JPH0631715Y2 - Polarized chip type electronic component - Google Patents
Polarized chip type electronic componentInfo
- Publication number
- JPH0631715Y2 JPH0631715Y2 JP10691389U JP10691389U JPH0631715Y2 JP H0631715 Y2 JPH0631715 Y2 JP H0631715Y2 JP 10691389 U JP10691389 U JP 10691389U JP 10691389 U JP10691389 U JP 10691389U JP H0631715 Y2 JPH0631715 Y2 JP H0631715Y2
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- anode
- terminal
- cathode
- type electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Description
【考案の詳細な説明】 〔産業上の利用分野〕 本考案は有極性チップ型電子部品に関し、特に外装樹脂
によって電子部品素子の外部を被覆したチップ型電子部
品に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial application] The present invention relates to a polar chip type electronic component, and more particularly to a chip type electronic component in which the exterior of an electronic component element is covered with an exterior resin.
〔従来の技術〕 第4図,第5図は従来の有極性チップ形電子部品の外観
斜視図である。従来この種のチップ形電子部品は、素子
から導出する陽極リード(図示省略)に板状の陽極端子
13を接続する。一方、素子の表面に披着形成した陰極
層(図示省略)に陰極端子14を半田付け等の手段で接
続固定した後、絶縁性を有する外装樹脂15で被覆し、
陽極端子13と陰極端子14に切断,折り曲げ等の加工
を施して製造されている。[Prior Art] FIG. 4 and FIG. 5 are external perspective views of a conventional polar chip type electronic component. Conventionally, in this type of chip-type electronic component, a plate-shaped anode terminal 13 is connected to an anode lead (not shown) led out from the element. On the other hand, after the cathode terminal 14 is connected and fixed to a cathode layer (not shown) formed on the surface of the element by a method such as soldering, it is covered with an exterior resin 15 having an insulating property,
It is manufactured by subjecting the anode terminal 13 and the cathode terminal 14 to processing such as cutting and bending.
尚、第4図は、特許願昭61−303109号による有
極性チップ形電子部品の一例である。Incidentally, FIG. 4 shows an example of a polar chip type electronic component according to Japanese Patent Application No. 61-303109.
上述した従来の有極性チップ形電子部品は、回路基板等
の電子部品への実装時において、電子回路の極性と電子
部品の陰極が逆となる誤実装を生じやすく、その結果近
年の電子回路の高付加価値及び高信頼度化のニーズに応
じられなくなって来ている。The above-described conventional polar chip-type electronic component is apt to cause erroneous mounting in which the polarity of the electronic circuit and the cathode of the electronic component are reversed when mounted on the electronic component such as a circuit board, and as a result, the electronic circuit of recent years It is becoming impossible to meet the needs for high added value and high reliability.
本考案の目的は、逆実装を防止でき、その結果電子部品
の性能劣化の発生とこれによる電子回路動作不良の不具
合発生を皆無とすることができ、かつ回路基板への実装
効率の向上が達成できる有極性チップ形電子部品を提供
することにある。The purpose of the present invention is to prevent reverse mounting, and as a result, it is possible to eliminate the occurrence of performance deterioration of electronic components and the resulting malfunction of electronic circuits, and to improve the mounting efficiency on circuit boards. It is to provide a polar chip-type electronic component that can be used.
本考案の、有極性チップ形電子部品は、外装樹脂で被覆
した有極性チップ型電子部品素子の陽極リードから対向
する一対の外装樹脂外側面まで引き出した陽極端子と、
前記電子部品素子の陰極層から前記外装樹脂の前記陽極
端子の引き出された外側面まで引き出した陰極端子とを
有し、前記陽極端子と前記陰極端子は並列に、かつ同一
極性の端子はそれぞれ対角線上に載置されていることを
特徴として構成される。The polar chip type electronic component of the present invention comprises an anode terminal drawn from the anode lead of the polar chip type electronic component element coated with the exterior resin to a pair of outer surfaces of the exterior resin facing each other.
The cathode terminal of the electronic component element has a cathode terminal drawn from the outer surface of the anode terminal of the exterior resin drawn out, the anode terminal and the cathode terminal are in parallel, and terminals of the same polarity are diagonal lines respectively. It is characterized by being placed on top.
次に、本考案の実施例について図面を参照して説明す
る。第1図は本考案の有極性チップ型電子部品の一実施
例(固体タンタルコンデンサ)の内部構造を示す外観斜
視図、第2図は第1図の状態の素子に外装樹脂を被覆し
た外観斜視図である。固体電解コンデンサの素子1は、
タンタル粉末成形体の同一方向二側面部に、平押し成形
法等の成形技術を用い、タンタル線を両側面に互いに偏
心させた位置へ植立させた後焼結してなる焼結体を、誘
電体形成,半導体層形成,陰極導体層形成等順次加工処
理したものである。このとき一方の陽極リード2上に
は、焼結体と同様に誘電体、半導体層、陰極導体層が形
成されているため、希塩酸で溶解し後工程の接合の妨害
とならない様にする。又、陽極リードの植立部に絶縁性
の樹脂を塗布しておくと溶解時のレベル出しが容易とな
る。Next, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is an external perspective view showing the internal structure of an embodiment (solid tantalum capacitor) of a polar chip type electronic component of the present invention, and FIG. 2 is an external perspective view of the element in the state of FIG. 1 coated with an exterior resin. It is a figure. Element 1 of the solid electrolytic capacitor is
Using a molding technique such as a flat pressing molding method on the two side surfaces in the same direction of the tantalum powder compact, a sintered body obtained by implanting tantalum wires at positions eccentric to each other on both sides, and then sintering, It is processed sequentially such as dielectric formation, semiconductor layer formation, cathode conductor layer formation. At this time, since a dielectric, a semiconductor layer, and a cathode conductor layer are formed on one of the anode leads 2 similarly to the sintered body, they are dissolved in dilute hydrochloric acid so as not to interfere with the bonding in the subsequent process. In addition, if an insulating resin is applied to the planting portion of the anode lead, the leveling during melting becomes easy.
この素子1に植立した陽極リード2と陽極端子3を電気
溶接にて接合する。陰極端子4は素子1の陰極層6の上
面に載置し、かつ、陽極端子3と同一平面をなすように
断面 状に加工してある。素子1の上面で陽極端子3と平行に
なる様配置した陰極端子4は、導電性接着剤又は高温半
田で陰極層6と固着する。The anode lead 2 and the anode terminal 3 which are planted in this element 1 are joined by electric welding. The cathode terminal 4 is placed on the upper surface of the cathode layer 6 of the element 1 and has a cross section which is flush with the anode terminal 3. It has been processed into a shape. The cathode terminal 4 arranged so as to be parallel to the anode terminal 3 on the upper surface of the element 1 is fixed to the cathode layer 6 with a conductive adhesive or high-temperature solder.
引き続き、エポキシ樹脂等の外装樹脂5をモールド成型
法により外装被覆する。陽極、陰極はともに外装樹脂5
の内部で電気的に接続され、外装樹脂5の同一方向二外
側面に並列して配置し、導出してある。Subsequently, the exterior resin 5 such as epoxy resin is exteriorly coated by a molding method. Exterior resin 5 for both anode and cathode
Is electrically connected inside, and is arranged in parallel with two outer surfaces of the exterior resin 5 in the same direction and is led out.
第3図(a),(b)は本考案の実施例を示す外観斜視
図である。第3図(a)は、陽極,陰極端子3,4を所
定の寸法に切断し、外装樹脂5の側面に沿ってほぼ直角
に折り曲げた後、底面に沿って折り曲げた例である。3 (a) and 3 (b) are external perspective views showing an embodiment of the present invention. FIG. 3 (a) shows an example in which the anode and cathode terminals 3 and 4 are cut to a predetermined size, bent at a substantially right angle along the side surface of the exterior resin 5, and then bent along the bottom surface.
第3図(b)は陽極,陰極端子3,4を外装樹脂5の側
面に沿ってほぼ直角に折り曲げた後、底面と逆方向に折
り曲げた例である。FIG. 3 (b) shows an example in which the anode and cathode terminals 3 and 4 are bent substantially at right angles along the side surface of the exterior resin 5 and then bent in the direction opposite to the bottom surface.
以上説明したように本考案は、素子から導出する陽極端
子及び陰極端子を外装樹脂側面の対向する位置に並列に
かつ同一極性の端子をそれぞれ対角線上に配置する構造
とすることにより、 (1) 回路基板などの電子回路への実装に当って、電子
部品の左右を間違えても、陽極端子と陰極端子の極性
は、電子回路の極性と一致し、逆実装による電子部品の
性能劣化の発生とこれにより電子回路動作不良の不具合
発生は皆無とすることが出来る。As described above, according to the present invention, by arranging the anode terminal and the cathode terminal, which are led out from the device, in parallel at the opposite positions on the side surface of the exterior resin and the terminals of the same polarity, respectively, (1) When mounting on an electronic circuit such as a circuit board, the polarity of the anode and cathode terminals matches the polarity of the electronic circuit even if the electronic component is mistaken for right and left, and the performance of the electronic component may deteriorate due to reverse mounting. As a result, it is possible to eliminate the occurrence of malfunctions in electronic circuit operation.
(2) 電極端子は一方向にそろっている為、従来の四方
向端子構造と比較し、回路基板への実装効率の向上とさ
らに外装形状が正方形であっても、逆実装による不具合
発生を防止出来る。(2) Compared with the conventional four-way terminal structure, the electrode terminals are aligned in one direction, so the mounting efficiency on the circuit board is improved and even if the exterior shape is square, the occurrence of defects due to reverse mounting is prevented. I can.
等の効果が有る。And so on.
第1図は本考案の有極性チップ形電子部品の素子の斜視
図、第2図は第1図の素子に外装樹脂を施した有極性チ
ップ形電子部品の斜視図、第3図(a),(b)は陽
極,陰極端子を折り曲げ加工した本考案による他の実施
例の斜視図、第4図、第5図は、従来の有極性チップ形
電子部品の一例の外観斜視図である。 1……素子、2……陽極リード、3,13……陽極端
子、4,14……陰極端子、5,15……外装樹脂、6
……陰極層。1 is a perspective view of an element of a polar chip-type electronic component of the present invention, FIG. 2 is a perspective view of a polar chip-type electronic component obtained by applying an exterior resin to the element of FIG. 1, and FIG. 3 (a). , (B) are perspective views of another embodiment of the present invention in which the anode and cathode terminals are bent, and FIGS. 4 and 5 are external perspective views of an example of a conventional polar chip type electronic component. 1 ... Element, 2 ... Anode lead, 3, 13 ... Anode terminal, 4, 14 ... Cathode terminal, 5, 15 ... Exterior resin, 6
...... Cathode layer.
Claims (1)
品素子の陽極リードから対向する一対の外装樹脂外側面
まで引き出した陽極端子と、前記電子部品素子の陰極層
から前記外装樹脂の前記陽極端子の引き出された外側面
まで引き出した陰極端子とを有し、前記陽極端子と前記
陰極端子は並列にかつ同一極性の端子はそれぞれ対角線
上に配置されていることを特徴とする有極性チップ形電
子部品。1. An anode terminal extending from an anode lead of a polar chip-type electronic component element coated with an exterior resin to a pair of opposing outer surfaces of the exterior resin, and a cathode layer of the electronic component element and the anode of the exterior resin. Polarized chip type characterized in that it has a cathode terminal drawn out to the outer side surface from which the terminal is drawn out, the anode terminal and the cathode terminal are arranged in parallel and terminals of the same polarity are respectively arranged on diagonal lines. Electronic components.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10691389U JPH0631715Y2 (en) | 1989-09-11 | 1989-09-11 | Polarized chip type electronic component |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10691389U JPH0631715Y2 (en) | 1989-09-11 | 1989-09-11 | Polarized chip type electronic component |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0345625U JPH0345625U (en) | 1991-04-26 |
JPH0631715Y2 true JPH0631715Y2 (en) | 1994-08-22 |
Family
ID=31655633
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10691389U Expired - Lifetime JPH0631715Y2 (en) | 1989-09-11 | 1989-09-11 | Polarized chip type electronic component |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0631715Y2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6870728B1 (en) | 2004-01-29 | 2005-03-22 | Tdk Corporation | Electrolytic capacitor |
-
1989
- 1989-09-11 JP JP10691389U patent/JPH0631715Y2/en not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6870728B1 (en) | 2004-01-29 | 2005-03-22 | Tdk Corporation | Electrolytic capacitor |
Also Published As
Publication number | Publication date |
---|---|
JPH0345625U (en) | 1991-04-26 |
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