CN101958315B - 发光装置、显示器及其制造方法 - Google Patents

发光装置、显示器及其制造方法 Download PDF

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Publication number
CN101958315B
CN101958315B CN2010102340226A CN201010234022A CN101958315B CN 101958315 B CN101958315 B CN 101958315B CN 2010102340226 A CN2010102340226 A CN 2010102340226A CN 201010234022 A CN201010234022 A CN 201010234022A CN 101958315 B CN101958315 B CN 101958315B
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China
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light
emitting device
light source
source cell
substrate
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CN2010102340226A
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CN101958315A (zh
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应文逡
侯维新
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Luxingtek Ltd
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Luxingtek Ltd
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    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
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    • G02B5/0278—Diffusing elements; Afocal elements characterized by the use used in transmission
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    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
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Abstract

本发明提供一种显示器、发光装置及用于制造该发光装置的方法。该发光装置包含一基板、一电极层、多个光源单元及一光散射层，该光散射层被一透明层及一反射层覆盖，以一超薄形式形成一均匀的面光源。一荧光层设置于该反射层之上，以于使用一蓝色发光二极管或紫外光发光二极管时形成白光。该发光装置亦提供一种独特的电极布局设计，其可适用于局部调光及区域发光控制并可容易地应用于大尺寸产品。

Description

发光装置、显示器及其制造方法
技术领域
本发明是关于一种能够产生一均匀的面光源的新颖超薄型发光装置及其制造方法。
背景技术
典型的发光二极管(light emitting diode；LED)封装包括：附着一发光二极管芯片至由一铸铝件制成的一引线框架(lead frame)，打线接合(wire bonding)以电性连接发光二极管至引线框架，并利用一成型工艺(molding process)以一光学透明的环氧树脂囊封该发光二极管、接合线及引线框架，其中二引线自该成型囊封引出以用于电性连接。此种类型的发光二极管封装结构形成一“点”光源，并广泛适用于一般的照明、讯息板(message board)及灯箱。另一种发光二极管封装则将发光二极管封装成用于SMT总成的一非常紧密的形式，其广泛用于液晶显示器(liquid crystal display；LCD)背光单元应用。然而，在本领域中众所熟悉的，这些典型的发光二极管封装非常昂贵(相较于发光二极管裸芯片而言)并且无法用于形成一均匀的面光源，除非使用一精密的光学设计及成本高昂的制造工艺。以一液晶显示装置为例，液晶显示装置包含例如液晶面板、TFT底板(backplane)及背光模块等关键部件。液晶面板上的各单独像素受控于TFT底板以容许光透过，藉此决定各该像素在受到背光模块发出的光的照射时的明暗状态。由于显示器日趋薄化的趋势，背光模块的厚度及成本已成为本领域中的主要技术问题。
各种用于背光模块的光源，例如冷阴极荧光灯(cold cathode fluorescent light；CCFL)、电致发光(electroluminescent；EL)元件、发光二极管(light emitting diode；LED)、有机LED(organic LED；OLED)及聚合物LED(polymer LED；PLED)。出于成本及成熟性的考量，通常使用由多个发光二极管形成的一发光二极管阵列作为一背光模块的光源。一般而言，背光模块可划分成直下式(direct-type)背光模块及侧边入光式(edge-type)背光模块。
侧边入光式背光模块广泛用于薄型液晶显示器中。侧边入光式背光模块包含一导光板及沿该导光板的周缘设置的该多个发光二极管，其中发光二极管的光进入导光板并照亮显示器。然而，在本领域中已知，大型光导板制造困难，并且用于大型显示器时成本高昂。此外，因各该发光二极管发出的光分布于整个导光板中，无法形成区域性开/关控制。因此，侧边入光式背光模块无法用于需要进行局部调光的液晶显示器。
用于显示器的现有的直下式背光模块直接将发光二极管设置于显示面板之下。为增强均匀性，需要设置一扩散板(diffuser)于发光二极管前方。尽管直下式背光模块适用于大型显示器，然而可以想见，直下式背光模块不仅过于复杂以致难以布置光源于背板上，且由于散射光的扩散板须与发光二极管间隔开，厚度过厚。换言之，直下式背光模块在提供均匀亮度与提供薄化外观之间面临两难的选择。
有鉴于此，需要为液晶显示器背光模块应用开发一种用于大型产品制造、超薄、能提供均匀面光源及局部调光特征的新颖发光装置。
发明内容
本发明的主要目的在于提供一种新颖的发光装置、显示器及该发光装置的制造方法。该发光装置包含多个光源单元，所述这些光源单元设置于基板上并电性连接一图案化电极层。所述这些光源单元可透过该电极层选择性地启动，以开关一局部区域。
本发明提供一种新颖的发光二极管封装结构，其不仅可以以一超薄形式产生一均匀的面光源，且亦能够采用传统印刷电路板(printed circuit board；PCB)组装方法及高生产量的涂布工艺来制造。本发明所揭露的新颖发光二极管封装结构可用于各种迫切需要超薄形式的产品应用，包括液晶显示器背光模块、POP展示牌、装饰性照明、灯箱、…等等。
更具体而言，所述这些光源单元是通过如下方式制成：以一非常紧密的形式直接接合多个发光二极管裸芯片至一印刷电路板(printed circuit board；PCB)，接着切割该印刷电路板以获得大量光源单元。然后，可组装所述这些光源单元于基板上以用于大型产品。
本发明的另一目的在于提供一种新颖发光装置及制造该发光装置的方法，其中用于形成内反射的反射层，以便无需使用现有的的扩散板即可使发光二极管的光在内部结构中行进。藉此，可大幅降低整个封装结构的厚度。
本发明的再一目的在于，较佳对光源单元采用发光二极管芯片。因发光二极管芯片远较封装的发光二极管廉价，本发明将现有的涂布工艺与印刷电路板组装工艺相互整合于一起。本发明中采用发光二极管芯片而非封装的发光二极管。
本发明的又一目的在于提供一种用作一显示器背光模块或用作一灯箱的发光装置。本发明的发光装置可以是双侧照明。该发光装置可以是一自身呈现一影像的主动式光源，或是一透过一面板呈现一影像的被动式光源。
为达上述目的，本发明揭露一种显示器及其发光装置。该显示器还包含堆叠于该发光装置上的一面板。该发光装置包含一基板、一电极层、至少一光源单元、一光散射层、一透明层及一反射层。该电极层图案化于该基板上。该至少一光源单元布置于该基板上，以电性连接该电极层。该光散射层覆盖除发光二极管芯片区域外的该基板及该电极层，该透明层上覆于该光散射层及该至少一光源单元，并且该反射层设置于该透明层上。一控制电路电性连接该电极层，其能够透过该电极层而选择性地启动该多个光源单元。
本发明还揭露一种用于制造该发光装置的方法。该方法包括以下步骤：提供一基板；形成一图案化电极层于该基板上；布置多个光源单元于该基板上，以电性连接该电极层，其中各该光源单元包含一电路板单元及封装至该电路板单元的至少一集成电路芯片；涂布一光散射层以覆盖该基板及该电极层；形成上覆于该光散射层及该至少一光源单元的一透明层；以及设置一反射层于该透明层上。
本发明的有益技术效果是：本发明适用于大尺寸的直下式发光装置能够在超薄形式内产生一均匀的面光源，并能够通过电极层选择性地控制发光二极管芯片，藉此提供局部调光特征。
附图说明
为让本发明的上述目的、技术特征、和优点能更明显易懂，以下将结合附图对本发明的较佳实施例进行详细说明，其中：
图1是本发明的一实施例的发光装置的示意图；
图2A至图4B是光源单元制造工艺的示意图；
图5A及图5B是一种用于形成绝缘层于基板上的工艺的示意图；
图6A及图6B是一种用于图案化电极层的工艺的示意图；
图7A-图7C是一种用于布置光源于基板上的工艺的示意图；
图8是一种用于涂布光散射层的工艺的示意图；
图9是一种用于形成透明层的工艺的示意图；
图10是一种用于设置反射层的工艺的示意图；
图11A-图11I是一种用于形成荧光层的工艺的示意图；
图12A及图12B是本发明第三实施例的示意图；
图13A-图13F是本发明第四实施例的示意图；
图14A及图14B是本发明第五实施例的示意图；
图15A及图15B是本发明第六实施例的示意图；
图16A-图16D是本发明第七实施例的显示器的示意图。
具体实施方式
本发明是关于一种发光装置，举例而言，一种直下式背光模块。图1显示根据本发明的第一实施例的发光装置1。发光装置1至少包含一基板101、图案化于基板101上的一电极层105、及多个光源单元107。光源单元107设置于该基板上，以电性连接该电极层105。于本实施例中，其特征在于，各该光源单元107包含一电路板单元及封装至该电路板单元的至少一发光二极管(LED)芯片。当然，发光装置1还包含电性连接电极层105的一控制电路(图未示出)。控制电路105能够根据所显示的影像，通过电极层105选择性地启动该多个光源单元107，以达成局部调光的目的。
基板101是由例如Al、Ni、Fe、Cu、不锈钢或合金制成的一金属板。基板101亦可由塑料、玻璃、陶瓷或聚合物组合物制成。发光装置1还包含形成于基板101上的一绝缘层103。电极层105图案化至绝缘层103上。发光装置1还包含一光散射层108，涂布于基板101及电极层105上除发光二极管芯片以外的区域，光散射层108是由例如包含二氧化钛颗粒(如商业白色漆)、碳化钙颗粒、氧化硅颗粒、金属颗粒、空气微孔、或多种颗粒的一混合物的一聚合物树脂制成。发光装置1还包含上覆于光散射层108及光源单元107的一透明层109、设置于透明层109上的一反射层111、及设置于反射层111上方的一荧光层115。反射层111形成具有相对于光源单元107分布的多个反射图案113。
本发明的第二实施例是关于一种用于制造第一实施例的发光装置1的方法。首先，图2A至图4B显示制造光源单元107的工艺。如图2A及图2D所示，提供包含多个电路板单元107b的一电路板107a，例如一印刷电路板(printed circuit board；PCB)或一挠性印刷电路板(flexible printed circuit board；FPC)。电路板107a可由环氧树脂或聚酰亚胺(polyimide)制成，并于顶面及底面形成有金属层107c。金属层107c可以是Cu、Al、Sn、Ni、或合金。各该电路板单元107b亦形成有通孔107d，此不仅用于传导电流，且亦用于导热。金属层107c是有意地设计成具有一大的表面覆盖区域，以更佳地从发光二极管芯片散热。此外，有意地形成连接顶部金属层与底部金属层的备援通孔107d，以增强从顶部金属层107c(此处接合有发光二极管芯片)至底部金属层107c的热传导，其中底部金属层107c还连接至基板101的电极层105。
然后，如图3A-图3D所示，使多个发光二极管芯片107e相对于电路板单元107b接合至电路板107a。该接合工艺可为打线接合(例如，如图3B所示的双打线接合及如图3C所示的单打线接合)或覆晶接合(如图3D所示)。因在本发明中采用发光二极管芯片107e而非封装的发光二极管，故可降低发光装置1的成本并提高设计自由度。
应注意，光源单元107可包含一电路板单元107b及接合至电路板单元107b的多个发光二极管芯片107e。各该发光二极管芯片可为一红色发光二极管芯片、一绿色发光二极管芯片、一蓝色发光二极管芯片或一紫外光发光二极管芯片。如图3E所示，三个发光二极管芯片107e，即一红色发光二极管芯片、一绿色发光二极管芯片及一蓝色发光二极管芯片，接合至电路板单元107b。金属层107c有意地设计用于电性连接图案化电极层105，如图3F所示。藉此，可通过电极层105独立地控制发光二极管芯片107e。
较佳地，如图4A及图4B所示，通过涂布囊封剂107f至发光二极管芯片107e，囊封各该发光二极管芯片107e。囊封剂107f包括任何能施配至发光二极管芯片107e上以于后续工序中包封和保护发光二极管芯片107e的现有的胶。囊封剂107f可由例如环氧树脂、聚氨酯、聚碳酸酯、聚酯、聚硅氧型聚合物、或聚丙烯酸树脂等透明聚合物材料制成。囊封剂107f亦可由含有光散射颗粒的透明聚合物材料制成，这些光散射颗粒例如为二氧化钛颗粒、碳酸钙颗粒、氧化硅颗粒、金属颗粒、或空气微孔或多种颗粒的一混合物。或者，囊封剂107f可由用于将发光二极管芯片107e所发出的光转换成白光的一荧光材料制成。
接着，执行一切割或锯割工序以形成多个光源单元107。以此方式，可非常紧密地制成分别包含一电路板单元107a及封装至电路板单元107a的一发光二极管芯片107e的多个光源单元107，以提供大量的光源单元，进而降低成本。举例而言，大小为100毫米×100毫米的印刷电路板107a可切割成400(即20×20)个光源单元107，其中各该光源单元107的大小为5毫米×5毫米。于该切割或锯割工序后，接着以一所需取向放置这些光源单元107于一托盘中，以利于后续工序中的取放。
此外，可同时执行以下工序。如图5A及图5B所示，提供基板101。基板101可以是一金属板或金属薄片，由铝、铜、铁、不锈钢、或任意类型的合金制成。其亦可由塑料、陶瓷、玻璃或任意复合材料制成。在基板101是导电性的情形中，将需要一绝缘层103(或一介电涂层)形成于基板101上。或者，绝缘层103可以是任意具有低导电率的材料，例如聚合物涂层(例如聚苯乙烯、聚甲基丙烯酸甲酯、聚氯乙烯、聚氨酯、聚酰亚胺、聚酰胺、聚碳酸酯、聚丙烯酸树脂等等)、任意类型的漆(例如白色漆、油基或水基漆等等)或任意复合涂层材料。或者，绝缘层103可通过电镀或通过利用化学或电性方法(例如氧化或阳极处理)的表面处理直接形成于金属板的表面上。
然后，如图6A及图6B所示，将电极层105图案化于基板101(或绝缘层103)上。较佳地，电极层105可由银胶/墨水、碳黑胶/墨水、铜胶/墨水、或聚合物树脂与导电颗粒(例如Ag、Au、Al、Cu、Fe或碳黑)的任意组合形成。现有的的涂布方法，例如丝网印刷(screen printing)、柔性版印刷(flexo printing)、凸版印刷(stamp printing)、喷墨印刷(inkjet printing)、凹版印刷(gravure printing)、及热转印(thermal transferring)可适用于将电极层105图案化。或者，可预先形成一导电层于绝缘层103上，然后予以蚀刻而形成图案化电极层105。再或者，基板101上的图案化电极层105可以是一传统印刷电路板。电极层105的图案较佳被设计于例如X及Y方向上。
参见图7A-图7C，其中图7A是俯视平面图，而第7B及7C图是剖视图，光源单元107可布置于基板101上，以电性连接电极层105。藉此，控制电路可根据需要分别控制各该光源单元107。如图7C所示，为确保光源单元107的电路板单元107b粘附至基板101，可额外涂布一滴胶117于电路板单元107a之下。于光源单元107置于基板101后，使其经受一烘烤(baking)工序。烘烤温度及烘烤时间是取决于电极层105的类型。
为增强背光模块1的亮度效能，设置光散射层108以覆盖除发光二极管芯片区域以外的基板101及电极层105，如图8所示。如同其中一种制造方法，设置一掩膜(mask)于基板101上，该掩膜是设计用于仅遮盖光源单元107上的发光二极管芯片区域。然后，涂布(例如，通过喷涂、溶液涂布或其它涂布工艺)或沉积(化学或物理方式)光散射层108于基板上位于发光二极管芯片区域以外的区域中，光散射层108例如为商业白漆、TiO2膏、CaCO3膏、含白色颜料或含任何闪光颗粒的聚合物树脂、或空气微孔。最后，移除掩膜，使发光二极管芯片区域保持敞开而不被光散射层108覆盖。可能需要对光散射层108实施一烘烤工序，以移除任何多余的溶剂并确保光散射层108干燥。
接着，参见图9，涂布透明层109于光散射层108及光源单元107上并覆盖整个区域。透明层109可由任意类型的透明聚合物材料形成，例如由硅橡胶(siliconrubber)、聚氨酯(polyurethane)、聚苯乙烯(polystyrene)、聚酯(polyester)、聚碳酸酯(polycarbonate)、聚酰亚胺(polyimide)、聚丙烯酸树脂(polyacrylic resin)、或多于一种类型的透明聚合物材料的一组合。若与反射层111一起使用，则透明层109的折射率较佳与囊封剂107f(图9未示出)的折射率相匹配。
参见图10，接着设置反射层111于透明层109上，反射层111具有相对于光源单元107分布于一软性基板上的多个反射图案113，该软性基板较佳是由任意类型的透明塑料(例如PET、PEN、PES、PU、PS、PC、PE、PP、PI、或ABS)制成，或是可图案使光穿透的铜箔基板(metal foil)亦或其它金属合金薄片。反射图案113的分布方式使光源单元107上方的图案具有一更高的密度。藉此，反射层111有助于光源单元107发出的光朝在正下方未设置有发光二极管的区域行进。反射图案113是利用一现有的真空沉积工艺(例如溅射、热沉积或离子束沉积)，通过沉积一薄层金属膜于塑料基板上而制成。金属膜的反射图案113可通过平印(lithography)工艺、直接蚀刻工艺、剥离工艺(lift-offprocess)、…等等制成。金属膜可包含Ag、Al、Ni、Cr、Mo、Cu、Au或Pt。反射图案113亦可通过将白色漆或反射漆图案化至塑料基板上而形成。
最后，形成荧光层115于反射层111上。如图11A所示，荧光层115可直接涂布于图案化的反射层111上。或者，荧光层115可涂布于一透明塑料膜120上，然后设置至反射层111上，如图11B所示。荧光层115包含均匀混合于一透明聚合物树脂中的荧光体颗粒123，该透明聚合物树脂例如是硅橡胶、聚氨酯、聚苯乙烯、聚酯、聚碳酸酯、聚酰亚胺、聚丙烯酸树脂、或多于一种类型的透明聚合物材料的组合。荧光层115可通过众所周知的的涂布工艺形成，例如丝网印刷、狭缝模具式涂布(slot die coating)、刮刀涂布(blade coating)、幕涂(curtain coating)、…等等。为增强总体光输出，可以不同的结构组合将光散射颗粒125(例如二氧化钛、碳酸钙、氧化硅、空气微孔、…等等)包含于荧光层115中，如图11C-图11H所示。如图11C所示，荧光体颗粒123及光散射颗粒125混合于荧光层115中后涂布至反射层111。如图11D所示，荧光体颗粒123及光散射颗粒125混合于荧光层115中后涂布至透明塑料膜120并接着设置至反射层111上。如第11E所示，荧光体颗粒123及光散射颗粒125依序涂布至透明塑料膜120并接着设置至反射层111上。如图11F所示，荧光体颗粒123及光散射颗粒125分别涂布至透明塑料膜120并接着堆叠于反射层111上。如图11G所示，荧光体颗粒123及光散射颗粒125分别直接涂布至反射层111上。
荧光层115用于将发光二极管发出的蓝光或紫外光转换成白光。举例而言，当发光二极管芯片107e是蓝光发光二极管或一“紫外光”发光二极管时，由荧光材料制成的荧光层115可将蓝光或紫外光转换成白光后从背光模块1发出。
或者，不设置荧光层115于反射层111上，而是添加荧光材料至如图4A所述的囊封剂107f。举例而言，如图11H所示，添加荧光体颗粒123至囊封剂107f。再举例而言，如图11I所示，同时添加荧光体颗粒123及光散射颗粒125二者至囊封剂107f。
为更增强发光二极管光源的光输出，可如上文所述在发光装置1中包含多个光学膜片。举例而言，如图12A所示，设置一或二片增亮膜(brightness enhanced film；BEF)131于荧光层115的顶部，然后设置一扩散膜133于增亮膜131的顶部。再举例而言，如图12B所示，设置增亮膜131于反射层111与荧光层115之间，并设置扩散膜133于荧光层115的顶部。可根据实际产品应用而改变荧光层115、增亮膜131与扩散膜133间的其它结构配置。
应注意，封装至光源单元107的发光二极管芯片的数量并无限制。图13A-图13C显示本发明的第四实施例。于本实施例中，接合多个发光二极管芯片107e至一个电路板单元107b，以形成一个光源单元107。金属层107c被有意地设计成电性连接图案化电极层105，如图13B所示。图案化电极层105亦被设计用于达成X-Y被动式矩阵驱动。藉此，可通过电极层105分别控制各发光二极管芯片107e。当然，还可组装多个光源单元107至基板101，并与电极层105连接，如图13C所示。或者，如图13D-图13F所示，光源单元107与电极层105间的电性连接亦可通过在基板101上形成孔或凹槽而形成，其中使孔的尺寸及形状适合于光源单元107的尺寸及形状。基板101的厚度可经选择以匹配电路板107a的厚度，以使光源单元107将紧紧地落入孔中，其中顶部金属层107c是与电极层105处于同一平面中。光源单元107的顶部金属层107c与电极层105间的电性连接可通过涂覆任意类型的导电胶104而形成。应注意，亦可由一导电胶带或通过涂覆一焊料于顶部金属层107c与电极层105之间来取代导电胶。图13D显示光源单元107的电路板单元107b的布局，第13E及13F图显示光源单元107在组装于基板101上之后的示意性结构。为防止光源单元107掉出基板101，可设置一支撑膜片102于基板101之下。
第五实施例揭露一种在光源单元107之间形成有分隔部的发光装置1。如图14A及图14B所示，多个隔离栅格结构121形成于透明层109内，以分隔该多个光源单元107。可通过丝网印刷、喷墨印刷、压印、或任何其它直接图案印刷工艺而预先形成隔离栅格结构121，然后涂布透明层109。或者，可预先形成透明层109，然后将隔离栅格结构121植入透明层109中，此可通过任何现有的的成型工艺或刀刃冲压(knife punching)方法达成。应注意，并不限制隔离栅格结构121的材料，且其较佳是白色且不透明或半透明，以阻挡来自相邻光源单元107的光。本实施例的发光装置1用于使每一单独光源单元107能够开关而不受任何相邻单元干扰，因此可获得具有锐利像素影像的一接通光源。更具体而言，通过控制光源单元107开关，发光装置1适可呈现具有界限分明的形状(例如本发明中所例示的正方形)的一影像。
本发明的第六实施例是关于一种双面背光模块。如图15A所示，可利用上述相同工艺复制如上所述的另一发光装置于基板101的另一侧。藉此，获得共享同一基板101的背对背发光装置。应注意，基板101较佳是由一金属板或金属薄片制成，其提供良好的散热。或者，如图15B所示，在基板101透明的情况下，即使仅提供一组光源单元107，亦可以一背对背方式组装另一类似的背光模块。光源单元107发出的光将被反射并进入背光模块。将获得两个相对的均匀照明。
本发明的第七实施例是提供一种包含前述实施例中所揭露的发光装置1的显示器3。显示器3还包含堆叠于发光装置1上的一面板。参见图16A，该面板是一用于显示影像的液晶面板161。参见图16B，该面板是一电润湿面板163，其中设置有含荧光体颗粒的油滴。电润湿面板163堆叠于发光装置1上而形成一电润湿面板显示器(electrowetting panel display；EWD)5。通过施加一电压至电润湿面板，控制油滴集中或散开。可以想见，可从仅具有一种类型的光源的发光装置1选择性地发出至少二种不同颜色。
参见图16C，该面板是一触控面板165，其电性连接至一控制集成电路(integrated circuit；IC)169。另一电性装置，例如一薄型扬声器167，亦可应用于本实施例中。参见图16D，该面板是一太阳能面板171，其电性连接至一控制集成电路175。一蓄电池173还被提供以储存电力并为发光装置1提供电力。
综上所述，本发明揭露适用于大尺寸的直下式发光装置。该发光装置能够在超薄形式内产生一均匀的面光源，并能够通过电极层选择性地控制发光二极管芯片，藉此提供局部调光特征。
上述的实施例仅用来例举本发明的实施态样，以及阐释本发明的技术特征，并非用来限制本发明的保护范畴。任何熟悉此技术者可轻易完成的改变或均等性的安排均属于本发明所主张的范围，本发明的权利保护范围应以申请专利范围为准。

Claims (24)

1.一种发光装置，包含：
一基板；
一电极层，图案化于该基板上；
至少一光源单元，配置于该基板上，该至少一光源单元具有二极性相反的电极，该二电极电性连接至相同的该电极层；
一光散射层，覆盖该基板及该电极层；
一透明层，覆于该光散射层及该至少一光源单元上；以及
一反射层，设置于该透明层上，该反射层具有相对于该至少一光源单元分布的多个反射图案，并使该至少一光源单元上方的该些反射图案具有一相对于该至少一光源单元的更高的密度。
2.根据权利要求1所述的发光装置，其特征在于，还包含设置于该反射层上方的一荧光层，其中该荧光层涂布至该反射层上或涂布于欲设置至该反射层上的一透明塑料膜片上。
3.根据权利要求2所述的发光装置，其特征在于，该荧光层包含添加于其中的多个光散射颗粒。
4.根据权利要求3所述的发光装置，其特征在于，所述多个光散射颗粒是选自由如下组成的一群组：二氧化钛颗粒、碳化钙颗粒、二氧化硅颗粒、金属颗粒、空气微孔、及其组合。
5.根据权利要求1所述的发光装置，其特征在于，该至少一光源单元包含一电路板单元及电性连接至该电路板单元的至少一发光二极管芯片。
6.根据权利要求5所述的发光装置，其特征在于，该电路板单元包含一顶部金属层、一底部金属层、及连接该顶部金属层与该底部金属层的多个通孔。
7.根据权利要求6所述的发光装置，其特征在于，该至少一发光二极管芯片是打线接合或覆晶接合至该电路板单元的该顶部金属层。
8.根据权利要求7所述的发光装置，其特征在于，该底部金属层电性连接至该电极层。
9.根据权利要求7所述的发光装置，其特征在于，该基板形成有用于容置该至少一光源单元的至少一凹槽，且该顶部金属层电性连接至该电极层。
10.根据权利要求5所述的发光装置，其特征在于，该至少一发光二极管芯片是选自由如下组成的一群组：一红色发光二极管芯片、一绿色发光二极管芯片、一蓝色发光二极管芯片、一紫外光发光二极管芯片、及其组合。
11.根据权利要求5所述的发光装置，其特征在于，该至少一发光二极管芯片包含三个发光二极管芯片，包括一红色发光二极管芯片、一绿色发光二极管芯片及一蓝色发光二极管芯片。
12.根据权利要求5所述的发光装置，其特征在于，该至少一光源单元还包含包封该至少一发光二极管芯片的一囊封剂。
13.根据权利要求12所述的发光装置，其特征在于，该囊封剂是一透明聚合物树脂与至少一种荧光材料的一混合物。
14.根据权利要求12所述的发光装置，其特征在于，该囊封剂是一透明聚合物树脂与多个光散射颗粒的一混合物，所述多个光散射颗粒是选自由如下组成的一群组：二氧化钛颗粒、碳化钙颗粒、二氧化硅颗粒、金属颗粒、空气微孔、及其组合。
15.根据权利要求12所述的发光装置，其特征在于，该囊封剂是一透明聚合物树脂、至少一种荧光材料及多个光散射颗粒的一混合物。
16.根据权利要求1所述的发光装置，其特征在于，该光散射层是一聚合物树脂与多个光散射颗粒的一混合物，所述多个光散射颗粒是选自由如下组成的一群组：二氧化钛颗粒、碳化钙颗粒、二氧化硅颗粒、金属颗粒、空气微孔、及其组合。
17.根据权利要求1所述的发光装置，其特征在于，还包含设置于该反射层上方的一光学膜片，该光学膜片是选自由如下组成的一群组：一增亮膜、一扩散膜、及其组合。
18.根据权利要求1所述的发光装置，其特征在于，还包含垂直于该基板形成的多个隔离栅格结构，用以分隔该至少一光源单元。
19.根据权利要求1所述的发光装置，其特征在于，还包含对称设置于该基板的另一侧的另一电极层、另一光源单元、另一光散射层、另一透明层及另一反射层。
20.一种显示器，包含一面板及根据权利要求1所述的一发光装置，其中该面板是叠置于该发光装置上。
21.根据权利要求20所述的显示器，其特征在于，该面板是选自由如下组成的一群组：一电润湿面板、一液晶面板、一触控面板、及一太阳能面板。
22.一种用于制造一发光装置的方法，该方法包含以下步骤：
提供一基板；
形成一图案化电极层于该基板上；
配置至少一光源单元于该基板上，该至少一光源单元具有二极性相反的电极，该二电极电性连接至相同的该电极层；
涂布一光散射层以覆盖该基板及该电极层；
形成一透明层覆盖该光散射层及该至少一光源单元；以及
设置一反射层于该透明层上，该反射层具有相对于该至少一光源单元分布的多个反射图案，并使该至少一光源单元上方的该些反射图案具有一相对于该至少一光源单元的更高的密度。
23.根据权利要求22所述的方法，其特征在于，于该配置该至少一光源单元的步骤之前，还包含以下步骤：
提供一电路板；
接合多个发光二极管芯片至该电路板；以及
切割该电路板以形成至少一光源单元。
24.根据权利要求22所述的方法，其特征在于，还包含以下步骤：
设置一荧光层于该反射层之上。
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