WO2017184941A1 - Small pitch direct view display and method of making thereof - Google Patents

Small pitch direct view display and method of making thereof Download PDF

Info

Publication number
WO2017184941A1
WO2017184941A1 PCT/US2017/028771 US2017028771W WO2017184941A1 WO 2017184941 A1 WO2017184941 A1 WO 2017184941A1 US 2017028771 W US2017028771 W US 2017028771W WO 2017184941 A1 WO2017184941 A1 WO 2017184941A1
Authority
WO
WIPO (PCT)
Prior art keywords
pixels
display device
view display
direct view
isolation grid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2017/028771
Other languages
English (en)
French (fr)
Inventor
Neil Deeman
Michael Jansen
Hyung-Chul Lee
Kai Liu
Kazunori Okui
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to EP17786687.8A priority Critical patent/EP3446330A4/en
Priority to KR1020187031032A priority patent/KR20180128464A/ko
Priority to JP2018554745A priority patent/JP2019515489A/ja
Publication of WO2017184941A1 publication Critical patent/WO2017184941A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
    • G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
    • G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/303—Assembling printed circuits with electric components, e.g. with resistors with surface mounted components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2300/00—Aspects of the constitution of display devices
    • G09G2300/04—Structural and physical details of display devices
    • G09G2300/0404—Matrix technologies
    • G09G2300/0408—Integration of the drivers onto the display substrate
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2300/00—Aspects of the constitution of display devices
    • G09G2300/04—Structural and physical details of display devices
    • G09G2300/0439—Pixel structures
    • G09G2300/0452—Details of colour pixel setup, e.g. pixel composed of a red, a blue and two green components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0112—Absorbing light, e.g. dielectric layer with carbon filler for laser processing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10522—Adjacent components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components

Definitions

  • the present disclosure relates to direct view display devices, and particularly to LED based small pitch direct display devices with an isolation grid and methods of fabricating the same.
  • a LED (light emitting diode) based direct view display is a display in which the LEDs are arranged in pixels and the image of the display is formed by turning the LEDs in each pixel on and off.
  • This type of device differs from a LED backlit liquid crystal display (LCD) in which the pixels contain a liquid crystal material which is backlit by light (e.g., white light) emitted by a LED backlight.
  • LCD liquid crystal display
  • a direct view display device includes a printed circuit board, an array of pixels located on a first side of the printed circuit board, each pixel including a plurality of light emitting diodes, and an isolation grid comprising a light absorbing material located between the pixels in the array of pixels.
  • a method of forming a direct view display device comprises providing a printed circuit board, attaching light emitting diodes to a first side of the printed circuit board to form an array of pixels, each pixel comprising a plurality of light emitting diodes, and providing an isolation grid comprising a light absorbing material between the pixels in the array of pixels.
  • FIGS. 1A, IB and 1C are respective top, side and bottom views of a direct view display device according to an embodiment of the present disclosure.
  • FIGS. 2A and 2B are respective magnified top view and side cross sectional view of the direct view display device of an embodiment of the present disclosure.
  • FIG. 3 is a top view of an isolation grid that provides lateral optical isolation according to an embodiment of the present disclosure.
  • FIGS. 4A-4D show steps in a manufacturing sequence that can be employed to fabricate a direct view display device of the present disclosure.
  • FIGS. 4A and 4B are bottom views
  • FIG. 4C is a top view
  • FIG. 4D is a perspective view of the display device.
  • a LED based small pitch direct view display device including an isolation grid
  • the direct view display device may be a multi-color or black and white display device which contains a red light emitting LED, blue light emitting LED and a green light emitting LED (i.e., RGB LEDs) in each pixel.
  • the pixels preferably contain no liquid crystal material.
  • the pitch of the LED pixels is preferably less than 1.5 mm, such as 5 microns to 1.2 mm.
  • the display device with a pixel pitch of 0.9 to 1.2 mm can be used for electronic display signage applications
  • the display device with a pixel pitch of 50 microns to 1.2 mm can be used in electronic device displays, such as tablet, phone or watch displays
  • the display device with a pixel pitch of 5 microns to 10 microns can be used for virtual reality or augmented reality devices (e.g., such as virtual reality goggles).
  • a LED based direct view device 1 of an embodiment of the present disclosure is shown in FIGS. 1A-1C.
  • the device 1 contains a substrate 2, such as a printed circuit board (PCB).
  • the LEDs 10, such as RGB LEDs, are mounted on the top surface of the substrate 2.
  • Driver electronics 20, such as logic and/or control chips, contact pads 22 and electrodes (e.g., electrical contacts or pins) 24 are mounted on the bottom side of the substrate 2.
  • an isolation grid 30 of light absorbing material can be provided between the pixels 100 of the device 1, as illustrated in FIGS. 2A, 2B and 3.
  • Each pixel 100 may contain a red light emitting LED 10R, blue light emitting LED 10B and a green light emitting LED 10G. More than one LED 10 of one or more colors may be provided in each pixel 100.
  • Each pixel 100 may also contain electrical contacts, sensor devices, and other electronics as needed.
  • the isolation grid 30 significantly reduces the optical interference between adjacent pixels (e.g., RGB pixels) 100.
  • the top of the isolation grid can be at least at the same level as (i.e., at the same level or protrude above) the top of the LEDs 10. In one embodiment, the top of the isolation grid can protrude above the plane including the topmost surfaces of the LED 10 dies.
  • the isolation grid 30 can be applied before or after the LEDs 10 are mounted on the substrate 2, such as the printed circuit board (PCB).
  • the isolation grid 30 can be manufactured employing two-dimensional (2D) printing or three- dimensional (3D) printing using ultraviolet (UV) curable or thermal applied material directly onto the PCB surface.
  • the isolation material of the isolation grid can be a black UV curable ink.
  • the isolation grid 30 can be manufactured by injection molding a plastic material to form a free-standing isolation grid, as shown in FIG. 3, and subsequently attaching the free-standing grid to the top PCB substrate 2 surface.
  • the isolation material of the isolation grid can be a black colored polycarbonate plastic material.
  • FIG. 3 shows an exemplary criss-cross pattern that can be employed for the isolation grid 30.
  • the isolation grid 30 has a rectangular array of openings therein. In another embodiment, the isolation grid 30 has a hexagonal array of openings therein.
  • the isolation grid 30 containing direct view display devices 1 of the present disclosure provide improvement over prior art display devices.
  • Optical interference from adjacent LED pixels 100 which would result in light emission from an apparently larger region than the physical area of the LED pixel 100 provided by design, can be significantly reduced.
  • Reduction of optional interference has the effect of enhancing the optical resolution of the display device.
  • FIGS. 4A to 4D illustrate an exemplary process sequence that may be employed to manufacture the direct view display device 1 of the present disclosure.
  • the electronic components (20, 22, 24) are mounted to the bottom side of the PCB substrate 2 in a first step.
  • the electronic components are then encapsulated in a planarizing
  • the planarizing encapsulation material of the bottom encapsulation layer 40 can include, e.g. Bakelite or epoxy molding compound (EMC).
  • EMC epoxy molding compound
  • the planarizing encapsulation material 40 is compatible with the third and fourth steps described below.
  • the thickness of the bottom encapsulation layer 40 can be in a range from 30 microns to 10 mm, although lesser and greater thicknesses can also be used.
  • a third step of mounting the LEDs 10 and forming the isolation grid 30 on the top side of the substrate 2 is then performed, as shown in FIG. 4C.
  • the LEDs 10 can be mounted to the top side of the substrate 2 in a pixel arrangement, followed by printing a UV or thermally curable ink between the pixels 100. The ink in then UV cured or thermally cured to form the isolation grid 30.
  • the free-standing isolation grid 30 can be formed separately from the substrate 2 followed by attaching the free-standing isolation grid 30 to the top side of the substrate 2 before or after mounting the LEDs 10.
  • a top encapsulation layer 50 is formed on the LEDs 10 and the isolation grid 30 over the top side of the substrate 2, as shown in FIG. 4D.
  • the second encapsulation process of the fourth step is aided by the presence of the bottom encapsulation layer 40 formed in the second step such that the pressure exerted on the PCB substrate 2 is more evenly distributed during the fourth step, thereby preventing cracking, bending or other damage to the assembly.
  • a relatively thin transparent coating layer 60 can be formed over the top encapsulation layer 50.
  • the thickness of the top encapsulation layer 50 can be in a range from 30 microns to 1 mm, although lesser and greater thicknesses can also be used.
  • the thickness of the second encapsulation layer 60 can be in a range from 10 microns to 300 microns, although lesser and greater thicknesses can also be employed.
  • Encapsulation materials that can be used for the top encapsulation layer 50 can be optically transparent silicones.
  • the surface properties of these types of materials lend themselves to easy pick up of contamination from fingerprints and dust that can impair the optical transmission.
  • This surface can be modified by the application of the transparent coating layer 60 that is thinner than top encapsulation layer 50, binds strongly to the second encapsulation layer 50, and is resistant to contamination build up.
  • An example of such a material for layer 60 is a contamination-resistant material, such as KJC-7022 made by Shin Etsu Chemical. This material does not have the required properties to replace the LED encapsulant entirely but can modify the surface properties sufficiently to have the desired effect.
  • a stack of a transparent top encapsulation layer 50 and a transparent coating layer 60 made from a material resistant to surface contamination can be employed to enhance display properties of a direct view display device.
  • the electronic components (20, 22, 24) which are mounted to the bottom surface of the PCB substrate 2 are protected from damage by the bottom encapsulation layer 40 during the mounting of the LEDs 10 and formation of the isolation grid 30 on the top side of the substrate 2 and during the product life. Furthermore, the top, outer viewable surface of the device 1 is protected from build-up of contamination (e.g., finger prints, dust etc.) that can reduce light output, and can be cleaned to return it to its original optical output due to the presence of the transparent coating layer 60.
  • contamination e.g., finger prints, dust etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Led Device Packages (AREA)
PCT/US2017/028771 2016-04-22 2017-04-21 Small pitch direct view display and method of making thereof Ceased WO2017184941A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP17786687.8A EP3446330A4 (en) 2016-04-22 2017-04-21 DIRECT VIEW DISPLAY WITH A SMALL TILTING ANGLE AND METHOD FOR PRODUCING THE SAME
KR1020187031032A KR20180128464A (ko) 2016-04-22 2017-04-21 소형 피치 직시형 디스플레이 및 이의 제조 방법
JP2018554745A JP2019515489A (ja) 2016-04-22 2017-04-21 狭ピッチ直視型ディスプレイおよびその製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201662326255P 2016-04-22 2016-04-22
US62/326,255 2016-04-22

Publications (1)

Publication Number Publication Date
WO2017184941A1 true WO2017184941A1 (en) 2017-10-26

Family

ID=60089638

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2017/028771 Ceased WO2017184941A1 (en) 2016-04-22 2017-04-21 Small pitch direct view display and method of making thereof

Country Status (5)

Country Link
US (1) US10600354B2 (https=)
EP (1) EP3446330A4 (https=)
JP (1) JP2019515489A (https=)
KR (1) KR20180128464A (https=)
WO (1) WO2017184941A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111464803A (zh) * 2020-04-16 2020-07-28 中国长城科技集团股份有限公司 一种显示控制系统

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20180210195A1 (en) * 2017-01-24 2018-07-26 Microsoft Technology Licensing, Llc Avoiding ghost images
US10878742B2 (en) * 2017-01-24 2020-12-29 Planar Systems, Inc. Protective cover for direct view light emitting diode displays
KR102532307B1 (ko) 2017-11-02 2023-05-15 삼성디스플레이 주식회사 표시장치
US10269711B1 (en) * 2018-03-16 2019-04-23 Taiwan Semiconductor Manufacturing Company Ltd. Semiconductor device and method for manufacturing the same
US10627673B2 (en) 2018-04-06 2020-04-21 Glo Ab Light emitting diode array containing a multilayer bus electrode and method of making the same
CN113950739A (zh) * 2019-05-09 2022-01-18 达科电子股份有限公司 用于显示模块的模制对比度掩膜
FR3097981B1 (fr) * 2019-06-28 2021-07-02 Valeo Vision Dispositif lumineux pour véhicule automobile
CN112930493B (zh) * 2019-10-07 2023-07-18 依视路国际公司 表征光学元件
US11594663B2 (en) 2019-12-20 2023-02-28 Nanosys, Inc. Light emitting diode device containing a micro lens array and method of making the same
TWI719775B (zh) * 2019-12-25 2021-02-21 錼創顯示科技股份有限公司 顯示裝置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140021493A1 (en) * 2012-07-20 2014-01-23 Peter Andrews Solid state lighting component package with layer
US20150069429A1 (en) * 2007-05-31 2015-03-12 Nthdegree Technologies Worldwide Inc. Method of Manufacturing Addressable and Static Electronic Displays
KR20150094733A (ko) * 2012-12-13 2015-08-19 픽스트로닉스 인코포레이티드 오프-축 어레인지먼트로 구성되는 광 변조 픽셀들을 갖는 디스플레이
US20160043061A1 (en) * 2013-04-01 2016-02-11 Lg Electronics Inc. Display device using semiconductor light emitting device
WO2016057588A2 (en) * 2014-10-07 2016-04-14 Corning Incorporated Direct view display device and light unit for direct view display device

Family Cites Families (62)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0553511A (ja) * 1991-08-28 1993-03-05 Toyoda Gosei Co Ltd カラーデイスプレイ装置
JPH08202290A (ja) * 1995-01-26 1996-08-09 Daihatsu Motor Co Ltd Ｌｅｄディスプレイモジュール
US6589650B1 (en) * 2000-08-07 2003-07-08 3M Innovative Properties Company Microscope cover slip materials
JP4049624B2 (ja) 2001-07-27 2008-02-20 株式会社エンプラス 面光源装置、画像表示装置及び導光板
JP4223740B2 (ja) 2002-06-13 2009-02-12 シチズン電子株式会社 発光素子用パッケージ
US7335908B2 (en) 2002-07-08 2008-02-26 Qunano Ab Nanostructures and methods for manufacturing the same
US20040061810A1 (en) 2002-09-27 2004-04-01 Lumileds Lighting, U.S., Llc Backlight for a color LCD using wavelength-converted light emitting devices
TWI351548B (en) 2003-01-15 2011-11-01 Semiconductor Energy Lab Manufacturing method of liquid crystal display dev
US8270061B2 (en) 2003-11-01 2012-09-18 Silicon Quest Kabushiki-Kaisha Display apparatus using pulsed light source
US7132677B2 (en) 2004-02-13 2006-11-07 Dongguk University Super bright light emitting diode of nanorod array structure having InGaN quantum well and method for manufacturing the same
TWI367686B (en) * 2004-04-07 2012-07-01 Semiconductor Energy Lab Light emitting device, electronic device, and television device
GB0408347D0 (en) 2004-04-15 2004-05-19 Design Led Products Ltd Light guide device
US7204631B2 (en) 2004-06-30 2007-04-17 3M Innovative Properties Company Phosphor based illumination system having a plurality of light guides and an interference reflector
WO2006131924A2 (en) 2005-06-07 2006-12-14 Oree, Advanced Illumination Solutions Inc. Illumination apparatus
CN101313176B (zh) 2005-11-21 2010-11-24 皇家飞利浦电子股份有限公司 光学系统
JP4669799B2 (ja) 2006-03-01 2011-04-13 パナソニック株式会社 エッジ入力型バックライト
CN101443265B (zh) 2006-03-08 2014-03-26 昆南诺股份有限公司 在硅上无金属合成外延半导体纳米线的方法
AU2007313096B2 (en) 2006-03-10 2011-11-10 Unm Rainforest Innovations Pulsed growth of GaN nanowires and applications in group III nitride semiconductor substrate materials and devices
JP4585481B2 (ja) 2006-04-28 2010-11-24 株式会社 日立ディスプレイズ Ｌｅｄバックライト及びそれを用いた液晶表示装置
GB2438440B (en) 2006-05-26 2008-04-23 Design Led Products Ltd A composite light guiding device
US20090128781A1 (en) 2006-06-13 2009-05-21 Kenneth Li LED multiplexer and recycler and micro-projector incorporating the Same
US20080049445A1 (en) 2006-08-25 2008-02-28 Philips Lumileds Lighting Company, Llc Backlight Using High-Powered Corner LED
US20080080184A1 (en) * 2006-10-03 2008-04-03 Cao Group Inc. Pixilated LED Light Source for Channel Letter Illumination
EP2102899B1 (en) 2007-01-12 2020-11-11 QuNano AB Nitride nanowires and method of producing such
JP4613947B2 (ja) 2007-12-07 2011-01-19 ソニー株式会社 照明装置、色変換素子及び表示装置
JP2009177117A (ja) * 2007-12-25 2009-08-06 Toshiba Lighting & Technology Corp 表示装置
WO2009133870A1 (ja) 2008-04-30 2009-11-05 アルプス電気株式会社 照光装置およびその製造方法
GB2459888B (en) 2008-05-09 2011-06-08 Design Led Products Ltd Capacitive sensing apparatus
GB0809385D0 (en) 2008-05-23 2008-07-02 Design Led Products Ltd Light-guide apparatus
EP2128689A1 (en) * 2008-05-27 2009-12-02 Barco NV A display panel with improved reflectivity
CN102047452B (zh) 2008-05-30 2013-03-20 夏普株式会社 发光装置、面光源、液晶显示装置和制造发光装置的方法
JP2010021131A (ja) 2008-06-09 2010-01-28 Hitachi Ltd 表示装置及びそれに用いられるバックライトユニット
KR20110039313A (ko) 2008-07-07 2011-04-15 글로 에이비 나노구조 ｌｅｄ
KR100953655B1 (ko) * 2008-07-08 2010-04-20 삼성모바일디스플레이주식회사 유기발광 표시장치
KR100924912B1 (ko) 2008-07-29 2009-11-03 서울반도체 주식회사 웜화이트 발광장치 및 그것을 포함하는 백라이트 모듈
US8755005B2 (en) 2008-09-24 2014-06-17 Koninklijke Philips N.V. Thin edge backlight with LEDS optically coupled to the back surface
US7717584B1 (en) * 2008-11-28 2010-05-18 Wei-Jei Tuan Vibrating and twinkling LED backlighting device
JP5407545B2 (ja) * 2009-05-19 2014-02-05 ソニー株式会社 防眩性フィルムおよびその製造方法、ならびに表示装置
JP2011065010A (ja) 2009-09-18 2011-03-31 Panasonic Corp 画像形成装置
JP5531629B2 (ja) 2010-01-14 2014-06-25 凸版印刷株式会社 バックライトユニット及び表示装置
GB201008599D0 (en) 2010-05-24 2010-07-07 Design Led Products Ltd Light guide device
GB201008601D0 (en) 2010-05-24 2010-07-07 Design Led Products Ltd Lighting apparatus
KR101147988B1 (ko) * 2010-07-13 2012-05-24 포항공과대학교 산학협력단 물리적 박리 방법을 이용한 플렉서블 전자소자의 제조방법, 플렉서블 전자소자 및 플렉서블 기판
KR20120035062A (ko) 2010-10-04 2012-04-13 삼성코닝정밀소재 주식회사 백라이트 유닛
US8585268B2 (en) 2011-10-21 2013-11-19 Ergophos, Llc Light-guide panel for display with laser backlight
CN104024931B (zh) * 2011-12-27 2017-04-05 夏普株式会社 液晶显示装置、光控膜、显示装置
US20130258216A1 (en) 2012-03-30 2013-10-03 Shin-Gwo Shiue Pico projection light system
CN103384179B (zh) * 2012-05-04 2017-08-11 电信科学技术研究院 使用时分双工通信制式的系统中的上下行配置方法和设备
KR101452768B1 (ko) 2012-08-21 2014-10-21 엘지전자 주식회사 반도체 발광 소자를 이용한 디스플레이 장치 및 이의 제조방법
KR101940761B1 (ko) * 2012-10-16 2019-04-10 엘지디스플레이 주식회사 유기발광소자표시장치
JP6565129B2 (ja) * 2013-02-15 2019-08-28 東洋紡株式会社 画像表示装置
JP2014229356A (ja) * 2013-05-17 2014-12-08 ソニー株式会社 発光素子およびその製造方法、ならびに表示装置
US9111464B2 (en) 2013-06-18 2015-08-18 LuxVue Technology Corporation LED display with wavelength conversion layer
US9726802B2 (en) 2013-09-23 2017-08-08 Glo Ab Integrated back light unit
US9281442B2 (en) 2013-12-17 2016-03-08 Glo Ab III-nitride nanowire LED with strain modified surface active region and method of making thereof
KR20150093284A (ko) 2014-02-06 2015-08-18 삼성디스플레이 주식회사 백라이트 유닛
US10833054B2 (en) 2014-02-08 2020-11-10 Cree Huizhou Solid State Lighting Company Limited Smart pixel surface mount device package
JP6429102B2 (ja) * 2014-04-22 2018-11-28 大日本印刷株式会社 画像表示装置
KR20160000096A (ko) * 2014-06-23 2016-01-04 삼성디스플레이 주식회사 표시 장치
KR20170066318A (ko) 2014-08-12 2017-06-14 글로 에이비 불균일 광 가이드 유닛을 포함하는 일체형 백 라이트 유닛
JP3203462U (ja) * 2016-01-19 2016-03-31 株式会社スリーエス 表示装置
KR102572819B1 (ko) * 2016-02-23 2023-08-30 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광모듈 제조방법 및 표시장치

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150069429A1 (en) * 2007-05-31 2015-03-12 Nthdegree Technologies Worldwide Inc. Method of Manufacturing Addressable and Static Electronic Displays
US20140021493A1 (en) * 2012-07-20 2014-01-23 Peter Andrews Solid state lighting component package with layer
KR20150094733A (ko) * 2012-12-13 2015-08-19 픽스트로닉스 인코포레이티드 오프-축 어레인지먼트로 구성되는 광 변조 픽셀들을 갖는 디스플레이
US20160043061A1 (en) * 2013-04-01 2016-02-11 Lg Electronics Inc. Display device using semiconductor light emitting device
WO2016057588A2 (en) * 2014-10-07 2016-04-14 Corning Incorporated Direct view display device and light unit for direct view display device

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP3446330A4 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111464803A (zh) * 2020-04-16 2020-07-28 中国长城科技集团股份有限公司 一种显示控制系统

Also Published As

Publication number Publication date
US10600354B2 (en) 2020-03-24
EP3446330A1 (en) 2019-02-27
JP2019515489A (ja) 2019-06-06
US20170309223A1 (en) 2017-10-26
KR20180128464A (ko) 2018-12-03
EP3446330A4 (en) 2019-12-18

Similar Documents

Publication Publication Date Title
US10600354B2 (en) Small pitch direct view display and method of making thereof
KR102339163B1 (ko) 발광 모듈의 제조 방법 및 발광 모듈
CN101958315B (zh) 发光装置、显示器及其制造方法
EP2400569B1 (en) Light-emitting diode package
US20060261357A1 (en) Array-type modularized light-emitting diode structure and a method for packaging the structure
CN113471259A (zh) 显示面板及显示装置
US12322735B2 (en) Display panel including opaque encapsulation and doped planarization layers and manufacturing method thereof
CN103682058B (zh) 基板、显示面板和显示装置
US11579486B2 (en) Light emitting device, backlight, and display panel with reflective layer
EP4246583A1 (en) Light-emitting module, method for manufacturing same and display device comprising same
CN107219655A (zh) 显示装置
WO2009028807A2 (en) Light emitting device package and method for fabricating the same
KR102585406B1 (ko) 발광소자 패키지
US7745840B2 (en) Solide-state light source
TW202131466A (zh) 板上封裝顯示元件及其製造方法
CN108630672A (zh) 影像显示模块及其制作方法、及显示设备
KR20240136355A (ko) 발광 모듈 및 그것을 포함하는 디스플레이 장치
KR102873277B1 (ko) 발광 장치
EP1732132B1 (en) Method for packaging an array-type modularized light-emitting diode structure
US12272679B2 (en) Display panel and manufacturing method thereof
CN114038873B (zh) 一种显示面板及其制作方法和显示装置
TWI886976B (zh) 顯示裝置
TWI882386B (zh) 顯示裝置及陣列基板
TWI889638B (zh) 顯示裝置及陣列基板
CN117976665A (zh) 一种封装结构及其制作方法、显示面板

Legal Events

Date Code Title Description
ENP Entry into the national phase

Ref document number: 2018554745

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

ENP Entry into the national phase

Ref document number: 20187031032

Country of ref document: KR

Kind code of ref document: A

WWE Wipo information: entry into national phase

Ref document number: 2017786687

Country of ref document: EP

ENP Entry into the national phase

Ref document number: 2017786687

Country of ref document: EP

Effective date: 20181122

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 17786687

Country of ref document: EP

Kind code of ref document: A1