WO2017154085A1 - 搬送用パッドおよびそれを用いる搬送装置、搬送方法 - Google Patents
搬送用パッドおよびそれを用いる搬送装置、搬送方法 Download PDFInfo
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- WO2017154085A1 WO2017154085A1 PCT/JP2016/057065 JP2016057065W WO2017154085A1 WO 2017154085 A1 WO2017154085 A1 WO 2017154085A1 JP 2016057065 W JP2016057065 W JP 2016057065W WO 2017154085 A1 WO2017154085 A1 WO 2017154085A1
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- transport
- porous substrate
- pad
- conveyance
- transport pad
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/07—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers Not used, see H01L21/677
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
- B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
- B25B11/005—Vacuum work holders
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
- B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
- B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H20/00—Advancing webs
- B65H20/12—Advancing webs by suction roller
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
- B65G2201/02—Articles
- B65G2201/0214—Articles of special size, shape or weigh
- B65G2201/022—Flat
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2207/00—Indexing codes relating to constructional details, configuration and additional features of a handling device, e.g. Conveyors
- B65G2207/10—Antistatic features
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
- B65G2249/04—Arrangements of vacuum systems or suction cups
- B65G2249/045—Details of suction cups suction cups
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2406/00—Means using fluid
- B65H2406/30—Suction means
- B65H2406/33—Rotary suction means, e.g. roller, cylinder or drum
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2701/00—Handled material; Storage means
- B65H2701/10—Handled articles or webs
- B65H2701/17—Nature of material
- B65H2701/175—Plastic
- B65H2701/1752—Polymer film
Definitions
- the present invention relates to a transport pad that adsorbs and fixes a transported object such as a wafer or a polymer film, or floats it in a non-contact manner, and a transport device and a transport method using the pad. Specifically, by pressing the back side of the transfer pad with a vacuum pump or pressurizing with a compressor, even if a part of the transfer surface is not covered with the transfer object, it is porous through many pores.
- the present invention relates to a transport pad that can adsorb and fix a transported object placed on the surface of a substrate, or can be lifted and transported in a non-contact manner, and a transport apparatus and a transport method using the pad. Furthermore, the present invention relates to a method for preventing static electricity (peeling charge) generated at the time of having a mechanism for operating a compressor to float when a transported object transported by suction is pulled away from a suction pad.
- peeling charge static electricity
- the back side is depressurized by a vacuum pump with respect to the surface of the transfer pad that adsorbs and fixes the transfer object such as a wafer or polymer film, and the transfer object to be worked is sucked through the pores communicating with the front and back surfaces.
- a vacuum pump In the vacuum chuck to be held, it is necessary to keep the internal pressure on the back side close to the vacuum with respect to the atmospheric pressure on the front side.
- the conveyed object does not cover the entire surface, which is the conveying surface, a part of the pores open to the surface, the outside air flows in through the pores, and the differential pressure between the front side and the back side is sufficient. Since it cannot be taken, a predetermined suction force cannot be obtained.
- the internal pressure is kept constant by focusing on reducing the conductance of the vacuum chuck by simply reducing the number of pores to a small diameter. It cannot be obtained simply by reducing the conductance. That is, the conveyed product is a porous substrate in the vertical direction of the bottom surface that covers the opening of the pores, by the differential pressure between the atmospheric pressure that works downward (from the surface to the back) and the internal pressure that works upward (from the back to the surface). The adsorption force is obtained by multiplying the total area of the pore openings covered by the conveyed product by the differential pressure.
- the present invention has been made in view of such conventional problems, and reliably attracts the object to be placed on a part of the conveyance surface by the adsorption force or floating force of the conveyance pad.
- a transport pad that can be fixed or levitated for non-contact transport, a transport device using the transport pad, and a transport method, and to solve problems caused by electrostatic charging when transporting the transported object by suction To do.
- the transport pad of the present invention is a transport pad that adsorbs and fixes a transported object, or floats and non-contact transports, It consists of a porous substrate that communicates with many pores, By depressurizing or pressurizing the back side of the porous substrate, the conveyed object placed on the surface side of the porous substrate is adsorbed or floated,
- the relationship between the area ratio ⁇ of the conveyed product covering the surface of the porous substrate and the conductance ratio ⁇ satisfies the following expression (a).
- the relationship between the area ratio ⁇ of the transported material covering the surface of the porous substrate that is the transport pad and the conductance ratio ⁇ satisfies the formula (a), so that the suction force of the transport pad or Due to the levitation force, the object to be placed on a part of the conveying surface can be reliably adsorbed and fixed, or can be levitated and conveyed in a non-contact manner.
- 1- ⁇ represents the degree of opening on the surface of the transport pad, and the smaller the 1- ⁇ is, the greater the adsorption force or the floating force.
- ⁇ represents conductance, which is an index of the ease of air flow in the transport pad having pores. In general ceramics, the smaller the ⁇ is, the larger the adsorption force or levitation force is. However, when ⁇ is zero, neither adsorption nor levitation is possible, and an optimum value exists in the vicinity thereof.
- the suction force or floating of the conveying pad With the force, the transported object placed on a part of the transport surface can be reliably adsorbed and fixed, or can be lifted and transported in a non-contact manner.
- the said structure of this invention WHEREIN: It is preferable that the shape of the said pad for conveyance is flat form, cylindrical shape, or U shape. If the shape of the transfer pad is a flat plate, the transfer object is suitable for a transfer object having a thickness like a wafer. If the transfer pad is cylindrical or U-shaped, the transfer object is a roll like a polymer film. Suitable for objects wound in a shape.
- the porosity ⁇ is 20 to 60%
- the pore diameter d is 0.5 to 10 ⁇ m
- the thickness t of the porous substrate is 2 to 20 mm.
- the transfer pad of the present invention can be made into a porous substrate having a porosity ⁇ : 20 to 60% by ceramic sintering. If the porosity is less than 20%, part of the pores are blocked and the front and back surfaces are in communication. A portion that does not occur is generated, so a stable adsorption force or levitation force cannot be obtained. On the other hand, if the porosity exceeds 60%, voids increase, the strength deteriorates, and there is a risk of breakage.
- the conductance ratio ⁇ is proportional to the square of the pore diameter d. Therefore, by setting the pore diameter d to a minute diameter of 0.5 to 10 ⁇ m, the conductance ratio ⁇ of the transport pad can be efficiently set to the optimum value.
- the conductance ratio ⁇ is inversely proportional to the thickness t of the porous substrate. Therefore, the conductance ratio ⁇ of the transport pad can be reduced by setting the thickness t of the porous substrate to 2 to 20 mm.
- the said structure of this invention WHEREIN:
- the said side surface sealing does not need to be carried out for the said pad for conveyance.
- the conventional transfer pad has been required to have side sealing.
- the transfer pad according to the present invention satisfies the formula (a), so that the conductance ratio ⁇ of the transfer pad is small and the resistance to air flow is low. Because it is large, it is possible to reliably attract and fix the transported object placed on a part of the transport surface, or lift it and contact it without contact without sealing the side surface of the pad. . As a result, cost reduction and process omission are possible.
- the porous substrate may include metal or ceramics, and the volume resistivity may be 10 10 ⁇ ⁇ m or less.
- the transported object is separated from the transport pad by adsorbing and transporting the transported object using a transport pad containing metal or ceramics and having a volume resistivity of 10 10 ⁇ ⁇ m or less, It can be pulled away while floating.
- the conveyance object placed on a part of the conveyance surface can be reliably adsorbed and fixed by the adsorption force or floating force of the conveyance pad, or can be lifted and contactlessly conveyed. Furthermore, when transporting using the suction force, when the transported object is pulled away from the transport pad, the transported object can be lifted and the electrostatic charge phenomenon can be prevented from occurring, and the transported object can be safely separated.
- DELTA differential pressure
- the transport apparatus 1 includes a transport pad 2 that adsorbs and holds a transported object W on the surface thereof, and a transport apparatus that forms a decompression chamber or a pressurization chamber 3 on the back side of the transport pad 2.
- a main body 4 and a flow meter 6 for detecting a flow rate per unit time of a vacuum pump or a compressor 5 exhausting or supplying air from the decompression chamber or pressurization chamber 3 are provided.
- the atmospheric pressure P1 and the internal pressure P2 are vertically measured at the opening of the pores covered by the transported object W.
- the conveyed product W receives an adsorption force or a floating force F obtained by multiplying the sum of the opening areas of all pores covered by the conveyed product W by the differential pressure ⁇ P.
- the transfer pad 2 is formed of, for example, a square porous ceramic substrate having a side of 60 cm.
- pores having a diameter of 0.5 to 10 ⁇ m are formed in close contact with each other, and a porosity ⁇ is 20 to The transfer pad 2 is 60%.
- the porosity ⁇ means that pores communicating with the back side are formed with equal density on the plane of the transport pad 2 and the pores that open within a unit area with respect to the unit area of the surface of the transport pad 2 The ratio of the total opening area.
- a porous ceramic substrate can be formed with a diameter in the range of 0.5 to 10 ⁇ m and a porosity ⁇ in the range of 20 to 60%.
- the transport pad 2 having the area ratio ⁇ and the conductance ratio ⁇ covering the surface of the porous substrate satisfying the formula (a) is selected, the transport pad 2 can be used regardless of the size of the transport object W. Even if the side surface is not sealed, the transport pad 1 having a suction force or a floating force equal to or higher than the gravity of the transported object can be reliably obtained.
- FIG. 2 is a view showing a transfer pad according to the second embodiment of the present invention.
- the conveyed product W is a polymer film
- the shape of the conveyance pad 2 is a cylindrical shape.
- a thin film is wound around the transport pad 2 and is adsorbed and fixed, rotated, lifted and released at an arbitrary angle, and transported. can do.
- FIG. 3 is a diagram showing the relationship between the conductance ratio ⁇ and the differential pressure ⁇ P between the front and back surfaces of the porous substrate in the present invention. As shown in FIG. 3, the area ratio ⁇ of the conveyed product covering the surface of the porous substrate increases, and the differential pressure ⁇ P increases as the conductance ratio ⁇ decreases.
- FIG. 4 is a diagram showing the relationship between the area ratio ⁇ of the conveyed product and the conductance ratio ⁇ when ⁇ P is 0.3 atm in the present invention. As shown in FIG. 4, the conductance ratio ⁇ increases as the area ratio ⁇ of the conveyed product covering the surface of the porous substrate increases.
- FIG. 5 is a diagram showing the relationship between the area ratio ⁇ of the conveyed product and the conductance ratio ⁇ when ⁇ P is 0.1 to 0.5 atm in the present invention. As shown in FIG. 5, when the area ratio ⁇ of the conveyed product covering the surface of the porous substrate increases, the conductance ratio ⁇ increases as ⁇ P decreases.
- FIG. 6 is a diagram showing the relationship between the area ratio ⁇ of the conveyed product and the differential pressure ⁇ P between the front and back surfaces of the conveyance pad when the conductance ratio ⁇ is 1 to 50 in the present invention. As shown in FIG. 6, the area ratio ⁇ of the conveyed product covering the surface of the porous substrate increases, and the differential pressure ⁇ P increases as the conductance ratio ⁇ decreases.
- Table 1 shows the results of the transport pad 2 of the present invention shown in FIG.
- Pad shape flat plate and cylindrical area ratio ⁇ : 0.0 to 0.656
- Constant k 0.1491 to 44.48
- Pore diameter d 0.5 to 50 ( ⁇ m)
- Porosity ⁇ 25 to 60
- Thickness t of porous substrate 2 to 10 (mm)
- Pressure converted value PW of transported material 0.1 (atm)
- Material of porous substrate Alumina / silica ceramic Volume resistivity of porous substrate: 10 3 to 10 7 ( ⁇ ⁇ m)
- the conveyance pad 2 having the area ratio ⁇ and the conductance ratio ⁇ covering the surface of the porous substrate that satisfies the formula (a) of the present invention, the conveyance is reliably performed regardless of the size of the conveyance object W. It was possible to obtain a transfer apparatus 1 having an adsorption force or levitation force equal to or higher than the gravity of an object. Further, when the transported object is pulled away from the transport pad, the transported object can be lifted off and the electrostatic charging phenomenon can be prevented. From the above, the effect of the present invention was confirmed.
- the present invention is suitable for holding workpieces of various sizes without changing the transport pad in a manufacturing apparatus such as a semiconductor, a liquid crystal, a printed wiring board or the like, or a work process of a printing machine. Further, in the removal process of the conveyed product, it is possible to prevent the electrostatic charging phenomenon and to remove it safely.
Abstract
Description
この従来の真空チャックによれば、一部の気孔が搬送物に覆われずに表面に開口しても、気孔を通して表面から背面側に流れる流量が制限され、表面側と背面側との差圧を一定に保つことができ、表面の一部に載置される搬送物であっても所定の吸着力で表面上に位置決め保持することができる。
また、このように、真空チャックは外圧と内圧の差によって搬送物を吸着するものであるが、発明者等は、外圧と内圧を逆転させることにより搬送物を浮上させることが可能になることに気が付いた。従来の搬送用パッドは吸着と浮上の両方を可能とするものはなかった。
さらに、真空チャックで搬送物を固定・離脱する際に発生する静電気を防止する必要がある。
多数の気孔によって連通する多孔性基板からなり、
前記多孔性基板の背面側を減圧もしくは加圧することにより、該多孔性基板の表面側に載置される搬送物を吸着もしくは浮上させ、
前記多孔性基板の表面を覆う搬送物の面積率αと、コンダクタンス比βとの関係が、下記(a)式を満足することを特徴とする。
(1-α)×β<[(|P1-P3|/PW)-1] ・・・(a)
ここに、
α=S1/S0
β=k×d2×η/t
k:定数
d:気孔径
η:気孔率
t:多孔性基板の厚み
S1:搬送物の面積(搬送物の多孔性基板への投影面積を云う、以下同じ。)
S0:多孔性基板の面積(多孔性基板の投影面積を云う、以下同じ。)
PW:搬送物の重量の圧力換算値
P1:外圧
P3:真空ポンプ圧もしくはコンプレッサー圧
また、(a)式において、βは気孔を有する搬送用パッドの空気の流れ易さの指標であるコンダクタンスを示し、通常のセラミックスの場合、一般論としてβが小さいほど吸着力もしくは浮上力が大きくなるが、βがゼロでは、吸着も浮上も不可能なので、その近傍に最適値が存在する。
前記搬送用パッドの形状が、平板状であれば搬送物がウェハのように厚みのある搬送物に適しており、また、円筒状もしくはU字状であれば搬送物がポリマーフィルムのようにロール状に巻かれている物に適している。
本発明の搬送用パッドは、セラミック焼結により気孔率η:20~60%の多孔性基板とすることができ、気孔率が20%未満では、気孔の一部が閉塞し、表裏面が連通しない部分が生じるため、安定した吸着力もしくは浮上力が得られない。また、気孔率が60%を超えると、空隙が増加して強度が劣化し、破損のおそれがある。
従来の搬送用パッドは、側面封止が必須であったが、本発明の搬送用パッドは、(a)式を満足することにより、搬送用パッドのコンダクタンス比βが小さく空気の流れの抵抗が大きいため、パッドの側面を密封する側面封止をしなくても、搬送面の一部に載置される搬送物を確実に吸着して固定させ、もしくは浮上させて非接触搬送することができる。その結果、コストダウンおよび工程省略が可能である。
金属またはセラミックスを含み、体積抵抗率が10の10乗Ω・m以下である搬送用パッドを使用して搬送物を吸着し搬送することにより、搬送物を搬送用パッドから引き離すとき、搬送物を浮上させつつ引き離すことができる。
さらに、吸着力を利用し搬送する時、搬送物を搬送用パッドから引き離す時に、搬送物を浮上させつつ静電気帯電現象発生を防止して安全に搬送物を引き離すことができる。
Q=C1×(P1-P2)=C2×(P2-P3)・・・(b)
ここに、
Q:流量
C1:P1-P2間のコンダクタンス
C2:P2-P3間のコンダクタンス
P1:外圧
P2:内圧
P3:真空ポンプ圧もしくはコンプレッサー圧
ΔP=(P1-P2)=(P1-P3)/(1+C1/C2)・・・(c)
上記(c)式におけるC1が、多孔性基板の表面を覆う搬送物の面積率αを除いた部分のコンダクタンスγ×(1-α)に相当するので、これに置き代えると下記(d)式となる。ここで、γ/C2=β(コンダクタンス比)とする。
ここに、
β=k×d2×η/t
k:定数
d:気孔直径
η:気孔率
t:多孔性基板の厚み
ここで、搬送物を逆さにしても落下しないように吸着し、もしくは逆さでない場合に浮上させることから、差圧ΔPが搬送物の重量の圧力換算値PWより大きいことが必要である。
ここに、
PW=(W/S1)
PW:搬送物の重量の圧力換算値
W:搬送物の重量
S1:搬送物の面積
ΔP=(P1-P3)/[1+β(1-α)]>PW・・・(f)(吸着の場合)
ΔP=(P3-P1)/[1+β(1-α)]>PW・・・(g)(浮上の場合)
β×(1-α)<[((P1-P3)/PW)-1]・・・(h)
β×(1-α)<[((P3-P1)/PW)-1]・・・(i)
これより本発明の条件である(a)を得る。
β×(1-α)<[(|P1-P3|/PW)-1]・・・(a)
この実施形態では、搬送物Wをポリマーフィルムとし、搬送用パッド2の形状は円筒形である。
図2に示すように、搬送用パッド2の形状を円筒形にすることにより、薄いフィルムを搬送用パッド2に巻きつけて吸着させて固定、回転させ、任意の角度の位置で浮上解放させ搬送することができる。
図3に示すように、多孔性基板の表面を覆う搬送物の面積率αが大きくなり、コンダクタンス比βが小さくなるほど差圧ΔPが大きくなる。
図4に示すように、多孔性基板の表面を覆う搬送物の面積率αが大きくなるほどコンダクタンス比βが大きくなる。
図5に示すように、多孔性基板の表面を覆う搬送物の面積率αが大きくなる時、ΔPが小さくなるほどコンダクタンス比βが大きくなる。
図6に示すように、多孔性基板の表面を覆う搬送物の面積率αが大きくなり、コンダクタンス比βが小さくなるほど差圧ΔPが大きくなる。
<実施条件>
パッド形状:平板状および円筒状
面積率α:0.0~0.656(-)
コンダクタンス比β:0.83~16680(-)
定数k: 0.1491~44.48
気孔直径d:0.5~50(μm)
気孔率η: 25~60(-)
多孔性基板の厚みt:2~10(mm)
搬送物の面積S1:S0×α(mm2)
多孔性基板の面積S0:400(20mm×20mm)(mm2)
搬送物の重量の圧力換算値PW:0.1(atm)
多孔性基板の材質:アルミナ・シリカ系セラミックス
多孔性基板の体積抵抗率:103~107(Ω・m)
また、搬送物を搬送用パッドから引き離すとき、搬送物を浮上させつつ引き離すことができ、静電気帯電現象を防止することができた。
以上により、本発明の効果が確認された。
W 搬送物の重量
PW 搬送物の重量の圧力換算値
α 面積率
β コンダクタンス比
P1 外圧
P2 内圧
P3 真空ポンプ圧もしくはコンプレッサー圧
Claims (8)
- 搬送物を吸着して固定させ、もしくは浮上させて非接触搬送する搬送用パッドであって、
多数の気孔によって連通する多孔性基板からなり、
前記多孔性基板の背面側を減圧もしくは加圧することにより、該多孔性基板の表面側に載置される搬送物を吸着もしくは浮上させ、
前記多孔性基板の表面を覆う搬送物の面積率αと、コンダクタンス比βとの関係が、下記(a)式を満足することを特徴とする搬送用パッド。
(1-α)×β<[(|P1-P3|/PW)-1]・・・(a)
ここに、
α=S1/S0
β=k×d2×η/t
k:定数
d:気孔径
η:気孔率
t:多孔性基板の厚み
S1:搬送物の面積
S0:多孔性基板の面積
P1:外圧
P3:真空ポンプ圧もしくはコンプレッサー圧
PW:搬送物の重量の圧力換算値 - 前記多孔性基板の形状が、平板状、円筒状もしくはU字状であることを特徴とする請求項1に記載の搬送用パッド。
- 前記気孔率η:20~60%、気孔径d:0.5~10μm、多孔性基板の厚みt:2~20mmであることを特徴とする請求項1または2に記載の搬送用パッド。
- 前記搬送用パッドは側面封止がされていないことを特徴とする請求項1から3のいずれか1項に記載の搬送用パッド。
- 前記多孔性基板は金属またはセラミックスを含み、体積抵抗率が10の10乗Ω・m以下であることを特徴とする請求項1から4のいずれか1項に記載の搬送用パッド。
- 請求項1から5のいずれか1項に記載の搬送用パッドを有することを特徴とする搬送装置。
- 請求項5に記載の搬送用パッドを使用して搬送物を吸着し搬送する搬送方法であって、搬送物を搬送用パッドから引き離すとき、搬送物を浮上させつつ引き離すことを特徴とする搬送方法。
- 請求項5に記載の搬送用パッドを使用する搬送方法であって、搬送物を搬送用パッドから引き離すとき、静電気帯電現象を防止することを特徴とする搬送方法。
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