WO2017113800A1 - 一种柔性电路板及移动终端 - Google Patents

一种柔性电路板及移动终端 Download PDF

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Publication number
WO2017113800A1
WO2017113800A1 PCT/CN2016/093916 CN2016093916W WO2017113800A1 WO 2017113800 A1 WO2017113800 A1 WO 2017113800A1 CN 2016093916 W CN2016093916 W CN 2016093916W WO 2017113800 A1 WO2017113800 A1 WO 2017113800A1
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WO
WIPO (PCT)
Prior art keywords
layer
hole
ring
layers
circuit board
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PCT/CN2016/093916
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English (en)
French (fr)
Inventor
黄占肯
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广东欧珀移动通信有限公司
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Application filed by 广东欧珀移动通信有限公司 filed Critical 广东欧珀移动通信有限公司
Publication of WO2017113800A1 publication Critical patent/WO2017113800A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB

Definitions

  • the present invention relates to electrical connection technologies, and in particular, to a flexible circuit board and a mobile terminal.
  • Flexible printed circuit is a common electrical connection device in various mobile terminals. One end is soldered to the connector. The connector can be connected to the connector on the motherboard. The other end of the flexible circuit board can be connected. Camera, etc., to achieve signal transmission.
  • FPC Flexible printed circuit
  • a signal is transmitted through a flexible circuit board, a certain amount of heat is generated on the flexible circuit board. If the heat cannot be dissipated in time, the speed and quality of the signal transmission may be affected, so that the heat dissipation performance of the existing flexible circuit board needs to be improved. .
  • the technical problem to be solved by the present invention is to provide a flexible circuit board and a mobile terminal, which can improve heat dissipation performance.
  • an embodiment of the present invention provides a flexible circuit board including two wiring layers and an intermediate layer disposed between two layers of the wiring layers and The two layers of the wiring layer are electrically isolated; the flexible circuit board is provided with a via hole, the through hole penetrating through the two layers of the wiring layer and the intermediate layer, and the via hole is provided with a conductive layer a layer, the conductive layer is connected to the two layers of the wiring layer to electrically connect the two layers of the wiring layer; the via hole is filled with a heat conductive material to form a solid heat conducting column.
  • a mobile terminal comprising a flexible circuit board comprising two layers of wiring layers and an intermediate layer, the intermediate layer being disposed between two layers of the routing layers and two layers
  • the wiring layer is electrically isolated; the flexible circuit board is provided with a via hole, the through hole penetrating through the two layers of the wiring layer and the intermediate layer, and a conductive layer is disposed on the hole wall of the via hole.
  • the conductive layer is connected to the two layers of the wiring layer to electrically connect the two layers of the wiring layer; the via hole is filled with a heat conductive material to form a solid heat conducting column.
  • the solid heat conducting column can absorb more heat, thereby enhancing the heat dissipation capability of the flexible circuit board; at the same time, the via hole is filled into a solid, and the via hole can be improved.
  • FIG. 1 is a cross-sectional view of a flexible circuit board provided by a preferred embodiment of the present invention
  • FIG. 2 is a structural block diagram of a mobile terminal according to an embodiment of the present invention.
  • a flexible circuit board comprising two wiring layers and an intermediate layer disposed between two layers of the wiring layers and electrically isolating two layers of the wiring layers; the flexible circuit board a via hole is disposed through the two layers of the trace layer and the intermediate layer, and a conductive layer is disposed on the hole wall of the via hole, and the conductive layer is connected to the two layers of the trace layer.
  • the two layers of the wiring layer are electrically connected; the via hole is filled with a heat conductive material to form a solid heat conducting column.
  • the intermediate layer includes a first plastic layer, a first copper foil layer, a base layer, a second copper foil layer and a second plastic layer, which are sequentially stacked, the first copper foil layer and the second copper foil layer Both are insulated from the conductive layer.
  • the first copper foil layer is provided with a first through hole
  • the second copper foil is provided with a second through hole
  • the through hole penetrates the first through hole and the second through hole And the three are coaxially disposed
  • the outer side of the conductive layer is provided with a first hole ring and a second hole ring, and the first hole ring and the second hole ring are disposed along a circumference of the through hole
  • the first hole ring is located between the first plastic layer and the base layer, and the outer diameter of the first hole ring is smaller than the diameter of the first through hole; the second hole ring is located at the first Between the two plastic layers and the base layer, the outer diameter of the second hole ring is smaller than the diameter of the second through hole.
  • the outer side of the conductive layer is provided with a third hole ring and a fourth hole ring, and the third hole ring and The fourth aperture ring is annularly disposed along a circumferential direction of the via hole; the third aperture ring is located at a position on the conductive layer corresponding to the trace layer, the third hole The ring is electrically connected to the trace on the trace layer; the fourth via ring is located at a position on the conductive layer corresponding to another of the trace layers, and the fourth aperture ring is adjacent to another The electrical connection of the traces on the trace layer.
  • the heat conducting column is made of copper or tin material.
  • the heat conducting column is made of thermal conductive glue.
  • the flexible circuit board further includes a heat dissipation plate disposed on a side of the wiring layer away from the intermediate layer, and the heat dissipation plate is connected to the heat conduction column to heat the heat conduction column Transfer to the heat sink.
  • the heat dissipation plate and the wiring layer are connected by a thermal conductive adhesive.
  • the heat dissipation plate and the heat conducting column are bonded by a thermal conductive adhesive.
  • a mobile terminal comprising a flexible circuit board comprising two layers of wiring layers and an intermediate layer, the intermediate layer being disposed between two layers of the routing layers and two layers of the routing layers Electrically isolating; the flexible circuit board is provided with a via hole penetrating through the two layers of the wiring layer and the intermediate layer, and a conductive layer is disposed on the hole wall of the via hole, and the conductive layer is connected The two layers of the wiring layer are electrically connected to each other; the via holes are filled with a heat conductive material to form a solid heat conducting column.
  • the intermediate layer includes a first plastic layer, a first copper foil layer, a base layer, a second copper foil layer and a second plastic layer, which are sequentially stacked, the first copper foil layer and the second copper foil layer Both are insulated from the conductive layer.
  • the first copper foil layer is provided with a first through hole
  • the second copper foil is provided with a second through hole
  • the through hole penetrates the first through hole and the second through hole And the three are coaxially disposed
  • the outer side of the conductive layer is provided with a first hole ring and a second hole ring, and the first hole ring and the second hole ring are disposed along a circumference of the through hole
  • the first hole ring is located between the first plastic layer and the base layer, and the outer diameter of the first hole ring is smaller than the diameter of the first through hole; the second hole ring is located at the first Between the two plastic layers and the base layer, the outer diameter of the second hole ring is smaller than the diameter of the second through hole.
  • the outer side of the conductive layer is provided with a third hole ring and a fourth hole ring, and the third hole ring and the fourth hole ring are both annularly arranged along the circumferential direction of the through hole; a third aperture ring is located at a position on the conductive layer corresponding to the trace layer, the third aperture ring is electrically connected to a trace on the trace layer; the fourth aperture ring is located at the a position on the conductive layer corresponding to another of the trace layers Wherein the fourth aperture ring is electrically connected to the trace on the other of the wiring layers.
  • the heat conducting column is made of copper or tin material.
  • the heat conducting column is made of thermal conductive glue.
  • the flexible circuit board further includes a heat dissipation plate disposed on a side of the wiring layer away from the intermediate layer, and the heat dissipation plate is connected to the heat conduction column to heat the heat conduction column Transfer to the heat sink.
  • the heat dissipation plate and the wiring layer are connected by a thermal conductive adhesive.
  • the heat dissipation plate and the heat conducting column are bonded by a thermal conductive adhesive.
  • the mobile terminal further includes a main board and electronic components, and the electronic components are connected to the main board through a flexible circuit board.
  • the electronic component is a camera and/or a button.
  • an embodiment of the present invention provides a mobile terminal 100 as shown in FIG. 2, which has a flexible circuit board 200.
  • the mobile terminal 100 can be any terminal device such as a tablet computer, a mobile phone, an e-reader, a remote controller, a personal computer (PC), a notebook computer, an in-vehicle device, a network television, a wearable device, and the like.
  • the mobile terminal 100 further includes a main board 300 and an electronic component 400.
  • the electronic component 400 can be a camera, a button, or the like.
  • the electronic component 400 and the main board 300 are connected by a flexible circuit board 200.
  • the flexible circuit board 1 is a cross-sectional view of a flexible circuit board provided by a preferred embodiment of the present invention.
  • the flexible circuit board 1 includes two wiring layers 1a, 1b and an intermediate layer 2, and the intermediate layer 2 is disposed on two layers of the wiring layer 1a. Between 1b and electrically separate the two wiring layers 1a, 1b.
  • a via 10 is disposed on the flexible circuit board.
  • the via 10 extends through the two wiring layers 1a, 1b and the intermediate layer 2.
  • the conductive layer 101 is disposed on the hole wall of the via 10, and the conductive layer 101 is connected to the two wiring layers. 1a, 1b to electrically connect the two wiring layers 1a, 1b.
  • Utilizing the conductive layer 101 in the via 10 allows electrical connection between the two wiring layers 1a, 1b to achieve signal communication between the two layers of traces.
  • the conductive layer 101 may be plated on the walls of the vias 10.
  • the number of the vias 10 can be determined according to the number of traces that need to be turned on between the two trace layers 1a and 1b. Therefore, the number of vias 10 can be plural as needed, and the number is not limited in this embodiment.
  • the through hole 10 is filled with a heat conductive material to form a solid heat conducting column 102.
  • a heat conducting column 102 Through the heat conducting column 102, the heat conducting capability of the flexible circuit board can be increased, and the solid heat conducting column 102 can absorb more heat, thereby enhancing the heat dissipation capability of the flexible circuit board.
  • the via 10 is filled to be solid, and the reliability of the connection of the conductive layer 101 and the wiring layer in the via 10 can be improved.
  • the intermediate layer 2 includes a first plastic layer 21a, a first copper foil layer 22a, a base layer 20, a second copper foil layer 22b, and a second plastic layer 21b, which are sequentially stacked, a first copper foil layer 22a and a second copper foil layer 22b. Both are insulated from the conductive layer 101 such that both the first copper foil layer 22a and the second copper foil layer 22b are electrically isolated from the conductive layer 101.
  • the first copper foil layer 22a and the second copper foil layer 22b can absorb the conduction heat, thereby improving the heat dissipation performance of the flexible circuit board, and at the same time, enhancing the structural strength of the flexible circuit board, increasing the number of bends of the flexible circuit board, thereby extending The life of a flexible circuit board.
  • the first plastic layer 21a and the second plastic layer 21b may be made of a thermally conductive plastic material such as a thermal conductive silica gel to improve heat transfer capability.
  • the first plastic layer 21a can insulate the first copper foil layer 22a from the wiring layer 1a to prevent the first copper foil layer 22a from electrically conducting with the wiring layers 1a, 1b to affect signal transmission.
  • the second plastic layer 21b can insulate the second copper foil layer 22b from the wiring layer 1b to prevent the second copper foil layer 22b from being electrically connected to the wiring layer 1b to affect signal transmission.
  • a first through hole 220a is disposed on the first copper foil layer 22a, and a second through hole 220b is disposed on the second copper foil layer 22b; the through hole 10 is disposed through the first through hole 220a and the second through hole 220b, and the three Coaxial settings.
  • the first hole ring 101a and the second hole ring 101b are provided on the outer side of the conductive layer 101, and the first hole ring 101a and the second hole ring 101b are annular shapes provided along the circumferential direction of the via hole 10.
  • the first hole ring 101a is located between the first plastic layer 21a and the base layer 20.
  • the outer diameter of the first hole ring 101a is smaller than the diameter of the first through hole 220a to prevent the first hole ring 101a from contacting the first copper foil layer 22a. connection.
  • the second aperture ring 101b is located between the second plastic layer 21b and the base layer 20.
  • the outer diameter of the second aperture ring 101b is smaller than the aperture of the second through hole 220b to prevent the second aperture ring 101b from contacting the second copper foil layer 22b. connection.
  • the structural strength of the conductive layer 101 can be improved by using the first aperture ring 101a and the second aperture ring 101b, and the conductive layer 101 is prevented from being broken during the bending process of the flexible circuit board, thereby affecting signal transmission.
  • the outer side of the conductive layer 101 is provided with a third hole ring 101c and a fourth hole ring 101d.
  • the third hole ring 101c and the fourth hole ring 101d are both annular in the circumferential direction of the through hole 10, and the third hole ring 101c is located.
  • the third hole ring 101c is electrically connected to the wiring on the wiring layer 1a, and the third hole ring 101c can facilitate the conductive layer 101 and the wiring layer 1a.
  • the electrical connection of the wires improves the electrical connection between the two.
  • the fourth hole ring 101d is located on the conductive layer 101 at a position corresponding to the other wiring layer 1b, The four-hole ring 101d is electrically connected to the trace on the other wiring layer 1b.
  • the fourth hole ring 101d can facilitate the electrical connection between the conductive layer 101 and the trace on the wiring layer 1b, and improve the electrical connection performance between the two.
  • the heat conducting column 102 is made of a metal material such as copper or tin. During processing and preparation, copper or tin can be melted into a paste and filled into the via hole 10 to form a heat conducting column 102, which can improve thermal conductivity by using copper or tin. The conductivity of the conductive layer 101 can be improved, and the signal transmission efficiency can be improved.
  • the flexible circuit board further includes a heat dissipation plate 3 disposed on a side of the wiring layer 1a away from the intermediate layer 2, and the heat dissipation plate 3 is connected to the heat conduction column 102 to transfer heat on the heat conduction column 102 to the heat dissipation plate 3,
  • the heat dissipation by the heat dissipation plate 3 further improves the heat dissipation capability of the flexible circuit board.
  • the heat dissipation plate 3 and the heat conductive column 102 are bonded by a thermal conductive adhesive, and the heat transfer adhesive can improve the heat transfer capability between the heat dissipation plate 3 and the heat conductive column 102.
  • the heat dissipation plate 3 and the wiring layers 1a and 1b are bonded by a thermal conductive adhesive, and the thermal conductive adhesive can improve the heat transfer capability between the heat dissipation plate 3 and the wiring layer 1a, thereby enhancing the heat dissipation effect.
  • the thermal conductive adhesive can insulate between the heat dissipation plate 3 and the wiring layer 1a, thereby preventing the electrical connection between the two from affecting the signal transmission capability.
  • the heat dissipation plate 3 and the flexible circuit can be firmly connected, and the heat dissipation plate 3 can function as a reinforcing plate to improve the structural strength of a certain portion of the flexible circuit board.
  • the heat dissipation plate 3 may be two and connected to the two wiring layers 1a, 1b, respectively.
  • the heat dissipation plate 3 may also be one, and is connected only to one of the wiring layers 1a.
  • the heat conducting column 102 is made of a metal material.
  • the heat conducting column 102 can also be made of other heat conducting materials, such as a thermal conductive adhesive, and heat is disposed on the wiring layers 1a, 1b.
  • the heat dissipation plate 3 is bonded to the wiring layers 1a and 1b by a thermal conductive adhesive.
  • the thermal conductive adhesive can be filled in the via hole 10. Thereby facilitating processing and preparation.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

一种柔性电路板(200)及移动终端(100)，所述柔性电路板(200)包括两层走线层(1a、1b)及中间层(2)，中间层(2)设置在两层走线层(1a、1b)之间并将两层走线层(1a、1b)电隔离；柔性电路板(200)上设置有过孔(10)，过孔(10)贯穿两层走线层(1a、1b)及中间层(2)，过孔(10)的孔壁上设有导电层(101)，导电层(101)连接于两层所述走线层(1a、1b)，以将两层所述走线层(1a、1b)电连接；过孔(10)内填充有导热材质以形成实心的导热柱(102)。实心的导热柱(102)可吸收更多热量，从而增强柔性电路板(200)的散热能力；同时将过孔(10)填充为实心，能够提高过孔(10)中导电层(101)与走线层(1a、1b)连接的可靠性。

Description

一种柔性电路板及移动终端 技术领域
本发明涉及电连接技术，尤其涉及一种柔性电路板及移动终端。
背景技术
柔性电路板(FPC，Flexible Printed Circuit)为各类移动终端中的常用电连接器件，其一端与连接头焊接，连接头可以与主板上的连接座对应插接，柔性电路板的另一端可以连接摄像头等，以实现信号传递。在进行信号传递有电流经过柔性电路板时，会产生在柔性电路板上产生一定热量，这些热量若无法及时散发出去，会影响信号传递速度及质量，因此需要提高现有柔性电路板的散热性能。
发明内容
本发明所要解决的技术问题在于，提供一种柔性电路板及移动终端，能够提高散热性能。
为了解决上述技术问题，一方面，本发明的实施例提供了一种柔性电路板，包括两层走线层、及中间层，所述中间层设置在两层所述走线层之间并将两层所述走线层电隔离；所述柔性电路板上设置有过孔，所述过孔贯穿两层所述走线层及所述中间层，所述过孔的孔壁上设有导电层，所述导电层连接于两层所述走线层，以将两层所述走线层电连接；所述过孔内填充有导热材质以形成实心的导热柱。
另一方面，提供一种移动终端，包括柔性电路板，所述柔性电路板包括两层走线层、及中间层，所述中间层设置在两层所述走线层之间并将两层所述走线层电隔离；所述柔性电路板上设置有过孔，所述过孔贯穿两层所述走线层及所述中间层，所述过孔的孔壁上设有导电层，所述导电层连接于两层所述走线层，以将两层所述走线层电连接；所述过孔内填充有导热材质以形成实心的导热柱。
本发明提供的柔性电路板及移动终端，实心的导热柱可吸收更多热量，从而增强柔性电路板的散热能力；同时将过孔填充为实心，能够提高过孔中 导电层与走线层连接的可靠性。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动性的前提下，还可以根据这些附图获得其他的附图。
图1是本发明优选实施例提供的柔性电路板的剖面图；
图2是本发明实施例提供的移动终端的结构框图。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
一种柔性电路板，包括两层走线层、及中间层，所述中间层设置在两层所述走线层之间并将两层所述走线层电隔离；所述柔性电路板上设置有过孔，所述过孔贯穿两层所述走线层及所述中间层，所述过孔的孔壁上设有导电层，所述导电层连接于两层所述走线层，以将两层所述走线层电连接；所述过孔内填充有导热材质以形成实心的导热柱。
其中，所述中间层包括依次层叠设置的第一塑胶层、第一铜箔层、基层、第二铜箔层及第二塑胶层，所述第一铜箔层及所述第二铜箔层二者均与所述导电层绝缘设置。
其中，所述第一铜箔层上设置有第一通孔，所述第二铜箔上设置有第二通孔；所述过孔穿设所述第一通孔及所述第二通孔，且三者同轴设置；所述导电层的外侧设置有第一孔环和第二孔环，所述第一孔环及所述第二孔环为沿所述过孔的周向设置的环状；所述第一孔环位于所述第一塑胶层和基层之间，所述第一孔环的外径小于所述第一通孔的孔径；所述第二孔环位于所述第二塑胶层和基层之间，所述第二孔环的外径小于所述第二通孔的孔径。
其中，所述导电层的外侧设置有第三孔环和第四孔环，所述第三孔环及 所述第四孔环均为沿所述过孔的周向设置的环状；所述第三孔环位于所述导电层上与所述走线层相对应的位置处，所述第三孔环与所述走线层上的走线电连接；所述第四孔环位于所述导电层上与另一所述走线层相对应的位置处，所述第四孔环与另一所述走线层上的走线电连接。
其中，所述导热柱为铜或锡材料制成。
其中，所述导热柱为导热胶制成。
其中，所述柔性电路板还包括散热板，所述散热板设置在所述走线层远离中间层的一侧，所述散热板与所述导热柱相连，以使所述导热柱上的热量传递至所述散热板上。
其中，所述散热板与所述走线层之间通过导热胶连接。
其中，所述散热板与所述导热柱之间通过导热胶粘接。
一种移动终端，包括柔性电路板，所述柔性电路板包括两层走线层、及中间层，所述中间层设置在两层所述走线层之间并将两层所述走线层电隔离；所述柔性电路板上设置有过孔，所述过孔贯穿两层所述走线层及所述中间层，所述过孔的孔壁上设有导电层，所述导电层连接于两层所述走线层，以将两层所述走线层电连接；所述过孔内填充有导热材质以形成实心的导热柱。
其中，所述中间层包括依次层叠设置的第一塑胶层、第一铜箔层、基层、第二铜箔层及第二塑胶层，所述第一铜箔层及所述第二铜箔层二者均与所述导电层绝缘设置。
其中，所述第一铜箔层上设置有第一通孔，所述第二铜箔上设置有第二通孔；所述过孔穿设所述第一通孔及所述第二通孔，且三者同轴设置；所述导电层的外侧设置有第一孔环和第二孔环，所述第一孔环及所述第二孔环为沿所述过孔的周向设置的环状；所述第一孔环位于所述第一塑胶层和基层之间，所述第一孔环的外径小于所述第一通孔的孔径；所述第二孔环位于所述第二塑胶层和基层之间，所述第二孔环的外径小于所述第二通孔的孔径。
其中，所述导电层的外侧设置有第三孔环和第四孔环，所述第三孔环及所述第四孔环均为沿所述过孔的周向设置的环状；所述第三孔环位于所述导电层上与所述走线层相对应的位置处，所述第三孔环与所述走线层上的走线电连接；所述第四孔环位于所述导电层上与另一所述走线层相对应的位置 处，所述第四孔环与另一所述走线层上的走线电连接。
其中，所述导热柱为铜或锡材料制成。
其中，所述导热柱为导热胶制成。
其中，所述柔性电路板还包括散热板，所述散热板设置在所述走线层远离中间层的一侧，所述散热板与所述导热柱相连，以使所述导热柱上的热量传递至所述散热板上。
其中，所述散热板与所述走线层之间通过导热胶连接。
其中，所述散热板与所述导热柱之间通过导热胶粘接。
其中，所述移动终端还包括主板及电子元件，所述电子元件与主板之间通过柔性电路板相连。
其中，所述电子元件为摄像头和/或按键。
请一并参阅图1及图2，本发明实施例提供了一种如图2所示的移动终端100，其具有柔性电路板200。该移动终端100可以是任何终端设备，例如：平板电脑、手机、电子阅读器、遥控器、个人计算机(Personal Computer，PC)、笔记本电脑、车载设备、网络电视、可穿戴设备等。该移动终端100还包括主板300及电子元件400，电子元件400可以为摄像头、按键等。电子元件400与主板300之间通过柔性电路板200相连。
参见图1，为本发明中优选实施例提供的柔性电路板的剖面图，柔性电路板1包括两层走线层1a、1b及中间层2，中间层2设置在两层走线层1a、1b之间并将两层走线层1a、1b电隔离。柔性电路板上设置有过孔10，过孔10贯穿两层走线层1a、1b及中间层2，过孔10的孔壁上设有导电层101，导电层101连接于两层走线层1a、1b，以将两层走线层1a、1b电连接。
利用过孔10中的导电层101可以使得两层走线层1a、1b之间电连接，实现两层走线之间的信号连通。导电层101可以电镀于过孔10的孔壁上。根据两层走线层1a、1b之间需要导通的走线数目可以确定过孔10的数目，因此过孔10的数目根据需要可以为多个，本实施例并不对其数目进行限定。
过孔10内填充有导热材质以形成实心的导热柱102，通过导热柱102，可以增加柔性电路板的热传导能力，实心的导热柱102可吸收更多热量，从而增强柔性电路板的散热能力。同时将过孔10填充为实心，能够提高过孔10中导电层101与走线层连接的可靠性。
中间层2包括依次层叠设置的第一塑胶层21a、第一铜箔层22a、基层20、第二铜箔层22b及第二塑胶层21b，第一铜箔层22a及第二铜箔层22b二者均与导电层101绝缘设置，以使得第一铜箔层22a及第二铜箔层22b二者均与导电层101电隔离。
利用第一铜箔层22a和第二铜箔层22b可以吸收传导热量，从而提高柔性电路板的散热性能，同时可以增强柔性电路板的结构强度，提高柔性电路板的可弯折次数，从而延长柔性电路板的使用寿命。作为优选，第一塑胶层21a、第二塑胶层21b均可以为导热硅胶等导热的塑胶材质制成，以提高热传递能力。
第一塑胶层21a可以将第一铜箔层22a与走线层1a绝缘隔离，避免第一铜箔层22a与走线层1a、1b电导通而影响信号传输。第二塑胶层21b可以将第二铜箔层22b与走线层1b绝缘隔离，避免第二铜箔层22b与走线层1b电导通而影响信号传输。
第一铜箔层22a上设置有第一通孔220a，第二铜箔层22b上设置有第二通孔220b；过孔10穿设第一通孔220a及第二通孔220b，且三者同轴设置。导电层101的外侧设置有第一孔环101a和第二孔环101b，第一孔环101a及第二孔环101b为沿过孔10的周向设置的环状。
第一孔环101a位于第一塑胶层21a和基层20之间，第一孔环101a的外径小于第一通孔220a的孔径，以避免第一孔环101a与第一铜箔层22a接触电连接。第二孔环101b位于第二塑胶层21b和基层20之间，第二孔环101b的外径小于第二通孔220b的孔径，以避免第二孔环101b与第二铜箔层22b接触电连接。
利用第一孔环101a和第二孔环101b可以提高导电层101的结构强度，避免在柔性电路板弯折过程中导电层101发生折断，影响信号传递。
导电层101的外侧设置有第三孔环101c和第四孔环101d，第三孔环101c及第四孔环101d均为沿过孔10的周向设置的环状，第三孔环101c位于导电层101上与走线层1a相对应的位置处，第三孔环101c与走线层1a上的走线电连接，利用第三孔环101c可以便于导电层101与走线层1a上走线的电连接，且提高二者之间的电连接性能。
第四孔环101d位于导电层101上与另一走线层1b相对应的位置处，第 四孔环101d与另一走线层1b上的走线电连接。利用第四孔环101d可以便于导电层101与走线层1b上走线的电连接，且提高二者之间的电连接性能。
导热柱102为铜或锡等金属材料制成，加工制备过程中，可以将铜或锡熔化成膏状，填充到过孔10中，从而形成导热柱102，利用铜或锡即可以提高导热能力，可以提高导电层101的导电能力，提高信号传递效率。
柔性电路板还包括散热板3，散热板3设置在走线层1a远离中间层2的一侧，散热板3与导热柱102相连，以使导热柱102上的热量传递至散热板3上，通过散热板3进行散热，从而进一步提高柔性电路板的散热能力。
散热板3与导热柱102之间通过导热胶粘接，利用导热胶可以提高散热板3与导热柱102之间的热传递能力。
散热板3与走线层1a、1b之间通过导热胶粘接，利用导热胶可以提高散热板3与走线层1a之间的热传递能力，增强散热效果。导热胶可以使得散热板3与走线层1a之间绝缘，避免二者之间电连接影响信号传递能力。同时，可以使得散热板3与柔性电路连接牢固，散热板3可以起到补强板的作用，以提高柔性电路板上某部分的结构强度。进一步，散热板3可以为两个，分别连接于两个走线层1a、1b。当然，在其他实施方式中，散热板3也可以为一个，仅连接于其中一个走线层1a。
在上述实施方式中，导热柱102为金属材料制成，在另一种实施方式中，导热柱102还可以为其他导热材质制成，例如导热胶，且在走线层1a、1b上设置散热板3，散热板3通过导热胶粘接于走线层1a、1b，在利用导热胶将散热板3粘接于走线层1a、1b时，便可以将导热胶填充于过孔10中，从而方便加工制备。
以上的实施方式，并不构成对该技术方案保护范围的限定。任何在上述实施方式的精神和原则之内所作的修改、等同替换和改进等，均应包含在该技术方案的保护范围之内。

Claims (20)

  1. 一种柔性电路板，其特征在于，包括两层走线层、及中间层，所述中间层设置在两层所述走线层之间并将两层所述走线层电隔离；
    所述柔性电路板上设置有过孔，所述过孔贯穿两层所述走线层及所述中间层，所述过孔的孔壁上设有导电层，所述导电层连接于两层所述走线层，以将两层所述走线层电连接；所述过孔内填充有导热材质以形成实心的导热柱。
  2. 根据权利要求1所述的柔性电路板，其特征在于，所述中间层包括依次层叠设置的第一塑胶层、第一铜箔层、基层、第二铜箔层及第二塑胶层，所述第一铜箔层及所述第二铜箔层二者均与所述导电层绝缘设置。
  3. 根据权利要求2所述的柔性电路板，其特征在于，所述第一铜箔层上设置有第一通孔，所述第二铜箔上设置有第二通孔；
    所述过孔穿设所述第一通孔及所述第二通孔，且三者同轴设置；
    所述导电层的外侧设置有第一孔环和第二孔环，所述第一孔环及所述第二孔环为沿所述过孔的周向设置的环状；所述第一孔环位于所述第一塑胶层和基层之间，所述第一孔环的外径小于所述第一通孔的孔径；所述第二孔环位于所述第二塑胶层和基层之间，所述第二孔环的外径小于所述第二通孔的孔径。
  4. 根据权利要求1所述的柔性电路板，其特征在于，所述导电层的外侧设置有第三孔环和第四孔环，所述第三孔环及所述第四孔环均为沿所述过孔的周向设置的环状；
    所述第三孔环位于所述导电层上与所述走线层相对应的位置处，所述第三孔环与所述走线层上的走线电连接；
    所述第四孔环位于所述导电层上与另一所述走线层相对应的位置处，所述第四孔环与另一所述走线层上的走线电连接。
  5. 根据权利要求1所述的柔性电路板，其特征在于，所述导热柱为铜或锡材料制成。
  6. 根据权利要求1所述的柔性电路板，其特征在于，所述导热柱为导热胶制成。
  7. 根据权利要求1所述的柔性电路板，其特征在于，所述柔性电路板 还包括散热板，所述散热板设置在所述走线层远离中间层的一侧，所述散热板与所述导热柱相连，以使所述导热柱上的热量传递至所述散热板上。
  8. 根据权利要求7所述的柔性电路板，其特征在于，所述散热板与所述走线层之间通过导热胶连接。
  9. 根据权利要求7所述的柔性电路板，其特征在于，所述散热板与所述导热柱之间通过导热胶粘接。
  10. 一种移动终端，其特征在于，包括柔性电路板，所述柔性电路板包括两层走线层、及中间层，所述中间层设置在两层所述走线层之间并将两层所述走线层电隔离；
    所述柔性电路板上设置有过孔，所述过孔贯穿两层所述走线层及所述中间层，所述过孔的孔壁上设有导电层，所述导电层连接于两层所述走线层，以将两层所述走线层电连接；所述过孔内填充有导热材质以形成实心的导热柱。
  11. 根据权利要求10所述的移动终端，其特征在于，所述中间层包括依次层叠设置的第一塑胶层、第一铜箔层、基层、第二铜箔层及第二塑胶层，所述第一铜箔层及所述第二铜箔层二者均与所述导电层绝缘设置。
  12. 根据权利要求11所述的移动终端，其特征在于，所述第一铜箔层上设置有第一通孔，所述第二铜箔上设置有第二通孔；
    所述过孔穿设所述第一通孔及所述第二通孔，且三者同轴设置；
    所述导电层的外侧设置有第一孔环和第二孔环，所述第一孔环及所述第二孔环为沿所述过孔的周向设置的环状；所述第一孔环位于所述第一塑胶层和基层之间，所述第一孔环的外径小于所述第一通孔的孔径；所述第二孔环位于所述第二塑胶层和基层之间，所述第二孔环的外径小于所述第二通孔的孔径。
  13. 根据权利要求10所述的移动终端，其特征在于，所述导电层的外侧设置有第三孔环和第四孔环，所述第三孔环及所述第四孔环均为沿所述过孔的周向设置的环状；
    所述第三孔环位于所述导电层上与所述走线层相对应的位置处，所述第三孔环与所述走线层上的走线电连接；
    所述第四孔环位于所述导电层上与另一所述走线层相对应的位置处，所 述第四孔环与另一所述走线层上的走线电连接。
  14. 根据权利要求10所述的移动终端，其特征在于，所述导热柱为铜或锡材料制成。
  15. 根据权利要求10所述的移动终端，其特征在于，所述导热柱为导热胶制成。
  16. 根据权利要求10所述的移动终端，其特征在于，所述柔性电路板还包括散热板，所述散热板设置在所述走线层远离中间层的一侧，所述散热板与所述导热柱相连，以使所述导热柱上的热量传递至所述散热板上。
  17. 根据权利要求16所述的移动终端，其特征在于，所述散热板与所述走线层之间通过导热胶连接。
  18. 根据权利要求16所述的移动终端，其特征在于，所述散热板与所述导热柱之间通过导热胶粘接。
  19. 根据权利要求10-18任一项所述的移动终端，其特征在于，所述移动终端还包括主板及电子元件，所述电子元件与主板之间通过柔性电路板相连。
  20. 根据权利要求19所述的移动终端，其特征在于，所述电子元件为摄像头和/或按键。
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