WO2017156829A1 - 基板的封装方法 - Google Patents

基板的封装方法 Download PDF

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Publication number
WO2017156829A1
WO2017156829A1 PCT/CN2016/080188 CN2016080188W WO2017156829A1 WO 2017156829 A1 WO2017156829 A1 WO 2017156829A1 CN 2016080188 W CN2016080188 W CN 2016080188W WO 2017156829 A1 WO2017156829 A1 WO 2017156829A1
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Prior art keywords
substrate
package cover
cutting line
sealant
packaging
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PCT/CN2016/080188
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English (en)
French (fr)
Inventor
刘亚伟
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TCL China Star Optoelectronics Technology Co Ltd
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Shenzhen China Star Optoelectronics Technology Co Ltd
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Priority to US15/105,570 priority Critical patent/US10069115B2/en
Publication of WO2017156829A1 publication Critical patent/WO2017156829A1/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
    • C03C25/62—Surface treatment of fibres or filaments made from glass, minerals or slags by application of electric or wave energy; by particle radiation or ion implantation
    • C03C25/6206—Electromagnetic waves
    • C03C25/6226—Ultraviolet
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
    • C03C27/06—Joining glass to glass by processes other than fusing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/841—Self-supporting sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/851—Division of substrate

Definitions

  • the present invention relates to the field of display technologies, and in particular, to a method of packaging a substrate.
  • planar light source technology is a new type of light source, and its technology research and development is close to the market mass production level.
  • the bonding of two flat glass sheets is an important technology, and the sealing effect will directly affect the performance of the device.
  • UV curing technology is the earliest and most commonly used technology for LCD/OLED packaging. It has the following characteristics: no solvent or a small amount of solvent, which reduces solvent pollution to the environment; low energy consumption, low temperature curing, suitable for heat Sensitive materials; fast curing speed, high efficiency, can be used in high-speed production lines, and the curing equipment has a small footprint.
  • FIG. 1 is a schematic diagram of a conventional method for packaging a substrate.
  • the packaging method includes the following steps: Step 1. Apply a sealant 300 containing no spacer particles to an edge position on the package cover 100.
  • the spacer glue 300 does not contain spacer particles, after the package cover 100 and the substrate 200 are paired, the glue height of the sealant 300 is difficult to control, and the substrate 200 has different positions.
  • the high glue width of the sealant 300 may be uneven, resulting in poor sealing of the obtained substrate package structure, resulting in package failure.
  • the object of the present invention is to provide a method for packaging a substrate, which uses a sealant without spacer particles to encapsulate the substrate, and ensures that the sealant has a uniform height and width, and has a simple process and a good packaging effect.
  • the present invention provides a method for packaging a substrate, comprising the following steps:
  • Step 1 providing a package cover plate and a substrate to be packaged, the edge of the package cover plate is provided with a frame-shaped first cutting line, and the edge of the substrate is provided with a frame-shaped second cutting line;
  • Step 2 forming a plurality of spaced apart support portions on the outer surface of the first cutting line on the package cover plate, and the plurality of support portions are disposed corresponding to a periphery of the second cutting line on the substrate;
  • Step 3 applying a ring of sealant on the inner side of the first cutting line on the package cover, and the frame glue is disposed on the inner side of the second cutting line on the substrate;
  • Step 4 aligning the package cover plate with the substrate
  • Step 5 curing the sealant
  • Step 6 Cutting the package cover along the first cutting line, cutting the substrate along the second cutting line, and cutting the plurality of support portions and the substrate contacting the plurality of support portions and the edge portion of the package cover Excision, encapsulation of the package cover to the substrate.
  • the package cover is a glass plate; the substrate comprises a TFT substrate and an OLED device disposed on the TFT substrate, and the second cutting line is disposed corresponding to a periphery of the OLED device on the substrate.
  • the material of the support portion is inorganic.
  • the shape of the support portion is a strip shape or a column shape.
  • the plurality of spaced apart support portions define a rectangular shape on the package cover.
  • the heights of the plurality of support portions are equal.
  • the height of the support portion is 3 to 6 ⁇ m, and the width of the support portion is 0.1 to 10 mm.
  • the sealant is a sealant that does not contain spacer particles.
  • the sealant is disposed between the OLED device on the substrate and the second cutting line.
  • the sealant is cured by heating or ultraviolet irradiation.
  • the invention also provides a method for packaging a substrate, comprising the following steps:
  • Step 1 providing a package cover plate and a substrate to be packaged, the edge of the package cover plate is provided with a frame-shaped first cutting line, and the edge of the substrate is provided with a frame-shaped second cutting line;
  • Step 2 forming a plurality of spaced apart support portions on the outer surface of the first cutting line on the package cover plate, and the plurality of support portions are disposed corresponding to a periphery of the second cutting line on the substrate;
  • Step 3 applying a ring of sealant on the inner side of the first cutting line on the package cover, and the frame glue is disposed on the inner side of the second cutting line on the substrate;
  • Step 4 aligning the package cover plate with the substrate
  • Step 5 curing the sealant
  • Step 6 Cutting the package cover along the first cutting line, cutting the substrate along the second cutting line, and the plurality of support portions and the substrate and the package cover plate that are in contact with the plurality of support portions The edge portion is cut off to realize packaging of the package cover plate to the substrate;
  • the package cover plate is a glass plate;
  • the substrate includes a TFT substrate and an OLED device disposed on the TFT substrate, and the second cutting line is disposed corresponding to a periphery of the OLED device on the substrate;
  • the material of the support portion is inorganic
  • the shape of the support portion is a strip shape or a column shape
  • the plurality of spaced apart support portions enclose a rectangle on the package cover
  • the present invention provides a method for packaging a substrate by forming a plurality of spaced apart support portions at an edge of the package cover to align the package cover with the substrate to be packaged. After that, the gap between the package cover and the substrate is limited, so that the glue height of the sealant without the spacer particles is ensured, and the glue width of the sealant is also ensured at the same time when the glue amount is fixed, and after the package is completed, Cutting the support portion and the edge portion of the substrate and the package cover plate in contact with the support portion, thereby obtaining a substrate packaged using a sealant without spacer particles, and ensuring a uniform height and width of the sealant, and the process is simple The packaging effect is good.
  • FIG. 1 is a schematic view showing a conventional method of packaging a substrate
  • FIG. 2 is a flow chart of a method of packaging a substrate of the present invention
  • FIG. 3 is a schematic structural view of a package cover plate provided in step 1 of the method for packaging a substrate of the present invention
  • FIG. 4 is a schematic structural view of a substrate to be packaged provided in step 1 of the method for packaging a substrate of the present invention
  • step 2 is a schematic diagram of step 2 of a method of packaging a substrate of the present invention.
  • 6-7 are schematic views showing a step 3 of a method of packaging a substrate of the present invention.
  • FIG. 8 is a schematic diagram of steps 4-5 of the method for packaging a substrate of the present invention.
  • step 6 is a schematic view of step 6 of the method of packaging a substrate of the present invention.
  • the present invention provides a method for packaging a substrate, including the following steps:
  • Step 1 as shown in FIG. 3 and FIG. 4, a package cover 10 and a substrate 20 to be packaged are provided.
  • the edge of the package cover 10 is provided with a frame-shaped first cutting line 11
  • a second cutting line 21 of a frame shape is provided at an edge position of the substrate 20.
  • the package cover 10 is a glass plate.
  • the substrate 20 is an OLED substrate, and includes a TFT substrate 23 and an OLED device 25 disposed on the TFT substrate 23.
  • the second cutting line 21 is disposed corresponding to a periphery of the OLED device 25 on the substrate 20.
  • Step 2 as shown in FIG. 5, a plurality of spaced apart support portions 12 are formed on the periphery of the first cutting line 11 on the package cover 10, and the plurality of support portions 12 correspond to the substrate 20.
  • the periphery of the second cutting line 21 is disposed.
  • the material of the support portion 12 is an inorganic substance such as silicon oxide (SiO 2 ), silicon nitride (SiN x ) or the like.
  • the shape of the support portion 12 may be various shapes such as a strip shape (as shown in FIG. 5) or a column shape.
  • the plurality of spaced-apart support portions 12 define a rectangular shape on the package cover 10.
  • the heights of the plurality of support portions 12 are equal.
  • the height of the support portion 12 can be designed according to the gap of the upper and lower substrates of the package to be required.
  • the height of the support portion 12 is 3 to 6 ⁇ m, and the width of the support portion 12 is 0.1 to 10 mm.
  • a plurality of support portions 12 are formed by a chemical vapor deposition process and a photolithography process.
  • Step 3 as shown in FIG. 6 and FIG. 7, a sealant 15 is coated on the inner side of the first cutting line 11 on the package cover 10, and the sealant 15 corresponds to the first on the substrate 20.
  • the sealant 15 is a sealant without spacers.
  • the sealant 15 is disposed between the OLED device 25 on the substrate 20 and the second cutting line 21 .
  • Step 4 and FIG. 8 the package cover 10 and the substrate 20 are aligned.
  • Step 5 As shown in FIG. 8, the sealant 15 is cured.
  • the sealant 15 is cured by heating or ultraviolet (UV) irradiation according to the curing conditions of the sealant 15.
  • UV ultraviolet
  • Step 6 as shown in FIG. 8 and FIG. 9, the package cover 10 is cut along the first cutting line 11, and the substrate 20 is cut along the second cutting line 21, and the plurality of support portions 12 and The substrate 20 and the edge portion of the package cover 10 which are in contact with each other are cut off, and the package cover 10 is packaged on the substrate 20.
  • the present invention provides a method for packaging a substrate by forming a plurality of spaced apart support portions at the edge of the package cover, thereby aligning the package cover with the substrate to be packaged.
  • the gap between the package cover and the substrate is limited, so that the glue height of the sealant without the spacer particles is ensured, and the glue width of the sealant is also ensured at the same time when the glue amount is fixed, and after the package is completed,
  • the support portion and the edge portion of the substrate and the package cover plate which are in contact with the support portion are cut, thereby obtaining a substrate packaged using a sealant without spacer particles, and ensuring a uniform height and width of the sealant, and the process is simple.
  • the packaging effect is good.

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Optics & Photonics (AREA)
  • Materials Engineering (AREA)
  • Geochemistry & Mineralogy (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
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  • Ceramic Engineering (AREA)
  • Electroluminescent Light Sources (AREA)
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Abstract

一种基板的封装方法，通过在封装盖板（10）的边缘位置形成数个间隔设置的支撑部（12），从而在封装盖板与待封装的基板（20）对位贴合后，限定了封装盖板与基板的间隙，使得不含间隔颗粒的框胶（15）的胶高得到保证，在涂胶量一定的情况下，框胶的胶宽也同时得到保证，并在封装完成后对支撑部、以及与支撑部相接触的基板及封装盖板的边缘部分进行切割，从而得到使用不含间隔颗粒的封装框胶的基板，并保证了框胶具有一致的高度及宽度，制程简便，封装效果好。

Description

基板的封装方法 技术领域
本发明涉及显示技术领域，尤其涉及一种基板的封装方法。
背景技术
在显示技术领域，平板显示技术(LCD、OLED)已经逐步取代CRT显示器。平面光源技术是新型的光源，其技术研发已经接近市场化量产水平。在平板显示与平面光源技术当中，对于两片平板玻璃的粘结是一项很重要的技术，其封止效果将直接影响器件的性能。
紫外光(UV)固化技术是LCD/OLED封装最早也是最常用的技术，其具有如下特点：不用溶剂或少量溶剂，减少了溶剂对环境的污染；耗能少，可低温固化，适用于对热敏感的材料；固化速度快，效率高，可在高速生产线上使用，固化设备占地面积小等。
有时，为了防止框胶内的间隔颗粒(spacer)压伤TFT(薄膜晶体管)基板上的TFT及电极引线，需要使用不含间隔颗粒的框胶进行封装。然而，由于没有间隔颗粒的限制，不含间隔颗粒的框胶的胶高胶宽很难控制，这一组玻璃与上一组玻璃、或者同一组玻璃内部都有可能存在胶高胶宽的差异。
图1为现有的一种基板的封装方法的示意图，如图1所示，该封装方法包括以下步骤：步骤1、在封装盖板100上的边缘位置涂布不含间隔颗粒的框胶300；步骤2、将封装盖板100与待封装的基板200对组在一起后，对框胶300进行固化，完成对基板200的封装。上述基板的封装方法中，由于框胶300内不含间隔颗粒，因此，将封装盖板100与基板200对组后，框胶300的胶高胶宽很难得到控制，并且基板200上不同位置的框胶300的胶高胶宽可能不均匀，从而导致得到的基板封装结构的密封性不好，造成封装失败。
因此，有必要提出一种基板的封装方法，以解决上述问题。
发明内容
本发明的目的在于提供一种基板的封装方法，采用不含间隔颗粒的框胶对基板进行封装，并保证框胶具有一致的高度及宽度，制程简便，封装效果好。
为实现上述目的，本发明提供一种基板的封装方法，包括以下步骤：
步骤1、提供封装盖板与待封装的基板，所述封装盖板的边缘位置设有框形的第一切割线，所述基板的边缘位置设有框形的第二切割线；
步骤2、在所述封装盖板上对应第一切割线的外围形成数个间隔设置的支撑部，同时该数个支撑部对应于所述基板上的第二切割线的外围设置；
步骤3、在所述封装盖板上对应第一切割线的内侧涂布一圈框胶，同时该框胶对应于所述基板上的第二切割线的内侧设置；
步骤4、将所述封装盖板与基板对位贴合；
步骤5、对所述框胶进行固化；
步骤6、沿第一切割线对封装盖板进行切割，沿第二切割线对基板进行切割，将所述数个支撑部、以及与数个支撑部相接触的基板及封装盖板的边缘部分切除，实现封装盖板对基板的封装。
所述封装盖板为玻璃板；所述基板包括TFT基板与设于TFT基板上的OLED器件，所述第二切割线对应于所述基板上的OLED器件的外围设置。
所述支撑部的材料为无机物。
所述支撑部的形状为条形或柱形。
所述数个间隔设置的支撑部在所述封装盖板上围成一矩形。
所述数个支撑部的高度相等。
所述支撑部的高度为3～6μm，所述支撑部的宽度为0.1～10mm。
所述框胶为不含间隔颗粒的框胶。
所述步骤3中，所述框胶对应于所述基板上的OLED器件与第二切割线之间设置。
所述步骤5中采用加热或者紫外线照射的方法对所述框胶进行固化。
本发明还提供一种基板的封装方法，包括以下步骤：
步骤1、提供封装盖板与待封装的基板，所述封装盖板的边缘位置设有框形的第一切割线，所述基板的边缘位置设有框形的第二切割线；
步骤2、在所述封装盖板上对应第一切割线的外围形成数个间隔设置的支撑部，同时该数个支撑部对应于所述基板上的第二切割线的外围设置；
步骤3、在所述封装盖板上对应第一切割线的内侧涂布一圈框胶，同时该框胶对应于所述基板上的第二切割线的内侧设置；
步骤4、将所述封装盖板与基板对位贴合；
步骤5、对所述框胶进行固化；
步骤6、沿第一切割线对封装盖板进行切割，沿第二切割线对基板进行切割，将所述数个支撑部、以及与数个支撑部相接触的基板及封装盖板的 边缘部分切除，实现封装盖板对基板的封装；
其中，所述封装盖板为玻璃板；所述基板包括TFT基板与设于TFT基板上的OLED器件，所述第二切割线对应于所述基板上的OLED器件的外围设置；
其中，所述支撑部的材料为无机物；
其中，所述支撑部的形状为条形或柱形；
其中，所述数个间隔设置的支撑部在所述封装盖板上围成一矩形；
其中，所述数个支撑部的高度相等。
本发明的有益效果：本发明提供的一种基板的封装方法，通过在封装盖板的边缘位置形成数个间隔设置的支撑部，从而在所述封装盖板与待封装的基板对位贴合后，限定了封装盖板与基板的间隙，使得不含间隔颗粒的框胶的胶高得到保证，在涂胶量一定的情况下，框胶的胶宽也同时得到保证，并在封装完成后对支撑部、以及与支撑部相接触的基板及封装盖板的边缘部分进行切割，从而得到使用不含间隔颗粒的框胶封装的基板，并保证了框胶具有一致的高度及宽度，制程简便，封装效果好。
为了能更进一步了解本发明的特征以及技术内容，请参阅以下有关本发明的详细说明与附图，然而附图仅提供参考与说明用，并非用来对本发明加以限制。
附图说明
下面结合附图，通过对本发明的具体实施方式详细描述，将使本发明的技术方案及其它有益效果显而易见。
附图中，
图1为现有的一种基板的封装方法的示意图；
图2为本发明的基板的封装方法的流程图；
图3为本发明的基板的封装方法的步骤1中所提供的封装盖板的结构示意图；
图4为本发明的基板的封装方法的步骤1中所提供的待封装的基板的结构示意图；
图5为本发明的基板的封装方法的步骤2的示意图；
图6-7为本发明的基板的封装方法的步骤3的示意图；
图8为本发明的基板的封装方法的步骤4-5的示意图；
图9为本发明的基板的封装方法的步骤6的示意图。
具体实施方式
为更进一步阐述本发明所采取的技术手段及其效果，以下结合本发明的优选实施例及其附图进行详细描述。
请参阅图2，本发明提供一种基板的封装方法，包括以下步骤：
步骤1、如图3和图4所示，提供封装盖板10与待封装的基板20，所述封装盖板10的边缘位置设有框形的第一切割线(cutting line)11，所述基板20的边缘位置设有框形的第二切割线21。
具体的，所述封装盖板10为玻璃板。
具体的，所述基板20为OLED基板，包括TFT基板23与设于TFT基板23上的OLED器件25，所述第二切割线21对应于所述基板20上的OLED器件25的外围设置。
步骤2、如图5所示，在所述封装盖板10上对应第一切割线11的外围形成数个间隔设置的支撑部12，同时该数个支撑部12对应于所述基板20上的第二切割线21的外围设置。
具体的，所述支撑部12的材料为无机物，如氧化硅(SiO2)、氮化硅(SiNx)等。
进一步的，所述支撑部12的形状可以为条形(如图5所示)或柱形等各种形状。
优选的，所述数个间隔设置的支撑部12在所述封装盖板10上围成一矩形。
具体的，所述数个支撑部12的高度相等。具体的，所述支撑部12的高度可以根据需要的封装的上下基板的间隙(gap)进行设计。
优选的，所述支撑部12的高度为3～6μm，所述支撑部12的宽度为0.1～10mm。
具体的，所述步骤2中通过化学气相沉积制程与光刻制程形成数个支撑部12。
步骤3、如图6和图7所示，在所述封装盖板10上对应第一切割线11的内侧涂布一圈框胶15，同时该框胶15对应于所述基板20上的第二切割线21的外围设置。
具体的，所述框胶15为不含间隔颗粒(spacer)的框胶。
具体的，所述框胶15对应于所述基板20上的OLED器件25与第二切割线21之间设置。
步骤4、图8所示，将所述封装盖板10与基板20对位贴合。
步骤5、如图8所示，对所述框胶15进行固化。
具体的，所述步骤5中，视框胶15的固化条件，采用加热、或者紫外线(UV)照射的方法对所述框胶15进行固化。
步骤6、如图8和图9所示，沿第一切割线11对封装盖板10进行切割，沿第二切割线21对基板20进行切割，将所述数个支撑部12、以及与数个支撑部12相接触的基板20及封装盖板10的边缘部分切除，实现封装盖板10对基板20的封装。
综上所述，本发明提供的一种基板的封装方法，通过在封装盖板的边缘位置形成数个间隔设置的支撑部，从而在所述封装盖板与待封装的基板对位贴合后，限定了封装盖板与基板的间隙，使得不含间隔颗粒的框胶的胶高得到保证，在涂胶量一定的情况下，框胶的胶宽也同时得到保证，并在封装完成后对支撑部、以及与支撑部相接触的基板及封装盖板的边缘部分进行切割，从而得到使用不含间隔颗粒的框胶封装的基板，并保证了框胶具有一致的高度及宽度，制程简便，封装效果好。
以上所述，对于本领域的普通技术人员来说，可以根据本发明的技术方案和技术构思作出其他各种相应的改变和变形，而所有这些改变和变形都应属于本发明权利要求的保护范围。

Claims (15)

  1. 一种基板的封装方法，包括以下步骤：
    步骤1、提供封装盖板与待封装的基板，所述封装盖板的边缘位置设有框形的第一切割线，所述基板的边缘位置设有框形的第二切割线；
    步骤2、在所述封装盖板上对应第一切割线的外围形成数个间隔设置的支撑部，同时该数个支撑部对应于所述基板上的第二切割线的外围设置；
    步骤3、在所述封装盖板上对应第一切割线的内侧涂布一圈框胶，同时该框胶对应于所述基板上的第二切割线的内侧设置；
    步骤4、将所述封装盖板与基板对位贴合；
    步骤5、对所述框胶进行固化；
    步骤6、沿第一切割线对封装盖板进行切割，沿第二切割线对基板进行切割，将所述数个支撑部、以及与数个支撑部相接触的基板及封装盖板的边缘部分切除，实现封装盖板对基板的封装。
  2. 如权利要求1所述的基板的封装方法，其中，所述封装盖板为玻璃板；所述基板包括TFT基板与设于TFT基板上的OLED器件，所述第二切割线对应于所述基板上的OLED器件的外围设置。
  3. 如权利要求1所述的基板的封装方法，其中，所述支撑部的材料为无机物。
  4. 如权利要求1所述的基板的封装方法，其中，所述支撑部的形状为条形或柱形。
  5. 如权利要求1所述的基板的封装方法，其中，所述数个间隔设置的支撑部在所述封装盖板上围成一矩形。
  6. 如权利要求1所述的基板的封装方法，其中，所述数个支撑部的高度相等。
  7. 如权利要求6所述的基板的封装方法，其中，所述支撑部的高度为3～6μm，所述支撑部的宽度为0.1～10mm。
  8. 如权利要求1所述的基板的封装方法，其中，所述框胶为不含间隔颗粒的框胶。
  9. 如权利要求2所述的基板的封装方法，其中，所述步骤3中，所述框胶对应于所述基板上的OLED器件与第二切割线之间设置。
  10. 如权利要求1所述的基板的封装方法，其中，所述步骤5中采用加热或者紫外线照射的方法对所述框胶进行固化。
  11. 一种基板的封装方法，包括以下步骤：
    步骤1、提供封装盖板与待封装的基板，所述封装盖板的边缘位置设有框形的第一切割线，所述基板的边缘位置设有框形的第二切割线；
    步骤2、在所述封装盖板上对应第一切割线的外围形成数个间隔设置的支撑部，同时该数个支撑部对应于所述基板上的第二切割线的外围设置；
    步骤3、在所述封装盖板上对应第一切割线的内侧涂布一圈框胶，同时该框胶对应于所述基板上的第二切割线的内侧设置；
    步骤4、将所述封装盖板与基板对位贴合；
    步骤5、对所述框胶进行固化；
    步骤6、沿第一切割线对封装盖板进行切割，沿第二切割线对基板进行切割，将所述数个支撑部、以及与数个支撑部相接触的基板及封装盖板的边缘部分切除，实现封装盖板对基板的封装；
    其中，所述封装盖板为玻璃板；所述基板包括TFT基板与设于TFT基板上的OLED器件，所述第二切割线对应于所述基板上的OLED器件的外围设置；
    其中，所述支撑部的材料为无机物；
    其中，所述支撑部的形状为条形或柱形；
    其中，所述数个间隔设置的支撑部在所述封装盖板上围成一矩形；
    其中，所述数个支撑部的高度相等。
  12. 如权利要求11所述的基板的封装方法，其中，所述支撑部的高度为3～6μm，所述支撑部的宽度为0.1～10mm。
  13. 如权利要求11所述的基板的封装方法，其中，所述框胶为不含间隔颗粒的框胶。
  14. 如权利要求11所述的基板的封装方法，其中，所述步骤3中，所述框胶对应于所述基板上的OLED器件与第二切割线之间设置。
  15. 如权利要求11所述的基板的封装方法，其中，所述步骤5中采用加热或者紫外线照射的方法对所述框胶进行固化。
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JP6696025B1 (ja) * 2019-04-22 2020-05-20 信越エンジニアリング株式会社 貼合デバイスの貼り合わせ装置及び貼り合わせ方法並びに貼合デバイス
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