WO2016026182A1 - Oled的封装方法及结构 - Google Patents

Oled的封装方法及结构 Download PDF

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Publication number
WO2016026182A1
WO2016026182A1 PCT/CN2014/086263 CN2014086263W WO2016026182A1 WO 2016026182 A1 WO2016026182 A1 WO 2016026182A1 CN 2014086263 W CN2014086263 W CN 2014086263W WO 2016026182 A1 WO2016026182 A1 WO 2016026182A1
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Prior art keywords
package cover
sealant
oled
desiccant
desiccant layer
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PCT/CN2014/086263
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English (en)
French (fr)
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刘亚伟
王宜凡
罗长诚
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深圳市华星光电技术有限公司
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Priority to US14/430,200 priority Critical patent/US9466809B2/en
Publication of WO2016026182A1 publication Critical patent/WO2016026182A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/874—Passivation; Containers; Encapsulations including getter material or desiccant
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54426—Marks applied to semiconductor devices or parts for alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
    • H01L2223/54486—Located on package parts, e.g. encapsulation, leads, package substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/351—Thickness
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment

Definitions

  • the present invention relates to the field of display technologies, and in particular, to a method and structure for packaging an OLED.
  • planar light source technology is a new type of light source, and its technology research and development is close to the market mass production level.
  • the bonding of two flat glass sheets is an important technology, and the packaging effect will directly affect the performance of the device.
  • UV curing technology is the earliest and most commonly used technology for LCD/OLED packaging. It has the following characteristics: no solvent or a small amount of solvent, which reduces solvent pollution to the environment; low energy consumption, low temperature curing, suitable for heat Sensitive materials; fast curing speed, high efficiency, can be used in high-speed production lines, and the curing equipment has a small footprint.
  • the UV glue is an organic material, the molecular gap is large after curing, and the water vapor and the oxygen are relatively easy to pass through the medium to reach the inner sealing region. Therefore, it is more suitable for applications that are less sensitive to moisture and oxygen, such as LCDs. Since OLED devices are very sensitive to moisture and oxygen, when UV packaging is used, there is usually a desiccant inside the device to reduce the water vapor that reaches the inner sealing region through the medium, thereby prolonging the service life of the OLED device.
  • FIG. 1 shows a conventional OLED packaging method in which a groove is pre-divisioned on a package cover 400, and then a desiccant 300 is placed in a recess on the package cover 400, and then the sealant 500 is applied.
  • the package cover 400 is packaged and affixed together with the OLED substrate 100.
  • FIG. 2 shows another conventional OLED packaging method, that is, directly coating a desiccant 300' on the package cover 400' and drying, and then coating the sealant 500', and finally encapsulating the cover 400' It is packaged together with the OLED substrate 100'.
  • An object of the present invention is to provide a method for packaging an OLED, which can improve the packaging effect, improve the ability to block water vapor and oxygen, and prolong the service life of the OLED device. And the method is applicable to the package of the lower light emitting device structure, the upper light emitting device structure, the planar light source and other devices that need to be dried.
  • Another object of the present invention is to provide a package structure of an OLED, which has a good packaging effect, strong ability to block water vapor and oxygen, and long service life.
  • the present invention provides a method for packaging an OLED, comprising the following steps:
  • Step 1 providing an OLED substrate and a package cover, and making a registration mark on the package cover;
  • Step 2 forming a circle of patterned desiccant layer on the package cover
  • Step 3 applying a ring of sealant on the outside of the desiccant layer on the package cover;
  • Step 4 affixing the package cover to the OLED substrate
  • Step 5 using a UV light source to illuminate or heat the frame glue to cure, thereby encapsulating the OLED substrate by the package cover.
  • the package cover is a glass substrate or a metal plate; and the OLED substrate is provided with a TFT array.
  • the desiccant layer is formed on the inside of the glue coating position of the package cover on which the sealant is to be formed, and in step 3, the sealant is coated on the adhesive cover position of the package cover to form the sealant.
  • the frame glue is adhered to the desiccant layer.
  • the method for forming the patterned desiccant layer in step 2 is to directly cut the desiccant sheet into a desired pattern and apply it to the inner side of the coating position on the package cover; the desiccant layer
  • the width is from 100um to 2000um and the height is from 1um to 100um.
  • the method for forming the patterned desiccant layer in step 2 is to first prepare a desiccant into a solution, and apply the desiccant solution to the coating position on the package cover by dispensing or screen printing. Inside, the package cover is placed in a high temperature furnace and baked at 120 ° C to 350 ° C for several hours to remove the solvent in the desiccant solution to cure the desiccant to form a desiccant layer; the width of the desiccant layer is 100um ⁇ 2000um, height is 1um ⁇ 100um.
  • the molecular sieve is a crystalline silicate or aluminosilicate.
  • the method for forming the patterned desiccant layer in step 2 is to first grind the 4A molecular sieve into a powder, the powder has a particle size of 1 um to 100 um, and is added with water to form a paste, and then the molecular sieve paste is applied by screen printing. Coating on the inner side of the coating position on the package cover plate, then placing the package cover plate in a high temperature furnace, baking at 120 ° C ⁇ 350 ° C for several hours, removing water to form a molecular sieve film; the molecular sieve The film has a width of 100 um to 2000 um and a height of 1 um to 100 um.
  • the sealant in step 3 is a UV glue; the height of the sealant is the same as the height of the desiccant layer.
  • the present invention also provides an OLED package structure, including an OLED substrate, a package cover plate disposed on the OLED substrate, a sealant disposed between the OLED substrate and the package cover plate, and disposed between the OLED substrate and the package cover plate. And a desiccant layer on the inside of the sealant.
  • the package cover is a glass substrate or a metal plate, and the OLED substrate is provided with a TFT array.
  • the sealant layer is closely attached to the desiccant layer, the desiccant layer has a width of 100 um to 2000 um, a height of 1 um to 100 um, and the desiccant layer is a molecular sieve film, and the molecular sieve is a crystalline silicate or The aluminosilicate; the sealant is a UV glue; the height of the sealant is the same as the height of the desiccant layer.
  • the invention provides the OLED packaging method and structure. By patterning the desiccant layer and exposing the light-emitting area to achieve no occlusion, the light emitted by the OLED can be emitted from the package cover or from the package cover.
  • the OLED substrate is ejected.
  • the packaging method is applicable to both the package of the upper light emitting device structure and the package of the lower light emitting device structure; and the contact position of the desiccant layer with the package cover plate and the OLED substrate has no gap, and the water vapor is dried for the first time after invading the frame glue.
  • the absorption of the agent the vapor has no chance and no propagation path to the surface of the OLED device, thus ensuring that the OLED device is absolutely safe for a relatively long period of time before the desiccant is saturated with water.
  • the path of oxygen entering the surface of the OLED device in the sealing region is blocked, which greatly reduces the damage of oxygen to the OLED device.
  • FIG. 1 is a schematic cross-sectional view of a conventional OLED package structure
  • FIG. 2 is a schematic cross-sectional view showing another conventional OLED package structure
  • FIG. 3 is a flow chart of a method for packaging an OLED of the present invention.
  • FIG. 4 is a schematic top view of a package cover plate in a method for packaging an OLED according to the present invention
  • FIG. 5 is a schematic cross-sectional view of a package cover plate in a method for packaging an OLED according to the present invention
  • FIG. 6 is a schematic cross-sectional view showing a package structure of an OLED of the present invention.
  • the present invention provides a method for packaging an OLED, including the following steps:
  • Step 1 Providing the OLED substrate 1 and the package cover 4, and making alignment on the package cover 4 mark.
  • the alignment mark is used to ensure proper bonding of the OLED substrate 1 and the package cover 4 in the subsequent step.
  • the package cover 4 is a glass substrate or a metal plate.
  • the package cover 4 is a glass substrate.
  • the OLED substrate 1 is provided with a TFT array.
  • Step 2 Form a circle of patterned desiccant layer 3 on the package cover 4.
  • the desiccant layer 3 is formed on the inside of the glue coating position of the package cover 4 on which the sealant 5 is to be formed, so as to ensure that the water vapor invades the sealant 5 and is absorbed by the desiccant layer 3 at the first time, so that there is no chance or no water vapor.
  • the propagation path reaches the surface of the OLED device 2, thereby ensuring that the OLED device 2 is absolutely safe for a relatively long period of time before the desiccant layer 3 is saturated with water; and, by blocking of the desiccant layer 3, oxygen is introduced into the sealed region of the OLED device. 2 The path of the surface is blocked, which effectively reduces the damage of oxygen to the OLED device 2.
  • the existing desiccant sheet is directly cut into a desired pattern, and is adhered to the inner side of the coating position on the package cover 4; the drying
  • the agent layer 3 has a width of 100 um to 2000 um and a height of 1 um to 100 um.
  • the desiccant may first be formulated into a solution, and the desiccant solution may be applied to the coating position on the package cover 4 by dispensing or screen printing. Inside, the package cover 4 is placed in a high temperature furnace, baked at 120 ° C ⁇ 350 ° C for several hours, the solvent in the desiccant solution is removed, the desiccant is solidified to form a desiccant layer 3; the desiccant layer 3 has a width of 100 um to 2000 um and a height of 1 um to 100 um.
  • the desiccant layer 3 may also be a molecular sieve membrane, which is a crystalline silicate or aluminosilicate.
  • the 4A molecular sieve is first ground into a powder, the powder has a particle size of 1 um to 100 um, and is added with water to form a paste, and then screen printing is performed.
  • the molecular sieve paste is coated on the inner side of the coating position on the package cover 4, and then the package cover 4 is placed in a high temperature furnace and baked at 120 ° C to 350 ° C for several hours to remove water.
  • a molecular sieve film the molecular sieve film has a width of 100 um to 2000 um and a height of 1 um to 100 um.
  • Step 3 Apply a ring of sealant 5 on the outside of the desiccant layer 3 on the package cover 4.
  • the sealant 5 is applied to the glue coating position of the package cover 4 on which the sealant 5 is to be formed, and the sealant 5 is in close contact with the desiccant layer 3.
  • the sealant 5 is a UV glue; the height of the sealant 5 is the same as the height of the desiccant layer 3 to ensure that the contact position of the desiccant layer 3 with the package cover 4 and the OLED substrate 1 is free of voids, further ensuring the OLED device. 2 is not destroyed by water or oxygen.
  • the sealant 5 is applied to the glue application position for bonding the package cover 4 to the OLED substrate 1.
  • Step 4 The package cover 4 is attached to the OLED substrate 1 .
  • the package cover 4 and the OLED substrate 1 are attached to each other with reference to the alignment mark (not shown) produced in the step 1.
  • Step 5 illuminating or heating the sealant 5 with a UV light source to cure, thereby encapsulating the OLED substrate 1 by the package cover 4.
  • the OLED packaging method and structure provided by the present invention can realize the unobstructed by patterning the desiccant layer and exposing the light-emitting region, so that the light emitted by the OLED can be emitted from the package cover or from the OLED.
  • the substrate is ejected.
  • the packaging method is applicable to both the package of the upper light emitting device structure and the package of the lower light emitting device structure; and the contact position of the desiccant layer with the package cover plate and the OLED substrate has no gap, and the water vapor is dried for the first time after invading the frame glue.
  • the absorption of the agent the vapor has no chance and no propagation path to the surface of the OLED device, thus ensuring that the OLED device is absolutely safe for a relatively long period of time before the desiccant is saturated with water.
  • the path of oxygen entering the surface of the OLED device in the sealing region is blocked, which greatly reduces the damage of oxygen to the OLED device.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
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Abstract

一种OLED的封装方法及结构，该方法包括如下步骤：步骤1、提供OLED基板（1）与封装盖板（4），并在封装盖板（4）上制作对位标记；步骤2、在封装盖板（4）上形成一圈图案化的干燥剂层（3）；步骤3、在封装盖板（4）上干燥剂层（3）外侧涂覆一圈框胶（5）；步骤４、将封装盖板（4）与OLED基板（1）相对贴合；步骤5、使用UV光源照射或者加热框胶（5）使其固化，从而实现封装盖板（4）对OLED基板（1）的封装。

Description

OLED的封装方法及结构 技术领域
本发明涉及显示技术领域，尤其涉及一种OLED的封装方法及结构。
背景技术
在显示技术领域，平板显示技术(LCD、OLED)已经逐步取代CRT显示器。平面光源技术是新型的光源，其技术研发已经接近市场化量产水平。在平板显示与平面光源技术当中，对于两片平板玻璃的粘结是一项很重要的技术，其封装效果将直接影响器件的性能。
紫外光(UV)固化技术是LCD/OLED封装最早也是最常用的技术，其具有如下特点：不用溶剂或少量溶剂，减少了溶剂对环境的污染；耗能少，可低温固化，适用于对热敏感的材料；固化速度快，效率高，可在高速生产线上使用，固化设备占地面积小等。但是，由于UV胶是有机材料，其固化后分子间隙较大，水汽与氧气比较容易透过介质抵达内部密封区域。所以，其比较适合用于对水汽、氧气不太敏感的应用领域，比如LCD。由于OLED器件对水汽、氧气非常敏感，所以采用UV封装时，器件内部通常会有干燥剂，以减小透过介质抵达内部密封区域的水汽，从而延长OLED器件的使用寿命。
图1所示为一种常用的OLED封装方法，即在封装盖板400上预先挖凹槽，然后把干燥剂300设于封装盖板400上的凹槽内，再涂覆框胶500，最后将封装盖板400与OLED基板100相对贴合封装在一起。图2所示为另一种常用的OLED封装方法，即直接在封装盖板400′上涂覆一层干燥剂300′并烘干，再涂覆框胶500′，最后将封装盖板400′与OLED基板100′相对贴合封装在一起。但是这两种方式都不适合上发光方式(既是光线无法从封装盖板方向出射)，因为干燥剂吸水后透光性会变差。另外，水汽从框胶进入后会在密封区域内到处移动，既可能被干燥剂吸收，也可能吸附在OLED器件表面，这样的话，水汽从进入密封区域的第一时间就可能会对OLED器件造成破坏。
发明内容
本发明的目的在于提供一种OLED的封装方法，通过该方法能够改善封装效果，提高阻挡水汽、氧气的能力，延长OLED器件的使用寿命，并 且该方法适用于下发光器件结构、上发光器件结构、平面光源及其他需要干燥的器件的封装。
本发明的另一目的在于提供一种OLED的封装结构，其封装效果好，阻挡水汽、氧气的能力强、使用寿命长。
为实现上述目的，本发明提供一种OLED的封装方法，包括如下步骤：
步骤1、提供OLED基板与封装盖板，并在封装盖板上制作对位标记；
步骤2、在封装盖板上形成一圈图案化的干燥剂层；
步骤3、在封装盖板上所述干燥剂层外侧涂覆一圈框胶；
步骤4、将封装盖板与OLED基板相对贴合；
步骤5、使用UV光源照射或者加热框胶使其固化，从而实现封装盖板对OLED基板的封装。
所述封装盖板为玻璃基板或金属板；所述OLED基板设有TFT阵列。
所述步骤2中于封装盖板上欲形成框胶的涂胶位置内侧形成所述干燥剂层，步骤3中于封装盖板上欲形成框胶的涂胶位置涂覆所述框胶，所述框胶紧贴所述干燥剂层。
步骤2中形成所述图案化的干燥剂层的方法是直接将干燥剂薄片裁切成需要的图形，并紧贴封装盖板上所述涂胶位置的内侧贴敷；所述干燥剂层的宽度为100um～2000um，高度为1um～100um。
步骤2中形成所述图案化的干燥剂层的方法是首先将干燥剂配成溶液，并采用点胶或丝网印刷将所述干燥剂溶液涂覆在封装盖板上所述涂胶位置的内侧，然后将封装盖板放入高温炉中，在120℃～350℃下烘烤数小时，去除干燥剂溶液中的溶剂，使干燥剂固化形成干燥剂层；所述干燥剂层的宽度为100um～2000um，高度为1um～100um。
所述分子筛为结晶态的硅酸盐或硅铝酸盐。
步骤2中形成所述图案化的干燥剂层的方法是首先将4A分子筛研磨成粉末，所述粉末粒径为1um～100um，并加入水配成膏状物，再采用丝网印刷将分子筛膏状物涂覆在封装盖板上所述涂胶位置的内侧，然后将封装盖板放入高温炉中，在120℃～350℃下烘烤数小时，去除水，形成分子筛薄膜；所述分子筛薄膜的宽度为100um～2000um，高度为1um～100um。
步骤3中所述框胶为UV胶；所述框胶的高度与干燥剂层的高度相同。
本发明还提供一种OLED的封装结构，包括OLED基板、设于OLED基板上的封装盖板、设于OLED基板与封装盖板之间的框胶、及设于OLED基板与封装盖板之间且位于框胶内侧的干燥剂层。
所述封装盖板为玻璃基板或金属板，所述OLED基板设有TFT阵列， 所述框胶紧贴所述干燥剂层，所述干燥剂层的宽度为100um～2000um，高度为1um～100um，所述干燥剂层为分子筛薄膜，所述分子筛为结晶态的硅酸盐或硅铝酸盐；所述框胶为UV胶；所述框胶的高度与干燥剂层的高度相同。
本发明的有益效果：本发明提供的OLED的封装方法及结构，通过将干燥剂层图案化，把发光区域裸露出来实现无遮挡，使OLED发出的光线既可以从封装盖板射出，也可以从OLED基板射出。该封装方法既适用于上发光器件结构的封装，也适用于下发光器件结构的封装；并且干燥剂层与封装盖板及OLED基板的接触位置无空隙，水汽侵入框胶后第一时间被干燥剂吸收，水汽没有机会也没有传播路径到达OLED器件表面，从而保证OLED器件在干燥剂吸水饱和之前的相当长的时间内是绝对安全的。另外，由于干燥剂的阻挡，使氧气进入密封区域内OLED器件表面的路径阻断，极大降低了氧气对OLED器件的破坏。
为了能更进一步了解本发明的特征以及技术内容，请参阅以下有关本发明的详细说明与附图，然而附图仅提供参考与说明用，并非用来对本发明加以限制。
附图说明
下面结合附图，通过对本发明的具体实施方式详细描述，将使本发明的技术方案及其他有益效果显而易见。
附图中，
图1为一种现有的OLED封装结构的剖面示意图；
图2为另一种现有的OLED封装结构的剖面示意图；
图3为本发明OLED的封装方法的流程图；
图4为本发明OLED的封装方法中封装盖板的俯视示意图；
图5为本发明OLED的封装方法中封装盖板的剖面示意图；
图6为本发明OLED的封装结构的剖面示意图。
具体实施方式
为更进一步阐述本发明所采取的技术手段及其效果，以下结合本发明的优选实施例及其附图进行详细描述。
请参阅图3至图6，本发明提供一种OLED的封装方法，包括如下步骤：
步骤1、提供OLED基板1与封装盖板4，并在封装盖板4上制作对位 标记。
其中，所述对位标记用于保证后续步骤中OLED基板1与封装盖板4的正确贴合。所述封装盖板4为玻璃基板或金属板，优选的，所述封装盖板4为玻璃基板。所述OLED基板1设有TFT阵列。
步骤2、在封装盖板4上形成一圈图案化的干燥剂层3。
其中，于封装盖板4上欲形成框胶5的涂胶位置内侧形成所述干燥剂层3，以确保水汽侵入框胶5后第一时间被干燥剂层3吸收，使水汽没有机会也没有传播路径到达OLED器件2表面，从而保证OLED器件2在干燥剂层3吸水饱和之前的相当长的时间内是绝对安全的；并且，通过干燥剂层3的阻挡，将氧气进入密封区域内OLED器件2表面的路径阻断，有效降低氧气对OLED器件2的破坏。
具体地，设置所述图案化的干燥剂层3时直接将现有的干燥剂薄片裁切成需要的图形，并紧贴封装盖板4上所述涂胶位置的内侧贴敷；所述干燥剂层3的宽度为100um～2000um，高度为1um～100um。
设置所述图案化的干燥剂层3时也可以首先将干燥剂配成溶液，并采用点胶或丝网印刷等方式将所述干燥剂溶液涂覆在封装盖板4上所述涂胶位置的内侧，然后将封装盖板4放入高温炉中，在120℃～350℃下烘烤数小时，去除干燥剂溶液中的溶剂，使干燥剂固化形成干燥剂层3；所述干燥剂层3的宽度为100um～2000um，高度为1um～100um。
另外，所述干燥剂层3还可以是分子筛薄膜，所述分子筛为结晶态的硅酸盐或硅铝酸盐。
以分子筛薄膜作为干燥剂设置所述图案化的干燥剂层3时首先将4A分子筛研磨成粉末，所述粉末粒径为1um～100um，并加入水配成膏状物，再采用丝网印刷等方式将分子筛膏状物涂覆在封装盖板4上所述涂胶位置的内侧，然后将封装盖板4放入高温炉中，在120℃～350℃下烘烤数小时，去除水，形成分子筛薄膜；所述分子筛薄膜的宽度为100um～2000um，高度为1um～100um。
步骤3、在封装盖板4上所述干燥剂层3外侧涂覆一圈框胶5。
其中，于封装盖板4上欲形成框胶5的涂胶位置涂覆所述框胶5，所述框胶5紧贴所述干燥剂层3。所述框胶5为UV胶；所述框胶5的高度与干燥剂层3的高度相同，以确保干燥剂层3与封装盖板4及OLED基板1的接触位置无空隙，进一步确保OLED器件2不被水或氧气等破坏。所述框胶5涂覆于所述涂胶位置上，用于将封装盖板4与OLED基板1粘结在一起。
步骤4、将封装盖板4与OLED基板1相对贴合。
其中，将封装盖板4与OLED基板1参照步骤1中制作的对位标记(未示出)相对贴合。
步骤5、使用UV光源照射或者加热框胶5使其固化，从而实现封装盖板4对OLED基板1的封装。
综上所述，本发明提供的OLED的封装方法及结构，通过将干燥剂层图案化，把发光区域裸露出来实现无遮挡，使OLED发出的光线既可以从封装盖板射出，也可以从OLED基板射出。该封装方法既适用于上发光器件结构的封装，也适用于下发光器件结构的封装；并且干燥剂层与封装盖板及OLED基板的接触位置无空隙，水汽侵入框胶后第一时间被干燥剂吸收，水汽没有机会也没有传播路径到达OLED器件表面，从而保证OLED器件在干燥剂吸水饱和之前的相当长的时间内是绝对安全的。另外，由于干燥剂的阻挡，使氧气进入密封区域内OLED器件表面的路径阻断，极大降低了氧气对OLED器件的破坏。
以上所述，对于本领域的普通技术人员来说，可以根据本发明的技术方案和技术构思作出其他各种相应的改变和变形，而所有这些改变和变形都应属于本发明后附的权利要求的保护范围。

Claims (11)

  1. 一种OLED的封装方法，包括如下步骤：
    步骤1、提供OLED基板与封装盖板，并在封装盖板上制作对位标记；
    步骤2、在封装盖板上形成一圈图案化的干燥剂层；
    步骤3、在封装盖板上所述干燥剂层外侧涂覆一圈框胶；
    步骤4、将封装盖板与OLED基板相对贴合；
    步骤5、使用UV光源照射或者加热框胶使其固化，从而实现封装盖板对OLED基板的封装。
  2. 如权利要求1所述的OLED的封装方法，其中，所述封装盖板为玻璃基板或金属板；所述OLED基板设有TFT阵列。
  3. 如权利要求1所述的OLED的封装方法，其中，所述步骤2中于封装盖板上欲形成框胶的涂胶位置内侧形成所述干燥剂层，步骤3中于封装盖板上欲形成框胶的涂胶位置涂覆所述框胶，所述框胶紧贴所述干燥剂层。
  4. 如权利要求3所述的OLED的封装方法，其中，步骤2中形成所述图案化的干燥剂层的方法是直接将干燥剂薄片裁切成需要的图形，并紧贴封装盖板上所述涂胶位置的内侧贴敷；所述干燥剂层的宽度为100um～2000um，高度为1um～100um。
  5. 如权利要求3所述的OLED的封装方法，其中，步骤2中形成所述图案化的干燥剂层的方法是首先将干燥剂配成溶液，并采用点胶或丝网印刷将所述干燥剂溶液涂覆在封装盖板上所述涂胶位置的内侧，然后将封装盖板放入高温炉中，在120℃～350℃下烘烤数小时，去除干燥剂溶液中的溶剂，使干燥剂固化形成干燥剂层；所述干燥剂层的宽度为100um～2000um，高度为1um～100um。
  6. 如权利要求3所述的OLED的封装方法，其中，步骤2中所述干燥剂层为分子筛薄膜，所述分子筛为结晶态的硅酸盐或硅铝酸盐。
  7. 如权利要求6所述的OLED的封装方法，其中，步骤2中形成所述图案化的干燥剂层的方法是首先将4A分子筛研磨成粉末，所述粉末粒径为1um～100um，并加入水配成膏状物，再采用丝网印刷将分子筛膏状物涂覆在封装盖板上所述涂胶位置的内侧，然后将封装盖板放入高温炉中，在120℃～350℃下烘烤数小时，去除水，形成分子筛薄膜；所述分子筛薄膜的宽度为100um～2000um，高度为1um～100um。
  8. 如权利要求1所述的OLED的封装方法，其中，步骤3中所述框胶(5)为UV胶；所述框胶的高度与干燥剂层的高度相同。
  9. 一种OLED的封装方法，包括如下步骤：
    步骤1、提供OLED基板与封装盖板，并在封装盖板上制作对位标记；
    步骤2、在封装盖板上形成一圈图案化的干燥剂层；
    步骤3、在封装盖板上所述干燥剂层外侧涂覆一圈框胶；
    步骤4、将封装盖板与OLED基板相对贴合；
    步骤5、使用UV光源照射或者加热框胶使其固化，从而实现封装盖板对OLED基板的封装；
    其中，所述封装盖板为玻璃基板或金属板；所述OLED基板设有TFT阵列；
    其中，所述步骤2中于封装盖板上欲形成框胶的涂胶位置内侧形成所述干燥剂层，步骤3中于封装盖板上欲形成框胶的涂胶位置涂覆所述框胶，所述框胶紧贴所述干燥剂层；
    其中，步骤2中形成所述图案化的干燥剂层的方法是直接将干燥剂薄片裁切成需要的图形，并紧贴封装盖板上所述涂胶位置的内侧贴敷；所述干燥剂层的宽度为100um～2000um，高度为1um～100um；
    其中，步骤3中所述框胶为UV胶；所述框胶的高度与干燥剂层的高度相同。
  10. 一种OLED的封装结构，包括OLED基板、设于OLED基板上的封装盖板、设于OLED基板与封装盖板之间的框胶、及设于OLED基板与封装盖板之间且位于框胶内侧的干燥剂层。
  11. 如权利要求10所述的OLED的封装结构，其中，所述封装盖板为玻璃基板或金属板，所述OLED基板设有TFT阵列，所述框胶紧贴所述干燥剂层，所述干燥剂层的宽度为100um～2000um，高度为1um～100um，所述干燥剂层为分子筛薄膜，所述分子筛为结晶态的硅酸盐或硅铝酸盐；所述框胶为UV胶；所述框胶的高度与干燥剂层的高度相同。
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