WO2017161701A1 - 显示器件的对位检测设备及曝光工艺系统 - Google Patents
显示器件的对位检测设备及曝光工艺系统 Download PDFInfo
- Publication number
- WO2017161701A1 WO2017161701A1 PCT/CN2016/085253 CN2016085253W WO2017161701A1 WO 2017161701 A1 WO2017161701 A1 WO 2017161701A1 CN 2016085253 W CN2016085253 W CN 2016085253W WO 2017161701 A1 WO2017161701 A1 WO 2017161701A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- display device
- alignment
- detecting device
- image
- display
- Prior art date
Links
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
- G03F9/7038—Alignment for proximity or contact printer
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
- G03F7/70466—Multiple exposures, e.g. combination of fine and coarse exposures, double patterning or multiple exposures for printing a single feature
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7069—Alignment mark illumination, e.g. darkfield, dual focus
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7073—Alignment marks and their environment
- G03F9/7076—Mark details, e.g. phase grating mark, temporary mark
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Nonlinear Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Multimedia (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Liquid Crystal (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
Description
Claims (13)
- 一种显示器件的对位检测设备,包括用于承载所述显示器件的承载架、控制装置、检测装置和分析装置,其中,所述控制装置用于在所述承载架处于工艺间的空闲时间时,根据预先存储的所述显示器件的对位区域的参考点坐标信息,向所述检测装置发送控制指令;所述检测装置用于根据所述控制装置发送的控制指令移动至所述承载架上所述显示器件的对位区域,并采集该区域的图像,然后将所述图像发送至所述分析装置;并且所述分析装置用于利用所述检测装置发送的图像分析处理所述显示器件的对位情况。
- 根据权利要求1所述的显示器件的对位检测设备,其中,所述分析装置用于显示所述图像,以供人肉眼判断所述显示器件的对位情况。
- 根据权利要求1所述的显示器件的对位检测设备,其中,所述分析装置用于将所述图像与存储在所述显示器件中的对位标准图像进行比较,并根据比较结果判断所述显示器件的对位情况。
- 根据权利要求3所述的显示器件的对位检测设备,其中,所述分析装置用于将所述图像与存储在所述显示器件中的对位标准图像进行比较,并根据比较结果判断所述显示器件的对位情况;所述对位检测设备还包括报警装置,用于在所述分析装置判断所述显示器件的对位情况不合格时,发出报警提示。
- 根据权利要求1所述的显示器件的对位检测设备,其中,所述检测装置包括照相机、机械臂和驱动机构,所述照相机安装在所述机械臂上,用于采集所述图像;并且所述驱动机构用于驱动所述机械臂运动,以使所述照相机移动至所述承载架上方与所述显示器件的对位区域相对。
- 根据权利要求5所述的显示器件的对位检测设备,其中,所述照相机包括自动对焦装置,用于根据环境光线及所述照相机与所述显示器件之间的距离自动对焦。
- 根据权利要求5所述的显示器件的对位检测设备,其中,所述承载架包括沿竖直方向间隔设置的多层托盘,每层托盘用于承载多个所述显示器件;所述驱动机构包括竖直驱动组件和水平驱动组件,其中,所述竖直驱动组件用于驱动所述水平驱动组件及所述机械臂在竖直方向同步移动;并且所述水平驱动组件用于驱动所述机械臂在水平方向运动。
- 根据权利要求7所述的显示器件的对位检测设备,其中,在所述竖直驱动组件驱动所述水平驱动组件及所述机械臂移动至与任意相邻两层托盘之间的间隙相对应的高度时,所述水平驱动组件驱动所述机械臂水平运动至该间隙中与所述显示器件的对位区域相对。
- 根据权利要求8所述的显示器件的对位检测设备,其中,所述水平驱动组件驱动所述机械臂采用旋入或旋出的方式运动;或者,所述水平驱动组件驱动所述机械臂采用伸出或回缩的方式运动。
- 根据权利要求7所述的显示器件的对位检测设备,其中,所述驱动机构还包括旋转机构,所述旋转机构安装在所述水平驱动组件上,用以驱动所述机械臂在水平面内旋转。
- 根据权利要求10所述的显示器件的对位检测设备,其中, 所述检测装置包括两个照相机,所述两个照相机间隔安装在所述机械臂上,并且所述两个照相机之间的间隔与托盘上相邻两个显示器件之间的间隔对应。
- 根据权利要求1所述的显示器件的对位检测设备,其中,所述工艺间的空闲时间为在完成曝光工艺之后,且在进行刻蚀工艺之前,所述承载架的运输途中或者等待工艺期间。
- 一种曝光工艺系统,包括曝光单元、烘干单元和权利要求1-12中任意一项所述的对位检测设备,其中,所述曝光单元用于对所述显示器件进行曝光工艺;所述烘干单元用于对完成曝光的所述显示器件进行烘干;并且所述对位检测设备用于对完成烘干的所述显示器件的对位情况进行检测。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15/509,484 US10466600B2 (en) | 2016-03-23 | 2016-06-08 | Overlay alignment detection apparatus for display device and exposure process system |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201620226332.6 | 2016-03-23 | ||
CN201620226332.6U CN205427436U (zh) | 2016-03-23 | 2016-03-23 | 显示器件的对位检测设备及曝光工艺系统 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2017161701A1 true WO2017161701A1 (zh) | 2017-09-28 |
Family
ID=56547910
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/CN2016/085253 WO2017161701A1 (zh) | 2016-03-23 | 2016-06-08 | 显示器件的对位检测设备及曝光工艺系统 |
Country Status (3)
Country | Link |
---|---|
US (1) | US10466600B2 (zh) |
CN (1) | CN205427436U (zh) |
WO (1) | WO2017161701A1 (zh) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106406038B (zh) * | 2016-10-21 | 2018-03-09 | 京东方科技集团股份有限公司 | 一种曝光机 |
CN109931914B (zh) * | 2019-03-18 | 2021-10-08 | 京东方科技集团股份有限公司 | 一种对位相机及检测设备 |
CN110220675B (zh) * | 2019-06-11 | 2021-09-28 | 深圳创维-Rgb电子有限公司 | 一种显示器性能测试系统、方法、终端及存储介质 |
CN110597360B (zh) * | 2019-10-25 | 2021-09-14 | 业成科技(成都)有限公司 | 曲面显示器之玻璃盖板的贴合方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5793472A (en) * | 1994-12-14 | 1998-08-11 | Nikon Corporation | Exposure method using reference marks on both the mask and the substrate and capable of providing high alignment precision even after multiple exposures |
CN101263433A (zh) * | 2005-09-13 | 2008-09-10 | 尔萨有限公司 | 用于确定两个基本平面元件之间的相对位置的装置 |
JP2010045099A (ja) * | 2008-08-11 | 2010-02-25 | Adwelds:Kk | アライメントマーク画像の表示方法およびアライメント装置 |
CN101981512A (zh) * | 2008-03-31 | 2011-02-23 | 富士通株式会社 | 面状体对准装置、制造装置、面状体对准方法及制造方法 |
CN102736280A (zh) * | 2012-05-22 | 2012-10-17 | 北京京东方光电科技有限公司 | 偏光板贴附精度检测装置及方法 |
CN103165501A (zh) * | 2011-12-08 | 2013-06-19 | 财团法人金属工业研究发展中心 | 无标记基板组装对位方法 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0735565B1 (en) * | 1995-03-31 | 1999-06-02 | International Business Machines Corporation | Method and apparatus for monitoring the dry etching of a dielectric film to a given thickness |
US6339028B2 (en) * | 1999-04-27 | 2002-01-15 | Stmicroelectronics, Inc. | Vacuum loadlock ultra violet bake for plasma etch |
US20050042523A1 (en) * | 2003-08-20 | 2005-02-24 | Banqiu Wu | Endpoint detection of plasma-assisted etch process |
JP5195417B2 (ja) * | 2006-02-21 | 2013-05-08 | 株式会社ニコン | パターン形成装置、露光装置、露光方法及びデバイス製造方法 |
TWI653511B (zh) * | 2006-08-31 | 2019-03-11 | 日商尼康股份有限公司 | Exposure apparatus, exposure method, and component manufacturing method |
TWI652720B (zh) * | 2006-09-01 | 2019-03-01 | 日商尼康股份有限公司 | Exposure method and device and component manufacturing method |
JP2008078486A (ja) * | 2006-09-22 | 2008-04-03 | Oki Electric Ind Co Ltd | 半導体素子 |
KR101427071B1 (ko) * | 2007-07-24 | 2014-08-07 | 가부시키가이샤 니콘 | 이동체 구동 방법 및 이동체 구동 시스템, 패턴 형성 방법 및 장치, 노광 방법 및 장치, 그리고 디바이스 제조 방법 |
KR20100057758A (ko) * | 2007-08-24 | 2010-06-01 | 가부시키가이샤 니콘 | 이동체 구동 방법 및 이동체 구동 시스템, 그리고 패턴 형성 방법 및 패턴 형성 장치 |
CN102566320B (zh) * | 2007-12-28 | 2015-01-28 | 株式会社尼康 | 曝光装置、曝光方法以及器件制造方法 |
NL2003785A (en) * | 2008-12-09 | 2010-06-10 | Asml Netherlands Bv | Method of forming a marker, substrate having a marker and device manufacturing method. |
US8760629B2 (en) * | 2008-12-19 | 2014-06-24 | Nikon Corporation | Exposure apparatus including positional measurement system of movable body, exposure method of exposing object including measuring positional information of movable body, and device manufacturing method that includes exposure method of exposing object, including measuring positional information of movable body |
US8514395B2 (en) * | 2009-08-25 | 2013-08-20 | Nikon Corporation | Exposure method, exposure apparatus, and device manufacturing method |
US9207549B2 (en) * | 2011-12-29 | 2015-12-08 | Nikon Corporation | Exposure apparatus and exposure method, and device manufacturing method with encoder of higher reliability for position measurement |
US9297773B2 (en) * | 2013-12-26 | 2016-03-29 | Intermolecular, Inc. | X-ray fluorescence analysis of thin-film coverage defects |
JP6166682B2 (ja) * | 2014-03-26 | 2017-07-19 | 富士フイルム株式会社 | 着色組成物、硬化膜、カラーフィルタ、パターン形成方法、カラーフィルタの製造方法、固体撮像素子、および、画像表示装置 |
US20170330876A1 (en) * | 2014-12-02 | 2017-11-16 | Glenn J. Leedy | Vertical system integration |
US10170274B2 (en) * | 2015-03-18 | 2019-01-01 | Battelle Memorial Institute | TEM phase contrast imaging with image plane phase grating |
US10224175B2 (en) * | 2015-03-18 | 2019-03-05 | Battelle Memorial Institute | Compressive transmission microscopy |
EP3291011A4 (en) * | 2015-03-25 | 2019-02-27 | Nikon Corporation | LAYOUT METHOD, BRAND DETECTION METHOD, LIGHT EXPOSURE METHOD, MEASURING APPARATUS, LIGHT EXPOSURE APPARATUS, AND DEVICE MANUFACTURING METHOD |
-
2016
- 2016-03-23 CN CN201620226332.6U patent/CN205427436U/zh not_active Expired - Fee Related
- 2016-06-08 US US15/509,484 patent/US10466600B2/en not_active Expired - Fee Related
- 2016-06-08 WO PCT/CN2016/085253 patent/WO2017161701A1/zh active Application Filing
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5793472A (en) * | 1994-12-14 | 1998-08-11 | Nikon Corporation | Exposure method using reference marks on both the mask and the substrate and capable of providing high alignment precision even after multiple exposures |
CN101263433A (zh) * | 2005-09-13 | 2008-09-10 | 尔萨有限公司 | 用于确定两个基本平面元件之间的相对位置的装置 |
CN101981512A (zh) * | 2008-03-31 | 2011-02-23 | 富士通株式会社 | 面状体对准装置、制造装置、面状体对准方法及制造方法 |
JP2010045099A (ja) * | 2008-08-11 | 2010-02-25 | Adwelds:Kk | アライメントマーク画像の表示方法およびアライメント装置 |
CN103165501A (zh) * | 2011-12-08 | 2013-06-19 | 财团法人金属工业研究发展中心 | 无标记基板组装对位方法 |
CN102736280A (zh) * | 2012-05-22 | 2012-10-17 | 北京京东方光电科技有限公司 | 偏光板贴附精度检测装置及方法 |
Also Published As
Publication number | Publication date |
---|---|
CN205427436U (zh) | 2016-08-03 |
US20180095371A1 (en) | 2018-04-05 |
US10466600B2 (en) | 2019-11-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2017161701A1 (zh) | 显示器件的对位检测设备及曝光工艺系统 | |
KR100958204B1 (ko) | 평판디스플레이 패널 검사 장비 및 방법 | |
WO2016138744A1 (zh) | 检测显示面板表面平坦度的装置及方法 | |
US9140546B2 (en) | Apparatus and method for three dimensional inspection of wafer saw marks | |
JP5881244B2 (ja) | 部品実装装置、基板検出方法及び基板製造方法 | |
CN107993958B (zh) | 半导体缺陷检测/光刻中的正交性补偿方法及补偿系统 | |
CN104567685A (zh) | 半导体晶片的检测装置 | |
JP2014115222A (ja) | 検査装置および検査方法 | |
KR102037384B1 (ko) | 패널 검사 장치 및 방법 | |
JP3946507B2 (ja) | 基板の厚さを測定するためのオンライン測定装置及びその測定方法 | |
TWM606479U (zh) | 晶圓盒檢測裝置 | |
TWI479145B (zh) | 外觀瑕疵檢測系統及方法 | |
JP5832909B2 (ja) | 赤外カメラを具備する配線欠陥検出装置、および当該赤外カメラの異常を検知する異常検知方法 | |
JP2013228232A (ja) | 基板外観検査方法 | |
WO2018227923A1 (zh) | 一种光学检测装置及光学检测方法 | |
CN207502412U (zh) | 一种屏幕检测装置 | |
JP5418490B2 (ja) | 位置決め制御装置およびこれを備えた位置決め装置 | |
JP2012127930A (ja) | 車両用ヘッドライトの測定方法とその装置 | |
JP2011170144A (ja) | フォトマスク、プロキシミティ露光装置、及びプロキシミティ露光装置のアライメントマーク検出方法 | |
JP2010282100A (ja) | カメラ設置位置検出装置及び検出方法並びにカメラ設置位置検出用治具 | |
JP4981703B2 (ja) | 外観検査装置および外観検査方法 | |
KR101234577B1 (ko) | 저항막 방식의 터치스크린 모듈의 비정형 불량을 검출하기 위한 비정형 불량 검사 장치 및 방법 | |
CN109829897A (zh) | 一种齿轮毛刺检测方法及齿轮高精度视觉测量系统 | |
JP2018080959A (ja) | 外観検査装置および外観検査方法 | |
KR20190097768A (ko) | 평판디스플레이 패널 검사 방법 및 장비 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 15509484 Country of ref document: US |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 16895053 Country of ref document: EP Kind code of ref document: A1 |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 16895053 Country of ref document: EP Kind code of ref document: A1 |
|
32PN | Ep: public notification in the ep bulletin as address of the adressee cannot be established |
Free format text: NOTING OF LOSS OF RIGHTS PURSUANT TO RULE 112(1) EPC (EPO FORM 1205A DATED 18/02/2019) |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 16895053 Country of ref document: EP Kind code of ref document: A1 |