TWI380518B - Method and apparatus for connecting print circuit boards - Google Patents

Method and apparatus for connecting print circuit boards Download PDF

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Publication number
TWI380518B
TWI380518B TW97106402A TW97106402A TWI380518B TW I380518 B TWI380518 B TW I380518B TW 97106402 A TW97106402 A TW 97106402A TW 97106402 A TW97106402 A TW 97106402A TW I380518 B TWI380518 B TW I380518B
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Taiwan
Prior art keywords
circuit board
mounting surface
connecting device
soldering portion
positioning
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TW97106402A
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Chinese (zh)
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TW200937754A (en
Inventor
De-Jin Chen
Yu San Hsiao
Meng-Xia Shang
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Hon Hai Prec Ind Co Ltd
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Priority to TW97106402A priority Critical patent/TWI380518B/en
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Publication of TWI380518B publication Critical patent/TWI380518B/en

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  • Coupling Device And Connection With Printed Circuit (AREA)

Description

1380518 六 [0001] [0002] [0003] [0004] [0005] [0006] ;!0!年.04.月13日修正替換頁發明說明: 【發明所屬之技術領域】 本發明是關於一種連接電路板之方法及裝置尤其是指 電性連接兩塊電路板之方法及裝置。 【先前技術】 在電子設備中常常涉及兩塊電路板間之連接,如何達成 兩塊電路板方便穩定地連接,是業界普遍關心之問題。 請參閱1998年11月17日公告之美國專利公告第 5, 836, 780號,其揭露了一種連接兩電路板之電連接器 100,凊參閱其第10圖(FIG. 10)並結合參閱其他圖所 示,該電連接器100安裝並電性連接在第一電路板4〇〇上 ,第二電路板200可以用手插入電連接器1〇〇之插槽中而 與該電連接器100電性連接,通過該電連接器1〇〇實現第 一電路板400與第二電路板200之相對固定與電性連接。 需要斷開時,可用手將第二電路板200從電連接器100之 插槽是拔出,如是可以方便地拆換第二電路板200。但是 ,連接該兩塊電路板200、400需要手工進行插入操作, 不便於自動化操作。 因此,需要提供一種能夠減少或消除上述缺點之電連接 器。 【發明内容】 因此’本發明之目的是在連接兩塊電路板時可以方便地 實現自動化操作,以提高製造效率。 本發明連接電路板之方法,其用於連接第一電路板與第 09710640#單编號 A0101 第3頁/共21頁 1013138251-0 1380518 _:__ 101年04姜13日修正替㈢頁 二電路板’包括以下步驟:在第一電路板和第二電路板 分別設置複數焊接墊;提供一個連接電路板之裝置,該 裝置具有相互成一定角度之第一安裝面與第二安裝面, 而且該裝置固定有複數導電端子,每一導電端子包括位 於第一安裝面之第一焊接部及位於第二安裝面之第二焊 接部’第一焊接部之位置分別對應第一電路板之焊接墊 設置’第二焊接部之位置分別對應第二電路板之焊接墊 設置;將連接電路板之裝置之第一安裝面安裝在第一電 路板,將第一焊接部分別與第一電路板之焊接墊焊接; 將連接電路板之裝置之第二安裝面安裝在第二電路板, 將第二焊接部分別與第二電路板之焊接墊焊接。 [0007] 本發明用於前述連接電路板之方法之連接電路板之裝置 ,其具有相互成一定角度之第一安裝面與第二安裝面, 第一安裝面與第二安裝面之相對面均鞞有便於吸取之平 面狀抓取部,而且該裝置固定有複數導電端子,每一導 電端子包括位於第一安裝面之第一焊接部及位於第二安 裝面之第二焊接部。 [0008] 與先前技術相比,本發明通過一個特製之連接電路板之 裝置以焊接之方式實現兩塊電路板之連接,方便實施自 動化操作。 【實施方式】 [〇〇〇9] 請參照第一圖到第七圖所示本發明第一實施例,連接電 路板之裝置1用於連接第一電路板2與第二電路板3 ’第一 電路板2和第二電路板3分別設置複數焊接墊20、30。本 實施例中裝置1包括第一連接裝置10及第二連接裝置12兩 09710640^^^^ A0101 第4頁/共21頁 1013138251-0 1380518 ‘ ιοί年04月13日梭正_頁 件,可並列安裝在第一電路板2兩側。當然,裝置1也可 以設置成只有一件,只安裝到第一電路板2—側;或者設 置成多件,分別在第一電.路板2每側安裝多件,例如,設 置成四件,可分別在第一電路板2每側各安裝兩件。 [0010] 第一連接裝置10及第二連接裝置12均是長形,每一連接 裝置10、12具有相互垂直的第一安裝面104、124與第二 安裝面106、126,當然第一安裝面104、124與第二安裝 面106、126的相互關係也可以設計成不是垂直角度,這 樣,第一電路板2可以傾斜地與第二電路板3連接,而不 是垂直地連接。第一安裝面104、124與第二安裝面106 、126的相對面均設有平面狀抓取部108、128,該抓取 部108、128位於連接裝置10、12中部,便於自動機(未 圖示)的吸盤以真空吸附方式抓取連接裝置10、12 »第 一連接裝置10的第一安裝面104與第二連接裝置12的第一 安裝面124相對,可以分別安裝在第一電路板2的相對兩 側面;第一連接裝置10的第二安裝面106與第二連接裝置 12的第二安裝面126在共同平面,可以安裝在第二電路板 3的同一侧面。 [0011] 在第一連接裝置10之第一安裝面104設置有三個定位柱 1 040、1 042,該三個定位柱1040、1 042—個位於中部 ,兩個靠近兩端部。其中,對應靠近兩端部之定位柱 1042之位置在第二連接裝置12之第一安裝面126及第一 電路板2上分別設有與其配合之定位孔1244、22,該定位 柱1 042、1242與第二連接裝置12及第一電路板2之相應 定位孔1244、22之配合關係設置成在第一連接裝置10之 09710640#單编號 Α0101 第5頁/共21頁 1013138251-0 1380518 101年.04月13日修正替換頁 縱長方向上之配合間隙大於其他方向。對應申部之定位 柱1040之位置也在第一電路板2上設有與其配合之定位孔 24,該定位柱1 040與相應定位孔24之配合關係設置成各 方向上之配合間隙相同。 [0012] 在第二連接裝置12之第一安裝面124也設置有三個定位柱 1240、1242,該三個定位柱1240、1242—個位於中部 ,兩個靠近兩端部。其中’對應靠近兩端部之定位柱 1242之位置在第一連接裝置10之第一安裝面1〇4及第一 電路板2上分別設有與其配合之定位孔1044、22 ’該定位 柱1242與第一連接裝置10及第一電路板2之相應定位孔 1044、22之配合關係設置成在第二連接裝置12之縱長方 向上之配合間隙大於其他方向。對應中部之定位枉1240 之位置在第一電路板2上設有與其配合之定位孔24,該定 位柱1240與相應定位孔22之配合關係設置成各方向上之 配合間隙相同。該種配合間隙之設計可以在較準確定位 之同時,提供在縱長方向上之較大誤差寬容度,有利於 降低製造難度,提高成品率,降低製造成本。 [0013]每一連接裝置10、12包括有絕緣殼體100、120及固定於 絕緣殼體100、120之複數導電端子1〇2、122。請結合參 閱第七圖所示,每一導電端子102、122包括位於第一安 裝面104、124之第一焊接部1 020、1220及位於第二安裝 面1〇δ、126之第二焊接部1〇22、1 222,第一焊接部 1 〇2〇 1220為SMT ( Surface Mount Technology表面 貼裝技術)形態,其位置分別對應第一電路板2之焊接墊 2〇設置,第二焊接部1022、1222也為SMT形態,其位置 09710640#單編號 A0101 第6頁/共21頁 1013138251-0 1380518 分別對應第二電路板3之焊接墊3〇設置 Ριοι^.04.^ 13 a [0014]女裝時,自動機(未圖示)之吸盤吸取第一連接裝置ι〇 之平面狀抓取部108,將第一連接裝置1〇之定位柱1〇4〇 、1 042穿過第一電路板2之定位孔22、24定位在第一電 路板2上,再將第一連接裝置1〇之第一焊接部1〇2〇焊接在 第電格板2之焊接墊20,該定位柱1042之長度大於第一 電路板2之厚度,請參第二圖所示,第一連接裝置10安裝 好後,定位柱1 042有部分突出在第一電路板2外。自動機 (未圖示)之吸盤吸取第二連接裝置12之平面狀抓取部 128,將其定位孔丨244套入突出在第一電路板2外之第一 連接裝置10之定位柱1042上而定位,再將第二連接裝置 12之第—焊接部1 220焊接在第一電路板2之焊接墊20。 [〇〇15]請結合參閱第二圖及第三圖所示,第一電路板2之焊接墊 20位於電路板2邊緣,而且請結合參閱第四圖及第五圖所 不’連接電路板之裝置丨焊接在第一電路板2上後,位於 第二安裝面106 ' 126之第二焊接部1022、1222超出了第 板2之邊緣。然後,可將連接電路板之裝置1之第 一安裝面106、126安裝在第二電路板3,第二焊接部 1()22、1222分別與第二電路板3之焊接墊30焊接,安裝 完成後如第六圖所示。 [0016] 請參笛、_ _ 弟八圖及第九圖所示,本發明第二實施例中導電端 子1〇2’之第二焊接部1022,改設計為T/H (Through HQle ’穿孔焊接)形態,可以提供更大之連接強度,而 其他結構不變,如絕緣殼體1〇〇’及絕緣殼體1〇〇,上之定 位杈1〇42, 09710640^·單編號 A〇1〇l 等結構與第一實施例相同,導電端子102’之 第7頁/共21頁 1013138251-0 1380518 101年04月13日按正替換百 第一焊接部1 020’也仍設計為SMT形態。 [0017] 綜合上述,本發明確已符合發明專利之要件。爰依法提 出專利申請。惟,以上所述僅為本發明之較佳實施例, 舉凡熟悉本發明之人士援依本發明之精神所作之等效修 飾或變化,皆應涵蓋在以下申請專利範圍内。 【圖式簡單說明】 [0018] 第一圖為本發明第一實施例立體分解圖; [0019] 第二圖為第一圖所示第一實施例中第一連接裝置安裝到 第一電路板之立體圖; [0020] 第三圖為第二圖所示第一連接裝置安裝到第一電路板之 前視平面圖; [0021] 第四圖為第一圖所示第一實施例中第一連接裝置及第二 連接裝置安裝到第一電路板之立體圖; [0022] 第五圖為第四圖所示第一連接裝置及第二連接裝置安裝 到第一電路板之右視平面圖; [0023] 第六圖為第一圖所示第一實施例立體組合圖; [0024] 第七圖為第二圖所示第一實施例中第一連接裝置之端子 之右視平面圖; [0025] 第八圖本發明第二實施例第一連接裝置之端子第二實施 例之右視平面圖; [0026] 第九圖為第八圖所示端子組裝到第一連接裝置之右視平 面圖。 09710640#單编號 A〇101 第8頁/共21頁 1013138251-0 1380518 ιοί年.04月i3日修正替換頁 [0027] [0028] [0029] [0030] [0031] [0032] [0033] [0034] [0035] [0036] [0037] [0038] [0039] 【主要元件符號說明】 裝置1第一連接裝置10 絕緣殼體100、120、100’ 導電端子102、122、102’ 第一焊接部 1 020、1220、1 020’ 第二焊接部 1 022、1222、1 022’ 第一安裝面104、124 定位柱 1 040、1 042、1 042’ 定位孔1044、22第二安裝面106、 抓取部108、128第二連接裝置12 定位柱1240、1242 定位孔 1244、22、24 第二安裝面126第一電路板2 焊接墊20、30第二電路板3 126 097腕0#單編號A0101 第9頁/共21頁 1013138251-01380518 [0001] [0001] [0002] [0003] [0004] [0006] ;! 0! Year. 04. Month 13 revised replacement page invention description: [Technical field of the invention] The present invention relates to a connection The method and device of the circuit board especially refer to a method and a device for electrically connecting two circuit boards. [Prior Art] In electronic devices, the connection between two boards is often involved. How to achieve two boards to facilitate stable connection is a common concern in the industry. Please refer to U.S. Patent No. 5,836,780, issued Nov. 17, the disclosure of which is incorporated herein incorporated by reference in its entirety, in As shown, the electrical connector 100 is mounted and electrically connected to the first circuit board 4, and the second circuit board 200 can be manually inserted into the slot of the electrical connector 1 to the electrical connector 100. Electrically connected, the first circuit board 400 and the second circuit board 200 are relatively fixed and electrically connected through the electrical connector 1 . When disconnection is required, the second circuit board 200 can be pulled out from the slot of the electrical connector 100 by hand, and the second circuit board 200 can be easily removed. However, connecting the two circuit boards 200, 400 requires manual insertion operations, which is not convenient for automated operation. Accordingly, it is desirable to provide an electrical connector that reduces or eliminates the above disadvantages. SUMMARY OF THE INVENTION Therefore, the object of the present invention is to facilitate automatic operation when connecting two circuit boards to improve manufacturing efficiency. The method for connecting a circuit board of the present invention is used for connecting a first circuit board with a 9791040# single number A0101 page 3 / a total of 21 pages 1013138251-0 1380518 _: _ 101 years 04 ginger 13 correction (3) page two circuit The board 'includes the steps of: respectively providing a plurality of solder pads on the first circuit board and the second circuit board; providing a device for connecting the circuit boards, the device having a first mounting surface and a second mounting surface at an angle to each other, and The device is fixed with a plurality of conductive terminals, and each of the conductive terminals includes a first soldering portion on the first mounting surface and a second soldering portion on the second mounting surface. The positions of the second soldering portions respectively correspond to the solder pads of the second circuit board; the first mounting surface of the device connecting the circuit boards is mounted on the first circuit board, and the first soldering portions are respectively soldered to the first circuit board Welding; mounting a second mounting surface of the device connected to the circuit board on the second circuit board, and soldering the second soldering portion to the solder pads of the second circuit board. [0007] The present invention is directed to the device for connecting a circuit board of the method for connecting a circuit board, which has a first mounting surface and a second mounting surface at an angle to each other, and the opposite surfaces of the first mounting surface and the second mounting surface are The device has a planar picking portion for easy suction, and the device is fixed with a plurality of conductive terminals, each of the conductive terminals including a first soldering portion on the first mounting surface and a second soldering portion on the second mounting surface. Compared with the prior art, the present invention realizes the connection of two circuit boards by means of a special device for connecting circuit boards, thereby facilitating the implementation of the automatic operation. [Embodiment] [〇〇〇9] Referring to the first embodiment of the present invention shown in the first to seventh embodiments, the device 1 for connecting a circuit board is used to connect the first circuit board 2 and the second circuit board 3' A circuit board 2 and a second circuit board 3 are provided with a plurality of solder pads 20, 30, respectively. In the embodiment, the device 1 includes a first connecting device 10 and a second connecting device 12, and the other 10,710,640^^^^ A0101, 4th page, a total of 21 pages, 1013138251-0, 1380518, ιοί, April 13th, the page is available. Side by side mounted on both sides of the first circuit board 2. Of course, the device 1 can also be arranged to have only one piece, only mounted to the side of the first circuit board 2; or set in multiple pieces, each of which is mounted on each side of the first electric circuit board 2, for example, set to four pieces. Two pieces can be mounted on each side of the first circuit board 2, respectively. [0010] The first connecting device 10 and the second connecting device 12 are each elongated, each connecting device 10, 12 has a first mounting surface 104, 124 and a second mounting surface 106, 126 perpendicular to each other, of course, the first installation The mutual relationship of the faces 104, 124 with the second mounting faces 106, 126 can also be designed to be not perpendicular, such that the first circuit board 2 can be connected obliquely to the second circuit board 3 instead of being vertically connected. The opposite faces of the first mounting faces 104, 124 and the second mounting faces 106, 126 are each provided with planar gripping portions 108, 128 which are located in the middle of the connecting devices 10, 12 for facilitating the automatic machine (not The suction cup of the figure is gripped by vacuum suction means 10, 12. The first mounting surface 104 of the first connecting device 10 is opposite to the first mounting surface 124 of the second connecting device 12, and can be respectively mounted on the first circuit board. The opposite sides of the second mounting surface 10 of the first connecting device 10 and the second mounting surface 126 of the second connecting device 12 are coplanar and can be mounted on the same side of the second circuit board 3. [0011] The first mounting surface 104 of the first connecting device 10 is provided with three positioning posts 1 040, 1042, which are located in the middle and two near the two ends. The positioning posts 1042 and 22 corresponding to the positioning posts 1042 of the second connecting device 12 are respectively disposed on the first mounting surface 126 of the second connecting device 12 and the positioning holes 1244 and 22, and the positioning posts 1404, 22 are respectively disposed. The mating relationship between 1242 and the second connecting device 12 and the corresponding positioning holes 1244, 22 of the first circuit board 2 is set to be 9771040# in the first connecting device 10, single number Α 0101, 5 pages, total 21 pages, 1013138251-0 1380518 101 On April 13th, the matching gap in the longitudinal direction of the replacement page is corrected to be larger than the other directions. The position of the column 1040 corresponding to the application portion is also provided with a positioning hole 24 matched with the first circuit board 2, and the matching relationship between the positioning column 1 040 and the corresponding positioning hole 24 is set to be the same in the matching direction in each direction. [0012] The first mounting surface 124 of the second connecting device 12 is also provided with three positioning posts 1240, 1242, one of which is located in the middle and two near the two ends. Wherein the position of the positioning post 1242 corresponding to the two end portions is respectively provided on the first mounting surface 1〇4 of the first connecting device 10 and the first circuit board 2 with the positioning holes 1044, 22 ′ which are matched with the positioning post 1242 The mating relationship with the corresponding positioning holes 1044, 22 of the first connecting device 10 and the first circuit board 2 is such that the matching gap in the longitudinal direction of the second connecting device 12 is larger than the other directions. A positioning hole 24 is formed on the first circuit board 2 at a position corresponding to the positioning position 1240 of the middle portion. The matching relationship between the positioning column 1240 and the corresponding positioning hole 22 is set to be the same as the matching clearance in each direction. The design of the matching gap can provide a large error latitude in the longitudinal direction while being accurately positioned, which is advantageous for reducing manufacturing difficulty, improving yield, and reducing manufacturing cost. Each of the connecting devices 10, 12 includes an insulative housing 100, 120 and a plurality of conductive terminals 1 , 2, 122 secured to the insulative housings 100, 120. As shown in the seventh figure, each of the conductive terminals 102, 122 includes a first soldering portion 1 020, 1220 at the first mounting surface 104, 124 and a second solder portion at the second mounting surface 1 〇 δ, 126. 1〇22, 1 222, the first soldering portion 1 〇2〇1220 is in the form of SMT (Surface Mount Technology), and the positions thereof are respectively corresponding to the solder pads 2〇 of the first circuit board 2, and the second soldering portion 1022 1222 is also in the form of SMT, its position is 09910640# single number A0101 page 6 / 21 pages 1013138251-0 1380518 respectively corresponding to the solder pad 3 of the second circuit board 3 Ρ οιοι^.04.^ 13 a [0014] female When loading, the suction cup of the automaton (not shown) sucks the planar gripping portion 108 of the first connecting device ι, and passes the positioning posts 1〇4〇, 1042 of the first connecting device 1 through the first circuit board. The positioning holes 22 and 24 of the second positioning device 22 are positioned on the first circuit board 2, and the first soldering portion 1〇2 of the first connecting device 1 is soldered to the soldering pad 20 of the first cell 2, and the positioning post 1042 is The length is greater than the thickness of the first circuit board 2, as shown in the second figure, after the first connecting device 10 is installed, positioning The pillar 1 042 partially protrudes outside the first circuit board 2. The suction cup of the automatic machine (not shown) sucks the planar gripping portion 128 of the second connecting device 12, and inserts the positioning hole 244 into the positioning post 1042 of the first connecting device 10 protruding from the first circuit board 2. For the positioning, the first soldering portion 1 220 of the second connecting device 12 is soldered to the solder pad 20 of the first circuit board 2. [〇〇15] Please refer to the second and third figures, the solder pad 20 of the first circuit board 2 is located at the edge of the circuit board 2, and please refer to the fourth and fifth figures to not connect the circuit board. After the device is soldered to the first circuit board 2, the second soldering portions 1022, 1222 at the second mounting surface 106' 126 extend beyond the edge of the second board 2. Then, the first mounting faces 106, 126 of the device 1 for connecting the circuit boards can be mounted on the second circuit board 3, and the second soldering portions 1 (22, 1222) are respectively soldered to the solder pads 30 of the second circuit board 3, and mounted. After completion, as shown in the sixth figure. [0016] Please show the flute, _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The welding) form can provide greater joint strength, while other structures are unchanged, such as the insulating case 1〇〇' and the insulating case 1〇〇, the positioning on the top 〇1〇42, 09710640^·single number A〇1 The structure of 〇1 and the like is the same as that of the first embodiment, and the 7th page of the conductive terminal 102'/the 21st page 1013138251-0 1380518 is replaced by the positive replacement of the first welding part 1 020'. . [0017] In summary, the present invention has indeed met the requirements of the invention patent.提 Submit a patent application in accordance with the law. However, the above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art in light of the spirit of the present invention are intended to be included in the following claims. BRIEF DESCRIPTION OF THE DRAWINGS [0018] The first figure is an exploded perspective view of a first embodiment of the present invention; [0019] The second figure is a first embodiment of the first embodiment shown in the first figure mounted to the first circuit board [0020] The third figure is a front plan view of the first connecting device shown in the second figure before being mounted to the first circuit board; [0021] The fourth figure is the first connecting device in the first embodiment shown in the first figure. And a perspective view of the second connecting device mounted to the first circuit board; [0022] FIG. 5 is a right side plan view showing the first connecting device and the second connecting device shown in FIG. 4 mounted to the first circuit board; [0023] 6 is a perspective view of the first embodiment shown in the first figure; [0024] FIG. 7 is a right side plan view of the terminal of the first connecting device in the first embodiment shown in the second figure; [0025] A right side plan view of a second embodiment of the terminal of the first connecting device of the second embodiment of the present invention; [0026] The ninth drawing is a right side plan view of the terminal shown in the eighth figure assembled to the first connecting device. 09710640#单号A〇101 Page 8/Total 21 Page 1013138251-0 1380518 ιοί年.04月I3日修正 replacement page [0027] [0028] [0033] [0033] [0036] [0010] [Major component symbol description] Device 1 first connection device 10 Insulating housing 100, 120, 100' conductive terminals 102, 122, 102' first Welding part 1 020, 1220, 1 020' second welding part 1 022, 1222, 1 022' first mounting surface 104, 124 positioning column 1 040, 1042, 1042' positioning hole 1044, 22 second mounting surface 106 Grasping portion 108, 128 second connecting device 12 positioning post 1240, 1242 positioning hole 1244, 22, 24 second mounting surface 126 first circuit board 2 solder pad 20, 30 second circuit board 3 126 097 wrist 0# single No. A0101 Page 9 / Total 21 Page 1013138251-0

Claims (1)

1380518 .1-01.年.04.月13日修正替换頁 七、申請專利範圍: 1 . 一種連接電路板之方法,其用於連接第一電路板與第二電 路板,包括以下步驟: 在第一電路板和第二電路板分別設置複數焊接墊; 提供一個連接電路板之裝置,該裝置具有相互成一定角度 之第一安裝面與第二安裝面,而且該裝置固定有複數導電 端子,每一導電端子包括位於第一安裝面之第一焊接部及 位於第二安裝面之第二焊接部,第一焊接部之位置分別對 應第一電路板之焊接墊設置,第二焊接部之位置分別對應 第二電路板之焊接墊設置; 將連接電路板之裝置之第一安裝面安裝在第一電路板,第 一焊接部分別與第一電路板之焊接墊焊接; 將連接電路板之裝置之第二安裝面安裝在第二電路板,第 二焊接部分別與第二電路板之焊接墊焊接; 前述第一電路板之焊接墊位於電路板邊緣,而且焊接在第 一電路板上後,位於第二安裝面之第二焊接部超出了第一 電路板之邊緣,前述連接電路板之裝置包括第一連接裝置 及第二連接裝置,第一連接裝置之第一安裝面與第二連接 裝置之第一安裝面相對,第一連接裝置之第二安裝面與第 二連接裝置之第二安裝面在共同平面,第一連接裝置之第 一安裝面設置有定位柱’在第二連接裝置之第一安裝面及 第一電路板上對應設有與第一連接裝置之定位柱配合之定 位孔;在將連接電路板之裝置之第一安裝面安裝到第一電 路板時,是先將第一連接裝置之定位柱穿過第一電路板之 定位孔定位在第一電路板上,再將第一連接裝置之第一焊 __产單编號A0101 第10頁/共21頁 1013138251-0 1380518 ιοί年·〇4月Ϊ3日梭正養換頁 接部焊接在第一電路板之焊接墊,該定位柱之長度大於第 一電路板之厚度,第一連接裝置安裝好後,定位柱有部分 突出在第一電路板外;將第二連接裝置之定位孔套入突出 在第一電路板外之定位柱上而定位,再將第二連接裝置之 第二焊接部焊接在第一電路板之焊接墊。 2 .如申請專利範圍第1項所述連接電路板之方法,其中前述 連接電路板之裝置是長形,複數導電端子是並列在其縱長 方向上’前述第一連接裝置之定位柱是設置有多個,而且 其中有一個定位柱與第一電路板及第二連接裝置之定位孔 設置成在第一連接裝置之縱長方向上之配合間隙大於其他 方向。 3.如申請專利範圍第2項所述連接電路板之方法,其中前述 連接電路板之裝置之第一焊接部及第二焊接部均為表面貼 裝技術形態。 4 .如申請專利範圍第2項所述連接電路板之方法,其中前述 連接電路板之裝置之第一焊接部為表面貼裝技術形態,而 第二焊接部為穿孔焊接形態。 5 . —種用於申請專利範圍第1項到第4項中任一項所述連接電 路板之方法之連接電路板之裝置,其中其具有相互成一定 角度之第一安裝面與第二安裝面,第一安裝面與第二安裝 面之相對面均設有便於吸取之平面狀抓取部,而且該裝置 固定有複數導電端子’每一導電端子包括位於第一安裝面 之第一焊接部及位於第二安裝面之第二焊接部。 6.如申請專利範圍第5項所述連接電路板之裝置,其中前述 連接電珞板之裝置包括第一連接裝置及第二連接裝置,第 一連接裝置之第一安裝面與第二連接裝置之第一安裝面相 09710640^·單編號讎1 帛 Π 頁 / 共 21 頁 1013138251-0 1380518 101年.Ο 4月· 13日梭正替換頁 對,第一連接裝置之第二安裝面與第二連接裝置之第二安 裝面在共同平面。 7. 如申請專利範圍第6項所述連接電路板之裝置,其中前述 第一連接裝置及第二連接裝置均是長形,第一連接裝置之 第一安裝面設置有多個定位柱,第二連接裝置之第一安裝 面對應設置有與該等定位柱配合之定位孔;其中有一個靠 近端部之定位柱與第二連接裝置之相應定位孔之配合關係 設置成在第一連接裝置之縱長方向上之配合間隙大於其他 方向。 8. 如申請專利範圍第7項所述連接電路板之裝置,其中前述 連接電路板之裝置之第一焊接部及第二焊接部均為表面貼 裝技術形態。 9. 如申請專利範圍第7項所述連接電路板之裝置,其中前述 連接電路板之裝置之第一焊接部為表面貼裝技術形態,而 第二焊接部為穿孔焊接形態。 單編號Α0101 第12頁/共21頁 1013138251-01380518 .1-01. Year 04.13.13 Amendment Replacement Page VII. Patent Application Range: 1. A method of connecting a circuit board for connecting a first circuit board and a second circuit board, comprising the following steps: The first circuit board and the second circuit board are respectively provided with a plurality of solder pads; a device for connecting the circuit boards is provided, the device has a first mounting surface and a second mounting surface at an angle to each other, and the device is fixed with a plurality of conductive terminals, Each of the conductive terminals includes a first soldering portion on the first mounting surface and a second soldering portion on the second mounting surface, the positions of the first soldering portions respectively corresponding to the solder pads of the first circuit board, and the positions of the second soldering portions Corresponding to the solder pad arrangement of the second circuit board; the first mounting surface of the device for connecting the circuit board is mounted on the first circuit board, and the first soldering portion is respectively soldered to the solder pad of the first circuit board; The second mounting surface is mounted on the second circuit board, and the second soldering portion is respectively soldered to the solder pad of the second circuit board; the solder pad of the first circuit board is located at the edge of the circuit board After soldering on the first circuit board, the second soldering portion on the second mounting surface extends beyond the edge of the first circuit board, and the device for connecting the circuit board includes a first connecting device and a second connecting device, and the first connecting device The first mounting surface is opposite to the first mounting surface of the second connecting device, the second mounting surface of the first connecting device and the second mounting surface of the second connecting device are in a common plane, and the first mounting surface of the first connecting device is disposed a positioning post' is disposed on the first mounting surface of the second connecting device and the first circuit board is provided with a positioning hole that cooperates with the positioning post of the first connecting device; and the first mounting surface of the device connecting the circuit board is mounted to In the first circuit board, the positioning post of the first connecting device is firstly positioned on the first circuit board through the positioning hole of the first circuit board, and then the first soldering device of the first connecting device is __ A01101 Page 10/Total 21 Pages 1013138251-0 1380518 ιοί年·〇April 3rd The shuttle is welded to the solder pad of the first circuit board, the length of the positioning post is greater than the thickness of the first circuit board, first Connection After being installed, the positioning post partially protrudes outside the first circuit board; the positioning hole of the second connecting device is sleeved into the positioning post protruding from the first circuit board for positioning, and then the second connecting device is second The soldering portion is soldered to the solder pad of the first circuit board. 2. The method of connecting a circuit board according to claim 1, wherein the device for connecting the circuit board is elongated, and the plurality of conductive terminals are juxtaposed in a longitudinal direction thereof. The positioning pillar of the first connecting device is set. There are a plurality of, and one of the positioning posts and the positioning holes of the first circuit board and the second connecting device are disposed such that the matching gap in the longitudinal direction of the first connecting device is larger than the other directions. 3. The method of connecting a circuit board according to claim 2, wherein the first soldering portion and the second soldering portion of the device for connecting the circuit board are in a surface mounting technology. 4. The method of connecting a circuit board according to claim 2, wherein the first soldering portion of the device for connecting the circuit board is in the form of a surface mount technology, and the second soldering portion is in a perforated soldering state. The device for connecting a circuit board of the method for connecting a circuit board according to any one of claims 1 to 4, wherein the first mounting surface and the second mounting are at an angle to each other The surface of the first mounting surface and the second mounting surface are respectively provided with a planar grabbing portion for facilitating suction, and the device is fixed with a plurality of conductive terminals. Each of the conductive terminals includes a first soldering portion on the first mounting surface. And a second soldering portion located on the second mounting surface. 6. The device for connecting a circuit board according to claim 5, wherein the device for connecting the power board comprises a first connecting device and a second connecting device, the first mounting surface and the second connecting device of the first connecting device The first mounting surface phase is 97110640^·single number 雠1 帛Π page / total 21 pages 1013138251-0 1380518 101 years. Ο April 13th shuttle is replacing the page pair, the second mounting surface of the first connecting device and the second The second mounting surface of the connecting device is in a common plane. 7. The device for connecting a circuit board according to claim 6, wherein the first connecting device and the second connecting device are each elongated, and the first mounting surface of the first connecting device is provided with a plurality of positioning posts, The first mounting surface of the two connecting devices is correspondingly provided with positioning holes matched with the positioning posts; wherein a positioning post adjacent to the end portion and a corresponding positioning hole of the second connecting device are disposed in the first connecting device The matching gap in the longitudinal direction is larger than the other directions. 8. The apparatus for connecting a circuit board according to claim 7, wherein the first soldering portion and the second soldering portion of the device for connecting the circuit board are in a surface mounting technology. 9. The apparatus for connecting a circuit board according to claim 7, wherein the first soldering portion of the device for connecting the circuit board is in the form of a surface mount technology, and the second soldering portion is in a perforated soldering state. Single Number Α0101 Page 12 of 21 1013138251-0
TW97106402A 2008-02-25 2008-02-25 Method and apparatus for connecting print circuit boards TWI380518B (en)

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TW97106402A TWI380518B (en) 2008-02-25 2008-02-25 Method and apparatus for connecting print circuit boards

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TWI380518B true TWI380518B (en) 2012-12-21

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