KR20180128464A - 소형 피치 직시형 디스플레이 및 이의 제조 방법 - Google Patents
소형 피치 직시형 디스플레이 및 이의 제조 방법 Download PDFInfo
- Publication number
- KR20180128464A KR20180128464A KR1020187031032A KR20187031032A KR20180128464A KR 20180128464 A KR20180128464 A KR 20180128464A KR 1020187031032 A KR1020187031032 A KR 1020187031032A KR 20187031032 A KR20187031032 A KR 20187031032A KR 20180128464 A KR20180128464 A KR 20180128464A
- Authority
- KR
- South Korea
- Prior art keywords
- pixels
- type display
- display device
- grid
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
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Images
Classifications
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
- G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
- G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
- G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
-
- H01L25/0753—
-
- H01L25/13—
-
- H01L25/167—
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/303—Assembling printed circuits with electric components, e.g. with resistors with surface mounted components
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G2300/00—Aspects of the constitution of display devices
- G09G2300/04—Structural and physical details of display devices
- G09G2300/0404—Matrix technologies
- G09G2300/0408—Integration of the drivers onto the display substrate
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G2300/00—Aspects of the constitution of display devices
- G09G2300/04—Structural and physical details of display devices
- G09G2300/0439—Pixel structures
- G09G2300/0452—Details of colour pixel setup, e.g. pixel composed of a red, a blue and two green components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0112—Absorbing light, e.g. dielectric layer with carbon filler for laser processing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10128—Display
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10507—Involving several components
- H05K2201/10522—Adjacent components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1316—Moulded encapsulation of mounted components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Led Device Packages (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201662326255P | 2016-04-22 | 2016-04-22 | |
| US62/326,255 | 2016-04-22 | ||
| PCT/US2017/028771 WO2017184941A1 (en) | 2016-04-22 | 2017-04-21 | Small pitch direct view display and method of making thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20180128464A true KR20180128464A (ko) | 2018-12-03 |
Family
ID=60089638
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020187031032A Withdrawn KR20180128464A (ko) | 2016-04-22 | 2017-04-21 | 소형 피치 직시형 디스플레이 및 이의 제조 방법 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US10600354B2 (https=) |
| EP (1) | EP3446330A4 (https=) |
| JP (1) | JP2019515489A (https=) |
| KR (1) | KR20180128464A (https=) |
| WO (1) | WO2017184941A1 (https=) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20180210195A1 (en) * | 2017-01-24 | 2018-07-26 | Microsoft Technology Licensing, Llc | Avoiding ghost images |
| US10878742B2 (en) * | 2017-01-24 | 2020-12-29 | Planar Systems, Inc. | Protective cover for direct view light emitting diode displays |
| KR102532307B1 (ko) | 2017-11-02 | 2023-05-15 | 삼성디스플레이 주식회사 | 표시장치 |
| US10269711B1 (en) * | 2018-03-16 | 2019-04-23 | Taiwan Semiconductor Manufacturing Company Ltd. | Semiconductor device and method for manufacturing the same |
| US10627673B2 (en) | 2018-04-06 | 2020-04-21 | Glo Ab | Light emitting diode array containing a multilayer bus electrode and method of making the same |
| CN113950739A (zh) * | 2019-05-09 | 2022-01-18 | 达科电子股份有限公司 | 用于显示模块的模制对比度掩膜 |
| FR3097981B1 (fr) * | 2019-06-28 | 2021-07-02 | Valeo Vision | Dispositif lumineux pour véhicule automobile |
| CN112930493B (zh) * | 2019-10-07 | 2023-07-18 | 依视路国际公司 | 表征光学元件 |
| US11594663B2 (en) | 2019-12-20 | 2023-02-28 | Nanosys, Inc. | Light emitting diode device containing a micro lens array and method of making the same |
| TWI719775B (zh) * | 2019-12-25 | 2021-02-21 | 錼創顯示科技股份有限公司 | 顯示裝置 |
| CN111464803B (zh) * | 2020-04-16 | 2022-04-12 | 中国长城科技集团股份有限公司 | 一种显示控制系统 |
Family Cites Families (67)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0553511A (ja) * | 1991-08-28 | 1993-03-05 | Toyoda Gosei Co Ltd | カラーデイスプレイ装置 |
| JPH08202290A (ja) * | 1995-01-26 | 1996-08-09 | Daihatsu Motor Co Ltd | Ledディスプレイモジュール |
| US6589650B1 (en) * | 2000-08-07 | 2003-07-08 | 3M Innovative Properties Company | Microscope cover slip materials |
| JP4049624B2 (ja) | 2001-07-27 | 2008-02-20 | 株式会社エンプラス | 面光源装置、画像表示装置及び導光板 |
| JP4223740B2 (ja) | 2002-06-13 | 2009-02-12 | シチズン電子株式会社 | 発光素子用パッケージ |
| US7335908B2 (en) | 2002-07-08 | 2008-02-26 | Qunano Ab | Nanostructures and methods for manufacturing the same |
| US20040061810A1 (en) | 2002-09-27 | 2004-04-01 | Lumileds Lighting, U.S., Llc | Backlight for a color LCD using wavelength-converted light emitting devices |
| TWI351548B (en) | 2003-01-15 | 2011-11-01 | Semiconductor Energy Lab | Manufacturing method of liquid crystal display dev |
| US8270061B2 (en) | 2003-11-01 | 2012-09-18 | Silicon Quest Kabushiki-Kaisha | Display apparatus using pulsed light source |
| US7132677B2 (en) | 2004-02-13 | 2006-11-07 | Dongguk University | Super bright light emitting diode of nanorod array structure having InGaN quantum well and method for manufacturing the same |
| TWI367686B (en) * | 2004-04-07 | 2012-07-01 | Semiconductor Energy Lab | Light emitting device, electronic device, and television device |
| GB0408347D0 (en) | 2004-04-15 | 2004-05-19 | Design Led Products Ltd | Light guide device |
| US7204631B2 (en) | 2004-06-30 | 2007-04-17 | 3M Innovative Properties Company | Phosphor based illumination system having a plurality of light guides and an interference reflector |
| WO2006131924A2 (en) | 2005-06-07 | 2006-12-14 | Oree, Advanced Illumination Solutions Inc. | Illumination apparatus |
| CN101313176B (zh) | 2005-11-21 | 2010-11-24 | 皇家飞利浦电子股份有限公司 | 光学系统 |
| JP4669799B2 (ja) | 2006-03-01 | 2011-04-13 | パナソニック株式会社 | エッジ入力型バックライト |
| CN101443265B (zh) | 2006-03-08 | 2014-03-26 | 昆南诺股份有限公司 | 在硅上无金属合成外延半导体纳米线的方法 |
| AU2007313096B2 (en) | 2006-03-10 | 2011-11-10 | Unm Rainforest Innovations | Pulsed growth of GaN nanowires and applications in group III nitride semiconductor substrate materials and devices |
| JP4585481B2 (ja) | 2006-04-28 | 2010-11-24 | 株式会社 日立ディスプレイズ | Ledバックライト及びそれを用いた液晶表示装置 |
| GB2438440B (en) | 2006-05-26 | 2008-04-23 | Design Led Products Ltd | A composite light guiding device |
| US20090128781A1 (en) | 2006-06-13 | 2009-05-21 | Kenneth Li | LED multiplexer and recycler and micro-projector incorporating the Same |
| US20080049445A1 (en) | 2006-08-25 | 2008-02-28 | Philips Lumileds Lighting Company, Llc | Backlight Using High-Powered Corner LED |
| US20080080184A1 (en) * | 2006-10-03 | 2008-04-03 | Cao Group Inc. | Pixilated LED Light Source for Channel Letter Illumination |
| EP2102899B1 (en) | 2007-01-12 | 2020-11-11 | QuNano AB | Nitride nanowires and method of producing such |
| US8889216B2 (en) * | 2007-05-31 | 2014-11-18 | Nthdegree Technologies Worldwide Inc | Method of manufacturing addressable and static electronic displays |
| JP4613947B2 (ja) | 2007-12-07 | 2011-01-19 | ソニー株式会社 | 照明装置、色変換素子及び表示装置 |
| JP2009177117A (ja) * | 2007-12-25 | 2009-08-06 | Toshiba Lighting & Technology Corp | 表示装置 |
| WO2009133870A1 (ja) | 2008-04-30 | 2009-11-05 | アルプス電気株式会社 | 照光装置およびその製造方法 |
| GB2459888B (en) | 2008-05-09 | 2011-06-08 | Design Led Products Ltd | Capacitive sensing apparatus |
| GB0809385D0 (en) | 2008-05-23 | 2008-07-02 | Design Led Products Ltd | Light-guide apparatus |
| EP2128689A1 (en) * | 2008-05-27 | 2009-12-02 | Barco NV | A display panel with improved reflectivity |
| CN102047452B (zh) | 2008-05-30 | 2013-03-20 | 夏普株式会社 | 发光装置、面光源、液晶显示装置和制造发光装置的方法 |
| JP2010021131A (ja) | 2008-06-09 | 2010-01-28 | Hitachi Ltd | 表示装置及びそれに用いられるバックライトユニット |
| KR20110039313A (ko) | 2008-07-07 | 2011-04-15 | 글로 에이비 | 나노구조 led |
| KR100953655B1 (ko) * | 2008-07-08 | 2010-04-20 | 삼성모바일디스플레이주식회사 | 유기발광 표시장치 |
| KR100924912B1 (ko) | 2008-07-29 | 2009-11-03 | 서울반도체 주식회사 | 웜화이트 발광장치 및 그것을 포함하는 백라이트 모듈 |
| US8755005B2 (en) | 2008-09-24 | 2014-06-17 | Koninklijke Philips N.V. | Thin edge backlight with LEDS optically coupled to the back surface |
| US7717584B1 (en) * | 2008-11-28 | 2010-05-18 | Wei-Jei Tuan | Vibrating and twinkling LED backlighting device |
| JP5407545B2 (ja) * | 2009-05-19 | 2014-02-05 | ソニー株式会社 | 防眩性フィルムおよびその製造方法、ならびに表示装置 |
| JP2011065010A (ja) | 2009-09-18 | 2011-03-31 | Panasonic Corp | 画像形成装置 |
| JP5531629B2 (ja) | 2010-01-14 | 2014-06-25 | 凸版印刷株式会社 | バックライトユニット及び表示装置 |
| GB201008599D0 (en) | 2010-05-24 | 2010-07-07 | Design Led Products Ltd | Light guide device |
| GB201008601D0 (en) | 2010-05-24 | 2010-07-07 | Design Led Products Ltd | Lighting apparatus |
| KR101147988B1 (ko) * | 2010-07-13 | 2012-05-24 | 포항공과대학교 산학협력단 | 물리적 박리 방법을 이용한 플렉서블 전자소자의 제조방법, 플렉서블 전자소자 및 플렉서블 기판 |
| KR20120035062A (ko) | 2010-10-04 | 2012-04-13 | 삼성코닝정밀소재 주식회사 | 백라이트 유닛 |
| US8585268B2 (en) | 2011-10-21 | 2013-11-19 | Ergophos, Llc | Light-guide panel for display with laser backlight |
| CN104024931B (zh) * | 2011-12-27 | 2017-04-05 | 夏普株式会社 | 液晶显示装置、光控膜、显示装置 |
| US20130258216A1 (en) | 2012-03-30 | 2013-10-03 | Shin-Gwo Shiue | Pico projection light system |
| CN103384179B (zh) * | 2012-05-04 | 2017-08-11 | 电信科学技术研究院 | 使用时分双工通信制式的系统中的上下行配置方法和设备 |
| US9287475B2 (en) * | 2012-07-20 | 2016-03-15 | Cree, Inc. | Solid state lighting component package with reflective polymer matrix layer |
| KR101452768B1 (ko) | 2012-08-21 | 2014-10-21 | 엘지전자 주식회사 | 반도체 발광 소자를 이용한 디스플레이 장치 및 이의 제조방법 |
| KR101940761B1 (ko) * | 2012-10-16 | 2019-04-10 | 엘지디스플레이 주식회사 | 유기발광소자표시장치 |
| US20140168278A1 (en) * | 2012-12-13 | 2014-06-19 | Pixtronix, Inc. | Display with light modulating pixels organized in off-axis arrangement |
| JP6565129B2 (ja) * | 2013-02-15 | 2019-08-28 | 東洋紡株式会社 | 画像表示装置 |
| KR101476686B1 (ko) | 2013-04-01 | 2014-12-26 | 엘지전자 주식회사 | 반도체 발광 소자를 이용한 디스플레이 장치 |
| JP2014229356A (ja) * | 2013-05-17 | 2014-12-08 | ソニー株式会社 | 発光素子およびその製造方法、ならびに表示装置 |
| US9111464B2 (en) | 2013-06-18 | 2015-08-18 | LuxVue Technology Corporation | LED display with wavelength conversion layer |
| US9726802B2 (en) | 2013-09-23 | 2017-08-08 | Glo Ab | Integrated back light unit |
| US9281442B2 (en) | 2013-12-17 | 2016-03-08 | Glo Ab | III-nitride nanowire LED with strain modified surface active region and method of making thereof |
| KR20150093284A (ko) | 2014-02-06 | 2015-08-18 | 삼성디스플레이 주식회사 | 백라이트 유닛 |
| US10833054B2 (en) | 2014-02-08 | 2020-11-10 | Cree Huizhou Solid State Lighting Company Limited | Smart pixel surface mount device package |
| JP6429102B2 (ja) * | 2014-04-22 | 2018-11-28 | 大日本印刷株式会社 | 画像表示装置 |
| KR20160000096A (ko) * | 2014-06-23 | 2016-01-04 | 삼성디스플레이 주식회사 | 표시 장치 |
| KR20170066318A (ko) | 2014-08-12 | 2017-06-14 | 글로 에이비 | 불균일 광 가이드 유닛을 포함하는 일체형 백 라이트 유닛 |
| TWI684048B (zh) | 2014-10-07 | 2020-02-01 | 美商康寧公司 | 直視型顯示裝置及用於直視型顯示裝置的發光單元 |
| JP3203462U (ja) * | 2016-01-19 | 2016-03-31 | 株式会社スリーエス | 表示装置 |
| KR102572819B1 (ko) * | 2016-02-23 | 2023-08-30 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | 발광모듈 제조방법 및 표시장치 |
-
2017
- 2017-04-21 EP EP17786687.8A patent/EP3446330A4/en not_active Withdrawn
- 2017-04-21 KR KR1020187031032A patent/KR20180128464A/ko not_active Withdrawn
- 2017-04-21 US US15/493,787 patent/US10600354B2/en active Active
- 2017-04-21 WO PCT/US2017/028771 patent/WO2017184941A1/en not_active Ceased
- 2017-04-21 JP JP2018554745A patent/JP2019515489A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| US10600354B2 (en) | 2020-03-24 |
| EP3446330A1 (en) | 2019-02-27 |
| JP2019515489A (ja) | 2019-06-06 |
| US20170309223A1 (en) | 2017-10-26 |
| WO2017184941A1 (en) | 2017-10-26 |
| EP3446330A4 (en) | 2019-12-18 |
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