M426882 五、新蜜説明： 【新型所屬之技術領域】 本創作係為一種高導熱可拆卸式具光學性能之led模組 結構，其特別為一種知'明用之面導熱可拆卸式具光學性能之 LED模組結構。 【先前技術】 方之透鏡I3與封裝體I4逸散至環境中 以及黏著用的樹脂ls傳遞至電路板 第1圖為習知之一種LED燈具結構中LED與電路板結合 方式之結構系意圖。如第1圖所示，習知之LED燈具結構中， LED 1 〇〇係以黏著或銲接的方式被固定在電路板16上，並且 以使用銲錫銲接的方式使LED 100之接腳n與電路板16 上之電路17達成電性連接以獲得電力供應。而LED晶片12 在工作過程中所產生的熱能，則是一部分透過LED晶片12上M426882 V. New Honey Description: [New Technology Field] This creation is a high thermal conductivity detachable optical module with LED performance. It is specially designed for the purpose of heat conduction and detachable optical performance. LED module structure. [Prior Art] The lens I3 and the package I4 are dissipated into the environment and the resin ls for adhesion is transferred to the circuit board. Fig. 1 is a schematic diagram of the structure in which the LED and the circuit board are combined in a conventional LED lamp structure. As shown in Fig. 1, in the conventional LED lamp structure, the LED 1 is fixed to the circuit board 16 by adhesion or soldering, and the pin 100 of the LED 100 and the circuit board are soldered. The circuit 17 on 16 is electrically connected to obtain a power supply. The thermal energy generated by the LED chip 12 during operation is partially transmitted through the LED chip 12.
〒’另一部分透過接腳11 16上’再經由電路板16 100時，組 〈黏著或銲接的方式被固定在電路 式與電路板16上的電路17達成 ^具中具有多個LED 100時，組 十接多個LED 1〇〇的步驟，於是整 #接的方式被固定在電路 b LED燈具中有個別led 1作自然變得極不容易， M426882 甚至可能根本無法進行維修，而需一併更換新的電路板16並 重新裝設新的LED 100。 至於LED 100在工作中所產生的熱能，由於大部分只能經 由導熱截面極小的接腳11以及導熱係數較差的黏著用樹脂15 傳遞至電路板16，再透過導熱係數也不是很好的電路板16逸 散到環境中，因此散熱效果並不是很好。除了容易造成LED 燈具溫度過高，進而影響到LED晶片12的發光性能外，也很 容易縮短LED晶片12的工作壽命。 經由以上的說明，可知習知的LED燈具結構不論是在製 造組裝以及維修更換的難易度上，或者是在散熱技術及元件壽 命方面，都存在了許多亟待解決的課題。 【新型内容】 本創作為一種高導熱可拆卸式具光學性能之LED模組結 構，其包括：本體可拆卸式支架、電路基板；以及LED。本創 作主要是要使LED與電路基板產生活動式可分離的結合關 係，並藉此能方便後續之更換或損壞時之維修；並且可達到外 殼燈具之永久使用的目的。 本創作提供一種高導熱可拆卸式具光學性能之LED模組 結構，其包括：一電路基板，其包括複數個結合單元，每一結 合單元包括：一結合螺孔；及一組第一導電板，其分別設置於 結合螺孔兩側；以及複數顆LED，一對一結合於該些結合單 元，每一 LED包括：一基座單元，其包括：一導熱螺桿，其 具有一結合部及一第一導熱接點；一組導電支架，設置於導熱 M426882 螺桿之兩側，並且該組導電支架具有一組腳架部及一組第二導 電板；及一封膠體，其具有：一底板，其包覆導熱螺桿及該組 導電支架，使導熱螺桿及該組導電支架分別裸露結合部及該組 腳架部於底板的下方側，又分別裸露第一導熱接點及該組第二 導電板於底板的上方側，其中結合部可分離的與結合螺孔結 - 合，又該組腳架部接觸式的與該組第一導電板電性連接；及一 側板，係由底板之端部向上延伸並環繞形成有一中空空間；以 鲁及一 LED單元，容置於中空空間中，其包括：一導熱基板， 其具有一第一表面及一第二表面，第二表面形成有一第二導熱 接點與第一導熱接點導熱結合，又形成有一組第三導電板與該 組第二導電板電性連接；一 LED晶片，固設且導熱結合於第 一表面，又電性連接於該組第二導電板；及一透鏡，封裝於中 空空間並覆蓋LED晶片。 本創作又提供一種電路基板結構，係用於如前述之高導熱 可拆卸式具光學性能之LED模組結構中，電路基板結構包括複 •數個結合單元，每一結合單元包括：一結合螺孔；以及一組第 一導電板，其分別設置於結合螺孔兩側。 本創作再提供一種LED結構，係用於前述之高導熱可拆 卸式具光學性能之LED模組結構中，其中LED模組包括：一 基座單元，其包括：一導熱螺桿，其具有一結合部及一第一導 熱接點；一組導電支架，設置於導熱螺桿之兩側，並且該組導 電支架具有一組腳架部及一組第二導電板；及一封膠體，其具 有：一底板，其包覆導熱螺桿及該組導電支架，使導熱螺桿及 該組導電支架分別裸露結合部及該組腳架部於底板的下方 5 财26882 側，又分別裸露第—導熱接點及該組第二導電板於底板的上方 側；及一側板，係由底板端部向上延伸並環繞形成有一令空允 間；以及一 LED單元，容置於中空空間中，其包括：一導熱 基板，其具有一第一表面及一第二表面，第二表面形成有一第 〜導熱接點與第一導熱接點導熱結合，又形成有—組第二導電 板與該組第二導電板電性連接；一 LED晶片，固設且導熱绊 合於第一表面’又電性連接於該組第二導電板；及一透鏡，、 裝於中空空間並覆蓋led晶片。 兄、 藉由本創作的實施，至少可達到下列進步功效： 、可使LED能與電路基板進行快速組裝及維修。 、可使LED具有良好之散熱效果以維持穩定之照明輸出 延長LED晶片之工作壽命。 ’:, 並且可達到外殼燈具之永久使用的目的。 以 式 Wh #«»»〇 Wh ^了使^熟習相關技藝者了解本創作之技 且根據本說明書所揭露之内容、申請專利範圍及: ，任何熟習《技藝者可^寻心圍及3 ’因此將在實施方式中^^^㈣㈣之目的及領 。 咩旧敘述本創作之詳細特徵以及偵 【實施方式】 第2圖為本創作實施例一古 之LED模組結構之立體圖 拆卸式具光學性能 路基板俯視圖。第4A圖為太L圖為本創作實施例之-種電 式具光學性能之狀—種高導熱可拆卸 ，、且結構之分解圖。第4B圖為本創作實 ^之-種尚導熱可拆卸式具光學性能之LED模組之結 D圖。 如第2 ®及第3圖所示’本實施例為—種高導熱可拆卸式 二子丨生此之LED模組結構2°° ’其包括：一電路基板20 ; 及複數顆LED 30。 電路基板20可以為―紹基板或—銅基板，其功能在於作 夏BD 30安裝固定之基座，並且其中還可安裝或容納供應燈 二作所需之電麟、控制線或其他電子電路元件。電路基板 括複數個結合單元21 ’其作用在於提供個別LED 30與電 土板20結合並且被固定的機構，以及個別lED 3〇接受工作 一而電力的通道。每-結合單元21包括：—結合螺孔21〇 ;及 一組第一導電板220。 六結合螺孔210，其作用在於與LED3〇6勺導熱螺桿結合以緊 ，固定LED 3〇,此外透過導熱螺桿與結合螺孔训的結合，也 可以使LED 30賴能有效轉遞至電路絲2()並進行散熱。 、第一導電板220，其係分別設置於結合螺孔21〇兩側，可 刀別作為電源的正極端與負極端。當LED 3〇與結合單元21 ，。而被緊密固定之後，第一導電板22〇便與£ED 3〇上的導 電支^之腳架部靠著接觸而達成電性連接，因此電力便可透過 第一導電板220與導電支架供應給lED 3〇。 如第4A圖及第4B圖所示，LED 30是以一對一的方式結 合於結合單元21上，每一 LED3〇包括：一基座單元31〇，·以 及一 LED單元330。又基座單元31〇，其包括··一導熱螺桿311; 一組導電支架312 ;及一封膠體313。 7 M426882 導熱螺桿Ml，其頂端為第一導熱接點314，底端則為結 合部315。結合部315用以可分離的與結合嫘孔210結合，也 就是說導熱螺桿311可藉由結合部315插設於結合螺孔210 中，藉此將LED 30固定於電路基板20上。此外，當LED 30 故障或損壞時也可以藉由分離導熱螺桿311與結合螺孔210， 以對故障或損壞之LED 30進行拆卸及更換。導熱螺桿311可 增加散熱的表面積，如此可使熱更有效地傳遞至電路基板20。 導電支架312’其功用在於提供每一結合單元21的第一導When the other portion is passed through the circuit board 16 100 through the pin 11 16 , the group <adhesively or soldered is fixed on the circuit 17 and the circuit 17 on the circuit board 16 has a plurality of LEDs 100. The group is connected to a plurality of LEDs 1〇〇, so the whole method is fixed in the circuit b. The LEDs in the LED fixtures are naturally difficult to make. The M426882 may not even be repairable at all, but needs to be combined. Replace the new board 16 and reinstall the new LED 100. As for the thermal energy generated by the LED 100 during operation, most of the heat can be transmitted to the circuit board 16 only through the pin 11 having a small heat conduction section and the adhesive resin 15 having a poor thermal conductivity, and the thermal transmission coefficient is not a good circuit board. 16 escapes into the environment, so the heat dissipation is not very good. In addition to the high temperature of the LED lamp, which affects the illuminating performance of the LED chip 12, it is also easy to shorten the working life of the LED chip 12. From the above description, it is known that the conventional LED lamp structure has many problems to be solved in terms of manufacturing assembly, ease of maintenance and replacement, or in terms of heat dissipation technology and component life. [New content] This creation is a high thermal conductivity detachable optical module structure with optical performance, including: a body detachable bracket, a circuit substrate; and an LED. This creation is mainly to make the LED and the circuit substrate produce a movable and detachable combination, thereby facilitating subsequent replacement or repair during damage; and achieving the purpose of permanent use of the housing luminaire. The present invention provides a high thermal conductivity detachable optical module having an optical performance, comprising: a circuit substrate comprising a plurality of bonding units, each bonding unit comprising: a combined screw hole; and a set of first conductive plates Each of the LEDs is disposed on both sides of the combined screw hole; and a plurality of LEDs are coupled to the combining units one-to-one. Each LED includes: a base unit including: a heat conducting screw having a joint portion and a a first heat conducting contact; a set of conductive brackets disposed on both sides of the heat conducting M426882 screw, and the set of conductive brackets has a set of tripod portions and a set of second conductive plates; and a gel body having: a bottom plate The heat conducting screw and the set of conductive brackets are coated, so that the heat conducting screw and the set of conductive brackets respectively expose the joint portion and the set of the tripod portion on the lower side of the bottom plate, and expose the first heat conduction joint and the second conductive plate respectively The upper side of the bottom plate, wherein the joint portion is detachably coupled with the combined screw hole, and the set of the tripod portion is in contact with the first conductive plate of the group; and the one side plate is connected to the end portion of the bottom plate A hollow space is extended and surrounded; and the LED unit is received in the hollow space, and comprises: a heat conducting substrate having a first surface and a second surface, the second surface forming a second heat conduction The contact is thermally coupled to the first thermally conductive contact, and a third conductive plate is electrically connected to the second conductive plate; an LED chip is fixedly and thermally coupled to the first surface, and electrically connected to the contact a second conductive plate; and a lens encapsulated in the hollow space and covering the LED chip. The present invention further provides a circuit substrate structure for use in the high thermal conductivity detachable optical module LED module structure as described above, the circuit substrate structure comprises a plurality of combined units, each combining unit comprises: a combined snail a hole; and a set of first conductive plates respectively disposed on both sides of the combined screw hole. The present invention further provides an LED structure for use in the above-mentioned high thermal conductivity detachable optical module LED module structure, wherein the LED module comprises: a base unit comprising: a heat conducting screw having a combination And a first heat conducting contact; a set of conductive brackets disposed on both sides of the heat conducting screw, and the set of conductive brackets has a set of tripod portions and a set of second conductive plates; and a glue body having: a bottom plate, which covers the heat conducting screw and the set of conductive brackets, so that the heat conducting screw and the set of conductive brackets respectively expose the joint portion and the set of the tripod portion on the side of the bottom of the bottom plate 5, 26882, respectively, and expose the first heat conduction joint and the The second conductive plate is disposed on the upper side of the bottom plate; and the one side plate extends upward from the bottom plate portion and is formed with an air gap; and an LED unit is received in the hollow space, and includes: a heat conductive substrate, The first surface and the second surface are formed. The second surface is formed with a first heat conducting contact and a first heat conducting contact, and a second conductive plate is electrically connected to the second conductive plate. ; A LED chip, is fixed and thermally bonded to a first surface of the trip 'in turn is electrically connected to the second set of conductive plates; ,, and a lens cover attached to the hollow space and led wafer. Brother, with the implementation of this creation, at least the following advancements can be achieved: The LED can be quickly assembled and repaired with the circuit substrate. The LED can have a good heat dissipation effect to maintain a stable illumination output and prolong the working life of the LED chip. ':, and can achieve the purpose of permanent use of the outer casing lamps. In the style of Wh #«»»〇Wh ^, the skilled artisan is familiar with the skill of the creation and according to the contents disclosed in this specification, the scope of the patent application and:: Any familiar with the artist can find the heart and 3 ' Therefore, in the embodiment, the purpose and the subject of ^^^(4)(4) will be adopted. The detailed description of the original features and the detection of the present invention [Embodiment] FIG. 2 is a perspective view of the LED module structure of the first embodiment of the present invention. The detachable optical circuit board top view. Fig. 4A is a perspective view of the structure of the present invention in which the optical performance of the present invention is optically detachable, and the structure is exploded. Figure 4B is a diagram D of the LED module with thermal conductivity and detachable optical performance. As shown in the second and third figures, the present embodiment is a high thermal conductivity detachable type of LED module structure 2°° which includes: a circuit substrate 20; and a plurality of LEDs 30. The circuit substrate 20 can be a substrate or a copper substrate, and functions as a base for mounting and fixing the summer BD 30, and can also mount or accommodate the electric lamp, control wire or other electronic circuit components required for supplying the lamp 2 . . The circuit substrate includes a plurality of bonding units 21' which function to provide a mechanism in which the individual LEDs 30 are combined with the earth plate 20 and are fixed, and the individual lEDs 3 accept the work and the power. Each of the bonding units 21 includes: a bonding screw hole 21; and a set of first conductive plates 220. Six combined with the screw hole 210, the role of which is combined with the LED3〇6 scoop heat-conducting screw to tightly fix the LED 3〇. In addition, through the combination of the heat-conducting screw and the combined screw hole training, the LED 30 can be effectively transferred to the circuit wire. 2 () and heat dissipation. The first conductive plates 220 are respectively disposed on the two sides of the combined screw holes 21, and can be used as the positive end and the negative end of the power source. When the LED 3 〇 is combined with the unit 21 . After being tightly fixed, the first conductive plate 22 is electrically connected to the contact portion of the conductive support on the £ED 3, so that power can be supplied through the first conductive plate 220 and the conductive support. Give lED 3〇. As shown in Figs. 4A and 4B, the LEDs 30 are coupled to the bonding unit 21 in a one-to-one manner, and each of the LEDs 3 includes: a base unit 31, and an LED unit 330. Further, the base unit 31A includes a heat conducting screw 311, a set of conductive brackets 312, and a glue body 313. 7 M426882 The thermal screw M1 has a first heat conduction contact 314 at the top end and a junction 315 at the bottom end. The joint portion 315 is detachably coupled to the joint bore 210, that is, the heat conductive screw 311 can be inserted into the joint screw hole 210 by the joint portion 315, thereby fixing the LED 30 to the circuit substrate 20. In addition, when the LED 30 is faulty or damaged, the defective or damaged LED 30 can be disassembled and replaced by separating the heat conducting screw 311 and the coupling screw hole 210. The heat conducting screw 311 can increase the surface area of heat dissipation, so that heat can be more efficiently transmitted to the circuit substrate 20. The conductive support 312' functions to provide a first guide for each bonding unit 21.
電板220與相對應之LED單元330電性連接的通道’以使LED 單元330可獲得工作所需之電力供應。導電支架312係設置於 導熱螺桿311之兩側，並具有一組腳架部316與一組第二導電 板 317。 每一腳架部316均可以為具有彈性之金屬件，並與第一導 電板220接觸式的電性連接。又每一腳架部316的底部玎具有 一接觸緣318 ’因此當導熱螺桿311固定於結合螺孔210時， 腳架部316的接觸緣318能與第一導電板220更有效的電性連 接，使得電力可由第一導電板22〇經過腳架部316傳遞至第二 導電板317上。 提供LED單兀330所需之電力，因此在lE 单元310、结合後，第二導電板爪與led 導電板337係透過銲接結合以達成電性連接 第二導電板317収用以與LED單元330 f性連接，以 因此在LED單元330與基座The circuit board 220 is electrically connected to the corresponding LED unit 330 to enable the LED unit 330 to obtain the power supply required for operation. The conductive brackets 312 are disposed on both sides of the heat conducting screw 311 and have a set of the legs 316 and a set of second conductive plates 317. Each of the leg portions 316 may be a resilient metal member and electrically connected in contact with the first conductive plate 220. Further, the bottom 玎 of each of the tripod portions 316 has a contact edge 318 '. Therefore, when the heat conducting screw 311 is fixed to the coupling screw hole 210, the contact edge 318 of the tripod portion 316 can be electrically connected to the first conductive plate 220 more effectively. The electric power can be transmitted from the first conductive plate 22 to the second conductive plate 317 through the stand portion 316. The power required for the LED unit 330 is provided. Therefore, after the lE unit 310 is combined, the second conductive plate claw and the led conductive plate 337 are coupled by welding to achieve electrical connection between the second conductive plate 317 and the LED unit 330 f. Sexual connection to thus the LED unit 330 and the base
導電板317傳送到LED單元330。 M426882 封勝體313，其係可藉由射出成型技術製造，封膠體3i3 經過射出成型後具有-底板319 ;以及一側板32〇。底板319 係用來包覆及固定導熱螺桿31!與導電支架312 ’但為了達到 必要的導電及導熱功效’因此於底板319的下方侧裸露出導熱 螺桿311下端之結合部315卩導電支架312下端的腳架部 316，並於底板319的上方側裸露出導熱螺桿311上端之第一 導熱接點314及導電支架312上端的第二導電板317。 φ 為了後縯對LED單元330進行封裝，因此封膠體313又 形成了 一側板320，側板320係由底板319端部向上延伸並環 繞形成有一中空空間321。 LED單元330 ’容置於中空空間321中，LED單元330包 括：一導熱基板331 ; — LED晶片332 ;及一透鏡333。 導熱基板331可為一陶瓷基板或一 SMT加工方式之SMD LED 封裝體，其中 SMT(Surface mount technology, SMT)為表 面黏著技術，SMD (Surface Mount Device, SMD )為表面黏著 鲁元件，又 LED(Light-EmittingDiode,LED)為發光二極體。 導熱基板331並具有一第一表面334及一第二表面335 ; 第一表面334為導熱基板331之上表面，而第二表面335為導 熱基板331之下表面。為了進行導熱，第二表面335形成有一 第二導熱接點336，用以與第一導熱接點314導熱結合，如此 LED晶片332工作時產生的熱能可以透過第二導熱接點336與 第一導熱接點314傳遞到導熱螺桿311，以快速散除LED晶片 332產生的熱能。又為了進行導電，第二表面335上又形成有 一組第三導電板337，其係用以與第二導電板317銲接結合並 9 M426882 達成電性連接，以使得電力可以傳遞到LED晶片332上。 LED晶片332,其係固定設置且導熱結合於第一表面州 上並且電f生連接於第二導電板337，再透過第三導電板 與第-V電板317結合後所達成之電性連接，使LED晶片332 獲得工作所需之電力供應；@ LED晶片332在工作時所產生 的熱旎，則可透過與第一表面334的導熱連接而傳遞至導熱基 板331，再經由導熱基板331、導熱螺桿311傳遞至電路基板 20，然後逸散至環境中。如此，可使LED晶片332的工作溫 度穩定維持在一定範圍内，進而可穩定LED晶片332所發出 的照明輸出。 換吕之，當LED 30完成封裝後，導熱螺桿3丨丨藉由頂端 之第一導熱接點314與LED單元330的第二導熱接點336形 成銲接結合並達成導熱連接。又當導熱螺桿311的結合部315 與結合單元21的結合螺孔21〇結合時，從第二導熱接點336、 第一導熱接點314、結合部315至結合螺孔21〇形成了〆導熱 通道’因而使LED晶片332所產生之熱能有效的傳遞至電路 基板20上進行散熱。 而在LED 30與電路基板2〇結合後，由於腳架部3丨6接觸 式的與第-導電板220電接觸，並且LED單元挪上之第三 導電板337係透過銲接結合與第二導電板317達成電性連接， 因此電力可由第-導電板22()透過腳架部316傳遞至第二導電 板317 ’再經由第三導電板337傳送led晶片。 透鏡333 ’其係可採用石夕膠材料製作。透鏡333係封裝於中 工工間321内並覆盍LED晶片332以提供LED晶片332保護， M426882 避免LED晶片332受到外力而導致損壞。此外，也可以藉由對 透鏡333進行光學設計，以遠到高導熱可拆卸式具光學性能之 LED模組結構200所需之光學特性。再者，為了保護LED晶片 332並提高LED晶片332之光線出光量，可於LED晶片332上 先設置一封裝膠材338以包覆LED晶片332後，再覆蓋透鏡333。 透過本實施例所提供的高導熱可拆卸式具光學性能之 LED模組結構200，可以很快速而簡易的將LED 3〇與電路基 鲁板20結合而完成高導熱可拆卸式具光學性能之LED模組結構 200的組裝，而不需要透過繁複的銲接程序便可使高導熱可拆 卸式具光學性能之LED模組結構200中的所有LED3〇獲得固 定以及工作所需的電力。同時，也由於不需銲接固定，因此當 尚導熱可拆卸式具光學性能之LED模組結構200中有個別 LED 30故障或損壞時，維修者可以报快速而簡易的將故障或 損壞的LED 3 0拆卸及更換。 又由於本實施例所提供的南導熱可拆卸式具光學性能之 鲁LED模組結構2〇〇又具備了可供工作時所產生的熱能傳導及逸 .散的通道’因此可使LED 30的工作溫度穩定，除了可以穩定 LED晶片332發射出來的照明輸出之外，還可進一步延長LED 晶片332的工作壽命。 惟上述各實施例係用以s尤明本創作之特點，其目的在使熟 習該技術者能暸解本創作之内容並據以實施，而非限定本創作 之專利範圍，故凡其他未脫離本創作所揭示之精神而完成之等 效修飾或修改，仍應包含在以下所述之申請專利範圍中。 M426882 【圖式簡單說明】 第1圖為習知之一種高導熱可拆卸式具光學性能之LED模組 結構中LED模組與電路板結合方式之結構示意圖。 第2圖為本創作實施例之一種高導熱可拆卸式具光學性能之 LED模組結構之立體圖。 第3圖為本創作實施例之一種電路基板俯視圖。 第4A圖為本創作實施例之一種高導熱可拆卸式具光學性能之 LED模組結構之分解圖。 第4B圖為本創作實施例之一種高導熱可拆卸式具光學性能之 LED模組結構之結合圖。 【主要元件符號說明】The conductive plate 317 is transferred to the LED unit 330. M426882 is a seal body 313 which can be manufactured by injection molding technology. The sealant 3i3 has an injection-molded body having a bottom plate 319 and a side plate 32〇. The bottom plate 319 is used to cover and fix the heat conducting screw 31! and the conductive bracket 312' but in order to achieve the necessary conductive and heat conducting effects. Therefore, the lower end of the heat conducting screw 311 is exposed on the lower side of the bottom plate 319, and the lower end of the conductive bracket 312 is closed. The tripod portion 316 exposes the first heat conducting contact 314 at the upper end of the heat conducting screw 311 and the second conductive plate 317 at the upper end of the conductive bracket 312 on the upper side of the bottom plate 319. φ For the post-operation of the LED unit 330, the encapsulant 313 forms a side plate 320, and the side plate 320 extends upward from the end of the bottom plate 319 and is formed with a hollow space 321 . The LED unit 330' is housed in the hollow space 321, and the LED unit 330 includes: a heat conductive substrate 331, an LED chip 332, and a lens 333. The thermal conductive substrate 331 can be a ceramic substrate or an SMT LED package of SMT processing mode, wherein SMT (Surface Mount Technology, SMT) is a surface adhesion technology, and SMD (Surface Mount Device, SMD) is a surface adhesion component and an LED ( Light-Emitting Diode (LED) is a light-emitting diode. The heat conductive substrate 331 has a first surface 334 and a second surface 335; the first surface 334 is an upper surface of the heat conductive substrate 331, and the second surface 335 is a lower surface of the heat conductive substrate 331. The second surface 335 is formed with a second heat conducting contact 336 for thermally conductively bonding with the first heat conducting contact 314. The heat generated by the LED chip 332 during operation can pass through the second heat conducting contact 336 and the first heat conducting. Contact 314 is transferred to thermally conductive screw 311 to rapidly dissipate the thermal energy generated by LED wafer 332. In order to conduct the conductive, the second surface 335 is further formed with a set of third conductive plates 337 for soldering and bonding with the second conductive plate 317 and 9 M426882 for electrical connection, so that power can be transmitted to the LED wafer 332. . The LED chip 332 is fixedly disposed and thermally coupled to the first surface state and electrically connected to the second conductive plate 337, and then electrically connected through the third conductive plate and the first-V electrical plate 317. The LED chip 332 is required to obtain the power supply required for the operation; the enthalpy generated by the LED chip 332 during operation can be transmitted to the heat conductive substrate 331 through the heat conduction connection with the first surface 334, and then through the heat conductive substrate 331, The heat conducting screw 311 is transferred to the circuit substrate 20 and then dissipated into the environment. Thus, the operating temperature of the LED chip 332 can be stably maintained within a certain range, and the illumination output from the LED chip 332 can be stabilized. In other words, after the LED 30 is packaged, the heat conducting screw 3 is soldered to the second heat conducting contact 336 of the LED unit 330 by the first heat conducting contact 314 at the top end to achieve a thermally conductive connection. When the joint portion 315 of the heat-conducting screw 311 is combined with the joint screw hole 21 of the joint unit 21, heat conduction is formed from the second heat-conductive joint 336, the first heat-conductive joint 314, the joint portion 315, and the joint screw hole 21〇. The channel ' thus enables the heat generated by the LED chip 332 to be efficiently transferred to the circuit substrate 20 for heat dissipation. After the LED 30 is combined with the circuit board 2, the tripod portion 3丨6 is in contact with the first conductive plate 220, and the third conductive plate 337 that is moved by the LED unit is soldered and bonded to the second conductive layer. The board 317 is electrically connected, so that power can be transmitted from the first conductive plate 22 () through the stand portion 316 to the second conductive plate 317' and then through the third conductive plate 337. The lens 333' can be made of a stone material. The lens 333 is packaged in the middle work chamber 321 and covers the LED chip 332 to provide protection for the LED chip 332. The M426882 prevents the LED chip 332 from being damaged by an external force. In addition, the optical characteristics of the LED module structure 200 with high thermal conductivity and detachability can be as far as possible by optically designing the lens 333. In addition, in order to protect the LED chip 332 and increase the amount of light emitted by the LED chip 332, a package adhesive 338 may be disposed on the LED chip 332 to cover the LED chip 332, and then the lens 333 is covered. The high thermal conductivity detachable optical module LED module structure 200 provided by the embodiment can quickly and easily combine the LED 3 〇 with the circuit base plate 20 to complete the high thermal conductivity detachable optical performance. The assembly of the LED module structure 200 allows all of the LEDs 3 in the high thermal conductivity detachable optical module LED module structure 200 to be secured and operated with the power required by the complicated soldering process. At the same time, since there is no need for soldering and fixing, when the LED module 30 of the thermal conductive detachable optical performance module has faulty or damaged individual LEDs 30, the repairer can report the faulty or damaged LED 3 quickly and easily. 0 Disassembly and replacement. Moreover, since the south heat conduction detachable optical module LED module structure provided by the embodiment has the heat conduction and escape channel which can be generated during operation, the LED 30 can be made. The operating temperature is stable, and in addition to stabilizing the illumination output emitted by the LED chip 332, the operational life of the LED wafer 332 can be further extended. However, the above embodiments are used for the characteristics of sui Mingben's creation, and the purpose thereof is to enable those skilled in the art to understand the contents of the creation and implement it according to the scope of the patent, and therefore the other is not divorced. Equivalent modifications or modifications made by the spirit of the disclosure should still be included in the scope of the patent application described below. M426882 [Simple description of the drawing] Fig. 1 is a schematic structural view of a combination of an LED module and a circuit board in a high thermal conductivity detachable optical module with optical performance. 2 is a perspective view of a high thermal conductivity detachable optical module having an optical performance according to an embodiment of the present invention. Fig. 3 is a plan view showing a circuit board of the present embodiment. 4A is an exploded view showing the structure of an LED module with high thermal conductivity and detachable optical performance according to the embodiment of the present invention. FIG. 4B is a combination diagram of a high thermal conductivity detachable optical module having an optical performance according to an embodiment of the present invention. [Main component symbol description]
100..............LED 10 ................鲜錫 11 ................接腳 12 ................LED晶片 13 ................透鏡 14 ................封裝體 15 ................樹脂 16 ................電路板 17 ................電路 200..............高導熱可拆卸式具光學性能之LED模組結構 20 ................電路基板 21 ................結合單元 M426882 210..............結合螺孔 220..............第一導電板100...................LED 10 ................Fresh tin 11 .............. .. pin 12 ................ LED chip 13 ............... lens 14 ........ ........Package 15 ................Resin 16 ............... Board 17 .. ..............Circuit 200..............High thermal conductivity detachable LED module structure with optical performance 20 ... ..........circuit board 21 ................ Combined unit M426882 210.............. Combined with screw hole 220..............first conductive plate
30................LED 310 ..............基座單元 311 ..............導熱螺桿 312 ..............導電支架 313 ..............封膠體 ^ 314..............第一導熱接點 315 ..............結合部 316 ..............腳架部 317 ..............第二導電板 318 ..............接觸緣 319 ..............底板 320 ..............側板 321 ..............中空空間 # 330..............LED 單元 .331..............導熱基板 332 ..............LED 晶片 333 ..............透鏡 334 ..............第一表面 335 ..............第二表面 336 ..............第二導熱接點 337 ..............第三導電板 338 ..............封裝膠材 1330................LED 310 ..............Base unit 311 ............. Thermal Conductive Screw 312 ..............Conductive Bracket 313 ..............Encapsulant ^ 314........... ...the first thermal contact 315..............the joint 316.............the tripod portion 317...... ........Second conductive plate 318 .............. Contact edge 319 ..............Backplane 320 .... ..........Side plate 321 .............. Hollow space # 330..............LED unit.331.. ............thermal substrate 332 ..............LED wafer 333..............lens 334 .. ............first surface 335 .............. second surface 336 ................... second Thermal Conductive Contact 337 .............. Third Conductive Plate 338 ..............Package Material 13