WO2017204357A1 - 固体レーザ装置 - Google Patents
固体レーザ装置 Download PDFInfo
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- WO2017204357A1 WO2017204357A1 PCT/JP2017/019805 JP2017019805W WO2017204357A1 WO 2017204357 A1 WO2017204357 A1 WO 2017204357A1 JP 2017019805 W JP2017019805 W JP 2017019805W WO 2017204357 A1 WO2017204357 A1 WO 2017204357A1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/05—Construction or shape of optical resonators; Accommodation of active medium therein; Shape of active medium
- H01S3/08—Construction or shape of optical resonators or components thereof
- H01S3/08018—Mode suppression
- H01S3/0804—Transverse or lateral modes
- H01S3/0805—Transverse or lateral modes by apertures, e.g. pin-holes or knife-edges
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
- H01S3/025—Constructional details of solid state lasers, e.g. housings or mountings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/05—Construction or shape of optical resonators; Accommodation of active medium therein; Shape of active medium
- H01S3/06—Construction or shape of active medium
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/05—Construction or shape of optical resonators; Accommodation of active medium therein; Shape of active medium
- H01S3/06—Construction or shape of active medium
- H01S3/0602—Crystal lasers or glass lasers
- H01S3/061—Crystal lasers or glass lasers with elliptical or circular cross-section and elongated shape, e.g. rod
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/05—Construction or shape of optical resonators; Accommodation of active medium therein; Shape of active medium
- H01S3/06—Construction or shape of active medium
- H01S3/0602—Crystal lasers or glass lasers
- H01S3/0615—Shape of end-face
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/05—Construction or shape of optical resonators; Accommodation of active medium therein; Shape of active medium
- H01S3/08—Construction or shape of optical resonators or components thereof
- H01S3/08054—Passive cavity elements acting on the polarization, e.g. a polarizer for branching or walk-off compensation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
- H01S3/11—Mode locking; Q-switching; Other giant-pulse techniques, e.g. cavity dumping
- H01S3/1123—Q-switching
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/005—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping
- H01S5/0064—Anti-reflection components, e.g. optical isolators
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
- H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
- H01S5/18361—Structure of the reflectors, e.g. hybrid mirrors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/05—Construction or shape of optical resonators; Accommodation of active medium therein; Shape of active medium
- H01S3/08—Construction or shape of optical resonators or components thereof
- H01S3/08004—Construction or shape of optical resonators or components thereof incorporating a dispersive element, e.g. a prism for wavelength selection
Definitions
- the present invention relates to a solid-state laser device provided with a laser rod made of a solid-state laser crystal as a laser medium.
- the solid-state laser device includes, for example, a resonator, a rod-shaped solid laser medium (laser rod) disposed in the resonator, an excitation light source such as a flash lamp that excites the laser rod, and an optical member such as a Q switch. It consists of. In many cases, in order to efficiently irradiate the laser rod with excitation light emitted from the excitation light source, the laser rod and the excitation light source are accommodated in at least a part of the laser chamber.
- Patent Document 1 in a solid-state laser device, return light from an optical component or the like to a laser rod is incident on an O-ring provided at an exposed root of a laser rod end from a laser chamber that houses the laser rod to burn out the O-ring. It is stated that there is a problem that the burnt residue adheres to the end face of the laser rod and damages the antireflection film on the end face of the laser rod.
- an opening smaller than the diameter of the laser rod is provided at a position facing the end face of the laser rod so that the return light does not enter the O-ring.
- a configuration in which a holder block is provided has been proposed.
- Patent Document 1 although the size of the opening of the holder block is smaller than the diameter of the laser rod, the laser light is gradually narrowed by the thermal lens effect, so that kicking occurs in a region where the laser output is extremely small. It is stated that there is no problem without being limited to.
- Patent Document 2 discloses a solid-state laser device provided with a mode limiting aperture in order to ensure the beam quality of oscillation laser light.
- the mode limiting aperture is generally provided to selectively oscillate the lowest order eigenmode.
- an optical film corresponding to the role of the element is provided on the optical surface.
- the end face of the laser rod is used as an optical film to prevent reflection.
- a membrane is provided.
- the optical film is usually provided on a smooth surface, and good adhesion to the sand surface (ground glass) portion is often not obtained.
- the ridgeline between adjacent surfaces of the optical member is often chamfered to prevent chipping, and this chamfered portion is generally a sand surface.
- a chamfered portion is not used as a light transmission region (optical path).
- the rod itself is usually the optical path, and the chamfered portion is also in the laser optical path, which is a region through which the laser light passes.
- the present inventors have found that when the laser rod is provided with a chamfered portion around the end surface, the optical film provided on the end surface may be damaged starting from the outer periphery of the end surface serving as a boundary with the chamfered portion. It was. Specifically, as described above, it has been found that when the diameter of the laser rod is small and the energy in the optical path cross section is very high, the optical film is broken.
- an object of the present invention is to provide a solid-state laser device that can be stably driven over a long period of time, with the occurrence of optical film destruction on the end face of the laser rod being suppressed.
- the solid-state laser device of the present invention is a solid-state laser device in which a laser rod is arranged in a resonator composed of a pair of mirrors.
- the laser rod has an antireflection film on the end surface, and has a chamfered portion on the periphery of the end surface,
- An end face protection member for limiting the area is provided.
- the distance between the opening defining portion of the end surface protection member and one end surface of the laser rod is preferably 0.5 mm or less.
- the opening defining portion of the end face protection member and one end face of the laser rod are in contact with each other.
- the opening defining portion of the end face protection member includes a tapered portion having a smaller opening diameter toward the laser rod side.
- the end surface protection member has a cylindrical portion that supports the opening defining portion, and the cylindrical portion is fitted and attached to an end portion on one end surface side of the laser rod. Is preferred.
- the solid-state laser device of the present invention includes a laser chamber having a columnar hole shorter than the long axis length of the laser rod, which accommodates at least a part of the laser rod, and the laser rod is inserted into the hole of the laser chamber. It is preferable that both ends of the laser rod are supported by the laser chamber in a state where both ends of the laser rod are exposed from the hole, and the cylindrical portion of the end surface protection member has a shape covering the entire side surface of the end exposed from the laser chamber. .
- the solid-state laser device of the present invention includes a laser chamber having a columnar hole shorter than the long axis length of the laser rod, which accommodates at least a part of the laser rod, and the laser rod is inserted into the hole of the laser chamber.
- the both ends of the laser rod are supported by the laser chamber in a state of being exposed from the hole, and an O-ring is provided at the exposed base from the hole of the laser chamber at the end including the end face provided with the end face protection member.
- a cover member for preventing the stray light from entering the O-ring is provided on the side surface of the laser rod closer to the end face than the O-ring.
- the end face protection member is preferably made of at least one of ceramic, glass and fluororesin.
- the laser rod is preferably made of alexandrite crystals.
- the rod diameter of the laser rod is preferably 3 mm or less.
- the solid-state laser device of the present invention is a solid-state laser device in which a laser rod is disposed in a resonator composed of a pair of mirrors.
- the laser rod includes an antireflection film on an end surface, and a chamfered portion on the periphery of the end surface. And having an opening defining portion that forms an opening having a diameter smaller than the diameter of the outer periphery of the end face at a position facing at least one end face of the laser rod, and the laser optical path region on the end face of the laser rod from the outer periphery of the end face.
- the end face protection member that restricts to the inner region is provided, it is possible to effectively suppress the occurrence of breakage in the antireflection film on the end face. Then, by suppressing the destruction of the antireflection film on the end face of the laser rod, stable driving can be performed for a long time.
- FIG. 1 Schematic perspective view of a solid-state laser device according to an embodiment Side surface schematic diagram which shows schematic structure in the side view of the solid-state laser apparatus which concerns on embodiment Plane schematic diagram showing a schematic configuration of the solid-state laser device according to the embodiment in plan view Perspective view of laser chamber Enlarged sectional view showing the vicinity of the end of the laser rod exposed from the laser chamber Laser rod end face front view and end side view Perspective view of end face protection member
- regulation part and a rod end surface Enlarged sectional view showing the vicinity of the end of the laser rod provided with the end face protection member of the design change example
- the expanded sectional view which shows the laser rod end part vicinity of the solid-state laser apparatus which concerns on 2nd Embodiment Side view showing the vicinity of the end of a laser rod provided with a cover member of a design change example
- FIG. 1 is a perspective view schematically showing the external shape of a solid-state laser device according to an embodiment of the present invention.
- FIGS. 2 and 3 are a schematic side view and a schematic plan view of the solid-state laser device according to the present embodiment, respectively, in which a part of the housing is omitted and the arrangement of internal components is schematically shown.
- the solid-state laser device 1 includes a pair of mirrors 11 and 12 constituting a resonator, a laser rod 13 disposed in the resonator, and a laser chamber 30 that houses at least a part of the laser rod 13.
- the solid-state laser device 1 further includes an aperture member 15, a polarizer (polarizer) 16, a shutter 17, a Q switch 18, and a wedge prism pair 19 as optical members between one mirror 12 and the laser rod 13. ing.
- the mirrors 11 and 12, the laser rod 13, and the optical members 15 to 19 are arranged in the housing 50.
- a part of the laser chamber 30 is exposed to the outside from the housing 50, and the flash lamp 20 is accommodated in a portion exposed from the housing 50 of the laser chamber 30.
- the housing 50 includes a base 51, a side wall portion 53, and a lid portion 55, and includes an emission opening 56 for outputting laser light to a part of the side wall portion 53.
- the pair of mirrors 11 and 12 are arranged to face each other with the laser rod 13 interposed therebetween, and constitute a linear resonator.
- the mirror 11 is a partial transmission mirror, and acts as a so-called output mirror that outputs laser light.
- the mirror 12 is a high reflection mirror and functions as a so-called rear mirror.
- the mirror 11 is a plane mirror and the mirror 12 is a concave mirror.
- the mirrors 11 and 12 may be referred to as an output mirror 11 and a rear mirror 12, respectively.
- the output mirror 11 and the rear mirror 12 face each other and are attached to each side surface in the short side direction of the side wall portion 53 that forms a part of the housing 50.
- the linear optical resonator is configured by the mirrors 11 and 12, but the solid-state laser device of the present invention is not limited to the linear resonator, and the light in the optical path. It may be provided with an L-type, Z-type, or X-type resonator structure including a prism or mirror for changing the traveling direction. On the other hand, from the viewpoint of miniaturization and cost reduction, the number of optical members is preferably small, and a linear resonator is most preferable.
- the laser rod 13 is a solid-state laser medium, for example, a solid-state laser such as alexandrite (Cr: BeAl 2 O 3 ), neodymium YAG (Nd: YAG (yttrium, aluminum, garnet)), titanium sapphire (Ti: Al 2 O 3 ), or the like.
- a crystal is processed into a rod shape.
- the rod shape is a columnar shape in which the distance between the two disks serving as end faces is longer than the diameter of the disk.
- the solid laser medium is not limited to those listed above, and other known media may be used as appropriate. In order to reduce the size of the entire apparatus, it is preferable that the laser rod 13 has a small diameter.
- the laser rod 13 is particularly preferably made of alexandrite, and the diameter of the cross section (circular cross section) perpendicular to the length direction of the laser rod 13 (hereinafter referred to as “rod diameter”) is 4 mm or less. It is preferable that The rod diameter is more preferably 3 mm or less, and further preferably 2.5 mm or less. Further, the length of the laser rod is preferably 75 mm or less, and more preferably 60 mm or less.
- the flash lamp 20 is an excitation light source that emits excitation light for exciting the laser rod 13, and the entirety including the terminals 21 provided at both ends is substantially formed in a rod shape.
- the length of the flash lamp 20 is, for example, about 10 cm.
- the length of the flash lamp 20 is defined by the length in the longitudinal direction including the terminal 21.
- Conductive wires (not shown) are connected to the two terminals 21, respectively, and the flash lamp 20 is connected to the lighting light source via the conductive wires. More specifically, for example, a xenon flash lamp or the like is applicable as the flash lamp 20.
- the excitation light source in the solid-state laser device of the present invention is not limited to the flash lamp 20 as described above, and, for example, a plurality of LEDs (light emitting diodes) are arranged in a transparent straight tube so that the whole is formed in a rod shape. A thing etc. may be applied.
- the laser chamber 30 is made of, for example, metal and configured to accommodate the laser rod 13 and the flash lamp 20.
- the laser chamber 30 has a space for accommodating the laser rod 13 and the flash lamp 20 inside, and transmits the light emitted from the flash lamp 20 to the laser rod 13 inside.
- a reflection surface is formed inside the laser chamber 30, and light emitted from the flash lamp 20 is directly applied to the laser rod 13, or reflected by the reflection surface and applied to the laser rod 13. .
- Pipes 42 and 44 are connected to the side wall of the laser chamber 30, and the laser chamber 30 is connected to a cooling device 45 through the pipes 42 and 44 as schematically shown in FIG. 3.
- the cooling device 45 is a device for cooling the laser rod 13 and the flash lamp 20.
- the cooling device 45 sends a cooling medium such as pure water into the laser chamber 30 through the pipe 42.
- the cooling device 45 receives the waste water from the laser chamber 30 through the pipe 44, lowers the temperature of the cooling medium, and sends it again to the laser chamber 30. By circulating the cooling medium in this manner, the temperature of the laser rod 13 in the laser chamber 30 can be maintained in a desired temperature range.
- FIG. 4 is a perspective view showing the external appearance of the laser chamber 30.
- the laser chamber 30 includes a first portion 31 that accommodates the flash lamp 20 and a second portion 32 that accommodates the laser rod 13.
- the first portion 31 has a hole 33 penetrating from one wall surface perpendicular to the longitudinal direction to the other wall surface as a space for accommodating the flash lamp 20, and the second portion 32 is provided with the laser rod 13.
- a hole 34 penetrating from one wall surface perpendicular to the longitudinal direction to the other wall surface is provided. That is, the two holes 33 and 34 are provided in parallel to each other along the longitudinal direction of the laser chamber 30.
- the hole 34 of the laser chamber 30 has a columnar shape shorter than the long axis length of the laser rod 13, and the laser rod 13 is supported in a state where both ends are exposed through the hole 34.
- the hole 33 is inserted and supported (see FIG. 2).
- the shape of the hole 34 is not limited to a cylindrical shape as long as the laser rod 13 can be received, and may be a prismatic shape or an elliptical column shape.
- the flash lamp 20 can be inserted into and removed from the laser chamber 30 in the longitudinal direction, in the right side in the drawing.
- the length of the first portion 31 of the laser chamber 30 in the longitudinal direction is longer than the length of the second portion 32 in the longitudinal direction. Note that the length in the longitudinal direction of the first portion 31 and the second portion 32 may be the same.
- the first portion 31 that accommodates the flash lamp 20 protrudes from the lid portion 55 of the casing 50, and the second portion 32 that accommodates the laser rod 13 is the casing 50. It is supported by the support base 23 so as to be disposed inside, and the flash lamp 20 can be replaced with the lid 55 closed.
- FIG. 5 shows an enlarged cross-sectional view of the vicinity of one end of the laser rod 13 exposed from the laser chamber 30 (region A surrounded by a broken line in FIG. 2).
- an O-ring 36 is disposed at an exposed root of the end portion 13 a of the laser rod 13 (hereinafter referred to as “rod end portion 13 a”) from the hole 34 of the laser chamber 30.
- an O-ring pressing plate 37 Adjacent to the ring 36, an O-ring pressing plate 37 having a through hole through which the laser rod 13 passes is disposed on the end surface 13 b (hereinafter referred to as “rod end surface 13 b”) side of the laser rod 13.
- the exposed root of the rod end portion 13a from the hole 34 of the laser chamber 30 means that the rod end portion 13a exposed from the hole 34 of the laser chamber 30 is closest to the laser chamber 30 side (that is, the hole 34 side). ) Part.
- the exposed root from the hole 34 of the laser chamber 30 may be referred to as an exposed root from the laser chamber.
- the O-ring 36 is fitted into the laser rod 13 and is disposed in an O-ring receiving portion provided at the end of the hole 34 of the laser chamber 30.
- the O-ring pressing plate 37 is screwed to the laser chamber 30, the O-ring 36 is biased toward the laser chamber 30 and the laser rod 13 is fixed.
- the O-ring 36 and the O-ring pressing plate 37 are basically provided at both ends of the laser rod 13 exposed from the laser chamber 30.
- FIG. 6 shows an end face front view (left figure) and an end side view (right figure) of the laser rod 13.
- the laser rod 13 has a chamfered portion 13d between an end surface 13b (hereinafter referred to as “rod end surface 13b”) and a side surface 13c (hereinafter referred to as “rod side surface 13c”). It has. That is, the laser rod 13 has a chamfered portion 13d on the outer periphery in the radial direction of the outer periphery of the end surface 13b and the outer periphery of the end surface 13b.
- the chamfered portion 13d is a sand surface.
- An antireflection film 14 is provided on the rod end surface 13b. In FIG. 6, only one end face of the laser rod is shown, but the structure is the same as both end faces.
- the antireflection film 14 is preferably provided over the entire rod end surface 13b.
- the width ⁇ of the chamfered portion 13d which corresponds to the difference between the radius of the end face the outer periphery of the laser rod 13, preferably about 2%.
- the width ⁇ of the chamfered portions 13d and 0.05 mm and the like.
- the solid-state laser apparatus in a position facing the rod end face 13b, with an opening defining portion 62 which constitutes a diameter phi 2 of the opening 61 than the diameter phi 1 of the outer periphery of the rod end face 13b
- An end face protection member 60 is provided.
- the end surface protection member 60 limits the laser light path region on the rod end surface 13b to a region inside the outer periphery of the rod end surface 13b. If without the end face protection member 60, laser rod 13 throughout a light path, the optical path cross-section is equal to a circular cross section with a diameter phi 0, by providing the end face protection member 60, the diameter phi shown by the two-dot chain line in FIG. 5 The optical path is limited to two circular cross-sectional areas.
- the laser light path region is limited to a region inside the outer periphery of the rod end surface 13b, that is, the laser light path is limited to a region inside the inner periphery of the chamfered portion 13d.
- the laser beam is not irradiated to the boundary between the rod end surface 13b and the chamfered portion 13d.
- the boundary between the rod end surface 13b and the chamfered portion 13d is a region where the coating of the optical film cannot be said to be satisfactory and the coating is easily broken.
- this boundary is not irradiated with high-energy laser light, the occurrence of coating breakdown can be suppressed. That is, by providing the end surface protection member 60, it is possible to suppress the occurrence of coating breakage on the rod end surface 13b.
- the end face protection member 60 in the present embodiment has a cylindrical portion 64 that supports the opening defining portion 62, and the cylindrical portion 64 is attached to the rod end portion 13a. It has a cap shape that fits and is attached.
- the shape of the end surface protection member 60 is not particularly limited as long as it can stably support and arrange the opening defining portion 62 in the vicinity of the rod end surface 13b. However, a cap shape that can be fitted and mounted as in the present embodiment is preferable because the placement accuracy can be easily secured.
- the opening defining portion 62 is provided in the very vicinity of the rod end surface 13b so as to cover the boundary between the rod end surface 13b and the chamfered portion 13d.
- the distance d is preferably 0.5 mm or less, more preferably 0.1 mm or less, and particularly preferably the rod end surface 13b and the opening defining portion 62 are in contact with each other.
- the distance between the opening defining portion 62 and the rod end surface 13b is provided on the opening defining portion 62 and the rod end surface 13b. It means the distance to the surface of the antireflection film 14.
- the rod end surface 13b and the opening defining portion 62 are in contact means that the surface of the antireflection film 14 provided on the rod end surface 13b and the opening defining portion 62 are in contact.
- the opening defining portion 62 of the end surface protection member 60 is provided with a tapered portion 62a whose opening diameter becomes smaller as the rod end surface 13b is closer.
- the distance between the opening defining portion 62 and the rod end face 13b is the aperture-defining portion 62, defined as the distance between the portion and the rod end face 13b located closest to the rod end surface 13b side of the portion constituting the diameter phi 2.
- the aperture-defining portion 62 defined as the distance between the portion and the rod end face 13b located closest to the rod end surface 13b side of the portion constituting the diameter phi 2.
- the distance from the rod end surface 13b to the rod end surface 13b is the distance d between the opening defining portion 62 and the rod end surface 13b.
- the end face protection member 60 may be provided on both end faces of the laser rod 13 as long as it is provided on any one end face. Even if only one of them is used, there is an effect of limiting the laser oscillation region.
- the aperture limit greatly affects the laser output.
- the end face protection member has high sensitivity to the laser output in terms of production accuracy and placement accuracy, resulting in decreased stability and increased manufacturing costs. May lead to. Therefore, it is desirable to provide the protective member only on one end face.
- the material is required to be free from damage and deformation by the laser beam and to generate less dust and outgas. Therefore, ceramic or fluororesin is suitable as the material for the opening defining portion 62.
- the entire end surface protection member 60 including the opening defining portion 62 is preferably made of at least one of ceramic or fluororesin.
- FIG. 9 is a cross-sectional view showing a first design modification of the end face protection member.
- the opening defining portion 62 is in contact with the rod end surface 13b (here, the antireflection film 14 formed on the rod end surface 13b), and the cylindrical portion 64A is a laser of the laser rod 13. It has a length that abuts against an O-ring pressing plate 37 provided at an exposed base from the chamber 30.
- the cover-like shape covering the entire exposed portion of the rod side surface 13c of the rod end portion 13a exposed from the laser chamber 30 can improve the arrangement accuracy of the opening defining portion 62 with respect to the rod end surface 13b.
- the stray light generated in the housing 50 on the O-ring 36 provided at the exposed root of the laser rod 13 from the laser chamber 30 is provided by providing the end surface protecting member 60A having a shape covering the exposed root of the laser rod 13. Can be prevented from entering.
- the end surface protecting member 60A may cause damage to the O-ring 36. Since the incidence of stray light can be suppressed, damage to the laser rod can be more effectively prevented.
- the solid-state laser device 1 includes the aperture member 15, the polarizer 16, the shutter 17, the Q switch 18, and the wedge prism pair 19 as optical members on the rear mirror 12 side of the laser rod 13.
- the aperture member 15 is disposed closest to the laser rod 13 side.
- the aperture member 15 can suppress the stray light generated in the polarizer 16, the shutter 17, the Q switch 18, the wedge prism pair 19, the rear mirror 12, and the like from traveling to the laser rod 13 side.
- the aperture member 15 has an opening in the optical path, blocks stray light that is far from the optical path toward the laser rod 13 at a relatively large angle from the optical members 16 to 19 side, and prevents the stray light from hitting the laser chamber 30. can do.
- the aperture member 15 is required to generate less dust and outgas, to absorb less laser light, and to have heat resistance. Further, a material having diffusibility with respect to laser light is desirable. Therefore, as the material of the aperture member 15, a fluororesin such as ceramic, ground glass, or polytetrafluoroethylene (PTFE) is suitable.
- PTFE polytetrafluoroethylene
- the aperture member 15 is desirably disposed between the laser chamber 30 and the other optical members 16 to 19 as in the present embodiment. Opening diameter of the aperture member 15 is preferably to the rod diameter phi 0 equal or more, and more preferably greater than rod diameter phi 0. In particular, when a laser rod having a small diameter such as a rod diameter ⁇ 0 of 4 mm or less is used as the laser rod 13 in order to reduce the size of the device and shorten the pulse of the laser beam, the aperture limitation by the aperture member 15 is limited by the laser output. Greatly affects.
- the arrangement accuracy of the aperture member 15 is high with respect to the laser output with respect to the small-diameter laser rod, if the arrangement accuracy of the aperture member 15 is low, the stability is lowered and the arrangement accuracy is increased. Leads to increased manufacturing costs. Therefore, when a small-diameter laser rod is employed, it is more desirable that the aperture diameter of the aperture member is larger than the rod diameter. However, if the aperture diameter of the aperture member is too large, the effect of blocking stray light may not be sufficiently obtained, so that it is preferably 120% or less of the rod diameter.
- the aperture shape of the aperture member 15 is preferably similar to the end surface shape of the laser rod 13.
- the aperture member 15 is disposed only on the rear mirror 12 side of the laser rod 13, but the aperture member 15 is disposed on both end surfaces of the laser rod 13 from the viewpoint of protection by blocking stray light. Is preferred.
- the aperture members 15 are arranged on both end surfaces of the laser rod 13, the requirement for the arrangement accuracy increases, leading to an increase in manufacturing cost. This is particularly noticeable when the rod has a small diameter.
- the various optical members 16 to 19 are concentratedly arranged on the rear mirror 12 side of the laser rod 13 so that the main stray light generation point is brought to one side, so that the aperture member 15 is arranged only on one side. Even so, a sufficiently high protective effect can be obtained.
- the polarizer 16 selectively extracts components linearly polarized in a predetermined direction from the oscillated laser light.
- the shutter 17 controls the emission of the laser beam, and is controlled to be opened and closed to mechanically block the emission of the laser beam.
- the Q switch 18 performs a so-called Q switch operation so as to generate a high-power pulsed laser beam.
- the solid-state laser device of the present invention is not limited to the one that generates pulsed laser light as described above, and may be configured to operate in a CW (continuous wave) manner.
- the wedge prism pair 19 is provided for performing optical system adjustment such as optical axis correction by adjusting the position and angle thereof. By providing the wedge prism pair 19, it is possible to perform optical axis adjustment with very high accuracy.
- Optical members 15 to 19 are attached to holders 25 to 29, respectively, and the holders 25 to 29 are installed on a base 51 that forms a part of the casing 50. Any of these optical members 15 to 19 may be provided as necessary.
- the solid-state laser device of the present invention may have a configuration including, for example, only a Q switch among these optical members. Good. Moreover, you may provide the other optical member as needed.
- the solid-state laser device 1 when the flash lamp 20 is turned on with the Q switch 18 in the light blocking state, the laser rod 13 is excited by the excitation light emitted therefrom, and a strong inversion distribution state is formed.
- the Q switch 18 When the Q switch 18 is in a light passing state after this state, the light stimulated and emitted from the laser rod 13 resonates between the mirrors 11 and 12 and becomes a high output giant pulse, and the output mirror 11 It is transmitted and emitted out of the resonator. Note that the flash lamp 20 and the laser rod 13 that generate heat are cooled by the refrigerant flowing in the laser chamber 30.
- the solid-state laser device 1 is provided with the end face protection member 60 on the end face 13b of the laser rod 13, the coating destruction of the antireflection film 14 on the rod end face 13b can be suppressed, and a stable laser output can be obtained for a long time.
- FIG. 10 is an enlarged cross-sectional view of the exposed portion of the laser rod from the laser chamber 30 in the design change example of the solid-state laser device of the above embodiment.
- the present design change example includes a cover member 38 that suppresses the incidence of stray light on the O-ring 36 at the exposed root of the laser rod 13 from the laser chamber 30 in the solid-state laser device 1.
- the stray light generated in the housing 50 is formed on the rod side surface 13c closer to the rod end surface 13b than the O-ring 36 fitted in the rod end portion 13a.
- a cover member 38 that prevents incidence on the ring 36 is provided.
- the cover member 38 by providing the cover member 38, stray light can be prevented from entering the O-ring 36 in the same manner as when the end surface protection member 60A shown in FIG. 9 is provided. Therefore, generation
- the cover member 38 is preferably provided at both ends of the laser rod, but only one of them may be provided. When the cover member 38 is provided only at one end of the laser rod, it is preferable to provide the cover member 38 on the side where more optical members that can cause stray light such as Q switches and polarizers are provided.
- the cover member 38 is required to generate less dust and outgas, to absorb less laser light, and to have heat resistance. Moreover, it is desirable to have a diffusibility with respect to a laser beam. Therefore, the cover member 38 is preferably made of at least one of a fluororesin such as ceramic, ground glass, or polytetrafluoroethylene (PTFE).
- a fluororesin such as ceramic, ground glass, or polytetrafluoroethylene (PTFE).
- the cover member 38 is preferably made of a soft material having high adhesion to the laser rod 13 in order to prevent stray light from entering the O-ring 36. Accordingly, fibrous ceramics or glass, or unfired fluororesin is particularly suitable.
- FIG. 11 shows an enlarged view of the vicinity of the end of the laser rod provided with the cover member 39 of the design change example.
- the cover member 39 shown in FIG. 11 is formed by winding a tape 39a made of PTFE around the rod side surface 13c a plurality of times.
- the cover member 39 configured by winding the tape 39a a plurality of times has high adhesion to the laser rod 13, and the size can be freely changed depending on the number of windings, which is preferable.
- the tape 39a is wound to such an extent that the O-ring 36 cannot be visually recognized when viewed from the rod end surface 13b side, stray light can be effectively prevented from entering the O-ring 36.
- the O-ring pressing plate may not be provided.
- the O-ring 36 a general rubber made of non-fluorine resin can be used.
- the O-ring 36 itself is made of a material that generates less dust and outgas, for example, a fluororesin rubber.
- stray light may enter the O-ring pressing plate 37 and dust and outgas may be generated.
- a material that generates less dust and outgas such as ceramic or fluororesin.
- the cover member is enlarged so that stray light is prevented from entering the O-ring pressing plate.
- the solid laser device having the configuration in which the resonator, the laser rod, and each optical member are disposed in the casing has been described.
- the present invention is not limited to the one disposed in the casing. There may be a configuration without a housing.
- the application of the solid-state laser device of the present invention is not particularly limited, and can be used for various applications.
- laser light particularly pulsed laser light
- irradiating a subject for photoacoustic wave detection is generated. It can be preferably used as a measurement light source.
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Abstract
Description
レーザロッドは、端面に反射防止膜を備え、かつ、端面の周縁に面取り部を有し、
レーザロッドの少なくとも一方の端面に対向する位置に、端面の外周の直径よりも小さい直径の開口を構成する開口規定部を有し、レーザロッドの端面におけるレーザ光路領域を端面の外周よりも内側の領域に制限する端面保護部材を備えている。
図9に示す端面保護部材60Aは、開口規定部62がロッド端面13b(ここでは、ロッド端面13bに形成されている反射防止膜14)に接触し、かつ筒状部64Aがレーザロッド13のレーザチャンバ30からの露出根元に備えられたOリング押さえ板37に突き当たる長さを有している。このようにレーザチャンバ30から露出するロッド端部13aのロッド側面13cの露出部分を全て覆うカバー状とされていることにより、開口規定部62のロッド端面13bに対する配置精度を高めることができ好ましい。また、レーザロッド13の露出根元までを覆う形状の端面保護部材60Aを備えることにより、レーザロッド13のレーザチャンバ30からの露出根元に備えられたOリング36に、筐体50内で発生した迷光が入射するのを抑制することができる。迷光が入射するとOリング36から塵やアウトガスが生じ、これらの塵やアウトガスがロッド端面に付着し、焼き付きを生じてロッド端面が損傷する場合があるが、端面保護部材60AによりOリング36への迷光の入射を抑制できるので、レーザロッドの損傷をさらに効果的に防止することができる。
本固体レーザ装置1においては、既述の通り、レーザロッド13のリアミラー12側に、光学部材として、アパーチャ部材15、ポラライザ16、シャッタ17、Qスイッチ18およびウェッジプリズムペア19を備えている。ここで、アパーチャ部材15が、最もレーザロッド13側に配置されている。このような配置により、アパーチャ部材15は、ポラライザ16、シャッタ17、Qスイッチ18、ウェッジプリズムペア19およびリアミラー12などにおいて生じた迷光のレーザロッド13側への進行を抑制することができる。アパーチャ部材15は、光路に開口を有し、光学部材16~19側から比較的大きい角度でレーザロッド13側に向かう、光路から大きくはずれた迷光を遮断し、迷光がレーザチャンバ30に当たることを防止することができる。
11 出力ミラー
12 リアミラー
13 レーザロッド
13a ロッド端部
13b ロッド端面
13c ロッド側面
13d 面取り部
14 反射防止膜
15 アパーチャ部材
16 ポラライザ
17 シャッタ
18 Qスイッチ
19 ウェッジプリズムペア
20 フラッシュランプ
21 端子
23 支持台
25~29 ホルダ
30 レーザチャンバ
31 第1の部分
32 第2の部分
33、34 孔部
36 Oリング
37 Oリング押さえ板
38、39 カバー部材
39a テープ
42、44 配管
45 冷却機器
50 筐体
51 基台
53 側壁部
55 蓋部
56 出射開口
60、60A 端面保護部材
61 開口
62 開口規定部
62a テーパ部
62b 開口規定部の突出した一部
64、64A 筒状部
Claims (10)
- 1対のミラーからなる共振器中にレーザロッドが配置される固体レーザ装置において、
前記レーザロッドは、端面に反射防止膜を備え、かつ、該端面の周縁に面取り部を有し、
前記レーザロッドの少なくとも一方の端面に対向する位置に、該端面の外周の直径よりも小さい直径の開口を構成する開口規定部を有し、前記レーザロッドの前記端面におけるレーザ光路領域を前記端面の外周よりも内側の領域に制限する端面保護部材を備えた固体レーザ装置。 - 前記端面保護部材の前記開口規定部と前記レーザロッドの前記一方の端面との距離が0.5mm以下である請求項1記載の固体レーザ装置。
- 前記端面保護部材の前記開口規定部と前記レーザロッドの前記一方の端面とが接触している請求項1記載の固体レーザ装置。
- 前記端面保護部材の前記開口規定部は、前記レーザロッド側ほど開口直径が小さくなるテーパ部を備えている請求項1から3いずれか1項記載の固体レーザ装置。
- 前記端面保護部材は、前記開口規定部を支持する筒状部を有し、該筒状部が前記レーザロッドの前記一方の端面側の端部に嵌合して装着される請求項1から4いずれか1項記載の固体レーザ装置。
- 前記レーザロッドの少なくとも一部を収容する、該レーザロッドの長軸長よりも短い柱状の孔部を有するレーザチャンバを備え、
前記レーザロッドは、前記レーザチャンバの前記孔部に挿通され、該レーザロッドの両端部が前記孔部から露出した状態で該レーザチャンバに支持されており、
前記端面保護部材の前記筒状部が、前記孔部から露出した前記端部の側面全域を覆う形状である請求項5記載の固体レーザ装置。 - 前記レーザロッドの少なくとも一部を収容する、該レーザロッドの長軸長よりも短い柱状の孔部を有するレーザチャンバを備え、
前記レーザロッドは、前記レーザチャンバの前記孔部に挿通され、該レーザロッドの両端部が前記孔部から露出した状態で該レーザチャンバに支持されており、
前記端面保護部材を備えた前記端面を含む端部の、前記孔部からの露出根元にOリングが設けられており、
前記レーザロッドの、前記Oリングよりも前記端面側の側面に、迷光の前記Oリングへの入射を妨げるカバー部材を備えた請求項1から5いずれか1項記載の固体レーザ装置。 - 前記端面保護部材は、セラミック、ガラスおよびフッ素樹脂の少なくとも1つからなる請求項1から7いずれか1項記載の固体レーザ装置。
- 前記レーザロッドはアレキサンドライト結晶からなる請求項1から8いずれか1項記載の固体レーザ装置。
- 前記レーザロッドのロッド直径は3mm以下である請求項1から9いずれか1項記載の固体レーザ装置。
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EP17802943.5A EP3467971B1 (en) | 2016-05-27 | 2017-05-26 | Solid-state laser device |
JP2018519652A JP6595712B2 (ja) | 2016-05-27 | 2017-05-26 | 固体レーザ装置 |
US16/200,117 US20190097382A1 (en) | 2016-05-27 | 2018-11-26 | Solid-state laser device |
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JPWO2017204357A1 (ja) | 2019-03-22 |
EP3467971A1 (en) | 2019-04-10 |
EP3467971B1 (en) | 2020-07-08 |
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