TWI393241B - 發光裝置、顯示器及其製造方法 - Google Patents
發光裝置、顯示器及其製造方法 Download PDFInfo
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- TWI393241B TWI393241B TW098125833A TW98125833A TWI393241B TW I393241 B TWI393241 B TW I393241B TW 098125833 A TW098125833 A TW 098125833A TW 98125833 A TW98125833 A TW 98125833A TW I393241 B TWI393241 B TW I393241B
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- 238000000034 method Methods 0.000 title claims abstract description 37
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 16
- 239000000758 substrate Substances 0.000 claims abstract description 61
- 238000000149 argon plasma sintering Methods 0.000 claims abstract description 40
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 27
- 239000002245 particle Substances 0.000 claims description 44
- 229910052751 metal Inorganic materials 0.000 claims description 31
- 239000002184 metal Substances 0.000 claims description 31
- 239000013078 crystal Substances 0.000 claims description 16
- 239000010408 film Substances 0.000 claims description 15
- 239000008393 encapsulating agent Substances 0.000 claims description 14
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 12
- 229920003023 plastic Polymers 0.000 claims description 12
- 239000004973 liquid crystal related substance Substances 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 11
- 239000002952 polymeric resin Substances 0.000 claims description 7
- 229920003002 synthetic resin Polymers 0.000 claims description 7
- 229910000420 cerium oxide Inorganic materials 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 6
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 claims description 6
- 239000002985 plastic film Substances 0.000 claims description 6
- 239000004408 titanium dioxide Substances 0.000 claims description 6
- 239000002923 metal particle Substances 0.000 claims description 5
- 239000003570 air Substances 0.000 claims description 4
- 238000005520 cutting process Methods 0.000 claims description 4
- 230000002708 enhancing effect Effects 0.000 claims description 3
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 claims description 2
- 229910052791 calcium Inorganic materials 0.000 claims description 2
- 239000011575 calcium Substances 0.000 claims description 2
- 230000003287 optical effect Effects 0.000 claims description 2
- 239000012788 optical film Substances 0.000 claims description 2
- 239000005997 Calcium carbide Substances 0.000 claims 2
- CLZWAWBPWVRRGI-UHFFFAOYSA-N tert-butyl 2-[2-[2-[2-[bis[2-[(2-methylpropan-2-yl)oxy]-2-oxoethyl]amino]-5-bromophenoxy]ethoxy]-4-methyl-n-[2-[(2-methylpropan-2-yl)oxy]-2-oxoethyl]anilino]acetate Chemical compound CC1=CC=C(N(CC(=O)OC(C)(C)C)CC(=O)OC(C)(C)C)C(OCCOC=2C(=CC=C(Br)C=2)N(CC(=O)OC(C)(C)C)CC(=O)OC(C)(C)C)=C1 CLZWAWBPWVRRGI-UHFFFAOYSA-N 0.000 claims 2
- 238000003763 carbonization Methods 0.000 claims 1
- 238000006116 polymerization reaction Methods 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 description 16
- 239000011248 coating agent Substances 0.000 description 12
- 229910052782 aluminium Inorganic materials 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 238000005286 illumination Methods 0.000 description 6
- 239000003973 paint Substances 0.000 description 6
- 238000009792 diffusion process Methods 0.000 description 5
- 239000004033 plastic Substances 0.000 description 5
- 239000004417 polycarbonate Substances 0.000 description 5
- 229920000642 polymer Polymers 0.000 description 5
- 239000004814 polyurethane Substances 0.000 description 5
- 239000004925 Acrylic resin Substances 0.000 description 4
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 4
- 239000004793 Polystyrene Substances 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 229920000515 polycarbonate Polymers 0.000 description 4
- 229920002635 polyurethane Polymers 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 239000003921 oil Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- -1 polyoxymethylene Polymers 0.000 description 3
- 229920002223 polystyrene Polymers 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 238000007650 screen-printing Methods 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000007641 inkjet printing Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000002861 polymer material Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- RICKKZXCGCSLIU-UHFFFAOYSA-N 2-[2-[carboxymethyl-[[3-hydroxy-5-(hydroxymethyl)-2-methylpyridin-4-yl]methyl]amino]ethyl-[[3-hydroxy-5-(hydroxymethyl)-2-methylpyridin-4-yl]methyl]amino]acetic acid Chemical compound CC1=NC=C(CO)C(CN(CCN(CC(O)=O)CC=2C(=C(C)N=CC=2CO)O)CC(O)=O)=C1O RICKKZXCGCSLIU-UHFFFAOYSA-N 0.000 description 1
- 229930040373 Paraformaldehyde Natural products 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- 238000005282 brightening Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000007766 curtain coating Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000010291 electrical method Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000007646 gravure printing Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000007737 ion beam deposition Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000004922 lacquer Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000007764 slot die coating Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 238000002207 thermal evaporation Methods 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000012463 white pigment Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133606—Direct backlight including a specially adapted diffusing, scattering or light controlling members
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/02—Diffusing elements; Afocal elements
- G02B5/0205—Diffusing elements; Afocal elements characterised by the diffusing properties
- G02B5/0236—Diffusing elements; Afocal elements characterised by the diffusing properties the diffusion taking place within the volume of the element
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/02—Diffusing elements; Afocal elements
- G02B5/0273—Diffusing elements; Afocal elements characterized by the use
- G02B5/0278—Diffusing elements; Afocal elements characterized by the use used in transmission
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133611—Direct backlight including means for improving the brightness uniformity
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B2207/00—Coding scheme for general features or characteristics of optical elements and systems of subclass G02B, but not including elements and systems which would be classified in G02B6/00 and subgroups
- G02B2207/113—Fluorescence
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B2207/00—Coding scheme for general features or characteristics of optical elements and systems of subclass G02B, but not including elements and systems which would be classified in G02B6/00 and subgroups
- G02B2207/115—Electrowetting
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/13306—Circuit arrangements or driving methods for the control of single liquid crystal cells
- G02F1/13324—Circuits comprising solar cells
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133342—Constructional arrangements; Manufacturing methods for double-sided displays
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/13338—Input devices, e.g. touch panels
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133601—Illuminating devices for spatial active dimming
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133603—Direct backlight with LEDs
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133605—Direct backlight including specially adapted reflectors
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133606—Direct backlight including a specially adapted diffusing, scattering or light controlling members
- G02F1/133607—Direct backlight including a specially adapted diffusing, scattering or light controlling members the light controlling member including light directing or refracting elements, e.g. prisms or lenses
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133612—Electrical details
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
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Description
本發明係關於一種能夠產生一均勻之面光源之新穎超薄型發光裝置及其製造方法。
典型之發光二極體(light emitting diode;LED)封裝包括:附著一發光二極體晶粒至由一鑄鋁件製成之一引線框架(lead frame),打線接合(wire bonding)以電性連接發光二極體至引線框架,並利用一成型製程(molding process)以一光學透明之環氧樹脂囊封該發光二極體、接合線及引線框架,其中二引線自該成型囊封引出以用於電性連接。此種類型之發光二極體封裝結構形成一「點」光源,並廣泛適用於一般之照明、訊息板(message board)及燈箱。另一種發光二極體封裝則將發光二極體封裝成用於SMT總成之一非常緊密之形式,其廣泛用於液晶顯示器(liquid crystal display;LCD)背光單元應用。然而,在本領域中眾所習知,該等典型之發光二極體封裝非常昂貴(相較於發光二極體裸晶粒而言)並且無法用於形成一均勻之面光源,除非使用一精密之光學設計及成本高昂之製造製程。以一液晶顯示裝置為例,液晶顯示裝置包含例如液晶面板、TFT底板(backplane)及背光模組等關鍵部件。液晶面板上之各單獨畫素受控於TFT底板以容許光透過,藉此決定各該畫素在受到背光模組發出之光之照射時之明暗狀態。由於顯示器日趨薄化之趨勢,背光模組之厚度及成本已成為本領域中之主要技術問題。
各種用於背光模組之光源,例如冷陰極螢光燈(cold cathode fluorescent light;CCFL)、電致發光(electroluminescent;EL)元件、發光二極體(light emitting diode;LED)、有機LED(organic LED;OLED)及聚合物LED(polymer LED;PLED)。出於成本及成熟性之考量,通常使用由複數個發光二極體形成之一發光二極體陣列作為一背光模組之光源。一般而言,背光模組可劃分成直下式(direct-type)背光模組及側邊入光式(edge-type)背光模組。
側邊入光式背光模組廣泛用於薄型液晶顯示器中。側邊入光式背光模組包含一導光板及沿該導光板之周緣設置之該複數個發光二極體,其中發光二極體之光進入導光板並照亮顯示器。然而,在本領域中已知,大型光導板製造困難,並且用於大型顯示器時成本高昂。此外,因各該發光二極體發出之光分佈於整個導光板中,無法形成區域性開/關控制。因此,側邊入光式背光模組無法用於需要進行局部調光之液晶顯示器。
用於顯示器之習知直下式背光模組直接將發光二極體設置於顯示面板之下。為增強均勻性,需要設置一擴散板(diffuser)於發光二極體前方。儘管直下式背光模組適用於大型顯示器,然可以想見,直下式背光模組不僅過於複雜以致難以佈置光源於背板上,且由於散射光之擴散板須與發光二極體間隔開,厚度過厚。換言之,直下式背光模組在提供均勻亮度與提供薄化外觀之間面臨兩難之選擇。
有鑒於此,需要為液晶顯示器背光模組應用開發一種用於大型產品製造、超薄、能提供均勻面光源及局部調光特徵之新穎發光裝置。
本發明之主要目的在於提供一種新穎之發光裝置、顯示器及該發光裝置之製造方法。該發光裝置包含複數個光源單元,該等光源單元係設置於基板上並電性連接一圖案化電極層。該等光源單元可透過該電極層選擇性地啟動,以開關一局部區域。
本發明提供一種新穎之發光二極體封裝結構,其不僅可以以一超薄形式產生一均勻之面光源,且亦能夠採用傳統印刷電路板(printed circuit board;PCB)組裝方法及高生產量之塗佈製程來製造。本發明所揭露之新穎發光二極體封裝結構可用於各種迫切需要超薄形式之產品應用,包括液晶顯示器背光模組、POP展示牌、裝飾性照明、燈箱、...等等。
更具體而言,該等光源單元係藉由如下方式製成:以一非常緊密之形式直接接合複數個發光二極體裸晶粒至一印刷電路板(printed circuit board;PCB),接著切割該印刷電路板以獲得大量光源單元。然後,可組裝該等光源單元於基板上以用於大型產品。
本發明之另一目的在於提供一種新穎發光裝置及製造該發光裝置之方法,其中用於形成內反射之反射層,以便無需使用習知之擴散板即可使發光二極體之光在內部結構中行進。藉此,可大幅降低整個封裝結構之厚度。
本發明之再一目的在於,較佳對光源單元採用發光二極體晶粒。因發光二極體晶粒遠較封裝之發光二極體廉價,本發明將習知塗佈製程與印刷電路板組裝製程相互整合於一起。本發明中採用發光二極體晶粒而非封裝之發光二極體。
本發明之又一目的在於提供一種用作一顯示器背光模組或用作一燈箱之發光裝置。本發明之發光裝置可係為雙側照明。該發光裝置可係為一自身呈現一影像之主動式光源,或係為一透過一面板呈現一影像之被動式光源。
為達上述目的,本發明揭露一種顯示器及其發光裝置。該顯示器更包含堆疊於該發光裝置上之一面板。該發光裝置包含一基板、一電極層、至少一光源單元、一光散射層、一透明層及一反射層。該電極層係圖案化於該基板上。該至少一光源單元係佈置於該基板上,以電性連接該電極層。該光散射層覆蓋除發光二極體晶粒區域外之該基板及該電極層,該透明層上覆於該光散射層及該至少一光源單元,並且該反射層設置於該透明層上。一控制電路電性連接該電極層,其能夠透過該電極層而選擇性地啟動該複數個光源單元。
本發明更揭露一種用於製造該發光裝置之方法。該方法包括以下步驟:提供一基板;形成一圖案化電極層於該基板上;佈置複數個光源單元於該基板上,以電性連接該電極層,其中各該光源單元包含一電路板單元及封裝至該電路板單元之至少一積體電路晶粒;塗佈一光散射層以覆蓋該基板及該電極層;形成上覆於該光散射層及該至少一光源單元之一透明層;以及設置一反射層於該透明層上。
為讓本發明之上述目的、技術特徵、和優點能更明顯易懂,下文係以較佳實施例、配合所附圖式進行詳細說明。
本發明係關於一種發光裝置,舉例而言,一種直下式背光模組。第1圖顯示根據本發明之第一實施例之發光裝置1。發光裝置1至少包含一基板101、圖案化於基板101上之一電極層105、及複數個光源單元107。光源單元107係設置於該基板上,以電性連接該電極層105。於本實施例中,其特徵在於,各該光源單元107包含一電路板單元及封裝至該電路板單元之至少一發光二極體(LED)晶粒。當然,發光裝置1更包含電性連接電極層105之一控制電路(圖未示出)。控制電路105能夠根據所顯示之影像,透過電極層105選擇性地啟動該複數個光源單元107,以達成局部調光之目的。
基板101係為由例如Al、Ni、Fe、Cu、不銹鋼或合金製成之一金屬板。基板101亦可由塑膠、玻璃、陶瓷或聚合物組合物製成。發光裝置1更包含形成於基板101上之一絕緣層103。電極層105係圖案化至絕緣層103上。發光裝置1更包含一光散射層108,塗佈於基板101及電極層105上除發光二極體晶粒以外之區域,光散射層108係由例如包含二氧化鈦顆粒(如商業白色漆)、碳化鈣顆粒、氧化矽顆粒、金屬顆粒、空氣微孔、或複數種顆粒之一混合物之一聚合物樹脂製成。發光裝置1更包含上覆於光散射層108及光源單元107之一透明層109、設置於透明層109上之一反射層111、及設置於反射層111上方之一螢光層115。反射層111形成具有相對於光源單元107分佈之複數個反射圖案113。
本發明之第二實施例係關於一種用於製造第一實施例之發光裝置1之方法。首先,第2A圖至第4B圖顯示製造光源單元107之製程。如第2A及2D圖所示,提供包含複數個電路板單元107b之一電路板107a,例如一印刷電路板(printed circuit board;PCB)或一撓性印刷電路板(flexible printed circuit board;FPC)。電路板107a可係由環氧樹脂或聚醯亞胺(polyimide)製成,並於頂面及底面形成有金屬層107c。金屬層107c可係為Cu、Al、Sn、Ni、或合金。各該電路板單元107b亦形成有通孔107d,此不僅用於傳導電流,且亦用於導熱。金屬層107c係有意地設計成具有一大之表面覆蓋區域,以更佳地從發光二極體晶粒散熱。此外,有意地形成連接頂部金屬層與底部金屬層之備援通孔107d,以增強從頂部金屬層107c(此處接合有發光二極體晶粒)至底部金屬層107c之熱傳導,其中底部金屬層107c更連接至基板101之電極層105。
然後,如第3A-3D圖所示,將複數個發光二極體晶粒107e相對於電路板單元107b接合至電路板107a。該接合製程可為打線接合(例如,如第3B圖所示之雙打線接合及如第3C圖所示之單打線接合)或覆晶接合(如第3D圖所示)。因在本發明中採用發光二極體晶粒107e而非封裝之發光二極體,故可降低發光裝置1之成本並提高設計自由度。
應注意,光源單元107可包含一電路板單元107b及接合至電路板單元107b之複數個發光二極體晶粒107e。各該發光二極體晶粒可為一紅色發光二極體晶粒、一綠色發光二極體晶粒、一藍色發光二極體晶粒或一紫外光發光二極體晶粒。如第3E圖所示,三個發光二極體晶粒107e,即一紅色發光二極體晶粒、一綠色發光二極體晶粒及一藍色發光二極體晶粒,接合至電路板單元107b。金屬層107c有意地設計用於電性連接圖案化電極層105,如第3F圖所示。藉此,可透過電極層105獨立地控制發光二極體晶粒107e。
較佳地,如第4A及4B圖所示,藉由塗佈囊封劑107f至發光二極體晶粒107e,囊封各該發光二極體晶粒107e。囊封劑107f包括任何能施配至發光二極體晶粒107e上以於後續製程中包封和保護發光二極體晶粒107e之習知膠。囊封劑107f可由例如環氧樹脂、聚氨酯、聚碳酸酯、聚酯、聚矽氧型聚合物、或聚丙烯酸樹脂等透明聚合物材料製成。囊封劑107f亦可由含有光散射顆粒之透明聚合物材料製成,該等光散射顆粒例如為二氧化鈦顆粒、碳酸鈣顆粒、氧化矽顆粒、金屬顆粒、或空氣微孔或複數種顆粒之一混合物。或者,囊封劑107f可由用於將發光二極體晶粒107e所發出之光轉換成白光之一螢光材料製成。
接著,執行一切割或鋸割製程以形成複數個光源單元107。以此方式,可非常緊密地製成分別包含一電路板單元107a及封裝至電路板單元107a之一發光二極體晶粒107e之複數個光源單元107,以提供大量之光源單元,進而降低成本。舉例而言,大小為100毫米×100毫米之印刷電路板107a可切割成400(即20×20)個光源單元107,其中各該光源單元107之大小為5毫米×5毫米。於該切割或鋸割製程後,接著以一所需取向放置該等光源單元107於一托盤中,俾利於後續製程中之取放。
此外,可同時執行以下製程。如第5A及5B圖所示,提供基板101。基板101可係為一金屬板或金屬薄片,由鋁、銅、鐵、不銹鋼、或任意類型之合金製成。其亦可由塑膠、陶瓷、玻璃或任意複合材料製成。在基板101係為導電性之情形中,將需要一絕緣層103(或一介電塗層)形成於基板101上。或者,絕緣層103可係為任意具有低導電率之材料,例如聚合物塗層(例如聚苯乙烯、聚甲基丙烯酸甲酯、聚氯乙烯、聚氨酯、聚醯亞胺、聚醯胺、聚碳酸酯、聚丙烯酸樹脂等等)、任意類型之漆(例如白色漆、油基或水基漆等等)或任意複合塗層材料。或者,絕緣層103可藉由電鍍或藉由利用化學或電性方法(例如氧化或陽極處理)之表面處理直接形成於金屬板之表面上。
然後,如第6A及6B圖所示,將電極層105圖案化於基板101(或絕緣層103)上。較佳地,電極層105可由銀膠/墨水、碳黑膠/墨水、銅膠/墨水、或聚合物樹脂與導電顆粒(例如Ag、Au、Al、Cu、Fe或碳黑)之任意組合形成。習知之塗佈方法,例如絲網印刷(screen printing)、柔性版印刷(flexo printing)、凸版印刷(stamp printing)、噴墨印刷(inkjet printing)、凹版印刷(gravure printing)、及熱轉印(thermal transferring)可適用於將電極層105圖案化。或者,可預先形成一導電層於絕緣層103上,然後蝕刻之而形成圖案化電極層105。再或者,基板101上之圖案化電極層105可係為一傳統印刷電路板。電極層105之圖案較佳被設計於例如X及Y方向上。
參見第7A-7C圖,其中第7A圖係為俯視平面圖,而第7B及7C圖係為剖視圖,光源單元107可佈置於基板101上,以電性連接電極層105。藉此,控制電路可根據需要分別控制各該光源單元107。如第7C圖所示,為確保光源單元107之電路板單元107b粘附至基板101,可額外塗佈一滴膠117於電路板單元107a之下。於光源單元107置於基板101後,使其經受一烘烤(baking)製程。烘烤溫度及烘烤時間係取決於電極層105之類型。
為增強背光模組1之亮度效能,設置光散射層108以覆蓋除發光二極體晶粒區域以外之基板101及電極層105,如第8圖所示。如同其中一種製造方法,設置一遮罩(mask)於基板101上,該遮罩係設計用於僅遮蓋光源單元107上之發光二極體晶粒區域。然後,塗佈(例如,藉由噴塗、溶液塗佈或其它塗佈製程)或沉積(化學或物理方式)光散射層108於基板上位於發光二極體晶粒區域以外之區域中,光散射層108例如為商業白漆、TiO2
膏、CaCO3
膏、含白色顏料或含任何閃光顆粒之聚合物樹脂、或空氣微孔。最後,移除遮罩,使發光二極體晶粒區域保持敞開而不被光散射層108覆蓋。可能需要對光散射層108實施一烘烤製程,以移除任何多餘之溶劑並確保光散射層108乾燥。
接著,參見第9圖,塗佈透明層109於光散射層108及光源單元107上並覆蓋整個區域。透明層109可由任意類型之透明聚合物材料形成,例如由矽橡膠(silicon rubber)、聚氨酯(polyurethane)、聚苯乙烯(polystyrene)、聚酯(polyester)、聚碳酸酯(polycarbonate)、聚醯亞胺(polyimide)、聚丙烯酸樹脂(polyacrylic resin)、或多於一種類型之透明聚合物材料之一組合。若與反射層111一起使用,則透明層109之折射率較佳與囊封劑107f(第9圖未示出)之折射率相匹配。
參見第10圖,接著設置反射層111於透明層109上,反射層111具有相對於光源單元107分佈於一軟性基板上之複數個反射圖案113,該軟性基板較佳係由任意類型之透明塑膠(例如PET、PEN、PES、PU、PS、PC、PE、PP、PI、或ABS)製成,或是可圖案使光穿透之銅箔基板(metal foil)亦或其他金屬合金薄片。反射圖案113之分佈方式使光源單元107上方之圖案具有一更高之密度。藉此,反射層111有助於光源單元107發出之光朝在正下方未設置有發光二極體之區域行進。反射圖案113係利用一習知真空沉積製程(例如濺射、熱沉積或離子束沉積),藉由沉積一薄層金屬膜於塑膠基板上而製成。金屬膜之反射圖案113可藉由黃光製程、直接蝕刻製程、剝離製程(lift-off process)、...等等製成。金屬膜可包含Ag、Al、Ni、Cr、Mo、Cu、Au或Pt。反射圖案113亦可藉由將白色漆或反射漆圖案化至塑膠基板上而形成。
最後,形成螢光層115於反射層111上。如第11A圖所示,螢光層115可直接塗佈於圖案化之反射層111上。或者,螢光層115可塗佈於一透明塑膠膜120上,然後設置至反射層111上,如第11B圖所示。螢光層115包含均勻混合於一透明聚合物樹脂中之螢光體顆粒123,該透明聚合物樹脂例如係為矽橡膠、聚氨酯、聚苯乙烯、聚酯、聚碳酸酯、聚醯亞胺、聚丙烯酸樹脂、或多於一種類型之透明聚合物材料之組合。螢光層115可藉由眾所習知之塗佈製程形成,例如絲網印刷、狹縫模具式塗佈(slot die coating)、刮刀塗佈(blade coating)、幕塗(curtain coating)、...等等。為增強總體光輸出,可以不同之結構組合將光散射顆粒125(例如二氧化鈦、碳酸鈣、氧化矽、空氣微孔、...等等)包含於螢光層115中,如第11C-11H圖所示。如第11C圖所示,螢光體顆粒123及光散射顆粒125混合於螢光層115中後塗佈至反射層111。如第11D圖所示,螢光體顆粒123及光散射顆粒125混合於螢光層115中後塗佈至透明塑膠膜120並接著設置至反射層111上。如第11E所示,螢光體顆粒123及光散射顆粒125依序塗佈至透明塑膠膜120並接著設置至反射層111上。如第11F圖所示,螢光體顆粒123及光散射顆粒125分別塗佈至透明塑膠膜120並接著堆疊於反射層111上。如第11G圖所示,螢光體顆粒123及光散射顆粒125分別直接塗佈至反射層111上。
螢光層115用於將發光二極體發出之藍光或紫外光轉換成白光。舉例而言,當發光二極體晶粒107e係為藍光發光二極體或一「紫外光」發光二極體時,由螢光材料製成之螢光層115可將藍光或紫外光轉換成白光後從背光模組1發出。
或者,不設置螢光層115於反射層111上,而是添加螢光材料至如第4A圖所述之囊封劑107f。舉例而言,如第11H圖所示,添加螢光體顆粒123至囊封劑107f。再舉例而言,如第11I圖所示,同時添加螢光體顆粒123及光散射顆粒125二者至囊封劑107f。
為更增強發光二極體光源之光輸出,可如上文所述在發光裝置1中包含複數個光學膜片。舉例而言,如第12A圖所示,設置一或二片增亮膜(brightness enhanced film;BEF)131於螢光層115之頂部,然後設置一擴散膜133於增亮膜131之頂部。再舉例而言,如第12B圖所示,設置增亮膜131於反射層111與螢光層115之間,並設置擴散膜133於螢光層115之頂部。可根據實際產品應用而改變螢光層115、增亮膜131與擴散膜133間之其它結構配置。
應注意,封裝至光源單元107之發光二極體晶粒之數量並無限制。第13A-13C圖顯示本發明之第四實施例。於本實施例中,接合複數個發光二極體晶粒107e至一個電路板單元107b,以形成一個光源單元107。金屬層107c被有意地設計成電性連接圖案化電極層105,如第13B圖所示。圖案化電極層105亦被設計用於達成X-Y被動式矩陣驅動。藉此,可透過電極層105分別控制各發光二極體晶粒107e。當然,可更組裝複數個光源單元107至基板101,並與電極層105連接,如第13C圖所示。或者,如第13D-13F圖所示,光源單元107與電極層105間之電性連接亦可藉由在基板101上形成孔或凹槽而形成,其中使孔之尺寸及形狀適合於光源單元107之尺寸及形狀。基板101之厚度可經選擇以匹配電路板107a之厚度,俾使光源單元107將緊緊地落入孔中,其中頂部金屬層107c係與電極層105處於同一平面中。光源單元107之頂部金屬層107c與電極層105間之電性連接可藉由塗覆任意類型之導電膠104而形成。應注意,亦可由一導電膠帶或藉由塗覆一焊料於頂部金屬層107c與電極層105之間來取代導電膠。第13D圖顯示光源單元107之電路板單元107b之佈局,第13E及13F圖顯示光源單元107在組裝於基板101上之後之示意性結構。為防止光源單元107掉出基板101,可設置一支撐膜片102於基板101之下。
第五實施例揭露一種在光源單元107之間形成有分隔部之發光裝置1。如第14A及14B圖所示,複數個隔離柵格結構121形成於透明層109內,以分隔該複數個光源單元107。可藉由絲網印刷、噴墨印刷、壓印、或任何其他直接圖案印刷製程而預先形成隔離柵格結構121,然後塗佈透明層109。或者,可預先形成透明層109,然後將隔離柵格結構121植入透明層109中,此可藉由任何習知之成型製程或刀刃衝壓(knife punching)方法達成。應注意,並不限制隔離柵格結構121之材料,且其較佳係為白色且不透明或半透明,以阻擋來自相鄰光源單元107之光。本實施例之發光裝置1係用於使每一單獨光源單元107能夠開關而不受任何相鄰單元干擾,因此可獲得具有銳利畫素影像之一接通光源。更具體而言,藉由控制光源單元107開關,發光裝置1適可呈現具有界限分明之形狀(例如本發明中所例示之正方形)之一影像。
本發明之第六實施例係關於一種雙面背光模組。如第15A圖所示,可利用上述相同製程複製如上所述之另一發光裝置於基板101之另一側。藉此,獲得共享同一基板101之背對背發光裝置。應注意,基板101較佳係由一金屬板或金屬薄片製成,其提供良好之散熱。或者,如第15B圖所示,在基板101透明之情況下,即使僅提供一組光源單元107,亦可以一背對背方式組裝另一類似之背光模組。光源單元107發出之光將被反射並進入背光模組。將獲得兩個相對之均勻照明。
本發明之第七實施例係提供一種包含前述實施例中所揭露之發光裝置1之顯示器3。顯示器3更包含堆疊於發光裝置1上之一面板。參見第16A圖,該面板係為一用於顯示影像之液晶面板161。參見第16B圖,該面板係為一電潤濕面板163,其中設置有含螢光體顆粒之油滴。電潤濕面板163堆疊於發光裝置1上而形成一電潤濕面板顯示器(electrowetting panel display;EWD)5。藉由施加一電壓至電潤濕面板,控制油滴集中或散開。可以想見,可從僅具有一種類型之光源之發光裝置1選擇性地發出至少二種不同顏色。
參見第16C圖,該面板係為一觸控面板165,其電性連接至一控制積體電路(integrated circuit;IC)169。另一電性裝置,例如一薄型揚聲器167,亦可應用於本實施例中。參見第16D圖,該面板係為一太陽能面板171,其電性連接至一控制積體電路175。一蓄電池173更被提供以儲存電力並為發光裝置1提供電力。
綜上所述,本發明揭露適用於大尺寸之直下式發光裝置。該發光裝置能夠在超薄形式內產生一均勻之面光源,並能夠透過電極層選擇性地控制發光二極體晶粒,藉此提供局部調光特徵。
上述之實施例僅用來例舉本發明之實施態樣,以及闡釋本發明之技術特徵,並非用來限制本發明之保護範疇。任何熟悉此技術者可輕易完成之改變或均等性之安排均屬於本發明所主張之範圍,本發明之權利保護範圍應以申請專利範圍為準。
1...發光裝置
3...顯示器
5...電潤濕面板顯示器
101...基板
102...支撐膜片
103...絕緣層
104...導電膠
105...電極層
107...光源單元
107a...電路板
107b...電路板單元
107c...金屬層
107d...通孔
107e...發光二極體晶粒
107f...囊封劑
108...光散射層
109...透明層
111...反射層
113...反射圖案
115...螢光層
117...膠
120...透明塑膠膜
121...隔離柵格結構
123...螢光體顆粒
125...光散射顆粒
131...增亮膜
133...擴散膜
161...液晶面板
163...電潤濕面板
165...觸控面板
167...薄型揚聲器
169...控制積體電路
171...太陽能面板
173...蓄電池
175...控制積體電路
第1圖係為本發明之一實施例之發光裝置之示意圖;
第2A圖至第4B圖係為光源單元製造製程之示意圖;
第5A及5B圖係為一種用於形成絕緣層於基板上之製程之示意圖;
第6A及6B圖係為一種用於圖案化電極層之製程之示意圖;
第7A-7C圖係為一種用於佈置光源於基板上之製程之示意圖;
第8圖係為一種用於塗佈光散射層之製程之示意圖;
第9圖係為一種用於形成透明層之製程之示意圖;
第10圖係為一種用於設置反射層之製程之示意圖;
第11A-11I圖係為一種用於形成螢光層之製程之示意圖;
第12A及12B圖係為本發明第三實施例之示意圖;
第13A-13F圖係為本發明第四實施例之示意圖;
第14A及14B圖係為本發明第五實施例之示意圖;
第15A及15B圖係為本發明第六實施例之示意圖;
第16A-16D圖係為本發明第七實施例之顯示器之示意圖。
1...發光裝置
101...基板
103...絕緣層
105...電極層
107...光源單元
108...光散射層
109...透明層
111...反射層
113...反射圖案
115...螢光層
Claims (24)
- 一種發光裝置,包含:一基板;一電極層,圖案化於該基板上;複數光源單元,配置於該基板上,以電性連接該電極層並形成一陣列,各光源單元具有極性相反之二接觸點,該二接觸點電性連接至相同的該電極層;一光散射層,覆蓋該基板及該電極層;一透明層,覆蓋於該光散射層及該等光源單元上之一整個區域;以及一反射層,設置於該透明層上,該反射層具有相對於該等光源單元分佈之複數反射圖案,該等反射圖案於各該光源單元上方具有一更高之密度。
- 如請求項1所述之發光裝置,更包含設置於該反射層上方之一螢光層(phosphor layer),其中該螢光層係塗佈至該反射層上或塗佈於欲設置至該反射層上之一透明塑膠膜片上。
- 如請求項2所述之發光裝置,其中該螢光層包含添加於其中之複數個光散射顆粒。
- 如請求項3所述之發光裝置,其中該等光散射顆粒係選自由如下組成之一群組:二氧化鈦顆粒、碳化鈣顆粒、二氧化矽顆粒、金屬顆粒、空氣微孔、及其組合。
- 如請求項1所述之發光裝置,其中各該光源單元包含一電路板單元及電性連接至該電路板單元之至少一發光二極體(light emitting diode;LED)晶粒。
- 如請求項5所述之發光裝置,其中該電路板單元包含一頂部金屬層、一底部金屬層、及連接該頂部金屬層與該底部金屬層之複數個通孔(via hole)。
- 如請求項6所述之發光裝置,其中該至少一發光二極體晶粒係打線接合(wire bonded)或覆晶接合(flip chip bonded)至該電路板單元之該頂部金屬層。
- 如請求項7所述之發光裝置,其中該底部金屬層電性連接至該電極層。
- 如請求項7所述之發光裝置,其中該基板係形成有用於容置該等光源單元之複數凹槽,且該頂部金屬層電性連接至該電極層。
- 如請求項5所述之發光裝置,其中該至少一發光二極體晶粒係選自由如下組成之一群組:一紅色發光二極體晶粒、一綠色發光二極體晶粒、一藍色發光二極體晶粒、一紫外光發光二極體晶粒、及其組合。
- 如請求項5所述之發光裝置,其中該至少一發光二極體晶粒包含三個發光二極體晶粒,包括一紅色發光二極體晶粒、一綠色發光二極體晶粒及一藍色發光二極體晶粒。
- 如請求項5所述之發光裝置,其中各該光源單元更包含包封該至少一發光二極體晶粒之一囊封劑(encapsulant)。
- 如請求項12所述之發光裝置,其中該囊封劑係為一透明聚合物樹脂與至少一種螢光材料之一混合物。
- 如請求項12所述之發光裝置,其中該囊封劑係為一透明聚合 物樹脂與複數個光散射顆粒之一混合物,該等光散射顆粒係選自由如下組成之一群組:二氧化鈦顆粒、碳化鈣顆粒、二氧化矽顆粒、金屬顆粒、空氣微孔、及其組合。
- 如請求項12所述之發光裝置,其中該囊封劑係為一透明聚合物樹脂、至少一種螢光材料及複數個光散射顆粒之一混合物。
- 如請求項1所述之發光裝置,其中該光散射層係為一聚合物樹脂與複數個光散射顆粒之一混合物,該等光散射顆粒係選自由如下組成之一群組:二氧化鈦顆粒、碳化鈣顆粒、二氧化矽顆粒、金屬顆粒、空氣微孔、及其組合。
- 如請求項1所述之發光裝置,更包含設置於該反射層上方之一光學膜片(optical sheet),該光學膜片係選自由如下組成之一群組:一增亮膜(brightness enhanced film;BEF)、一擴散膜(diffuser film)、及其組合。
- 如請求項1所述之發光裝置,更包含垂直於該基板形成之複數個隔離柵格結構,用以分隔該等光源單元。
- 如請求項1所述之發光裝置,更包含對稱設置於該基板之另一側之一電極層、複數光源單元、一光散射層、一透明層及一反射層。
- 一種顯示器,包含一面板及如請求項1所述之一發光裝置,其中該面板係疊置於該發光裝置上。
- 如請求項20所述之顯示器,其中該面板係選自由如下組成之一群組:一電潤濕面板(electrowetting panel)、一液晶面板、一觸控面板(touch panel)、及一太陽能面板(solar cell panel)。
- 一種用於製造一發光裝置之方法,該方法包含以下步驟:提供一基板;形成一圖案化電極層於該基板上;配置複數光源單元於該基板上,以電性連接該電極層並形成一陣列,各光源單元具有極性相反之二接觸點,該二接觸點電性連接至相同的該電極層;塗佈一光散射層以覆蓋該基板及該電極層;形成一透明層覆蓋該光散射層及該至少一光源單元上之一整個區域;以及設置一反射層於該透明層上,該反射層具有相對於該等光源單元分佈之複數反射圖案,該等反射圖案於各該光源單元上方具有一更高之密度。
- 如請求項22所述之方法,於該配置該等光源單元之步驟之前,更包含以下步驟:提供一電路板;接合複數個發光二極體(light emitting diode;LED)晶粒至該電路板;以及切割該電路板以形成該等光源單元。
- 如請求項22所述之方法,更包含以下步驟:設置一螢光層於該反射層之上。
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CN101958315B (zh) | 2013-05-01 |
US8110839B2 (en) | 2012-02-07 |
CN101958315A (zh) | 2011-01-26 |
TW201103120A (en) | 2011-01-16 |
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