WO2017110472A1 - 剥離シート用硬化性樹脂組成物、剥離シート、これを用いた工程基材、及び基材を保護する方法 - Google Patents
剥離シート用硬化性樹脂組成物、剥離シート、これを用いた工程基材、及び基材を保護する方法 Download PDFInfo
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- WO2017110472A1 WO2017110472A1 PCT/JP2016/086353 JP2016086353W WO2017110472A1 WO 2017110472 A1 WO2017110472 A1 WO 2017110472A1 JP 2016086353 W JP2016086353 W JP 2016086353W WO 2017110472 A1 WO2017110472 A1 WO 2017110472A1
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- 229920000098 polyolefin Polymers 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 239000007870 radical polymerization initiator Substances 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 239000013557 residual solvent Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 150000003377 silicon compounds Chemical class 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 150000003464 sulfur compounds Chemical class 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 239000008399 tap water Substances 0.000 description 1
- 235000020679 tap water Nutrition 0.000 description 1
- 125000001302 tertiary amino group Chemical group 0.000 description 1
- 238000001029 thermal curing Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 150000003624 transition metals Chemical class 0.000 description 1
- ILJSQTXMGCGYMG-UHFFFAOYSA-N triacetic acid Chemical compound CC(=O)CC(=O)CC(O)=O ILJSQTXMGCGYMG-UHFFFAOYSA-N 0.000 description 1
- UXVLEXMPXZXYSA-UHFFFAOYSA-N triazine-1,2-diamine Chemical group NN1C=CC=NN1N UXVLEXMPXZXYSA-UHFFFAOYSA-N 0.000 description 1
- ZZJNLOGMYQURDL-UHFFFAOYSA-M trifluoromethanesulfonate;tris(4-methylphenyl)sulfanium Chemical compound [O-]S(=O)(=O)C(F)(F)F.C1=CC(C)=CC=C1[S+](C=1C=CC(C)=CC=1)C1=CC=C(C)C=C1 ZZJNLOGMYQURDL-UHFFFAOYSA-M 0.000 description 1
- VMJFYMAHEGJHFH-UHFFFAOYSA-M triphenylsulfanium;bromide Chemical compound [Br-].C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1 VMJFYMAHEGJHFH-UHFFFAOYSA-M 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/38—Esters containing sulfur
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/308—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising acrylic (co)polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
- C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G75/00—Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen, or carbon in the main chain of the macromolecule
- C08G75/02—Polythioethers
- C08G75/04—Polythioethers from mercapto compounds or metallic derivatives thereof
- C08G75/045—Polythioethers from mercapto compounds or metallic derivatives thereof from mercapto compounds and unsaturated compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/17—Amines; Quaternary ammonium compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur, or oxygen atoms in addition to the carboxy oxygen
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/20—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes for coatings strippable as coherent films, e.g. temporary coatings strippable as coherent films
Definitions
- This invention relates to the curable resin composition for release sheets which can obtain the release sheet excellent in adhesiveness and a softness
- a peelable sheet has been used to protect the surface of a substrate in the manufacturing process of precision parts such as electronic materials (see, for example, JP-A-2001-247832).
- precision parts such as electronic materials
- the residue may remain on the base material.
- Japanese Patent Laid-Open No. 2001-270971 proposes a technique that can improve heat resistance and can be printed and protected only in necessary places by using it in a liquid state, thereby reducing waste.
- the resin dissolves in the cleaning solution and cannot be easily peeled off.
- An object of the present invention is to provide a material that can be applied to a substrate relatively thinly and the obtained cured film is excellent in masking property, flexibility, and peelability. Moreover, an object of this invention is to provide the material from which the peeling sheet by which the residue by a residual solvent, a plasticizer, etc. does not remain in a base material after peeling from a base material is obtained.
- Another object of the present invention is to provide a process substrate having a release sheet excellent in masking property, flexibility, and peelability obtained by curing such a material.
- a further object of the present invention is to provide a method for protecting a substrate using such a release sheet as a protective layer.
- the present invention relates to a curable sheet for a release sheet comprising (A) a polyfunctional thiol compound having a weight average molecular weight of 200 to 2,000 and (B) a polyfunctional (meth) acrylate having a weight average molecular weight of 200 to 50,000.
- the resin composition has a mass ratio ((A) / (B)) between the component (A) and the component (B) of 0.05 to 30.
- the curable resin composition for a release sheet contains (C) a photopolymerization initiator in an amount of 0.01 to 10 parts by mass with respect to 100 parts by mass as a total mass of the component (A) and the component (B). Also good.
- an amine compound having a weight average molecular weight of 90 to 700 is 0.01% with respect to 100 parts by mass of the total mass of the component (A) and the component (B). It may be contained up to 50 parts by mass.
- this invention is a peeling sheet formed by hardening
- this invention is a process base material by which the peeling sheet which hardened
- the present invention is a method of protecting a substrate by providing a release sheet obtained by applying and curing a curable resin composition for a release sheet as a protective layer.
- (meth) acrylate means a generic name including both acrylate and methacrylate
- (meth) acryloxy group means a generic name including both an acryloxy group and a methacryloxy group.
- XX to XX indicating a numerical range is a concept including a lower limit value (“XX”) and an upper limit value (“XX”) unless otherwise specified. In other words, it means “more than XX and less than xx”.
- “molecular weight” means a weight average molecular weight unless otherwise specified.
- the curable resin composition for a release sheet of the present invention is a curable resin composition containing the following components (A) and (B) as essential components, and optionally further containing at least one of components (C) and (D). is there.
- the polyfunctional thiol compound (A) in the curable resin composition of the present invention is an organic compound having two or more thiol groups (—SH groups).
- the weight average molecular weight of the polyfunctional thiol compound is 200 to 2000, preferably 300 to 1800, more preferably 350 to 1600. Even if the molecular weight is smaller than 200, there is no problem with curability, but the polyfunctional thiol compound has high volatility and tends to have strong odor. On the other hand, if the molecular weight is larger than 2000, the solubility in the later-described (B) polyfunctional (meth) acrylate resin may be lowered.
- a polyfunctional thiol compound (A) As a polyfunctional thiol compound (A), the polyfunctional thiol compound represented, for example by following General formula (1) can be mentioned.
- a polyfunctional thiol compound (A) can also be used individually by 1 type, and 2 or more types can also be mixed and used for it.
- n is an integer of 2 to 5
- a is an integer of 2 to 10
- R 1 is a hydrocarbon group having 2 to 30 carbon atoms ( ⁇ 1), ether oxygen (—O—) and carbon number. Any of a group ( ⁇ 2) consisting of only 2 to 40 hydrocarbon groups, an isocyanurate ring ( ⁇ 3), or a group consisting only of an isocyanurate ring and a hydrocarbon group ( ⁇ 4).
- the storage stability of the curable resin composition containing the compound is slightly high. Tend to get worse.
- the reactivity of the polyfunctional thiol compound obtained becomes low as n becomes large, and there exists a tendency for the curing time at the time of thermosetting of the curable resin composition containing this to become long.
- the polyfunctional thiol compound represented by the general formula (1) is obtained by an esterification reaction between a mercaptocarboxylic acid represented by the following general formula (2) and a polyfunctional alcohol represented by the following general formula (3). be able to.
- n is an integer of 2 to 5.
- R 1 consists of a hydrocarbon group having 2 to 30 carbon atoms ( ⁇ 1), ether oxygen (—O—) and a hydrocarbon group having 2 to 40 carbon atoms. Any one of the group ( ⁇ 2), the isocyanurate ring ( ⁇ 3), or the group ( ⁇ 4) consisting only of the isocyanurate ring and the hydrocarbon group.
- R 1 is a group composed only of ether oxygen (—O—) and a hydrocarbon group having 2 to 30 carbon atoms
- a compound ( ⁇ 4-1) in which a is 3 and R 1 is a group consisting only of an isocyanurate ring and a hydrocarbon group having 1 to 3 carbon atoms This is because such a
- Examples of ( ⁇ 1-1) include alkylene diols having 2 to 20 carbon atoms, glycerin, pentaerythritol, and trimethylolpropane.
- Examples of ( ⁇ 2-1) include polyethylene glycol, polypropylene glycol, dipentaerythritol and the like.
- Examples of ( ⁇ 3-1) include N, N ′, N ′′ -trihydroxyisocyanuric acid.
- Examples of ( ⁇ 4-1) include tris (2-hydroxyethyl) isocyanurate.
- the polyfunctional (meth) acrylate which is the component (B) has a (meth) acryloxy group at the terminal, and preferred examples thereof include compounds represented by the following general formula (4).
- the polyfunctional (meth) acrylate which is (B) component can also be used individually by 1 type, and 2 or more types can also be mixed and used for it.
- R 2 is a hydrocarbon group having 2 to 200 carbon atoms, a group consisting only of ether oxygen (—O—) and a hydrocarbon group having 2 to 300 carbon atoms, or An isocyanurate ring or a group consisting only of an isocyanurate ring and a hydrocarbon group, and R 3 is a hydrogen atom or a methyl group.
- the (B) polyfunctional (meth) acrylate a polymer type can also be suitably used.
- the polymer type polyfunctional (meth) acrylate include a polymer obtained by reacting a (meth) acrylate having a group that reacts with an epoxy group with a (meth) acrylate (co) polymer having an epoxy group, and a hydroxyl group.
- a polymer obtained by reacting a (meth) acrylate (co) polymer having a group that reacts with a hydroxyl group hereinafter referred to as a polymer derived from a hydroxyl group
- a polymer derived from a hydroxyl group hereinafter referred to as a polymer derived from a hydroxyl group
- a polymer obtained by reacting a polymer with a (meth) acrylate having a group that reacts with a carboxyl group hereinafter referred to as a carboxyl group-derived polymer.
- a polymer obtained by reacting a (meth) acrylate (co) polymer having an epoxy group with a (meth) acrylate having a group that reacts with an epoxy group specifically, a glycidyl (meth) acrylate (co) polymer (Meth) acrylic acid adducts and the like.
- a polymer obtained by reacting a (meth) acrylate (co) polymer having a hydroxyl group with a (meth) acrylate having a group that reacts with a hydroxyl group specifically, a hydroxyethyl (meth) acrylate (co) polymer
- Examples include 2-isocyanatoethyl (meth) acrylate adducts.
- (meth) acrylate (co) polymer having a carboxyl group As a polymer obtained by reacting a (meth) acrylate (co) polymer having a carboxyl group with a (meth) acrylate having a group that reacts with a carboxyl group, specifically, a glycidyl of a (meth) acrylic acid copolymer Examples include (meth) acrylate adducts.
- “(co) polymer” means a homopolymer (only one kind of monomer) and a copolymer (copolymerized with plural kinds of monomers).
- the polyfunctional (meth) acrylate has a weight average molecular weight of 200 to 50000, preferably 220 to 40000, more preferably 240 to 30000.
- weight average molecular weight of (B) polyfunctional (meth) acrylate is smaller than 200, volatility tends to increase and odor tends to increase, which is not preferable.
- weight average molecular weight is more than 50000, the solubility in other components may be lowered, which is not preferable.
- the (meth) acrylate equivalent of (B) polyfunctional (meth) acrylate is 80 to 6000 g / mol, preferably 80 to 4500 g / mol, more preferably 85 to 3000 g / mol.
- the (meth) acrylate equivalent is less than 80 g / mol, the (meth) acryloxy group per unit volume is excessive, and a large amount of (A) polyfunctional thiol thiol groups and unreacted (meth) acryloxy groups remain. Thereby, there exists a possibility that the toughness of the cured film which consists of curable resin compositions may fall.
- the (meth) acrylate equivalent is larger than 6000 g / mol, the (meth) acryloxy group concentration is remarkably low, so that the reaction efficiency with the thiol group of the (A) polyfunctional thiol decreases, so that the curable resin composition There is a possibility that the toughness of the cured film made of the material may decrease.
- the curable resin composition for a release sheet of the present invention can further contain (C) a photopolymerization initiator in addition to the components (A) to (B).
- the component (C) is blended in an amount of 0.01 to 10 parts by mass with respect to 100 parts by mass as the total mass of the component (A) and the component (B).
- the photopolymerization initiator (C) component is added to promote the reaction between the thiol group and the (meth) acryloxy group, and can reduce the light irradiation necessary for curing the curable composition.
- the photopolymerization initiator include a photoradical polymerization initiator, a photocationic polymerization initiator, and a photoanionic polymerization initiator.
- the photoradical polymerization initiator is preferably used for shortening the reaction time
- the photocationic polymerization initiator is preferably used for reducing curing shrinkage
- the photoanionic polymerization initiator is used in the field of electronic circuits and the like. It is preferable to use in.
- photo radical polymerization initiator examples include 2,2-dimethoxy-1,2-diphenylethane-1-one, 1-hydroxy-cyclohexyl-phenyl-ketone, 2-hydroxy-2-methyl-1-phenyl-propane. -1-one, 1- [4- (2-hydroxyethoxy) -phenyl] -2-hydroxy-2-methyl-1-propan-1-one, 2-hydroxy-1- ⁇ 4- [4- (2 -Hydroxy-2-methyl-propionyl) -benzyl] -phenyl ⁇ -2-methyl-propan-1-one, 2-methyl-1- [4- (methylthio) phenyl] -2-morpholinopropan-1-one Bis (2,4,6-trimethylbenzoyl) -phenylphosphine oxide, 2,4,6-trimethylbenzoyl-diphenyl-phosphine oxide, etc. And the like.
- Examples of the cationic photopolymerization initiator include bis (4-tert-butylphenyl) iodonium hexafluorophosphate, bis (4-tert-butylphenyl) iodonium trifluoromethanesulfonate, cyclopropyldiphenylsulfonium tetrafluoroborate, and diphenyl.
- Iodonium hexafluorophosphate diphenyliodonium hexafluoroarsenate, 2- (3,4-dimethoxystyryl) -4,6-bis (trichloromethyl) -1,3,5-triazine, triphenylsulfonium tetrafluoroborate, Examples include triphenylsulfonium bromide, tri-p-tolylsulfonium hexafluorophosphate, and tri-p-tolylsulfonium trifluoromethanesulfonate.
- photoanionic polymerization initiator examples include acetophenone o-benzoyloxime, nifedipine, 2- (9-oxoxanthen-2-yl) propionic acid 1,5,7-triazabicyclo [4,4,0] deca- 5-ene, 2-nitrophenylmethyl 4-methacryloyloxypiperidine-1-carboxylate, 1,2-diisopropyl-3- [bis (dimethylamino) methylene] guanidinium 2- (3-benzoylphenyl) propionate, and 1, Examples include 2-dicyclohexyl-4,4,5,5-tetramethylbiguanidinium, n-butyltriphenylborate and the like.
- the curable resin composition for a release sheet of the present invention has (D) a weight average molecular weight of 90 to 700 in addition to the components (A) to (B) or (A) to (C).
- An amine compound can be contained.
- the component (D) is blended in an amount of 0.01 to 50 parts by mass with respect to 100 parts by mass as the total mass of the component (A) and the component (B).
- the amine compound as the component (D) is added to promote (catalyze) the reaction between the thiol group and the (meth) acryloxy group. Specifically, since the thiol group and the (meth) acryloxy group can be reacted at a low temperature by containing the component (D), the curable resin composition containing the component (A) and the component (B). An object can be cured at a low temperature.
- the amine compound as component (D) include monofunctional amines and polyamines having a weight average molecular weight of 90 to 700, preferably 100 to 690, more preferably 110 to 680, and a plurality of amino groups. When the weight average molecular weight of the amine compound is less than 90, the volatility of the amine increases, causing odor and voids. When the weight average molecular weight of an amine compound exceeds 700, water resistance will fall easily.
- Monofunctional amines include primary amines, secondary amines, and tertiary amines.
- polyamines include primary amines, secondary amines, tertiary amines, and complex amines.
- a complex amine is an amine having two or more of a primary amino group, a secondary amino group, and a tertiary amino group. Examples of such complex amines include imidazoline compounds, imidazole compounds, N-substituted piperazine compounds, and N, N-dimethylurea derivatives.
- an amine compound can also be used individually by 1 type, and 2 or more types can also be mixed and used for it.
- the amine compound may form a salt with an organic acid in advance in order to adjust the catalytic activity.
- organic acid that is preliminarily reacted with the amine compound include aliphatic carboxylic acids and aromatic carboxylic acids.
- imidazole compounds with high basicity are suitable for curing at the lowest temperature. Further, an imidazole compound coated with a phenol resin or the like can also be used.
- the imidazole compound is a compound represented by the following formula (5).
- R 5 is a cyano group, a hydrocarbon group having 1 to 10 carbon atoms, a hydrocarbon group having 1 to 10 carbon atoms substituted with 2,3-diaminotriazine, an alkoxy group having 1 to 4 carbon atoms, or a hydrogen atom.
- R 4 , R 6 , and R 7 are each a hydrocarbon group having 1 to 20 carbon atoms, an alkoxy group having 1 to 4 carbon atoms, or a hydrogen atom, and R 4 to R 7 are bonded to form a ring. In this case, it is a hydrocarbon group having 2 to 8 carbon atoms.
- the curable resin composition for a release sheet of the present invention has a mass ratio ((A) / (B)) of (A) polyfunctional thiol to (B) polyfunctional (meth) acrylate of 0.05 to 30.
- Blend as follows.
- “(A) / (B)” is a value obtained by dividing the mass of (A) polyfunctional thiol by the mass of (B) polyfunctional (meth) acrylate.
- the optimum value of (A) / (B) varies depending on the properties required for the curable resin composition and the types of (A) polyfunctional thiol and (B) polyfunctional (meth) acrylate.
- the characteristics after curing the curable resin composition are the values of (number of thiol groups) / (number of (meth) acryloxy groups) (hereinafter referred to as thiol / ene ratio) in the unit weight of the curable resin composition. to be influenced.
- the thiol / ene ratio is in the range of 0.5 to 1.5, it is easy to form dense crosslinks and to become a tough cured product.
- the thiol / ene ratio is 0.1 or more and less than 0.5 or more than 1.5 and 2.0 or less, a flexible and sticky cured product can be obtained.
- the curable resin composition for a release sheet of the present invention is based on 100 parts by mass of (A) polyfunctional thiol and (B) polyfunctional (meth) acrylate in total mass ((A) + (B)).
- C) The photopolymerization initiator is blended so as to be 0.01 to 10 parts by mass.
- the blending amount of the component (C) is less than 0.01 parts by mass with respect to 100 parts by mass of ((A) + (B))
- a large amount of integrated light is required for the reaction between the thiol group and the (meth) acryloxy group to proceed. Is necessary, and if it exceeds 10 parts by mass, it is excessive with respect to curing, which is not preferable.
- the total weight of (A) polyfunctional thiol and (B) polyfunctional (meth) acrylate ((A ) + (B)) 100 parts by mass of (D) the amine compound is blended in an amount of 0.01 to 50 parts by mass, preferably 0.01 to 45 parts by mass.
- the blending amount of the component (D) is less than 0.01 with respect to ((A) + (B))
- the function as a catalyst becomes insufficient, the curing is not accelerated by heating, and the amount exceeds 50 parts by mass.
- the storage stability of the curable resin composition is lowered.
- the curable resin composition for a release sheet of the present invention can form a cured film by coating on a substrate and curing.
- the curable resin composition for a release sheet of the present invention exhibits adhesion to a substrate due to a thioether group comprising a reaction of (A) polyfunctional thiol and (B) polyfunctional (meth) acrylate. Therefore, as a base material, a base material that forms a chemical bond with a thioether group (high chemical affinity), such as a transition metal or an alloy thereof, a silicon compound, a phosphorus compound, a sulfur compound, or a boron compound, etc.
- an organic substrate such as an inorganic substrate, an organic substance having an unsaturated bond (including an aromatic ring), an organic substance having a hydroxyl group or a carboxyl group, or an organic substance treated with plasma or UV ozone.
- the inorganic base material include glass, silicon, and various metals.
- PET polyethylene terephthalate
- PET polyethylene terephthalate
- PET polybutylene terephthalate
- polycarbonate resins polyimide resins
- polyolefins such as polyethylene and polypropylene
- Preferable examples include resin, polycarbonate, polyimide, ABS resin, polyvinyl alcohol, vinyl chloride resin, and polyacetal.
- (A) polyfunctional thiol has a specific hydrocarbon group, and a cured film is excellent in a softness
- the curable resin composition for a release sheet of the present invention can be cured by, for example, irradiating light.
- the light to be irradiated include active energy rays such as UV (ultraviolet rays) and EB (electron beams).
- the curable resin composition comprises a component (C)
- the curable resin composition contains the component (D)
- it can be cured only by heating at a low temperature of about 80 ° C.
- the curable resin composition contains the component (C) and the component (D)
- it can be cured through a two-stage process including a curing process by light irradiation and a curing process by heating.
- the curable resin composition for a release sheet of the present invention may be used by diluting with an organic solvent in order to make the reaction system uniform and facilitate coating.
- organic solvents include alcohol solvents, aromatic hydrocarbon solvents, ether solvents, ester solvents, ether ester solvents, ketone solvents, and phosphate ester solvents. These organic solvents are preferably suppressed to a blending amount of less than 10000 parts by mass with respect to 100 parts by mass of the curable resin composition, but basically the solvent is volatilized at the time of becoming a cured film. It does not have a big influence on the physical properties.
- the curable resin composition for a release sheet of the present invention may contain a viscosity modifier such as silica powder for the purpose of adjusting the viscosity.
- a viscosity modifier such as silica powder for the purpose of adjusting the viscosity.
- These viscosity modifiers are preferably suppressed to a blending amount of less than 300 parts by mass with respect to 100 parts by mass of the curable resin composition. If the blending amount of the viscosity modifier exceeds 300 parts by mass, a cured film may not be obtained.
- the curable resin composition for a release sheet of the present invention may contain various additives such as those used in ordinary paints and adhesives.
- additives such as those used in ordinary paints and adhesives.
- examples of such an additive include a surfactant for smoothing the coated surface, and an aluminum salt for increasing the usable time.
- These additives are preferably suppressed to a blending amount of less than 80 parts by mass with respect to 100 parts by mass of the curable resin composition. If the amount of these additives exceeds 80 parts by mass, a large amount of integrated light may be required for the reaction to proceed.
- the curable resin composition for a release sheet of the present invention can be cured and used as a release sheet.
- the curable resin composition for a release sheet of the present invention includes, for example, glass, PET (polyethylene terephthalate), polyethylene, polypropylene, nylon, ITO (indium tin oxide), polyimide (PI), Si wafer, general metals (stainless steel, copper). , Aluminum, etc.), acrylic resin, epoxy resin, and other base materials and cured to form a release sheet, which can be peeled off if necessary.
- the present invention relates to a process substrate in which a release sheet obtained by applying and curing a curable resin composition for a release sheet is laminated on a substrate.
- a substrate the above-described substrates can be used.
- the process substrate of the present invention is a so-called intermediate process product in the product manufacturing process, and is obtained, for example, by applying and curing the curable resin composition for a release sheet of the present invention to the touch panel that is the substrate during touch panel manufacture.
- the release sheet protects the touch panel as a base material from cracks, scratches, dust, dirt, and the like.
- a peeling sheet can be used in order to mask the non-printing part and non-plating part of a base material.
- the process substrate of the present invention has a release sheet excellent in masking property, flexibility, and peelability obtained by curing the curable resin composition for a release sheet of the present invention, various substrates are used. Can be configured.
- the method for protecting a substrate of the present invention relates to a method for protecting a substrate by providing a release sheet obtained by applying and curing a curable resin composition for a release sheet as a protective layer.
- the base material described above can be used as the base material.
- the curable resin composition for release sheet the curable resin composition for release sheet of the present invention described above can be used.
- coating and hardening of curable resin composition for peeling sheets can be performed on the above conditions.
- the method for protecting a substrate of the present invention is, for example, by applying a curable resin composition for a release sheet to a touch panel that is a substrate and curing it to protect the touch panel from cracks, scratches, dust, dirt, and the like.
- a release sheet curable resin composition is applied and cured on a non-printed portion or a non-plated portion of the substrate. Protect the substrate from printing and plating.
- the curable resin composition for a release sheet of the present invention can be easily applied to a desired thickness, and can be easily peeled off without residue at the time of peeling. Furthermore, since the cured film obtained by curing the composition is excellent in masking property and peelability, it can be laminated on a substrate and used as a process substrate. It is also possible to use the release sheet itself as a substrate.
- the method of protecting a base material can be provided by using as a protective layer the release sheet obtained by hardening
- Mw represents a weight average molecular weight
- Components (A) to (D) were mixed at the blending ratios shown in Tables 1 to 4 below, and stirred with a spatula until uniform, and samples of the curable resin compositions for release sheets of Examples and Comparative Examples were prepared. Obtained. The following peelability, heat resistance, printability, masking property, and scratch resistance were evaluated for the samples of the curable resin compositions obtained in Examples and Comparative Examples. The results are shown in Tables 1 to 4.
- test piece 1 for evaluation of peelability and heat resistance
- the substrates used were glass (Corning, Eagle XG), PET film (Toray Industries, Lumirror U46-100), polyimide (PI) film (Toray DuPont, Kapton 100H), ITO Glass (soda glass having a pattern of 20 mm in length and 50 ⁇ m in width and 100 ⁇ / ⁇ in line and space).
- a UV lamp system “Light Hammer 6” manufactured by Heraeus Noblelight Fusion Ubuy Co., Ltd. was used, and an H bulb was used as the lamp bulb.
- test piece 2 for printability evaluation
- a 10 cm ⁇ 10 cm glass Cornning Corp., Eagle XG
- UV irradiation was performed under the curing conditions shown to obtain a test piece 2 for evaluation having a release sheet.
- MT-320TV manufactured by Micro Tech Co., Ltd. was used as a screen printing machine.
- test piece 3 for masking evaluation Each sample of the curable resin composition for release sheet was applied to a half of a 10 cm ⁇ 10 cm copper plate at a thickness of 200 ⁇ m, UV irradiation was performed under the curing conditions shown in Tables 1 to 4, and an evaluation test piece having a release sheet 3 was obtained.
- test piece 4 for scratch resistance evaluation Each sample of the curable resin composition for the release sheet was applied to 10 cm ⁇ 10 cm glass (Corning Corp., Eagle XG) with a die coater to a thickness of 200 ⁇ m, and UV irradiation was performed under the curing conditions shown in Tables 1 to 4. The test piece 4 for evaluation which has a peeling sheet was obtained.
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Abstract
Description
本発明の硬化性樹脂組成物における多官能チオール化合物(A)とは、2個以上のチオール基(-SH基)を有する有機化合物である。多官能チオール化合物の重量平均分子量は200~2000、好ましくは300~1800、より好ましくは350~1600とする。分子量が200より小さくても硬化性に関しては問題ないが、多官能チオール化合物の揮発性が高く、臭気が強くなる傾向がある。一方、分子量が2000より大きいと、後述の(B)多官能(メタ)アクリレート樹脂に対する溶解性が低くなる可能性がある。
(式中のnは2~5の整数であり、aは2~10の整数であり、R1は炭素数2~30の炭化水素基(α1)、エーテル酸素(-O-)と炭素数2~40の炭化水素基のみからなる基(α2)、イソシアヌレート環(α3)、又はイソシアヌレート環と炭化水素基のみからなる基(α4)のいずれかである。)
(式中のnは2~5の整数である。)
(式中のaは2~10の整数であり、R1は炭素数2~30の炭化水素基(α1)、エーテル酸素(-O-)と炭素数2~40の炭化水素基のみからなる基(α2)、イソシアヌレート環(α3)、又はイソシアヌレート環と炭化水素基のみからなる基(α4)のいずれかである。)
(B)成分である多官能(メタ)アクリレートは末端に(メタ)アクリロキシ基を有しており、その好ましい例として下記一般式(4)で表される化合物が挙げられる。なお、(B)成分である多官能(メタ)アクリレートは、1種のみを単独で使用することもできるし、2種以上を混合使用することもできる。
(式中のbは2~30の整数であり、R2は炭素数2~200の炭化水素基、エーテル酸素(-O-)と炭素数2~300の炭化水素基のみからなる基、またはイソシアヌレート環若しくはイソシアヌレート環と炭化水素基のみからなる基であり、R3は水素原子またはメチル基である。)
本発明の剥離シート用硬化性樹脂組成物は、前記(A)~(B)成分に加えて、さらに(C)光重合開始剤を含有させることができる。当該(C)成分は、前記(A)成分と前記(B)成分との合計質量100質量部に対し、0.01~10質量部配合する。
本発明の剥離シート用硬化性樹脂組成物は、前記(A)~(B)成分、または、(A)~(C)成分に加えて、さらに(D)重量平均分子量が90~700であるアミン化合物を含有させることができる。当該(D)成分は、前記(A)成分と前記(B)成分との合計質量100質量部に対し、0.01~50質量部配合する。
(R5はシアノ基、炭素数1~10の炭化水素基、2,3-ジアミノトリアジンで置換された炭素数1~10の炭化水素基、炭素数1~4のアルコキシ基、又は水素原子であり、R4、R6、及びR7は炭素数1~20の炭化水素基、炭素数1~4のアルコキシ基、又は水素原子であり、R4~R7が結合して環を形成している場合には炭素数2~8の炭化水素基である。)
本発明の剥離シート用硬化性樹脂組成物は、(A)多官能チオールと(B)多官能(メタ)アクリレートとの質量比((A)/(B))が0.05~30となるように配合する。ここで、「(A)/(B)」とは、(A)多官能チオールの質量を(B)多官能(メタ)アクリレートの質量で除した値である。(A)/(B)が0.05未満の場合は剥離時に裂けや割れが発生し易くなり、(A)/(B)が30を超える場合は硬化膜を得にくくなる。最適な(A)/(B)の値は、硬化性樹脂組成物に求められる特性や、(A)多官能チオールや(B)多官能(メタ)アクリレートの種類によって異なる。硬化性樹脂組成物を硬化した後の特性は、厳密には硬化性樹脂組成物単位重量中の(チオール基数)/((メタ)アクリロキシ基数)(以下、チオール/エン比と称す)の値に影響を受ける。例えば、チオール/エン比が0.5~1.5の範囲にあれば、密な架橋を形成し易く、且つ強靭な硬化物になり易い。一方、チオール/エン比が0.1以上0.5未満、あるいは1.5を超え2.0以下であれば、柔軟で粘着質な硬化物を得ることができる。
本発明の剥離シート用硬化性樹脂組成物は、基材上に塗工し、硬化させることで、硬化膜を形成することができる。本発明の剥離シート用硬化性樹脂組成物は、(A)多官能チオールと(B)多官能(メタ)アクリレートの反応からなるチオエーテル基に起因して基材に対して密着性を発揮する。したがって、基材としては、チオエーテル基と化学的な結合を形成する(化学的な親和力の高い)基材、例えば、遷移金属あるいはその合金や珪素化合物、リン化合物、硫黄化合物、又はホウ素化合物等の無機基材、不飽和結合(芳香環を含む)を有する有機物、水酸基やカルボキシル基を有する有機物、又はプラズマやUVオゾン処理された有機物等の有機基材への密着性向上効果に優れる。具体的には、無機基材としては、ガラス、シリコン、各種金属などが挙げられる。有機基材として、ポリ(メタ)アクリル系樹脂、トリアセテートセルロース(TAC)系樹脂、ポリエチレンテレフタレート(PET)やポリブチレンテレフタレート等のポリエステル系樹脂、ポリカーボネート系樹脂、ポリイミド系樹脂、ポリエチレンやポリプロピレン等のポリオレフィン系樹脂、ポリカーボネート、ポリイミド、ABS樹脂、ポリビニルアルコール、塩化ビニル系樹脂、ポリアセタールなどが好ましく挙げられる。また、本発明の剥離シート用硬化性樹脂組成物は、(A)多官能チオールが特定の炭化水素基を有することで、硬化膜が柔軟性に優れる。そのため、フレキシブルな基材のコーティングに特に好適に使用することができる。
グリシジルメタクリレートとシクロヘキシルメタクリレートとの共重合体(グリシジルメタクリレート:シクロヘキシルメタクリレート=3モル:2モル)のエポキシ基に対し、下記D-3を触媒として、当モルのメタクリル酸を付加したポリマー(50wt%メチルイソブチルケトン溶液をヘキサンで再沈した白色固体)。
グリシジルメタクリレートとシクロヘキシルメタクリレートとの共重合体(グリシジルメタクリレート:シクロヘキシルメタクリレート=3モル:2モル)のエポキシ基に対し、下記D-3を触媒として、当モルのメタクリル酸を付加したポリマー(50wt%メチルイソブチルケトン溶液をヘキサンで再沈した白色固体)。
(C-1、Mw:204)
1-ヒドロキシ-シクロヘキシル-フェニル-ケトン
2,4,6-トリメチルベンゾイル-ジフェニル-フォスフィンオキサイド
2-(9-オキソキサンテン-2-イル)プロピオン酸1,5,7-トリアザビシクロ[4.4.0]デカ-5-エン
N,N-ジメチル-1,3-プロパンジアミン
剥離シート用硬化性樹脂組成物の各サンプルを10cm×10cmの各種基材にダイコーターで150μmの厚みに塗布し、表1~表4に示す硬化条件でUV照射を行い、剥離シートを有する評価用試験片1を得た。使用した基材は、ガラス(コーニング社製、イーグルXG)、PETフィルム(東レ(株)製、ルミラーU46-100)、ポリイミド(PI)フィルム(東レ・デュポン(株)製、カプトン100H)、ITOガラス(ソーダガラスにラインアンドスペースで長さ20mm×幅50μm 100Ω/□でパターンが形成されているもの)である。UV照射には、ヘレウス・ノーブルライト・フュージョン・ユーブイ(株)製UVランプシステム「ライトハンマー6」を用い、ランプバルブは、Hバルブを使用した。
評価用試験片1を作製後、テープを剥離シートの端部に貼り剥離シートを剥離した後、基材の外観と剥離性を目視で確認して、以下の通り評価した。
○ :剥離(残渣なし)
×A:剥離時に裂けや割れが発生
×B:硬化不良
評価用試験片1のガラス基材品を100℃で30分加熱し、テープを剥離シートの端部に貼り剥離した後、基材の外観と剥離性を目視で確認して、以下の通り評価した。
○ :剥離(残渣なし)
×A:剥離時に裂けや割れが発生
×B:硬化不良
剥離シート用硬化性樹脂組成物の各サンプルを10cm×10cmのガラス(コーニング社製、イーグルXG)にスクリーン印刷機を用いてラインアンドスペース=100μm/100μmで印刷した後、表1~表4に示す硬化条件でUV照射を行い、剥離シートを有する評価用試験片2を得た。スクリーン印刷機はマイクロ・テック(株)製、MT-320TVを用いた。
評価用試験片2の剥離シートのライン間の距離を、光学顕微鏡を用いて測定して、以下の通り評価した。
○:スペースの幅が100~80μm
×:スペースの幅が80μm未満
10cm×10cm銅板の半分に剥離シート用硬化性樹脂組成物の各サンプルを厚さ200μmで塗工し、表1~表4に示す硬化条件でUV照射を行い、剥離シートを有する評価用試験片3を得た。
評価用試験片3を60℃の硫酸水溶液(0.5N)に1時間浸漬後、銀メッキを1分間施した。次に、水道水で銀メッキを洗浄した後、剥離性を目視で確認して、以下の通り評価した。
○ :剥離(残渣なし)
×A:剥離時に裂けや割れが発生
×B:硬化不良
剥離シート用硬化性樹脂組成物の各サンプルを10cm×10cmのガラス(コーニング社製、イーグルXG)にダイコーターで200μmの厚みに塗布し、表1~表4に示す硬化条件でUV照射を行い、剥離シートを有する評価用試験片4を得た。
評価用試験片4の剥離シートに対して300gの荷重をかけてカッターナイフを用いて切り込みを入れ、剥離シートを剥離した後、基材の外観を目視で確認して、以下の通り評価した。
○:傷なし
×:傷あり
Claims (6)
- (A)重量平均分子量が200~2000である多官能チオール化合物と、
(B)重量平均分子量が200~50000である多官能(メタ)アクリレートと、を含有し、
前記(A)成分と前記(B)成分との質量比((A)/(B))が0.05~30である剥離シート用硬化性樹脂組成物。 - (C)光重合開始剤を、前記(A)成分と前記(B)成分との合計質量100質量部に対し、0.01~10質量部配合してなる、請求項1に記載の剥離シート用硬化性樹脂組成物。
- (D)重量平均分子量が90~700であるアミン化合物を、前記(A)成分と前記(B)成分との合計質量100質量部に対して0.01~50質量部配合してなる、請求項1または請求項2に記載の剥離シート用硬化性樹脂組成物。
- 請求項1から請求項3のいずれか一つに記載の剥離シート用硬化性樹脂組成物を硬化してなる剥離シート。
- 基材に、請求項1から請求項3のいずれか一つに記載の剥離シート用硬化性樹脂組成物を硬化した剥離シートが積層された工程基材。
- 基材に、請求項1から請求項3のいずれか一つに記載の剥離シート用硬化性樹脂組成物を塗布、硬化してなる剥離シートを保護層として設けることにより、基材を保護する方法。
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KR1020187007070A KR20180040635A (ko) | 2015-12-22 | 2016-12-07 | 박리 시트용 경화성 수지 조성물, 박리 시트, 이것을 사용한 공정 기재, 및 기재를 보호하는 방법 |
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Publication number | Priority date | Publication date | Assignee | Title |
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JP2019116013A (ja) * | 2017-12-27 | 2019-07-18 | 東洋紡株式会社 | セラミックグリーンシート製造用離型フィルム |
JP2022016467A (ja) * | 2017-12-27 | 2022-01-21 | 東洋紡株式会社 | セラミックグリーンシート製造用離型フィルム |
JP2022016466A (ja) * | 2017-12-27 | 2022-01-21 | 東洋紡株式会社 | セラミックグリーンシート製造用離型フィルム |
JP2022016465A (ja) * | 2017-12-27 | 2022-01-21 | 東洋紡株式会社 | セラミックグリーンシート製造用離型フィルム |
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61207476A (ja) * | 1985-03-12 | 1986-09-13 | Hitachi Chem Co Ltd | 絞り加工の表面保護フイルム用放射線硬化型粘着剤 |
JPH03297638A (ja) * | 1990-04-17 | 1991-12-27 | Hitachi Chem Co Ltd | 放射線硬化型塗料付銅箔の製造方法 |
JPH10110035A (ja) * | 1996-08-14 | 1998-04-28 | Asahi Optical Co Ltd | 着脱可能なレンズ貼付シート |
WO2013073364A1 (ja) * | 2011-11-17 | 2013-05-23 | 株式会社スリーボンド | アクリル樹脂組成物 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3263162B2 (ja) * | 1992-01-31 | 2002-03-04 | 三井化学株式会社 | 含硫リン酸エステル系内部離型剤 |
JP3308113B2 (ja) * | 1994-08-25 | 2002-07-29 | 三井化学株式会社 | 酸性ホスホン酸誘導体系内部離型剤 |
JP5828225B2 (ja) * | 2011-05-31 | 2015-12-02 | 日油株式会社 | 硬化性樹脂組成物 |
US20150125659A1 (en) * | 2012-06-15 | 2015-05-07 | Mitsubishi Rayon Co., Ltd. | Laminate |
TWI553089B (zh) * | 2012-09-28 | 2016-10-11 | 長興材料工業股份有限公司 | 塗料組合物及其用途 |
-
2016
- 2016-12-07 JP JP2017557857A patent/JP6881317B2/ja active Active
- 2016-12-07 KR KR1020187007070A patent/KR20180040635A/ko not_active Application Discontinuation
- 2016-12-07 CN CN201680050961.0A patent/CN108026387B/zh active Active
- 2016-12-07 WO PCT/JP2016/086353 patent/WO2017110472A1/ja active Application Filing
- 2016-12-13 TW TW105141222A patent/TWI612115B/zh active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61207476A (ja) * | 1985-03-12 | 1986-09-13 | Hitachi Chem Co Ltd | 絞り加工の表面保護フイルム用放射線硬化型粘着剤 |
JPH03297638A (ja) * | 1990-04-17 | 1991-12-27 | Hitachi Chem Co Ltd | 放射線硬化型塗料付銅箔の製造方法 |
JPH10110035A (ja) * | 1996-08-14 | 1998-04-28 | Asahi Optical Co Ltd | 着脱可能なレンズ貼付シート |
WO2013073364A1 (ja) * | 2011-11-17 | 2013-05-23 | 株式会社スリーボンド | アクリル樹脂組成物 |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2019116013A (ja) * | 2017-12-27 | 2019-07-18 | 東洋紡株式会社 | セラミックグリーンシート製造用離型フィルム |
JP2022016467A (ja) * | 2017-12-27 | 2022-01-21 | 東洋紡株式会社 | セラミックグリーンシート製造用離型フィルム |
JP2022016466A (ja) * | 2017-12-27 | 2022-01-21 | 東洋紡株式会社 | セラミックグリーンシート製造用離型フィルム |
JP2022016465A (ja) * | 2017-12-27 | 2022-01-21 | 東洋紡株式会社 | セラミックグリーンシート製造用離型フィルム |
JP7188537B2 (ja) | 2017-12-27 | 2022-12-13 | 東洋紡株式会社 | セラミックグリーンシート製造用離型フィルム |
JP7188536B2 (ja) | 2017-12-27 | 2022-12-13 | 東洋紡株式会社 | セラミックグリーンシート製造用離型フィルム |
JP7188535B2 (ja) | 2017-12-27 | 2022-12-13 | 東洋紡株式会社 | セラミックグリーンシート製造用離型フィルム |
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CN108026387B (zh) | 2021-07-27 |
TW201723128A (zh) | 2017-07-01 |
CN108026387A (zh) | 2018-05-11 |
JPWO2017110472A1 (ja) | 2018-10-11 |
TWI612115B (zh) | 2018-01-21 |
JP6881317B2 (ja) | 2021-06-02 |
KR20180040635A (ko) | 2018-04-20 |
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