KR20180128464A - 소형 피치 직시형 디스플레이 및 이의 제조 방법 - Google Patents

소형 피치 직시형 디스플레이 및 이의 제조 방법 Download PDF

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Publication number
KR20180128464A
KR20180128464A KR1020187031032A KR20187031032A KR20180128464A KR 20180128464 A KR20180128464 A KR 20180128464A KR 1020187031032 A KR1020187031032 A KR 1020187031032A KR 20187031032 A KR20187031032 A KR 20187031032A KR 20180128464 A KR20180128464 A KR 20180128464A
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KR
South Korea
Prior art keywords
pixels
type display
display device
grid
circuit board
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Withdrawn
Application number
KR1020187031032A
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English (en)
Korean (ko)
Inventor
네일 디먼
마이클 잰슨
형철 이
카이 리우
카즈노리 오쿠이
Original Assignee
글로 에이비
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Application filed by 글로 에이비 filed Critical 글로 에이비
Publication of KR20180128464A publication Critical patent/KR20180128464A/ko
Withdrawn legal-status Critical Current

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    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09GARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/22Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
    • G09G3/30Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
    • G09G3/32Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H01L25/0753
    • H01L25/13
    • H01L25/167
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0274Optical details, e.g. printed circuits comprising integral optical means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/181Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • H05K3/284Applying non-metallic protective coatings for encapsulating mounted components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/303Assembling printed circuits with electric components, e.g. with resistors with surface mounted components
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/84Coatings, e.g. passivation layers or antireflective coatings
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09GARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2300/00Aspects of the constitution of display devices
    • G09G2300/04Structural and physical details of display devices
    • G09G2300/0404Matrix technologies
    • G09G2300/0408Integration of the drivers onto the display substrate
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09GARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2300/00Aspects of the constitution of display devices
    • G09G2300/04Structural and physical details of display devices
    • G09G2300/0439Pixel structures
    • G09G2300/0452Details of colour pixel setup, e.g. pixel composed of a red, a blue and two green components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0104Properties and characteristics in general
    • H05K2201/0112Absorbing light, e.g. dielectric layer with carbon filler for laser processing
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10106Light emitting diode [LED]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10128Display
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431Details of mounted components
    • H05K2201/10507Involving several components
    • H05K2201/10522Adjacent components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305Moulding and encapsulation
    • H05K2203/1316Moulded encapsulation of mounted components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Led Device Packages (AREA)
KR1020187031032A 2016-04-22 2017-04-21 소형 피치 직시형 디스플레이 및 이의 제조 방법 Withdrawn KR20180128464A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201662326255P 2016-04-22 2016-04-22
US62/326,255 2016-04-22
PCT/US2017/028771 WO2017184941A1 (en) 2016-04-22 2017-04-21 Small pitch direct view display and method of making thereof

Publications (1)

Publication Number Publication Date
KR20180128464A true KR20180128464A (ko) 2018-12-03

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020187031032A Withdrawn KR20180128464A (ko) 2016-04-22 2017-04-21 소형 피치 직시형 디스플레이 및 이의 제조 방법

Country Status (5)

Country Link
US (1) US10600354B2 (https=)
EP (1) EP3446330A4 (https=)
JP (1) JP2019515489A (https=)
KR (1) KR20180128464A (https=)
WO (1) WO2017184941A1 (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20180210195A1 (en) * 2017-01-24 2018-07-26 Microsoft Technology Licensing, Llc Avoiding ghost images
US10878742B2 (en) * 2017-01-24 2020-12-29 Planar Systems, Inc. Protective cover for direct view light emitting diode displays
KR102532307B1 (ko) 2017-11-02 2023-05-15 삼성디스플레이 주식회사 표시장치
US10269711B1 (en) * 2018-03-16 2019-04-23 Taiwan Semiconductor Manufacturing Company Ltd. Semiconductor device and method for manufacturing the same
US10627673B2 (en) 2018-04-06 2020-04-21 Glo Ab Light emitting diode array containing a multilayer bus electrode and method of making the same
CN113950739A (zh) * 2019-05-09 2022-01-18 达科电子股份有限公司 用于显示模块的模制对比度掩膜
FR3097981B1 (fr) * 2019-06-28 2021-07-02 Valeo Vision Dispositif lumineux pour véhicule automobile
CN112930493B (zh) * 2019-10-07 2023-07-18 依视路国际公司 表征光学元件
US11594663B2 (en) 2019-12-20 2023-02-28 Nanosys, Inc. Light emitting diode device containing a micro lens array and method of making the same
TWI719775B (zh) * 2019-12-25 2021-02-21 錼創顯示科技股份有限公司 顯示裝置
CN111464803B (zh) * 2020-04-16 2022-04-12 中国长城科技集团股份有限公司 一种显示控制系统

Family Cites Families (67)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0553511A (ja) * 1991-08-28 1993-03-05 Toyoda Gosei Co Ltd カラーデイスプレイ装置
JPH08202290A (ja) * 1995-01-26 1996-08-09 Daihatsu Motor Co Ltd Ledディスプレイモジュール
US6589650B1 (en) * 2000-08-07 2003-07-08 3M Innovative Properties Company Microscope cover slip materials
JP4049624B2 (ja) 2001-07-27 2008-02-20 株式会社エンプラス 面光源装置、画像表示装置及び導光板
JP4223740B2 (ja) 2002-06-13 2009-02-12 シチズン電子株式会社 発光素子用パッケージ
US7335908B2 (en) 2002-07-08 2008-02-26 Qunano Ab Nanostructures and methods for manufacturing the same
US20040061810A1 (en) 2002-09-27 2004-04-01 Lumileds Lighting, U.S., Llc Backlight for a color LCD using wavelength-converted light emitting devices
TWI351548B (en) 2003-01-15 2011-11-01 Semiconductor Energy Lab Manufacturing method of liquid crystal display dev
US8270061B2 (en) 2003-11-01 2012-09-18 Silicon Quest Kabushiki-Kaisha Display apparatus using pulsed light source
US7132677B2 (en) 2004-02-13 2006-11-07 Dongguk University Super bright light emitting diode of nanorod array structure having InGaN quantum well and method for manufacturing the same
TWI367686B (en) * 2004-04-07 2012-07-01 Semiconductor Energy Lab Light emitting device, electronic device, and television device
GB0408347D0 (en) 2004-04-15 2004-05-19 Design Led Products Ltd Light guide device
US7204631B2 (en) 2004-06-30 2007-04-17 3M Innovative Properties Company Phosphor based illumination system having a plurality of light guides and an interference reflector
WO2006131924A2 (en) 2005-06-07 2006-12-14 Oree, Advanced Illumination Solutions Inc. Illumination apparatus
CN101313176B (zh) 2005-11-21 2010-11-24 皇家飞利浦电子股份有限公司 光学系统
JP4669799B2 (ja) 2006-03-01 2011-04-13 パナソニック株式会社 エッジ入力型バックライト
CN101443265B (zh) 2006-03-08 2014-03-26 昆南诺股份有限公司 在硅上无金属合成外延半导体纳米线的方法
AU2007313096B2 (en) 2006-03-10 2011-11-10 Unm Rainforest Innovations Pulsed growth of GaN nanowires and applications in group III nitride semiconductor substrate materials and devices
JP4585481B2 (ja) 2006-04-28 2010-11-24 株式会社 日立ディスプレイズ Ledバックライト及びそれを用いた液晶表示装置
GB2438440B (en) 2006-05-26 2008-04-23 Design Led Products Ltd A composite light guiding device
US20090128781A1 (en) 2006-06-13 2009-05-21 Kenneth Li LED multiplexer and recycler and micro-projector incorporating the Same
US20080049445A1 (en) 2006-08-25 2008-02-28 Philips Lumileds Lighting Company, Llc Backlight Using High-Powered Corner LED
US20080080184A1 (en) * 2006-10-03 2008-04-03 Cao Group Inc. Pixilated LED Light Source for Channel Letter Illumination
EP2102899B1 (en) 2007-01-12 2020-11-11 QuNano AB Nitride nanowires and method of producing such
US8889216B2 (en) * 2007-05-31 2014-11-18 Nthdegree Technologies Worldwide Inc Method of manufacturing addressable and static electronic displays
JP4613947B2 (ja) 2007-12-07 2011-01-19 ソニー株式会社 照明装置、色変換素子及び表示装置
JP2009177117A (ja) * 2007-12-25 2009-08-06 Toshiba Lighting & Technology Corp 表示装置
WO2009133870A1 (ja) 2008-04-30 2009-11-05 アルプス電気株式会社 照光装置およびその製造方法
GB2459888B (en) 2008-05-09 2011-06-08 Design Led Products Ltd Capacitive sensing apparatus
GB0809385D0 (en) 2008-05-23 2008-07-02 Design Led Products Ltd Light-guide apparatus
EP2128689A1 (en) * 2008-05-27 2009-12-02 Barco NV A display panel with improved reflectivity
CN102047452B (zh) 2008-05-30 2013-03-20 夏普株式会社 发光装置、面光源、液晶显示装置和制造发光装置的方法
JP2010021131A (ja) 2008-06-09 2010-01-28 Hitachi Ltd 表示装置及びそれに用いられるバックライトユニット
KR20110039313A (ko) 2008-07-07 2011-04-15 글로 에이비 나노구조 led
KR100953655B1 (ko) * 2008-07-08 2010-04-20 삼성모바일디스플레이주식회사 유기발광 표시장치
KR100924912B1 (ko) 2008-07-29 2009-11-03 서울반도체 주식회사 웜화이트 발광장치 및 그것을 포함하는 백라이트 모듈
US8755005B2 (en) 2008-09-24 2014-06-17 Koninklijke Philips N.V. Thin edge backlight with LEDS optically coupled to the back surface
US7717584B1 (en) * 2008-11-28 2010-05-18 Wei-Jei Tuan Vibrating and twinkling LED backlighting device
JP5407545B2 (ja) * 2009-05-19 2014-02-05 ソニー株式会社 防眩性フィルムおよびその製造方法、ならびに表示装置
JP2011065010A (ja) 2009-09-18 2011-03-31 Panasonic Corp 画像形成装置
JP5531629B2 (ja) 2010-01-14 2014-06-25 凸版印刷株式会社 バックライトユニット及び表示装置
GB201008599D0 (en) 2010-05-24 2010-07-07 Design Led Products Ltd Light guide device
GB201008601D0 (en) 2010-05-24 2010-07-07 Design Led Products Ltd Lighting apparatus
KR101147988B1 (ko) * 2010-07-13 2012-05-24 포항공과대학교 산학협력단 물리적 박리 방법을 이용한 플렉서블 전자소자의 제조방법, 플렉서블 전자소자 및 플렉서블 기판
KR20120035062A (ko) 2010-10-04 2012-04-13 삼성코닝정밀소재 주식회사 백라이트 유닛
US8585268B2 (en) 2011-10-21 2013-11-19 Ergophos, Llc Light-guide panel for display with laser backlight
CN104024931B (zh) * 2011-12-27 2017-04-05 夏普株式会社 液晶显示装置、光控膜、显示装置
US20130258216A1 (en) 2012-03-30 2013-10-03 Shin-Gwo Shiue Pico projection light system
CN103384179B (zh) * 2012-05-04 2017-08-11 电信科学技术研究院 使用时分双工通信制式的系统中的上下行配置方法和设备
US9287475B2 (en) * 2012-07-20 2016-03-15 Cree, Inc. Solid state lighting component package with reflective polymer matrix layer
KR101452768B1 (ko) 2012-08-21 2014-10-21 엘지전자 주식회사 반도체 발광 소자를 이용한 디스플레이 장치 및 이의 제조방법
KR101940761B1 (ko) * 2012-10-16 2019-04-10 엘지디스플레이 주식회사 유기발광소자표시장치
US20140168278A1 (en) * 2012-12-13 2014-06-19 Pixtronix, Inc. Display with light modulating pixels organized in off-axis arrangement
JP6565129B2 (ja) * 2013-02-15 2019-08-28 東洋紡株式会社 画像表示装置
KR101476686B1 (ko) 2013-04-01 2014-12-26 엘지전자 주식회사 반도체 발광 소자를 이용한 디스플레이 장치
JP2014229356A (ja) * 2013-05-17 2014-12-08 ソニー株式会社 発光素子およびその製造方法、ならびに表示装置
US9111464B2 (en) 2013-06-18 2015-08-18 LuxVue Technology Corporation LED display with wavelength conversion layer
US9726802B2 (en) 2013-09-23 2017-08-08 Glo Ab Integrated back light unit
US9281442B2 (en) 2013-12-17 2016-03-08 Glo Ab III-nitride nanowire LED with strain modified surface active region and method of making thereof
KR20150093284A (ko) 2014-02-06 2015-08-18 삼성디스플레이 주식회사 백라이트 유닛
US10833054B2 (en) 2014-02-08 2020-11-10 Cree Huizhou Solid State Lighting Company Limited Smart pixel surface mount device package
JP6429102B2 (ja) * 2014-04-22 2018-11-28 大日本印刷株式会社 画像表示装置
KR20160000096A (ko) * 2014-06-23 2016-01-04 삼성디스플레이 주식회사 표시 장치
KR20170066318A (ko) 2014-08-12 2017-06-14 글로 에이비 불균일 광 가이드 유닛을 포함하는 일체형 백 라이트 유닛
TWI684048B (zh) 2014-10-07 2020-02-01 美商康寧公司 直視型顯示裝置及用於直視型顯示裝置的發光單元
JP3203462U (ja) * 2016-01-19 2016-03-31 株式会社スリーエス 表示装置
KR102572819B1 (ko) * 2016-02-23 2023-08-30 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광모듈 제조방법 및 표시장치

Also Published As

Publication number Publication date
US10600354B2 (en) 2020-03-24
EP3446330A1 (en) 2019-02-27
JP2019515489A (ja) 2019-06-06
US20170309223A1 (en) 2017-10-26
WO2017184941A1 (en) 2017-10-26
EP3446330A4 (en) 2019-12-18

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