WO2017152879A1 - 发光二极管模组及其制作方法和灯具 - Google Patents

发光二极管模组及其制作方法和灯具 Download PDF

Info

Publication number
WO2017152879A1
WO2017152879A1 PCT/CN2017/076320 CN2017076320W WO2017152879A1 WO 2017152879 A1 WO2017152879 A1 WO 2017152879A1 CN 2017076320 W CN2017076320 W CN 2017076320W WO 2017152879 A1 WO2017152879 A1 WO 2017152879A1
Authority
WO
WIPO (PCT)
Prior art keywords
light emitting
emitting diode
substrate
printed circuit
lens assembly
Prior art date
Application number
PCT/CN2017/076320
Other languages
English (en)
French (fr)
Inventor
陈凯
黄建明
Original Assignee
杭州华普永明光电股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 杭州华普永明光电股份有限公司 filed Critical 杭州华普永明光电股份有限公司
Priority to EP17762565.4A priority Critical patent/EP3425263A4/en
Priority to JP2018547960A priority patent/JP6678249B2/ja
Priority to US16/082,819 priority patent/US10641466B2/en
Publication of WO2017152879A1 publication Critical patent/WO2017152879A1/zh

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S8/00—Lighting devices intended for fixed installation
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F21S2/005—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V15/00—Protecting lighting devices from damage
    • F21V15/01—Housings, e.g. material or assembling of housing parts
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/0015—Fastening arrangements intended to retain light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V27/00—Cable-stowing arrangements structurally associated with lighting devices, e.g. reels 
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V31/00—Gas-tight or water-tight arrangements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V31/00—Gas-tight or water-tight arrangements
    • F21V31/005—Sealing arrangements therefor
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V5/00—Refractors for light sources
    • F21V5/007—Array of lenses or refractors for a cluster of light sources, e.g. for arrangement of multiple light sources in one plane
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V5/00—Refractors for light sources
    • F21V5/04—Refractors for light sources of lens shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V5/00—Refractors for light sources
    • F21V5/04—Refractors for light sources of lens shape
    • F21V5/048—Refractors for light sources of lens shape the lens being a simple lens adapted to cooperate with a point-like source for emitting mainly in one direction and having an axis coincident with the main light transmission direction, e.g. convergent or divergent lenses, plano-concave or plano-convex lenses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S8/00—Lighting devices intended for fixed installation
    • F21S8/08—Lighting devices intended for fixed installation with a standard
    • F21S8/085—Lighting devices intended for fixed installation with a standard of high-built type, e.g. street light
    • F21S8/086—Lighting devices intended for fixed installation with a standard of high-built type, e.g. street light with lighting device attached sideways of the standard, e.g. for roads and highways
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/001—Arrangement of electric circuit elements in or on lighting devices the elements being electrical wires or cables
    • F21V23/002—Arrangements of cables or conductors inside a lighting device, e.g. means for guiding along parts of the housing or in a pivoting arm
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
    • F21W2131/00—Use or application of lighting devices or systems not provided for in codes F21W2102/00-F21W2121/00
    • F21W2131/10—Outdoor lighting
    • F21W2131/103—Outdoor lighting of streets or roads
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F21Y2105/14—Planar light sources comprising a two-dimensional array of point-like light-generating elements characterised by the overall shape of the two-dimensional array
    • F21Y2105/16—Planar light sources comprising a two-dimensional array of point-like light-generating elements characterised by the overall shape of the two-dimensional array square or rectangular, e.g. for light panels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • Embodiments of the present invention provide an LED module, a method of fabricating the same, and a lamp.
  • LED lighting devices have the advantages of energy saving, long life, good applicability, short response time, environmental protection, etc., and have a good application prospect.
  • the LED lighting device Since the performance of the light-emitting diode is highly susceptible to humidity, temperature, and mechanical vibration, in order for the light-emitting diode to work normally during the service life, the LED lighting device is required to have good waterproof performance, heat dissipation performance, and mechanical vibration resistance.
  • an LED module includes: at least one light emitting diode element; a bottom plate for supporting the light emitting diode element; and a lens assembly disposed on a light emitting surface side of the light emitting diode element; An annular seal disposed between the lens assembly and the bottom plate, wherein the light emitting diode element is located in a sealed space formed by the lens assembly, the bottom plate, and the annular seal.
  • Another embodiment of the present invention provides a method of fabricating an LED module, including: connecting an LED component to a printed circuit board; electrically connecting the wire to the printed circuit board; and the lens component and the printed circuit board Combining with each other and providing an annular seal between the lens assembly and the printed circuit board such that a portion surrounded by the annular seal between the lens assembly and the bottom plate forms a closed space, The light emitting diode element is located within the enclosed space.
  • Another embodiment of the present invention provides a lamp comprising a lamp housing and the above-mentioned LED module, the lamp housing including a cavity, and the LED module is fixed in the cavity.
  • FIG. 1 is a top plan view of an LED module in accordance with one embodiment of the present invention.
  • FIG. 2 is an exploded perspective view of an LED module in accordance with one embodiment of the present invention.
  • FIG. 3 is a schematic view of a lens assembly of an LED module (one side facing the bottom plate) according to an embodiment of the present invention
  • FIG. 4 is a schematic diagram of a bottom plate of an LED module according to an embodiment of the present invention.
  • FIG. 5 is a schematic cross-sectional view of an LED module in accordance with an embodiment of the present invention.
  • FIG. 6 is a schematic cross-sectional view of an LED module in accordance with an embodiment of the present invention.
  • FIG. 7 is a partial cross-sectional view of an LED module in accordance with an embodiment of the present invention.
  • FIG. 8 is a partial cross-sectional view of an LED module in accordance with an embodiment of the present invention.
  • FIG. 9 is a schematic structural view of a wire gripper of an LED module according to an embodiment of the present invention.
  • Figure 10 is an exploded perspective view of a luminaire in accordance with an embodiment of the present invention.
  • a light emitting diode (LED) module includes at least one LED element; a bottom plate (LED element base) for supporting the LED element; a lens assembly disposed on a light emitting surface side of the LED element, and a setting An annular seal between the lens assembly and the bottom plate.
  • the LED elements are located in a sealed space formed by the lens assembly, the bottom plate, and the annular seal.
  • FIG. 1 is a top plan view of an LED module according to an embodiment of the present invention
  • FIG. 2 is an exploded perspective view of an LED module according to an embodiment of the present invention
  • FIG. 3 is a lens assembly of an LED module according to an embodiment of the present invention.
  • Figure 4 is an embodiment in accordance with the invention
  • FIG. 5 is a schematic cross-sectional view of an LED module according to an embodiment of the invention.
  • FIG. 5 in order to clearly illustrate the relationship between components, some of the components in the figure have been simplified and exaggerated, and some components have been omitted. Referring to FIG. 1 , FIG. 2 and FIG.
  • an LED module 10 includes a bottom plate 100 , a lens assembly 200 disposed opposite the bottom plate 100 , and an annular seal between the bottom plate 100 and the lens assembly 200 . 300.
  • the annular seal may be a rubber ring formed by curing the glue, or any other suitable elastic member.
  • the annular seal 300 cooperates with the base plate 100 and the lens assembly 200 to form a closed space between the bottom plate 100 and the lens 200 and the area surrounded by the annular seal 300.
  • the LED module according to an embodiment of the present invention further includes at least one LED element 400 supported on the bottom plate 100 and located in the sealed space.
  • the lens assembly 200 and the bottom plate 100 are disposed opposite each other, and an annular seal is disposed between the lens assembly 200 and the bottom plate 100 such that a sealed space can be formed between the lens assembly 200 and the bottom plate 100.
  • annular seal is not shown in FIGS. 1 and 2, and the annular seal 300 can be referred to the schematic cross-sectional view of FIG. In addition, an example of the annular seal can also be referred to FIG. 8 described later.
  • a groove 210 for accommodating glue is shown in Fig. 8, and the ring seal 300 may be formed after the glue in the glue tank 210 solidifies, although the embodiment according to the present invention is not limited thereto.
  • the apron may be gel-like when applied to the lens, which gradually solidifies during the curing process, and in the embodiment of the invention, the bottom plate and the lens assembly are bonded by the apron Together, a closed space is enclosed by the rubber ring between the bottom plate and the lens assembly.
  • the apron herein may be a cured adhesive, and thus the apron may also be referred to as an adhesive disposed at a peripheral portion of the LED module to connect the lens assembly to the bottom plate.
  • the material of the adhesive is not particularly limited in the embodiment of the present invention, and any suitable adhesive capable of bonding the lens assembly and the bottom plate together may be selected.
  • the annular seal may have the function of sealing and bonding the bottom plate and the lens assembly, or may have only a sealing function without a bonding function, in which case the bond between the bottom plate and the lens assembly is also This can be done in other ways, such as screws.
  • a plurality of LED elements 400 may be disposed on the substrate 100 in an array.
  • the LED elements of the LED module according to the embodiment of the present invention may be disposed on the substrate 100 in any suitable manner, or the LED module may include only one LED element.
  • an LED according to an embodiment of the present invention The module has no particular limitation on the LED element 400 used.
  • LED component 400 can include an LED chip, an individually packaged LED bead, an integrated LED (also known as a COB), a multi-core packaged chip, a CSP, and the like.
  • the lens assembly 200 may have at least one lens portion 240, and each lens portion 240 may correspond to one LED element 400 for the light distribution of the LED element 400 corresponding thereto, but according to the present invention.
  • the LED module of the embodiment of the invention is not limited thereto, and each of the lens portions 240 may correspond to the plurality of LED elements 400.
  • the specific form of the lens assembly 200 is not particularly limited.
  • the lens assembly 200 may be a plate member on which a plurality of lenses are disposed, or the lens assembly 200 itself is a lens.
  • the ribs may be provided on the lens assembly 200 or the lens assembly 200 may be locally thickened to prevent deformation of the lens assembly.
  • the material of the lens assembly 200 may be any material that satisfies mechanical and optical properties, such as PC (polycarbonate) or PMMA (polymethyl methacrylate, also known as acrylic).
  • a plurality of LED elements arranged in an array are disposed on a printed circuit board, and the lens assembly includes a plurality of lens portions, each lens portion corresponding to one LED element, that is, the LED element and the lens portion are in one-to-one correspondence.
  • Each lens portion is used to distribute light to a corresponding LED element.
  • Each LED element can include one or more LED chips.
  • the bottom plate 100 of the LED module may be a printed circuit board (PCB).
  • the printed circuit board used in accordance with an embodiment of the present invention may be any one or more of a metal-based printed circuit board, a ceramic-based printed circuit board, and a plastic-based printed circuit board.
  • the metal-based printed circuit board, the ceramic-based printed circuit board, and the plastic-based printed circuit board mean that the substrates of the printed circuit board are a metal substrate, a ceramic substrate, and a plastic substrate, respectively.
  • the printed circuit board includes a substrate and a printed circuit layer formed on the substrate. As shown in FIGS.
  • the substrate 100 includes a substrate 110 and a printed circuit layer 120 formed on the substrate 110.
  • the printed circuit layer 120 is formed on the side of the substrate 110 facing the lens assembly.
  • the substrate 110 includes a central region 111 and a peripheral region 112 surrounding the central region 111.
  • the printed circuit layer 120 is located on a central area of the substrate 110. Therefore, the peripheral region 112 of the substrate 110 is not covered by the printed circuit layer and is exposed.
  • an insulating layer 130 may be provided between the substrate 110 of the printed circuit board 100 and the printed circuit layer 120.
  • the insulating layer 130 is also located in the central region 111 of the substrate 110, and therefore, the peripheral region 112 of the substrate 110 is also not covered by the insulating layer.
  • the insulating layer 130 itself may also include a central area and a periphery surrounding the central area.
  • the printed circuit layer 120 is located, for example, on a central region of the insulating layer 130.
  • the insulating layer 130 can ensure electrical insulation between the metal substrate 110 and the printed circuit layer 120.
  • the printed circuit layer 120 is disposed on the central region of the insulating layer 130 with a certain interval between the edge and the edge of the insulating layer 130 to ensure a proper creepage distance.
  • the substrate 110 may be a plate member, for example, may be a flat member.
  • the specific material of the metal substrate is not particularly limited, and for example, it may be aluminum or aluminum alloy having good thermal conductivity.
  • the specific material of the ceramic substrate is not particularly limited, and may be, for example, aluminum nitride, silicon carbide or the like.
  • the specific material of the plastic substrate is not particularly limited, and may be, for example, phenolic cotton paper, epoxy resin or inorganic-organic composite material.
  • the printed circuit layer 120 may include a single layer or a plurality of layers, or may be a composite structure of a line and an insulating material.
  • the LED element 400 disposed on the substrate 100 may be electrically connected to the printed circuit layer 120, that is, electrically connected to the wiring in the printed circuit layer 120.
  • the LED element 400 can be powered or otherwise driven by circuitry in the printed circuit layer 120 to control the illumination of the LED component 400.
  • the insulating layer 130 and the printed circuit layer 120 are distributed in a central region of the substrate, and there is no printed circuit layer and insulating layer in the peripheral region (edge portion) of the substrate.
  • An annular seal eg, a liquid apron, adhesive, etc.
  • the adhesive is applied to the exposed portion (peripheral region) of the substrate that is not covered by the insulating layer.
  • the annular seal 300 is disposed in the peripheral region 122 of the substrate 120. That is, the annular seal 300 is formed on the periphery of the printed circuit layer 120. In the peripheral region 122, the substrate 120 is not covered by the printed circuit layer or other layers, and therefore, the annular seal 300 can be in direct contact with the substrate 110. In addition, the other side of the annular seal 300 may be in direct contact with the lens assembly 200, so that a sealed space can be better formed.
  • the lens assembly and the substrate of the printed circuit board are directly connected (or bonded) together by an annular seal (such as glue, adhesive or elastic member, etc.), directly with the printed circuit board
  • an annular seal such as glue, adhesive or elastic member, etc.
  • the printed circuit layer or the insulating layer is connected (or bonded) together to prevent moisture or the like from entering the sealed space between the lens assembly and the printed circuit board through the printed circuit layer or the gap between the insulating layer and the substrate. Inside, and thus affect the performance of the LED.
  • the insulating layer and the metal substrate are generally pressed together.
  • the sealing property between the metal substrate and the insulating layer is affected by the forming method of the insulating layer.
  • there is a gap between the insulating layer and the metal substrate and moisture easily enters the lens assembly from the gap between the metal layer and the insulating layer.
  • the insulating layer is apt to be gradually deteriorated during use, and the insulating layer is gradually peeled off from the metal substrate due to aging, so that water vapor or the like is more easily entered into the lens assembly and the printed circuit board from the gap between the metal substrate and the insulating layer.
  • the performance of the LED element is affected.
  • the substrate has a problem that the printed circuit layer or other layers on the upper surface are not tightly bonded. Therefore, in the LED module of the embodiment of the present invention, the problem that the substrate is not tightly coupled to the upper layers can be solved by directly connecting (or bonding) the substrate to the substrate through the sealing member.
  • the metal substrate can be a thick metal layer, and only the insulating layer and the printed circuit layer are interposed between the LED element and the metal substrate, and the number of thermally conductive dielectric layers is small, and the heat dissipation performance is good.
  • the thickness of the metal substrate is sufficient to support the LED element and the insulating layer thereon as well as the printed circuit layer.
  • the metal substrate according to an embodiment of the present invention has a thickness of 1 mm to 4 mm.
  • the thickness may also be 1 mm to 4 mm.
  • the LED module of the embodiment of the invention the lens assembly is directly sealed to the substrate of the printed circuit board. The heat generated during the operation of the LED module can be dissipated through the substrate of the printed circuit board without the need for heat sink fins.
  • the LED module of the embodiment of the present invention further includes a wire 310 for electrically connecting the printed circuit layer with an external power source.
  • a wire 310 for electrically connecting the printed circuit layer with an external power source.
  • one end of the wire 310 extends into the central region 121 of the substrate 120 to electrically connect with the printed circuit layer and through the peripheral region 122 of the substrate 120 (the seal through the peripheral region 122) Pieces 300).
  • the other end of the wire 310 is led out to the outside of the sealed space to be connected to an external power source.
  • the wire is electrically connected to an external power source through a seal (apron or adhesive) between the lens assembly and the bottom plate. The sealing of the wire and the seal is achieved by direct intimate contact of the seal with the wire.
  • FIG. 6 is a schematic cross-sectional view of a portion of the LED module according to an embodiment of the present invention
  • FIG. 7 is a partially enlarged schematic view of a portion shown by a circle on the left side of FIG. 6.
  • FIG. 9 is a schematic structural view of a wire gripper of an LED module according to an embodiment of the invention.
  • annular groove 210 is provided on the side of the lens assembly 200 facing the bottom plate 100, which can be used to receive at least a portion of the annular seal 300.
  • glue can be added to the above-mentioned annular groove 210 during the manufacturing process.
  • a plurality of overflow grooves 220 are provided on both sides of the annular groove 210 to facilitate glue coating and prevent glue overflow.
  • the annular groove 210 and the glue overflow groove 220 correspond to the bare substrate peripheral region of the printed circuit board 100.
  • the embodiment according to the present invention is not limited thereto, and the overflow tank 220 may be provided only on one side of the annular groove 210 or the overflow tank may not be provided.
  • a portion of the annular groove 220 may have a greater width and a deeper depth, and this portion may be referred to as a glue pool portion 211. That is, the glue pool 211 can be considered as a part of the groove 210 for applying glue.
  • the depth of the groove refers to the dimension in a direction perpendicular to the lens assembly, and the width refers to a dimension in a plane parallel to the lens assembly and perpendicular to the extending direction of the groove.
  • a wire holder 320 for fixing a wire may be disposed in the glue pool 211, and the wire holder 320 is fixed in the glue pool 211.
  • the glue pool 211 is coated with a large amount of glue (binder), and the card holder 320 and the wire 310 are submerged in the glue water of the glue tank 211 to achieve good contact between the wire 310 and the glue, so that the glue and the wire 321 are Sealed well.
  • the function of the glue tank 211 is to hold a relatively large amount of glue therein so that the glue can be applied to the periphery of the wire 310 when the wire 310 and/or the wire catcher 320 are placed, so that the wire 310 is in close contact with the glue, preventing the wire.
  • the positional movement of 310 affects the sealing performance.
  • a glue pool a groove for holding the adhesive
  • at least one of the lens assembly 200 and the bottom plate 100 has a groove for holding an adhesive at a peripheral portion.
  • annular groove for holding glue may also be provided on the bottom plate or on both the lens assembly and the bottom plate (on the surfaces facing each other).
  • a positioning pin 230 for positioning may be disposed on the lens assembly 200, and the positioning pin 230 corresponds to the positioning hole 140 on the printed circuit board.
  • the locating pin 230 can be inserted into the locating hole 140 on the base plate.
  • a through hole 260 may be provided in the locating pin 230.
  • the LED module can be mounted to the lamp housing through the through hole 260.
  • the lens assembly and/or the backplane may also include through holes for connecting the fasteners of the bottom plate to external components (eg, lamp housings).
  • a groove 250 for wiring is further disposed on a side of the lens assembly facing the bottom plate, such that a wire 310 leading from the printed circuit board of the LED module can be disposed in the groove 250, thereby The LED module is more beautiful.
  • the lens assembly 200 can also include a wire bonding slot 270, for example, where the wire 310 is soldered to the printed circuit layer 120 can correspond to the wire bonding slot 270.
  • lens assembly 200 also includes a central region and a peripheral region located in the central region.
  • the lens portion 240 is located in a central region of the lens assembly 200, and a positioning pin 230, a groove 210 for applying glue, a glue overflow groove 220, a wiring groove 250, a glue pool 211, and the like are located in the peripheral region.
  • the central area of the lens assembly 200 is opposite to the central area 111 of the substrate 110 of the bottom plate, and the lens portion 240 on the lens assembly 200 and the light-emitting element on the bottom plate 100 400 corresponds (for example, one-to-one correspondence), the peripheral area of the lens assembly 200 is opposite to the peripheral area 112 of the substrate 110 of the bottom plate. Therefore, the applied glue (binder) can directly bond the exposed surface of the substrate 110 to the lens assembly, thereby avoiding the influence of the interface or the insulating layer (or other layer) itself between the insulating layer or other layer and the substrate. Sealing performance.
  • the wire gripper 320 includes a first wire clamping member 321 and a second wire clamping member 322, the first card.
  • the wire member 321 is fixedly connected to the substrate 110 of the bottom plate 100, and the first wire clamping member 321 is provided with a first groove having a semicircular cross section (the cross section may also be any non-closed pattern), and the second wire clamping member 322 is also A second groove matching the first groove is provided with a semicircular cross section (the cross section may also be any non-closed pattern).
  • the first wire clamping member 321 and the second wire clamping member 322 are fixedly connected, and the wire 310 passes through the first groove and the second groove, and is disposed between the first wire clamping member 321 and the second wire clamping member 322.
  • the first groove of the first wire member and the second groove of the second wire member may form a wire through hole 323 after the first wire member and the second wire member are mounted together.
  • the wire 310 can pass through the wire 323 through the wire.
  • the wire retainer 320 avoids the problem that the wire 310 is in contact with the lens assembly 200 or the bottom plate 100 while the wire 310 is fixed, thereby causing poor contact between the wire 310 and the glue, thereby improving the sealing performance.
  • the first positioning member 3211 is disposed on the first positioning member 3211, and is connected to the substrate 110 of the bottom plate 100 through the positioning post 3211.
  • the first positioning post 3211 and the first positioning hole 150 of the substrate 110 are The first interference member 321 fixes the first card member 321 on the substrate 110.
  • the first card is passed by an interference fit between a second positioning post (not shown) on the second wire member 322 and a second positioning hole (not shown) on the first wire member 321
  • the wire member 321 and the second wire hook member 322 are fixedly connected. Thereby, fixing of the wire 310 to the base plate 100 is achieved.
  • connection manner of the first wire clamping member 321 and the substrate 110 and the second wire clamping member 322 The manner of connection with the first card wire member 321 is merely exemplary, and embodiments according to the present invention are not limited to the above-described connection mode.
  • the wire holder 320 may be fixed to a peripheral region of the substrate 100 (that is, a peripheral region of the substrate 110), for example, a peripheral region of the substrate 110 that is not covered by an insulating layer or a printed circuit layer.
  • the cable gripper 320 can be multiple and spaced together.
  • the plurality of wire grippers 320 may be arranged and spaced apart in a direction along which the wires extend. In this way, the wire can be sufficiently fixed with the glue while being sufficiently fixed by the wire holder 320, thereby ensuring a good sealing of the wire.
  • the wire 310 passes through the wire catcher 320 between the lens assembly 200 and the bottom plate 100, extending from the sealed space to the outside of the sealed space.
  • the lens assembly 200 can also include a wire stop portion 260 for shielding the lead wire 310 that is drawn.
  • the wires are taken out of the glue tank 211, and the wires are directly sealed by a seal (or an adhesive), thereby avoiding the problem that the wires 310 need to be double-sealed from the lens assembly 200 or from the bottom plate 100. Moreover, compared with the technical solution that the wires pass through the printed circuit board, it is not necessary to provide the insulating layer and the partial opening of the printed circuit on the printed circuit board to lead the wires out, which reduces the manufacturing difficulty of the printed circuit board and reduces the production. cost.
  • a wire extends from the sealed space to the outside of the sealed space between the lens assembly and the bottom plate of the LED element.
  • a wire may extend from the sealed space to the outside of the sealed space through a via hole in the lens assembly.
  • the electrical connection of the LED element to the outside is achieved by a wire passing through the sealing member (binder), and the wire is taken out from between the lens assembly and the bottom plate, thereby preventing the wire or the lens assembly from being disposed for the wire. Through the hole.
  • the wire can be in close contact with the glue to ensure the sealing performance.
  • a transparent colloid may be filled between each lens portion and the LED element of the lens assembly.
  • the light emitted from the LED element passes through the light exit surface of the LED element, passes through the space between the lens portion and the LED element, and is transmitted through the lens portion.
  • the refractive index of the transparent colloid is higher than that of the air and the lens portion, and the refractive index of the lens portion is higher than that of the air.
  • the light emitted from the LED element passes through the transparent colloid between the lens portion and the LED element and then passes through the lens portion.
  • the light emitted from the LED element passes through the transparent colloid having a higher refractive index and is then transmitted through the lens portion having a lower refractive index.
  • the loss of light efficiency is lower than when the light propagates from a medium having a lower refractive index to a medium having a higher refractive index. Therefore, the light-emitting efficiency of the LED element after filling the transparent colloid is higher than that of the transparent colloid.
  • the transparent colloid may not be filled in the pits of the lens portion.
  • the colloid may be filled in such a manner that the colloid is filled in the space between the entire lens and the PCB, or the colloid may be filled only in the pit of the lens portion.
  • a portion of the lens assembly 200 may be in contact with the bottom plate 100, leaving only a space for accommodating the LED elements in a portion of the lens portion 240.
  • the LED module according to an embodiment of the present invention is not limited thereto, and the lens assembly 200 may not be in direct contact with the bottom plate 100.
  • the substrate of the printed circuit board is extended to the periphery of the sealing member to increase the substrate of the printed circuit board (for example, metal) compared to the structure in which the printed circuit board is disposed between the lens assembly, the bottom plate and the sealant.
  • the area of the substrate, that is, the heat dissipation area is increased, which is advantageous for heat dissipation.
  • the lens assembly is fixedly connected to the printed circuit board.
  • the back surface of the substrate (for example, the metal substrate) of the printed circuit board of the LED module is attached to the lamp housing.
  • the heat generated by the LED elements is conducted to the lamp housing through the substrate of the printed circuit board. Since the lamp housing of the LED lamp is generally made of a metal material, the heat of the substrate is transmitted to the air through the lamp housing after being conducted to the lamp housing, that is, the heat is dissipated by the lamp housing of the LED lamp.
  • the heat dissipation condition of the LED module is better than that of the existing lamp housing provided with the LED module, and the heat conduction condition is more excellent.
  • the structure of the LED module is simple, and the heat sink with complicated shape and structure is avoided, the material is saved, the weight of the module is reduced, and the cost is saved.
  • the LED module in the embodiment of the present invention is in contact with the lamp housing (for example, surface bonding and surface contact), and the size of the inner cavity of the lamp housing is smaller than that of the existing lamp assembly provided with the LED module.
  • the lamp structure is more compact, the weight of the lamp housing is reduced, the lamp housing material is saved, and the cost is reduced.
  • Embodiments of the present invention also provide a method of manufacturing an LED module (installation method).
  • the installation sequence is as follows: electrically connecting the LED components to the backplane; The wire is fixed; the wire is welded to the bottom plate; the wire holder is fixed on the bottom plate; the concave surface of the lens assembly (the surface facing the bottom plate) faces upward, and the glue is coated on the lens assembly for holding Putting the glue into the groove; passing the positioning pin on the lens assembly through the positioning hole on the PCB board, and putting the lens assembly and the PCB cover together; placing the LED module on the fixture provided with the heat sink, and The metal layer of the PCB board is attached to the heat sink on the fixture, and the LED module is aged by the clamp.
  • the installation sequence is as follows: electrically connecting the LED component to the PCB board; fixing the first wire clamp of the wire clamp to the bottom plate; soldering the wire to the bottom plate; and fixing the wire to the first wire clamp Closing the second cable ties with the first cable ties, fixing the wires in the wire keeper; facing the concave surface of the lens assembly (the surface facing the bottom plate) upward, and coating the glue on In the glue tank of the lens assembly; the positioning pin on the lens assembly passes through the positioning hole on the bottom plate, and the lens assembly and the bottom plate are closed together; the LED module is placed on the fixture provided with the heat sink, and the bottom plate is The metal layer is attached to the heat sink on the fixture, and the LED module is aged by the clamp.
  • a method of fabricating an LED module may include the steps of: connecting an LED element to a backplane; electrically connecting the wire to the backplane (eg, electrically connecting to a printed circuit layer on the printed circuit board) a step of disposing the lens assembly and the printed circuit board opposite each other and providing an annular seal between the lens assembly and the printed circuit board.
  • the order of the other steps in these steps is not particularly limited except for the last step.
  • the fabrication method according to an embodiment of the present invention may further include some other steps as shown in the above examples.
  • the above steps are merely exemplary.
  • the above steps of arranging the lens assembly and the printed circuit board opposite to each other and providing a sealing member therebetween may firstly provide a sealing member on at least one of the lens assembly and the printed circuit board, and then the lens Components and printed circuit board pairs.
  • a lamp comprising a lamp housing and an LED module, the lamp housing comprising a cavity, wherein the LED module is fixed in the cavity.
  • the luminaire further includes a power component that is electrically coupled to the LED module via a wire for powering the LED module.
  • the power supply assembly is disposed within the lamp housing.
  • the cavity described above can be a sealed cavity.
  • the LED module included in the luminaire can be an LED module according to any of the embodiments of the present invention.
  • the lamp housing includes a lower cover and an upper cover, the lower cover including a transparent area for the LED The light emitted by the module is transmitted, and the LED module is fixed on the upper cover.
  • the bottom plate of the LED module is in contact with the upper cover surface. Since the substrate in the bottom plate of the LED can be in contact with the upper cover surface of the luminaire, it is advantageous for the heat generated by the operation of the LED element to be dissipated through the upper cover of the luminaire.
  • the metal substrate as the substrate of the bottom plate is in contact with the upper cover, which is more advantageous for the heat generated during the use of the LED module to be dissipated through the metal substrate and the upper cover.
  • the lamp housing further includes a spindle assembly, and the upper cover and the lower cover are rotatable about the spindle assembly.
  • the upper cover of the lamp housing is a detachable structure.
  • FIG. 10 shows an exemplary structure in which an LED lamp according to an embodiment of the present invention includes a lamp housing, an LED module 10, and a power supply assembly 21.
  • the lamp housing is a hollow sealed cavity, and the LED module 10 and the power supply assembly 21 are fixed in the sealed cavity.
  • the power component 21 is electrically connected to the LED module 10 through a wire for supplying power to the LED module.
  • the LED module 10 is the LED module of any of the above embodiments.
  • the lamp housing includes a lower cover 12, an upper cover 11, and a spindle assembly 23.
  • the upper cover 11 and the lower cover 12 are rotatably coupled by the spindle assembly 23 such that the upper cover 11 and the lower cover 23 are relatively rotatable about the spindle assembly 23.
  • the upper cover 11 and the lower cover 12 are in a closed state, a sealing cavity is formed between the upper cover 11 and the lower cover 12, and a sealing ring 19 is further disposed at the cover of the upper cover 11 and the lower cover 12 to ensure the upper cover.
  • the LED module 10 and the power supply assembly 21 are fixed to the upper cover 11 by fasteners.
  • An opening corresponding to the light emitting surface of the LED module 10 is disposed at a position opposite to the LED module 10 at the lower cover 12.
  • a light-transmitting plate 18 is further disposed at the opening, and a sealing ring 15 is further disposed between the lower cover opening and the light-transmitting plate 18.
  • the plurality of pressing pieces 14 are further disposed on the lower cover 12, and each of the pressing pieces 14 is disposed on the transparent plate 18. It is fixed to the lower cover 12, and the sealing ring 15 is elastically deformed between the light-transmitting plate 18 and the lower cover 12 to seal the opening in the lower cover 12.
  • the light-transmitting plate 18 may be tempered glass, and the light emitted by the LED module is transmitted through the light-transmitting plate 18 from the inside of the lamp housing.
  • the LED module is placed inside the lamp housing, and the entire lamp housing forms a sealed cavity.
  • the sealed lamp housing is less likely to accumulate dust and water is difficult to enter. Good protection for components such as power components and LED modules installed in the lamp housing.
  • the power component and the LED module are both fixed on the upper cover, and the upper cover and the lower cover are fixedly connected by a hinge.
  • the upper cover and the lower cover can be loosened by hand, and the upper cover can be rotated around the lower cover through the rotating shaft assembly.
  • the upper cover can be separated from the lower cover.
  • the power component and the LED module are all mounted on the upper cover.
  • the power component and the LED module can be first mounted on the upper cover, and then the upper cover and the LED module and the power component are integrally mounted under the cover. Covered for easy installation.
  • the upper cover, the LED module and the power supply component can be removed from the luminaire as a whole without removing the entire luminaire from the lamp post, thereby facilitating maintenance of the luminaire.
  • the lower cover is further provided with a lamp post mounting portion and a lamp post adapter 13 corresponding to the lamp post mounting portion.
  • the plurality of first tooth-shaped protrusions are disposed on the lamp pole mounting portion, and the plurality of second tooth-shaped protrusions corresponding to the first tooth-shaped protrusions are disposed on the light pole adapter 13
  • the protrusions mesh with the first dentations.
  • the mounting angle between the lamp post adapter and the lamp post mounting portion is adjusted by the difference in the position at which the first toothed projection and the second toothed projection are engaged, thereby adjusting the angle at which the lamp is mounted to the lamp post.
  • the LED module in the present application is disposed in a sealed lamp housing, and the bottom plate of the LED module can be directly attached to the lamp housing.
  • the heat generated by the LED module can be transmitted to the lamp housing through the bottom plate, and the heat dissipation fins are not required for the heat dissipation.
  • embodiments according to the present invention are not limited thereto, and the LED module of the present application may also be disposed directly on the unsealed lamp housing.
  • the bottom plate of the LED module can be in contact with the upper cover surface of the lamp housing. Since the bottom plate of the LED module can be a metal-based printed circuit board, the heat generated by the LED module can pass through the metal. The metal substrate of the base printed circuit board is conducted to the upper cover of the LED module, and the heat is dissipated.
  • the upper cover may be made of a material having good thermal conductivity such as metal.
  • the bottom plate side faces the upper cover
  • the lens assembly side faces the lower cover, so that the light emitted by the LED module can be emitted from the transparent area of the lower cover.
  • some other components are also shown, such as light control 26, light control base 25, hook 27, hook spring 28, lightning arrester 22, respirator 17, over coil 16 , controller 20, open cover power off switch 24 and other components.
  • Some of the components shown in the figure may be replaced or omitted as needed, or other components may be added as needed.
  • a light emitting diode (LED) module includes at least one LED element; an LED element bottom plate for supporting the LED element; and the LED element is disposed A lens assembly above the smooth surface, the lens assembly is provided with at least one lens portion, and a rubber ring disposed between the lens assembly and the bottom plate of the LED element, the LED element being located in a sealed space formed by the lens assembly, the LED element bottom plate and the apron.
  • LED light emitting diode
  • each lens portion corresponds to one LED element for light distribution of the LED element corresponding thereto.
  • the LED component backplane is a metal based printed circuit board.
  • the metal-based printed circuit board includes a metal plate and an insulating layer formed on the metal plate and a printed circuit layer.
  • the printed circuit layer is formed on the insulating layer to be electrically insulated from the metal plate.
  • a surface of the metal plate includes a central region and a peripheral region at a periphery of the central region, and the insulating layer and the printed circuit layer are formed only in a central region of a surface of the metal plate, The peripheral region of the surface of the metal plate is not covered by the insulating layer.
  • the metal plate is thick enough to support the LED element and the insulating layer thereon as well as the printed circuit layer.
  • the LED elements are disposed on the metal-based printed circuit board and are electrically coupled to the printed circuit layer.
  • the metal plate is a plate member, for example, may be a flat member.
  • the apron is in direct contact with a surface of the metal sheet that is not covered by the insulating layer and the lens assembly.
  • the apron is disposed on a periphery of the insulating layer.
  • the apron is formed by curing a liquid binder that bonds the bottom panel and the lens assembly together to form the enclosed space.
  • the lens assembly and the bottom plate have holes or indentations through which the keeper or fixture passes.
  • annular groove is provided on a side of the lens assembly that faces the bottom plate, and the rubber ring is disposed in the annular groove.
  • the apron is disposed in the annular groove.
  • one or both sides of the annular groove are also provided with at least one overflow tank.
  • the annular groove includes a glue pool having a depth and a width greater than other portions section.
  • the LED module further includes a wire extending from the sealed space through the apron to an exterior of the enclosed space.
  • the LED module further includes a wire gripper disposed between the lens assembly and the bottom plate and located in the rubber ring, the wire passing through the card Wire cutter.
  • the cable gripper is disposed at a location of the glue pool.
  • the wire holder includes a first wire member and a second wire member, and the first wire member and the second wire member are provided with grooves corresponding to each other on the mutually facing surfaces to Holes are formed when superposed on each other, and the wires pass through the holes.
  • the first wire clip is fixed to a peripheral region of the metal plate of the bottom plate that is not covered by the insulating layer.
  • the first wire gripper includes a first positioning post through which the metal plate of the bottom plate is coupled.
  • the LED module further includes a positioning pin disposed on the lens assembly for insertion into a positioning hole on the base plate.
  • each lens portion of the lens assembly and the LED element are filled with a transparent colloid.
  • the transparent colloid has a higher refractive index than the air and the refractive index of the lens portion.
  • a method for fabricating an LED module includes:
  • An adhesive is applied to the lens assembly and the lens assembly and the PCB board are bonded.
  • the LED element substrate is a metal-based printed circuit board including a metal plate and an insulating layer formed on the metal plate and a printed circuit layer.
  • a surface of the metal plate includes a central region and a peripheral region at a periphery of the central region, and the insulating layer and the printed circuit layer are formed only in a central region of a surface of the metal plate, The peripheral region of the surface of the metal plate is not covered by the insulating layer.
  • an adhesive coated on the lens assembly corresponds to a peripheral region of the metal plate that is not covered by an insulating layer.
  • a light fixture includes a lamp housing and an LED module, and the lamp The housing includes a cavity, and the LED module is fixed in the cavity, wherein the LED module is the LED module according to any one of the above.
  • the luminaire further includes a power component that is electrically connected to the LED module through a wire for powering the LED module.
  • the cavity is a sealed cavity.
  • the bottom plate of the LED module is in surface contact with at least a portion of the lamp housing.
  • the lamp housing includes a lower cover and a top cover
  • the lower cover includes a transparent area for transmitting light emitted by the LED module
  • the LED module is fixed on the upper cover.
  • the bottom plate of the LED module is in surface contact with the upper cover.
  • the lamp housing further includes a spindle assembly, the upper and lower covers being rotatable about the spindle assembly.
  • the upper cover of the lamp housing is a detachable structure.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

一种发光二极管模组（10）和灯具。一种发光二极管模组（10），包括：至少一个发光二极管元件（400）；用于支撑所述发光二极管元件（400）的底板（100）；设置在所述发光二极管元件（400）的出光面侧的透镜组件（200）；以及设置在所述透镜组件（200）和所述底板（100）之间的环状密封件（300），其中，所述发光二极管元件（400）位于所述透镜组件（200）、所述底板（100）和所述环状密封件（300）形成的密闭空间内。

Description

发光二极管模组及其制作方法和灯具 技术领域
本发明的实施例提供一种发光二极管模组及其制作方法和灯具。
背景技术
发光二极管(Light Emitting Diode,LED)照明装置具有节能、寿命长、适用性好、响应时间短、环保等优点，具有很好的应用前景。
由于发光二极管的性能极易受到湿度、温度以及机械振动的影响，为了使发光二极管能在使用寿命内正常工作，这就要求发光二极管照明装置具有良好的防水性能、散热性能以及防机械振动性能。
发明内容
根据本发明的一个实施例提供一种发光二极管模组，包括：至少一个发光二极管元件；用于支撑所述发光二极管元件的底板；设置在所述发光二极管元件的出光面侧的透镜组件；以及设置在所述透镜组件和所述底板之间的环状密封件，其中，所述发光二极管元件位于所述透镜组件、所述底板和所述环状密封件形成的密闭空间内。
本发明的另一个实施例提供一种发光二极管模组的制作方法，包括：将发光二极管元件连接到印刷电路板；将导线与印刷电路板电连接；将所述透镜组件和所述印刷电路板彼此结合并在所述透镜组件和所述印刷电路板之间设置环状密封件，从而在所述透镜组件和所述底板之间由所述环状密封件包围的部分形成密闭空间，所述发光二极管元件位于所述密闭空间内。
本发明的另一个实施例提供一种灯具，包括灯壳和上述发光二极管模组，所述灯壳包括一腔体，所述发光二极管模组固定在该腔体内。
附图说明
为了更清楚地说明本发明实施例的技术方案，下面将对实施例的附图作简单地介绍，显而易见地，下面描述中的附图仅仅涉及本发明的一些实施例， 而非对本发明的限制。
图1是根据本发明一个实施例的LED模组的俯视示意图；
图2是根据本发明一个实施例的LED模组的分解示意图；
图3是根据本发明实施例的LED模组的透镜组件的示意图(面对底板的一面)；
图4是根据本发明实施例的LED模组的底板的示意图；
图5是根据本发明实施例的LED模组的截面示意图；
图6是根据本发明实施例的LED模组的截面示意图；
图7是根据本发明实施例的LED模组的局部截面示意图；
图8是根据本发明实施例的LED模组的局部截面示意图；
图9是根据本发明实施例的LED模组的卡线器的结构示意图；
图10是根据本发明实施例的灯具的分解示意图。
具体实施方式
为使本发明实施例的目的、技术方案和优点更加清楚，下面将结合本发明实施例的附图，对本发明实施例的技术方案进行清楚、完整地描述。显然，所描述的实施例是本发明的一部分实施例，而不是全部的实施例。基于所描述的本发明的实施例，本领域普通技术人员在无需创造性劳动的前提下所获得的所有其它实施例，都属于本发明保护的范围。
除非另作定义，此处使用的技术术语或者科学术语应当为本发明所属领域内具有一般技能的人士所理解的通常意义。本发明专利申请说明书以及权利要求书中使用的“第一”、“第二”以及类似的词语并不表示任何顺序、数量或者重要性，而只是用来区分不同的组成部分。
根据本发明的一些实施例提供一种发光二极管(LED)模组，包括至少一个LED元件；用于支撑LED元件的底板(LED元件底座)；设置在LED元件出光面侧的透镜组件，以及设置在透镜组件和底板之间的环状密封件。LED元件位于透镜组件、底板和环状密封件形成的密闭空间内。
图1是根据本发明一个实施例的LED模组的俯视示意图；图2是根据本发明一个实施例的LED模组的分解示意图；图3是根据本发明实施例的LED模组的透镜组件的示意图(面对底座的一面)；图4是根据本发明实施例的 LED模组的底板的示意图；图5是根据本发明实施例的LED模组的截面示意图。在图5中，为了清楚说明部件之间的关系，该图中某些部件进行了简化和夸大显示，并且对某些部件进行了省略。参考图1、图2和图5，根据本发明实施例的一种LED模组10包括底板100、与底板100相对设置的透镜组件200以及位于底板100和透镜组件200之间的环状密封件300。该环状密封件可以为胶状物固化后形成的胶圈，也可以为其他任意合适的弹性件。该环状密封件300与底板100和透镜组件200配合以在底板100和透镜200之间且由该环状密封件300围绕的区域形成一密闭空间。根据本发明实施例的LED模组还包括至少一个LED元件400，该LED元件400支撑在底板100上，并位于上述密封空间中。
例如，透镜组件200和底板100彼此相对设置，且环状密封件设置在透镜组件200和底板100之间，从而在透镜组件200和底板100之间可以形成一个密闭空间。
在图1和图2中没有示出环状密封件，该环状密封件300可以参考示意性截面图图5。另外，该环状密封件的一个示例也可以参照后面所述的图8。在图8中示出了用于容纳胶水的槽210，在胶水槽210中的胶水凝固后可以形成环状密封件300，当然根据本发明的实施例并不限制于此。例如，在制作LED模组的过程中，胶圈在涂布到透镜上时可为凝胶状，其在固化过程中逐渐凝固，并且本发明实施例中底板与透镜组件依靠胶圈粘结在一起，并在底板和透镜组件之间由胶圈围成一个密闭的空间。例如，这里的胶圈可以是固化了的粘结剂，因此，胶圈也可以称为设置在LED模组的周边部分连接透镜组件和底板的粘结剂。本发明实施例对粘结剂的材料没有特别限制，可以选用能够将透镜组件和底板粘结在一起的任何合适的粘结剂。在本发明的实施例中，环状密封件可以具有密封和粘接底板和透镜组件的功能，也可以仅具有密封功能而不具有粘接功能，此时，底板和透镜组件之间的结合也可以通过其他方式(例如螺钉)来实现。
例如，如图2或图4所示，多个LED元件400可以以阵列的形式设置在底板100上。然而，根据本发明的实施例并不限制于此，根据本发明实施例的LED模组的LED元件可以以任何合适的方式设置在底板100上，或者，LED模组也可以仅仅包括一个LED元件。例如，根据本发明实施例的LED 模组对所使用的LED元件400没有特别限制。例如，LED元件400可以包括LED芯片、独立封装好的LED灯珠、集成LED(又称之为COB)、多芯封装芯片、CSP等。
如图1-3所示，透镜组件200可以具有至少一个透镜部240，每个透镜部240可以与一个LED元件400相对应，用于与之相对应的LED元件400进行配光，但根据本发明实施例的LED模组不限制于此，也可以每个透镜部240对应多个LED元件400。例如，透镜组件200的具体形式没有特别限定。例如，透镜组件200可以为其上设置多个透镜的板状构件，或者透镜组件200本身就为透镜。或者，透镜组件200上可以设置加强筋，或者将透镜组件200局部增厚，防止透镜组件变形。透镜组件200的材料可以为满足机械和光学性能的任意材料，例如为PC(聚碳酸酯)或PMMA(聚甲基丙烯酸甲酯，又名亚克力)。
例如，在印刷电路板上设置有排列成阵列的多个LED元件，透镜组件包括多个透镜部，每个透镜部对应一个LED元件，也就是说，LED元件和透镜部一一对应。每个透镜部用于对相应的LED元件进行配光。每个LED元件可以包括一个或多个LED芯片。
根据本发明的实施例中，LED模组的底板100可以为印刷电路板(Printed circuit board，PCB)。根据本发明实施例所使用的印刷电路板可以为金属基印刷电路板、陶瓷基印刷电路板和塑料基印刷电路板中的任何一种或几种。金属基印刷电路板、陶瓷基印刷电路板和塑料基印刷电路板是指印刷电路板的基板分别为金属基板、陶瓷基板和塑料基板。然而，根据本发明的实施例并不限制于此。印刷电路板包括基板以及形成在基板上的印刷电路层。如图2、图4和图5所示，底板100包括基板110以及形成在基板110上的印刷电路层120。例如，印刷电路层120形成在基板110的面对透镜组件的一侧。如图5所示，基板110包括中心区域111以及围绕中心区域111的周边区域112。印刷电路层120位于基板110的中心区域上。因此，基板110的周边区域112没有被印刷电路层覆盖而裸露。另外，在印刷电路板100的基板110和印刷电路层120之间，还可以设置绝缘层130。例如，绝缘层130也是位于基板110的中心区域111，因此，基板110的周边区域112也没有被绝缘层覆盖。另外，绝缘层130本身也可以包括中心区域和围绕中心区域的周边 区域，印刷电路层120例如位于绝缘层130的中心区域上。在金属基印刷电路板的情况下，绝缘层130可以保证金属基板110与印刷电路层120之间的电绝缘。另外，印刷电路层120设置在绝缘层130的中心区域上，其边缘与绝缘层130的边缘之间具有一定的间隔，可以保证合适的爬电距离。
基板110可以为板状构件，例如，可以为平板状构件。对于金属基板，其具体材料没有特别限制，例如可以为导热性能良好的铝、铝合金等。对于陶瓷基板，其具体材料也没有特别限制，例如，可以为氮化铝、碳化硅等。对于塑料基板，其具体材料也没有特别限制，例如，可以为酚醛棉纸、环氧树脂或者无机-有机复合材料等。印刷电路层120可以包括单层或多层线路，也可以是线路与绝缘材料的复合结构。
根据本发明实施例的LED模组中，设置在底板100上的LED元件400可以与印刷电路层120电连接，也就是，与印刷电路层120中的线路电连接。这样，可以通过印刷电路层120中的线路为LED元件400提供电源或者其他驱动信号，从而控制LED元件400的发光。
本发明实施例中绝缘层130和印刷电路层120分布在基板的中心区域，在基板的周边区域(边缘部分)没有印刷电路层和绝缘层。环状密封件(例如，液体胶圈、粘结剂等)涂布在印刷电路板的基板上，且包围绝缘层和印刷电路层。也就是说，粘结剂涂布在基板的未被绝缘层覆盖的裸露部分(周边区域)。
例如，环状密封件300设置在基板120的周边区域122中。也就是说，环状密封件300形成在印刷电路层120的外围。在该周边区域122中，基板120没有被印刷电路层或其他层覆盖，因此，环状密封件300可以直接与基板110接触。另外，环状密封件300的另一侧可以与透镜组件200直接接触，从而能够更好地形成密闭空间。
在本发明的实施例中，通过环状密封件(例如胶水、粘结剂或者弹性构件等)直接将透镜组件和印刷电路板的基板连接(或粘结)在一起，与直接同印刷电路板上的印刷电路层或绝缘层连接(或粘结)在一起的好处在于，防止湿气等通过印刷电路层或绝缘层与基板之间的间隙进入到透镜组件和印刷电路板之间的密闭空间内，进而影响LED的使用性能。
例如，在金属基印刷电路板中，绝缘层和金属基板一般通过压合的方式 连接，金属基板和绝缘层之间的密闭性能受到绝缘层成形方式的影响，通常在绝缘层和金属基板之间存在一定间隙，水汽容易从金属层和绝缘层之间的缝隙内进入到透镜组件和印刷电路板之间的密闭空间内。另外，绝缘层容易在使用的过程中逐渐老化，绝缘层由于老化的原因会与金属基板逐渐剥离，这样水汽等更容易从金属基板和绝缘层之间的缝隙内进入到透镜组件和印刷电路板之间的密闭空间内，进而影响LED元件的使用性能。另外，在其他材料基板的印刷电路板中也存在这样的问题，基板与上面的印刷电路层或其他层存在结合不紧密的问题。因此，在本发明实施例的LED模组中，通过密封件直接与基板连接(或粘结)，可以解决上述因基板与其上各层结合不紧密引起的问题。
本发明实施例中金属基板可为较厚的金属层，LED元件与金属基板之间仅隔着绝缘层和印刷电路层，其热传导的介质层数少，散热性能较好。例如，所述金属基板的厚度足以支撑所述LED元件以及其上的绝缘层以及印刷电路层。例如，根据本发明实施例的金属基板的厚度为1mm至4mm。对于其他的基板，如陶瓷基板或塑料基板，其厚度也可以为1mm至4mm。对于本发明实施例的LED模组，其透镜组件直接与印刷电路板的基板密封。在LED模组工作过程中产生的热量可以通过印刷电路板的基板散发出去，而可以不需要散热鳍片。
例如，本发明实施例的LED模组还包括用于电连接印刷电路层与外部电源的导线310。如图1、图2或图4所示，导线310的一端伸入到基板120的中心区域121以与印刷电路层电连接，并且穿过基板120的周边区域122(穿过周边区域122的密封件300)。导线310的另一端引出到密闭空间的外部，以与外部电源相连接。本发明实施例中，导线穿过透镜组件和底板之间的密封件(胶圈或粘结剂)与外部电源电连接。通过密封件与导线直接的紧密接触实现导线和密封件的密封。
图6是根据本发明实施例的LED模组的截面示意图；图7是图6中左侧圆圈示出的部分的局部放大示意图；图8是图6中右侧圆圈示出的部分的局部放大示意图；图9是根据本发明实施例的LED模组的卡线器的结构示意图。
参看图1、3和8，在透镜组件200面对底板100的一侧设置有环状凹槽210，该环状凹槽210可以用于容纳环状密封件300的至少一部分。例如，在 环状密封件300由胶水形成的情况下，在制作过程中可以将胶水添加到上述环状凹槽210中。另外，在一些示例中，如图8所示，在环状凹槽210的两侧还设置有多个溢胶槽220，便于胶水涂布和防止胶水溢出。例如，环状凹槽210和溢胶槽220对应于印刷电路板100的裸露的基板周边区域。然而，根据本发明的实施例并不限制于此，也可以仅在环状凹槽210的一侧设置有溢胶槽220或者不设置溢胶槽。例如，如图3所示，环状凹槽220的一部分可以具有更大的宽度和更深的深度，而该部分可以称为胶水池部分211。也就是说，胶水池211可以看作用于涂布胶水的凹槽210的一部分。凹槽的深度是指在垂直于透镜组件的方向上的尺寸，宽度是指在平行于透镜组件的平面内且垂直于凹槽的延伸方向的尺寸。
在胶水池211中可以设置有用于固定导线的卡线器320(请参照图2、图4、图6或图7)，卡线器320固定在胶水池211中。胶水池211中涂布有大量胶水(粘结剂)，将卡线器320和导线310淹没在胶水池211的胶水中，实现导线310和胶水之间的良好接触，使得胶水和导线321处的密封良好。胶水池211的作用是在其中盛放较大量的胶水，以使得在此放置导线310和/或卡线器320时胶水能够涂覆到导线310的周边，使得导线310与胶水紧密接触，防止导线310的位置移动影响密闭性能。
在一些实施例中，透镜组件上也可以没有用于盛放胶水的环形凹槽，而只有胶水池(用于盛放粘结剂的凹槽)。例如，所述透镜组件200和底板100的至少之一在周边部分具有用于盛放粘结剂的凹槽。
例如，用于盛放胶水(或粘结剂)的环状凹槽也可以设置在底板上或者设置在透镜组件和底板二者上(二者相面对的表面上)。
此外，参看图1、图2和图3，在透镜组件200上还可以设置有用于定位的定位销230，定位销230与印刷电路板上的定位孔140相对应。例如，定位销230可以插入到底板上的定位孔140中。在根据本发明的实施例中，定位销230内可以设有通孔260。LED模组可以通过该通孔260安装到灯壳上。
例如，透镜组件和/或底板(印刷电路板)还可以包括通孔，用于连接底板与外部部件(例如，灯壳)的紧固件的穿过。
在透镜组件面对底板的一侧还设置有用于布线的凹槽250，这样将从LED模组的印刷电路板引出的导线310可以设置在该凹槽250中，从而使得 LED模组更加美观。
在一些实施例中，如图3所示，透镜组件200还可以包括导线焊接槽270，例如，导线310与印刷电路层120焊接的位置可以对应于该导线焊接槽270。
例如，透镜组件200也包括中心区域和位于中心区域的周边区域。透镜部240位于所述透镜组件200的中心区域，而定位销230、用于涂布胶水的凹槽210、溢胶槽220、布线凹槽250、胶水池211等位于所述周边区域。在将透镜组件200和底板100对盒形成密闭的容置空间时，透镜组件200的中心区域与底板的基板110的中心区域111相对，透镜组件200上的透镜部240与底板100上的发光元件400相对应(例如，一一对应)，透镜组件200的周边区域与底板的基板110的周边区域112相对。因此，涂布的胶水(粘结剂)可以直接将基板110的裸露的表面与透镜组件粘结，从而避免因绝缘层或其他层与基板之间的界面或绝缘层(或其他层)本身影响密闭性能。
参看图2、图3、图4、图6、图7和图9，在本发明的一些实施例中，卡线器320包括第一卡线件321和第二卡线件322，第一卡线件321与底板100的基板110固定连接，在第一卡线件321上设置有一截面为半圆形(截面也可以为任意非封闭图形)的第一凹槽，第二卡线件322也设置有一截面为半圆形(截面也可以为任意非封闭图形)的与第一凹槽相匹配的第二凹槽。第一卡线件321和第二卡线件322固定连接，导线310穿过第一凹槽和第二凹槽，并卡设在第一卡线件321和第二卡线件322之间。如图9所示，第一卡线件的第一凹槽和第二卡线件的第二凹槽在第一卡线件和第二卡线件安装在一起后可以形成导线穿过孔323，导线310可以穿过导线穿过孔323。卡线器320在固定导线310的同时，避免了导线310与透镜组件200或者底板100相接触而导致导线310与胶水接触不良的问题，从而能够改善密封性能。
例如，第一卡线件321上设置有第一定位柱3211，通过定位柱3211与底板100的基板110连接，本发明实施例中通过第一定位柱3211与基板110的第一定位孔150之间过盈配合将第一卡线件321固定在基板110上。通过第二卡线件322上的第二定位柱(图中未示出)和第一卡线件321上的第二定位孔(图中未示出)之间的过盈配合将第一卡线件321和第二卡线件322固定连接。从而，实现了将导线310固定在底板100上。
在上述示例中，第一卡线件321与基板110的连接方式和第二卡线件322 与第一卡线件321之间的连接方式仅仅是示例性的，根据本发明的实施例不限于上述连接方式。
卡线器320可以固定在底板100的周边区域(也就是基板110的周边区域)，例如，基板110的未被绝缘层或印刷电路层覆盖的周边区域。
参考图9，卡线器320可为多个，且间隔连接在一起。例如，多个卡线器320可以在沿着导线延伸的方向排列且间隔设置。这样尽可能的使得导线在被卡线器320充分固定的同时还能与胶水充分接触，保证了导线的良好密封。
如图7所示，导线310穿过透镜组件200和底板100之间的卡线器320，从密闭空间延伸到密闭空间的外部。另外，在一个示例中，如图7所示，透镜组件200还可以包括挡线部260以用于遮挡引出的导线310。
将导线从胶水池211中引出，利用密封件(或粘接剂)直接密封导线，避免了导线310从透镜组件200或者是从底板100穿出需要进行二次密封的问题。并且，与导线从印刷电路板穿出的技术方案相比，无需在印刷电路板上设置有绝缘层和印刷电路的部分开孔将导线引出，减小了印刷电路板的制作难度，降低了生产成本。
上述以导线在所述透镜组件和所述LED元件底板之间从所述密闭空间延伸到所述密闭空间的外部为例进行了描述。但根据本发明的实施例不限于此，例如，导线可以通过所述透镜组件中的过孔从所述密闭空间延伸到所述密闭空间的外部。
另外，根据本发明的实施例LED元件与外部的电连接通过穿过密封件(粘结剂)的导线实现，导线从透镜组件和底板之间引出，避免了在底板或透镜组件设置用于导线穿过的过孔。此外，导线可以与胶水紧密接触，可以保证密闭性能。
在根据本发明的一些实施例中，透镜组件各透镜部与LED元件之间可以填充有透明胶体。LED元件发出的光经过LED元件的出光面后经过透镜部和LED元件之间的空间，再经过透镜部透射出去。透明胶体的折射率高于空气和透镜部，透镜部的折射率高于空气。当透镜部和LED元件之间没有填充胶体的时候，LED元件发出的光经过透镜部和LED元件之间的空间，即空气介质后再经由透镜部透射出去，LED元件发出的光经过折射率较低的空气 之后再经过比空气折射率高的透镜部透射出去；当透镜部和LED元件之间填充有透明胶体的时候，LED元件发出的光经过透镜部和LED元件之间的透明胶体后再经由透镜部透射出去，LED元件发出的光经过折射率较高的透明胶体之后再经过折射率较低的透镜部透射出去。当光从折射率较高的一面向折射率较低的介质传播的时候光效损失相比较于光从折射率较低的一面向折射率较高的介质传播时的光效损失要低。因此填充透明胶体后LED元件的出光效率较没有填充透明胶体的出光效率要高。
透镜部的凹坑内也可以不填充透明胶体。填充胶体的方式可以是在整个透镜与PCB板之间的空间内填充胶体，也可以只是在透镜部的凹坑处填充胶体。
另外，如图6所示的，透镜组件200的部分可以与底板100接触，而仅在透镜部240的部分留出容纳LED元件的空间。然而，根据本发明实施例的LED模组不限于此，透镜组件200也可以不与底板100直接接触。
与印刷电路板设置在透镜组件、底板和密封胶之间的结构相比，本发明实施例中将印刷电路板的基板延伸到密封件的外围，增大了印刷电路板的基板(例如，金属基板)的面积，即增大了散热面积，有利于散热。
本发明实施例中的LED模组，透镜组件与印刷电路板固定连接。在将LED模组安装到灯壳上时，LED模组的印刷电路板的基板(例如金属基板)的背面与灯壳相贴合。LED元件产生的热量通过印刷电路板的基板传导到灯壳上。由于LED灯具的灯壳一般为金属材料，基板的热量在传导到灯壳上后通过灯壳散发到空气中，即利用LED灯具的灯壳进行散热。相比较于现有的LED模组，由于LED灯壳与空气的接触面积较大，使得LED模组的散热条件较现有的设置有LED模组的灯壳，其热传导条件更为优良。另外，无需在LED模组上设置单独的散热器，LED模组的结构简单，避免制作形状结构复杂的散热器，节省了材料，降低了模组的重量，节省了成本。
另外，本发明实施例中的LED模组与灯壳相贴合(例如面贴合、面接触)，相对现有的设置有LED模组的灯具而言，灯壳内部空腔的尺寸更小，其灯具结构更紧凑，灯壳的重量减小，节省灯壳材料，降低了成本。
本发明的实施例还提供了LED模组的制作方法(安装方法)。
在一个示例中，安装顺序如下：将LED元件与底板电连接；将导线用卡 线器固定；将导线与底板焊接；将卡线器固定在底板上；将透镜组件的凹坑面(与底板相面对的面)朝上，并将胶水涂布在透镜组件的用于盛放胶水的凹槽中；通过透镜组件上的定位销穿过PCB板上的定位孔，并将透镜组件和PCB板盖合在一起；将LED模组放置到设置有散热器的夹具上，并将PCB板的金属层与夹具上的散热器相贴合，并用夹具夹紧LED模组老化。
再另外一个示例中，安装顺序如下：将LED元件与PCB板电连接；将卡线器的第一卡线件固定在底板上；将导线与底板焊接；将导线固定在第一卡线器上；将第二卡线器与第一卡线器盖合，将导线固定在卡线器中；将透镜组件的凹坑面(与底板相面对的面)朝上，并将胶水涂布在透镜组件的胶水槽中；通过透镜组件上的定位销穿过底板上的定位孔，并将透镜组件和底板盖合在一起；将LED模组放置到设置有散热器的夹具上，并将底板的金属层与夹具上的散热器相贴合，并用夹具夹紧LED模组老化。
上述制作步骤仅仅为根据本发明实施例的一些示例性步骤。总体来说，根据本发明实施例的LED模组的制作方法可以包括以下步骤：将LED元件连接到底板的步骤；将导线与底板电连接(例如，与印刷电路板上的印刷电路层电连接)的步骤；将所述透镜组件和所述印刷电路板彼此相对设置并在所述透镜组件和所述印刷电路板之间设置环状密封件的步骤。这些步骤中除最后一步外，其他步骤的顺序没有特别限制。另外，根据本发明实施例的制作方法还可以包括如上述示例中示出的一些其他步骤。
上述步骤仅为示例性的，例如，上述在透镜组件和印刷电路板相对设置并在其间设置密封件的步骤可以是先在透镜组件和印刷电路板的至少之一上设置密封件，再将透镜组件与印刷电路板对盒。
根据本发明的实施例还提供一种灯具，包括灯壳和LED模组，灯壳包括一腔体，LED模组固定在该腔体内。
在一些实施例中，灯具还包括电源组件，该电源组件通过导线与LED模组电连接，用于给LED模组供电。例如，该电源组件设置在该灯壳内。
例如，上述腔体可以为密封腔体。
例如，该灯具包括的LED模组可以为根据本发明任一实施例的LED模组。
例如，所述灯壳包括下盖和上盖，所述下盖包括透明区域以供所述LED 模组发出的光透过，所述LED模组固定在所述上盖上。
例如，所述LED模组的底板与所述上盖面接触。由于LED的底板中的基板可以与灯具的上盖面接触，因此，有利于LED元件工作时产生的热量通过灯具的上盖散发出去。另外，在底板为金属基印刷电路板的情况下，作为底板的基板的金属基板与上盖接触后，更有利于LED模组使用过程中发出的热量通过金属基板和上盖散发出去。
例如，所述灯壳还包括转轴组件，所述上盖和所述下盖可以绕着所述转轴组件旋转。
例如，所述灯壳的所述上盖为可拆卸的结构。
图10示出了一种示例性的结构，根据本发明的实施例的LED灯具包括灯壳、LED模组10和电源组件21。灯壳为一中空的密封腔体，LED模组10和电源组件21固定在该密封的腔体内。电源组件21通过导线与LED模组10电连接，用于给LED模组供电。
LED模组10为上述任意实施例的LED模组。
例如，灯壳包括下盖12、上盖11和转轴组件23。上盖11和下盖12通过转轴组件23转动连接，使得上盖11和下盖23可绕着转轴组件23相对旋转。上盖11和下盖12在盖合的状态下，上盖11和下盖12之间形成一密封腔体，上盖11和下盖12盖合处还设置有一圈密封圈19，保证上盖11和下盖12之间的密封性。
例如，LED模组10和电源组件21通过紧固件固定在上盖11上。
在下盖12与LED模组10相对的位置处设置有一与LED模组10出光面相对应的开口。在开口处还设置有一透光板18，在下盖开口和透光板18之间还设置有密封圈15，在下盖12上还设置有多个压片14，各压片14将透光板18固定在下盖12上，且使得密封圈15在透光板18和下盖12之间发生弹性形变，将下盖12上的开口密封。透光板18可以为钢化玻璃，LED模组发出的光经过透光板18从灯壳内部透射出来。
本发明实施例中LED模组置于灯壳内部，整个灯壳形成一个密封的腔体。与原有的在灯壳上开设有许多通风孔或者其他通风结构的带有模组的灯具相比，密闭的灯壳内不易积尘、水不易进入。对设置在灯壳内的元器件如电源组件和LED模组等有良好的保护。
本发明实施例中电源组件和LED模组均固定在上盖上，上盖和下盖之间通过铰链固定连接。可徒手转动铰链将上盖与下盖松开，并将上盖通过转轴组件绕着下盖转动，当上盖相对下盖转动到一定角度的时候，可将上盖与下盖分离。电源组件和LED模组均安装在上盖上，在灯具组装时，可先将电源组件和LED模组安装到上盖上，再将上盖与LED模组以及电源组件等以一个整体安装在下盖上，便于安装。在灯具维护时，可将上盖、LED模组以及电源组件作为一个整体从灯具上拆下，而不需要将整个灯具从灯杆上拆下，便于灯具维护。
下盖上还设置有灯杆安装部，以及与灯杆安装部相对应的灯杆转接件13。具体的灯杆安装部上设置有多个第一齿状凸起，在灯杆转接件13上设置有多个与第一齿状凸起相对应的第二齿状凸起，第一齿状突起和第一齿状突起相啮合。通过第一齿状凸起和第二齿状凸起啮合的位置不同，调整灯杆转接件和灯杆安装部之间的安装角度，进而调整个灯具安装到灯杆后的角度。
例如，本申请中的LED模组设置在密封的灯壳中，LED模组的底板可以直接与灯壳贴合。LED模组产生的热量可以经由底板传递到灯壳上散发，灯壳上不需要散热鳍片进行散热。然而，根据本发明的实施例不限于此，本申请中的LED模组也可以直接设置在非密封的灯壳上。
在根据本发明实施例的灯具中，LED模组的底板可以与灯壳的上盖面接触，由于LED模组的底板可以为金属基印刷电路板，LED模组工作时产生的热量可以通过金属基印刷电路板的金属基板传导到LED模组的上盖，并将热量散发出去。例如，上盖可以由导热性良好的材料(例如金属)制成。
在根据本发明的实施例中，在将LED模组安装到灯壳中时，底板一侧面向上盖，透镜组件一侧面向下盖，从而LED模组发出的光可以从下盖的透明区域发出。
此外，在图10所示的示例中，还示出了一些其他的部件，比如，光控26、光控底座25、挂钩27、挂钩弹簧28、防雷器22、呼吸器17、过线圈16、控制器20、开盖断电开关24等部件。该图中所示出的某些部件是可以根据实际需要被替换或省略的，也可以根据需要添加其他的部件。
根据本发明的一些实施例提供一种发光二极管(LED)模组，包括至少一个LED元件；用于支撑LED元件的LED元件底板；设置在LED元件出 光面上方的透镜组件，透镜组件上设置有至少一个透镜部，以及设置在透镜组件和LED元件底板之间的胶圈，LED元件位于透镜组件、LED元件底板和胶圈形成的密闭空间内。
在一些示例中，每个透镜部与一个LED元件相对应，用于与之相对应的LED元件的配光。
在一些示例中，所述LED元件底板为金属基印刷电路板。
在一些示例中，所述金属基印刷电路板包括金属板以及形成在所述金属板上的绝缘层以及印刷电路层。
在一些示例中，所述印刷电路层形成在所述绝缘层上以与所述金属板电绝缘。
在一些示例中，所述金属板的表面包括中心区域和位于所述中心区域周边的周边区域，所述绝缘层和所述印刷电路层仅形成在所述金属板的表面的中心区域，所述金属板的表面的所述周边区域没有被所述绝缘层覆盖。
在一些示例中，所述金属板的厚度足以支撑所述LED元件以及其上的绝缘层以及印刷电路层。
在一些示例中，所述LED元件设置在所述金属基印刷电路板上并与所述印刷电路层电连接。
在一些示例中，所述金属板为板状构件，例如，可以为平板状构件。
在一些示例中，所述胶圈与所述金属板的未被所述绝缘层覆盖的表面以及所述透镜组件直接接触。
在一些示例中，所述胶圈设置在所述绝缘层的外围。
在一些示例中，所述胶圈为液态粘结剂经过固化而形成，将所述底板和所述透镜组件粘结在一起，以形成所述密闭空间。
在一些示例中，所述透镜组件和所述底板具有供定位件或固定件穿过的孔或者缺口。
在一些示例中，在所述透镜组件的面向所述底板的一侧具有环形凹槽，所述胶圈设置在所述环形凹槽中。
在一些示例中，所述胶圈设置在所述环形凹槽中。
在一些示例中，所述环形凹槽的一侧或两侧还设置有至少一个溢胶槽。
在一些示例中，所述环形凹槽包括深度和宽度均比其他部分大的胶水池 部分。
在一些示例中，所述的LED模组还包括导线，所述导线从所述密闭空间穿过所述胶圈延伸到所述密闭空间的外部。
在一些示例中，所述的LED模组还包括卡线器，所述卡线器设置在所述透镜组件和所述底板之间并位于所述胶圈中，所述导线穿过所述卡线器。
在一些示例中，所述卡线器设置在所述胶水池的位置处。
在一些示例中，所述卡线器包括第一卡线件和第二卡线件，第一卡线件和第二卡线件在相互面对的表面上设置有彼此对应的凹槽以在彼此叠合时形成孔，所述导线从所述孔穿过。
在一些示例中，所述第一卡线件固定在所述底板的金属板的未被绝缘层覆盖的周边区域。
在一些示例中，所述第一卡线器包括第一定位柱，通过所述第一定位柱与所述底板的金属板连接。
在一些示例中，所述的LED模组还包括设置在所述透镜组件上的定位销，用于插入到底板上的定位孔。
在一些示例中，所述透镜组件的各透镜部与所述LED元件之间填充有透明胶体。
在一些示例中，所述透明胶体的折射率高于空气和透镜部的折射率。
根据本发明的另外一些实施例提供一种LED模组的制作方法，包括：
将LED元件连接到PCB板；
将导线与PCB板电连接；
在透镜组件上涂布粘结剂并将透镜组件和PCB板结合。
在一些示例中，所述LED元件底板为金属基印刷电路板，所述金属基印刷电路板包括金属板以及形成在所述金属板上的绝缘层以及印刷电路层，
在一些示例中，所述金属板的表面包括中心区域和位于所述中心区域周边的周边区域，所述绝缘层和所述印刷电路层仅形成在所述金属板的表面的中心区域，所述金属板的表面的所述周边区域没有被所述绝缘层覆盖。
在一些示例中，在将所述透镜组件和所述底板结合时，涂布在所述透镜组件上的粘结剂与所述金属板的未被绝缘层覆盖的周边区域对应。
根据本发明的另外一些实施例提供一种灯具，包括灯壳和LED模组，灯 壳包括一腔体，所述LED模组固定在该腔体内，其中所述LED模组为上述任一项所述的LED模组。
在一些示例中，所述的灯具还包括电源组件，通过导线与LED模组电连接，用于给LED模组供电。
在一些示例中，所述腔体为密封腔体。
在一些示例中，所述LED模组的底板与所述灯壳的至少一部分面接触。
在一些示例中，所述灯壳包括下盖和上盖，所述下盖包括透明区域以供所述LED模组发出的光透过，所述LED模组固定在所述上盖上。
在一些示例中，所述LED模组的底板与所述上盖面接触。
在一些示例中，所述灯壳还包括转轴组件，所述上盖和所述下盖可以绕着所述转轴组件旋转。
在一些示例中，所述灯壳的所述上盖为可拆卸的结构。
以上所述仅是本发明的示范性实施方式，而非用于限制本发明的保护范围，本发明的保护范围由所附的权利要求确定。
本申请要求于2016年3月11日递交的中国专利申请第201610140714.1号的优先权，在此全文引用上述中国专利申请公开的内容以作为本申请的一部分。

Claims (32)

  1. 一种发光二极管模组，包括：
    至少一个发光二极管元件；
    用于支撑所述发光二极管元件的底板；
    设置在所述发光二极管元件的出光面侧的透镜组件；以及
    设置在所述透镜组件和所述底板之间的环状密封件，
    其中，所述发光二极管元件位于所述透镜组件、所述底板和所述环状密封件形成的密闭空间内。
  2. 根据权利要求1所述的发光二极管模组，其中，所述底板为印刷电路板。
  3. 根据权利要求1或2所述的发光二极管模组，其中，所述环状密封件分别与所述透镜组件和所述底板直接接触，以在所述透镜组件和所述底板之间形成所述密闭空间。
  4. 根据权利要求2所述的发光二极管模组，其中，所述印刷电路板包括基板和形成在所述基板的面对所述透镜组件一侧的印刷电路层。
  5. 根据权利要求4所述的发光二极管模组，其中，所述基板包括中心区域和围绕所述中心区域的周边区域，所述印刷电路层仅形成所述基板的中心区域中。
  6. 根据权利要求5所述的发光二极管模组，其中，所述基板为金属基板、陶瓷基板和塑料基板至少之一。
  7. 根据权利要求6所述的发光二极管模组，其中，所述基板为金属基板，且在所述印刷电路层和所述基板之间还包括绝缘层。
  8. 根据权利要求7所述的发光二极管模组，其中，所述绝缘层仅位于所述基板的中心区域中，且所述绝缘层包括中心区域和围绕所述中心区域的周边区域，所述印刷电路层形成在所述绝缘层的中心区域中。
  9. 根据权利要求5所述的发光二极管模组，其中，所述环状密封件位于所述基板的周边区域以与所述基板直接接触。
  10. 根据权利要求4所述的发光二极管模组，其中，所述发光二极管与所述印刷电路层电连接。
  11. 根据权利要求1-10中任一项所述的发光二极管模组，其中，在所述透镜组件的面向所述底板的一侧具有环形凹槽，所述环状密封件的至少一部分设置在所述环形凹槽中。
  12. 根据权利要求11所述的发光二极管模组，其中，所述环形凹槽包括深度和宽度均比其他部分大的胶水池部分。
  13. 根据权利要求1-12中任一项所述的发光二极管模组，还包括导线，所述导线从所述密闭空间穿过所述环状密封件延伸到所述密闭空间的外部。
  14. 根据权利要求13所述的发光二极管模组，还包括卡线器，所述卡线器设置在所述透镜组件和所述底板之间并位于所述环状密封件中，所述导线穿过所述卡线器。
  15. 根据权利要求14所述的发光二极管模组，其中，所述卡线器设置在所述胶水池的位置处。
  16. 根据权利要求14或15所述的发光二极管模组，其中，所述卡线器包括第一卡线件和第二卡线件，所述第一卡线件和所述第二卡线件在相互面对的表面上设置有彼此对应的凹槽以在彼此叠合时形成供导线穿过的孔。
  17. 根据权利要求16所述的发光二极管模组，其中，所述第一卡线件固定在所述底板上。
  18. 根据权利要求1-17中任一项所述的发光二极管模组，其中所述透镜组件上设置有至少一个透镜部，每个透镜部与一个发光二极管元件相对应，用于与之相对应的发光二极管元件的配光。
  19. 根据权利要求18所述的发光二极管模组，其中，所述透镜组件的各透镜部与所述发光二极管元件之间填充有透明胶体。
  20. 根据权利要求19所述的发光二极管模组，其中，所述透明胶体的折射率高于空气和所述透镜部的折射率。
  21. 根据权利要求4所述的发光二极管模组，其中，所述印刷电路板的基板的厚度在1至4毫米的范围内。
  22. 根据权利要求1所述的发光二极管模组，其中，所述发光二极管模组不包括散热鳍片。
  23. 一种发光二极管模组的制作方法，包括：
    将发光二极管元件连接到印刷电路板；
    将导线与印刷电路板电连接；
    将所述透镜组件和所述印刷电路板彼此相对设置并在所述透镜组件和所述印刷电路板之间设置环状密封件，从而在所述透镜组件和所述底板之间由所述环状密封件包围的部分形成密闭空间，所述发光二极管元件位于所述密闭空间内。
  24. 根据权利要求23所述的制作方法，其中所述印刷电路板包括基板和形成在所述基板上的印刷电路层，所述基板包括中心区域和围绕所述中心区域的周边区域，所述印刷电路层仅位于所述基板的中心区域中。
  25. 根据权利要求24所述的制作方法，其中在将所述透镜组件和所述印刷电路板结合时，所述环状密封件对应于所述基板的周边区域，且与所述基板直接接触。
  26. 一种灯具，包括灯壳和发光二极管模组，所述灯壳包括一腔体，所述发光二极管模组固定在该腔体内，其中所述发光二极管模组为权利要求1-22中任一项所述的发光二极管模组。
  27. 根据权利要求26所述的灯具，还包括设置于所述腔体内的电源组件，所述电源组件通过导线与所述发光二极管模组电连接。
  28. 根据权利要求26或27所述的灯具，其中，所述腔体为密封腔体。
  29. 根据权利要求26-28中任一项所述的灯具，其中，所述发光二极管模组的底板与所述灯壳的至少一部分面接触。
  30. 根据权利要求26-29中任一项所述的灯具，所述灯壳包括下盖和上盖，所述下盖包括透明区域以供所述发光二极管模组发出的光透过，所述发光二极管模组固定在所述上盖上。
  31. 根据权利要求26-30中任一项所述的灯具，其中所述灯壳还包括转轴组件，所述上盖和所述下盖被配置为能够绕着所述转轴组件旋转。
  32. 根据权利要求30所述的灯具，其中所述灯壳的所述上盖为可拆卸的结构。
PCT/CN2017/076320 2016-03-11 2017-03-10 发光二极管模组及其制作方法和灯具 WO2017152879A1 (zh)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP17762565.4A EP3425263A4 (en) 2016-03-11 2017-03-10 LED MODULE AND MANUFACTURING METHOD THEREFOR, AND LAMP
JP2018547960A JP6678249B2 (ja) 2016-03-11 2017-03-10 発光ダイオードモジュール及びその製造方法並びに灯具
US16/082,819 US10641466B2 (en) 2016-03-11 2017-03-10 Light emitting diode module and manufacturing method therefor, and lamp

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201610140714 2016-03-11
CN201610140714.1 2016-03-11

Publications (1)

Publication Number Publication Date
WO2017152879A1 true WO2017152879A1 (zh) 2017-09-14

Family

ID=59788984

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2017/076320 WO2017152879A1 (zh) 2016-03-11 2017-03-10 发光二极管模组及其制作方法和灯具

Country Status (5)

Country Link
US (1) US10641466B2 (zh)
EP (1) EP3425263A4 (zh)
JP (1) JP6678249B2 (zh)
CN (4) CN206973339U (zh)
WO (1) WO2017152879A1 (zh)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017152879A1 (zh) * 2016-03-11 2017-09-14 杭州华普永明光电股份有限公司 发光二极管模组及其制作方法和灯具
US10222038B2 (en) * 2017-04-04 2019-03-05 Hubbell Incorporated Luminaire conforming accessory interface
US10836318B2 (en) * 2017-10-16 2020-11-17 SMR Patents S.à.r.l. Logo lamp assembly and method of using same
CN108019635A (zh) * 2017-11-07 2018-05-11 江苏欧惠达光电节能科技有限公司 多功率通用透镜
CN110928123A (zh) * 2018-09-19 2020-03-27 青岛海信激光显示股份有限公司 一种激光器阵列、激光光源及激光投影设备
WO2020057124A1 (zh) 2018-09-19 2020-03-26 青岛海信激光显示股份有限公司 一种激光器阵列、激光光源及激光投影设备
EP3899366B1 (en) * 2018-12-18 2022-05-18 Signify Holding B.V. A lighting device
US10655838B1 (en) * 2019-02-28 2020-05-19 Valoya Oy Lighting element and a method for manufacturing a lighting element
CN110131695B (zh) * 2019-05-17 2021-05-11 杭州华普永明光电股份有限公司 一种led模组密封工艺
USD950110S1 (en) * 2019-05-29 2022-04-26 Nanolumens Acquisition, Inc. Light emitting display module with diffusely reflective facade
JP7407571B2 (ja) * 2019-11-28 2024-01-04 三菱電機株式会社 照明装置
CN212510541U (zh) * 2020-06-03 2021-02-09 杭州华普永明光电股份有限公司 照明模块和照明装置
CN215831708U (zh) 2021-04-30 2022-02-15 伊顿智能动力有限公司 用于严苛和危险环境的led照明组件的led模块
CN113586988B (zh) * 2021-07-16 2023-08-04 浙江双宇电子科技有限公司 一种可同步调光调色的交流两线led高压灯串
CN113611585A (zh) * 2021-07-20 2021-11-05 浙江双宇电子科技有限公司 一种具有光感和定时功能的高压控制盒及其控制方法
USD1039996S1 (en) * 2021-11-12 2024-08-27 Autel Intelligent Technology Corp., Ltd. Accessory for calibrator
USD1026695S1 (en) * 2021-11-12 2024-05-14 Autel Intelligent Technology Corp., Ltd. Accessory for calibrator
CN116928610B (zh) * 2022-04-11 2024-09-06 深圳市绎立锐光科技开发有限公司 光源系统及发光设备

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201973590U (zh) * 2011-04-01 2011-09-14 深圳市证通佳明光电有限公司 一种可防水的led路灯
CN102364685A (zh) * 2011-06-17 2012-02-29 杭州华普永明光电股份有限公司 一种无引线的led模组及其制造工艺
US20120106174A1 (en) * 2010-10-29 2012-05-03 Ecolighting, Inc Corp. Lamp with double water resistance structure
CN202733519U (zh) * 2012-06-14 2013-02-13 欧司朗股份有限公司 发光模块和包括该发光模块的照明装置
CN203703908U (zh) * 2013-11-08 2014-07-09 杭州华普永明光电股份有限公司 一种led模组
CN104121494A (zh) * 2013-04-25 2014-10-29 深圳市海洋王照明工程有限公司 Led光源模组

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3390661B2 (ja) * 1997-11-13 2003-03-24 三菱電機株式会社 パワーモジュール
JP3458809B2 (ja) * 2000-02-02 2003-10-20 住友金属鉱山株式会社 プリント配線板及びその製造方法
JP2007213881A (ja) 2006-02-08 2007-08-23 Aristo Engineering Pte Ltd 照明装置ユニット、照明装置及び照明装置機構
CN101469852A (zh) * 2007-12-29 2009-07-01 富准精密工业(深圳)有限公司 发光二极管灯具
CN201203017Y (zh) * 2008-04-24 2009-03-04 周丽玲 一种应用于水族箱照明及生态的led灯具
GB2473185B (en) 2009-08-28 2012-05-30 Ocean Led Ltd Luminaire
JP2011222333A (ja) * 2010-04-09 2011-11-04 Dainippon Printing Co Ltd 熱伝導性封止部材およびそれにより封止された電子デバイス
CN102444793A (zh) * 2010-10-07 2012-05-09 富准精密工业(深圳)有限公司 发光二极管灯具
KR101228612B1 (ko) 2011-03-07 2013-01-31 대양산업(주) 다수의 확산렌즈를 구비한 엘이디 가로등 유닛
CN202032396U (zh) * 2011-03-16 2011-11-09 浙江耀恒光电科技有限公司 Led道路照明灯具模组
CN202074464U (zh) * 2011-04-03 2011-12-14 东莞市星晖光电有限公司 一种大功率集成灯珠
CN202111089U (zh) * 2011-06-22 2012-01-11 浙江英特来光电科技有限公司 可调光调色cobled结构
JP3171377U (ja) * 2011-08-18 2011-10-27 深▲川▼市耐比光電科技股▲分▼有限公司 発光ダイオード防爆灯
CN103017054B (zh) * 2011-09-21 2015-05-20 海洋王照明科技股份有限公司 一种照明灯具
CN103094425A (zh) * 2011-11-04 2013-05-08 杭州华普永明光电股份有限公司 Led模组的制造工艺及led模组
CN102612261A (zh) * 2011-11-20 2012-07-25 葛豫卿 一种高导热金属基印刷电路板及其制备方法
JP2014165039A (ja) * 2013-02-26 2014-09-08 Pioneer Electronic Corp 発光素子
CN203082721U (zh) 2013-03-22 2013-07-24 温州市子夜照明科技有限公司 改进型led灯具
DE102013104240B4 (de) * 2013-04-26 2015-10-22 R. Stahl Schaltgeräte GmbH Explosionsgeschützte Anordnung elektrischer und/oder elektronischer Bauelemente
JP2015002032A (ja) 2013-06-14 2015-01-05 株式会社朝日ラバー 透光防水カバーレンズ
KR102108204B1 (ko) * 2013-08-26 2020-05-08 서울반도체 주식회사 면 조명용 렌즈 및 발광 모듈
JP6041167B2 (ja) * 2015-06-01 2016-12-07 東芝ライテック株式会社 照明装置
WO2017152879A1 (zh) * 2016-03-11 2017-09-14 杭州华普永明光电股份有限公司 发光二极管模组及其制作方法和灯具

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120106174A1 (en) * 2010-10-29 2012-05-03 Ecolighting, Inc Corp. Lamp with double water resistance structure
CN201973590U (zh) * 2011-04-01 2011-09-14 深圳市证通佳明光电有限公司 一种可防水的led路灯
CN102364685A (zh) * 2011-06-17 2012-02-29 杭州华普永明光电股份有限公司 一种无引线的led模组及其制造工艺
CN202733519U (zh) * 2012-06-14 2013-02-13 欧司朗股份有限公司 发光模块和包括该发光模块的照明装置
CN104121494A (zh) * 2013-04-25 2014-10-29 深圳市海洋王照明工程有限公司 Led光源模组
CN203703908U (zh) * 2013-11-08 2014-07-09 杭州华普永明光电股份有限公司 一种led模组

Also Published As

Publication number Publication date
CN206943825U (zh) 2018-01-30
CN107178711A (zh) 2017-09-19
JP6678249B2 (ja) 2020-04-08
US10641466B2 (en) 2020-05-05
CN107178729B (zh) 2023-10-20
CN107178711B (zh) 2023-06-13
EP3425263A4 (en) 2019-11-20
CN206973339U (zh) 2018-02-06
US20190032898A1 (en) 2019-01-31
EP3425263A1 (en) 2019-01-09
JP2019509598A (ja) 2019-04-04
CN107178729A (zh) 2017-09-19

Similar Documents

Publication Publication Date Title
WO2017152879A1 (zh) 发光二极管模组及其制作方法和灯具
TWI567334B (zh) 照明裝置
JP6021863B2 (ja) 電気機器
TWI408310B (zh) 照明裝置及其製造方法
WO2005091386A1 (ja) 照明装置
EP3182471B1 (en) Light source module
JP5570018B2 (ja) Ｌｅｄモジュール
JP2006344978A (ja) Ｌｅｄパッケージ及びその製造方法、並びにそれを利用したｌｅｄアレイモジュール
US20080266869A1 (en) LED module
JP4981600B2 (ja) 照明器具
US20130001613A1 (en) Light emitting diode package and method for making the same
JP2012182192A (ja) Ｌｅｄユニットおよびそれを用いた照明器具
JP6290518B1 (ja) Ｌｅｄモジュール及び封着方法
EP2317206A1 (en) Illuminating device and method for manufacturing the same
JP3215065U (ja) Ｌｅｄ照明器具
EP3116039B1 (en) Light source module, fabrication method therefor, and lighting device including the same
TWM426882U (en) Detachable LED modular structure with high thermal conductivity and optical performance
KR101613582B1 (ko) 엘이디 모듈
TWM483546U (zh) Ｌｅｄ燈管
KR100887713B1 (ko) 발광장치
KR20140090784A (ko) 조명 장치
KR20140074691A (ko) 조명 장치
KR20150017596A (ko) 발광 소자 및 조명 시스템

Legal Events

Date Code Title Description
ENP Entry into the national phase

Ref document number: 2018547960

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

WWE Wipo information: entry into national phase

Ref document number: 2017762565

Country of ref document: EP

ENP Entry into the national phase

Ref document number: 2017762565

Country of ref document: EP

Effective date: 20181005

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 17762565

Country of ref document: EP

Kind code of ref document: A1