WO2017092720A1 - 工件台基板交接装置与预对准方法 - Google Patents

工件台基板交接装置与预对准方法 Download PDF

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Publication number
WO2017092720A1
WO2017092720A1 PCT/CN2017/072467 CN2017072467W WO2017092720A1 WO 2017092720 A1 WO2017092720 A1 WO 2017092720A1 CN 2017072467 W CN2017072467 W CN 2017072467W WO 2017092720 A1 WO2017092720 A1 WO 2017092720A1
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Prior art keywords
substrate
air
vacuum chuck
floating
workpiece
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PCT/CN2017/072467
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English (en)
French (fr)
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杨玉杰
朱岳彬
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上海微电子装备(集团)股份有限公司
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Publication of WO2017092720A1 publication Critical patent/WO2017092720A1/zh

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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Definitions

  • the present invention relates to the field of lithography, and in particular to a workpiece table substrate transfer device and a pre-alignment method.
  • OLED organic light-emitting display
  • LCD liquid crystal display
  • the existing substrate transfer positioning method has the disadvantages of long exposure waiting time, low positioning accuracy, low working efficiency, and fragile substrate.
  • the prior art provides a mechanical detection method based on a touch sensor, which is characterized in that a position sensor is placed on a substrate table to achieve pre-alignment of the glass substrate, and the disadvantage is that the contact alignment method is easy. Contamination and damage to the glass substrate.
  • the invention provides a workpiece table substrate transfer device and a pre-alignment method, which overcomes the problems of excessive waiting time and pre-alignment of the substrate transfer exposure station to the upper plate in the prior art, and misalignment.
  • the present invention provides a workpiece table substrate transfer device for moving a substrate on a workpiece table at least between a substrate transfer position and an exposure position, the substrate transfer device comprising: being disposed on the workpiece stage a detecting feedback device and an air floating rail device; a moving base mounted on the air floating rail device, wherein the air floating rail device is configured to control the moving base to move in a horizontal direction relative to the workpiece table; a support table on the moving abutment; and installed in the a substrate table with a gas hole on the support table, the substrate table is placed on the substrate by air floating, wherein: the substrate table is provided with a vacuum chuck device for adsorbing the substrate on the substrate table and driving the substrate a central axis of the vacuum chuck device is rotated; a position on the support table corresponding to both sides of the substrate table is provided with a rotary clamping mechanism for clamping the substrate adsorbed by the vacuum chuck device, And working in cooperation with the vacuum chuck device to realize
  • the support table is further provided with a guide pin and a stop pin corresponding to the periphery of the substrate table for limiting the substrate.
  • the air-floating rail device comprises a Y-direction air-floating guide rail and an X-direction air-floating guide rail, wherein the Y-direction and the X-direction are both in a horizontal direction and the Y-direction and the X-direction are perpendicular to each other, and the X-direction air-floating guide rail is installed at The Y-direction air-floating guide rail is disposed on the X-direction air-floating guide rail, and the motion base platform moves in an X direction on the X-direction air-floating guide rail, and the X-direction air-floating guide rail is at The Y moves in the Y direction on the air bearing rail.
  • the vacuum chuck device comprises a vacuum chuck, a lifting mechanism, a rotating mechanism, a motor and a vacuum pump, the vacuum chuck being connected to the vacuum pump for adsorbing the substrate, the motor driving the lifting mechanism to drive the The vacuum chuck is raised and lowered, and the motor drives the rotating mechanism to rotate the vacuum chuck around its central axis, which in turn drives the substrate to rotate about a central axis of the vacuum chuck device, the central axis being in a vertical Z direction.
  • the rotary clamping mechanism comprises a clamping member, a cylinder and a solenoid valve assembly, the cylinder driving the clamping member to clamp the substrate, the solenoid valve assembly controlling the clamping force of the clamping member And angle.
  • the rotary clamping mechanism cooperates with the vacuum chuck device to control the substrate to rotate at a predetermined angle by controlling the clamping force and angle of the clamping member.
  • the detection feedback device comprises a non-contact detector for detecting a position of the substrate and determining whether the substrate is at a correct substrate handover position, the handover safety sensor, the handover safety sensor It is used to detect the position of the substrate stage when the substrate stage performs the rotation in the Rx and Ry directions and the displacement in the Z direction.
  • the non-contact detector is a CCD.
  • the invention also provides a workpiece table substrate pre-alignment method, comprising:
  • Step 1 According to the detection of the detection feedback device, the substrate table is moved to the correct substrate intersection position, and the air valve is opened to form an air float above the substrate table;
  • Step 2 The robot moves the substrate above the substrate stage to suspend the substrate on the substrate stage;
  • Step 3 the vacuum chuck device on the substrate table extends and sucks the substrate, and the robot returns;
  • Step 4 the rotating clamping mechanism around the substrate clamps the substrate
  • Step 5 the vacuum chuck device rotates around its central axis according to the detection of the detecting feedback device, and the rotating clamping mechanism adjusts the clamping force and the angle to realize the vertical Z-direction rotation of the substrate to complete the substrate. Pre-aligned.
  • the step of moving the substrate table to the substrate transfer position according to the detection of the detecting feedback device in the step 1 comprises: rotating the substrate table in the Rx and Ry directions and adjusting the Z direction downward to the upper sheet before the substrate reaches the workpiece table. Height, the detection feedback device checks to confirm that the substrate table is in a normal state, the moving base for supporting the substrate table moves along the X, Y direction to the substrate transfer position by the air floating rail device, wherein the Rx and Ry directions are respectively around X Rotate in the Y direction.
  • the moving base for supporting the substrate table is moved along the X, Y direction to the substrate transfer position by the air floating rail device, and the moving base is on the X-direction air floating guide of the air floating rail device.
  • the X-direction air-floating guide moves in the Y direction on the Y-direction air-floating guide of the air-floating guide device.
  • the substrate transfer device of the present invention adopts an air floating rail device, which is The rubbing coefficient is extremely small, the moving abutment can quickly move in the X direction and the Y direction.
  • the vacuum chucking device in the substrate transfer device can quickly suck the substrate, and the rotating clamping device quickly clamps the substrate to perform pre-alignment, so that the substrate is handed over.
  • the workpiece table can be greatly reduced by the detection feedback device, and the rotating clamping mechanism can be quickly adjusted by the center axis of the vacuum chuck to realize the rotation of the substrate, thereby rapidly completing the pre-alignment of the substrate;
  • the waiting and pre-positioning time of the upper board greatly increases productivity.
  • FIG. 1 is a plan view of a workpiece table substrate transfer device according to an embodiment of the present invention.
  • FIG. 2 is a front view of a workpiece table substrate transfer device according to an embodiment of the present invention.
  • 3a-11b are schematic diagrams showing states of a substrate transfer device at various stages in an embodiment of the present invention.
  • the figure shows: 1-Y air-floating guide, 2-X air-floating guide, 3-moving abutment, 4-support table, 5-substrate table, 6-vacuum suction cup device, 7-rotation clamping mechanism, 81-first guide pin, 82-second guide pin, 83-stop pin, 91-manipulator, 92-floating table, 10-substrate.
  • the workpiece stage substrate transfer apparatus of the present invention comprises: a Y-direction air-floating guide rail 1, and an X-direction air-floating guide rail 2 mounted on the Y-direction air-floating guide rail 1, and is mounted on the A moving base 3 on the X-direction air-floating guide 2, a support table 4 mounted on the moving base 3, and a substrate table 5 with air holes mounted on the support table 4.
  • the support table 4 can be vertically moved up and down, and its driving device is installed in the moving base 3; the moving base 3 can float in the X direction
  • the guide rail 2 moves in the X direction, and the X-direction air-floating guide rail 2 can move in the Y direction on the Y-direction air-floating guide rail 1, so that the X and Y-direction displacement of the motion base station 3 can be quickly realized, that is, the speed can be quickly realized.
  • the substrate stage 5 having pores is displaced in the X direction and the Y direction.
  • the workpiece table substrate transfer device further includes a vacuum chuck device 6, a rotary clamping mechanism 7, and a limiting device, wherein the vacuum chuck device 6 is mounted on the substrate table 5,
  • the adsorption substrate 10; the rotation clamping mechanism 7 and the limiting device are mounted on a support table 4 around the substrate table 5, and the vacuum chuck device 6 cooperates with the rotary clamping mechanism 7 to achieve the The substrate 10 is rotated in the Rz direction.
  • the limiting device includes a first guiding pin 81, a second guiding pin 82 and a blocking pin 83, and the first and second guiding pins 81, 82 and the blocking pin 83 are used for guiding the substrate 10
  • the substrate 10 is prevented from deviating from the theoretical position too much, and plays a role of coarse positioning.
  • the vacuum chuck device 6 comprises: a vacuum chuck, a lifting mechanism, a rotating mechanism, a motor and a vacuum pump, wherein the vacuum chuck is connected to a vacuum pump for adsorbing the substrate 10, and the motor is used to drive the lifting mechanism to drive the The vacuum chuck is lifted and lowered, and the motor drives the rotating mechanism to drive the vacuum chuck to rotate around itself, which in turn drives the substrate 10 to rotate in the Rz direction.
  • the rotary clamping mechanism 7 includes a clamping member, a cylinder and a solenoid valve assembly, the cylinder driving clamping member clamping the substrate 10, the solenoid valve assembly controlling the clamping force and angle of the clamping member.
  • the workpiece table substrate transfer device further comprises a detection feedback device comprising a non-contact detector and a handover safety sensor, preferably the non-contact detector is a CCD.
  • the CCD is used to detect the position of the substrate 10, and it is determined whether the substrate 10 is at the correct substrate transfer position, and the CCD does not need to be in contact with the substrate 10 to avoid contact pollution to the substrate 10 and damage the substrate 10;
  • the transfer safety sensor detects the position of the substrate stage 5 when the substrate stage 5 performs the rotation in the Rx and Ry directions and the displacement in the Z direction, and determines whether or not the substrate stage 5 is in the normal transfer state.
  • the present invention further provides a workpiece table substrate pre-alignment method, comprising:
  • the upper plate and the substrate are pre-aligned as shown in Figures 3a to 9b:
  • the substrate stage 5 rotates in the Rx and Ry directions and is lowered in the Z direction to the height required for the upper sheet.
  • the motion base 3 passes through the Y gas.
  • the floating guide rails 1 and X move rapidly to the air bearing rail 2 to the workpiece table substrate transfer position, open the air valve, and ventilate the substrate table 5 to form an air float above the substrate table 5; at the same time, the air floating platform 92 ventilates the robot 91 Holding the substrate 10 to move toward the substrate transfer position, as shown in Figures 3a, 3b;
  • the robot 91 sucks the substrate 10 to accurately move to the substrate transfer position, the substrate 10 is suspended on the substrate stage 5, and the CCD non-contact detector detects the position of the substrate 10 in the X and Y directions, as shown in Figs. 4a and 4b;
  • the rotary clamping mechanism 7 clamps the substrate 10 to fix the substrate 10 to realize pre-clamping of the substrate 10, as shown in Figures 6a and 6b;
  • the vacuum chuck device 6 rotates the vacuum chuck around the point A on the substrate 10, and simultaneously rotates the clamping mechanism 7 to adjust the angle and strength of the clamping substrate 10, thereby realizing the substrate 10 at Rz.
  • the lower plate of the substrate 10 includes the following steps:
  • the substrate stage 5 returns to the substrate transfer position
  • the rotating clamping mechanism 7 releases the substrate 10, closes the vacuum, opens the air valve, and vents the air holes to the substrate table 5 to suspend the substrate 10 on the substrate table 5, as shown in Figs. 9a and 9b;
  • the robot 91 moves to the substrate transfer position, and sucks the substrate 10 to move toward the air floating platform 92, so that the substrate 10 is located above the air floating platform 92, as shown in Figs. 10a, 10b;
  • the air-floating rail device is adopted in the substrate transfer device of the present invention. Because the friction coefficient is extremely small, the moving base 3 can move in the X-direction and the Y-direction rapidly, and the vacuum chuck device 6 is used to quickly suck the substrate 10 and rotate.
  • the clamping mechanism 7 quickly clamps the substrate 10 to perform pre-clamping positioning of the substrate 10, and the transfer time of the substrate 10 is greatly reduced; and the workpiece table rotates around the vacuum chuck itself by detecting the detection result of the feedback device, and simultaneously adjusts the rotation.
  • the clamping mechanism 7 clamps the angle and the force of the substrate 10, and realizes the rotation of the substrate 10 in the Rz direction, thereby quickly completing the pre-alignment of the substrate 10, and greatly reducing the waiting and reservation of the exposure station to the upper plate.
  • the bit time greatly increases the productivity, and the use of the contactless detector in the pre-alignment overcomes the disadvantages of the prior art contact sensor, effectively avoiding contamination and damage to the substrate 10.

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  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
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Abstract

一种工件台基板交接装置与预对准方法。装置包括位于工件台上的检测反馈装置和气浮导轨装置(1, 2);安装在气浮导轨装置(1, 2)上的运动基台(3),气浮导轨装置(1, 2)控制运动基台(3)相对工件台沿水平方向移动;安装在运动基台(3)上的支撑台(4);以及安装在支撑台(4)上的基板台(5),基板台(5)上设有真空吸盘装置(6),用于吸附基板(10)并带动基板(10)绕中心轴旋转;支撑台(4)上对应基板台(5)两侧的位置设有旋转夹紧机构(7),用于夹紧基板(10)并与真空吸盘装置(6)协同工作以实现基板(10)的旋转;检测反馈装置检测基板(10)的位置,并基于检测结果控制气浮导轨装置(1, 2)和/或真空吸盘装置(6)及旋转夹紧机构(7)对基板(10)的位置进行调整。这种装置为基板(10)的上板和预对准节省了时间,采用无接触式的检测反馈装置有效避免了污染和损坏基板(10)。

Description

工件台基板交接装置与预对准方法 技术领域
本发明涉及光刻领域,特别涉及一种工件台基板交接装置与预对准方法。
背景技术
在当今信息化社会,显示器技术的快速发展,使其在人们的生活中扮演着越来越重要的角色。与此同时,人们对显示器的要求也越来越高。最新出现的OLED(有机发光显示器)具有超薄、主动发光、高亮度、高对比度、宽视角、宽工作温度范围、低功耗、低成本、全固态等优点,将为人们提供更加理想的显示画面,并对现有的显示产业格局产生巨大的影响,也被认为是LCD(液晶显示器)最强有力的竞争者。而OLED的制作依赖于光刻工艺,在进行光刻工艺之前基板传输定位具有很重要的作用。
现有基板传输定位方法,具有曝光等待时间长、定位精度低、工作效率低、基板易碎等缺点。现有技术中提供了一种基于接触式传感器的机械检测方法,该方法的特点是在基板台上放置位置传感器,实现对玻璃基板的预对准,其缺点是采用接触式的对准方法容易污染和损坏玻璃基板。
发明内容
本发明提供一种工件台基板交接装置与预对准方法,以克服现有技术中基板传输曝光工位对上板的等待和预对准的时间过长以及定位不准等问题。
为解决上述技术问题,本发明提供一种工件台基板交接装置,用于将工件台上的基板至少在基板交接位置和曝光位置之间移动,所述基板交接装置包括:设置在所述工件台上的检测反馈装置和气浮导轨装置;安装在所述气浮导轨装置上的运动基台,所述气浮导轨装置用于控制所述运动基台相对于工件台沿水平方向移动;安装在所述运动基台上的支撑台;以及安装在所述 支撑台上的带有气孔的基板台,所述基板台利用气浮承放所述基板,其中:所述基板台上设置有真空吸盘装置,用于将基板吸附于基板台上以及带动基板绕真空吸盘装置的中心轴旋转;所述支撑台上对应于所述基板台两侧的位置设置有旋转夹紧机构,所述旋转夹紧机构用于夹紧被所述真空吸盘装置吸附的基板,并与所述真空吸盘装置协同工作以实现所述基板的旋转;所述检测反馈装置用于检测所述基板是否位于所述基板交接位置或曝光位置,并基于检测结果控制所述气浮导轨装置和/或所述真空吸盘装置及旋转夹紧机构对所述基板的位置进行调整。
作为优选,所述支撑台上对应于所述基板台周边的位置还设置有导向销和挡销,用于对所述基板进行限位。
作为优选,所述气浮导轨装置包括Y向气浮导轨和X向气浮导轨,其中Y向和X向均沿水平方向且Y向与X向相互垂直,所述X向气浮导轨安装在所述Y向气浮导轨上,所述运动基台设置在所述X向气浮导轨上,所述运动基台在X向气浮导轨上沿X向运动,所述X向气浮导轨在所述Y向气浮导轨上沿Y向运动。
作为优选,所述真空吸盘装置包括真空吸盘、升降机构、旋转机构、马达及真空泵,所述真空吸盘与所述真空泵连接,用于吸附所述基板,所述马达驱动所述升降机构带动所述真空吸盘升降,所述马达驱动所述旋转机构带动所述真空吸盘绕其中心轴旋转,继而带动所述基板绕真空吸盘装置的中心轴旋转,所述中心轴是沿竖直Z向。
作为优选,所述旋转夹紧机构包括夹紧部件、气缸及电磁阀组件,所述气缸驱动所述夹紧部件夹紧所述基板,所述电磁阀组件控制所述夹紧部件的夹紧力度和角度。
作为优选,通过控制所述夹紧部件的夹紧力度和角度,使所述旋转夹紧机构与所述真空吸盘装置协同工作以实现所述基板按预定角度旋转。
作为优选,所述检测反馈装置包括非接触式探测器和交接安全传感器,所述非接触式探测器用于探测所述基板的位置,判断基板是否处于正确的基板交接位置处,所述交接安全传感器用于在基板台进行Rx、Ry方向上的旋转及Z向的位移时检测基板台的位置。
作为优选,所述非接触式探测器为CCD。
本发明还提供一种工件台基板预对准方法,包括:
步骤1、根据检测反馈装置的检测将基板台移动至正确的基板交接位,打开气阀使基板台上方形成气浮;
步骤2、机械手将基板移动至所述基板台上方,使所述基板悬浮在所述基板台上;
步骤3、所述基板台上的真空吸盘装置伸出并吸住所述基板,机械手返回;
步骤4、所述基板周边的旋转夹紧机构夹紧所述基板;
步骤5、所述真空吸盘装置根据检测反馈装置的检测绕其中心轴旋转,同时所述旋转夹紧机构调整夹紧力度和角度,实现所述基板绕竖直Z向旋转,完成所述基板的预对准。
作为优选,所述步骤1中根据检测反馈装置的检测将基板台移动至基板交接位置具体包括:在基板未到达工件台之前,基板台沿Rx、Ry方向旋转并Z向下降调整至上片所需高度,检测反馈装置检查确认基板台交接状态正常后,用于支撑所述基板台的运动基台通过气浮导轨装置沿X、Y向移动到基板交接位置,其中Rx、Ry方向分别为绕X、Y方向旋转。
作为优选,用于支撑所述基板台的运动基台通过气浮导轨装置沿X、Y向移动到基板交接位置包括,所述运动基台在所述气浮导轨装置的X向气浮导轨上沿X向运动,所述X向气浮导轨在所述气浮导轨装置的Y向气浮导轨上沿Y向运动。
与现有技术相比,本发明的基板交接装置中采用了气浮导轨装置,其摩 擦系数极小,运动基台可以快速进行X向、Y向移动,基板交接装置中真空吸盘装置可以快速吸住基板,旋转夹紧装置快速夹持基板,进行预对准,使得基板的交接时间大幅度地下降;而且工件台通过检测反馈装置,可以以真空吸盘的中心轴为中心,快速调整旋转夹紧机构,实现基板旋转,从而快速完成基板的预对准;由此大幅度降低曝光工位对上板的等待和预定位时间,大幅度地提高生产率。
附图说明
图1为本发明一具体实施方式中工件台基板交接装置的俯视图;
图2为本发明一具体实施方式中工件台基板交接装置的主视图;
图3a~11b为本发明一具体实施方式中各阶段基板交接装置的状态示意图。
图中所示:1-Y向气浮导轨、2-X向气浮导轨、3-运动基台、4-支撑台、5-基板台、6-真空吸盘装置、7-旋转夹紧机构、81-第一导向销、82-第二导向销、83-挡销、91-机械手、92-气浮台、10-基板。
具体实施方式
为使本发明的上述目的、特征和优点能够更加明显易懂,下面结合附图对本发明的具体实施方式做详细的说明。需说明的是,本发明附图均采用简化的形式且均使用非精准的比例,仅用以方便、明晰地辅助说明本发明实施例的目的。
如图1至图11b所示,本发明的工件台基板交接装置,包括:Y向气浮导轨1、安装在所述Y向气浮导轨1上的X向气浮导轨2、安装在所述X向气浮导轨2上的运动基台3、安装在所述运动基台3上的支撑台4以及安装在所述支撑台4上的带有气孔的基板台5。具体的,所述支撑台4能够沿垂向升降,其驱动装置安装于所述运动基台3内;所述运动基台3能够在X向气浮 导轨2上沿X向运动,X向气浮导轨2能够在Y向气浮导轨1上沿Y向运动,这样可以快速实现运动基台3的X、Y向位移,也就是说,可以快速实现带有气孔的基板台5的X向、Y向位移。
进一步的,参照图1和图2,所述工件台基板交接装置还包括真空吸盘装置6、旋转夹紧机构7和限位装置,其中,真空吸盘装置6安装在所述基板台5上,用于吸附基板10;所述旋转夹紧机构7和所述限位装置安装在所述基板台5周边的支撑台4上,所述真空吸盘装置6与旋转夹紧机构7配合,实现对所述基板10的Rz方向旋转。
具体地,所述限位装置包括第一导向销81、第二导向销82和挡销83,所述第一、第二导向销81、82和挡销83用于对基板10进行导向限位,避免基板10偏离理论位置太多,起到粗定位的作用。
作为优选,所述真空吸盘装置6包括:真空吸盘、升降机构、旋转机构、马达及真空泵,其中,所述真空吸盘与真空泵连接,用于吸附基板10,所述马达用于驱动升降机构带动所述真空吸盘升降,所述马达驱动旋转机构带动真空吸盘绕自身旋转,继而带动基板10沿Rz方向旋转。
作为优选,所述旋转夹紧机构7包括:夹紧部件、气缸及电磁阀组件,所述气缸驱动夹紧部件夹紧基板10,所述电磁阀组件控制夹紧部件的夹紧力度和角度。
作为优选,所述工件台基板交接装置还包括检测反馈装置,所述检测反馈装置包括非接触式探测器和交接安全传感器,优选地,所述非接触式探测器为CCD。其中,所述CCD用于探测所述基板10的位置,判断基板10是否处于正确的基板交接位置处,CCD无需与所述基板10接触,避免对基板10造成接触污染、损坏基板10;所述交接安全传感器用于在基板台5进行Rx、Ry方向上的旋转及Z向的位移时检测基板台5的位置,判断基板台5是否处于正常的交接状态。
请重点参照图3a~图11b,本发明还提供一种工件台基板预对准方法,包括:
基板上板和基板预对准,如图3a~图9b所示:
(1)在基板10未到达工件台之前,基板台5沿Rx、Ry方向旋转并Z向下降调整至上片所需高度,交接安全传感器检查确认交接状态正常后,运动基台3通过Y向气浮导轨1和X向气浮导轨2快速移动到工件台基板交接位置,打开气阀,向基板台5通气,使基板台5上方形成气浮;与此同时,气浮台92通气使机械手91吸住基板10准备向基板交接位置运动,如图3a、3b所示;
(2)机械手91吸住基板10准确运动到基板交接位置,基板10悬浮在基板台5上,CCD非接触式探测器检测基板10的X、Y方向的位置,如图4a、4b所示;
(3)真空吸盘装置6伸出真空吸盘吸住基板10上点A,然后机械手91回到起始位置,如图5a、5b所示;
(4)旋转夹紧机构7夹紧基板10,使基板10固定,实现基板10的预夹持,如图6a、6b所示;
(5)通过检测反馈装置的检测结果,真空吸盘装置6以基板10上的点A为中心旋转真空吸盘,同时旋转夹紧机构7调整夹紧基板10的角度和力度,进而实现基板10在Rz方向的旋转,从而快速完成基板10的预对准,检测反馈装置是无接触式的,故不会污染和损害基板10;
(6)关闭气阀,停止向基板台5气孔通气,真空吸盘下降回到起始位置,打开真空阀门,基板台5上的气孔输出真空,将基板10吸附在基板台5上,如图7a、7b所示,再进行后续曝光工艺。
曝光完成后,基板10下板包括以下步骤:
(1)曝光完成后,基板台5回到基板交接位置;
(2)运动基台3驱使基板台5Z向上升,如图8a、8b所示;
(3)交接安全传感器检查基板台5,确认交接位置正常;
(4)旋转夹紧机构7松开基板10,关闭真空,打开气阀,向基板台5气孔通气,使基板10悬浮在基板台5上,如图9a、9b所示;
(6)机械手91运动到基板交接位置,吸住基板10向气浮台92方向运动,使基板10位于气浮台92上方,如图10a、10b所示;
(7)关闭机械手91中的真空,使基板10与机械手91分离,机械手91撤出,基板10落在气浮台92上,同时停止向基板台5通气,如图11a、11b所示。
综上所述,本发明的基板交接装置中采用气浮导轨装置,因其摩擦系数极小,运动基台3可以快速X向、Y向移动,采用真空吸盘装置6快速吸住基板10、旋转夹紧机构7快速夹持基板10,进行基板10预夹紧定位,基板10的交接时间大幅度地下降;而且工件台通过检测反馈装置的检测结果,以真空吸盘自身为中心旋转,同时调整旋转夹紧机构7夹紧基板10的角度和力度,实现了基板10在Rz方向的旋转,从而快速地完成了基板10的预对准,大幅度地降低了曝光工位对上板的等待和预定位时间,大幅度地提高了生产率,同时在预对准时采用无接触式探测器克服了现有技术中接触式传感器的缺点,有效避免了污染和损坏基板10。
显然,本领域的技术人员可以对发明进行各种改动和变型而不脱离本发明的精神和范围。这样,倘若本发明的这些修改和变型属于本发明权利要求及其等同技术的范围之内,则本发明也意图包括这些改动和变型在内。

Claims (11)

  1. 一种工件台基板交接装置,用于将工件台上的基板至少在基板交接位置和曝光位置之间移动,所述基板交接装置包括:
    设置在所述工件台上的检测反馈装置和气浮导轨装置;
    安装在所述气浮导轨装置上的运动基台,所述气浮导轨装置用于控制所述运动基台相对于工件台沿水平方向移动;
    安装在所述运动基台上的支撑台;以及
    安装在所述支撑台上的带有气孔的基板台,所述基板台利用气浮承放所述基板,其特征在于:
    所述基板台上设置有真空吸盘装置,用于将基板吸附于基板台上以及带动基板绕真空吸盘装置的中心轴旋转;
    所述支撑台上对应于所述基板台两侧的位置设置有旋转夹紧机构,所述旋转夹紧机构用于夹紧被所述真空吸盘装置吸附的基板,并与所述真空吸盘装置协同工作以实现所述基板的旋转;
    所述检测反馈装置用于检测所述基板是否位于所述基板交接位置或曝光位置,并基于检测结果控制所述气浮导轨装置和/或所述真空吸盘装置及旋转夹紧机构对所述基板的位置进行调整。
  2. 如权利要求1所述的工件台基板交接装置,其特征在于,所述支撑台上对应于所述基板台周边的位置还设置有导向销和挡销,用于对所述基板进行限位。
  3. 如权利要求1所述的工件台基板交接装置,其特征在于,所述气浮导轨装置包括Y向气浮导轨和X向气浮导轨,其中Y向和X向均沿水平方向且Y向与X向相互垂直,所述X向气浮导轨安装在所述Y向气浮导轨上,所述运动基台设置在所述X向气浮导轨上,所述运动基台在X向气浮导轨上沿X 向运动,所述X向气浮导轨在所述Y向气浮导轨上沿Y向运动。
  4. 如权利要求1所述的工件台基板交接装置,其特征在于,所述真空吸盘装置包括真空吸盘、升降机构、旋转机构、马达及真空泵,所述真空吸盘与所述真空泵连接,用于吸附所述基板,所述马达驱动所述升降机构带动所述真空吸盘升降,所述马达驱动所述旋转机构带动所述真空吸盘绕其中心轴旋转,继而带动所述基板绕真空吸盘装置的中心轴旋转,所述中心轴是沿竖直Z向。
  5. 如权利要求1所述的工件台基板交接装置,其特征在于,所述旋转夹紧机构包括夹紧部件、气缸及电磁阀组件,所述气缸驱动所述夹紧部件夹紧所述基板,所述电磁阀组件控制所述夹紧部件的夹紧力度和角度。
  6. 如权利要求5所述的工件台基板交接装置,其特征在于,通过控制所述夹紧部件的夹紧力度和角度,使所述旋转夹紧机构与所述真空吸盘装置协同工作以实现所述基板按预定角度旋转。
  7. 如权利要求1所述的工件台基板交接装置,其特征在于,所述检测反馈装置包括非接触式探测器和交接安全传感器,所述非接触式探测器用于探测所述基板的位置,判断基板是否处于正确的基板交接位置处,所述交接安全传感器用于在基板台进行Rx、Ry方向上的旋转及Z向的位移时检测基板台的位置。
  8. 如权利要求7所述的工件台基板交接装置,其特征在于,所述非接触式探测器为CCD。
  9. 一种采用如权利要求1~8中任一项所述的工件台基板交接装置进行工件台基板预对准的方法,其特征在于,包括:
    步骤1、根据检测反馈装置的检测将基板台移动至正确的基板交接位置,打开气阀使基板台上方形成气浮;
    步骤2、机械手将基板移动至所述基板台上方,使所述基板悬浮在所述基 板台上;
    步骤3、所述基板台上的真空吸盘装置伸出并吸住所述基板,机械手返回;
    步骤4、所述基板周边的旋转夹紧机构夹紧所述基板;
    步骤5、所述真空吸盘装置根据检测反馈装置的检测绕其中心轴旋转,同时所述旋转夹紧机构调整夹紧力度和角度,实现所述基板绕竖直Z向旋转,完成所述基板的预对准。
  10. 如权利要求9所述的工件台基板预对准方法,其特征在于,所述步骤1中根据检测反馈装置的检测将基板台移动至基板交接位置具体包括:在基板未到达工件台之前,基板台沿Rx、Ry方向旋转并Z向下降调整至上片所需高度,检测反馈装置检查确认基板台交接状态正常后,用于支撑所述基板台的运动基台通过气浮导轨装置沿X、Y向移动到基板交接位置,其中Rx、Ry方向分别为绕X、Y方向旋转。
  11. 如权利要求10所述的工件台基板预对准方法,其特征在于,用于支撑所述基板台的运动基台通过气浮导轨装置沿X、Y向移动到基板交接位置包括,所述运动基台在所述气浮导轨装置的X向气浮导轨上沿X向运动,所述X向气浮导轨在所述气浮导轨装置的Y向气浮导轨上沿Y向运动。
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Publication number Priority date Publication date Assignee Title
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Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001044093A (ja) * 1999-07-27 2001-02-16 Canon Inc 位置合わせ方法及び位置合わせ装置
CN101216686A (zh) * 2008-01-10 2008-07-09 上海微电子装备有限公司 一种晶片预对准平台及使用该平台的晶片预对准方法
CN101640181A (zh) * 2008-07-31 2010-02-03 佳能安内华股份有限公司 基底对准设备和基底处理设备
CN101702404A (zh) * 2009-11-05 2010-05-05 上海微电子装备有限公司 一种硅片交接装置及其硅片交接方法
CN103034064A (zh) * 2011-09-29 2013-04-10 上海微电子装备有限公司 一种用于基板预对准以及基板方向检测及调整的装置
CN103472680A (zh) * 2012-06-08 2013-12-25 上海微电子装备有限公司 硅片预对准装置
CN103489818A (zh) * 2013-10-14 2014-01-01 北京自动化技术研究院 一种硅片预对准装置
CN204595427U (zh) * 2015-02-28 2015-08-26 上海微电子装备有限公司 一种用于晶圆曝光的工件台

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6179012B2 (ja) * 2013-07-28 2017-08-16 アテル株式会社 ウエハ位置決め装置
CN104570614B (zh) * 2013-10-25 2017-06-06 上海微电子装备有限公司 可工位切换的精密定位台

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001044093A (ja) * 1999-07-27 2001-02-16 Canon Inc 位置合わせ方法及び位置合わせ装置
CN101216686A (zh) * 2008-01-10 2008-07-09 上海微电子装备有限公司 一种晶片预对准平台及使用该平台的晶片预对准方法
CN101640181A (zh) * 2008-07-31 2010-02-03 佳能安内华股份有限公司 基底对准设备和基底处理设备
CN101702404A (zh) * 2009-11-05 2010-05-05 上海微电子装备有限公司 一种硅片交接装置及其硅片交接方法
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