WO2017170838A1 - Dispositif de condensation de lumière pour capteur infrarouge et son procédé de fabrication - Google Patents

Dispositif de condensation de lumière pour capteur infrarouge et son procédé de fabrication Download PDF

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Publication number
WO2017170838A1
WO2017170838A1 PCT/JP2017/013186 JP2017013186W WO2017170838A1 WO 2017170838 A1 WO2017170838 A1 WO 2017170838A1 JP 2017013186 W JP2017013186 W JP 2017013186W WO 2017170838 A1 WO2017170838 A1 WO 2017170838A1
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WIPO (PCT)
Prior art keywords
infrared sensor
infrared
peripheral surface
synthetic resin
end opening
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PCT/JP2017/013186
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English (en)
Japanese (ja)
Inventor
柏木　一浩
健太 過能
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興和株式会社
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Publication date
Priority claimed from JP2016069909A external-priority patent/JP5996139B1/ja
Application filed by 興和株式会社 filed Critical 興和株式会社
Publication of WO2017170838A1 publication Critical patent/WO2017170838A1/fr

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    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/01—Measuring temperature of body parts ; Diagnostic temperature sensing, e.g. for malignant or inflamed tissue
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors

Definitions

  • the present invention relates to a condensing device for an infrared sensor that guides infrared rays radiated from an object to be measured to an infrared sensor.
  • Patent Document 1 discloses an infrared thermometer including a waveguide.
  • a waveguide is a condensing device that guides infrared rays emitted from a human body to an infrared sensor.
  • the inner peripheral surface of the waveguide disclosed in the document 1 is mirror-finished and has an inner diameter from the first opening (front end opening) toward the second opening (rear end opening). The shape converges to decrease.
  • the waveguide having a mirror-finished inner peripheral surface and a reduced diameter has an advantage that the infrared rays emitted from the measurement target can be efficiently guided to the infrared sensor.
  • condensation may occur on the inner peripheral surface of the waveguide and the infrared incident window of the infrared sensor. If dew condensation occurs on the inner peripheral surface of the waveguide, the infrared light taken from the tip is diffusely reflected, and the amount of infrared light guided to the infrared sensor is reduced. Further, when condensation occurs in the infrared incident window, the infrared rays are similarly irregularly reflected at the dew condensation portion, and the amount of incident infrared light into the sensor is reduced. Due to these factors, an error occurs in the temperature of the measurement object measured by the infrared sensor. As described above, in the combination of an infrared sensor and a light collecting device such as a waveguide, an error may occur in the detection accuracy of the infrared sensor due to the occurrence of condensation due to a change in the surrounding temperature and humidity environment.
  • the conventional infrared sensor condensing device including the waveguide disclosed in Patent Document 1 pays attention to the dew condensation that occurs with changes in the surrounding temperature and humidity environment, and measures against the dew condensation are taken. There was no.
  • the present invention has been made in view of the above-described circumstances, and can efficiently guide infrared rays radiated from an object to be measured to an infrared sensor, and when condensation occurs due to changes in the surrounding temperature and humidity environment.
  • An object of the present invention is to provide a condensing device for an infrared sensor that can quickly eliminate the condensation.
  • the present invention is formed in a cylindrical shape and takes infrared rays emitted from a measurement object into a hollow portion from a front end opening and guides it to an infrared sensor arranged opposite to the base end opening.
  • Infrared sensor concentrator for It is characterized by including an inner peripheral surface portion for waveguide that is made of a synthetic resin and is mirror-finished, and an outer peripheral surface portion for heat absorption / heat radiation that is not mirror-finished.
  • the infrared sensor By providing a mirror-finished inner peripheral surface portion for waveguide, it is possible to efficiently guide infrared rays radiated from the measurement target to the infrared sensor. Furthermore, since the heat absorption / radiation outer peripheral surface portion that is not mirror-finished has a large surface area and low reflectance, it can efficiently absorb the surrounding heat and contribute to quick elimination of condensation. When the internal temperature of the infrared sensor is higher than the ambient temperature, the heat stored in the infrared sensor can be efficiently radiated from the outer peripheral surface for heat absorption / radiation.
  • the condensing device for an infrared sensor of the present invention is manufactured by two kinds of synthetic resins having a difference in affinity with plating, and the first synthetic resin having high affinity with plating is set on the inside.
  • the second synthetic resin which has a lower affinity for plating than the first synthetic resin, can be configured as the outside.
  • the inner peripheral surface of the first synthetic resin is plated to form an inner peripheral surface portion for waveguide, and the outer peripheral surface of the second synthetic resin forms an outer peripheral surface portion for heat absorption and heat dissipation.
  • the first synthetic resin be exposed from the front end opening to the outer peripheral surface side because an electrode used in the electrolytic plating process can be formed protrudingly on the exposed portion.
  • the heat absorption (and heat dissipation) can be further improved by roughening the outer peripheral surface for heat absorption and heat dissipation.
  • the support part held by the surrounding structure is formed by extending from the outer peripheral surface part for heat absorption / radiation, and the support part is also roughened so that it can be held without rattling with the surrounding structure.
  • the support part held by the surrounding structure is formed by extending from the outer peripheral surface part for heat absorption / radiation, and the support part is also roughened so that it can be held without rattling with the surrounding structure.
  • the condensing device for an infrared sensor of the present invention has an infrared incident window on the front surface, and an infrared sensor including a configuration for irradiating infrared rays taken from the infrared incident window to an infrared detection element provided therein.
  • the end opening may be arranged with a gap formed between the front surface of the infrared sensor.
  • At least three legs are extended from the peripheral wall of the base end opening, and each leg is brought into contact with the infrared sensor to combine them, so that the gap between the base end opening and the front of the infrared sensor.
  • a gap can be formed.
  • the central axis of the waveguide inner peripheral surface portion is coaxial with the center of the infrared incident window in the infrared sensor. If they are aligned so that they are arranged, simply by combining the legs with the infrared sensor, the inner peripheral surface of the waveguide can be automatically aligned with the central axis of the infrared sensor, improving workability. .
  • the infrared sensor condensing device and infrared sensor are incorporated into lighting fixtures, crime prevention devices, air conditioners, thermometers, etc.
  • the relative position of the infrared sensor condensing device fluctuates in the axial direction with respect to the infrared sensor, particularly infrared light reflected near the proximal end opening (near the infrared sensor) is taken in from the infrared incident window of the infrared sensor. This may cause the orbit entering the infrared detecting element to be off.
  • the infrared light reflected near the proximal end opening does not enter the infrared detection element in this way, the amount of infrared light incident on the infrared sensor is reduced, and the infrared detection accuracy of the infrared sensor is reduced.
  • the infrared sensor condensing device of the present invention forms an infrared diffusing surface that diffuses and reflects the infrared rays taken from the front end opening into the hollow portion in the region from the base end opening to the periphery of the inner peripheral surface. It is preferable to do.
  • the inner peripheral surface of the waveguide is a mirror-finished inner peripheral surface portion
  • the infrared reflection trajectory taken into the hollow portion from the front end opening in accordance with a predetermined axial relative position variation with respect to the infrared sensor is infrared
  • the reflection region that is removed from the infrared detection element of the sensor is at least an infrared diffusion surface.
  • the infrared diffusing surface By forming the infrared diffusing surface in this way, even if there is a relative position fluctuation in the axial direction between the infrared sensor and the infrared sensor condensing device, a part of the infrared diffused on the infrared diffusing surface is an infrared detecting element. Therefore, a decrease in the amount of infrared incident light on the infrared sensor can be suppressed.
  • the manufacturing method of the condensing device for infrared sensors is as follows: A two-color molding step for producing a cylindrical intermediate molded body by two-color molding of the first synthetic resin and the second synthetic resin; A plating process for plating the inner peripheral surface of the first synthetic resin to form an inner peripheral surface portion for waveguide; It is characterized by including.
  • the manufacturing method of the condensing device for infrared sensor according to the present invention is as follows:
  • the first synthetic resin and the second synthetic resin are molded in two colors, and the first synthetic resin is exposed from the front end opening portion to the outer peripheral surface side, and the protruding portion for the electrode protrudes from the exposed portion.
  • a two-color molding process to produce an intermediate molded body A pre-plating treatment step of performing an electroless plating treatment on the exposed portion of the first synthetic resin in the intermediate molded body; An electric current is passed from the electrode protruding portion subjected to the electroless plating treatment, and the exposed portion of the first synthetic resin is subjected to electrolytic plating treatment, and the inner peripheral surface portion for waveguide is formed on the inner peripheral surface of the first synthetic resin.
  • the manufacturing method of the concentrating device for an infrared sensor according to the present invention includes a step of roughening the outer peripheral surface of the second synthetic resin.
  • the infrared rays radiated from the measurement object can be efficiently guided to the infrared sensor, and when condensation occurs due to changes in the surrounding temperature and humidity environment, It is possible to quickly eliminate condensation and return the detection accuracy of the infrared sensor to the original state in a short time.
  • FIG. 1A is a perspective view showing an appearance of a condensing device for an infrared sensor according to the first embodiment of the present invention.
  • FIG. 1B is a front sectional view showing the configuration of the apparatus.
  • FIG. 2A is a front view showing the configuration of the condensing device for an infrared sensor according to the first embodiment of the present invention.
  • FIG. 2B is also a left side view.
  • FIG. 2C is also a right side view.
  • FIG. 2D is also a bottom view.
  • FIG. 3 is a partial cross-sectional front view showing a configuration example of the infrared sensor.
  • FIG. 1A is a perspective view showing an appearance of a condensing device for an infrared sensor according to the first embodiment of the present invention.
  • FIG. 1B is a front sectional view showing the configuration of the apparatus.
  • FIG. 2A is a front view showing the configuration of the condensing device for an infrared sensor according to the
  • FIG. 4 is an enlarged front sectional view showing an infrared sensor and a condensing device for the infrared sensor incorporated in the housing of the device using the infrared sensor.
  • FIG. 5A, FIG. 5B, and FIG. 5C are sectional front views schematically showing a method for manufacturing the condensing device for an infrared sensor according to the first embodiment of the present invention.
  • 6A, FIG. 6B, and FIG. 6C are sectional front views schematically showing the manufacturing method of the concentrating device for an infrared sensor according to the first embodiment of the present invention, following FIG. 5C.
  • 7A and 7B are perspective views for explaining the manufacturing method of the condensing device for an infrared sensor according to the first embodiment of the present invention, following FIG.
  • FIG. 8A is a perspective view showing an appearance of a condensing device for an infrared sensor according to a second embodiment of the present invention.
  • FIG. 8B is a front sectional view showing the configuration of the apparatus.
  • FIG. 9A is a front view showing a configuration of a condensing device for an infrared sensor according to a second embodiment of the present invention.
  • FIG. 9B is a left side view of the same.
  • FIG. 9C is a right side view of the same.
  • FIG. 9D is a bottom view of the same.
  • FIG. 10A, FIG. 10B, and FIG. 10C are sectional front views schematically showing a manufacturing method of the condensing device for an infrared sensor according to the second embodiment of the present invention.
  • FIG. 10A, FIG. 10B, and FIG. 10C are sectional front views schematically showing a manufacturing method of the condensing device for an infrared sensor according to the second embodiment of the present invention.
  • FIG. 11A, FIG. 11B, and FIG. 11C are cross-sectional front views schematically showing a manufacturing method of the condensing device for an infrared sensor according to the second embodiment of the present invention, following FIG. 10C.
  • 12A and 12B are perspective views for explaining a manufacturing method of the condensing device for an infrared sensor according to the second embodiment of the present invention, following FIG. 11C.
  • FIG. 13A is a front cross-sectional view for explaining a condensing device for an infrared sensor according to a third embodiment of the present invention.
  • FIG. 13B is an enlarged front sectional view showing a part of FIG. 13A.
  • FIG. 14A is a front sectional view for explaining an infrared sensor condensing device according to the third embodiment of the present invention, in conjunction with FIG. 13A.
  • FIG. 14B is a front sectional view showing a part of FIG. 14A in an enlarged manner.
  • FIG. 15 is a front cross-sectional view showing the configuration of the condensing device for an infrared sensor according to the third embodiment of the present invention.
  • a condensing device for an infrared sensor according to the present embodiment (hereinafter sometimes simply referred to as a “condensing device”) is generally a waveguide. It adopts a cylindrical basic structure, also called.
  • the condensing device 1 is incorporated in the inside of a device 4 (hereinafter also referred to as “device to be incorporated”) 4 such as an infrared thermometer together with the infrared sensor 3.
  • the proximal end opening 12 is disposed to face the infrared incident window 31 of the infrared sensor 3.
  • infrared rays radiated from the measurement object are taken into the hollow portion 13 from the front end opening 11, guided to the base end opening 12 while reflecting the infrared rays on the inner peripheral surface, and detected through the infrared incident window 31 of the infrared sensor 3.
  • the element 32 is irradiated.
  • FIG. 3 shows a configuration example of the infrared sensor 3.
  • the infrared sensor 3 shown in the figure is called a thermopile type infrared sensor, and when a thermal type infrared detection element 32 called a thermopile receives infrared rays, a thermoelectromotive force corresponding to the amount of incident energy is output as an electrical signal.
  • an infrared detection element 32 is disposed in the center of the front surface of the substrate 33, and a temperature detection element 34 is disposed in the vicinity thereof.
  • a thermistor that changes the resistance value according to the ambient temperature of the infrared detection element 32 is applied.
  • the infrared detecting element 32 and the temperature detecting element 34 are covered with a protective member 35 that forms the appearance of the infrared sensor 3, and infrared rays are incident on the front center portion of the protective member 35 (that is, the front central portion of the infrared sensor 3).
  • a window 31 is formed.
  • the infrared incident window 31 faces the light receiving part of the infrared detecting element 32, and the infrared light incident through the infrared incident window 31 enters the light receiving part of the infrared detecting element 32.
  • the lead wire 36 has extended outside.
  • the infrared incident window 31 and the infrared detecting element 32 are arranged on the same central axis.
  • the light collecting device 1 is made of synthetic resin, and the inner peripheral surface is mirror-finished by plating.
  • This mirror-finished inner peripheral surface is referred to as a waveguide inner peripheral surface portion 14.
  • the waveguide inner peripheral surface portion 14 of the light collecting device 1 is formed in a cylindrical shape whose diameter is reduced from the front end opening 11 to the base end opening 12.
  • the waveguide inner peripheral surface portion 14 is formed in a parabolic shape.
  • the shape of the inner peripheral surface portion 14 for waveguide is not limited to a parabolic shape, and may be appropriately designed as necessary, such as a conical cylindrical inner peripheral surface.
  • the infrared rays taken in from the front end opening 11 are reflected toward the base end opening 12.
  • the light is gradually converged, and the infrared detecting element 32 can be irradiated with high intensity through the infrared incident window 31 of the infrared sensor 3 having a small size.
  • the outer peripheral surface of the light collecting device 1 has a configuration in which the background of the synthetic resin is exposed without being mirror-finished except for a part, and the background of the exposed synthetic resin is roughened.
  • the outer peripheral surface portion in which the surface of the synthetic resin is roughened without being mirror-finished in this way is referred to as a heat absorbing / radiating outer peripheral surface portion 15.
  • the condensing device 1 and the infrared sensor 3 incorporated therein are also in a low temperature state. Thereafter, when the device 4 to be incorporated is moved to a room temperature environment, there is a possibility that condensation occurs on the surface of the light collecting device 1 in a low temperature state.
  • the heat absorbing / dissipating outer peripheral surface portion 15 which is not mirror-finished and has a roughened synthetic resin surface has a large surface area and low reflectivity, and thus efficiently absorbs surrounding heat. be able to.
  • the heat absorption / radiation outer peripheral surface portion 15 efficiently absorbs the surrounding heat, whereby the internal temperature of the light collecting device 1 can be brought close to the ambient temperature quickly. As a result, the surface of the light collecting device 1 It is possible to quickly eliminate the dew condensation that has occurred.
  • the condensing device 1 has a configuration in which three legs 16 are extended in the axial direction from the peripheral wall 12a of the base end opening 12.
  • the peripheral wall 12a of the base end opening portion 12 is formed in an annular shape, and the leg portion 16 extends from each portion that is divided into three in the circumferential direction.
  • These leg portions 16 have the same size and shape, and both have an inner peripheral surface with a stepped shape, and a flat front support portion 16 a is formed at a site slightly outside the base end opening 12.
  • the inner peripheral surface of the leg 16 forms a side support 16b from the front support 16a to the tip.
  • the heat absorbing / dissipating outer peripheral surface portion 15 of the light collecting device 1 is formed with a flat plate-like support portion 18 extending from two locations in the outer diameter direction.
  • These support portions 18 have a function of holding the light collecting device 1 inside the device to be incorporated 4 as described later.
  • These support portions 18 have a surface shape in which the surface of the synthetic resin is roughened in the same manner as the outer peripheral surface portion 15 for heat absorption and heat dissipation. Thereby, the heat absorption property (and heat dissipation) of the condensing device 1 can be further improved.
  • the support part 18 designs a formation location, a shape, etc. corresponding to the holding structure comprised inside the apparatus 4 to be assembled.
  • the condensing device 1 is incorporated into the assembling target device 4 together with the infrared sensor 3.
  • the support unit 18 formed in the light collecting device 1 is engaged with the holding unit 41 provided in the installation target device 4 to hold the light collection device 1 in the installation target device 4.
  • the lead wire 36 is fixed to the printed circuit board 43 attached to the built-in device 4 by soldering.
  • each leg portion 16 is in contact with the three peripheral portions of the front surface 3 a of the infrared sensor 3, and the side surface support portion 16 b of each leg portion 16 is the side surface 3 b of the infrared sensor 3.
  • Each leg part 16 is fitted by the infrared sensor 3 in the state which contacted three places.
  • shaft O of the waveguide internal peripheral surface part 14 is the infrared sensor 3.
  • the light collecting device 1 is pre-aligned so as to be arranged coaxially with the center of the infrared incident window 31 in FIG.
  • each leg portion 16 is fitted to the infrared sensor 3
  • the front surface 3 a of the infrared sensor 3 is disposed away from the peripheral wall 12 a of the proximal end opening portion 12 of the light collector 1. Therefore, a gap 17 is formed between the proximal end opening 12 in the light collecting device 1 and the front surface 3 a of the infrared sensor 3. Therefore, the inside of the hollow portion 13 of the light collecting device 1 communicates with the surrounding space 42 of the infrared sensor 3 described above through the gap 17.
  • the surrounding space 42 communicates with the surrounding space where the heat absorbing / dissipating outer peripheral surface portion 15 of the light collecting device 1 is in contact.
  • the above-described light collecting device 1 is made of two types of synthetic resins having a difference in affinity with plating. That is, the first synthetic resin 5 having a high affinity for plating is provided on the inside, while the second synthetic resin 6 having a low affinity for plating as compared with the first synthetic resin 5 is provided on the outside.
  • the first synthetic resin 5 having high affinity with plating for example, ABS resin (a thermoplastic resin composed of three components of acrylonitrile, butadiene, and styrene) can be applied.
  • the second synthetic resin 6 having a low affinity for plating for example, polycarbonate (PC) or polystyrene (PS) can be applied.
  • PC polycarbonate
  • PS polystyrene
  • Each component of the light collecting device 1 described above is formed on one of the first and second synthetic resins 5 and 6. That is, the waveguide inner peripheral surface portion 14 is formed on the inner peripheral surface of the first synthetic resin 5. On the other hand, the outer peripheral surface portion 15 for heat absorption / radiation is formed on the outer peripheral surface of the second synthetic resin 6. Further, the leg portion 16 and the support portion 18 are formed in the second synthetic resin 6. The first synthetic resin 5 is exposed to the outer peripheral surface side from the front end opening 11 to form a peripheral wall 11 a of the front end opening 11. As will be described later, the peripheral wall 11a of the front end opening 11 is plated, and an electrode protrusion 20 is formed on the peripheral wall during the manufacturing process (see FIG. 7A).
  • the light collecting device 1 having a configuration in which the inner peripheral surface is plated and mirror-finished, and the outer peripheral surface is exposed to the background of the synthetic resin is realized by using a resin molding method called two-color molding (double molding).
  • two-color molding double molding
  • 5A to 6C show the procedure of the two-color molding process.
  • FIGS. 5A and 5B first, molds 51 and 52 for molding the first synthetic resin 5 having a high affinity with plating are prepared, and the molds 51 and 52 are provided.
  • the cavity 53 is filled with a melt of the first synthetic resin 5 and molded.
  • the first synthetic resin 5 for example, an ABS resin can be applied.
  • one mold 52 formed with the outer peripheral surface of the molded product made of the first synthetic resin 5 is used as a mold 54 for molding the second synthetic resin 6. change.
  • the mold 55 is filled with a melt of the second synthetic resin 6 in a cavity 55 formed on the outer peripheral surface side of the molded product of the first synthetic resin 5 in the molds 51 and 54.
  • the second synthetic resin 6 for example, polycarbonate (PC) or polystyrene (PS) can be applied.
  • FIG. 7A shows the appearance of the intermediate molded body 21.
  • the cylindrical intermediate molded body 21 is formed of the first synthetic resin 5 at the portion from the inner peripheral surface to the peripheral wall 11a of the front end opening 11, and the outer peripheral surface excluding the peripheral wall 11a of the front end opening 11 is the second synthetic resin. Molded with resin 6.
  • the peripheral wall 11a of the front end opening portion 11 formed of the first synthetic resin 5 is exposed to the outer peripheral surface side, and the electrode protruding portion 20 protrudes in the outer diameter direction.
  • an electroless plating process is performed on the exposed portion of the first synthetic resin 5 in the intermediate molded body 21 shown in FIG. 7A (preliminary plating process).
  • electroless nickel plating is performed to form a nickel metal film on the exposed portion of the first synthetic resin 5.
  • a nickel metal film is also formed on the electrode protrusion 20.
  • the exposed portion of the second synthetic resin 6 is not plated.
  • an electric current is passed from the electrode protrusion 20 that has been subjected to the electroless plating process, and the exposed portion of the first synthetic resin 5 is subjected to an electrolytic plating process (electrolytic plating process).
  • the electrolytic plating process is performed in three steps in the order of, for example, copper plating process, nickel plating process, and gold plating process, so that a high-quality plating layer that does not peel off even if the gold plating on the surface is thin is first synthesized. It can be formed on the exposed portion of the resin 5. Also in this electrolytic plating process, the exposed portion of the second synthetic resin 6 is not plated.
  • the technique of an electroless plating process and an electroplating process is already a well-known technique, detailed description in this specification is abbreviate
  • the electrode protrusion 20 is cut and removed as shown in FIG. 7B (protrusion removal step).
  • the heat absorption / radiation outer peripheral surface portion 15 and the support portion 18 where the background of the second synthetic resin 6 is exposed are roughened.
  • the rough surface finish can be processed, for example, by applying a texture to the lumen of the mold 54 in FIG. 6A.
  • a known surface treatment such as a blasting process for roughing the heat absorption / radiation outer peripheral surface portion 15 and the support portion 18 where the background of the second synthetic resin 6 is exposed is performed.
  • the technology can be applied (rough surface finishing process).
  • the condensing device 1 according to the second embodiment is configured as shown in FIGS. 8A, 8B, and 9A to 9D, and is manufactured by the manufacturing method shown in FIGS. 10A to 12B.
  • the manufacturing method of the first embodiment described above in the two-color molding step, the first synthetic resin 5 is first molded, and then the second synthetic resin 6 is molded.
  • the ABS resin applied to the first synthetic resin 5 has a lower melting point than the polycarbonate and polystyrene applied to the second synthetic resin 6. For this reason, when the second synthetic resin 6 is molded, the ABS resin already solidified in the mold may be dissolved again. Therefore, in order to maintain the shape of the first synthetic resin 5, it is necessary to carefully perform temperature management and time management.
  • the second synthetic resin 6 having a high melting point is first molded, and then the first synthetic resin 5 is molded. Thereby, about the 1st, 2nd synthetic resins 5 and 6, the shape at the time of shaping
  • FIGS. 10A and 10B first, molds 61, 62, and 63 for molding the second synthetic resin 6 having a high melting point are prepared.
  • the cavity 64 is filled with a melt of the second synthetic resin 6 and molded.
  • the molds 61 and 62 formed with a part of the outer shape of the molded product of the second synthetic resin 6 are used as the mold for molding the first synthetic resin 5.
  • a melt of the first synthetic resin 5 is filled into a cavity 67 formed for molding the first synthetic resin 5 in the molds 63, 65, 66 and then molded. .
  • FIG. 12A shows the appearance of the intermediate molded body 21.
  • the intermediate molded body 21 is subjected to electroless plating treatment (pre-plating treatment step) and electrolytic plating treatment in the same procedure as in the first embodiment, and thereafter, as shown in FIG. Is removed by cutting (protrusion removal step).
  • pre-plating treatment step electroless plating treatment
  • electrolytic plating treatment in the same procedure as in the first embodiment
  • FIG. Is removed by cutting protrusion removal step
  • the heat absorption / radiation outer peripheral surface portion 15 and the support portion 18 at which the background of the second synthetic resin 6 is exposed are roughened by the same method as in the first embodiment.
  • the three leg portions 16 extending from the peripheral wall 12 a of the proximal end opening 12 in the light collecting device 1 are molded with the first synthetic resin 5.
  • the first synthetic resin 5 has step portions 11b and 12b formed on the peripheral wall 11a of the front end opening 11 and the peripheral wall 12a of the base end opening 12, respectively.
  • the second synthetic resin 5 is formed. The two-color molding can be performed in the order in which the first synthetic resin 5 is molded after the molding 6 is molded first.
  • FIGS. 13A to 15 an infrared sensor condensing device according to a third embodiment of the present invention will be described in detail with reference to FIGS. 13A to 15.
  • the third embodiment only technical matters that are different from the first embodiment or the second embodiment already described will be described in detail, and the same or corresponding parts as those in the first embodiment or the second embodiment will be described. Are denoted by the same reference numerals, and detailed description thereof is omitted.
  • the condensing device 1 reflects the infrared rays S1, S2, S3... Taken into the hollow portion 13 from the front end opening 11 by the inner peripheral surface portion 14 for wave guide, and the infrared sensor 3 The relative position with respect to the infrared sensor 3 is adjusted so as to be incident on the infrared detection element 32.
  • the condensing device 1 and the infrared sensor 3 are incorporated in the assembling target device 4, the assembling positions of the condensing device 1 and the infrared sensor 3 are slightly shifted or loosened after assembling. There may be a date. 14A and 14B, when the relative position of the light collecting device 1 fluctuates in the axial direction with respect to the infrared sensor 3, the light is reflected particularly near the proximal end opening 12 (near the infrared sensor 3). There is a possibility that the infrared ray S ⁇ b> 1 is taken out of the infrared incident window 31 and deviates from the orbit where it enters the infrared detection element 32.
  • the infrared ray S1 reflected near the proximal end opening 12 does not enter the infrared detection element 32, the amount of infrared incident light on the infrared sensor 3 decreases, and the infrared detection accuracy of the infrared sensor 3 decreases. End up.
  • the distance from the portion P where infrared rays are reflected to the infrared detecting element 32 of the infrared sensor 3 is shortened near the proximal end opening 12 in the waveguide inner peripheral surface portion 14. .
  • the incident angle ⁇ of the infrared ray S1 reflected near the proximal end opening 12 to the infrared detecting element 32 becomes smaller than the incident angles of the other infrared rays S2 and S3.
  • the incident angle ⁇ to the infrared detection element 32 decreases, the relative position from the portion P where the infrared ray is reflected to the infrared detection element 32 of the infrared sensor 3 slightly varies, as shown in FIG. 14B.
  • the probability that the infrared rays S ⁇ b> 1 reflected near the proximal end opening 12 will be detached from the infrared detection element 32 increases.
  • an infrared diffusing surface 19 is formed in a region L ⁇ b> 2 extending from the proximal end opening 12 to the periphery of the inner peripheral surface of the light collecting device 1.
  • the infrared diffusing surface 19 has a function of irregularly reflecting infrared rays taken into the hollow portion from the front end opening 11 of the light collecting device 1.
  • the base end portion of the first synthetic resin 5 provided on the inner side is shortened, and instead, the second synthetic resin 6 is expanded to the inner peripheral surface (region L2) of the base end portion. It is as. If comprised in this way, the area
  • the inner peripheral surface region L2 is roughened by applying the embossing to the inner cavity as described above. Can be. As a result, a surface-shaped infrared diffusing surface 19 for irregularly reflecting incident infrared rays is formed in the region L2.
  • the surface of the second synthetic resin 6 where the background is exposed is subjected to a rough surface finish by applying a known surface treatment technique such as blasting, so that an infrared diffusion surface 19 can also be formed.
  • the region L2 of the inner peripheral surface where the infrared diffusing surface 19 is formed can be set as follows from the relationship with the relative position fluctuation in the axial direction of the light collecting device 1 with respect to the infrared sensor 3.
  • positional deviation when the light collecting device 1 and the infrared sensor 3 are incorporated into the device to be incorporated 4 and rattling after the incorporation are specified by performing simulations or experiments at the stage of design or prototyping. Can do. Therefore, it is defined in advance how much the position of the condensing device 1 changes in the axial direction with respect to the infrared sensor 3.
  • the relative position of the infrared ray sensor 3 is changed by a predetermined length L1 in the axial direction. Is assumed.
  • the infrared reflection trajectory taken into the hollow portion 13 from the front end opening 11 includes at least the reflection region that is out of the infrared detection element 32 of the infrared sensor 3.
  • the formation region L2 of the infrared diffusing surface 19 is set.
  • the region L2 may include a region where the infrared reflection trajectory does not deviate from the infrared detection element 32 of the infrared sensor 3. Conversely, as the region becomes wider, the amount of infrared incident light on the infrared sensor 3 decreases. Therefore, it is preferable to minimize the area.
  • the infrared diffusing surface 19 By forming the infrared diffusing surface 19 in this way, even if there is a relative position variation in the axial direction between the infrared sensor 3 and the light collecting device 1, a part of the infrared light irregularly reflected by the infrared diffusing surface 19 is infrared sensor. Therefore, a decrease in the amount of infrared incident light on the infrared sensor can be suppressed.
  • the inventor manufactured the condensing device 1 having the following configurations (1) to (3), and combined with the infrared sensor 3 to the inner peripheral surface of the condensing device 1 and the front surface of the infrared sensor 3. The state of condensation was visually observed.
  • the common shape parts are manufactured to the same dimensions, and the combination structure with the infrared sensor 3 is the same structure except for the presence or absence of the gap 17 due to the presence or absence of the legs 16, and experiments such as temperature change and humidity are performed. The conditions were the same.
  • Condensing device A according to the first embodiment shown in FIGS. 1A and 1B It has a waveguide inner peripheral surface portion 14 which is manufactured by two-color molding using ABS resin and polycarbonate and is mirror-finished, and an outer heat absorption / radiation outer peripheral surface portion 15 which is not mirror-finished. A gap 17 is formed between the front surface of each of the two.
  • the outer peripheral surface portion 15 for heat absorption / radiation and the support portion 18 are roughened by blasting.
  • Condensing device B having a configuration in which legs 16 in the shape shown in FIGS. 1A and 1B are provided over the entire circumference instead of three places. It has a waveguide inner peripheral surface portion 14 which is manufactured by cutting ABS resin and is mirror-finished by plating, and a heat absorbing / dissipating outer peripheral surface portion 15 where the plating is scraped off (not mirror-finished). However, since the leg portion 16 is provided on the entire periphery, the hollow portion 13 and the surrounding space 42 are not communicated with each other by the peripheral wall 12a. The outer peripheral surface portion 15 for heat absorption / radiation and the support portion 18 are roughened by cutting.
  • Condensing device C having the appearance shown in FIG. 1A and FIG. 1B and mirror-finished as a whole by plating. It is made of only ABS resin, the entire exposed surface is plated and mirror-finished, and a gap 17 is formed between the front surface of the infrared sensor 3 by the leg portion 16.
  • the condensation that occurred on the inner peripheral surface and the condensation that occurred on the front surface of the infrared sensor 3 both disappeared in 3 minutes and 47 seconds.
  • the condensation generated on the inner peripheral surface disappeared in about 5 minutes
  • the condensation generated on the front surface of the infrared sensor 3 disappeared in about 9 minutes.
  • the integrated device C the condensation generated on the inner peripheral surface and the condensation generated on the front surface of the infrared sensor 3 disappeared in about 6 minutes.

Abstract

La présente invention est moulée par moulage à deux couleurs, dans lequel une première résine synthétique 5 ayant une affinité élevée pour un placage est disposée à l'intérieur de celui-ci, tandis qu'une deuxième résine synthétique 6 ayant une faible affinité pour le placage par rapport à la première résine synthétique 5 est disposée à l'extérieur de celui-ci. Une face périphérique interne 14 de la première résine synthétique 5 est finie par un traitement de placage. Par ailleurs, une face périphérique externe 15 de la deuxième résine synthétique 6 n'est pas pourvue d'une finition miroir, et une surface de la résine synthétique de celle-ci est pourvue d'une finition rugueuse pour augmenter les propriétés d'absorption de chaleur ou les propriétés de dissipation de chaleur de celle-ci.
PCT/JP2017/013186 2016-03-31 2017-03-30 Dispositif de condensation de lumière pour capteur infrarouge et son procédé de fabrication WO2017170838A1 (fr)

Applications Claiming Priority (4)

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JP2016069909A JP5996139B1 (ja) 2016-03-31 2016-03-31 赤外線温度計
JP2016-069909 2016-03-31
JP2016-162417 2016-08-23
JP2016162417 2016-08-23

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WO2019225578A1 (fr) * 2018-05-24 2019-11-28 オムロンヘルスケア株式会社 Module capteur, procédé de production de module capteur, et dispositif de mesure de tension artérielle
US11969235B2 (en) 2018-05-24 2024-04-30 Omron Healthcare Co., Ltd. Sensor module, method for manufacturing sensor module, and blood pressure measurement device

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JP2003052645A (ja) * 2001-05-22 2003-02-25 Metatech Co Ltd 赤外線体温計
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JPH10328146A (ja) * 1997-05-31 1998-12-15 Horiba Ltd 鼓膜体温計
JPH11281484A (ja) * 1998-03-31 1999-10-15 Keiosu:Kk 耳式体温計
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WO2019225578A1 (fr) * 2018-05-24 2019-11-28 オムロンヘルスケア株式会社 Module capteur, procédé de production de module capteur, et dispositif de mesure de tension artérielle
JP2019201979A (ja) * 2018-05-24 2019-11-28 オムロンヘルスケア株式会社 センサモジュール、センサモジュールの製造方法、及び血圧測定装置
CN112105291A (zh) * 2018-05-24 2020-12-18 欧姆龙健康医疗事业株式会社 传感器模块、传感器模块的制造方法以及血压测定装置
JP7091832B2 (ja) 2018-05-24 2022-06-28 オムロンヘルスケア株式会社 センサモジュール、センサモジュールの製造方法、及び血圧測定装置
CN112105291B (zh) * 2018-05-24 2023-08-04 欧姆龙健康医疗事业株式会社 传感器模块、传感器模块的制造方法以及血压测定装置
US11969235B2 (en) 2018-05-24 2024-04-30 Omron Healthcare Co., Ltd. Sensor module, method for manufacturing sensor module, and blood pressure measurement device

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