WO2017133127A1 - 覆晶薄膜及显示装置 - Google Patents
覆晶薄膜及显示装置 Download PDFInfo
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- WO2017133127A1 WO2017133127A1 PCT/CN2016/082220 CN2016082220W WO2017133127A1 WO 2017133127 A1 WO2017133127 A1 WO 2017133127A1 CN 2016082220 W CN2016082220 W CN 2016082220W WO 2017133127 A1 WO2017133127 A1 WO 2017133127A1
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- Prior art keywords
- chip
- lead
- flip chip
- substrate
- output
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49838—Geometry or layout
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/4985—Flexible insulating substrates
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09227—Layout details of a plurality of traces, e.g. escape layout for Ball Grid Array [BGA] mounting
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10128—Display
Definitions
- Embodiments of the present invention relate to a flip chip and a display device.
- a flexible display is a research hotspot in the field of display technology in recent years. Because of its thinner, more vibration-resistant and lighter weight, it will be widely used in civil and military fields.
- a flexible display can be defined as a substrate on which a display panel is fabricated using a very thin flexible substrate that can be bent to a radius of curvature of only a few centimeters or less without damaging the display function of the display panel.
- At least one embodiment of the present invention provides a flip chip comprising: a substrate, and a plurality of mutually independent output pads extending along a first direction disposed on one side of the substrate.
- the method further includes: a chip, and a plurality of leads extending in a second direction and corresponding to each of the output pads; each of the leads is used for corresponding An output pad is connected to the chip.
- the second direction is perpendicular to the first direction.
- each of the output pads constitutes at least one group that is parallel to each other in a direction perpendicular to the first direction, and is sequentially shifted by a certain distance in the first direction. Dislocation structure.
- each of the output pads constitutes at least one set of interposer electrode structures arranged in a direction perpendicular to the first direction.
- each of the interposer electrode structures is arranged at least along the first direction.
- the lead in a flip chip provided in an embodiment of the invention, includes a plurality of sets of sub-leads disposed in different layers.
- the sub-leads located in different layers at least partially overlap in a direction perpendicular to the substrate.
- the chip and each of the output pads are respectively located on two sides of the substrate, and the leads include: the output pad on the substrate a first lead disposed on the same side, and a second lead disposed on the substrate on the same side of the chip; one end of the first lead is connected to a portion of the output pad constituting the interposer electrode structure, and the other end Connecting to the chip through a first via hole penetrating the substrate; one end of the second lead is connected to another portion of the output pad constituting the interposer electrode structure by a second via hole penetrating the substrate, The other end is connected to the chip.
- an output pad connected to the first lead and an output pad connected to the second lead are alternately distributed in the interposer electrode structure.
- the second via is located in a region where the interposer electrode structure is located.
- the second via is located outside the region where the interposing electrode structure is located, and the lead further includes: a layer disposed in the same layer as the first lead a third lead corresponding to the second lead; the one end of the third lead is connected to one end of the corresponding second lead through the second via, and the other end is connected to the finger electrode Another part of the structure is the output pad connection.
- each of the output pads is parallel to each other in a direction perpendicular to the first direction.
- At least one embodiment of the present invention provides a display device comprising: a flexible display panel, and a flip chip according to any one of the claims above bound to a binding area of the flexible display panel; the flexible display panel
- the binding zone has a plurality of input pads extending in the first direction and corresponding to the output pads of the flip chip; the output pads and the input pads of the one-to-one correspondence are crimped Electrical connection.
- the length of the one-to-one corresponding input pad in the first direction is smaller than the length of the output pad in the first direction.
- a width of each of the input pads corresponding to the first direction is greater than a width of the output pad perpendicular to the first direction. The width in the direction.
- FIG. 1 is a schematic structural view of a flip chip according to an embodiment of the present invention.
- 2a is a side view of a flip chip according to an embodiment of the present invention.
- 2b is a cross-sectional view of the flip chip according to the C-C' direction of FIG. 1 according to an embodiment of the present invention
- FIG. 3 is a schematic structural view of a flip chip according to another embodiment of the present invention.
- FIG. 4a is a schematic plan view of a display device according to an embodiment of the present invention.
- FIG. 4b is a partial schematic structural diagram of a display device according to an embodiment of the invention.
- the flexible display device generally first fixes the flexible substrate on the glass substrate, and then performs the flexible display panel manufacturing process.
- the process is compatible with the existing display panel preparation device, and the flexible display panel is completed after the flexible substrate is fabricated. Separating from the glass substrate, and then attaching a back film to the back surface of the flexible substrate to planarize the flexible substrate, and finally performing a process such as COF (Chip On Film) bonding.
- COF Chip On Film
- the inventors of the present application have noticed that the flexible display panel separated from the glass substrate is generally thin, and it is easy to cause the flexible display panel to be subjected to a force and a slight dimensional change during the process of attaching the back film.
- the output pads on the COF are dense and generally arranged in the vertical direction, which is sensitive to dimensional changes, the dimensional change of the flexible display panel may result in a flexible display panel when bound.
- the output pad is misplaced with the output pad on the COF, and the circuit is not connected, which affects the yield.
- a flip chip provided in this embodiment, as shown in FIG. 1, includes: a substrate 10, and a setting A plurality of mutually independent output pads 11 extending along the first direction on one side of the substrate 10, that is, the size of the output pads 11 in the first direction is larger than the size of the output pads 11 in other directions.
- the first direction is parallel to the direction in which the substrate is to be bent; the first direction is the x direction shown in FIG. 1, and generally, the first direction may be a horizontal direction, for example, parallel to a rectangle.
- the long side direction of the display device is parallel to the direction in which the substrate is to be bent; the first direction is the x direction shown in FIG. 1, and generally, the first direction may be a horizontal direction, for example, parallel to a rectangle. The long side direction of the display device.
- the flip chip provided in this embodiment is changed in the vertical direction by extending the output pad 11 from the normal direction to the first direction, so that the span of the output pad 11 in the first direction is large, when the flexible display is displayed.
- the correct alignment of the output pad 11 of the flip chip and the input pad of the flexible display panel can be ensured, thereby improving the binding yield and reliability of the display device.
- the span occupied by the output pad 11 in the vertical direction after the extending in the first direction becomes small, since the size of the substrate of the flexible display panel in the vertical direction does not change, the alignment in the vertical direction is not affected.
- the above vertical direction is the y direction shown in FIG. 1, for example, parallel to the short side direction of the rectangular display device.
- each of the output pads 11 is parallel to each other in a direction perpendicular to the first direction. Therefore, when the flip chip provided in the embodiment is bent, the output pads are not in contact with each other due to deformation. In this case, the pitch of each of the output pads 11 can be set small, so that more output pads can be formed on the substrate.
- the flip chip provided in the first embodiment of the present invention further includes: a chip 13 and a plurality of leads 12 extending in the second direction and corresponding to the output pads 11; 12 is used to connect the corresponding output pad 11 to the chip 13.
- the alignment mark 14 disposed at the position of the most edged lead 12 is generally included for alignment when the flip chip is bonded to the display panel.
- the second direction is perpendicular to the first direction.
- the second direction can be a vertical direction.
- the embodiment includes but is not limited thereto, and the second direction may not be perpendicular to the first direction as long as each lead connects the corresponding output pad to the chip.
- each of the output pads 11 may constitute at least one set of staggered structures that are parallel to each other in a direction perpendicular to the first direction and sequentially shifted by a certain distance in the first direction.
- the sequentially shifted distances in the first direction ensure that the leads can be connected to the chip 13 by being connected to one end of each of the output pads 11.
- each of the output pads 11 can be formed into at least one set of interposer electrode structures A arranged in a direction perpendicular to the first direction. .
- each of the output pads 11 may constitute at least one set of the interposer electrode structures A arranged in the vertical direction.
- Each of the interposing electrode structures A is arranged at least along the first direction (ie, the horizontal direction).
- the multi-row interdigitated electrode structures A may be disposed.
- interposer electrode structure A is a structure including a dislocation structure in which two sets of output pads alternately intersect each other, thereby further optimizing the layout of the output pad 11 and the lead 12 connected thereto on the substrate, thereby More output pads 11 can be formed on the substrate.
- the output pads 11 may be connected to the chips through the leads 12 respectively disposed in different layers. That is, the lead 12 may include a plurality of sets of sub-leads disposed in different layers, each set of sub-leads achieving efficient use of space and mutual insulation by being disposed in different layers. For example, sub-leads located in different layers at least partially overlap in a direction perpendicular to the substrate, thereby saving space.
- the chip 13 and each of the output pads 11 may be respectively disposed on two sides of the substrate 10.
- the lead 12 specifically includes: a first lead 121 disposed on the same side of the substrate 10 as the output pad 11 and a second lead 122 disposed on the same side of the substrate 10 as the chip 13; one end of the first lead 121 and the one forming the interposer electrode structure A Part of the output pad 11 is connected, and the other end is connected to the chip 13 through the first via hole a through the substrate 10; one end of the second lead 122 passes through the second via hole b penetrating the substrate 10 and the other component constituting the interposer electrode structure A A portion of the output pads 11 are connected and the other end is connected to the chip 13.
- the embodiment includes, but is not limited to, the first lead and the second lead described above, and the lead 12 may further include more sub-leads disposed in different layers.
- the output pad 11 connected to the first lead 121 and the output pad 11 connected to the second lead 122 are alternately distributed on the interposer electrode structure A. in.
- the second via b connecting the second lead 122 and the corresponding output pad 11 may be located in the region 15 where the interposer electrode structure A is located (Fig. In the case of such a flip chip, when the flip chip is bonded to the flexible display substrate, the second via b will fall into the bonding region 15.
- the second The via hole b is located outside the region 15 of the interposer electrode structure A (shown by a broken line in the figure).
- the lead 12 may further include: a third lead 123 disposed in the same layer as the first lead 121 and corresponding to the second lead 122; one end of the third lead 123 passes through the second via b It is connected to one end of the corresponding second lead 122, and the other end is connected to another part of the output pad 11 constituting the interposer electrode structure A.
- the present embodiment provides a display device, as shown in FIG. 4a, the display device includes a flexible display panel 200, and the flip chip 100 provided in the above embodiment, which is bound to the binding region 15 of the flexible display panel 200; As shown in FIG. 4b, the flexible display panel has a plurality of input pads 21 corresponding to the output pads 11 of the flip chip in a first direction, and a corresponding one of the output pads 11 and the input pads. 21 is electrically connected by crimping. It should be noted that, in this embodiment, the one-to-one corresponding output pad 11 and the input pad 21 can be electrically connected by other means, which is not limited herein. It should be noted that generally, the first direction may be a horizontal direction.
- the display device may be any product or component having a display function, such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator, and the like.
- a display function such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator, and the like.
- a display device reference may be made to the above embodiment of the flip chip, and the repeated description will not be repeated.
- the input pad 21 and the output pad 11 always have the same overlapping area, and the binding is ensured.
- the uniformity of the effect is as shown in FIG. 4b, and the length L1 of the one-to-one corresponding input pad 21 in the first direction is smaller than the length L2 of the output pad 11 in the first direction.
- the first direction may be a horizontal direction.
- the input pad 21 and the output pad 11 always have the same coincidence.
- the area, the uniformity of the binding effect is ensured, as shown in FIG. 4b, the width D1 of the one-to-one corresponding input pad 21 in the direction perpendicular to the first direction is greater than the length D2 of the output pad 11 in the direction perpendicular to the first direction.
- the above direction perpendicular to the first direction may be a vertical direction.
- the flip chip has a plurality of mutually independent output pads extending along the first direction on the substrate side; correspondingly, the display
- the flexible display panel in the device has a plurality of input pads corresponding to the output pads of the flip chip in a first direction, and the one-to-one corresponding output pads and the input pads are electrically connected by crimping. .
- the input pad and the output pad occupy a larger span in the first direction, when the size of the flexible display panel
- the correct alignment of the output pad of the flip chip and the input pad of the flexible display panel can be ensured, thereby improving the binding yield and reliability of the display device.
- the span of the input pad and the output pad in the vertical direction after extending in a direction perpendicular to the first direction becomes small, since the size of the flexible display panel in the direction perpendicular to the first direction does not change, Therefore, it does not affect the alignment in the vertical direction.
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Abstract
Description
Claims (16)
- 一种覆晶薄膜,包括:基材,以及设置在所述基材一侧的沿着第一方向延伸的多个相互独立的输出垫。
- 如权利要求1所述的覆晶薄膜,还包括:芯片,以及多条沿着第二方向延伸的与各所述输出垫一一对应的引线,其中,各所述引线用于将对应的输出垫连接至所述芯片。
- 如权利要求2所述的覆晶薄膜,其中,所述第二方向垂直于所述第一方向。
- 如权利要求2或3任一项所述的覆晶薄膜,其中,各所述输出垫组成至少一组在垂直于所述第一方向的方向上相互平行,在所述第一方向上依次错开一定距离的错位结构。
- 如权利要求2或3所述的覆晶薄膜,其中,各所述输出垫组成至少一组沿着垂直于所述第一方向的方向上排列的插指电极结构。
- 如权利要求5所述的覆晶薄膜,其中,各组所述插指电极结构至少沿着所述第一方向排列。
- 如权利要求2-6任一项所述的覆晶薄膜,其中,所述引线包括设置在不同层的多组子引线。
- 如权利要求7所述的覆晶薄膜,其中,位于不同层的所述子引线在垂直于所述基材的方向上至少部分重叠。
- 如权利要求5所述的覆晶薄膜,其中,所述芯片与各所述输出垫分别位于所述基材的两侧,所述引线包括:在所述基材上与所述输出垫同侧设置的第一引线,以及在所述基材上与所述芯片同侧设置的第二引线;其中,所述第一引线的一端与组成所述插指电极结构的部分输出垫连接,另一端通过贯穿所述基材的第一过孔与所述芯片连接;所述第二引线的一端通过贯穿所述基材的第二过孔与组成所述插指电极结构的另一部分输出垫连接,另一端与所述芯片连接。
- 如权利要求9所述的覆晶薄膜,其中,与所述第一引线连接的输出垫和与所述第二引线连接的输出垫交替分布于所述插指电极结构。
- 如权利要求9所述的覆晶薄膜,其中,所述第二过孔位于所述插指电极结构所在区域内。
- 如权利要求9所述的覆晶薄膜,其中,所述第二过孔位于所述插指电极结构所在区域的外侧,所述引线还包括:与所述第一引线同层设置的与所述第二引线一一对应的第三引线;所述第三引线的一端通过所述第二过孔与对应的所述第二引线的一端连接,另一端与所述组成所述插指电极结构的另一部分输出垫连接。
- 如权利要求1-12任一项所述覆晶薄膜,其中,各所述输出垫在垂直于所述第一方向的方向上相互平行。
- 一种显示装置,包括:柔性显示面板,以及绑定于所述柔性显示面板的绑定区之上的如权利要求1-13任一项所述的覆晶薄膜;其中,所述柔性显示面板在绑定区具有沿着所述第一方向延伸的多个与所述覆晶薄膜的输出垫一一对应的输入垫,各一一对应的所述输出垫和所述输入垫通过压接方式电连接。
- 如权利要求14所述的显示装置,其中,各一一对应的所述输入垫在所述第一方向上的长度小于所述输出垫在所述第一方向上的长度。
- 如权利要求14所述的显示装置,其中,各一一对应的所述输入垫在垂直于所述第一方向的方向上的宽度大于所述输出垫在垂直于所述第一方向的方向上的宽度。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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US15/538,340 US10340215B2 (en) | 2016-02-04 | 2016-05-16 | Chip on film and display device |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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CN201610079781.7 | 2016-02-04 | ||
CN201610079781.7A CN105513498B (zh) | 2016-02-04 | 2016-02-04 | 一种覆晶薄膜及显示装置 |
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WO2017133127A1 true WO2017133127A1 (zh) | 2017-08-10 |
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PCT/CN2016/082220 WO2017133127A1 (zh) | 2016-02-04 | 2016-05-16 | 覆晶薄膜及显示装置 |
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US (1) | US10340215B2 (zh) |
CN (1) | CN105513498B (zh) |
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Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
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CN105513498B (zh) * | 2016-02-04 | 2018-12-25 | 京东方科技集团股份有限公司 | 一种覆晶薄膜及显示装置 |
CN108417151B (zh) * | 2018-02-02 | 2020-04-10 | 武汉华星光电半导体显示技术有限公司 | 显示装置及其覆晶薄膜结构 |
CN108663861A (zh) * | 2018-06-22 | 2018-10-16 | Oppo广东移动通信有限公司 | 一种液晶显示装置 |
CN108828855A (zh) * | 2018-06-22 | 2018-11-16 | Oppo广东移动通信有限公司 | 一种显示装置 |
CN109168250B (zh) | 2018-10-24 | 2020-04-17 | 合肥鑫晟光电科技有限公司 | 一种电路板及其制作方法、使用方法、显示装置 |
WO2020113384A1 (zh) * | 2018-12-03 | 2020-06-11 | 深圳市柔宇科技有限公司 | 显示装置 |
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US10340215B2 (en) | 2019-07-02 |
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CN105513498B (zh) | 2018-12-25 |
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