WO2017185344A1 - Carte de circuit imprimé d'un dispositif vestimentaire, son procédé de préparation et dispositif vestimentaire - Google Patents

Carte de circuit imprimé d'un dispositif vestimentaire, son procédé de préparation et dispositif vestimentaire Download PDF

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Publication number
WO2017185344A1
WO2017185344A1 PCT/CN2016/080722 CN2016080722W WO2017185344A1 WO 2017185344 A1 WO2017185344 A1 WO 2017185344A1 CN 2016080722 W CN2016080722 W CN 2016080722W WO 2017185344 A1 WO2017185344 A1 WO 2017185344A1
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WO
WIPO (PCT)
Prior art keywords
welding
wearable device
circuit board
wire
predetermined
Prior art date
Application number
PCT/CN2016/080722
Other languages
English (en)
Chinese (zh)
Inventor
刘鹏
马富强
孙备
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to CN201680025252.7A priority Critical patent/CN107548574A/zh
Priority to PCT/CN2016/080722 priority patent/WO2017185344A1/fr
Publication of WO2017185344A1 publication Critical patent/WO2017185344A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering

Definitions

  • the present invention relates to the field of communications technologies, and in particular, to a wearable device circuit board, a method for fabricating the same, and a wearable device.
  • the prior art adopts the manual welding method for welding, and the conventional manual welding has high requirements on the layout space (the welding area is generally 2 mm or more in diameter, the pad edge spacing is 1 mm or more), and the wearable product
  • the short and thin stacking form is generally difficult to meet; thus it is caused by the manual positioning of the operator, which is more dependent on the experience and concentration of the operator.
  • the conventional manual welding is difficult to control the welding line and the height of the solder joint, and it is easy to form a bridge, which has the risk of short circuit or structural interference; and the wearable manual solder joint is generally a key component such as battery, motor, SPK, and is electrically reliable.
  • Sexual requirements are extremely high, and conventional manual welding has a probabilistic failure.
  • the invention provides a wearable device circuit board, a preparation method thereof and a wearable device, which are used for improving the production quality and efficiency of the wearable device circuit board.
  • the present invention provides a wearable device circuit board including a substrate and an electrical component, the substrate being provided with a circuit pattern on which the circuit pattern is connected to the electrical component A pre-positioned gasket is welded through the high temperature solder paste, the pre-positioned gasket being soldered with a wire through a low temperature solder paste, the electrical component being coupled to the wire and in conductive communication with the circuit pattern through the predetermined spacer.
  • the welding of the wire is facilitated by the provision of the predetermined position gasket, the quality of the welding is improved, and the positioning of the wire during welding is facilitated by the provision of the predetermined position gasket, thereby further improving the welding effect.
  • the wearable product is welded in a small space and a variable three-dimensional space, and the layout area of the welding is miniaturized, the orientation of the welding wire is oriented, the welding height is controlled, and the reliability of the solder joint is improved.
  • robot welding, thermocompression bonding, or welding using a limited scene such as ACF (ANISOTROPIC CONDUCTIVE FILM; ACF) can be realized.
  • the pre-positioning spacer includes a soldering plate, and two limiting posts disposed on the soldering plate, and a limiting space defining the wire is formed between the two limiting posts .
  • the two relatively large surfaces of the welded plate are welded to the welded plate on one side and the wires are welded on the other side, and the wire is fixed by the limiting space formed by the limiting post, thereby facilitating the positioning during welding and the wire. Trace settings.
  • the limiting post is integrally formed with the welded plate, and is formed at one end of the welded plate.
  • the surface of the predetermined spacer has a tin plating layer. Soldering and conduction are facilitated by the tin plating provided.
  • the width of the welded plate is 0.8 to 1 mm and the thickness is 0.1 to 0.2 mm. Therefore, the area occupied by the welding can be well controlled and miniaturized.
  • the spacing between adjacent predetermined spacers is between 0.4 and 0.5 mm.
  • the embodiment of the invention further provides a method for preparing the above-mentioned wearable device circuit board, the preparation method comprising:
  • connection pad connected to the electrical component on the circuit pattern on the substrate is soldered to the predetermined spacer by a high temperature solder paste;
  • the wires are electrically connected to the electrical components.
  • the method further includes tin plating on the predetermined pad.
  • a wearable device in another aspect, includes a housing and the aforementioned wearable device circuit board within the housing.
  • the welding of the wire is facilitated by the provision of the predetermined position gasket, the quality of the welding is improved, and the positioning of the wire during welding is facilitated by the provision of the predetermined position gasket, thereby further improving the welding effect.
  • the wearable product realizes welding in a small space and a variable three-dimensional space, and the layout area of the welding is miniaturized, the orientation of the welding wire is oriented, the welding height is controlled, and the reliability of the solder joint is improved.
  • robot welding, thermocompression bonding, or welding using a limited scene such as ACF ACF (ANISOTROPIC CONDUCTIVE FILM; ACF) can be realized.
  • FIG. 1 is a schematic structural diagram of a circuit board of a wearable device according to an embodiment of the present invention
  • FIG. 2 is a schematic structural diagram of a circuit board of a wearable device according to an embodiment of the present invention
  • 3a-3d are diagrams showing a process of preparing a wearable device circuit board according to an embodiment of the present invention.
  • FIG. 1 is a schematic structural view of a circuit board according to an embodiment of the present invention
  • FIG. 2 is a schematic structural view of a pre-positioning pad provided by an embodiment of the present invention.
  • the embodiment of the present invention provides a wearable device circuit board, which includes a substrate 10 and an electrical component.
  • the substrate 10 is provided with a circuit pattern, and the circuit pattern is used for the electrical component.
  • the connection position of the piece is soldered with a pre-positioned gasket 20 by a high-temperature solder paste, the pre-positioned spacer 20 being soldered with a wire 30 through a low-temperature solder paste, the electrical component being connected to the wire 30 and passing through the predetermined spacer 20 is in conductive communication with the circuit pattern.
  • the welding of the wire 30 is facilitated by the provision of the predetermined spacer 20, the quality of the welding is improved, and the positioning of the wire 30 during welding is facilitated by the provision of the predetermined spacer 20, which is further improved.
  • the welding effect The wearable product realizes welding in a small space and a variable three-dimensional space, and the layout area of the welding is miniaturized, the orientation of the welding wire is oriented, the welding height is controlled, and the reliability of the solder joint is improved.
  • robot welding, thermocompression bonding, or welding using a limited scene such as ACF (ANISOTROPIC CONDUCTIVE FILM; ACF) can be realized.
  • the circuit board provided in this embodiment includes a substrate 10 , a predetermined pad 20 , and an electrical component.
  • the substrate 10 is provided with a circuit pattern on which the position for connecting with the electrical component is soldered.
  • a pre-positioning pad 20 is soldered to the pre-position pad 20 for soldering the wires 30 for connecting the electrical components.
  • the pre-position pad 20 is soldered to the circuit pattern by a high-temperature solder paste, and then, when the wire 30 is soldered to the pre-position pad 20, soldering is performed using a low-temperature solder paste, thereby ensuring that the wire 30 is soldered at a predetermined time.
  • the spacer 20 is placed on the spacer 20, the pre-position spacer 20 and the substrate 10 are not soldered to ensure the stability of soldering.
  • the pre-positioning spacer 20 includes a soldering plate 21, and two limiting posts 22 disposed on the soldering plate 21, and a limit is formed between the two limiting posts 22.
  • the pre-positioning pad 20 is composed of two parts, namely a soldering plate 21 and a limiting post 22, wherein the soldering plate 21 has two soldering faces for respectively matching the circuit pattern and the wire 30. Welding, the welding surface is two surfaces having a relatively large relative area on the welded plate 21.
  • the pre-position spacer 20 is provided with a limit post 22, specifically, two opposite limit posts 22 are disposed at one end of the welded plate 21, and two limit positions are provided.
  • a limiting space 23 for accommodating the wire 30 is formed between the columns 22, and the wire 30 is caught by the limiting space 23 during use, thereby facilitating the pre-positioning of the wire 30, facilitating the welding of the wire 30, and further, passing the limit
  • the bit space 23 fixes the wire 30, which facilitates the setting of the wire of the wire 30.
  • the direction of the pre-position pad 20 can be adjusted according to the actual welding condition.
  • a predetermined position pad 20 is inclined. Therefore, the wire 30 connected to the predetermined position gasket 20 can be conveniently arranged, which improves the utilization of the space inside the wearable device.
  • the limiting post 22 and the welded plate 21 are integrally formed, and are formed at one end of the welded plate 21 to be bent.
  • the limiting post 22 and the welding plate 21 are integrally formed, thereby facilitating the processing of the pre-positioning pad 20.
  • one end of the welding plate 21 extends two legs, and then two The pillars are bent upward to form a limiting column 22, and a limiting space 23 is formed between the two limiting pillars 22.
  • the surface of the predetermined spacer 20 has a tin plating layer. Soldering and conduction are facilitated by the tin plating provided.
  • the tin plating layer increases the electrical conductivity and, at the same time, facilitates soldering.
  • the welded plate 21 has a width of 0.8 to 1 mm and a thickness of 0.1 to 0.2 mm. Therefore, the area occupied by the welding can be well controlled and miniaturized.
  • the specific choice is that the width of the welded plate 21 may be any value between 0.8 mm and 1 mm, such as 0.8 mm, 0.85 mm, 0.9 mm, 0.95 mm, 1 mm, and the thickness may be between 0.1 mm, 0.15 mm, and 0.2 mm. Any value between 0.1 and 0.2 mm.
  • the spacing between adjacent predetermined spacers 20 is between 0.4 and 0.5 mm.
  • the layout area of the welding is miniaturized, and the small pitch is increased, thereby improving the utilization of the space.
  • an embodiment of the present invention further provides a method for fabricating the above-mentioned wearable device circuit board, the preparation method comprising:
  • connection point on the circuit pattern on the substrate 10 to the electrical component is predetermined by high temperature solder paste soldering Position spacer 20;
  • solder paste soldering the wire 30 for connecting the electrical component to the pre-positioning pad 20 by a low temperature solder paste
  • the wire 30 is electrically connected to the electrical component.
  • the welding of the wire 30 is facilitated by the provision of the predetermined spacer 20, the quality of the welding is improved, and the positioning of the wire 30 during welding is facilitated by the provision of the predetermined spacer 20, which is further improved.
  • Welding effect The wearable product realizes welding in a small space and a variable three-dimensional space, and the layout area of the welding is miniaturized, the orientation of the welding wire is oriented, the welding height is controlled, and the reliability of the solder joint is improved.
  • robot welding, thermocompression bonding, or welding using a limited scene such as ACF (ANISOTROPIC CONDUCTIVE FILM; ACF) can be realized.
  • Step one customizing the normalized manual welding pre-position gasket 20 (conductive metal), the diameter is 0.8-1.0mm, the thickness is 0.1-0.2mm, and the surface is tin-plated;
  • Step 2 Reserve a pad on the substrate 10, and mount it by SMT (Surface Mount Technology);
  • the circuit layer on the substrate 10 is which reserved pad is used for soldering with the pre-position pad 20, and then, as shown in FIG. 3b, passes through the high-temperature solder paste and passes through The SMT is mounted to solder the pre-positioned spacer 20 to the substrate 10.
  • Step 3 The manual welding stage is assisted by the welding preset piece, and the operator completes the high quality manual welding operation through the low temperature solder paste;
  • the wire 30 is placed to the predetermined spacer 20, and then, as shown in FIG. 3d, the wire 30 is snapped to the two limit posts of the predetermined spacer 20.
  • the limiting space 23 between the 22, and then the wire 30 is soldered to the predetermined spacer 20 by hand soldering using a low temperature solder paste.
  • the pre-position spacer 20 is used to achieve the soldering between the wire 30 and the substrate 10, thereby solving the problem of pad burn or pad off of the hand soldering.
  • the layout space can be optimized and can be made into a diameter. 1.0mm (or smaller) pitch is 0.4mm (or smaller) and is used.
  • the structure improves the welding consistency, can prevent the wire from being aligned (avoiding the formation of bridging, the risk of short circuit or structural interference), and can prevent the inconsistency of the solder joint height and the inconsistency of the solder joint size; Welding reliability has been improved, resulting in reduced electrical reliability (short circuit or virtual soldering).
  • a wearable device in another aspect, includes a housing and the aforementioned wearable device circuit board within the housing.
  • the welding of the wire 30 is facilitated by the provision of the predetermined spacer 20, the quality of the welding is improved, and the positioning of the wire 30 during welding is facilitated by the provision of the predetermined spacer 20, which is further improved.
  • the welding effect The wearable product realizes welding in a small space and a variable three-dimensional space, and the layout area of the welding is miniaturized, the orientation of the welding wire is oriented, the welding height is controlled, and the reliability of the solder joint is improved.
  • robot welding, thermocompression bonding, or welding using a limited scene such as ACF (ANISOTROPIC CONDUCTIVE FILM; ACF) can be realized.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Combinations Of Printed Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

L'invention porte sur une carte de circuit imprimé d'un dispositif vestimentaire. La carte de circuit imprimé comprend un substrat et un composant électrique. Un motif de circuit est disposé sur le substrat, un joint de pré-positionnement est soudé sur une position de connexion avec le composant électrique du motif de circuit au moyen d'une pâte à braser à haute température, un fil est soudé sur le joint de pré-positionnement au moyen d'une pâte à braser à basse température, et le composant électrique est connecté au fil et communique de manière conductrice avec le motif de circuit au moyen du joint de pré-positionnement. Dans la solution technique, en disposant un joint de pré-positionnement, le soudage d'un fil est facilité, et la qualité du soudage est améliorée, et en disposant le joint de pré-positionnement, la localisation du fil pendant le soudage est facilitée, et l'effet de soudage est encore amélioré. Le soudage d'un produit vestimentaire dans un petit espace et un espace tridimensionnel changeant est terminé. Les objectifs de la miniaturisation de la zone d'implantation du soudage, de l'orientation de la sortie de soudage, de la gestion et de la commande de la hauteur d'un joint à brasure tendre, et de l'amélioration de la fiabilité du joint à brasure tendre sont obtenus.
PCT/CN2016/080722 2016-04-29 2016-04-29 Carte de circuit imprimé d'un dispositif vestimentaire, son procédé de préparation et dispositif vestimentaire WO2017185344A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201680025252.7A CN107548574A (zh) 2016-04-29 2016-04-29 一种穿戴设备电路板及其制备方法、穿戴设备
PCT/CN2016/080722 WO2017185344A1 (fr) 2016-04-29 2016-04-29 Carte de circuit imprimé d'un dispositif vestimentaire, son procédé de préparation et dispositif vestimentaire

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2016/080722 WO2017185344A1 (fr) 2016-04-29 2016-04-29 Carte de circuit imprimé d'un dispositif vestimentaire, son procédé de préparation et dispositif vestimentaire

Publications (1)

Publication Number Publication Date
WO2017185344A1 true WO2017185344A1 (fr) 2017-11-02

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PCT/CN2016/080722 WO2017185344A1 (fr) 2016-04-29 2016-04-29 Carte de circuit imprimé d'un dispositif vestimentaire, son procédé de préparation et dispositif vestimentaire

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WO (1) WO2017185344A1 (fr)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202907340U (zh) * 2012-10-19 2013-04-24 佛山市顺德区和而泰电子科技有限公司 一种镶嵌式电路板
CN204560052U (zh) * 2015-05-08 2015-08-12 宁波晨翔电子有限公司 一种固定底座
CN204652783U (zh) * 2015-05-21 2015-09-16 深圳市七九科技有限公司 一种智能穿戴功能模块标准化封装结构

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19640058C2 (de) * 1996-09-30 1999-06-10 Heraeus Sensor Nite Gmbh Leiterplatte mit Zugentlastung für Anschluß-Kabel, Verfahren zu deren Herstellung und Verbindung sowie deren Verwendung
JP2005229138A (ja) * 2005-05-11 2005-08-25 Kyocera Corp 配線基板
US9167698B2 (en) * 2010-06-30 2015-10-20 Kitagawa Industries Co., Ltd. Surface mount clip
CN203707382U (zh) * 2013-12-24 2014-07-09 江苏超力电器有限公司 一种新型pcb线路板与导线连接端子连接结构

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202907340U (zh) * 2012-10-19 2013-04-24 佛山市顺德区和而泰电子科技有限公司 一种镶嵌式电路板
CN204560052U (zh) * 2015-05-08 2015-08-12 宁波晨翔电子有限公司 一种固定底座
CN204652783U (zh) * 2015-05-21 2015-09-16 深圳市七九科技有限公司 一种智能穿戴功能模块标准化封装结构

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