JP5143607B2 - 真空吸着装置 - Google Patents
真空吸着装置 Download PDFInfo
- Publication number
- JP5143607B2 JP5143607B2 JP2008088216A JP2008088216A JP5143607B2 JP 5143607 B2 JP5143607 B2 JP 5143607B2 JP 2008088216 A JP2008088216 A JP 2008088216A JP 2008088216 A JP2008088216 A JP 2008088216A JP 5143607 B2 JP5143607 B2 JP 5143607B2
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- JP
- Japan
- Prior art keywords
- vacuum suction
- porous body
- substrate
- adhesive
- suction device
- Prior art date
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- 238000001179 sorption measurement Methods 0.000 title description 15
- 239000000758 substrate Substances 0.000 claims description 39
- 239000002245 particle Substances 0.000 claims description 31
- 239000000853 adhesive Substances 0.000 claims description 24
- 230000001070 adhesive effect Effects 0.000 claims description 23
- 239000000919 ceramic Substances 0.000 claims description 22
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 22
- 239000011148 porous material Substances 0.000 claims description 21
- 239000011231 conductive filler Substances 0.000 claims description 20
- 229910052751 metal Inorganic materials 0.000 claims description 18
- 239000002184 metal Substances 0.000 claims description 18
- 239000010703 silicon Substances 0.000 claims description 17
- 229910052710 silicon Inorganic materials 0.000 claims description 17
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 15
- 239000012790 adhesive layer Substances 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 12
- 239000011230 binding agent Substances 0.000 claims description 7
- 239000011156 metal matrix composite Substances 0.000 claims description 7
- 239000010410 layer Substances 0.000 claims description 6
- 229910052799 carbon Inorganic materials 0.000 claims description 5
- 229910052737 gold Inorganic materials 0.000 claims description 5
- 229910052709 silver Inorganic materials 0.000 claims description 5
- 229910052763 palladium Inorganic materials 0.000 claims description 4
- 229910052697 platinum Inorganic materials 0.000 claims description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 20
- 238000004519 manufacturing process Methods 0.000 description 15
- 238000000034 method Methods 0.000 description 9
- 239000000843 powder Substances 0.000 description 8
- 230000005611 electricity Effects 0.000 description 6
- 239000005011 phenolic resin Substances 0.000 description 6
- 230000003068 static effect Effects 0.000 description 6
- 239000003822 epoxy resin Substances 0.000 description 5
- 239000000945 filler Substances 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 229920000647 polyepoxide Polymers 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 230000001681 protective effect Effects 0.000 description 4
- 238000011109 contamination Methods 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 239000012779 reinforcing material Substances 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011863 silicon-based powder Substances 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 229910017052 cobalt Inorganic materials 0.000 description 2
- 239000010941 cobalt Substances 0.000 description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000003795 desorption Methods 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 230000003204 osmotic effect Effects 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 238000002336 sorption--desorption measurement Methods 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 229910052720 vanadium Inorganic materials 0.000 description 2
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910000676 Si alloy Inorganic materials 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000000274 adsorptive effect Effects 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 238000007580 dry-mixing Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000004952 furnace firing Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910000856 hastalloy Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 239000011812 mixed powder Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
Images
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
11:載置部
11a:載置面
12、22:支持部
13:把手
14:接着層
15、25:吸引孔
Claims (5)
- 基板を載置する載置面を有する、炭化珪素粒子と金属シリコンとからなる導電性のセラミックス多孔質体からなる載置部と、
セラミックスを強化材とした金属基複合材料または炭化珪素からなり、前記載置部を取り囲む略凹型の支持部と、
前記載置部と前記支持部とを接着する接着層と、
を備える基板搬送用の真空吸着装置であって、
前記接着層は、バインダーと導電性フィラーとを含む接着剤からなり、
前記接着剤の前記導電性フィラーの含有量は50〜80質量%であり、
前記導電性フィラーの平均粒径は、前記セラミックス多孔質体の平均気孔径の1/2よりも小さいことを特徴とする真空吸着装置。 - 前記セラミックス多孔質体の平均気孔径は、3〜40μmである請求項1記載の真空吸着装置。
- 前記導電性フィラーは、Ag、Pd、Pt、Au及びCから選ばれる1以上である請求項1又は2記載の真空吸着装置。
- 前記接着層の厚さは、10〜300μmであって、前記接着剤が前記セラミックス多孔質体に浸透した浸透層の厚さは、10〜300μmである請求項1〜3のいずれか一項に記載の真空吸着装置。
- 前記載置部の厚さは2mm以下であって、前記載置部を含めた真空吸着装置の全厚さが5mm以下である請求項1〜4のいずれか一項に記載の真空吸着装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008088216A JP5143607B2 (ja) | 2008-03-28 | 2008-03-28 | 真空吸着装置 |
Applications Claiming Priority (1)
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---|---|---|---|
JP2008088216A JP5143607B2 (ja) | 2008-03-28 | 2008-03-28 | 真空吸着装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009246010A JP2009246010A (ja) | 2009-10-22 |
JP5143607B2 true JP5143607B2 (ja) | 2013-02-13 |
Family
ID=41307608
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008088216A Active JP5143607B2 (ja) | 2008-03-28 | 2008-03-28 | 真空吸着装置 |
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JP (1) | JP5143607B2 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5527602B2 (ja) * | 2010-06-11 | 2014-06-18 | 新東工業株式会社 | 吸着部材及びその製造方法 |
JP2016103626A (ja) * | 2014-11-13 | 2016-06-02 | 株式会社ナノテム | 搬送用パッドおよびそれを用いる搬送装置、搬送方法 |
JPWO2017154085A1 (ja) * | 2016-03-08 | 2018-11-22 | 株式会社ナノテム | 搬送用パッドおよびそれを用いる搬送装置、搬送方法 |
KR102143180B1 (ko) * | 2019-05-21 | 2020-08-12 | 주식회사 빅스턴 | 척 테이블 및 그 제조 방법 |
CN111393180A (zh) * | 2020-03-31 | 2020-07-10 | 中国建筑材料科学研究总院有限公司 | 碳化硅陶瓷吸盘及其制备方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2507151B2 (ja) * | 1990-06-29 | 1996-06-12 | シャープ株式会社 | 導電性セラミックス焼結体及びその製造方法 |
JPH08340036A (ja) * | 1995-06-09 | 1996-12-24 | Tokyo Electron Ltd | 処理装置 |
JPH10107131A (ja) * | 1996-09-25 | 1998-04-24 | Teikoku Seiki Kk | 吸着テーブル及びそのエレメント |
JP4371979B2 (ja) * | 2003-10-10 | 2009-11-25 | ジャパンゴアテックス株式会社 | 電気二重層キャパシタ用電極、および電気二重層キャパシタ、並びに導電性接着剤 |
JP4476595B2 (ja) * | 2003-10-23 | 2010-06-09 | 太平洋セメント株式会社 | 真空吸着用治具 |
JP4872220B2 (ja) * | 2005-03-04 | 2012-02-08 | 住友金属鉱山株式会社 | 導電性接着剤 |
JP4868885B2 (ja) * | 2005-05-24 | 2012-02-01 | 京セラ株式会社 | 珪素−炭化珪素複合部材の製造方法 |
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2008
- 2008-03-28 JP JP2008088216A patent/JP5143607B2/ja active Active
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