of the patterned metal layer to be formed can be adjusted as appropriate.
  • process X4 Although the form which implements process X4 was described above, as above-mentioned, when a plating catalyst or its precursor is contained in the pattern-like to-be-plated layer of process X1, it is not necessary to implement process X3. .
  • a patterned metal layer is formed on the patterned layer to be plated. Therefore, a desired electroconductive film can be obtained by forming a pattern-like to-be-plated layer according to the shape of the patterned metal layer to form.
  • the two electroconductive films used for the manufacturing method of the wiring board which concerns on the said embodiment may be produced by the same method, and may be produced by a different method. That is, one conductive film may be produced by a photolithography method, and the other conductive film may be produced by a printing method.
  • Method 3 for producing conductive film Also, for example, a plating layer precursor layer containing a functional group that interacts with the plating catalyst or its precursor and a polymerizable group is formed on the substrate to obtain a substrate with a plating layer precursor layer.
  • Step Z1 A step Z2 of deforming the substrate with the precursor layer to be plated to obtain the substrate with the precursor layer to be plated having a three-dimensional shape;
  • the exposed layer precursor layer to be exposed is developed to form a patterned plated layer Z4 and the patterned plated layer is plated to form a patterned metal layer on the patterned plated layer.
  • a primer layer for improving the adhesion between the substrate and the patterned layer to be plated may be disposed.
  • primer layer forming composition Preparation of primer layer forming composition
  • the following components were mixed to obtain a primer layer forming composition.
  • Cyclopentanone 98% by mass Zetpol0020 (manufactured by Zeon Corporation, hydrogenated nitrile rubber) 2% by mass
  • composition 1 for forming plated layer [Preparation of composition 1 for forming plated layer] The following components were mixed to obtain a composition 1 for forming a layer to be plated.
  • the primer layer forming composition was applied to a polycarbonate substrate (trade name: Panlite PC2151, manufactured by Teijin Ltd., thickness 125 ⁇ m) using a bar coater so as to have an average dry film thickness of 1 ⁇ m, thereby forming a primer layer.
  • the composition 1 for plating layer formation was apply
  • the substrate 1 with the patterned layer to be plated is provided with a patterned layer to be matched with the top drive pattern of True Touch (registered trademark) Evaluation kit CYTK58. -1 and a substrate 1-2 with a patterned plating layer having a patterned plating layer that matches the lower surface driving pattern.
  • the substrates 1-1 and 1-2 with the patterned plated layer were vacuum thermoformed into a hemispherical shape (see FIG. 2A).
  • the obtained substrates 1-1 and 1-2 with a hemispherical pattern-like layer to be plated are placed on a Pd catalyst-providing liquid Omnishield 1573 activator (Rohm and Haas Electronic Materials Co., Ltd.).
  • the substrate with the hemispherical layer to be plated is immersed in an aqueous solution diluted with pure water to 6% by volume and adjusted to pH 4.0 with 0.1 N HCl at 45 ° C. for 5 minutes, and then And washed twice with pure water.
  • the obtained hemispherical substrate with a layer to be plated was added to a 0.8% by volume aqueous solution of a reducing agent cycle positive PB oxide converter 60C (manufactured by Rohm and Haas Electronic Materials Co., Ltd.) at 30 ° C. It was immersed for a minute and then washed twice with pure water. Thereafter, the obtained hemispherical substrate with a layer to be plated was added with 12% by volume of M agent, 6% by volume of A agent, and 10% by volume of B agent of Circuposit 4500 (manufactured by Rohm and Haas Electronic Materials Co., Ltd.).
  • the patterned metal layers are arranged on the inner surfaces through the resin layer.
  • Each was mounted on the first mold and the second mold. Thereafter, the mold was clamped to form a mold cavity, and polycarbonate was injection molded into the mold cavity to obtain a wiring board having a hemispherical curved surface.
  • the wiring board was a touch sensor 1.
  • the shape of the first mold is a shape corresponding to the three-dimensional shape of the obtained conductive film 1-1 (matched shape)
  • the shape of the second mold is the obtained conductive film 1 -2 corresponding to the three-dimensional shape (matched shape).
  • Example 2 [Production of touch sensor 2] Touch in the same manner as in Example 1 except that a self-healing layer (Z913-3 manufactured by Aika Industry Co., Ltd.) is formed on the main surface of the substrate on the opposite side of the substrate to be plated of the substrate to be plated. Sensor 2 was produced.
  • a self-healing layer Z913-3 manufactured by Aika Industry Co., Ltd.
  • Example 3 [Production of touch sensor 3]
  • the conductive films 1-1 and 1-2 having a hemispherical curved surface are attached to the mold, the patterned metal layers are respectively directed to the mold side (in the obtained wiring board, the pattern-shaped metal layer).
  • a touch sensor 3 was obtained in the same manner as in Example 1 except that the metal layers were arranged so that the metal layers were the outermost surfaces.
  • the touch sensors 1 to 4 were confirmed to be driven as touch sensors. As a result, the touch sensors 1 and 2 were driven as a touch sensor without any problem. Further, the touch sensor 3 was scratched on the patterned metal layer and rubbed with the mold, and a part of the touch sensor 3 was disconnected, but the touch sensor was driven. On the other hand, the touch sensor 4 has air bubbles between the conductive films 1-1 and 1-2, and there is a difference in detection sensitivity within the surface of the touch sensor depending on the presence or absence of air bubbles. I could't put it to practical use as a touch sensor.

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