EP0843326A2 - Chip type electronic part - Google Patents
Chip type electronic part Download PDFInfo
- Publication number
- EP0843326A2 EP0843326A2 EP97120307A EP97120307A EP0843326A2 EP 0843326 A2 EP0843326 A2 EP 0843326A2 EP 97120307 A EP97120307 A EP 97120307A EP 97120307 A EP97120307 A EP 97120307A EP 0843326 A2 EP0843326 A2 EP 0843326A2
- Authority
- EP
- European Patent Office
- Prior art keywords
- electronic part
- standoff
- chip type
- capacitor
- type electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 230000000630 rising effect Effects 0.000 claims abstract description 6
- 238000000465 moulding Methods 0.000 abstract description 13
- 238000005476 soldering Methods 0.000 abstract description 8
- 239000003990 capacitor Substances 0.000 description 43
- 239000011347 resin Substances 0.000 description 10
- 229920005989 resin Polymers 0.000 description 10
- 229910000679 solder Inorganic materials 0.000 description 5
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 5
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 description 4
- 230000001965 increasing effect Effects 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
- H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
- H05K3/3426—Leaded components characterised by the leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Definitions
- the present invention relates to a chip type electronic part and, more particularly, to the configuration of the bottom of the body of a molding included in a chip type electronic part.
- a chip type solid-state electrolytic capacitor belongs to a family of electronic parts of the type described. Journal of Technical Disclosure, for example, teaches a chip type solid-state electrolytic capacitor including an anode terminal, a cathode terminal, and an upright standoff intervening between the two terminals on the bottom of the body of the product. Tapered notches extend from the upper edges of the standoff. The standoff is extended along the sides of the product except for surfaces where terminals are drawn out.
- the conventional chip type solid-state electrolytic capacitor has the following problems left unsolved.
- a chip type electronic part of the present invention has a body, two terminals drawn out from the body and facing each other, a standoff protruding from a mounting surface, and tapered notches each rising from the bottom of the standoff.
- the electronic part is implemented as a solid-state electrolytic capacitor by way of example.
- this type of capacitor is formed of tantalum.
- a tantalum wire is implanted in tantalum powder having a valve function and then subjected to compression molding and vacuum sintering.
- a dielectric oxide film has been formed on the sintered body, a semiconductor layer implemented by, e.g., MnO2 and a conductor layer are sequentially formed on the oxide film, completing a capacitor element 1.
- the tantalum wire plays the role of an anode lead 2.
- a cathode terminal 4 is connected to the capacitor element 1 by, e.g., a conductive adhesive 5 while an anode terminal 3 is welded or otherwise connected to the anode lead 2.
- the capacitor element 1, including the connecting portions of the cathode terminal 4 and anode terminal 3, and the anode lead 2 are covered with a resin 6.
- the portions of the cathode terminal 4 and anode terminal 3 protruding from the resin 6 are bent in the form of a letter L along the sides 9 and bottom 10 of the resin 6.
- the reference numeral 8 designates the body of the capacitor.
- An upright standoff 7 intervenes between the anode terminal 3 and the cathode terminal 4 and between the terminals 3 and 4 on the bottom 10 of the product. Tapered notches extend from the upper edges 12 of the standoff 7.
- the standoff 7 is extended along the sides of the product except for the surfaces where the terminals are drawn out, forming an extended standoff 11.
- the corners of the capacitor element 1 are spaced from the tapered surfaces by a distance of d 3 .
- the capacitor having the above configuration is not desirable for the reasons discussed earlier.
- the capacitor includes a capacitor element 1.
- the capacitor element 1 is made up of an anode formed of tantalum or similar metal having a valve function, and a dielectric film, MnO2 or similar semiconductor layer and graphite, silver paste or similar cathode layer sequentially formed on the anode.
- An anode lead 2 is implemented by a wire formed of metal having a valve function, and implanted or welded to the anode when the anode is formed. The anode lead 2 is welded to an anode terminal 3.
- the capacitor element 1 is connected to a cathode terminal 4 by a conductive adhesive 5 made of silver by way of example. Subsequently, the entire periphery of the capacitor element 1, a part of the anode terminal 3 and a part of the cathode terminal 4 are molded by use of a resin 6.
- a standoff 7 is provided on the bottom of the body of the capacitor 1 in parallel with a circuit board surface.
- tapered surfaces 14 are formed which rise from the edges 13 of the standoff 7 toward the outer side surfaces 9 where the anode terminal 3 and cathode terminal 4 are respectively drawn out.
- the tapered surfaces 14 should preferably be inclined by 10° to 30° relative to the horizontal. Assume that the distance between the corners of the capacitor element 1 and the tapered surfaces 14, i.e., the thickness of the mold resin is d 1 .
- FIGS. 3A and 3B show a second embodiment of the present invention.
- this embodiment also includes the mold resin 6 covering the capacitor assembly.
- this embodiment is not formed with the standoff 7 parallel to a circuit board surface on the bottom of the body.
- the standoff 7 is replaced with a standoff 7' extending in the form of a single line.
- the tapered surfaces 14 extend from the common standoff 7' to the outer sides 9 where the anode terminal 3 and cathode terminal 4 are respectively drawn out.
- the tapered surfaces 14 should preferably be inclined by an angle equal to or smaller than the angle of the first embodiment, e.g., 5° to 30° relative to the horizontal. Assume that the distance between the corners of the capacitor element 1 and the tapered surfaces 14 is d 1 .
- FIGS. 4A and 4B compare the first and second embodiments of the present invention and the conventional capacitor.
- FIG. 4A is the superposition of sections along lines C-C' of FIGS. 1B, 2B and 3B while FIG. 4B is an enlarged view showing the thick mold portion intervening between the capacitor 1 and the body 8 of the molding shown in FIG. 4A.
- the distance between the capacitor element 1 and the tapered surfaces of the mold resin 6, i.e., the thickness of the mold resin is greater in the first embodiment than in the second embodiment and greater in the second embodiment than in the conventional configuration. The greater distance allows a greater capacitor element to be accommodated in the molding without being exposed to the outside.
- FIG. 5 compares the first and second embodiments and the conventional capacitor with respect to the volume of a capacitor element which can be accommodated in the molding.
- FIG. 6 compares them with respect to a bonding strength after soldering measured by pushing each of them sideways by use of a push-pull gauge. It is to be noted that FIGS. 5 and 6 give a numerical value of 1 to the conventional capacitor and give relative numerical values to the first and second embodiments.
- the mold thickness between the capacitor element 1 and the molding body 8 can be made greater in the first embodiment than in the second embodiment and greater in the second embodiment than in the conventional capacitor. As a result, the volume of a capacitor which can be accommodated in the molding increases in the above order.
- the first and second embodiments do not include the extended standoff 11 shown in FIGS. 1A and 1B. Therefore, when the capacitor of the first or second embodiment is soldered to a circuit board, a greater amount of solder can turn round to the anode terminal 3 and cathode terminal 4 in directions A shown in FIG. 2B or 3B than in the directions A shown in FIG. 1B. Therefore, the embodiments achieve a greater bonding strength after soldering than the conventional capacitor, as shown in FIG. 6.
- the second embodiment is smaller than the first embodiment in the mold thickness between the capacitor element 1 and the bottom of the molding body 8. This, however, increases the space between the tapered surfaces 14 and the anode terminal 3 and cathode terminal 4 and thereby increases the amount of solder that can turn round to the terminals 3 and 4. As a result, the second embodiment achieves a slightly greater bonding strength after soldering than the first embodiment.
- FIGS. 7A and 7B show a third embodiment of the present invention.
- the tapered surfaces 14 rising from the bottom of the standoff 7 terminate before reaching the sides of the molding body 8 where the anode terminal 3 and cathode terminal 4 are drawn out.
- the tapered surfaces 14 are bent on the bottom of the molding body 8. This configuration also enhances the volume efficiency and bonding strength of a chip type solid-state electrolytic capacitor.
- a chip type electronic part of the present invention achieves a high volume efficiency. Therefore, a greater capacitor element, resistor element or similar electronic element can be accommodated in the conventional dimensions, enhancing a miniature, large capacity configuration. This is because a mold thickness between the electronic part and the bottom of a molding body is increased.
- the electronic part of the present invention can be soldered to a circuit board with a greater bonding strength. Specifically, a greater space is available between the bottom of the molding body and terminals, allowing a greater amount of solder to turn round to the terminals at the time of soldering.
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
Claims (3)
- A chip type electronic part comprising:a body;two terminals drawn out from said body and facing each other;a standoff protruding from a mounting surface; andtapered notches each rising from a bottom of said standoff.
- An electronic part as claimed in claim 1, wherein said standoff is in a form of a flat surface, said tapered notches each rising from an end of said flat surface.
- An electronic part as claimed in claim 1, wherein said standoff is in a form of a straight line, said tapered notches each rising from opposite sides of said line.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP30848496 | 1996-11-19 | ||
JP308484/96 | 1996-11-19 | ||
JP30848496A JP3175609B2 (en) | 1996-11-19 | 1996-11-19 | Chip type electronic components |
Publications (2)
Publication Number | Publication Date |
---|---|
EP0843326A2 true EP0843326A2 (en) | 1998-05-20 |
EP0843326A3 EP0843326A3 (en) | 1999-08-25 |
Family
ID=17981579
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP97120307A Withdrawn EP0843326A3 (en) | 1996-11-19 | 1997-11-19 | Chip type electronic part |
Country Status (3)
Country | Link |
---|---|
US (1) | US5952715A (en) |
EP (1) | EP0843326A3 (en) |
JP (1) | JP3175609B2 (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19625228C2 (en) * | 1996-06-24 | 1998-05-14 | Siemens Ag | System carrier for mounting an integrated circuit in an injection molded housing |
JP2001007268A (en) * | 1999-06-24 | 2001-01-12 | Oki Electric Ind Co Ltd | Semiconductor device and manufacture thereof |
JP4396734B2 (en) * | 2007-06-27 | 2010-01-13 | 株式会社村田製作所 | Surface mount electronic components |
US8610822B2 (en) | 2010-04-19 | 2013-12-17 | Apple Inc. | Camera alignment and mounting structures |
US8526161B2 (en) | 2010-04-19 | 2013-09-03 | Apple Inc. | Button structures for electronic devices |
US20220028622A1 (en) * | 2018-11-30 | 2022-01-27 | Panasonic Intellectual Property Management Co., Ltd. | Electrolytic capacitor and method for producing the same |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6068641A (en) * | 1984-08-27 | 1985-04-19 | Hitachi Ltd | Mounting method of semiconductor device |
JPH02112220A (en) * | 1988-10-21 | 1990-04-24 | Matsushita Electric Ind Co Ltd | Solid electrolytic capacitor with built-in fuse |
JPH03280566A (en) * | 1990-03-29 | 1991-12-11 | Nec Corp | Surface mounting type semiconductor device |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4574297A (en) * | 1981-07-15 | 1986-03-04 | Rohm Company Limited | Encapsulated semiconductor with terminals having tabs to increase solder wetting |
JPH0627959Y2 (en) * | 1988-10-20 | 1994-07-27 | ローム株式会社 | diode |
JP3238803B2 (en) * | 1993-08-24 | 2001-12-17 | ローム株式会社 | Substrate mounting structure of surface mounted polar electronic components |
JPH07230934A (en) * | 1994-02-18 | 1995-08-29 | Rohm Co Ltd | Electronic part and its substrate-mounting structure |
JPH0918016A (en) * | 1995-06-27 | 1997-01-17 | Shindengen Electric Mfg Co Ltd | Manufacture of semiconductor pressure sensor |
-
1996
- 1996-11-19 JP JP30848496A patent/JP3175609B2/en not_active Expired - Fee Related
-
1997
- 1997-11-19 EP EP97120307A patent/EP0843326A3/en not_active Withdrawn
- 1997-11-19 US US08/974,347 patent/US5952715A/en not_active Expired - Lifetime
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6068641A (en) * | 1984-08-27 | 1985-04-19 | Hitachi Ltd | Mounting method of semiconductor device |
JPH02112220A (en) * | 1988-10-21 | 1990-04-24 | Matsushita Electric Ind Co Ltd | Solid electrolytic capacitor with built-in fuse |
JPH03280566A (en) * | 1990-03-29 | 1991-12-11 | Nec Corp | Surface mounting type semiconductor device |
Non-Patent Citations (3)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 009, no. 204 (E-337), 21 August 1985 & JP 60 068641 A (HITACHI SEISAKUSHO KK), 19 April 1985 * |
PATENT ABSTRACTS OF JAPAN vol. 014, no. 336 (E-0953), 19 July 1990 & JP 02 112220 A (MATSUSHITA ELECTRIC IND CO LTD), 24 April 1990 * |
PATENT ABSTRACTS OF JAPAN vol. 016, no. 104 (E-1178), 13 March 1992 & JP 03 280566 A (NEC CORP), 11 December 1991 * |
Also Published As
Publication number | Publication date |
---|---|
EP0843326A3 (en) | 1999-08-25 |
JPH10149953A (en) | 1998-06-02 |
US5952715A (en) | 1999-09-14 |
JP3175609B2 (en) | 2001-06-11 |
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17P | Request for examination filed |
Effective date: 19991213 |
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17Q | First examination report despatched |
Effective date: 20000222 |
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AKX | Designation fees paid |
Free format text: DE GB SE |
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RAP1 | Party data changed (applicant data changed or rights of an application transferred) |
Owner name: NEC TOKIN CORPORATION |
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STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
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18D | Application deemed to be withdrawn |
Effective date: 20060411 |