WO2017141378A1 - 非接触給電装置 - Google Patents
非接触給電装置 Download PDFInfo
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- WO2017141378A1 WO2017141378A1 PCT/JP2016/054585 JP2016054585W WO2017141378A1 WO 2017141378 A1 WO2017141378 A1 WO 2017141378A1 JP 2016054585 W JP2016054585 W JP 2016054585W WO 2017141378 A1 WO2017141378 A1 WO 2017141378A1
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- Prior art keywords
- power
- power supply
- substrate
- circuit
- power receiving
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
- H02J50/10—Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling
- H02J50/12—Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling of the resonant type
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F38/00—Adaptations of transformers or inductances for specific applications or functions
- H01F38/14—Inductive couplings
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
- H02J50/90—Circuit arrangements or systems for wireless supply or distribution of electric power involving detection or optimisation of position, e.g. alignment
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
- H02J50/005—Mechanical details of housing or structure aiming to accommodate the power transfer means, e.g. mechanical integration of coils, antennas or transducers into emitting or receiving devices
Definitions
- the present invention relates to a non-contact power feeding device that feeds power from a power feeding unit to a power receiving unit in a non-contact manner.
- solder printing machine an electronic component mounting machine, a reflow machine, a board inspection machine, and the like as a board production machine that produces a board on which a large number of parts are mounted. It has become common to configure a substrate production line by connecting these facilities. Furthermore, there are many cases where a substrate production line is configured by arranging modular board production machines of the same size. By using a modularized board production machine, it is easy to change the setup when changing the line or adding a longer line, and a flexible board production line is realized.
- a non-contact power feeding device is considered as a power feeding means to the moving body.
- the application of the non-contact power feeding device is not limited to the board production line, but covers a wide range of fields such as an assembly line and a processing line for producing other products, and power feeding during running of an electric vehicle.
- an electromagnetic coupling method using coils for power feeding elements and power receiving elements is often used.
- Patent Documents 1 and 2 are disclosed as technical examples related to the electromagnetic coupling type non-contact power feeding device.
- the non-contact power supply device of Patent Document 1 includes a pickup unit that is inductively coupled to a power supply line through which a high-frequency current flows, and supplies power to a load by an induced electromotive force induced in the pickup unit.
- the pickup unit has a core, a coil, and a resonance circuit.
- the resonant circuit is configured such that a mother board on which a conductor pattern connected to a coil is formed, a plurality of daughter boards each having one to a plurality of capacitors mounted thereon, and each child board is detachably connected to the mother board. A plurality of connectors. According to this, the capacitance value of the capacitor constituting the resonance circuit together with the coil can be adjusted, and the adjustment work of the resonance circuit can be simplified. In other words, the capacitance value of the capacitor can be adjusted by attaching and detaching the sub board by dividing the resonance circuit, which has conventionally been constituted by a single board, into the mother board and the sub board.
- Patent Document 2 discloses a non-contact power feeding device that excites a primary coil, generates secondary power in a secondary coil of an adjacent device by electromagnetic induction, and supplies the secondary power to a load of the device.
- a power supply module is disclosed.
- the power supply module includes a plurality of coil units each having a primary coil, and a printed wiring board on which the plurality of coil units are arranged and terminal-connected so as to be driven. Furthermore, a mode in which a resonant capacitor is connected to each primary coil is also disclosed. According to this, the power supply module has a high degree of freedom in design, can perform various forms of non-contact power supply, and can be manufactured easily and in a short time.
- the shape of a power feeding coil (power feeding element) and a power receiving coil (power receiving element) can be adjusted according to the size of each board production machine and the power feeding capacity to be fed to a moving body. Characteristics such as dimensions are changed. Therefore, various large and small resonant capacitors (resonant elements) are used to secure a desired capacitance value (element constant).
- the AC power circuit of the power supply unit is composed of a single substrate including a resonant capacitor.
- a large resonant capacitor is required when a large capacitance value is desired, and space for mounting on a single substrate is insufficient.
- a power receiving circuit of a power receiving unit includes a resonance capacitor and is configured by a single substrate, a space for mounting a large resonance capacitor on a single substrate is insufficient.
- the present invention has been made in view of the above-mentioned problems of the background art, and provides a non-contact power feeding device having a versatile board configuration capable of dealing with a plurality of types of power feeding elements and power receiving elements having different characteristics. It should be a challenge.
- the contactless power supply device of the present invention that solves the above problems is provided with a power supply element provided in a power supply unit, an AC power supply circuit that supplies AC power to the power supply element, and a power reception unit that faces the power supply element.
- a power receiving element that is electrically coupled to receive AC power in a contactless manner, a power receiving circuit that converts AC power received by the power receiving element to generate a received voltage, and outputs the received voltage to the electrical load, the power feeding element, and the power receiving
- a non-contact power supply device comprising: a resonance element connected to at least one of the elements to form a resonance circuit; and a power supply substrate configured to include at least a part of the AC power supply circuit; The power receiving substrate configured to include at least a part and the resonance element, and when there is a remaining part of the AC power supply circuit or a remaining part of the power receiving circuit, the remaining part is also included. And configured resonant substrate, but is separate from.
- a power supply substrate configured to include at least a part of the AC power supply circuit
- a power reception substrate configured to include at least a part of the power reception circuit
- a resonance substrate including a resonance element Is a separate body.
- FIG. 1 is a diagram schematically illustrating a circuit configuration and a substrate configuration of the contactless power supply device 1 of the first embodiment.
- a thick line in FIG. 1 indicates a non-contact power feeding circuit.
- the non-contact power feeding device 1 of the first embodiment includes a power feeding unit 1S and a power receiving unit 1R.
- the power supply unit 1S is disposed at a fixed position.
- the power receiving unit 1R can be changed in position relative to the power feeding unit 1S. As shown in the drawing, when the power receiving unit 1R is arranged at a position facing the power feeding unit 1S, the non-contact power feeding device 1 performs non-contact power feeding of an electromagnetic coupling method.
- the power supply unit 1S includes an AC power supply circuit 2, a power supply side resonance capacitor 35, and a power supply coil 31. More specifically, the high voltage output terminal 21 of the AC power supply circuit 2 is connected to one end of the power supply side resonance capacitor 35. The other end of the power supply side resonance capacitor 35 is connected to one end of the power supply coil 31. The other end of the feeding coil 31 is connected to the low voltage output terminal 22 of the AC power supply circuit 2.
- An annular power feeding circuit is configured by the connection described above.
- the AC power supply circuit 2 supplies AC power to the feeding coil 31.
- the AC power supply circuit 2 can be configured using, for example, a DC power supply unit that supplies a DC voltage and a known bridge circuit that converts the DC voltage to AC.
- the frequency f0 of the AC power supply circuit 2 can be on the order of several tens of kHz to several hundreds of kHz, and is not limited to this.
- the power supply side resonance capacitor 35 and the power supply coil 31 constitute a power supply side resonance circuit.
- the power supply side resonance circuit is a series resonance circuit as viewed from the AC power supply circuit 2.
- the power supply side resonance frequency fs of the power supply side resonance circuit is obtained by the following equation 1.
- ⁇ is the circumference
- LS is the inductance value of the feeding coil 31
- CS is the capacitance value of the feeding-side resonance capacitor 35.
- the power receiving unit 1R includes a power receiving coil 41, a power receiving resonance capacitor 45, and a power receiving circuit 5.
- One end of the power receiving coil 41 is connected to one end of the power receiving side resonance capacitor 45 and the input first terminal of the power receiving circuit 5.
- the other end of the power receiving coil 41 is connected to the other end of the power receiving side resonance capacitor 45 and the input second terminal of the power receiving circuit 5.
- the output first terminal and the output second terminal of the power receiving circuit 5 are connected to the electric load EL.
- a power receiving circuit is configured by the connection described above.
- the power receiving coil 41 faces the power feeding coil 31, it is electromagnetically coupled and receives AC power in a non-contact manner.
- the power receiving coil 41 and the power receiving side resonance capacitor 45 constitute a power receiving side resonance circuit.
- the power reception side resonance circuit is a parallel resonance circuit as viewed from the electric load EL side.
- the power receiving side resonance frequency fr of the power receiving side resonance circuit is obtained by the following formula 2.
- ⁇ is the circumference ratio
- LR the inductance value of the power receiving coil 41
- CR is the capacitance value of the power receiving side resonance capacitor 45.
- the power receiving circuit 5 converts the AC power received by the power receiving coil 41 to generate a received voltage and outputs it to the electric load EL.
- the power receiving circuit 5 can be exemplified by a full-wave rectifier circuit, but is not limited thereto.
- the full-wave rectifier circuit can be constituted by, for example, a bridge circuit composed of four rectifier diodes and a smoothing capacitor.
- the electrical load EL performs work on the power receiving unit 1R, and the type and power consumption are not limited.
- the electric load EL may include an electric drive source that moves the power receiving unit 1R.
- a DCDC converter that adjusts the level of the received voltage and outputs it to the electric load EL can be considered as part of the electric load EL.
- the power supply unit 1 ⁇ / b> S includes a power supply substrate 61 and a power supply side resonance substrate 65 that are separated separately.
- the power supply board 61 is configured by mounting circuit components forming the AC power supply circuit 2.
- the power supply substrate 61 includes a connector 62 that is responsible for connection between the high voltage output terminal 21 and the low voltage output terminal 22 of the AC power supply circuit 2.
- the power supply side resonance substrate 65 is configured by mounting a power supply side resonance capacitor 35 and a conductor 36.
- the conductor 36 is a part for connecting the other end of the feeding coil 31 and the low voltage output terminal 22 of the AC power supply circuit 2.
- the power supply side resonance substrate 65 has a connector 66 and a terminal pair 67 that are connected to the power supply side resonance capacitor 35 and the conductor 36.
- the connector 66 is fitted and connected to the connector 62 of the power supply board 61.
- the terminal pair 67 is connected to the feeding coil 31.
- a part of the circuit components forming the AC power supply circuit 2 may be mounted on the power supply substrate 61 and the remaining part may be mounted on the power supply side resonance substrate 65.
- the power receiving unit 1S has a power receiving side resonance substrate 75 and a power receiving substrate 71 separated separately.
- the power receiving side resonance substrate 75 is configured by mounting the power receiving side resonance capacitor 45.
- the power reception side resonance substrate 75 includes a terminal pair 76 and a connector 77 that are connected to the power reception side resonance capacitor 45.
- the terminal pair 76 is connected to the power receiving coil 41.
- the power receiving board 71 is configured by mounting circuit components forming the power receiving circuit 5.
- the power receiving board 71 includes a connector 72 and a terminal pair 73 that are responsible for connection of the power receiving circuit 5.
- the connector 72 is fitted and connected to the connector 77 of the power receiving side resonance substrate 75.
- the terminal pair 73 is connected to the electric load EL.
- a part of the circuit components forming the power receiving circuit 5 may be mounted on the power receiving substrate 71 and the remaining part may be mounted on the power receiving side resonance substrate 75.
- the frequency f0 of the AC power supply circuit 2 is set to a constant value.
- a plurality of types of power supply coils 31 and power reception coils 41 having different characteristics are prepared. For this reason, regardless of the characteristics of the power feeding coil 31 and the power receiving coil 41, it is necessary to set frequency matching that optimizes the power feeding side resonance frequency fs with respect to the frequency f 0 of the AC power supply circuit 2.
- the element constant that is, the capacitance value CS of the power supply side resonance capacitor 35 is changed in accordance with the element constant, that is, the inductance value LS of the plurality of types of power supply coils 31.
- the capacitance value CS is changed small when the inductance value LS is large, and the capacitance value CS is increased when the inductance value LS is small. Change it.
- the electrostatic capacitance value CR of the power receiving resonance capacitor 45 is changed in accordance with the inductance value LR of the plurality of types of power receiving coils 41.
- the capacitance value CR is changed small when the inductance value LR is large, and the capacitance value CR is increased when the inductance value LR is small. Change it. In this case, since the power reception voltage does not change significantly, only one type of power reception substrate 71 needs to be prepared.
- the power supply side resonance capacitor 35 and the power reception side resonance capacitor 45 need not be a single component.
- desired capacitance values CS and CR can be realized by appropriately combining a plurality of capacitor components.
- the power supply substrate 61 and the power reception substrate 71 can be of one type.
- a plurality of types of power supply side resonance substrate 65 and power reception side resonance substrate 75 are prepared.
- the plurality of types of the power supply side resonance substrate 65 and the power reception side resonance substrate 75 can be handled only by changing the capacitance values CS and CR according to the plurality of types of the power supply coil 31 and the power reception coil 41. Therefore, a new design of the substrates 65 and 75 is unnecessary.
- the power feeding unit 1S and the power receiving unit 1R are each configured by a single substrate. For this reason, it is necessary to design different single substrates corresponding to the plurality of types of power feeding coils 31 and power receiving coils 41 having different characteristics. That is, the prior art lacked versatility.
- the non-contact power feeding device 1 of the first embodiment is provided in a power feeding element (feeding coil 31) provided in the power feeding unit 1S, an AC power supply circuit 2 that supplies AC power to the power feeding element, and a power receiving unit 1R.
- a power receiving element power receiving coil 41
- a power receiving voltage that converts the AC power received by the power receiving element to generate a received voltage and outputs the received voltage to the electric load EL.
- a non-contact power feeding device 1 including a circuit 5 and a resonant element (a power feeding side resonance capacitor 35, a power receiving side resonance capacitor 45) connected to at least one of a power feeding element and a power receiving element to form a resonance circuit,
- the power supply substrate 61 configured to include at least a part of the AC power supply circuit 2
- the power reception substrate 71 configured to include at least a part of the power reception circuit 5, a resonant element
- a power feeding substrate 61 configured to include at least a part of the AC power supply circuit 2, a power receiving substrate 71 configured to include at least a part of the power receiving circuit 5, and resonance
- the resonance substrate (the power supply side resonance substrate 65 and the power reception side resonance substrate 75) including the elements is separated. Therefore, the same power supply substrate 61 and the same power reception substrate 71 can cope with a plurality of types of power supply elements (power supply coil 31) and power reception elements (power reception coil 41) having different characteristics.
- the element constants (capacitance values CS and CR) of the resonance elements (the power supply side resonance capacitor 35 and the power reception side resonance capacitor 45) on the resonance substrate are simply changed for a plurality of types of power supply elements and power reception elements. It is possible to cope with this, and a new design of the resonance substrates 65 and 75 is unnecessary. This facilitates production management, quality control, and inventory management of the substrates 61, 65, 71, and 75, and facilitates handling of already delivered devices. Therefore, the non-contact power feeding device 1 having a versatile board configuration can be provided.
- the resonance element is a power supply side resonance element (power supply side resonance capacitor 35) connected to the power supply element (power supply coil 31) to form a power supply side resonance circuit
- the resonance substrate includes the power supply side resonance element
- the power supply side resonance substrate 65 is configured to include the remaining portion.
- the resonance element is a power reception side resonance element (power reception side resonance capacitor 45) connected to the power reception element (power reception coil 41) to form a power reception side resonance circuit, and the resonance substrate includes the power reception side resonance element.
- the power receiving side resonance substrate 75 is configured to include the remaining portion.
- the resonance elements power feeding side resonance capacitor 35, power receiving side resonance capacitor 45
- the element constant (capacitance values CS and CR) is changed. According to this, high power supply efficiency can be obtained using the resonance characteristics, regardless of which of the plurality of types of power supply coils 31 and power reception coils 41 having different characteristics.
- the power feeding element is the power feeding coil 31
- the power receiving element is the power receiving coil 41
- the resonant elements are the power feeding side resonance capacitor 35 connected to the power feeding coil 31 and the power receiving side resonance capacitor 45 connected to the power receiving coil 41. At least one of them.
- the electromagnetic coupling type non-contact power feeding device 1 can be a versatile board configuration.
- FIG. 2 is a diagram schematically illustrating a substrate configuration on the power receiving unit 1A side in a modification of the contactless power supply device 1 of the first embodiment.
- the power reception unit 1A in a modified form includes a power reception side resonance substrate 75A and a power reception substrate 71A.
- the power receiving side resonance substrate 75A is configured with the power receiving side resonance capacitor 45 mounted thereon.
- the power receiving side resonance substrate 75 ⁇ / b> A has a connector 77 that is connected to the power receiving side resonance capacitor 45.
- the power receiving board 71 ⁇ / b> A is configured by mounting circuit components that form the power receiving circuit 5.
- the power receiving board 71 ⁇ / b> A includes a connector 72 responsible for connection of the power receiving circuit 5 and two sets of terminal pairs 73 and 74.
- the connector 72 is fitted and connected to the connector 77 of the power receiving side resonance board 75A.
- the first terminal pair 73 is connected to the electric load EL.
- the second terminal pair 74 is connected to the power receiving coil 41.
- a part of the circuit components forming the power receiving circuit 5 may be mounted on the power receiving substrate 71A, and the remaining part may be mounted on the power receiving side resonance substrate 75A.
- FIG. 3 is a diagram schematically illustrating the configuration of the contactless power supply device 1B of the second embodiment.
- the non-contact power feeding device 1B of the second embodiment is applied to the board production line 9.
- the substrate production line 9 includes a plurality of substrate production machines 91 to 93 arranged in a line.
- the left-right direction in FIG. 3 is an arrangement direction of the board production machines 91 to 93, and is also a movement direction of the moving body 99 described later.
- the board production machines 91 to 93 are modularized and have the same width dimension in the row direction.
- the board production machines 91 to 93 can change the order of the arrangement positions and can be replaced with other modular board production machines.
- the number of board production machines 91 to 93 arranged in a row is not limited, and it is also possible to add modules to increase the number of board productions later.
- the board production machines 91 to 93 can be exemplified by electronic component mounting machines, but are not limited thereto.
- the moving body 99 moves in the moving direction along the guide rail.
- the movable body 99 plays a role of carrying in the equipment and members used in each of the board production machines 91 to 93 from a storage box (not shown) and returning the used equipment and members to the storage room.
- two power supply units 1S are provided on the front side of each board production machine 91-93.
- the two power supply units 1 ⁇ / b> S share the AC power supply circuit 25. That is, the respective power supply coils 31 of the two power supply units 1S are connected in parallel to the AC power supply circuit 25 via the power supply switch 26, respectively.
- the two power supply coils 31 are individually turned on / off.
- two power receiving units 1R are provided on a side surface 98 of the moving body 99 facing the board production machines 91 to 93. In the two power receiving units 1R, the output sides of the power receiving circuit 5 are combined into one to supply power to the common electric load EL.
- the length in the moving direction of the plurality of power feeding coils 31 and the two power receiving coils 41 and the mutual separation distance adjacent to each other in the moving direction are set so that the non-contact power feeding is performed stably. That is, regardless of the position of the moving body 99, the power feeding coil 31 and at least one power receiving coil 41 are always facing each other.
- the directly facing state means a state in which the entire length of the power receiving coil 41 in the moving direction faces within the range of the length of the feeding coil 31 in the moving direction.
- the power receiving coil 41 in the directly-facing state has a power receiving capacity that can drive the electric load EL alone.
- FIG. 4 is a diagram schematically illustrating the substrate configuration on the power supply unit 1S side in the non-contact power supply apparatus 1B of the second embodiment.
- the power supply board 61B and the power supply side resonance board 65B separated separately are common to the two power supply units 1S.
- the power supply board 61 ⁇ / b> B is configured by mounting circuit components forming the AC power supply circuit 25 and the two power switches 26.
- the power supply board 61 ⁇ / b> B has two sets of connectors 62 ⁇ / b> B responsible for connection of the AC power supply circuit 25.
- the power supply side resonance board 65B is configured by mounting two sets of power supply side resonance capacitors 35 and conductors 36.
- the power supply side resonance board 65B has two sets of connectors 66B and two sets of terminal pairs 67B for connecting the power supply side resonance capacitor 35 and the conductor 36.
- the two sets of connectors 66B are connected to the two sets of connectors 62B of the power supply board 61B in a one-to-one relationship.
- the two sets of terminal pairs 67B are connected to the feeding coil 31, respectively.
- FIG. 5 is a diagram schematically illustrating the substrate configuration on the power receiving unit 1R side in the non-contact power feeding apparatus 1B of the second embodiment.
- the power receiving side resonance substrate 75B and the power receiving substrate 71B separated into separate bodies are common to the two power receiving units 1R.
- the power receiving side resonance substrate 75B is configured by mounting two power receiving side resonance capacitors 45.
- the power receiving side resonance substrate 75B has two sets of terminal pairs 76B and two sets of connectors 77B that are responsible for connection of the power receiving side resonance capacitor 45.
- the two terminal pairs 76B are connected to the power receiving coil 41, respectively.
- the power receiving board 71B is configured by mounting circuit components forming two sets of power receiving circuits 5.
- the power receiving board 71 ⁇ / b> B has two sets of connectors 72 ⁇ / b> B and two sets of terminal pairs 73 ⁇ / b> B responsible for connection of the power receiving circuit 5.
- the two sets of connectors 72B are fitted and connected to the two sets of connectors 77B on the power receiving side resonance board 75B on a one-to-one basis.
- the two sets of terminal pairs 73B are connected in parallel to the electric load EL.
- the power supply substrate 61B and the power reception substrate 71B can be of one type.
- a plurality of types of power supply side resonance substrate 65B and power reception side resonance substrate 75B are prepared.
- the plurality of types of the power supply side resonance substrate 65B and the power reception side resonance substrate 75B can be handled only by changing the capacitance values CS and CR according to the plurality of types of the power supply coil 31 and the power reception coil 41. Therefore, a new design of the substrates 65B and 75B is unnecessary.
- the resonance substrate (power supply side resonance substrate 65B, power reception side resonance substrate 75B) is composed of a plurality of power supply units 1S.
- the resonance substrate is common to a plurality of power receiving units 1R and includes a plurality of resonance elements (a power supply side resonance capacitor 35 and a power reception side resonance capacitor 45). According to this, the board
- the same number (two) of power supply units 1S are provided in each of the plurality of substrate production machines 91 to 93 constituting the substrate production line 9, and the power receiving unit 1R is provided in an array of the plurality of substrate production machines 91 to 93. It is provided in a moving body 99 that moves in the direction.
- the non-contact power feeding device 1B can be configured by combining one type of power feeding board 61B and power receiving board 71B with the selected power feeding side resonance board 65B and power receiving side resonance board 75B. Therefore, according to 2nd Embodiment, the non-contact electric power feeder 1B of a versatile board
- the power supply substrates 61 and 61B, the power supply side resonance substrates 65 and 65B, the power reception substrates 71 and 71B, and the power reception side resonance substrates 75 and 75B do not necessarily have the shape of the substrate.
- a box-shaped AC power supply device may be used instead of the power supply substrates 61 and 61B.
- the power supply side resonance substrates 65 and 65B are separate from the AC power supply device, and the same effect as in the first and second embodiments is produced.
- Various other applications and modifications are possible for the present invention.
- the non-contact power feeding device of the present invention can be used in a wide range of fields such as assembly lines and processing lines for producing other products, and power feeding during running of electric vehicles. .
- Non-contact electric power feeder 1S Electric power feeding unit 1R, 1A: Power receiving unit 2: AC power supply circuit 25: AC power supply circuit 26: Power switch 31: Power feeding coil 35: Power feeding side resonance capacitor 41: Power receiving coil 45: Power receiving side Resonant capacitor 5: Power receiving circuit 61, 61B: Power feeding board 65, 65B: Power feeding side resonant board 71, 71A, 71B: Power receiving board 75, 75A, 75B: Power receiving side resonant board 9: Board production line 91-93: Board production machine 99: Mobile object EL: Electric load
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Abstract
Description
まず、本発明の第1実施形態の非接触給電装置1の回路構成について、図1を参考にして説明する。図1は、第1実施形態の非接触給電装置1の回路構成および基板構成を模式的に説明する図である。図1中の太線は、非接触給電回路を示している。第1実施形態の非接触給電装置1は、給電ユニット1Sと受電ユニット1Rを備える。給電ユニット1Sは、定位置に配置される。受電ユニット1Rは、給電ユニット1Sに対して位置の変更が可能とされている。図示されるように、給電ユニット1Sに対して受電ユニット1Rが対向位置に配置されると、非接触給電装置1は電磁結合方式の非接触給電を行う。
fs=1/2π(LS・CS)0.5 ……………………………式1
fr=1/2π(LR・CR)0.5 ……………………………式2
第1実施形態の非接触給電装置1の基板構成の説明に移る。図1に示されるように、給電ユニット1Sは、別体に分離された給電基板61および給電側共振基板65を有する。給電基板61は、交流電源回路2を形成する回路部品が実装されて構成される。給電基板61は、交流電源回路2の高圧出力端子21および低圧出力端子22の接続を担うコネクタ62を有する。
第1実施形態の非接触給電装置1は、給電ユニット1Sに設けられた給電素子(給電コイル31)と、給電素子に交流電力を供給する交流電源回路2と、受電ユニット1Rに設けられ、給電素子に対向すると電気的に結合して非接触で交流電力を受け取る受電素子(受電コイル41)と、受電素子が受け取った交流電力を変換して受電電圧を生成し、電気負荷ELに出力する受電回路5と、給電素子および受電素子の少なくとも一方に接続されて共振回路を形成する共振素子(給電側共振コンデンサ35、受電側共振コンデンサ45)と、を備えた非接触給電装置1であって、交流電源回路2の少なくとも一部を含んで構成された給電基板61と、受電回路5の少なくとも一部を含んで構成された受電基板71と、共振素子を含むとともに、交流電源回路2の残部または受電回路5の残部が有る場合には当該残部をも含んで構成された共振基板(給電側共振基板65、受電側共振基板75)と、が別体とされている。
次に、第1実施形態の変形態様について説明する。変形態様において、給電ユニット1Sの側の基板構成は変わらず、受電ユニット1Aの側の基板構成が変形されている。図2は、第1実施形態の非接触給電装置1の変形態様における受電ユニット1Aの側の基板構成を模式的に説明する図である。
次に、第2実施形態の非接触給電装置1Bについて、第1実施形態と異なる点を主に説明する。図3は、第2実施形態の非接触給電装置1Bの構成を模式的に説明する図である。第2実施形態の非接触給電装置1Bは、基板生産ライン9に適用されている。図示されるように、基板生産ライン9は、複数台の基板生産機91~93が列設されて構成されている。図3の左右方向は、基板生産機91~93の列設方向であり、後述する移動体99の移動方向でもある。
なお、給電基板61、61B、給電側共振基板65、65B、受電基板71、71B、および受電側共振基板75、75Bは、必ずしも基板の形状でなくともよい。例えば、給電基板61、61Bに代えて、箱形状の交流電源装置を用いてもよい。この場合、交流電源装置に対して、給電側共振基板65、65Bは別体となり、第1および第2実施形態と同様の効果が生じる。本発明は、その他にも様々な応用や変形が可能である。
1S:給電ユニット 1R、1A:受電ユニット
2:交流電源回路 25:交流電源回路 26:電源スイッチ
31:給電コイル 35:給電側共振コンデンサ
41:受電コイル 45:受電側共振コンデンサ
5:受電回路
61、61B:給電基板 65、65B:給電側共振基板
71、71A、71B:受電基板
75、75A、75B:受電側共振基板
9:基板生産ライン 91~93:基板生産機 99:移動体
EL:電気負荷
Claims (7)
- 給電ユニットに設けられた給電素子と、
前記給電素子に交流電力を供給する交流電源回路と、
受電ユニットに設けられ、前記給電素子に対向すると電気的に結合して非接触で交流電力を受け取る受電素子と、
前記受電素子が受け取った交流電力を変換して受電電圧を生成し、電気負荷に出力する受電回路と、
前記給電素子および前記受電素子の少なくとも一方に接続されて共振回路を形成する共振素子と、を備えた非接触給電装置であって、
前記交流電源回路の少なくとも一部を含んで構成された給電基板と、
前記受電回路の少なくとも一部を含んで構成された受電基板と、
前記共振素子を含むとともに、前記交流電源回路の残部または前記受電回路の残部が有る場合には当該残部をも含んで構成された共振基板と、が別体とされている非接触給電装置。 - 前記共振素子は、前記給電素子に接続されて給電側共振回路を形成する給電側共振素子であり、
前記共振基板は、前記給電側共振素子を含むとともに、前記交流電源回路の残部が有る場合には当該残部をも含んで構成された給電側共振基板である請求項1に記載の非接触給電装置。 - 前記共振素子は、前記受電素子に接続されて受電側共振回路を形成する受電側共振素子であり、
前記共振基板は、前記受電側共振素子を含むとともに、前記受電回路の残部が有る場合には当該残部をも含んで構成された受電側共振基板である請求項1または2に記載の非接触給電装置。 - 前記給電ユニットおよび前記受電ユニットの少なくとも一方は複数個あり、
前記共振基板は、複数個の前記給電ユニットまたは複数個の前記受電ユニットに共通とされ、複数の前記共振素子を含んで構成される請求項1~3のいずれか一項に記載の非接触給電装置。 - 前記給電素子および前記受電素子の少なくとも一方の素子定数に合わせて、前記共振素子の素子定数が変更される請求項1~4のいずれか一項に記載の非接触給電装置。
- 前記給電素子は給電コイルであり、前記受電素子は受電コイルであり、前記共振素子は、前記給電コイルに接続された給電側共振コンデンサ、および前記受電コイルに接続された受電側共振コンデンサの少なくとも一方である請求項1~5のいずれか一項に記載の非接触給電装置。
- 前記給電ユニットは、基板生産ラインを構成する複数の基板生産機にそれぞれ同数個ずつ設けられ、前記受電ユニットは、前記複数の基板生産機の列設方向に移動する移動体に設けられた請求項1~6のいずれか一項に記載の非接触給電装置。
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