WO2017185344A1

WO2017185344A1 - Circuit board of wearable device, preparation method therefor, and wearable device

Info

Publication number: WO2017185344A1
Application number: PCT/CN2016/080722
Authority: WO
Inventors: 刘鹏; 马富强; 孙备
Original assignee: 华为技术有限公司
Priority date: 2016-04-29
Filing date: 2016-04-29
Publication date: 2017-11-02
Also published as: CN107548574A

Abstract

A circuit board of a wearable device. The circuit board comprises a substrate and an electrical component. A circuit pattern is arranged on the substrate, a pre-locating gasket is welded on a position for connection with the electrical component of the circuit pattern by means of a high-temperature solder paste, a wire is welded on the pre-locating gasket by means of a low-temperature solder paste, and the electrical component is connected to the wire and conductively communicates with the circuit pattern by means of the pre-locating gasket. In the technical solution, by arranging a pre-locating gasket, the welding of a wire is facilitated, and the quality of welding is improved, and by arranging the pre-locating gasket, the locating of the wire during welding is facilitated, and the welding effect is further improved. The welding of a wearable product in a small space and a changing three-dimensional space is completed. The goals of the miniaturization of the layout area of welding, orientation of welding outlet, the management and control of the height of a solder joint, and the improvement of the reliability of the solder joint are achieved.

Description

Wearable device circuit board, preparation method thereof, wearable device

Technical field

The present invention relates to the field of communications technologies, and in particular, to a wearable device circuit board, a method for fabricating the same, and a wearable device.

Background technique

At present, most of the wearable products of the terminal need to be welded in a small space and a variety of three-dimensional space, mechanical welding, thermo-compression welding; ACF (ANISOTROPIC CONDUCTIVE FILM; ACF) welding methods are not Good productization, most of the current products are still hand-welded, and the wearable products have high requirements on the layout area of the welding, the direction of the welding leads, the control of the height of the solder joints, and the reliability of the solder joints;

In order to ensure the processing and mass production, the prior art adopts the manual welding method for welding, and the conventional manual welding has high requirements on the layout space (the welding area is generally 2 mm or more in diameter, the pad edge spacing is 1 mm or more), and the wearable product The short and thin stacking form is generally difficult to meet; thus it is caused by the manual positioning of the operator, which is more dependent on the experience and concentration of the operator. In addition, the conventional manual welding is difficult to control the welding line and the height of the solder joint, and it is easy to form a bridge, which has the risk of short circuit or structural interference; and the wearable manual solder joint is generally a key component such as battery, motor, SPK, and is electrically reliable. Sexual requirements are extremely high, and conventional manual welding has a probabilistic failure.

Summary of the invention

The invention provides a wearable device circuit board, a preparation method thereof and a wearable device, which are used for improving the production quality and efficiency of the wearable device circuit board.

In order to solve the above technical problem, the present invention provides a wearable device circuit board including a substrate and an electrical component, the substrate being provided with a circuit pattern on which the circuit pattern is connected to the electrical component A pre-positioned gasket is welded through the high temperature solder paste, the pre-positioned gasket being soldered with a wire through a low temperature solder paste, the electrical component being coupled to the wire and in conductive communication with the circuit pattern through the predetermined spacer.

In the above technical solution, the welding of the wire is facilitated by the provision of the predetermined position gasket, the quality of the welding is improved, and the positioning of the wire during welding is facilitated by the provision of the predetermined position gasket, thereby further improving the welding effect. The wearable product is welded in a small space and a variable three-dimensional space, and the layout area of the welding is miniaturized, the orientation of the welding wire is oriented, the welding height is controlled, and the reliability of the solder joint is improved. In addition, after the above structure is adopted, robot welding, thermocompression bonding, or welding using a limited scene such as ACF (ANISOTROPIC CONDUCTIVE FILM; ACF) can be realized.

In a specific embodiment, the pre-positioning spacer includes a soldering plate, and two limiting posts disposed on the soldering plate, and a limiting space defining the wire is formed between the two limiting posts . During welding, the two relatively large surfaces of the welded plate are welded to the welded plate on one side and the wires are welded on the other side, and the wire is fixed by the limiting space formed by the limiting post, thereby facilitating the positioning during welding and the wire. Trace settings.

In a specific arrangement, the limiting post is integrally formed with the welded plate, and is formed at one end of the welded plate.

In the above embodiment, in order to improve the conductive effect at the time of soldering, the surface of the predetermined spacer has a tin plating layer. Soldering and conduction are facilitated by the tin plating provided.

In the specific setting, in order to control the solder joints well, it is preferable that the width of the welded plate is 0.8 to 1 mm and the thickness is 0.1 to 0.2 mm. Therefore, the area occupied by the welding can be well controlled and miniaturized.

In addition, when the circuit board provided in this embodiment uses a plurality of predetermined spacers, the spacing between adjacent predetermined spacers is between 0.4 and 0.5 mm. Thereby, the layout area of the welding is miniaturized, and the small pitch is increased, thereby improving the utilization of the space.

The embodiment of the invention further provides a method for preparing the above-mentioned wearable device circuit board, the preparation method comprising:

a connection pad connected to the electrical component on the circuit pattern on the substrate is soldered to the predetermined spacer by a high temperature solder paste;

Soldering a wire for connecting electrical components with a low temperature solder paste on a predetermined spacer;

The wires are electrically connected to the electrical components.

In a specific technical solution, the method further includes tin plating on the predetermined pad.

In another aspect, a wearable device is provided that includes a housing and the aforementioned wearable device circuit board within the housing.

In the above technical solution, the welding of the wire is facilitated by the provision of the predetermined position gasket, the quality of the welding is improved, and the positioning of the wire during welding is facilitated by the provision of the predetermined position gasket, thereby further improving the welding effect. The wearable product realizes welding in a small space and a variable three-dimensional space, and the layout area of the welding is miniaturized, the orientation of the welding wire is oriented, the welding height is controlled, and the reliability of the solder joint is improved. In addition, after the above structure is adopted, robot welding, thermocompression bonding, or welding using a limited scene such as ACF ACF (ANISOTROPIC CONDUCTIVE FILM; ACF) can be realized.

DRAWINGS

1 is a schematic structural diagram of a circuit board of a wearable device according to an embodiment of the present invention;

2 is a schematic structural diagram of a circuit board of a wearable device according to an embodiment of the present invention;

3a-3d are diagrams showing a process of preparing a wearable device circuit board according to an embodiment of the present invention.

Reference mark:

10-substrate 20-predetermined spacer 21-welded board

22-limit column 23-limit space 30-wire

detailed description

Specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. It is to be understood that the specific embodiments described herein are merely illustrative and not restrictive.

1 and FIG. 2, FIG. 1 is a schematic structural view of a circuit board according to an embodiment of the present invention, and FIG. 2 is a schematic structural view of a pre-positioning pad provided by an embodiment of the present invention.

The embodiment of the present invention provides a wearable device circuit board, which includes a substrate 10 and an electrical component. The substrate 10 is provided with a circuit pattern, and the circuit pattern is used for the electrical component. The connection position of the piece is soldered with a pre-positioned gasket 20 by a high-temperature solder paste, the pre-positioned spacer 20 being soldered with a wire 30 through a low-temperature solder paste, the electrical component being connected to the wire 30 and passing through the predetermined spacer 20 is in conductive communication with the circuit pattern.

In the above technical solution, the welding of the wire 30 is facilitated by the provision of the predetermined spacer 20, the quality of the welding is improved, and the positioning of the wire 30 during welding is facilitated by the provision of the predetermined spacer 20, which is further improved. The welding effect. The wearable product realizes welding in a small space and a variable three-dimensional space, and the layout area of the welding is miniaturized, the orientation of the welding wire is oriented, the welding height is controlled, and the reliability of the solder joint is improved. In addition, after the above structure is adopted, robot welding, thermocompression bonding, or welding using a limited scene such as ACF (ANISOTROPIC CONDUCTIVE FILM; ACF) can be realized.

In order to facilitate the understanding of the circuit board provided by the embodiment of the present invention, the following detailed description will be made in conjunction with the accompanying drawings and specific embodiments.

As shown in FIG. 1 , the circuit board provided in this embodiment includes a substrate 10 , a predetermined pad 20 , and an electrical component. The substrate 10 is provided with a circuit pattern on which the position for connecting with the electrical component is soldered. A pre-positioning pad 20 is soldered to the pre-position pad 20 for soldering the wires 30 for connecting the electrical components. And during soldering, the pre-position pad 20 is soldered to the circuit pattern by a high-temperature solder paste, and then, when the wire 30 is soldered to the pre-position pad 20, soldering is performed using a low-temperature solder paste, thereby ensuring that the wire 30 is soldered at a predetermined time. When the spacer 20 is placed on the spacer 20, the pre-position spacer 20 and the substrate 10 are not soldered to ensure the stability of soldering.

In a specific embodiment, the pre-positioning spacer 20 includes a soldering plate 21, and two limiting posts 22 disposed on the soldering plate 21, and a limit is formed between the two limiting posts 22. The limiting space 23 of the wire 30. Specifically, as shown in FIG. 2, the pre-positioning pad 20 is composed of two parts, namely a soldering plate 21 and a limiting post 22, wherein the soldering plate 21 has two soldering faces for respectively matching the circuit pattern and the wire 30. Welding, the welding surface is two surfaces having a relatively large relative area on the welded plate 21. During welding, one welding surface of the welding plate 21 is welded to the substrate 10 by a high-temperature solder paste, and the other welding surface is welded by a low-temperature solder paste. 30. In addition, in order to plan the routing of the wires 30, And the reasonable use of the space in the wearable device, the pre-position spacer 20 is provided with a limit post 22, specifically, two opposite limit posts 22 are disposed at one end of the welded plate 21, and two limit positions are provided. A limiting space 23 for accommodating the wire 30 is formed between the columns 22, and the wire 30 is caught by the limiting space 23 during use, thereby facilitating the pre-positioning of the wire 30, facilitating the welding of the wire 30, and further, passing the limit The bit space 23 fixes the wire 30, which facilitates the setting of the wire of the wire 30. As shown in FIG. 1, the direction of the pre-position pad 20 can be adjusted according to the actual welding condition. In FIG. 1, a predetermined position pad 20 is inclined. Therefore, the wire 30 connected to the predetermined position gasket 20 can be conveniently arranged, which improves the utilization of the space inside the wearable device.

In a specific arrangement, the limiting post 22 and the welded plate 21 are integrally formed, and are formed at one end of the welded plate 21 to be bent. Continuing to refer to FIG. 2, the limiting post 22 and the welding plate 21 are integrally formed, thereby facilitating the processing of the pre-positioning pad 20. Specifically, one end of the welding plate 21 extends two legs, and then two The pillars are bent upward to form a limiting column 22, and a limiting space 23 is formed between the two limiting pillars 22.

Further, in order to secure the electrical connection effect between the electrical component and the circuit layer after soldering, in the above embodiment, the surface of the predetermined spacer 20 has a tin plating layer. Soldering and conduction are facilitated by the tin plating provided. The tin plating layer increases the electrical conductivity and, at the same time, facilitates soldering.

In the specific arrangement, in order to control the solder joints well, it is preferable that the welded plate 21 has a width of 0.8 to 1 mm and a thickness of 0.1 to 0.2 mm. Therefore, the area occupied by the welding can be well controlled and miniaturized. The specific choice is that the width of the welded plate 21 may be any value between 0.8 mm and 1 mm, such as 0.8 mm, 0.85 mm, 0.9 mm, 0.95 mm, 1 mm, and the thickness may be between 0.1 mm, 0.15 mm, and 0.2 mm. Any value between 0.1 and 0.2 mm.

In addition, when the circuit board provided in this embodiment uses a plurality of predetermined spacers 20, the spacing between adjacent predetermined spacers 20 is between 0.4 and 0.5 mm. Thereby, the layout area of the welding is miniaturized, and the small pitch is increased, thereby improving the utilization of the space.

With reference to FIG. 3a to FIG. 3d, an embodiment of the present invention further provides a method for fabricating the above-mentioned wearable device circuit board, the preparation method comprising:

The connection point on the circuit pattern on the substrate 10 to the electrical component is predetermined by high temperature solder paste soldering Position spacer 20;

Soldering the wire 30 for connecting the electrical component to the pre-positioning pad 20 by a low temperature solder paste;

The wire 30 is electrically connected to the electrical component.

In the above solution, the welding of the wire 30 is facilitated by the provision of the predetermined spacer 20, the quality of the welding is improved, and the positioning of the wire 30 during welding is facilitated by the provision of the predetermined spacer 20, which is further improved. Welding effect. The wearable product realizes welding in a small space and a variable three-dimensional space, and the layout area of the welding is miniaturized, the orientation of the welding wire is oriented, the welding height is controlled, and the reliability of the solder joint is improved. In addition, after the above structure is adopted, robot welding, thermocompression bonding, or welding using a limited scene such as ACF (ANISOTROPIC CONDUCTIVE FILM; ACF) can be realized.

In order to facilitate the understanding of the method provided by the embodiments of the present invention, it will be described below in conjunction with the specific drawings and embodiments.

Step one, customizing the normalized manual welding pre-position gasket 20 (conductive metal), the diameter is 0.8-1.0mm, the thickness is 0.1-0.2mm, and the surface is tin-plated;

Step 2: Reserve a pad on the substrate 10, and mount it by SMT (Surface Mount Technology);

As shown in FIG. 3a and FIG. 3b, as shown in FIG. 3a, the circuit layer on the substrate 10 is which reserved pad is used for soldering with the pre-position pad 20, and then, as shown in FIG. 3b, passes through the high-temperature solder paste and passes through The SMT is mounted to solder the pre-positioned spacer 20 to the substrate 10.

Step 3: The manual welding stage is assisted by the welding preset piece, and the operator completes the high quality manual welding operation through the low temperature solder paste;

Specifically, as shown in FIG. 3c and FIG. 3d, as shown in FIG. 3c, the wire 30 is placed to the predetermined spacer 20, and then, as shown in FIG. 3d, the wire 30 is snapped to the two limit posts of the predetermined spacer 20. The limiting space 23 between the 22, and then the wire 30 is soldered to the predetermined spacer 20 by hand soldering using a low temperature solder paste.

It can be seen from the above description that the pre-position spacer 20 is used to achieve the soldering between the wire 30 and the substrate 10, thereby solving the problem of pad burn or pad off of the hand soldering. In addition, the layout space can be optimized and can be made into a diameter. 1.0mm (or smaller) pitch is 0.4mm (or smaller) and is used The structure improves the welding consistency, can prevent the wire from being aligned (avoiding the formation of bridging, the risk of short circuit or structural interference), and can prevent the inconsistency of the solder joint height and the inconsistency of the solder joint size; Welding reliability has been improved, resulting in reduced electrical reliability (short circuit or virtual soldering).

It is apparent that those skilled in the art can make various modifications and variations to the invention without departing from the spirit and scope of the invention. Thus, it is intended that the present invention cover the modifications and modifications of the invention

Claims

A wearable device circuit board includes a substrate and an electrical component, wherein the substrate is provided with a circuit pattern on which the connection position with the electrical component is soldered with a predetermined position pad through a high temperature solder paste a sheet, the predetermined spacer is soldered with a wire through a low temperature solder paste, the electrical component being coupled to the wire and in conductive communication with the circuit pattern through the predetermined spacer.
The wearable device circuit board according to claim 1, wherein said predetermined position spacer comprises a welded plate, and two limiting posts disposed on said welded plate, and said two limiting posts A space is defined between the defined wires.
The wearable device circuit board according to claim 2, wherein the limiting post and the welded plate are integrally formed, and are formed at one end of the welded plate.
The wearable device circuit board according to any one of claims 1 to 3, wherein the surface of the predetermined spacer has a tin plating layer.
The wearable device circuit board according to claim 4, wherein the welded plate has a width of 0.8 to 1 mm and a thickness of 0.1 to 0.2 mm.
The wearable device circuit board according to claim 4, wherein the number of the predetermined spacers is plural, and the spacing between adjacent predetermined spacers is between 0.4 and 0.5 mm.
A method of manufacturing a wearable device circuit board according to claim 1, comprising:

a connection pad connected to the electrical component on the circuit pattern on the substrate is soldered to the predetermined spacer by a high temperature solder paste;

Soldering a wire for connecting electrical components with a low temperature solder paste on a predetermined spacer;

The wires are electrically connected to the electrical components.
The method of manufacturing according to claim 7, further comprising tin plating on the pre-positioned spacer.
A wearable device, comprising: a housing and a right within the housing The wearable device circuit board according to any one of claims 1 to 6.